M298783 八、新型說明： ， 【新型所屬之技術領域】 本創作涉及-種主動式天線，尤指-種可簡化製程之主動式天線結構。 【先前技術】 近年來隨著無線通誠業的起飛，對其元件體_驗小的要求，使低溫 共燒陶兗(l〇W-temperature co-firedceramics，LTCC)成為無線通訊模组的被動元 件炙手可熱的技術之一。 • 低溫共燒陶曼（LTCC)是以陶:是作為電路基板材料，藉由將數個只有幾 個/zm厚的陶兗基板堆疊、建入被動元件以及其他忙，而提供了 一個可以節省 大量個別1C裝置賴組技術。其巾㈣電極可分職祕、銅、金等金屬， 在攝氏850〜900多度的燒結爐中，將各種被動元件（如低容值電容、電 •阻、舰器、阻抗轉換器、麵合器等元件埋入多層陶兗基板中）以平行式印刷 塗佈製程燒結形成整合式陶竟元件。因為陶究與石夕的材質極接近，因此適合與 1C晶片連接，且具有省空間、降低成本的優點。使用在行動電話無線射頻 籲⑽）中的濾波器以及其他元件一共有十幾個左右，而LTCC可以讓它們全都 包在-個只有幾公厘平方的封裝中，如今，LTCC技術舰展已進入一個新的階 段’已逐漸。它們開始合作的領域有無線區域網路（WLAN)、地面數位廣播調 諧器 '全球定位系統（GPS)接收器模組、甚至是數位信號處理器⑴奶和記 憶體等數位電路基板。 凊參閱第1圖，第1圖係習知技術應用LTCC技術之天線1〇之示意圖。天 線10包3帛一基板12、一輪射金屬層16、一第二基板14、一饋入金屬層π、 5 M298783 元件2G以及—f孔22。第—基板12係由聽製程燒結而成。而 第基板14般係為FR4的板材的印刷電路板。輻射金屬層】6係用來接收或 發射無線電婦ϋ板12係由―社金顧膜之貫孔22貫通，其係用來 電性連接輻_層1δ以及饋人金屬層ls。上述之第—基板U、輻射金屬層 I6以及饋入金屬層ls作為傳統天線的收發端，而接收/發射之無線電訊號則需 透過其它電路作處理。因此習知技術巾係將各種電路如電容、濾波器、阻抗 轉換器^等電路安裝於第二基板M上。但是傳統刚材質的第二基板Μ與由 LTCC衣転製成的第一基板u在係分別由不同的縣製造，這需要額外的製程 以及成本支出。因此如何製造—滅節省製程細降低成柄天線是急待解決 的問題。 【新型内容】 本創作之主要目的在聽供—種可簡化製程之主動式天線結構。 依據本創作之上述㈣，本齡提供—動歧線，其包含-第一低溫 共燒多層陶究基板，其包含一第一表面以及—第二表面，該第一表面係相對於 該第二表面；—輻射金屬層，《於該第—低溫共燒多餘板之第-表面， 用來接收/發射—無線電減；__第二低溫共燒多層喊基板，其包含—第三表 面以及-第四表面，該第三表面係相對於該第四表面；—魏人金屬層，形成於 該第-低溫共燒多層喊基板之第二表面以及該第二低溫共燒多層·基板之 第=表面之間；以及複數個微型藉，設置於鶴二低温共燒多層喊基板之 該第四表面上，用來處理該無線電訊號。 依據本創作之另一申請專利範圍，其提供一 種主動式天線，其包含一 天線 6 M298783 收Μ，其包含複數_—低溫錄多層陶絲板以及複數個輕射金屬層，每 / 一輻射金屬層係對應於-第-低溫共燒多層陶变基板，用來收發一無線電訊 唬，複數個第二低溫共燒多層陶瓷基板；以及複數個微型元件，設置於該複數 個第二低溫共燒多層喊基板±，用來處賴無線電訊號。 【實施方式】 請參閱第2圖，第2圖係本創作之主動式天線％之示意圖。主動式天線％ 包含-第-基板52、-第二基板54、一饋入金屬層％、一輕射金屬層％、複 •數雛型元件6G。第-基板52以及第二基板54皆為高介電絲之低溫共燒多 層陶瓷基板。一第一低溫共燒多層陶瓷基板52包含一第一表面521以及一 第二表面522 ’第-表面521係相對於第二表面522。輕射金屬層％係形 成於第-低溫共燒多層陶竟基板52之第一表面521，用來接收/發射一無線電 訊號。第三低溫共燒多層陶竟基板54包含_第三表面541以及—第四表 面542，第三表面541係相對於第四表面542。錢上金屬薄膜之貫孔72 使得輻射金制56以及設置於第二低溫錢多層陶懿板％之第四表面 • 542之微型元件60得以相互電性連接。複數個微型元件6〇包含電容、電 阻或電感’或疋由电谷、電阻或電感形成的據波器、放大器以及開關電路等等 用來處理無線電訊號之元件。接地金屬層62係形成於第二低溫共燒多層陶£ 基板54之第四表面544,用來形成主動式天線5〇之接地端。接地金屬層 62以及輻射金屬層56之材質為銀。為了屏蔽外界的雜訊干擾’本實施例可 以在第一基板54上没置一遮蔽罩70，覆蓋於微型元件6〇之上。 請-併參M 3圖以及第4圖’第3圖係本創作之$一實施例之主動式天 7 M298783 線80之示意圖。第4圖係第3圖之主動式天線8〇之俯視圖。主動式天線如包 ，含—第―基板82、一第二基板84、-饋人金屬層88、„輻射金屬層％、複數 個微型tl件60。-第-低温共燒多層陶竞基板82包含_第一表面似以及 -第-表面822，第-表面821係相對於第二表面822。輻射金屬層％係 形成於第-低溫共燒多層陶究基板82之第一表面821，用來接收/發射一無線 電訊號。第二低溫共燒多㉟陶竟基板84包含一第三表φ 841以及一第四表 面842，第三表面84Η系相對於第四表自如。複數個微型元件⑼係設 _ 置於第一低溫共燒多層陶曼基板％之第四表面Μ2上，用來處理該無線 私汛號鍍上金屬薄膜之貝孔72使得輕射金屬層86以及設置於第二低溫 共燒多層陶瓷基板84之第四表面842之微型元件6〇得以相互電性連接。 複數個彳政型元件包含電容、電阻或電感，或是由電容、電阻或電感形成的 慮波為 '放大|§以及開關電路等等用來處理無線電訊號之元件。接地金屬層％ 係形成於第二低溫共燒多層陶:是基板84之第四表面m，用來形成主動式 天線80之接地端。接地金屬層％以及輻射金屬層％之材質為銀。為了屏蔽 _外界的雜訊干擾，本實_可以在第二基板84上設置—遮蔽罩9()，覆蓋 於极型凡件60之上。除此之外，第二基板84另設有突出件％，可用來嵌合 於對應之開槽，而穩固主動式天線8〇。而突出件％上另設有開孔％，其用來 於主動式天線運作時，散逸微型元件6〇在處理無線電訊號產生的大量熱量。 在第2圖以及第3圖所繪示之转式天線⑽和⑽係—單層式天線架構， 當然本實關亦可應多雜構之絲式天線。請參閱第5圖，第$圖係本 .旬作之夕層表構之主動式天線1QQ之示意圖。主動式天線刚包含—天線收發 M298783 區120，其包含複數個第一低溫共燒多層陶瓷基板1〇2以及複數個輻射金屬層 106，每一輻射金屬層1〇6係對應於一第一低溫共燒多層陶瓷基板1犯，用來收 务-無線電訊號。主動式天線1〇〇還包含複數個第二低溫共燒多層陶竟基板 1〇4，其中取外緣之第二低溫共燒多層陶瓷基板1〇4上設置有突出件1仍，而突 出件1〇5上5又有開孔m，翻來散逸設置於複數個第二低溫共燒多層陶曼基板 104上之複數個微型元件6()於處理該無線電訊號時產生之熱量。