TWI907912B - An equipment for reading a batch code of a wafer - Google Patents

Abstract

An equipment for reading a batch code of a wafer includes a carrying platform, a pushing device, and a reading device. The carrying platform has a first open which punches through the carrying platform and a carrying surface. When a wafer box is disposed on the carrying surface, the first open is connected to a bottom open of the wafer box. The pushing device is disposed under the carrying platform and could move from a starting position, the first open, and the bottom open to a pushing position to push a wafer of the wafer box, which moves a coding zone of the wafer from a direction opposite to the bottom open. The reading device is disposed on the carrying platform and includes a light source and an image capturing unit, wherein the light source illuminates the coding zone along a reference axis. The image capturing unit captures an image of the coding zone.

Description

Wafer coding equipment and wafer coding methods

This invention relates to semiconductor manufacturing equipment; in particular, it refers to a wafer reading device.

It is known that there are a large number of process stations in the manufacturing process of integrated circuits. In order to track the status of each wafer at each process station, laser codes are usually added to the surface of the wafer to facilitate wafer identification at each process station and to cope with the large number of wafers produced.

However, due to the small size of the laser-etched code, and the fact that the halo caused by the light source of the reading device can easily obscure the entire laser-etched code, it is easy to make mistakes when identifying it with the naked eye. In addition, there is a risk of human error in the process, and a large amount of manpower is required to cope with the large number of wafers produced and the process stations, which leads to a decrease in the overall efficiency of wafer reading operations and an increase in additional costs.

Therefore, there is still room for improvement in existing wafer reading technology. How to improve the efficiency and accuracy of wafer reading is a technical issue that related industries are currently focusing on.

In view of this, the purpose of this invention is to provide a wafer reading device that uses automated equipment to replace manual labor, thereby improving the efficiency and accuracy of wafer reading.

To achieve the above objectives, the present invention provides a wafer reading device for reading the codes of wafers in a wafer cassette. The wafer cassette has a plurality of interconnected receiving slots and a bottom opening, defining a reference axis. The receiving slots allow a plurality of wafers to be arranged along the reference axis in the wafer cassette. Each wafer has a coding area on one surface. The wafer reading device includes a stage, a pushing device, and a reading device. The stage has a first opening penetrating one of its sections and a bearing surface. When the wafer cassette is placed on the bearing surface, the first opening communicates with the bottom opening of the wafer cassette. The pushing device is disposed below the stage. The device is movable between a starting position and a pushing position. When the pushing device is in the starting position, it does not protrude through the first opening. When the pushing device is in the pushing position, it protrudes through the first opening. The pushing device can move from the starting position through the first opening and the bottom opening to the pushing position to push one of the wafers in the wafer cassette, causing the coding area of the wafer to shift away from the bottom opening. The reading device is disposed above the support stage and includes a light source and an image capturing unit. The light source emits light along the reference axis and illuminates the coding area. The image capturing unit captures an image of the coding area.

The present invention also provides a wafer coding method, the steps of which include: A. Providing a wafer cassette having a plurality of interconnected receiving slots and a bottom opening, the receiving slots correspondingly accommodating a plurality of wafers arranged along a reference axis in the wafer cassette, each wafer having a coding area on one surface; providing a light source and an image capturing unit; B. Displacing one wafer in the wafer cassette away from the bottom opening, exposing one coding area of the wafer to the outside of the wafer cassette; C. The light source emitting light and illuminating the coding area; D. The image capturing unit capturing an image of the coding area.

The advantages of this invention are that it achieves the purpose of automated wafer reading by capturing the image of the coding area through the image capture unit; and by emitting light along the reference axis and illuminating the coding area through the setting, the halos in the coding area are reduced, which facilitates the identification of the code in the coding area, thereby improving the accuracy of wafer reading.

To more clearly illustrate the present invention, preferred embodiments are described in detail below with reference to the accompanying drawings. Please refer to Figures 1 to 3, which show a preferred embodiment of the wafer reading device 100 of the present invention. The wafer reading device 100 is mounted on a rack F, wherein a horizontal reference surface R is defined. The rack F is mounted on the horizontal reference surface R. The rack F includes a top cover F1, a side cover F2, and an opening F3. The top cover F1 can be flipped vertically relative to the rack F, the side cover F2 can be flipped horizontally relative to the rack F, and the opening... The opening F3 is connected to the top cover F1 and the side cover F2 for placing a wafer cassette 200 on the rack F. The wafer reading device 100 is used to read the codes of multiple wafers 203 in the wafer cassette 200. As shown in FIG3, each wafer 203 has a coding area 203a on its surface. The coding area 203a of each wafer 203 has a code corresponding to each wafer 203. The code can be laser coding.

