TWM278828U - LED planar light source module - Google Patents
LED planar light source module Download PDFInfo
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- TWM278828U TWM278828U TW094207598U TW94207598U TWM278828U TW M278828 U TWM278828 U TW M278828U TW 094207598 U TW094207598 U TW 094207598U TW 94207598 U TW94207598 U TW 94207598U TW M278828 U TWM278828 U TW M278828U
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- 239000007769 metal material Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 9
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
M278828 八、 新型說明: 【新型所屬之技術領域】 本創作係關於一種發光- M ^ . , 一柽肢面狀光源模組,尤指一 光源模組。 放…此力佳的發光二極體面狀 【先前技術】 目前發光二極體被廣泛地應用 二極體燈式;1;“ 4 +、且,、上,而各種發光
「LO燈模@成如公告第M241 584號 保、、且」新型專利案, — 光二極體元杜略%丄 〜種利用現有單顆式發 位版兀件所設計而成的 常知識者皆知此—領域具通 若長時間…:體被驅動點亮時,會產生熱能, -動而無散熱途徑,合 命。 9、、傾減發光二極體的壽 疋以,此一新型專利案除了設 發光二極组| ^ 種可將現有單顆式 、、且凌置成一 LED燈模組的处 極體的散埶η σ冓卜,為解決發光二 月文熱問喊,誠如此新型專利 發光二極I#亓 一 0罘一圖所不,複數 位 to7L 件(122) 設置於一麻成, 、電路板(121)上,再 蓋合於該底座r U)的開” ’最後再將-透光罩(〗3) 質,以與該電路^/口’·其中該底座(U)係為金屬材 此—新型專=板連接,提供發光二極體的散熱途徑。由 、 和案的圖式結構可知,I至少十西 歿數發光-托 八 ^而要一電路板供 尤—極體元件連接,以及一 方能達到勒勒 放熱用的基座, 放…、功效,由是可知, 較為複雜。又’兮τ ϋ k枳組的結構元件 该led燈模組的基座上蓋設有一透光外罩, M278828 其並無聚光效果,力口上其採用單顆式發光二極體元件,當 其點冗呀,务光二極體元件之光線不易聚集。 由於發光二極體或模組應用在燈具上已是必然趨勢, 故不論是單顆或栽& #丨』A、 只乂鮮組型式的發光二極體均需針對其缺點進 行改進u提供較佳發光效能,而有助於此技術領域的發 展。 【新型内容】 為此本新型係提供一種具有高聚光能力、結構簡單、 散熱能力佳的發光二極體面狀光源模組。 右人達上述目的所使用的主要技術手段係令該發光二極 體面狀光源模組包含有一兼具散熱功效的基座、至少一顆 奋置欢4基座上的發光裸晶以及一光學聚光元件;該基座 上立而面升V成有至少一晶杯凹#,供發光裸晶容置於其中, 又’、為增加其散熱效果’可於基座下端面形成有複數凸塊, 、:曰力政熱面#。再者’該基座上端面配合設置一光學聚 光-件則此進一步將各晶杯凹槽射出的光線予以聚集, 加強本創作的出光強度。 是以,本創作確實可利用最少元件,克服發光二極體 模組的低亮度、複雜結構及散熱差等問題。 【實施方式】 首先σ月茶閱第一圖所示,係為本創作發光二極體面狀 光源模組(1 Q )—^ ^ i貫%例的剖面圖,該發光二極體 面狀光源模組(丄Q )包含有: 基座(1 1 ),其上端面(1 1 1 )係形成有至少 4 M278828 曰曰 杯凹槽(1 1 3 ),而下端面( 成有複數凸塊(114)或凹槽’以增加下表二::: 於加速散熱的效用;於本實施例中,各晶杯凹槽(11 3) 的斷面係呈一上寬下窄的錐形狀, 果,a楚-间讲- 達到較佳的聚光效 等二::::;而該基座可採用金屬材質(如紹、銅 寺)或南導熱係數材質(如陶瓷、合金等). 至少一顆發光裸晶(1 9^ ^ 休日日(丄J),係容置於基座( ::對應晶杯凹槽…施例係 發光裸晶(1 2 ); 個 -透明保護層(i 3 ),係封合各晶片凹槽( 及基座(1 1 )上’以保護位於晶片凹槽(工 裸晶(1 2 ); 一光學聚光元件(1 4 ),係設於該基座( 上端面"⑴,可以結合件(…置於光 :(1 4 )及基座(i丄)上端面(丄丄丄)之間,將兩 者予以結合;光學聚光元件可為一透鏡,而結合件 明膠材、螺合裝置等。 “上述發光二極體面狀光源模組(1 0 )係主要採用基 座/ 1 1 ),同時作為發光裸晶(1 2 )的容置基座及散 熱裝置,相較既有發光模組的結構更為簡化。此外,為了 將t散设置於基座(1 1 )上發光裸晶(1 2 )的光源有 放小集’特別於基座(1 1 )上端面設置-光學聚光元件 (14),令各晶杯凹槽(1工3 )内發光裸晶(工2 ) ^出的光線經光學聚光元件(1 4 ),能夠予以集中,加 M278828 強本創作的發光強度。 請參閱第二圖所示,係為本創作的第二較佳實施例, 其主要於基座(丄丨)上形成有複數晶杯凹肖("3), 而各晶杯凹槽(113)内容置有複數個發光g裸晶(12)。 誠如第一圖及第三圖所示,本創作基座(丄丄)的下 端面(ill)複數凸塊(114a)係並排排列,並呈 -長矩形長條狀’再如第四圖所示,為本創作另一較佳實
