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TWI913515B - Workpiece star wheel - Google Patents

Workpiece star wheel

Info

Publication number
TWI913515B
TWI913515B TW111139646A TW111139646A TWI913515B TW I913515 B TWI913515 B TW I913515B TW 111139646 A TW111139646 A TW 111139646A TW 111139646 A TW111139646 A TW 111139646A TW I913515 B TWI913515 B TW I913515B
Authority
TW
Taiwan
Prior art keywords
workpiece
star wheel
star
wheel
workpiece star
Prior art date
Application number
TW111139646A
Other languages
Chinese (zh)
Other versions
TW202318498A (en
Inventor
岩本陽平
田山遊
田中敬
加藤剛敏
Original Assignee
日商創技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021171876A external-priority patent/JP2023061759A/en
Application filed by 日商創技股份有限公司 filed Critical 日商創技股份有限公司
Publication of TW202318498A publication Critical patent/TW202318498A/en
Application granted granted Critical
Publication of TWI913515B publication Critical patent/TWI913515B/en

Links

TW111139646A 2021-10-20 2022-10-19 Workpiece star wheel TWI913515B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-171876 2021-10-20
JP2021171876A JP2023061759A (en) 2021-10-20 2021-10-20 work carrier

Publications (2)

Publication Number Publication Date
TW202318498A TW202318498A (en) 2023-05-01
TWI913515B true TWI913515B (en) 2026-02-01

Family

ID=

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080318493A1 (en) 2004-08-02 2008-12-25 Showa Denko K.K. Method of Manufacturing Polishing Carrier and Silicon Substrate for Magnetic Recording Medium, and Silicon Substrate for Magnetic Recording Medium
US20100210188A1 (en) 2009-02-18 2010-08-19 Siltronic Ag Carrier For Holding Semiconductor Wafers During A Double-Side Polishing Of The Semiconductor Wafers
JP2016022542A (en) 2014-07-17 2016-02-08 信越半導体株式会社 Carrier for holding wafer, double-sided polishing method of wafer using the same, and evaluation method and design method of carrier for holding wafer
TW201912304A (en) 2017-09-06 2019-04-01 日商創技股份有限公司 Double-sided grinding device for the object to be used for grinding
JP2019058994A (en) 2017-09-27 2019-04-18 スピードファム株式会社 Manufacturing method of workpiece carrier and widening member for polishing of workpiece carrier

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080318493A1 (en) 2004-08-02 2008-12-25 Showa Denko K.K. Method of Manufacturing Polishing Carrier and Silicon Substrate for Magnetic Recording Medium, and Silicon Substrate for Magnetic Recording Medium
US20100210188A1 (en) 2009-02-18 2010-08-19 Siltronic Ag Carrier For Holding Semiconductor Wafers During A Double-Side Polishing Of The Semiconductor Wafers
JP2016022542A (en) 2014-07-17 2016-02-08 信越半導体株式会社 Carrier for holding wafer, double-sided polishing method of wafer using the same, and evaluation method and design method of carrier for holding wafer
TW201912304A (en) 2017-09-06 2019-04-01 日商創技股份有限公司 Double-sided grinding device for the object to be used for grinding
JP2019058994A (en) 2017-09-27 2019-04-18 スピードファム株式会社 Manufacturing method of workpiece carrier and widening member for polishing of workpiece carrier

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