TWI911731B - Dual ultra-wideband antenna module - Google Patents
Dual ultra-wideband antenna moduleInfo
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- TWI911731B TWI911731B TW113117299A TW113117299A TWI911731B TW I911731 B TWI911731 B TW I911731B TW 113117299 A TW113117299 A TW 113117299A TW 113117299 A TW113117299 A TW 113117299A TW I911731 B TWI911731 B TW I911731B
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Abstract
Description
本發明有關於一種天線模組，且特別是一種雙超寬頻天線模組。 This invention relates to an antenna module, and more particularly to a dual ultra-wideband antenna module.
工業用無線裝置，例如是工業用無線控制裝置的成本很高昂，其原因不但在於裝置可靠度的要求很高，也在於工業用裝置的應用情境繁多，使得工業用無線裝置的設計廠商盡可能設計應用層面廣的機種型號，以減少開發機型項目，不但減少研發成本，也減少量產之後產線布置成本，藉以更加符合經濟效益。 Industrial wireless devices, such as industrial wireless control devices, are very expensive. This is not only due to the high reliability requirements but also because industrial devices are used in a wide variety of scenarios. As a result, manufacturers design models with broad application ranges to reduce the number of development projects, thereby reducing R&D costs and production line setup costs after mass production, thus achieving greater economic efficiency.
因為工業用無線裝置對於其使用壽命長度的需求比一般消費性產品來得高，研製廠商為了提高可靠度而往往使用同一個無線模組的公版應用於多種機型，公版通常將電路部分與天線部分各自獨立，參照圖1與圖2，電路1與天線2是彼此獨立分開的，天線2則通常需要一個獨立的天線淨空區。公版的設計是期望在當產品更新版本時能減少各電路參數之間的互相干擾因素。但當要改變通信規格時，因為無線晶片不同，所使用的天線也因而改變，使得最終結果仍然要將整個電路板進行完全重新設計，而造成工業用無線裝置的整機研發成本始終難以顯著減少。 Because industrial wireless devices require a longer lifespan than general consumer products, manufacturers often use a reference design of the same wireless module across multiple models to improve reliability. This reference design typically separates the circuitry and antenna sections. Referring to Figures 1 and 2, circuit 1 and antenna 2 are independent, and antenna 2 usually requires a separate antenna clearance. The reference design aims to reduce interference between circuit parameters when product versions are updated. However, when communication specifications are changed, the antenna used also changes due to different wireless chips, ultimately requiring a complete redesign of the entire circuit board. This makes it difficult to significantly reduce the overall development cost of industrial wireless devices.
為了解決前述的技術問題，本發明實施例提供一種 雙超寬頻天線模組，可用於替換傳統無線模組，達到在性能提升的(或改進)的同時也能減少開發成本。 To address the aforementioned technical issues, this invention provides a dual ultra-wideband antenna module that can replace traditional wireless modules, achieving performance improvements (or enhancements) while reducing development costs.
本發明實施例提供一種雙超寬頻天線模組，包括陶瓷基底、第一超寬頻天線以及第二超寬頻天線。陶瓷基底具有第一側面、第二側面、第三側面、第四側面、頂面與底部凹槽，第一側面、第二側面、第三側面與第四側面連接頂面的四周，其中第一側面連接第二側面，第二側面連接第三側面，第四側面連接第三側面與第一側面，其中頂面設有隔離部，隔離部連接接地部，接地部位於第二側面，其中底部凹槽用以容置無線模組。第一超寬頻天線具有第一天線部、第一短路部與第一饋線部，其中第一天線部與第一短路部位於第二側面，且位於接地部的右側，其中第一饋線部位於第一側面，第一短路部與第一饋線部皆連接第一天線部。第二超寬頻天線具有第二天線部、第二短路部與第二饋線部，其中第二天線部與第二短路部位於第二側面，且位於接地部的左側，其中第二饋線部位於第三側面，第二短路部與第二饋線部皆連接第二天線部。 This invention provides a dual ultra-wideband antenna module, including a ceramic substrate, a first ultra-wideband antenna, and a second ultra-wideband antenna. The ceramic substrate has a first side, a second side, a third side, a fourth side, a top surface, and a bottom groove. The first, second, third, and fourth sides are connected to the perimeter of the top surface, wherein the first side is connected to the second side, the second side is connected to the third side, and the fourth side is connected to the third side and the first side. The top surface has an isolation portion connected to a grounding portion, and the grounding portion is located on the second side. The bottom groove is used to accommodate the wireless module. The first ultra-wideband antenna has a first antenna section, a first short-circuit section, and a first feed line section. The first antenna section and the first short-circuit section are located on a second side, to the right of the grounding section. The first feed line section is located on a first side, and both the first short-circuit section and the first feed line section are connected to the first antenna section. The second ultra-wideband antenna has a second antenna section, a second short-circuit section, and a second feed line section. The second antenna section and the second short-circuit section are located on a second side, to the left of the grounding section. The second feed line section is located on a third side, and both the second short-circuit section and the second feed line section are connected to the second antenna section.
