TWM271371U - Dismantle tool for shield cover - Google Patents
Dismantle tool for shield cover Download PDFInfo
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- TWM271371U TWM271371U TW94201069U TW94201069U TWM271371U TW M271371 U TWM271371 U TW M271371U TW 94201069 U TW94201069 U TW 94201069U TW 94201069 U TW94201069 U TW 94201069U TW M271371 U TWM271371 U TW M271371U
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Description
M271371 沒、創作說明(1) (一)【新型所屬之技術領域】 本創作係有關於一種遮蔽蓋拆卸治具, 用以拆卸電 動化加工的方式,縮短加工時間及加工^ , 0曰 路板上所設的遮蔽蓋之治具者。 ’ )【先前技術】 按,目前的攜帶式 器、掌上型電腦或 界上的任何角落, 與任何其他個人進 在市面上愈來愈普 式通訊裝置在通訊 在摒除了通訊業者 能造成的通訊品質 會受到内部電路上 受到極大影響,由 隨著電子工業相關 向於輕薄短小進行 須建構著許多的電 頻雜訊的電子元件 成電磁的干擾,進 職司通訊功能的相 磁雜訊的相關干擾 體内部電磁雜訊外 助理 在世 _實施 裝置 攜帶 視, 其可 可能 發射 尺寸 漸趨 3里必 生高 件造 -* 些 到電 善機 通訊裝置,如行動電話、個人數位 智慧型手機等,滿足了現代人可以 /皆可以接收各種的即時訊息,以及 行通訊的聯絡,且隨著攜帶式通訊 及,也為現代人普遍地使用,因此 上的品質,亦日漸為使用者所重 其本身因為在硬體建置上的缺點, 不良的情況下,攜帶式通訊裝置亦 的電磁干擾,而造成訊息的接收及 於目前的攜帶式通訊裝置,其外觀 技術的精進及市場上的需要,而日 ΰ又ό十,因此在機體内部的有限空間 子元件,尤其是一些在運作中會產 ,更會對於機體内部其他的電子元 而影響到其正常的運作,尤其對於 關電子元件及電路來說,更容易受 而造成通品質的不佳,因此為改 溢的干擾,一般皆會在電路板上針M271371 Description of creation (1) (1) [Technical field to which the new type belongs] This creation relates to a method of dismantling a cover for dismantling electric processing, shortening the processing time and processing ^, 0 The fixture of the cover set on it. ') [Previous technology] Press, the current portable device, palmtop computer or any corner of the world, and any other individual into the market, more and more common communication devices in the communication are eliminating the communications that the carrier can cause. The quality will be greatly affected by the internal circuit. From the electronic industry to the thin and short, the electronic components that must be constructed with a lot of electric frequency noise become electromagnetic interference. The phase magnetic noise of the communication function of the company is related. The internal assistant of the electromagnetic interference inside the interference body is alive. The implementation device carries a video, which may emit a size that will gradually increase to 3 miles. It will be made of high-quality products-* Some smart phone communication devices, such as mobile phones, personal digital smartphones, etc. It satisfies that modern people can / can all receive various instant messages and communication contacts, and with portable communication and universal use by modern people, the quality is becoming more important to users. Because of the shortcomings in the hardware construction and the poor situation, the electromagnetic interference of the portable communication device also causes the access of the message. Contained in the current portable communication devices, the appearance technology is advanced and the needs in the market, and the sun is ten years old. Therefore, the limited space sub-components inside the body, especially some will be produced in operation, will be more Other electronic elements inside the body affect its normal operation, especially for electronic components and circuits, which are more susceptible to poor quality. Therefore, in order to improve the interference, they are usually pinned on the circuit board.
