M259164 捌、新型說明： 【新型所屬之技術領域】 本創作係關於一種懸臂式探針卡(cantilever probe card)，尤指一種 南頻懸臂式探針卡，係應用在半導體晶圓測試（semiconductor wafer testing) 〇 【先前技術】 積體電路的測試(testing of integrated circuits)是電路設計與製 造過程中重要的一部分。當晶粒(die)形成於一半導體晶圓，尚未被切塊封 裝前便實施晶圓測試，以確認每一晶粒皆能達成設計者的要求。探針卡是 實施晶圓測試時一種習知的工具，作為測試設備與一受測試晶粒之間的介 面。測試時，實際接觸受測試晶粒之接合焊墊(bonding pad)的是探針卡中 探針（probe needle)的尖端（tip)，每一探針由一介電質（dieiectric material)包覆以隔離（isolation)其他探針。如第一圖所示為習知懸臂式 探針卡中的探針排列結構的一個剖面圖，每一支探針包含一導體 (conductor)ll 與其外圍的絕緣套管（insulating tube)12。 然而，無雜訊遮蔽且數目龐大的探針一層層整齊的疊放在一起，y測 試時探針中的電流改變時，探針電感（incluctance)會產生不需要的電壓暫 態（voltage transient) 〇此外，習知的懸臂式探針卡與探針結構，有一 受限的測賴率範圍，㈣臂式探針卡於職晶__於較低頻率範 圍。於高細試時，探針線_電容與電緣合(capacitive触地如阳 coupling)易產生雜訊(noise)與串擾(crosstalk) ’而導致測試不穩及誤宰 M259164 (overkill) 〇 為改善上述關題，目前業界__魏(GQaxial eable)作為探 針以隔離雜訊與串擾。如第二圖所示為同轴電纜的一個剖面圖，其由内而 外的構造為··内部導體21、内部絕緣體22、外部導體23與外部絕緣體24。 其中’内部導體21作為訊號線’而外部導體23作為接地線並連接至探針 卡的接地點。使關軸魏雖有良好的雜訊遮蔽效果，但是當訊號線、電 源線及接地職目-增加，便無法在有_基板㈣上設計及製作，所以 只能針對某些信麟作遮蔽，而無法全面遮蔽。再者，同轴魏的價格較 高、坪接較複雜且費時。 另-種業界所_隔_訊與串擾的方法是使龍直探針卡 (vertical probe card)或微機電探針卡 (Micro-Electro-Mechanical-Systems probe > 但因兩者製造費時，約為懸臂式探針卡製造時間的三至四倍。此外，此兩 者價格高昂’約域臂式探針卡的四至六倍，亦增加量產成本。 【新型内容】 為解決上述習用懸臂式探針卡中雜訊與串擾的問題，因此本創作的主 要目的在触-财效隔離雜域_擾之高縣臂式探針卡。 本創作的另-目的缺供—種高㈣顧探針卡，麟親實施高頻 訊號的晶圓測試。 本創作的再—目的缺供-種價格低廉、焊接簡單的高㈣臂式探針 M259164 卡0 為達到本創作上述的目的，本創作之高讎臂式探針卡，朗在測試 -半導體晶粒，此高麵臂式騎卡包含—電路板、乡數支探針、一探針 固疋環與多數層遮蔽層（shielding layer)。此電路板具有-上表面與一 下表面，於該上表面設置多數個測試接點，用以與一測試機台電氣連接， 並於該下表面設置多數個金屬焊點，此電路板的中心並形成一穿孔 (aperture)。每一支探針各具有兩端，其中之一為一尖端，與半導體晶粒 上相對之一接合銲墊接觸，另一端則電氣連接至該電路板的各個金屬焊 點。一探針固定環設置於電路板的下表面以及此穿孔的周圍，在距離各探 針的尖端的-預設長度的地方，彻—黏細，將多數支探針蚊在此探 針固定環上。於晶圓測試時，使各探針的尖端與此半導體晶粒上相對的接 合銲墊接觸。 多數層遮蔽層鋪設於探針固定環的外圍並介於此多數支探針之間，各 層遮蔽層與其相鄰之遮蔽層相互焊接並接地。本創作中將多數支探針與多 數層遮蔽層相互交錯排列，使探針間的雜訊與串擾降至最低的程度。然而， 若遮蔽層的數目減少，則遮蔽的效果較差。至於遮蔽層本身的形狀，牙·以 為扇型或同心圓(donut)型或半同心圓形(semi_donut)。而製作遮蔽層的材料 為可導電性的介質，例如金屬等。另外，又可將此金屬遮蔽層製作為金屬 膜(film)、金屬片（Piate)或金屬網(mesh)的形式。而多數層遮蔽層可以直 接焊接至電路板的各接地端，也可以用導線以匕幻連接至電路板的各接地 M259164 本創作高頻懸臂式探針卡相較於先前技術，量產成本較低、焊接簡單 與縮短製造時間。本創作中探針與遮蔽層相互交錯排列結構，改善了習知 懸臂式探針卡雜訊與串擾的問題，提高測試訊號的頻率，以達成穩定測試 高頻訊號的目的。本創作中遮蔽層與習知同轴電纜相較，材料價格低廉、 製作簡便更能節省基板空間。此外，探針與遮蔽層相互交錯排列結構的製 作方式，與習知懸臂式探針卡的製程相容，在焊接探針的步驟中同時鋪設 遮蔽層，不需開發額外的製程，即可達成減少雜訊與串擾的目的。 茲配合下列圖示、實施例之詳細說明及申請專利範圍，將上述及本創 作之其他目的與優點詳述於後。 【實施方式】 請同時參考第三A圖與第四圖，第三a圖所示為本創作高麵臂式探 針卡的-侧测1四_梢作冑機臂雜針卡的—麵視圖。此 高頻懸臂式探針卡包含-電路板310、多數支探針33〇、一探針固定環32〇 與多數層遮蔽層340。電路板31G的中心形成一穿孔313，此電路板31•『具 有一上表面311與一下表面312，在上表面311設置多數個測試接點314， 用來和-測試機台35G電氣連接，此外，在下表面312也設置多數個金屬 焊點犯。此電路板310為-印刷電路板(printed circuit 或積體 電路板(integrated circuit board)。探針330包含一導體11和一絕緣 套管12(如第一圖所示）。導體11具有兩端，其中之一為一尖端331，與半 M259164 導體晶粒上相對的一接合銲墊接觸，另一端則電氣連接至電路板310的各 金屬焊點315。第三B圖為第三A圖中虛線區塊3B之放大圖，可以清楚看 到探針330的導體U在探針固定環320外圍的部分，即在金屬焊點315與 探針固定環320之間，以絕緣套管12包覆住，其餘部分的導體η則未包 覆絕緣套管12。 探針固定環320設置在電路板310的下表面312以及穿孔313的周 圍’在距離各探針330的尖端331的一預設長度的地方，利用一黏著劑321， 以特定排列方向，將各探針330固定在探針固定環32〇上。在晶圓測試時， 使各探針的尖端331與半導體晶粒上相對的接合銲墊接觸。此黏著劑321 可以是環氧樹脂(epoxy resin)等的絕緣材質，將探針330固定在探針固定環 320 上。 本創作為降低探針之間的雜訊與串擾，將探針與遮蔽層相互交錯排 列，在焊接探針的步驟中同時鋪設遮蔽層，多數層遮蔽層鋪設在探針固定 環320的外圍並介於此多數支探針31〇之間，各層遮蔽層與其相鄰的遮蔽 層相互焊接並接地。 關於本創作中探針與遮蔽層相互交錯排列的結構，有三個較佳實落例 詳述如下。 第五圖為本創作中探針與遮蔽層排列結構之第—實施例的_個剖面 圖。本實施例中的探針層共三層（535~537) ’遮蔽層34()則為四層分別鋪 設在探針層（535、537)的⑭m及介於每—探針層之間，即探針層與遮蔽 層相互交錯平行排列， 而各層遮蔽層340與其相鄰的遮蔽層34Q相互焊接 M259164 並接地。此種結構隔離了來自上下兩外側以及鄰層探針間的雜訊與串擾。 