TWI912153B - Heat dissipation plate, heat dissipation device and computing device - Google Patents

Abstract

A heat dissipation plate includes a frame, a cold plate and a vapor chamber. The frame is provided with a first accommodation chamber, a second accommodation chamber and a first opening. The first accommodation chamber is in space connection with the second accommodation chamber. The first opening is in space connection with the second accommodation chamber. The cold plate is mounted in the first accommodation chamber. The cold plate is provided with a liquid cooling chamber in which a liquid coolant is provided. The cold plate is provided with a liquid inlet and a liquid outlet that are in space connection with the liquid cooling chamber. The vapor chamber is mounted in the second accommodation chamber. The vapor chamber is provided with an evaporation surface disposed facing the first opening and a condensation surface connected to the cold plate. The condensation surface of the vapor chamber is provided with a plurality of protrusions that are spaced apart and arranged along a first direction of the heat dissipation plate. The cold plate is provided with a plurality of grooves at one end thereof connected to the vapor chamber, with each protrusion disposed in a corresponding groove. The vapor chamber is provided with a phase-change medium therein.

Description

Heat sink, heat dissipation device and computing equipment

This application relates to the field of computer accessories technology, and in particular to a heatsink, heat dissipation device and computing equipment.

With the acceleration of global digitalization and the explosive growth in computing power demand, server chips are becoming increasingly powerful and demanding in terms of heat dissipation during iterative upgrades.

To meet the ever-increasing heat dissipation demands of server chips, the heat dissipation capabilities of cooling devices need continuous improvement. Current cooling devices are cold plate heatsinks, which rely on liquid cooling media flowing inside the cold plate to remove surface heat from the chip. However, the convective heat transfer capacity of this single-phase liquid is limited, making it difficult to meet the heat dissipation requirements of high-power chips. Therefore, current cooling devices suffer from low heat exchange efficiency and poor heat dissipation capabilities.

Therefore, it is necessary to provide a heat dissipation plate, a heat dissipation device, and a computing device to address the problems of low heat exchange efficiency and poor heat dissipation capacity of heat dissipation devices.

This invention provides a heat dissipation plate, comprising:

A frame having a first receiving cavity, a second receiving cavity, and a first opening, wherein the first receiving cavity is connected to the second receiving cavity, and the first opening is connected to the second receiving cavity;

A cold plate is installed in the first accommodating cavity. The cold plate is provided with a liquid cooling cavity, which is provided with a liquid cooling medium. The cold plate is provided with a liquid inlet and a liquid outlet, both of which are connected to the liquid cooling cavity.

The heat spreader is installed in the second accommodating cavity and has an evaporation end face and a condensation end face. The evaporation end face faces the first opening and the condensation end face is connected to the cold plate. The heat spreader has multiple protrusions on the condensation end face, which are spaced apart along the first direction of the heat dissipation plate. The end of the cold plate connected to the heat spreader has multiple grooves, and the protrusions are correspondingly disposed in the grooves. The heat spreader contains a phase change medium.

In one embodiment, the heat spreader includes a capillary wick, the heat spreader is provided with a first vacuum chamber, the phase change medium is disposed in the first vacuum chamber, the protrusion is provided with a second vacuum chamber, the second vacuum chamber is connected to the first vacuum chamber, and the capillary wick covers the inner wall of the first vacuum chamber and/or the inner wall of the second vacuum chamber.

In one embodiment, the heat spreader includes a support member, one end of which is connected to the evaporation end face and the other end of which is connected to the condensation end face.

In one embodiment, the support includes multiple members, one end of which is obliquely arranged to the evaporation end face, and the other end of which is obliquely arranged to the condensation end face. The multiple support members are connected end to end in the first vacuum cavity to form a zigzag structure.

Alternatively, one end of the support is perpendicularly connected to the evaporation end face, and the other end of the support is perpendicularly connected to the condensation end face.

In one embodiment, the frame is further provided with a limiting portion connected to one end of the frame near the first opening.

In one embodiment, the frame is further provided with a second opening, which is located on the side opposite to the first opening. The end face of the cold plate away from the heat spreader faces the second opening, and the liquid inlet and the liquid outlet are both located on the end face of the cold plate away from the heat spreader.