第5頁 M271371 四、創作說明(2) 對會產生電磁雜訊的高 遮蔽蓋體,將這些電子 其所產生出來的電磁雜 防止外溢的電磁雜訊對 擾’且為使得遮蔽蓋體 而言,該遮蔽蓋體與電 住’以避免電磁雜訊從 惟’當前述裝設有 時,一般皆必須先將遮 .對於内部的電路及電子 蔽蓋體,首先需要將遮 去,方可取下遮蔽蓋體 係以大量的吸錫線,利 時去吸附熔解後的銲錫 需要利用大量的銲錫線 要相當長的加工時間, 間成本上的大量浪費。 頻電子兀件或電⑫言曼置以-金屬的 疋件及電路予以遮蔽及覆蓋,使得 :能夠藉由遮蔽蓋體的進行阻隔: 其他電子元件或電路產生不當的 的遮蔽效果能夠達到最佳化,一 路板相接面皆全部藉由銲錫所封又 縫隙處產生有溢露的情形。 體的電子裝置需要進行維修 蓋於電路板上遮蔽蓋體除去,ς 疋件進行檢修,而為了除去這些 蔽蓋體與電路板間所銲固的銲i二 ,而為除去這些銲錫,%有= 用電焊搶加熱銲錫後,以吸錫 ,以達到除去銲錫的效果,但由^ ’且在吸附銲錫的加工過程中又^ 因此往往會造成在吸錫線材料及^ 新型内容】Page 5 M271371 IV. Creation instructions (2) For the high shielding cover that will generate electromagnetic noise, prevent the electromagnetic noise generated by these electrons from interfering with the electromagnetic noise, and to make the shielding cover The shielding cover and the electric shield are used to avoid electromagnetic noise. However, when the aforementioned equipment is installed, generally the shield must be shielded first. For the internal circuit and the electronic shield, the shield must be removed before it can be removed. The shielding cover system uses a large number of soldering lines, and it is necessary to use a large number of soldering lines to take a long time to process the melted solder, which is a waste of time. High-frequency electronic components or electronic devices are shielded and covered with -metal components and circuits, so that: can be blocked by shielding the cover: other electronic components or circuits can achieve the best shielding effect All the contact surfaces of a circuit board are all sealed by solder, and there is an overflow situation. Electronic devices need to be repaired and removed from the cover on the circuit board and removed from the cover. In order to remove the soldered solder between the cover and the circuit board, in order to remove these solders,% = After the solder is heated by electric welding, the solder is absorbed to achieve the effect of removing the solder. However, ^ 'and in the process of solder absorption ^ Therefore, it often results in the solder absorption wire material and ^ new content]
Me v 可用以簡化k 1 ―間化拆卸遮蔽 線,郎省材料費用 ,、·#··主要目的,在於提供一種遮蔽蓋拆卸治具 蓋的程序,並避免浪費大量的^锡 本創作〇 可大幅縮短^另—目#’在於提供一種遮蔽蓋拆卸治1 加工時間,加快拆除遮蔽蓋的速度,敦 "Me v can be used to simplify k 1-the demolition of the shielding line, save the cost of materials, and the main purpose is to provide a procedure for removing the cover from the cover and avoid wasting a lot of ^ tin book creation. Significantly shorten the ^ another-head # 'is to provide a processing time to remove the cover 1 to speed up the speed of removing the cover, "
'M271371 四、創作說明(3) 工作的效率。 為達成上述目的, 組,該上模組係由一 > 創作分別設有一上模組及一下模 組可沿上下方向作輛=壓缸之活塞桿所帶動,使得該上模 模組上,藉由氣壓缸:之移,,一電路板可被置放在該下 電路板上所設置的一 杯帶動該上模組下移並輕觸於 面加熱,藉以使得銲技认^表面,該上模組可對遮蔽蓋表 面間之銲錫呈一熔融狀熊,、、、蔽蓋周緣與電路板表面相接觸 吸附於該遮蔽蓋表面,^丄,藉由上模組所設之真空吸盤 >達到將遮蔽蓋自電路板.氣壓缸帶動上模組上移,藉以 可直接藉由機械自動操作面的,且由於本創作 後,即可將遮蔽蓋自電 主知錫直接加熱呈熔融狀態 省加工成本及縮短加工時拆除,故可同時具有節 (四)【實施方式】 為使 貝審查委員能逸一十 及其目的,兹附以圖式及知:步瞭解本創作之結構、特徵 后: 父佳具體實施例之詳細說明如 請分別參閱第1圖至第 治具之較佳實施例,係包圖所示,本創作遮蔽蓋拆卸 2 〇,該上模組1 〇係由一 ^ :上模組1 0及一下模組 動,使得上模組1 0可沿J乳壓缸3 〇之活塞桿3 2所帶 板4〇(示於圖4A、4°下方向作軸向之移動,一電路 藉由氣壓缸3 0之活塞桿=置放在該下模組2 0上’ 干05 2帶動該上模組1 〇下移並輕 M271371 曰、創作說明(4) 觸於電路板4 1 〇可對遮蔽 4 2周緣與電 達到將遮蔽蓋 他變化例中, 式之習知致動 請參閱第 平板狀之上蓋 1 1 4 2螺固 I空狀之套筒部 其内,套筒部 可藉由一螺釘 固活塞桿3 2 周緣環設有一 1141可藉 1 2之上表面 的電木材質的 —呈半圓柱狀 |一呈圓枉狀之 處,而固定座 1 6 2,連結 1 7,調整螺 座1 6 2之固 〇上所設 蓋4 2表 路板4 〇 4 2自電 氣歷紅3 件所取代 3圖所示 板1 2 ’ 有一連結 112, 1 1 2側 112 2 於套筒部 凸邊1 1 由螺釘1 處;該上 隔板1 3 之固定座 端面1 6 體1 6下 座1 6 2 在固定嫘 椁1 7具 定螺孔1 置的一遮蔽蓋42表面,該上模組 面均勻加熱,以使得銲固於遮蔽蓋 表面相接觸面間之銲錫熔解,藉以 路板4 〇表面上拆卸之目的。