第三A圖中探針層與遮蔽層的排列方式也是屬於第一實施例的相互交錯平 行排列方式。 第六A、第六B圖為本創作中探針與遮蔽層排列結構之第二、第三實施 例的剖面圖。第二、第三實施例中探針層同樣為三層（535〜537)，遮蔽層則 分別為五層與七層。第二實施例除了鋪設在探針層（535、537)外側的遮蔽 層340,介於探針330之間的遮蔽層341以波浪的形式與探針33〇相互交錯 排列，各層遮蔽層（340、341)與其相鄰的遮蔽層（34〇、341)相互焊接並 接地。此種結構隔離了來自上下兩外側以及同層相鄰探針間的雜訊與串 擾。而第三實施例則混合第一實施例與第二實施例的特色，除了舖設在探 針層（535、537)外側以及介於每一探針層之間的遮蔽層34〇之外，介於探 針330之間的遮蔽層341以波浪的形式與探針330相互交錯排列，各層遮 蔽層（340、341)與其相鄰的遮蔽層（340、341)相互焊接並接地。此種結 構不但隔離了來自鄰層探針間的訊號衰減與串擾，同層相鄰探針的雜訊與 串擾也一併隔離，因此，遮蔽的效果更佳。再者，無論第一或第二或第三 實施例中，若遮蔽層（340、341)的數目減少，遮蔽的效果會比較差。〜 此外’關於遮蔽層本身的形狀，如第四圖中的遮蔽層34〇為扇形，也 可以為同心圓形(如第七圖）74〇縣同心圓形(如第人圖侧#。至於製作 遮蔽層的材料為可導電性的介質，通常為金屬。另外，又可將此金屬遮蔽 層製作為金屬膜(film)、金屬片（piate)或金屬網(mesh)的形式。 綜上所述，本創作高頻懸臂式探針卡中探針與遮蔽層相互交錯排列結 M259164 構，改善了習知懸 ’气探針卡雜訊與_擾的問題，提細試訊號的頻率、 …μ :、宰狀λ又，本創作巾遮蔽層的材料價格健、製作簡便， ^ 目，肖⑼猶式探針卡 的製程相容，在焊接探針的步驟巾同時鋪設遮蔽層 ，不需開發額外的製程， 即可達成減少雜訊與串擾的目的 、上所述者’僅為本創作之較佳實施例*已，當不能以此限定本 到作實施之朗。即大驗摘作_料概騎作之均輕化與修飾， 白應仍屬本創作專利涵蓋之範圍内。 【圓式簡單說明】 第一圖為習知鮮式探針卡巾的探針制結構的-個剖面圖。 第一圖為習知同軸電規的一個剖面圖。 第二A圖為本創作高頻懸臂式探針卡的一個侧視圖。 第二B圖為為第三A圖中虛線區塊的放大圖。 ·， 第四圖為本創作高頻懸臂式探針卡的一個俯視圖。 第五圖為本創作中探針與遮蔽層排列結構之第一實施例的剖面圖。 第六A圖為本創作中探針與遮蔽層排列結構之第二實施例的剖面圖。 第六B圖為本創作中探針與遮蔽層排列結構之第三實施例的剖面圖。 第七圖顯示本創作中遮蔽層為同心圓形示意圖。 第八圓顯示本創作中遮蔽層為半同心圓形示意圖。 一 M259164 圖號說明： 11導體 21内部導體 23 外部導體 310電路板 312電路板的下表面 314 測試接點 320探針固定環 330探針 340遮蔽層 350 測試機台 740同心圓形遮蔽層 12絕緣套管 22 内部絕緣體 24 外部絕緣體 311電路板的上表面 313穿孔 315 金屬焊點 321黏著劑 331 探針的尖端 341波浪形遮蔽層 535〜537探針層 840半同心圓形遮蔽層 12M259164 新型 Description of the new type: [Technical field to which the new type belongs] This creation is about a cantilever probe card, especially a south frequency cantilever probe card, which is applied to semiconductor wafer testing (semiconductor wafer) testing) [Previous technology] Testing of integrated circuits is an important part of the circuit design and manufacturing process. When a die is formed on a semiconductor wafer, wafer testing is performed before it is diced and packaged to confirm that each die can meet the designer's requirements. A probe card is a well-known tool for performing wafer testing as an interface between test equipment and a die under test. During the test, what actually touches the bonding pad of the die under test is the tip of the probe needle in the probe card, and each probe is covered with a dieiectric material To isolate other probes. As shown in the first figure, a cross-sectional view of a probe arrangement structure in a conventional cantilever probe card is shown. Each probe includes a conductor 11 and an insulating tube 12 around the probe 11. However, the large number of probes without noise cover and stacked neatly on top of each other. When the current in the probe is changed during the y test, the incluctance of the probe will generate unwanted voltage transients. 〇 In addition, the conventional cantilever probe card and probe structure have a limited range of detection rate, and the arm probe card is in the lower frequency range. In the high-precision test, the probe line_capacitor and electrical connection (capacitive contact to the ground coupling) are prone to noise and crosstalk, which leads to instability in the test and the M259164 (overkill). 