[go: up one dir, main page]

TWM275395U - Heat dissipating assembly with heat pipes - Google Patents

Heat dissipating assembly with heat pipes Download PDF

Info

Publication number
TWM275395U
TWM275395U TW94205120U TW94205120U TWM275395U TW M275395 U TWM275395 U TW M275395U TW 94205120 U TW94205120 U TW 94205120U TW 94205120 U TW94205120 U TW 94205120U TW M275395 U TWM275395 U TW M275395U
Authority
TW
Taiwan
Prior art keywords
heat
heat pipe
base
evaporation
groove
Prior art date
Application number
TW94205120U
Other languages
Chinese (zh)
Inventor
Hsieh-Kun Lee
Chun-Chi Chen
Shi-Wen Zhou
Hong-Wei Du
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94205120U priority Critical patent/TWM275395U/en
Publication of TWM275395U publication Critical patent/TWM275395U/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

M275395 八、新型說明: 【新型所屬之技術領域】 本創作係關於一種散熱裝置,特別係關於一種可有效冷卻電子元件之 熱管散熱裝置。 【先前技術】M275395 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to a heat sink, and in particular to a heat pipe heat sink capable of effectively cooling electronic components. [Prior art]

隨著電子越不斷發展,電子元件(尤為巾央處職)運行速度和整 體性能不斷提昇。然而’其發歸亦隨之增加,另—方_賴來越小, 亦更加集中,使得業界單純使用金屬實體傳熱之散熱裝置無法滿足高 端電子元件之散熱需求。 為此,業界開始使用帶有熱管之散熱裝置。熱管係主要由真空密封之 管形殼體、其内壁上設置之毛細結構(如粉末燒結物、溝槽結構、絲網結 構等)及其内適量裝入之工作液體(如水、酒精、氣里昂、丙嗣等)組成 熱管係通過工作液體受熱後進行液汽_變化而吸收、釋放熱量以達到傳 熱目的,由於熱管的傳熱孩向且傳熱距離長而得到廣泛應用。 其包括一設 台灣專利第M245465號揭露了一種使用熱管的散熱裝置 有數個溝槽之基座、數個“L”字形絲及複數制輯疊之散細片,其 中該每-鮮的林部分結合於職虹,其向上延伸㈣麵分穿過散 熱韓片。該基座通過熱管將所吸收的熱量傳遞至鱗散熱則,而散麟 片上的熱量通過其絲散發於朋空氣。然,該散熱裝制數錄管之水 平科平行的僅靠基座上之溝槽來㈣,該等水平部分在基座上延伸方向 單-,當由風1«他產生震動時散熱裝置容易左右搖擺變形或松 脫’使得熱管與基座、散熱則之間之接合不良,影響散熱裝置的散孰效 M275395 ^另外喷個熱管之垂直部分套接複數散_片,相當於通過熱管將該 寻具有疋重量之她^吊狀空巾,歸支撐貞叙大,當有 動時容易對熱管造成損壞;還有,由於機械加工的限制,熱管通常很難垂 其料部分—般呈形態,從而該散熱裝置的複數散熱韓片套 玄L挪熱管時無法套接至其·彎折部分,使得散熱鰭片與基座 間有一間距未能利用。 【新型内容】 置 本創作之目的在於提供—種散熱效率高且結構較穩固之熱管散熱裝 一本創作熱管賴裝置包括—基座、至少_第_熱管及至少—第二熱 管,該二細蝴蝴帛碰㈣幽她雜基座方向、 U申之冷々部’稷數相互疊置之第—散熱則穿設於該二熱管的冷凝部, 該第-熱管和第二鮮之綠部蚊設置於基座上,且基絲向第一散熱 鳍片之表面設有多數第二散熱鰭片。 本創作相比先前技術具有如下優點:由於散熱裝置的第一熱管和第二 熱管交又設置,有效防止散熱裝置產生左右搖擺的可能,使散熱裝置的結 構穩固’另外’第-熱管與第二熱管相互交叉設置,其各冷凝部能夠從不 同的方向由織職㈣偷,娜自犧至撫 各Η立J·基座向第散熱鰭片表面設有多數第二散熱縛片而加強散 熱’有政利用基座與第-散熱鰭片間之間距。 本創作熱管散熱裝置之進—步改進在於,該基座底面還設有一底座, 該底座頂硫有供與基縣叹設第―熱管蒸發部之凹槽,其中至少一第 M275395 一熱管蒸發部被夾設於該基座與底座間。由於基座和底座夹設第一熱管之 冷凝部,使得第一熱管的固定更加穩固,有利於提高整個散熱裝置的、纟士構 穩固性。 本創作熱管散熱裝置之更進一步改進在於,該第一散熱鰭片與第二散 熱鰭片相互頂靠。由於該複數第一散熱鰭片頂靠於第二散熱鰭片上,減_ 熱管支撐該等第一散熱鰭片之負荷,使熱管與基座、散熱鰭片之接觸較稃 定,並且保障熱管不易受損壞。 【實施方式】 請參閱第-圖至四圖所示,本創作熱管散熱裝置係用來安裝於中央處 理器(圖未示)等發熱電子元件上對其進行散熱。該鮮散練置包括一 底座10、設置於該底i 10上表面之-散熱體20、夾設於該底座1〇和散熱 體20間之三第-鮮3〇、設置於錄舰2()上之―第二歸*及位於散 熱體20上並穿接於該第一、二熱管3〇、4〇上之複數相互疊置之第一散熱 鰭片50。 該底座10包括一主體12,該主體12相對兩側端連接有固定板14,該 主體12為具有高傳熱係數之銅等金屬板體,其下表面用於與電子元件接 觸’上表面設有與第—熱管3G結合之二半_凹槽122,定板Μ兩端 分別向外側延伸有固定腳142。該散熱體包括-基座22及該基座22上 向上延伸之複數第二散_片24,絲座22絲無底錢上表面貼合 並對應凹槽m設有二半圓形凹槽222 (第三圖所示),每條凹槽222兩端 處分別開設相通基座22側緣並上下穿透散熱體2()之開槽3,該基座U 頂面設有-橫向延伸方向與該凹槽扣相交又(特別係垂直交叉)之溝槽 M275395 226。該二第-熱管3GA致呈“u”字形,其具有—底部似該底部32兩 端向上圓弧彎折延伸之二自由端部34,每—第—熱f 3Q的底部32被埋設 於3玄對應的凹槽122、222中間,其二自由端部34分別向上穿過該凹槽222 兩端之開槽224。該第二熱管4〇亦大致呈“σ,字形,其具有一底部幻及 該底部42兩端向上圓弧f折延伸之二自由端部44,該第二熱管4〇的底部With the continuous development of electronics, the operating speed and overall performance of electronic components (especially the central office) have been continuously improved. However, its return has also increased, and the smaller it is, the more concentrated it is, making the industry's heat dissipation device using only metal solid heat transfer unable to meet the heat dissipation requirements of high-end electronic components. For this reason, the industry began to use heat sinks with heat pipes. The heat pipe is mainly composed of a vacuum-sealed tubular shell, a capillary structure (such as a powder sintered body, a groove structure, a wire mesh structure, etc.) provided on its inner wall and an appropriate amount of working liquid (such as water, alcohol, and gas Lyon). , Bingzhi, etc.) The heat pipe system is used to absorb and release heat to achieve heat transfer through liquid-vapor changes after the working liquid is heated. It is widely used due to the heat transfer direction of the heat pipe and the long heat transfer distance. It includes a Taiwan patent No. M245465 which discloses a heat-dissipating device using a heat pipe, a base with several grooves, several "L" shaped wires, and a plurality of scattered thin pieces, wherein the per-fresh forest part Combined with Zhihong, it extends upward through the heat sink. The base transmits the absorbed heat to the scales through a heat pipe, and the heat on the diffuser sheet is radiated to the air through its filaments. However, the horizontal section of the heat-dissipating digital recording tube is parallel only by the grooves on the base, and the horizontal sections extend in a single direction on the base. The heat-dissipating device is easy when the wind generates vibration. Deformation or loosening left and right 'makes the joint between the heat pipe and the base and the heat sink bad, which affects the cooling effect of the heat sink M275395 ^ In addition, spray the vertical part of the heat pipe with multiple scattered pieces, which is equivalent to the heat pipe. Look for her ^ hanging-shaped empty towel with a large weight, which is supported