M362514 五、新型說明： 【新型所屬之技術領域】 本創作係與照明用燈管有關，更詳而言之係指一種易 於調整色溫之三波長LED白光照明燈管結構。 【先前技術】 按，由於發光二極體（Light Emitting Diode，簡稱LED) 具有低耗能、高效率的特性及優點，因此目前各國及業界 • 皆將此一技術列為策略發展的重點技術，以取代現有傳統 之照明設備。 第一圖所示，現有之LED照明燈管，係將多數可發出 紅光、綠光、藍光元件i、2、3電性連接於一電路 板4上，再由該電路板4連接一連接端子（圖中未示），以 由該連接端子與電源（或燈座）電性連接，使能利用三原 色先（紅、綠、藍）混出可供照明用之白光而照射。但此 禮Γ紅、綠、藍光加料成白光之方式，除了波長配合 ===色1卜，光強度亦要有適當的配比，因此在混光 實β上有者相虽之困難度，常見白光僅出現 中央區域的混光色溫會逐漸趨近紅父綠: 的色塊，一 請參閱二圖所示，另有一種 <發出紅光、料係、將多數 z、3電性連接於 M362514 一電路板4上，再由該電路板4連接一連接端子（圖中未 示），並於該電路板4前置設一透明燈罩5，該透明燈罩5 内部則加入螢光粉（劑）6，以利用三原色光（紅、綠、 藍）經由螢光粉之混合而混出可供照明用之白光。但此種 方式所能照明之角度有限，且因LED元件1、2、3發光 的同時必然伴隨著高熱，而螢光粉6本身並不耐高溫，故 當LED元件溫度提高時，螢光粉會快速產生質變，造成 LED元件產生光衰現象，嚴重影響照度或明亮度。 • 其次’ LED的波長取決於蠢晶層的結構及組成的材 料’更重要的是晶格匹配的課題，導致半導體因溫度的焉 低致生波長飄移的問題不容忽視。就開機初期和通電一段 時間來說，開機初期隨著紅光發光效率的強度，該RGB三 原色光混出白色偏紅的光源；通電一段時間，隨著發光效 率較高的藍光逐步增強，讓混光色溫偏向冷光系的白色偏 藍光，故於兩段時期所混光的色溫各不相同。依光譜的角 0度來看，波長由暖色系移動到冷色系的熱飄移範圍過大， 嚴重影響混光色溫的白平衡，相對減損光源的照度。 另外，亦有一種利用一發白光之LED充當主要光源， 並於白光LED附近置設一組由紅、綠、藍光等LED構成 之色溫補償單元，即當白光LED亮度因螢光層質變而快速 下降而形成光衰時，以紅、綠、藍光LED隨著衰變的白光 LED進行單顆或多顆之電流強度調整。但此種方式不僅無 法精確地恢復至原先白光之標準色溫，且欲精準地控制單 M362514 顆或多顆之電流，於實際上有著相當高之難度而不符 經濟效益。 【新型内容】 有鑑於此，本創作之主要目的乃在提供一種易於調整 =之三波長㈣白光照明燈管結構，係能減少混光不均 之蚁形，使照明之白光效果更佳。 本創作之另-主要目的乃在提供一種易於調整色溫之 :波長LED白光照明燈管結構，係可將色溫於冷色系白光 至暖色系白光間加以調整者。 本創作之再-主要目的乃在提供—種易於調整色溫之 =皮長㈣白光翻燈管結構，切形成高演色性之三波 長白光者。 緣此，本創作乃提供-種易於調整色溫之三波長哪 白先照明燈管結構’包含有：—可為電路板之承載基板； 至少三紅S LED封裝元件’係設置於該承載基板上，具有 —至少可發出紅光之LED晶片一罩覆於該紅光㈣晶 片上之罩覆體及多數佈設於該罩覆體中之擴散粒子；至少 二綠光LED封裝元件，係設置於該承魅板上，具有至少 —可發出綠光之LED晶片、-罩覆於該綠光led晶片上 之罩覆體及錄佈設於鮮覆體巾之擴散粒子；至少三該 光LED封裝元件’係設置於該承板上，具有至少一; 5 M362514 發出藍光之LED晶片、一罩覆於該藍光LED晶片上之罩 覆體及多數佈設於該罩覆體中之擴散粒子；一燈管，呈可 透光，係供該承載基板容置；一導電封蓋，係套接於該燈 管一端並與該紅、綠、藍光LED封裝元件電性連接，以導 入電流給該紅、綠、藍光LED封裝元件進行發光。 【實施方式】 為使貴審查委員能對本創作之特徵與特點有更進一 步之了解與認同，茲列舉以下較佳實施例並配合圖式說明 •如下： 請參閱第三圖至第五圖，係本創作第一較佳實施例所 提供一種易於調整色溫之三波長LED白光照明燈管結構1 00，包含有一承載基板1 0、多數紅光LED封裝元件2 0、多數綠光LED封裝元件3 0、多數藍光LED封裝元 件40、一燈管50及一導電封蓋60 ;其中： 請參閱第三圖，該承載基板1 〇，為一平板狀之印刷 •電路板（PCB)，佈設有多數預定態樣之電路佈線（圖中末 示）。 請參閱第四圖，該紅光LED封裝元件2 0包含有至少 一紅光LED晶片2 1、一罩覆體2 2及多數之擴散粒子2 3 ;該紅光LED晶片2 1係能接通預定電流而發射出紅 光，該罩覆體2 2係由透光之材質所製成，如環氧樹脂 (Epoxy )、石夕膠（Silicone )、玻璃…等透光材質，該罩覆 體2 2係覆蓋於該紅光LED晶片2 1上，該等擴散粒子2 M362514 3係散佈於該罩覆體2 2中’該擴散粒子2 3係由具高反 射率或高散射率之材料所製成，例如銀（W)、碳酸舞 (CAC〇3 )、矽（Sllic〇n )、二氣化石夕（s⑴2 )等其它材質 所製成或與樹脂依適t比例調合而成。該等紅光LED封裝 元件2 Q係依預定態樣料於該承餘板i ◦上，並與該 承載基板1 〇電性接通，以由該承載基i Q供給該等紅光 LED封褒元件2 Q電流，以使該紅光LED晶片2 1能發射 出紅光。 明參閱第二及第四圖，該綠光Led封裝元件3 〇與紅 光LED封裝元件2 〇相同包含有至少一綠光lED晶片、 、，罩覆體及多數之擴散粒子；惟，其構造及組裝方式與紅 光LED封裝元件2 〇相同，容不在此多加贅述。該等綠光 LED封裝凡件3 〇係分別依預定態樣佈設於該承載基板1 〇上，並與該承載基板丨〇電性接通，以由該承載基工〇 供給該等料LED縣元件3 0電流，减發射出綠光。 凊參閱第三及第四圖，該藍光LED封裝元件4 〇與紅 光LED封裝元件2 〇相同包含有至少一藍光LED晶片、 一罩覆體及多數之擴散粒子；惟，其構造及組裝方式與紅 光LED封裝元件2 〇相同，容不在此多加贅述。該等藍光 LED封破元件4 〇係分別依預定態樣佈設於該承載基板1 〇上，並與該承載基板i 〇電性接通，以由該承載基板工 0供給4等藍光LED封裝元件4 〇電流，以能發射出藍光。 β月參閱第三及第四圖，該燈管5 〇，為一中空且可透 M362514 光之&體’且該燈管5 〇内壁兩相對位置分別形成有一卡 槽5 1，以供該承載基板1 〇置入於該燈管5 0内部，並 由遠承載基板1〇之兩側緣卡入於該卡槽5工中，使該承 載基板1〇能被固定於該燈管5 〇中。 請參閱第三圖，該導電封蓋6 0，具有-連接管體6 1及一導電蓋體6 2 ;該連接管體6工為一中空之管體， 其可界定出呈連通狀態之一第一端6丄丄及一第二端6工 2 ’該第-端6 1 1之内徑約略等於該燈f5◦之外徑， 而可套接於該燈管5 〇一端上；該導電蓋體6 2一端面向 内凹陷有-容槽6 2 1，且該容槽6 2工之開口徑約略等 於該連接管體6 1之第二端6工2外徑，以由該容槽6 2 ^供及連接&體6 ^第二端6 i 2套接，該導電蓋體6 上並叹有— Vi端子6 2 2 ’係；^該導電蓋體6 2套接 於該連接管體61第二端612上時，與該承载基板1〇 電性連接而導通電流，以由該導電端子6 2 2將電流導入 至該承載基板i 〇上再導通至該各紅、綠、藍光咖封裝 狀牛2 0 3 0、4 0上’進而使各紅、綠、藍光led封 衣凡件2 0、3 0、4 0進行發光。 是以，上料林_第—錄實施狀主要構件及其 組裝方式介紹,，接著再將使料點介紹如下： 如第三圖所示，於本實施例中該各紅 :=上3。