TWI907948B - Hydrogenated block copolymers, hydrogenated block copolymer compositions, and molded articles - Google Patents
Hydrogenated block copolymers, hydrogenated block copolymer compositions, and molded articlesInfo
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Abstract
本發明獲得一種發揮出優異之低反彈性及耐磨耗性之氫化嵌段共聚物。 本發明之氫化嵌段共聚物(甲)滿足條件(1)~(3)。 <條件(1)>: 含有至少1個包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),且氫化共聚物嵌段(b)之含量為65~95質量%。 <條件(2)>: 氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40~75質量%。 <條件(3)>: 利用熱分解氣相層析質譜分析裝置檢測出之波峰強度P、與 根據(式I)求出之P0之比率g=P/P0為0.75以上。 P0=k×RS (式I) ((式I)中,RS為相對於氫化嵌段共聚物(甲)整體之嵌段(b)中之乙烯基芳香族單體單元之含量(質量%)。 k表示將RS(質量%)與波峰強度P進行一次近似時之比例常數) This invention provides a hydrogenated block copolymer exhibiting excellent low elasticity and wear resistance. The hydrogenated block copolymer (A) of this invention satisfies conditions (1) to (3). <Condition (1)>: It contains at least one hydrogenated copolymer block (b) comprising a vinyl aromatic monomer unit and a conjugated diene monomer unit, and the content of the hydrogenated copolymer block (b) is 65-95% by mass. <Condition (2)>: The content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 40-75% by mass. <Condition (3)>: The ratio g = P/P0 of the peak intensity P detected by thermal decomposition gas chromatography-mass spectrometry and calculated according to (Equation I) is 0.75 or higher. P0 = k × RS (Equation I) (In (Equation I), RS is the content (mass %) of vinyl aromatic monomer units in block (b) relative to the entire hydrogenated block copolymer (A). k represents the proportionality constant when approximating RS (mass %) with the peak intensity P.)
Description
本發明係關於一種氫化嵌段共聚物、氫化嵌段共聚物組合物、及成形體。This invention relates to a hydrogenated block copolymer, a hydrogenated block copolymer composition, and a molded article.
包含共軛二烯化合物與乙烯基芳香族化合物之嵌段共聚物之氫化物即便未進行硫化,於常溫下亦具有與硫化後之天然橡膠或合成橡膠同樣之彈性,並且於高溫下具有與熱塑性樹脂同樣之加工性,故被廣泛地用於塑膠之改質劑、黏著接著劑、汽車零件、及醫療器具等領域中。進而上述嵌段共聚物之氫化物由於耐候性、耐熱性優異,故尤其被廣泛地實際用作汽車零件或醫療器具等之材料。Hydrogenates of block copolymers containing conjugated diene compounds and vinyl aromatic compounds possess the same elasticity at room temperature as vulcanized natural or synthetic rubber, even without vulcanization, and exhibit the same processability as thermoplastic resins at high temperatures. Therefore, they are widely used in plastic modifiers, adhesives, automotive parts, and medical devices. Furthermore, due to their excellent weather resistance and heat resistance, these block copolymer hydrogenates are particularly widely used in practical applications as materials for automotive parts and medical devices.
然而,包含共軛二烯化合物與乙烯基芳香族化合物之嵌段共聚物之氫化物,例如氫化苯乙烯系彈性體(以下,有時簡稱為「TPS材料」)之耐磨耗性較差,故有於其用途方面存在限制之問題。 針對上述問題,業界提出有一種乙烯基芳香族單體單元之含量為40質量%以上且未達95質量%之無規共聚物苯乙烯系彈性體與聚丙烯樹脂之樹脂組合物、及該樹脂組合物之成形體,且揭示該成形體之耐磨耗性優異(例如參照專利文獻1)。However, hydrogenated block copolymers containing conjugated diene compounds and vinyl aromatic compounds, such as hydrogenated styrene elastomers (hereinafter sometimes referred to as "TPS materials"), exhibit poor abrasion resistance, thus limiting their applications. To address this issue, the industry has proposed a resin composition of a random copolymer styrene elastomer and polypropylene resin, comprising 40% by mass or more but less than 95% by mass of vinyl aromatic monomers, and a molded article of the resin composition, revealing that the molded article exhibits excellent abrasion resistance (see, for example, Patent 1).
又,近年來,作為汽車之新穎之方向性,自動駕駛化或出行服務(mobility service)受到關注。因該潮流於汽車內飾材料所要求之性能方面亦會產生變化。例如,預測隨著自動駕駛化,汽車作為居住空間之意義會進一步增強。因此,為了不斷進行如搭乘者可生活得更舒適之空間構建,產生具有高級感之觸感,需要低反彈之材料等。 又,從出行服務之觀點出發,認為隨著共享汽車(car sharing)之滲透,業界不斷追求汽車之長壽命性與清潔性。因此,汽車內飾材料之清掃次數較先前增加,成為汽車內飾材料之材料之樹脂組合物需要更高之耐磨耗性。 如上所述,因自動駕駛化或出行服務之滲透,近年來,樹脂組合物之材料之聚合物需要優於先前產品之高耐磨耗性、良好之觸感。Furthermore, in recent years, autonomous driving and mobility services have garnered attention as innovative directions in the automotive industry. This trend will also change the performance requirements for automotive interior materials. For example, it is predicted that with the advancement of autonomous driving, the meaning of the car as a living space will be further enhanced. Therefore, in order to continuously construct spaces where passengers can live more comfortably and to create a high-end feel, materials with low rebound are needed. Moreover, from the perspective of mobility services, with the penetration of car sharing, the industry is constantly pursuing the longevity and cleanliness of vehicles. Therefore, the frequency of cleaning automotive interior materials has increased, requiring higher wear resistance in the resin compositions of automotive interior materials. As mentioned above, due to the penetration of autonomous driving or mobility services, in recent years, the polymers of resin composition materials have needed to have superior wear resistance and good tactile feel compared to previous products.
鑒於如上所述之要求,業界提出有一種於特定之溫度範圍內具有tanδ(損耗正切)之波峰之氫化嵌段共聚物,且顯示使用該氫化嵌段共聚物之樹脂組合物之能量吸收性優異,可表現出低反彈性(例如參照專利文獻2)。 [先前技術文獻] [專利文獻]In view of the requirements described above, the industry has proposed a hydrogenated block copolymer that exhibits a tanδ (loss tangent) peak within a specific temperature range, and resin compositions using this hydrogenated block copolymer show excellent energy absorption and low elasticity (see, for example, Patent 2). [Prior Art Documents] [Patent Documents]
[專利文獻1]國際公開第2003/035705號 [專利文獻2]國際公開第2010/018743號[Patent Document 1] International Publication No. 2003/035705 [Patent Document 2] International Publication No. 2010/018743
[發明所欲解決之問題] 然而,先前提出之氫化嵌段共聚物具有如下問題:關於良好之觸感即低反彈性、耐磨耗性,尚有改善之餘地。[Problem to be solved by the invention] However, the previously proposed hydrogenated block copolymers have the following problems: there is room for improvement in terms of good tactile feel, i.e., low elasticity and abrasion resistance.
因此,本發明之目的在於提供一種可發揮出優異之低反彈性、及耐磨耗性之氫化嵌段共聚物。 [解決問題之技術手段]Therefore, the purpose of this invention is to provide a hydrogenated block copolymer that exhibits excellent low elasticity and wear resistance. [Technical means to solve the problem]
本發明人等為了解決上述先前技術之課題而反覆進行努力研究,結果發現,可提供一種氫化嵌段共聚物,從而完成本發明,該氫化嵌段共聚物係具有特定之結構者,且藉由特定出氫化嵌段共聚物中之包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b)之含量、上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量、及規定之隨機性參數g,其低反彈性與耐磨耗性優異。 即,本發明如下所述。The inventors have made repeated efforts to solve the problems of the prior art, and have discovered that a hydrogenated block copolymer can be provided, thus completing the present invention. This hydrogenated block copolymer has a specific structure, and by specifying the content of the hydrogenated copolymer block (b) containing vinyl aromatic monomers and conjugated diene monomers, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b), and a prescribed random parameter g, it exhibits excellent low elasticity and wear resistance. That is, the present invention is as follows.
[1] 一種氫化嵌段共聚物(甲),其包含乙烯基芳香族單體單元與共軛二烯單體單元,且 含有至少1個將乙烯基芳香族單體單元作為主體之聚合物嵌段(a),並且 滿足下述<條件(1)>~<條件(3)>。 <條件(1)>: 含有至少1個包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),且上述氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下。 <條件(2)>: 上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下。 <條件(3)>: 利用熱分解氣相層析質譜分析裝置檢測出之波峰強度P、與 根據下述(式I)求出之P0之比率g=P/P0為0.75以上。 P0=k×RS (式I) ((式I)中,RS為相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%)。 k表示將相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%)、與波峰強度P進行一次近似時之比例常數,該波峰強度P係利用熱分解氣相層析質譜分析裝置對均相聚合(homogeneous polymerization)之氫化嵌段共聚物(甲)進行分析時獲得) [2] 如上述[1]中所記載之氫化嵌段共聚物,其中上述波峰強度P、與 利用上述(式I)求出之P0之比率g=P/P0為0.9以上。 [3] 如上述[1]或[2]中所記載之氫化嵌段共聚物,其中上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為55質量%以上且65質量%以下。 [4] 如上述[1]至[3]中任一項所記載之氫化嵌段共聚物,其中氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為75質量%以上且85質量%以下。 [5] 一種氫化嵌段共聚物組合物,其含有:如上述[1]至[4]中任一項所記載之氫化嵌段共聚物(甲):1質量%以上且50質量%以下、 至少一種烯烴系樹脂(乙):5質量%以上且90質量%以下、 至少一種熱塑性樹脂(丙):1質量%以上且50質量%以下、及 至少一種軟化劑(丁):5質量%以上且90質量%以下。 [6] 如上述[5]中所記載之氫化嵌段共聚物組合物,其中上述烯烴系樹脂(乙)包含至少一種聚丙烯系樹脂。 [7] 一種成形體,其為如上述[5]中所記載之氫化嵌段共聚物組合物之成形體。 [8] 如上述[5]中所記載之成形體,其為發泡體。 [發明之效果][1] A hydrogenated block copolymer (A) comprising a vinyl aromatic monomer unit and a conjugated diene monomer unit, and comprising at least one polymer block (a) in which the vinyl aromatic monomer unit is the main component, and satisfying the following <condition (1)> to <condition (3)>. <condition (1)>: Contains at least one hydrogenated copolymer block (b) comprising a vinyl aromatic monomer unit and a conjugated diene monomer unit, and the content of the hydrogenated copolymer block (b) in the above-mentioned hydrogenated block copolymer (A) is 65% by mass or more and 95% by mass or less. <condition (2)>: The content of the vinyl aromatic monomer unit in the above-mentioned hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less. <Condition (3)>: The ratio g = P/P0 of the peak intensity P detected by the thermal decomposition gas chromatography mass spectrometry analysis device and the P0 calculated according to the following (Equation I) is 0.75 or higher. P0 = k × RS (Equation I) (In Equation I, RS is the content (mass %) of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the whole hydrogenated block copolymer (A). k represents the proportionality constant when the content RS (mass %) of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the whole hydrogenated block copolymer (A) is approximated with the peak intensity P, which is obtained by analyzing the homogeneous polymerization hydrogenated block copolymer (A) using a thermal decomposition gas chromatography mass spectrometry analysis device) [2] As described in [1] above, the ratio g = P/P0 of the above peak intensity P and P0 obtained by using the above (Equation I) is 0.9 or more. [3] The hydrogenated block copolymer as described in [1] or [2] above, wherein the content of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) is 55% by mass or more and 65% by mass or less. [4] The hydrogenated block copolymer as described in any of [1] to [3] above, wherein the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (a) is 75% by mass or more and 85% by mass or less. [5] A hydrogenated block copolymer composition comprising: a hydrogenated block copolymer (A) as described in any one of [1] to [4] above: 1% by mass and 50% by mass, at least one olefinic resin (B): 5% by mass and 90% by mass, at least one thermoplastic resin (C): 1% by mass and 50% by mass, and at least one softener (D): 5% by mass and 90% by mass. [6] A hydrogenated block copolymer composition as described in [5] above, wherein the olefinic resin (B) comprises at least one polypropylene resin. [7] A molded body, which is a molded body of the hydrogenated block copolymer composition as described in [5] above. [8] The molded body described in [5] above is a foamed body. [Effects of the Invention]
根據本發明,可獲得發揮出優異之低反彈性及耐磨耗性之氫化嵌段共聚物。According to the present invention, hydrogenated block copolymers exhibiting excellent low elasticity and wear resistance can be obtained.
以下,對用以實施本發明之形態(以下,稱為「本實施方式」)詳細地進行說明。再者,以下之本實施方式為用以說明本發明之例示,並非將本發明限定為以下內容之宗旨,本發明可於其主旨之範圍內進行各種變化而實施。The following describes in detail the forms used to implement the present invention (hereinafter referred to as "the embodiments"). Furthermore, the embodiments described below are examples used to illustrate the present invention and are not intended to limit the present invention to the following objectives. The present invention can be implemented with various variations within the scope of its objectives.
[氫化嵌段共聚物] 本實施方式之氫化嵌段共聚物(以下,有時記載為氫化嵌段共聚物(甲))係包含乙烯基芳香族單體單元與共軛二烯單體單元,且含有至少1個將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)之嵌段共聚物之氫化物,並且滿足下述<條件(1)>~<條件(3)>。[Hydrogenated Block Copolymer] The hydrogenated block copolymer of this embodiment (hereinafter, sometimes referred to as hydrogenated block copolymer (A)) is a hydrogenated block copolymer containing a vinyl aromatic monomer unit and a conjugated diene monomer unit, and containing at least one polymer block (a) with a vinyl aromatic monomer unit as the main component, and satisfies the following <condition (1)> to <condition (3)>.
<條件(1)>: 含有至少1個包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),且本實施方式之氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下。 <條件(2)>: 上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下。 <條件(3)>: 利用熱分解氣相層析質譜分析裝置檢測出之波峰強度P、與根據下述(式I)求出之P0之比率g=P/P0為0.75以上。 P0=k×RS … (式I) (RS為相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%)。 k表示將相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS、與波峰強度P進行一次近似時之比例常數,該波峰強度P係利用熱分解氣相層析質譜分析裝置對藉由下述特定之聚合方法(均相聚合法)聚合而成之氫化嵌段共聚物(甲)進行分析時獲得)<Condition (1)>: Contains at least one hydrogenated copolymer block (b) comprising a vinyl aromatic monomer unit and a conjugated diene monomer unit, and the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) of this embodiment is 65% by mass or more and 95% by mass or less. <Condition (2)>: The content of the vinyl aromatic monomer unit in the above-mentioned hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less. <Condition (3)>: The ratio g = P/P0 of the peak intensity P detected by a thermal decomposition gas chromatography-mass spectrometry analysis apparatus and P0 calculated according to the following (Equation I) is 0.75 or more. P0 = k × RS … (Equation I) (RS is the content (mass %) of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the whole hydrogenated block copolymer (A). k represents the proportionality constant when approximating the content RS of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the whole hydrogenated block copolymer (A) with the peak intensity P, which is obtained by analyzing the hydrogenated block copolymer (A) polymerized by the following specific polymerization method (homogeneous polymerization) using a thermal decomposition gas chromatography-mass spectrometry analysis device.)
藉由具有上述構成,可獲得發揮出優異之低反彈性及耐磨耗性之氫化嵌段共聚物。 再者,於本說明書中,將組入至聚合物中前之狀態記載為「化合物」,將組入至聚合物中後之狀態記載為「單體單元」。By having the above-mentioned structure, a hydrogenated block copolymer exhibiting excellent low elasticity and wear resistance can be obtained. Furthermore, in this specification, the state before being incorporated into the polymer is referred to as "compound", and the state after being incorporated into the polymer is referred to as "monomer".
(乙烯基芳香族單體單元) 本實施方式之氫化嵌段共聚物(甲)包含乙烯基芳香族單體單元。 作為形成乙烯基芳香族單體單元之乙烯基芳香族化合物,例如可例舉源自苯乙烯、α-甲基苯乙烯、對甲基苯乙烯、二乙烯苯、1,1-二苯基乙烯、N,N-二甲基-對胺基乙基苯乙烯、N,N-二乙基-對胺基乙基苯乙烯等之單體單元,但並不限定於以上。 尤其是從成本與包含氫化嵌段共聚物之樹脂組合物之機械強度的平衡之觀點出發,較佳為苯乙烯。 該等可僅單獨使用一種,亦可併用兩種以上。(Vinyl Aromatic Monomer Unit) The hydrogenated block copolymer (A) of this embodiment comprises vinyl aromatic monomer units. Examples of vinyl aromatic compounds forming the vinyl aromatic monomer units include, but are not limited to, monomer units derived from styrene, α-methylstyrene, p-methylstyrene, divinylbenzene, 1,1-diphenylethylene, N,N-dimethyl-p-aminoethylstyrene, and N,N-diethyl-p-aminoethylstyrene. Styrene is particularly preferred from the viewpoint of balancing cost and the mechanical strength of the resin composition comprising the hydrogenated block copolymer. Only one of these monomer units may be used, or two or more may be used in combination.
(共軛二烯單體單元) 本實施方式之氫化嵌段共聚物(甲)包含共軛二烯單體單元。 共軛二烯單體單元係源自具有1對共軛雙鍵之二烯烴之單體單元。 作為此種二烯烴,例如可例舉:1,3-丁二烯、2-甲基-1,3-丁二烯(異戊二烯)、2,3-二甲基-1,3-丁二烯、1,3-戊二烯、2-甲基-1,3-戊二烯、1,3-己二烯等,但並不限定於以上。 尤其是從良好之成形加工性與機械強度之平衡之觀點出發,較佳為1,3-丁二烯、異戊二烯。 該等可僅單獨使用一種,亦可併用兩種以上。(Conjugated Diene Monomer Unit) The hydrogenated block copolymer (A) of this embodiment comprises a conjugated diene monomer unit. The conjugated diene monomer unit is derived from a diene hydrocarbon having one pair of conjugated double bonds. Examples of such dienes include, but are not limited to, 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, and 1,3-hexadiene. Especially from the viewpoint of a good balance between processability and mechanical strength, 1,3-butadiene and isoprene are preferred. One or more of these monomers may be used alone.
(全部共軛二烯單體單元中之乙烯基鍵量) 本實施方式之氫化嵌段共聚物(甲)對全部共軛二烯單體單元中之乙烯基鍵量並無特別限定,較佳為5質量%以上。更佳為15質量%以上,進而較佳為20質量%以上。 若氫化嵌段共聚物(甲)之全部共軛二烯單體單元中之乙烯基鍵量為5質量%以上,則於氫化步驟中,可抑制由經氫化之共軛二烯嵌段之結晶化所引起之自溶液中的析出。又,若乙烯基鍵量為5質量%以上,則經氫化之共軛二烯嵌段之結晶化得以抑制,於本實施方式之氫化嵌段共聚物、其組合物、及成形體中可獲得良好之柔軟性。 又,本實施方式之氫化嵌段共聚物(甲)之全部共軛二烯單體單元中之乙烯基鍵量較佳為60質量%以下,更佳為50質量%以下。若氫化嵌段共聚物(甲)之全部共軛二烯單體單元中之乙烯基鍵量為60質量%以下,則於本實施方式之氫化嵌段共聚物、其組合物、及成形體中可獲得良好之拉伸強度。 氫化嵌段共聚物(甲)之全部共軛二烯單體單元中之乙烯基鍵量例如可藉由使用下述三級胺化合物或醚化合物等調整劑(乙烯基鍵量調整劑),控制在上述數值範圍內。 又,上述乙烯基鍵量可藉由下述實施例中所記載之方法進行測定。(Amount of vinyl bonds in all conjugated diene monomer units) The hydrogenated block copolymer (A) of this embodiment does not have a particular limitation on the amount of vinyl bonds in all conjugated diene monomer units, but it is preferably 5% by mass or more. More preferably 15% by mass or more, and even more preferably 20% by mass or more. If the amount of vinyl bonds in all conjugated diene monomer units of the hydrogenated block copolymer (A) is 5% by mass or more, then during the hydrogenation step, precipitation from solution caused by crystallization of the hydrogenated conjugated diene blocks can be suppressed. Furthermore, if the vinyl bond content is 5% by mass or more, the crystallization of the hydrogenated conjugated diene blocks is suppressed, and good flexibility can be obtained in the hydrogenated block copolymer, its composition, and the molded article of this embodiment. Also, the vinyl bond content in all conjugated diene monomer units of the hydrogenated block copolymer (A) of this embodiment is preferably 60% by mass or less, and more preferably 50% by mass or less. If the vinyl bond content in all conjugated diene monomer units of the hydrogenated block copolymer (A) is 60% by mass or less, good tensile strength can be obtained in the hydrogenated block copolymer, its composition, and the molded article of this embodiment. The amount of vinyl bonds in all conjugated diene monomer units of the hydrogenated block copolymer (A) can be controlled within the above-mentioned value range, for example, by using modifiers such as tertiary amine compounds or ether compounds (vinyl bond content modifiers). Furthermore, the amount of vinyl bonds can be measured by the method described in the following embodiments.
