TWI909020B - Substrate processing apparatus and substrate positioning method - Google Patents

Abstract

A technique for positioning a rectangular substrate is provided. This disclosure provides a processing apparatus comprising: a conveying mechanism for conveying a rectangular substrate; a positioning stage for placing the substrate and positioning it; and a rotating stage for rotating the positioned substrate; the conveying mechanism includes a block portion that presses the end of the substrate placed on the positioning stage to position the substrate.

Description

Substrate processing apparatus and substrate positioning method

This disclosure relates to a processing device and a positioning method.

A known technique involves movably supporting a substrate on a support member and clamping the substrate in place by pressing and positioning members (e.g., see Patent 1).

Patent Document 1: Japanese Patent Application Publication No. 2005-116878

This disclosure provides a technique for positioning rectangular substrates.

This disclosure discloses a processing apparatus comprising: a conveying mechanism for conveying a rectangular substrate; a positioning stage for placing the substrate and positioning it; and a rotating stage for rotating the positioned substrate; the conveying mechanism includes a block portion that presses the end of the substrate placed on the positioning stage to position the substrate.

According to this disclosure, a rectangular substrate can be positioned.

The following describes, with reference to the drawings, embodiments of the non-limiting examples disclosed herein. In all the drawings, the same or corresponding reference symbols will be assigned to the same or corresponding components or parts to avoid redundant descriptions.

[Inspection Device] An example of an inspection device in the embodiment will be described with reference to Figures 1 to 3. Figure 1 is a front view showing an example of the inspection device in the embodiment. Figure 2 is a top view showing an example of the inspection device in the embodiment. Figure 3 is a diagram showing an example of the mounting section.

The inspection device 1 includes a loading unit 10, an inspection unit 20, and a device controller 30. Under the control of the device controller 30, the inspection device 1 transports the substrate W to be inspected from the loading unit 10 to the inspection unit 20, and applies electrical signals to the device under test (DUT) formed on the substrate W to inspect various electrical characteristics. The substrate W can be, for example, a rectangular substrate. An example of a rectangular substrate is a PLP (Panel Level Package).

The loading unit 10 includes a loading port 11, a positioning stage 12, a rotating stage 13, a back stage 14, a substrate conveying mechanism 15, and a position detection sensor 16.

The loading port 11 is located on the front (-Y direction) side of the inspection device 1. The loading port 11 holds the box C that houses the substrate W.

The positioning stage 12 is located on the back (+Y direction) side of the inspection device 1. The positioning stage 12 is a platform for placing the substrate W and positioning the substrate W. Details about the positioning stage 12 will be explained later.

The rotary table 13 is located on the back side of the inspection device 1 and below the positioning stage 12 (in the -Z direction). However, the rotary table 13 may also be located above the positioning stage 12 (in the +Z direction). The rotary table 13 is a stage for adsorbing and holding the substrate W so that the substrate W rotates. Details regarding the rotary table 13 will be explained later.

The back stage 14 is located on the back side of the inspection device 1 and above the positioning stage 12. However, the back stage 14 may also be located below the positioning stage 12. The back stage 14 is a platform for mounting a tray (not shown) that will hold the substrate W. The tray can be removed from the back side of the inspection device 1.

The substrate transport mechanism 15 transports the substrate W between the cassette C placed on the loading port 11, the positioning stage 12, the rotating stage 13, the tray of the back stage 14, and the loading stage 21 described later. The substrate transport mechanism 15 includes pick-up parts 151 and 152, a rotary drive mechanism 153, and an up-down drive mechanism 154.

Pick-up members 151 and 152 are configured as two segments, upper and lower. Each pick-up member 151 and 152 will hold the substrate W. Pick-up members 151 and 152 are also referred to as forks or end effectors. Details about pick-up members 151 and 152 will be explained later.

A rotary drive mechanism 153 is located below the pickups 151 and 152 and drives the pickups 151 and 152 to rotate. The rotary drive mechanism 153 includes, for example, a stepper motor.