、4〇係分別預_方式二： M362514M362514 V. New description: [New technical field] This creation is related to the lighting tube, more specifically, a three-wavelength LED white light tube structure that is easy to adjust the color temperature. [Prior Art] According to the fact that Light Emitting Diode (LED) has the characteristics and advantages of low energy consumption and high efficiency, all countries and industries have listed this technology as a key technology for strategic development. To replace the existing traditional lighting equipment. As shown in the first figure, the existing LED lighting tube is configured to electrically connect a plurality of red, green and blue components i, 2, 3 to a circuit board 4, and then connect the circuit board 4 to a connection. The terminal (not shown) is electrically connected to the power source (or the lamp holder) by the connection terminal, so that the three primary colors (red, green, and blue) can be used to mix and illuminate the white light for illumination. However, the way of adding red, green and blue light to white light, in addition to the wavelength matching === color 1 Bu, the light intensity should also have an appropriate ratio, so there is a difficulty in the phase of the mixed light, Common white light only appears in the central region, the color temperature of the mixed light will gradually approach the red parent green: the color block, please refer to the second picture, and another type [red light, material system, most z, 3 electrical connection On the circuit board 4 of the M362514, a connection terminal (not shown) is connected to the circuit board 4, and a transparent lamp cover 5 is disposed in front of the circuit board 4. The inside of the transparent lamp cover 5 is filled with phosphor powder ( The agent 6 mixes the white light for illumination by mixing the phosphors with the three primary colors (red, green, and blue). However, the illumination angle of this method is limited, and the LED elements 1, 2, and 3 are accompanied by high heat, and the phosphor powder 6 itself is not resistant to high temperature, so when the temperature of the LED element is increased, the phosphor powder It will quickly produce a qualitative change, causing the LED component to produce light decay, which seriously affects the illumination or brightness. • Secondly, the wavelength of the LED depends on the structure and composition of the stupid layer. What is more important is the problem of lattice matching. The problem of semiconductor wavelength drift due to the low temperature can not be ignored. In the initial stage of power-on and power-on for a period of time, with the intensity of red light-emitting efficiency at the beginning of the booting, the RGB three primary colors of light mix out a white reddish light source; after a period of power-on, the blue light with higher luminous efficiency is gradually enhanced, allowing mixing The color temperature is biased toward the white light of the cold light system, so the color temperature of the light mixed in the two periods is different. According to the angle of the spectrum of 0 degree, the wavelength of the thermal shift from the warm color system to the cool color system is too large, which seriously affects the white balance of the mixed color temperature and relatively reduces