於其 0及活塞桿3 2亦可為其他適當形 ,該上模 上蓋板1 器1 1, 可使氣壓 邊表面穿 螺固於該 1 1 2内 4,該凸 1 4 2將 袁板1 2 ,並在隔 體1 6, 1可螺固 端處則設 軸中央處 孔1 6 2 組1 0 2上表 連結器 缸3 0 設有一 螺孔1 ,另在 邊1 1 連接器 下方處 板1 3 固定座 主要係 面處藉 1 1具 之活塞 螺孔1 12 1 套筒部 4上設 1 1螺 疊設一 的下方 體1 6 於該隔板1 3 有一呈圓柱狀 並穿設有一固 1内設置有一 有一螺紋部1 7 1可螺 62 1内,另在位於連 設置有一呈 由複數螺釘 有一内呈中 桿3 2套接 1 2 1,即 内,藉以鎖 1 1 2下端 有複數螺孔 固於上蓋板 具隔熱效果 表面處固設 上端處設有 的下表面 之連結座 定螺孔 調整螺桿 設於該連結 、结座1 6 2'M271371 IV. Creative Instructions (3) Work efficiency. In order to achieve the above purpose, the upper module is driven by a > creation with an upper module and a lower module, respectively, which can be driven by the piston rod of a car = press cylinder in the up and down direction, so that the upper module is With the movement of the pneumatic cylinder, a circuit board can be placed on a cup set on the lower circuit board to drive the upper module to move down and touch the surface to heat, so that the welding technology recognizes the surface, the upper The module can form a molten bear on the solder between the surface of the cover, and the peripheral edge of the cover is in contact with the surface of the circuit board and adsorbed on the surface of the cover, ^ 丄, by the vacuum suction cup provided by the upper module > It can reach the cover from the circuit board. The air cylinder drives the upper module to move up, so that the machine can automatically operate the surface directly, and after this creation, the cover can be directly heated from the main tin to be molten. Processing cost and shortening of dismantling during processing, so it can have section (IV) at the same time. [Implementation Method] In order to make the review committee be able to escape ten and its purpose, here are attached drawings and knowledge: after understanding the structure and characteristics of this creation : Detailed description of the specific embodiment of the parent Please refer to Figure 1 to the preferred embodiment of the jig, as shown in the package diagram. The cover of this creative is disassembled, and the upper module 10 is composed of 1 ^: upper module 10 and lower module. The upper module 10 can be moved axially along the plate 40 of the piston rod 32 of the J milk cylinder 3 0 (shown in FIG. 4A and 4 °). A circuit is driven by the pneumatic cylinder 3 0 Piston rod = placed on the lower module 2 0 'dry 05 2 drives the upper module 1 〇 to move down and light M271371, creation instructions (4) touch the circuit board 4 1 〇 can shield 4 2 periphery In the modified example of the electric actuator that will cover the cover, the conventional actuation of the type is described in the first plate-shaped upper cover 1 1 4 2 screwed I hollow sleeve part inside, the sleeve part can be fixed by a screw to the piston The periphery of the rod 3 2 is provided with a 1141 bakelite material that can be borrowed from the upper surface of the 1 2—a semi-cylindrical shape | a round cymbal shape, while the fixed seat 1 6 2 is connected to 1 7 and the adjusted screw seat 1 6 The cover of 2 〇 The cover 4 2 The road board 4 〇 4 2 The electric calendar red 3 replaced the board shown in the figure 1 2 ′ There is a connection 112, 1 1 2 side 112 2 on the sleeve 1 convex edge 1 1 by screw 1; the End face of the fixed seat of the upper partition 1 3 1 6 body 1 6 lower seat 1 6 2 The surface of a shielding cover 42 with a fixed screw hole 1 placed on the fixing plate 1 7 and the surface of the upper module is evenly heated to make the welding fixed. The solder between the contact surfaces of the cover surface is melted for the purpose of disassembly on the surface of the road board 40. The 0 and the piston