by Zhenxu University, and it is easy to cause damage to the heat pipe when it is moving. Also, due to the limitations of mechanical processing, the heat pipe is usually difficult to hang down on the material-it is generally shaped. As a result, the plurality of heat-dissipating Korean fins of the heat-dissipating device can not be sleeved to the bent portion when moving the heat pipe, so that a gap between the heat-dissipating fin and the base cannot be used. [New content] The purpose of this book creation is to provide a heat pipe with high heat dissipation efficiency and a relatively stable structure. A creative heat pipe installation device includes a base, at least a _th heat pipe, and at least a second heat pipe. The butterfly touches the direction of the miscellaneous base, and the number of the cold parts of the U-strip are superimposed on each other—the heat is passed through the condensation part of the two heat pipes, the first-heat pipe and the second fresh green part mosquito. It is arranged on the base, and the surface of the base wire facing the first heat dissipation fin is provided with a plurality of second heat dissipation fins. Compared with the prior art, this creation has the following advantages: Because the first heat pipe and the second heat pipe of the heat dissipation device are arranged alternately, the possibility of the heat dissipation device to swing from side to side is effectively prevented, and the structure of the heat dissipation device is stabilized. The heat pipes are intersected with each other, and the condensation parts of the heat pipes can be stolen from different directions by different positions. From the sacrifice to the care of each standing J. base, the second heat dissipation fin is provided with a plurality of second heat dissipation fins to enhance heat dissipation. The distance between the base and the first heat-dissipating fin is used. The improvement of the heat pipe cooling device of this creation is that the base of the base is also provided with a base. The top sulfur of the base is provided with a groove for the first heat pipe evaporation part of Jixian County, at least one of which is the M275395 heat pipe evaporation part. It is sandwiched between the base and the base. The condensing part of the first heat pipe is sandwiched between the base and the base, so that the fixing of the first heat pipe is more stable, which is beneficial to improving the stability of the structure of the heat sink. A further improvement of the heat pipe radiating device of the present invention is that the first heat radiating fin and the second heat radiating fin abut against each other. Since the plurality of first heat radiation fins abut against the second heat radiation fins, the heat pipe supports the load of the first heat radiation fins, making the heat pipe contact with the base and the heat radiation fins more stable, and ensuring that the heat pipes are not easy Damaged. [Embodiment] Please refer to Figures-4 to 4. The creative heat pipe cooling device is used to dissipate heat from electronic components such as a central processor (not shown). The fresh loose training set includes a base 10, a heat sink 20 provided on the upper surface of the base i 10, a third heat sink sandwiched between the base 10 and the heat sink 20, and a fresh heat sink 30. ) Above-the second return * and a plurality of first heat radiation fins 50 which are located on the heat sink 20 and pass through the first and second heat pipes 30 and 40. The base 10 includes a main body 12 connected to fixing plates 14 on opposite sides of the main body 12. The main body 12 is a metal plate body such as copper having a high heat transfer coefficient, and a lower surface thereof is used to contact an electronic component. There are two half grooves 122 which are combined with the first heat pipe 3G, and the two ends of the fixing plate M are respectively extended with fixed feet 142 to the outside. The heat sink includes a base 22 and a plurality of second scattered sheets 24 extending upwardly on the base 22. The upper surface of the wire seat 22 is attached with two semicircular grooves 222 corresponding to the groove m ( (Shown in the third figure), at each end of each groove 222, a slot 3 communicating with the side edge of the base 22 and penetrating the heat sink 2 () up and down is provided. The top surface of the base U is provided with a lateral extension direction and The groove intersects (especially perpendicularly crosses) the groove M275395 226. The second third heat pipe 3GA is formed in a "u" shape, and has two free ends 34 which are bent and extended upwardly at both ends of the bottom 32, and the bottom 32 of each third heat f 3Q is buried in 3 In the middle of the corresponding grooves 122 and 222, the two free ends 34 respectively pass through the slots 224 at both ends of the groove 222 upward. The second heat pipe 40 is also generally in the shape of “σ”, and has a free end 44 and a free end 44 extending from both ends of the bottom 42 to an upward arc f. The bottom of the second heat pipe 40