the illumination of the light source. In addition, there is also a light source that uses a white light as a main light source, and a set of color temperature compensation units composed of red, green, blue light and the like are disposed near the white light LED, that is, when the brightness of the white light LED changes rapidly due to the quality of the fluorescent layer. When the light decays, the red, green, and blue LEDs are adjusted with the current intensity of the single or multiple white LEDs. However, this method can not only accurately restore the original color temperature of the original white light, but to accurately control the current of a single M362514 or more, it is actually quite difficult and economical. [New content] In view of this, the main purpose of this creation is to provide a three-wavelength (four) white light illumination tube structure that is easy to adjust = to reduce the uneven shape of the mixed light, so that the white light effect of the illumination is better. Another main purpose of this creation is to provide an easy-to-adjust color temperature: wavelength LED white light tube structure, which can adjust the color temperature between cool white light and warm white light. The main purpose of this creation is to provide a kind of easy-to-adjust color temperature = leather length (four) white light turning tube structure, and cut into three waves of high color rendering. Therefore, the present invention provides a three-wavelength structure for easily adjusting the color temperature. The white light bulb structure includes: - can be a carrier substrate of the circuit board; at least three red S LED package components are disposed on the carrier substrate An LED chip having at least red light, a cover covering the red (four) wafer, and a plurality of diffusion particles disposed in the cover; at least two green LED package components are disposed on the LED chip The glazed plate has at least - an LED chip that emits green light, a cover that covers the green LED chip, and a diffusion particle that is disposed on the fresh cover towel; at least three of the light LED package components Is disposed on the carrier plate, and has at least one; 5 M362514 LED chip emitting blue light, a cover body covering the blue LED chip, and a plurality of diffusion particles disposed in the cover body; a lamp tube, The light-transmissive light is provided for the carrier substrate; a conductive cover is sleeved at one end of the lamp tube and electrically connected to the red, green and blue LED package components to introduce current to the red, green, The blue LED package component emits light. [Embodiment] In order to enable your review committee to have a better understanding and recognition of the features and characteristics of this creation, the following preferred embodiments are listed with reference to the following diagrams: • Refer to the third to fifth figures. The first preferred embodiment of the present invention provides a three-wavelength LED white light lamp structure 100 that is easy to adjust color temperature, and includes a carrier substrate 10, a plurality of red LED package components 20, and a plurality of green LED package components. a plurality of blue LED package components 40, a