綜上所述，本發明實施例提供一種雙超寬頻天線模組，能夠以立體堆疊方式整合天線及無線模組，更能使舊型無線裝置不需要修改其裝置的主電路板的電路設計，本發明所提供的雙超寬頻天線模組能夠取代傳統的天線及無線模組而可提供超寬頻工作頻帶的應用。因為當應用在電路板上時僅使用到傳統無線模組的佔用面積，而可直接免除天線淨空區的使用需要，使得傳統的舊型無線模組可輕易被升級為新種類的超寬頻無線模組。因此，本發明的單一模組能廣泛應用於多種不同型號的無線裝置機 種，而能以減少對於電路板做設計變更的情況下完成無線機種的更新與升級。再者，即使應用於新產品設計也能減少天線模組的佔用面積，具有很高的產業應用價值。 In summary, this invention provides a dual ultra-wideband antenna module that integrates antenna and wireless modules in a three-dimensional stacking manner. Furthermore, it eliminates the need to modify the main circuit board design of older wireless devices. The dual ultra-wideband antenna module provided by this invention can replace traditional antenna and wireless modules, providing ultra-wideband operating frequency applications. Because it only uses the space occupied by traditional wireless modules when applied to a circuit board, the need for antenna clearance is eliminated, allowing traditional older wireless modules to be easily upgraded to this new type of ultra-wideband wireless module. Therefore, this invention's single module can be widely used in various models of wireless devices, enabling the upgrading and replacement of wireless models with minimal changes to the circuit board design. Furthermore, even when applied to new product designs, it reduces the footprint of the antenna module, demonstrating high industrial application value.
為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明之詳細說明與附圖，但是此等說明與所附圖式僅是用來說明本發明，而非對本發明的權利範圍作任何的限制。 To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are for illustrative purposes only and do not constitute any limitation on the scope of the invention.
1:電路 1: Circuit
2:天線 2: Antenna
30:陶瓷基底 30: Ceramic substrate
31:第一超寬頻天線 31: First Ultra-Broadband Antenna
32:第二超寬頻天線 32: Second Ultra-Broadband Antenna
301:第一側面 301: First Side
302:第二側面 302: Second side
303:第三側面 303: Third Side
304:第四側面 304: Fourth side
305:頂面 305: Top surface
306:底部凹槽 306: Bottom recess
33:隔離部 33: Isolation Section
34:接地部 34: Grounding Part
4:無線模組 4: Wireless Module
311:第一天線部 311: First Line Division
312:第一短路部 312: First Short Circuit Section
313:第一饋線部 313: First Feeder Section
321:第二天線部 321: The Second Day Line
322:第二短路部 322: Second Short Circuit Section
323:第二饋線部 323: Second Feeder Section
G:底面接地區 G: Bottom grounding area
5:藍牙天線 5: Bluetooth antenna
51:藍牙輻射體 51: Bluetooth Radiation
52:藍牙饋入部 52: Bluetooth Feeding Introduction
53:藍牙短路部 53: Bluetooth short circuit section
S:信號區塊 S: Signal Block
P:電源區塊 P: Power Block
EG:接地延伸區 EG: Grounding Extension Area
A-A:截面 A-A: Section
H:深度 H: Depth
圖1是傳統的工業用無線裝置的無線模組的示意圖。 Figure 1 is a schematic diagram of a wireless module in a traditional industrial wireless device.