42結合於該基座22上的溝槽挪’其二自由端部私亦與第一熱管的自 由端部34相同向上延伸。由於該凹槽222與溝槽226之橫向延伸方向相交 又(特別係垂直交又),與該凹槽222和溝槽⑽相結合的第一、二熱管 3〇、40的各自由端部34、44圍成略橢圓形狀態。該複數第一散熱趙片% 係相互等間距平行的疊置而成,每—散熱鳍片如相對兩側端分別同向彎折 延伸-折邊52’該折邊52抵頂相鄰散熱鰭片5G,每—散熱鰭片5〇對應第 一、二熱管30、4()的各自由卿34、44設有穿孔54,鱗纽%周緣分 別脊折延伸有結合面56,從而該複數第—散熱鰭片π上對應第_、二熱管 3〇、40的各自由端部34、44形成圓筒狀結合面。該複數第一散熱韓片5〇 由其圓筒狀結合面套設於該第一、二熱管3〇、4〇的各自由端部从、私上 並其最下層之散解片50緊靠於散舰2G的第二散熱則Μ頂端。 從而’中央處理器工作時,其産生之熱量傳遞到散熱裝置的底座ι〇, _座1()上的-部分熱量直接傳送至散熱體2(),另—部分熱量通過第一熱 管30傳送至散熱體2〇和第—散熱鰭片w上,該散熱體π上的熱量一部 分通過其第二散熱則24直接散發於關空間,另_部分通過第二熱管奶 傳送至第-散編5〇,而第—散鱗片5G上之熱量通過其表面散發於周 圍空間。 M275395 本創作散熱裝置-側可安裝至少一散熱風扇6〇,以提高散熱裝置與周 圍空氣之熱對流速度。 由於本創作散熱裝置之第一熱管3〇與第二熱管4〇相互交又設置,其 各自由端部34、44圍成呈橢圓形狀態,從而該等自由端部34、料均勾分 佈的穿設於散熱體2〇及第-散熱鰭片5〇上,使得熱量能夠均句之傳送至 散熱體2〇及第-散熱彳%各部位,且散熱體2Q與第—熱管%的彎折 部分亦接合,使得散熱體20及第-散熱則5Q各雜及第_、二熱管%、 4〇被充分利用,有利於提高散熱裝置的整體散熱效果;另夕卜散熱體如與 底座10夾設第-熱f 3G並使第-熱管3Q❺自由端部34冑過其基座^, 故第-熱管3G的·非常穩固,還有最下層之第—散熱鰭片%抵靠於散 熱體20的第二散熱鰭片24上,因此第_、二熱管3G、4G支撐複數第一散 熱縛片50之負4小’更係’該二熱管3G、4G交叉設置而形成架式狀態, 有效防止産生左右搖擺的可能性。 上述實施例中,本創作散熱裝置的熱管為,,字形,其主要提供具有 吸熱用之相對水平部分(蒸發部)及由水平部分向上彎折延伸並放熱用之 相對垂直部分(冷凝部)。可賴解地,“L,,字形熱管亦能提供上述相對 水平心及相職直部分,故本麟散熱裝置的鮮亦可使肖“l”字形熱 官,此時鮮與底座、散熱敝合方式可採取上述實施财的“字形熱 s的、、且σ方式’還可以知取將所有“L”字形熱管放射性狀態職置於底座 和基座中間或其任-個上。可進_步轉地,本_賴裝置之熱管亦可 等 子幵^和L子形熱管混合使用,此時熱管與底座、散熱體組合方 式可採取上述各組合方式或其他組合方式。 M275395 /從上述各實關可見,本㈣散缝置的第―、二鱗相互交叉設置 係包括料-熱管和第二熱管的蒸發部相互不平行的所料置狀能。 還可以理解地,上述各實施财的第—熱管和第二熱管之數量可根據 ^進仃增減,如第-熱管之數量可為—域兩纽^、第二熱管之數量 可為兩個或兩個以上。 上述散歸置讀鐘可絲由錄絲面_於好树上;該散The two free ends of the groove coupled to the base 22 also extend upwards in the same way as the free end 34 of the first heat pipe. Since the groove 222 intersects with the lateral extension direction of the groove 226 (especially perpendicularly), the first and second heat pipes 30, 40 combined with the groove 222 and the groove ⑽ are respectively formed by the end portions 34. , 44 circle into a slightly oval state. The plurality of first cooling fins are superimposed at equal intervals and parallel to each other. Each of the cooling fins is bent and extended in the same direction as the opposite sides, respectively. Each of the 5G fins 50 corresponds to the first and second heat pipes 30 and 4 () provided with perforations 54 by 34 and 44, respectively, and the peripheral edges of the scales are extended by ridges to have a bonding surface 56. -The heat dissipation fins π correspond to the first and second heat pipes 30 and 40, respectively, and end portions 34 and 44 form cylindrical joint surfaces. The plurality of first heat-dissipating Korean sheets 50 are sleeved on the first and second heat pipes 30 and 40 by their cylindrical bonding surfaces, and the end-pieces of the first and second heat pipes 30 and 40 are abutted closely, and the lowermost dispersing sheet 50 abuts. The second heat sink at the bulker 2G is the top of the M. Therefore, when the central processing unit is working, the heat generated by it is transferred to the base of the heat sink, part of the heat on the seat 1 () is directly transmitted to the heat sink 2 (), and part of the heat is transmitted through the first heat pipe 30. To the heat sink 20 and the first heat sink fin w, part of the heat on the heat sink π is directly dissipated to the closed space through its second heat sink 24, and the other part is transmitted to the first heat sink 5 through the second heat pipe milk. 