M298783 VIII. New description: , [New technical field] This creation involves an active antenna, especially an active antenna structure that simplifies the process. [Prior Art] In recent years, with the take-off of the wireless communication industry, the requirements for the small body of the device have made the low-temperature co-fired ceramics (LTCC) become the passive of the wireless communication module. One of the hottest technologies of components. • Low Temperature Co-fired Taman (LTCC) is a ceramic substrate that provides a circuit board material that saves by stacking several ceramic substrates with only a few /zm thickness, building passive components, and other busy A large number of individual 1C devices rely on group technology. The towel (4) electrode can be divided into secret, copper, gold and other metals. In the sintering furnace of 850~900 degrees Celsius, various passive components (such as low capacitance capacitor, electric resistance, ship, impedance converter, surface) The components such as the combiner are embedded in the multi-layer ceramic substrate, and are sintered in a parallel printing coating process to form an integrated ceramic component. Because the material of the ceramics is very close to that of Shi Xi, it is suitable for connection with 1C wafers, and has the advantages of space saving and cost reduction. There are more than a dozen filters and other components used in the mobile radio RF (10), and the LTCC allows them to be packaged in a package of only a few square centimeters. Now, the LTCC technology shipbuilding has entered A new stage 'has gradually. The areas where they began to cooperate include wireless local area networks (WLANs), terrestrial digital broadcast tuner 'global positioning system (GPS) receiver modules, and even digital signal processors (1) digital and digital circuit boards. Referring to Figure 1, Figure 1 is a schematic diagram of an antenna 1 LTCC technology using conventional techniques. The antenna 10 includes a substrate 12, a metallization layer 16, a second substrate 14, a metal layer π, a 5 M298783 element 2G, and a -f hole 22. The first substrate 12 is sintered by an acoustic process. The first substrate 14 is a printed circuit board of a FR4 board. Radiation metal layer] The 6 series is used to receive or transmit the radio radiant slab. The 12 series is connected by the through hole 22 of the ECO film, which is used to electrically connect the radiant layer 1δ and the feeding metal layer ls. The above-mentioned first substrate U, the radiating metal layer I6 and the feeding metal layer ls serve as the transmitting and receiving ends of the conventional antenna, and the received/transmitted radio signals are processed through other circuits. Therefore, the conventional technology system mounts various circuits such as a capacitor, a filter, an impedance converter, and the like on the second substrate M. However, the second substrate 传统 of the conventional rigid material and the first substrate u made of the LTCC vestibule are separately manufactured by different counties, which requires additional processes and costs. Therefore, how to manufacture--eliminate the process and reduce the size of the antenna is an urgent problem to be solved. [New Content] The main purpose of this creation is to listen to the active antenna structure that simplifies the process. According to the above (4) of the present invention, the present invention provides a dynamic profile comprising: a first low temperature co-fired multi-layer ceramic substrate comprising a first surface and a second surface, the first surface being opposite to the second Surface; - a radiant