(全部乙烯基芳香族單體單元之含量) 本實施方式之氫化嵌段共聚物(甲)之全部乙烯基芳香族單體單元之含量較佳為50質量%以上且80質量%以下,更佳為55質量%以上且80質量%以下,進而較佳為60質量%以上且80質量%以下。 若全部乙烯基芳香族單體單元之含量為50質量%以上,則本實施方式之氫化嵌段共聚物(甲)有耐油性變得良好之傾向。若耐油性良好,則於汽車材料等中,可用於要求更嚴格之耐油性之用途。 作為要求更嚴格之耐油性之用途,例如於汽車內飾材料等中,於更薄壁之成形體成形時、或更複雜/大型之成形體成形時,亦於更長時間使用之情形時,藉由使用本實施方式之氫化嵌段共聚物(甲),有可抑制材料之變形或外觀不良等之傾向。 再者,於本說明書中,「通常之成形體」係定義為厚度為2 mm左右且平板狀之簡易之150 mm見方左右的小型成形體。經確認,與此種「通常之成形體」相比,薄壁之成形體、或複雜且大型之成形體有耐油性、耐磨耗性、耐損傷性、外觀、低溫特性、觸感、形狀維持等各種特性降低之傾向。 又,若耐油性良好,則有於下述本實施方式之氫化嵌段共聚物組合物中氫化嵌段共聚物(甲)調配量上限增加,調配自由度提高之傾向。 通常,有於下述本實施方式之氫化嵌段共聚物組合物中之氫化嵌段共聚物(甲)調配量越少,則耐油性變得越良好之傾向,但有氫化嵌段共聚物(甲)調配量越多,則耐磨耗性或觸感越優化之傾向,故調配量之上限較佳為較高。 再者,本實施方式之氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元之含量可將氫化前之嵌段共聚物、或氫化後之氫化嵌段共聚物作為檢體,並使用紫外線分光光度計來測定。 又,氫化嵌段共聚物(甲)之全部乙烯基芳香族單體單元之含量可藉由主要調整添加至聚合反應器中的乙烯基芳香族化合物之量、反應溫度、反應時間,控制在上述數值範圍內。(Content of all vinyl aromatic monomers) The content of all vinyl aromatic monomers in the hydrogenated block copolymer (A) of this embodiment is preferably 50% by mass or more and 80% by mass or less, more preferably 55% by mass or more and 80% by mass or less, and even more preferably 60% by mass or more and 80% by mass or less. If the content of all vinyl aromatic monomers is 50% by mass or more, the hydrogenated block copolymer (A) of this embodiment tends to have good oil resistance. If the oil resistance is good, it can be used in automotive materials and other applications requiring more stringent oil resistance. For applications requiring stricter oil resistance, such as automotive interior materials, when molding thinner-walled or more complex/larger molded bodies, and for longer-term use, the hydrogenated block copolymer (A) of this embodiment tends to suppress material deformation or appearance defects. Furthermore, in this specification, "typical molded body" is defined as a simple, small molded body of approximately 150 mm square, with a thickness of about 2 mm and a flat surface. It has been confirmed that, compared to this "typical molded body," thin-walled or complex and large molded bodies tend to exhibit reduced properties in oil resistance, abrasion resistance, damage resistance, appearance, low-temperature characteristics, tactile feel, and shape retention. Furthermore, if the oil resistance is good, there is a tendency to increase the upper limit of the amount of hydrogenated block copolymer (A) in the hydrogenated block copolymer composition of the present embodiment, thereby increasing the degree of freedom in formulation. Generally, the less hydrogenated block copolymer (A) in the hydrogenated block copolymer composition of the present embodiment, the better the oil resistance becomes. However, there is a tendency for the more hydrogenated block copolymer (A) in the composition, the better the abrasion resistance or tactile feel. Therefore, a higher upper limit for the amount in the composition is preferable. Moreover, the content of all vinyl aromatic monomer units in the hydrogenated block copolymer (A) of the present embodiment can be determined using the unhydrogenated block copolymer or the hydrogenated block copolymer after hydrogenation as samples and with a UV spectrophotometer. Furthermore, the content of all vinyl aromatic monomer units in the hydrogenated block copolymer (A) can be controlled within the above-mentioned value range by mainly adjusting the amount of vinyl aromatic compounds added to the polymerization reactor, the reaction temperature, and the reaction time.
再者,於本說明書中,關於構成氫化嵌段共聚物(甲)之聚合物嵌段,「作為主體」意指規定之嵌段聚合物中之比率為85質量%以上,較佳為90質量%以上,更佳為95質量%以上。 再者,上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下(上述<條件(2)>),故上述聚合物嵌段(a)與氫化聚合物嵌段(b)可明確地區分開來。Furthermore, in this specification, the term "as the main component" for the polymer block constituting the hydrogenated block copolymer (a) means that the specified proportion of the block polymer is 85% by mass or more, preferably 90% by mass or more, and even more preferably 95% by mass or more. Furthermore, the content of vinyl aromatic monomer units in the aforementioned hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less (as described in <condition (2)>), thus the aforementioned polymer block (a) and the hydrogenated polymer block (b) can be clearly distinguished.
(將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)) 本實施方式之氫化嵌段共聚物(甲)含有至少1個將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)。因此有可防止顆粒黏連之傾向。 又,本實施方式之氫化嵌段共聚物(甲)之上述聚合物嵌段(a)之含量較佳為5質量%以上,更佳為10質量%以上,進而較佳為15質量%以上。 若將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)之含量為5質量%以上,則氫化嵌段共聚物(甲)之顆粒之耐黏連性變得良好,有於本實施方式之氫化嵌段共聚物、其組合物、及成形體中表現出良好之拉伸特性之傾向。(Polymer block (a) with vinyl aromatic monomers as the main component) The hydrogenated block copolymer (A) of this embodiment contains at least one polymer block (a) with vinyl aromatic monomers as the main component. Therefore, it tends to prevent particle adhesion. Furthermore, the content of the above-mentioned polymer block (a) in the hydrogenated block copolymer (A) of this embodiment is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 15% by mass or more. If the content of the polymer block (a) with vinyl aromatic monomers as the main component is 5% by mass or more, the particle adhesion resistance of the hydrogenated block copolymer (A) becomes good, and it tends to exhibit good tensile properties in the hydrogenated block copolymer, its composition, and the molded article of this embodiment.
於本實施方式之氫化嵌段共聚物(甲)之顆粒顯示出良好的耐黏連性之情形時,有輸送時於更長時間、更高之荷重、嚴苛之溫度環境(例如外部氣溫較高之地域、冷暖差劇烈之地域)等條件下亦不易產生黏連之傾向,可謀求容易進行複合物成形時之顆粒計量或摻合等。又,有能夠減少防黏著劑之調配量,可獲得避免裝置污垢,減少環境負荷,抑制意料之外之物性之降低,例如透明性、機械強度等之降低之效果之傾向。When the particles of the hydrogenated block copolymer (A) of this embodiment exhibit good anti-blocking properties, they tend to be less prone to sticking even under conditions such as longer transport times, higher loads, and harsher temperature environments (e.g., regions with high external temperatures or drastic temperature differences). This facilitates particle measurement or admixture during composite molding. Furthermore, it can reduce the amount of anti-stick agent required, thereby preventing equipment contamination, reducing environmental impact, and suppressing unexpected degradation of physical properties, such as decreased transparency and mechanical strength.
本實施方式之氫化嵌段共聚物(甲)中之上述聚合物嵌段(a)的含量可將氫化前之嵌段共聚物或氫化後之氫化嵌段共聚物作為檢體,藉由使用核磁共振裝置(NMR)之方法(Y. Tanaka, et al., RUBBER CHEMISTRY and TECHNOLOGY 54, 685 (1981)中所記載之方法。以下稱為「NMR法」)進行測定。具體而言,可藉由下述實施例中所記載之方法進行測定。 又,氫化嵌段共聚物(甲)中之聚合物嵌段(a)之含量可藉由主要調整添加至聚合反應器中的乙烯基芳香族化合物之量、反應溫度、反應時間,控制在上述數值範圍內。The content of the polymer block (a) in the hydrogenated block copolymer (A) of this embodiment can be determined by using nuclear magnetic resonance (NMR) as a sample, either the unhydrogenated block copolymer or the hydrogenated block copolymer (Y. Tanaka, et al., RUBBER CHEMISTRY and TECHNOLOGY 54, 685 (1981), hereinafter referred to as "NMR method"). Specifically, it can be determined by the method described in the following embodiments. Furthermore, the content of the polymer block (a) in the hydrogenated block copolymer (A) can be controlled within the above-mentioned value range by mainly adjusting the amount of vinyl aromatic compound added to the polymerization reactor, the reaction temperature, and the reaction time.
(氫化共聚物嵌段(b)) <條件(1)> 本實施方式之氫化嵌段共聚物(甲)含有至少1個包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),且氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下。(Hydrogenated copolymer block (b)) <Condition (1)> The hydrogenated block copolymer (A) of this embodiment contains at least one hydrogenated copolymer block (b) comprising a vinyl aromatic monomer unit and a conjugated diene monomer unit, and the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) is 65% by mass or more and 95% by mass or less.
本實施方式之氫化嵌段共聚物(甲)中之上述氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下,較佳為70質量%以上且90質量%以下,更佳為75質量%以上且85質量%以下。 若本實施方式之氫化嵌段共聚物(甲)中之上述氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下,則有本實施方式之氫化嵌段共聚物(甲)表現出良好之耐磨耗性之傾向。進而,若為70質量%以上且90質量%以下,則表現更出高之耐磨耗性,若為75質量%以上且85質量%以下,則可於如下情形時使用:於如耐磨耗性之要求進而嚴格之用途,例如於汽車內飾材料等中於更薄壁之成形體中需要優異之耐磨耗性之用途、或汽車內飾材料用途中,假定乘車時需要由更高之荷重或眼較粗之布料,例如細白布3號之類的眼粗於棉布料之布料即粗斜紋棉布布料等所產生之耐磨耗性的用途中,要求長時間維持外觀。 又,若耐磨耗性良好,則於使用本實施方式之氫化嵌段共聚物(甲)之氫化嵌段共聚物組合物中可降低氫化嵌段共聚物(甲)之調配量的下限值,有調配自由度提高之傾向。 通常,有下述氫化嵌段共聚物組合物中之氫化嵌段共聚物(甲)之調配量越多,耐磨耗性變得越良好之傾向,但由於有氫化嵌段共聚物(甲)之調配量越少,則耐油性或材料成本等變得越良好之傾向,故調配量之下限值較佳為較低。 若本實施方式之氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量為65質量%以上且95質量%以下,則表現出優異之低反彈性,故有表現出良好之觸感之傾向。進而,若為70質量%以上且90質量%以下,則低反彈性提高,可用於如觸感之要求更嚴格之用途中,若為75質量%以上且85質量%以下,則可適宜地用於如觸感之要求進而嚴格之用途,例如汽車內飾材料等中。The hydrogenated block copolymer (A) of this embodiment contains 65% by mass or more and 95% by mass or less, preferably 70% by mass or more and 90% by mass or less, and more preferably 75% by mass or more and 85% by mass or less. If the content of the hydrogenated block copolymer (A) of this embodiment contains 65% by mass or more and 95% by mass or less, the hydrogenated block copolymer (A) of this embodiment tends to exhibit good wear resistance. Furthermore, if the abrasion resistance is 70% or more and 90% or less, it exhibits even higher abrasion resistance. If the abrasion resistance is 75% or more and 85% or less, it can be used in the following situations: applications where abrasion resistance requirements are even more stringent, such as applications in automotive interior materials where excellent abrasion resistance is required in thinner molded bodies, or applications in automotive interior materials where abrasion resistance is required due to higher loads or coarser weave fabrics, such as fine white cloth No. 3, which has a coarser weave than cotton fabric, i.e., coarse twill cotton fabric, etc., and where maintaining appearance for a long time is required. Furthermore, if the wear resistance is good, the lower limit of the amount of hydrogenated block copolymer (A) in the hydrogenated block copolymer composition using this embodiment can be reduced, tending to increase the degree of freedom in formulation. Generally, the more hydrogenated block copolymer (A) is formulated in the following hydrogenated block copolymer composition, the better the wear resistance becomes. However, since the less hydrogenated block copolymer (A) is formulated, the better the oil resistance or material cost becomes, the lower limit of the formulation amount is preferred to be lower. If the content of hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) of this embodiment is 65% by mass or more and 95% by mass or less, it exhibits excellent low elasticity and thus tends to exhibit a good tactile feel. Furthermore, if it is 70% by mass or more and 90% by mass or less, the low elasticity is improved, making it suitable for applications with more stringent tactile requirements. If it is 75% by mass or more and 85% by mass or less, it can be appropriately used for applications with even more stringent tactile requirements, such as automotive interior materials.
<條件(2)> 本實施方式之氫化嵌段共聚物(甲)之上述氫化共聚物嵌段(b)(100質量%)中之乙烯基芳香族單體單元的含量為40質量%以上且75質量%以下。<Condition (2)> The content of vinyl aromatic monomer units in the hydrogenated block copolymer (a) of the present embodiment in the above-mentioned hydrogenated copolymer block (b) (100% by mass) is 40% by mass or more and 75% by mass or less.
氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下,較佳為45質量%以上且70質量%以下,更佳為55質量%以上且65質量%以下 若氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下,則有本實施方式之氫化嵌段共聚物(甲)表現出良好之耐磨耗性之傾向。進而,若為45質量%以上且70質量%以下,則表現出更高之耐磨耗性,若為55質量%以上且65質量%以下,則有可於如下情形時使用之傾向:於如耐磨耗性之要求進而更嚴格之用途,例如於汽車內飾材料等中,於更薄壁下之成形體中需要優異之耐磨耗性之用途、或汽車內飾材料用途中,假定乘車時需要更高之荷重或眼較粗之布料,例如眼粗於細白布3號之類的棉布料之布料即粗斜紋棉布布料等所產生之耐磨耗性的用途中,要求長時間維持外觀。 若氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量為40質量%以上且75質量%以下,則表現出優異之低反彈性,故有表現出良好之觸感之傾向。進而,若為45質量%以上且70質量%以下,則低反彈性提高,可於如觸感之要求更嚴格之用途中使用,若為55質量%以上且65質量%以下,則可於如觸感之要求進而嚴格之用途,例如汽車內飾材料等中使用。The content of vinyl aromatic monomer units in the hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less, preferably 45% by mass or more and 70% by mass or less, and more preferably 55% by mass or more and 65% by mass or less. If the content of vinyl aromatic monomer units in the hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less, the hydrogenated block copolymer (a) of this embodiment tends to exhibit good wear resistance. Furthermore, if the abrasion resistance is 45% or more and 70% or less, it exhibits even higher abrasion resistance. If the abrasion resistance is 55% or more and 65% or less, it tends to be used in the following situations: applications where the abrasion resistance requirements are even more stringent, such as in automotive interior materials, applications where excellent abrasion resistance is required in molded bodies with thinner walls, or in automotive interior materials applications where higher load-bearing capacity or coarser fabrics are required during vehicle use, such as coarser twill cotton fabrics with a coarser weave than fine white cotton No. 3, etc., where abrasion resistance is required to maintain appearance for a long time. If the content of vinyl aromatic monomer units in the hydrogenated copolymer block (b) is 40% by mass or more and 75% by mass or less, it exhibits excellent low elasticity and thus tends to provide a good tactile feel. Furthermore, if it is 45% by mass or more and 70% by mass or less, the low elasticity is improved, making it suitable for applications with more stringent tactile requirements. If it is 55% by mass or more and 65% by mass or less, it can be used in applications with even more stringent tactile requirements, such as automotive interior materials.
再者,氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量可藉由核磁共振裝置(NMR)等來進行測定。 又,氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量可藉由調整添加至聚合反應器中之乙烯基芳香族化合物、共軛二烯化合物之量或供給速度、反應溫度等,控制在上述數值範圍內。Furthermore, the content of vinyl aromatic monomer units in the hydrogenated copolymer block (b) can be determined using nuclear magnetic resonance (NMR) or similar methods. Also, the content of vinyl aromatic monomer units in the hydrogenated copolymer block (b) can be controlled within the aforementioned range by adjusting the amount, feeding rate, and reaction temperature of the vinyl aromatic compounds and conjugated diene compounds added to the polymerization reactor.
(氫化嵌段共聚物(甲)之重量平均分子量) 從本實施方式之氫化嵌段共聚物之顆粒製造時之擠出成形性、及獲得良好之機械強度之觀點出發,本實施方式之氫化嵌段共聚物(甲)之重量平均分子量(Mw)較佳為1萬以上且50萬以下,更佳為5萬以上且45萬以下,進而較佳為10萬以上且40萬以下。若重量平均分子量(Mw)為1萬以上,則有於使用本實施方式之氫化嵌段共聚物之氫化嵌段共聚物組合物中,表現出良好之機械強度之傾向 又,若重量平均分子量(Mw)為50萬以下,則於氫化嵌段共聚物之顆粒製造時(擠出成形時),有氫化嵌段共聚物(甲)容易熔融,線料較穩定,擠出成形性提高之傾向。 再者,本實施方式之氫化嵌段共聚物(甲)之重量平均分子量可利用凝膠滲透層析法(GPC)進行測定,並使用根據市售之標準聚苯乙烯之測定求出之校準曲線(使用標準聚苯乙烯之波峰分子量製作)而求出。(Weight average molecular weight of hydrogenated block copolymer (A)) From the viewpoint of extrusion molding properties and obtaining good mechanical strength during the particle manufacturing of the hydrogenated block copolymer of this embodiment, the weight average molecular weight (Mw) of the hydrogenated block copolymer (A) of this embodiment is preferably 10,000 or more and 500,000 or less, more preferably 50,000 or more and 450,000 or less, and even more preferably 100,000 or more and 400,000 or less. If the weight-average molecular weight (Mw) is above 10,000, the hydrogenated block copolymer composition using this embodiment tends to exhibit good mechanical strength. Furthermore, if the weight-average molecular weight (Mw) is below 500,000, during the particle manufacturing (extrusion molding) of the hydrogenated block copolymer, the hydrogenated block copolymer (A) tends to melt easily, the filament is more stable, and the extrusion molding properties are improved. Moreover, the weight-average molecular weight of the hydrogenated block copolymer (A) of this embodiment can be determined using gel permeation chromatography (GPC) and obtained using a calibration curve derived from the determination of commercially available standard polystyrene (using the peak molecular weight of standard polystyrene).
(氫化嵌段共聚物(甲)之分子量分佈(Mw/Mn)) 本實施方式之氫化嵌段共聚物(甲)分子量分佈(Mw/Mn)較佳為10以下,更佳為1~8,進而較佳為1.01~1.10。 氫化嵌段共聚物(甲)之重量平均分子量(Mw)與數量平均分子量(Mn)係利用凝膠滲透層析法(GPC)進行測定,使用根據市售之標準聚苯乙烯之測定求出之校準曲線(使用標準聚苯乙烯之波峰分子量製作)而求出層析圖之波峰的分子量。氫化嵌段共聚物(甲)之分子量分佈(Mw/Mn)係根據重量平均分子量(Mw)與數量平均分子量(Mn)之比率求出。(Molecular weight distribution (Mw/Mn) of the hydrogenated block copolymer (A) in this embodiment) The molecular weight distribution (Mw/Mn) of the hydrogenated block copolymer (A) is preferably 10 or less, more preferably 1 to 8, and even more preferably 1.01 to 1.10. The weight-average molecular weight (Mw) and number-average molecular weight (Mn) of the hydrogenated block copolymer (A) are determined using gel osmosis chromatography (GPC). The molecular weight of the peak in the chromatogram is determined using a calibration curve derived from the determination of commercially available standard polystyrene (using the peak molecular weight of standard polystyrene). The molecular weight distribution (Mw/Mn) of the hydrogenated block copolymer (A) is determined based on the ratio of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn).
(氫化嵌段共聚物(甲)中之共軛二烯單體單元之雙鍵之氫化率) 於使用本實施方式之氫化嵌段共聚物之氫化嵌段共聚物組合物中,從獲得良好之耐候性、低溫特性之觀點出發,本實施方式之氫化嵌段共聚物(甲)中之共軛二烯單體單元之雙鍵的氫化率較佳為25莫耳%以上,更佳為70莫耳%以上,進而較佳為85莫耳%以上,進而更佳為92莫耳%以上。 氫化嵌段共聚物(甲)中之共軛二烯單體單元之雙鍵之氫化率可藉由調整氫化量,控制在上述數值範圍內。氫化嵌段共聚物(甲)之氫化率可使用核磁共振裝置(NMR)等來測定。(Hydrolysis rate of double bonds in the conjugated diene monomer unit in the hydrogenated block copolymer (A)) In the hydrogenated block copolymer composition using the present embodiment, from the viewpoint of obtaining good weather resistance and low-temperature characteristics, the hydrogenation rate of double bonds in the conjugated diene monomer unit in the hydrogenated block copolymer (A) of the present embodiment is preferably 25 mol% or more, more preferably 70 mol% or more, further preferably 85 mol% or more, and further preferably 92 mol% or more. The hydrogenation rate of double bonds in the conjugated diene monomer unit in the hydrogenated block copolymer (A) can be controlled within the above-mentioned value range by adjusting the amount of hydrogenation. The hydrogenation rate of the hydrogenated block copolymer (A) can be determined using nuclear magnetic resonance (NMR) devices.