A reference axis L1 is defined, as shown in Figure 3. The wafer cassette 200 has a plurality of interconnected storage slots 201 and a bottom opening 202. The storage slots 201 are for the wafers 203 to be arranged in the wafer cassette 200 along the reference axis L1. The bottom opening 202 is connected to the storage slots 201.

As shown in Figure 4, the wafer reading device 100 includes a platform 10 and two slide rails 20. The platform 10 is disposed on the rack F. The platform 10 has a second opening 11 and a third opening 12 that pass through the platform 10. The third opening 12 and the second opening 11 are arranged at intervals on the reference axis L1. The two slide rails 20 are disposed on the top surface of the platform 10, and the two slide rails 20 are respectively located on opposite sides of the second opening 11 and the third opening 12.

As shown in Figures 3 and 4, the wafer reading device 100 further includes a support stage 30 and a baffle plate 40. The support stage 30 has a first opening 31 penetrating through it, a support surface 32, at least one set of slides 33, and at least one through hole 34. The top surface of the support stage 30 forms the support surface 32. The at least one set of slides 33 is disposed on the support surface 32. The at least one set of slides 33 includes two slides 331 extending along the reference axis L1. The two slides 331 support each other. The two slides 331 of each slide group 33 should be set on opposite sides of the first opening 31 of the carrier platform 30. The minimum distance between the two slides 331 of each slide group 33 is different from each other, as shown in Figure 5. When the wafer cassette 200 is set on the carrier surface 32, the bottom of the wafer cassette 200 engages with the two slides 331, and the wafer cassette 200 is connected to the carrier platform 30 in a way that allows it to slide on the two slides 331. The first opening 31 is connected to the bottom opening 202 of the wafer cassette 200 (see Figure 4).

In this embodiment, there are three slide groups 33, but this is not a limitation. In other embodiments, the number of slide groups 33 can be adjusted as needed. For example, the number of slide groups 33 can be one, and the minimum distance between the two slides 331 can be adjusted as needed to accommodate wafer cassettes 200 of various specifications.

As shown in Figure 6, one side of the baffle 40 is disposed on the bearing surface 32 and located at one end of the two sliding grooves 331, and the other side extends in a direction perpendicular to the bearing surface 32. The baffle 40 has a plate surface 41 and at least one first alignment member 42, wherein the at least one first alignment member 42 is disposed on the plate surface 41. The plate surface 41 is used to abut against one side of the wafer cassette 200, and one side of the wafer cassette 200 has at least one second alignment member 204 (as shown in Figure 3) corresponding to the at least one first alignment member 42. The at least one first alignment member 42 has an outer contour that cooperates with the at least one second alignment member 204 to fix the wafer cassette 200 in the position corresponding to the baffle 40. In this embodiment, the at least one first alignment member 42 and the at least one second alignment member 204 are illustrated as a groove and a protrusion, respectively. In other embodiments, the at least one first alignment member 42 and the at least one second alignment member 204 may also be any components that can be aligned and engaged with each other.

In this embodiment, the number of each of the at least one first alignment member 42 and the at least one second alignment member 204 is one, but not limited thereto. In other embodiments, the number of the at least one first alignment member 42 and the at least one second alignment member 204 can be adjusted as needed. For example, the number of the at least one first alignment member 42 and the at least one second alignment member 204 can be multiple, as long as the at least one first alignment member 42 has an outer contour that mates with the corresponding at least one second alignment member 204.

As shown in Figure 7, the at least one through hole 34 penetrates the support platform 30 and connects to the at least one slide rail assembly 33. The at least one through hole 34 has a first end opening 341 and a second end opening 342 disposed opposite to each other on two corresponding side edges of the support platform 30. In this embodiment, the number of the at least one through hole 34 is one, but not limited thereto. In other embodiments, the number of the at least one through hole 34 may be multiple.