圖2是傳統的工業用無線裝置的無線模組的示意圖。 Figure 2 is a schematic diagram of a wireless module in a traditional industrial wireless device.
圖3是本發明實施例提供的雙超寬頻天線模組的底部凹槽的示意圖。 Figure 3 is a schematic diagram of the bottom recess of the dual ultra-wideband antenna module provided in this embodiment of the invention.
圖4是本發明實施例提供的雙超寬頻天線模組的頂面的示意圖。 Figure 4 is a schematic diagram of the top surface of the dual ultra-wideband antenna module provided in this embodiment of the invention.
圖5是本發明實施例提供的雙超寬頻天線模組的第一側面的示意圖。 Figure 5 is a schematic diagram of the first side of the dual ultra-wideband antenna module provided in this embodiment of the invention.
圖6是本發明實施例提供的雙超寬頻天線模組的第二側面的示意圖。 Figure 6 is a schematic diagram of the second side of the dual ultra-wideband antenna module provided in this embodiment of the invention.
圖7是本發明實施例提供的雙超寬頻天線模組的第三側面的示意圖。 Figure 7 is a schematic diagram of the third side of the dual ultra-wideband antenna module provided in this embodiment of the invention.
圖8是本發明實施例提供的雙超寬頻天線模組的第四側面的示意圖。 Figure 8 is a schematic diagram of the fourth side of the dual ultra-wideband antenna module provided in this embodiment of the invention.
圖9是本發明實施例提供的雙超寬頻天線模組的第一視角 的立體圖。 Figure 9 is a first-view perspective perspective of the dual ultra-wideband antenna module provided in this embodiment of the invention.
圖10是本發明實施例提供的雙超寬頻天線模組的第二視角的立體圖。 Figure 10 is a second perspective perspective view of the dual ultra-wideband antenna module provided in this embodiment of the invention.
圖11是本發明實施例提供的雙超寬頻天線模組的對於截面A-A的剖面圖。 Figure 11 is a cross-sectional view along section A-A of the dual ultra-wideband antenna module provided in this embodiment of the invention.
請參照圖3至圖11，本發明實施例提供的雙超寬頻天線模組主要應用於工業用無線裝置。雙超寬頻天線模組包括陶瓷基底30、第一超寬頻天線31以及第二超寬頻天線32。圖3至圖8是各個視角的圖，圖9及圖10是立體圖，圖11是陶瓷基底30的截面圖。陶瓷基底30具有第一側面301、第二側面302、第三側面303、第四側面304、頂面305與底部凹槽306。雙超寬頻天線模組的外觀大致是一個長方體，圖3是底部凹槽306的示意圖，圖4是頂面305的示意圖，頂面305的四周有四個面，第一側面301、第二側面302、第三側面303與第四側面304連接頂面305的四周。圖1所示的第一側面301是連接圖6所示的第二側面302，圖6所示的第二側面302連接圖7所示的第三側面303，第四側面304連接第三側面303與第一側面301，其中頂面305設有隔離部33，隔離部33連接接地部34，接地部34位於第二側面302。底部凹槽306用以容置無線模組4，在圖3中的無線模組4是位於底部凹槽306的空間之內。而在圖9及圖10，為了顯示底部凹槽306的立體空間，因此不繪示出無線模組4的本體，所述無線模組4例如是一個外觀為晶片化的系統單晶片 (System on a Chip，SoC)。而圖11繪示了截面A-A的情況，也表示出凹槽的深度H。 Referring to Figures 3 to 11, the dual ultra-wideband antenna module provided in this embodiment is mainly used in industrial wireless devices. The dual ultra-wideband antenna module includes a ceramic substrate 30, a first ultra-wideband antenna 31, and a second ultra-wideband antenna 32. Figures 3 to 8 are perspective views, Figures 9 and 10 are perspective views, and Figure 11 is a cross-sectional view of the ceramic substrate 30. The ceramic substrate 30 has a first side surface 301, a second side surface 302, a third side surface 303, a fourth side surface 304, a top surface 305, and a bottom groove 306. The dual ultra-wideband antenna module is roughly rectangular in shape. Figure 3 is a schematic diagram of the bottom recess 306, and Figure 4 is a schematic diagram of the top surface 305. The top surface 305 has four sides: the first side 301, the second side 302, the third side 303, and the fourth side 304, which are connected to the four sides of the top surface 305. The first side 301 shown in Figure 1 is connected to the second side 302 shown in Figure 6. The second side 302 shown in Figure 6 is connected to the third side 303 shown in Figure 7. The fourth side 304 is connected to the third side 303 and the first side 301. The top surface 305 is provided with an isolation part 33, which is connected to a grounding part 34, which is located on the second side 302. The bottom recess 306 is used to accommodate the wireless module 4, which is located within the space of the bottom recess 306 in Figure 3. In Figures 9 and 10, to show the three-dimensional space of the bottom recess 306, the wireless module 4 itself is not shown; the wireless module 4 is, for example, a system-on-a-chip (SoC) with a chip-like appearance. Figure 11 illustrates the cross-section A-A and also shows the depth H of the recess.