(氫化嵌段共聚物(甲)中之乙烯基芳香族單體單元之芳香族雙鍵之氫化率) 關於本實施方式之氫化嵌段共聚物(甲)中之乙烯基芳香族單體單元之芳香族雙鍵的氫化率,於下述本實施方式之氫化嵌段共聚物組合物中,從獲得良好之耐候性之觀點出發,較佳為50莫耳%以下,更佳為30莫耳%以下,進而較佳為10莫耳%以下。 氫化嵌段共聚物(甲)中之乙烯基芳香族單體單元之芳香族雙鍵之氫化率可使用核磁共振裝置(NMR)等來測定。(Hydrolysis rate of aromatic double bonds in the vinyl aromatic monomer units of the hydrogenated block copolymer (A)) Regarding the hydrolysis rate of aromatic double bonds in the vinyl aromatic monomer units of the hydrogenated block copolymer (A) of this embodiment, from the viewpoint of obtaining good weather resistance, it is preferably 50 mol% or less, more preferably 30 mol% or less, and even more preferably 10 mol% or less. The hydrolysis rate of aromatic double bonds in the vinyl aromatic monomer units of the hydrogenated block copolymer (A) can be determined using a nuclear magnetic resonance (NMR) apparatus or the like.
(氫化嵌段共聚物(甲)之結晶化波峰) 本實施方式之氫化嵌段共聚物(甲)較佳為於示差掃描熱量測定(DSC)圖中,於-25~80℃之範圍內,實質上不存在由氫化共聚物嵌段(b)引起之結晶化波峰之氫化物。 此處,「於-25~80℃之範圍內實質上不存在由氫化共聚物嵌段(b)引起之結晶化波峰」意指於該溫度範圍中,未出現由氫化共聚物嵌段(b)部分之結晶化引起之波峰,或者即便於確認到由結晶化引起之波峰之情形時,由該結晶化產生之結晶化波峰熱量亦未達3 J/g,較佳為未達2 J/g,更佳為未達1 J/g,進而較佳為無結晶化波峰熱量。 如上所述,若於-25~80℃之範圍內實質上不存在由氫化共聚物嵌段(b)引起之結晶化波峰,則於本實施方式之氫化嵌段共聚物(甲)中可獲得良好之柔軟性,從而可謀求下述氫化嵌段共聚物組合物之軟質化而較適宜。 為了獲得於-25~80℃之範圍內實質上不存在由氫化共聚物嵌段(b)引起之結晶化波峰氫化嵌段共聚物(甲),只要使共聚物進行氫化反應即可,該共聚物係藉由使用進行乙烯基鍵量之調整或乙烯基芳香族化合物與共軛二烯之共聚性之調整的規定之調整劑,於下述條件下進行聚合反應所獲得。(Crystallization peak of hydrogenated block copolymer (A)) Preferably, in the differential scanning calorimetry (DSC) curve, the hydrogenated block copolymer (A) does not substantially contain hydrogenated compounds that cause crystallization peaks in the range of -25 to 80°C. Here, "there is no substantial crystallization peak caused by the hydrogenated copolymer block (b) in the range of -25 to 80°C" means that in this temperature range, no peak caused by the crystallization of the hydrogenated copolymer block (b) appears, or even if a peak caused by crystallization is confirmed, the heat of the crystallization peak generated by the crystallization does not reach 3 J/g, preferably not 2 J/g, more preferably not 1 J/g, and even more preferably no heat of crystallization peak. As described above, if there is no substantial crystallization peak caused by the hydrogenated copolymer block (b) within the temperature range of -25 to 80°C, good softness can be obtained in the hydrogenated block copolymer (A) of this embodiment, thereby making it more suitable to achieve the softening of the hydrogenated block copolymer composition described below. In order to obtain the hydrogenated block copolymer (A) in which there is no substantial crystallization peak caused by the hydrogenated copolymer block (b) within the temperature range of -25 to 80°C, it is only necessary to carry out a hydrogenation reaction on the copolymer. The copolymer is obtained by using a modifier that specifies the adjustment of the vinyl bond quantity or the copolymerization of the vinyl aromatic compound and the conjugated diene, and by carrying out a polymerization reaction under the following conditions.
(氫化嵌段共聚物(甲)之黏彈性測定圖中之tanδ(損耗正切)波峰) 本實施方式之氫化嵌段共聚物(甲)較佳為於黏彈性測定圖中,tanδ(損耗正切)之波峰於-25℃以上且45℃以下存在至少1個。更佳為於-5℃以上且40℃以下,進而較佳為於10℃以上且35℃以下,進而更佳為於15℃以上且30℃以下存在至少1個。 該tanδ之波峰為由氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)引起之波峰。藉由在-25℃以上且60℃以下之範圍內存在至少1個該波峰,有於本實施方式之氫化嵌段共聚物(甲)中,表現出低反彈性,從而表現出良好之觸感之傾向。 再者,氫化嵌段共聚物(甲)之tanδ可使用黏彈性測定裝置(TA Instrument股份有限公司製造,ARES),於應變0.5%、頻率1 Hz、升溫速度3℃/min之條件下進行測定。具體而言,可藉由下述實施例中所記載之方法進行測定。(The tanδ (loss tangent) peak in the viscoelasticity test graph of the hydrogenated block copolymer (A) of this embodiment is preferably such that at least one tanδ (loss tangent) peak exists in the viscoelasticity test graph above -25°C and below 45°C. More preferably, it exists above -5°C and below 40°C, even more preferably above 10°C and below 35°C, and even more preferably above 15°C and below 30°C. This tanδ peak is caused by the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A). By exhibiting at least one peak within a temperature range of -25°C to 60°C, the hydrogenated block copolymer (A) of this embodiment exhibits low elasticity, thus tending to provide a good tactile feel. Furthermore, the tanδ of the hydrogenated block copolymer (A) can be measured using a viscoelasticity measuring apparatus (manufactured by TA Instruments Inc., ARES) under conditions of 0.5% strain, 1 Hz frequency, and a heating rate of 3°C/min. Specifically, it can be measured using the method described in the following embodiments.
(氫化嵌段共聚物(甲)之隨機性參數g) <條件(3)> 本實施方式之氫化嵌段共聚物(甲)之利用熱分解氣相層析質譜分析裝置檢測出之波峰強度P、與 根據下述(式I)求出之P0之比率:g=P/P0為0.75以上。 P0=k×RS (式I) ((式I)中,RS為相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%)。 k表示將相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%)、與波峰強度P進行一次近似時之比例常數,該波峰強度P係利用熱分解氣相層析質譜分析裝置對藉由下述特定之聚合方法(均相聚合法)聚合而成之均相聚合之氫化嵌段共聚物(甲)進行分析時獲得)(Random parameter g of hydrogenated block copolymer (A)) <Condition (3)> The ratio of the peak intensity P detected by thermal decomposition gas chromatography mass spectrometry analysis device to P0 calculated according to the following (Equation I): g = P/P0 is 0.75 or more. P0 = k × RS (Equation I) (In Equation I, RS is the content (mass %) of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the whole hydrogenated block copolymer (A). k represents the proportionality constant when approximating the content RS (mass %) of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the whole hydrogenated block copolymer (A) with the peak intensity P, which is obtained by analyzing the homogeneous hydrogenated block copolymer (A) polymerized by the following specific polymerization method (homogeneous polymerization) using a thermal decomposition gas chromatography-mass spectrometry analysis device.)
上述g=P/P0可根據藉由氫化嵌段共聚物(甲)之熱分解氣相層析質譜分析測定(以下,有時表述為py-GC/MS測定)所獲得之特定之波峰強度算出,為氫化嵌段共聚物(甲)之隨機性參數。 上述隨機性參數g(可評價隨機性之原因如下所述)表示氫化共聚物嵌段(b)中之乙烯基芳香族單體單元與共軛二烯單體單元多麼均勻地排列。上述g之值越大,則表示乙烯基芳香族單體單元與共軛二烯單體單元越均勻地排列。 可利用上述隨機性參數g評價隨機性之原因在於,如下所述,P表示被推測為氫化共聚物嵌段(b)中之(乙烯基芳香族單體)-(共軛二烯單體)-(乙烯基芳香族單體)之3連體結構之分解物之波峰的強度合計值。即,P表示乙烯基芳香族單體與共軛二烯單體多麼均勻地反應。The above g = P/P0 can be calculated based on the specific peak intensity obtained by thermal decomposition gas chromatography-mass spectrometry analysis (hereinafter, sometimes referred to as py-GC/MS analysis) of the hydrogenated block copolymer (A), and is a random parameter of the hydrogenated block copolymer (A). The above random parameter g (the reason for evaluating randomness is explained below) indicates how uniformly the vinyl aromatic monomer units and conjugated diene monomer units are arranged in the hydrogenated copolymer block (b). The larger the value of g, the more uniformly the vinyl aromatic monomer units and conjugated diene monomer units are arranged. The reason why the randomness can be evaluated using the aforementioned randomness parameter g is that, as described below, P represents the sum of the peak intensities of the decomposition products of the (vinyl aromatic monomer)-(conycene monomer)-(vinyl aromatic monomer) 3-linked structure in the hydrogenated copolymer block (b). That is, P represents how uniformly the vinyl aromatic monomer and the conycene monomer react.
於本實施方式之氫化嵌段共聚物(甲)中,上述隨機性參數g為0.75以上,較佳為0.8以上,更佳為0.85以上,進而較佳為0.9以上。 若隨機性參數g為0.75以上,則有本實施方式之氫化嵌段共聚物(甲)表現出良好之耐磨耗性之傾向。進而,若為0.9以上,則表現出更高之耐磨耗性,且可於如下情形時使用:於如耐磨耗性之要求更嚴格之用途,例如汽車內飾材料等中,於更薄壁之成形體中需要優異之耐磨耗性之用途、或汽車內飾材料用途中,於假定乘車時需要由更高之荷重或眼較粗之布料,例如眼粗於細白布3號之類的棉布料之布料即粗斜紋棉布布料等所產生之耐磨耗性之用途中,要求長時間維持外觀。 又,若隨機性參數g為0.75以上,則本實施方式之氫化嵌段共聚物(甲)之tanδ波峰之高度提高,低反彈性提高,表現出良好之觸感。進而,若為0.9以上,則有可獲得更高之tanδ波峰,可獲得更優異之低反彈性,而可獲得更良好之觸感之傾向。In the hydrogenated block copolymer (A) of this embodiment, the random parameter g is 0.75 or higher, preferably 0.8 or higher, more preferably 0.85 or higher, and even more preferably 0.9 or higher. If the random parameter g is 0.75 or higher, the hydrogenated block copolymer (A) of this embodiment tends to exhibit good wear resistance. Furthermore, if the value is 0.9 or higher, it exhibits even higher abrasion resistance and can be used in the following situations: applications with stricter abrasion resistance requirements, such as automotive interior materials; applications requiring excellent abrasion resistance in thinner-walled molded parts; or automotive interior materials applications where higher loads or coarser weave fabrics, such as coarser twill cotton fabrics (like No. 3 fine white cotton), are required to maintain appearance for a long time. Also, if the random parameter g is 0.75 or higher, the height of the tanδ peak of the hydrogenated block copolymer (A) in this embodiment is increased, low elasticity is improved, and a good tactile feel is exhibited. Furthermore, if the value is above 0.9, a higher tanδ peak can be obtained, resulting in better low elasticity and a tendency to achieve a better tactile feel.
[隨機性參數g之算出方法] 隨機性參數g可根據藉由py-GC/MS測定所獲得之特定之波峰強度而算出。 g之算出中所使用之波峰強度P為被推測為氫化共聚物嵌段(b)中之(乙烯基芳香族單體)-(共軛二烯單體)-(乙烯基芳香族單體)結構之分解物之3個波峰強度的合計值,3個波峰設為由下述2個條件(i)、條件(ii)所定義者。[Calculation Method of Random Parameter g] The random parameter g can be calculated based on a specific peak intensity obtained by py-GC/MS measurement. The peak intensity P used in the calculation of g is the sum of the three peak intensities of the decomposition product of the (vinyl aromatic monomer)-(conjugated diene monomer)-(vinyl aromatic monomer) structure in the hydrogenated copolymer block (b), which is assumed to be defined by the following two conditions (i) and (ii).
(條件(i)) 於將在下述表1所示之條件下測定試樣之情形時檢測之源自苯乙烯二聚物之波峰(藉由樣本測定來歸屬)的保持時間設為0 min之情形時,分別為以相對保持時間:1.83 min、2.15 min、2.45 min(容許誤差0.01 min左右)檢測到之波峰。 (條件(ii)) 分別具有質量值:252、264、276之碎片峰。(Condition (i)) When the retention time of the peaks originating from styrene dimers (attributed by sample determination) detected under the conditions shown in Table 1 below is set to 0 min, the peaks detected are those with relative retention times of 1.83 min, 2.15 min, and 2.45 min (with an allowable error of approximately 0.01 min). (Condition (ii)) Fragmented peaks with mass values of 252, 264, and 276, respectively.
將對以上述方法定義之3個波峰之絕對面積值的合計進行下述裝置感度修正所得之相對面積值設為波峰強度P。 隨機性參數g可藉由與利用下述(式I)求出之P0之比:g=P/P0而算出。 P0=k×RS … (式I) 上述(式I)中,RS為相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%),能夠利用核磁共振裝置(NMR)等進行測定。 上述(式I)中,k係使用相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%)、與波峰強度P,利用一次近似式求出之比例常數,該波峰強度P係利用熱分解氣相層析質譜分析裝置(py-GC/MS)對藉由下述特定之聚合方法(均相聚合法)聚合而成之氫化嵌段共聚物(甲)進行測定時之波峰強度。 實驗上k之值成為0.0056左右。 例如,於某氫化嵌段共聚物之RS為40質量%時,P0根據上述(式I)而成為0.0056×40=0.224。 於利用py-GC/MS求出之波峰強度P=0.112之情形時, 可算出為g=0.112/0.224=0.5。The relative area value obtained by performing the following device sensitivity correction on the sum of the absolute area values of the three peaks defined by the above method is set as the peak intensity P. The random parameter g can be calculated by the ratio of P0 obtained using the following (Equation I): g = P/P0. P0 = k × RS … (Equation I) In the above (Equation I), RS is the content (mass %) of vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the hydrogenated block copolymer (a) as a whole, which can be measured using nuclear magnetic resonance (NMR) or the like. In Equation I above, k is a proportionality constant obtained using a first-order approximation formula, which is the ratio of the content RS (mass %) of the vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the total hydrogenated block copolymer (A) to the peak intensity P. The peak intensity P is the peak intensity measured using a pyrolysis gas chromatography-mass spectrometry (py-GC/MS) apparatus for hydrogenated block copolymer (A) polymerized by the following specific polymerization method (homogeneous polymerization). Experimentally, the value of k is approximately 0.0056. For example, when the RS of a certain hydrogenated block copolymer is 40% by mass, P0 is 0.0056 × 40 = 0.224 according to Equation I above. When the peak intensity P = 0.112 obtained using py-GC/MS, g = 0.112/0.224 = 0.5 can be calculated.
P0為藉由下述特定之聚合方法(均相聚合法)使氫化嵌段共聚物(甲)聚合時之py-GC/MS測定之波峰強度P的推定值,藉由以隨機性參數g=P/P0之形式比較上述P0與實際上檢測到之P之值,可對氫化共聚物嵌段(b)中之乙烯基芳香族單體與共軛二烯單體多麼均勻地排列進行評價。P0 is an estimated value of the peak intensity P measured by py-GC/MS during the polymerization of the hydrogenated block copolymer (A) using the specific polymerization method described below (homogeneous polymerization). By comparing the above P0 with the actual detected P value in the form of the random parameter g = P/P0, the uniformity of the arrangement of the vinyl aromatic monomers and conjugated diene monomers in the hydrogenated copolymer block (b) can be evaluated.
py-GC/MS測定之MS檢測器之檢測感度由於每次進行調整均會產生變化,故使用外部標準物質進行感度修正。 於本說明書中,只要未特別說明,則波峰強度P之值設為將波峰絕對面積值除以由外部標準物質之測定獲得的基準值X所得之值。 作為外部標準物質,較佳為使用不易於熱或氧氣氣氛下分解,且容易操作之二丁基羥基甲苯(2,6-二第三丁基對甲酚,以下表述為BHT)。 基準值X設為於下述表1之條件下對0.010 mg之外部標準物質進行測定時所獲得之峰面積值。 再者,表1中,「樣品測定量」為製備溶液並滴加至樣品杯中後風乾所得之測定值,故測定樣品量設為成為固體0.10 mg者。Since the detection sensitivity of the MS detector used in py-GC/MS determination changes with each adjustment, an external standard is used for sensitivity correction. In this manual, unless otherwise specified, the peak intensity P is defined as the value obtained by dividing the absolute area of the peak by the baseline value X obtained from the determination of the external standard. Preferred external standard is dibutylhydroxytoluene (2,6-di-tert-butyl-p-cresol, hereinafter referred to as BHT), which is not easily decomposed under heat or oxygen atmospheres and is easy to handle. The baseline value X is defined as the peak area obtained when 0.010 mg of the external standard is measured under the conditions specified in Table 1 below. Furthermore, in Table 1, the "sample measurement quantity" is the measurement value obtained after preparing the solution, adding it dropwise to the sample cup, and then air-drying it. Therefore, the measurement sample quantity is set to 0.10 mg as a solid.
[表1]
[均相聚合法] 本實施方式之氫化嵌段共聚物(甲)係於<條件(3)>之隨機性參數g之算出中,藉由均相聚合法製作者。 於利用均相聚合法之氫化嵌段共聚物(甲)之製造中,較佳為使用Mettler Toledo公司製造之in Situ FTIR分光光度計ReactIR 45P(以下,表述為ReactIR)。藉由使用上述ReactIR,可即時將聚合反應中之乙烯基芳香族化合物濃度與共軛二烯化合物濃度定量化,故可基於定量結果控制乙烯基芳香族化合物與共軛二烯化合物之進料速度,以較高之水準製造均勻之無規共聚物。[Homogeneous Polymerization Method] The hydrogenated block copolymer (A) of this embodiment is produced by homogeneous polymerization based on the calculation of the random parameter g in <condition (3)>. In the production of the hydrogenated block copolymer (A) using homogeneous polymerization, it is preferable to use the ReactIR 45P in Situ FTIR spectrophotometer (hereinafter referred to as ReactIR) manufactured by Mettler Toledo. By using the ReactIR, the concentrations of vinyl aromatic compounds and conjugated diene compounds in the polymerization reaction can be quantified in real time. Therefore, the feed rate of vinyl aromatic compounds and conjugated diene compounds can be controlled based on the quantitative results, so as to produce a more uniform random copolymer.
作為本實施方式之氫化嵌段共聚物(甲)之製造方法之一例,有如下方法:藉由ReactIR之測定立即求出某時間內之乙烯基芳香族化合物與共軛二烯化合物之反應性比,並以成為所需之反應性比之方式,立即控制作為聚合單體之乙烯基芳香族化合物與共軛二烯化合物之進料速度。 根據規定之時刻t0~t1之乙烯基芳香族化合物之進料量S0、共軛二烯化合物之進料量B0、規定之時刻t0~t1之反應系統中之乙烯基芳香族化合物之變化量ΔS、及共軛二烯化合物之變化量ΔB,即時求出乙烯基芳香族化合物與共軛二烯化合物之反應性比(S0+ΔS)/(B0+ΔB),以成為所需之反應性比之方式立即控制乙烯基芳香族化合物與共軛二烯化合物之進料速度。 例如,於上述反應性比:(S0+ΔS)/(B0+ΔB)高於所需之反應性比之情形時,只要加快共軛二烯化合物之進料速度,或者延遲乙烯基芳香族化合物之進料速度即可。As an example of the manufacturing method of the hydrogenated block copolymer (A) of this embodiment, there is a method in which the reactivity ratio of the vinyl aromatic compound to the conjugated diene compound within a certain time period is immediately determined by measuring ReactIR, and the feed rate of the vinyl aromatic compound and the conjugated diene compound as polymer monomers is immediately controlled in such a way as to achieve the desired reactivity ratio. Based on the specified feed rates S0 of the vinyl aromatic compound and B0 of the conyoderm compound at time t0 to t1, and the changes ΔS and ΔB of the vinyl aromatic compound and conyoderm compound in the reaction system at the specified time t0 to t1, the reactivity ratio (S0 + ΔS)/(B0 + ΔB) of the vinyl aromatic compound and conyoderm compound is calculated in real time. The feed rates of the vinyl aromatic compound and conyoderm compound are then immediately controlled to achieve the desired reactivity ratio. For example, if the reactivity ratio (S0 + ΔS)/(B0 + ΔB) is higher than the desired reactivity ratio, the feed rate of the conyoderm compound can be increased or decreased.