〇 is To improve the above problems, the industry currently uses GQ axial eable as a probe to isolate noise and crosstalk. As shown in the second figure, a cross-sectional view of a coaxial cable is shown. The inner conductor is constructed from an inner conductor 21, an inner insulator 22, an outer conductor 23, and an outer insulator 24. Among them, the "internal conductor 21 serves as a signal line" and the external conductor 23 serves as a ground line and is connected to the ground point of the probe card. Although Guan Jianwei has a good noise shielding effect, when the signal line, power line, and grounding title are increased, it cannot be designed and manufactured on the substrate, so it can only be shielded for certain letterheads. It cannot be completely covered. Furthermore, coaxial Wei is expensive, complicated and time-consuming. Another method used by the industry to isolate and crosstalk is to use a vertical probe card or Micro-Electro-Mechanical-Systems probe > It is three to four times the manufacturing time of the cantilever probe card. In addition, the two are expensive, about four to six times that of the range arm probe card, which also increases the mass production cost. [New content] To solve the above-mentioned conventional cantilever type The problem of noise and crosstalk in the probe card, so the main purpose of this creation is to touch-finance and isolate the noise domain_ disturbing Gao County arm-type probe card. Pin card, Lin Qin implements wafer testing of high-frequency signals. The re-purpose of this creation is a lack of high-arm probe M259164 card with low price and simple soldering. In order to achieve the above purpose of this creation, High-arm arm type probe card, Lang is testing-semiconductor die. This high-surface arm type riding card includes a circuit board, several probes, a probe retaining ring and most shielding layers. This circuit board has an upper surface and a lower surface. A test contact is used to electrically connect with a test machine, and a plurality of metal solder joints are arranged on the lower surface. The center of the circuit board forms an aperture. Each probe has two ends, One of them is a tip, which is in contact with the opposite one of the bonding pads on the semiconductor die, and the other end is electrically connected to each metal pad of the circuit board. A probe fixing ring is arranged on the lower surface of the circuit board and the perforation. Around, at a distance of a preset length from the tip of each probe, stick thinly, and stick most of the probes on this probe fixing ring. During the wafer test, the tip of each probe and The opposite bonding pads on this semiconductor die are in contact. A plurality of shielding layers are laid on the periphery of the probe fixing ring and interposed between the plurality of probes. Each shielding layer and its adjacent shielding layer are welded to each other and grounded. In the creation, most of the probes are interlaced with most of the shielding layers, so that the noise and crosstalk between the probes are minimized. However, if the number of shielding layers is reduced, the shielding effect is worse. As for the shielding layer itself Shape, teeth · Think of fan-shaped or donut-shaped or