TWI913818B - Active heat dissipation apparatus - Google Patents

Abstract

This invention relates to an active heat dissipation mechanism, comprising: a heat-conducting plate body having a refrigerant flow space filled with refrigerant inside, wherein the heat-conducting plate body includes: a one-sided heat-conducting plate forming one side of the refrigerant flow space in the thickness direction; and a other-sided heat-conducting plate forming another side of the refrigerant flow space in the thickness direction, wherein at least one of the one-sided heat-conducting plate and the other-sided heat-conducting plate is formed with a strength reinforcing portion protruding into the refrigerant flow space.

Description

Active heat dissipation mechanism

This invention relates to an active heat dissipation mechanism, and more specifically, to an active heat dissipation mechanism that can improve heat dissipation performance by actively transferring heat generated from a heat-generating device (e.g., electronic equipment) through a phase change of a refrigerant that is more efficient than the thermal conductivity of the material itself.

Wireless communication technologies (such as Multiple Input Multiple Output (MIMO) technology) are technologies that significantly increase data transmission capacity by using multiple antennas. They are also spatial multiplexing technologies that transmit different data in the transmitter through separate transmitting antennas and distinguish the transmitted data in the receiver through appropriate signal processing.

Therefore, increasing the number of transmit and receive antennas simultaneously increases channel capacity, allowing more data to be transmitted. For example, increasing the number of antennas to 10 ensures approximately 10 times the channel capacity compared to an existing single-antenna system using the same frequency band. In transceiver devices employing MIMO technology as described above, the number of transmitters and filters also increases with the number of antennas.

As mentioned above, with the increase in the number of transmitters and filters, there is also a problem of the increase in heat-generating elements. In order to prevent the performance of the antenna device from degrading, MIMO technology has taken the lead in researching heat dissipation mechanisms that effectively dissipate the heat generated from multiple heat-generating elements.

Figure 1 is an exploded perspective view showing an example of an antenna device according to the prior art.

As shown in Figure 1, the heating device (e.g., an electronic device) can be implemented as an antenna device.

As shown in Figure 1, the existing antenna device includes: an antenna housing body 10, which is equipped with a cuboid box shape with an opening at the front and a relatively thin front and rear thickness, and a plurality of heat dissipation fins 11 integrally formed on the rear surface; a main board (not shown), which is stacked and arranged in the rear surface inside the antenna housing body 10; and an antenna plate 15, which is stacked and arranged in the front surface inside the antenna housing body 10.

Multiple power supply-related components for power supply control calibration are installed on the motherboard, and the heat generated by the components during the power supply process is dissipated to the outside through multiple heat dissipation fins 11 at the rear of the antenna housing 10.

Furthermore, the PSU board 40, which houses the power supply unit (PSU) components, is stacked on the underside of the main board or arranged at the same height, and is designed so that the heat generated from the PSU components is also dissipated to the outside through multiple heat dissipation fins 11 at the rear of the antenna housing body 10.

The front surface of the motherboard has multiple RF filters (not shown), and the rear surface of the antenna board 15 is arranged to be stacked on the front surface of the multiple RF filters.

Multiple patch or dipole radiating elements 17 can be installed on the front surface of the antenna plate 15. An antenna cover panel 50 can be provided on the front surface of the antenna housing body 10 to protect the internal components from external influences while allowing the multiple radiating elements 17 to radiate smoothly.

However, existing antenna devices have an antenna cover panel 50 at the front, and the system heat generated inside needs to be concentrated and dissipated at the rear of the antenna housing body 10. Therefore, it is necessary to improve the heat dissipation performance of multiple heat dissipation fins 11.

Here, as a solution to improve the heat dissipation performance of the multiple heat dissipation fins 11, the following manufacturing method can be considered: using a material with better thermal conductivity to form an integral part with the antenna housing body 10, and keeping its outermost front end as far away from the heat-generating element as possible from the external space.

However, relying solely on the material of the multiple heat dissipation fins 11 not only has limitations in improving thermal conductivity, but also presents the following problems: even when the outermost front end of the multiple heat dissipation fins 11 is far away from the heat-generating element, it is impossible to eliminate the heat concentration phenomenon in the part adjacent to the heat-generating element where heat flows in, and it becomes a factor that increases the size of the product in the thickness direction, thus hindering the ultra-thinning of the product.

In addition, in the field of related heat dissipation technology, thermally conductive materials (metals) that are commonly used as the material for multiple heat dissipation fins 11 include aluminum (Al) alloys.

Among metals, silver (Au, 418.6), copper (Cu, 372.1), and gold (Ag, 295.3) have higher thermal conductivity (in W/mK) than aluminum (Al). However, they are relatively expensive compared to aluminum, so from an economic (cost) perspective, they cannot be widely used in methods that cover large heat dissipation areas.

However, since pure aluminum (Al) cannot meet the strength and ductility requirements, it is usually manufactured in the form of aluminum alloys that are roughly mixed with silicon and magnesium. In this case, due to its low castability, its application is extremely limited to the manufacture of small or simple-shaped parts. Although the cost is lower than that of silver, copper and gold mentioned above, it still has the disadvantage of higher manufacturing cost.

Furthermore, the heat dissipation fins 11 made of aluminum alloy are also difficult to overcome the aforementioned material limitations. Recently, a refrigerant-type heat dissipation system that uses a phase change substance as a refrigerant to fill the sealed interior and dissipates heat by the temperature difference between the latent heat and sensible heat used during the phase change of the refrigerant has attracted much attention.

In this refrigerant-type heat dissipation system, the core element for maximizing heat dissipation performance is the refrigerant undergoing phase change. The aluminum alloy heat dissipation fins 11 can only serve to transfer all the heat generated from the heat-generating element, which is the object of heat generation, to the refrigerant according to its own thermal conductivity while forming a closed refrigerant flow space for the refrigerant to flow due to phase change.

Therefore, the heat dissipation fins 11 that form the refrigerant flow space filled with the refrigerant as a phase change substance should be designed to minimize the physical distance from the heating element to the refrigerant. This is the optimal design point for improving heat dissipation performance. Currently, the heat dissipation fins 11 that have been researched and developed still prefer the expensive aluminum alloy material because it is the most widely used material.

However, in the case of pure aluminum, due to the good elongation related to the workability of the metal, it is possible to manufacture heat dissipation fins 11 that can minimize their thickness. However, in order to enhance strength and flexibility, the elongation of heat dissipation fins 11 made of aluminum alloy material is reduced, and there are limitations in minimizing their thickness.

Furthermore, when the metal material constituting the heat dissipation fin 11 is aluminum and the refrigerant is water, during the initial filling of the refrigerant, the aluminum material reacts with the water to form aluminum oxide. During this process, some of it is replaced by hydrogen, which increases the internal pressure. Typically, in aluminum heat dissipation mechanisms, special refrigerants such as Honeywell refrigerants or CFCs (Freon gases) are required to prevent this chemical reaction. Therefore, the disadvantage of a reduced range of refrigerant choices is pointed out.

In addition, phase change refers to the phenomenon that the intrinsic state of a liquid/gas/solid changes when it accumulates a large amount of energy or releases stored heat.

Phase change refers to a change in the physical arrangement of molecules, rather than a chemical reaction such as chemical bonding or formation. The amount of heat that does not undergo a phase change when energy is applied to a substance is called sensible heat, while the amount of heat used when a phase change occurs is called latent heat.

However, since temperature and pressure are directly proportional, there is a problem that the pressure increases as the temperature of the heat dissipation mechanism rises. If the pressure rises due to the high temperature conducted from the heat source within a sealed heat dissipation mechanism, it can cause the mechanism itself to rupture. To solve this problem, it is necessary to prevent pressure rise; therefore, the heat dissipation mechanism needs sufficient internal volume to achieve pressure balance during the phase change cycle of the substance.

Furthermore, the refrigerant filled inside the heat dissipation mechanism must be selected from those that do not cause chemical reactions with the metal material that serves as the heat dissipation mechanism, in order to prevent an increase in the internal pressure of the heat dissipation mechanism.

For example, when the metal material constituting the heat dissipation mechanism is aluminum (Al) and the refrigerant is water, during the initial filling of the refrigerant, the aluminum material reacts with the water to form aluminum oxide. During this process, some of it is replaced by hydrogen, which leads to an increase in internal pressure. Typically, special refrigerants such as Honeywell refrigerants or CFCs (Freon gases) are selected in aluminum heat dissipation mechanisms to prevent this chemical reaction.

However, in recent years, many countries have shown a trend of restricting the use of special refrigerants other than water, such as Honeywell refrigerants or CFCs (Freon gases). As mentioned above, there are concerns about leakage of these special refrigerants to the outside when the heat dissipation mechanism is damaged due to increased internal pressure or during the transportation, transfer, or installation of the product. In such cases, there is a potential problem of air and environmental pollution.

However, if special refrigerants are excluded as usable refrigerants, aluminum has a higher thermal conductivity compared to other metal materials, which limits the use of commonly used heat dissipation mechanisms. Therefore, the manufacturing industry of related heat dissipation mechanisms is currently actively conducting research on the substitution of metal materials for heat dissipation mechanisms and heat dissipation design.

In addition, as research data related to the above-mentioned shortcomings, the paper by Liqiang Deng, co-author of the International Journal of Thermal Sciences (published on August 15, 2022, hereinafter referred to as the "existing paper"), is briefly introduced below as "Thermal study of the natural air cooling using roll bond flat heat pipe as plate fin under multi-heat source condition".

Figure 2 is a schematic diagram showing the manufacturing process of the Roll Bond Flat Heat Pipe (hereinafter referred to as "RBFHP") as described in the existing paper (see Figure 4 of the existing paper), and Figure 3 is a schematic diagram of the experimental apparatus of the RBFHP in Figure 2 (Figure 6 of the existing paper).

As shown in Figure 2, the existing paper's RBFHP uses a pre-designed mold to print non-bonded graphite on the first aluminum sheet and then stacks it onto the second aluminum sheet. Then, the two aluminum sheets are rolled and joined in the order of hot rolling-cold rolling-annealing, and a feed pipe is welded. High-pressure gas is injected into the plate from the inlet, causing the unbonded part to expand, thereby forming a self-connected chamber.

The existing paper concludes that the RBFHP formed as described above has better results than ordinary aluminum plates (fins) under the test conditions shown in Figure 3 (test with four uniformly distributed heat sources).

However, since the RBFHP in the existing paper is manufactured by the roller bonding method described above, there is a problem that the refrigerant (especially the liquid phase refrigerant) is difficult to place at the joint end (i.e., the edge end) closest to the heat source.

That is, in the roller bonding method, the edge ends must be joined, and at least the overlapping joints need to be separated from the heat source (heating body). Therefore, thermal resistance is generated according to the material of the component itself.

The reason why existing papers limit the manufacturing method of RBFHP to roller bonding or adopt this method is that it is the best way to form two aluminum plates inside, since it is practically impossible for the aluminum plates themselves to bend, and therefore it is considered an unavoidable method.

Furthermore, in existing RBFHP papers, when the vaporized refrigerant moves near the heat source and then to the condensation zone for condensation, in order to maximize its area, although it has a honeycomb structure, the flow zone at the top furthest point from the heat source where the vapor refrigerant moves rapidly becomes longer. Since the return path of the liquid refrigerant condensing in the condensation zone overlaps with the flow zone of the vapor refrigerant, a large flow resistance problem can be expected.

[Technical Problem] In order to solve the aforementioned technical problem, the purpose of this invention is to provide an active heat dissipation mechanism and its manufacturing method that can improve the heat dissipation performance of a heat-generating device (electronic equipment).

Furthermore, another objective of this invention is to provide an active heat dissipation mechanism and its manufacturing method that maximizes the heat transfer capacity of the refrigerant filled inside.

Furthermore, another objective of this invention is to provide an active heat dissipation mechanism with excellent manufacturability and a method for manufacturing the same.

Furthermore, this invention expands the application of water as a refrigerant by replacing aluminum (Al) with a metal with lower thermal conductivity in conventional metal materials, thereby enabling the production of low-cost products. Another objective of this invention is to provide an active heat dissipation mechanism and its manufacturing method that can achieve the same or better heat dissipation performance as existing ones.

Furthermore, another objective of this invention is to enable the use and application of water as a phase-change refrigerant, thereby providing an active heat dissipation mechanism and its manufacturing method that can fully meet the requirements of various countries.

The technical problems that this invention aims to solve are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description. [Technical Solution]

The active heat dissipation mechanism according to the present invention includes: a heat-conducting plate body having a refrigerant flow space filled with refrigerant inside, wherein the heat-conducting plate body includes: a one-sided heat-conducting plate forming one side of the refrigerant flow space in the thickness direction; and a other-sided heat-conducting plate forming another side of the refrigerant flow space in the thickness direction, wherein at least one of the one-sided heat-conducting plate and the other-sided heat-conducting plate is formed with a strength reinforcing portion protruding into the refrigerant flow space.

Furthermore, the metal plate components constituting the main body of the heat-conducting plate can be made of stainless steel (SUS).

Furthermore, the refrigerant flow space may include: a first refrigerant flow path, which obtains heat from the heat-generating body that is the heat dissipation target through the heat-conducting plate body; and a plurality of second refrigerant flow paths, which are connected to the first refrigerant flow path and uniformly supply the liquid phase refrigerant that condenses from the gaseous state to the liquid state to one side of the first refrigerant flow path.

Furthermore, the second refrigerant flow path can be formed along the direction of gravity or inclined relative to the direction of gravity.

Furthermore, the second refrigerant flow path can be defined among a plurality of inclined guides that symmetrically protrude from the opposite surface of the heat-conducting plate body into the refrigerant flow space.

Furthermore, at least one of the second refrigerant flow path or one end and the other end of the plurality of inclined guides can be connected to the first refrigerant flow path, and the one end and the other end can be connected in a straight line.

Furthermore, the heat-conducting plate on one side and the heat-conducting plate on the other side can be constructed using a single metal plate component, and the refrigerant flow space can be formed by bending the single metal plate component.

Furthermore, the heat-conducting plate on one side and the heat-conducting plate on the other side can be constructed using two separate metal plate components, and the refrigerant flow space can be formed by joining the two metal plate components. [Technical Effect]

According to an embodiment of the active heat dissipation mechanism and its manufacturing method of the present invention, the following effects can be achieved.

First, it can minimize heat concentration caused by rising airflow on the back surface of the heat dissipation shell and achieve active heat transfer through the phase change of the refrigerant, thereby significantly improving the overall heat dissipation performance.

Secondly, by shortening the gas-liquid circulation cycle of the refrigerant filled inside, the heat transfer capacity can be maximized, thereby improving the heat dissipation performance.

Third, the material of the heat-conducting plate body that constitutes the refrigerant flow space during the refrigerant phase change is replaced with SUS material, which is a metal material lower than aluminum. Compared with the material made of existing aluminum, it can achieve a higher heat dissipation performance.

Fourth, it allows for the selection of refrigerant limited to water, and in particular, it enables countries that restrict the use of refrigerants to ensure product design diversity in terms of usage and manufacturing.

Fifth, compared with metal materials with relatively high thermal conductivity, it is possible to manufacture heat dissipation mechanisms with the same or better heat dissipation performance using metal materials with relatively low thermal conductivity, thereby achieving the effect of reducing manufacturing costs and simplifying the manufacturing process.

The following describes in detail, with reference to the figures, embodiments of the active heat dissipation mechanism of the present invention and its manufacturing method.

It should be noted that when assigning component symbols to the constituent elements of each drawing, the same component symbol should be assigned to the same constituent element as much as possible, even if it is marked on different drawings. Furthermore, in describing the embodiments of the present invention, detailed descriptions of known structures or functions are omitted if it is determined that a detailed explanation would impede the understanding of the embodiments of the present invention.

In describing the constituent elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish one constituent element from others, and the nature, order, or sequence of the corresponding constituent elements are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary knowledge in the art to which the present invention pertains. Terms identical to those defined in commonly used dictionaries shall be interpreted as having the same meaning as in the context of the relevant art, and shall not be interpreted as having an ideal or overly formal meaning unless expressly defined in this application.

1 The setting of the heat dissipation mechanism is solar energy. - Antenna device

Figures 4a and 4b are perspective views showing two different configurations of the rear portion of the antenna device of an active heat dissipation mechanism according to an embodiment of the present invention, and Figures 5a and 5b are exploded perspective views showing the rear portion of the antenna device of Figures 4a and 4b, respectively.

Typically, heat-generating devices (electronic devices) are manufactured in various forms throughout the industry. However, the applicant of this invention is an enterprise engaged in the manufacturing of other wireless communication equipment. A representative heat-generating device (electronic device) in wireless communication equipment is the antenna device. The antenna device will be used as a specific example for explanation below.

However, the active heat dissipation mechanism according to the embodiments of the present invention described later is not necessarily to be interpreted as being limited to applications in antenna devices.

As shown in Figures 4a and 4b, the antenna device 100 of the active heat dissipation mechanism 200, 1200 of the embodiment of the present invention includes: a heat dissipation shell body 110, which forms a receiving space with an opening in front and is formed into a cuboid shape that is generally longer in the vertical direction and has a thin front and rear receiving width.

The heat dissipation housing body 110 may be equipped with a thermally conductive material (in particular, a metal material) to effectively transfer heat by making surface thermal contact with the heat-generating element described later (e.g., element symbol “140” in Figures 22 and 23 described later).

Although not shown, a motherboard (referring to component symbol "120" in Figure 7) can be stacked and arranged inside the housing space of the heat dissipation shell body 110 using a clasp (refer to component symbol "125" in Figure 7) as a substrate for a power amplifier (PAU) and a digital transceiver unit (DTU). The motherboard can have multiple micro bellows filter (MBF) elements mounted on its front surface and a heat-generating element 140 mounted on its back.

Here, motherboard 120 can be defined as a heat-generating element 140, such as a radio frequency integrated circuit (RFIC) component or a power amplifier (PA), which generates a significant amount of heat during its operation. However, it should be noted that in this embodiment of the invention, the electronic device is only described as an antenna device, and the heat-generating element 140 is not limited to the above-described configuration. For example, a semiconductor or the CPU of a PC, which are representative heat-generating elements, can also be used as heat-generating element 140.

An antenna cover panel 50 may be provided on the front surface of the housing space of the heat dissipation housing body 110, so as to protect the radiating element, which is implemented as an antenna element, from external influences, while allowing the radiating element to radiate smoothly.

However, as described below, for antenna devices in electronic equipment where heat dissipation is of great necessity, the antenna cover panel 50, which is not suitable for heat dissipation, is provided on the front surface of the heat dissipation housing body 110. Due to the above factors, it is more necessary to concentrate heat dissipation on the remaining parts other than the front surface of the heat dissipation housing body 110, and an effective heat dissipation design with a limited heat dissipation area is required.

Additionally, an active heat dissipation mechanism 200, 1200 according to an embodiment of the present invention may be provided on the back of the heat dissipation shell body 110.

According to embodiments of the present invention, the active heat dissipation mechanisms 200 and 1200 are equipped in the form of heat dissipation fins. Strictly speaking, they are different from the fixed heat dissipation fins 200F-1 and 200F-2 described later. Their feature is that they are equipped with a type of vapor chamber with a thin thickness, which is filled with a refrigerant that can undergo phase change as heat that must be supplied from the outside.

Here, the active heat dissipation mechanism 200 according to an embodiment of the present invention may include an absorber 300 that absorbs the liquid refrigerant in the refrigerant and holds it close to the heating element 140, and promotes the evaporation of the liquid refrigerant into the gaseous refrigerant.

However, the concept of retaining liquid refrigerant by absorber 300 is not limited to simply absorbing and storing liquid refrigerant. It should be understood that the liquid refrigerant is at least made to flow above its water surface in the opposite direction (upper side) to the direction of gravity by absorption force (or capillary force).

Typically, a wicking component is provided inside a well-known (and publicly known) vapor chamber. This wicking component has a wick structure with multiple pores. The wicking component can be manufactured by sintering metal powder to form multiple pores that allow the liquid refrigerant filling the interior of the heat-conducting panel component to move towards the side equipped with the heating element by capillary force, while simultaneously allowing the gaseous refrigerant to flow freely to the outside.

However, the liquid absorbent core component is not limited to the sintered metallic liquid absorbent core component described above. In particular, within the scope of being able to absorb and disperse liquid-phase refrigerant or promote gasification, although it may have any name such as the absorber 300, it can be defined as including all possible materials such as fibrous materials. This will be explained in more detail below.

