TWI912993B - A wafer polishing and grinding system and method - Google Patents

Abstract

This invention discloses a wafer polishing and grinding system, including a frame and a loading unit, a transfer unit, a processing unit, and a pickup unit mounted on the frame. The first pickup unit of the pickup unit picks up wafers from the loading unit, and a robotic arm drives a robotic hand to place the wafers in the transfer unit. The transfer unit positions the wafers. Multiple pickup heads of the second pickup unit pick up multiple wafers positioned in the transfer unit, and the robotic arm drives the robotic hand to transfer the wafers to the processing position in the processing unit. The processing unit performs polishing and grinding on the wafers. The robotic hand of this invention can pick up wafers from both the loading unit and the transfer unit, and the second pickup unit includes multiple pickup heads, allowing for the simultaneous pickup of multiple wafers, thus improving production efficiency and wafer quality.

Description

A wafer polishing and grinding system and method

This invention relates to the field of wafer production equipment and related supporting facilities, and in particular to a wafer polishing system and method.

A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. In the wafer production process, one process is to polish and grind both sides of the wafer. There are many wafer polishing and grinding technologies. The polishing and grinding method commonly used in the modern semiconductor industry is chemical-mechanical polishing (CMP). Using chemical-mechanical polishing, the etched surface of the wafer is flattened to a nanometer-level smoothness, while also taking into account various indicators such as warpage and flatness of the silicon wafer. This avoids problems encountered by the silicon wafer in the lithography etching process in high-end applications. Therefore, wafer polishing and grinding is an important part of semiconductor processing technology.

For double-sided processing units, wafer polishing and grinding requires placing the wafer into the groove of the carrier. In the current technology, this process is done manually, which has low production efficiency, high labor intensity for operators, and can easily affect wafer quality.

The purpose of this invention is to provide a wafer polishing and grinding system and method to solve the problems existing in the prior art, improve the efficiency of wafer polishing and grinding, ensure the quality of wafer processing, and at the same time reduce the labor intensity of operators.

To achieve the above objectives, the present invention provides the following solution: The present invention provides a wafer polishing and grinding system, including a rack and: a loading unit capable of storing multiple stacked wafers; a transfer unit capable of carrying and positioning a single wafer; a processing unit capable of polishing and grinding the wafer; The picking unit includes a robotic arm and a robotic hand. The robotic arm is mounted on the frame, and the robotic hand is connected to the robotic arm. The robotic arm can move the robotic hand in space. The robotic hand includes a first picking part and a second picking part. The first picking part has a flat structure and is used to pick up wafers stored in the loading unit. The first picking part can also pick up wafers to be positioned in the transfer unit. The second picking part includes multiple picking heads to pick up wafers positioned in the transfer unit and place the picked-up wafers into the processing position of the processing unit. After wafer processing is completed, the second picking part can also remove the processed wafers.

Preferably, the first pickup unit includes an outer clamping plate and an inner clamping plate, both the outer clamping plate and the inner clamping plate having clamping slots adapted to the wafer, and the clamping slots of the outer clamping plate and the inner clamping plate being disposed opposite to each other. The inner clamping plate is slidably connected to the outer clamping plate, and the inner clamping plate is connected to a clamping driver. The outer clamping plate is a V-shaped plate with its opening facing the side away from the inner clamping plate.

Preferably, the first pickup section has a Y-shaped plate structure and is provided with multiple adsorption elements to adsorb wafers. The adsorption elements are connected to an external adsorption driver.

Preferably, the second pickup unit includes a mounting base plate, both the mounting base plate and the first pickup unit are connected to the robotic arm, the pickup head is connected to the mounting base plate, the pickup head is provided with a plurality of suction cups, the suction cups are connected to an external adsorption driver, and the end of the mounting base plate connected to the pickup head is inclined.

Preferably, the mounting base plate has a star-shaped structure, the mounting base plate includes multiple support plates, and the pickup head is connected to the support plates and the two correspond to each other.