As shown in Figures 5 and 7, the wafer reading device 100 further includes a first sensing device S1 and at least one second sensing device S2. In this embodiment, the first sensing device S1 and the at least one second sensing device S2 are contrast sensors. The first sensing device S1 includes a first transmitting unit S11 and a first receiving unit S12. The first transmitting unit S11 is disposed at the first end opening 341, and the first receiving unit S12 is disposed at the second end opening 342. When the wafer cassette 200 is disposed on the support surface 32, the device senses whether the first receiving unit S12 of the first sensing device S1 can receive the light from the first transmitting unit S11. The test measures whether the wafer cassette 200 abuts against the baffle 40. More specifically, when the wafer cassette 200 abuts against the baffle 40 and the at least one first alignment member 42 engages with the corresponding at least one second alignment member 204 (refer to Figures 3 and 6), the at least one through hole 34 will not be blocked by the bottom of the wafer cassette 200 and will be connected to the at least one slide group 33. The first receiving unit S12 can receive light from the first transmitting unit S11. Conversely, when the wafer cassette 200 does not abut against the baffle 40, the at least one through hole 34 will be blocked by the bottom of the wafer cassette 200 and will not be connected to the at least one slide group 33. The first receiving unit S12 will not be able to receive light from the first transmitting unit S11.

In this embodiment, the first transmitting unit S11 and the first receiving unit S12 are respectively disposed at the first end opening 341 and the second end opening 342. In other embodiments, the positions of the first transmitting unit S11 and the first receiving unit S12 can also be interchanged. For example, the first transmitting unit S11 and the first receiving unit S12 can be respectively disposed at the second end opening 342 and the first end opening 341, as long as the first transmitting unit S11 and the first receiving unit S12 are disposed at the openings at opposite ends of the at least one through hole 34.

As shown in Figure 5, in this embodiment, there are two second sensing devices S2. These two second sensing devices S2 are disposed above the support stage 30, and are respectively disposed along the reference axis L1 at both ends of the wafer cassette 200. Each second sensing device S2 includes a second transmitting unit S21 and a second receiving unit S22, respectively disposed on the left and right sides of the wafer cassette 200, and is used to sense whether the top of the wafer cassette 200 is in the correct position. More specifically, when the wafer cassette 200 is disposed in the corresponding at least one slide group 33 and the bottom of the wafer cassette 200 is aligned with the reference axis L1, the device is positioned correctly. When at least one of the slide groups 33 is engaged, the top of the wafer cassette 200 does not block the light emitted by the two second transmitting units S21. At this time, the top of the wafer cassette 200 is in the correct position, and the two second receiving units S22 can receive the light from the two second transmitting units S21. Conversely, when the wafer cassette 200 is not placed in the corresponding slide group 33, the top of the wafer cassette 200 blocks the light emitted by the two second transmitting units S21, and the two second receiving units S22 cannot receive the light from the two second transmitting units S21. At this time, the top of the wafer cassette 200 is not in the correct position.

In this embodiment, the number of second sensing devices S2 is illustrated by two, but this is not a limitation. In other embodiments, the number of second sensing devices S2 can be one or more. Furthermore, in this embodiment, the simultaneous installation of the first sensing device S1 and the two second sensing devices S2 is used as an example to increase the accuracy of sensing the placement position of the wafer cassette 200. In other embodiments, only the first sensing device S1 or one of the two second sensing devices S2 can be installed to achieve the same effect of sensing whether the wafer cassette 200 is correspondingly placed in the at least one slide group 33.

As shown in Figure 8, the wafer reading device 100 further includes a pushing device 50 and a reading device 60. The pushing device 50 is disposed below the support stage 30. The pushing device 50 includes a longitudinal slide rail 51 and a pushing member 52. The longitudinal slide rail 51 is disposed below the support stage 30 and extends in a direction away from the support stage 30. As shown in Figures 9 to 12, the pushing member 52 has two pushing ends 521, each pushing end 521 having a notch 521a. The notch 521a is formed by a... The pusher 52 is formed by two inclined surfaces with an angle θ2 (see Figure 11). The angle θ2 is between 30 and 80 degrees. Preferably, the angle θ2 can be set between 60 and 80 degrees. The pusher 52 is coupled to the longitudinal slide rail 51 in a way that allows it to slide on the longitudinal slide rail 51. In this way, the pusher 50 can move between a starting position P1 (see Figure 8) and a push position P2 (see Figure 13). In this embodiment, the pusher 52 is suitable for pushing wafers of various sizes, such as 12-inch and 6-inch wafers.

As shown in Figures 8, 12, and 13, when the pusher 52 pushes one of the wafers 203 in the wafer cassette 200, the pusher device 50 can move from the starting position P1 to the pusher position P2 to push one of the wafers 203 in the wafer cassette 200. The two pusher ends 521 of the pusher 52 respectively contact the outer edge of each wafer 203 in a point-contact manner (see Figure 12), so that one of the wafers 203... The coding area 203a is displaced away from the bottom opening 202 (see Figure 4). When the pusher device 50 is in the starting position P1, the pusher 52 of the pusher device 50 does not protrude from the first opening 31 (see Figure 4). When the pusher device 50 is in the pusher position P2, the pusher 52 protrudes from the first opening 31 and the bottom opening 202 of the wafer cassette 200 (see Figure 4).