rod 32 can also be other suitable shapes. The upper mold cover 1 and 11 can be The air pressure side surface is screwed into the 1 1 2 inner 4 and the convex 1 4 2 is the Yuan plate 1 2, and a hole at the center of the shaft is provided at the screwable end of the spacer 1 6 1 1 2 2 group 1 0 2The connector cylinder 3 on the table above is provided with a screw hole 1 and the other side 1 1 the plate below the connector 1 3 the main bearing surface of the holder 1 1 the piston screw hole 1 12 1 the sleeve part 4 is provided 1 1 screwed a lower body 1 6 on the partition 1 3 is cylindrical and penetrates a solid 1 is provided with a threaded portion 1 7 1 can be screwed 62 1 A plurality of screws have an inner rod 3 2 socket 1 2 1 inside, that is, inside, by a lock 1 1 2 there are a plurality of screw holes at the lower end fixed to the surface of the upper cover with heat insulation effect. Connecting the lower surface of the seat adjustment set screw holes provided in the coupling, the junction housing 162
• M271371 勾、創作說明(5) 下方的調整螺桿1 7 1 7 2,該螺帽1 7 1 6 2後,可以貼緊 以防止調整螺桿1 7 之軸中心處貫穿設有 端處延伸設置有一呈 接一導管174 1之 一抽氣幫浦(未圖示 延伸有一呈圓柱狀之 Φ央處穿設有一内螺孔 連結部1 7 5下方則 盤1 7 6可藉由一螺 設之穿孔176 1穿 1 7 5 1 ’使得真空 端,其中該螺栓丄7 177 1而與氣道1 產生作動時,位於真 栓177之氣孔I? > 之氣道173、固定 浦所排出;另在該隔 該隔板1 3與上模板 體1 4 ’使得上模板 間’連接柱體1 4分 於上蓋板1 2、隔板 J、、文4 1 7 1上則螺設有一螺帽• M271371 hook, the adjustment screw 1 7 1 7 2 below the creation instruction (5), after the nut 1 7 1 6 2 can be tightly attached to prevent the adjustment screw 17 from extending through the center of the shaft to an end. One of the pumps 174 1 is connected to a suction pump (not shown in the figure, a cylindrical Φ center is extended with an internal screw hole connecting portion 1 7 5 and the disk 1 7 6 can be perforated by a screw. 176 1 through 1 7 5 1 'makes the vacuum end, where the bolt 丄 7 177 1 and the airway 1 act, located in the air hole I of the true plug 177 > airway 173, fixed Pu discharge; another in the septum The partition plate 13 and the upper template body 14 are connected to the upper cover plate 14 by dividing the upper template body 14 into the upper cover plate 1. The partition plate J, and the text 4 1 7 1 are provided with a nut.
整螺桿17螺固定位在連結座 =於連結座162下端之表面,J 一々%動或移位者,沿調整螺桿i 7 由ί道1 73 ’並在調整螺桿17上 2管體”定端174用以套4 )相遠:導官1 7 4 1另一端則係與 連接,在調整螺桿17下端處另 ^ = 1 7 5,連結部i 7 5之軸中 5 1且與氣道1 7 3呈一導通, 真空吸盤1 7 6 ’該真空吸 77由真空吸盤176中央處所 ^螺固於連結部1 7 5之内螺孔 吸=17 6固定於連結部175下 j沿其軸中心處亦貫穿設有一氣孔 * 3呈一導通,藉以使得當抽氣幫浦 空吸盤1 7 6下方的空氣可以經由螺 I 1進入,並分別經由調整螺桿丄7 了4及導管1 7 4 1而由抽氣幫 板1 3下方處設置有一上模板1 5, 1 5之間則分別設置有複數的連接柱 1 5與隔板1 3間保持一定距離空 別係藉由複數的螺桿1 4 2穿設螺固 1 3與上模板1 5之間,另在上模板The whole screw 17 is fixed on the connection seat = on the surface of the lower end of the connection seat 162, if the J is moved or displaced, the adjustment screw i 7 is followed by the path 1 73 ′, and the adjustment screw 17 is 2 pipes. 174 is used to set 4) The distance is far: the other end of the guide 1 7 4 1 is connected to the lower end of the adjustment screw 17 ^ = 1 7 5; the axis of the connecting part i 7 5 is 5 1 and the airway 1 7 3 is a continuity, the vacuum chuck 1 7 6 'The vacuum chuck 77 is screwed by the central place of the vacuum chuck 176 ^ screwed to the inside of the connecting part 1 7 5 screw hole suction = 17 6 fixed at the lower part of the connecting part 175 j along the center of its axis An air hole * 3 is also formed throughout, so that the air under the suction pump 1 7 6 can enter through the screw I 1 and pass through the adjusting screw 丄 7 4 and the duct 1 7 4 1 respectively. An upper template 15 is arranged at the bottom of the air extraction board 1 3, and a plurality of connecting columns 15 and 15 are respectively arranged between the 5 to maintain a certain distance between the spacers. The screws are inserted through the plurality of screws 1 4 2 Set the screw between 1 3 and the upper template 1 5 and the other on the upper template