通常,於乙烯基芳香族化合物與共軛二烯化合物之共聚中,於以所需之反應性比均勻地進行聚合之情形時,需要使乙烯基芳香族化合物與共軛二烯化合物之進料速度比與所需之反應性比相同而開始進料,且於共聚結束時,同時結束乙烯基芳香族化合物與共軛二烯化合物之進料。 例如,於進行苯乙烯與丁二烯之共聚之情形時,通常,丁二烯之反應速度快於苯乙烯之反應速度,故於進料剛開始後,有反應性比:(S0+ΔS)/(B0+ΔB)變得小於目標值之傾向,且有逐漸接近目標之反應性比之傾向。又,於進料剛結束後,有反應性比:(S0+ΔS)/(B0+ΔB)大於目標值之傾向。藉由使用上述ReactIR,即時測定反應性比:(S0+ΔS)/(B0+ΔB),以成為目標之反應性比之方式控制苯乙烯與丁二烯之進料速度比,藉此可將進料剛開始後與進料結束時之反應性比:(S0+ΔS)/(B0+ΔB)控制為目標之反應性比。Typically, in the copolymerization of vinyl aromatic compounds and conydate compounds, when polymerizing uniformly at the desired reactivity ratio, the feed rate ratio of the vinyl aromatic compound to the conydate compound must be the same as the desired reactivity ratio at the start of feeding, and the feeding of both the vinyl aromatic compound and the conydate compound must be stopped simultaneously at the end of copolymerization. For example, in the copolymerization of styrene and butadiene, butadiene typically reacts faster than styrene. Therefore, initially, the reactivity ratio (S0 + ΔS)/(B0 + ΔB) tends to be lower than the target value, and gradually approaches the target reactivity ratio. Conversely, immediately after feeding is stopped, the reactivity ratio (S0 + ΔS)/(B0 + ΔB) tends to be higher than the target value. By using ReactIR as described above, the reactivity ratio (S0 + ΔS)/(B0 + ΔB) can be measured in real time, and the feed rate ratio of styrene to butadiene can be controlled in a way that achieves the target reactivity ratio. In this way, the reactivity ratio (S0 + ΔS)/(B0 + ΔB) at the beginning and end of the feed can be controlled as the target reactivity ratio.
以下,獲得具體之3種氫化嵌段共聚物(甲)-I~(甲)-III,並分別利用熱分解氣相層析質譜分析裝置(py-GC/MS)進行測定,求出波峰強度P。 又,根據上述氫化共聚物嵌段(b)中之乙烯基芳香族單體單元相對於上述氫化嵌段共聚物((甲)-I~(甲)-III)整體之含量RS(質量%)、與上述波峰強度P之一次近似式,將上述(式I)之係數k算出為k=005563。 將用於k之確定之值示於下述表2。Below, three specific hydrogenated block copolymers (a)-I to (a)-III were obtained, and their peak intensities P were determined using a pyrolysis gas chromatography-mass spectrometry (py-GC/MS) analyzer. Furthermore, based on the first-order approximation formula between the content RS (mass %) of the vinyl aromatic monomer unit in the hydrogenated copolymer block (b) relative to the total content of the hydrogenated block copolymers ((a)-I to (a)-III) and the peak intensities P, the coefficient k in the above (Equation I) was calculated to be k = 0.05563. The values used to determine k are shown in Table 2 below.
<氫化嵌段共聚物(甲)-I> 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯20質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.053質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯50質量份與苯乙烯30質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 其後,添加甲醇,停止聚合反應。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為50質量%,且相對於氫化嵌段共聚物(甲)整體之(b)氫化共聚物嵌段中之乙烯基芳香族單體單元之含量RS為30質量%。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-I。 所獲得之氫化嵌段共聚物(甲)-I之氫化率為98莫耳%。<Hydrogenated Block Copolymer (A)-I> Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirrer and jacket. First, a cyclohexane solution (concentration 20% by mass) containing 20 parts by mass of styrene was added. Next, 0.053 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 50 parts by mass of butadiene and 30 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR is used to measure the concentrations of butadiene and styrene in the reaction system in real time, and the feed rate is adjusted appropriately to achieve a 1:1 (mass part conversion) polymerization rate for each. Then, methanol is added to stop the polymerization reaction. Regarding the block copolymer obtained by the above method, the styrene content is 50% by mass, and the content of vinyl aromatic monomers in the (b) hydrogenated copolymer blocks relative to the overall hydrogenated block copolymer (a) is 30% by mass. Furthermore, for every 100 parts by mass of the obtained block copolymer, 100 ppm of the hydrogenation catalyst prepared in the above manner (based on Ti) is added, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-I. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-I was 98 mol%.
<氫化嵌段共聚物(甲)-II> 將上述氫化嵌段共聚物(甲)-I之丁二烯50質量份與苯乙烯30質量份變更為丁二烯40質量份與苯乙烯40質量份,並進行聚合反應、及氫化反應,獲得氫化嵌段共聚物(甲)-II。 氫化反應前之嵌段共聚物中,苯乙烯含量為60質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為40質量%,且氫化嵌段共聚物(甲)-II之氫化率為98莫耳%。<Hydrogenated Block Copolymer (A)-II> The butadiene (50 parts by mass) and styrene (30 parts by mass) of the above-mentioned hydrogenated block copolymer (A)-I were changed to 40 parts by mass of butadiene and 40 parts by mass of styrene, and polymerization and hydrogenation reactions were carried out to obtain hydrogenated block copolymer (A)-II. In the block copolymer before the hydrogenation reaction, the styrene content was 60% by mass, and the content of vinyl aromatic monomer units RS in the hydrogenated copolymer block (b) of the whole hydrogenated block copolymer (A) was 40% by mass, and the hydrogenation rate of hydrogenated block copolymer (A)-II was 98 moles.
<氫化嵌段共聚物(甲)-III> 將上述氫化嵌段共聚物(甲)-I之丁二烯50質量份與苯乙烯30質量份變更為丁二烯30質量份與苯乙烯50質量份,並進行聚合反應、氫化反應,獲得氫化嵌段共聚物(甲)-III。 氫化反應前之嵌段共聚物中,苯乙烯含量為70質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,且氫化嵌段共聚物(甲)-III之氫化率為98莫耳%。<Hydrogenated Block Copolymer (A)-III> The 50 parts by mass of butadiene and 30 parts by mass of styrene in the above-mentioned hydrogenated block copolymer (A)-I were changed to 30 parts by mass of butadiene and 50 parts by mass of styrene, and a polymerization reaction and a hydrogenation reaction were carried out to obtain hydrogenated block copolymer (A)-III. In the block copolymer before the hydrogenation reaction, the styrene content was 70% by mass, and the content of vinyl aromatic monomer units RS in the hydrogenated copolymer block (b) of the whole hydrogenated block copolymer (A) was 50% by mass, and the hydrogenation rate of hydrogenated block copolymer (A)-III was 98 moles.
[表2]
(氫化嵌段共聚物(甲)之結構) 本實施方式之氫化嵌段共聚物(甲)之結構例如可例舉具有下述通式所表示之結構者。 c-(b-a)n、c-(a-b)n、c-(a-b-a)n、c-(b-a-b)n、c-(b-c-a)n、a-(c-b-c-a)n、a-c-(b-a)n、a-c-(a-b)n、a-c-(b-a)n-b、c-a-(b-a)n-c、a-c-(b-a)n-c、a-b-(c-a)n-b、a-c-(b-c)n-a-c、c-(a-b-c)n-a-c、a-(c-b)n-c-a、c-(a-c)n-b-c-a-c、[(a-b-c)n]m-X、[a-(b-c)n]m-X、[(a-b)n-c]m-X、[(a-b-a)n-c]m-X、[(b-a-b)n-c]m-X、[(c-b-a)n]m-X、[c-(b-a)n]m-X、[c-(a-b-a)n]m-X、[c-(b-a-b)n]m-X 再者,於上述各通式中,a表示將乙烯基芳香族單體單元作為主體之聚合物嵌段(a),b表示包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b),c表示將共軛二烯單體單元作為主體之氫化聚合物嵌段(c)。 n為1以上之整數,較佳為1~5之整數。 m為2以上之整數,較佳為2~11之整數。 X表示偶合劑之殘基或多官能起始劑之殘基。(Structure of hydrogenated block copolymer (A)) The structure of the hydrogenated block copolymer (A) of this embodiment can be exemplified by having a structure represented by the following general formula. c-(ba) n , c-(ab) n , c-(aba) n , c-(bab) n , c-(bca) n , a-(cbca) n , ac-(ba) n , ac-(ab) n , ac-(ba) n -b, ca-(ba) n -c, ac-(ba) n -c, ab-(ca) n -b, ac-(bc) n -ac, c-(abc) n -ac, a-(cb) n -ca, c-(ac) n -bcac, [(abc) n ] m -X, [a-(bc) n ] m -X, [(ab) n -c] m -X, [(aba) n -c] m -X, [(bab) n -c] m -X, [(cba) n ] m -X, [c-(ba) n ] m -X、[c-(aba) n ] m -X、[c-(bab) n ] m -X Furthermore, in the above general formulas, a represents a polymer block (a) with a vinyl aromatic monomer unit as the main component, b represents a hydrogenated copolymer block (b) containing a vinyl aromatic monomer unit and a conjugated diene monomer unit, and c represents a hydrogenated polymer block (c) with a conjugated diene monomer unit as the main component. n is an integer of 1 or more, preferably an integer of 1 to 5. m is an integer of 2 or more, preferably an integer of 2 to 11. X represents the residue of the coupling agent or the residue of the multifunctional initiator.
(氫化嵌段共聚物(甲)之結構之其他例) 本實施方式之氫化嵌段共聚物(甲)亦可為鍵結有具有規定之官能基的原子團之改性嵌段共聚物。只要根據於製作使用本實施方式之氫化嵌段共聚物(甲)之組合物時混練之樹脂之結構等,適當設定有無改性、官能基之種類等即可。 又,於將氫化嵌段共聚物(甲)設為改性嵌段共聚物之情形時,亦可為二次改性嵌段共聚物。於本說明書中,「二次改性」係以藉由製造方法賦予特徵之命名,將使官能基鍵結於聚合物之最初之步驟稱為一次改性,將使其他化合物與其官能基反應之步驟稱為二次改性。例如,典型之製造方法為於溶液中進行聚合後,於擠出機中使其他化合物(例如順丁烯二酸)、與使改性劑(例如胺)和聚合結束末端反應而成之一次改性品反應,製造二次改性品。(Other examples of the structure of hydrogenated block copolymer (A)) The hydrogenated block copolymer (A) of this embodiment can also be a modified block copolymer bonded with atomic groups having specified functional groups. The type of modification, functional groups, etc., can be appropriately set according to the structure of the resin used in the preparation of the composition using the hydrogenated block copolymer (A) of this embodiment. Furthermore, when the hydrogenated block copolymer (A) is set as a modified block copolymer, it can also be a secondary modified block copolymer. In this specification, "secondary modification" is a designation based on the characteristics imparted by the manufacturing method. The initial step of bonding functional groups to the polymer is called primary modification, and the step of reacting other compounds with its functional groups is called secondary modification. For example, a typical manufacturing method involves polymerizing in solution and then reacting other compounds (e.g., maleic acid) with a modifier (e.g., amine) and the polymerization terminus in an extruder to produce a primary modified product, thereby producing a secondary modified product.
[氫化嵌段共聚物(甲)之製造方法] 作為本實施方式之氫化嵌段共聚物(甲)之氫化前的狀態之嵌段共聚物例如可藉由如下方法所獲得:於烴溶劑中使用有機鹼金屬化合物等聚合起始劑,使乙烯基芳香族化合物與共軛二烯化合物活性進行陰離子聚合。[Method for manufacturing hydrogenated block copolymer (A)] The block copolymer (A) of this embodiment, in its pre-hydrogenation state, can be obtained, for example, by using a polymerization initiator such as an organic alkali metal compound in a hydrocarbon solvent to enable the vinyl aromatic compound and the conjugated diene compound to undergo anionic polymerization.
(烴溶劑) 作為烴溶劑,例如可例舉:正丁烷、異丁烷、正戊烷、正己烷、正庚烷、正辛烷等脂肪族烴類;環己烷、環庚烷、甲基環庚烷等脂環式烴類;苯、甲苯、二甲苯、乙基苯等芳香族烴,但並不限定於以上。(Chemical solvents) Examples of hydrocarbon solvents include: aliphatic hydrocarbons such as n-butane, isobutane, n-pentane, n-hexane, n-heptane, and n-octane; alicyclic hydrocarbons such as cyclohexane, cycloheptane, and methylcycloheptane; and aromatic hydrocarbons such as benzene, toluene, xylene, and ethylbenzene, but are not limited to the above.
(聚合起始劑) 作為聚合起始劑,並無特別限定,例如可例舉:已知對乙烯基芳香族化合物及共軛二烯具有陰離子聚合活性之脂肪族烴鹼金屬化合物、芳香族烴鹼金屬化合物、有機胺基鹼金屬化合物等有機鹼金屬化合物。 作為有機鹼金屬化合物,例如較佳為碳數1~20之脂肪族及芳香族烴鋰化合物,但並不限定於以上,可應用1分子中包含1個鋰之化合物、1分子中包含複數個之鋰之二鋰化合物、三鋰化合物、四鋰化合物。 具體而言,可例舉:正丙基鋰、正丁基鋰、第二丁基鋰、第三丁基鋰、正戊基鋰、正己基鋰、苄基鋰、苯基鋰、甲苯基鋰、二異丙烯基苯與第二丁基鋰之反應產物、二乙烯苯與第二丁基鋰及少量1,3-丁二烯之反應產物等。 進而,例如亦可應用美國專利第5,708,092號說明書、英國專利第2,241,239號說明書、美國專利第5,527,753號說明書中所揭示之有機鹼金屬化合物。(Polymerization Initiator) There is no particular limitation on the type of polymerization initiator. Examples include aliphatic hydrocarbon alkali metal compounds, aromatic hydrocarbon alkali metal compounds, and organic amino alkali metal compounds that are known to have anionic polymerization activity for vinyl aromatic compounds and conjugated dienes. As organic alkali metal compounds, aliphatic and aromatic hydrocarbon lithium compounds with 1 to 20 carbon atoms are preferred, but they are not limited to the above. Compounds containing one lithium atom in one molecule, dilithium compounds, trilithium compounds, and tetralithium compounds containing multiple lithium atoms in one molecule can also be used. Specifically, examples include: the reaction products of n-propyl lithium, n-butyl lithium, dibutyl lithium, tributyl lithium, n-pentyl lithium, n-hexyl lithium, benzyl lithium, phenyl lithium, tolyl lithium, the reaction products of diisopropylbenzene and dibutyl lithium, and the reaction products of divinylbenzene and dibutyl lithium with a small amount of 1,3-butadiene. Furthermore, organoalkali metal compounds disclosed in U.S. Patent No. 5,708,092, British Patent No. 2,241,239, and U.S. Patent No. 5,527,753 can also be used.
(調整劑) 於使用有機鹼金屬化合物作為聚合起始劑,使乙烯基芳香族化合物與共軛二烯化合物共聚時,使用規定之調整劑,藉此可調整組入至聚合物中之由共軛二烯化合物產生之乙烯基鍵(1,2-鍵或3,4-鍵)之含量、或乙烯基芳香族單體單元與共軛二烯單體單元之無規共聚性。 作為此種調整劑,例如可例舉:三級胺化合物、醚化合物、金屬醇化物化合物等,但並不限定於以上。 調整劑可僅單獨使用一種,亦可組合使用兩種以上。(Modifier) When using an organoalkali metal compound as a polymerization initiator to copolymerize a vinyl aromatic compound with a conjugated diene compound, a prescribed modifier is used to adjust the content of vinyl bonds (1,2- or 3,4- bonds) generated by the conjugated diene compound incorporated into the polymer, or the random copolymerization of the vinyl aromatic monomers and the conjugated diene monomers. Examples of such modifiers include, but are not limited to, tertiary amine compounds, ether compounds, and metal alkoxide compounds. A modifier may be used alone or in combination of two or more.
作為三級胺化合物,例如可例舉通式R1R2R3N(此處,R1、R2、R3表示碳數1~20之烴基或具有三級胺基之烴基)所表示之化合物,但並不限定於以上。 具體而言,可例舉:三甲基胺、三乙基胺、三丁基胺、N,N-二甲基苯胺、N-乙基哌啶、N-甲基吡咯啶、N,N,N',N'-四甲基乙二胺、N,N,N',N'-四乙基乙二胺、1,2-二哌啶基乙烷、三甲基胺基乙基哌𠯤、N,N,N',N'',N''-五甲基伸乙基三胺、N,N'-二辛基對苯二胺等。As tertiary amine compounds, examples include compounds represented by the general formula R1R2R3N (where R1, R2, and R3 represent hydrocarbons with 1 to 20 carbon atoms or hydrocarbons having tertiary amine groups), but are not limited to these. Specifically, examples include: trimethylamine, triethylamine, tributylamine, N,N-dimethylaniline, N-ethylpiperidine, N-methylpyrrolidine, N,N,N',N'-tetramethylethylenediamine, N,N,N',N'-tetraethylethylenediamine, 1,2-dipiperidinylethane, trimethylaminoethylpiperidine, N,N,N',N'',N''-pentamethylethylenediamine, N,N'-dioctyl-p-phenylenediamine, etc.
作為醚化合物,例如可應用等直鏈狀醚化合物及環狀醚化合物,但並不限定於以上。 作為直鏈狀醚化合物,例如可例舉:二甲醚、二乙醚、二苯醚、乙二醇二甲醚、乙二醇二乙醚、乙二醇二丁醚等乙二醇之二烷基醚化合物類;二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇二丁醚等二乙二醇之二烷基醚化合物類,但並不限定於以上。 作為環狀醚化合物,例如可例舉:四氫呋喃、二㗁烷、2,5-二甲基氧雜環戊烷、2,2,5,5-四甲基氧雜環戊烷、2,2-雙(2-四氫呋喃基)丙烷、呋喃甲醇之烷基醚等,但並不限定於以上。As ether compounds, examples include, for example, isolinear ether compounds and cyclic ether compounds, but are not limited to the above. Examples of linear ether compounds include, for example, dialkyl ethers of ethylene glycol such as dimethyl ether, diethyl ether, diphenyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, and ethylene glycol dibutyl ether; and dialkyl ethers of diethylene glycol such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and diethylene glycol dibutyl ether, but are not limited to the above. Examples of cyclic ether compounds include, for example, tetrahydrofuran, dialkylene, 2,5-dimethyloxacyclopentane, 2,2,5,5-tetramethyloxacyclopentane, 2,2-bis(2-tetrahydrofuranyl)propane, and alkyl ethers of furanol, but are not limited to the above.
作為金屬醇化物化合物,例如可例舉:第三戊醇鈉、第三丁醇鈉、第三戊醇鉀、第三丁醇鉀等,但並不限定於以上。Examples of metal alkoxides include sodium tripentoxide, sodium tributoxide, potassium tripentoxide, potassium tributoxide, etc., but are not limited to these.
(聚合方法) 作為使用有機鹼金屬化合物作為聚合起始劑,使乙烯基芳香族化合物及共軛二烯化合物聚合之方法,可應用先前公知之方法。 例如可為分批聚合、連續聚合、或該等之組合中之任一種,但並不限定於以上。尤其是為了獲得耐熱性優異之共聚物,適宜為分批聚合。 聚合溫度較佳為0℃~180℃,更佳為30℃~150℃。聚合時間根據條件而有所不同,通常為48小時以內,較佳為0.1~10小時。 又,作為聚合系統之氣氛,較佳為氮氣等惰性氣體氣氛。 聚合壓力只要設定為於上述溫度範圍內可將單體及溶劑維持為液相之壓力範圍即可,並無特別限定。 進而,較佳為多加注意以避免聚合系統內混入如造成觸媒及活性聚合物惰性化之雜質,例如水、氧、二氧化碳等。(Polymerization Method) The method for polymerizing vinyl aromatic compounds and conjugated diene compounds using an organoalkali metal compound as a polymerization initiator can employ previously known methods. For example, it can be batch polymerization, continuous polymerization, or any combination thereof, but is not limited to the above. Batch polymerization is particularly suitable for obtaining copolymers with excellent heat resistance. The polymerization temperature is preferably 0°C to 180°C, more preferably 30°C to 150°C. The polymerization time varies depending on the conditions, typically within 48 hours, preferably 0.1 to 10 hours. Furthermore, the atmosphere for the polymerization system is preferably an inert gas atmosphere such as nitrogen. The polymerization pressure is not particularly limited, as long as it is set within the above temperature range to maintain the monomer and solvent in a liquid phase. Furthermore, it is preferable to take extra care to avoid the introduction of impurities into the polymerization system that could inert the catalyst and active polymers, such as water, oxygen, and carbon dioxide.
