M286564 八、新型說明： 【新型所屬之技術領域】 本卿祕触散娜’從-種具料触板餘管組合之 熱器組合結構之均溫散熱器。 【先前技術】 、隨著電觀體技_進步，現今各觀子元件之贿效率皆有長 4足進但是，隨著電子元件效率的提升，所消耗之功率亦相對較高， 因而谷易產生高溫，以致造成過熱而無法正常運作嚴重時，甚至有 電子元件驗之虞，，裝錄錄置便絲電林料可或缺之 施，藉著餘裝置降低電子元件所產生之高溫，使其得 於正常工作溫度。 習用之散絲置，主要係藉-導熱金屬與電子元件表 梦 金^表面錢有·，且雜絲面並套财複數則，使電 生之触得經由導熱金屬之直接接觸方式轉遞至熱管，使其 能十八二=表面’進一步達到降溫的目的。然’此種方式，該i 能平於電子元件與導熱金屬接觸之部位，而無法有效將熱 想^均刀佈於導熱金屬表面，以致其表面以及熱管之散錄況皆不理 10 ^所Γ有均溫板10之設計產生（如第1圖所示），藉著均溫板 雜11叹之工作流體11及毛細組織12 ,而使熱能得以藉由工作流 而充分傳導至均溫板10的每個角落，藉以達到均溫目的。 其表1G設計雖可有效達到均溫的絲，雜能可透過 使用時，卻的傳導至錄片14表面’但’於實際組裝及 問題或复叛撞=焊接其熱管13，常因與均溫板1〇表面焊接 無法達導效果不佳等種種因素，因而造成均溫板1〇與熱管13 TP〇S〇226 f均'现之效果，而導致均溫板10溫度無法充分的傳導至熱管 M286564 13 ’而其熱導效果大打折扣。 【新型内容】 有鑑於此，本創作提出一種均溫散 及均溫板内部設為相通，以供其均溫板之熱能可充分的二=工= 該均溫板與熱管間得達到均溫化效果。 透、…g ,使 為達上述目的’本創作之均溫散熱器 管以及-籍片組，其中均溫板内部具有 ^ 複數熱 別固定於均秘表面，該#U 1 i 等熱管係分 該熱管之内部空間係與ί在^ 教能充、中工腔至相通;藉此，使該均溫板之 的、。充刀的傳奸絲，舰均職熟抑得叫财效均溫之目 依據本創作之均溫散熱器，其中均 及毛細組織，做触爾作· ^本創作之均溫散熱器，其中熱管之内部空間係填 體以及毛細組織，係使熱管各處均可達到均溫之效果。 ^ 【實施方式】 -較作:上ί之目的，所採用之技術手段及其餘功效，兹舉 較佳實施例，並配合圖式純卿如下·· 竿 參閲第2及3圖，第2圖為本創作均溫散熱器之結構示专圖以 本創H散細之顯示缝之舰雜之結構示“。 如圖所不，本創作之均溫散熱器，係包含一均溫板2〇 上321鰭片組4°;其中均溫板2G係設於發熱元件H表面，並由： 及下板體22所構成，而於其内部形成一中空腔 ==液_以及毛細組織咖，而工作液體231主要目的在用^ 曰沾广使熱能得以平均分佈於均溫板20上，而毛細組織232主要 tp_於承載工作液體231，使該液鳢不虞因外力搖晃而流動並集中 6 M286564 於中玉腔至23 —側，此外，上板體21表面係設有與中空腔室23相通 之複數套筒211，係用以套接複數熱管30，使其可固定於均溫板2〇 上0 而複數熱管30彼套接而固定於上板體21上，其内部係具有一内 邛二間31，且該空間並同樣填充有用以傳遞熱能之工作液體311以及 •用以承載該液體之毛細組織312，而本創作主要在於：該熱管3〇之内 •部空間31係與前述之均溫板20之中空腔室23相通，藉此，均溫板 20内之工作液體32丨係可將熱能由發熱元件Η傳遞至熱管3〇之工作 φ液體311内，使知均溫板20之熱能得以充分傳遞於熱管3〇，俾以達 到均溫板20與熱管3〇均溫之目的； 阳箱；ί組40係係由複數鰭片41所組成，而鰭片型狀及數量可依 ^用需求而定，且該韓片41係以等間距方式套接熱管3〇表面上， 1，氣_面積較Α之則4卜使鮮3G之熱祕以迅速傳導 至空氣中，進一步地達到熱交換之目的，另外，本創作之鰭片组40 結構在此不雜定，僅要是可將達職增進熱交換皆可，更且體 ，言’本創作之鰭片組40之側邊係可依絲而加裝一轴流式風扇、45 2上未不），藉著該風扇45帶動氣流，使簿片表面之熱能得迅速地 得遞至空氣，藉以而達到加速熱交換率的目的。 魅^次參㈣3圖，本解均溫板20健設錄航件Η表面並 ^接觸，而當該元件產生熱能時，均溫板2G内之工作液趙231係可 2收該熱能’並藉著均溫板2G之中空腔室23與熱㈣之 31間相通，而使熱能可直接傳遞至熱管3〇内部空間沿之工作液體祀 :’使均溫板20與熱管30可有效達到均溫之目的， 片4i將熱管3G之無由找帶走崎到餘之絲。再藉由鰭 作眘，僅為賴作之—㈣實_，並翻聰定本創 範1故及’凡_，請專利顧所述之形狀構造特徵 :M286564 參 及精神所為之均等變化與修飾，均應同時包含於本創作之申請專利範 圍内。 【圖式簡單說明】 第1圖為習用散熱裝置之結構示意圖。 第2圖為本創作均溫散熱器之結構示意圖。 第3圖為本創作均溫散熱器之顯示熱能之傳遞路徑之結構示意圖。 【主要元件符號說明】 a 20 均溫板 φ 21 上板體 22 下板體 23 中空腔室 231 工作液體 232 毛細組織 30 熱管 31 内部空間 φ 311 工作液體 40 籍片組 41 鰭片 45 風扇 Η 發熱元件 ΤΡ050226M286564 VIII. New description: [New technical field] The secret of the secretary is the average temperature radiator of the combined structure of the heat exchangers. [Previous technology] With the advancement of the electrical concept, the bribery efficiency of each of the components is 4 times longer. However, as the efficiency of electronic components increases, the power consumed is relatively high. When high temperature is generated, causing overheating and failure to operate normally, even if there is an electronic component inspection, the recording and recording of the silk forest material may be indispensable, and the excess temperature of the electronic component may be reduced by the remaining device. It is obtained at normal operating temperature. The conventional use of the loose wire, mainly by the use of heat-conducting metal and electronic components, the surface of the gold, the surface of the money, and the miscellaneous silk surface and the financial complex, so that the electric contact is transferred to the direct contact of the thermal conductive metal to The heat pipe enables it to achieve the purpose of further cooling. However, in this way, the i can be flat on the part where the electronic component is in contact with the heat-conducting