TWI912185B - Warpage detection device - Google Patents
Warpage detection deviceInfo
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- TWI912185B TWI912185B TW114114214A TW114114214A TWI912185B TW I912185 B TWI912185 B TW I912185B TW 114114214 A TW114114214 A TW 114114214A TW 114114214 A TW114114214 A TW 114114214A TW I912185 B TWI912185 B TW I912185B
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Abstract
Description
本發明係有關一種檢測技術,尤指一種便於檢測板材翹曲狀態之翹曲檢測裝置。 This invention relates to a detection technique, and more particularly to a warp detection device for easily detecting the warp state of sheet materials.
為滿足半導體裝置之高積集度(Integration)及微型化(Miniaturization)需求,故在半導體產品製程中,確保用以承載晶片之載板的平整度及準確度對於正常運行與可靠性將至關重要,尤其是在出貨時對翹曲程度的檢驗,且隨著載板需求及產量增多,需採用快速篩查之方式提升檢驗效率。 To meet the high integration and miniaturization requirements of semiconductor devices, ensuring the flatness and accuracy of the substrates used to carry the chips is crucial for normal operation and reliability during semiconductor product manufacturing. This is especially true for inspecting warpage at the time of shipment. Furthermore, with increasing substrate demand and production volume, rapid screening methods are needed to improve inspection efficiency.
習知測量載板之翹曲程度之主流方法係採用Shadow Moire測量系統,其利用垂直光源信號照射待測載板,再接收分析反射信號,以計算出載板之翹曲情況,但Shadow Moire測量系統之價格昂貴,致使檢測成本難以下降,且分析時間冗長,並對於待測載板之尺寸有特別限制,導致載板之設計需配合Shadow Moire測量系統,因而造成載板設計之發展困境。 The mainstream method for measuring the warpage of a substrate is the Shadow Moire measurement system. This system uses a vertical light source to illuminate the substrate, then receives and analyzes the reflected signal to calculate the warpage. However, the Shadow Moire system is expensive, making it difficult to reduce testing costs. Furthermore, the analysis time is lengthy, and there are specific limitations on the size of the substrate being measured. This necessitates that the substrate design be adapted to the Shadow Moire system, thus creating a developmental dilemma in substrate design.
因此,業界遂有採用價格便宜之塞規(Pin gauge),其藉由間隙尺以手動方式測量翹曲程度,但此方法之誤差較大,且人工及時間成本更高,並於該間隙尺與載板之正面(佈線/置晶面)直接接觸時,容易損傷載板之正面,導致載板之損耗風險大幅提升。 Therefore, the industry has adopted inexpensive pin gauges, which manually measure warpage using a gap gauge. However, this method has a larger error margin and higher labor and time costs. Furthermore, when the gap gauge is in direct contact with the front side of the substrate (layout/crystal plane), it can easily damage the substrate, significantly increasing the risk of substrate damage.
因此,如何克服上述習知技術的種種問題,實已成目前亟欲解決的課題。 Therefore, overcoming the various problems associated with the aforementioned learning techniques has become an urgent issue that needs to be addressed.
鑑於上述習知技術之種種缺失,本發明係提供一種翹曲檢測裝置,係包括:工作平台,係為發光式平台,其具有一承載面,以置放及照射至少一如板材之目標物;遮光件,係立設於該承載面上且具有一鄰接該承載面之遮光區域;以及感應組,係包含至少一對應該遮光件配置之感光器,其偵測該遮光區域外之光線。 In view of the various deficiencies of the prior art, the present invention provides a warping detection device, comprising: a working platform, which is a light-emitting platform having a supporting surface for placing and illuminating at least one target object, such as a sheet material; a light-shielding member erected on the supporting surface and having a light-shielding area adjacent to the supporting surface; and a sensing assembly comprising at least one photosensor corresponding to the light-shielding member, which detects light outside the light-shielding area.
於一具體實施態樣中,該工作平台係包含一具有該承載面之平台本體、及配置於相對該承載面之另一表面上之發光件,且該平台本體係採用透光材質製成,以令該發光件照射該目標物。 In one specific embodiment, the work platform includes a platform body having the bearing surface and a light-emitting element disposed on another surface opposite the bearing surface. The platform body is made of a light-transmitting material so that the light-emitting element illuminates the target object.