Preferably, the transfer unit includes a positioning mechanism mounted on the rack. The positioning mechanism includes a flipping station, a positioning station, and a storage station. The flipping station can fix and rotate the wafer. There are multiple positioning stations. Each positioning station includes circumferentially distributed positioning pins. Each positioning station is also equipped with a detection sensor to detect whether a wafer is being held on the positioning station and whether the wafer is tilted or offset. The second pickup unit can pick up the wafer from the positioning station. The storage station is located below the positioning stations and corresponds one-to-one. The storage station is used to store the wafer to be positioned. The first pickup unit can pick up the wafer from the storage station.

Preferably, the transfer unit further includes a cache mechanism, which comprises a cache base, a motion mechanism, and a cache platform. The cache base is mounted on the frame, and the cache platform is connected to the cache base via the motion mechanism, which enables the cache platform to move in three-dimensional space. The cache stage has a cache station, which includes a cache fork arm and a cache positioning block. The cache fork arm has a flat structure, and the cache positioning block is slidably connected to the cache fork arm. The cache positioning block is connected to a cache driver. Both the cache fork arm and the cache positioning block have cache positioning slots adapted to the wafer. The cache positioning slots are U-shaped, and the openings of the cache positioning slots of the cache fork arm and the cache positioning block are arranged opposite to each other. Multiple cache positioning slots cooperate to fix the wafer. The cache station corresponds one-to-one with the storage station, so that the cache stage fixes the wafer at the storage station and moves the wafer to the positioning station.

Preferably, the wafer polishing system further includes a feeding unit and a feeding docking unit. The feeding unit can remove the processed wafer from the processing unit and transfer it to the feeding docking unit. The feeding docking unit includes a buffer tank and a feeding tank. The buffer tank is located close to the processing unit. The feeding unit can remove the wafer from the processing unit and transport it to the buffer tank. The feeding unit can also transfer the wafer from the buffer tank to the feeding tank. The feeding tank can be transported to subsequent processing steps.

Preferably, the wafer polishing system further includes a control unit, wherein the loading unit, the transfer unit, the processing unit, and the pickup unit are all communicatively connected to the control unit; the processing unit further includes a visual positioning mechanism capable of collecting position information of the processing station.

This invention also provides a wafer polishing and grinding method, utilizing the aforementioned wafer polishing and grinding system. The first pickup unit of the pickup unit picks up the wafer from the loading unit, and the robotic arm drives the robotic hand to place the wafer in the transfer unit. The transfer unit positions the wafer, and multiple pickup heads of the second pickup unit pick up multiple wafers positioned by the transfer unit. The robotic arm drives the robotic hand to transfer the wafer to the processing position of the processing unit. The processing unit performs polishing and grinding on the wafer.

This invention achieves the following technical effects compared to existing technologies: The wafer polishing and grinding system of this invention includes a rack and a loading unit, a transfer unit, a processing unit, and a pick-up unit mounted on the rack. The loading unit can store multiple stacked wafers; the transfer unit can carry and position a single wafer; the processing unit can polish and grind the wafer; the pick-up unit includes a robotic arm and a robotic hand, the robotic arm being mounted on the rack and the robotic hand being connected to the robotic arm. The robotic arm can drive the robotic hand to move in space; the robotic hand includes a first picking unit and a second picking unit. The first picking unit has a flat structure to pick up wafers stored in the loading unit. The first picking unit can also pick up wafers to be positioned in the transfer unit. The second picking unit includes multiple picking heads to pick up wafers positioned in the transfer unit and place the picked-up wafers into the processing position of the processing unit. After the wafer processing is completed, the second picking unit can also remove the processed wafers.

In the wafer polishing and grinding system of this invention, during operation, the first pickup unit of the pickup unit picks up the wafer from the loading unit, and the robotic arm drives the robotic arm to move to place the wafer in the transfer unit; the transfer unit positions the wafer, and multiple pickup heads of the second pickup unit pick up multiple wafers after they have been positioned by the transfer unit, and the robotic arm drives the robotic arm to move to transfer the wafer to the processing position of the processing unit; the processing unit performs polishing and grinding on the wafer. The robotic arm of this invention includes a first picking unit and a second picking unit, thereby enabling the robotic arm to pick up wafers from the loading unit and the transfer unit, improving picking efficiency. The second picking unit includes multiple picking heads, which can pick up multiple wafers at the same time and cooperate with the robotic arm to transfer the wafers to the processing position of the processing unit, so as to realize the simultaneous feeding of multiple processing positions in the processing unit, improving production efficiency. Furthermore, the combination of robotic arm and robotic arm in picking up materials effectively avoids wafer damage and improves wafer quality.