又,亦可於上述聚合步驟結束時,添加必需量之2官能以上之偶合劑而進行偶合反應。 作為2官能偶合劑,可應用公知者,並無特別限定。例如可例舉:三甲氧基矽烷、三乙氧基矽烷、四甲氧基矽烷、四乙氧基矽烷、二甲基二甲氧基矽烷、二乙基二甲氧基矽烷、二氯二甲氧基矽烷、二氯二乙氧基矽烷、三氯甲氧基矽烷、三氯乙氧基矽烷等烷氧基矽烷化合物;二氯乙烷、二溴乙烷、二甲基二氯矽烷、二甲基二溴矽烷等二鹵素化合物;苯甲酸甲酯、苯甲酸乙酯、苯甲酸苯酯、鄰苯二甲酸酯類等酸酯類等。 又,作為3官能以上之多官能偶合劑,可應用先前公知者,並無特別限定。例如可例舉:三元以上之多元醇類、環氧化大豆油、二縮水甘油基雙酚A、1,3-雙(N-N'-二縮水甘油基胺基甲基)環己烷等多元環氧化合物;通式R4 -nSiXn(此處,R表示碳數1~20之烴基,X表示鹵素,n表示3~4之整數)所表示之鹵化矽化合物,例如甲基三氯化矽、第三丁基三氯化矽、四氯化矽及該等之溴化物等;通式R4 -nSnXn(此處,R表示碳數1~20之烴基,X表示鹵素,n表示3~4之整數)所表示之鹵化錫化合物,例如甲基三氯化錫、第三丁基三氯化錫、四氯化錫等多價鹵素化合物等。又,亦可使用碳酸二甲酯或碳酸二乙酯等。Alternatively, at the end of the above polymerization step, a necessary amount of a coupling agent with two or more functions can be added to carry out the coupling reaction. Known coupling agents can be used as difunctional coupling agents, and there are no particular limitations. Examples include: alkoxysilane compounds such as trimethoxysilane, triethoxysilane, tetramethoxysilane, tetraethoxysilane, dimethyldimethoxysilane, diethyldimethoxysilane, dichlorodimethoxysilane, dichlorodiethoxysilane, trichloromethoxysilane, and trichloroethoxysilane; dihalogen compounds such as dichloroethane, dibromoethane, dimethyldichlorosilane, and dimethyldibromosilane; and acid esters such as methyl benzoate, ethyl benzoate, phenyl benzoate, and phthalates. Furthermore, as a multifunctional coupling agent with three or more functions, previously known agents can be used without particular limitation. Examples include: polyols with three or more ternary components, epoxidized soybean oil, diglycidyl bisphenol A, 1,3-bis(N-N'-diglycidylaminomethyl)cyclohexane, and other polyepoxides; halogenated silicon compounds represented by the general formula R4 - nSiXn (where R represents an alkyl group with 1 to 20 carbon atoms, X represents a halogen, and n represents an integer of 3 to 4), such as methyl silicon trichloride, tert-butyl silicon trichloride, silicon tetrachloride, and their bromides; and compounds with the general formula R4 - nSnXn . (Here, R represents an hydrocarbon with 1 to 20 carbon atoms, X represents a halogen, and n represents an integer from 3 to 4.) The halogenated tin compounds represented are, for example, polyvalent halogen compounds such as methyl tin trichloride, tributyl tin trichloride, and tin tetrachloride. Alternatively, dimethyl carbonate or diethyl carbonate may also be used.
(改性步驟) 如上所述,本實施方式之氫化嵌段共聚物(甲)可為鍵結有具有官能基之原子團之改性嵌段共聚物。具有官能基之原子團之鍵結較佳為作為下述氫化步驟之前步驟。 作為上述「具有官能基之原子團」,例如可例舉含有至少一種選自羥基、羧基、羰基、硫代羰基、醯鹵化物基、酸酐基、羧酸基、硫代羧酸基、醛基、硫代醛基、羧酸酯基、醯胺基、磺酸基、磺酸酯基、磷酸基、磷酸酯基、胺基、亞胺基、腈基、吡啶基、喹啉基、環氧基、硫代環氧基、硫基、異氰酸基、異硫氰酸基、鹵化矽基、矽烷醇基、烷氧基矽基、鹵化錫基、硼酸基、含硼之基、硼酸鹽基、烷氧基錫基、苯基錫基等中之官能基之原子團,但並不限定於以上。尤佳為具有至少1個選自羥基、環氧基、胺基、矽烷醇基、烷氧基矽烷基中之官能基之原子團。 上述「具有官能基之原子團」可利用改性劑進行鍵結。 作為改性劑,例如可例舉:四縮水甘油基間苯二甲胺、四縮水甘油基-1,3-二胺基甲基環己烷、ε-己內酯、δ-戊內酯、4-甲氧基二苯甲酮、γ-縮水甘油氧基乙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基二甲基苯氧基矽烷、雙(γ-縮水甘油氧基丙基)甲基丙氧基矽烷、1,3-二甲基-2-咪唑啶酮、1,3-二乙基-2-咪唑啶酮、N,N'-二甲基伸丙基脲、N-甲基吡咯啶酮等,但並不限定於以上。(Modification Step) As described above, the hydrogenated block copolymer (A) of this embodiment can be a modified block copolymer bonded with functional groups. The bonding of functional groups is preferably a step prior to the hydrogenation step described below. As for the aforementioned "functional group", examples include groups containing at least one functional group selected from hydroxyl, carboxyl, carbonyl, thiocarbonyl, acetyl halide, acid anhydride, carboxylic acid, thiocarboxylic acid, aldehyde, thioaldehyde, carboxylic acid ester, acetamino, sulfonic acid, sulfonate, phosphate, phosphate ester, amino, imine, nitrile, pyridinyl, quinolinyl, epoxy, thioepoxy, thio, isocyanate, isothiocyanate, halogenated silica, silanol, alkoxysilyl, halogenated tin, borate, boron-containing group, borate salt, alkoxytin, phenyltin, etc., but are not limited to the above. Preferably, the atomic group has at least one functional group selected from hydroxyl, epoxy, amino, silanol, alkoxysilyl. The aforementioned "atomic group with functional group" can be bonded using a modifier. Examples of modifiers include tetraglycidyl-m-phenylenediamine, tetraglycidyl-1,3-diaminomethylcyclohexane, ε-caprolactone, δ-valerolactone, 4-methoxybenzophenone, γ-glycidyloxyethyltrimethoxysilane, γ-glycidyloxypropyltrimethoxysilane, γ-glycidyloxypropyldimethylphenoxysilane, bis(γ-glycidyloxypropyl)methylpropoxysilane, 1,3-dimethyl-2-imidazolidineone, 1,3-diethyl-2-imidazolidineone, N,N'-dimethylpropylurea, N-methylpyrrolidone, etc., but are not limited to the above.
改性嵌段共聚物並無特別限定,例如可藉由如下方法獲得:藉由陰離子活性聚合,使用具有官能基之聚合起始劑或具有官能基之不飽和單體進行聚合,或者於活性末端形成官能基,或者使含有官能基之改性劑進行加成反應。 作為其他方法,可藉由如下方法獲得:使有機鋰化合物等有機鹼金屬化合物與嵌段共聚物反應(金屬化反應),使具有官能基之改性劑與加成了有機鹼金屬之嵌段聚合物進行加成反應。 其中,於後者之方法之情形時,亦可藉由在獲得氫化嵌段共聚物後進行金屬化反應,其後使改性劑反應,而製作改性氫化嵌段共聚物。 進行改性反應之溫度較佳為0~150℃,更佳為20~120℃。改性反應所需之時間根據其他條件而有所不同,較佳為24小時以內,更佳為0.1~10小時。 根據所使用之改性劑之種類,有時於使改性劑反應之階段,通常胺基等亦會變為有機金屬鹽,但於該情形時,可藉由利用水或醇等具有活性氫之化合物進行處理而轉換為胺基等。再者,於此種改性嵌段共聚物中,於改性嵌段共聚物中,亦可混合存在一部分未經改性之嵌段共聚物。Modified block copolymers are not particularly limited and can be obtained, for example, by anionic living polymerization using a polymerization initiator with functional groups or an unsaturated monomer with functional groups, or by forming functional groups at the active end, or by subjecting a modifier containing functional groups to an addition reaction. Alternatively, they can be obtained by reacting an organolithium compound or other organolithium metal compound with the block copolymer (metallization reaction), or by subjecting a modifier with functional groups to an addition reaction with a block polymer containing an organolithium metal. In the latter case, modified hydrogenated block copolymers can also be produced by performing a metallization reaction after obtaining the hydrogenated block copolymer, followed by a reaction of the modifier. The preferred temperature for the modification reaction is 0–150°C, more preferably 20–120°C. The reaction time varies depending on other conditions, but is preferably within 24 hours, more preferably 0.1–10 hours. Depending on the type of modifier used, sometimes during the reaction stage, amine groups may also be converted into organometallic salts. In such cases, these groups can be converted back to amine groups by treatment with compounds containing active hydrogen, such as water or alcohol. Furthermore, in this type of modified block copolymer, a portion of unmodified block copolymer may also be mixed in.
又,上述改性嵌段共聚物亦可為二次改性嵌段共聚物。二次改性嵌段共聚物可藉由使與該改性嵌段共聚物之官能基具有反應性之二次改性劑和改性嵌段共聚物反應所獲得。 作為二次改性劑,例如可例舉具有選自羧基、酸酐基、異氰酸基、環氧基、矽烷醇基、烷氧基矽烷基中之官能基之改性劑,但並不限定於以上,較佳為具有至少2個選自該等官能基中之官能基者。 其中,於官能基為酸酐基之情形時,亦可為具備1個酸酐基者。Furthermore, the aforementioned modified block copolymer can also be a secondary modified block copolymer. A secondary modified block copolymer can be obtained by reacting a secondary modifier that is reactive with the functional groups of the modified block copolymer and the modified block copolymer. Examples of secondary modifiers include those having functional groups selected from carboxyl, anhydride, isocyanate, epoxy, silanol, and alkoxysilyl groups, but are not limited to these. Preferably, it has at least two functional groups selected from these functional groups. In the case where the functional group is an anhydride group, it may also have one anhydride group.
如上所述,於使二次改性劑與改性嵌段共聚物反應之情形時,相對於鍵結於改性嵌段共聚物之官能基每1當量,二次改性劑之使用量較佳為0.3~10莫耳,更佳為0.4~5莫耳,進而較佳為0.5~4莫耳。 關於使改性嵌段共聚物與二次改性劑反應之方法,可應用公知之方法,並無特別限定。例如可例舉下述熔融混練方法、或者使各成分溶解或分散混合於溶劑等中並使其反應之方法等。再者,該等二次改性較佳為於氫化步驟後進行。As described above, when reacting the secondary modifier with the modified block copolymer, the amount of secondary modifier used is preferably 0.3 to 10 mol, more preferably 0.4 to 5 mol, and even more preferably 0.5 to 4 mol, relative to one equivalent of the functional groups bonded to the modified block copolymer. The method for reacting the modified block copolymer with the secondary modifier can be any known method and is not particularly limited. Examples include the melt-mixing method described below, or methods of dissolving or dispersing the components in a solvent and then reacting them. Furthermore, such secondary modification is preferably performed after the hydrogenation step.
作為二次改性劑,例如可例舉:順丁烯二酸酐、均苯四甲酸二酐、1,2,4,5-苯四羧酸二酐、甲苯基二異氰酸酯、四縮水甘油基-1,3-二胺基甲基環己烷、雙-(3-三乙氧基矽烷基丙基)-四硫化物等作為適宜者,但並不限定於以上。As secondary modifiers, examples include: maleic anhydride, pyromellitic dianhydride, 1,2,4,5-benzenetetracarboxylic acid dianhydride, toluene diisocyanate, tetraglycidyl-1,3-diaminomethylcyclohexane, bis-(3-triethoxysilylpropyl)-tetrasulfide, etc., but are not limited to the above.
又,本實施方式之氫化嵌段共聚物(甲)可設為利用α,β-不飽和羧酸或其衍生物,例如其酸酐、酯化物、醯胺化物、醯亞胺化物進行接枝改性而成之改性嵌段共聚物。 作為α,β-不飽和羧酸或其衍生物,例如可例舉:順丁烯二酸酐、順丁烯二酸酐醯亞胺、丙烯酸或其酯、甲基丙烯酸或其酯、內-順-雙環[2,2,1]-5-庚烯-2,3-二羧酸或其酸酐等,但並不限定於以上。 α,β-不飽和羧酸或其衍生物之加成量相對於氫化嵌段共聚物(甲)每100質量份,較佳為0.01~20質量份,更佳為0.1~10質量份。 進行接枝改性之情形時之反應溫度較佳為100~300℃,更佳為120~280℃。 作為接枝改性之方法,並無特別限定,例如可應用日本專利特開昭62-79211號公報中所記載之方法。Furthermore, the hydrogenated block copolymer (A) of this embodiment may be a modified block copolymer obtained by grafting modification with α,β-unsaturated carboxylic acids or their derivatives, such as their anhydrides, esters, amides, and amides. Examples of α,β-unsaturated carboxylic acids or their derivatives include, for example, maleic anhydride, maleic anhydride amide, acrylic acid or its esters, methacrylic acid or its esters, intra-cis-bicyclo[2,2,1]-5-heptene-2,3-dicarboxylic acid or its anhydrides, but it is not limited to the above. The amount of α,β-unsaturated carboxylic acids or their derivatives added relative to 100 parts by weight of the hydrogenated block copolymer (A) is preferably 0.01 to 20 parts by weight, more preferably 0.1 to 10 parts by weight. The reaction temperature for graft modification is preferably 100–300°C, and more preferably 120–280°C. There are no particular limitations on the method of graft modification; for example, the method described in Japanese Patent Application Publication No. 62-79211 may be used.
(氫化反應步驟) 本實施方式之氫化嵌段共聚物(甲)可藉由如下方法獲得:使用規定之氫化觸媒,將如上所述之非氫化之非改性或改性嵌段共聚物供於氫化反應。 作為氫化觸媒,並無特別限定,例如可例舉公知之觸媒,即(1)使Ni、Pt、Pd、Ru等金屬擔載於碳、二氧化矽、氧化鋁、矽藻土等而成之擔載型非均相氫化觸媒;(2)使用Ni、Co、Fe、Cr等之有機酸鹽或乙醯丙酮鹽等過渡金屬鹽與有機鋁等還原劑之所謂齊格勒型氫化觸媒;(3)Ti、Ru、Rh、Zr等之有機金屬化合物等所謂有機金屬錯合物等均相氫化觸媒。 又,作為氫化觸媒,例如亦可使用日本專利特公昭42-8704號公報、日本專利特公昭43-6636號公報、日本專利特公昭63-4841號公報、日本專利特公平1-37970號公報、日本專利特公平1-53851號公報、日本專利特公平2-9041號公報中所記載之氫化觸媒,但並不限定於以上。 作為適宜之氫化觸媒,可例舉:二茂鈦化合物、還原性有機金屬化合物、或該等之混合物。 作為二茂鈦化合物,例如可使用日本專利特開平8-109219號公報中所記載之化合物,但並不限定於以上。具體而言,可例舉:雙環戊二烯基二氯化鈦、單五甲基環戊二烯基三氯化鈦等具有至少1個以上之具有(取代)環戊二烯基骨架、茚基骨架、或茀基骨架之配位基之化合物。 作為還原性有機金屬化合物,例如可例舉:有機鋰等有機鹼金屬化合物、有機鎂化合物、有機鋁化合物、有機硼化合物、或有機鋅化合物等,但並不限定於以上。(Hydrogenation reaction steps) The hydrogenated block copolymer (A) of this embodiment can be obtained by the following method: using a specified hydrogenation catalyst, the non-hydrogenated unmodified or modified block copolymer as described above is fed into a hydrogenation reaction. There are no particular limitations on what constitutes a hydrogenation catalyst. For example, known catalysts include (1) supported heterogeneous hydrogenation catalysts in which metals such as Ni, Pt, Pd, and Ru are supported on carbon, silica, alumina, diatomaceous earth, etc.; (2) so-called Ziegler-type hydrogenation catalysts in which transition metal salts such as organic acids and salts of Ni, Co, Fe, and Cr or acetone salts and reducing agents such as organoaluminum are used; and (3) so-called homogeneous hydrogenation catalysts in which organometallic compounds such as Ti, Ru, Rh, and Zr are used. Furthermore, as a hydrogenation catalyst, for example, the hydrogenation catalysts described in Japanese Patent Publication Nos. 42-8704, 43-6636, 63-4841, 1-37970, 1-53851, and 2-9041 may be used, but are not limited to the above. Suitable hydrogenation catalysts include, for example, titanium diacene compounds, reducing organometallic compounds, or mixtures thereof. As a titanium diacene compound, for example, the compound described in Japanese Patent Application Publication No. 8-109219 may be used, but is not limited to the above. Specifically, examples include compounds such as dicyclopentadienyl titanium dichloride and monopentamethylcyclopentadienyl titanium trichloride, which have at least one ligand with a (substituted) cyclopentadienyl, indyl, or fumonisinyl skeleton. Reducing organometallic compounds include, but are not limited to, organolithic compounds such as organolithium, organomagnesium compounds, organoaluminum compounds, organoboron compounds, or organozinc compounds.
對氫化反應進行說明。 反應溫度通常較佳為0~200℃之溫度範圍,更佳為30~150℃之溫度範圍。 氫化反應中所使用之氫之壓力較佳為0.1~15 MPa,更佳為0.2~10 MPa,進而較佳為0.3~5 MPa。 氫化反應時間通常較佳為3分鐘~10小時,更佳為10分鐘~5小時。 氫化反應可為分批製程、連續製程、或該等之組合中之任一種。 較佳為視需要自經過氫化反應經所獲得之氫化嵌段共聚物之溶液中去除觸媒殘渣,並將氫化嵌段共聚物自溶液中分離。 作為分離方法,例如可例舉:於氫化後之反應液中添加丙酮或醇等對氫化改性共聚物而言為不良溶劑之極性溶劑,使聚合物沉澱並回收之方法;將反應液於攪拌下投入至熱水中,藉由蒸汽汽提去除溶劑並回收之方法;直接加熱聚合物溶液而將溶劑蒸餾去除之方法等,但並不限定於以上。The hydrogenation reaction is described below. The reaction temperature is preferably in the range of 0–200°C, more preferably in the range of 30–150°C. The pressure of the hydrogen used in the hydrogenation reaction is preferably 0.1–15 MPa, more preferably 0.2–10 MPa, and further preferably 0.3–5 MPa. The hydrogenation reaction time is preferably 3 minutes to 10 hours, more preferably 10 minutes to 5 hours. The hydrogenation reaction can be a batch process, a continuous process, or any combination thereof. Preferably, catalyst residues are removed from the solution of the hydrogenated block copolymer obtained after the hydrogenation reaction, and the hydrogenated block copolymer is separated from the solution, as needed. Examples of separation methods include: adding polar solvents such as acetone or alcohol, which are unsuitable solvents for hydrogenated modified copolymers, to the hydrogenated reaction solution to precipitate and recover the polymer; adding the reaction solution to hot water under stirring to remove and recover the solvent by steam stripping; and directly heating the polymer solution to remove the solvent by distillation, etc., but are not limited to the above.
再者,於本實施方式之氫化嵌段共聚物(甲)中亦可添加各種酚系穩定劑、磷系穩定劑、硫系穩定劑、胺系穩定劑等穩定劑。Furthermore, various phenolic stabilizers, phosphorus stabilizers, sulfur stabilizers, amine stabilizers, and other stabilizers can also be added to the hydrogenated block copolymer (A) of this embodiment.
[氫化嵌段共聚物組合物] 本實施方式之氫化嵌段共聚物組合物含有氫化嵌段共聚物(甲)、烯烴系樹脂(乙)、熱塑性樹脂(丙)、及軟化劑(丁)。 本實施方式之氫化嵌段共聚物組合物含有本實施方式之(甲)氫化嵌段共聚物:1質量%以上且50質量%以下、至少一種(乙)烯烴系樹脂:5質量%以上且90質量%以下、至少一種熱塑性樹脂(丙):1質量%以上且50質量%以下、及至少一種軟化劑(丁):5質量%以上且90質量%以下。[Hydrogenated Block Copolymer Composition] The hydrogenated block copolymer composition of this embodiment contains a hydrogenated block copolymer (A), an olefinic resin (B), a thermoplastic resin (C), and a softener (D). The hydrogenated block copolymer composition of this embodiment contains (A) hydrogenated block copolymer: 1% or more and 50% or less by mass, at least one (B) olefinic resin: 5% or more and 90% or less by mass, at least one thermoplastic resin (C): 1% or more and 50% or less by mass, and at least one softener (D): 5% or more and 90% or less by mass.