於一具體實施態樣中,該翹曲檢測裝置復可包括配置於該承載面上且與該遮光件係分別位於該承載面之相對兩側上的限位件,使該限位件與該遮光件夾合該目標物。例如,該承載面上係配置軌道結構,以令該限位件沿該軌道結構直線位移。進一步,該承載面之上方配置至少一校正件,以於該限位件之移動過程中,使該限位件之表面與該遮光件保持平行。 In one specific embodiment, the warpage detection device may further include limiting members disposed on the support surface and located on opposite sides of the support surface, respectively, so that the limiting members and the light-shielding member clamp the target object. For example, a track structure is disposed on the support surface to allow the limiting members to move linearly along the track structure. Furthermore, at least one correction member is disposed above the support surface to keep the surface of the limiting member parallel to the light-shielding member during the movement of the limiting member.
於一具體實施態樣中,該遮光件係為透光材製成之板片體,且該遮光件之該遮光區域形成有帶狀之不透光材。 In one specific embodiment, the light-shielding member is a plate made of a light-transmitting material, and the light-shielding area of the light-shielding member has a strip of opaque material formed therein.
於一具體實施態樣中,該遮光區域係具有一相對該承載面之目標高度,且該目標高度係為該目標物之最大容許翹曲程度。 In one specific embodiment, the shading area has a target height relative to the load-bearing surface, and this target height is the maximum permissible warpage of the target object.
於一具體實施態樣中,該感應組復包含至少一通訊連接該感光器之指示器。例如,該指示器係為燈型式。 In one specific embodiment, the sensing array further includes at least one indicator that is communicatively connected to the photosensor. For example, the indicator may be a light-type indicator.
於一具體實施態樣中,該遮光區域外出現該目標物時,該目標物會圈出透光區域,令該工作平台照射該目標物之光線穿過該透光區域,使感光器偵測到該透光區域之光線,即表示該目標物之翹曲程度過大而不合格。 In a specific embodiment, when the target object appears outside the light-blocking area, the target object will outline a light-transmitting area. Light from the work platform illuminating the target object passes through this light-transmitting area, and the photosensor detects the light in this area, indicating that the target object's warping is too excessive and therefore unacceptable.
由上可知,本發明之翹曲檢測裝置,主要藉由該遮光件及感光器之配合,即可篩查該目標物之翹曲程度,不僅結構簡單而易於建置,且採用現有規格之感應組,因而有利於便宜採購該感應組以降低檢測成本。 As can be seen from the above, the warp detection device of this invention mainly uses the cooperation of the light-shielding component and the photosensitive sensor to screen the degree of warp of the target object. It not only has a simple structure and is easy to install, but also uses existing standard sensor modules, thus facilitating the inexpensive procurement of these modules and reducing detection costs.
再者,藉由該感光器之設計,即可快速分析該目標物之翹曲程度是否符合需求,故相較於習知技術,本發明之翹曲檢測裝置採用自動化分析,不僅分析時間極短以大幅降低時間成本,且誤差極微,因而符合快速篩查產品之翹曲程度是否合格之需求。 Furthermore, the design of this photosensitive sensor allows for rapid analysis of whether the warp degree of the target object meets the requirements. Therefore, compared to prior art, the warp detection device of this invention employs automated analysis, resulting in extremely short analysis time, significantly reducing time costs, and minimal error. This meets the need for rapid screening of whether the warp degree of a product is acceptable.
又,藉由該限位件之可移動設計,以配合該目標物之尺寸調整該限位件之位置,故相較於習知Shadow Moire測量系統,本發明之翹曲檢測裝置可檢測各種載板之尺寸,以避免因對於尺寸限制而造成載板設計之發展困境之問題。 Furthermore, by utilizing the movable design of the limiting member, its position can be adjusted to match the size of the target object. Therefore, compared to the conventional Shadow Moire measurement system, the warp detection device of this invention can detect the dimensions of various carrier plates, thus avoiding the development dilemmas in carrier plate design caused by size limitations.
另外,該限位件僅接觸該目標物之側邊,因而不會損傷該目標物之正面,故相較於習知塞規,本發明之翹曲檢測裝置可降低載板之損耗風險。 Furthermore, the limiting member only contacts the side of the target object, thus avoiding damage to the front of the target object. Therefore, compared to conventional plug gauges, the warp detection device of this invention can reduce the risk of damage to the carrier board.