2-1 Regarding the first embodiment (an embodiment of the present invention) and the setting of the pressing part

Figure 6 is an exploded perspective view showing the installation state of an active heat dissipation mechanism according to an embodiment of the present invention with respect to the press-in portion formed on the back side of the antenna device of Figure 5a. Figure 7 is a cross-sectional view and a partially enlarged view showing the installation state of the active heat dissipation mechanism according to an embodiment of the present invention with respect to the press-in portion of Figure 6. Figure 8 is a cross-sectional perspective view and a partially enlarged view showing the installation state of the active heat dissipation mechanism according to an embodiment of the present invention with respect to the press-in portion of Figure 6. Figure 9 is a cross-sectional perspective view showing the internal structure of a single active heat dissipation mechanism in the structure of Figure 8; Figure 10 is a rear side cross-sectional view showing the internal structure of the groove structure of Figures 4a and 5a; Figure 11 is a partial perspective view showing the configuration of an active heat dissipation mechanism according to an embodiment of the invention with respect to the press-in portion in the structure of Figures 4a and 5a; and Figure 12 is a perspective view showing the manufacturing process of an active heat dissipation mechanism according to an embodiment of the invention.

As shown in Figures 4a and 5a, the back of the heat dissipation shell body 110 implemented using the first configuration example may be provided with a groove structure 170 that is empty in the middle part between the left and right ends along the vertical division.

Here, on the back of the heat dissipation shell body 110 on the left and right sides of the groove structure 170, multiple pressing portions 150 can be provided in a manner that, according to an embodiment of the present invention, multiple active heat dissipation mechanisms 200 are arranged obliquely upward toward the left and right ends respectively. That is, the pressing portions 150 are respectively arranged in the upper left and upper right directions with the groove structure 170 as the center, and a pair of active heat dissipation mechanisms 200 fixed to the pressing portions 150 can be formed in a "V" shape, and multiple of them are arranged in a patterned manner in the vertical direction.

Furthermore, according to one embodiment of the present invention, multiple active heat dissipation mechanisms 200 can be provided, and all of them are formed into rectangular shapes of the same specifications that are longer in the same length direction, as shown in FIG4a. When active heat dissipation mechanisms 200 of the same specifications are installed on multiple press-in parts 150, one position of the inverted triangle shape on the upper part of the back of the heat dissipation shell body 110 and two positions of the right-angled triangle shape on the left and right sides of the lower part of the back of the heat dissipation shell body 110 can be left unoccupied by the active heat dissipation mechanism 200, and fixed heat dissipation fins 200F-1 and 200F-2 can be arranged there.

Here, as shown in FIG4a, the fixed heat dissipation fins 200F-1 and 200F-2 include: an upper fixed heat dissipation fin 200F-1, which is disposed on the upper side of the back side of the heat dissipation shell body 110 not occupied by the active heat dissipation mechanism 200 according to an embodiment of the present invention; and a lower fixed heat dissipation fin 200F-2, which is disposed on the lower left and right sides of the back side of the heat dissipation shell body 110 not occupied by the active heat dissipation mechanism 200 according to an embodiment of the present invention.

These fixed heat dissipation fins 200F-1 and 200F-2 can be configured as ordinary heat dissipation fins that do not contain refrigerant, unlike the active heat dissipation mechanisms 200 and 1200 according to the embodiments of the present invention, and can be manufactured using aluminum or aluminum alloy materials, which have excellent thermal conductivity among metal materials.

That is, to be stated in advance, unlike the active heat dissipation mechanism 200 of one embodiment of the present invention, the upper fixed heat dissipation fins 200F-1 and the lower fixed heat dissipation fins 200F-2 are configured to transfer heat without filling with refrigerant and based on the thermal conductivity of the metal material itself.

However, as shown in Figures 4a and 5a, the fixed heat dissipation fins 200F-1 and 200F-2 do not necessarily need to be separated at the top and bottom. As shown in Figures 4b and 5b of another embodiment of the active heat dissipation mechanism 1200 according to the present invention, the fixed heat dissipation fins 200F can also be provided only on the lower part of the active heat dissipation mechanism 1200 that is not occupied.

The area on the back of the heat dissipation shell body 110 implemented using the first embodiment, which is equipped with a groove structure 170 and an area (inverted triangle area) 130 where the upper fixed heat dissipation fin 200F-1 of the fixed heat dissipation fins 200F-1 and 200F-2 is provided, can be equipped with a heat transfer medium 135 formed in the form of a common steam chamber.

A predetermined refrigerant can be filled inside the heat transfer medium 135, which is equipped in the form of a vapor chamber. That is, the heat transfer medium 135 of the vapor chamber type can be embedded in the back of the heat dissipation shell body 110 so that the refrigerant can be filled.

At the same time, similar to the heat transfer medium 135 provided in the inverted triangle region 130, a predetermined refrigerant can also be filled in the region corresponding to the groove structure 170.

However, as shown in Figure 5a, the groove structure 170 is formed along the vertical direction (gravity direction) from the lower apex of the inverted triangular region 130 provided on the back of the heat dissipation shell body 110, and the liquid refrigerant filling the interior of the groove structure 170 needs to be uniformly dispersed and maintained in the vertical length direction.

To this end, inside the groove structure 170, the heat transferred from the heating element 140 or the heat dissipation shell body 110 can easily and uniformly vaporize the refrigerant over the entire vertical length. Furthermore, regardless of the vertical position, in order to maintain a uniform liquid refrigerant, the body absorber 350 can be further included.

The main absorber 350 can be one of the following: non-woven fabric itself or non-woven fabric bonded to the inside of a metal woven body, or a metal sintered body formed by sintering metal powder. In the case of fibrous materials such as non-woven fabrics absorbing liquids such as liquid refrigerants, it is difficult for them to maintain their shape in a relatively long vertical direction (the direction of gravity) due to the load of the liquid. Therefore, the shape can be maintained by the aforementioned copper wire woven body. Within the limits of maintaining the shape of the main absorbent 350, the nonwoven fabric can be incorporated into the interior of the copper wire weave, or it can be provided in a spiral pattern around the copper wire weave on the outer periphery of the nonwoven fabric.

However, the absorber 350 disposed in the main body of the groove structure 170 can be interpreted in terms of its function as the absorber 300 of the active heat dissipation mechanism 200, 1200 according to the present invention described later. In particular, it can be regarded as performing the same function in terms of enabling the liquid refrigerant filled in each of them to flow upwards more than the water surface of naturally formed liquid refrigerant.

Here, the heat transfer medium 135 and the groove structure 170 can be equipped independently without being connected to each other.

In particular, the liquid refrigerant inside the groove structure 170 filling the back of the heat dissipation shell 110 undergoes a phase change from liquid to gaseous in the evaporation zone located at the lower part of the groove structure 170, based on the temperature change of the heat transferred from the heating element 140, thereby performing partial heat dissipation.

Furthermore, in the inverted triangular region 130 of the upper fixed heat dissipation fin 200F-1, which is a condensation zone located at the top, partial heat dissipation can also be performed by causing a phase change from liquid to gaseous by the main body absorber 350.

In the groove structure 170 and the inverted triangular region 130, the vaporized gaseous refrigerant repeatedly performs a gas-liquid cycle that causes a phase change, resulting in liquefaction, through heat exchange with the outside air, thereby performing part of the heat dissipation function on the back of the heat dissipation shell body 110.

For reference, the refrigerant filling the refrigerant flow space inside the active heat dissipation mechanism 200 according to the present invention described later and the refrigerant filling the inverted triangular area 130 and the groove structure 170 are separate, so that the same specification of refrigerant can be filled, or different specifications of refrigerant can be filled according to the heat generation and installation position of the heating element 140.

Additionally, as shown in Figures 4a and 5a, the back side of the heat dissipation shell body 110 implemented using the first embodiment may include a pressing portion 150. In order to press in the active heat dissipation mechanism 200 according to an embodiment of the present invention, the pressing portion 150 may be provided in the form of a pair of grooves 150a, 150b (see Figure 32 described later).

As described above, in an embodiment of the present invention implemented using the first configuration implementation example, the active heat dissipation mechanism 200 is arranged with the groove structure 170 as the center, inclined upward toward the left and right ends. Multiple pressing portions 150 may also be provided, which can be arranged in a manner that forms a "V" shape with the groove structure 170 as the reference.

That is, as shown in Figures 4a, 5a and 6 to 11, the active heat dissipation mechanism 200 according to an embodiment of the present invention can be pressed into and coupled to a plurality of press-in portions 150 formed on the back side of the heat dissipation shell body 110 by a press-in insertion method.

At this point, although not shown, it is preferable that the insert 150 is pressed in after being treated with thermal epoxy resin to improve heat transfer efficiency.

Here, as shown in FIG10, the press-in portion 150 is recessed from front to rear to accommodate the heating surface of the heating element 140 on the inner side of the back side of the heat dissipation shell body 110, or it can be arranged to form at least one of the heating coupling surfaces 145 that protrude from rear to front toward the heating surface of the heating element 140.

Furthermore, as shown in FIG11, the press-in portion 150 can be formed at an angle, such that the refrigerant (especially liquid refrigerant) filled inside the active heat dissipation mechanism 200 according to an embodiment of the present invention is easily captured by gravity on the lower side in the direction of gravity, so that the rear end of the heat dissipation plate portion 203 described later is located on the upper side compared to the press-in end portion 201 described later.

More specifically, referring to the coordinate diagram of FIG11, as described above, the press-in portion 150 is formed with the groove structure 170 as a reference, tilting upwards on the left and right sides respectively, and can be formed on the back side of the heat dissipation shell body 110 at a predetermined angle (refer to arrow "a") with the coordinate Y, which is indicated along the horizontal direction, as a reference.

Furthermore, referring to the coordinate diagram of FIG11, the pressing portion 150 can be configured such that the rear end of the active heat dissipation mechanism 200 according to an embodiment of the present invention, which is pressed into the pressing portion 150, is inclined upward at a predetermined angle (refer to arrow "b") with reference to coordinate X.

Therefore, in the case where the refrigerant filling the refrigerant flow space of the active heat dissipation mechanism 200 according to an embodiment of the present invention is a liquid refrigerant (liquid phase refrigerant), the refrigerant flows naturally toward the injection end 201 located in the direction of gravity, and the gaseous refrigerant (gas phase refrigerant) can naturally diffuse and flow from the injection end 201 toward the heat dissipation plate portion 203.

However, as long as the condensed liquid refrigerant is provided in a manner that is uniformly guided to flow by the multiple second refrigerant flow paths 220 or multiple inclined guides 215 described later, as mentioned above, the press-in portion 150 does not need to be formed at a predetermined angle (refer to arrows "a" and "b" in FIG11) with the back side of the heat dissipation shell body 110 as a reference.

2-2 Second Setting Implementation Example

Referring to Figures 4b and 5b, an active heat dissipation mechanism 1200 according to another embodiment of the present invention can be arranged along a relatively long vertical line on the back side of the heat dissipation shell body 110 implemented using the second configuration embodiment.

Therefore, on the back side of the heat dissipation shell body 110 implemented using the second arrangement embodiment, the pressing portion 150 for being combined with the active heat dissipation mechanism 1200 according to another embodiment of the present invention is also arranged to be longer in the vertical straight direction, and each pressing portion 150 can be formed to be parallel to each other at a predetermined distance in the left and right direction.

Here, as shown in Figures 4a and 5a, the rear structure of the heat dissipation shell body 110 implemented using the first arrangement embodiment is based on the middle portion in the left-right width direction. In order to achieve the effect of uniformly dissipating the heat generated by the heat-generating elements 140, which are respectively concentrated on the left and right sides, upwards and to the left and right sides, the active heat dissipation mechanism 200 according to an embodiment of the present invention has multiple active heat dissipation mechanisms. The structure arranged in a "V" shape based on the groove structure 170 is different from the structure shown in Figures 4b and 5b. On the back side of the heat dissipation shell body 110 implemented using the second arrangement embodiment, an active heat dissipation mechanism 1200 according to another embodiment of the invention is arranged in a longer vertical direction, thereby designed to prevent the rising airflow of hot air generated by heat dissipation from being subjected to upward flow resistance.

For ease of explanation, the active heat dissipation mechanism 200 disposed on the back of the heat dissipation shell main body 110 implemented using the first embodiment is defined as "an active heat dissipation mechanism 200 according to an embodiment of the present invention", and the active heat dissipation mechanism 1200 disposed on the back of the heat dissipation shell main body 110 implemented using the second embodiment is defined as "an active heat dissipation mechanism 1200 according to another embodiment of the present invention" for explanation. However, each embodiment differs only in its shape and the shape of the device. Therefore, the devices can be used interchangeably regardless of the above-mentioned device implementations.

3 The first refrigerant flow path (overall flow path) and the second refrigerant flow path (liquid phase refrigerant guiding flow path)

Figure 12 is a perspective view showing the manufacturing process of an active heat dissipation mechanism according to an embodiment of the present invention. Figure 13 is a plan view showing the heat-conducting plate body before bending in the structure of the active heat dissipation mechanism according to an embodiment of the present invention shown in Figure 12. Figure 14 is an enlarged perspective view and an enlarged plan view showing the press-in end and its variant examples in the active heat dissipation mechanism according to an embodiment of the present invention. Figure 15 is a cross-sectional view showing the state in which the absorber is removed in the structures of Figure 14 (d) and (e).

Referring to Figures 12 to 15, according to an embodiment of the present invention, the active heat dissipation mechanism 200, as a single metal plate component, may include a heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) equipped with a refrigerant flow space filled with refrigerant through a bending process (S20) and a joining process (S40) (refer to Figure 33 described later).

That is, according to an embodiment of the present invention, the active heat dissipation mechanism 200, which is a single metal plate component, bends the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) with reference to a predetermined arbitrary reference line T in FIG10 as a reference (bending process (S20)) and then bonds it (bonding process (S40)), thereby forming a sealed refrigerant flow space 205 inside.

That is, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) as a single metal plate component can be formed in a predetermined manner to form a refrigerant flow space 205. In particular, according to an embodiment of the present invention, the active heat dissipation mechanism 200 can directly form at least the first refrigerant flow path 210 described later in the refrigerant flow space 205 by bending in a predetermined manner (including the bending process (S20) and the joining process (S40) described later) to fill the refrigerant and make the refrigerant flow.

Here, the refrigerant flow space 205 may include: a first refrigerant flow path 210, disposed at a position located relatively lower relative to the direction of gravity, to facilitate the capture (retention) or water storage of liquid refrigerant, and to form an evaporation region for the phase change of liquid refrigerant (liquid phase refrigerant) to gaseous refrigerant (gas phase refrigerant); and a second refrigerant flow path 220, disposed at a condensation region other than the first refrigerant flow path 210, and to guide the flow of liquid refrigerant that has undergone phase change from gaseous refrigerant (gas phase refrigerant) to the aforementioned evaporation region.

That is, as a part equipped with the first refrigerant flow path 210, when the part formed by the bending (bending process (S20)) is defined as the evaporation area of the liquid phase refrigerant in the refrigerant, and the remaining part outside the evaporation area is defined as the condensation area, the second refrigerant flow path 220 can be equipped in the condensation area.

In particular, the first refrigerant flow path 210, as a portion that is shaped by bending in the predetermined manner of a single metal plate component, is formed such that the heating element 140 or the press-in portion 150 equipped with the heating element 140 is spaced apart only according to the material thickness of the metal plate component, so that the liquid phase refrigerant in the refrigerant is filled.

In this case, the first refrigerant flow path 210, serving as the portion for storing and retaining the liquid refrigerant filling the refrigerant flow space 205, can be arranged vertically in the direction of gravity or inclined at least at the upper and lower ends relative to the direction of gravity. Therefore, the liquid refrigerant stored in the first refrigerant flow path 210 has its surface at least at the lower end of the inclined arrangement. This principle also applies to the active heat dissipation mechanism 1200 according to another embodiment of the invention described later.

More specifically, according to one embodiment of the present invention, the active heat dissipation mechanism 200 can be manufactured by bending (bending process (S20)) and joining (joining process (S40)) a single heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) along a predetermined arbitrary reference line T (see FIG12 for details) as described later, so as to form a sealed refrigerant flow space 205 inside.

Therefore, the first refrigerant flow path 210, as a part whose shape is deformed by the bending process (bending process (S20)), can be defined for the heating element 140 or the pressing part 150 equipped with the heating element 140 as a refrigerant filling and flow space where the refrigerant is filled with liquid phase refrigerant, with only the spacing distance between the metal plate components according to the material thickness.

Specifically, "separation distance based on material thickness" refers to the distance between the first refrigerant flow path 210 and the heating element 140 or the press-in portion 150 equipped with the heating element 140. However, the first refrigerant flow path 210 is not simply defined as a space that traps liquid refrigerant; it is more meaningful as an evaporation region at one end of the width direction from the heating element 140, which is the object of heat dissipation, to the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)).

Furthermore, the definition of the first refrigerant flow path 210 in the active heat dissipation mechanism 200 according to one embodiment of the present invention differs from the definition of the first refrigerant flow path 1210 in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, which will be described later. Here, the common technical configuration of the first refrigerant flow path 210 being directly inserted into the evaporation region or the pressing end 201 provided by the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) in a manner that supplies heat from the heating element 140, which is the object of heat dissipation, in the width direction is of great significance.

For example, the active heat dissipation mechanism according to the present invention is not necessarily limited to the manufacturing method of the bending manner of the above embodiment 200.

That is, as shown in Figures 4b and 5b and Figures 23 to 29 described later, an active heat dissipation mechanism 1200 according to another embodiment of the invention can also be manufactured by joining two separate metal plate components in a joint manner (joining process (S40)), forming a sealed refrigerant flow space 205 inside.

As described above, the first refrigerant flow path 1210 in the active heat dissipation mechanism 1200 according to another embodiment of the present invention is manufactured by a joining method, which differs from the active heat dissipation mechanism 1200 according to another embodiment of the present invention. This is because the position or arrangement characteristics based on the spacing distance according to the material thickness cannot be directly applied to the active heat dissipation mechanism 1200 according to another embodiment of the present invention. The specific features of the active heat dissipation mechanism 1200 according to another embodiment of the present invention will be described in more detail below.

In addition, the second refrigerant flow path 220 is formed in multiple locations in the condensation region other than the first refrigerant flow path 210. Its function is to allow the liquid phase refrigerant that has condensed from a gaseous state to a liquid state in the refrigerant to flow from the other end of the width direction of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) to the side of the first refrigerant flow path 210 by means of surface tension or gravity.

More specifically, if the gaseous refrigerant (gas phase refrigerant) condenses into liquid refrigerant (liquid phase refrigerant) through heat exchange with the external air in the condensation zone, the volume of the second refrigerant flow path 220 in its original position within the condensing refrigerant flow space 205 gradually increases. When flowing in the direction of gravity, it provides a flow path in a manner that flows toward the first refrigerant flow path 210 and supplies a uniform amount of liquid phase refrigerant.

In particular, as described below, the second refrigerant flow path 220 can be positioned among a plurality of inclined guides 215, so that when the liquid refrigerant condensed in the condensation region flows toward the first refrigerant flow path 210, the surface tension can be used to suppress the dispersed flow toward the second refrigerant flow path 220 which is adjacent to the second refrigerant flow path 220, which is a magnetofluidic path.

That is, since the flow space of the multiple inclined guides 215 is smaller than the flow space of the second refrigerant flow path 220, surface tension is applied to suppress the flow toward the adjacent side of the second refrigerant flow path 220.

As described above, by using multiple inclined guides 215 and the second refrigerant flow path 220 to suppress the dispersion flow of the condensed liquid refrigerant, the phenomenon of the liquid refrigerant falling directly downwards in the direction of gravity can be minimized. By connecting each lower end to the first refrigerant flow path 210 at uniform intervals, the liquid refrigerant condensed in the condensation area will not be biased, and it can be supplied to the first refrigerant flow path 210 side in a uniform amount.

Meanwhile, multiple second refrigerant flow paths 220 can be defined as multiple inclined guides 215 protruding from the inner side of the refrigerant flow space 205 facing each other from the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)).

Referring to FIG12(a), according to an embodiment of the present invention, the active heat dissipation mechanism 200 can form the first refrigerant flow path 210 and the second refrigerant flow path 220, as well as the plurality of inclined guides 215 described below, by a stamping process (S10) before the bending process (S20) described later. The heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) made of a single component using a predetermined thermally conductive material.

At this time, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) which is flat and unfolded before the bending process (S20) is formed into a rectangle whose width in the left and right direction is smaller than the length in the up and down direction in Figure 12. Any reference line T is arranged to run horizontally through the center of the left and right ends in the up and down direction, and can become the reference for the bending process (S20) described later (refer to (b) and (c) of Figure 12).

At this point, the central part of the left and right ends of the main body of the heat-conducting plate (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) is the middle part, which can be understood as the part that forms the boundary between one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2.

Referring to Figures 12(b) and (c), bending can be performed using bending fixtures (not shown) to bring the heat-conducting plate 200-1 on the left and the heat-conducting plate 200-2 on the right, which are based on an arbitrary reference line T, into contact with each other.

At this time, in addition to the first refrigerant flow path 210 and the second refrigerant flow path 220, a third refrigerant flow path 230 may be formed according to the embodiment, and the multiple strength reinforcements 240 required for the bonding process (S40) described later (refer to (d) of FIG12) may be formed in a manner in which they face each other and are in contact with each other.

Referring to Figure 12(d), if the heat-conducting plate 200-1 and the heat-conducting plate 200-2 of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) are in face contact with each other, they are joined together along their edge ends using a predetermined joining method. At the same time, each of the multiple strength reinforcement parts 240 that are in face contact with each other can be joined together using a predetermined joining method.