lamp tube 50 and a conductive cover 60; wherein: Referring to the third figure, the carrier substrate 1 is a flat printed circuit board (PCB), which is provided with a majority of reservations. The circuit wiring of the aspect (shown at the end of the figure). Referring to the fourth figure, the red LED package component 20 includes at least one red LED chip 2 1 , a cover 2 2 and a plurality of diffusion particles 2 3 ; the red LED chip 2 1 can be connected The red light is emitted by the predetermined current, and the cover 2 2 is made of a light transmissive material, such as an epoxy resin (Epoxy), a Silicone (Silicone), a glass, etc., the cover material. 2 2 is overlaid on the red LED chip 21, and the diffusion particles 2 M362514 3 are dispersed in the cover 2 2. The diffusion particles 2 are made of a material having high reflectivity or high scattering rate. It is made of other materials such as silver (W), carbonated dance (CAC〇3), strontium (Sllic〇n), and two gas fossils (s(1)2) or blended with resin-dependent t. The red LED package components 2 Q are placed on the shunt plate i 依 according to a predetermined state, and electrically connected to the carrier substrate 1 to supply the red LED packages by the carrier i Q The element 2 is Q current so that the red LED chip 2 1 can emit red light. Referring to the second and fourth figures, the green LED package element 3 〇 and the red LED package component 2 包含 include at least one green light lED wafer, a cover body and a plurality of diffusion particles; however, the structure thereof And the assembly method is the same as that of the red LED package component 2, and the details are not described here. The green LED package parts 3 are respectively arranged on the carrier substrate 1 according to a predetermined state, and are electrically connected to the carrier substrate to supply the materials to the LED county. Element 30 current, minus green light emission. Referring to the third and fourth figures, the blue LED package component 4 〇 and the red LED package component 2 包含 include at least one blue LED chip, a cover and a plurality of diffusion particles; however, the construction and assembly manner thereof The same as the red LED package component 2 ,, the details are not described here. The blue LED sealing elements 4 are respectively disposed on the carrier substrate 1 预定 according to a predetermined state, and are electrically connected to the carrier substrate i to supply the blue LED package components by the carrier substrate 0 4 〇 current to emit blue light. Referring to the third and fourth figures, the lamp tube is 5 〇, which is hollow and permeable to the M362514 light &body' and the opposite positions of the inner wall of the lamp tube 5 are respectively formed with a card slot 51 for the purpose The carrier substrate 1 is disposed inside the lamp tube 50, and the two side edges of the remote carrier substrate 1 are engaged in the card slot 5 so that the carrier substrate 1 can be fixed to the lamp tube 5 in. Referring to the third figure, the conductive cover 60 has a connecting pipe body 6 1 and a conductive cover body 6 2 ; the connecting pipe body 6 is a hollow pipe body, which can be defined as one of connected states. The first end 6丄丄 and the second