1:翹曲檢測裝置 1: Warp Detection Device
10:工作平台 10: Work Platform
10a:承載面 10a: Load-bearing surface
100:平台本體 100: Platform Body
101:發光件 101: Light-emitting components
11:遮光件 11: Sunshade components
110:刻度線 110: Scale line
12:感應組 12: Sensing Group
120:感光器 120: Image sensor
121,122:指示器 121, 122: Indicators
13:限位件 13: Limiting components
130:導向槽 130: Guide slot
14:軌道結構 14: Track Structure
140:軌條 140: Rails
141:支撐板 141: Support Plate
15:校正件 15: Calibration parts
9:目標物 9: Target
A:遮光區域 A: Shaded area
E:透光區域 E: Transparent area
H:目標高度 H: Target Height
L:偵測高度 L: Detection Altitude
S:容置空間 S: Accommodation space
X,Y,Z:箭頭方向 X, Y, Z: Arrow direction (The arrow points are X, Y, and Z.)
圖1係為本發明之翹曲檢測裝置之立體透視示意圖。 Figure 1 is a three-dimensional perspective view of the warp detection device of this invention.
圖2係為本發明之翹曲檢測裝置於使用中呈現合格狀態之側視平面示意圖。 Figure 2 is a side plan view showing the warp detection device of this invention in a qualified state during use.
圖3係為本發明之翹曲檢測裝置於使用中呈現不合格狀態之側視平面示意圖。 Figure 3 is a side plan view of the warp detection device of this invention in a non-conforming state during use.
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following specific examples illustrate the implementation of this invention. Those skilled in the art can easily understand the other advantages and effects of this invention from the content disclosed in this specification.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「下」、「左」、「右」、「前」、「後」、「第一」、「第二」、「一」、「二」、「五」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those familiar with the technology in understanding and reading the content disclosed in the manual, and are not intended to limit the implementation of the invention. Therefore, they have no substantive technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effectiveness and purpose of the invention, should still fall within the scope of the technical content disclosed in the invention. Furthermore, the terms used in this specification, such as "above," "below," "left," "right," "front," "back," "first," "second," "one," "two," and "five," are merely for clarity of description and are not intended to limit the scope of this invention. Any changes or adjustments to these relative relationships, without substantial alteration to the technical content, shall also be considered within the scope of this invention.
圖1係為本發明之翹曲檢測裝置1之立體透視示意圖。如圖1所示,所述之翹曲檢測裝置1係用於半導體製程之檢測板材翹曲狀態之快速篩查作業,其包括一具有承載面10a之工作平台10、一立設於該承載面10a上之遮光件11以及一對應該遮光件11配置之感應組12。 Figure 1 is a three-dimensional perspective view of the warp detection device 1 of the present invention. As shown in Figure 1, the warp detection device 1 is used for rapid screening of the warp state of semiconductor manufacturing materials. It includes a work platform 10 with a bearing surface 10a, a light-shielding member 11 erected on the bearing surface 10a, and a sensing assembly 12 corresponding to the light-shielding member 11.
於本實施例中,該翹曲檢測裝置1係基於該承載面10a定義出前、後方向(如箭頭方向X)及左、右方向(如箭頭方向Y),且將垂直該承載面10a之方向定義為上、下方向(如箭頭方向Z)。應可理解地,該方位係用於說明本實施例之配置,並無特別限制。 In this embodiment, the warpage detection device 1 is based on the bearing surface 10a, defining the front and rear directions (e.g., arrow direction X) and left and right directions (e.g., arrow direction Y), and defining the direction perpendicular to the bearing surface 10a as the up and down directions (e.g., arrow direction Z). It should be understood that these orientations are used to illustrate the configuration of this embodiment and are not particularly limiting.
所述之工作平台10係為發光式平台,其承載面10a係用以置放及照射至少一如板材之目標物9。 The work platform 10 is a light-emitting platform, and its bearing surface 10a is used to place and illuminate at least one target object 9, such as a sheet material.
