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TWI913875B - Wafer processing equipment - Google Patents

Wafer processing equipment

Info

Publication number
TWI913875B
TWI913875B TW113132882A TW113132882A TWI913875B TW I913875 B TWI913875 B TW I913875B TW 113132882 A TW113132882 A TW 113132882A TW 113132882 A TW113132882 A TW 113132882A TW I913875 B TWI913875 B TW I913875B
Authority
TW
Taiwan
Prior art keywords
processing equipment
wafer processing
wafer
equipment
processing
Prior art date
Application number
TW113132882A
Other languages
Chinese (zh)
Other versions
TW202512297A (en
Inventor
白木智大
高妻豊
廣實一幸
Original Assignee
日商日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2023/032520 external-priority patent/WO2025052582A1/en
Application filed by 日商日立全球先端科技股份有限公司 filed Critical 日商日立全球先端科技股份有限公司
Publication of TW202512297A publication Critical patent/TW202512297A/en
Application granted granted Critical
Publication of TWI913875B publication Critical patent/TWI913875B/en

Links

TW113132882A 2023-09-06 2024-08-30 Wafer processing equipment TWI913875B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2023/032520 WO2025052582A1 (en) 2023-09-06 2023-09-06 Wafer processing device
WOPCT/JP2023/032520 2023-09-06

Publications (2)

Publication Number Publication Date
TW202512297A TW202512297A (en) 2025-03-16
TWI913875B true TWI913875B (en) 2026-02-01

Family

ID=

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080069951A1 (en) 2006-09-15 2008-03-20 Juan Chacin Wafer processing hardware for epitaxial deposition with reduced auto-doping and backside defects
US20090056629A1 (en) 2007-09-05 2009-03-05 Applied Materials, Inc. Cathode liner with wafer edge gas injection in a plasma reactor chamber
US20120171870A1 (en) 2010-12-30 2012-07-05 Veeco Instruments Inc. Wafer processing with carrier extension
TW201801130A (en) 2016-03-28 2018-01-01 日立全球先端科技股份有限公司 Plasma processing device and plasma processing method
TW202324597A (en) 2019-01-09 2023-06-16 日商東京威力科創股份有限公司 Plasma processing appratus and ring assembly thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080069951A1 (en) 2006-09-15 2008-03-20 Juan Chacin Wafer processing hardware for epitaxial deposition with reduced auto-doping and backside defects
US20090056629A1 (en) 2007-09-05 2009-03-05 Applied Materials, Inc. Cathode liner with wafer edge gas injection in a plasma reactor chamber
US20120171870A1 (en) 2010-12-30 2012-07-05 Veeco Instruments Inc. Wafer processing with carrier extension
TW201801130A (en) 2016-03-28 2018-01-01 日立全球先端科技股份有限公司 Plasma processing device and plasma processing method
TW202324597A (en) 2019-01-09 2023-06-16 日商東京威力科創股份有限公司 Plasma processing appratus and ring assembly thereof

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