metal, and cannot effectively smear the heat on the surface of the heat-conducting metal, so that the surface and the heat pipe are not scattered. ΓThe design of the temperature equalizing plate 10 is generated (as shown in Fig. 1), and the thermal energy can be fully transmitted to the temperature equalizing plate by the working flow by the working fluid 11 and the capillary structure 12 of the uniform temperature plate 11 Every corner of 10, in order to achieve the purpose of temperature. Although the table 1G design can effectively reach the temperature of the uniform temperature, the abilities can be transmitted to the surface of the recording sheet 14 when used, but the actual assembly and problems or rebel attacks = welding the heat pipe 13, often cause and The surface soldering of the warm plate can not achieve various factors such as poor guiding effect, thus causing the effect of the uniform temperature plate 1〇 and the heat pipe 13 TP〇S〇226 f, and the temperature of the temperature equalizing plate 10 cannot be sufficiently transmitted to Heat pipe M286564 13 ' and its thermal conductivity is greatly reduced. [New content] In view of this, this creation proposes a uniform temperature and uniform temperature plate inside to be connected, so that the heat energy of the temperature equalizing plate can be sufficient 2 = work = the average temperature between the temperature plate and the heat pipe Effect. Translucent, ...g, for the above purposes, the creation of the uniform temperature radiator tube and the - film group, wherein the temperature inside the temperature plate has ^ complex heat not fixed on the uniform surface, the #U 1 i and other heat pipe The internal space of the heat pipe is connected to the middle of the working chamber, thereby making the temperature equalizing plate. The knives of the knives, the average job, and the financial efficiency of the ship are based on the average temperature radiator of the creation, which is the capillary structure, which is the average temperature radiator of the creation. The internal space of the heat pipe is filled with the capillary structure, so that the heat pipe can achieve the effect of uniform temperature everywhere. ^ [Embodiment] - Comparison: The purpose of the ί, the technical means used and the rest of the efficiencies, the preferred embodiment, and the diagram of the pure Qing as follows · 竿 see Figures 2 and 3, the second The figure shows that the structure of the uniform temperature radiator is shown in the structure of the ship's miscellaneous display. The picture shows the uniform temperature radiator, which includes a temperature plate 2 The upper 321 fin group is 4°; wherein the temperature equalizing plate 2G is disposed on the surface of the heating element H, and is composed of: and a lower plate body 22, and a hollow cavity == liquid _ and a capillary tissue coffee are formed therein. The main purpose of the working liquid 231 is to distribute the heat energy evenly on the temperature equalizing plate 20 by using the smear, and the capillary structure 232 mainly carries the working liquid 231, so that the liquid sputum does not flow due to external force and is concentrated. The M286564 is located on the side of the Zhongyu cavity to the 23 side. In addition, the surface of the upper plate body 21 is provided with a plurality of sleeves 211 communicating with the hollow chamber 23 for tying