於本實施例中,該工作平台10係包含一具有該承載面10a(如圖所示之頂面)之平台本體100、及配置於相對該承載面10a之另一表面(如圖所示之底面)上之發光件101,以藉由該發光件101照射該目標物9。例如,該發光件101可發散均勻的光線,供作背光源,且該平台本體100係採用透光材質(如透明材質)製作成矩形載物台,不僅可均勻化光源,使該發光件101之光線能均勻分散穿透該平台本體100,且同時具有散熱功能。此外,可控制發光件101的照光區域限於感應組12之前方承載面10a範圍,抑或者可使遮光件11後方之平台本體100不透出光線,例如加工該平台本體100,形成如黑色材料之不透光材在所述範圍之該平台本體100表面,以遮蔽光線。 In this embodiment, the work platform 10 includes a platform body 100 having the bearing surface 10a (the top surface as shown in the figure) and a light-emitting element 101 disposed on another surface opposite the bearing surface 10a (the bottom surface as shown in the figure) to illuminate the target object 9. For example, the light-emitting element 101 can emit uniform light to serve as a backlight, and the platform body 100 is made of a light-transmitting material (such as a transparent material) to form a rectangular stage, which can not only homogenize the light source so that the light from the light-emitting element 101 can be uniformly dispersed and penetrate the platform body 100, but also has a heat dissipation function. Furthermore, the illumination area of the luminescent element 101 can be controlled to be limited to the area of the bearing surface 10a in front of the sensing assembly 12, or the platform body 100 behind the light-shielding element 11 can be made to block light from passing through. For example, the platform body 100 can be processed to form an opaque material, such as black material, on the surface of the platform body 100 within the stated area to block light.
再者,該承載面10a上係配置一限位件13,其與該遮光件11係分別位於該承載面10a之相對兩側(如圖所示之前後兩側)上,以令該限位件13靠合該目標物9,使該限位件13推緊固定目標物9而定位。例如,該限位件13係為透光材製之矩形夾板,其與該遮光件11夾合該目標物9。 Furthermore, a limiting member 13 is disposed on the bearing surface 10a, which, along with the light-shielding member 11, is respectively located on opposite sides of the bearing surface 10a (the front and rear sides as shown in the figure). This allows the limiting member 13 to abut against the target object 9, thereby pressing and fixing the target object 9 in place. For example, the limiting member 13 may be a rectangular clamping plate made of a light-transmitting material, which clamps the target object 9 together with the light-shielding member 11.
又,該限位件13係為可移動式,其在箭頭方向X朝向該遮光件11直線位移。例如,該承載面10a上可配置軌道結構14,以令該限位件13沿該軌道結構14直線位移。 Furthermore, the limiting member 13 is movable, and it moves linearly toward the light-shielding member 11 in the arrow direction X. For example, a track structure 14 can be configured on the bearing surface 10a to allow the limiting member 13 to move linearly along the track structure 14.
進一步,該軌道結構14係包含至少一軌條140,其配置於該承載面10a之另相對兩側(如圖所示之左右兩側)上,且該限位件13係具有對應該軌條140之導向槽130,以令該軌條140嵌卡於該導向槽130中,使該軌條140相對該導向槽130滑動。較佳地,該軌道結構14可包含二支撐板141,其架設於該承載面10a之另相對兩側(如圖所示之左右兩側)上,以令如圖所示之四個軌條140配置於該支撐板141之上下兩邊緣,使該限位件13之四個角落處開設該導向槽130而連接該軌道結構14,以平穩地直線前後位移而避免於移動時產生晃動搖擺。例如,該支撐板141係為透光材製成之矩形板片,且該軌條140係為導向棱。 Furthermore, the track structure 14 includes at least one rail 140 disposed on the other two opposite sides (left and right sides as shown in the figure) of the bearing surface 10a, and the limiting member 13 has a guide groove 130 corresponding to the rail 140, so that the rail 140 is engaged in the guide groove 130 and slides relative to the guide groove 130. Preferably, the track structure 14 may include two support plates 141, mounted on opposite sides of the bearing surface 10a (as shown in the figure, the left and right sides), with four rails 140 arranged on the upper and lower edges of the support plates 141. Guide grooves 130 are provided at the four corners of the limiting member 13 to connect to the track structure 14, allowing for stable linear forward and backward displacement and preventing swaying during movement. For example, the support plate 141 may be a rectangular plate made of a light-transmitting material, and the rails 140 may be guide edges.