M271371 四、創作說明(6) 1 5表面相對應於固定座體1 6位置處則穿設有一貫穿孔 1 5 1 ’籍以提供固定座體1 6下方所設之連結座;[6 2 及真空吸盤1 7 6可輕易穿越而過,上模板1 5之下方表 面處則形成有一由凸邊所環繞構成之框體1 5 2,且框體 1 5 2係環繞於貫穿孔1 5 1而設置者,該框體1 5 2的 形狀則需要配合所欲拆除遮蔽蓋4 2之外觀形狀而設計, 使得該框體1 5 2大小恰可套設於遮蔽蓋4 2上表面之周 緣處’上模板1 5之材質最佳者係由具有良好導熱性之金 屬銅或合金所製成,上模板1 5之側邊處另橫向貫穿有複 的固定穿孔1 5 3 ,固定穿孔1 5 3内部設置有一加熱 管1 5 3 2 ’藉以對上模板1 5進行加熱,另在垂直於固 疋穿孔1 5 3之上模板1 5側邊處穿設有複數之螺孔 1 5 4並貫穿於固定穿孔i 5 3内壁,螺孔1 5 4内部則 分別設置有一螺桿1 5 4 1 ,藉由螺桿1 5 4 1可將加熱 管1 5 3 2螺固於固定穿孔丄5 3内部,俾防止加熱管…、 1 5 32自固定穿孔1 53内部向外脫落,另在上模板 1 5側邊另穿設有一安裝螺孔i 5 5,該安裝螺孔' 内部設置有一感溫元件丄5 5丄,係用以即時偵 1 5 :溫度。於其他變化例中,加熱管丄5 、為 •他適當形式之習知加熱元件所取代。 為 底板】L該組20具有一下模板21,係固定於-把 2上,下模板21的上方表面處凹設有一 電路板40的容置凹槽211,並在位於 兩側的下模板2 i上方表面處各設置有_扣固^2 1 1M271371 IV. Creation instructions (6) 1 5 The surface corresponding to the fixed base 16 is provided with a through hole 1 5 1 'to provide the connecting base provided under the fixed base 16; [6 2 and The vacuum chuck 1 7 6 can be easily passed through, and a frame 1 5 2 formed by a convex edge is formed at the lower surface of the upper template 15, and the frame 1 5 2 surrounds the through hole 1 5 1 and Setters, the shape of the frame 1 5 2 needs to be designed to match the appearance shape of the shielding cover 4 2 to be removed, so that the size of the frame 1 5 2 can be set on the periphery of the upper surface of the shielding cover 4 2 ' The best material of the upper template 15 is made of metal copper or alloy with good thermal conductivity. The side of the upper template 15 is penetrated by a plurality of fixed perforations 1 5 3 and the interior of the fixed perforations 1 5 3 A heating pipe 1 5 3 2 'is provided to heat the upper template 15 and a plurality of screw holes 1 5 4 are penetrated at the side of the template 15 which is perpendicular to the solid perforation 1 5 3 and penetrates the fixing. The inner wall of i 5 3 is perforated, and a screw 1 5 4 1 is provided inside the screw hole 1 5 4. The heating tube 1 5 3 can be connected by the screw 1 5 4 1. 2 is screwed into the fixed perforation 丄 5 3 inside, 俾 prevents the heating tube ..., 1 5 32 from the fixed perforation 1 53 to fall out from the inside, and another mounting screw hole i 5 5 is installed on the side of the upper template 1 5 The mounting screw hole 'is provided with a temperature sensing element 丄 5 5 丄, which is used to detect the temperature of 15: In other variations, the heating tube 丄 5 is replaced by a conventional heating element of its appropriate form. For the bottom plate] L The group 20 has a lower template 21, which is fixed on the handlebar 2. The upper surface of the lower template 21 is recessed with a receiving groove 211 for the circuit board 40, and the lower template 2 i _ 扣 固 ^ 2 1 1