At this time, in order to facilitate the refrigerant filling process and the grouting process described later, one end and the other end of the first refrigerant flow path 210 formed by the bending process (S20) can connect the refrigerant flow space 205 with the outside, and the remaining part (heat dissipation plate part 203) can be sealed to completely block the refrigerant flow space 205 from the outside.

More specifically, as shown in Figure 12, according to an embodiment of the present invention, the active heat dissipation mechanism 200 uses an arbitrary reference line T, defined as a straight line in the vertical direction, as a reference. The heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) may include: one side heat-conducting plate 200-1, forming the left end before the bending process (S20); and the other side heat-conducting plate 200-2, forming the right end before the bending process (S20). Here, one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 can be understood as defining the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) before the bending process (S20).

However, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) can be redefined as the configuration after the bending process (S20) described later.

For example, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) as a part formed by the bending process (S20) and the joining process (S40) described later may include: a pressing end 201, which is pressed into and joined with the pressing portion 150, which is inclined to the left and right respectively with the groove structure 170 formed on the back side of the heat dissipation shell body 110 as the heat dissipation target; and a heat dissipation plate portion 203, which is a part defined by the edge end of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) other than the pressing end 201, to perform heat dissipation according to the phase change of the refrigerant and the heat exchange with the outside air (outdoor air).

However, the heat dissipation plate portion 203, as a portion other than the aforementioned press-in end 201, is preferably defined as all areas that perform heat dissipation after heat exchange between the refrigerant (especially vapor-phase refrigerant) filled inside and the external air (outdoor air). Heat exchange between the vapor-phase refrigerant inside the heat dissipation plate portion 203 and the external air refers to the vapor-phase refrigerant condensing and changing phase into liquid-phase refrigerant.

In addition, multiple strength-reinforcing portions 240 protruding from the inner surface of one side of the heat-conducting plate 200-1 and the inner surface of the other side of the heat-conducting plate 200-2, which are separated along the thickness direction, can be formed in the heat dissipation plate portion 203.

Meanwhile, as described below, multiple strength reinforcements 240 are formed simultaneously with the second refrigerant flow path 220, the third refrigerant flow path 230, and multiple inclined guides 215 through a stamping process (S10). After the bending process (S20) and the joining process (S40), when viewed from the outside, they can be understood as being formed by recessing from the outside of the heat dissipation plate portion 203.

If the first refrigerant flow path 210 is located on the lower side with the direction of gravity as the reference, and the refrigerant whose main phase change is liquid (liquid phase refrigerant) in the refrigerant flow space 205 flows downward along the direction of gravity, it can be defined as a flow path that, while capturing the liquid refrigerant on the same inclined guide 215, performs the function of uniformly moving and dispersing the liquid phase refrigerant in the entire evaporation region where it is converted into a gas phase by the heat transferred from the multiple heating elements 140 of the heat dissipation shell body 110. In this case, the uniform movement and dispersion of the liquid phase refrigerant in the function of the first refrigerant flow path 210 can refer to the concept of moving the liquid phase refrigerant at least in a direction different from the direction of gravity through the absorber 300 described later.

Furthermore, in the function of the first refrigerant flow path 210, the uniform movement and dispersion of the liquid refrigerant can be understood as the uniform supply and transfer of the liquid refrigerant through multiple second refrigerant flow paths 220 or multiple inclined guides 215 formed at an angle relative to the single first refrigerant flow path 210. This will be explained in more detail in the section on the absorber 300. The absorber 300, described later, is inserted and disposed inside the first refrigerant flow path 210, thereby promoting the capture and dispersion of the liquid refrigerant and its movement in a direction different from the direction of gravity.

Here, as shown in Figure 13, after the bending process (S20) described above, the first refrigerant flow path 210 can be formed symmetrically to each other along the thickness direction of the refrigerant flow space 205 with any reference line T as the reference. Therefore, the first refrigerant flow path 210 can be redefined as a flow path including the arbitrary reference line T that serves as the reference for the bending process (S20).

4 The first refrigerant flow path and the injection end, and the second refrigerant flow path and the heat dissipation plate section.

As described above, as shown in Figures 14 to 16, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) can be bent with one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 as a reference line T, and can form a first refrigerant flow path 210 inside, and form a press-in end 201 outside that is combined with the press-in portion 150 formed on the back side of the heat dissipation shell body 110 which is the object of heat dissipation.

Furthermore, as described above, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) may also include a heat dissipation plate portion 203, which is defined as the remaining portion other than the press-in end 201.

After the bending process (S20), the edges of the heat dissipation plate 203 on one side 200-1 and the heat dissipation plate 200-2 on the other side are joined together in a predetermined manner, thereby sealing the refrigerant flow space 205.

Here, the predetermined joining method can be either welding or jointing. Preferably, laser welding can be used in the welding method. However, laser welding is not required; any joining method is acceptable as long as it provides a seal sufficient to prevent leakage of the refrigerant inside.

Additionally, as shown in Figures 14 and 15, the end of the insert into the insert portion 150 in the insert end 201 can be bent in a manner including a circular cross section (refer to Figures 14(b) and (d), Figure 15(a)) or a planar cross section (refer to Figures 14(c) and (e), Figure 15(b)).

More specifically, as shown in Figures 14(b) and (d) and Figure 15(a), the press-in end 201 can be formed as a semi-circular arc-shaped cross section with a radius of R1, as shown in Figures 14(c) and (e) and Figure 15(b), and can be formed as an edge end with a rounded surface having a radius of R2 smaller than R1, and the remainder can be formed as a planar end.

In the case of the press-in end 201 implemented with an R1 value (refer to FIG. 15(a)), it has advantages in process since it can be formed by a single bending process (S20). Conversely, it has the disadvantage that the first refrigerant flow path 210 occupies a relatively small volume compared to the press-in portion 150. On the other hand, in the case of the press-in end 201 implemented with an R2 value (refer to FIG. 15(b)), it has disadvantages in process since it is formed by two bending processes (S20). However, it has the advantage that the first refrigerant flow path 210 occupies a relatively large volume compared to the press-in portion 150.

In this case, the outer side of the press-in end 201 can be inserted in a press-in manner after the press-in portion 150 formed on the back side of the heat dissipation shell body 110 is treated with thermal epoxy resin.

Furthermore, when the press-in end 201 is inserted into the press-in portion 150, at least a portion of the first refrigerant flow path 210 can flow into the inner front end of the press-in portion 150. The mounting structures of the active heat dissipation mechanism 200 according to one embodiment of the present invention and the active heat dissipation mechanism 1200 according to another embodiment of the present disclosure relative to the press-in portion 150 will be described in more detail below.

Additionally, as shown in Figures 12 to 15, the multiple second refrigerant flow paths 220 can serve the following functions: the refrigerant that undergoes a phase change to gaseous refrigerant (gas-phase refrigerant) and flows towards the heat dissipation plate portion 203 to exchange heat with the outside air, and then condenses back into liquid-phase refrigerant (liquid-phase refrigerant), naturally flows towards the first refrigerant flow path 210.

More specifically, as shown in Figures 12 to 15, the second refrigerant flow path 220 is provided in the condensation region formed outside the first refrigerant flow path 210, and can be defined as the space between multiple inclined guides 215 that guide the flow of liquid refrigerant that changes from the gas phase to the liquid phase to the evaporation region.

Here, as shown in Figure 13, the multiple inclined guides 215 of the second refrigerant flow path 220 are defined as being configured to protrude from the inner sides of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 toward the refrigerant flow space 205 after the bending process (S20) described later.

The multiple inclined guides 215 can be configured in a straight line that is inclined downwards in the direction of gravity toward the first refrigerant flow path 210. Therefore, the liquid refrigerant condensed on the heat dissipation plate portion 203 can naturally condense and flow toward the first refrigerant flow path 210 between the multiple downwardly inclined guides 215, thereby increasing the circulation speed of the liquid refrigerant.

Here, multiple second refrigerant flow paths 220 or multiple inclined guides 215 can arrange adjacent second refrigerant flow paths 220 or inclined guides 215 parallel to each other. The second refrigerant flow paths 220, which tightly and uniformly parallel the liquid refrigerant condensed in a wider condensation region that is larger than the evaporation region generally defined by the first refrigerant flow path 210, or the flow of the liquid refrigerant can be dispersed by the inclined guides 215, thereby providing the advantage of uniform heat dissipation performance throughout the condensation region.

Furthermore, multiple inclined guides 215 are respectively formed on one side of the heat-conducting plate 200-1 and the other side of the heat-conducting plate 200-2, and each front end protruding toward the refrigerant flow space 205 can be formed to be non-joined and separated from each other within the refrigerant flow space 205.

As described above, since the second refrigerant flow path 220 performs the function of guiding the flow of liquid refrigerant in the direction of gravity, preferably, the second refrigerant flow path 220 has a thickness direction that allows the flow to naturally form in the direction of gravity without stopping the flow due to surface tension, which is an inherent characteristic of liquids. Furthermore, the second refrigerant flow path 220 can be configured to suppress dispersed flow towards adjacent sides of the second refrigerant flow path 220 due to surface tension or gravity after the liquid refrigerant has condensed to a predetermined size or larger.

Meanwhile, at least one of one end and the other end of the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 is connected to the evaporation region or the first refrigerant flow path 210 formed in the evaporation region, and the end that is connected to the first refrigerant flow path 210 formed in the evaporation region (i.e., one of the ends) is located on the lower side of the gravity direction relative to the other end of the other end.

Therefore, when at least one of the plurality of second refrigerant flow paths 220 is defined as "one end", one end has the same meaning as "lower end" which is located on the lower side based on the direction of gravity. Conversely, when the other of the plurality of second refrigerant flow paths 220 is defined as "other end", the other end can have the same meaning as "upper end" which is located on the upper side based on the direction of gravity.

Furthermore, as described above, the plurality of second refrigerant flow paths 220 or the plurality of inclined guides 215 may be configured such that at least one of one end and the other end is connected to the first refrigerant flow path 210, and the one end and the other end are connected in a straight line.

Based on the straight shape of the multiple second refrigerant flow paths 220 as described above, the distance between one end of the first refrigerant flow path 210 that receives heat closest to the heating element 140 and the other end of the outermost end of the condensation region that actively condenses through heat exchange with the outside air is minimized. The straight shape of the second refrigerant flow path 220 itself is the optimal shape that can minimize the overlap length (flow resistance length) of the liquid phase refrigerant flow path and the gas phase refrigerant flow path.

For example, although not shown, the difference between the straight-shaped second refrigerant flow path 220 and the case where the second refrigerant flow path 220 is formed into a honeycomb structure only to ensure the heat dissipation area of the condensation area corresponding to the heat dissipation plate portion 203 will be briefly explained below.

That is, when the second refrigerant flow path 220 is formed into a honeycomb structure, when the liquid refrigerant receives heat in the evaporation region corresponding to the injection end 201 and changes phase to gaseous refrigerant, and then diffuses to the outer end side, the liquid refrigerant acts as a flow resistance to prevent the liquid refrigerant from flowing in a straight line to the other end of the heat dissipation plate portion 203 corresponding to the minimum distance, so it is difficult to expect active gas-liquid circulation.

In contrast, in the case of the active heat dissipation mechanism 200 according to an embodiment of the present invention, the difference lies in that the gas-liquid circulation from the first refrigerant flow path 210 (i.e., one end in the width direction) to the outer end (i.e., the other end in the width direction) which is the end of the condensation zone adopts a straight structure that can proceed smoothly without particular flow resistance and a gas-liquid flow separation structure described later.

That is, in an active heat dissipation mechanism 200 according to an embodiment of the present invention, unlike the honeycomb structure, in order to guide the liquid phase refrigerant after phase change in the gas phase refrigerant in the refrigerant flow space 205, multiple refrigerant flow paths are formed so that they do not branch from the other end in the width direction toward one end in the width direction of the first refrigerant flow path 210 located on the lower side in the gravity direction.

This confirms that it is a completely different heat dissipation mechanism from the honeycomb structure (honeycomb structure) of RBFHP equipped with the refrigerant flow path morphology in the "existing papers" already introduced in the "Background Art" section.

That is, in the RBFHP of the existing paper, the edges of two material sheets are joined by a roller joint. Even if the refrigerant is filled inside, in order for the liquid refrigerant to initially receive the heat actually transferred from the heat source, there is a concern that the thermal fluidity will decrease due to the thermal resistance of the material itself, corresponding to the length of the edge end as the joint part. After the liquid refrigerant receives heat and is converted into gaseous refrigerant, as the flow path to the outer end becomes longer due to the honeycomb structure, resistance is generated to the flow in the opposite direction to the condensed liquid refrigerant, making it difficult to expect active gas-liquid circulation.

Conversely, in the case of the active heat dissipation mechanism 200 according to an embodiment of the present invention, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) is spaced apart from the heating element 140 or the press-in portion 150 equipped with the heating element 140 by a thickness equivalent to that obtained by the bending process (S20) of a single metal plate component. A first refrigerant flow path 210 for supplying liquid refrigerant is provided. A straight structure and a gas-liquid flow separation structure are suitable for the smooth flow of gas-liquid circulation without particular flow resistance from the first refrigerant flow path 210 (i.e., one end in the width direction) to the outer end of the end portion that serves as the condensation zone (i.e., the other end in the width direction). This allows for the realization of completely different heat dissipation mechanisms.

That is, in order to guide the liquid phase flow of the refrigerant that has undergone phase change from the gas phase refrigerant in the refrigerant flow space, multiple second refrigerant flow paths 220 are formed so that they do not branch from the other end in the width direction toward one end in the width direction of the first refrigerant flow path 210 located on the lower side in the gravity direction.

In addition, as described above, the multiple tilting guides 215 not only define the second refrigerant flow path 220 between each tilting guide 215 as a flow path that guides the flow of liquid refrigerant in the direction of gravity, but can also perform the function of defining the third refrigerant flow path 230, which corresponds to the spaced portion in the thickness direction, as described later.

In this case, when the multiple tilting guides 215 are positioned relative to the lower part of the direction of gravity due to the tilting adjustment of the entire heat dissipation shell body 110, it is preferable to form a pattern in a tilted manner relative to the first refrigerant flow path 210 to form a flow path for the liquid refrigerant (liquid phase refrigerant) to flow.

Here, the second refrigerant flow path 220, defined as the adjacent gap space of multiple inclined guides 215, can be a refrigerant flow path that extends obliquely upward from the first refrigerant flow path 210 corresponding to the arbitrary reference line T towards the ends of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)). This is to allow the liquid phase refrigerant liquefied on the heat dissipation plate portion 203 to easily move towards the first refrigerant flow path 210 having the absorber 300 due to its own weight.

5 Third refrigerant flow path

Figures 16 and 17 are perspective views and enlarged views of an active heat dissipation mechanism according to an embodiment of the present invention before and after bending. Figure 18 is a plan view of an active heat dissipation mechanism according to an embodiment of the present invention after bending. Figure 19 is a cross-sectional view taken along line C-C of Figure 18.

Referring to Figures 16 to 19, the active heat dissipation mechanism 200 according to an embodiment of the present invention may further include a third refrigerant flow path 230.

Here, after the bending process (S20) and joining process (S40) are completed, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) is based on an arbitrary reference line T, a portion of one surface of one side heat-conducting plate 200-1 and a portion of one surface of the other side heat-conducting plate 200-2 are joined together to form a refrigerant flow space 205. The refrigerant flow space 205 can form a first refrigerant flow path 210 and a second refrigerant flow path 220 together with the joining process (S40), as well as a third refrigerant flow path 230 added according to the embodiment.

Referring to the cross-sectional view along line E-E in Figure 17, the second refrigerant flow path 220 is formed on one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2, respectively, and is the opposite of the multiple adjacent inclined guides 215 defined as formed between each other in the thickness direction of the refrigerant flow space 205. The third refrigerant flow path 230 in the thickness direction of the refrigerant flow space 205 can be defined as the space between the inclined guides 215 formed on one side heat-conducting plate 200-1 and the inclined guides 215 formed on the other side heat-conducting plate 200-2. However, it should be noted that when defining the second refrigerant flow path 220, excluding the thickness direction means that the defined reference direction is not the thickness direction, and should not be interpreted as excluding the volume occupied by the thickness direction as the corresponding volume and space.

More specifically, when the inclined guide 215 of the third refrigerant flow path 230 protrudes further into the refrigerant flow space 205 than the second refrigerant flow path 220, the thickness and length of the refrigerant flow space 205 can be set to be a region smaller than that of the second refrigerant flow path 220. That is, the third refrigerant flow path 230 can be defined by multiple inclined guides 215 as a region with a thickness smaller than that of the second refrigerant flow path 220.

Meanwhile, the third refrigerant flow path 230 is a part in which multiple inclined guides 215 are formed on the facing surfaces of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 in the main body of the heat-conducting plate (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)). It can be defined as a part that is not joined and is separated from each other in the refrigerant flow space 205.

The third refrigerant flow path 230 serves to provide a gas flow path, allowing the refrigerant filling the refrigerant flow space 205 to easily diffuse and flow throughout the heat sink portion 203 after it undergoes a phase change to gaseous refrigerant in the evaporation region of the first refrigerant flow path 210. The gaseous refrigerant evaporated in the first refrigerant flow path 210, which serves as the evaporation region, moves towards the heat sink portion 203 and is smoothly and uniformly dispersed through the third refrigerant flow path 230, thereby performing heat dissipation and condensation.

For example, while the liquid refrigerant flows naturally through the space between the inclined guide 215 adjacent to the second refrigerant flow path 220, the gaseous refrigerant flows actively through the third refrigerant flow path 230, which serves as a space not occupied by the liquid refrigerant.

However, this does not mean that the liquid refrigerant is completely separated from the gaseous refrigerant through the third refrigerant flow path 230 and is not occupied. Preferably, it should be understood that the gaseous refrigerant flows more actively through the third refrigerant flow path 230.

That is, the phase change of the refrigerant is not formed by the complete separation of the liquid phase refrigerant and the gas phase refrigerant, so it is difficult to distinguish and define it accurately. However, in general, the second refrigerant flow path 220 is relatively large in the thickness direction, thus becoming the main flow path of the liquid phase refrigerant, and the third refrigerant flow path 230 can be the main flow path of the gas phase refrigerant.

More specifically, since gaseous refrigerants have greater mobility than liquid refrigerants, the third refrigerant flow path 230, which has a relatively small size in the thickness direction, can be the main flow path. Considering the surface tension of the liquid refrigerant itself, the second refrigerant flow path 220, which has a larger size in the thickness direction than the third refrigerant flow path 230, can be the main flow path of the liquid refrigerant.

Alternatively, the third refrigerant flow path 230 can also be defined as a refrigerant flow path that connects the space between the second refrigerant flow paths 220 that are spaced apart in parallel.

For example, the second refrigerant flow path 220 can process one side and the other side of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) through a stamping process (S10) before bending, using any reference line T of the middle part of the first refrigerant flow path 210 as a reference, so that one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 are processed to protrude to form a refrigerant flow space, but after bending, a third refrigerant flow path 230 is formed, so that it can form a certain pattern shape, and thus be divided by the third refrigerant flow path 230. Of course, it should be noted that the “division” here does not refer to a complete physical and spatial division, but rather to the shape and position that distinguishes the second refrigerant flow path 220 and the third refrigerant flow path 230.

Additionally, as shown in Figure 16, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) can be bent at both ends in the width direction, with one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 as a reference line T, and then joined together in face-to-face contact.

At this time, as described above, the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230 are symmetrically formed on one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 with an arbitrary reference line T as the center, and each of them has an internal size in the thickness direction that is twice as deep as the recess depth formed on one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 by the stamping process (S10) described later.

More specifically, as shown in Figure 19, the first refrigerant flow path 210 is a portion formed by the bending process (S20) described later. It is a portion where the pressed end 201 is formed by the pressing part 150 of the heat dissipation shell body 110 directly contacting the heating surface of the plurality of heating elements 140. The size of the outer side of the portion forming the pressed end 201 can be approximately larger than or equal to the thickness 220L of the second refrigerant flow path 220.

Meanwhile, as shown in Figure 19, the maximum dimension 220L of the second refrigerant flow path 220 in the thickness direction can be greater than the maximum dimension 230L of the third refrigerant flow path 230 in the thickness direction.

This is because, during the stamping process (S10) performed before the bending process (S20) of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)), the second refrigerant flow path 220 is not pressed; only the edge end of the heat dissipation plate portion 203, the multiple inclined guides 215, the third refrigerant flow path 230, and the multiple strength reinforcing portions 240 described later are pressed into shape.

6 Multiple reinforcement sections

Additionally, as shown in Figures 16 to 19, an active heat dissipation mechanism 200 of an embodiment of the present invention may further include: a plurality of strength reinforcing parts 240 formed on at least one of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2, and formed in a manner that protrudes a predetermined length from the inner surface of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 toward the refrigerant flow space 205 and is formed in a manner that faces each other.