((乙)烯烴系樹脂) 以下對構成本實施方式之氫化嵌段共聚物組合物之烯烴系樹脂(乙)進行說明。 作為烯烴系樹脂(乙),例如可例舉:聚乙烯(PE)、聚丙烯(PP)、1-丁烯、1-戊烯、1-己烯、3-甲基-1-丁烯、4-甲基-1-戊烯、1-辛烯等α-烯烴類之均聚物,但並不限定於以上。又,可例舉:包含選自乙烯、丙烯、丁烯、戊烯、己烯、辛烯等中之烯烴之組合之無規共聚物、或嵌段共聚物。 具體而言,可例舉:乙烯-丙烯共聚物、乙烯-1-丁烯共聚物、乙烯-3-甲基-1-丁烯共聚物、乙烯-4-甲基-1-戊烯共聚物、乙烯-1-己烯共聚物、乙烯-1-辛烯共聚物、乙烯-1-癸烯共聚物、丙烯-1-丁烯共聚物、丙烯-1-己烯共聚物、丙烯-1-辛烯共聚物、丙烯-4-甲基-1-戊烯共聚物、乙烯-丙烯-1-丁烯共聚物、丙烯-1-己烯-乙烯共聚物、丙烯-1-辛烯-乙烯共聚物等乙烯及/或丙烯-α-烯烴共聚物。 又,作為與乙烯及/或丙烯之共聚物,亦包含與其他不飽和單體之共聚物。 作為上述與其他不飽和單體之共聚物,例如可例舉:乙烯及/或丙烯與丙烯酸、甲基丙烯酸、順丁烯二酸、伊康酸、丙烯酸甲酯、甲基丙烯酸甲酯、順丁烯二酸酐、芳基順丁烯二醯亞胺、烷基順丁烯二醯亞胺等不飽和有機酸或其衍生物之共聚物;乙烯及/或丙烯與乙酸乙烯酯等乙烯酯類之共聚物;進而乙烯及/或丙烯與二環戊二烯、4-亞乙基-2-降𦯉烯、4-甲基-1,4-己二烯、5-甲基-1,4-己二烯等非共軛二烯等之共聚物,但並不限定於以上。 從經濟性、或使本實施方式之氫化嵌段共聚物組合物中之相溶性變得良好而獲得較高之透明性的觀點出發,(乙)烯烴系樹脂較佳為包含至少一種聚丙烯系樹脂。(B) Olefin Resins) The following describes olefin resin (B) constituting the hydrogenated block copolymer composition of this embodiment. Examples of olefin resin (B) include homopolymers of α-olefins such as polyethylene (PE), polypropylene (PP), 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 4-methyl-1-pentene, and 1-octene, but it is not limited to these. Examples of olefin resin (B) include random copolymers or block copolymers containing combinations of olefins selected from ethylene, propylene, butene, pentene, hexene, and octene. Specifically, examples include: ethylene-propylene copolymers, ethylene-1-butene copolymers, ethylene-3-methyl-1-butene copolymers, ethylene-4-methyl-1-pentene copolymers, ethylene-1-hexene copolymers, ethylene-1-octene copolymers, ethylene-1-decene copolymers, propylene-1-butene copolymers, propylene-1-hexene copolymers, propylene-1-octene copolymers, propylene-4-methyl-1-pentene copolymers, ethylene-propylene-1-butene copolymers, propylene-1-hexene-ethylene copolymers, propylene-1-octene-ethylene copolymers, and other ethylene and/or propylene-α-olefin copolymers. Furthermore, copolymers with ethylene and/or propylene also include copolymers with other unsaturated monomers. Examples of copolymers of the above with other unsaturated monomers include: copolymers of ethylene and/or propylene with unsaturated organic acids or their derivatives such as acrylic acid, methacrylic acid, maleic acid, itaconic acid, methyl acrylate, methyl methacrylate, maleic anhydride, aryl maleic anhydride, and alkyl maleic anhydride; copolymers of ethylene and/or propylene with vinyl acetate and other vinyl esters; and further copolymers of ethylene and/or propylene with non-conjugated dienes such as dicyclopentadiene, 4-ethylidene-2-norphene, 4-methyl-1,4-hexadiene, and 5-methyl-1,4-hexadiene, but not limited to the above. From the viewpoint of economic efficiency, or to improve the compatibility of the hydrogenated block copolymer composition of the present embodiment and obtain higher transparency, the (ethylene) hydrocarbon resin preferably contains at least one polypropylene resin.
又,烯烴系樹脂(乙)亦可為利用規定之官能基改性而成者。 作為官能基,並無特別限定,例如可例舉:環氧基、羧基、酸酐基、羥基等。 作為用以使烯烴系樹脂(乙)改性之含官能基之化合物或改性劑,並無特別限定,例如可例舉下述化合物。 例如可例舉:甲基丙烯酸縮水甘油酯、丙烯酸縮水甘油酯、乙烯基縮水甘油醚、烯丙基縮水甘油醚等不飽和環氧化物;或順丁烯二酸、反丁烯二酸、伊康酸、檸康酸、烯丙基琥珀酸、順丁烯二酸酐、反丁烯二酸酐、伊康酸酐等不飽和有機酸等。除此以外,並無特別限定,例如可例舉離子聚合物、氯化聚烯烴等。Furthermore, olefinic resin (B) can also be modified using specified functional groups. There are no particular limitations on the functional groups; examples include epoxy groups, carboxyl groups, anhydride groups, and hydroxyl groups. There are also no particular limitations on the functional group-containing compounds or modifiers used to modify olefinic resin (B); examples include unsaturated epoxides such as glycidyl methacrylate, glycidyl acrylate, vinyl glycidyl ether, and allyl glycidyl ether; or unsaturated organic acids such as maleic acid, fumaric acid, itaconic acid, leuconic acid, allyl succinic acid, maleic anhydride, fumaric anhydride, and itaconic anhydride. Apart from this, there are no particular limitations; examples include ionic polymers and chlorinated polyolefins.
從經濟性、或使本實施方式之氫化嵌段共聚物組合物中之相溶性變得良好而獲得較高之透明性的觀點出發,烯烴系樹脂(乙)較佳為聚丙烯均聚物、乙烯-丙烯之無規或嵌段共聚物等聚丙烯系樹脂。 尤其是就透明性、柔軟性之觀點而言,更佳為乙烯-丙烯之無規共聚物。 烯烴系樹脂(乙)可包含僅一種之單獨之材料,亦可為併用兩種以上者。From the viewpoint of economic efficiency, or to improve the compatibility of the hydrogenated block copolymer composition of this embodiment and obtain higher transparency, the olefinic resin (B) is preferably a polypropylene homopolymer, a random or block copolymer of ethylene and propylene, or other polypropylene-based resins. In particular, from the viewpoint of transparency and flexibility, a random copolymer of ethylene and propylene is more preferred. The olefinic resin (B) may contain only one type of material or may contain two or more types.
本實施方式之氫化嵌段共聚物組合物含有氫化嵌段共聚物(甲)、及至少一種烯烴系樹脂(乙),氫化嵌段共聚物(甲)之含量較佳為1質量%以上且50質量%以下,更佳為1質量%以上且45質量%以下,進而較佳為5質量%以上且40質量%以下。 若氫化嵌段共聚物(甲)之含量為1質量%以上,則有氫化嵌段共聚物組合物之耐磨耗性提高,硬度降低之傾向。另一方面,若氫化嵌段共聚物(甲)之含量為50質量%以下,則有本實施方式之氫化嵌段共聚物組合物之耐油性提高之傾向。 又,從本實施方式之氫化嵌段共聚物組合物之機械強度之觀點出發,烯烴系樹脂(乙)之含量為5質量%以上,從氫化嵌段共聚物組合物之低溫特性之觀點出發為90質量%以下。較佳為7質量%以上且85質量%以下,更佳為10質量%以上且80質量%以下。The hydrogenated block copolymer composition of this embodiment contains a hydrogenated block copolymer (A) and at least one olefinic resin (B). The content of hydrogenated block copolymer (A) is preferably 1% by mass or more and 50% by mass or less, more preferably 1% by mass or more and 45% by mass or less, and even more preferably 5% by mass or more and 40% by mass or less. If the content of hydrogenated block copolymer (A) is 1% by mass or more, the wear resistance of the hydrogenated block copolymer composition tends to increase, and the hardness tends to decrease. On the other hand, if the content of hydrogenated block copolymer (A) is 50% by mass or less, the oil resistance of the hydrogenated block copolymer composition of this embodiment tends to increase. Furthermore, from the viewpoint of the mechanical strength of the hydrogenated block copolymer composition of this embodiment, the content of olefinic resin (ethyl) is 5% by mass or more, and from the viewpoint of the low-temperature characteristics of the hydrogenated block copolymer composition, it is 90% by mass or less. Preferably, it is 7% by mass or more and 85% by mass or less, and more preferably, it is 10% by mass or more and 80% by mass or less.
本實施方式之氫化嵌段共聚物組合物除了上述本實施方式之氫化嵌段共聚物(甲)、聚烯烴系樹脂(乙)以外,還含有至少一種熱塑性樹脂(丙)1質量%以上且50質量%以下、至少一種軟化劑(丁)5質量%以上且90質量%以下。除此以外,亦可調配改質劑、添加劑等。In addition to the hydrogenated block copolymer (A) and polyolefin resin (B) of this embodiment, the hydrogenated block copolymer composition also contains at least 1% to 50% by mass of at least one thermoplastic resin (C) and at least 5% to 90% by mass of at least one softener (D). Modifiers, additives, etc., may also be formulated.
上述軟化劑(丁)使本實施方式之氫化嵌段共聚物組合物柔軟化,且賦予流動性(成形加工性)。 作為軟化劑,例如可應用礦物油或液狀或者低分子量之合成軟化劑,但並不限定於以上,尤其適宜為環烷系及/或石蠟系之加工處理油或增量油。 礦物油系之軟化劑為芳香族環、環烷環及石蠟鏈之混合物,石蠟鏈之碳數占全部碳之50%以上者被稱為石蠟系,環烷環之碳數為30~45%者被稱為環烷系,又,芳香族碳數超過30%者被稱為芳香族系。 作為合成軟化劑,例如可使用聚丁烯、低分子量聚丁二烯、液態石蠟等,但更佳為上述礦物油系軟化劑。 於對本實施方式之氫化嵌段共聚物組合物要求較高之耐熱性、機械物性之情形時,所應用之礦物油系之軟化劑於40℃之動黏度較佳為60 cst以上,更佳為120 cst以上。 軟化劑可僅單獨使用一種,亦可併用兩種以上。The aforementioned softener (D) softens the hydrogenated block copolymer composition of this embodiment and imparts fluidity (processability). As a softener, for example, mineral oil or liquid or low molecular weight synthetic softeners can be used, but are not limited to the above; particularly suitable are naphthenic and/or paraffinic processing oils or extender oils. Mineral oil-based softeners are mixtures of aromatic rings, cycloalkane rings, and paraffin chains. Those with paraffin chains comprising more than 50% of the total carbon are called paraffinic; those with cycloalkane rings comprising 30-45% of the total carbon are called cycloalkane; and those with aromatic carbons exceeding 30% are called aromatic. As a synthetic softener, for example, polybutene, low molecular weight polybutadiene, liquid paraffin, etc., can be used, but mineral oil-based softeners are preferred. When high heat resistance and mechanical properties are required for the hydrogenated block copolymer composition of this embodiment, the applied mineral oil-based softener preferably has a kinematic viscosity of 60 cst or higher at 40°C, more preferably 120 cst or higher. One type of softener may be used alone, or two or more may be used in combination.
上述改質劑設為提高本實施方式之氫化嵌段共聚物組合物表面之耐損傷性,或者具有改良黏著性之功能者。 作為改質劑,例如可應用有機聚矽氧烷,但並不限定於以上。其發揮氫化嵌段共聚物組合物之表面改質效果,且作為耐磨耗性改善助劑而發揮功能。 作為改質劑之形態,可為低黏度之液狀~高黏度之液狀物、固體狀中之任一種,從確保於本實施方式之氫化嵌段共聚物組合物中之良好之分散性的觀點出發,適宜為液狀物,即矽油。進而關於改質劑之動黏度,從抑制聚矽氧烷本身之滲出之觀點出發,較佳為90 cst以上,更佳為1000 cst以上。作為聚矽氧烷,例如可例舉:二甲基聚矽氧烷、甲基苯基聚矽氧烷等通用矽油;或烷基改性、聚醚改性、氟改性、醇改性、胺基改性、環氧改性等各種改性矽油,但並不限定於以上。就作為耐磨耗性改善助劑之效果較高之方面而言,適宜為二甲基聚矽氧烷,但並無特別限制。 該等改質劑可僅單獨使用一種,亦可併用兩種以上。The aforementioned modifier is intended to improve the surface damage resistance of the hydrogenated block copolymer composition of this embodiment, or to improve adhesion. As a modifier, for example, organopolysiloxanes can be used, but are not limited to the above. It exerts a surface modification effect on the hydrogenated block copolymer composition and functions as an abrasion resistance improving agent. The form of the modifier can be any of low-viscosity liquid to high-viscosity liquid, or solid. From the viewpoint of ensuring good dispersibility in the hydrogenated block copolymer composition of this embodiment, a liquid, i.e., silicone oil, is suitable. Regarding the kinematic viscosity of the modifier, from the viewpoint of suppressing the seepage of the polysiloxane itself, it is preferably 90 cst or higher, and more preferably 1000 cst or higher. Examples of polysiloxanes include, for example, general-purpose silicone oils such as dimethyl polysiloxane and methylphenyl polysiloxane; or various modified silicone oils such as alkyl-modified, polyether-modified, fluorinated, alcohol-modified, amino-modified, and epoxy-modified, but not limited to these. Dimethyl polysiloxane is suitable for its superior effect as a wear resistance improving agent, but there are no particular limitations. One of these modifiers may be used alone, or two or more may be used in combination.
作為添加劑,只要係填充劑、潤滑劑、離型劑、塑化劑、抗氧化劑、熱穩定劑、光穩定劑、紫外線吸收劑、阻燃劑、防靜電劑、補強劑、著色劑、熱塑性樹脂或橡膠狀聚合物之調配中通常所使用者,則並無特別限制。 作為填充劑,例如可例舉:二氧化矽、滑石、雲母、矽酸鈣、鋁碳酸鎂、高嶺土、矽藻土、石墨、碳酸鈣、碳酸鎂、氫氧化鎂、氫氧化鋁、硫酸鈣、硫酸鋇等無機填充劑;碳黑等有機填充劑,但並不限定於以上。 作為潤滑劑,例如可例舉:硬脂酸、山萮酸、硬脂酸鋅、硬脂酸鈣、硬脂酸鎂、伸乙基雙硬脂醯胺等,但並不限定於以上。 作為塑化劑,例如可例舉有機聚矽氧烷、礦物油等,但並不限定於以上。 作為抗氧化劑,例如可例舉受阻酚系抗氧化劑,但並不限定於以上。 作為熱穩定劑,例如可例舉:磷系、硫系及胺系熱穩定劑等,但並不限定於以上。 作為光穩定劑,例如可例舉受阻胺系光穩定劑,但並不限定於以上。 作為紫外線吸收劑,例如可例舉苯并三唑系紫外線吸收劑,但並不限定於以上。 作為補強劑,例如可例舉:有機纖維、玻璃纖維、碳纖維、金屬晶鬚等,但並不限定於以上。 作為著色劑,例如可例舉:氧化鈦、氧化鐵、碳黑等,但並不限定於以上。 除此以外,可例舉於「橡膠、塑膠調配藥品」(Rubber Digest公司編)等中所記載者。As an additive, there are no particular restrictions as long as it is commonly used in the formulation of fillers, lubricants, release agents, plasticizers, antioxidants, heat stabilizers, light stabilizers, ultraviolet absorbers, flame retardants, antistatic agents, reinforcing agents, colorants, or thermoplastic resins or rubber-like polymers. Examples of fillers include, for instance, inorganic fillers such as silica, talc, mica, calcium silicate, magnesium aluminum carbonate, kaolin, diatomaceous earth, graphite, calcium carbonate, magnesium carbonate, magnesium hydroxide, aluminum hydroxide, calcium sulfate, and barium sulfate; and organic fillers such as carbon black, but are not limited to these. Examples of lubricants include stearic acid, benzyl acid, zinc stearate, calcium stearate, magnesium stearate, and ethyl bis-stearamide, but are not limited to these. Examples of plasticizers include organopolysiloxanes and mineral oils, but are not limited to these. Examples of antioxidants include hindered phenolic antioxidants, but are not limited to these. Examples of heat stabilizers include phosphorus-based, sulfur-based, and amine-based heat stabilizers, but are not limited to these. Examples of light stabilizers include hindered amine-based light stabilizers, but are not limited to these. As ultraviolet absorbers, examples include benzotriazole ultraviolet absorbers, but are not limited to the above. As reinforcing agents, examples include organic fibers, glass fibers, carbon fibers, and metal fibers, but are not limited to the above. As coloring agents, examples include titanium oxide, iron oxide, and carbon black, but are not limited to the above. In addition, examples can be found in "Rubber and Plastic Compounds" (published by Rubber Digest Co., Ltd.).
((丙)熱塑性樹脂) 作為上述熱塑性樹脂(丙),例如可例舉:共軛二烯化合物與乙烯基芳香族化合物之嵌段共聚物及其氫化物(但不同於上述本實施方式之氫化嵌段共聚物(甲));上述乙烯基芳香族化合物之聚合物;上述乙烯基芳香族化合物與其他乙烯基單體例如乙烯、丙烯、丁烯、氯乙烯、偏二氯乙烯、乙酸乙烯酯、丙烯酸及丙烯酸甲酯等丙烯酸酯、甲基丙烯酸及甲基丙烯酸甲酯等甲基丙烯酸酯、丙烯腈、甲基丙烯腈等之共聚樹脂;橡膠改性苯乙烯系樹脂(HIPS);丙烯腈-丁二烯-苯乙烯共聚樹脂(ABS);甲基丙烯酸酯-丁二烯-苯乙烯共聚樹脂(MBS)等,但並不限定於以上。(C) Thermoplastic Resins Examples of the above-mentioned thermoplastic resins (C) include: block copolymers of conjugated diene compounds and vinyl aromatic compounds and their hydrogenates (but different from the hydrogenated block copolymers (A) of the present embodiment); polymers of the above-mentioned vinyl aromatic compounds; copolymers of the above-mentioned vinyl aromatic compounds with other vinyl monomers such as ethylene, propylene, butene, vinyl chloride, vinylidene chloride, vinyl acetate, acrylic acid and methyl acrylate, methacrylate and methyl methacrylate, acrylonitrile, methacrylonitrile, etc.; rubber-modified styrene resins (HIPS); acrylonitrile-butadiene-styrene copolymers (ABS); methacrylate-butadiene-styrene copolymers (MBS), etc., but are not limited to the above.
又,作為上述(丙)熱塑性樹脂,例如可例舉:聚乙烯;含有50質量%以上之乙烯之乙烯共聚物,例如乙烯-丙烯共聚物、乙烯-丁烯共聚物、乙烯-己烯共聚物、乙烯-辛烯共聚物、乙烯-乙酸乙烯酯共聚物及其水解物;乙烯-丙烯酸離子聚合物或氯化聚乙烯等聚乙烯系樹脂;聚丙烯;含有50質量%以上之丙烯之丙烯共聚物,例如丙烯-乙烯共聚物、丙烯-丙烯酸乙酯共聚物;或氯化聚丙烯等聚丙烯系樹脂;乙烯-降𦯉烯樹脂等環狀烯烴系樹脂;聚丁烯系樹脂;聚氯乙烯系樹脂;聚乙酸乙烯酯系樹脂及其水解物等,但並不限定於以上。Furthermore, examples of the above-mentioned (C) thermoplastic resins include: polyethylene; ethylene copolymers containing 50% by mass or more of ethylene, such as ethylene-propylene copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, ethylene-octene copolymers, ethylene-vinyl acetate copolymers and their hydrolysates; polyethylene-based resins such as ethylene-acrylate ionic polymers or chlorinated polyethylene; polypropylene; propylene copolymers containing 50% by mass or more of propylene, such as propylene-ethylene copolymers, propylene-ethyl acrylate copolymers; or polypropylene-based resins such as chlorinated polypropylene; cyclic olefin resins such as ethylene-norphene resins; polybutene-based resins; polyvinyl chloride-based resins; polyvinyl acetate-based resins and their hydrolysates, but are not limited to the above.
又,作為(丙)熱塑性樹脂,例如可例舉:丙烯酸及其酯或醯胺之聚合物;聚丙烯酸酯系樹脂;丙烯腈及/或甲基丙烯腈之聚合物;含有50質量%以上之該等丙烯腈系單體之與其他能夠共聚之單體的共聚物,即腈樹脂;尼龍-46、尼龍-6、尼龍-66、尼龍-610、尼龍-11、尼龍-12、尼龍-6尼龍-12共聚物等聚醯胺系樹脂;聚酯系樹脂;熱塑性聚胺基甲酸酯系樹脂;聚-4,4'-二氧基二苯基-2,2'-丙烷碳酸酯等聚碳酸酯系聚合物;聚醚碸或聚烯丙基碸等熱塑性聚碸;聚甲醛系樹脂;聚(2,6-二甲基-1,4-伸苯基)醚等聚苯醚系樹脂;聚苯硫醚、聚4,4'-二苯硫醚等聚苯硫醚系樹脂;聚芳酯系樹脂;聚醚酮聚合物或共聚物;聚酮系樹脂;氟系樹脂;聚氧苯甲醯基系聚合物;聚醯亞胺系樹脂;1,2-聚丁二烯、反式-聚丁二烯等聚丁二烯系樹脂等,但並不限定於以上。Furthermore, examples of (c) thermoplastic resins include: polymers of acrylic acid and its esters or amides; polyacrylate resins; polymers of acrylonitrile and/or methacrylonitrile; copolymers containing 50% by mass or more of these acrylonitrile monomers with other copolymerizable monomers, i.e., nitrile resins; polyamide resins such as nylon-46, nylon-6, nylon-66, nylon-610, nylon-11, nylon-12, and nylon-6/nylon-12 copolymers; polyester resins; thermoplastic polyurethane resins; poly-4,4'-dioxanone... Polycarbonate polymers such as diphenyl-2,2'-propane carbonate; thermoplastic polyurethanes such as polyether ether or polyallyl ether; polyoxymethylene resins; polyphenylene ether resins such as poly(2,6-dimethyl-1,4-phenylene) ether; polyphenylene sulfide resins such as polyphenylene sulfide and poly4,4'-diphenylene sulfide; polyaryl ester resins; polyetherketone polymers or copolymers; polyketide resins; fluorinated resins; polyoxybenzoyl polymers; polyimide resins; 1,2-polybutadiene, trans-polybutadiene and other polybutadiene resins, etc., but not limited to the above.