施例’其基座(11)同樣為—長條形狀,惟複數凸塊 1 4 )並排於其下端面(丄丄2 ) ^ 」上係壬一波浪狀長條 狀。再请麥閱第五圖所示,為本創作再一較佳實施例,其 基:(11a)為一較大面積的長矩形狀,而其下端面的 μ ) J 鋸回長备'狀。由此前揭數個實 施例揭示可知,本創作基 Q1 1 )及其下端面凸塊(1 一 4 a ) ( 1 1 4 b )並不限制於特定形狀, 而則各貫施例的複數凸塊亦 J J彼此相互連接,構成一網格 形狀。 由上述說明可知,本創作基座兼具有容置發光裸晶及 散熱用,配合光學聚朵$ & 曰 子+先兀件則能將散置於基 線予以聚集,而加強φ亦幡命 日]殊日日先 # i θ — - > 先輝&,故本創作確實能夠提供一 種兼具有局亮度、社禮鋒σσ Γ 、: 、,σ構間早及散熱佳的發光二極體模組。 【圖式簡單說明】 、 第—圖係本創作-較佳實施例的剖面圖。 ::圖·钻本創作另-較佳實施例的分解圖。 第三圖:係本劍作 再—較佳實施例的立體外觀圖。 6 M278828 第四圖:係本創作又一較佳實施例的立體外觀圖。 第五圖:係本創作再一較佳實施例的立體外觀圖。 【主要元件符號說明】 (1 〇)發光二極體面狀光源模組 (11) ( 1 1 a )基座 (1 1 1 )上端面 (1 1 2 )下端面 (1 1 3 )晶杯凹槽
(114) (114a) (114b)凸塊 (1 2 )發光裸晶 (1 3 )透明保護層 (1 4 )光學聚光元件 (1 5 )結合件
Claims (1)
- M278828九、申請專利範圍·· 1 ·一種發光二極體面狀光源模組,係包含有·· 一基座,其上端面係形成有至少一晶杯凹槽; 至少一發光裸晶,係容置於基座的對應晶杯凹槽内; 一透明保護層,係封合於晶杯凹槽及基座上;及 一光學聚光元件,係設於基座的上端面。 2 ·如申請專利範圍第1項所述之發光二極體面狀光 源模組,該基座的下端面係形成有複數凸塊。 3 ·如申請專利範圍第1項所述之發光二極體面狀光 源模組,該基座的下端面係形成有複數凹槽。 4 ·如申請專利範圍第1項所述之發光二極體面狀光 源模組,該光學聚光元件為一透鏡。 5 ·如申請專利範圍第2項所述之發光二極體面狀光 源模組,該複數凸塊係並排於該基座下端面上,而各凸塊 呈波矩形長條狀。 6 ·如申請專利範圍第2項所述之發光二極體面狀光 源模組’該複數凸塊係並排於該基座下端面上,而各凸塊 呈波浪狀長條狀。 7 ·如申請專利範圍第2項所述之發光二極體面狀光 源模組’该複數凸塊係並排於該基座下端面上,而各凸塊 王錄齒長條狀。 8 ·如申請專利範圍第2項所述之發光二極體面狀光 源模組,該複數凸塊形成一網格狀。 9 ·如申請專利範圍第1項所述之發光二極體面狀光 8M278828 綠丞y坐係為金屬材戶、 丄〇 ·如申請專利範圍第1項所述之發光二極體面狀 光源模組,該基座係為高導熱係數材質。 1 1 ·如申請專利範圍第1項所述之發光二極體面狀 光源模組’该光學聚光元件係以結合件黏合於基座上端 面。1 2 ·如申請專利範圍第1至1 1項任_項所述之發 光二極體面狀光源模組,各晶杯凹槽的斷面係呈一上寬下 窄的錐形狀。 十、圖式: 如次頁9
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094207598U TWM278828U (en) | 2005-05-11 | 2005-05-11 | LED planar light source module |
| US11/252,282 US20060255359A1 (en) | 2005-05-11 | 2005-10-17 | Light emitting diode light source model |
| JP2005008587U JP3117740U (ja) | 2005-05-11 | 2005-10-18 | 発光ダイオード光源 |
| DE202005017030U DE202005017030U1 (de) | 2005-05-11 | 2005-10-31 | LED-Lichtquelle |
| US11/327,024 US20060255352A1 (en) | 2005-05-11 | 2006-01-06 | Light emitting diode light source model |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094207598U TWM278828U (en) | 2005-05-11 | 2005-05-11 | LED planar light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM278828U true TWM278828U (en) | 2005-10-21 |
Family
ID=35854015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094207598U TWM278828U (en) | 2005-05-11 | 2005-05-11 | LED planar light source module |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20060255359A1 (zh) |
| JP (1) | JP3117740U (zh) |
| DE (1) | DE202005017030U1 (zh) |
| TW (1) | TWM278828U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206558A (zh) * | 2012-09-14 | 2016-12-07 | 晶元光电股份有限公司 | 具有改进的热耗散和光提取的高压led |
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| SM200600005A (it) * | 2006-02-15 | 2007-08-22 | Idealed.It S R L | Unita' luminosa led ad alta potenza, nonche' apparato di illuminazione comprendente tale unita' |