More specifically, when the refrigerant flow space 205 is formed by bending and joining a single metal plate component, the heat-conducting plate 200-1 on one side before bending forms the edge end in the width and length directions on one side with an arbitrary reference line T as the reference, and the heat-conducting plate 200-2 on the other side before bending forms the edge end in the width and length directions on the other side with an arbitrary reference line T as the reference.

Similarly, in the case of forming a refrigerant flow space 205 by joining two metal plate components, before joining, one side of the heat-conducting plate 200-1 forms an edge in the width and length directions on one side with reference to the edge end of the first refrigerant flow path 210, and before joining, the other side of the heat-conducting plate 200-2 can form an edge in the width and length directions on the other side with reference to the edge end of the first refrigerant flow path 210.

Here, the multiple reinforcement portions 240 are portions other than the aforementioned arbitrary reference line T or the evaporation region forming the first refrigerant flow path 210, and can be formed on at least one of the heat-conducting plates 200-1 on one side and the heat-conducting plate 200-2 on the other side constituting the condensation region.

Multiple strength reinforcements 240 are typically formed on at least one of the planar heat-conducting plates 200-1 on one side and 200-2 on the other side, which can enhance the strength to prevent sagging or pressing caused by internal pressure (internal pressure) due to external pressure or phase change of refrigerant.

Here, the front faces of the multiple strength reinforcements 240 are formed more prominently than the front faces of the multiple inclined guides 215, at least after bending, toward the refrigerant flow space 205 in the thickness direction corresponding to the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)).

At this time, the amount by which the front ends of the multiple strength reinforcements 240 protrude toward the refrigerant flow space 205 is preferably such that, at least in the joining process (S40) after the bending process (S20) described later, the opposing parts of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 protrude to the extent that they can be joined together by a predetermined joining method.

However, the multiple strength reinforcements 240 do not necessarily have to be in face-to-face contact with each other after bending; they can also be separated from each other in the refrigerant flow space 205 as shown by the inclined guide 215 described above.

However, when the multiple strength reinforcing portions 240 are configured to be joined together by welding or other means in the joining process (S40) described later, preferably, the multiple strength reinforcing portions 240 are formed protrudingly on the refrigerant flow space 205 in a manner of face-to-face contact with each other. This is because forming multiple strength reinforcing portions 240 alone has the function of reinforcing the strength of one side heat-conducting plate 200-1 and the other side heat-conducting plate 1200-2.

In this case, the multiple strength reinforcements 240 can be sheet metal processed during the stamping process (S10) to make them smaller than the minimum thickness within the refrigerant flow space 205 formed by at least a multiple second refrigerant flow paths 220.

Here, referring to FIG17, the minimum thickness within the refrigerant flow space 205 formed by the second refrigerant flow path 220 is defined as the space between two adjacent inclined guides 215, excluding the thickness direction. The thickness direction magnitude of the third refrigerant flow path 230 can be interpreted as having the same meaning as the thickness direction magnitude of the third refrigerant flow path 230.

As described above, in the active heat dissipation mechanism 200 according to the embodiment of the present invention, the multiple strength reinforcements 240 are processed to be at least less than the thickness of the third refrigerant flow path 230 (or the minimum thickness of the second refrigerant flow path 220), thereby achieving the effect of refrigerant condensation in a shorter time by further increasing the contact surface area with the gaseous refrigerant flowing freely through the third refrigerant flow path 230.

Furthermore, as shown in Figure 13, multiple strength reinforcements 240 are symmetrically formed on one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 with an arbitrary reference line T as the reference, and can be formed only on multiple inclined guide members 215.

Here, multiple inclined guides 215 are also processed into a planar shape with one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 through a stamping process (S10), thereby performing the function of first strengthening. Multiple strength-reinforcing parts 240 are then processed on the multiple inclined guides 215 that have undergone the first processing, thereby performing the function of second strengthening.

However, according to embodiments, such as another embodiment described later (refer to 200T-1 in FIG. 22a and 200T-2 in FIG. 22b described later), it can also be formed in a location other than the tilting guide 215 (i.e., a location unrelated to the tilting guide 215). This will be explained in more detail below in the description of the corresponding embodiments.

Here, multiple reinforcement sections 240 are formed on the opposing surfaces of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)). Their front ends can be arranged facing each other within the refrigerant flow space 205 or the first refrigerant flow path 210 to the third refrigerant flow path 230. Furthermore, the opposing and contact surfaces of the multiple reinforcement sections 240 arranged facing each other can be joined by laser welding.

In particular, preferably, multiple strength-reinforcing portions 240 are formed on the third refrigerant flow path 230, which mainly serves as the flow path for the gaseous refrigerant, to increase the condensation surface area where the gaseous refrigerant, which has undergone phase change to gaseous state, comes into contact and condenses during the flow process. However, as described above, the third refrigerant flow path 230 can be defined as the space between the thickness directions of the multiple inclined guides 215, and therefore, within this limitation, it can be the same concept as the concept defined as multiple strength-reinforcing portions 240 formed on multiple inclined guides 215.

Here, the multiple strength reinforcing parts 240 can be formed in any shape as long as they are shapes that strengthen the heat conduction plate 200-1 on one side and the heat conduction plate 200-2 on the other side. However, as shown in Figures 16 and 17, they can include dot reinforcing parts 242 with a circular cross-section and line reinforcing parts 241 with a semi-circular cross-section at the end in the length direction and a straight line length in the length direction.

More specifically, multiple line reinforcements 241 are formed along the width direction of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) and are formed on multiple inclined guides 215. When one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 are bent and joined, they can be arranged facing each other respectively.

Similarly, multiple point reinforcements 242 are formed between each of multiple line reinforcements 241 and on multiple inclined guides 215, and can be arranged opposite each other when one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 are bent and joined.

Here, multiple line reinforcements 241 and multiple point reinforcements 242 can be alternately arranged on a tilting guide 215.

However, the multiple strength reinforcements 240 do not necessarily need to be formed as multiple line reinforcements 241 and multiple point reinforcements 242, as shown in FIG22a described later. Of course, they can be arranged in an elliptical shape similar to the point reinforcements 242 at uniform intervals relative to the entire heat dissipation plate portion 203.

7 Absorbent

Figures 20 and 21 are perspective views illustrating an example of an absorber in the structure of an active heat dissipation mechanism according to an embodiment of the present invention.

As shown in Figures 11, 14, 20, and 21, an active heat dissipation mechanism 200 according to an embodiment of the present invention may further include: an absorber 300 that absorbs the liquid phase refrigerant in the state of the refrigerant guided by the second refrigerant flow path 220, and uniformly disperses it in the first refrigerant flow path 210 which is arranged relative to or inclined relative to the direction of gravity.

More specifically, the absorber 300 is located near the pressing portion 150 on the back side of the heat dissipation shell body 110, which is the object of heat dissipation, and is disposed in the first refrigerant flow path 210, which forms an evaporation region that causes the refrigerant to change from liquid to gas phase. By means of capillary force or absorption force, it can perform the function of causing the liquid phase refrigerant in the refrigerant to rise at least upwards above its absorption point.

For this purpose, the absorber 300 may include: a plurality of pores (not shown element symbols) that absorb and retain liquid refrigerant and disperse the liquid refrigerant in the direction of gravity or at least in the direction opposite to the direction of gravity (i.e., the downward direction).

As described above, the absorber 300 can maintain the absorption rate of liquid refrigerant according to the multiple pores, while preventing shape deformation caused by sag in the direction of gravity through the support structure (e.g., skeleton retainer 320) described later.

Here, the absorber 300, as a sintered metal body made by sintering metal powder, is a concept that includes a liquid-absorbing core component having a liquid-absorbing core structure provided inside a conventional vapor chamber. However, it is not limited to this. The concept may include all of these materials or structures that capture and transfer liquid-phase refrigerant on the entire upper and lower sides of the first refrigerant flow path 210, which is arranged at an angle relative to the direction of gravity, thereby overcoming the limitations of the heat conduction material of conventional heat dissipation fins and maximizing heat dissipation performance.

In addition, in the absorber 300, the closer to the press-in end 201, the easier it is for the heat transferred through the heating element 140 to make the phase change of the liquid refrigerant to the gaseous refrigerant more active. Preferably, it is installed as close as possible to the press-in end 201, which has a relatively narrow width in the width direction in the refrigerant flow space 205.

However, the absorber 300 does not necessarily have to be installed only close to the side of the press-in end 201. It can also be installed in a way that it is evenly distributed throughout the entire heat dissipation plate portion 203, which is equivalent to the evaporation area where the refrigerant can evaporate, except for the press-in end 201.

However, in the case of the active heat dissipation mechanism 200 according to an embodiment of the present invention, after bending the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) equipped with a single component, the portions corresponding to the edge ends of the heat dissipation plate portion 203 are joined together, and an absorber 300 is provided in the opening portion at both ends of the first refrigerant flow path 210. For manufacturing reasons, the evaporation area of the refrigerant can be limited to the first refrigerant flow path 210.

Here, the absorber 300 may include one of the following: a nonwoven fabric forming multiple pores (a liquid-absorbing core structure); a nonwoven fabric supported by metal threads or a metal braid; and a sintered metal body formed by sintering metal powder. Similar to the main absorber 350, the metal material may include copper, which has excellent thermal conductivity, and the nonwoven fabric may be supported by thin copper wires or a copper wire braid weaving the copper wires.

That is, the absorber 300 can be made of non-woven fabric made of fibrous material. In this case, the non-woven fabric itself is a very soft material, and when the liquid refrigerant is absorbed, it may be difficult to maintain a vertical shape due to the weight of the absorbed liquid refrigerant. Therefore, the non-woven fabric can be supported by copper wire or a braid made of copper wire woven from copper wire.

Here, the nonwoven fabric is formed and maintained in shape by being inserted into the braided body of copper wire material, so that it can be stably fixed and not flow in the first refrigerant flow path 210 which is inclined relative to the direction of gravity (i.e., the up and down direction) or in the direction of gravity.

However, it is not necessary to support the nonwoven fabric in a way that inserts it into the braided body of copper wire. Alternatively, a single strand of copper wire can be used to run through the nonwoven fabric vertically or to spiral around the nonwoven fabric.

Here, the absorber 300 can maintain its shape even under the load of the retained liquid refrigerant. The nonwoven fabric can be combined with the inside of the copper wire material weave, or it can be provided in a spiral shape around the copper wire itself or the copper wire material weave on the outer periphery of the nonwoven fabric.

More specifically, as shown in Figures 20 and 21, the absorber 300 includes: an absorber body 310 having a predetermined absorption rate for the liquid refrigerant and being deformed by an external force including a predetermined gravity; and a skeleton retainer 320 connected to the absorber body 310 to prevent the absorber body 310 from being deformed by the external force.

Here, the absorbent core 310 can be made of one of the following: non-woven fabric, cotton, or sponge, which forms the aforementioned multiple pores (a liquid-absorbing core structure). Due to the properties of the material, the absorbent core 310 made of non-woven fabric, cotton, or sponge can be arranged in a relatively long manner along the vertical direction of gravity. However, if liquid is contained in the multiple pores, its shape may be deformed due to the weight of the liquid, such as drooping in the direction of gravity.

As described above, if the absorber body 310 droops due to the presence of liquid, thereby changing the uppermost position on the first refrigerant flow path 210 to the lower part, it may lead to a problem where the evaporation area is reduced to the extent of the change.

The skeleton retaining part 320 serves to prevent shape deformation such as sagging of the absorber body 310 as described above. For this purpose, the skeleton retaining part 320 can be made in the form of a tube that forms the hollow part (not shown element symbol) located inside the absorber body 310.

Preferably, since the frame retainer 320 also has a structure that transfers heat from the external heating element 140 to the absorption body 310, the frame retainer 320 is preferably made of a metal material with a predetermined thermal conductivity or higher. For example, the metal material constituting the frame retainer 320 can be copper.

Furthermore, as shown in FIG20, the skeleton retaining part 320 is woven into a tube shape using metal wires of metal material (refer to component symbol "321"), or as shown in FIG21, it can be wrapped in a spiral shape around the outer peripheral surface of the absorbing body part 310 using a single metal wire (refer to component symbol "322").

More specifically, referring to Figure 20, the skeleton retaining part 321 is made of metal (copper) wire braided into a tube shape, so that the liquid refrigerant that is guided to flow to the first refrigerant flow path 210 through multiple second refrigerant flow paths 220 can penetrate into the internal absorption body part 310.

At this time, the skeleton holding part 321 of the woven body in the form of a tube can be woven into gaps that allow at least the liquid refrigerant in the refrigerant to be transferred from the outside to the inside of the absorber body part 310 by surface tension. In this case, the gaseous refrigerant that undergoes a phase change from the liquid refrigerant through the absorber body part 310 can be easily dispersed to the outside through the woven gaps.

Furthermore, referring to FIG21, the skeleton retaining part 322 may be equipped so that a single metal (copper) plate (or wire) is spirally wrapped around the outer side of the absorbing body part 310.

Here, preferably, the metal plate (or metal wire) has a shape-holding force that prevents it from sagging downwards due to gravity, even when the absorber body 310 contains sufficient liquid refrigerant.

Additionally, as shown in FIG20, the skeleton holding portion 321 of the absorber 300 can be formed into a cylindrical shape, and the absorber body portion 310 can be formed into a cylindrical shape so that it can be inserted into the cylindrical skeleton holding portion 321.

As described above, in an active heat dissipation mechanism 200 according to an embodiment of the present invention, the absorber 300 is formed by manufacturing separately and combining the absorber body 310 and the skeleton retainer 320. However, it is not necessary to add the skeleton retainer 320. Even if the shape retaining force of the absorber body 310 itself does not cause any sagging shape deformation in the case of liquid refrigerant, it is sufficient to have the absorber body 310 itself.

According to the above embodiment, the absorber 300 includes an absorbent body 310 formed of a material selected from non-woven fabric, cotton, and sponge, and a skeleton holding part 320 formed or wound in a spiral shape by a woven body made of metal (copper) wire in a tubular shape. This prevents downward sagging regardless of the amount of liquid refrigerant contained in the absorbent body 310, thereby enabling a uniform amount of liquid refrigerant to undergo phase change in the first refrigerant flow path 210.

Furthermore, as shown in Figure 14, the active heat dissipation mechanism 200 of one embodiment of the present invention may also include a plurality of absorber fixing guides 250.

Multiple absorber fixing guides 250 serve to stably fix the absorber 300, which is arranged relatively long along the direction of gravity (i.e., the vertical direction), within the refrigerant flow space 205 (especially the first refrigerant flow path 210). In particular, when the absorber 300 is made only of non-woven fabric and is not supported by a woven body of metal material such as the skeleton retainer 320, the multiple absorber fixing guides 250 serve to prevent it from sagging downwards in the direction of gravity when absorbing liquid refrigerant.

During the stamping process (S10), these multiple absorber fixing guides 250 can be formed together with the first refrigerant flow path 210 to the third refrigerant flow path 230 and multiple inclined guides 215 or multiple strength reinforcing parts 240.

More specifically, if a non-woven absorber 300 is used to absorb the liquid refrigerant, there is a concern that the multiple absorber fixing guides 250 may sag in the direction of gravity. To prevent this, a protrusion is formed on the side of the refrigerant flow space 205. When the edge ends of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 are joined together by a joining process (S40), the absorber 300 can be pressed and the absorber 300 can be stably fixed.

Here, with the non-woven fabric located inside and supported by the metal woven body, the absorbent 300 can of course be supported by the structure of multiple absorbent fixing guides 250 on the outer surface of the woven body.

Furthermore, the multiple absorber fixing guides 250 press against the outer surface of the absorber 300 or woven fabric, which is easily deformed by external force, and can simultaneously perform the function of ensuring a predetermined space for the flow of gaseous refrigerant (vapor phase refrigerant) evaporating in the first refrigerant flow path 210.

As described above, an absorber 300 is installed inside the first refrigerant flow path 210. The liquid refrigerant that condenses and liquefies from the heat dissipation plate 203 side is moved towards the part near the heating element 140 by the absorption force (or capillary force) of the absorber 300 and is retained. After it changes phase into gaseous refrigerant by the heat transferred from the heating element 140, the gaseous refrigerant can diffuse and flow again to the entire heat dissipation plate 203 by the principle of gas diffusion.

The vapor refrigerant that moves to the heat dissipation plate 203 side is smoothly and evenly distributed throughout the heat dissipation plate 203 through the third refrigerant flow path 230. It is condensed while performing heat dissipation through heat exchange with the outside air. The condensed liquid refrigerant can then easily move along the second refrigerant flow path 220, whose size is larger than that of the multiple inclined guides 215 in the thickness direction, towards the gravity direction, i.e., the first refrigerant flow path 210 side.

The heat generated from the heating element 140 is preferentially transferred to the first refrigerant flow path 210 side where the absorber 300 is provided. Most of the refrigerant stored in the first refrigerant flow path 210 side with the absorber 300 is in a liquid state inside the absorber 300. After changing to a gaseous state by the heat transferred from the heating element 140, it preferably flows through the third refrigerant flow path 230 to the heat dissipation plate portion 203 of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) and performs heat dissipation.

Hereinafter, one cycle of the refrigerant is defined as one circulation. In this one-cycle phenomenon, the liquid refrigerant changes phase to gaseous refrigerant at the injection end 201, then diffuses and flows to the heat dissipation plate 203. Then, the gaseous refrigerant changes phase to liquid refrigerant at the heat dissipation plate 203, then returns and flows to the injection end 201. The time required to form one cycle is defined as the "cycle time of the gas-liquid cycle" for explanation.

Hereinafter, the phenomenon of the liquid refrigerant phase on the side of the injection end 201 changing into the gaseous refrigerant and then diffusing to the heat dissipation plate 203 side, and then changing back into the liquid refrigerant phase on the side of the heat dissipation plate 203 and returning to the refrigerant on the side of the injection end 201 is defined as 1 cycle, and the time required to realize 1 cycle is defined as "the cycle time of the gas-liquid cycle".

The active heat dissipation mechanism 200 of one embodiment of the present invention described above, as well as the various modifications (200T-1, 200T-2, 200T-3, 200T-4, 200T-5) described below, and the active heat dissipation mechanism 1200 of another embodiment of the present invention, including the first refrigerant flow path 210, 1210, the second refrigerant flow path 220, 1220, and the third refrigerant flow path 230, and the various inclined guides 215, 1215 and the various strength reinforcements 240, 1240, are understood to be designed with the ultimate goal of maximizing heat dissipation performance by minimizing the circulation time of the aforementioned gas-liquid circulation in the active heat dissipation mechanism 200 of one embodiment of the present invention described above.

8 First to fourth variations

Figures 22a to 22d are unfolded views of the heat-conducting plate body of the first variant (200T-1) to the fourth variant (200T-4) of a partial structure according to an embodiment of the present invention before bending.

The differences of an embodiment 200 of the present invention will be explained below with reference to the first variant (200T-1) to the fourth variant (200T-4) shown in Figures 22a to 22d.

That is, as shown in FIG22a, in the first variation (200T-1) of the present invention, as shown in the above embodiment 200, the multiple strength reinforcements 240 may be provided only to the multiple inclined guides 215 that divide the second refrigerant flow path 220, and unlike the above embodiment 200, a portion 240' of the multiple strength reinforcements may be designed to be provided on the outer part that is unrelated to the second refrigerant flow path 220 or the third refrigerant flow path 230 and the multiple inclined guides 215.

Furthermore, referring to FIG22b, a comparison is made between the active heat dissipation mechanism 200T-2 of the second variation of the present invention and the active heat dissipation mechanism 200 of an embodiment of the present invention with reference to FIGS. 9 to 21, and the following differences can be observed.

That is, as shown in FIG22b, in the second variant of the present invention, the active heat dissipation mechanism 200T-2 has only a plurality of inclined guides 215 formed on one side of the heat conduction plate 200-1 and the other side of the heat conduction plate 200-2, and the other side of the heat conduction plate 200-1 and the other side of the heat conduction plate 200-2 may only have a plurality of strength reinforcing parts 240 in the form of point reinforcing parts 242.

In this case, according to the second variant, after the bending process (S20), the front end faces of multiple joints and the front end faces of multiple inclined guides 215 of the active heat dissipation mechanism 200T-2 can be arranged in a manner that is almost in contact with each other or in surface contact.

More specifically, in the active heat dissipation mechanism 200T-2 according to the second variation, one of the heat-conducting plates 200-1 on the left and right sides of the first refrigerant flow path 210, which performs the function of a total refrigerant flow path, is (200-2) inclined at the ends of the plurality of second refrigerant flow paths 220 defined between the plurality of inclined guides 215 described above, in the corresponding width direction. In the other (200-1), a plurality of point reinforcements 242 may be provided, such that the end faces of the plurality of inclined guides 215 forming the plurality of second refrigerant flow paths 220 after the bending process (S20) described later are opposite to each other.

In this case, the heat-conducting plate 200-2 on the other side does not need to be equipped with a separate reinforcement 240, and it can be understood that the multiple inclined guides 215 equipped with the second refrigerant flow path 220 can also perform the function of the reinforcement 240.