The present invention also provides a wafer polishing and grinding method, which, by utilizing the above-mentioned wafer polishing and grinding system, improves production efficiency, ensures wafer processing quality, and reduces the labor burden of operators.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative labor are within the scope of protection of the present invention.

The purpose of this invention is to provide a wafer polishing and grinding system and method to solve the problems existing in the prior art, improve the efficiency of wafer polishing and grinding, ensure the quality of wafer processing, and at the same time reduce the labor intensity of operators.

To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

Implementation Example 1

This embodiment provides a wafer polishing and grinding system, including a rack 1 and a loading unit 2, a transfer unit 3, a processing unit 4, and a pick-up unit 5 disposed on the rack 1. The loading unit 2 can store multiple stacked wafers; the transfer unit 3 can carry and position a single wafer; the processing unit 4 can polish and grind the wafers; the pick-up unit 5 includes a robotic arm and a robotic hand. The robotic arm is disposed on the rack 1, and the robotic hand is connected to the robotic arm. The robotic arm can drive the robotic hand to move in space. The robotic arm includes a first picking unit 501 and a second picking unit 502. The first picking unit 501 has a flat structure to pick up wafers stored in the loading unit 2. The first picking unit 501 can also pick up wafers to be positioned in the transfer unit 3. The second picking unit 502 includes multiple picking heads 503 to pick up wafers positioned in the transfer unit 3 and place the picked-up wafers into the processing position of the processing unit 4. After the wafer processing is completed, the second picking unit 502 can also remove the processed wafers.

In the wafer polishing and grinding system of the present invention, during operation, the first pickup unit 501 of the pickup unit 5 picks up the wafer from the loading unit 2, and the robotic arm drives the robotic arm to move to place the wafer in the transfer unit 3; the transfer unit 3 positions the wafer, and the multiple pickup heads 503 of the second pickup unit 502 pick up the multiple wafers after they are positioned in the transfer unit 3, and the robotic arm drives the robotic arm to move to transfer the wafer to the processing position of the processing unit 4; the processing unit 4 performs polishing and grinding on the wafer. The robotic arm of this invention includes a first picking unit 501 and a second picking unit 502, thereby enabling the robotic arm to pick up wafers from the loading unit 2 and the transfer unit 3, improving picking efficiency. The second picking unit 502 includes multiple picking heads 503, which can pick up multiple wafers at the same time and cooperate with the robotic arm to transfer the wafers to the processing position of the processing unit 4, so as to realize the simultaneous feeding of multiple processing positions in the processing unit 4, improving production efficiency. Furthermore, the combination of robotic arm and robotic arm in picking up materials effectively avoids wafer damage and improves wafer quality.

In this specific embodiment, the first pickup unit 501 includes an outer clamping plate 504 and an inner clamping plate 505. Both the outer clamping plate 504 and the inner clamping plate 505 have clamping grooves 506 adapted to the wafer, and the clamping grooves 506 of the outer clamping plate 504 and the inner clamping plate 505 are arranged opposite to each other. The inner clamping plate 505 is slidably connected to the outer clamping plate 504. The inner clamping plate 505 is connected to a clamping drive 511. The outer clamping plate 504 is a V-shaped plate and the opening direction is towards the side away from the inner clamping plate 505. The clamping drive 511 drives the inner clamping plate 505 to slide, adjusting the distance between the outer clamping plate 504 and the inner clamping plate 505. This allows the opposing clamping slots 506 on the outer and inner clamping plates 504 to fix the wafer, achieving the purpose of wafer pickup. The outer clamping plate 504 has a plate-like structure, allowing it to extend into the gaps between adjacent wafers in the loading unit 2, thus facilitating smooth wafer pickup. The outer clamping plate 504 is V-shaped, and clamping slots 506 can be provided at both ends of the opening of the V-shaped outer clamping plate 504 for multi-point wafer fixation, improving pickup reliability. In practical applications, the clamping drive 511 can be a hydraulic cylinder or a pneumatic cylinder.

