M291175 八、新型說明： 【新型所屬之技術領域】 有防=麵有關於一種模組構裝結構，尤其係指-種且 有防EMI之模組構裴結構。 種… 【先前技術】 如弟一圖所不，传為羽* l 一基板10上電性連接腿之模組結構，係於 件]1 3电零件1 1 ,再於該等電子零 Μ 土板1 〇上設置以金屬製成之 隸罩1 2可提供電磁韻效果，心防止電磁干 能，再以錫I曰之11後，必須先測試確認該模組之功 、易、干之方式將該遮蔽罩1 2銲於·^亥美板1 η卜甘 遮蔽該等電子灾株]τ —平1乙奸瓦。亥基板1 〇上亚 功能，以二/11，元成後需再次測試確認該模組之 ’此=式1 該等電子零件11遭受破壞。惟，以 生產1模式。之成型率低、瑕疲率高且無法達到大量 • ，需重複測試該模組之功能，無法縮短 際使用上曰t可知’上述習知防EMI之模組結構，在實 ”上，頭然具有不便與缺失存在，而可待加以改盖者。 究並2學缺失之可改善，乃特;心研 上述缺失之本創作。 種。又。十口理且有效改善 【新型内容】 本創作之目的，係提供一種具有防腿之模組構裝結 5 M291175 =果利^於基板及絕緣層上附著—導電層，提供電磁遮蔽 疵口：防止電磁干擾’並能避免人為疏失所造成之瑕 疵°°，可提高產品成型率之功效。 構裝創作：供-種具有防EMI之模组 的表面上；-絕緣層，其係形成於該基板上而包M291175 VIII. New description: [New technical field] There is a module structure for the module structure, especially the module structure with anti-EMI. Kind of [Prior Art] If the figure is not in the picture, it is transmitted as a feather. The module structure of the electrical connection leg of the substrate 10 is attached to the piece]1 3 electric parts 1 1 and then to the electronic zero earth The plate 1 is provided with a metal cover 1 2 to provide electromagnetic effect, and the heart prevents electromagnetic dry energy. After the tin I 11 , the method must be tested to confirm the function, easy and dry of the module. The mask 1 2 is welded to the ^ haimei board 1 η Bu Gan to shield the electronic disaster strains] τ - Ping 1 奸 奸. The board 1 has an upper sub-function, which is 2/11, and needs to be tested again to confirm the module. This is the destruction of the electronic parts 11. Only, in production mode. The molding rate is low, the fatigue rate is high, and it is impossible to reach a large number. • The function of the module needs to be tested repeatedly, and the use of the above-mentioned conventional anti-EMI module structure can not be shortened. Inconvenience and lack of existence, but can be changed to cover. Study and 2 learning can be improved, but special; heart research on the above-mentioned missing creation. Kind. Also. Ten-and-nothing and effective improvement [new content] This creation The purpose is to provide a module assembly with anti-legged 5 M291175 = fruit on the substrate and the insulation layer - conductive layer, providing electromagnetic shielding mouth: prevent electromagnetic interference 'and can avoid human error caused by瑕疵°°, can improve the molding rate of the product. Build creation: for the surface of the module with anti-EMI; - insulation layer, which is formed on the substrate
層以及一導電層’其附著於該基板及該絕緣 ，、中，邊基板具有一個以上的接地孔及一金屬$ ==地孔貫通至該金“層，該基板的至少—接地孔 二=層外’使該導電層附著於該外露之接地孔 為使能更進一步瞭解本創作之特徵及技術内容，&夂 :::t關本創作之詳細說明與附圖，然而所附圖式：i 考與况明用，並非用來對本創作加以限制者。 【實施方式】 =閱第二圖及第三圖，本創作係提供—種具有防 ectromagnetic Interference，電磁干擾）之握 組構裝結構，包括一基板2 〇、一個以上的電、 〇、一絕緣層40、及一金屬材質之導電層5〇。 請參閱第二圖，該基板2 〇係為一 pcB板，該電子愛 ΐ3 2係電性連接地設置於該基板2 0的表面上，係於該 電子零件3 0連接複數個導線3 1至該基板2 〇上，用以 達到所需之功能，該基板2 〇上係可依需求設置一個或一 個以上的電子零件3 0，於本創作係設置二個電子零件3 〇 ;該絕緣層4 0係形成於該基板2 〇上而包覆該電子零 6 M291175 件3 Ο，即係以1C封裝之方式用以保護該電子零件3 0，該絕緣層4 0可係為環氧樹脂（Ep〇xy Resin)或〒 亞醯胺（Polyimide)。該電子零件3 〇、該基板2 〇及^ 等導線3 1連接方式及1C封裝技術原理為業界所皆知f 故不再贅述。 該基板2 0具有一個以上的接地孔2 1、及一金屬箱 層2 2，該金屬箔層2 2位於該基板2 〇的内部，該接2 孔2 1係没置於该基板2 0適當位置處上，且貫通至該金 屬箔層2 2，且該接地孔2 1係露出於該絕緣層4 〇外。 ❿ 該外露之接地孔21可設為一個或一個以上，於本創作中 ‘ 最佳的實施例係設為四個接地孔21，且係分別設置於該 基板2 0的四邊端面上。 人 請參閱第三圖，並請配合參閱第二圖，該導電層5 〇 係附著於該基板2 0、該外露之接地孔2 、該金屬箔層 2 2及該絕緣層4 0上，該導電層5 〇可係採用電鍍 (Electroplating)、無電解式電鍍（Electr〇lessplating)、真 空瘵鍍（Vacuum Evaporation)、濺鍍（Sputtering)、或塗佈 _ (Coatmg)等之附著方式，形成於該基板2 0、該外露之接 4 地孔2 1、該金屬箔層2 2及該絕緣層4 0上，可提供電 磁遮蔽效果，用以防止電磁干擾。 产本創作係於基板2 〇設置接地孔2 且貫通至金屬 泊層2 2，並利用ic封裝技術包覆上絕緣層4 〇，再於 2 0、接地孔2 1、金屬箔層2 2及絕緣層4 0上附 著=電層5〇,利用導電層50與基板2 0、接地孔2 1 及孟屬名層2 2電性連接，將形成於絕緣層4 〇間的雜訊 7 M291175 電流導至金屬層2 2 ’以達到EMI接地之效果。 綜上所述，本創作之具有防EMI之電子零件 改良，利用i C封裝之技術原理，並可達到防E M!之=構 ^有效改知技術之癥結，不需以繁複製程方式 腿之功效，可減少製程工時，且能提供大量生產 方 2避免人為疏失所造成之瑕疲品，可提高產品成型率之功 ^ Γ以上所述僅為補作之健可行實施例，非因此即 :(創作之專利範圍，故舉凡運用本創作說明書及圖式 谷所為之等效結構變化，均同理皆包含於本創作 内，合予陳明。 【圖式簡單說明】 ==圖為習知防ΕΜΙ之模組結構之立體圖。 第二圖為本創作具有肖ΕΜΙ之模組構裝結構之立體透視 圖。 