end 6 2 2 have an inner diameter which is approximately equal to the outer diameter of the lamp f5◦, and can be sleeved on one end of the lamp 5; One end of the conductive cover body 6 2 is recessed inwardly with a receiving groove 6 2 1 , and the opening diameter of the receiving groove 6 2 is approximately equal to the outer diameter of the second end 6 of the connecting pipe body 6 1 to be used by the receiving groove 6 2 ^ Supply and connection & body 6 ^ second end 6 i 2 socket, the conductive cover 6 is sighed - Vi terminal 6 2 2 ' system; ^ the conductive cover 6 2 is sleeved in the connection When the second end 612 of the tube body 61 is connected to the carrier substrate 1 , a current is electrically connected to conduct current from the conductive terminal 6 2 2 to the carrier substrate i 再 and then to the red, green, and Blu-ray coffee packaged cattle 2 0 3 0, 40 on 'and then each red, green, blue light led seals 20 0, 30, 40 light. Therefore, the main components of the loading forest _ the first recording embodiment and the assembly method thereof are introduced, and then the material points are introduced as follows: As shown in the third figure, in the present embodiment, the red color: = upper 3. , 4〇 are pre- _ mode two: M362514
監无呀’具光束經⑽擴散㈣較佳之散射路徑 光’以提供較佳之光線散射路徑，使紅、綠、藍 而充分混 徑，使紅、綠、藍光之光束 能近乎完全重疊， 色之色塊產生，其未能均w合之色塊區域僅會發生於光 形之周緣區域，其所佔之比例遠低於人眼所能見及之比 率，以達成㈣混光之效果，況且光餘由㈣粒子所發 而能均勻地混成白光，並不致有其它顏 散後，將使照明之廣度更佳。 其次，雖然本實施例該承載基板為一電路板，更實際 上該承載基板亦可為-絕緣載體，而再利用跳線將各㈣ 封裝元件加以電性連接，亦同樣可達成本創作之目的。 再者，由於本實施例易於調整色溫之三波長led白光 鲁照明燈管結構，係具有多數各色紅、綠、藍光之LED封裝 元件，因此可利用佈設於承載基板上位置之置換或調配， 來達成調整色溫之功效，即使混成之白光能於冷色系白光 至暖色糸白光間進行§周整’如室内照明或室外两明所採用 不同色溫之白光，以能因應不同之照明需求。藉此，本創 作易於調整色溫之三波長LED白光照明燈管結構，不僅具 有較佳之混光效果’使能均勻地混成白光而無其它色塊之 產生’更具備藉由佈設於承載基板上各色LED封裝元件之 9 M362514 ‘數量、設置位置之變化，來達成調整色溫之效果，而無需 習知技術必須改變電流、電壓之複雜方式，使其調整色溫 之方式更為簡易。 請參閱第六至第九圖，係本創作第二較佳實施例所提 供一種易於調整色溫之三波長led白光照明燈管結構2 〇 0，其與第一較佳實施例相同包含有一承載基板丄〇、多 數紅光LED封裝元件2 〇，、多數綠光LED封裝元件3 0 ’、多數藍光LED封裝元件4 〇，、一燈管5 〇,及一導電 •封蓋6 0 ;惟與第一較佳實施例之主要差異在於： 第一較佳實施例中各光色封裝元件係採用LED [AMP (插件型LED)型式之LED，而本實施例中該等紅光、綠 光、藍光LED封裝元件2 〇，、3 〇，、4 〇，則採用為SMD LED ( Surface mount deviceLED) ’ 即貼片型 LED (亦稱表 面黏著型LED)’其差異僅在封裝態樣不同，但同樣可達成 本創作之目的； • 另外，於本實施例中之燈管5 0,係為一斷面呈半圓形 之罩體（如第六圖所示）’即該燈管5 〇,形成有一與外界 連通之透光開口 5 2，使該承載基板i 〇卡入於該燈管5 0 ’之卡槽5 1 ’中時’該等紅、綠、藍光LED封裝元件2 0 3 0’4 0’之發光方向係直接朝向該透光開口 5 2 (如 第七圖所示），而在未經任何遮蔽下發散而出，可藉此使照 明亮度更佳。 如第八圖所示’雖然本實_該等紅、綠、藍光 10 M362514 封裝元件20’、30’、40，，係採用SMD LED型式， 但其於封裝時亦同樣設置有多數之擴散粒子，以達成混光 均勻之效果。 如第九圖所示，本創作於實際使用時，可將多數之燈 管結構2 0 0，裝設於一物件g 〇上，以由該物件供給該 等燈管結構2 0 0電源，而該等燈管結構2 〇 〇之紅、綠、 藍光LED封裝元件2 〇，、3 〇，、4 0，則直接由透光開口 5 2而呈裸露狀態，使照明之廣度更佳。 ® 请參閱第十圖及第十一圖，係本創作第三較佳實施例 所提供一種易於調整色溫之三波長L e D白光照明燈管結構 3 0 0，其與第二較佳實施例相同包含有一承载基板丄〇、 多數紅光LED封裝元件2 0，、多數綠光LED封裝元件3 0 ’、多數藍光LED封裝元件4〇，、一燈管5 〇,及一導電 封蓋6 0 ;惟與第二較佳實施例之主要差異在於： 於本實施例中，更具有多數之第四光led封裝元件7 φ 〇 ’该第四光led封裝元件7 〇同樣包含有至少一第四光 LED晶片71、一罩覆體72及多數之擴散粒子7 3 ;該 第四光LED晶片7 1係能接通於預定電流，而發射出第四 光’ §亥弟四光係一波長在5 6 0 nm〜6 1 0 nm或470nm 〜5 0 〇nm頻譜範圍的光束，前者依光譜圖來看泛稱一黃 光（Yellow Light，YL )’後者泛稱一青光或稱藍綠光（Bluish Green Light，BGL)。 該等第四光LED封裝元件7 0係與該承載基板丄〇電 M362514 性接通，以由該承載基板1 0供給該等第四光LED封裝元 件7 0電流，以使該第四光LED晶片7 1能發射出有別於 紅光、綠光、藍光之第四光。 其中，該第四光LED封裝元件7 0所發出之第四光為 一黃光，黃光為紅光與綠光的混色光，可與藍光混成白光。 另外，其中該等紅光LED封裝元件、綠光LED封裝 元件、藍光LED封裝元件及第四光LED封裝元件，亦可 採用高功率（如1瓦（W)或以上）之LED封裝元件，而能 • 減少所需設置之數量，其同樣可達成本創作之目的。 以上所揭，僅為本創作之較佳實施方式而已，並非用以 限定本創作實施例的範圍，本技術領域内的一般技術人員 根據本創作所作的均等變化，以及本領域内技術人員熟知 的改變，仍應屬本創作涵蓋的範圍。 