In one embodiment, the heat dissipation plate further includes fasteners disposed on the frame for connecting the frame to heat dissipation elements.

In one embodiment, the fastener includes two bolts, which are respectively disposed on both sides of the frame. The frame has connecting holes through which the bolts are connected to heat dissipation components.

The present invention also provides a heat dissipation device, including a water pump, a first pipe, a second pipe, a water tank, and a heat dissipation plate as described in any of the above embodiments. The output end of the water tank and the liquid inlet of the heat dissipation plate are connected through the first pipe, and the liquid outlet of the heat dissipation plate and the input end of the water tank are connected through the second pipe. The water tank, the heat dissipation plate, the first pipe, and the second pipe are sequentially connected to form a circulation pipe, and the water pump is disposed in the circulation pipe.

The present invention also provides a computing device, including a computing element and a heat dissipation plate as described in the above embodiments, wherein the heat dissipation device is mounted on the computing element.

The aforementioned heat dissipation plate is constructed by installing a cold plate in the first accommodating cavity of the frame and a heat spreader in the second accommodating cavity of the frame. The condensation end face of the cold plate is connected to the heat spreader, which has multiple protrusions. The cold plate has grooves to allow the protrusions to fit into the grooves. The evaporation end face of the heat spreader is used to mount the component to be cooled. The heat from the component is transferred to the heat spreader, causing the phase change medium to absorb heat and evaporate from liquid to gas. After the phase change medium becomes gas, it rises into the protrusions. Since the cold plate inputs liquid cooling medium into the liquid cooling cavity through the liquid inlet, the grooves of the cold plate wrap around the protrusions of the heat spreader, thereby increasing the contact area between the cold plate and the heat spreader. This allows the heat from the heat spreader to be transferred to the cold plate more quickly, causing the evaporated gaseous phase change medium to condense into a liquid phase change medium. The alternating evaporation and condensation processes inside the vapor chamber remove a significant amount of heat. Therefore, relying on phase change heat transfer through liquid evaporation and gas condensation, compared to simple convection heat transfer through the cold plate, can transfer more heat in a shorter time, significantly enhancing the heat dissipation capacity of the heat exchanger and thus reducing the temperature of the components. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

The above description of the contents of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention.

To make the aforementioned objectives, features, and advantages of this application more apparent, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are elaborated in the following description to provide a full understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the scope of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

In the description of this application, it should be understood that if terms such as "center", "longitudinal", "horizontal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the diagram, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application.

Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature marked "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, the term "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixation," etc., should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal connections between two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirectly contacted through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature may mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature may mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

It should be noted that if a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. If a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiments.

Referring to Figure 1, a schematic diagram of the structure of a heat dissipation plate according to an embodiment of this application is shown. The heat dissipation plate includes a frame 100, a cold plate 200, and a heat spreader 300. The frame 100 is provided with a first accommodating cavity 100A, a second accommodating cavity 100B, and a first opening 100C. The first accommodating cavity 100A is connected to the second accommodating cavity 100B, and the first opening 100C is connected to the second accommodating cavity 100B. The cold plate 200 is installed in the first accommodating cavity 100A and is provided with a liquid cooling cavity 210A. The liquid cooling cavity 210A is provided with a liquid cooling medium. The cold plate 200 is provided with a liquid inlet 210B and a liquid outlet 210C, both of which are connected to the liquid cooling cavity 210A. A heat spreader 300 is installed in the second accommodating cavity 100B. The heat spreader 300 has an evaporation end face 311 and a condensation end face 312. The evaporation end face 311 faces the first opening 100C, and the condensation end face 312 is connected to the cold plate 200. The heat spreader 300 has multiple protrusions 301 on the condensation end face 312, which are spaced apart along the first direction of the heat spreader. The end of the cold plate 200 connected to the heat spreader 300 has multiple grooves 210D, and the protrusions 301 are correspondingly disposed in the grooves 210D. The heat spreader 300 contains a phase change medium. The first direction of the heat spreader is the length direction of the heat spreader, as shown in the X-axis direction of Figure 1.

In an alternative embodiment, the frame 100 is a cuboid structure, and the cold plate 200 and the heat spreader 300 are stacked within the frame 100.

