M290361 八、新型說明： 【新型所屬之技術領域】 本創作係有關-種導電基板，尤指一 隔設置有導電元件之導電^ 板材上寻間 可有效降低生產成本與廢料產生，適用文机且 連接之使用者。 飞电子材科用以電性 【先前技術】 現今各式電子材料在與互連 -導電基板來作為電性連接。，：:之=設備’常利用 盥舛声禪„* ▲ 明多閱弟1圖，以電腦中用 連;二二電連接器(如平面栅袼陣列（“A) π相H平面婦陣騎接_ 插設有複數個導電端子c，藉 丄反：上，M290361 VIII. New description: [New technical field] This creation is related to a kind of conductive substrate, especially the conductive plate on which the conductive element is placed, which can effectively reduce the production cost and waste, and is suitable for the machine. Connected users. The use of the fly-electronics family is electrical. [Prior Art] Various electronic materials are now electrically connected to the interconnect-conducting substrate. , :: ==Device 'usually use 盥舛声禅 „* ▲ Ming Duo reading brother 1 map, to use in the computer; two or two electrical connectors (such as plane grid array ("A) π phase H plane array Ride the _ plug with a plurality of conductive terminals c, by the reverse: up,
之前::: 模組，其導片可接觸到導電端子C 而導電端子c末端則供焊接在印刷電路板上，使 連=柵格陣列晶片模組與印刷電路板之間形成穩定之電性 電性連接器的組合’其雖可透過導電端子c來達到 極易產生彈性疲乏，你2 折之設計’久用後 縮乏使其減低向上抵壓的力量，而產生接 不良的現象。當複數個導電端子c π a± h j @ s 組時，而未於保…… 同牯向上抵屋晶片模 則將無法、^了母導電端子c皆能與導片緊密接觸， C，1阻:…性連接的目的，同時彎折過後之導電端子 爲增加’相對地影響到傳輸之效率。 【新型内容】 M290361 本創作之主要目的在提供-種結構簡單、傳輸效果佳、且 可有效降低生產成本與廢料產生之導電基板。 為達上述之目f本創作所設之一種導電基板，包括 一板材，該板材上係等間隔設置有複數個孔洞，供導電元 件配置後，形成電子元件相互導通之導電基板。 為進一步了解本創作，以下舉較佳之實施例，配合圖 示、圖號，將本封作之具體構成内容及其所達成的功效詳 0細說明如后： 【實施方式】 請參閱第2、3圖，圖示内容為本創作導電基板丨一實 施例，用以供各式電子材料電性連接之使用。Before::: module, the guide piece can contact the conductive terminal C and the end of the conductive terminal c is soldered on the printed circuit board, so that the stable = grid array chip module and the printed circuit board form a stable electrical The combination of electrical connectors, which can pass through the conductive terminal c, is extremely prone to elastic fatigue. Your 2-fold design is designed to reduce the upward pressure when it is used for a long time, resulting in poor connection. When a plurality of conductive terminals c π a± hj @ s group, but not guaranteed ... the same as the upward facing the wafer die will not be able to, the mother conductive terminal c can be in close contact with the guide, C, 1 resistance: The purpose of the sexual connection, while the conductive terminals after bending are increased to 'relatively affect the efficiency of transmission. [New Content] M290361 The main purpose of this creation is to provide a conductive substrate with a simple structure, good transmission effect, and effective reduction of production cost and waste. A conductive substrate provided for the purpose of the present invention comprises a plate material having a plurality of holes equally spaced at intervals to form a conductive substrate on which the electronic components are electrically connected to each other. In order to further understand the present invention, the following preferred embodiments, together with the drawings and figure numbers, detail the specific components of the present invention and the effects achieved by the present invention as follows: [Embodiment] Please refer to section 2. 3 is a diagram showing an embodiment of a conductive substrate for creating an electrical connection of various electronic materials.
遠導電基板1係包括-板材u ’該板材u係為塑膠材質 製成，該板材11上係等間隔設置有複數個孔洞13，供導電 元件12垂直置入後，可穩固容置於孔洞13内。 實施時，請再參閱第2〜4圖，以製作插座式連接器2 之導電基板1為例，首先於板材u上等間隔設置有複數個孔洞 I3，然後將導電元件n(如單芯或多芯之金屬導線)直接垂直置 入於孔洞13内，並令該導電元件12可穩固容置於孔洞13 内’且$電元件12兩端係與板材i J上下之表面切齊。 藉此，如第3、4圖所示，經由上述製出之導電基板i，可供與 插座式連接$ 2組裝，而該導電基板卜端面可再經由錫濟而使 附著錫球3後1以與電路板連接，而導電基板丨另—端面職與带 子材料如CPU作電性連接。 ’、兒 6 M290361 又’本創作導電基板1所設之導電元件12可設為一連續 之s型導電元件14,其一端切除後所形成之複數個〇型導電元件 14(如第5圖所示），使鋪設在板材u上後，用以增加 之電性接觸。或是該導電元件15係呈—η形， 形成有折片15卜供與錫球3相結合(如第6、7 · ° ’疋向内 導帝分I 及口 。 f圖所不）；或是該 因此，本創作具有以下之優點： 1.本創作導電基板，其導電元件係直接垂直置於板材上 須另行加工及彎折，故除了可省略習用導電端子 過程，無須彎折之導電元件更可降 2° 效果。 