M362514 【圖式簡單說明】 第一圖係習用一種LED燈管之照明狀態示意圖。 第二圖係習用另一種LED燈管之照明狀態示意圖。 第三圖係本創作第一較佳實施例之立體分解圖。 第四圖係第三圖所示較佳實施例之剖視圖。 第五圖係第三圖所示較佳實施例之照明狀態示意圖。 φ 第六圖係本創作第二較佳實施例之立體分解圖。 第七圖係第六圖所示較佳實施例之剖視圖。 第八圖係第六圖所示較佳實施例之局部構件立體圖。 第九圖係第六圖所示較佳實施例之使用狀態示意圖。 第十圖係本創作第三較佳實施例之立體分解圖。 第十一圖係第十圖所示較佳實施例之剖視圖。 【主要元件符號說明】 φ 「習知」 綠光LED元件2 電路板4 螢光粉6 紅光LED元件1 藍光LED元件3 透明燈罩5 「本創作」 「第一較佳實施例」 易於調整色溫之三波長LED白光照明燈管結構1 〇 〇 承載基板1 0 紅光LED封裝元件2 0 13 M362514 紅光LED晶片2 1 罩覆體2 2 擴散粒子2 3 綠光LED封裝元件3 0 藍光LED封裝元件4 0 燈管5 0 卡槽5 1 連接管體6 1. 導電件6 0 第一端6 1 1 第二端6 1 2 導電蓋體6 2 容槽6 2 1 導電端子6 2 2 第二較佳實施例」 易於調整色溫之三波長LED白光照明燈管結構2 0 0 承載基板1 0 紅光LED封裝元件2 0 綠光LED封裝元件3 0’ 藍光LED封裝元件4 0’ 燈管5 0’ 卡槽5 1’ 透光開口 5 2 物件9 0 導電件6 0 第三較佳實施例」 易於調整色溫之三波長LED白光照明燈管結構3 0 0 承载基板1 〇 紅光LED封裝元件2 0 ’ 綠光LED封裝元件3 0’ 藍光LED封裝元件4 0’ 燈管5 0’ 導電件6 0 第四光LED封裝元件7 0 第四光LED發光晶片7 1 罩覆體7 2 擴散粒子7 3Nothing to do with 'the beam through (10) diffusion (four) better scattering path light 'to provide a better light scattering path, so that red, green, blue and fully mixed diameter, so that the red, green, blue light beams can almost completely overlap, color The color block is generated, and the color block region which cannot be uniformly combined only occurs in the peripheral region of the light shape, and the proportion thereof is far lower than the ratio that can be seen by the human eye, so as to achieve the effect of (4) light mixing, and light The remainder of (4) particles can be evenly mixed into white light, which will make the illumination wider. Secondly, although the carrier substrate is a circuit board in this embodiment, in fact, the carrier substrate can also be an insulating carrier, and the (4) package components are electrically connected by using a jumper, which can also achieve the purpose of cost creation. . Furthermore, since the three-wavelength led white light illuminating lamp tube structure of the present embodiment is easy to adjust the color temperature, the LED package component having a plurality of red, green and blue colors of various colors can be replaced or arranged by the position disposed on the carrier substrate. The effect of adjusting the color temperature is achieved, even if the white light can be mixed between the cool white light and the warm white light, the white light of different color temperatures such as indoor lighting or outdoor bright light can be used to meet different lighting requirements. Therefore, the present invention is easy to adjust the color temperature of the three-wavelength LED white light tube structure, not only has a better light mixing effect 'enables to uniformly mix white light without the generation of other color blocks', and has various colors arranged on the carrier substrate The LED package component 9 M362514 'quantity, set position changes, to achieve the effect of adjusting the color temperature, without the need to change the current and voltage complex methods, so that the way to adjust the color temperature is easier. Please refer to the sixth to ninth embodiments. The second preferred embodiment of the present invention provides a three-wavelength led white light illumination tube structure 2 易于0 which is easy to adjust the color temperature, and includes a carrier substrate as in the first preferred embodiment.