semi-donut-shaped. The material used to make the shielding layer is a conductive medium, such as metal. In addition, the metal shielding layer can be made. It is in the form of a metal film, a metal plate, or a metal mesh. Most shielding layers can be soldered directly to the ground terminals of the circuit board, or can be connected to each of the circuit boards with wires. Grounded M259164 Compared with the prior art, this creative high-frequency cantilever probe card has lower mass production cost, simple welding and shorter manufacturing time. In this creation, the probe and the shielding layer are staggered with each other, which improves the conventional cantilever probe. The problem of pin card noise and crosstalk increases the frequency of the test signal to achieve the purpose of stable testing of high frequency signals. Compared with the conventional coaxial cable, the shielding layer in this creation is cheaper in material, easier to manufacture and saves space on the substrate. In addition, the manufacturing method of the staggered arrangement of the probe and the shielding layer is compatible with the manufacturing process of the conventional cantilever probe card. The shielding layer is laid at the same time in the step of welding the probe, which can be achieved without developing an additional process. The purpose of reducing noise and crosstalk. In conjunction with the following illustrations, detailed descriptions of the examples, and the scope of patent applications, the above and other objects and advantages of this creation are detailed below. [Embodiment] Please refer to Figures 3A and 4 at the same time. Figure 3a shows the side of the creative high-arm probe card-side test 1-4-the tip of the machine arm miscellaneous needle card view. The high-frequency cantilever probe card includes a circuit board 310, a plurality of probes 33o, a probe fixing ring 32o, and a plurality of shielding layers 340. A hole 313 is formed in the center of the circuit board 31G. This circuit board 31 has an upper surface 311 and a lower surface 312, and a plurality of test contacts 314 are provided on the upper surface 311 for electrical connection with the -test machine 35G. A plurality of metal solder joints are also provided on the lower surface 312. The circuit board 310 is a printed circuit (integrated circuit board). The probe 330 includes a conductor 11 and an insulating sleeve 12 (as shown in the first figure). The conductor 11 has two ends. One of them is a tip 331, which is in contact with an opposite bonding pad on the half M259164 conductor die, and the other end is electrically connected to each metal pad 315 of the circuit board 310. The third diagram B is the third diagram A In the enlarged view of the dotted block 3B, it can be clearly seen that the conductor U of the probe 330 is outside the probe fixing ring 320, that is, between the metal welding point 315 and the probe fixing ring 320, and is covered with an insulating sleeve 12. The remaining part of the conductor η is not covered with the insulating sleeve 12. The probe fixing ring 320 is provided around the lower surface 312 and the through hole 