As shown in Figures 8 and 14, the reading device 60 is disposed above the support platform 30. The reading device 60 defines a major axis L2 and includes a light source 61, an image capturing unit 62, and a bracket 63. The light source 61 is disposed on one side of the image capturing unit 62 so as to emit light along the reference axis L1. One end of the bracket 63 is disposed on the platform 10, and the other end extends along the major axis L2 in a direction away from the top surface of the platform 10 and houses the image capturing unit 62. The image capturing unit 62 and the light source 61 are disposed on the bracket 63 so as to be movable along the major axis L2 and the reference axis L1. Image capture unit 62 captures the image of the coding area 203a (see Figure 3); the image capture unit 62 and the light source 61 move along the long axis L2 and the reference axis L1 to the position corresponding to the coding area 203a of each wafer 203, so that the light source 61 illuminates the coding area 203a of each wafer 203 in a manner parallel to the reference axis L1, avoiding the halo effect generated by the light source 61 illuminating the coding area 203a of the wafer 203 when the reading device 60 reads the code of each wafer 203, thus making it impossible to identify the code in the coding area 203a. In this way, the effect of accurately identifying the code in the coding area 203a is achieved.

In this embodiment, the movement of the image capture unit 62 and the light source 61 can be adjusted as needed. It is not limited to the movement of the image capture unit 62 and the light source 61 simultaneously along the direction of the major axis L2 and the reference axis L1. For example, the movement of the image capture unit 62 and the light source 61 can also be along the direction of the major axis L2 only, and then the wafer cassette 200 is moved along the reference axis L1 by the carrier stage 30, as long as the image capture unit 62 and the light source 61 can be moved to the position corresponding to the coding area 203a of each wafer 203.

As shown in Figure 14, the wafer reading device 100 further includes a first rotating device 70 and a second rotating device 80. The first rotating device 70 is located below the second opening 11 of the platform 10, and the second rotating device 80 is located below the third opening 12 (with reference to Figure 4). The first rotating device 70 and the second rotating device 80 are respectively used to rotate the wafers 203 in the wafer cassette 200 to rotate the coding area 203a (with reference to Figure 3) of the wafers 203 to the upper position. As shown in Figure 4, the carrier stage 30 is coupled to the two slide rails 20 and can move along the reference axis L1 relative to the push device 50 (with reference to Figure 5) and the reading device 60. Thus, when the carrier stage 30 moves along the two slide rails 20 to the second opening 11, the device can rotate the wafers 203 in the platform 10 to the upper position. When the wafer cassette 200 is above the opening 11, the bottom opening 202, the first opening 31, and the second opening 11 of the wafer cassette 200 are connected (see Figure 4). At this time, the first rotating device 70 can engage with the wafers 203 in the wafer cassette 200 to rotate the coding area 203a (see Figure 3) of the wafers 203 to the top. When the carrier stage 30 moves along the two slide rails 20 to the top of the third opening 12 (as shown by the dotted line in Figure 4), the bottom opening 202, the first opening 31, and the third opening 12 of the wafer cassette 200 are connected. At this time, the second rotating device 80 can engage with the wafers 203 in the wafer cassette 200 to rotate the coding area 203a (see Figure 3) of the wafers 203 to the top.

Furthermore, in this embodiment, the first rotating device 70 and the second rotating device 80 are used to rotate wafers of different sizes. For example, the first rotating device 70 is used to rotate 8-inch and 12-inch wafers, while the second rotating device 80 is used to rotate 4-inch and 6-inch wafers. In this way, before the reading device 60 reads the code of each wafer 203, the carrier stage 30 can be controlled to move to the corresponding first rotating device 70 or second rotating device 80 to perform the wafer rotating operation, depending on the size of the wafer 203 carried by the carrier stage 30. In this way, the wafer reading device 100 can be applied to wafers of various sizes.