In an alternative embodiment, as shown in Figure 1, the first accommodating cavity 100A is located above the second accommodating cavity 100B, and the heating element to be installed is located below the second accommodating cavity 100B. That is, the first accommodating cavity 100A is disposed at the end of the second accommodating cavity 100B away from the heating element, and the cold plate 200 is connected to the end of the heat spreader 300 away from the heating element.

The heat dissipation plate described in this application embodiment comprises a cold plate 200 installed in the first receiving cavity 100A of the frame 100, and a heat spreader 300 installed in the second receiving cavity 100B of the frame 100. The cold plate 200 is connected to the condensation end face 312 of the heat spreader 300, which is connected to multiple protrusions 301. The cold plate 200 is provided with a groove 210D, which allows the protrusions 301 to fit into the groove 210D. The evaporation end face 311 of the heat spreader 300 is used to mount the element to be dissipated. The heat of the element to be dissipated is transferred to the heat spreader 300, causing the phase change medium to absorb heat. The heat is absorbed as the liquid evaporates into gas, as shown by the arrows in the heat spreader 300 in Figure 1. After the phase change medium becomes gas, it rises into the protrusion 301. Since the cold plate 200 inputs liquid cooling medium into the liquid cooling cavity 210A through the liquid inlet 210B, the groove 210D of the cold plate 200 covers the protrusion 301 of the heat spreader 300. That is to say, the protrusion 301 acts as a heat dissipation fin of the heat spreader 300, thereby increasing the contact area between the cold plate 200 and the heat spreader 300, so that the heat of the heat spreader 300 is transferred to the cold plate 200 more quickly, causing the evaporated gaseous phase change medium to condense into a liquid phase change medium. The alternating process of evaporation and condensation inside the heat spreader 300 removes a large amount of heat.

The heat dissipation plate described in this application embodiment, by setting a phase change medium in the heat spreader 300, relies on the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium to transfer the heat on the component that needs to be dissipated to the cold plate 200 and be carried away by the liquid cooling medium. Compared with the convection heat transfer of the cold plate 200 alone, more heat can be transferred in a short time, which can significantly enhance the heat dissipation capacity of the heat dissipation plate and thus reduce the temperature of the component. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

In one exemplary embodiment, the heat sink operates such that the evaporation end face 311 of the heat sink contacts the encapsulation surface of the component to be cooled through a thermally conductive contact material, wherein the thermally conductive contact material can be thermal paste, thermally conductive pad, thermally conductive sealant, etc.

In some embodiments, as shown in Figure 1, the heat spreader 300 includes a capillary wick 320. The heat spreader 300 is provided with a first vacuum chamber 310A, in which the phase change medium is disposed. A protrusion 301 is provided with a second vacuum chamber 301A, which is connected to the first vacuum chamber 310A. The capillary wick 320 covers the inner wall of the first vacuum chamber 310A and/or the inner wall of the second vacuum chamber 301A. By providing a sealed first vacuum chamber 310A inside the heat spreader 300 and a second vacuum chamber 301A connected to the first vacuum chamber 310A on the protrusion 301, the sealed first vacuum chamber 310A and the second vacuum chamber 301A can ensure efficient phase change circulation of the phase change medium within the heat spreader 300. The phase change medium is disposed in the first vacuum chamber 310A. When the phase change medium is heated, it becomes gaseous and rises to the second vacuum chamber 301A. The protrusion 301 acts as a heat dissipation part of the heat spreader 300, accelerating the heat transfer to the cold plate 200, so that the gaseous phase change medium turns back into a liquid phase change medium. The capillary wick 320 covers the inner wall of the first vacuum chamber 310A and the inner wall of the second vacuum chamber 301A. Driven by the capillary force, the liquid phase change medium condensed in the protrusion 301 flows back to the evaporation end face 311, forming a circulation and reflux of the phase change medium.

Furthermore, the heat spreader 300 includes a support member 330, one end of which is connected to the evaporation end face 311, and the other end of which is connected to the condensation end face 312. A support member 330 is also provided inside the first vacuum chamber 310A, with its two ends connected to the evaporation end face 311 and the condensation end face 312 respectively, thereby providing support for the evaporation end face 311 and the condensation end face 312, preventing the heat spreader 300 from being deformed under pressure, and maintaining the stability of the first vacuum chamber 310A.