Specifically, the second pickup unit 502 includes a mounting substrate 507. Both the mounting substrate 507 and the first pickup unit 501 are connected to a robotic arm. The pickup head 503 is connected to the mounting substrate 507. Each pickup head 503 is equipped with multiple suction cups 508, employing a multi-point adsorption method to enhance the adsorption and fixation effect on the wafer. The suction cups 508 are connected to an external adsorption driver, which can perform air extraction and inflation operations on the suction cups 508. When air is extracted from the suction cups 508, the suction cups 508 adsorb the wafer. When it is necessary to place the wafer at the processing position of the processing unit 4, the adsorption driver inflates the suction cups 508 to separate them from the wafer. In this specific embodiment, the pickup head 503 is connected to the bottom of the mounting substrate 507, and the suction cup 508 is also disposed at the bottom of the pickup head 503 to ensure smooth pickup and release of wafers. In order to avoid interference, the end of the mounting substrate 507 connected to the pickup head 503 is inclined to provide sufficient operating space for the pickup head 503 and improve the working reliability of the robot.

More specifically, the mounting base plate 507 has a star-shaped structure and includes multiple support plates 509. The pickup heads 503 are connected to the support plates 509 and correspond one-to-one, which helps improve the uniformity of force distribution on the mounting base plate 507 and enhances the stability of the robot's movement. In this specific embodiment, the mounting base plate 507 includes three support plates 509 and three pickup heads 503. Correspondingly, each carrier component of the processing unit 4 also has three processing positions to meet processing and feeding requirements, thereby effectively improving processing efficiency. In practical applications, the number of pickup heads 503 can be adjusted according to the number of processing positions of the carrier components in the processing unit 4 to adapt to different processing conditions and improve the system's flexibility and adaptability.

The transfer unit 3 includes a positioning mechanism 301, which is mounted on the frame 1. The positioning mechanism 301 includes a flipping station 302, a positioning station 303, and a storage station 304. The flipping station 302 can fix and drive the wafer to flip, flipping the wafer 180° to meet different processing requirements.

Correspondingly, there are multiple positioning stations 303 to meet the material supply requirements of each carrier processing position in the processing unit 4. Each positioning station 303 includes positioning pins evenly distributed in a circumferential shape. The positioning station 303 is also equipped with a detection sensor to detect whether the positioning station 303 is carrying a wafer and whether the wafer is tilted or offset, so as to realize the positioning of the wafer. The second pickup unit 502 can pick up the wafer on the positioning station 303. The pickup head 503 adsorbs the wafer on the positioning station 303 and transfers the wafer to the processing position of the processing unit 4 under the drive of the robotic arm.

The positioning mechanism 301 is also provided with a storage station 304, which is located below the positioning station 303 and the two correspond one to one. The storage station 304 is used to store the wafer to be positioned. The first pickup unit 501 can pick up the wafer on the storage station 304 and transfer the wafer on the storage station 304 to the positioning station 303 for wafer positioning, which provides convenience for subsequent wafer processing.

It should also be emphasized that the transfer unit 3 also includes a cache mechanism 305, which includes a cache base 306, a motion mechanism 307, and a cache stage 308. The cache base 306 is mounted on the rack 1. The cache stage 308 is connected to the cache base 306 via the motion mechanism 307. The motion mechanism 307 can drive the cache stage 308 to move in three-dimensional space, thereby driving the movement of the wafers cached on the cache stage 308.