metal layer, "on the first-low temperature co-firing the first surface of the excess plate, for receiving/emitting-radio subtraction; __ second low temperature co-fired multi-layer shouting substrate, which includes - the third surface and - a fourth surface, the third surface is opposite to the fourth surface; a Weier metal layer formed on the second surface of the first low temperature co-fired multilayer substrate and the second low temperature co-fired multilayer substrate Between the surfaces; and a plurality of micro-borrows, disposed on the fourth surface of the Hiroshi low-temperature co-fired multilayer shingling substrate for processing the radio signal. According to another patent application scope of the present invention, an active antenna is provided, which comprises an antenna 6 M298783, which comprises a plurality of low-temperature recording multi-layer ceramic plates and a plurality of light-emitting metal layers, each of which is irradiated with metal. The layer system corresponds to a first-low temperature co-fired multi-layer ceramic substrate for transmitting and receiving a radio signal, a plurality of second low-temperature co-fired multi-layer ceramic substrates, and a plurality of micro-components disposed on the plurality of second low-temperature co-fired Multi-layer shouting substrate ± used to rely on radio signals. [Embodiment] Please refer to Fig. 2, and Fig. 2 is a schematic diagram of the active antenna % of the present invention. The active antenna % includes a -first substrate 52, a second substrate 54, a feed metal layer %, a light metal layer %, and a plurality of prototype elements 6G. The first substrate 52 and the second substrate 54 are low temperature co-fired multi-layer ceramic substrates of high dielectric wires. A first low temperature co-fired multilayer ceramic substrate 52 includes a first surface 521 and a second surface 522'. The first surface 521 is opposite the second surface 522. The light metal layer % is formed on the first surface 521 of the first low temperature co-fired multilayer ceramic substrate 52 for receiving/transmitting a radio signal. The third low temperature co-fired multilayer ceramic substrate 54 includes a third surface 541 and a fourth surface 542, the third surface 541 being opposite the fourth surface 542. The through hole 72 of the metal film allows the radiation gold 56 and the fourth surface of the second low temperature multilayer ceramic board to be electrically connected to each other. A plurality of micro-components 6A include capacitors, resistors, or inductors or elements that are formed by electric valleys, resistors, or inductors, amplifiers, and switching circuits, etc., for processing radio signals. The grounding metal layer 62 is formed on the fourth surface 544 of the second low temperature co-fired multilayer substrate 54 for forming the ground end of the active antenna 5'. The material of the ground metal layer 62 and the radiant metal layer 56 is silver. In order to shield the external noise interference, the present embodiment may be provided with a mask 70 on the first substrate 54 to cover the micro-element 6. Please - and refer to the M 3 diagram and the 4th diagram 'Fig. 3 is a schematic diagram of the active day 7 M298783 line 80 of the present