〇, and the first-scale 5G heat is dissipated to the surrounding space through its surface. M275395 At least one cooling fan 60 can be installed on the side of the original cooling device to increase the heat convection speed between the cooling device and the surrounding air. Since the first heat pipe 30 and the second heat pipe 40 of the radiating device of the present invention are arranged and intersected with each other, each of them is surrounded by ends 34 and 44 in an oval shape, so that the free ends 34 and the materials are evenly distributed. It is placed on the heat sink 20 and the first heat-dissipating fin 50, so that the heat can be transmitted to each part of the heat sink 20- and the first heat-dissipating 彳%, and the heat sink 2Q and the first heat-pipe% are bent. The parts are also joined, so that the heat sink 20 and the first heat sink 5Q are mixed and the first and second heat pipes% and 40 are fully utilized, which is conducive to improving the overall heat dissipation effect of the heat sink; in addition, if the heat sink is clamped with the base 10 Let the first heat f 3G and the third heat pipe 3Q❺free end 34 pass through its base ^, so the first heat pipe 3G is very stable, and the lowermost heat sink fin% abuts on the heat sink 20 Therefore, the second and third heat pipes 3G and 4G support the negative 4th of the first heat sink 50, and the two heat pipes 3G and 4G are arranged crosswise to form a rack state, which effectively prevents The possibility of swinging left and right. In the above embodiment, the heat pipe of the heat sink of the present invention is a zigzag shape, which mainly provides a relatively horizontal portion (evaporation portion) for absorbing heat and a relatively vertical portion (condensation portion) that extends upward from the horizontal portion and radiates heat. It can be said that the "L," shaped heat pipe can also provide the above-mentioned relatively horizontal center and straight parts, so the freshness of Benlin's heat dissipation device can also make Xiao "l" shaped heat officials. At this time, it is rarely combined with the base and heat dissipation. The method can adopt the above-mentioned "zig-shaped heat s, and sigma method" to implement the property. It can also be known that all "L" -shaped heat pipes are placed in the middle of the base and the base or any one of them. It can be further transferred to the ground, and the heat pipe of this Lai device can also be used in combination with the sub-shaped heat pipe and L-shaped heat pipe. At this time, the combination of the heat pipe, the base and the heat sink can adopt the above-mentioned combinations or other combinations. M275395 / It can be seen from the above-mentioned facts that the first and second scales interspersed with each other are arranged in an intersecting manner, and the evaporation parts including the material-heat pipe and the second heat pipe are not parallel to each other. It can also be understood that the number of the first heat pipe and the second heat pipe of each of the above implementations can be increased or decreased according to the difference, for example, the number of the first heat pipe can be two domains, and the number of the second heat pipe can be two. Or two or more. The above scattered home reading clock can be made from the silk surface_ 于 好 树;