In actual operation, when the wafer cassette 200 is placed on the support surface 32, the first sensing device S1 and at least one second sensing device S2 first sense the corresponding position of the wafer cassette 200. At this time, the bottom opening 202, the first opening 31 and the second opening 11 of the wafer cassette 200 are connected. The first rotating device 70 rotates the coding area 203a of each wafer 203 in the wafer cassette 200 to the top, or via the support stage. The stage 30 moves along the reference axis L1 to the junction of the first opening 31 and the third opening 12. The second rotating device 80 rotates the coding area 203a of each wafer 203 in the wafer cassette 200 to the top. Then, the image capturing unit 62 and the light source 61 move along the long axis L2 and the reference axis L1 to the position corresponding to the coding area 203a of each wafer 203. At the same time, the stage 30 can be controlled to move along the two slide rails 20. The reference axis L1 moves until the pushing device 50 can move from the starting position P1 through the second opening 11, the first opening 31, and the bottom opening 202 of the wafer cassette 200 to the pushing position P2 to push one of the wafers 203 in the wafer cassette 200. Then, the image capture unit 62 captures the image of the encoding area 203a to read the wafer code. After that, the pushing device 50 returns to the starting position P1, so that the aforementioned wafer 203... 3. Return to the wafer cassette 200, and then the carrier stage 30 can be controlled to move along the reference axis L1 and toward the reading device by a first predetermined distance, so that the pushing device 50 can move from the starting position P1 to the pushing position P2 to push another wafer 203 adjacent to the aforementioned wafer 203. By repeating the aforementioned actions, the code of all wafers 203 in the wafer cassette 200 can be read, thereby achieving the purpose of wafer code reading automation.

To further explain, as shown in Figure 14, the support surface 32 is tilted at an angle θ1 relative to the horizontal reference surface R, and the angle θ1 is between 1 and 5 degrees. Therefore, when the wafer cassette 200 is placed on the support surface 32, the wafers 203 of the wafer cassette 200 are tilted to one side along the angle θ1, so that the spacing between the wafers 203 is consistent and equal to the first predetermined distance. In this way, when the support stage 30 is controlled to move the reading distance along the reference axis L1 and toward the reading device 60, the pusher device 50 can be precisely aligned with one of the wafers 203 in the wafer cassette 200.

Please refer to Figure 15, which shows a preferred embodiment of the wafer reading method of the present invention. In this embodiment, the wafer reading method is performed through the aforementioned wafer reading device 100. In practice, the wafer reading method can also be performed through other devices, and is not limited to the aforementioned wafer reading device 100. The wafer reading method includes the following steps:

Step A: A wafer cassette 200 is provided, which has a plurality of interconnected storage slots 201 and a bottom opening 202. The storage slots 201 are provided to accommodate a plurality of wafers 203. The wafers 203 are arranged in the wafer cassette 200 along a reference axis L1. Each wafer 203 has a coding area 203a on one surface. A light source 61 and an image capturing unit 62 are provided.

Herein, a horizontal reference surface R is defined. Step A further includes a step A01, in which the wafer cassette 200 is tilted at an angle θ1 relative to the horizontal reference surface R, so that the wafers 203 housed in the receiving slots 201 are tilted against one side of each receiving slot 201. This ensures that the wafers 203 in the wafer cassette 200 are spaced equally apart from each other.

Step A further includes step A02, in which the wafer cassette 200 is positioned at a location and a first sensing device S1 is provided. The first sensing device S1 senses whether the bottom of the wafer cassette 200 is located at the location. The location refers to the position where the bottom of the wafer cassette 200 is engaged with the at least one slide group 33 and the at least one second alignment member 204 of the wafer cassette 200 abuts against the at least one first alignment member 42 of the baffle 40. In addition, when the first sensing device S1 senses that the bottom of the wafer cassette 200 is not engaged with the at least one slide group 33 or the at least one second alignment member 204 is not abutting against the at least one first alignment member 42 of the baffle 40 and is not at the location, the wafer reading device 100 can issue an alarm to remind the user that the bottom of the wafer cassette 200 is not at the location. In this way, the wafer cell 200 can be accurately positioned relative to the light source 61 and the image capturing unit 62 at the positioning position.

Step A further includes step A03, in which the wafer cassette 200 is positioned at the designated location, and at least one second sensing device S2 is provided. The at least one second sensing device S2 senses whether the top of the wafer cassette 200 is located at the designated location. The designated location further refers to the position where the top of the wafer cassette 200 must be below the light emitted by the second transmitting unit S21. Furthermore, when the second sensing device S2 senses that the top of the wafer cassette 200 is blocking the light emitted by the second transmitting unit S21 and is not located at the designated location, the wafer reader 100 can issue an alarm to remind the user that the top of the wafer cassette 200 is not located at the designated location. In this way, the wafer cassette 200 can be accurately positioned relative to the light source 61 and the image capturing unit 62 at the designated location.

In this embodiment, step A02 is followed by step A03. In other embodiments, the order of step A02 and step A03 can be interchanged, and the effect of sensing the wafer cassette 200 being set at the positioning position can still be achieved.