丄〇, most red LED package components 2 〇, most green LED package components 3 0 ', most blue LED package components 4 〇, a light tube 5 〇, and a conductive • cover 6 0 ; The main difference of a preferred embodiment is that the light color packaging components in the first preferred embodiment are LEDs of the LED [AMP (Insert LED) type, and in this embodiment, the red, green, and blue light are used. LED package components 2 〇, 3 〇, 4 〇, use SMD LED (Surface mount device LED) 'SMD LED (also known as surface mount LED)' difference is only different in the package, but the same For the purpose of cost creation; • In addition, the lamp tube 50 in the embodiment is a cover having a semi-circular cross section (as shown in the sixth figure), that is, the lamp tube 5 is formed. There is a light-transmissive opening 52 2 communicating with the outside, so that the carrier substrate i 〇 is stuck in the light tube 5 0' of the card slot 5 1 'in the middle of the red, green, and blue LED package components 2 0 3 0 '4 0 'the direction of illumination is directly toward the light-transmissive opening 5 2 (as shown in the seventh figure), It can be diverged without any obscuration, which can make the illumination brightness better. As shown in the eighth figure, although the red, green, and blue 10 M362514 package components 20', 30', and 40 are SMD LED type, they are also provided with a large number of diffusion particles during packaging. In order to achieve the effect of uniform light mixing. As shown in the ninth figure, in the actual use, the majority of the lamp structure 200 can be installed on an object g , to supply the lamp structure to the power supply of the lamp structure. The red, green and blue LED package components 2 〇, 3 〇, and 40 of the lamp structure 2 are directly exposed by the light-transmissive opening 52 to make the illumination wider. Referring to the tenth and eleventh drawings, a third preferred embodiment of the present invention provides a three-wavelength L e D white light illumination lamp structure 300 that is easy to adjust color temperature, and the second preferred embodiment The same includes a carrier substrate, a plurality of red LED package components 20, a plurality of green LED package components 30', a plurality of blue LED package components 4, a lamp 5 〇, and a conductive cover 60 The main difference from the second preferred embodiment is that: in this embodiment, the fourth optical LED package component 7 φ ′′ of the fourth optical LED package component 7 〇 also includes at least one fourth The LED chip 71, a cover 72 and a plurality of diffusing particles 7 3; the fourth LED chip 71 can be turned on at a predetermined current to emit a fourth light. 5 6 0 nm~6 1 0 nm or 470 nm ~ 5 0 〇nm spectrum range of light beam, the former according to the spectrum diagram is generally called a yellow light (Yellow Light, YL) 'the latter is generally called a blue light or blue green light (Bluish Green Light, BGL). The fourth LED package component 70 is electrically connected to the carrier substrate M362514 to supply the fourth LED package component 70 current from the carrier substrate 10 to make the fourth LED The wafer 71 can emit a fourth light different from red, green, and blue light. The fourth light emitted by the fourth