embodiment. Fig. 4 is a plan view of the active antenna 8A of Fig. 3. The active antenna, such as a package, includes a first substrate 82, a second substrate 84, a donor metal layer 88, a radiant metal layer %, and a plurality of micro tl members 60. - a low temperature co-fired multi-layer ceramic substrate 82 The first surface is similar to the first surface 822, and the first surface 821 is opposite to the second surface 822. The radiant metal layer is formed on the first surface 821 of the first low temperature co-fired multilayer ceramic substrate 82, Receiving/transmitting a radio signal. The second low temperature co-fired substrate 35 includes a third table φ 841 and a fourth surface 842, and the third surface 84 is freely movable relative to the fourth table. The plurality of micro-elements (9) are设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置 设置The micro-components 6 of the fourth surface 842 of the fired multi-layer ceramic substrate 84 are electrically connected to each other. The plurality of eccentric components include a capacitor, a resistor or an inductor, or a wave formed by a capacitor, a resistor or an inductor is 'amplified| § and switching circuits, etc. are used to process the radio The component of the grounding metal layer is formed on the second low-temperature co-fired multi-layer ceramic: it is the fourth surface m of the substrate 84, and is used to form the grounding end of the active antenna 80. The material of the ground metal layer % and the radiant metal layer % In order to shield the external noise interference, the present embodiment can be disposed on the second substrate 84 - a mask 9 () covering the polar device 60. In addition, the second substrate 84 is additionally provided. The protruding member % is provided for fitting into the corresponding slot, and the active antenna 8 is stabilized. The protruding member % is additionally provided with an opening %, which is used for dissipating the micro component 6 when the active antenna is operated.处理Processing a large amount of heat generated by radio signals. The rotary antennas (10) and (10) are single-layer antenna architectures shown in Figures 2 and 3, of course, this can also be used for multi-hybrid wire antennas. Please refer to Fig. 5, which is a schematic diagram of the active antenna 1QQ of the layered structure. The active antenna just includes an antenna transceiver M298783 area 120, which includes a plurality of first low temperature co-fired layers. a ceramic substrate 1 〇 2 and a plurality of radiant metal layers 106, each The metallization layer 1〇6 is corresponding to a first low-temperature co-fired multi-layer ceramic substrate 1 for receiving a radio signal. The active antenna 1〇〇 further comprises a plurality of second low-temperature co-fired multi-layer ceramic substrates. 4, wherein the second low temperature co-fired multilayer ceramic substrate 1 〇 4 on the outer edge is provided with the protruding member 1 still, and the protruding member 1 〇 5 has an opening m in the upper portion 5, and is turned over and disposed in the plurality of second low temperatures. The plurality of micro-elements 6 on the multi-layered Tauman substrate 104 are co-fired to generate heat when the radio signal is processed.