上述熱塑性樹脂(丙)之中,尤佳為聚苯乙烯、橡膠改性苯乙烯系樹脂等苯乙烯系樹脂;聚乙烯;乙烯-丙烯共聚物、乙烯-丁烯共聚物、乙烯-己烯共聚物、乙烯-辛烯共聚物、乙烯-乙酸乙烯酯系共聚物、乙烯-丙烯酸酯系共聚物、乙烯-甲基丙烯酸酯系共聚物等聚乙烯系聚合物;聚丙烯;丙烯-乙烯共聚物等聚丙烯系樹;聚醯胺系樹脂;聚酯系樹脂;聚碳酸酯系樹脂。該等熱塑性樹脂(丙)之數量平均分子量通常為1000以上,較佳為5000~500萬,更佳為1萬~100萬。Among the aforementioned thermoplastic resins (propylene), styrene-based resins such as polystyrene and rubber-modified styrene resins are particularly preferred; polyethylene; polyethylene-based polymers such as ethylene-propylene copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, ethylene-octene copolymers, ethylene-vinyl acetate copolymers, ethylene-acrylate copolymers, and ethylene-methacrylate copolymers; polypropylene; polypropylene-based resins such as propylene-ethylene copolymers; polyamide resins; polyester resins; and polycarbonate resins. The number average molecular weight of these thermoplastic resins (propylene) is typically 1000 or more, preferably 50 million to 5 million, and more preferably 10,000 to 1 million.
於本實施方式之氫化嵌段共聚物組合物中,從機械強度之觀點出發,熱塑性樹脂(丙)之含量設為1質量%以上,從耐油性之觀點出發,設為50質量%以下。較佳為3質量%以上且47質量%以下,更佳為5質量%以上且45質量%以下。 又,於將上述成分(甲)及(丙)之合計量設為100質量份之情形時,成分(丙)之含量較佳為2~150質量份,更佳為2~140質量份,進而較佳為2~130質量份。In the hydrogenated block copolymer composition of this embodiment, from the viewpoint of mechanical strength, the content of thermoplastic resin (propylene) is set to 1% by mass or more, and from the viewpoint of oil resistance, it is set to 50% by mass or less. Preferably, it is 3% by mass or more and 47% by mass or less, more preferably 5% by mass or more and 45% by mass or less. Furthermore, when the total amount of the above-mentioned components (a) and (c) is set to 100 parts by mass, the content of component (c) is preferably 2 to 150 parts by mass, more preferably 2 to 140 parts by mass, and even more preferably 2 to 130 parts by mass.
((丁)軟化劑) 其次,對構成本實施方式之氫化嵌段共聚物組合物之軟化劑(丁)進行說明。 軟化劑(丁)較佳為使氫化嵌段共聚物組合物柔軟化,並且賦予加工性之橡膠用軟化劑。 作為軟化劑(丁),例如可例舉:礦物油、或液狀或低分子量之合成軟化劑,但並不限定於以上,其中,較佳為環烷系及/或石蠟系之加工處理油或增量油。 礦物油系軟化劑為芳香族環、環烷環及石蠟鏈之混合物,石蠟鏈之碳數占全部碳之50%以上者被稱為石蠟系,環烷環之碳數為30~45%者被稱為環烷系,又,芳香族碳數超過30%者被稱為芳香族系。 於本實施方式之氫化嵌段共聚物組合物中可使用合成軟化劑,並無特別限定,例如可使用聚丁烯、低分子量聚丁二烯、液態石蠟等。其中,較佳為上述礦物油系橡膠用軟化劑。(D) Softener) Next, the softener (D) constituting the hydrogenated block copolymer composition of this embodiment will be explained. The softener (D) is preferably a rubber softener that softens the hydrogenated block copolymer composition and imparts processability. Examples of softeners (D) include, for example, mineral oils, or liquid or low molecular weight synthetic softeners, but are not limited to the above. Preferably, it is a naphthenic and/or paraffinic processing oil or a bulking oil. Mineral oil-based softeners are mixtures of aromatic rings, cycloalkane rings, and paraffin chains. Those with paraffin chains comprising more than 50% of the total carbon are called paraffin-based softeners, those with cycloalkane rings comprising 30-45% of the total carbon are called cycloalkane-based softeners, and those with aromatic carbons comprising more than 30% are called aromatic-based softeners. Synthetic softeners can be used in the hydrogenated block copolymer compositions of this embodiment without particular limitation; for example, polybutene, low molecular weight polybutadiene, and liquid paraffin can be used. Preferably, the aforementioned mineral oil-based softener for rubber is preferred.
於本實施方式之氫化嵌段共聚物組合物中,從表面觸感之觀點出發,軟化劑(丁)之含量設為5質量%以上,從抑制滲出之觀點出發,設為90質量%以下。較佳為7質量%以上且85質量%以下,更佳為10質量%以上且80質量%以下。 又,於將成分(甲)及(乙)之合計量設為100質量份之情形時,成分(丁)之含量較佳為2~150質量份,更佳為2~130質量份,進而較佳為2~100質量份。若軟化劑(丁)之含量為上述上限值以下,則可抑制滲出,表面觸感變得良好。In the hydrogenated block copolymer composition of this embodiment, from the viewpoint of surface feel, the content of softener (D) is set to 5% by mass or more, and from the viewpoint of inhibiting exudation, it is set to 90% by mass or less. Preferably, it is 7% by mass or more and 85% by mass or less, more preferably 10% by mass or more and 80% by mass or less. Furthermore, when the total amount of components (A) and (B) is set to 100 parts by mass, the content of component (D) is preferably 2 to 150 parts by mass, more preferably 2 to 130 parts by mass, and even more preferably 2 to 100 parts by mass. If the content of softener (D) is below the above-mentioned upper limit, exudation can be inhibited, and the surface feel becomes good.
於本實施方式之氫化嵌段共聚物組合物中,除了上述成分(甲)、(乙)、(丙)、及(丁)以外,視需要可任意地調配添加劑。 添加劑之種類只要係熱塑性樹脂或橡膠狀聚合物之調配中通常所使用者,則並無特別限制。In the hydrogenated block copolymer composition of this embodiment, in addition to the above-mentioned components (A), (B), (C), and (D), additives may be added as needed. There are no particular restrictions on the type of additives, as long as they are commonly used in the formulation of thermoplastic resins or rubber-like polymers.
本實施方式之氫化嵌段共聚物組合物可藉由先前公知之方法製造。 本實施方式之氫化嵌段共聚物組合物之製造方法例如可使用利用班布里混合機、單螺桿擠出機、雙螺桿擠出機、雙向捏合機、多螺桿擠出機等混合機,將各成分(上述氫化嵌段共聚物(甲)、及聚烯烴系樹脂(乙)、熱塑性樹脂(丙)、軟化劑(丁)、其他添加劑)熔融混練之方法;於將各成分溶解或分散混合後,將溶劑加熱去除之方法等,但並不限定於以上。 從生產性、優良混練性之觀點出發,尤其適宜為利用擠出機之熔融混練法。 關於氫化嵌段共聚物組合物之形狀,例如可設為顆粒狀、片狀、繩狀、小片狀等任意形狀,但並不限定於以上。又,亦可於熔融混練後,直接製作成形品。The hydrogenated block copolymer composition of this embodiment can be manufactured by previously known methods. Methods for manufacturing the hydrogenated block copolymer composition of this embodiment include, for example, using a Bainbury mixer, single-screw extruder, twin-screw extruder, biaxial kneader, multi-screw extruder, etc., to melt-mix the components (the aforementioned hydrogenated block copolymer (A), polyolefin resin (B), thermoplastic resin (C), softener (D), and other additives); or methods for removing the solvent by heating after dissolving or dispersing the components, etc., but are not limited to the above. From the viewpoint of productivity and excellent mixing properties, melt mixing using an extruder is particularly suitable. Regarding the shape of the hydrogenated block copolymer composition, it can be any shape, such as granules, flakes, ropes, small pieces, etc., but is not limited to the above. Also, it can be directly made into molded products after melt mixing.
(補強性填充劑及補強性填充劑調配物) 藉由在本實施方式之氫化嵌段共聚物或上述氫化嵌段共聚物組合物(以下,有時記載為成分(A))中,調配選自二氧化矽系無機填充劑、金屬氧化物、金屬氫氧化物、金屬碳酸化物、碳黑中之至少一種補強性填充劑(以下,有時記載為成分(C)),可製備補強性填充劑調配物。 相對於本實施方式之氫化嵌段共聚物或上述氫化嵌段共聚物組合物(成分(A))100質量份,補強性填充劑調配物中之成分(C)之含量較佳為0.5~100質量份,更佳為5~100質量份,進而較佳為20~80質量份。 於使用本實施方式之氫化嵌段共聚物或上述氫化嵌段共聚物組合物(成分(A))製備上述補強性填充劑調配物之情形時,較佳為相對於成分(A)100質量份,進而包含0~500質量份、較佳為5~300質量份、更佳為10~200質量份之不同於上述本實施方式之氫化嵌段共聚物及上述烯烴系樹脂(乙)及上述熱塑性樹脂(丙)之熱塑性樹脂及/或橡膠狀聚合物(以下,有時記載為成分(B))。(Reinforcing filler and reinforcing filler formulation) A reinforcing filler formulation can be prepared by incorporating at least one reinforcing filler selected from silica-based inorganic fillers, metal oxides, metal hydroxides, metal carbonates and carbon black (hereinafter sometimes referred to as component (C)) into the hydrogenated block copolymer or the above-mentioned hydrogenated block copolymer composition (hereinafter sometimes referred to as component (A)). Relative to 100 parts by weight of the hydrogenated block copolymer or the above-mentioned hydrogenated block copolymer composition (component (A)) of this embodiment, the content of component (C) in the reinforcing filler formulation is preferably 0.5 to 100 parts by weight, more preferably 5 to 100 parts by weight, and even more preferably 20 to 80 parts by weight. When preparing the reinforcing filler formulation using the hydrogenated block copolymer of this embodiment or the hydrogenated block copolymer composition (component (A)), it is preferable to include 0 to 500 parts by weight, more preferably 5 to 300 parts by weight, and even more preferably 10 to 200 parts by weight of a thermoplastic resin and/or rubber polymer (hereinafter sometimes referred to as component (B)) that is different from the hydrogenated block copolymer of this embodiment, the olefinic resin (B), and the thermoplastic resin (C) of the above embodiment.
(不同於成分(乙)、成分(丙)之熱塑性樹脂及/或橡膠狀聚合物) 作為上述熱塑性樹脂及/或橡膠狀聚合物(成分(B)),例如可例舉:乙烯基芳香族單體單元含量超過60質量%之共軛二烯單體與乙烯基芳香族單體之嵌段共聚樹脂及其氫化物(但不同於本實施方式之(A)氫化嵌段共聚物);上述乙烯基芳香族化合物之聚合物;上述乙烯基芳香族化合物與其他乙烯系化合物(例如乙烯、丙烯、丁烯、氯乙烯、偏二氯乙烯、乙酸乙烯酯、丙烯酸及丙烯酸甲酯等丙烯酸酯、甲基丙烯酸及甲基丙烯酸甲酯等甲基丙烯酸酯、丙烯腈、甲基丙烯腈等)之共聚樹脂;橡膠改性苯乙烯系樹脂(HIPS);丙烯腈-丁二烯-苯乙烯共聚樹脂(ABS);甲基丙烯酸酯-丁二烯-苯乙烯共聚樹脂(MBS);聚乙烯;乙烯-丙烯共聚物、乙烯-丁烯共聚物、乙烯-己烯共聚物、乙烯-辛烯共聚物、乙烯-乙酸乙烯酯共聚物及其水解物等包含乙烯與其他能夠共聚之單體之乙烯含量為50質量%以上之共聚物;乙烯-丙烯酸離子聚合物或氯化聚乙烯等聚乙烯系樹脂;聚丙烯;丙烯-乙烯共聚物、丙烯-丙烯酸乙酯共聚物或氯化聚丙烯等聚丙烯系樹脂、乙烯-降𦯉烯樹脂等環狀烯烴系樹脂、聚丁烯系樹脂、聚氯乙烯系樹脂、聚乙酸乙烯酯系樹脂及其水解物等包含丙烯與其他能夠共聚之單體之丙烯含量為50質量%以上之共聚物;丙烯酸及其酯或醯胺之聚合物;聚丙烯酸酯系樹脂;丙烯腈及/或甲基丙烯腈之聚合物;包含丙烯腈系單體與其他能夠共聚之單體之丙烯腈系單體含量為50質量%以上之共聚物,即腈樹脂;尼龍-46、尼龍-6、尼龍-66、尼龍-610、尼龍-11、尼龍-12、尼龍-6、尼龍-12共聚物等聚醯胺系樹脂;聚酯系樹脂;熱塑性聚胺基甲酸酯系樹脂;聚-4,4'-二氧基二苯基-2,2'-丙烷碳酸酯等聚碳酸酯系聚合物;聚醚碸或聚烯丙基碸等熱塑性聚碸;聚甲醛系樹脂;聚(2,6-二甲基-1,4-伸苯基)醚等聚苯醚系樹脂;聚苯硫醚、聚4,4'-二苯硫醚等聚苯硫醚系樹脂;聚芳酯系樹脂;聚醚酮聚合物或共聚物;聚酮系樹脂;氟系樹脂;聚氧苯甲醯基系聚合物;聚醯亞胺系樹脂;1,2-聚丁二烯、反式-聚丁二烯等聚丁二烯系樹脂等,但並不限定於以上。 該等成分(B)亦可為鍵結有羥基、環氧基、胺基、羧酸基、酸酐基等含極性基之原子團者。(Different from components (B) and (C) thermoplastic resins and/or rubber polymers) Examples of the aforementioned thermoplastic resins and/or rubber polymers (component (B)) include: block copolymers of conjugated diene monomers and vinyl aromatic monomers with a vinyl aromatic monomer content exceeding 60% by mass, and their hydroxides (but different from the hydrogenated block copolymers of embodiment (A)); polymers of the aforementioned vinyl aromatic compounds; copolymers of the aforementioned vinyl aromatic compounds with other vinyl compounds (e.g., ethylene, propylene, butene, vinyl chloride, vinylidene chloride, vinyl acetate, acrylates such as acrylic acid and methyl acrylate, methacrylates such as methacrylic acid and methyl methacrylate, acrylonitrile, methacrylonitrile, etc.). Polyesters; rubber-modified styrene resins (HIPS); acrylonitrile-butadiene-styrene copolymers (ABS); methacrylate-butadiene-styrene copolymers (MBS); polyethylene; ethylene-propylene copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, ethylene-octene copolymers, ethylene-vinyl acetate copolymers and their hydrolysates, etc., containing ethylene and other copolymerizable monomers with an ethylene content of 50% by mass or more; polyethylene-based resins such as ethylene-acrylate ionic polymers or chlorinated polyethylene; polypropylene; polypropylene-based resins such as propylene-ethylene copolymers, propylene-ethyl acrylate copolymers, or chlorinated polypropylene. Cyclic olefin resins such as ethylene-norphene resins, polybutene resins, polyvinyl chloride resins, polyvinyl acetate resins and their hydrolysates, etc., containing propylene and other copolymerizable monomers with a propylene content of 50% by mass or more; polymers of acrylic acid and its esters or amides; polyacrylate resins; polymers of acrylonitrile and/or methacrylonitrile; copolymers containing acrylonitrile monomers and other copolymerizable monomers with a content of acrylonitrile monomers of 50% by mass or more, i.e., acrylonitrile resins; nylon-46, nylon-6, nylon-66, nylon-610, nylon-11, nylon-12, nylon-6, nylon-12 copolymers, etc. Acrylamide resins; polyester resins; thermoplastic polyurethane resins; polycarbonate polymers such as poly-4,4'-dioxydiphenyl-2,2'-propane carbonate; thermoplastic polyurethanes such as polyether sulfide or polyallyl sulfide; polyoxymethylene resins; polyphenylene ether resins such as poly(2,6-dimethyl-1,4-phenylene) ether; polyphenylene sulfide resins such as polyphenylene sulfide and poly-4,4'-diphenylene sulfide; polyaryl ester resins; polyetherketone polymers or copolymers; polyketide resins; fluorinated resins; polyoxybenzoyl polymers; polyimide resins; polybutadiene resins such as 1,2-polybutadiene and trans-polybutadiene, etc., but not limited to the above. These components (B) may also be groups containing polar groups such as hydroxyl, epoxy, amino, carboxylic acid, and anhydride groups.
可用作上述補強性填充劑(成分(C))之二氧化矽系無機填充劑係將化學式SiO2作為結構單元之主成分之固體粒子,例如可例舉:二氧化矽、黏土、滑石、高嶺土、雲母、矽灰石、蒙脫石、沸石、玻璃纖維等無機纖維狀物質等,但並不限定於以上。又,亦可使用對表面進行疏水化而成之二氧化矽系無機填充劑、或二氧化矽系無機填充劑與二氧化矽系以外之無機填充劑之混合物。作為二氧化矽系無機填充劑,較佳為二氧化矽及玻璃纖維。作為二氧化矽,可使用被稱為乾式法白碳、濕式法白碳、合成矽酸鹽系白碳、膠體二氧化矽者等。 二氧化矽系無機填充劑較佳為平均粒徑為0.01~150 μm者,二氧化矽系無機填充劑分散於補強性填充劑調配物中,為了充分地發揮其添加效果,平均分散粒徑較佳為0.05~1 μm,更佳為0.05~0.5 μm。The silica-based inorganic filler that can be used as the reinforcing filler (component (C)) is a solid particle with SiO2 as the main component of the structural unit. Examples include silica, clay, talc, kaolin, mica, wollastonite, montmorillonite, zeolite, glass fiber, and other inorganic fibrous materials, but it is not limited to these. Furthermore, silica-based inorganic fillers that have been hydrophobized on their surface, or mixtures of silica-based inorganic fillers and inorganic fillers other than silica-based fillers, can also be used. Silica and glass fiber are preferred as silica-based inorganic fillers. As for silica, it can be known as dry-process white carbon, wet-process white carbon, synthetic silicate-based white carbon, colloidal silica, etc. The silica-based inorganic filler preferably has an average particle size of 0.01–150 μm. When the silica-based inorganic filler is dispersed in a reinforcing filler formulation, to fully exert its additive effect, the average dispersed particle size is preferably 0.05–1 μm, more preferably 0.05–0.5 μm.
可用作上述補強性填充劑(成分(C))之金屬氧化物係將化學式MxOy(M為金屬原子,x、y分別為1~6之整數)作為結構單元之主成分之固體粒子,例如可例舉:氧化鋁、氧化鈦、氧化鎂、氧化鋅等。又,作為補強性填充劑,亦可使用金屬氧化物與除金屬氧化物以外之無機填充劑之混合物。 作為用作補強性填充劑之金屬氫氧化物,例如可例舉:氫氧化鋁、氫氧化鎂、氫氧化鋯、水合矽酸鋁、水合矽酸鎂、鹼性碳酸鎂、水滑石、氫氧化鈣、氫氧化鋇、氧化錫之水合物、硼砂等無機金屬化合物之水合物等水合系無機填充材,但並不限定於以上,尤佳為氫氧化鎂與氫氧化鋁。 作為用作補強性填充劑之金屬碳酸化物,例如可例舉碳酸鈣、碳酸鎂等,但並不限定於以上。 又,作為補強性填充劑,例如可使用FT(Fine Thermal,細粒子熱裂法爐黑)、SRF(Semi-reinforcing Furnace,半補強爐黑)、FEF(Fast Extruding Furnace,快壓出爐黑)、HAF(High Abrasion Furnace,高耐磨爐黑)、ISAF(Intermediate Super Abrasion Furnace,中超耐磨爐黑)、SAF(Super Abrasion Furnace,超耐磨爐黑)等各等級之碳黑,尤佳為氮吸附比表面積為50 mg/g以上、且DBP(鄰苯二甲酸二丁酯)吸油量為80 mL/100 g以上之碳黑。The metal oxide that can be used as the reinforcing filler (component (C)) is a solid particle with the chemical formula MxOy (where M is a metal atom, and x and y are integers from 1 to 6) as the main component of the structural unit. Examples include aluminum oxide, titanium oxide, magnesium oxide, and zinc oxide. Furthermore, a mixture of metal oxide and inorganic fillers other than metal oxides can also be used as a reinforcing filler. Examples of metallic hydroxides used as reinforcing fillers include: aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, hydrated aluminum silicate, hydrated magnesium silicate, alkaline magnesium carbonate, hydrotalcite, calcium hydroxide, barium hydroxide, tin oxide hydrate, borax, and other hydrated inorganic metal compounds, but are not limited to the above. Magnesium hydroxide and aluminum hydroxide are particularly preferred. Examples of metallic carbonates used as reinforcing fillers include calcium carbonate and magnesium carbonate, but are not limited to the above. Furthermore, as a reinforcing filler, various grades of carbon black such as FT (Fine Thermal), SRF (Semi-reinforcing Furnace), FEF (Fast Extruding Furnace), HAF (High Abrasion Furnace), ISAF (Intermediate Super Abrasion Furnace), and SAF (Super Abrasion Furnace) can be used. Carbon black with a nitrogen adsorption specific surface area of 50 mg/g or more and a DBP (dibutyl phthalate) oil absorption of 80 mL/100 g or more can be used.