Step A further includes step A04, which involves rotating the wafers 203 in the wafer cassette 200 to move the coding area 203a of each wafer 203 to the opening of the wafer cassette 200. In this embodiment, the wafers 203 in the wafer cassette 200 can be rotated by a first rotating device 70 located below the wafer cassette, so that the coding area 203a of each wafer 203 moves to the opening of the wafer cassette 200. In this embodiment, in order to accommodate the rotating edges of wafers 203 of various sizes, a second rotating device 80 can be provided. The second rotating device 80 is located near the first rotating device 70. Step A04 further includes moving the wafer cassette 200 a second predetermined distance on the reference axis L1, so that the wafer cassette 200 moves to the location of the second rotating device 80, so as to rotate the wafers 203 in the wafer cassette 200, so that the coding area 203a of each wafer 203 moves to the opening of the wafer cassette 200.

Step B involves displacing one of the wafers 203 in the wafer cassette 200 away from the bottom opening 202, so that the coding area 203a of the wafer 203 is exposed outside the wafer cassette 200. In this embodiment, the wafer 203 in the wafer cassette 200 is pushed by the pusher 50 to move the wafer 203 away from the bottom opening 202. In other embodiments, it is possible to move the wafer 203 away from the bottom opening 202 by means of clamping or other methods.

Step C: The light source 61 emits light and illuminates the coding area 203a. Step C further includes moving the position of the light source 61 so that the light source 61 can illuminate the coding area 203a along the reference axis L1. In this embodiment, the example is to move the position of the light source 61 so that the light source 61 can illuminate the coding area 203a along the reference axis L1. In other embodiments, the position of the wafer cell 200 can also be moved so that the light source 61 can illuminate the coding area 203a along the reference axis L1.

Step D: The image capture unit 62 captures the image of the encoding area 203a. Step D further includes moving the setting position of the image capture unit 62 so that the image capture unit 62 captures the image of the encoding area 203a. In this embodiment, the example is to move the setting position of the image capture unit 62 so that the image capture unit 62 captures the image of the encoding area 203a. In other embodiments, the image capture unit 62 can capture the image of the encoding area 203a by moving the position of the wafer cell 200.

Step E: Displace the wafer 203 toward the bottom opening 202 so that the wafer 203 is accommodated in one of the accommodating slots 201; thereby, the wafer 203, which has been pushed and read, can return to the accommodating slot 201 of the wafer cassette 200.

Step F: Move the wafer cassette 200 a first predetermined distance on the reference axis L1. By moving the wafer cassette 200 a first predetermined distance on the reference axis L1, another wafer 203 adjacent to the wafer 203 that has been read can be moved to a position to be pushed by the pusher device 50. In this way, the light source 61 and the image capturing unit 62 do not need to move. As long as the pusher device 50 pushes the other wafer 203 in the wafer cassette 200, the reading operation can be performed again.

Step G: Execute steps B, C, D, E, and F multiple times in sequence; through step G, the codes of all wafers 203 in the wafer cassette 200 can be automatically read.

In summary, the wafer reading device 100 of this invention achieves automated wafer reading by capturing an image of the coding area 203a through the image capture unit 62; and by emitting light along the reference axis L1 through the light source 61 and illuminating the coding area 203a, the halos in the coding area 203a are reduced, which facilitates the identification of the code in the coding area 203a, thereby improving the accuracy of wafer reading. By means of the wafer reading method of the present invention, all wafers 203 of the wafer cassette 200 can capture the image of the encoding area 203a through the image capture unit 62, thereby achieving the effect of automated reading. In addition, with the setting of the light source 61 emitting light along the reference axis L1 and illuminating the encoding area 203a, the accuracy of wafer reading of all wafers 203 of the wafer cassette 200 can be improved.

The above description is merely a preferred embodiment of the present invention. Any equivalent changes made in accordance with the present invention and the scope of the patent application should be included within the scope of the present invention.