313 of the circuit board 310 'a predetermined length from the tip 331 of each probe 330 , Each probe 330 is fixed on the probe fixing ring 32 in a specific arrangement direction using an adhesive 321. During the wafer test, the tip 331 of each probe is relatively bonded to the semiconductor die. Pad contact. This adhesive 321 can be epoxy (epo xy resin) and other insulating materials, the probe 330 is fixed on the probe fixing ring 320. In order to reduce the noise and crosstalk between the probes, the probe and the shielding layer are arranged alternately with each other. In the step, a shielding layer is laid at the same time, most of the shielding layers are laid on the periphery of the probe fixing ring 320 and interposed between the majority of the probes 31, and each shielding layer and its adjacent shielding layer are welded to each other and grounded. The structure in which the probe and the shielding layer are staggered with each other is described in detail below. The fifth figure is a cross-sectional view of the first embodiment of the arrangement structure of the probe and the shielding layer in the creation. This implementation The probe layer in the example consists of three layers (535 ~ 537). The "shielding layer 34 ()" is four layers which are respectively laid on the probe layer (535, 537) and between each probe layer. The needle layer and the shielding layer are arranged alternately and in parallel, and each shielding layer 340 and its adjacent shielding layer 34Q are welded to each other and grounded. This structure isolates noise and crosstalk from the upper and lower outer sides and between adjacent probes. Arrangement of probe layer and masking layer in three A The formula also belongs to the staggered parallel arrangement of the first embodiment. The sixth and sixth figures are sectional views of the second and third embodiments of the arrangement of the probe and the shielding layer in the creation. The second and third In the embodiment, the probe layer is also three layers (535 to 537), and the shielding layers are five layers and seven layers respectively. In addition to the shielding layer 340 laid on the outside of the probe layers (535, 537), The shielding layers 341 between the probes 330 are staggered with each other in the form of waves and the probes 33. Each shielding layer (340, 341) and its adjacent shielding layer (340, 341) are welded to each other and grounded. This structure isolates noise and crosstalk from the upper and lower outer sides and between adjacent probes on the same layer. The third embodiment mixes the features of the first embodiment and the second embodiment. In addition to laying on the outside of the probe layer (535, 537) and the shielding layer 34 between each probe layer, The shielding layers 341 between the probes 330 are staggered with each other in a wave form, and each of the shielding layers (340, 341) and its adjacent shielding layer (340, 341) are welded to each other and grounded. This structure not only isolates signal attenuation and crosstalk from adjacent probes, but also isolates noise and crosstalk from adjacent probes at the same layer, so