另外,可於該承載面10a之上方配置至少一校正件15,以於該限位件13之移動過程中,使該限位件13之表面與該遮光件11保持平行。例如,該校正件15係為直角架,其係將構成直角之其中一邊配置於基準面上(如該承載面10a上、該支撐板141上),而以構成直角之另一邊靠合該限位件13,以確保該限位件13緊壓該目標物9。 Additionally, at least one alignment member 15 can be disposed above the bearing surface 10a to ensure that the surface of the limiting member 13 remains parallel to the light-shielding member 11 during the movement of the limiting member 13. For example, the alignment member 15 can be a right-angle bracket, with one side forming a right angle positioned on a reference surface (such as the bearing surface 10a or the support plate 141), and the other side forming the right angle abutting against the limiting member 13 to ensure that the limiting member 13 firmly presses against the target object 9.
所述之目標物9係為晶圓、用以承載半導體晶片之載板(如封裝基板(substrate)、打線架、矽中介板或其它載板等)或其它板材,並無特別限制。 The target material 9 refers to wafers, carriers used to support semiconductor wafers (such as substrates, bonding pads, silicon interposers, or other carriers), or other substrates, without particular limitation.
所述之遮光件11係具有一鄰接該承載面10a之遮光區域A,且該遮光區域A係具有一相對該承載面10a之目標高度H,如圖2所示,其係依據客製化可接受該目標物9之最大容許翹曲程度設計。 The light-shielding member 11 has a light-shielding area A adjacent to the supporting surface 10a, and the light-shielding area A has a target height H relative to the supporting surface 10a, as shown in Figure 2. This height H is designed according to the maximum permissible warpage of the target object 9, as customized.
於本實施例中,該遮光件11係為透光材製成之矩形板片體,其相對兩側連接該支撐板141。例如,該遮光件11、該限位件13及該支撐板141係形成一容置空間S,且該軌條140之其中一端(後端)可固定於該遮光件11上。 In this embodiment, the light-shielding member 11 is a rectangular plate made of light-transmitting material, with the support plate 141 connected to its opposite sides. For example, the light-shielding member 11, the limiting member 13, and the support plate 141 form an accommodating space S, and one end (rear end) of the rail 140 can be fixed to the light-shielding member 11.
再者,該遮光區域A係於該遮光件11上形成如黑色材料之不透光材之矩形帶狀。例如,該遮光區域A旁可形成刻度線110(如圖所示之設於該支撐板141上),供量化檢測結果,以便區分所篩查之不同目標物9之需求。 Furthermore, the light-shielding area A is a rectangular strip formed on the light-shielding member 11 using an opaque material such as black. For example, scale lines 110 can be formed next to the light-shielding area A (as shown in the figure, provided on the support plate 141) to quantify the test results, so as to differentiate the requirements of the different targets 9 being screened.
所述之感應組12係包含至少一對應該遮光件11配置之感光器120,其偵測高度L係高於該目標高度H,如圖2所示,以偵測該遮光區域A外之光線。 The sensing assembly 12 includes at least one photosensor 120 corresponding to the light-shielding member 11, with its detection height L higher than the target height H, as shown in Figure 2, to detect light outside the light-shielding area A.
於本實施例中,該感光器120係通訊連接一終端電腦(圖略),且於使用時,該遮光區域A係位於該目標物9與該感光器120之間。例如,於使用中,該目標物9係位於該容置空間S內,而該感光器120係位於該容置空間S外。 In this embodiment, the photosensor 120 is communicatively connected to a terminal computer (not shown), and in use, the light-blocking area A is located between the target object 9 and the photosensor 120. For example, in use, the target object 9 is located within the accommodating space S, while the photosensor 120 is located outside the accommodating space S.
再者,該感光器120之感應範圍係對應該遮光區域A之分布範圍,以完整偵測該遮光區域A外之光線。例如,該遮光區域A係對應配置多個(五個)感光器120。 Furthermore, the sensing range of the photosensor 120 corresponds to the distribution range of the shaded area A, so as to completely detect light outside the shaded area A. For example, the shaded area A may correspond to the arrangement of multiple (five) photosensors 120.