In one exemplary embodiment, the support 330 is a cylindrical structure, with the two ends of the cylinder connected to the evaporation end face 311 and the condensation end face 312, respectively.

In one exemplary embodiment, the vapor chamber 300 is made of a highly thermally conductive metal, such as copper or a copper-aluminum alloy, thereby improving the thermal conductivity of the vapor chamber 300 and thus improving the heat dissipation efficiency of the heat sink. In other embodiments, the vapor chamber 300 may also be made of aluminum to suit certain lightweight applications.

In one exemplary embodiment, the support member 330 is made of the same metal material as the heat spreader 300, so that the support member 330 provides a certain strength support for the heat spreader 300.

In an alternative embodiment, the protrusion 301 and the heat spreader 300 are integrally formed and connected. By making the protrusion 301 integrally connected with the heat spreader 300, the first vacuum chamber 310A and the second vacuum chamber 301A are made into sealed vacuum chambers, thereby improving the sealing and stability of the first vacuum chamber 310A and the second vacuum chamber 301A, and thus improving the stability of the heat dissipation plate in use.

In an alternative embodiment, as shown in Figure 1, the support member 330 includes multiple members, one end of which is obliquely arranged to the evaporation end face 311, and the other end of which is obliquely arranged to the condensation end face 312. The multiple support members 330 are connected end to end in the first vacuum chamber 310A to form a zigzag structure. By setting the end faces of the support member 330 and the heat spreader 300 to an inclined state, and connecting multiple support members 330 into a zigzag structure, the support structure of the support member 330 is made more stable, preventing deformation of the evaporation end face 311 and the condensation end face 312 of the heat spreader 300, which would lead to insufficient connection between the heat spreader 300 and the cold plate 200, thereby avoiding affecting the heat conduction and improving the heat dissipation efficiency of the heat dissipation plate. Moreover, the inclined state of the support member 330 can also be used to guide the phase change medium that has condensed into a liquid state, so that the deformable medium can form a circulation.

In other embodiments, as shown in Figure 2, one end of the support 330 is perpendicularly connected to the evaporation end face 311, and the other end of the support 330 is perpendicularly connected to the condensation end face 312. Positioning the support 330 perpendicularly to the evaporation end face 311 and the condensation end face 312 also provides support for the heat spreader 300, preventing deformation of the heat spreader 300.

In an alternative embodiment, as shown in Figure 1, the frame 100 is further provided with a limiting part 120, which is connected to one end of the frame 100 near the first opening 100C. By providing the limiting part 120 at one end of the first opening 100C, when the heat dissipation plate is installed on the component to be dissipated, the limiting part 120 can be locked onto the side of the component, thereby making the heat dissipation plate installation more accurate, ensuring that the heat spreader 300 of the heat dissipation plate is aligned with the position of the component, and ensuring the heat dissipation effect of the heat dissipation plate.

In one exemplary embodiment, a gap is provided between the heat spreader 300 and the first opening 100C, so that the frame 100 protruding from the evaporation end face 311 of the heat spreader 300 forms a limiting portion 120.

In one exemplary embodiment, as shown in FIG2, the evaporation end face 311 of the heat spreader 300 is flush with the first opening 100C. The heat spreader 300 is stably installed by confining it inside the second receiving cavity 100B of the frame 100.

In an alternative embodiment, the capillary wick 320 is a mesh capillary wick, a sintered capillary wick, or a grooved capillary wick. The mesh capillary wick is composed of multiple layers of woven metal wires stacked together, exhibiting high permeability and low flow resistance to the gaseous phase change medium. The sintered capillary wick is a porous structure formed by high-temperature sintering of metal powder, possessing extremely strong capillary force, enabling rapid pumping of the phase change medium back to the evaporation end face 311. The grooved capillary core has microgrooves mechanically or chemically etched into the inner wall of the heat spreader 300, opening up diffusion channels for the gaseous phase change medium and maximizing permeability. Through the differentiated design of the capillary core 320, the heat spreader can be precisely matched to the thermal management needs of different scenarios, achieving an optimal balance between efficiency, cost, and reliability.