100: Wafer Reading Equipment 10: Platform 11: Second Opening 12: Third Opening 20: Slide Rail 30: Support Stage 31: First Opening 32: Support Surface 33: Slide Assembly 331: Slide Rail 34: Through Hole 341: First End Opening 342: Second End Opening 40: Baffle Plate 41: Plate Surface 42: First Alignment Component 50: Pushing Device 51: Longitudinal Slide Rail 52: Pushing Component 521: Pushing End 521a: Notch 60: Reading Device 61: Light Source 62: Image Capture Unit 63: Support 70: First Screwing Device 80: Second Rotation Device 200: Wafer Cage 201: Storage Slot 202: Bottom Opening 203: Wafer 203a: Encoding Area 204: Second Alignment Component F: Rack F1: Top Cover F2: Side Cover F3: Opening L1: Reference Axis L2: Major Axis P1: Starting Position P2: Pushing Position R: Horizontal Reference Surface S1: First Sensing Device S11: First Transmitting Unit S12: First Receiving Unit S2: Second Sensing Device S21: Second Transmitting Unit S22: Second Receiving Unit θ1: Inclination Angle θ2: Angle A,A01,A02,A03,A04,B,C,D,E,F,G: Steps

Figure 1 is a perspective view of a wafer reading device according to a preferred embodiment of the present invention. Figure 2 is a perspective view of area A1 in Figure 1. Figure 3 is a schematic diagram of some components of the wafer reading device according to the preferred embodiment described above. Figure 4 is a top view of some components of the wafer reading device according to the preferred embodiment described above, showing the wafer cassette placed on the carrier stage. Figure 5 is a schematic diagram of the wafer reading device according to the preferred embodiment described above. Figure 6 is a schematic diagram of some components of the wafer reading device according to the preferred embodiment described above. Figure 7 is a cross-sectional view along the B-B direction in Figure 4. Figure 8 is a schematic diagram of some components of the wafer reading device according to the preferred embodiment described above, showing the pusher in its initial position. Figure 9 is a perspective view of the pusher component in the wafer reading device of the preferred embodiment described above. Figure 10 is a side view of Figure 9. Figure 11 is a schematic diagram of area A2 in Figure 10. Figure 12 is a schematic diagram of the pusher component pushing the wafer in the wafer reading device of the preferred embodiment described above. Figure 13 is a schematic diagram of some components of the wafer reading device of the preferred embodiment described above, showing the pusher component in the pushing position. Figure 14 is a schematic diagram of the wafer reading device of the preferred embodiment described above. Figure 15 is a flowchart of a wafer reading method of a preferred embodiment of the present invention.

100: Wafer Code Reading Equipment

10: Platform

20: Sliding rail

30: Supporting Platform

40: Baffle

60: Reading device

F: Rack

F1: Lid

F2: Side Cover

F3: Opening section

R: Horizontal reference plane

S2: Second sensing device

Claims (20)