The cache stage 308 has a cache station, which includes a cache fork arm 309 and a cache positioning block 310. The cache fork arm 309 has a flat structure, and the cache positioning block 310 is slidably connected to the cache fork arm 309. The cache positioning block 310 is connected to a cache driver 312. Both the cache fork arm 309 and the cache positioning block 310 have cache positioning slots 311 adapted to the wafer. The cache positioning slots 311 are U-shaped, and the openings of the cache positioning slots 311 of the cache fork arm 309 and the cache positioning block 310 are arranged opposite to each other. Multiple cache positioning slots 311 cooperate to fix the wafer. The cache driver 312 can drive the cache positioning block 310 to reciprocate, adjusting the distance between the cache positioning block 310 and the cache fork arm 309 so that the cache positioning slots 311 on the cache positioning block 310 and the cache fork arm 309 can fix the wafer. Combined with the motion mechanism 307, it drives the wafer to move. In this specific embodiment, the cache station and the storage station 304 correspond one-to-one, so that the cache stage 308 fixes the wafer at the storage station 304 and drives the wafer to move to the positioning station 303, facilitating wafer positioning. The cache fork arm 309 has a flat structure, which allows it to extend into the gap between the wafers in the storage station 304, ensuring the operational reliability of the cache mechanism 305.

In addition, the wafer polishing system of this invention also includes a feeding unit 6 and a feeding docking unit 7. The feeding unit 6 can remove the processed wafer from the processing unit 4 and transfer it to the feeding docking unit 7. The feeding unit 6 can use a feeding robot to improve the feeding efficiency and at the same time minimize damage to the wafer.

In this specific embodiment, the unloading docking unit 7 includes a buffer tank 701 and an unloading tank 702. The buffer tank 701 is located close to the processing unit 4. The unloading unit 6 can remove the wafers from the processing unit 4 and transport them to the buffer tank 701. The unloading unit 6 can also transfer the wafers from the buffer tank 701 to the unloading tank 702, which can then be transported to subsequent processing steps. The inclusion of the buffer tank 701 and the unloading tank 702 in the unloading docking unit 7 helps maintain the cleanliness and safety of the wafers, ensuring wafer quality.

Furthermore, the wafer polishing and grinding system of the present invention also includes a control unit, and the feeding unit 2, transfer unit 3, processing unit 4 and picking unit 5 are all connected to the control unit for communication, which facilitates the control of the working status of each unit and improves the automation level of the system.

In addition, the processing unit 4 also includes a vision positioning mechanism 401, which can collect the position information of the processing position to monitor the information of the processing position of the processing unit 4 and the wafer loading information.

Implementation Example 2

In the wafer polishing system of this embodiment, the first pickup unit 501 has a Y-shaped plate structure and is equipped with multiple adsorption elements 510 to adsorb wafers. The adsorption elements 510 are connected to an external adsorption driver. The adsorption driver can evacuate and inflate the adsorption elements 510. When evacuating the adsorption elements 510, the adsorption elements 510 can adsorb the wafers under negative pressure. When it is necessary to release the wafers, the adsorption driver inflates the adsorption elements 510 to separate them from the wafers. The first pickup unit 501 uses an adsorption method to pick up the wafers, maximizing wafer protection and improving the pickup safety factor. It should also be noted that the adsorption drive can use external air pumps or other equipment, or an external compressed air source, which can be adjusted according to the specific working conditions to meet the adsorption and pickup requirements.

The other structures of the wafer polishing system in this embodiment are the same as those in Embodiment 1, and will not be described again here.

Implementation Example 3

This embodiment provides a wafer polishing method. Using the wafer polishing system of Embodiment 1 or Embodiment 2, the first pickup unit 501 of the pickup unit 5 picks up the wafer from the loading unit 2, and a robotic arm drives a robotic hand to place the wafer in the transfer unit 3. The transfer unit 3 positions the wafer, and multiple pickup heads 503 of the second pickup unit 502 pick up the wafers positioned in the transfer unit 3. The robotic arm drives a robotic hand to transfer the wafers to the processing position in the processing unit 4. The processing unit 4 performs polishing and grinding on the wafer.

The wafer polishing and grinding method of the present invention, using the wafer polishing and grinding system of Embodiment 1 or Embodiment 2, improves production efficiency while ensuring wafer processing quality and reducing the labor burden of operators.