That is, in the case of one embodiment 200 of the present invention as described above, the multiple strength reinforcements 240 do not distinguish between the left side heat conduction plate 200-1 corresponding to the heat conduction plate main body (one side heat conduction plate (200-1) and the right side heat conduction plate 200-2), but instead consist of multiple line reinforcements 241 and multiple point reinforcements 24. The second variation of the present invention, the active heat dissipation mechanism 200T-2, as shown in FIG22b, is equipped with different strength-enhancing elements in the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)).

In this case, the surface of the heat-conducting plate 200-2 on the other side, which is equipped with multiple inclined guides 215, is located in the lower part in the direction of gravity. This is conducive to the smooth flow of liquid refrigerant. Preferably, when it is installed on the heat dissipation shell body 110, the surface of the heat-conducting plate 200-1 on the other side, which is located on the lower side relative to the direction of gravity, is conducive to the smooth flow of gaseous refrigerant. When it is installed on the heat dissipation shell body 110, it is preferably located on the upper side relative to the direction of gravity.

Furthermore, referring to Figures 22c and 22d, according to the third variation 200T-3 and the fourth variation 200T-4, after performing a bending process (S20) on one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 without distinguishing the heat-conducting plate main body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)), multiple point reinforcements 242 can be formed as multiple strength reinforcements 240 for welding together with each other.

In this case, the multiple point reinforcement 242 can be formed with the first refrigerant flow path 210 as in the active heat dissipation mechanism 200 of an embodiment of the present invention, or it can be formed with a circular horizontal cross section as shown in the third variation 200T-3, or it can be formed with a hexagonal horizontal cross section as shown in the fourth variation 200T-4.

In particular, compared with the active heat dissipation mechanism 200 of one embodiment of the present invention, the third variation 200T-3 and the fourth variation 200T-4 are designs that include only the third refrigerant flow path 230 and do not include the inclined second refrigerant flow path 220, thereby having the advantage of making the liquid phase refrigerant and the gas phase refrigerant flow uniformly and easily throughout the entire range.

Here, the multiple reinforcing parts 242 are joined together by welding (see the joining process (S40) described later) as above, which provides the advantage of increasing the rigidity of the entire heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) after the bending process (S20).

However, as described above, the active heat dissipation mechanism 200 and its variations (200T-1, 200T-2, 200T-3, 200T-4) according to an embodiment of the present invention have a core structure in which a refrigerant is filled and the heat dissipation performance is improved by the phase change of the refrigerant. The internal structure design of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) also needs to be optimally adapted to its placement position or gravity and the phase change of the refrigerant.

9 Fifth and Sixth Variations

Figure 23 is an unfolded view of the heat-conducting plate body of the fifth variant (200T-5) which is adapted to the various variants of Figures 22a to 22d. Figure 24 is an unfolded view of the heat-conducting plate body of the sixth variant.

Referring to Figure 23, the pressing portion 150 formed on the back of the heat dissipation shell body 110 is based on the groove structure 170. The closer it is to the outer end (one end) in the left and right width direction, the more it forms an upward inclined "V" shape. In one embodiment (200) and the variants (200T-1~200T-4) of the present invention, when the pressing end 201 is fixed to the pressing portion 150, the "upper part" and "lower part" areas can be relatively distinguished.

This division of the upper and lower regions is also the same when the main body of the heat-conducting plate (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) is arranged vertically along the direction of gravity (i.e., the up and down direction).

The heat generated from the heating element 140 is preferentially transferred to the first refrigerant flow path 210 side where the absorber 300 is provided. The refrigerant stored in the first refrigerant flow path 210 side where the absorber 300 is provided is mostly in a liquid phase refrigerant state. After the heat transferred from the heating element 140 is phase-changed into a gaseous phase refrigerant, preferably, heat dissipation is performed by heat exchange with the outside air while flowing as a whole to the heat dissipation plate portion 203 side including the third refrigerant flow path 230.

Here, the volume occupied by the refrigerant in the refrigerant flow space 205 when it changes to a gaseous phase is relatively smaller than the volume of the liquid refrigerant. Therefore, the water surface of the liquid refrigerant is located in the aforementioned lower region. On the first refrigerant flow path 210 side, which is above the water surface of the liquid refrigerant, the absorber 300 can absorb the liquid refrigerant through capillary forces and move it upwards. Therefore, the water surface of the first refrigerant flow path 210 is formed between its upper and lower ends, which should be understood as being located relatively close to the lower side in the direction of gravity within the refrigerant flow space 205.

However, in this case, when the arrangement of the first refrigerant flow path 210 is formed in a relatively long vertical direction (gravity direction), there is also a problem that the upward dispersion based on the absorber 300 is also limited.

In order to overcome the limitations of the absorber 300, the active heat dissipation mechanism 200T-5 according to the fifth variation of the present invention is provided with multiple inclined guides 215 in a position relative to the upper region, based on the direction of gravity, so as to minimize the flow of a large amount of liquid refrigerant that changes phase due to heat exchange of the gas phase refrigerant downwards.

Here, each of the plurality of tilting guides 215 may be formed with only one of the plurality of linear reinforcing parts 241 of the plurality of strength reinforcing parts 240 described above.

Furthermore, preferably, the multiple line reinforcements 241 are formed protruding further toward the refrigerant flow space 205 than the multiple inclined guides 215, so that they can be joined to each other on the refrigerant flow space 205.

At this time, as shown in Figure 23, the multiple line reinforcements 241 are formed with almost similar lengths or similar pattern shapes for the multiple inclined guides 215, except for the different protrusions toward the refrigerant flow space 205. They can be distinguished and named as multiple line pattern portions 241P, and can be understood as having the same configuration as the multiple inclined guides 215 described above.

Therefore, the space between multiple adjacent line pattern sections 241P can be understood as the second refrigerant flow path 220, and the space between multiple line pattern sections 241P in the thickness direction can be understood as the third refrigerant flow path 230.

However, the multiple inclined guides 215 and the multiple line pattern sections 241P should not be understood as being completely physically separate from each other. Rather, as shown in the case of the active heat dissipation mechanism 200 according to an embodiment of the present invention, the multiple inclined guides 215 and the multiple line pattern sections 241P should be understood as having the same configuration to the extent that they provide the main flow path of the liquid phase refrigerant.

Additionally, referring to FIG23, preferably, a refrigerant flow path is provided in the lower part to allow the gaseous refrigerant that has undergone phase change from liquid refrigerant to gaseous refrigerant to flow smoothly. Only a plurality of point reinforcements 242 among the plurality of reinforcements 240 may be provided. In this case, as described above, in order to distinguish it from the active heat dissipation mechanism 200 according to an embodiment of the present invention, it may be referred to as a dot pattern section 242P.

Therefore, although the name of the multi-dot pattern section 242P is different, it should be understood as a structure that performs the same function as the aforementioned multi-dot reinforcement section 242.

However, in the active heat dissipation mechanism 200T-5 according to the fifth variation of the present invention, the "lower region" equipped with multiple dotted pattern sections 242P does not have a configuration that performs the same function as multiple inclined guides 215 that guide the flow of liquid refrigerant. Instead, they can be arranged parallel to the length direction of the multiple line reinforcement sections 241 or multiple line pattern sections 241P.

That is, when multiple line reinforcement sections 241 or multiple line pattern sections 241P are arranged in a concentrated manner with the same tilting shape as multiple tilting guides 215 and at a predetermined density or higher, taking into account the surface tension of the liquid phase refrigerant, the amount of liquid phase refrigerant falling directly downward can be minimized.

As described above, as shown in FIG23, the active heat dissipation mechanism 200T-5 according to the fifth variation of the present invention can be configured to have multiple line pattern portions 241P arranged more centrally in the area corresponding to the upper region, so that the maximum amount of liquid refrigerant that condenses into liquid after heat exchange with the gaseous refrigerant is guided to the upper region of the first refrigerant flow path 210 or absorber 300, and multiple dot pattern portions 242P arranged more centrally in the area corresponding to the lower region for rapid diffusion and dispersion flow of the gaseous refrigerant that undergoes phase change by evaporation in the first refrigerant flow path 210.

Furthermore, in the case of the active heat dissipation mechanism 200 according to one embodiment of the present invention and the active heat dissipation mechanism (200T-1, 200T-2, 200T-3, 200T-4, 200T-5) according to the present invention, the second refrigerant flow path 220 can be provided in an inclined straight line form, or it can be indirectly formed by multiple strength reinforcements 240 instead of directly forming the second refrigerant flow path 220. However, in the active heat dissipation mechanism 200T-6 according to the sixth variation below, a technical feature is proposed in which the second refrigerant flow path 220 and the third refrigerant flow path 230 are formed with each of the multiple strength reinforcements 240 in the form of a midpoint reinforcement as the center.

More specifically, as shown in FIG24, the active heat dissipation mechanism 200T-6 according to the sixth variation of the present invention may include a plurality of strength reinforcements 240 arranged in the form of point reinforcements spaced at a uniform density in the heat dissipation plate portion 203 of the condensation area other than the press-in end 201 corresponding to the evaporation area.

Multiple reinforcement sections 240 may be formed on the entirety of one side heat-conducting plate 200A and the other side heat-conducting plate 200B, respectively protruding toward the refrigerant flow space 205 formed in the thickness direction of one side heat-conducting plate 200A and the other side heat-conducting plate 200B.

Here, multiple reinforcement sections 240 are provided in the form of small circular dots. The reinforcement sections 240 formed in the condensation area can be formed relatively densely throughout the heat dissipation plate section 203. Conversely, the reinforcement sections 240 formed in the heat dissipation plate section 203 adjacent to the evaporation area can be spaced apart in a way that their density is relatively low.

As described above, the reason for setting the density of the strength reinforcement section 240 differently based on whether it is near or far, using the evaporation area as a reference, is as follows.

First, multiple strength-reinforcing portions 240 formed in the heat dissipation plate portion 203, which serves as the condensation zone and is slightly separated from the evaporation zone, are relatively densely formed throughout the condensation zone. The second refrigerant flow path 220 and the third refrigerant flow path 230, described later, are also formed tightly and densely. During the gas-liquid circulation of the refrigerant (or during phase change), the swaying (flow) between the heat-conducting plate 200A on one side and the heat-conducting plate 200B on the other side caused by changes in internal pressure can be appropriately prevented. The multiple strength-reinforcing portions 240, the second refrigerant flow path 220, and the third refrigerant flow path 230 formed in the sheet metal process of the stamping process can enhance their rigidity.

Secondly, the portion corresponding to the heat dissipation plate portion 203 near the evaporation region is mainly the part that stores the liquid refrigerant. As shown in the heat dissipation plate portion 203 of the condensation region, when multiple strength reinforcements 240 are tightly joined together, there is a concern that the joints may break when the refrigerant freezes and the volume of the refrigerant increases. Therefore, in the portion of the heat dissipation plate portion 203 near the evaporation region (or the press-in end 201), line reinforcements 241 that are slightly spaced apart from each other are used and joined together, and the formation density of the strength reinforcements 240 in the form of point reinforcements provided therebetween is reduced, so that stress is minimized when the refrigerant freezes, and the design allows for a certain degree of volume expansion and contraction.

Additionally, the refrigerant flow space 205 may include: a second refrigerant flow path 220, formed around the strength reinforcement portion 240 in the form of a dot reinforcement portion of the condensation portion, and sheet metal processing performed in a predetermined pattern; and a third refrigerant flow path 230, formed between the second refrigerant flow path 220 and the strength reinforcement portion 240, and sheet metal processing performed in a form with fewer depressions than the strength reinforcement portion 240.

Typically, since the thickness of the refrigerant flow space 205 in the second refrigerant flow path 220 is greater than that in the third refrigerant flow path 230, when the gaseous refrigerant condenses into liquid refrigerant through heat exchange in the heat dissipation plate portion 203, which serves as the condensation zone, the liquid refrigerant is dispersed by surface tension or gravity and its flow is guided, so that the liquid refrigerant is collected on the side of the heat dissipation plate portion 203 near the evaporation zone.

Conversely, the thickness of the third refrigerant flow path 230 is less than that of the second refrigerant flow path 220. If the liquid refrigerant evaporates into gaseous refrigerant in the evaporation region, the evaporated gaseous refrigerant can diffuse and disperse through the relatively narrow thickness of the third refrigerant flow path 230 and flow to the entire heat dissipation plate portion 203, which serves as the condensation region, thereby promoting heat exchange.

The aforementioned second refrigerant flow path 220 and third refrigerant flow path 230 are formed in a predetermined pattern around the reinforcement portion 240 that is tightly formed on the side of the heat dissipation plate portion 203, which serves as the condensation region. It should be noted that the side of the heat dissipation plate portion 203 near the evaporation region mainly involves only the storage and evaporation of liquid refrigerant (phase change to gaseous refrigerant). Therefore, the second refrigerant flow path 220 and third refrigerant flow path 230 are not formed separately.

Additionally, as shown in Figure 24, when the pattern shape of the second refrigerant flow path 220 is formed as a polygon (e.g., a honeycomb hexagon or other pentagon), at least one side of adjacent second refrigerant flow paths 220 can be connected to each other in a shared form.

10. Comparison of comparative examples with the present invention

Figure 25 is a cross-sectional view showing the configuration of the press-in portion of the comparative example (200D, (a)) and an embodiment of the present invention (200, (b)).

10-1 , SUS Material and bending forming

In order to provide a smooth comparison between the active heat dissipation mechanism 200 according to an embodiment of the present invention and the active heat dissipation mechanism 200D according to a comparative example, the comparative example 200D in FIG25 indicates that the press-in end 201 of the active heat dissipation mechanism 200 according to an embodiment of the present invention is inserted into and fixed to the press-in part 150 having the same specifications (i.e., shape and size).

First, in order to make a detailed comparison between the active heat dissipation mechanism 200 of an embodiment of the present invention with reference to FIG. 25(b) and the active heat dissipation mechanism 200D of a comparative example with reference to FIG. 25(a), the specifications of the active heat dissipation mechanism 200D will be explained in detail according to the comparative example.

According to the comparative example, the active heat dissipation mechanism 200D is manufactured by joining two panel components made of aluminum (Al) material with very good thermal conductivity through a predetermined joining process, and it is assumed that the refrigerant is filled and forms a refrigerant flow space 205 through phase change.

As is well known, aluminum (Al) has a thermal conductivity of 230 and a specific gravity of 2.7. In this invention, the thickness of one panel component is 0.5T (hereinafter, "T" represents "mm" in the unit of length), and the sum of the thickness of the two panel components is 1T. This refers to the thickness of the insert 150, which is inserted into the heat-generating element 140 near the heat dissipation object, being 1T thick.

More specifically, it can be assumed that the heat-conducting plate 200D-1 on one side and the heat-conducting plate 200D-2 on the other side of the comparative active heat dissipation mechanism 200D are manufactured under conditions using the limit thickness definition described later.

For example, as shown in Figure 22(a), the comparative active heat dissipation mechanism 200D, with its one-side heat conduction plate 200D-1 and the other-side heat conduction plate 200D-2, can be manufactured with an additional limit thickness of 0.5T, which cannot be further manufactured as thin, taking into account the aluminum material and the product's strength and safety design requirements.

That is, the width of the interior of the pair of grooves 150a and 150b forming the press-in portion 150 is twice the sum of the thicknesses of the heat-conducting plates 200D-1 on one side and 200D-2 on the other side of the comparative active heat dissipation mechanism 200D, which is 0.5T. The press-in portion 150 having the same shape and size is also applied to the active heat dissipation mechanism 200 according to an embodiment of the present invention.

Here, as part of the factors determining the aforementioned “limit thickness”, the strength and safety design of products made of aluminum are required to have the strength to stably retain the refrigerant filled inside, and the elongation and processability of pure aluminum are relatively better than those of SUS. However, it does not meet the above strength requirements. Therefore, in order to have sufficient strength, additional processes such as heat treatment, cold working or alloying are required for aluminum sheet components.

In particular, as shown in the comparative example of the active heat dissipation mechanism 200D, when aluminum is used as the main component of the heat-conducting plate, although it has the advantage of excellent thermal conductivity, it also has several disadvantages in addition to the problem of increased cost due to the high cost mentioned above.

First, in the case of the comparative active heat dissipation mechanism 200D, which utilizes an aluminum heat-conducting plate body (200D-1, 200D-2), the choice of refrigerant is very limited. That is, when aluminum comes into contact with water, a chemical reaction occurs that generates hydrogen and aluminum oxide. In particular, the generation of some hydrogen causes an increase in the internal pressure of the refrigerant flow space 205.

Secondly, as described above, the increase in internal pressure in the refrigerant flow space 205 of the comparative example active heat dissipation mechanism 200D, which is constructed using aluminum heat-conducting plate main bodies (200D-1, 200D-2), not only increases the risk of damage to the completed active heat dissipation mechanism 200D itself, causing one side of the heat-conducting plate 200D-1 and the other side of the heat-conducting plate 200D-2 to lift up, thereby causing vibration during the gas-liquid circulation of the refrigerant, and also causing problems that hinder smooth gas-liquid circulation. In order to prevent this situation, it is necessary to form the strength reinforcement part 240 and other reinforcement components according to the above-mentioned multiple embodiments 200 of the present invention during the stamping process (S10).

Third, due to the first and second issues mentioned above, the refrigerants that can be used in the comparative example of the aluminum active heat dissipation mechanism 200D are limited to Honeywell refrigerants or special refrigerants such as CFCs (Freon gases). Recently, many countries have been actively researching restrictions on refrigerant use to prevent environmental pollution, thus creating a conflict with the international trend of preventing environmental pollution. That is, when producing products such as the comparative example of the aluminum active heat dissipation mechanism 200D, it may be impossible to market and use the products in every country with the aforementioned usage regulations.

Fourth, as mentioned above, when the aluminum heat-conducting plate body (200D-1, 200D-2) is set with an extreme thickness, there are design limitations in the position of bringing the refrigerant close to the heat-generating body. That is, pure aluminum has a good elongation rate in terms of its properties. However, as mentioned above, in order to stably maintain the refrigerant without internal warping, the strength of aluminum sheet components increases when manufactured by heat treatment, cold working or alloying, according to the strength and safety design requirements of the product. However, the machinability of the stamping process decreases. Therefore, under the premise of forming a refrigerant flow space 205 of the same thickness, it is impossible to form multiple strength reinforcing parts 240 equipped according to the embodiment 200 of the present invention to prevent the refrigerant from shaking during gas-liquid circulation.

Fifth, if a maximum thickness is set for the heat-conducting plate 200D-1 on one side and the heat-conducting plate 200D-2 on the other side as described above, then, as shown in the active heat dissipation mechanism 200 of an embodiment of the present invention, the following problem actually exists: the closest contact position of the refrigerant flow space 205 corresponding to the first refrigerant flow path 210, which collects the liquid refrigerant closest to the heating element 140, is located outside the press-in portion 150. The above problem causes the distance between the heating element 140 and the liquid refrigerant to become greater, thereby diluting the advantages of the aluminum material with excellent thermal conductivity.

Therefore, in the comparative example of the active heat dissipation mechanism 200D, the metal plate components constituting the main body of the heat-conducting plate (200D-1, 200D-2) are made of aluminum, and are made of an aluminum alloy having the aforementioned predetermined tensile strength or higher. As described above, aluminum materials, including aluminum alloys, have a very excellent thermal conductivity of 230 W/m-k and a low specific gravity, making aluminum one of the most commonly used thermally conductive metal materials for heat dissipation elements.

However, although aluminum has excellent thermal conductivity and specific gravity, it is relatively expensive and the types of refrigerant that can be filled inside are limited.

Therefore, in one embodiment of the present invention, the active heat dissipation mechanism 200 uses a material that is less expensive than aluminum, namely stainless steel (SUS), and modifies the design to have heat dissipation performance similar to that of aluminum as its core structural element.

More specifically, as shown in Figure 25(a), the active heat dissipation mechanism 200D according to the comparative example includes two components, with a refrigerant flow space 205 formed inside, which is filled with and flows refrigerant, and may include a flat heat-conducting plate body (200D-1, 200D-2) made of aluminum.

This differs from the active heat dissipation mechanism 200 of an embodiment of the present invention in that the active heat dissipation mechanism 200 is bent into a single component to form multiple refrigerant flow paths (210, 220, 230) corresponding to the aforementioned refrigerant flow space 205.

However, even when the two components of the heat-conducting plate body (200D-1, 200D-2) are joined together as shown in the comparative example active heat dissipation mechanism 200D, the operation of welding the two heat-conducting plate bodies (200D-1, 200D-2) together is the same as shown in the comparative example active heat dissipation mechanism 200D, where the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230 are formed, and the absorber 300 is provided at the position corresponding to the first refrigerant flow path 210.

That is, in the active heat dissipation mechanism 200D according to the comparative example, the two heat conduction plate bodies (200D-1, 200D-2) can be joined to each other in opposite directions, and the refrigerant flow space 205 can be formed inside them.