In one alternative embodiment, the phase change medium is either ultrapure water or ethanol. Ultrapure water has a latent heat of vaporization of 2260 kJ/kg, allowing it to absorb more heat per unit mass, making it suitable for high-power heat dissipation applications. Ethanol has a freezing point as low as -114°C, making it suitable for extremely low-temperature environments and preventing freezing failure of the phase change medium. By appropriately selecting the phase change medium, the heatsink can precisely match the heat source characteristics and environmental conditions, maximizing heat dissipation efficiency and reliability.

In an alternative embodiment, as shown in Figure 1, the frame 100 is further provided with a second opening 100D, which is located on the opposite side of the first opening 100C. The end face of the cold plate 200 away from the heat spreader 300 faces the second opening 100D, and the liquid inlet 210B and the liquid outlet 210C are both located on the end face of the cold plate 200 away from the heat spreader 300. By providing the second opening 100D on the opposite side of the frame 100, the liquid inlet 210B and the liquid outlet 210C on the cold plate 200 are located at the second opening 100D, which facilitates the connection of the liquid inlet 210B and the liquid outlet 210C to pipes, and has the advantage of convenient operation.

In an alternative embodiment, as shown in Figure 1, the heatsink further includes a fastener 110 disposed on the frame 100 for connecting the frame 100 to a heat-dissipating component. The heatsink can be mounted to the component requiring heat dissipation via the fastener 110, thereby tightly connecting the heatsink to the component and transferring heat from the component to the heatsink.

In one exemplary embodiment, the fastener 110 includes two bolts, which are respectively disposed on both sides of the frame 100. The frame 100 has connection holes, through which the bolts connect to the heat dissipation components. By connecting the heat dissipation components with the bolts, the heat dissipation plate is fixed to the components that need heat dissipation, so that the heat dissipation plate and the components are tightly connected, ensuring the heat dissipation effect of the heat dissipation plate.

In another exemplary embodiment, the fastener 110 is a snap-fit, and the component to be cooled has a claw that engages with the snap-fit. The snap-fit is used to detachably connect with the claw of the component to be cooled, thereby securing the heat dissipation plate to the component to be cooled, and has the advantage of easy disassembly.

On the other hand, this application embodiment also provides a heat dissipation device, including a water pump, a first pipe, a second pipe, a water tank, and a heat dissipation plate as described in any of the above embodiments. The output end of the water tank and the liquid inlet 210B of the heat dissipation plate are connected through the first pipe, and the liquid outlet 210C of the heat dissipation plate and the input end of the water tank are connected through the second pipe. The water tank, the heat dissipation plate, the first pipe, and the second pipe are sequentially connected to form a circulation pipe, and the water pump is installed in the circulation pipe.

The heat dissipation device described in this embodiment uses a water pump to input liquid cooling medium from the water tank into the heat dissipation plate, thereby removing heat from the heat dissipation plate and achieving the purpose of cooling. The heat dissipation plate uses a phase change medium installed in the heat spreader 300. Relying on the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium, the heat on the components that need to be cooled is transferred to the cold plate 200 and carried away by the liquid cooling medium. Compared with the convection heat transfer of the cold plate 200 alone, more heat can be transferred in a short time, which can significantly enhance the heat dissipation capacity of the heat dissipation plate and thus reduce the temperature of the components. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

On the other hand, this application embodiment also provides a computing device, including a computing element and a heat dissipation plate as described in any of the above embodiments, with a heat dissipation device mounted on the computing element.

The computing device described in this embodiment dissipates heat from the computing elements by installing a heat dissipation device on them, ensuring stable operation of the computing elements. The heat dissipation device is equipped with a heat dissipation plate, which is connected to the computing elements. The heat dissipation plate uses a phase change medium installed in the heat spreader 300. Relying on the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium, the heat on the elements that need to be dissipated is transferred to the cold plate 200 and carried away by the liquid cooling medium. Compared with the convection heat transfer of the cold plate 200 alone, more heat can be transferred in a short time, which can significantly enhance the heat dissipation capacity of the heat dissipation plate and thus reduce the temperature of the elements. With the same power consumption of the computing element, the heat dissipation plate of this embodiment can tolerate a higher inlet water temperature, which can reduce the power of the heat dissipation device, save the operating cost of the heat dissipation device, and has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The embodiments described above merely illustrate several implementations of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application shall be determined by the appended claims.