A wafer reading device for reading the code of a wafer in a wafer cassette, the wafer cassette having a plurality of interconnected receiving slots and a bottom opening, defining a reference axis, the receiving slots for arranging a plurality of wafers along the reference axis in the wafer cassette, each wafer having a coding area on one surface, the wafer reading device comprising: a carrier stage having a first opening penetrating a first opening of the carrier stage and a carrier surface, wherein when the wafer cassette is disposed on the carrier surface, the first opening communicates with the bottom opening of the wafer cassette; A pushing device is disposed below the support platform. The pushing device is movable between a starting position and a pushing position. When the pushing device is in the starting position, it does not protrude through the first opening. When the pushing device is in the pushing position, it protrudes through the first opening. The pushing device can move from the starting position through the first opening and the bottom opening to the pushing position to push one of the wafers in the wafer cassette, causing the coding area of the wafer to shift away from the bottom opening; and A reading device is disposed above the platform. The reading device includes a light source and an image capturing unit, wherein the light source emits light along the reference axis and illuminates the encoding area; the image capturing unit captures an image of the encoding area. The wafer reading device as described in claim 1 includes a platform, two slide rails, and a baffle. The platform has a second opening. The two slide rails are disposed on the top surface of the platform and are respectively located on opposite sides of the second opening. A support stage is coupled to the two slide rails and can move along the reference axis relative to the pushing device and the reading device. The first opening and the second opening are connected. When the wafer cassette is disposed on the support surface, the bottom opening, the first opening, and the second opening of the wafer cassette are connected, and the pushing device can move from the bottom opening to the second opening. The starting position passes through the second opening, the first opening, and the bottom opening to move to the pushing position to push the wafers; one side of the baffle is disposed on the bearing surface, and the opposite side extends in a direction perpendicular to the bearing surface; the baffle has a plate surface and at least one first alignment member, the plate surface being used to abut against one side of the wafer cassette; one side of the wafer cassette has at least one second alignment member corresponding to the at least one first alignment member, the at least one first alignment member having an outer contour that cooperates with the at least one second alignment member. The wafer reading device as described in claim 1, wherein a horizontal reference plane is defined, and the bearing surface is inclined at an angle relative to the horizontal reference plane, the angle being between 1 and 5 degrees. The wafer reading device as described in claim 1, wherein the carrier stage has at least one set of slides disposed on the carrier surface, the at least one set of slides including two slides extending along the reference axis, the two slides being correspondingly disposed on opposite sides of the first opening of the carrier stage, and the wafer cassette being coupled to the carrier stage in a manner slidable on the two slides; the wafer reading device includes a first sensing device, the carrier stage having at least one through hole, the at least one through hole penetrating the carrier stage and communicating with the at least one set of slides, the at least one through hole having a first end opening and a second end opening disposed opposite to each other, the first end opening and the second end opening being disposed on two corresponding side edges of the carrier stage, and the first sensing device being disposed at the first end opening and the second end opening. The wafer reading device as described in claim 4, wherein the number of the at least one slide group is multiple, and the minimum spacing between two slides in each slide group is different from each other. The wafer reading device as described in claim 4 includes at least one second sensing device disposed above the carrier stage for sensing whether the wafer cassette is correspondingly disposed in the at least one slide assembly. As described in claim 1, the wafer reading device includes a longitudinal slide rail and a pusher, the longitudinal slide rail being disposed below the support stage; the pusher is coupled to the longitudinal slide rail in a sliding manner, the pusher not protruding from the first opening when the pusher is in the initial position, and protruding from the first opening when the pusher is in the push position; the pusher has two push ends, the two push ends respectively contacting the outer edge of each wafer in a point contact manner, each push end having a notch formed by two inclined surfaces having an angle between 30 and 80 degrees. The wafer reading device as described in claim 1 includes a platform and a first rotating device, wherein the platform has a second opening, the first opening is connected to the second opening, and the first rotating device is located below the second opening of the platform and is used to rotate the wafers in the wafer cassette. The wafer reading device as described in claim 1 includes a platform, two slide rails, and a second rotating device. The platform has a second opening and a third opening. The two slide rails are disposed on the top surface of the platform. The third opening and the second opening are arranged at intervals on the reference axis, and the two slide rails are respectively located on opposite sides of the second opening and the third opening. The second rotating device is located below the third opening. The carrier stage is coupled to the two slide rails and can move along the two slide rails to the connection point between the first opening and the third opening. The second rotating device is used to rotate the wafers in the wafer cassette. The wafer reading device as described in claim 1 includes a platform, wherein the reading device includes a bracket, one end of which is disposed on the platform and the other end extends along a long axis toward a direction away from the top surface of the platform, and the image capturing unit and the light source are disposed on the bracket in a manner that allows them to move along the long axis and the reference axis. A wafer coding method includes the following steps: A. Providing a wafer cassette having a plurality of interconnected receiving slots and a bottom opening, the receiving slots correspondingly accommodating a plurality of wafers arranged along a reference axis in the wafer cassette, each wafer having a coding area on one surface; providing a light source and an image capturing unit; B. Displacing one wafer in the wafer cassette away from the bottom opening, exposing the coding area of the wafer to the outside of the wafer cassette; C. The light source emitting light along the reference axis and illuminating the coding area; D. The image capturing unit capturing an image of the coding area. The wafer reading method as described in claim 11 includes a step E, displacing the wafer toward the direction of the bottom opening so that the wafer is received in one of the receiving slots. The wafer reading method as described in claim 12 includes a step F, moving the wafer cassette a first predetermined distance along the reference axis. The wafer reading method as described in claim 13 includes step G, which is performed sequentially multiple times, including steps B, C, D, E and F. The wafer reading method as described in claim 11, wherein a horizontal reference plane is defined, and step A includes tilting the wafer cassette relative to the horizontal reference plane at an angle such that the wafers contained in the receiving slots are tilted against one side of each receiving slot. The wafer reading method as described in claim 11, wherein step A includes rotating the wafers in the wafer cassette to move the coding area of each wafer to the opening of the wafer cassette. The wafer coding method as described in claim 11, wherein step A includes moving the wafer cassette a second predetermined distance on the reference axis, and then rotating the wafers in the wafer cassette to move the coding area of each wafer to the opening of the wafer cassette. The wafer reading method as described in claim 11 includes step C, which involves moving the position of the light source so that the light source can illuminate the coding area along the reference axis; and step D, which involves moving the position of the image capturing unit so that the image capturing unit captures an image of the coding area. The wafer reading method as described in claim 11, wherein step A includes setting the wafer cassette at a positioning position and providing a first sensing device that senses whether the bottom of the wafer cassette is located at the positioning position. The wafer reading method as described in claim 11, wherein step A includes setting the wafer cassette at a positioning position and providing at least one second sensing device that senses whether the top of the wafer cassette is located at the positioning position.