弟二圖為本創作具有防EMI 【主要元件符號說明】[習知] 之模組構裝結構之立體圖 1 〇基板 ii 電子零件 1 2遮蔽罩 f本創作] 接地孔 2 〇基板 M291175 2 2 金屬箔層 3 0 電子零件 3 1 導線 4 0 絕緣層 5 0 導電層 9a layer and a conductive layer 'attached to the substrate and the insulating layer, wherein the side substrate has more than one grounding hole and a metal $== ground hole penetrates to the gold "layer, at least the grounding hole of the substrate = The outer layer's attachment of the conductive layer to the exposed grounding hole enables a further understanding of the features and technical contents of the present creation, &:::t detailed description and drawings of the creation, however, the drawing :i Tests and conditions are not used to limit the creation of this work. [Embodiment] = Read the second and third pictures, this creation provides a grip group with anti-ectromagnetic Interference, electromagnetic interference) The structure comprises a substrate 2 〇, more than one electric, 〇, an insulating layer 40, and a conductive layer 5 of a metal material. Referring to the second figure, the substrate 2 is a pcB board, and the electronic ΐ 3 2 is electrically connected to the surface of the substrate 20, and the electronic component 30 is connected to the plurality of wires 3 1 to the substrate 2 to achieve the desired function, and the substrate 2 is attached to the substrate. One or more electrons can be set as required In the present invention, two electronic components are disposed in the present invention; the insulating layer 40 is formed on the substrate 2 to cover the electronic component, and is encapsulated in a 1C package. Protecting the electronic component 30, the insulating layer 40 may be an epoxy resin (Ep〇xy Resin) or a phthalimide (Polyimide). The electronic component 3 〇, the substrate 2 〇 and the wire 3 1 are connected. The method and the principle of the 1C packaging technology are well known in the art, so the substrate 20 has more than one grounding hole 2 1 and a metal box layer 2 2 , and the metal foil layer 2 2 is located on the substrate 2 . Internally, the second hole 2 1 is not placed at the appropriate position of the substrate 20, and penetrates to the metal foil layer 22, and the ground hole 2 1 is exposed outside the insulating layer 4. ❿ The exposed The grounding hole 21 can be set to one or more. In the present invention, the 'best embodiment is set as four grounding holes 21, and are respectively disposed on the four end faces of the substrate 20. Please refer to the third. Figure 2, and with reference to the second figure, the conductive layer 5 is attached to the substrate 20, the exposed ground hole 2, the gold On the foil layer 2 2 and the insulating layer 40, the conductive layer 5 can be electroplated, electroplated, vacuumed, vaporized, or sputtered. An adhesion method such as coating (Coatmg) or the like is formed on the substrate 20, the exposed ground hole 2 1 , the metal foil layer 2 2 and the insulating layer 40, thereby providing an electromagnetic shielding effect for Prevent electromagnetic interference. The production is based on the substrate 2, the grounding hole 2 is provided, and the metal plating layer 2 2 is penetrated, and the insulating layer 4 is covered by the ic packaging technology, and then the grounding hole 2 1 and the metal foil layer 2 2 are covered by the ic packaging technology. The insulating layer 40 is attached to the electrical layer 5〇, and the conductive layer 50 is electrically connected to the substrate 20, the grounding hole 2 1 and the Meng name layer 2 2 to form a noise 7 M291175 current formed between the insulating layer 4 Lead to the metal layer 2 2 ' to achieve the effect of EMI grounding. In summary, the creation of the electronic parts with anti-EMI, using the technical principles of the i C package, and can achieve the anti-EM! = structure of effective correction technology, without the need to copy the legs , can reduce the man-hours of the process, and can provide a large number of production side 2 to avoid the fatigue caused by human error, can improve the product forming rate ^ Γ The above is only a healthy and feasible embodiment of the supplement, not the following: The scope of the patents created, so the equivalent structural changes made by the use of this creation manual and the pattern valley are all included in this creation, and are combined with Chen Ming. [Simplified illustration] == The perspective view of the module structure of the 。. The second picture is a perspective view of the module structure with Xiao Wei. The second picture is a module with anti-EMI [main component symbol description] [known] Stereo view of the structure 1 〇 Substrate ii Electronic parts 1 2 Shield f created] Ground hole 2 〇 Substrate M291175 2 2 Metal foil layer 3 0 Electronic part 3 1 Conductor 4 0 Insulation 5 0 Conductive layer 9