又,該感應組12復包含至少一通訊連接該感光器120之指示器121,122。例如,該指示器121,122係為燈型式,以藉由燈亮/燈滅之方式代表該目標物9之翹曲程度是否正常。進一步地,該感應組12包含兩個指示器121,122,其採用波長不同之顏色而易於區分,以形成更多燈號組合(例如,亮/熄、熄/亮、亮/亮、熄/熄),供篩選翹曲程度合格或不合格之目標物9。 Furthermore, the sensor assembly 12 also includes at least one indicator 121, 122 that is communicatively connected to the photosensor 120. For example, the indicators 121, 122 are lamp-type, used to represent whether the warping degree of the target object 9 is normal by turning the lamp on/off. Further, the sensor assembly 12 includes two indicators 121, 122 that use different wavelengths of color for easy differentiation, forming more light signal combinations (e.g., on/off, off/on, on/on, off/off) for filtering target objects 9 that have acceptable or unacceptable warping degrees.
因此,於使用時,首先,開啟該發光件101、該感光器120及兩個指示器121,122,且於初始狀態時,其中一指示器121之信號燈亮起,作為第一指示燈,而另一指示器122之信號燈熄滅,作為第二指示燈。 Therefore, in use, firstly, the light-emitting element 101, the photosensor 120, and the two indicators 121 and 122 are turned on. In the initial state, the indicator light of one indicator 121 is lit, serving as the first indicator light, while the indicator light of the other indicator 122 is off, serving as the second indicator light.
接著,將該目標物9置放於該平台本體100上(或容置空間S中),使該目標物9呈現上拱形狀態,且該目標物9之其中一側(後側)緊貼於該遮光件11上,令該遮光區域A位於該目標物9與該感光器120之間。 Next, the target object 9 is placed on the platform body 100 (or in the accommodating space S), so that the target object 9 is in an upwardly arched shape, and one side (rear side) of the target object 9 is in close contact with the light-shielding member 11, so that the light-shielding area A is located between the target object 9 and the photosensor 120.
之後,將該限位件13沿該軌道結構14朝向該遮光件11緩慢移動,且同時利用該校正件15確保該限位件13以平行的角度推向該目標物9,直至該限位件13接觸該目標物9並夾緊固定該目標物9。 Then, the limiting member 13 is slowly moved along the track structure 14 toward the light-shielding member 11, while the corrector 15 ensures that the limiting member 13 is pushed toward the target object 9 at a parallel angle until the limiting member 13 contacts and clamps the target object 9.
最後,該感光器120進行感應動作,以供使用者讀取該些指示器122之信號燈狀態。 Finally, the photosensor 120 performs a sensing action so that the user can read the status of the indicator lights 122.
於本實施例中,當該目標物9之翹曲程度過大而不合格時,該遮光區域A上方會出現該目標物9之側面弧形投影所圈出之透光區域E,如圖3所示,令該發光件101照射該目標物9之光線穿過該透光區域E,使該感光器120捕捉到該目標物9及該透光區域E之光線,此時,該些指示器122之信號燈狀態不變,即第一指示燈(指示器121)之信號燈仍亮著,而第二指示燈(指示器122)之信號燈仍熄滅,故使用者可將該目標物9列為不良品。 In this embodiment, when the warping of the target object 9 is excessive and unacceptable, a light-transmitting area E, circled by the side arc projection of the target object 9, will appear above the light-blocking area A, as shown in Figure 3. The light emanating from the light-emitting element 101 illuminates the target object 9 through the light-transmitting area E, allowing the photosensor 120 to capture the light from the target object 9 and the light-transmitting area E. At this time, the indicator lights of the indicators 122 remain unchanged; that is, the indicator light of the first indicator (indicator 121) remains lit, while the indicator light of the second indicator (indicator 122) remains off. Therefore, the user can classify the target object 9 as a defective product.
相對地,若該目標物9之翹曲程度符合需求而合格時,該遮光區域A會完全遮擋該目標物9之側面拱形投影,如圖2所示,使該感光器120未捕捉到額外光型態,此時,該些指示器122之信號燈狀態會做出變化,即第一指示燈(指示器121)之信號燈熄滅,而第二指示燈(指示器122)之信號燈亮起,故使用者可將該目標物9列為良品。 Conversely, if the warping degree of the target object 9 meets the requirements and is qualified, the light-blocking area A will completely block the side arched projection of the target object 9, as shown in Figure 2, preventing the photosensor 120 from capturing the additional light pattern. At this time, the status of the indicator lights 122 will change; that is, the indicator light of the first indicator (indicator 121) will turn off, while the indicator light of the second indicator (indicator 122) will light up. Therefore, the user can classify the target object 9 as a good product.