Here, the active heat dissipation mechanism 200 of one embodiment of the present invention may differ from the active heat dissipation mechanism 200D of the comparative example which includes two components in that the active heat dissipation mechanism 200 is configured as a single component and is bent to be symmetrical in the left-right direction.

Here, in the case of the active heat dissipation mechanism 200D according to the comparative example, unlike the active heat dissipation mechanism 200 according to an embodiment of the present invention, the two separate components (heat-conducting plate main body (200D-1, 200D-2)) are joined in a predetermined manner to form a refrigerant flow space 205 inside for the following reason: This is because, in the case of aluminum material, in order to ensure a predetermined strength, the elongation of the aluminum alloy is reduced during the metal processing, making it difficult to perform precise additional processing.

For example, as shown in one embodiment 200 of the present invention, when the heat-conducting plate body (200D-1, 200D-2) made of aluminum is bent by bending process (S20), due to its very poor machinability, the curvature radius of the part forming the pressing end 201 can only be formed to be relatively large.

The increase in the radius of curvature of the press-in end 201 not only requires increasing the size of the groove of the press-in portion 150 (i.e., the size between a pair of groove ribs 150a and 150b) manufactured for placement on the back of the heat dissipation shell body 110, which is the object of heat dissipation, but also requires increasing the size of the groove of the press-in portion 150 (i.e., the size between a pair of groove ribs 150a and 150b). As a result, it is necessary to increase the size of the heat conduction plate body (200D-1, 200D-2) itself, which leads to a significant reduction in the number of units per unit area on the back of the heat dissipation shell body 110.

More specifically, generally speaking, the higher the purity, the more elongation the sheet metal parts made of aluminum will have, exceeding 40%, which is greater than the 35% elongation of sheet metal parts made of SUS materials (refer to SUS304, SUS316, SUS321, and SUS410 in JIS standards). Therefore, the expected processability will also be better.

However, as mentioned above, when aluminum sheet components are manufactured through heat treatment, cold working, or alloying to meet the product's strength and safety design requirements, the elongation is reduced, resulting in poor machinability.

Here, the low machinability of aluminum sheet components manufactured by the aforementioned heat treatment, cold working, or alloying methods refers to the fact that, due to the aforementioned limited thickness, it is difficult to reduce the separation distance between the inner surface of the press-in portion 150 that receives heat from the heating element 140 and the refrigerant flow space 205 that realizes the evaporation of liquid refrigerant (requiring additional processing steps), and the reinforcing elements such as the heat-conducting plate 200D-1 generated during the gas-liquid circulation of the refrigerant and the multiple strength-reinforcing portions 240 in an embodiment 200 of the present invention, which are used to prevent the vibration of the heat-conducting plate 200D-2 on the other side, are formed by a stamping process (poor machinability).

That is, referring to Figure 25(a) and observing the comparative example of the active heat dissipation mechanism 200D, assuming that further processing is difficult due to the thickness limit caused by the design requirements, and the width and length between the pair of grooves 150a and 150b constituting the press-in portion 150 are designed to match twice the aforementioned limit thickness, the heating element 140 and the liquid refrigerant are actually closest to the refrigerant flow space 205 at a distance that is further outward than the outer ends of the press-in portion 150 (the outer ends of the pair of grooves 150a and 150b). Therefore, a difference in the corresponding heat transfer rate and heat transfer amount will occur.

For example, as shown in FIG25(a), when the metal plate component forming the heat-conducting plate body (200D-1, 200D-2) with a pair of grooves 150a and 150b of the press-in portion 150 formed with the same shape and size is made of aluminum, at least a portion of the refrigerant flow space 205 corresponding to the first refrigerant flow path is not located inside the grooves 150a and 150b of the press-in portion 150, but is at a minimum thickness of 0. When the 1T setting is twice that of 5T, as shown in Figure 25(b) of an embodiment of the present invention, the active heat dissipation mechanism 200, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) made of SUS material can contain twice the thickness of 0.15T in the interior 150c of a pair of grooves 150a, 150b of the press-in portion 150, and can be processed to a thickness that can accommodate a portion of the first refrigerant flow path 210.

Furthermore, as shown in the comparative example of the active heat dissipation mechanism 200D in Figure 25(a), if the metal plate components constituting the heat conduction plate body (200D-1, 200D-2) are manufactured with the maximum thickness according to the design requirements, the machinability decreases as its strength and hardness increase. As a result, it is difficult to process the reinforcing elements corresponding to the multiple strength reinforcing parts 240 by stamping. Therefore, there is a disadvantage that other processing methods (e.g., etching or turning processes) of other metal plate components are required to process the internal structure or reinforcing elements of the refrigerant flow space.

In contrast, in the case of embodiment 200 of the present invention shown in FIG. 25(b), the metal sheet component made of SUS material has excellent elongation and workability. It is possible to simultaneously form a refrigeration system including the first refrigerant flow path 210 to the third refrigerant flow path 230 and multiple strength reinforcements 240 through a single stamping process. The internal structure of the refrigerant flow space 205, and the welding of multiple strength reinforcement parts 240 in contact with each other through a joining process, can prevent the shaking or expansion and contraction of one side heat conduction plate 200-1 and the other side heat conduction plate 200-2 during the gas-liquid circulation of the refrigerant, and has the advantage of preventing unnecessary consumption of energy required for the evaporation of the liquid phase refrigerant.

Meanwhile, in the case of the active heat dissipation mechanism 200D according to the comparative example, as described above, the press-in end 201 is formed with the material thickness (0.5T*2) of the two heat-conducting plate bodies (200D-1, 200D-2). In terms of its poor machinability, when it is simply joined to the press-in part 150 by press-in fitting, the fixing force on the heat dissipation shell body 110 is necessarily weak. In order to ensure its fixing force, after the press-in end 201 is inserted and joined to the press-in part 150, it is necessary to increase the bonding force by welding. Therefore, there is a complicated problem in the operation process.

Furthermore, when a refrigerant flow space 205 is formed inside the heat-conducting plate body (200D-1, 200D-2) made of aluminum, as described above, the types of refrigerant filling the refrigerant flow space 205 may be very limited. For example, if distilled water (water) is used as the refrigerant, it cannot perform its function as a refrigerant because it reacts chemically with the aluminum material, thus creating a problem that distilled water needs to be excluded from the available refrigerants.

According to an embodiment of the present invention, the active heat dissipation mechanism 200 proposes to use stainless steel (SUS) for the heat conduction plate body (one side heat conduction plate (200-1) and the other side heat conduction plate (200-2)), but in the case of using aluminum, various shape designs and characteristics can ensure the corresponding heat dissipation performance, so as to solve the various problems existing in the heat conduction plate body (200D-1, 200D-2) of the comparative example of the active heat dissipation mechanism 200D using the above-mentioned aluminum material.

More specifically, as shown in Figure 25(b), according to an embodiment of the present invention, the active heat dissipation mechanism 200 utilizes a heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) made of a single material to bend the pressed end 201 with an arbitrary reference line T through a bending process (S20), thereby forming a predetermined curvature (e.g., referring to “R1” or “R2” in Figures 15 and 16), and at least a portion of the first refrigerant flow path 210 in the refrigerant flow space 205 can be formed such that the refrigerant flows inward more towards the front end of the pair of grooves 150a, 150b constituting the pressed portion 150.

At this time, the material of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) in an embodiment 200 of the present invention can be limited to a metal material having an elongation that satisfies the following conditions.

More specifically, as one of its conditions, assuming that the heat-conducting plate body is configured with an aluminum plate shape as described in the existing paper's RBFHP, and that the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) in an embodiment 200 of the present invention is inserted with twice the thickness in such a way that there is no space inside the pair of grooves 150a, 150b formed in the back of the heat-dissipating shell body 110, which is the object of heat dissipation, can be limited to a metal material having an elongation of less than 1/6 of the thickness of the aforementioned RBFHP heat-conducting plate body.

For example, the thickness of the aluminum heat-conducting plate body (200D-1, 200D-2) of the comparative active heat dissipation mechanism 200D or the RBFHP of the prior art is as described above. When it is inserted into the pressing part 150 with a thickness of 0.5T, twice the thickness (1T) is inserted. According to an embodiment of the present invention, the thickness of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) in the active heat dissipation mechanism 200 can be 0.15T, which is less than 1/6 of 1T.

In the case of the comparative example active heat dissipation mechanism 200D, the refrigerant flow space 205 is constructed using a heat-conducting plate 200D-1 on one side and a heat-conducting plate 200D-2 on the other side. In an embodiment of the present invention, the individual thickness of the heat-conducting plate 200-1 and the heat-conducting plate 200-2 in the main body of the heat-conducting plate (heat-conducting plate (200-1) and heat-conducting plate (200-2)) can be defined as less than 1/3 of 0.5T.

Furthermore, as described above, preferably, the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) in one embodiment 200 of the present invention is made of a metal material with a bendable elongation so that at least a portion of the first refrigerant flow path 210 is inserted into the inner side of the front end of the press-in portion 150.

Furthermore, the aforementioned metal material can be defined as having an elongation that allows multiple strength reinforcements 240 to be formed on multiple inclined guides 215 during processing via a stamping process (S10).

Therefore, the elongation at this time is also as shown in the comparative example of the active heat dissipation mechanism 200D. After the metal material of the heat conduction plate body (200D-1, 200D-2) is made of aluminum, it is limited to the case of additional manufacturing (heat treatment, cold working or alloying) with a predetermined tensile strength.

Meanwhile, in one embodiment 200 of the present invention, the thermal conductivity of the metal material used as the main body of the heat-conducting plate (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) can be limited to less than 1/10 of the thermal conductivity of aluminum (230 W/m-K level). It is actually known that the thermal conductivity of the SUS material described below is less than 1/10 of the thermal conductivity of aluminum, at the 20 W/m-K level.

10-2 Advantages of using water as a refrigerant

The SUS material described above is an example of a material best suited to meet the limitations of elongation and thermal conductivity as described above. In an active heat dissipation mechanism 200 of an embodiment of the present invention, when the metal material of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) is made of SUS material, not only can the limitations related to elongation and thermal conductivity mentioned above be overcome, but also, as a refrigerant, it has the advantage of being able to use distilled water.

That is, the refrigerant filling the refrigerant flow space 205 of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) made of SUS material can be defined as a refrigerant that does not chemically react with the aluminum plate, except for refrigerants that chemically react with the aluminum plate.

As a refrigerant that meets this definition, distilled water (water) as described above is a representative example. When distilled water is used as a refrigerant, it has advantages over other refrigerants in terms of cost, heat of vaporization, and surface tension. In particular, when distilled water is used as the refrigerant, its high latent heat and sensible heat mean that even if the position of the injection end 201 is relatively high relative to the direction of gravity, it can still exert sufficient heat transfer capacity. Regardless of the inclination direction of the second refrigerant flow path 220, the versatility of the fixing design of the injection end 201 can be ensured.

More specifically, the refrigerant filling the refrigerant flow space 205 does not cause any chemical reaction when it comes into contact with the metal heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)). The heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) can be converted from liquid to gas or from gas to liquid by the thermal conductivity of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)).

The “chemical reaction” here also includes the concept of the additional generation of substances that “corrode” the water used as a refrigerant or that change the internal pressure of the refrigerant flow space 205.

However, it is extremely rare for contact between substances, especially over a long period of time, to not produce any chemical reaction at all. Therefore, the concept of "chemical reaction" here is as follows: preferably, broadly, a reaction that affects the phase change conditions of water to at least the extent that it alters the internal pressure of the refrigerant flow space 205.

Here, the water constituting the refrigerant may include one of the following: water in its natural state, distilled water, and ultrapure water. However, in the case of using water, water in its natural state may contain organic and inorganic matter. Therefore, it is preferable to use distilled water that has been purified by water vaporization or ultrapure water that has had its internal organic and inorganic matter removed.

For reference, distilled water can be classified into single-distilled water, double-distilled water, and triple-distilled water according to the distillation process. The different grades of distilled water are based on the purification process and are different from the purity of water.

Single-distilled water refers to water that has only undergone distillation and is called distilled water (DW). Double-distilled water refers to water obtained by distilling single-distilled water once more. Triple-distilled water refers to water obtained by distilling three times. Deionized water is usually obtained by removing ions from single-distilled water.

Furthermore, ultrapure water is pure water that has been purified through highly advanced water treatment methods such as reverse osmosis (RO), ion exchange resins, activated carbon filters, and sterilization to remove electrolytes, microorganisms, organic matter, and dissolved gases. It refers to water with a specific resistivity of 18 MΩ·cm or higher at 25°C, indicating that ions have been removed to a certain extent.

For reference, water with a specific resistance value in the range of 5 MΩ·cm to less than 18 MΩ·cm at 25°C can be classified as pure water.

Here, not only ultrapure water but also pure water can be used as a refrigerant. However, pure water with a resistivity of less than 18 MΩ·cm at 25°C differs from ultrapure water and may contain trace amounts of electrolytes, microorganisms, organic matter, and dissolved gases. In a closed space, organic gases may be generated over time. Since the total dissolved solids (TDS) is greater than 0.028 ppm, ultrapure water with a resistivity of 18 MΩ·cm or greater at 25°C is preferred.

Meanwhile, when water is selected and used as the refrigerant, it can be inferred from the problems of the comparative active heat dissipation mechanism 200D that the metal material of the heat conduction plate body (one side heat conduction plate (200-1) and the other side heat conduction plate (200-2)) should be limited to a material that does not cause any chemical reaction when in contact with water.

Therefore, in the active heat dissipation mechanism 200 according to an embodiment of the present invention, the metal material of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) is a metal material that does not chemically react with the water constituting the refrigerant, and may include stainless steel (SUS). Here, SUS is the standard name for stainless steel included in the JIS standard.

Here, as a metal that does not react with the water used as a refrigerant, platinum, gold, silver, iridium, tungsten, titanium, etc. can be considered, but as mentioned above, stainless steel (SUS) or copper, which has excellent machinability and is inexpensive, is preferred.

Furthermore, since the active heat dissipation mechanism 200 of an embodiment of the present invention has a greater elongation than the active heat dissipation mechanism 200D of the comparative example made of aluminum alloy or the RBFHP of the prior art, if the press-in end 201 is formed in such a way that it has an outer shape with a groove size greater than that of the press-in portion 150, and then the insertion is performed by a press-in insertion method that forces it into the press-in portion 150, it has the advantage that sufficient fixing force can be formed without additional processes such as separate welding processes.

The use of the pressing end 201 and the pressing part 150 of the pressing fit method described above has the following advantages: it can prevent the absorbent 300 made of fibrous materials such as non-woven fabric from being damaged by welding heat in advance through additional welding process.

As described above, in one embodiment 200 of the present invention, the first refrigerant flow path 210 to the third refrigerant flow path 230 are filled with refrigerant, and heat dissipation is actively performed by the heat transferred from the heat-generating element 140 disposed inside the heat dissipation shell body 110, thereby maximizing the heat dissipation performance.

In particular, referring to FIG25, compared with the active heat dissipation mechanism 200D of the comparative example, in the case of an embodiment 200 of the present invention, at least a portion of the first refrigerant flow path 210 flows into the inner side of the groove formed by the press-in portion 150 (i.e., the inner side of the front end of the press-in portion 150). Since the refrigerant absorbed and captured by the absorber 300 of the first refrigerant flow path 210 can receive heat in a state closer to the heating element 140, it has the advantage of ensuring heat dissipation performance second only to that of the case where aluminum material is used, in terms of the phase change being more active in the evaporation region.

10-3 Hydrophobic coating materials

However, when the refrigerant filling the refrigerant flow space 205 is distilled water, the very high surface tension of the water may cause a problem of reduced flowability due to the slightly thinner inner surface of the refrigerant flow space 205.

To address the problem of reduced fluidity of liquid refrigerants, an active heat dissipation mechanism 200 according to an embodiment of the present invention can solve this problem by applying a hydrophobic coating material that reduces the surface tension and adhesion of the refrigerant to the inner surfaces of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) that forms the refrigerant flow space.

In the case of the first refrigerant flow path 210, an overall flow path is provided regardless of the state of the filled refrigerant. There is no major problem in the flow path in which the liquid refrigerant is mainly absorbed by the absorber 300. However, the second refrigerant flow path 220 and the third refrigerant flow path 230 provide flow paths for the liquid refrigerant to flow along the surface. A coating layer using a hydrophobic coating material is formed on the inner surface of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) that forms the refrigerant flow space 205. This is to ensure smoother flow of the liquid refrigerant.

However, it is not necessary to use hydrophobic coating materials to form the coating layer; hydrophilic coating materials can also be used depending on the type of refrigerant or the characteristics of the flow path.

11 Another embodiment of the present invention (joint manufacturing) and the heat dissipation shell main body layout structure

Figure 26 is a cross-sectional view taken along line A-A of Figure 4b and a partially enlarged view thereof. Figure 27 is a cross-sectional perspective view taken along line A-A of Figure 4b and a partially enlarged view thereof. Figure 28 is a cross-sectional perspective view taken along line B-B of Figure 4b and a partially enlarged view thereof. Figure 29 is a perspective view showing an active heat dissipation mechanism according to another embodiment of the present invention. Figure 30 is an exploded perspective view of Figure 29. Figure 31 is a cut perspective view (a), a partially enlarged view (b), and a cross-sectional view (c) of Figure 29. Figure 32 is a cross-sectional view showing the connection state of the active heat dissipation mechanism with respect to the press-in portion according to another embodiment of the present invention.

So far, an active heat dissipation mechanism 200 and its variations (200T-1 to 200T-6) of an embodiment of the present invention, with reference to Figures 4a and 5a, and Figures 7 to 24, have been described with the premise that the first refrigerant flow path 210 is formed by a manufacturing method of bending or bending a single metal plate component (S20).

However, the manufacturing method of the active heat dissipation mechanism according to the present invention is not limited to the above-described bending process (S20) in one embodiment 200. Hereinafter, as shown in Figures 4b and 5b and Figures 26 to 32, an active heat dissipation mechanism 1200 according to the present invention is proposed and described by joining two separate metal plate components in a joint manner, thereby forming a refrigerant flow space 1205 including a first refrigerant flow path 1210 and a second refrigerant flow path 1220 (including a third refrigerant flow path in the embodiment).

In another embodiment of the active heat dissipation mechanism 1200 according to the present invention, as shown in Figures 26 to 32, the heat-conducting plate body (1200-1, 1200-2) can be formed into two separate metal plate components by joining them together (same as the joining process (S40) described later) to form the refrigerant flow space 1205. This differs from the manufacturing method of the active heat dissipation mechanism 200 according to one embodiment of the present invention in that the refrigerant flow space 205 is formed by joining the single metal plate components after bending them.

As described above, the active heat dissipation mechanism 1200 according to another embodiment of the present invention can be combined with the back side of the heat dissipation shell body 110 implemented using the first arrangement embodiment shown in Figures 4a and 5a, provided that it is combined with and disposed on the back side of the heat dissipation shell body 110 implemented using the second embodiment, which has a different shape of the press-in portion 150 including a press-in end 201 side adapted to the above-described manufacturing method, as shown in Figures 4b and 5b.

Referring to Figures 26 to 29, a plurality of press-in portions 150 are arranged on the back side of the heat dissipation shell body 110 implemented using the second arrangement example, which is longer in the vertical direction (i.e., along the vertical direction). Furthermore, according to another embodiment of the present invention, the active heat dissipation mechanism 1200 can be formed to be spaced apart from each other in the left-right width direction.

As described above, in the case where the back of the heat dissipation shell body 110 implemented using the second arrangement embodiment is provided with an active heat dissipation mechanism 1200 according to another embodiment of the present invention, compared with the active heat dissipation mechanism 200 with a "V" pattern according to one embodiment of the present invention, the flow resistance of external air (outdoor air) in the vertical direction is minimized, thereby making the inflow of outside air smooth. It has the advantage that the flow resistance of the rising airflow is also minimized by the heat released from each active heat dissipation mechanism 1200.

Furthermore, on the back side of the heat dissipation shell body 110 implemented using the second embodiment, a single press-in portion 150 can be arranged for a relatively long length in the vertical direction. However, considering the limitations of the liquid phase refrigerant dispersion force or upward force of the first refrigerant flow path 1210, in this case, multiple fixed heat dissipation fins 200F can be provided in the lower end region, which is a part where heat dissipation is less required.

According to another embodiment of the present invention, an active heat dissipation mechanism 1200 disposed on the back side of the heat dissipation shell body 110 implemented using the second arrangement embodiment described above, after being manufactured by a bonding process (S40), may include a heat-conducting plate 1200-1 forming one side of the refrigerant flow space 1205 in the thickness direction and another heat-conducting plate 1200-2 forming the other side of the refrigerant flow space 1205 in the thickness direction after bonding.

Here, the first refrigerant flow path 1210 and the second refrigerant flow path 1220 can be formed symmetrically to each other with reference to the mating surface of one side heat-conducting plate 1200-1 and the other side heat-conducting plate 1200-2.