熱體還可雜據各實施狀獨“進行魏,料撕散餘置的熱管 而其上表面無需設置溝 全部採用“L”字繼並放射性狀態的設置於底座上時,其散熱體底面上 對應廷些熱管設置凹槽及該凹槽兩端的開槽即可, 槽及散熱鰭片等。 综上所述,本創作符合新型專利要件,爰依法提出專利申請。惟,以 上所述者僅為賴狀触#_,軌熟悉核轉之人士,在爱依本 創作精神所彳㈣賴恤,編她了彻軸圍内。 【圖式簡單說明】 第-圖係本創作熱管散_置之立體分解圖。 第二圖係本創作熱管散_置之部分組裝圖。 第三圖係本創作鮮散熱裝置部分結構之倒置示意圖 第四圖係本創作鮮散熱裝置與風扇之組裝圖。 【主要元件符號說明】 底座 凹槽 固定腳 10 主體 122 、 222 固定板 142 散熱體 12 14 20 M275395 基座 22 溝槽 226 第一熱管 30 自由端部 34、44 第一散熱鰭片 50 穿孔 54 風扇 60 開槽 224 第二散熱鰭片 24 底部 32、42 第二熱管 40 折邊 52 結合面 56The heating body can also be used according to the implementation status. "The heat pipe is torn apart, and the remaining heat pipe is torn apart. The upper surface does not need to be provided with a groove. All of them are installed on the base in the form of" L ". It is only necessary to set grooves for the heat pipes and slots at both ends of the grooves, grooves and fins, etc. In summary, this creation meets the requirements for new patents, and patent applications are filed according to law. However, the above only For Lai-like touch #_, the person familiar with the nuclear transfer, in the spirit of Ai Yiben's creative spirit, edited her inside the shaft. [Simplified illustration of the figure] The first-picture system of this creative heat pipe A three-dimensional exploded view. The second figure is an assembly diagram of a part of the heat pipe of the original creation. The third diagram is an inverted schematic diagram of the structure of the fresh heat sink of the author. The fourth picture is an assembly diagram of the fresh heat sink and the fan of the author. Description of main component symbols] Base groove fixing foot 10 Body 122, 222 Fixing plate 142 Heat sink 12 14 20 M275395 Base 22 Groove 226 First heat pipe 30 Free end 34, 44 First heat sink fin 50 Perforation 54 Fan 60 open 24 the bottom 224 of second fins 32, 42 of the second heat pipe 40 flange 52 binding surface 56