100: Frame; 100A: First accommodating cavity; 100B: Second accommodating cavity; 100C: First opening; 100D: Second opening; 110: Fastener; 120: Limiting part; 200: Cold plate; 210A: Liquid cooling cavity; 210B: Liquid inlet; 210C: Liquid outlet; 210D: Groove; 300: Heat spreader; 301: Protrusion; 301A: Second vacuum cavity; 311: Evaporation end face; 312: Condensation end face; 310A: First vacuum cavity; 320: Capillary wick; 330: Support component.

Figure 1 is a schematic diagram of the structure of the heat dissipation plate according to an embodiment of this application. Figure 2 is a schematic diagram of the structure of the heat dissipation plate according to another embodiment of this application.

100: Framework

100A: First accommodating cavity

100B: Second accommodating cavity

100C: First opening

100D: Second Opening

110: Fasteners

120: Limiting part

200: Cold Plate

210A: Liquid cooling chamber

210B: Liquid Inlet

210C: Liquid outlet

210D: Groove

300: Heat Spreader Plate

301: Protrusion

301A: Second Vacuum Chamber

311: Evaporation end face

312: Condensation end face

310A: First Vacuum Chamber

320: Fine Hair Core

330: Support component

Claims (7)

A heat dissipation plate includes: a frame having a first accommodating cavity, a second accommodating cavity, and a first opening, the first accommodating cavity communicating with the second accommodating cavity, and the first opening communicating with the second accommodating cavity; a cold plate installed in the first accommodating cavity, the cold plate having a liquid cooling cavity containing a liquid cooling medium, the cold plate having a liquid inlet and a liquid outlet, both of which are communicating with the liquid cooling cavity; and a heat spreader installed in the second accommodating cavity, the heat spreader having an evaporation end face and a condensation end face, the evaporation end face facing the first opening, the condensation end face being connected to the cold plate, the heat spreader having a plurality of protrusions on the condensation end face, the protrusions being spaced apart along a first direction of the heat dissipation plate, and the end of the cold plate connected to the heat spreader having a plurality of The heat spreader has a groove, and the protrusions are correspondingly disposed in the groove. The heat spreader includes a capillary wick. The heat spreader has a first vacuum chamber, and a phase change medium is disposed inside the first vacuum chamber. The protrusions have a second vacuum chamber, which is connected to the first vacuum chamber. The capillary wicks cover the inner wall of the first vacuum chamber and/or the inner wall of the second vacuum chamber. The heat spreader includes multiple support members. One end of each support member is connected to the evaporation end face and is obliquely disposed to the evaporation end face. The other end of each support member is connected to the condensation end face and is obliquely disposed to the condensation end face. The multiple support members are connected end to end in the first vacuum chamber to form a zigzag line structure. Alternatively, one end of each support member is perpendicularly connected to the evaporation end face, and the other end of each support member is perpendicularly connected to the condensation end face. The heat dissipation plate as described in claim 1, wherein the frame is further provided with a limiting portion connected to one end of the frame near the first opening. As described in claim 1, the heat dissipation plate, wherein the frame is further provided with a second opening, the second opening being disposed on the side opposite to the first opening, the end face of the cold plate away from the heat spreader facing the second opening, and the liquid inlet and the liquid outlet being disposed on the end face of the cold plate away from the heat spreader. The heatsink as described in claim 1, wherein the heatsink further includes fasteners disposed on the frame for connecting the frame to heat-dissipating elements. The heat dissipation plate as described in claim 4, wherein the fasteners include two bolts, the two bolts are respectively disposed on both sides of the frame, the frame is provided with connecting holes, and the bolts are connected to the heat dissipation components through the connecting holes. A heat dissipation device includes: a water pump, a first pipe, a second pipe, a water tank, and a heat dissipation plate as described in any one of claims 1-5. The output end of the water tank and the liquid inlet of the heat dissipation plate are connected through the first pipe, and the liquid outlet of the heat dissipation plate and the input end of the water tank are connected through the second pipe. The water tank, the heat dissipation plate, the first pipe, and the second pipe are sequentially connected to form a circulation pipeline, and the water pump is disposed in the circulation pipeline. A computing device includes: a computing element and a heat dissipation plate as described in claim 6, wherein the heat dissipation device is mounted on the computing element.