However, it is not limited to the first refrigerant flow path 1210 and the second refrigerant flow path 1220 being symmetrically formed on one side of the heat-conducting plate 1200-1 and the other side of the heat-conducting plate 1200-2, and it is not excluded that they are asymmetrically formed as shown in the multiple variations (200T-1 to 200T-6) of the active heat dissipation mechanism 200 according to an embodiment of the present invention, as shown in Figures 22a to 24.

In another embodiment of the present invention, in the active heat dissipation mechanism 1200, the first refrigerant flow path 1210 is a portion of the liquid refrigerant in the refrigerant filling the refrigerant flow space 1205, and is thus arranged vertically up and down along the direction of gravity, with the liquid refrigerant located at least near the lower end of the upper and lower ends of the first refrigerant flow path 1210.

The mating surface of one side heat-conducting plate 1200-1 and the other side heat-conducting plate 1200-2 can be defined as the edge end of the mating area, which includes the pressed end 1201 corresponding to the evaporation region and the heat dissipation plate portion 1203 corresponding to the condensation region.

That is, in the case of the active heat dissipation mechanism 200 and the like according to one embodiment of the present invention, the part joined by the joining process (S40) described later is the edge end of the heat dissipation plate part 203 other than the side of the pressed end 201 of the part formed by the bending process (S20). It should be noted that this is different from the part of the joining portion of the active heat dissipation mechanism 1200 according to another embodiment of the present invention, which combines two separate metal plate parts and seals them.

More specifically, in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, the heat-conducting plate body (1200-1, 1200-2) joins the edge ends of one side heat-conducting plate 1200-1 and the other side heat-conducting plate 1200-2. The first refrigerant flow path 1210 is formed inside one of the edge ends in the width direction (based on FIG25, corresponding to the end that is the left side end). A press-in end 1201 that is coupled to the press-in portion 150 formed on the back side of the heat dissipation shell body 110 as the heat dissipation target can be formed on the outside of one of the edge ends in the width direction (one end).

Furthermore, the heat-conducting plate body (1200-1, 1200-2) is formed by joining the edge ends of one side heat-conducting plate 1200-1 and the other side heat-conducting plate 1200-2. The second refrigerant flow path 1220 is formed inside the other end (based on FIG. 26, the other end as the right end is equivalent to the aforementioned press-in end 1201) of one end and the other end in the width direction of the edge end. A heat dissipation plate portion 1203 for heat exchange with the outside air can be formed on the outside of the other end (the other end) of one end and the other end in the width direction of the edge end.

Additionally, as shown in Figures 4b and 5b, according to another embodiment of the present invention, an active heat dissipation mechanism 1200 is provided in a press-in portion 150, which is a part of the joint portion of the active heat dissipation mechanism 1200 of another embodiment of the present invention, and is arranged on the back side 54 of the heat dissipation shell body 110 in a vertically vertical manner to engage and seal two separate metal plate components. Therefore, the press-in end 1201 corresponding to the front end and the outer end of the heat dissipation plate portion 1203 corresponding to the rear end can be parallel to each other.

Therefore, the technical feature mentioned in the description of the active heat dissipation mechanism 200, etc., according to one embodiment of the present invention, that "among the plurality of inclined guides 215, the one located below the first refrigerant flow path 210 in the direction of gravity is more significant in defining the inclined direction of the second refrigerant flow path 1220 in the active heat dissipation mechanism 1200 according to another embodiment of the present invention.

That is, the first refrigerant flow path 1210 is located below the second refrigerant flow path 1220 along the direction of gravity. This means that the portion of the second refrigerant flow path 1220 corresponding to the outer end of the heat dissipation plate portion 1203 at one end and the other end is inclined and positioned at a higher position than the portion corresponding to the pressed end 1201 of the first refrigerant flow path 1210, with the direction of gravity as the reference.

Meanwhile, as shown in Figures 29 and 30, the active heat dissipation mechanism 1200 according to another embodiment of the present invention may also include an auxiliary absorber 301 for improving the absorption rate of the liquid phase refrigerant of the absorber 300.

For example, antenna devices that recently adopted Massive Multiple Input Multiple Output (MIMO) technology are typically manufactured to be longer in the vertical direction than in the width direction. Furthermore, in order to effectively dissipate heat from multiple heat-generating elements 140 spaced apart from each other in the vertical direction using a minimum number of active heat sinks 1200, the active heat sinks 1200 should be manufactured to be as long as possible in the vertical direction. Moreover, as shown in Figures 4b and 5b of an antenna device 100 employing an active heat sink 1200 according to another embodiment of the invention, a portion of the upper end of the active heat sink 1200 may extend upwards further to cover the upper end of the heat sink housing body 110.

However, when the heat-conducting plate body (1200-1, 1200-2) is formed to be longer along one side (e.g., the direction of gravity), the length of the first refrigerant flow path 1210 in the direction of gravity can only be longer. It is difficult to draw out and disperse sufficient liquid refrigerant from the lower side to the upper end part in the direction of gravity by relying solely on the absorption force of the absorber 300 itself to absorb the liquid refrigerant. Furthermore, since the absorption rate of the liquid refrigerant along the direction of gravity is different, the heat dissipation performance may also be uneven depending on the location.

Here, as described above in the active heat dissipation mechanism 200 according to one embodiment of the present invention, the auxiliary absorber 301, in addition to performing the basic function of increasing the absorption rate of the absorber 300 itself, further, as shown in the active heat dissipation mechanism 1200 according to another embodiment of the present invention, when the active heat dissipation mechanism 1200 extends further upward than the upper end of the heat dissipation shell main body 110 to cover the upper part of the heat dissipation shell main body 110, the liquid refrigerant condensed on the heat dissipation plate portion 1203 side corresponding to the upper part of the heat dissipation shell main body 110 can be easily captured and absorbed on the upper end side of the absorber 300.

That is, the auxiliary absorber 301 performs the function of easily guiding the liquid phase refrigerant to be captured on the upper end side of the absorber 300, which is arranged relatively long along the length direction, relative to the side of the absorber 300 located in the direction of gravity.

More specifically, preferably, the liquid refrigerant that condenses and falls at the heat dissipation plate portion 1203 located on the upper side in the direction of gravity is uniformly supplied to the first refrigerant flow path 1210 side along multiple second refrigerant flow paths 1220 formed between multiple inclined guides 1215.

However, in the heat dissipation plate section 1203, when a portion of the liquid refrigerant condensing on the upper side in the direction of gravity has a very small volume before the surface tension is formed, there is a concern that it will fall directly downwards through the second refrigerant flow path 1220 instead of the third refrigerant flow path 1230. In this case, there is a problem that the liquid refrigerant cannot be successfully supplied to the absorber 300 on the upper side in the direction of gravity.

Here, since the auxiliary absorber 301 can absorb the condensing refrigerant falling directly from its top and supply the liquid refrigerant to each corresponding part of the absorber 300, the auxiliary absorber 301 can perform the function of reducing the uneven supply of liquid refrigerant to the absorber 300.

That is, as shown in Figures 29 and 30, after capturing the liquid refrigerant that condenses and falls from the heat dissipation plate portion 1203 located on the upper side of the gravity direction, it is supplied to the upper end of the absorber 300. By dispersing the liquid refrigerant from the location where the liquid refrigerant is supplied to the upper side of the gravity direction and lifting it upward, it can perform the function of supplementing the heat dissipation performance of the parts of the existing absorber 300 with low absorption rate.

Furthermore, typically, as the high-temperature vapor refrigerant evaporates downwards in the direction of gravity and moves to the upper part of the refrigerant flow space, it may be difficult to eliminate the heat at the upper end of the refrigerant flow space due to the lack of sufficient condensation space (condensation area). The auxiliary absorber 301 performs the function of continuously supplying a portion of the liquid refrigerant flowing downwards from the upper side of the refrigerant flow space to the first refrigerant flow path 1210 side, which corresponds to the upper end side of the absorber 300, thereby achieving uniform heat dissipation overall.

Therefore, in another embodiment of the active heat dissipation mechanism 1200 according to the present invention, as shown in Figures 29 and 30, the auxiliary absorber 301 may also be provided with two upper auxiliary absorbers 301-1 and two lower auxiliary absorbers 301-2 at opposite upper and lower positions.

More specifically, the auxiliary absorber 301 can be disposed in the auxiliary absorber placement portions 1261 and 1262, which are modified to have a wider width in a portion of the second refrigerant flow path 1220.

In the case where two auxiliary absorbers 301 (refer to element symbols 301-1 and 301-2) are provided, as shown in FIG30, the auxiliary absorber placement parts 1261 and 1262 may also be formed at two positions corresponding to the positions of the auxiliary absorbers 301.

The auxiliary absorber 301 may include: an upper auxiliary absorber 301-1 connected close to the upper end of the absorber 300; and a lower auxiliary absorber 301-2 connected close to the middle portion of the absorber 300.

Furthermore, the upper auxiliary absorber 301-1 and the lower auxiliary absorber 301-2 may each be provided with a pair of auxiliary absorbers (301-1A, 301-1B, 301-2A, 301-2B) made of non-woven fabric in the auxiliary absorber placement parts 1261 and 1262 respectively formed on one side of the heat-conducting plate 1200-1 and the other side of the heat-conducting plate 1200-2.

Additionally, as shown in Figure 30, multiple fixing ribs 1263 may be provided in the refrigerant flow space 1205 to stably fix the auxiliary absorber 301.

Multiple fixing ribs 1263 are formed to traverse the auxiliary absorber mounting portions 1261 and 1262 in the width direction, and the two ends are respectively welded to the outer ends of the auxiliary absorber mounting portions 1261 and 1262 in the width direction.

Here, the auxiliary absorber placement portions 1261 and 1262 are processed into a groove shape that further increases the thickness of the refrigerant flow space 1205 from the inner surface of one side heat-conducting plate 1200-1 and the other side heat-conducting plate 1200-2 outward. A gap for inserting and placing the auxiliary absorber 301 can be provided between the auxiliary absorber placement portions 1261 and 1262 and the plurality of fixing ribs 1263, and the auxiliary absorber 301 can be placed through the gap.

The multiple fixing ribs 1263 described above can prevent the auxiliary absorber 301 from detaching from the thickness direction of the refrigerant flow space 1205.

In addition, according to another embodiment of the present invention, the active heat dissipation mechanism 1200 is made by joining a heat-conducting plate 1200-1 and a heat-conducting plate 1200-2, which are composed of two metal plate components, with their edge ends, including the portion corresponding to the press-in end 1201, in face contact with each other, and is made of SUS material with good elongation. As shown in FIG32, the multiple press-in portions 150 formed on the back side of the heat dissipation shell body 110 can be joined by a press-fit method.

At this point, preferably, at least half of the portion of the mating edge end portion corresponding to the first refrigerant flow path 1210 (or absorber 300) is press-fitted in such a manner that it is located further inward than the outer ends of the pair of grooves 150a, 150b forming the press-in portion 150.

As described above, the active heat dissipation mechanism 1200 according to another embodiment of the present invention is made of SUS material with good elongation. Even if the absorber 300 is made of a slightly heat-resistant fiber material such as non-woven fabric and is provided on the side of the first refrigerant flow path 1210, it has the advantage that it can be firmly fixed to the back of the heat dissipation shell body 110 by a simple pressing-fit method without the use of a welding process.

Furthermore, when comparing the active heat dissipation mechanism 1200 according to another embodiment of the present invention with the active heat dissipation mechanism 200D of the comparative example shown in FIG25(b) manufactured with the same joining method, even taking into account the same insertion thickness of the press-in portion 150, the first refrigerant flow path 1210 with a thickness of 0.7T (0.15T*2) minus the insertion thickness of at least 1T (0.5T*2) can be positioned close to the press-in portion 150. In fact, it is expected that the heat dissipation performance can be improved by the phase change of the refrigerant according to an embodiment of the present invention.

12 Comparison of comparative examples and experimental data of the present invention

Figure 33 is a curve (a) and a comparison graph (b) showing the temperature of the active heat dissipation mechanism 200D according to the comparison example of Figure 25 and the heating element 140 of the active heat dissipation mechanism 200 according to an embodiment of the present invention.

In order to confirm the heat dissipation performance of the active heat dissipation mechanism 200 according to an embodiment of the present invention, the applicant of the present invention respectively provided a comparative active heat dissipation mechanism 200D and an active heat dissipation mechanism 200 according to an embodiment of the present invention on the back of the same heat dissipation shell body 110 with the same number or the same shape of pressing parts 150. After installing five heating elements 140 with an input power of 25W on the motherboard, the temperature result value of each heating element 140 can be obtained as shown in FIG33.

Referring to Figure 33, the temperature difference between the comparative example (200D) and an embodiment (200) of each of the five heating elements 140 is a minimum of 0.2°C (refer to heating element 1) and a maximum of 2.1°C. It is known that the temperature measurement of the heating element of the active heat dissipation mechanism 200 according to an embodiment of the invention is lower.

The relatively low temperature of the measured heating element indicates that the heat dissipation performance of the active heat dissipation mechanism 200 according to an embodiment of the present invention is superior to that of the active heat dissipation mechanism 200D of the comparative example.

Figure 34 is a table showing the results of measuring the time it takes for two types of products (roll bonded fins (292*115 and 310*90)) in the existing RBFHP and an active heat dissipation mechanism (PTX (310*90)) according to an embodiment of the present invention to reach 50°C, 60°C and 70°C, respectively. Figure 35 is a graph comparing the temperature of a common aluminum heat dissipation fin AL6063_REF without refrigerant, estimated to be the temperature of two types of products (roll bonded fins (292*115 and 310*90)) in the existing RBFHP and an active heat dissipation mechanism (PTX (310*90)) according to an embodiment of the present invention, based on the location of each heat source (heating element).

The experiment used to obtain the results table in Figure 34 was as follows: After immersing a portion of the product of two shapes and specifications in the existing paper and a portion of the prototype of the active heat dissipation mechanism 200 according to an embodiment of the present invention in a water tank corresponding to the same heat source, the temperature rise time of the part not immersed in the water tank was obtained.

However, in order to confirm that the above results do not vary depending on the shape of the product itself, the RBFHP of the existing paper was used as two shapes, and the measurements were performed by manufacturing a prototype of the active heat dissipation mechanism 200 according to an embodiment of the present invention with the same shape (size).

Referring to Figure 34, the time required for two RBFHP products from an existing paper, constructed using the same aluminum material and utilizing the phase change of the refrigerant, to reach a specific temperature is approximately as follows: the product with a length greater than its width (roll bonding fin, 310*90) is faster than the other product (roll bonding fin, 292*115) (i.e., it reaches 50°C 1 second faster, 60°C 25 seconds faster, and 70°C 36 seconds faster).

This is likely due to the active diffusion flow of the vapor-phase refrigerant when the evaporation and condensation regions of the refrigerant are separated from each other, and the condensation region is further separated from the evaporation region or to some extent separated from each other. Therefore, the dimension in the width direction can be slightly reduced, which can be an important indicator for reducing the front and rear thickness of the antenna device (or electronic equipment).

Meanwhile, as shown in Figure 32, by comparing the temperature arrival times of the active heat dissipation mechanism 200 (PTX, 310*90) according to an embodiment of the present invention and a product of the same shape and specifications (roll bonding fin, 310*90) in the two RBFHP products mentioned above, it can be confirmed that the target temperature is reached in a very short time.

That is, in the case of the active heat dissipation mechanism 200 (PTX, 310*90) according to an embodiment of the present invention, the time to reach the maximum target temperature of 70°C is only 8 seconds. This is nearly 5 times faster than the time to reach the minimum target temperature of 50°C by the RBFHP roller bonding fin (310*90) product in the prior art, and nearly 10 times faster than the same maximum target temperature.

This demonstrates that, compared to the RBFHP roll-bonding fin (310*90) product in the prior art, the active heat dissipation mechanism 200 (PTX, 310*90) according to an embodiment of the invention performs gas-liquid circulation very actively in the refrigerant flow space.

That is, compared with the RBFHP product in the prior art, the active heat dissipation mechanism 200 according to an embodiment of the present invention is estimated to have minimized the spacing between the refrigerant flow space 205 (more specifically, the first refrigerant flow path 210) that substantially performs heat dissipation. Compared with the excellent thermal conductivity of the metal plate component material itself, the reduction in the spacing between the liquid phase refrigerant in the refrigerant filling the refrigerant flow space 205 and the heating element 140 is considered to be a good result of more realistically improving heat dissipation performance.

As mentioned above, by minimizing the time it takes for all condensation zones, except for the evaporation zone, to reach the target temperature, it is certainly possible to achieve heat dissipation faster and with higher performance.

Furthermore, the purpose of the test that yields the results in Figure 34 is to verify the installation suitability of the antenna device by comparing the temperature measurement results at each location of the heat source (heat generator) of the heat dissipation part formed along the vertical direction, which is typically as shown in the antenna device, without utilizing the phase change of the refrigerant in the active heat dissipation mechanism 200 (PTX, 310*90) according to an embodiment of the present invention, with ordinary aluminum heat dissipation fins (AL6063_REF) and two specifications of product roller bonded fins ((Roll Bonding Fin) 292*115 and 310*90) of RBFHP, which is presumed to be in the prior art.

In order to obtain accurate results, as shown in Figure 35, a heat source (heating body) with a uniform power input of 25W was placed at 5 locations with the same spacing above and below, and used as heat dissipation fins. The above 4 products were replaced and measurements were taken.

The results, as shown in Figure 35, show that in the case of ordinary aluminum heat dissipation fins (AL6063_REF), compared with the two specifications of RBFHP products (Roll Bonding Fin, 292*115 and 310*90) presumably in the existing paper, the temperature from the bottom heat source to the middle third heat source is relatively high, while the temperature of the fourth heat source and the top heat source is relatively low.

While it is difficult to pinpoint the exact cause of this result, it can be inferred that both RBFHP products in the existing paper are more significantly affected by the rising airflow of the seemingly relatively hot external air at higher positions. Therefore, the RBFHP in the existing paper is not optimally suited for all heat dissipation sections that are formed along a relatively long vertical direction, as shown in the antenna device. Preferably, it is designed to be cross-configured with the aforementioned common aluminum heat dissipation fins (AL6063_REF) to achieve optimal performance at each location.

In contrast, in the case of the active heat dissipation mechanism 200 (PTX, 310*90) according to an embodiment of the present invention, a good heat source temperature value is presented regardless of the height of the heat source. Therefore, the present invention has the advantage of being able to uniformly apply to all heat dissipation parts that are formed in a relatively long vertical direction, as shown in an antenna device.

As described above, the active heat dissipation mechanism 200 according to an embodiment of the present invention provides the following advantages: it can overcome the limitations on the use and selection of refrigerants that have recently emerged as international restrictions, and can maximize the heat dissipation performance of the product itself.

13 Manufacturing methods according to one embodiment and another embodiment of the present invention

Figure 36 is a flowchart illustrating a method of manufacturing an active heat dissipation mechanism according to one embodiment of the present invention. Figure 37 is a flowchart illustrating a method of manufacturing an active heat dissipation mechanism according to another embodiment of the present invention.

As shown in Figure 36, the manufacturing method of the active heat dissipation mechanism according to an embodiment of the present invention includes: a stamping process (S10) in which a heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) of thermally conductive material, which is a single component, is pressed together, thereby processing to a predetermined depth to recess the first refrigerant flow path 210, the second refrigerant flow path 220 and the third refrigerant flow path 230.

As shown in Figure 12, the stamping process (S10) can be defined as a process of manufacturing a single heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) with the same specifications and dimensions, under the condition that they are bent relative to each other with an arbitrary reference line T as the reference, so that the first refrigerant flow path 210 to the third refrigerant flow path 230 and the multiple strength reinforcing parts 240 are symmetrically formed.

Additionally, a method for manufacturing an active heat dissipation mechanism according to an embodiment of the present invention may include: a bending process (S20), after a stamping process (S10), folding one side of the heat-conducting plate 200-1 in the width direction and the other side of the heat-conducting plate 200-2 in the width direction, using an arbitrary reference line T as a reference for the first refrigerant flow path 210; and a joining process (S40), after the bending process (S20), joining the edge ends corresponding to the heat dissipation plate portions 203 of the one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2, the second refrigerant flow path 220, and a plurality of strength reinforcing portions 240 formed in the third refrigerant flow path 230 together.

Here, the joining process (S40) is performed for the purpose of sealing the refrigerant flow space 205 filled with refrigerant. The pressing end 201 on the side of the first refrigerant flow path 210 is the part that has been sealed by the bending process (S20). Therefore, as described above, it can be interpreted as a joining process along the edge end corresponding to the heat dissipation plate portion 203.

In addition, the manufacturing method of the active heat dissipation mechanism according to the embodiment of the present invention may also include: an absorber placement step (S30), in which an absorber 300 is placed at a position corresponding to the first refrigerant flow path 210 near the press-in end 201 to absorb and move the liquid phase refrigerant by capillary force before the joining step (S40).

At this time, the absorber 300 can be inserted into one of the openings at both ends of the opening at both ends of the first refrigerant flow path 210 formed in the bending process (S20), and then filled with refrigerant by the refrigerant filling process (S50) described later. After that, the internal refrigerant leakage is prevented by blocking one of the two ends of the opening.