以上圖面，對於陶瓷基底30各表面的金屬結構(如天線圖案或線路)皆以其厚度接近為零的情況去示意，僅是用以方便製圖表示。實際上，以習知的陶瓷製程，本實施例所述的相關天線圖案(或線路狀態)在陶瓷基底30的表面都是具有一定厚度的，只是相對於陶瓷基底30的尺寸而言是大致可以忽略其厚度，不做贅述。第一超寬頻天線31具有第一天線部311、第一短路部312與第一饋線部313，其中第一天線部311與第一短路部312位於第二側面302，且位於接地部34的右側，其中第一饋線部313位於第一側面301，第一短路部312與第一饋線部313皆連接第一天線部311。詳細的說，第一饋線部313通過第一側面301與第二側面302的交接處連接第一天線部311。 The above figures illustrate the metal structures (such as antenna patterns or lines) on each surface of the ceramic substrate 30 with a thickness close to zero, solely for ease of illustration. In reality, with conventional ceramic manufacturing processes, the antenna patterns (or line configurations) described in this embodiment all have a certain thickness on the surface of the ceramic substrate 30, but this thickness is negligible relative to the size of the ceramic substrate 30 and will not be elaborated upon. The first ultra-wideband antenna 31 has a first antenna section 311, a first short-circuit section 312, and a first feed section 313. The first antenna section 311 and the first short-circuit section 312 are located on the second side 302, to the right of the grounding section 34. The first feed section 313 is located on the first side 301. Both the first short-circuit section 312 and the first feed section 313 are connected to the first antenna section 311. Specifically, the first feed section 313 is connected to the first antenna section 311 through the junction of the first side 301 and the second side 302.
第二超寬頻天線32具有第二天線部321、第二短路部322與第二饋線部323，其中第二天線部321與第二短路部322位於第二側面302，且位於接地部34的左側，其中第二饋線部323位於第三側面303，第二短路部322與第二饋線部323皆連接第二天線部321。詳細的說，第二饋線部323通過第三側面303與第二側面302的交接處連接第二天線部321。接地部34、第一短路部312與第二短路部322連接底部凹槽306的底面接地區G，第一饋線部313與第二饋線部323不連接底面接地區G。 The second ultra-wideband antenna 32 has a second antenna section 321, a second short-circuit section 322, and a second feed section 323. The second antenna section 321 and the second short-circuit section 322 are located on the second side 302, to the left of the grounding section 34. The second feed section 323 is located on the third side 303. Both the second short-circuit section 322 and the second feed section 323 are connected to the second antenna section 321. Specifically, the second feed section 323 is connected to the second antenna section 321 through the junction of the third side 303 and the second side 302. The grounding section 34, the first short-circuit section 312, and the second short-circuit section 322 are connected to the bottom grounding area G of the bottom recess 306. The first feed section 313 and the second feed section 323 are not connected to the bottom grounding area G.