M271371 電路板40固定於 1 2具有一呈長形 1 2 2將檔板 表面處,而樓板 之抓持部 2 1 2 1可以轉轴 2 1另一端經轉動 定位該電路板4 ◦ 係應用在一表面設 蔽蓋42由電路板 朝向上方而將電路 1 1内部,並轉動 的檔板2 1 2 1 , 1内部不易於移動 所欲加工的電路板 板2 1上所設置的 路板4 〇之形狀及 者’待電路板4 〇 之操作上模板1 5 上模板1 5的溫度 低工作溫度係指可 間的銲錫可以達到 程中則可同時藉由 四、創作說明(7) 2 1 2,以便於藉 容置凹槽2 1 1内 片狀之檔板2 1 2 2121 —端轴固 2121另一端表 2 1 2 3 ’使得扣 2 122為中心而 後移至容置凹槽2 之目的。 | 請參閱第4 A 有遮蔽蓋4 2的電 4 0上拆卸者,其 板4 0置放於下模 下模板2 1兩側所 使電路板4 0得以 或脫落,且本創作 4 0形狀及大小而 容置凹槽211之 |大小,並提供電路 正確定位於容置凹 所設的加熱管1 5 可以升高至所需的 以使銲接於遮蔽蓋 熔融狀態之最低溫 由扣固元件2 1 2將 ,其中該扣固元件2 1,並藉由一轉軸2 於下模板2 1之上方 面則凸設有一呈桿狀 固元件212之檔板 轉動,使其檔板2 1 1 1上方,藉以達到 圖所示,本創作主要 路板4 0,藉以將遮 主要係使遮蔽蓋4 2 板2 1之容置凹槽2 設之扣固元件2 1 2 固定於容置凹槽2 1 之下模板2 1可依據 做替換,以使得下模 形狀大小能夠符合電 板4 0能夠置入定位 槽2 1 1内部後,繼 3 2進行加熱,使得 最低工作溫度,其最 4 2與電路板4 〇之 度者,其進行加熱過The M271371 circuit board 40 is fixed at 1 2 and has an elongated 1 2 2 surface of the baffle plate, and the holding portion 2 1 2 1 of the floor can rotate the shaft 2 1 and the other end can be positioned by rotating the circuit board 4 ◦ It is used in A shielding cover 42 is provided on the surface to face the circuit board 1 upward from the circuit board, and the baffle plate 2 1 2 1 is rotated inside, and it is not easy to move the circuit board 4 provided on the circuit board board 21 to be processed. The shape and the operation of the circuit board 4 〇 The upper template 1 5 The lower temperature of the upper template 15 means that the solder can be reached in the middle of the process, and it can be achieved by four at the same time (7) 2 1 2 So as to facilitate the receiving of the groove 2 1 1 inside the sheet-shaped baffle 2 1 2 2121 —the end of the shaft 2121 the other end of the table 2 1 2 3 'so that the buckle 2 122 as the center and then moved to the purpose of receiving the groove 2 . Please refer to Section 4A. The disassembler on the electric 40 with the cover 4 2 has its board 40 placed on both sides of the lower die plate 2 1 so that the circuit board 40 can be taken off or detached. The size and size of the receiving groove 211 | size, and provide the correct positioning of the heating tube set in the receiving cavity 1 5 can be raised to the lowest temperature required to enable welding to the melting state of the shielding cover by the fastening element 2 1 2 The retaining element 2 1 is rotated by a rotating shaft 2 above the lower template 2 1 and a baffle plate with a rod-shaped fixing element 212 is rotated to make the baffle plate 2 1 1 1 Above, in order to reach the figure, the main road board 40 of this creation is used to cover the main cover 4 2 and the receiving groove 2 of the board 2 1 is fixed to the receiving groove 2 1 The lower template 2 1 can be replaced to make the shape of the lower mold conform to the shape of the electrical board 40. It can be placed inside the positioning slot 2 1 1 and then heated after 3 2 so that the minimum operating temperature is 4 2 and Circuit board 4 ℃, it is heated
第11頁 M271371 四、創作說明(8) 的ί溫元件15 51對上模板“進 需最低工模板15經持續加熱後達到: 下移,如第所ΐ動氣壓红30帶動上模組10 i::::::觸於遮蔽蓋42之表面,即=巧下方 成”ii52可以套置在遮蔽二 移時仍係持、d ;熱管1 5 3 2在上模組1 〇下 声,/ * IV 熱,以維持上模板15的工作π 度在本創作中該上模板1 5可以e诚&冰i 乍 kA 9 ^ ^ ^ , 依據所欲加工的遮絲筌 2形狀予以替換,使 j圯敞盍 4 2形狀大小能夠相符合 Τ:: 蓋42相接觸絲,名田上模板15與遮蔽 乙邳稷觸後,軋壓缸3 〇停止下移,上 過熱傳導方式加熱遮蔽蓋4 2 、^ 5則透 以拄绛μ & ^ 便付遮蔽盍4 2的溫度可 升可:逵“曰ί加熱一段時間後,使遮蔽蓋4 2的溫度上 及電路板4 ί 3:融點時,即可使得銲接於遮蔽蓋4 2 圖所-4 〇之間的銲錫產生熔融狀態,另請參閱第4 c 圖所不,此時抽氣幫浦則產生作 1 7 6與遮蔽蓋4 2間的空氣匕==真空吸盤 川進入,並經由=螺=”之氣孔 可以緊緊地吸附於空吸' 壓缸30作動以帶動上模組1〇上移,如第 遮蔽蓋4 2吸附起來’使遮蔽蓋 板 40表面,待上模組10移動Page 11 M271371 IV. The temperature control element 15 of the creation description (8) 51 pair of upper templates "Minimum input template 15 required for continuous heating: After moving down, the upper module 10 will be driven by the air pressure red 30" :::::: Touching the surface of the cover 42, that is, the bottom of the cover "ii52" can be placed on the cover and moved when the cover is moved, d; the heat pipe 1 5 3 2 is heard on the upper module 1 0, * IV heat in order to maintain the working π degree of the upper template 15. In this creation, the upper template 1 5 can be replaced by 诚 & ice kA 9 ^ ^ ^ according to