More specifically, the absorber setting process (S30), which is performed during the bending process (S20), can be defined as the process of inserting the absorber 300 into a portion of the first refrigerant flow path 210 before the bending process (S20) is completed.

That is, if we refer to the diagram in FIG12, in the bending process (S20), as shown in FIG12(b), after bending one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2 at a certain angle with an arbitrary reference line T to form a part of the first refrigerant flow path 210, after the absorber 300 is disposed at the part where the first refrigerant flow path 210 is formed, the joining process (S40) shown in FIG10(d) can be performed by the additional bending process (S20) shown in FIG12(c).

At this time, if the bending process (S20) is completed, the absorber 300 can be stably fixed in the position corresponding to the first refrigerant flow path 210 by means of a plurality of absorber fixing guides 250 formed in the first refrigerant flow path 210.

Subsequently, when the joining process (S40) described above is performed along the edge ends of one side heat-conducting plate 200-1 and the other side heat-conducting plate 200-2, it is equivalent to the two ends of the length direction of one end and the other end of the pressing end 201 constituting the first refrigerant flow path 210 being in an open state. After one end of the two ends of the opening is blocked for the subsequent vacuuming process (not shown), after the refrigerant is filled by the subsequent refrigerant filling process (S50), the subsequent caulking finishing process (not shown) can be performed to cover the other uncaulked end of the two ends of the opening by the caulking operation, thereby preventing the internal refrigerant from leaking.

Meanwhile, the manufacturing method of the active heat dissipation mechanism according to the embodiment of the present invention includes: a refrigerant filling step (S50), after the joining step (S40), filling refrigerant through one end or the other end (i.e., one of the two ends of the opening) in the length direction of the first refrigerant flow path 210; and a heat dissipation mechanism fastening step (S60), after the refrigerant filling step (S50), pressing the mechanism into the pressing portion 150 of the heat dissipation shell body 110.

The refrigerant filling process (S50) can be achieved by one of the openings formed on one side and the other side (i.e., both ends) of the first refrigerant flow path 210 in the length direction, which completely seals the refrigerant after filling, thereby preventing refrigerant leakage.

However, the manufacturing method of the active heat dissipation mechanism according to the embodiments of the present invention may also include: a cleaning step (not shown), which, before the absorber placement step (S30), plugs and covers one of the openings formed at both ends of the first refrigerant flow path 210 and cleans the refrigerant flow space; and a vacuuming step (not shown), which, after the cleaning step and before or after the refrigerant filling step (S50), vacuums the refrigerant flow space through one of the unfilled openings formed at both ends of the first refrigerant flow path.

Here, the cleaning process can be achieved by sequentially immersing the active heat dissipation mechanism 200 according to an embodiment of the invention in a sedimentation tank, an ultrasonic tank, a rinsing tank, and a steam degreasing tank, and finally by drying to remove moisture. The vacuuming process is usually one of the following: vacuuming the inside of a device operated by vacuum by suction, filling it with refrigerant, heating and evaporating the refrigerant, and then vacuuming it again (heating vacuuming process); or filling it with refrigerant, temporarily freezing (solidifying) the refrigerant, and then vacuuming it (freezing vacuuming method).

For reference, in the vacuuming process of filling (injecting) refrigerant after vacuuming, which is the former method, the vacuum level changes during the filling (injection) of refrigerant. If a high vacuum is formed first and then the refrigerant is filled, it becomes a low vacuum state. In terms of low-cost process methods, it is mainly suitable for mass production and manufacturing of low-priced products where price is prioritized over quality.

Meanwhile, the filling (injection) of liquid-phase refrigerant and the vacuuming process after freezing the liquid-phase refrigerant, specifically, involves filling the liquid-phase refrigerant and freezing it after the first vacuuming, followed by a second vacuuming. Although this process is more complex than the first method, it has the advantages of faster reaction speed, minimizing NCG, and improving the Qmax of high-vacuum products. Furthermore, the freezing process of the liquid-phase refrigerant can reduce the capacity of the vacuum equipment and increase the vacuum exhaust speed, making it mainly suitable for small-batch production and the manufacture of high-priced products.

If the vacuuming process is completed, it may also include a caulking finishing process (not shown), in which the remaining opening of the remaining first refrigerant flow path 210 is caulked because the vacuuming process was not performed.

In particular, as shown in FIG13, an active heat dissipation mechanism 200 according to an embodiment of the present invention has a caulking end 207a and a caulking end 207b that protrude further outward from a portion of the press-in end 201 corresponding to one end and the other end of the first refrigerant flow path 210. During the caulking operation and the caulking finishing operation performed after the above-mentioned joining process (S40), the opening is covered by a predetermined caulking component made of elastic material, and the protruding part is completely sealed by pressing the caulking tool (not shown). As a part that is compressed again, the protruding part is cut and removed, thereby enabling the caulking operation to be performed.

Meanwhile, the manufacturing method of the active heat dissipation mechanism according to an embodiment of the present invention may also include at least one of the following: a leakage test step (not shown) to test whether the refrigerant leaks after the grouting finishing step; a performance check step (not shown) to check the performance of the active heat dissipation mechanism 200 of the present invention; and a reliability test step to test the reliability of the active heat dissipation mechanism 200 of the present invention.

Additionally, although not shown, a method for manufacturing an active heat dissipation mechanism according to an embodiment of the present invention may also include: a coating process (not shown), in which a hydrophobic coating material is formed on one surface of the heat-conducting plate body (one side heat-conducting plate (200-1) and the other side heat-conducting plate (200-2)) of the refrigerant flow space 205 filled by the refrigerant flow process (S50) before the bending process (S20) (or absorber setting process (S30)).

Here, we will assume that the refrigerant is water (distilled water) and limit the hydrophobic coating material to the raw material of the coating layer. However, depending on the type of refrigerant or the refrigerant flow path, hydrophilic coating materials can of course be used.

Furthermore, referring to Figure 37, the manufacturing method of the active heat dissipation mechanism 1200 according to another embodiment of the present invention can be different from the manufacturing method of the active heat dissipation mechanism 200, etc., according to one embodiment of the present invention, which includes a bending process (S20).

That is, the manufacturing method of the active heat dissipation mechanism 1200 according to another embodiment of the present invention may include: a stamping process (S10), in which two separate metal plate components are pressed together to form refrigerant flow spaces including a first refrigerant flow path 1210 and a second refrigerant flow path 1220 at predetermined depths; and a joining process (S40), in which the stamping process... (S10) Then, the edges of the heat-conducting plate bodies (1200-1, 1200-2) equipped with two separate metal plate components are joined together, thereby simultaneously forming a refrigerant flow space equivalent to the first refrigerant flow path 1210 and the second refrigerant flow path 1220; and a refrigerant filling process (S50) is performed to fill the refrigerant flow space with refrigerant.

According to an embodiment of the present invention, the manufacturing method of the active heat dissipation mechanism 200 etc. uses a single metal plate component to perform a stamping process (S10) to form a refrigerant flow space including a first refrigerant flow path 210 and a second refrigerant flow path 220, and through a bending process (S20), the edge end except for the side of the pressed end 201 is formed, and then manufactured in a jointing process (S40) to a jointable state.

In contrast, according to another embodiment of the present invention, the active heat dissipation mechanism 1200 is manufactured by forming portions corresponding to the first refrigerant flow path 1210 and the second refrigerant flow path 1220 by stamping two separate metal plate components together with their edge ends as their shapes through a stamping process (S10). Without the aforementioned bending process (S20), the edge ends of the two separate metal plate components can be directly joined by a joining process (S40) to achieve the joining.

Of course, in the manufacturing method of the active heat dissipation mechanism 1200 according to another embodiment of the present invention, the absorber setting process (S30) of setting absorber 300 or auxiliary absorber 301 can also be performed before the joining process (S40).

Furthermore, in the case where the active heat dissipation mechanism 1200 according to another embodiment of the present invention includes multiple strength reinforcements 1240, the joining process (S40) should be interpreted as a process that includes joining the edge ends of two separate metal plate components in a predetermined manner, while simultaneously joining the multiple strength reinforcements 1240 together.

However, in the manufacturing method of the active heat dissipation mechanism 1200 according to another embodiment of the present invention, in order to perform the cleaning process and vacuuming process after the joining process (S40), after forming the part corresponding to the pressing end 1201 side with one end and the other end open, a subsequent caulking and finishing process can be performed.

According to the embodiments of the present invention, the active heat dissipation mechanisms 200 and 1200 having the above-described configuration achieve heat transfer and dissipation through the phase change of the refrigerant actively filled inside. Since they can overcome the material limitations of the existing heat dissipation fins and achieve higher heat dissipation performance, they have the advantage of significantly improving the performance of antenna devices or similar electronic equipment.

The heat dissipation mechanism according to one embodiment of the present invention has been described in detail above with reference to the accompanying drawings. However, the embodiments of the present invention are not limited to the one described above, and it is natural that those skilled in the art to which the present invention pertains can make various modifications and implement them within equivalent scopes. Therefore, the true scope of the present invention should be determined by the scope of the patent application.

Industrial utilization potential

This invention provides an active heat dissipation mechanism that can actively transfer heat generated from a heat-generating device (e.g., electronic equipment) through a phase change of a refrigerant that is more efficient than the thermal conductivity of the material itself, thereby improving heat dissipation performance.

10: Antenna housing body 11: Heat dissipation fins 15: Antenna plate 17: Radiating element 40: PSU plate 50: Antenna cover panel 100: Antenna device 110: Heat dissipation housing body 120: Main board 125: Flip cover 130: Inverted triangle area 135: Heat transfer medium 140: Heating element 145: Heating coupling surface 150: Press-in part 150a, 150b: Ribs 170: Groove structure 200, 200D, 200T-1, 200T-2, 200T-3, 200T-4, 200T-5, 200T-6: Active heat dissipation mechanism 200A: One side heat conduction plate 200B: The other side heat conduction plate 200D-1: One side heat-conducting plate 200D-2: The other side heat-conducting plate 200F, 200F-1, 200F-2: Fixed heat dissipation fins 200-1: One side heat-conducting plate 200-2: The other side heat-conducting plate 201, 1201: Press-in end 203, 1203: Heat dissipation plate portion 205, 1205: Refrigerant flow space 207a: One side caulking end 207b: The other side caulking end 210, 1210: First refrigerant flow path 215, 1215: Inclined guide 220, 1220: Second refrigerant flow path 230, 1230: Third refrigerant flow path 240, 1240: Multiple reinforcement sections; 240': A portion of the multiple reinforcement sections; 241: Linear reinforcement section; 241P: Linear pattern section; 242: Dotted reinforcement section; 242P: Dotted pattern section; 250: Absorber fixing guide; 300: Absorber; 301, 301-1A, 301-1B, 301-2A, 301-2B: Auxiliary absorber; 301-1: Upper auxiliary absorber; 301-2: Lower auxiliary absorber; 310: Absorber main body; 320, 321, 322: Frame retaining section; 350: Main body absorber; 1200: Active heat dissipation mechanism; 1200-1: One side heat conduction plate; 1200-2: The other side heat conduction plate. 1261, 1262: Auxiliary absorber mounting section; 1263: Multiple fixing ribs; R1, R2: Radius; S10: Stamping process; S20: Bending process; S30: Absorber mounting process; S40: Joining process; S50: Refrigerant filling process; S60: Heat dissipation mechanism fastening process; T: Arbitrary reference line.

Figure 1 is an exploded perspective view showing an example of an antenna device according to the prior art.

Figure 2 is a schematic diagram showing the manufacturing process of the Roll Bond Flat Heat Pipe (hereinafter referred to as "RBFHP") described in the existing paper (see Figure 4 of the existing paper).

Figure 3 is a schematic diagram of the RBFHP test device in Figure 1 (Figure 6 in the existing paper).

Figures 4a and 4b are perspective views showing two different configurations of the rear portion of the antenna device of an active heat dissipation mechanism according to an embodiment of the present invention.

Figures 5a and 5b are exploded perspective views showing the back of the antenna device of Figures 4a and 4b, respectively.

Figure 6 is an exploded perspective view showing the configuration of an active heat dissipation mechanism according to an embodiment of the present invention for the press-in portion formed on the back side of the antenna device of Figure 5a.

Figure 7 is a cross-sectional view and a partially enlarged view showing the configuration of an active heat dissipation mechanism according to an embodiment of the present invention with respect to the press-in portion of Figure 6.

Figure 8 is a cross-sectional perspective view and a partially enlarged view of an active heat dissipation mechanism according to an embodiment of the present invention, showing the configuration of the press-in portion of Figure 6.

Figure 9 is a cross-sectional perspective view showing the internal structure of a single active heat dissipation mechanism in the structure of Figure 8.

Figure 10 is a rear side sectional view showing the internal structure of the groove structure used to illustrate Figures 4a and 5a.

Figure 11 is a partial perspective view showing the configuration of an active heat dissipation mechanism according to an embodiment of the present invention with respect to the press-in portion in the structure of Figures 4a and 5a.

Figure 12 is a perspective view showing the manufacturing process of an active heat dissipation mechanism according to an embodiment of the present invention.

Figure 13 is a plan view of the heat-conducting plate body before bending in the structure of an active heat dissipation mechanism according to an embodiment of the present invention shown in Figure 12.

Figure 14 is an enlarged perspective view and an enlarged plan view showing an active heat dissipation mechanism and its structure according to an embodiment of the present invention, including the press-in end and its variations.

Figure 15 is a cross-sectional view showing the state of the absorber removal in the structures (d) and (e) of Figure 14.

Figures 16 and 17 are perspective views and enlarged views of an active heat dissipation mechanism according to an embodiment of the present invention before and after bending.

Figure 18 is a plan view of an active heat dissipation mechanism according to an embodiment of the present invention after bending.

Figure 19 is a cross-sectional view taken along line C-C in Figure 18.

Figures 20 and 21 are perspective views illustrating an example of an absorber in the structure of an active heat dissipation mechanism according to an embodiment of the present invention.

Figures 22a to 22d are unfolded views of the heat-conducting plate body before bending in the first (200T-1) to the fourth (200T-4) variants of the partial structure according to an embodiment of the present invention.

Figure 23 is an unfolded view of the heat-conducting plate body of the fifth variant (200T-5) which is adapted to the various variants of Figures 22a to 22d.

Figure 24 is an unfolded view showing the heat-conducting plate body of the sixth variant example.

Figure 25 is a cross-sectional view showing the configuration of the press-in portion of the comparative example (200D, (a)) and an embodiment of the present invention (200, (b)).

Figure 26 is a cross-sectional view taken along line A-A in Figure 4b and a partial enlarged view.

Figure 27 is a cross-sectional three-dimensional view taken along line A-A in Figure 4b and a partial enlarged view.

Figure 28 is a cross-sectional three-dimensional view taken along line B-B in Figure 4b and a partial enlarged view.

Figure 29 is a perspective view showing an active heat dissipation mechanism according to another embodiment of the present invention.

Figure 30 is an exploded perspective view of Figure 29.

Figure 31 is a cut-through perspective view (a), a partial enlarged view (b), and a cross-sectional view (c) of Figure 29.

Figure 32 is a cross-sectional view showing the connection state of the active heat dissipation mechanism with respect to the press-in portion according to another embodiment of the present invention.

Figure 33 is a curve (a) and a comparison graph (b) showing the temperature of the active heat dissipation mechanism 200D according to the comparative example of Figure 25 and the heating element 140 of the active heat dissipation mechanism 200 according to an embodiment of the present invention.

Figure 34 is a table showing the results of measuring the time taken for the active heat dissipation mechanism 200D, a comparative example of an active heat dissipation mechanism 200 made of aluminum heat-conducting plate body (200D-1, 200D-2), and the active heat dissipation mechanism 200 made of SUS material according to an embodiment of the present invention to reach 50, 60 and 70 respectively.

Figure 35 is a graph comparing the temperature of a common aluminum heat dissipation fin AL6063_REF without refrigerant, estimated to be two specifications of the RBFHP product (roller-jointed fins (292*115 and 310*90)) from an existing paper, and an active heat dissipation mechanism (PTX (310*90)) according to an embodiment of the present invention, based on the location of each heat source (heating element).

Figure 36 is a flowchart illustrating a method for manufacturing an active heat dissipation mechanism according to an embodiment of the present invention.

Figure 37 is a flowchart illustrating a method for manufacturing an active heat dissipation mechanism according to another embodiment of the present invention.

50: Antenna cover panel

100: Antenna Device

110: Main body of the heatsink casing

130: Inverted triangle area

150: Pressing section

170: Groove structure

200: Active heat dissipation mechanism

200F-1, 200F-2: Fixed heat dissipation fins

Claims (17)

An active heat dissipation mechanism is characterized by comprising: a heat-conducting plate body having a refrigerant flow space filled with refrigerant, wherein the heat-conducting plate body comprises: a one-sided heat-conducting plate, formed by a plate component, forming one side of the refrigerant flow space in the thickness direction; and a other-sided heat-conducting plate, formed by a plate component, forming another side of the refrigerant flow space in the thickness direction, wherein at least one of the one-sided heat-conducting plate and the other-sided heat-conducting plate has a strength reinforcing portion formed by recessing the plate component in a manner that protrudes into the refrigerant flow space. The active heat dissipation mechanism as described in claim 1, wherein the plate component is constructed of a metal plate component, the metal plate component being made of stainless steel. The active heat dissipation mechanism as described in claim 1, wherein the refrigerant flow space includes: a first refrigerant flow path, which obtains heat from the heat-generating body that is the object of heat dissipation through the heat-conducting plate body; and a plurality of second refrigerant flow paths, which are connected to the first refrigerant flow path and uniformly supply liquid refrigerant that has condensed from gaseous to liquid state to the side of the first refrigerant flow path. The active heat dissipation mechanism as described in claim 3, wherein the second refrigerant flow path is formed along the direction of gravity or inclined relative to the direction of gravity. As described in claim 3, the active heat dissipation mechanism wherein the second refrigerant flow path is defined between a plurality of inclined guides that symmetrically protrude from the opposite surface of the heat-conducting plate body toward the inside of the refrigerant flow space. The active heat dissipation mechanism as described in claim 5, wherein at least one of one end and the other end of the second refrigerant flow path or the plurality of inclined guides is connected to the first refrigerant flow path, and the one end and the other end are connected in a straight line. The active heat dissipation mechanism as described in claim 1, wherein the one-sided heat-conducting plate and the other-sided heat-conducting plate are constructed using a single metal plate component, and the refrigerant flow space is formed by bending the single metal plate component. The active heat dissipation mechanism as described in claim 1, wherein the one-sided heat-conducting plate and the other-sided heat-conducting plate are composed of two separate metal plate components, and the refrigerant flow space is formed by the joining of the two separate metal plate components. The active heat dissipation mechanism as described in claim 3, wherein the strength reinforcement is stamped to be at least less than the minimum thickness within the refrigerant flow space formed by the plurality of second refrigerant flow paths. The active heat dissipation mechanism as described in claim 3, wherein the second refrigerant flow path is formed to suppress the dispersion flow toward the adjacent side of the second refrigerant flow path due to surface tension or gravity after the liquid refrigerant has condensed to a size greater than a predetermined size. As described in claim 5, the active heat dissipation mechanism further includes: a plurality of third refrigerant flow paths, wherein the plurality of inclined guides are formed in the opposite surfaces of the heat-conducting plate body, and are defined as unjoined and spaced apart from each other in the refrigerant flow space. The active heat dissipation mechanism as described in claim 3 further includes: an absorber disposed in the first refrigerant flow path, which absorbs the liquid refrigerant in the refrigerant state and then moves in a direction different from the direction of gravity. The active heat dissipation mechanism as described in claim 12, wherein the absorber comprises one of the following: a non-woven fabric having a plurality of pores, a non-woven fabric internally bonded to a woven body of metal material, and a sintered metal body formed by sintering metal material. The active heat dissipation mechanism as described in claim 1, wherein the inner surface forming the refrigerant flow space is coated with a hydrophobic coating material that reduces adhesion based on the surface tension of the refrigerant. As described in claim 1, the active heat dissipation mechanism comprises a refrigerant flow space formed inside the heat-conducting plate on one side and the heat-conducting plate on the other side, an infeed end and a heat dissipation plate portion formed on the outside of the heat-conducting plate on one side and the heat-conducting plate on the other side, the infeed end being coupled to the infeed portion formed on the heat dissipation object, and the heat dissipation plate portion condensing the gaseous refrigerant in the refrigerant flow space through heat exchange with the outside air. The active heat dissipation mechanism as described in claim 15, wherein, in the heat dissipation plate portion, the respective edge ends of the one-sided heat-conducting plate and the other-sided heat-conducting plate are joined together in a predetermined engagement manner to form a sealed refrigerant flow space. The active heat dissipation mechanism as described in claim 1, wherein the refrigerant is distilled water that can change from a liquid state to a gaseous state or from a gaseous state to a liquid state by means of the thermal conductivity of the heat-conducting plate body itself.