為了整合常用的藍牙功能，此雙超寬頻天線模組更包括藍牙天線5，藍牙天線5包括藍牙輻射體51、藍牙饋入部52以及藍牙短路部53，藍牙輻射體51位於頂面305，藍牙饋入部52與藍 牙短路部53位於第四側面304，藍牙短路部53連接藍牙饋入部52，藍牙饋入部52通過第四側面304與頂面305的交接處連接藍牙輻射體51。另外，為了提高第二超寬頻天線32與藍牙天線5兩者間的隔離度，也使用位於第三側面303的接地延伸區EG，使接地延伸區EG位於第二超寬頻天線32與藍牙天線5兩者之間。所述接地延伸區EG連接底面接地區G。 To integrate commonly used Bluetooth functions, this dual ultra-wideband antenna module also includes a Bluetooth antenna 5. The Bluetooth antenna 5 includes a Bluetooth radiator 51, a Bluetooth feed inlet 52, and a Bluetooth short circuit 53. The Bluetooth radiator 51 is located on the top surface 305, and the Bluetooth feed inlet 52 and the Bluetooth short circuit 53 are located on the fourth side surface 304. The Bluetooth short circuit 53 is connected to the Bluetooth feed inlet 52, and the Bluetooth feed inlet 52 is connected to the Bluetooth radiator 51 through the junction of the fourth side surface 304 and the top surface 305. Furthermore, to improve the isolation between the second ultra-wideband antenna 32 and the Bluetooth antenna 5, a grounding extension region EG is used on the third side 303, positioned between the second ultra-wideband antenna 32 and the Bluetooth antenna 5. The grounding extension region EG is connected to the bottom grounding region G.
無線模組4裝設於電路板(如圖1或圖2所示的電路1所在的電路基板)，例如以表面黏著技術將無線模組4裝設於印刷電路板，底部凹槽306在完全覆蓋無線模組4的情況下而裝設於電路板。參考圖11的截面A-A，底部凹槽306的深度H是大於無線模組4的厚度。因此，無線模組4是位於陶瓷基底30與電路板兩者之間，並且無線模組4是被陶瓷基底30所完全覆蓋，以完成立體化結構的堆疊。再者，底部凹槽306更設有信號區塊S與電源區塊P，信號區塊S用以將無線模組4所處理過的信號引出至電路板，電源區塊P用以將電源引入至無線模組4。信號區塊S、電源區塊P與底面接地區G是各自獨立，且各自獨立地連接到電路板，互不影響。因此，陶瓷基底30覆蓋無線模組4之後並不影響無線模組4的引腳(pin)在電路板上所傳遞的信號或電源。詳細的說，信號區塊S與電路板上對應的信號線路連接到無線模組4的信號引腳，使其傳輸信號；電源區塊P與電路板上對應的電源線路連接到無線模組4的電源引腳，使其傳輸電源；而底面接地區G被劃分為多個，且都連接到電路板上的接地，以維持接地狀態的穩定。圖中的信號區塊S與電源區塊P其所被選定位置的僅是用以舉例，本發明不因此限定。 The wireless module 4 is mounted on a circuit board (such as the circuit substrate on which circuit 1 is located, as shown in Figure 1 or Figure 2). For example, the wireless module 4 is mounted on the printed circuit board using surface mount technology. The bottom recess 306 is mounted on the circuit board while completely covering the wireless module 4. Referring to section A-A of Figure 11, the depth H of the bottom recess 306 is greater than the thickness of the wireless module 4. Therefore, the wireless module 4 is located between the ceramic substrate 30 and the circuit board, and the wireless module 4 is completely covered by the ceramic substrate 30 to complete the stacking of the three-dimensional structure. Furthermore, the bottom recess 306 is provided with a signal block S and a power block P. The signal block S is used to lead the signal processed by the wireless module 4 to the circuit board, and the power block P is used to introduce power to the wireless module 4. The signal block S, power block P, and bottom grounding area G are independent and connected to the circuit board independently, without affecting each other. Therefore, the ceramic substrate 30 covering the wireless module 4 does not affect the signals or power transmitted by the pins of the wireless module 4 on the circuit board. Specifically, the signal block S and its corresponding signal lines on the circuit board are connected to the signal pins of the wireless module 4 to transmit signals; the power block P and its corresponding power lines on the circuit board are connected to the power pins of the wireless module 4 to transmit power; and the bottom grounding area G is divided into multiple sections, all of which are connected to the grounding on the circuit board to maintain a stable grounding state. The selected locations of signal block S and power block P in the diagram are merely illustrative and are not intended to limit the scope of this invention.