Implementation Example 4

This embodiment provides a wafer polishing method using the wafer polishing system of Embodiment 1 or Embodiment 2, specifically including the following steps:

S01: The AGV trolley places the full Open Cassette into loading unit 2. Loading unit 2 receives the read code command from the PLC and reads the Open Cassette. The system receives the barcode information of the Cassette open frame and feeds it back to the PLC. The PLC receives the barcode information and feeds it back to the upper-level MES system. The MES system, based on the PLC's request, feeds back the information of each layer of wafers in the frame contained in the barcode to the PLC. At the same time, the loading unit 2 scans each layer of slot (the narrow gap for placing wafers) in the frame and feeds back the scan results to the PLC. The PLC receives the scan results and compares them with the information of each layer of wafers in the frame fed back by the MES system. If there is a difference in the comparison, the alarm device sounds an alarm; if there is no difference in the comparison, it automatically executes the next step.

S02: The first pickup unit 501 of pickup unit 5 horizontally picks up a wafer from loading unit 2. When the system requires a flip, pickup unit 5 first feeds the wafer to the flip station 302 of the transfer unit 3 for a 180-degree flip. Pickup unit 5 then places the flipped wafer into the storage station 304 at the bottom of positioning mechanism 301 (positioning mechanism 301 is divided into two parts: the upper part is the positioning station 303, and the lower part is the storage station 304, which can cache multiple wafers). When the system does not require a wafer flip, the first pickup unit 501 of pickup unit 5 directly places the wafer picked up from loading unit 2 into the storage station 304 at the bottom of positioning mechanism 301 until the set number is cached.

S03: The cache mechanism 305 simultaneously transports three wafers from the lower storage station 304 of the positioning mechanism 301 and places them in the positioning stations 303 of the positioning mechanism 301 respectively. The three positioning stations 303 of the positioning mechanism 301 simultaneously perform mechanical positioning on the wafers, and the anti-static pin positioning pins push the outer circle of the wafer for positioning.

S04: After the polishing and grinding of processing unit 4 is completed, unloading unit 6 takes out the wafer from the groove of the wafer carrier and puts it into unloading docking unit 7. Unloading docking unit 7 is composed of multiple lifting units and overflow tanks. After a wafer is put in, a mechanism will descend to make the wafer completely immersed in the water in the overflow tank to protect the wafer surface (the process requires that the wafer after polishing and grinding should be immersed in deionized water as soon as possible after being taken out). In this way, all the wafers of the wafer carrier are put into unloading docking unit 7 and completely immersed in water.

S05: After this, processing unit 4 will have a self-cleaning process. After cleaning is completed, picking unit 5 has completed the second step above. Then, repeat the sixth, seventh and eighth steps below to complete the loading work.

S06: Pick-up unit 5 picks up three wafers from the upper positioning station 303 of positioning mechanism 301. Combining the compensation data given by vision positioning mechanism 401, it places the wafers into the groove of wafer carrier in processing unit 4. Because the wafer carrier stops at different positions each time, pick-up unit 5 needs to cooperate with vision positioning mechanism 401 for vision positioning to accurately place the wafers into the groove of wafer carrier.

S07: Processing unit 4 has multiple wafer carriers. The lower part of the carrier is a grinding pad, and the lower part of the grinding pad is a lower grinding disk. After one wafer carrier is filled with wafers, the lower grinding disk of processing unit 4 will rotate at an angle, so that another wafer carrier rotates to the loading position. Then, the action of step six is repeated to load the current carrier. At the same time, unloading unit 6 will press and drain the wafers in the wafer carriers that have completed step six, and check whether the wafers in the wafer carriers are completely placed in the groove. If the wafer placement is not qualified, the flexible material will be pressed again, and the groove size will be detected by a micrometer. If the second detection is still not qualified, the equipment will issue an alarm message and wait for manual intervention.

S08: Repeat steps 6 and 7 above to place all wafers into the grooves of the wafer carrier and check that the placement is correct. After loading is complete, the PLC will send a loading completion signal to processing unit 4, and then processing unit 4 will begin polishing and grinding.