| ES2288394B1 (es) * | 2006-02-24 | 2008-11-16 | Vitri Electro-Metalurgica, S.A.U. | Lampara dotada de medios disipadores de calor. |
| DE102006018603B3 (de) * | 2006-04-21 | 2007-12-27 | Paul Heinrich Neuhorst | Leuchte |
| US7338186B1 (en) * | 2006-08-30 | 2008-03-04 | Chaun-Choung Technology Corp. | Assembled structure of large-sized LED lamp |
| USD575246S1 (en) | 2006-11-15 | 2008-08-19 | Citizen Electronics Co., Ltd. | Light-emitting diode unit for illuminating an object |
| USD565515S1 (en) * | 2007-04-18 | 2008-04-01 | Edison Opto Corporation | Light emitting diode assembly for linear illumination |
| US7902761B2 (en) | 2008-10-03 | 2011-03-08 | Next Gen Illumination, Inc | Dimmable LED lamp |
| US8348460B2 (en) * | 2009-05-01 | 2013-01-08 | Abl Ip Holding Llc | Lighting apparatus with several light units arranged in a heatsink |
| TWI408310B (zh) * | 2009-09-29 | 2013-09-11 | Liang Meng Plastic Share Co Ltd | 照明裝置及其製造方法 |
| MY177679A (en) * | 2010-07-30 | 2020-09-23 | Dominant Semiconductors Sdn Bhd | Led lighting module |
| DE202011050596U1 (de) * | 2011-06-30 | 2012-08-01 | Frank Keller | LED-Beleuchtungsmodul |
| US9366422B2 (en) | 2012-03-22 | 2016-06-14 | Makersled Llc | Slotted heatsinks and systems and methods related thereto |
| USD717986S1 (en) * | 2012-03-22 | 2014-11-18 | Makersled Llc | LED light fixture |
| DE102012021163A1 (de) * | 2012-10-29 | 2014-05-15 | Herner Glas Bernd Hoffbauer Gmbh & Co Leuchten Und Industrieglas Kg | Lichtaustrittskörper |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7027304B2 (en) * | 2001-02-15 | 2006-04-11 | Integral Technologies, Inc. | Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
| EP1399612A4 (en) * | 2001-04-30 | 2008-04-30 | Thermo Composite Llc | THERMAL MANAGEMENT MATERIAL, DEVICES AND METHOD THEREFOR |
| US20060124953A1 (en) * | 2004-12-14 | 2006-06-15 | Negley Gerald H | Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
-
2005
- 2005-05-11 TW TW094207598U patent/TWM278828U/zh unknown
- 2005-10-17 US US11/252,282 patent/US20060255359A1/en not_active Abandoned
- 2005-10-18 JP JP2005008587U patent/JP3117740U/ja not_active Expired - Fee Related
- 2005-10-31 DE DE202005017030U patent/DE202005017030U1/de not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206558A (zh) * | 2012-09-14 | 2016-12-07 | 晶元光电股份有限公司 | 具有改进的热耗散和光提取的高压led |
| CN106206558B (zh) * | 2012-09-14 | 2019-04-09 | 晶元光电股份有限公司 | 具有改进的热耗散和光提取的高压led |
Also Published As
| Publication number | Publication date |
|---|---|
| DE202005017030U1 (de) | 2006-02-09 |
| US20060255359A1 (en) | 2006-11-16 |
| JP3117740U (ja) | 2006-01-12 |
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