就陶瓷基底30的結構而言，雙超寬頻天線模組是一 個長方體模組，在本實施例以介電常數(Dk)是6.2且介質損耗(Df)是0.015的情況，其外觀尺寸大致為長是16毫米、寬是16毫米，高度是6.2毫米，其僅大致占用原先設計在電路板上用於放置無線模組4的電路空間，使陶瓷基底30整體類似於罩設在無線模組4之上，也使得電路板上的天線淨空區不再被需要。換句話說，無線模組4及雙超寬頻天線模組共用相同的電路區塊。無線模組4具有第一信號端、第二信號端與接地端(圖未示)，第一信號端連接第一饋線部313，第二信號端連接第二饋線部323。在具有藍牙天線5的情況，無線模組4更具有藍牙信號端以連接藍牙饋入部52。上述的第一饋線部313、第二饋線部323與藍牙饋入部52的結構各自具有延伸至底部凹槽306的部分。上述的第一信號端、第二信號端與藍牙信號端可各自經由電路板上的引線(trace)導通至底部凹槽306的對應位置，或者各自以引腳方式直接接觸已延伸到底部凹槽306的第一饋線部313、第二饋線部323或藍牙饋入部52，並可利用壓合或卡扣機制穩定其導通狀態。接地端通過底面接地區G連接接地部34、第一短路部312與第二短路部322。底面接地區G則連接至電路板的接地面(圖未示)，且底面接地區G的形狀可以配合電路板的接地面做設計，而不需變更電路板設計。同理，信號區塊S與電源區塊P也能配合電路板的設計，而不須變更電路板的走線，可大幅提升此雙超寬頻天線模組的應用廣泛度。 Regarding the structure of the ceramic substrate 30, the dual ultra-wideband antenna module is a cuboid module. In this embodiment, with a dielectric constant (Dk) of 6.2 and a dielectric loss (Df) of 0.015, its dimensions are approximately 16 mm in length, 16 mm in width, and 6.2 mm in height. It only occupies roughly the circuit space originally designed on the circuit board for placing the wireless module 4, making the ceramic substrate 30 essentially cover the wireless module 4, thus eliminating the need for an antenna clearance area on the circuit board. In other words, the wireless module 4 and the dual ultra-wideband antenna module share the same circuit block. The wireless module 4 has a first signal terminal, a second signal terminal, and a ground terminal (not shown). The first signal terminal is connected to the first feed line portion 313, and the second signal terminal is connected to the second feed line portion 323. In the case of a Bluetooth antenna 5, the wireless module 4 further has a Bluetooth signal terminal for connecting to the Bluetooth feed inlet portion 52. The first feed line portion 313, the second feed line portion 323, and the Bluetooth feed inlet portion 52 each have a portion extending to the bottom recess 306. The aforementioned first signal terminal, second signal terminal, and Bluetooth signal terminal can each be connected to the corresponding position in the bottom recess 306 via traces on the circuit board, or each can directly contact the first feed line portion 313, the second feed line portion 323, or the Bluetooth feed inlet portion 52 that has extended into the bottom recess 306 via pins, and their conduction state can be stabilized by a pressing or snapping mechanism. The ground terminal is connected to the ground portion 34, the first short-circuit portion 312, and the second short-circuit portion 322 through the bottom grounding area G. The bottom grounding area G is connected to the ground plane of the circuit board (not shown in the figure), and the shape of the bottom grounding area G can be designed to match the ground plane of the circuit board without changing the circuit board design. Similarly, the signal block S and power block P can be integrated with the circuit board design without altering the circuit board routing, significantly increasing the versatility of this dual ultra-wideband antenna module.