S09: After the loading is completed, the processing unit 4 starts working. The unloading unit 6 takes the wafers out of the buffer tank 701 of the unloading docking unit 7 and puts them into the unloading tank 702. In this way, all the wafers in the unloading docking unit 7 are put into the unloading tank 702. The unloading tank 702 contains wafer frames. When the frames are full, the PLC will send the full information to the MES system. The MES system will then send instructions to the AGV to pick up the wafers.

This invention uses specific examples to illustrate its principles and implementation methods. These examples are merely for the purpose of helping to understand the method and core idea of this invention. Furthermore, those skilled in the art will likely make changes to the specific implementation methods and application scope based on the ideas of this invention. Therefore, the content of this specification should not be construed as a limitation of this invention.

1: Frame 2: Loading Unit 3: Transfer Unit 301: Positioning Mechanism 302: Turning Station 303: Positioning Station 304: Storage Station 305: Cache Mechanism 306: Cache Seat 307: Motion Mechanism 308: Cache Table 309: Cache Fork Arm 310: Cache Positioning Block 311: Cache Positioning Slot 312: Cache Driver 4: Processing Unit 401: Visual Positioning Mechanism 5: Pickup Unit 501: First Pickup Section 502: Second Pickup Section 503: Pickup Head 504: Outer Clamping Plate 505: Inner Clamping Plate 506: Clamping slot 507: Mounting substrate 508: Suction cup 509: Support plate 510: Adsorption element 511: Clamping driver 6: Unloading unit 7: Unloading docking unit 701: Buffer water tank 702: Unloading water tank

To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other accompanying drawings can be obtained from these drawings without any creative effort. Figure 1 is a schematic diagram of the structure of the wafer polishing and grinding system disclosed in this embodiment of the invention; Figure 2 is a schematic diagram of the internal structure of the wafer polishing and grinding system disclosed in this embodiment of the invention; Figure 3 is a schematic diagram of the structure of the robotic arm of the wafer polishing and grinding system disclosed in Embodiment 1 of the invention; Figure 4 is a schematic diagram of the structure of the robotic arm of the wafer polishing and grinding system disclosed in Embodiment 2 of the invention; Figure 5 is a schematic diagram of the structure of the flipping station of the wafer polishing and grinding system disclosed in this embodiment of the invention; Figure 6 is a schematic diagram of the structure of the positioning mechanism of the wafer polishing and grinding system disclosed in this embodiment of the invention; Figure 7 is an axonometric schematic diagram of the buffer mechanism of the wafer polishing and grinding system disclosed in this embodiment of the invention; Figure 8 is a front view of the caching mechanism of the wafer polishing system disclosed in this embodiment of the invention; Figure 9 is a side view of the caching mechanism of the wafer polishing system disclosed in this embodiment of the invention; Figure 10 is a top view of the caching mechanism of the wafer polishing system disclosed in this embodiment of the invention.

Domestic Storage Information (Please record in order of storage institution, date, and number) None International Storage Information (Please record in order of storage country, institution, date, and number) None

1: Rack

2: Feeding Unit

3: Transfer Unit

301: Positioning Mechanism

302: Rotating workstation

305: Cache Provider

4: Processing Unit

401: Visual Positioning Mechanism

5: Pick-up Unit

6: Material feeding unit

7: Material feeding docking unit

701: Buffer Tank

702: Feeding Tank

Claims (10)

