由積 藉面。 指熱層 是散塗 乃物熱 ，熱散 之散之 言待物 而加熱 詳增散 更來待 層種 關塗一 有熱之 1 術散果 域技之效 領熱整熱 術散平散 技與不的 之係面佳 1 1)屬作表更 術 爿所創層生 技 δ型本一產 前 州新 佈而先 塗進 t 對，更 或手亦 是}有 片工扇 扇 僅 具 熱加風 常U以 散的或 通 藉 裝上片 ，W ，加裝熱 例欠片 是組散 為11熱 論 裝 W J f 板C散 無外加 路t裝 ，此， 電M加 中，者 以㈠置 式^1,再。 理位 方問 大 ) ， 中處定 熱的一龐 術熱預 散高之為 技散之 知本量更 熱一上 習成考得 散做板 之件本變 之件路。述零成積 知元電果前有為體 習子於效，會亦體 ，電接熱而均間整 按熱直散然，時得 發是的 扇、使 於或好 風續會 M245730 【新型内容】 本創作之主要目的即在提供一種待散熱物之散熱塗層， 其可在幾乎不增加待散熱物高度的情形下增加待散熱物的 散熱面積，進而提高散熱效果。 本創作之次一目的乃在提供一種待散熱物之散熱塗層，其 僅增加一塗佈層，較習用方式以散熱片或風扇者更為節省 成本。 【實施方式】Borrowed from the product. Refers to the thermal layer is a matter of heat, and the word of heat dissipation is to treat the object, and the heat is increased to disperse, and it is more to be treated. The layer is coated with heat. The combination of good and bad skills is good 1 1) It is a type of biotechnology δ type created by the table, and it is a new cloth in the prenatal state, and it is first applied into t pairs, or it is also the hand. With heat and wind, U is usually used to load the film, W, and the thermal example is to install the film is 11 thermal theory, WJ f, board C, and no external circuit, so the electric M is added, or the ㈠ 式 式 1, again. The reason is that Fang is a big fan), the heat of the middle heat is high, and the heat dissipation is high. It is said that there is something to do before the fruit of electricity, and the body will also be effective. The electricity is connected to the heat and the heat is evenly dissipated. The fan, the good or the good wind will be renewed. M245730 [New model] Content] The main purpose of this creation is to provide a heat-dissipating coating for heat-dissipating objects, which can increase the heat-dissipating area of the heat-dissipating objects without increasing the height of the heat-dissipating objects, thereby improving the heat-dissipating effect. The second purpose of this creation is to provide a heat-dissipating coating for heat-dissipating objects, which only adds a coating layer, which is more cost-effective than those using conventional heat sinks or fans. [Embodiment]
第4頁 M245730 五、創作說明（2) 為了詳細說明本創作之構造及特點所在，茲舉以下二 較佳實施例並配合圖式說明如后：Page 4 M245730 V. Creation Instructions (2) In order to explain in detail the structure and characteristics of this creation, the following two preferred embodiments are illustrated together with the illustrations as follows:
請參閱第一圖至第二圖，本創作第一較佳實施例所提 供之一種待散熱物之散熱塗層（1 0)， 主要係由多數氧化鋁 顆粒（1 1 )塗佈預定厚度於一待散熱物（2 1 )上所形成，本實 施例中係以一電路板為例，該等顆粒（1 1 )的直徑於本實施 例中約為0 . 1 5 mm， 為方便說明，特於圖中將該等顆粒較實 際比例放大，該散熱塗層（1 0 )具有絕緣、以及高導熱之特 性，即使全面塗佈於待散熱物（2 1)上，亦不會造成待散熱 物（2 1 )(電路板）上線路或接點間的短路。其中，該散熱塗 層的材質亦可為其他氧化金屬，而具有類似高導熱、絕緣 之功效者。 請再參閱第一圖，由圖中可見，該等顆粒（11 )之表面 積係球狀外露，故其表面積總和係至少兩倍於該待散熱物 (2 1 )表面上之被塗佈面積，亦即，塗佈了該散熱塗層（1 〇 ) 所產生的散熱面積會較原來的散熱面積多出至少一倍。Please refer to the first graph to the second graph. A heat-dissipating coating (1 0) for a heat-dissipating material provided by the first preferred embodiment of the present invention is mainly coated with a plurality of alumina particles (1 1) to a predetermined thickness on Formed on a heat sink (2 1), a circuit board is taken as an example in this embodiment, and the diameter of the particles (1 1) in this embodiment is about 0.15 mm. For convenience, Especially in the figure, these particles are enlarged compared to the actual proportion. The heat-dissipating coating (1 0) has the characteristics of insulation and high thermal conductivity. Even if it is fully coated on the object to be dissipated (2 1), it will not cause heat to be dissipated. Short circuit between lines or contacts on the object (2 1) (circuit board). Among them, the material of the heat-dissipating coating can also be other oxidized metal, and has similar high thermal conductivity and insulation effect. Please refer to the first figure again. As can be seen from the figure, the surface area of the particles (11) is spherically exposed, so the total surface area is at least twice the coated area on the surface of the heat sink (2 1). That is, the heat dissipation area generated by applying the heat dissipation coating (10) will be at least double the original heat dissipation area.
