TWI913515B - Workpiece star wheel - Google Patents
Workpiece star wheelInfo
- Publication number
- TWI913515B TWI913515B TW111139646A TW111139646A TWI913515B TW I913515 B TWI913515 B TW I913515B TW 111139646 A TW111139646 A TW 111139646A TW 111139646 A TW111139646 A TW 111139646A TW I913515 B TWI913515 B TW I913515B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- star wheel
- star
- wheel
- workpiece star
- Prior art date
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-171876 | 2021-10-20 | ||
| JP2021171876A JP2023061759A (en) | 2021-10-20 | 2021-10-20 | work carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202318498A TW202318498A (en) | 2023-05-01 |
| TWI913515B true TWI913515B (en) | 2026-02-01 |
Family
ID=
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080318493A1 (en) | 2004-08-02 | 2008-12-25 | Showa Denko K.K. | Method of Manufacturing Polishing Carrier and Silicon Substrate for Magnetic Recording Medium, and Silicon Substrate for Magnetic Recording Medium |
| US20100210188A1 (en) | 2009-02-18 | 2010-08-19 | Siltronic Ag | Carrier For Holding Semiconductor Wafers During A Double-Side Polishing Of The Semiconductor Wafers |
| JP2016022542A (en) | 2014-07-17 | 2016-02-08 | 信越半導体株式会社 | Carrier for holding wafer, double-sided polishing method of wafer using the same, and evaluation method and design method of carrier for holding wafer |
| TW201912304A (en) | 2017-09-06 | 2019-04-01 | 日商創技股份有限公司 | Double-sided grinding device for the object to be used for grinding |
| JP2019058994A (en) | 2017-09-27 | 2019-04-18 | スピードファム株式会社 | Manufacturing method of workpiece carrier and widening member for polishing of workpiece carrier |
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080318493A1 (en) | 2004-08-02 | 2008-12-25 | Showa Denko K.K. | Method of Manufacturing Polishing Carrier and Silicon Substrate for Magnetic Recording Medium, and Silicon Substrate for Magnetic Recording Medium |
| US20100210188A1 (en) | 2009-02-18 | 2010-08-19 | Siltronic Ag | Carrier For Holding Semiconductor Wafers During A Double-Side Polishing Of The Semiconductor Wafers |
| JP2016022542A (en) | 2014-07-17 | 2016-02-08 | 信越半導体株式会社 | Carrier for holding wafer, double-sided polishing method of wafer using the same, and evaluation method and design method of carrier for holding wafer |
| TW201912304A (en) | 2017-09-06 | 2019-04-01 | 日商創技股份有限公司 | Double-sided grinding device for the object to be used for grinding |
| JP2019058994A (en) | 2017-09-27 | 2019-04-18 | スピードファム株式会社 | Manufacturing method of workpiece carrier and widening member for polishing of workpiece carrier |
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