1212

Claims (1)

M275395 九、申睛專利範圍·· 1. 一種熱管散熱裝置,用以散發電子树産生的熱量,其包括— 二第-熱管及至少一第二熱管,該二熱管均具有與基座連接二二: 及由洛發部末端向遠離基座方向延伸之冷凝部,複數相 ^ 熱物Γ於該二熱管的冷凝部,其改良在於:該第-熱管和第^ 爾虹,且赫㈣—散賴之表 數弟二散熱鰭片。 义 • 2.如申請專利範圍第i項所述之熱管散熱裝置,其改良在於:該第―、二 熱&呈u子形,其位於底部之水平部分為蒸發部,二向上延伸之垂直 部分為冷凝部,該基絲面設有供第—熱管蒸發部結合之凹槽,盆頂面 設有橫向延伸方向與絲面_做又之供第二鮮蒸發部結合 槽。 3. 如申請專利範圍第!項所述之鮮散熱裝置,其改良在於:該第一、二 # 熱管呈π字形,其位於底部之水平部分為蒸發部,蒸發部末端向上延 伸之垂直部分為冷凝部,該基座交又設有供第_、二熱管蒸發部結合之 凹槽。 4. 如申請專利細第3項所述之熱管散熱裝置,其改良在於:該二凹槽分 別設於基座頂面及底面上。 5. 如申請專利範圍第丨項所述之熱管散熱裝置,纽良在於:該第一熱管 呈“U”字賴“L”字形,而相應之第二熱管呈“l”字形或“u”字 ,形,該二熱管之位於底部之水平部分為蒸發部,由水平部分末端向上延 伸之垂直部分為冷凝部’絲絲岭有供第—絲蒸發部結合之凹 13 M275395 槽,其頂面設有橫向延伸方向與上述凹衛目交又之供第4管蒸發部結 合之溝槽。 6. 如申請專利範圍第2、4或5項所述之熱管散熱裝置,其改良在於:該基 座凹槽兩端處分別開設相通基座側緣並上下穿透之門样M275395 IX. Patent scope of Shenjing ... 1. A heat pipe cooling device for dissipating the heat generated by the electronic tree, including-the second heat pipe and at least one second heat pipe, both of which have a connection with the base. : And the condensing part extending from the end of the Luofa part to the direction away from the base, a plurality of phases ^ hot matter Γ in the condensing part of the two heat pipes, the improvement is that the first heat pipe and the second heat pipe, and Lai's cousin has two cooling fins. Yi • 2. The heat pipe cooling device as described in item i of the scope of the patent application, which is improved: the first and second heat & are u-shaped, the horizontal part at the bottom is the evaporation part, and the vertical part extends upward The part is a condensing part. The base wire surface is provided with a groove for combining the first heat pipe evaporation part, and the top surface of the basin is provided with a lateral extension direction and the wire surface for a second fresh evaporation part combination groove. 3. If the scope of patent application is the first! The improvement of the fresh heat dissipation device described in the item is that the first and second # heat pipes are π-shaped, the horizontal part at the bottom is the evaporation part, and the vertical part extending upward from the end of the evaporation part is the condensation part, and the base crosses There are grooves for combining the first and second heat pipe evaporation sections. 4. The heat pipe radiating device according to item 3 of the patent application, which is improved in that the two grooves are respectively provided on the top surface and the bottom surface of the base. 5. According to the heat pipe radiating device described in item 丨 of the scope of patent application, Niu Liang is that the first heat pipe has a "U" shape and an "L" shape, and the corresponding second heat pipe has an "l" shape or "u" The horizontal part of the two heat pipes at the bottom is the evaporation part, and the vertical part extending upward from the end of the horizontal part is the condensation part. There is a recess 13 M275395 in the Sisiling for the combination of the first and the evaporation part, and its top surface A groove is provided for the fourth tube evaporation section to intersect with the above-mentioned concave guard in a transversely extending direction. 6. The heat pipe radiating device according to item 2, 4 or 5 of the scope of the patent application, which is improved in that: two ends of the base groove groove are respectively provided with doors that communicate with the side edge of the base and penetrate up and down. 7. 如申請專利朗第6項所述之熱管散歸置,其改良在於:該基座底面 還設有-底座,該底座頂面設有供與基座共同夾設第一熱管蒸發部之凹 槽’其中至少-第一熱管蒸發部被夾設於該基座與底座間。 8·如申請專利範圍第丨至5中任—項所述之熱管散熱妓,纽良在於: 該第-散熱鰭片與第二散鏡片相互頂靠。 :該熱管散熱 申月專矛J範圍第1項所述之熱管散熱裝置,其改良在於 裝置一側面安裝一風扇。7. The heat pipe arrangement according to item 6 of the patent application, the improvement is that the base surface is also provided with a-base, and the top surface of the base is provided with a base for the first heat pipe evaporation part The groove 'at least-the first heat pipe evaporation portion is sandwiched between the base and the base. 8. According to the heat pipe heat sink described in any one of the claims 1-5, the new Liang lies in that: the first heat-dissipating fin and the second diffuser lens abut against each other. : The heat pipe heat sink The heat pipe heat sink device described in item 1 of the J range of Shenyue Special Spear, which is improved by installing a fan on one side of the device. 1414
TW94205120U 2005-04-01 2005-04-01 Heat dissipating assembly with heat pipes TWM275395U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94205120U TWM275395U (en) 2005-04-01 2005-04-01 Heat dissipating assembly with heat pipes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94205120U TWM275395U (en) 2005-04-01 2005-04-01 Heat dissipating assembly with heat pipes