the shape of the mask 2 to be processed, so that j 圯 OPEN 盍 4 2 The shape and size can conform to Τ :: cover 42 contact wire, Mingtian upper template 15 comes in contact with the shield E, the rolling cylinder 3 stops moving downward, and the upper cover heats the shield cover 4 2 , ^ 5 through 拄 绛 μ & ^ will cover the temperature of 盍 4 2 can rise: 逵 "say after heating for a period of time, the temperature of the cover 4 and the circuit board 4 ί 3: melting point At this time, the solder soldered between the shielding cover 4 2 and Figure 4 can be melted. Please also refer to Figure 4 c. At this time, the suction pump generates 1 7 6 and The air dagger between 2 and 4 of the cover 4 enters the vacuum suction cup, and can be tightly adsorbed to the air suction through the air holes of the screw. The pressure cylinder 30 is actuated to move the upper module 10 upward, such as the first cover 4 2 Attracted 'to cover the surface of cover plate 40 and wait for module 10 to move
第12頁 'M271371 四、創作說明(9) 示,即可由下模板? 浦作動,使真空取出電路板40,並停止抽氣幫 態,藉以取下該遮6與遮蔽蓋A 2間切斷真空狀 卸遮蔽蓋42之目的42,藉以達到由電路板40上拆 間,另可免除以往心ΐ此!但可同時A幅縮短加工的時 龐大花費。 p遮蔽蓋4 2時需使用大量吸錫線的Page 12 'M271371 IV. Creation instructions (9), can you use the template below? The pump is operated to make the circuit board 40 be taken out by the vacuum, and the pumping state is stopped, so as to remove the vacuum cover 42 and cut off the vacuum cover 42 between the cover 6 and the cover A 2, so as to achieve the disassembly of the circuit board 40. It also saves you from having to worry about it! However, it can reduce the processing cost of A-frame at the same time. p Shielding cover 4 2
請參閱第5圖戶斤+ 丄M L ,該冷卻裝置5 〇 可設置一冷卻裝置5 〇 使得冷卻裝置5 〇可二m:模組2 ◦之位置而設置, Μ 0表面;該冷卻心生的冷空氣吹向電路板 5 2,並在該管體5以;二;:中空管狀之管體 = !向下模組20之容置凹槽…方 氣管5 4 2之一端、拿:置有一連接座5 4,可以提供一輸 ^ ^ ^ ^連接’輸氣管542之另一端則俜盥一 空礼幫浦(未圖示)相連接,*々封:“知貝J係” 空氣經由輸氣管5 4 ?、隹入#二虱幫浦可以輸送高壓之冷 5 2 〇 4, . 2進入官體52内部,並由出氣孔 分離電n,侍ί上模組1 〇帶動遮蔽蓋4 2上移而 ^冷;面ί,可以即時啟動空氣幫浦作動,使 作4=:板40表面溫度之效果,以便於操 !以由下模組2〇中取出電路板4〇。 非用來:ί:Ϊ:實ί:ί Ϊ作之-較佳實施例而已,並 圍所述之形狀槿、止也脒車:’舉凡依本創作申請專利範 义 < 形狀、構造、特徵及籍細& & 汉猜砷所為之均等變化與修Please refer to Figure 5 for household weight + 丄 ML. The cooling device 50 can be provided with a cooling device 50, so that the cooling device 5 can be set at the position of 2m: module 2, the surface of M0; the cooling heart Cold air is blown to the circuit board 5 2 and placed in the tube body 5; 2 ;: hollow tube body =! Down the receiving groove of the module 20 ... one end of the square gas tube 5 4 2 The connection seat 5 4 can provide an outlet ^ ^ ^ ^ Connect to the other end of the gas pipe 542 and connect it to the air pump (not shown). * 々 Seal: "知 贝 J 系" Air passes through the gas pipe 5 4? , 隹 入 # 二 lice 帮 浦 can transport high-pressure cold 5 2 〇4,. 2 into the official body 52, and the electricity is separated by the air vent, the upper module 1 〇 drives the shielding cover 4 2 Move to the cold side; you can immediately start the air pump action to make 4 =: the effect of the surface temperature of the board 40 in order to facilitate operation! In order to remove the circuit board 40 from the lower module 20. Not used for: ί: Ϊ: 实 ί: ί Ϊ 作 之-the preferred embodiment, and the shape described in the hibiscus, but also the car: 'Jiu Fan in accordance with the meaning of this application to create a patent Fanyi < shape, structure, Features & details & & & Hanchai Arsenic
Η 第13頁 M271371 四、創作說明(ίο) 飾,均應包括於本創作之申請專利範圍内。271 Page 13 M271371 IV. Creation Instructions (ίο) Decorations shall be included in the scope of patent application for this creation.