the plurality of heat pipes 30 so as to be fixed to the temperature equalizing plate 2 The upper heat pipe 30 is sleeved and fixed to the upper plate body 21, and the inner portion thereof has an inner space 31, and The space is also filled with a working liquid 311 for transferring heat energy and a capillary structure 312 for carrying the liquid, and the present invention mainly consists in: the inner space 31 of the heat pipe 3 is connected to the above-mentioned uniform temperature plate 20 The hollow chamber 23 communicates, whereby the working liquid 32 in the temperature equalizing plate 20 can transfer heat energy from the heating element Η to the working φ liquid 311 of the heat pipe 3, so that the heat energy of the temperature equalizing plate 20 can be sufficiently transmitted. In the heat pipe 3〇, the crucible is used to achieve the uniform temperature of the temperature equalizing plate 20 and the heat pipe 3〇; the male box; the 40 series is composed of a plurality of fins 41, and the fin shape and the number can be used according to the demand. The Korean film 41 is sleeved on the surface of the heat pipe 3 in an equidistant manner, and the gas area is relatively shallow, so that the heat of the fresh 3G is quickly transmitted to the air to further achieve heat exchange. Objective, in addition, the structure of the fin group 40 of the present invention is not complicated here, and only the heat exchange can be improved, and the body can be said to be the side of the fin group 40 of the present creation. And an axial flow fan is installed, and 45 2 is not used. The fan 45 drives the air flow to make the book The heat of the surface is quickly transferred to the air, thereby achieving the purpose of accelerating the heat exchange rate. The charm of the sub-parameter (4) 3, the solution of the uniform temperature plate 20 is set to the surface of the recording member and is contacted, and when the component is produced In the case of thermal energy, the working fluid Zhao 2 231 in the temperature equalizing plate can receive the heat energy and communicate with the heat chamber (4) in the cavity 2 of the temperature equalizing plate 2G, so that the heat can be directly transmitted to the heat pipe 3〇. The working space along the internal space 祀: 'The uniform temperature plate 20 and the heat pipe 30 can effectively achieve the purpose of uniform temperature, and the piece 4i can take the heat pipe 3G to the smear of the wire. For the sake of the work - (four) the real _, and turn the Cong Ding this Creativity 1 and 'Where _, please take the shape of the structure described by the patent Gu: M286564 Participate in the spirit of the equal change and modification, should be included in this creation Within the scope of the patent application. [Simple description of the drawing] Fig. 1 is a schematic view showing the structure of a conventional heat sink. The second picture shows the structure of the creation of the uniform temperature radiator. The third figure is a schematic structural diagram of the transmission path of the display heat energy of the created uniform temperature radiator. [Main component symbol description] a 20 Mean temperature plate φ 21 Upper plate body 22 Lower plate body 23 Middle cavity chamber 231 Working liquid 232 Capillary structure 30 Heat pipe 31 Internal space φ 311 Working liquid 40 Chip group 41 Fin 45 Fan Η Fever Component ΤΡ050226