LED package component 70 is a yellow light, and the yellow light is a mixed light of red light and green light, and can be mixed with blue light to form white light. In addition, among the red LED package components, the green LED package components, the blue LED package components, and the fourth LED package components, high power (eg, 1 watt (W) or more) LED package components may be used. Can • Reduce the number of settings required, which can also be used for cost creation purposes. The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present embodiments, and the equivalent variations made by those skilled in the art according to the present invention, as well as those well known to those skilled in the art. Changes should still be covered by this creation. M362514 [Simple description of the diagram] The first figure is a schematic diagram of the illumination state of an LED tube. The second figure is a schematic diagram of the illumination state of another LED tube. The third drawing is an exploded perspective view of the first preferred embodiment of the present creation. The fourth drawing is a cross-sectional view of the preferred embodiment shown in the third figure. The fifth drawing is a schematic view of the illumination state of the preferred embodiment shown in the third figure. φ Figure 6 is an exploded perspective view of a second preferred embodiment of the present invention. Figure 7 is a cross-sectional view of the preferred embodiment shown in the sixth diagram. Figure 8 is a perspective view of a partial member of the preferred embodiment shown in the sixth embodiment. The ninth drawing is a schematic view showing the state of use of the preferred embodiment shown in the sixth drawing. The tenth drawing is an exploded perspective view of a third preferred embodiment of the present creation. Figure 11 is a cross-sectional view of the preferred embodiment shown in the tenth diagram. [Explanation of main component symbols] φ "Practical" Green LED component 2 Circuit board 4 Fluorescent powder 6 Red LED component 1 Blue LED component 3 Transparent lampshade 5 "This creation" "First preferred embodiment" Easy to adjust color temperature Three-wavelength LED white light tube structure 1 〇〇 Carrier substrate 1 0 Red LED package component 2 0 13 M362514 Red LED chip 2 1 Cover 2 2 Diffused particles 2 3 Green LED package components 3 0 LED package Component 4 0 Lamp 5 0 Card slot 5 1 Connection body 6 1. Conductive member 6 0 First end 6 1 1 Second end 6 1 2 Conductive cover 6 2 Slot 6 2 1 Conductive terminal 6 2 2 Second Preferred Embodiment Three-wavelength LED white light tube structure for easy adjustment of color temperature 2 0 0 carrier substrate 1 0 red LED package component 2 0 green LED package component 3 0' blue LED package component 4 0' lamp 5 0 ' Card slot 5 1' Light-transmissive opening 5 2 Object 90 0 Conductive member 6 0 Third preferred embodiment Three-wavelength LED white light lamp tube structure that is easy to adjust color temperature 3 0 0 Carrier substrate 1 Red LED package component 2 0 ' Green LED package component 3 0' Blue LED package component 4 0' Lamp 5 0' Conductor 6 0 Fourth light LED package component 7 0 fourth light LED light emitting chip 7 1 cover body 7 2 diffusion particles 7 3