再者，第一超寬頻天線31所工作的第一中心頻率是6489.6MHz，頻寬是500MHz。第二超寬頻天線32所工作的第二中心頻率是7987.2MHz，頻寬是500MHz。此雙超寬頻天線模組尤其可應用於工業用無線裝置，而可使此雙超寬頻天線模組具有超寬 頻通信的功能，也一併具有藍牙通信的功能。也就是說，此雙超寬頻天線模組可以同時載有兩種或兩種以上規格的無線通信系統。 Furthermore, the first ultra-wideband antenna 31 operates at a first center frequency of 6489.6MHz and a bandwidth of 500MHz. The second ultra-wideband antenna 32 operates at a second center frequency of 7987.2MHz and a bandwidth of 500MHz. This dual ultra-wideband antenna module is particularly suitable for industrial wireless devices, enabling it to perform both ultra-wideband communication and Bluetooth communication. In other words, this dual ultra-wideband antenna module can simultaneously support two or more wireless communication systems.
綜上所述，本發明實施例所提供的雙超寬頻天線模組，能夠以立體堆疊方式整合天線及無線模組。能使舊型無線裝置(尤其是工業用的)不需要修改其裝置的主電路板的電路設計，底部凹槽的底面接地區，甚至於信號區塊與電源區塊能夠配合應用機種而替換圖案，本發明所提供的雙超寬頻天線模組能夠取代傳統的天線及無線模組而可提供至少兩個超寬頻工作頻帶的應用及新增一個藍牙天線應用。因為當應用在電路板上時僅使用到傳統無線模組的佔用面積，而可直接免除天線淨空區的使用需要，使得(尤其是工業用的)無線模組可輕易升級為新種類的超寬頻無線模組，且能一併附帶有新增的藍牙無線功能。因此，本發明的單一模組能廣泛應用於多種不同型號的無線裝置機種，而能以減少對於電路板做設計變更的情況下完成無線機種(尤其是工業用的)的更新與升級。再者，即使應用於新產品設計也能減少天線模組的佔用面積，具有很高的產業應用價值。 In summary, the dual ultra-wideband antenna module provided by this invention can integrate antenna and wireless modules in a three-dimensional stacking manner. This allows older wireless devices (especially industrial ones) to operate without modifying the main circuit board design. The bottom grounding area of the recessed area, and even the signal and power blocks, can have their patterns changed to suit different applications. The dual ultra-wideband antenna module provided by this invention can replace traditional antenna and wireless modules, providing applications with at least two ultra-wideband operating frequency bands and adding a Bluetooth antenna application. Because it utilizes only the space occupied by traditional wireless modules when applied to circuit boards, the need for antenna clearance is eliminated. This allows wireless modules (especially for industrial applications) to be easily upgraded to new types of ultra-wideband wireless modules, while also incorporating added Bluetooth functionality. Therefore, this single module can be widely used in various wireless device models, enabling the updating and upgrading of wireless devices (especially for industrial applications) with minimal changes to circuit board design. Furthermore, even when applied to new product designs, it reduces the footprint of the antenna module, demonstrating high industrial application value.
以上所述僅為本發明之實施例，其並非用以侷限本發明之專利範圍。 The above description is merely an embodiment of the present invention and is not intended to limit the scope of the patent.
30:陶瓷基底 30: Ceramic substrate
31:第一超寬頻天線 31: First Ultra-Broadband Antenna
32:第二超寬頻天線 32: Second Ultra-Broadband Antenna
302:第二側面 302: Second side
303:第三側面 303: Third Side
304:第四側面 304: Fourth side
306:底部凹槽 306: Bottom recess
34:接地部 34: Grounding Part
311:第一天線部 311: First Line Division
312:第一短路部 312: First Short Circuit Section
313:第一饋線部 313: First Feeder Section
321:第二天線部 321: The Second Day Line
322:第二短路部 322: Second Short Circuit Section
323:第二饋線部 323: Second Feeder Section
G:底面接地區 G: Bottom grounding area
S:信號區塊 S: Signal Block
P:電源區塊 P: Power Block
EG:接地延伸區 EG: Grounding Extension Area
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| TWI911731B true TWI911731B (en) | 2026-01-11 |
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| US20230145401A1 (en) | 2016-12-21 | 2023-05-11 | Intel Corporation | Wireless communication technology, apparatuses, and methods |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20230145401A1 (en) | 2016-12-21 | 2023-05-11 | Intel Corporation | Wireless communication technology, apparatuses, and methods |
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