若以電路板為例，就電路板本身之散熱而言，其僅能 透過金屬材質之佈線（銅鉑）來散熱，因此實際上在電路板 上之真實散熱面積一般會少於其整體表面積的一半，而本 創作之實際散熱面積又至少大於待散熱物（即電路板）面積 的兩倍，換言之，本創作之散熱面積即至少大於電路板原 來實際散熱面積的四倍以上；由此可見本創作可大幅提高 散熱面積，且再藉由該散熱塗層本身的高導熱性，可大幅 提高散熱效率；且，藉由該散熱塗層的絕緣性，可使得人If a circuit board is taken as an example, as far as the heat dissipation of the circuit board itself is concerned, it can only be dissipated through metal wiring (copper-platinum). Therefore, the actual heat dissipation area on the circuit board is generally less than its overall surface area. Half, and the actual heat dissipation area of this creation is at least twice the area of the object to be cooled (ie, the circuit board), in other words, the heat dissipation area of this creation is at least four times greater than the original actual heat dissipation area of the circuit board; The creation can greatly improve the heat dissipation area, and the high thermal conductivity of the heat dissipation coating itself can greatly improve the heat dissipation efficiency; and the insulation of the heat dissipation coating can make people
第5頁 M245730 性 全 安 的 佳 更 有 具 電 觸 會 不 而 板 路 電 觸 接 3)接 奶夠 ^ bb 月 、-員 五 電他本 以其施 中實 例圍可 施範均 實案 本置 限制裝 為限熱 板以發 路用等 電非等 以並： 不 面 並便表 物方具 熱明燈 散說、 待為面 之係表 作僅體 創例殼 本為達 板馬 路如 作 創 片 熱 散 - 合 配 可 亦 作 創 本 圖 三 第 閱 參 再 請 其 以 高片 的熱 0)散 (1該 層至 塗導 熱能 散熱 該的 由上 ia \)y 麥1 2 5 /IV 上物 0)熱 (1散 層待 塗將 熱的 散速 該快 於可 置 貼性’ 部熱 底導 其 有 具 尚 外， 效 功 之 率 效 。熱 果散 效高 熱述 導前 的有 佳具 更了 生除 產作 以 藉本 上’ 使 可 此 度 高 的 物 熱 散 待 加 增 會 不 時 施 實 作 創 本 1 央合曰 可不 ，即 層線 塗佈 熱的 散上 之物 作熱 倉散 本待 。由 性藉除， 彈：移 用度上 應密物 的流熱 佳電散 極加待 持增自 保可能 物、熱 熱二將 散 的 待 速 即 度 密 流 電 的 受 承 bb 厶月 所 線 佈 抗， 阻 高 生 產 而 響 影。 熱加 高增 到而 受因Page 5 M245730 The sexual safety is better than the electric contact 3) The milk is enough ^ bb month,-Wu Wudian can use the practical examples to enclose the practical examples Set the restriction device as a heat-limiting board to send electricity to the road, etc .: The surface of the surface is not covered with hot lights, the surface of the system is made only for the case. Wound sheet heat dissipation-can also be used as the creation of the third picture. Please refer to it for the high heat of the sheet. 0) spread (1 this layer to the thermal conductivity of the heat. This is ia \) y Mai 1 2 5 / IV on the object 0) heat (1 scattered layer to be coated will be faster than the dispersibility of the heat can be applied to the part of the bottom of the heat has a special effect, the effectiveness of the work. The hot fruit dispersion effect is high before the introduction There is a good tool to change the production in order to borrow from the book, so that the heat can be increased to increase the degree of material will be implemented from time to time to create a book, the central government said that it can be, that is, the layer of coating heat spread The material is used as a thermal warehouse to dissipate. It is borrowed by sex, and it is bombed: the transfer of heat should be a good thing. Warranty materials, heat and heat will soon dissipate, and the acceptance of the current density will be affected. Bb The month's line resistance will hinder high production and affect the production. The increase in heat will be caused by the increase.
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第6頁 層 塗 熱 散 之 1物物 明熱熱 說散散 號待待 符!)[) 式： 圖 2 M245730 圖式簡單說明 第一圖係本創作一較佳實施例之立體示意圖； 第二圖係本創作一較佳實施例之側面示意圖； 第三圖係本創作一較佳實施例之實施狀態圖。 (11)顆粒 (3 1)散熱片The first layer of the heat-dissipating layer on the 6th page is bright and hot, the scattered number is to be signed!) [) Formula: Figure 2 M245730 The diagram is a simple illustration. The first figure is a three-dimensional schematic diagram of a preferred embodiment of this creation; The second figure is a schematic side view of a preferred embodiment of the present invention; the third figure is an implementation state diagram of a preferred embodiment of the present invention. (11) Particles (3 1) Heat sink
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