The up-and-down drive mechanism 154 is located below the rotary drive mechanism 153 and drives the pickups 151 and 152 and the rotary drive mechanism 153 to move them up and down. The up-and-down drive mechanism 154 includes, for example, a stepper motor. Furthermore, the substrate conveying mechanism 15 is not limited to the form shown in FIG3, and may also be, for example, a form with multiple articulated arms and an up-and-down drive mechanism.

A position detection sensor 16 is installed on the transport path where the substrate W is housed in the cassette C by the pickups 151 and 152, and detects the position of the substrate W held by the pickups 151 and 152. The position detection sensor 16 includes a light-emitting section 161 and a light-receiving section 162. Two light-emitting sections 161 are provided at predetermined intervals in the left-right direction (X direction) above the entrance of the cassette C held in the loading port 11. Two light-receiving sections 162 are provided at predetermined intervals in the left-right direction below the entrance of the cassette C. The predetermined intervals are wider than one side of the substrate W and narrower than the inner dimensions of the cassette C. For example, if one side of the substrate W is 300mm long and the inner dimension of the box C is 305mm, the predetermined interval can be 301~304mm, preferably 303mm. The light-projecting part 161 illuminates the light L towards the light-receiving part 162. The light-receiving part 162 detects whether it receives the light L illuminating from the light-projecting part 161. Furthermore, the positional relationship between the light-projecting part 161 and the light-receiving part 162 can be reversed. That is, the light-projecting part 161 can also be provided at the lower part near the entrance of the box C, and the light-receiving part 162 can also be provided at the upper part near the entrance of the box C.

In the position detection sensor 16, when the pickup members 151 and 152, which hold the substrate W, enter the cassette C, and the substrate W is within the predetermined range of the pickup members 151 and 152, the light-receiving part 162 will receive the light L emitted from the light-emitting part 161. On the other hand, when the substrate W is outside the predetermined range of the pickup members 151 and 152, the light L emitted from the light-emitting part 161 will be blocked by the substrate W, and therefore the light-receiving part 162 will not receive the light L emitted from the light-emitting part 161. Therefore, when the light-receiving part 162 does not receive the light L emitted from the light-emitting part 161, by preventing the pickup members 151 and 152 from storing the substrate W in the cassette C, the contact between the substrate W and the cassette C can be avoided. Furthermore, the position detection sensor 16 is not limited to the example shown in the figure, and may also be of other forms.

The inspection unit 20 is arranged adjacent to the loading unit 10. The inspection unit 20 includes a loading platform 21, a lifting mechanism 22, an XY platform 23, a probe holder 24, and an alignment mechanism 25.

The mounting table 21 mounts and holds the substrate W. The mounting table 21 includes, for example, a vacuum suction cup.

The lifting mechanism 22 is located below the platform 21 and causes the platform 21 to rise or fall relative to the XY platform 23. The lifting mechanism 22 includes, for example, a stepper motor.

The XY platform 23 is located below the lifting mechanism 22, allowing the platform 21 and the lifting mechanism 22 to move in a dual-axis direction (X and Y directions in the figure). The XY platform 23 is fixed to the bottom of the inspection unit 20. The XY platform 23 includes, for example, a stepper motor.

The probe holder 24 is positioned above the mounting stage 21. Multiple probes 24a are formed on one side of the mounting stage 21 of the probe holder 24. The probe holder 24 is easily mounted on the top plate 24b. The probe holder 24 is connected to a tester (not shown) via a test head T.

The alignment mechanism 25 includes a camera 25a, guide rails 25b, and alignment bridge 25c. The camera 25a is mounted downwards in the center of the alignment bridge 25c and captures images of the stage 21, substrate W, etc. The camera 25a is, for example, a CCD camera or a CMOS camera. The guide rails 25b support the alignment bridge 25c so that it can move horizontally (in the Y direction in the diagram). The alignment bridge 25c is supported by a pair of guide rails 25b on its left and right sides and moves horizontally (in the Y direction in the diagram) along the guide rails 25b. In this way, the camera 25a moves between the standby position and directly below the center of the probe card 24 (hereinafter referred to as the "probe center") via the alignment bridge 25c. The camera 25a located at the probe center will capture images of the electrode pads of the substrate W on the mounting stage 21 from above while the stage 21 moves in the XY direction during alignment, and perform image processing to display the captured images on the display device 40.

The device controller 30 is located below the stage 21 and controls the overall operation of the inspection device 1. The CPU in the device controller 30 performs the desired inspection based on the product parameters stored in memory such as ROM and RAM. In addition, the product parameters can also be stored on a hard drive or semiconductor memory other than ROM and RAM. Furthermore, the product parameters can also be read after being inserted into a predetermined location while recorded on a computer-readable recording medium such as a CD-ROM or DVD.

[Pick-up Component] An example of the pick-up component 151 of the substrate conveying mechanism 15 of the loading section 10 will be described with reference to FIG. 4. FIG. 4 is a diagram showing an example of the pick-up component 151, showing the pick-up component 151 holding the substrate W. FIG. 4(a) is a view of the pick-up component 151 from above, and FIG. 4(b) is a view of the pick-up component 151 from the side. Furthermore, the pick-up component 152 may have the same configuration as the pick-up component 151.

Pick-up component 151 includes base 151a, pad 151b, and block part 151c, etc.

The base 151a is formed by plate-shaped components. When viewed from above, the base 151a has a roughly U-shaped form.

Multiple pads 151b are provided on the base 151a (e.g., eight). Each pad 151b includes at least two adsorption pads capable of independent attraction. Each adsorption pad holds the substrate W by vacuum adsorption. Alternatively, the multiple pads 151b may also include holding pads that can hold the substrate W without vacuum adsorption.

Block portion 151c is provided on the base end of pickup member 151. Block portion 151c has a pressing surface 151d. The pressing surface 151d is orthogonal to the forward and backward direction of pickup member 151. The pressing surface 151d extends from the top of pickup member 151 to a position higher than the top of substrate W held by pickup member 151. Block portion 151c presses the end of substrate W placed on positioning stage 12 with pressing surface 151d to position substrate W on pickup member 151.

[Positioning Stage] An example of the positioning stage 12 of the loading unit 10 will be described with reference to FIG. 5. FIG. 5 is a diagram showing an example of the positioning stage 12, showing the state in which the pickup 151 enters above the positioning stage 12. FIG. 5(a) is a view of the positioning stage 12 from above, and FIG. 5(b) is a view of the positioning stage 12 from the side.

The positioning platform 12 includes a base 121, a retaining pin 122, etc.

The base 121 is fixed to the loading section 10. The base 121 is formed by a plate-shaped component. The base 121 has a rectangular shape when viewed from above.

Multiple (e.g., six) retaining pins 122 are provided on the base 121. Each retaining pin 122 is located outside the entry path of the pickup member 151. Each retaining pin 122 protrudes upward from the base 121 and holds the substrate W in place so that it can slide freely. Each retaining pin 122 is formed of, for example, a material with low frictional resistance. Preferably, there are six or more retaining pins 122. In this way, the warped substrate W can be held in place correctly.

[Rotating Table] An example of the rotating table 13 of the loading unit 10 will be described with reference to FIG. 6. FIG. 6 is a diagram showing an example of the rotating table 13, showing the state in which the pickup 151 enters above the rotating table 13. FIG. 6(a) is a view of the rotating table 13 from above, and FIG. 6(b) is a view of the rotating table 13 from the side.

The rotary table 13 includes a base 131, a reducer 132, and a motor 133.

The base 131 holds the substrate W by vacuum adsorption using multiple (e.g., three) adsorption pads 131a disposed on it. The base 131 is connected to the motor 133 via a reducer 132, and the substrate W is rotated by the power of the motor 133.

The reducer 132 uses gears and the like to reduce the rotational speed of the power on one side of the motor 133 and output it to the base 131.

Motor 133 outputs power to base 131 through reducer 132 to make base 131 rotate.

[Operation of the Inspection Device] Referring to Figures 7 to 9, an example of the operation of the inspection device 1 in the case of inspecting the substrate W in the aforementioned inspection device 1 will be explained. Figure 7 is a flowchart showing an example of the operation of the inspection device in the embodiment.

In step S1, the loading unit 10 positions the substrate W before inspection. Figure 8 shows an example of the operation of positioning the substrate W, and is a side view of the positioning stage 12. Figure 9 shows an example of the operation of rotating the substrate W, and is a side view of the rotating stage 13.

In this embodiment, as shown in FIG8(a), the device controller 30 controls the substrate conveying mechanism 15 to move the substrate W stored in the box C to the positioning stage 12 by bringing the pick-up member 151 above the positioning stage 12.

Next, as shown in Figure 8(b), the device controller 30 controls the substrate conveying mechanism 15 to place the substrate W on the retaining pin 122 by lowering the pick-up member 151 to the correction position. The correction position is the position where the pad 151b leaves the substrate W from below, and the position where the block portion 151c is higher than the substrate W.

Next, as shown in Figure 8(c), the device controller 30 controls the substrate conveying mechanism 15 to move the pickup 151, which is in the corrected position, in the infeed direction by a first distance, so that the pressing surface 151d of the block portion 151c abuts against the end of the substrate W. Thereby, the substrate W slides on the retaining pin 122, and one side of the block portion 151c of the substrate W becomes parallel to the pressing surface 151d. The first distance can be, for example, 30 mm.

Next, as shown in Figure 8(d), the device controller 30 controls the substrate conveying mechanism 15 to move the pickup 151 backward by a second distance, causing the pressing surface 151d of the block portion 151c to separate from the end of the substrate W. This completes the positioning of the substrate W relative to the pickup 151 in the first direction. The first direction is the forward and backward direction of the pickup 151. The second distance can be, for example, 20 mm.

Next, as shown in Figure 8(e), the device controller 30 controls the substrate transport mechanism 15 to hold the substrate W placed on the holding pin 122 by raising the pick-up member 151 to the UP position and using the pad 151b. The UP position is the position where the substrate W is below the holding pin 122.

Next, as shown in Figure 9(a), the device controller 30 controls the substrate conveying mechanism 15 to move the substrate W, which has been positioned in the first direction, to the top of the rotary table 13 by bringing the pick-up member 151 above the rotary table 13.

Next, as shown in Figure 9(b), the device controller 30 controls the substrate conveying mechanism 15 to place the substrate W on the platform 131 by lowering the pick-up piece 151 to the DOWN position. The DOWN position is the position where the pad 151b moves away from under the substrate W.

Next, as shown in Figure 9(c), the device controller 30 controls the rotary table 13 to rotate the stage 131 by 90° while the substrate W is held in place by the adsorption pad 131a, thereby rotating the substrate W by 90°. Furthermore, after rotating the substrate W by 90°, the device controller 30 controls the rotary table 13 to stop the adsorption caused by the adsorption pad 131a.

Next, as shown in Figure 9(d), the device controller 30 controls the substrate conveying mechanism 15 to hold the substrate W placed on the platform 131 by raising the pick-up member 151 to the UP position and using the pad 151b. The UP position is the position where the substrate W is below the platform 131.

Next, the device controller 30 controls the substrate conveying mechanism 15 to transport the substrate W, which has been rotated 90°, back to the positioning stage 12. Then, as shown in Figures 8(a) to 8(e), the device controller 30 positions the substrate W relative to the pickup 151 in the second direction, which is orthogonal to the first direction, in the same way as the positioning of the substrate W relative to the pickup 151 in the first direction.

Based on the above description, the loading unit 10 will complete the positioning of the pickup 151 by the substrate W in the first and second directions before inspection.

In step S2, the substrate W, positioned in step S1 and before inspection, is transported to the inspection unit 20. In this embodiment, the device controller 30 controls the substrate transport mechanism 15 to transport the substrate W, which has been positioned in the first and second directions, to the rotary table 13. Then, the device controller 30 controls the rotary table 13 to rotate the substrate W to a pre-specified orientation. In other words, the rotary table 13 can be used to rotate the substrate W to any specified angle. Next, the device controller 30 controls the substrate transport mechanism 15 to transport the substrate W from the rotary table 13 to the inspection unit 20 and place it on the mounting table 21. Furthermore, when the substrate W is in the pre-specified orientation, the device controller 30 can also control the substrate conveying mechanism 15 to not convey the substrate W to the rotary table 13, but to the inspection unit 20 and then place it on the placement table 21.

In step S3, the inspection unit 20 inspects the substrate W. In this embodiment, the device controller 30 controls the alignment mechanism 25 to align the electrode pads of the component under test formed on the substrate W on the stage 21 with the positions of the multiple probes 24a of the probe card 24. Next, the device controller 30 controls the lifting mechanism 22 to raise the stage 21 so that the multiple probes 24a of the probe card 24 contact the corresponding electrode pads. Then, the device controller 30 applies the inspection signal from the tester to the component under test formed on the substrate W through the test head T and the multiple probes 24a of the probe card 24 to inspect the electrical characteristics of the component under test. After the electrical characteristics of the component under inspection are checked, the device controller 30 controls the lifting mechanism 22 to lower the stage 21 so that the probe 24a leaves the electrode pad.

In step S4, the loading unit 10 will position the substrate W after inspection. The positioning of the substrate W after inspection can be performed in the same way as the positioning of the substrate W before inspection in step S1.

In step S5, the inspected substrate W is stored in the cassette C. In this embodiment, the device controller 30 controls the substrate conveying mechanism 15 to transport the inspected substrate W, which has been positioned in the loading section 10, to the cassette C for storage. At this time, the device controller 30 determines whether the inspected substrate W is within the predetermined range of the pickup 151 based on the detection value of the position detection sensor 16. Then, if the device controller 30 determines that the inspected substrate W is within the predetermined range of the pickup 151, it will transport the inspected substrate W to the cassette C for storage. On the other hand, if the device controller 30 determines that the inspected substrate W is outside the predetermined range of the pickup 151, it will not store the inspected substrate W in the cassette C. For example, the device controller 30 controls the substrate conveying mechanism 15 to stop the operation of the pickup 151. Alternatively, the device controller 30 controls the substrate conveying mechanism 15 to transport the inspected substrate W to the back stage 14 and place it on a tray provided on the back stage 14. Alternatively, the device controller 30 can also cause the display device 40 to indicate that the inspected substrate W cannot be stored in the case C. Alternatively, the device controller 30 can also reposition the inspected substrate W in the loading section 10 at various locations. Thus, in step S5, if the device controller 30 determines that the inspected substrate W is outside the predetermined range of the pickup 151, it will not store the inspected substrate W in the case C. This prevents the substrate W held by the pickup 151 from coming into contact with the box C.

Furthermore, while the operation of the inspection device 1 in the aforementioned embodiment describes the presence of positioning the substrate W before inspection (step S1) and positioning the substrate W after inspection (step S4), it is not limited to this. For example, either positioning the substrate W before inspection (step S1) or positioning the substrate W after inspection (step S4) may be omitted. Additionally, for example, positioning the substrate W after inspection (step S4) may only be performed if, in step S5, the device controller 30 determines that the substrate W after inspection is outside the predetermined range of the pickup member 151.

As explained above, according to the embodiment, the substrate W is positioned relative to the pickup 151 by pressing the end of the substrate W, which is slidably held in place by the holding pin 122 of the positioning stage 12, with the block portion 151c of the pickup member 151. This allows the substrate W to be positioned without clamping it from the side. Therefore, even when positioning easily damaged substrates such as resin substrates or glass substrates, damage to the substrate W can be prevented. Furthermore, the substrate W can be positioned regardless of its size. Therefore, even if the substrate W is warped, it can still be positioned. Additionally, since the substrate W is positioned by moving the pickup member 151, the center position of the substrate W can be easily fine-tuned.

[Variations] A variation of the positioning table and rotating table in the loading unit 10 will be described with reference to FIG10. FIG10 shows another example of the positioning table and rotating table, showing the state in which the pickup 151 enters above the positioning table and rotating table. FIG10(a) is a view of the positioning table and rotating table from above, and FIG10(b) is a view of the positioning table and rotating table from the side.

The difference between the modified example and the aforementioned positioning stage 12 and rotating stage 13 is that the positioning stage 17 and rotating stage 18 are integrated into one unit.

The positioning stage 17 includes a base 171, a retaining pin 172, a support plate 173, an actuator 174, etc.

The base 171 is fixed to the support plate 173 by means of the actuator 174. The base 171 is formed by means of a plate-shaped component. The base 171 has a rectangular shape when viewed from above.

The retaining pin 172 may have the same configuration as the aforementioned retaining pin 122.

The support plate 173 supports the base 171 so that it can be raised and lowered freely through the actuator 174. The support plate 173 is fixed to the loading part 10.

Multiple actuators 174 (e.g., two) are provided on the support plate 173. The actuators 174 cause the base 171 to rise or fall relative to the support plate 173. As actuators 174, motors such as DC motors, stepper motors, linear motors, air-driven mechanisms such as cylinders, or piezoelectric actuators can be used.

The rotary table 18 may have the same configuration as the aforementioned rotary table 13. That is, the rotary table 18 includes a base 181, a reducer 182, and a motor 183. The rotary table 18 holds the substrate W in a state of vacuum adsorption by multiple (e.g., three) adsorption pads 181a provided on the base 181, and outputs the power of the motor 183 to the base 181 through the reducer 182 to make the substrate W rotate.

Referring to Figures 11-13, an example of a method for positioning the substrate W before inspection in the loading section 10 of the inspection device 1 with a modified positioning stage 17 and a rotating stage 18 will be described. Furthermore, the positioning of the substrate W after inspection can also be performed using the same method as the positioning of the substrate W before inspection. Figures 11-13 are diagrams showing an example of the operation of positioning the substrate W, and are side views of the positioning stage 17 and the rotating stage 18.

In this embodiment, as shown in FIG11(a), the device controller 30 controls the substrate conveying mechanism 15 to move the substrate W stored in the box C to the positioning stage 17 by bringing the pick-up member 151 above the positioning stage 17.

Next, as shown in Figure 11(b), the device controller 30 controls the actuator 174 to raise the base 171 to the UP position. The UP position is where the upper end of the holding pin 172 is higher than the top of the base 181.

Next, as shown in Figure 11(c), the device controller 30 controls the substrate conveying mechanism 15 to place the substrate W on the retaining pin 172 by lowering the pick-up member 151 to the corrected position. The corrected position is the position where the pad 151b leaves the substrate W from below, and the position where the block portion 151c is higher than the substrate W.

Next, as shown in Figure 11(d), the device controller 30 controls the substrate conveying mechanism 15 to move the pickup 151, which is in the corrected position, in the infeed direction by a first distance, so that the pressing surface 151d of the block portion 151c abuts against the end of the substrate W. Thereby, the substrate W slides on the retaining pin 172, and one side of the block portion 151c of the substrate W becomes parallel to the pressing surface 151d. The first distance can be, for example, 30 mm.

Next, as shown in Figure 12(a), the device controller 30 controls the substrate conveying mechanism 15 to move the pickup 151 backward by a second distance, causing the pressing surface 151d of the block portion 151c to separate from the end of the substrate W. This completes the positioning of the substrate W relative to the pickup 151 in the first direction. The first direction is the forward and backward direction of the pickup 151. The second distance can be, for example, 20 mm.

Next, as shown in Figure 12(b), the device controller 30 controls the substrate transport mechanism 15 to hold the substrate W placed on the holding pin 172 by raising the pick-up member 151 to the UP position and using the pad 151b. The UP position is the position where the substrate W is below the holding pin 172.

Next, as shown in Figure 12(c), the device controller 30 controls the actuator 174 to lower the base 171 to the DOWN position. The DOWN position is such that the upper end of the holding pin 172 is lower than the upper end of the base 181.

Next, as shown in Figure 12(d), the device controller 30 controls the substrate conveying mechanism 15 to move the pickup 151 so that the center of the pickup 151 (substrate W) is aligned with the center of the rotary table 18 in the forward and backward direction of the pickup 151.

Next, as shown in Figure 13(a), the device controller 30 controls the substrate conveying mechanism 15 to place the substrate W on the platform 181 by lowering the pick-up member 151 to the DOWN position. The DOWN position is the position where the pad 151b moves away from under the substrate W.

Next, as shown in Figure 13(a), the device controller 30 controls the rotary table 18 to rotate the table 181 by 90° while the substrate W is held in place by the adsorption pad 181a, thereby rotating the substrate W by 90°. Furthermore, after rotating the substrate W by 90°, the device controller 30 controls the rotary table 18 to stop the adsorption caused by the adsorption pad 181a.

Next, as shown in Figure 13(c), the device controller 30 controls the substrate conveying mechanism 15 to hold the substrate W placed on the platform 181 by raising the pick-up member 151 to the UP position and using the pad 151b. The UP position is the position where the substrate W is below the platform 181.

Next, the device controller 30 controls the substrate conveying mechanism 15 to move the pickup 151 so that the center of the substrate W after rotating 90° is aligned with the center of the positioning stage 17 in the forward and backward direction of the pickup 151. Then, as shown in Figures 11(a) to 11(d) and Figures 12(a) to 12(c), the device controller 30 positions the substrate W relative to the pickup 151 in a second direction orthogonal to the first direction in the same way as it positions the substrate W relative to the pickup 151 in the first direction.

Based on the above description, the loading unit 10 will complete the positioning of the pickup 151 by the substrate W in the first and second directions before inspection.

Furthermore, although the above-described variation illustrates that the retaining pin 172 of the positioning stage 17 can be freely raised and lowered relative to the base 181 of the rotary stage 18, this disclosure is not limited to this. For example, the base 181 of the rotary stage 18 could also be freely raised and lowered relative to the retaining pin 172 of the positioning stage 17. Alternatively, both the retaining pin 172 of the positioning stage 17 and the base 181 of the rotary stage 18 could be freely raised and lowered.

Furthermore, in the above embodiment, the device controller 30 is an example of a control unit.

The embodiments disclosed herein should be considered as exemplars in all respects rather than limitations. The aforementioned embodiments can be omitted, substituted, or modified in various forms without departing from the scope and intent of the patent application.

Although the above embodiments are illustrated using inspection device 1 as an example, this disclosure is not limited thereto. It can also be used in other processing devices such as film forming devices that form films on substrate W, etching devices that etch films formed on substrate W, etc., instead of inspection device 1.

1: Inspection device 12, 17: Positioning stage 13, 18: Rotary table 15: Substrate conveying mechanism 151, 152: Pick-up parts 151c: Block section W: Substrate

Figure 1 is a front view showing an example of an inspection apparatus in an embodiment. Figure 2 is a top view showing an example of an inspection apparatus in an embodiment. Figure 3 is a diagram showing an example of a loading unit. Figure 4 is a diagram showing an example of a pickup unit. Figure 5 is a diagram showing an example of a positioning stage. Figure 6 is a diagram showing an example of a rotary stage. Figure 7 is a flowchart showing an example of an inspection method in an embodiment. Figure 8 is a diagram showing an example of the operation of a positioning substrate. Figure 9 is a diagram showing an example of the operation of rotating the substrate. Figure 10 is a diagram showing other examples of a positioning stage and a rotary stage. Figure 11 is a diagram showing another example of the operation of a positioning substrate (1). Figure 12 is a diagram showing another example of the operation of a positioning substrate (2). Figure 13 is a diagram showing another example of the operation of a positioning substrate (3).

151: Pick-up component 151a: Base 151b: Pad 151c: Block part 151d: Pressing surface W: Substrate

Claims (14)

A substrate processing apparatus includes: a conveying mechanism for conveying a rectangular substrate; a positioning stage for positioning the substrate conveyed by the conveying mechanism; and a rotating stage for rotating the substrate, which has been positioned in a first direction on the positioning stage, to position it in a second direction orthogonal to the first direction; the positioning stage includes a plurality of retaining pins at its upper end to hold the substrate in a freely sliding manner; the conveying mechanism includes a block portion that presses the end of the substrate placed on the plurality of retaining pins of the positioning stage to position the substrate. The substrate processing apparatus of claim 1 includes a control unit configured to perform the following steps: placing the substrate on the positioning stage and positioning the substrate in the first direction by pressing the end of the substrate with the block portion; placing the substrate positioned in the first direction on the rotary table and rotating it by 90°; and placing the substrate rotated by 90° on the positioning stage and positioning the substrate in the second direction by pressing the end of the substrate with the block portion. For example, in the substrate processing apparatus of claim 1 or 2, the block portion is disposed at the base of the pick-up component of the conveying mechanism. For example, in the substrate processing apparatus of claim 3, the block portion has a pressing surface that is orthogonal to the forward and backward direction of the pickup and presses the end of the substrate. For example, in the substrate processing apparatus of claim 3, the pickup includes multiple pads that hold the substrate. For example, in the substrate processing apparatus of claim 5, the plurality of pads includes at least two adsorption pads that can attract independently. The substrate processing apparatus of claim 3 includes: a cassette for storing the substrate; and a position detection sensor disposed on a transport path that causes the pickup to store the substrate in the cassette and detects the position of the substrate held by the pickup. For example, in the substrate processing apparatus of claim 1 or 2, the positioning stage includes a base formed in the shape of a plate; the plurality of retaining pins protrude upward from the base. For example, in the substrate processing apparatus of claim 8, the positioning stage includes a lifting mechanism that raises the base. For example, in the substrate processing apparatus of claim 1 or 2, the positioning stage is located above or below the rotary table. For example, in the substrate processing apparatus of claim 1 or 2, the positioning stage is integrated with the rotary table. The substrate processing apparatus of claim 1 or 2, wherein the substrate is at least one of the substrate before being processed in the processing apparatus and the substrate after being processed in the processing apparatus. Such as the substrate processing apparatus in claim 12, wherein the processing is the processing of inspecting the substrate. A substrate positioning method comprises: a step of conveying a rectangular substrate by a conveying mechanism and placing the substrate on a plurality of retaining pins on a positioning stage; a step of positioning the substrate in a first direction by pressing the end of the substrate placed on the plurality of retaining pins on the positioning stage with a block portion provided on the conveying mechanism to make the substrate slide on the plurality of retaining pins; a step of placing the substrate, which has been positioned in the first direction, on a rotary table and rotating it by 90°; and a step of conveying the substrate, which has been rotated by 90°, by the conveying mechanism and placing it on the plurality of retaining pins on the positioning stage, and positioning the substrate in a second direction orthogonal to the first direction by pressing the end of the substrate with the block portion to make the substrate slide on the plurality of retaining pins.