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TWM268895U - Uniform temperature heat conduction structure improvement - Google Patents

Uniform temperature heat conduction structure improvement Download PDF

Info

Publication number
TWM268895U
TWM268895U TW93220197U TW93220197U TWM268895U TW M268895 U TWM268895 U TW M268895U TW 93220197 U TW93220197 U TW 93220197U TW 93220197 U TW93220197 U TW 93220197U TW M268895 U TWM268895 U TW M268895U
Authority
TW
Taiwan
Prior art keywords
heat conduction
temperature heat
uniform temperature
structure improvement
conduction structure
Prior art date
Application number
TW93220197U
Other languages
Chinese (zh)
Inventor
Guo-Ren Lin
Huei-Min Tsuei
Original Assignee
Cpumate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cpumate Inc filed Critical Cpumate Inc
Priority to TW93220197U priority Critical patent/TWM268895U/en
Publication of TWM268895U publication Critical patent/TWM268895U/en

Links

TW93220197U 2004-12-15 2004-12-15 Uniform temperature heat conduction structure improvement TWM268895U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93220197U TWM268895U (en) 2004-12-15 2004-12-15 Uniform temperature heat conduction structure improvement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93220197U TWM268895U (en) 2004-12-15 2004-12-15 Uniform temperature heat conduction structure improvement

Publications (1)

Publication Number Publication Date
TWM268895U true TWM268895U (en) 2005-06-21

Family

ID=36599048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93220197U TWM268895U (en) 2004-12-15 2004-12-15 Uniform temperature heat conduction structure improvement

Country Status (1)

Country Link
TW (1) TWM268895U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422315B (en) * 2008-10-09 2014-01-01 Foxconn Tech Co Ltd Heat sink dissipation
CN117062382A (en) * 2022-05-05 2023-11-14 惠州惠立勤电子科技有限公司 Heat radiation structure of electronic device and heat radiation module thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422315B (en) * 2008-10-09 2014-01-01 Foxconn Tech Co Ltd Heat sink dissipation
CN117062382A (en) * 2022-05-05 2023-11-14 惠州惠立勤电子科技有限公司 Heat radiation structure of electronic device and heat radiation module thereof

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Legal Events

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MC4K Revocation of granted utility model