圓_1 第14頁 M271371 圖式簡單說明 一~-~—- (五)【圖式簡單說明】 第1圖係本創作上模組及下模組之立體結構示意圖。 第2圖係本創作之前視及其部分結構剖面示意圖。 第3圖係本創作上模組之立體分解示意圖。 第4 A圖係本創作將欲加工之電路板置放於下模組之 圖。 思 第4 B圖係本創作之上模組經活塞桿帶動下移後,使下模 板接觸於遮蔽蓋表面之示意圖。 第4 C圖係本創作將真空吸盤及遮蔽蓋間的空氣抽離呈一 春真空狀態之示意圖。 第4 D圖係本創作之上模組經活塞桿帶動上移後,使遮蔽 蓋脫離電路板之示意圖。 第4 E圖係本創作在解除真空吸盤及遮蔽蓋間之真空狀態 後取下遮蔽蓋及電路板之示意圖。 第5圖係本創作之另一實施例示意圖。 主要元件符號說明 0 上模組 1 連結器 12 套筒部 1121 螺孔 1122 螺釘 114 凸邊 1141 螺孔Circle_1 Page 14 M271371 Simple illustration of the drawings I ~-~ —- (Five) [Simplified illustration of the drawings] Figure 1 is a schematic diagram of the three-dimensional structure of the upper and lower modules of this creation. Figure 2 is a schematic view of the front view and part of the structure of this creation. Figure 3 is a three-dimensional exploded view of the module in this creation. Figure 4A is a diagram of placing the circuit board to be processed on the lower module. Figure 4B is the schematic diagram of the upper module moved down by the piston rod to make the lower module contact the cover surface. Figure 4C is a schematic diagram of the spring vacuuming the air between the vacuum chuck and the cover. Figure 4D is a schematic diagram of the upper module moved upward by the piston rod to remove the shielding cover from the circuit board. Figure 4E is a schematic diagram of this work after removing the vacuum between the vacuum chuck and the cover, and removing the cover and the circuit board. FIG. 5 is a schematic diagram of another embodiment of this creation. Description of main component symbols 0 Upper module 1 Connector 12 Sleeve part 1121 Screw hole 1122 Screw 114 Convex edge 1141 Screw hole
第15頁 M271371Page 15 M271371
第16頁 M271371 第17頁 圖式簡單說明 1 7 5 1 内 螺 孔 1 7 6 真 空 吸 盤 1 7 6 1 穿 孔 1 7 7 螺 栓 1 7 7 1 氣 孔 2 0 下 模 組 2 1 下 模 板 2 1 1 容 置 凹 槽 2 1 2 扣 固 元 件 2 1 2 1 播 板 2 1 2 2 轉 轴 2 1 2 3 抓 持 部 2 2 底 板 3 0 氣 壓 缸 3 2 活 塞 桿 4 0 電 路 板 4 2 遮 蔽 蓋 5 0 冷卻 裝 置 5 2 管 體 丨5 2 2 出 氣 孔 5 4 連 接 座 5 4 2 輸 氣 管Page 16 M271371 Page 17 Brief description of the drawings 1 7 5 1 Internal screw hole 1 7 6 Vacuum suction cup 1 7 6 1 Perforation 1 7 7 Bolt 1 7 7 1 Air hole 2 0 Lower module 2 1 Lower template 2 1 1 Content Set groove 2 1 2 Fastening element 2 1 2 1 Seeding board 2 1 2 2 Rotating shaft 2 1 2 3 Holding part 2 2 Base plate 3 0 Pneumatic cylinder 3 2 Piston rod 4 0 Circuit board 4 2 Cover 5 5 Cooling Device 5 2 tube body 5 2 2 air outlet 5 4 connection seat 5 4 2 gas pipe
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94201069U TWM271371U (en) | 2005-01-20 | 2005-01-20 | Dismantle tool for shield cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94201069U TWM271371U (en) | 2005-01-20 | 2005-01-20 | Dismantle tool for shield cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM271371U true TWM271371U (en) | 2005-07-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94201069U TWM271371U (en) | 2005-01-20 | 2005-01-20 | Dismantle tool for shield cover |
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| TW (1) | TWM271371U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102241007A (en) * | 2011-06-27 | 2011-11-16 | 鸿富锦精密工业(深圳)有限公司 | Detaching device |
| CN103264570A (en) * | 2013-05-20 | 2013-08-28 | 共青城赛龙通信技术有限责任公司 | Device for separating double faced adhesive tape adhering object and separation method using device |
| TWI483656B (en) * | 2010-07-21 | 2015-05-01 | Hon Hai Prec Ind Co Ltd | Cooling device and method, circuit board repairing device and method using same |
-
2005
- 2005-01-20 TW TW94201069U patent/TWM271371U/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI483656B (en) * | 2010-07-21 | 2015-05-01 | Hon Hai Prec Ind Co Ltd | Cooling device and method, circuit board repairing device and method using same |
| CN102241007A (en) * | 2011-06-27 | 2011-11-16 | 鸿富锦精密工业(深圳)有限公司 | Detaching device |
| CN103264570A (en) * | 2013-05-20 | 2013-08-28 | 共青城赛龙通信技术有限责任公司 | Device for separating double faced adhesive tape adhering object and separation method using device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |