TWI909265B - Power module architecture and method for fabricating the same - Google Patents

Abstract

A power module architecture and a method for fabricating the same are provided. The method includes: obtaining circuit data of an original power circuit and perform a modularization step to define a plurality of signal pins and a module space required by the original power circuit; generating a custom power module according to the required signal pins, the module space, and a target power module architecture, in which the custom power module has a plurality of preset signal pins; performing a circuit forming process to form the custom power module on an isolated circuit board; and performing a surface-mount technology process to place the isolated circuit board on a main circuit board in a predetermined area planned according to the module space, such that the isolated circuit board is attached and electrically connected to the main circuit board.

Description

Power module architecture and manufacturing method

This invention relates to an apparatus and a method, and more particularly to a power supply module architecture and its manufacturing method.

In the circuit design process, power supply components are often designed on the same motherboard as other hardware, which must share the motherboard area and internal routing space. However, the related signals of power supply components usually have the characteristic of rapid switching, which can lead to the abnormal operation of some high-speed signals, and thus cause abnormalities in system operation that are difficult to trace.

Furthermore, as computers demand more functionality, various devices need to be placed within limited space, resulting in increasingly smaller usable motherboard areas. Consequently, optimizing the space allocation of power supply components and other hardware requires significant time and manpower, increasing circuit complexity and severely impacting circuit design efficiency.

The technical problem to be solved by this invention is to provide a power module architecture and its manufacturing method to address the shortcomings of existing technologies, which can improve circuit design efficiency and reduce the impact of power components on other hardware and signals on the circuit board.

To solve the aforementioned technical problems, one of the technical solutions adopted by this invention is to provide a method for manufacturing a power module architecture, applicable to a main circuit board pre-configured with at least one original power circuit. The manufacturing method includes: obtaining circuit data of the at least one original power circuit; performing a modularization step to define multiple signal pins and a module space required by the at least one original power circuit; generating at least one custom power module according to a target power module architecture based on the required signal pins and the module space, wherein each custom power module has multiple preset signal pins; performing a circuit forming process to form the at least one custom power module on an independent circuit board; and performing a surface mount technology. The SMT (Surface Mount Technology) process is used to place the independent circuit board in a preset area planned according to the module space on the main circuit board, so that the independent circuit board is simultaneously attached to and electrically connected to the main circuit board.

To solve the aforementioned technical problems, another technical solution adopted by the present invention is to provide a power module architecture, including a main circuit board, an independent circuit board, and a custom power module. The independent circuit board is disposed in a preset area on the main circuit board, wherein the preset area is divided into a module space defined by performing a modularization step based on circuit data of at least one original power circuit. The custom power module is disposed on the independent circuit board and has multiple preset signal pins. The independent circuit board is simultaneously attached to and electrically connected to the main circuit board.

To further understand the features and technical content of this invention, please refer to the following detailed description and drawings of this invention. However, the drawings provided are for reference and illustration only and are not intended to limit this invention.

The following specific embodiments illustrate the implementation of the "Power Module Architecture and Manufacturing Method Thereof" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions based on actual dimensions, as stated in advance. The following embodiments will further explain the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. Additionally, the term "or" as used in this article may include, depending on the circumstances, any combination of one or more of the related listed items.

Figure 1 is a flowchart of the manufacturing method of the power supply module architecture of the present invention. Referring to Figure 1, the present invention provides a manufacturing method of a power supply module architecture, which is applicable to a main circuit board that is predetermined to be provided with at least one original power supply circuit.

In some embodiments, the main circuit board may be, for example, a motherboard. In a motherboard, the main purpose of the power supply circuit is to convert the power from the power supply into voltages and currents suitable for use by electronic devices, in order to drive the various components and integrated circuits (ICs) on the motherboard.

For example, a basic power supply circuit may include components such as a pulse width modulation (PWM) controller, a switching driver, switching elements, capacitors, and inductors. The PWM controller reads the core voltage of the central processing unit to output a PWM signal and controls the operating time of each power phase. The switching driver receives the PWM signal and controls the on-time of switching elements (such as upper-bridge and lower-bridge switches) to regulate the voltage. Switching elements may be, for example, metal-oxide-semiconductor (MOSFET) transistors, which can be controlled by the switching driver. In addition, inductors are used to regulate voltage, and capacitors are used for filtering.

In the process of circuit design, the original power supply circuit and other hardware are often designed on the same main circuit board, which must share the area and internal routing space. Furthermore, the PWM signal in the original power supply circuit has the characteristic of fast switching, which can easily lead to abnormal high-speed signals on the main circuit board.

To address the above problems, the present invention provides a manufacturing method comprising the following steps:

Step S10: Obtain the circuit data of the original power circuit and perform the modularization steps to define the multiple signal pins and module space required by the power circuit.

In the modularization process, the original power supply circuit data can be obtained through an electronic device (such as a general-purpose computer) that has circuit design software (such as OrCAD) installed. This data can include multiple power supply circuits corresponding to different system voltages (such as 1.2V/2.5V/3.3V/5V). It should be noted that the aforementioned circuit design software, OrCAD, is a widely used software for circuit design. It can run in a Windows operating system and assists hardware designers in circuit design. Next, all system operating voltages, currents, and power stages are compiled, and the loads are listed. Based on the required output voltage and load current, they are organized and arranged. Finally, the required signal pins and module space for the original power supply circuit are defined. The required signal pins and corresponding pin types for the original power supply circuit are shown in Table 1 below:

Table 1: Introductory foot number Type of foot P1 +DVMAIN P2 +V5A P3 PWRON_5VA P4 PWRON_3VA P5 GND P6 GND P7 V5A_V3A_PWRGD P8 +VDD3_EC P9 +V3.3A P10 +DVMAIN

As shown in Table 1, signal pins may include at least one input power pin (e.g., pin type PWRON_5VA), at least one output power pin (e.g., pin type +V5A), and at least one ground pin (e.g., pin type GND). Next, the physical limitations of the system are taken into account to assess the required space of the original power circuit while meeting isolation requirements.

Furthermore, in Table 1 provided in this embodiment, pin type +DVMAIN is used to provide the system as the main power source when connected to an AC power supply (e.g., voltage level 19V); pin type +V5A is the 5V output power designed for this power supply circuit for system use; pin type PWRON_5VA is used to provide this power supply circuit as a 5V power supply switching signal; and pin type PWRON_3VA is used to provide this power supply circuit as a 3V... The power switch signal is specified; pin type GND is the ground pin; pin type V5A_V3A_PWRGD is used to indicate and inform the system that the power circuit can output power normally when the power circuit is normally outputting 3V/5V voltage; pin type +VDD3_EC is used by the power circuit to generate 3V power through the internal regulator to supply system components, such as embedded controllers (ECs); pin type +V3.3A is used for the 3V power output designed for this power circuit to supply the system. However, the above-described pins are merely examples, and the invention is not limited thereto.

Step S11: Generate a custom power module based on the required signal pins and module space, according to the target power module architecture.

Please refer to Figure 2, which is a wiring diagram of a custom power module according to an embodiment of the present invention. As shown in Figure 2, the original power circuit after the modularization process can be simplified into a block form to represent the custom power module 10, and multiple default signal pins P1 to P10 are designed for the custom power module 10 according to Table 1 above. In addition, fixed power pins and signal pins can be set for these default signal pins, thereby establishing a power module library to save time spent on repetitive wiring planning in the future. Furthermore, the number of custom power modules 10 can be one or more, and the present invention is not limited to this.

On the other hand, please refer to Figure 3, which is a schematic diagram of the target power supply module architecture of the present invention. As shown in Figure 3, the target power supply module architecture of the present invention adopts the design of an independent circuit board 20. In step S11, the preset signal pins P1 to P10 can be set on the mating surface 200 of the independent circuit board 20 in the form of contact solder points according to the wiring diagram of Figure 2. The PWM controller, switching driver, switching element, capacitor and inductor and other components in the original power supply circuit are set on the non-matting surface 202 of the independent circuit board 20. The relevant lines are set on the independent circuit board 20 or the non-matting surface 202 as required.

Therefore, through the above steps, in the hardware design stage, it is only necessary to call this power module library and connect the defined power supply and signal to the corresponding custom power module 10. This improves the efficiency of routing in the design wiring diagram and reduces the complexity of the circuit. Furthermore, the modular custom power modules can be stored as a component library for circuit designers to use, and can share the Bill of Materials (BOM) and Engineering Change Notice (ECR). Therefore, they are reusable in both the design and production stages, thereby saving labor costs.

Step S12: Perform the circuit forming process to form the custom power module on the independent circuit board.

In this step, depending on the required number of metal layers and circuitry, metal layers with corresponding circuitry are printed on one or more laminates. Redundant metal portions are removed through an etching process. After the laminates are bonded, a solder mask layer is formed on the surface to form an independent circuit board 20. Then, the aforementioned components from the original power circuit are disposed on the non-bonded surface 202 of the independent circuit board 20 by soldering or bonding. Furthermore, the custom power module 10 also includes multiple custom traces L1 formed in the independent circuit board 20, for example, in the top metal layer near the non-bonded surface 202. The independent circuit board 20 may have a predetermined thickness, for example, in the range of 0.1 mm to 3 mm, preferably in the range of 0.2 mm to 1.1 mm.

Step S13: Perform surface mount technology (SMT) procedures to place the independent circuit board in a preset area on the main circuit board according to the module space, so that the independent circuit board is simultaneously attached to and electrically connected to the main circuit board.

Please refer to Figure 4, which is a top view of the mounting surface of the main circuit board of this embodiment. As shown in Figure 4, the mounting surface of the main circuit board 30 has multiple raw signal traces L0 and a preset area A0 planned according to the required module space. In the preset area A0, multiple pads P0 are provided, each corresponding to a preset signal pin P1 to P10, and these pads P0 can be electrically connected to the preset signal pins P1 to P10 respectively through the SMT process. In the SMT process, solder paste can be printed onto the preset area A0 of the main circuit board 30 through a stencil, especially above the pad P0. Then, the independent circuit board 20, which is equipped with a custom power module 10, is mounted on the preset area A0 of the main circuit board 30 according to a predetermined configuration. The solder paste is melted by heating in a reflow oven, so that the preset signal pins P1 to P10 form a firm mechanical and electrical connection with the pad P0 on the main circuit board 30. This allows the independent circuit board 20 to be attached to and electrically connected to the main circuit board 30 at the same time.

Refer to Figure 5, which is a side view of the power supply module architecture of an embodiment of the present invention.

As shown in Figure 5, in the power module architecture 40 formed through step S13, since the custom trace L1 is located in the top metal layer of the independent circuit board 20 with a predetermined height, its height can differ from that of the original signal trace L0. Therefore, in the power module architecture 40 provided by this invention, signals with fast switching characteristics can be transmitted through the custom trace L1, thereby maintaining a certain degree of isolation from the high-speed signals transmitted through the original signal trace L0 and avoiding abnormal conditions.

[Beneficial effects of the implementation]

One of the advantages of this invention is that, in the power module architecture and manufacturing method provided by this invention, since the power components are designed on an independent circuit board, they do not need to share the motherboard area and inner layer routing space with other hardware on the main circuit board. Furthermore, signals with fast switching characteristics can be transmitted through custom routing on the independent circuit board, thereby maintaining a certain degree of isolation from high-speed signals transmitted through the original signal routing on the main circuit board and avoiding abnormal conditions.

Furthermore, in the power module architecture and manufacturing method provided by this invention, the spatial configuration of power components and other hardware, due to the modularization of the original power circuit, can significantly increase the efficiency of design routing and reduce the complexity of the circuit. Moreover, the modularized custom power module can be stored as a component library for circuit designers to use, possessing reusability at both the design and production ends, thereby saving labor costs.

The above-disclosed content is merely a preferred feasible embodiment of the present invention and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's description and drawings are included within the scope of the patent application of the present invention.

10: Custom Power Module 20: Independent Circuit Board 200: Connecting Surface 202: Non-Connecting Surface 30: Main Circuit Board 40: Power Module Architecture L1: Custom Trace L0: Original Signal Trace A0: Default Area P0: Spare Pins P1 to P10: Default Signal Pins +DVMAIN,+V5A,PWRON_5VA,PWRON_3VA,GND,V5A_V3A_PWRGD,+V3.3A,+VDD3_EC: Pin Type S10,S11,S12,S13: Steps

Figure 1 is a flowchart of the manufacturing method of the power supply module architecture of the present invention.

Figure 2 is a wiring diagram of the custom power module of the present invention embodiment.

Figure 3 is a schematic diagram of the target power supply module architecture of the present invention.

Figure 4 is a top view of the mounting surface of the main circuit board in an embodiment of the present invention.

Figure 5 is a side view of the power supply module architecture of an embodiment of the present invention.

S10, S11, S12, S13: Steps

Claims (10)

A method for manufacturing a power module architecture, applicable to a main circuit board pre-configured with at least one original power circuit, the method comprising: obtaining circuit data of the at least one original power circuit; performing a modularization step to define multiple signal pins and a module space required by the at least one original power circuit; generating at least one custom power module according to a target power module architecture based on the required signal pins and the module space, wherein each custom power module has multiple preset signal pins; performing a circuit forming process to form the at least one custom power module on an independent circuit board; and performing a surface mount technology. The SMT (Surface Mount Technology) process is used to place the independent circuit board in a preset area planned according to the module space on the main circuit board, so that the independent circuit board is simultaneously attached to and electrically connected to the main circuit board. The manufacturing method as described in claim 1, wherein the preset signal pins are provided on one surface of the independent circuit board. The manufacturing method as described in claim 2, wherein a plurality of pads corresponding to the preset signal pins are provided in the preset area on the main circuit board, and the pads are electrically connected to the preset signal pins respectively through the SMT process. The manufacturing method as described in claim 1, wherein the signal pins include at least one input power pin, at least one output power pin, and at least one ground pin. The manufacturing method as described in claim 1, wherein the at least one custom power module has multiple custom traces when formed on the independent circuit board, the main circuit board has multiple original signal traces, and the height of the custom traces is different from the height of the original signal traces. A power module architecture includes: a main circuit board having a predetermined area on one surface, on which at least one original power circuit is predeterminedly disposed; an independent circuit board disposed in the predetermined area on the main circuit board, wherein the predetermined area is divided into a module space defined by performing a modularization step based on circuit data of the at least one original power circuit; and a custom power module disposed on the independent circuit board and having a plurality of predetermined signal pins, wherein the custom power module is generated according to the plurality of signal pins required by the at least one original power circuit and the module space, and according to a target power module architecture; wherein the independent circuit board is simultaneously attached to and electrically connected to the main circuit board through a surface mount technology process. The power module architecture as described in claim 6, wherein the default signal pins are provided on one surface of the independent circuit board. The power module architecture as described in claim 7, wherein a plurality of pads corresponding to the preset signal pins are provided in the preset area on the main circuit board, and the pads are electrically connected to the preset signal pins respectively. The power module architecture as described in claim 6, wherein the signal pins include at least one input power pin, at least one output power pin, and at least one ground pin. The power module architecture as described in claim 6, wherein the custom power module further includes a plurality of custom traces formed in the independent circuit board, the main circuit board is provided with a plurality of original signal traces, and the height of the custom traces is different from the height of the original signal traces.