與本創作之先珂技術相比較，本創作之主動式天線在一低溫共燒多層陶瓷 基板上置複數個微型元件，來取代傳統上將複務個微型元件設置於印 屈U路板上的設計。這麼_來，在製程上，用來設置複數個微型元件的低溫 ϋ陶錄板可以與設置於傭金屬層錢人金屬狀間的低溫共 W層喊基板_次完成，所以可以減少額外的成本支出。 •上述實施例之特徵在於第一基板以及第二基板皆為同—低溫共燒多層 陶是陶储質構成，因此可以以同—共燒製程完成。也就是說本創作提 供一種將傳統第-基板从設置有複數倾型元件之第二基板加以整合 的主動式天線，並可_同―共燒製程將第—基板以及第二基板與其上 之複數個微型元件—次完成，故可大大減少製程與成本支出。 、 彳述本創作確已符合創作專利之要件，妥依法提出專利申請。惟， w所作之等效修飾或變化，皆涵蓋於後附之中請專利範圍内。 【圖式簡單說明】 9 M298783 第1圖係習知技術應用LTCC技術之天線之示意圖。 第2圖係本創作之主動式天線之示意圖。 第3圖係本創作之另一實施例之主動式天線之示意圖。 第4圖係第3圖之主動式天線之俯視圖。 第5圖係本創作之多層架構之主動式天線之示意圖。 【主要元件符號說明】Compared with the prior art of this creation, the active antenna of the present invention is provided with a plurality of micro-components on a low-temperature co-fired multi-layer ceramic substrate instead of the conventionally disposed micro-components on the printed circuit board. design. In this way, in the process, the low-temperature enamel recording board used to set a plurality of micro-components can be completed with the low-temperature common W-layer substrate disposed between the metal layer of the servant metal layer, so that the additional cost can be reduced. expenditure. The above embodiment is characterized in that the first substrate and the second substrate are both of the same-low-temperature co-fired multi-layer ceramics, and thus can be completed by the same-co-firing process. That is to say, the present invention provides an active antenna in which a conventional first substrate is integrated from a second substrate provided with a plurality of tilting elements, and the first substrate and the second substrate are combined with the same The micro-components are completed in one step, which greatly reduces process and cost. It is stated that this creation has indeed met the requirements for the creation of a patent and has filed a patent application in accordance with the law. However, equivalent modifications or changes made by w are covered by the scope of the patents attached. [Simple description of the diagram] 9 M298783 Fig. 1 is a schematic diagram of an antenna using LTCC technology in the prior art. Figure 2 is a schematic diagram of the active antenna of the present invention. Figure 3 is a schematic illustration of an active antenna of another embodiment of the present invention. Figure 4 is a plan view of the active antenna of Figure 3. Figure 5 is a schematic diagram of the active antenna of the multi-layer architecture of the present invention. [Main component symbol description]
10 主動式天線 12 第一基板 14 弟二基板 16 幸S射金屬層 18 饋入金屬層 20 微型元件 22 貫孔 50、80 主動式天線 52、82 第一基板 54、84 弟一基板 56、86 輻射金屬層 58、88 饋入金屬層 60 微型元件 62、96 接地金屬層 70、90 遮蔽罩 85 突出件 92 開孔 52 卜 821 弟一表面 522 、 822 第二表面 54 卜 842 第三表面 542 、 842 第四表面 100 主動式天線 120 天線收發區 102 第一基板 104 第二基板 105 突出件 112 開孔 1010 Active antenna 12 First substrate 14 Second substrate 16 Fortunately, S metal layer 18 is fed into metal layer 20 Micro component 22 Through hole 50, 80 Active antenna 52, 82 First substrate 54, 84 Younger substrate 56, 86 The radiant metal layers 58, 88 are fed into the metal layer 60. The micro-elements 62, 96 are grounded metal layers 70, 90, the mask 85, the protrusions 92, the openings 52, the 821, the first surface 522, the second surface 54, the second surface 542, 842 fourth surface 100 active antenna 120 antenna transceiver area 102 first substrate 104 second substrate 105 protruding member 112 opening 10