the shielding effect is better. Furthermore, in the first, second or third embodiment, if the number of the shielding layers (340, 341) is reduced, the shielding effect will be poor. ~ In addition, regarding the shape of the masking layer itself, as in the fourth figure, the masking layer 34o is fan-shaped, or it can be a concentric circle (as in the seventh figure), and the county's concentric circle (as in the first figure side #.) The material used to make the shielding layer is a conductive medium, usually metal. In addition, the metal shielding layer can be made into the form of a metal film, a piate, or a metal mesh. As mentioned above, in this creative high-frequency cantilever probe card, the probe and the shielding layer are arranged in a staggered arrangement with the M259164 structure, which improves the problem of noise and interference of the conventional cantilever probe card, and improves the frequency of the test signal,… μ :, slaughter λ, and the material of the masking layer of this creative towel is healthy and easy to make. ^ The process of the Xiaoyue-type probe card is compatible. The masking layer is laid at the same time when the probe is soldered. The development of additional processes can achieve the purpose of reducing noise and crosstalk. The above-mentioned one is only a preferred embodiment of this creation *, when this cannot be limited to the implementation of the implementation. _The light weight and modification of the materials of the rough rider, Bai Ying is still covered by this creation patent [Circular type brief explanation] The first picture is a sectional view of the probe structure of the conventional fresh-type probe card. The first picture is a sectional view of the conventional coaxial electric gauge. The second diagram A This is a side view of the creative high-frequency cantilever probe card. Figure 2B is an enlarged view of the dashed block in Figure 3A. ·, The fourth picture is one of the creative high-frequency cantilever probe card. Top view. The fifth figure is a cross-sectional view of the first embodiment of the arrangement of the probe and the shielding layer in the creation. The sixth diagram A is the cross-sectional view of the second embodiment of the arrangement of the probe and the shielding layer in the creation. Figure 6B is a cross-sectional view of the third embodiment of the arrangement of the probe and the shielding layer in the creation. Figure 7 shows a schematic diagram of the concentric layer in this creation. The eighth circle shows that the shielding layer is semi-concentric in this creation. Circular diagram. One M259164 drawing number description: 11 conductor 21 inner conductor 23 outer conductor 310 circuit board 312 lower surface of the circuit board 314 test contacts 320 probe fixing ring 330 probe 340 shielding layer 350 test machine 740 concentric circle Shielding layer 12 Insulation sleeve 22 Internal insulator 24 External insulator 311 Upper surface of circuit board 313 Perforation 315 Metal solder joint 321 Adhesive 331 Tip of probe 341 Wave-shaped shielding layer 535 ~ 537 Probe layer 840 Semi-concentric circular shielding layer 12