應可理解地,有關該指示器121,122之信號燈之變化方式繁多,並不限於上述。 It should be understood that the signal lights of indicators 121 and 122 can vary in many ways, and are not limited to those described above.
綜上所述,本發明之翹曲檢測裝置1,其藉由該遮光件11及感應組12之配合,即可篩查該目標物9之翹曲程度,不僅結構簡單而易於建置,且採用現有規格之感應組12,因而有利於便宜採購該感應組12以降低檢測成本。 In summary, the warp detection device 1 of this invention, through the cooperation of the light-shielding member 11 and the sensor assembly 12, can screen the degree of warp of the target object 9. It not only has a simple structure and is easy to install, but also uses a sensor assembly 12 of existing specifications, thus facilitating the inexpensive procurement of the sensor assembly 12 and reducing detection costs.
再者,藉由該感應組12之光偵測結果及燈號反應,即可快速分析該目標物9之翹曲程度是否符合需求,故相較於習知技術,本發明之翹曲檢測裝置1採用自動化分析,不僅分析時間極短以大幅降低時間成本,且誤差極微,因而符合快速篩查產品之翹曲程度是否合格之需求。 Furthermore, by utilizing the light detection results and light response of the sensor group 12, the warp degree of the target object 9 can be quickly analyzed to determine whether it meets the requirements. Therefore, compared to prior art, the warp detection device 1 of this invention employs automated analysis, which not only significantly reduces time costs due to its extremely short analysis time but also minimizes errors, thus meeting the need for rapid screening of whether the warp degree of a product is acceptable.
又,藉由該限位件13之可移動設計,以配合該目標物9之尺寸調整該限位件13之位置,故相較於習知Shadow Moire測量系統,本發明之翹曲檢測裝置1能檢測各種載板之尺寸,以避免因對於尺寸限制而造成載板設計之發展困境之問題。 Furthermore, by utilizing the movable design of the limiting member 13, its position can be adjusted to match the size of the target object 9. Therefore, compared to the conventional Shadow Moire measurement system, the warp detection device 1 of this invention can detect the dimensions of various carrier plates, thus avoiding the development difficulties in carrier plate design caused by size limitations.
另外,該限位件13僅接觸該目標物9(如載板)之側邊,因而不會損傷該目標物9之正面(即上下表面),故相較於習知塞規(Pin gauge),本發明之翹曲檢測裝置1能降低載板之損耗風險。 Furthermore, the limiting member 13 only contacts the side of the target object 9 (such as a carrier plate), thus avoiding damage to the front surface (i.e., the top and bottom surfaces) of the target object 9. Therefore, compared to conventional pin gauges, the warp detection device 1 of this invention can reduce the risk of carrier plate damage.
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。 The foregoing embodiments are illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art may modify the foregoing embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as set forth in the patent application section below.
1:翹曲檢測裝置 1: Warp Detection Device
10:工作平台 10: Work Platform
10a:承載面 10a: Load-bearing surface
100:平台本體 100: Platform Body
101:發光件 101: Light-emitting components
11:遮光件 11: Sunshade components
110:刻度線 110: Scale line
12:感應組 12: Sensing Group
120:感光器 120: Image sensor
121,122:指示器 121, 122: Indicators
13:限位件 13: Limiting components
130:導向槽 130: Guide slot
14:軌道結構 14: Track Structure
140:軌條 140: Rails
141:支撐板 141: Support Plate
15:校正件 15: Calibration parts
9:目標物 9: Target
A:遮光區域 A: Shaded area
S:容置空間 S: Accommodation space
X,Y,Z:箭頭方向 X, Y, Z: Arrow direction (The arrow points are X, Y, and Z.)
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2025102830359 | 2025-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI912185B true TWI912185B (en) | 2026-01-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190013224A1 (en) | 2017-07-05 | 2019-01-10 | Tokyo Electron Limited | Substrate warping monitoring device and substrate processing apparatus using the same, and substrate warping monitoring method |
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190013224A1 (en) | 2017-07-05 | 2019-01-10 | Tokyo Electron Limited | Substrate warping monitoring device and substrate processing apparatus using the same, and substrate warping monitoring method |
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