t低阻抗'提向傳輸之 之S型導電元件，其— ’使鋪設在板材上後，用 電元件底端設有折片，The far-conducting substrate 1 includes a plate u' which is made of a plastic material, and the plate 11 is provided with a plurality of holes 13 at equal intervals, and the conductive member 12 is vertically placed therein to be stably placed in the hole 13 Inside. In the implementation, please refer to the second to fourth figures, taking the conductive substrate 1 of the socket connector 2 as an example. First, a plurality of holes I3 are equally spaced on the plate u, and then the conductive element n (such as a single core or The multi-core metal wire is directly inserted into the hole 13 vertically, and the conductive member 12 can be stably received in the hole 13 and the two ends of the electric component 12 are aligned with the upper and lower surfaces of the plate i J . Thereby, as shown in FIGS. 3 and 4, the conductive substrate i prepared as described above can be assembled with the socket type connection, and the end surface of the conductive substrate can be attached to the solder ball 3 via the tin. In connection with the circuit board, the conductive substrate is electrically connected to the tape material such as the CPU. ', child 6 M290361 and 'the conductive element 12 provided in the present conductive substrate 1 can be set as a continuous s-type conductive element 14, a plurality of 〇-shaped conductive elements 14 formed after one end cut off (as shown in Figure 5 Show), after laying on the board u, to increase the electrical contact. Or the conductive element 15 is in the shape of a -n, and is formed with a flap 15 for bonding with the solder ball 3 (for example, the sixth, seventh, ° '疋 inward guides the I and the mouth. f is not shown); Or, therefore, the creation has the following advantages: 1. The conductive substrate of the present invention has its conductive components directly placed on the sheet material and must be separately processed and bent, so that the conductive terminal process can be omitted, and the conductive is not required to be bent. The component can be reduced by 2°. t low-impedance 'stoothed S-type conductive elements, which are placed on the board, and the bottom end of the electrical component is provided with a flap.
2·本創作所設之導電元件可設為一連續 端切除後所形成之複數個U型導電元件 以增加與電子材料之電性接觸，或是於導 以利與錫球相結合。 依以上所揭示之說明與圖式 創作之預期目的，提供一種結構簡單可達到 把止+、， 1寻哥效果佳、且可有敔隆 本與廢料產生之導電基板。以上戶斤述乃是本創作之且體 所運用之技術手段，根據本文的揭露或教導可衍 咏妆傳 創作之構想所作之等 交，/、所產生之作用仍未超出說明奎 眚暂杜斗η士 曰及圖式所涵盍之 貫貝精神蚪，均應視為在本創作之技 明。 仅婀乾嚀之内，合先陳 7 M290361 【圖式簡單說明】 :圖係為§用電連4 導電基板之立 第2圖係盔士〜 版外靦分解圖。 m 作實施例導電基板之立體外觀分解圖。 # /糸為本創作實施例導電基板之剖面圖。 弟圖係為本創作實施例中導電 ^之使用狀態示意圖。 I插底式連接器結合時2. The conductive element provided in this creation can be set as a plurality of U-shaped conductive elements formed after a continuous end cut to increase the electrical contact with the electronic material, or to facilitate the combination with the solder ball. According to the above-mentioned explanations and the intended purpose of the creation of the drawings, a conductive substrate having a simple structure and capable of achieving a good effect of the +, 1 and the generation of waste materials and scraps can be provided. The above accounts are the technical means used by this creation and the body is used. According to the disclosure or teaching of this article, the concept of the creation of the makeup can be made, and the effect is not exceeded. The spirit of the η 曰 曰 and the 所 蚪 图 图 图 蚪 蚪 蚪 蚪 蚪 蚪 蚪 蚪 蚪 蚪 蚪 蚪 。 。 。 。 Only in the dry, the first Chen 7 M290361 [Simple description of the diagram]: The figure is § with the electrical connection of 4 conductive substrate. Figure 2 is the helmet ~ version of the external exploded view. m is a perspective exploded view of the conductive substrate of the embodiment. # /糸 is a cross-sectional view of the conductive substrate of the present embodiment. The figure is a schematic diagram of the state of use of the conductive ^ in the present embodiment. I insert the bottom connector when combined
If:創作導電元件設為一連續之s型導電元件直 ㈣除後’所形成之複數個D型 w 70件’其一 面圖。 、尾70件與板材結合時之剖 第6圖係為本創作導電元件 板材結合後之剖面圖。 弟⑽為本創作導電元件 μ 板材結合後之剖面圖。 籲第8圖係為本創作導電元件 【主要元件符號說明】 1、 導電基板 12、導電元件 14、導電元件 151、折片 2、 插座式連接器 Α、平面栅格陣列連接器 C、導電端子 ’η形(底部向外形成有折片）時與 门形(底部向内形成有折片）時與 ζ形日寸與板材結合後之剖面圖。 、板材 13'孔洞 15、 導電元件 16、 導電元件 3、錫球 β '基板 8If: the conductive element is created as a continuous s-type conductive element. (4) A side view of a plurality of D-type w 70 pieces formed by the latter. Section 70 of the tail when combined with the sheet material Fig. 6 is a cross-sectional view of the sheet of the conductive member. Brother (10) is a cross-sectional view of the creative conductive element μ plate combined. 8 is a creative conductive element [main component symbol description] 1. Conductive substrate 12, conductive element 14, conductive element 151, flap 2, socket connector 平面, planar grid array connector C, conductive terminal A cross-sectional view of the 'n-shaped (the bottom is formed with the flaps) and the door shape (the bottom is formed with the flaps inward). , sheet 13' hole 15, conductive element 16, conductive element 3, solder ball β 'substrate 8