A wafer polishing and grinding system includes a rack and the following components mounted on the rack: a loading unit capable of storing multiple stacked wafers; a transfer unit capable of carrying and positioning a single wafer, the transfer unit including a caching mechanism comprising multiple sets of caching forks, a caching base, a motion mechanism, and a caching stage, the caching stage being connected to the caching base via the motion mechanism, the motion mechanism passing through the caching base and driving the caching stage to move relative to the caching base in three-dimensional space; and a processing unit capable of polishing and grinding the wafers. The picking unit includes a robotic arm and a robotic hand. The robotic arm is mounted on the frame, and the robotic hand is connected to the robotic arm. The robotic arm can move the robotic hand in space. The robotic hand includes a first picking part and a second picking part. The first picking part has a flat structure to pick up wafers stored in the loading unit. The first picking part can also pick up wafers to be positioned in the transfer unit. The second picking part includes multiple picking heads to pick up wafers positioned in the transfer unit and place the picked-up wafers into the processing position of the processing unit. After the wafer processing is completed, the second picking part can also remove the processed wafers. The wafer polishing system as described in claim 1, wherein: the first pickup unit includes an outer clamping plate and an inner clamping plate, both the outer clamping plate and the inner clamping plate having clamping grooves adapted to the wafer, and the clamping grooves of the outer clamping plate and the inner clamping plate being disposed opposite to each other, the inner clamping plate being slidably connected to the outer clamping plate, the inner clamping plate being connected to a clamping drive, and the outer clamping plate being a V-shaped plate with its opening facing the side away from the inner clamping plate. The wafer polishing system as described in claim 1, wherein: the first pickup unit has a Y-shaped plate structure, the first pickup unit is provided with a plurality of adsorption elements to adsorb wafers, and the adsorption elements are connected to an external adsorption driver. The wafer polishing system as described in claim 2 or 3, wherein: the second pickup unit includes a mounting substrate, both the mounting substrate and the first pickup unit are connected to the robotic arm, the pickup head is connected to the mounting substrate, the pickup head is provided with a plurality of suction cups, the suction cups are connected to an external adsorption driver, and the end of the mounting substrate connected to the pickup head is inclined. The wafer polishing system as described in claim 4, wherein: the mounting substrate has a star-shaped structure, the mounting substrate includes multiple support plates, and the pickup head is connected to the support plates and the two correspond to each other. The wafer polishing and grinding system as described in claim 1, wherein: the transfer unit includes a positioning mechanism, the positioning mechanism is disposed on the rack, the positioning mechanism includes a flipping station, a positioning station and a storage station, the flipping station can fix and drive the wafer to flip; the number of positioning stations is multiple, each positioning station includes positioning pins evenly distributed in a circular shape, the positioning station is also provided with a detection sensor to detect whether the positioning station is carrying a wafer and whether the wafer is tilted or offset, the second pickup unit can pick up the wafer on the positioning station; the storage station is disposed below the positioning station and the two correspond one-to-one, the storage station is used to store the wafer to be positioned, the first pickup unit can pick up the wafer on the storage station. The wafer polishing system as described in claim 6, wherein: the cache holder is disposed on the rack, the cache stage has a cache station, the cache station includes a cache positioning block, the cache fork arm has a flat structure, the cache positioning block is slidably connected to the cache fork arm, the cache positioning block is connected to a cache driver, and both the cache fork arm and the cache positioning block have... The device has a U-shaped cache positioning slot adapted to the wafer. The openings of the cache positioning slots of the cache fork arm and the cache positioning block are arranged opposite to each other. Multiple cache positioning slots cooperate to fix the wafer. The cache station corresponds to the storage station one by one, so that the cache stage fixes the wafer at the storage station and moves the wafer to the positioning station. The wafer polishing system as described in claim 1 further includes a feeding unit and a feeding docking unit. The feeding unit can remove the processed wafer from the processing unit and transfer it to the feeding docking unit. The feeding docking unit includes a buffer tank and a feeding tank. The buffer tank is located close to the processing unit. The feeding unit can remove the wafer from the processing unit and transport it to the buffer tank. The feeding unit can also transfer the wafer from the buffer tank to the feeding tank. The feeding tank can be transported to subsequent processing steps. The wafer polishing system as described in claim 1 further includes a control unit, wherein the loading unit, the transfer unit, the processing unit, and the pickup unit are all communicatively connected to the control unit; the processing unit further includes a visual positioning mechanism capable of collecting position information of the processing position. A wafer polishing and grinding method, wherein: using the wafer polishing and grinding system described in any one of claims 1 to 9, the first picking unit of the picking unit picks up the wafer from the loading unit, the robotic arm drives the robotic hand to move, so as to place the wafer in the transfer unit; the transfer unit positions the wafer, the multiple picking heads of the second picking unit pick up multiple wafers after being positioned by the transfer unit, the robotic arm drives the robotic hand to move, so as to transfer the wafer to the processing position of the processing unit; the processing unit performs polishing and grinding processing on the wafer.