Publications (1)

Publication Number Publication Date
TWM275395U true TWM275395U (en) 2005-09-11

Family

ID=37008434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94205120U TWM275395U (en) 2005-04-01 2005-04-01 Heat dissipating assembly with heat pipes

Country Status (1)

Country Link
TW (1) TWM275395U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7866375B2 (en) 2006-12-01 2011-01-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7866375B2 (en) 2006-12-01 2011-01-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes

Similar Documents

Publication Publication Date Title
CN2736925Y (en) Heat sink
CN2842733Y (en) Radiating apparatus
TWM246694U (en) Heat dissipation device
TWM244512U (en) Heat pipe type radiator
JP4550664B2 (en) Heat sink with heat pipe
TWM270388U (en) Heat dissipation device for electronic device
TWM275395U (en) Heat dissipating assembly with heat pipes
TWM244561U (en) A heat pipe radiator
JP2004047789A (en) heatsink
TWM279915U (en) Water-cooling heat dissipation mechanism
JP3146030U (en) Heat dissipation fin structure and heat dissipation module using the heat dissipation fin
TW201212799A (en) Heat dissipation device
TWM281394U (en) Heat dissipation device
CN2694493Y (en) Heat pipe type heat radiator
JP4969979B2 (en) heatsink
CN221959342U (en) Horizontal heat transfer device
CN217503850U (en) Radiator and semiconductor air conditioner
TWI284500B (en) Heat sink
CN2509640Y (en) Heat dissipation device on a computer system processor
TWI289425B (en) Heat sink
JP4358963B2 (en) heatsink
TWM396426U (en) Structure improvement on heat dissipater
TWM276433U (en) Heat sink
TWI301745B (en) Heat dissipation device with heat pipe
CN1933131A (en) Radiating device

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees