TWI908365B - Display apparatus - Google Patents

Abstract

A display apparatus includes a driving backplane, a bank layer, light-emitting elements and a color filter substrate. The bank layer is disposed on the driving backplane and has a first opening, a second opening and a third opening, wherein the first opening and the second opening are located on the same side of the third opening. The light-emitting elements are located in the first opening, the second opening and the third opening, and are electrically connected to the driving backplane. The color filter substrate is disposed opposite to the driving backplane. The color filter substrate has a yellow filter pattern and a cyan filter pattern. The yellow filter pattern is located above the first opening and the second opening. The cyan filter pattern is located above the third opening.

Description

Display device

This invention relates to an electronic device, and more particularly to a display device.

With the evolution of display technology, high-resolution and thin-film display devices have become popular in the mainstream market. In recent years, breakthroughs in the manufacturing process of light-emitting diode (LED) elements have led to the development of micro-LED displays (or millimeter-scale LED displays) made by arranging LED arrays. Micro-LED displays do not require a liquid crystal layer, further reducing the thickness of the display device. Furthermore, compared to organic light-emitting diode (OLED) displays, micro-LED displays offer advantages such as lower power consumption and longer lifespan.

In the current manufacturing process of miniature LED displays, a large number of LEDs are transferred onto the driver backplane via mass transfer. However, modern displays often have millions of pixels, and the LEDs are so small that precise bonding with the solder pads is difficult, leading to problems where some LEDs cannot be driven properly. Furthermore, among the large number of LEDs, a small number may be faulty and unable to light up. All of these situations cause pixel malfunctions in miniature LED displays, requiring repair by bonding new LEDs to the pre-installed solder pads. However, the reserved solder pads make it difficult to improve the resolution of miniature LED displays.

On the other hand, due to the poor high-temperature reliability of light-emitting diode (LED) elements that can directly emit red light, most current miniature LED displays use blue LED elements combined with color-conversion patterns to emit red light. Generally, color-conversion materials can be sprayed into the openings of the substrate layer using an inkjet printing process to form the color-conversion pattern. However, the limited precision of the inkjet printing process restricts the improvement of the resolution of miniature LED displays.

This invention provides a display device with excellent performance.

A display device according to an embodiment of the present invention includes a driver backplane, a shore layer, a plurality of light-emitting elements, and a color filter substrate. The shore layer is disposed on the driver backplane and has a first opening, a second opening, and a third opening, wherein the first opening and the second opening are located on the same side of the third opening. The plurality of light-emitting elements are located in the first opening, the second opening, and the third opening and are electrically connected to the driver backplane. The color filter substrate is disposed opposite the driver backplane. The color filter substrate has a yellow filter pattern and a cyan filter pattern. The yellow filter pattern is located on the first opening and the second opening. The cyan filter pattern is located on the third opening.

A display device according to one embodiment of the present invention includes a driver backplane, a embankment layer, and a plurality of light-emitting elements. The embankment layer is disposed on the driver backplane and has a first opening, a second opening, and a third opening, wherein the first opening and the second opening are located on the same side of the third opening. The plurality of light-emitting elements are located in the first opening, the second opening, and the third opening, and are electrically connected to the driver backplane. The area of the first opening is not equal to the area of the third opening. The number of a portion of the plurality of light-emitting elements located in the first opening is not equal to the number of another portion of the plurality of light-emitting elements located in the third opening.

In one embodiment of the present invention, the area of the first opening and the area of the second opening are smaller than the area of the third opening.

In one embodiment of the present invention, the plurality of light-emitting elements mentioned above includes a first light-emitting element. The display device further includes a color conversion pattern disposed in one of the first opening and the second opening, and covering the first light-emitting element. The color conversion pattern is used to convert the first color light emitted by the first light-emitting element into red light, and the color conversion pattern overlaps with the yellow filter pattern.

In one embodiment of the present invention, the aforementioned plurality of light-emitting elements further includes a second light-emitting element disposed in the other of the first opening and the second opening. The second light-emitting element is used to emit a second color light. The first color light is different from the second color light, and the yellow filter pattern overlaps the first light-emitting element and the second light-emitting element.

In one embodiment of the present invention, the aforementioned plurality of light-emitting elements further includes a second light-emitting element and a third light-emitting element. The second light-emitting element and the third light-emitting element are disposed in the third opening and are respectively used to emit a second color light and a third color light. The second color light and the third color light are different, and the cyan filter pattern overlaps on the second light-emitting element and the third light-emitting element.

In one embodiment of the present invention, the plurality of light-emitting elements mentioned above include a first light-emitting element and a third light-emitting element, which are respectively disposed in a first opening and a third opening, and the long side direction of the first light-emitting element intersects with the long side direction of the third light-emitting element.

In one embodiment of the present invention, the plurality of light-emitting elements mentioned above includes a first light-emitting element disposed in a first opening, wherein the long side direction of the first light-emitting element is substantially parallel to the long side direction of the third opening.

In one embodiment of the present invention, the plurality of light-emitting elements described above includes a second light-emitting element. The display device further includes a spare pad assembly electrically connected to a drive backplane. The spare pad assembly and the second light-emitting element are disposed in a third opening. The arrangement direction of the plurality of pads in the spare pad assembly is staggered with the long side direction of the second light-emitting element.

Reference will now be made to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

It should be understood that when a component, such as a layer, film, region, or substrate, is referred to as being "on" or "connected" to another component, it may be directly on or connected to the other component, or an intermediate component may also be present. Conversely, when a component is referred to as being "directly on" or "directly connected" to another component, no intermediate component is present. As used herein, "connection" can refer to physical and/or electrical connection. Furthermore, "electrical connection" or "coupling" may involve the presence of other components between two components.

As used herein, “about,” “approximately,” or “substantially” includes the value and the average of the values within an acceptable range of deviation from a particular value as determined by a person of ordinary skill in the art, taking into account the measurement under discussion and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, “about,” “approximately,” or “substantially” may be used to select a more acceptable range of deviations or standard deviations depending on the optical, etchable, or other properties, rather than applying a single standard deviation to all properties.

Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant technical and present invention context, and will not be interpreted as having an idealized or overly formal meaning, unless expressly defined herein.

Figures 1A to 1F are top views illustrating the manufacturing process of the display device 10 according to the first embodiment of the present invention. Figures 1A to 1F illustrate the manufacturing process of one pixel area PX of the display device 10 as an example. Those skilled in the art can implement the entire display device 10 based on the manufacturing process of one pixel area PX shown in Figures 1A to 1F, therefore other pixel areas PX will not be shown again.

Referring to Figure 1A, firstly, a driver backplane 110 and multiple pad groups 120 electrically connected to the driver backplane 110 are provided. The driver backplane 110 has multiple sub-pixel driver circuits (not shown). The multiple pad groups 120 are electrically connected to the multiple sub-pixel driver circuits. Each pad group 120 includes at least one pad 122. For example, in some embodiments, each pad group 120 may optionally include two pads 122, and each sub-pixel driving circuit may include a first transistor (not shown), a second transistor (not shown), and a capacitor (not shown), wherein a first terminal of the first transistor is electrically connected to a corresponding data line (not shown), and a control terminal of the first transistor is electrically connected to a corresponding scan line (not shown). The second terminal of the capacitor is electrically connected to the control terminal of the second transistor, the first terminal of the second transistor is electrically connected to a corresponding power line (not shown), the capacitor is electrically connected to the second terminal of the first transistor and the first terminal of the second transistor, the second terminal of the second transistor is electrically connected to a corresponding pad 122 of a pad group 120, and the other pad 122 of the pad group 120 is electrically connected to a corresponding common line (not shown). However, the invention is not limited thereto. In other embodiments, each pad group 120 may optionally include other numbers of pads 122 (e.g., only one pad 122), and the sub-pixel driving circuit may also be other types of circuits.

In some embodiments, the multiple solder pad groups 120 may include multiple main solder pad groups 120M and multiple spare solder pad groups 120R. For example, in some embodiments, within the same pixel area, the multiple main solder pad groups 120M may include a first main solder pad group 120M-1, a second main solder pad group 120M-2, a third main solder pad group 120M-3, a first spare solder pad group 120R-1, and a second spare solder pad group 120R-2, but the invention is not limited thereto.

Referring to Figure 1A, a embankment layer 130 is then formed on the drive backplate 110, wherein the embankment layer 130 has multiple openings 132 that expose multiple solder pad assemblies 120. Within the same pixel area, the multiple openings 132 of the embankment layer 130 include a first opening 132-1, a second opening 132-2, and a third opening 132-3, wherein the first opening 132-1 and the second opening 132-2 are located on the same side of the third opening 132-3. The first opening 132-1, the second opening 132-2, and the third opening 132-3 are adjacent to each other. There are no other openings of the embankment layer 130 between the first opening 132-1 and the second opening 132-2. There are no other openings with a levee layer 130 between the first opening 132-1 and the third opening 132-3. There are no other openings with a levee layer 130 between the second opening 132-2 and the third opening 132-3. In some embodiments, the areas of the first opening 132-1 and the second opening 132-2 may be smaller than the area of the third opening 132-3. In some embodiments, the first opening 132-1 has an edge 132-1s that is away from the second opening 132-2, the second opening 132-2 has an edge 132-2s that is away from the first opening 132-1, the edge 132-1s of the first opening 132-1 and the edge 132-2s of the second opening 132-2 are separated by a distance D1 in a direction x, and the third opening 132-3 has a width D2 in the same direction x, and the distance D1 is substantially equal to the width D2. In some embodiments, the first primary pad group 120M-1 is located in the first opening 132-1, the first backup pad group 120R-1 is located in the second opening 132-2, and the second primary pad group 120M-2, the second backup pad group 120R-2, and the third primary pad group 120M-3 are located in the third opening 132-3, but the invention is not limited thereto. In some embodiments, there are no other pad groups 120 in the first opening 132-1 except for one pad group 120 (e.g., the first primary pad group 120M-1). In some embodiments, there are no other pad groups 120 in the second opening 132-2 except for one pad group 120 (e.g., the first backup pad group 120R-1). In some embodiments, the embankment layer 130 is reflective, and the color of the embankment layer 130 is, for example, white, but the invention is not limited thereto.

Referring to Figure 1A, a plurality of light-emitting elements 140 are then transposed onto the driver backplane 110, and the plurality of light-emitting elements 140 are electrically connected to a plurality of solder pad assemblies 120 respectively. The plurality of light-emitting elements 140 includes a first light-emitting element 140-1, a second light-emitting element 140-2, and a third light-emitting element 140-3. In some embodiments, in the same pixel area, the first light-emitting element 140-1, the second light-emitting element 140-2, and the third light-emitting element 140-3 are transposed onto the driver backplane 110 and respectively bonded to the first main solder pad assembly 120M-1, the second main solder pad assembly 120M-2, and the third main solder pad assembly 120M-3. The first light-emitting element 140-1, the second light-emitting element 140-2, and the third light-emitting element 140-3 are respectively used to emit a first color light, a second color light, and a third color light. In some embodiments, the first color light is different from the second color light, and the second color light is different from the third color light. In some embodiments, the first color light and the third color light may be selectively the same. For example, in some embodiments, the first color light, the second color light, and the third color light are, for example, blue light, green light, and blue light, respectively, but the invention is not limited thereto.

Referring to Figure 1B, next, check whether the multiple light-emitting elements 140 can be illuminated by the drive backplane 110 to identify the light-emitting elements 140 that cannot be illuminated (i.e., the light-emitting elements 140 marked with an X in Figure 1B). Referring to Figures 1B and 1C, next, perform a repair process, which may involve removing or leaving the light-emitting elements 140 that cannot be illuminated, and bonding new light-emitting elements 140' to the spare pad assembly 120R. For example, in some embodiments, the second light-emitting element 140-2 and the third light-emitting element 140-3 cannot be lit and are removed. After the second light-emitting element 140-2 and the third light-emitting element 140-3 are removed, the multiple main pad groups 120M originally located under the second light-emitting element 140-2 and the third light-emitting element 140-3 are exposed to form idle pad groups 120M'. The new second light-emitting element 140-2' and the new third light-emitting element 140-3' are used to emit the second color light and the third color light, respectively. The new second light-emitting element 140-2' and the new third light-emitting element 140-3' can be respectively bonded to the first spare pad group 120R-1 and the second spare pad group 120R-2, but the present invention is not limited thereto.

Referring to Figure 1D, multiple optical structures 150 are then formed in the multiple openings 132 of the embankment layer 130. A light-emitting element substrate 100 is formed by the drive backplate 110, the pad assembly 120, the embankment layer 130, the multiple light-emitting elements 140, 140', and the multiple optical structures 150. For example, in some embodiments, ink-jet printing (IJP) can be used to form the multiple optical structures 150 in the multiple openings 132, but the invention is not limited thereto. In some embodiments, within the same pixel area, multiple optical structures 150 may include a color conversion pattern 151 disposed in a first opening 132-1, a first light-transmitting pattern 152 disposed in a second opening 132-2, and a second light-transmitting pattern 153 disposed in a third opening 132-3. In some embodiments, the color conversion pattern 151 covers the first light-emitting element 140-1 and is used to convert a first color light (e.g., blue light) emitted by the first light-emitting element 140-1 into red light. In some embodiments, the first light-transmitting pattern 152 and the second light-transmitting pattern 153 respectively cover the second light-emitting element 140-2' and the third light-emitting element 140-3'. In some embodiments, the first light-transmitting pattern 152 and the second light-transmitting pattern 153 may selectively include multiple scattering particles mixed into the light-transmitting substrate in addition to the light-transmitting substrate, but the present invention is not limited thereto.

Referring to Figure 1E, a color filter substrate 200 is then provided. The color filter substrate 200 includes a light-shielding pattern layer 210 and a plurality of color filter patterns 220, wherein the light-shielding pattern layer 210 has a plurality of openings 212, and the plurality of color filter patterns 220 are respectively disposed in the plurality of openings 212 of the light-shielding pattern layer 210. For example, in some embodiments, in the same pixel area, the plurality of openings 212 of the light-shielding pattern layer 210 may include a first opening 212-1 and a second opening 212-2, and the plurality of color filter patterns 220 may include a yellow filter pattern 220Y and a cyan filter pattern 220C respectively disposed in the first opening 212-1 and the second opening 212-2.

Figure 2 is a schematic cross-sectional view of the display device 10 according to the first embodiment of the present invention. Figure 2 corresponds to line segments I-I’, II-II’ and III-III’ in Figure 1F. Referring to Figures 1D, 1E, 1F and 2, the light-emitting element substrate 100 and the color filter substrate 200 are then assembled to complete the display device 10. In some embodiments, the light-emitting element substrate 100 and the color filter substrate 200 are connected to each other, for example, through a filler 300 (shown in Figure 2).

Referring to Figures 1F and 2, the display device 10 includes a driving backplate 110, a embankment layer 130, multiple light-emitting elements 140, 140', and a color filter substrate 200. The embankment layer 130 is disposed on the driving backplate 110 and has a first opening 132-1, a second opening 132-2, and a third opening 132-3, wherein the first opening 132-1 and the second opening 132-2 are located on the same side of the third opening 132-3. The multiple light-emitting elements 140 are located in the first opening 132-1, the second opening 132-2, and the third opening 132-3, and are electrically connected to the driving backplate 110. A color filter substrate 200 is disposed opposite to the drive backplate 110, wherein the color filter substrate 200 includes a yellow filter pattern 220Y, and the yellow filter pattern 220Y is located on the first opening 132-1 and the second opening 132-2 of the embankment layer 130.

In some embodiments, the first opening 212-1 of the shading pattern layer 210 may be located on the first opening 132-1 and the second opening 132-2 of the embankment layer 130, and the yellow light filtering pattern 220Y in the first opening 212-1 of the shading pattern layer 210 may overlap with the first light-emitting element 140-1 in the first opening 132-1 of the embankment layer 130 and the second light-emitting element 140-2' in the second opening 132-2 of the embankment layer 130. However, the present invention is not limited thereto. In other embodiments not shown, the yellow filter pattern 220Y may also include multiple yellow sub-filter patterns (not shown) respectively disposed in multiple openings (not shown) of the light-shielding pattern layer 210, and the multiple yellow sub-filter patterns may overlap with the first light-emitting element 140-1 located in the first opening 132-1 and the second light-emitting element 140-2' located in the second opening 132-2, respectively.

The color filter substrate 200 further includes a cyan filter pattern 220C disposed in the second opening 212-2 of the light-shielding pattern layer 210 and located on the third opening 132-3 of the embankment layer 130. In some embodiments, the cyan filter pattern 220C may overlap with the third light-emitting element 140-3' located in the third opening 132-3 and the idle pad assembly 120M' located in the third opening 132-3.

In some embodiments, a pixel area PX of the display device 10 includes a first sub-pixel area SPX1, a second sub-pixel area SPX2, and a third sub-pixel area SPX3. At least a portion of the first light-emitting element 140-1, the color conversion pattern 151, and the yellow filter pattern 220Y for emitting a first color light (e.g., blue light) are located in the first sub-pixel area SPX1, and the first sub-pixel area SPX1 can provide red light for emitting a second color light (e.g., green light). At least a portion of the second light-emitting element 140-2', the first light-transmitting pattern 152, and the yellow light-filtering pattern 220Y are located in the second sub-pixel area SPX2, which provides green light. At least a portion of the third light-emitting element 140-3', the second light-transmitting pattern 153, and the cyan light-filtering pattern 220C are located in the third sub-pixel area SPX3, which provides blue light.

The display device 10 of this invention has at least one of the following advantages: (1) it can improve the color conversion efficiency and light extraction efficiency of the first sub-pixel area SPX1; (2) it can improve the process window of the ink-jet printing (IJP) process; (3) it can achieve high resolution; (4) while achieving high resolution, it can maintain sufficient spare solder pads 120R for repair.

Figure 3 illustrates the relationship between the width W1/W2 of the color conversion pattern 151 of the first sub-pixel region SPX1 in Figure 1F and the ratio of the emitted light intensity of the first sub-pixel region SPX1. Referring to Figures 1F and 3, it can be seen from Figure 3 that when the width W1/W2 of the color conversion pattern 151 falls within the range of 40μm to 50μm, the color conversion efficiency and light extraction efficiency of the first sub-pixel region SPX1 can be improved by approximately 24%. Referring to Figure 1F, for example, in some embodiments, the width W1/W2 of the color conversion pattern 151 (or, the width W1/W2 of the first sub-pixel region SPX1) can be 46μm, but the present invention is not limited to this.

It must be noted that the following embodiments use the component designations and some content of the aforementioned embodiments, employing the same designations to represent the same or similar components, and omitting descriptions of the same technical content. For explanations of the omitted parts, please refer to the aforementioned embodiments; these will not be repeated in the following embodiments.

Figures 4A to 4F are top views illustrating the manufacturing process of the display device 10A of the second embodiment of the present invention. The display device 10A of the second embodiment shown in Figures 4A to 4F and its manufacturing process are similar to those of the display device 10 of the first embodiment shown in Figures 1A to 1F.

The manufacturing process of the display device 10A of the second embodiment shown in Figures 4A to 4F differs from the manufacturing process of the display device 10 of the first embodiment shown in Figures 1A to 1F in that: in the embodiments shown in Figures 4A to 4F, in the step of inspecting the light-emitting element 140 shown in Figure 4B, it is found that the first light-emitting element 140-1 and the second light-emitting element 140-2 cannot be lit; in the steps shown in Figures 4B to 4C, the first light-emitting element 140-1 and the second light-emitting element 140-2 that cannot be lit are removed to expose the two solder pad sets 120, and the exposed solder pad sets 120 form two idle solder pad sets 120M' (or, the first light-emitting element 140-1 and the second light-emitting element 140-2 that cannot be lit are left and the first light-emitting element 140-1 and the second light-emitting element 140-2 are left to be lit). The light-emitting element 140-2 is disconnected from the drive backplane 110, and a new first light-emitting element 140-1' is bonded to the spare pad assembly 120R located in the second opening 132-2, and a new second light-emitting element 140-2' is bonded to the spare pad assembly 120R located in the third opening 132-3; in the steps shown in FIG4D, the color conversion pattern 151 is formed on the second The opening 132-2 is used to cover the new first light-emitting element 140-1'. The first light-transmitting pattern 152 is formed in the first opening 132-1 to cover an idle solder pad group 120M'. The second light-transmitting pattern 153 is formed in the third opening 132-3 to cover the third light-emitting element 140-3, the new second light-emitting element 140-2', and another idle solder pad group 120M'.

The difference between the display device 10A of the second embodiment shown in FIG4F and the display device 10 of the first embodiment shown in FIG1F is that, in the embodiment of FIG4F, the yellow filter pattern 220Y overlaps with the new first light-emitting element 140-1’ and an idle pad group 120M’ located in the first opening 132-1, and the cyan filter pattern 220C overlaps with the second light-emitting element 140-2’ and the third light-emitting element 140-3, which are used to emit different second and third colors of light, and further overlaps with another idle pad group 120M’. The first light-emitting element 140-1’ is disposed in one of the first opening 132-1 and the second opening 132-2 (e.g., the second opening 132-2), and the idle solder pad assembly 120M’, the second light-emitting element 140-2’ and the third light-emitting element 140-3 are disposed in the third opening 132-3.

Figures 5A to 5F are top views illustrating the manufacturing process of the display device 10B according to the third embodiment of the present invention. The display device 10B and its manufacturing process of the third embodiment shown in Figures 5A to 5F are similar to the display device 10 and its manufacturing process of the first embodiment shown in Figures 1A to 1F.

The manufacturing process of the display device 10B of the third embodiment shown in Figures 5A to 5F differs from the manufacturing process of the display device 10 of the first embodiment shown in Figures 1A to 1F in that: in the embodiments shown in Figures 5A to 5F, in the step of inspecting the light-emitting element 140 shown in Figure 5B, it is found that the first light-emitting element 140-1 and the third light-emitting element 140-3 cannot be lit; in the steps shown in Figures 5B to 5C, the first light-emitting element 140-1 and the third light-emitting element 140-3 that cannot be lit are removed, exposing the two solder pad sets 120. The exposed two solder pad sets 120 form two idle solder pad sets 120M', and a new first light-emitting element 140-1 is then placed... 1’ is bonded to the spare pad assembly 120R located in the second opening 132-2, and the new third light-emitting element 140-3’ is bonded to the spare pad assembly 120R located in the third opening 132-3; in the steps shown in FIG5D, a color conversion pattern 151 is formed in the second opening 132-2 to cover the new first light-emitting element 140-1’, a first light-transmitting pattern 152 is formed in the first opening 132-1 to cover an idle pad assembly 120M’, and a second light-transmitting pattern 153 is formed in the third opening 132-3 to cover the new third light-emitting element 140-3’, the second light-emitting element 140-2, and another idle pad assembly 120M’.

The difference between the display device 10B of the third embodiment shown in FIG5F and the display device 10 of the first embodiment shown in FIG1F is that, in the embodiment of FIG5F, the yellow filter pattern 220Y overlaps with the new first light-emitting element 140-1’ and an idle pad group 120M’ located in the first opening 132-1, and the cyan filter pattern 220C overlaps with the second light-emitting element 140-2 and the third light-emitting element 140-3’ used to emit different second and third colors of light, and further overlaps with another idle pad group 120M’.

Figures 6A to 6F are top views illustrating the manufacturing process of the display device 10C according to the fourth embodiment of the present invention. The display device 10C and its manufacturing process of the fourth embodiment shown in Figures 6A to 6F are similar to the display device 10 and its manufacturing process of the first embodiment shown in Figures 1A to 1F. The difference between the two is that, in the embodiments of Figures 6A to 6F, as shown in Figure 6A, the arrangement direction d122 of the plurality of solder pads 122 located in the first opening 132-1 is substantially parallel to the long side direction d132-3 of the third opening 132-3, and the arrangement direction d122 of the plurality of solder pads 122 located in the second opening 132-2 is substantially parallel to the long side direction d132-3 of the third opening 132-3, wherein the long side 132-3e of the third opening 132-3 extends along the long side direction d132-3 of the third opening 132-3.

Furthermore, in the embodiments shown in Figures 6A to 6F, as shown in Figure 6F, the long side direction d140-1 of the first light-emitting element 140-1 and the long side direction d140-2' of the second light-emitting element 140-2' are substantially parallel to the long side direction d132-3 of the third opening 132-3. Referring to Figure 6F, the long side direction d140-1 of the first light-emitting element 140-1 and the long side direction d140-2' of the second light-emitting element 140-2' intersect with the long side direction d140-3' of the third light-emitting element 140-3'. The long side 140-1e of the first light-emitting element 140-1 extends along the long side direction d140-1 of the first light-emitting element 140-1, the long side 140-2e' of the second light-emitting element 140-2' extends along the long side direction d140-2' of the second light-emitting element 140-2', and the long side 140-3e' of the third light-emitting element 140-3' extends along the long side direction d140-3' of the third light-emitting element 140-3'.

Figures 7A to 7F are top views illustrating the manufacturing process of the display device 10D of the fifth embodiment of the present invention. The display device 10D of the fifth embodiment shown in Figures 7A to 7F and its manufacturing process are similar to the display device 10C of the fourth embodiment shown in Figures 6A to 6F and its manufacturing process.

The manufacturing process of the display device 10D of the fifth embodiment shown in Figures 7A to 7F differs from the manufacturing process of the display device 10C of the fourth embodiment shown in Figures 6A to 6F in that: in the embodiments of Figures 7A to 7F, in the step of inspecting the light-emitting element 140 shown in Figure 7B, it is found that the first light-emitting element 140-1 and the second light-emitting element 140-2 cannot be lit; in the steps shown in Figures 7B to 7C, the first light-emitting element 140-1 and the second light-emitting element 140-2 that cannot be lit are removed to expose the two solder pad groups 120, the exposed two solder pad groups 120 form two idle solder pad groups 120M', and a new first light-emitting element 140-1 is placed... 1’ is bonded to the spare pad assembly 120R located in the second opening 132-2, and the new second light-emitting element 140-2’ is bonded to the spare pad assembly 120R located in the third opening 132-3; in the steps shown in FIG7D, a color conversion pattern 151 is formed in the second opening 132-2 to cover the new first light-emitting element 140-1’, a first light-transmitting pattern 152 is formed in the first opening 132-1 to cover an idle pad assembly 120M’, and a second light-transmitting pattern 153 is formed in the third opening 132-3 to cover the third light-emitting element 140-3, the new second light-emitting element 140-2’, and another idle pad assembly 120M’.

The difference between the display device 10D of the fifth embodiment shown in FIG7F and the display device 10C of the fourth embodiment shown in FIG6F is that, in the embodiment of FIG7F, the yellow filter pattern 220Y overlaps with the new first light-emitting element 140-1’ and an idle pad group 120M’ located in the first opening 132-1, and the cyan filter pattern 220C overlaps with the second light-emitting element 140-2’ and the third light-emitting element 140-3, which are used to emit different second and third colors of light, and further overlaps with another idle pad group 120M’.

Figures 8A to 8F are top views illustrating the manufacturing process of the display device 10E according to the sixth embodiment of the present invention. The display device 10E of the sixth embodiment shown in Figures 8A to 8F and its manufacturing process are similar to those of the display device 10C of the fourth embodiment shown in Figures 6A to 6F.

The manufacturing process of the display device 10E of the sixth embodiment shown in Figures 8A to 8F differs from the manufacturing process of the display device 10C of the fourth embodiment shown in Figures 6A to 6F in that: in the embodiments of Figures 8A to 8F, in the step of inspecting the light-emitting element 140 shown in Figure 8B, it is found that the first light-emitting element 140-1 and the third light-emitting element 140-3 cannot be lit; in the steps shown in Figures 8B to 8C, the first light-emitting element 140-1 and the third light-emitting element 140-3 that cannot be lit are removed, exposing the two solder pad sets 120. The two exposed solder pad sets 120 form two idle solder pad sets 120M', and a new first light-emitting element 140 is then placed... -1’ is bonded to the spare pad group 120R located in the second opening 132-2, and the new third light-emitting element 140-3’ is bonded to the spare pad group 120R located in the third opening 132-3; in the steps shown in FIG8D, a color conversion pattern 151 is formed in the second opening 132-2 to cover the new first light-emitting element 140-1’, a first light-transmitting pattern 152 is formed in the first opening 132-1 to cover an idle pad group 120M’, and a second light-transmitting pattern 153 is formed in the third opening 132-3 to cover the new third light-emitting element 140-3’, the second light-emitting element 140-2 and another idle pad group 120M’.

The difference between the display device 10E of the sixth embodiment shown in FIG8F and the display device 10C of the fourth embodiment shown in FIG6F is that, in the embodiment of FIG8F, the yellow filter pattern 220Y overlaps with the new first light-emitting element 140-1’ and an idle pad group 120M’ located in the first opening 132-1, and the cyan filter pattern 220C overlaps with the second light-emitting element 140-2 and the third light-emitting element 140-3’ used to emit different second and third colors of light, and further overlaps with another idle pad group 120M’.

Figures 9A to 9F are top views illustrating the manufacturing process of the display device 10F of the seventh embodiment of the present invention. The display device 10F of the seventh embodiment shown in Figures 9A to 9F and its manufacturing process are similar to the display device 10C of the first embodiment shown in Figures 1A to 1F and its manufacturing process.

The manufacturing process of the display device 10F of the seventh embodiment shown in Figures 9A to 9F differs from the manufacturing process of the display device 10 of the first embodiment shown in Figures 1A to 1F in that: in the embodiments of Figures 9A to 9F, as shown in Figure 9A, the arrangement direction d122 of the multiple solder pads 122 located in the first opening 132-1 is substantially parallel to the long side direction d132-3 of the third opening 132-3, the arrangement direction d122 of the multiple solder pads 122 located in the second opening 132-2 is substantially parallel to the long side direction d132-3 of the third opening 132-3, and the number of spare solder pad groups 120R located in the third opening 132-3 is larger. The arrangement direction d122 of multiple pads 122 in one of the backup pad groups 120R located in the third opening 132-3 is intersected with the arrangement direction d122’ of multiple pads 122 in another backup pad group 120R located in the third opening 132-3.

In the embodiments shown in Figures 9A to 9F, in the step of inspecting the light-emitting element 140 shown in Figure 9B, it is found that the third light-emitting element 140-3 cannot be lit; in the steps shown in Figures 9B to 9C, the third light-emitting element 140-3 that cannot be lit is removed to expose a pad assembly 120, the exposed pad assembly 120 forms an idle pad assembly 120M', and a new third light-emitting element 140-3' is bonded to a spare pad assembly 120R located in the third opening 132-3.

The difference between the display device 10F of the seventh embodiment shown in FIG. 9F and the display device 10 of the first embodiment shown in FIG. 1F is that, in the embodiment of FIG. 9F, a spare pad assembly 120R and a second light-emitting element 140-2 are disposed in the third opening 132-3, and the arrangement direction d122' of the multiple pads 122 of the spare pad assembly 120R is staggered with the long side direction d140-2 of the second light-emitting element 140-2. In the embodiment of FIG. 9F, the area of the first opening 132-1 is not equal to the area of the third opening 132-3, and the number of light-emitting elements 140 located in the first opening 132-1 is not equal to the number of light-emitting elements 140 located in the third opening 132-3.

Figures 10A to 10F are top views illustrating the manufacturing process of the display device 10G of the eighth embodiment of the present invention. The display device 10G of the eighth embodiment shown in Figures 10A to 10F and its manufacturing process are similar to the display device 10F of the seventh embodiment shown in Figures 9A to 9F and its manufacturing process. The difference between the two is as follows: In the embodiments shown in Figures 10A to 10F, in the step of checking the light-emitting element 140 shown in Figure 10B, it is found that the second light-emitting element 140-2 cannot be lit; in the steps shown in Figures 10B to 10C, the second light-emitting element 140-2 that cannot be lit is removed to expose a pad assembly 120, the exposed pad assembly 120 forms an idle pad assembly 120M', and a new second light-emitting element 140-2' is bonded to a spare pad assembly 120R located in the second opening 132-2. The difference between the display device 10G of the eighth embodiment shown in FIG10F and the display device 10F of the seventh embodiment shown in FIG9F is that, in the embodiment of FIG10F, the second light-emitting element 140-2’ is located in the second opening 132-2.

Figures 11A to 11F are top views illustrating the manufacturing process of the display device 10H of the ninth embodiment of the present invention. The display device 10H of the ninth embodiment shown in Figures 11A to 11F and its manufacturing process are similar to the display device 10F of the seventh embodiment shown in Figures 9A to 9F and its manufacturing process. The difference between the two is as follows: In the embodiments shown in Figures 11A to 11F, in the step of inspecting the light-emitting element 140 shown in Figure 11B, it is found that the first light-emitting element 140-1 cannot be lit; in the steps shown in Figures 11B to 11C, the first light-emitting element 140-1 that cannot be lit is removed to expose a set of solder pads 120, the exposed set of solder pads 120 forms an idle set of solder pads 120M', and a new first light-emitting element 140-1' is bonded to the second opening 132- In step 11D, a color-changing pattern 151 is formed in the second opening 132-2 to cover the new first light-emitting element 140-1', a first light-transmitting pattern 152 is formed in the first opening 132-1 to cover an idle pad assembly 120M', and a second light-transmitting pattern 153 is formed in the third opening 132-3 to cover the third light-emitting element 140-3, the second light-emitting element 140-2, and multiple spare pad assemblies 120R. The difference between the display device 10H of the ninth embodiment shown in Figure 11F and the display device 10F of the seventh embodiment shown in Figure 9F is that the first light-emitting element 140-1' is located in the second opening 132-2.

10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H: Display device; 100: Light-emitting element substrate; 110: Driver backplate; 120: Solder pad assembly; 120M: Main solder pad assembly; 120M’: Idle solder pad assembly; 120M-1: First main solder pad assembly; 120M-2: Second main solder pad assembly; 120M-3: Third main solder pad assembly; 120R: Backup solder pad assembly; 120R-1: First backup solder pad assembly; 120R-2: Second backup solder pad assembly; 122: Solder pad; 130: Embankment layer; 132: Opening; 132-1: First opening; 132-1s, 132-2s: Edges. 132-2: Second opening; 132-3: Third opening; 132-3e, 140-1e, 140-2e’, 140-3e’: Long side; 140, 140’: Light-emitting element; 140-1, 140-1’: First light-emitting element; 140-2, 140-2’: Second light-emitting element; 140-3, 140-3’: Third light-emitting element; 150: Optical structure; 151: Color conversion pattern; 152: First light-transmitting pattern; 153: Second light-transmitting pattern; 200: Color filter substrate; 210: Light-shielding pattern layer; 212: Opening; 212-1: First opening; 212-2: Second opening; 220: Color filter pattern; 220Y: Yellow filter pattern. 220C: Cyan filter pattern 300: Filler D1: Distance D2, W1, W2: Width d122, d122’: Alignment direction d132-3, d140-1, d140-2, d140-2’, d140-3’: Long side direction PX: Pixel area SPX1: First sub-pixel area SPX2: Second sub-pixel area SPX3: Third sub-pixel area x: Direction I-I’, II-II’, III-III’: Line segment

Figures 1A to 1F are top views illustrating the manufacturing process of the display device 10 according to the first embodiment of the present invention. Figure 2 is a cross-sectional view illustrating the display device 10 according to the first embodiment of the present invention. Figure 3 shows the relationship between the width W1/W2 of the color conversion pattern 151 of the first sub-pixel area SPX1 in Figure 1F and the ratio of the light emission intensity of the first sub-pixel area SPX1. Figures 4A to 4F are top views illustrating the manufacturing process of the display device 10A according to the second embodiment of the present invention. Figures 5A to 5F are top views illustrating the manufacturing process of the display device 10B according to the third embodiment of the present invention. Figures 6A to 6F are top views illustrating the manufacturing process of the display device 10C according to the fourth embodiment of the present invention. Figures 7A to 7F are schematic top views illustrating the manufacturing process of the display device 10D according to the fifth embodiment of the present invention. Figures 8A to 8F are schematic top views illustrating the manufacturing process of the display device 10E according to the sixth embodiment of the present invention. Figures 9A to 9F are schematic top views illustrating the manufacturing process of the display device 10F according to the seventh embodiment of the present invention. Figures 10A to 10F are schematic top views illustrating the manufacturing process of the display device 10G according to the eighth embodiment of the present invention. Figures 11A to 11F are schematic top views illustrating the manufacturing process of the display device 10H according to the ninth embodiment of the present invention.

10: Display Devices

110: Drive Back Panel

120: Welding Pad Assembly

120M: Main Welding Pad Assembly

120M’: Idle Welding Pad Set

120M-1: First Main Welding Pad Assembly

120R: Spare solder pad set

120R-1: First Backup Welding Pad Set

120R-2: Second spare solder pad set

122: Welding pad

130: Embankment Layer

132: Opening

132-1: First Opening

132-2: Second opening

132-3: Third Opening

140, 140': Light-emitting element

140-1: First light-emitting element

140-2’: Second light-emitting element

140-3’: Third light-emitting element

150: Optical Structure

151: Color Conversion Pattern

152: First Translucent Pattern

153: Second translucent pattern

210: Opacity Pattern Layer

212: Opening

212-1: First Opening

212-2: Second opening

220: Color Filter Pattern

220Y: Yellow filter pattern

220C: Cyan Filter Pattern

W1, W2: Width

PX: Pixel Area Plain Page Area

SPX1: First Sub-pixel Area

SPX2: Second Sub-pixel Area

SPX3: Third Sub-Pixel Area

I-I’, II-II’, III-III’: line segment

Claims (8)

A display device includes: a driving backplate; a embankment layer disposed on the driving backplate and having a first opening, a second opening, and a third opening, wherein the first opening and the second opening are located on the same side of the third opening; a plurality of light-emitting elements disposed in the first opening, the second opening, and the third opening and electrically connected to the driving backplate; and a color filter substrate disposed opposite to the driving backplate, wherein the color filter substrate includes a yellow filter pattern and a cyan filter pattern, the yellow filter pattern being located on the first opening and the second opening, and the cyan filter pattern being located on the third opening. The display device as claimed in claim 1, wherein the area of the first opening and the area of the second opening are smaller than the area of the third opening. The display device as claimed in claim 1, wherein the light-emitting elements include a first light-emitting element, and the display device further includes: a color conversion pattern disposed in one of the first opening and the second opening, and covering the first light-emitting element, wherein the color conversion pattern is used to convert a first color light emitted by the first light-emitting element into a red light, and the color conversion pattern overlaps with the yellow filter pattern. The display device as described in claim 3, wherein the light-emitting elements further include a second light-emitting element disposed in the other of the first opening and the second opening, the second light-emitting element being used to emit a second color light, the first color light being different from the second color light, and the yellow filter pattern being superimposed on the first light-emitting element and the second light-emitting element. The display device as described in claim 3, wherein the light-emitting elements further include a second light-emitting element and a third light-emitting element, the second light-emitting element and the third light-emitting element being disposed at the third opening and respectively used to emit a second color light and a third color light, the second color light being different from the third color light, and the cyan filter pattern overlapping the second light-emitting element and the third light-emitting element. The display device as claimed in claim 1, wherein the light-emitting elements include a first light-emitting element and a third light-emitting element, the first light-emitting element and the third light-emitting element being respectively disposed in the first opening and the third opening, and a long side direction of the first light-emitting element intersecting with a long side direction of the third light-emitting element. The display device as claimed in claim 1, wherein the light-emitting elements include a first light-emitting element disposed in the first opening, and a long side of the first light-emitting element is substantially parallel to a long side of the third opening. The display device as claimed in claim 1, wherein the light-emitting elements include a second light-emitting element, the display device further includes: a spare pad assembly electrically connected to the drive backplate, wherein the spare pad assembly and the second light-emitting element are disposed in the third opening, and an arrangement direction of a plurality of pads of the spare pad assembly is staggered with a long side direction of the second light-emitting element.