於使用本實施方式之氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物(成分(A))之補強性填充劑調配物中,亦可調配矽烷偶合劑(以下,有時記載為成分(D))。 矽烷偶合劑(D)係用以使本實施方式之氫化嵌段共聚物(甲)與上述補強性填充劑(C)之相互作用變得緊密者,係具有對氫化嵌段共聚物(甲)與補強性填充劑(C)中之一者或兩者為親和性或鍵結性之基之化合物。 作為較佳之矽烷偶合劑(D),例如可例舉2個以上之巰基及/或硫與矽烷醇基或烷氧基矽烷一同連結而成之具有多硫鍵者,但並不限定於以上。具體而言,可例舉:雙-[3-(三乙氧基矽烷基)-丙基]-四硫化物、雙-[3-(三乙氧基矽烷基)-丙基]-二硫化物、雙-[2-(三乙氧基矽烷基)-乙基]-四硫化物、3-巰基丙基-三甲氧基矽烷、3-三乙氧基矽烷基丙基-N,N-二甲硫基胺甲醯基四硫化物、3-三乙氧基矽烷基丙基苯并噻唑四硫化物等。 從獲得目標之作用效果之觀點出發,矽烷偶合劑(D)之調配量相對於補強性填充劑調配物較佳為0.1~30質量%,更佳為0.5~20質量%,進而較佳為1~15質量%。In the reinforcing filler formulation of the hydrogenated block copolymer (A) or hydrogenated block copolymer composition (component (A)) using the present embodiment, a silane coupling agent (hereinafter sometimes referred to as component (D)) may also be formulated. The silane coupling agent (D) is a compound having a group that is affinity or binding to one or both of the hydrogenated block copolymer (A) and the reinforcing filler (C) to make the interaction between the hydrogenated block copolymer (A) of the present embodiment and the reinforcing filler (C) tighter. Preferred silane coupling agents (D) include, for example, those with polysulfide bonds formed by linking two or more syl groups and/or sulfur groups with silanol or alkoxysilane groups, but are not limited to the above. Specifically, examples include: bis-[3-(triethoxysilyl)-propyl]-tetrasulfide, bis-[3-(triethoxysilyl)-propyl]-disulfide, bis-[2-(triethoxysilyl)-ethyl]-tetrasulfide, 3-sylpropyl-trimethoxysilane, 3-triethoxysilylpropyl-N,N-dimethylthioaminomethyltetrasulfide, 3-triethoxysilylpropylbenzothiazole tetrasulfide, etc. From the perspective of achieving the desired effect, the amount of silane coupling agent (D) relative to the reinforcing filler formulation is preferably 0.1 to 30% by mass, more preferably 0.5 to 20% by mass, and even more preferably 1 to 15% by mass.
含有本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物與補強性填充劑之補強性填充劑調配物可利用硫化劑進行硫化,即進行交聯而形成為硫化組合物。 作為硫化劑,可例舉:有機過氧化物及偶氮化合物等自由基產生劑、肟化合物、亞硝基化合物、聚胺化合物、硫、硫化合物(一氯化硫、二氯化硫、二硫醚化合物、高分子聚硫化合物等。 硫化劑之使用量通常相對於氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物100質量份為0.01~20質量份,較佳為0.1~15質量份之比率。 作為用作硫化劑之有機過氧化物(以下,有時記載為成分(E)),從臭氣性或焦化穩定性(於各成分之混合時之條件下不會交聯,但於設為交聯反應條件時會迅速交聯之特性)之觀點出發,例如可例舉:2,5-二甲基-2,5-二-(過氧化第三丁基)己烷、2,5-二甲基-2,5-二-(過氧化第三丁基)己炔-3、1,3-雙(過氧化第三丁基異丙基)苯、1,1-雙(過氧化第三丁基)-3,3,5-三甲基環己烷、4,4-雙(過氧化第三丁基)戊酸正丁酯、過氧化二第三丁基作為較佳者,但並不限定於以上。 除上述以外,例如亦可使用過氧化二異丙苯、過氧化苯甲醯、過氧化對氯苯甲醯、過氧化2,4-二氯苯甲醯、過氧化苯甲酸第三丁酯、過氧化苯甲酸第三丁酯、過氧化異丙基碳酸第三丁酯、過氧化二乙醯、過氧化月桂醯、過氧化第三丁基異丙苯基等。The hydrogenated block copolymer (A) of this embodiment, or the reinforcing filler formulation of the above-mentioned hydrogenated block copolymer composition and reinforcing filler, can be vulcanized using a vulcanizing agent, i.e., crosslinked to form a vulcanized composition. Examples of vulcanizing agents include: free radical generators such as organic peroxides and azo compounds, oxime compounds, nitroso compounds, polyamine compounds, sulfur, and sulfur compounds (sulfur monochloride, sulfur dichloride, disulfide compounds, high-molecular-weight polysulfide compounds, etc.). The amount of vulcanizing agent used is typically 0.01 to 20 parts by weight, preferably 0.1 to 15 parts by weight, relative to 100 parts by weight of the hydrogenated block copolymer (A) or the above-mentioned hydrogenated block copolymer composition. As an organic peroxide (hereinafter sometimes referred to as component (E)) used as a sulfiding agent, from the viewpoint of odor or coking stability (the characteristic that it does not crosslink under mixed conditions, but crosslinks rapidly under crosslinking reaction conditions), for example, 2,5-dimethyl-2,5-di-(tert-butylperoxide)hexane, 2,5-dimethyl-2,5-di-(tert-butylperoxide)hexyn-3, 1,3-bis(tert-butylperoxide isopropyl)benzene, 1,1-bis(tert-butylperoxide)-3,3,5-trimethylcyclohexane, 4,4-bis(tert-butylperoxide)valerate n-butyl ester, and ditert-butylperoxide are preferred, but not limited to the above. In addition to the above, other alternatives may include dicumyl peroxide, benzoyl peroxide, p-chlorobenzoyl peroxide, 2,4-dichlorobenzoyl peroxide, tert-butyl peroxide, tert-butyl peroxide, tert-butyl peroxyisopropyl carbonate, diacetyl peroxide, lauryl peroxide, and tert-butylisopropylphenyl peroxide.
又,硫化時,作為硫化加速劑(以下,有時記載為成分(F)),亦能夠以視需要之量使用亞磺醯胺系、胍系、秋蘭姆系、醛-胺系、醛-氨系、噻唑系、硫脲系、二硫代胺基甲酸酯系化合物等。 又,作為硫化助劑,亦能夠以視需要之量使用鋅白、硬脂酸等。 又,於使用有機過氧化物作為上述硫化劑而使補強性填充劑調配物交聯時,尤其亦可與作為上述硫化劑之有機過氧化物併用如下成分:對醌二肟、對,對'-二苯甲醯醌二肟、N-甲基-N-4-二亞硝基苯胺、亞硝基苯、二苯基胍、三羥甲基丙烷-N,N'-間伸苯基二順丁烯二醯亞胺等過氧化交聯用助劑(以下,有時記載為成分(G));二乙烯苯、氰尿酸三烯丙酯、乙二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、聚乙二醇二甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、甲基丙烯酸烯丙酯等多官能性甲基丙烯酸酯單體;丁酸乙烯酯、硬脂酸乙烯酯等多官能性乙烯基單體(以下,有時記載為成分(H))等。 此種硫化加速劑(F)、過氧化交聯用助劑(G)、多官能性乙烯基單體(H)通常係相對於氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物(成分(A))100質量份,以較佳為0.01~20質量份、更佳為0.1~15質量份之比率使用。 作為利用硫化劑使補強性填充劑調配物硫化之方法,可應用先前實施之方法,例如於120~200℃,較佳為140~180℃之溫度下硫化。硫化後之補強性填充劑調配物於硫化物之狀態下發揮出耐熱性、耐撓曲性或耐油性。Furthermore, during vulcanization, as vulcanization accelerators (hereinafter sometimes referred to as component (F)), sulfinamide, guanidine, thiuram, aldehyde-amine, aldehyde-amine, thiazole, thiourea, and dithiocarbamate compounds may be used in appropriate amounts as needed. Also, as vulcanization aids, zinc oxide and stearic acid may be used in appropriate amounts as needed. Furthermore, when using organic peroxides as the aforementioned vulcanizing agent to crosslink reinforcing filler formulations, the following components may also be used in conjunction with the organic peroxides used as the aforementioned vulcanizing agent: p-quinone dioxime, p,p'-dibenzoquinone dioxime, N-methyl-N-4-dinitrosoaniline, nitrosobenzene, diphenylguanidine, trihydroxymethylpropane-N,N'-m-phenyldicis-butene diimidimide, and other peroxide crosslinking auxiliaries. Hereinafter, sometimes referred to as component (G); divinylbenzene, triallyl cyanurate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, allyl methacrylate and other multifunctional methacrylate monomers; vinyl butyrate, vinyl stearate and other multifunctional vinyl monomers (hereinafter, sometimes referred to as component (H)). This vulcanization accelerator (F), peroxidation crosslinking aid (G), and multifunctional vinyl monomer (H) are usually used at a ratio of 0.01 to 20 parts by weight, more preferably 0.1 to 15 parts by weight, relative to 100 parts by weight of the hydrogenated block copolymer (A) or the above-mentioned hydrogenated block copolymer composition (component (A)). As a method for curing reinforcing filler formulations using a vulcanizing agent, previously implemented methods can be applied, such as curing at a temperature of 120–200°C, preferably 140–180°C. The cured reinforcing filler formulation exhibits heat resistance, flexural strength, or oil resistance in the vulcanized state.
為了改良使用上述本實施方式之氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物之補強性填充劑調配物之加工性,亦可進而調配軟化劑(以下,有時記載為成分(I))。即,除了構成氫化嵌段共聚物組合物之軟化劑(丁)以外,可進而以所需之量調配軟化劑。 軟化劑中較適合為礦物油、或液狀或者低分子量之合成軟化劑。其中,通常較佳為用於橡膠之軟化、增容、加工性提高之環烷系及/或石蠟系之加工處理油或增量油。 礦物油系軟化劑為芳香族環、環烷環及石蠟鏈之混合物,石蠟鏈之碳數占全部碳之50%以上者被稱為石蠟系,環烷環之碳數為30~45%者被稱為環烷系,又,芳香族碳數超過30%者被稱為芳香族系。 於上述補強性填充劑調配物中可使用合成軟化劑,可使用聚丁烯、低分子量聚丁二烯、液態石蠟等。然而,較佳為上述礦物油系軟化劑。 相對於氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物(成分(A))100質量份,補強性填充劑調配物中之軟化劑(成分(I))之調配量較佳為0~100質量份,更佳為1~90質量份,進而較佳為30~90質量份。若軟化劑之量超過100質量份,則容易產生滲出,有於組合物表面產生黏膩之虞。To improve the processability of the hydrogenated block copolymer (A) or the reinforcing filler formulation of the hydrogenated block copolymer composition using the present embodiment described above, a softener (hereinafter sometimes referred to as component (I)) may also be formulated. That is, in addition to the softener (D) constituting the hydrogenated block copolymer composition, a softener may be formulated in the required amount. Mineral oil, liquid, or low molecular weight synthetic softener are more suitable. Generally, naphthenic and/or paraffinic processing oils or extender oils used for softening, compatibilizing, and improving the processability of rubber are preferred. Mineral oil-based softeners are mixtures of aromatic rings, cycloalkane rings, and paraffin chains. Those with paraffin chains comprising more than 50% of the total carbon are called paraffin-based softeners, those with cycloalkane rings comprising 30-45% of the total carbon are called cycloalkane-based softeners, and those with aromatic carbons comprising more than 30% are called aromatic-based softeners. Synthetic softeners can be used in the above-mentioned reinforcing filler formulations, such as polybutene, low molecular weight polybutadiene, and liquid paraffin. However, the above-mentioned mineral oil-based softeners are preferred. The amount of softener (component (I)) in the reinforcing filler formulation is preferably 0 to 100 parts by weight relative to 100 parts by weight of the hydrogenated block copolymer (A) or the aforementioned hydrogenated block copolymer composition (component (A)), more preferably 1 to 90 parts by weight, and even more preferably 30 to 90 parts by weight. If the amount of softener exceeds 100 parts by weight, it is easy to seep out, which may cause stickiness on the surface of the composition.
包含本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物之補強性填充劑調配物可適宜地用作建築材料、電線被覆材或制振材料等。又,其硫化物利用該特徵而適於輪胎用途或抗振橡膠、皮帶、工業用品、鞋類、發泡體等之材料。The hydrogenated block copolymer (A) of this embodiment or the reinforcing filler formulation of the above-mentioned hydrogenated block copolymer composition can be suitably used as building materials, wire sheathing materials, or vibration damping materials. Furthermore, its sulfides, utilizing this characteristic, are suitable for tire applications or as materials for vibration-damping rubber, belts, industrial products, footwear, foams, etc.
(交聯物) 本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物可於硫化劑之存在下交聯,形成為交聯物,即交聯氫化嵌段共聚物或交聯氫化嵌段共聚物組合物。 藉由使本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物交聯,可提高耐熱性[高溫C-Set(compression set,壓縮永久變形)]或耐撓曲性。 於製備含有本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物之上述補強性填充劑調配物之交聯物之情形時,尤其是氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物(成分(A))、與不同於上述烯烴系樹脂(乙)或上述熱塑性樹脂(丙)之熱塑性樹脂及/或橡膠狀聚合物(成分(B))之調配比率以成分(A)/成分(B)之質量比率計,較佳為10/90~100/0,更佳為20/80~90/10,進而較佳為30/70~80/20。(Crosslinked Compound) The hydrogenated block copolymer (A) of this embodiment or the above-mentioned hydrogenated block copolymer composition can be crosslinked in the presence of a vulcanizing agent to form a crosslinked compound, namely a crosslinked hydrogenated block copolymer or a crosslinked hydrogenated block copolymer composition. By crosslinking the hydrogenated block copolymer (A) of this embodiment or the above-mentioned hydrogenated block copolymer composition, heat resistance [high-temperature C-Set (compression set)] or flexural resistance can be improved. In the preparation of crosslinks containing the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition of the present embodiment and the reinforcing filler formulation thereof, especially in the case of the mixing ratio of the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition (component (A)) and the thermoplastic resin and/or rubber polymer (component (B)) different from the above-mentioned olefinic resin (B) or the above-mentioned thermoplastic resin (C) by mass ratio of component (A) to component (B), it is preferably 10/90 to 100/0, more preferably 20/80 to 90/10, and even more preferably 30/70 to 80/20.
於使本實施方式之氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物交聯之情形時,交聯方法並無特別限定,較佳為進行所謂「動態交聯」。 動態交聯係藉由使各種調配物於熔融狀態下,於硫化劑反應之溫度條件下混練,同時產生分散與交聯之方法,且詳細地記載於A. Y. Coran等人之文獻(Rub. Chem. and Technol. vol. 53.141 - (1980))中。 動態交聯通常係使用如班布里混合機或加壓式捏合機之密閉式混練機、或單軸或雙軸擠出機等來進行。混練溫度通常為130~300℃,較佳為150~250℃,混練時間通常為1~30分鐘。 作為動態交聯中所使用之硫化劑,可適宜地使用有機過氧化物或酚樹脂交聯劑,其使用量通常相對於氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物(成分(A))100質量份為0.01~15質量份,較佳為0.04~10質量份。 作為用作硫化劑之有機過氧化物,可使用上述成分(E)。於使用有機過氧化物進行交聯時,可使用上述成分(F)作為硫化加速劑,又,亦可併用上述成分(G):過氧化交聯用助劑或上述成分(H):多官能性乙烯基單體等。該等硫化加速劑之使用量通常相對於氫化嵌段共聚物或氫化嵌段共聚物組合物(成分(A))100質量份為0.01~20質量份,較佳為0.1~15質量份。When crosslinking the hydrogenated block copolymer (A) or hydrogenated block copolymer composition of this embodiment, the crosslinking method is not particularly limited, but so-called "dynamic crosslinking" is preferred. Dynamic crosslinking is a method that simultaneously disperses and crosslinks various formulations by mixing them in a molten state at the temperature conditions of the vulcanizing agent reaction, and is described in detail in the literature of A. Y. Coran et al. (Rub. Chem. and Technol. vol. 53.141 - (1980)). Dynamic crosslinking is usually carried out using a closed mixer such as a Bamboo mixer or a pressure kneader, or a single-shaft or bi-shaft extruder. The mixing temperature is typically 130–300°C, preferably 150–250°C, and the mixing time is typically 1–30 minutes. As a vulcanizing agent used in dynamic crosslinking, an organic peroxide or phenolic resin crosslinking agent can be appropriately used. The amount used is typically 0.01–15 parts by weight, preferably 0.04–10 parts by weight, relative to 100 parts by weight of the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition (component (A)). As an organic peroxide used as a vulcanizing agent, component (E) can be used. When using an organic peroxide for crosslinking, component (F) can be used as a vulcanization accelerator. Alternatively, component (G): a peroxide crosslinking auxiliary agent, or component (H): a multifunctional vinyl monomer, can also be used concurrently. The amount of such vulcanization accelerators used is typically 0.01 to 20 parts by weight relative to 100 parts by weight of the hydrogenated block copolymer or the hydrogenated block copolymer composition (component (A)), preferably 0.1 to 15 parts by weight.
於使用本實施方式之氫化嵌段共聚物或氫化嵌段共聚物組合物(成分(A))之交聯物中,可於不損害其目的之範圍內視需要調配軟化劑、耐熱穩定劑、防靜電劑、耐候穩定劑、抗老化劑、填充劑、著色劑、潤滑劑等添加物。作為為了控制最終製品之硬度或流動性所調配之軟化劑,可使用上述橡膠用軟化劑(I)。 軟化劑可於混練各成分時添加,亦可於氫化嵌段共聚物(甲)之製造時預先使其包含於上述氫化嵌段共聚物中,即製備充油橡膠。 製備上述交聯物時之軟化劑之添加量相對於氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物(成分(A))100質量份,通常為0~200質量份,較佳為10~150質量份,更佳為20~100質量份。 又,作為填充劑,可使用上述作為補強性填充劑之成分(C)。相對於氫化嵌段共聚物或氫化嵌段共聚物組合物(成分(A))100質量份,填充劑之添加量通常為0~200質量份,較佳為10~150質量份,更佳為20~100質量份。 上述交聯物較佳為以凝膠含量(其中,不含無機填充劑等不溶物等不溶成分)較佳為成為5~80質量%、更佳為成為10~70質量%、進而較佳為成為20~60質量%之方式進行動態交聯。關於凝膠含量,使用沸騰二甲苯利用索氏萃取器使交聯物1 g進行10小時回流,利用80目之金屬篩網對殘留物進行過濾,測定殘留於篩網上之不溶物之乾燥質量(g)而求出之不溶物相對於試樣1 g之比率(質量%),將該比率(質量%)設為凝膠含量。凝膠含量可藉由調整硫化劑之種類或量、硫化時之條件(溫度、滯留時間、佔有率等)而加以控制。 上述交聯物可與上述補強性填充劑調配物之硫化物同樣地用於輪胎用途或抗振橡膠、皮帶、工業用品、鞋類、發泡體等,進而亦可用作醫療用器具材料或食品包裝材料。In the crosslinks of the hydrogenated block copolymers or combinations of hydrogenated block copolymers (component (A)) using this embodiment, additives such as softeners, heat stabilizers, antistatic agents, weather stabilizers, anti-aging agents, fillers, colorants, and lubricants may be formulated as needed, without impairing their purpose. As a softener formulated to control the hardness or flowability of the final product, the aforementioned rubber softener (I) may be used. The softener may be added during the mixing of the components, or it may be pre-included in the hydrogenated block copolymer (A) during its manufacture, thereby preparing oil-extended rubber. The amount of softener added during the preparation of the above-mentioned crosslinks is typically 0 to 200 parts by weight relative to 100 parts by weight of the hydrogenated block copolymer (A) or the hydrogenated block copolymer composition (component (A)), preferably 10 to 150 parts by weight, and even more preferably 20 to 100 parts by weight. Furthermore, as a filler, component (C) as a reinforcing filler can be used. The amount of filler added is typically 0 to 200 parts by weight relative to 100 parts by weight of the hydrogenated block copolymer or the hydrogenated block copolymer composition (component (A)), preferably 10 to 150 parts by weight, and even more preferably 20 to 100 parts by weight. The aforementioned crosslinks are preferably dynamically crosslinked with a gel content (excluding insoluble components such as inorganic fillers) preferably of 5-80% by mass, more preferably of 10-70% by mass, and even more preferably of 20-60% by mass. Regarding the gel content, 1 g of the crosslinks is refluxed for 10 hours using a Soxhlet extractor with boiling xylene. The residue is filtered through an 80-mesh metal sieve, and the ratio (mass %) of the dried mass (g) of the insoluble residue remaining on the sieve to 1 g of the sample is determined. This ratio (mass %) is set as the gel content. The gel content can be controlled by adjusting the type or amount of vulcanizing agent and the vulcanization conditions (temperature, residence time, occupancy, etc.). The aforementioned crosslinks can be used in tire applications or vibration-damping rubber, belts, industrial products, footwear, foams, etc., just like the vulcanized products of the aforementioned reinforcing filler formulations. Furthermore, they can also be used as materials for medical devices or food packaging materials.
[使用氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物之成形體] 本實施方式之成形體為本實施方式之氫化嵌段共聚物(甲)或氫化嵌段共聚物組合物之成形體,可藉由使上述本實施方式之氫化嵌段共聚物(甲)或上述氫化嵌段共聚物組合物成形所獲得。 上述成形體例如可藉由擠出成形、射出成形、雙色射出成形、夾層成形、中空成形、壓縮成形、真空成形、旋轉成形、粉末凝塑成形、發泡成形、積層成形、壓延成形、吹塑成形等而製造。 作為上述成形體,例如可例舉:片材、膜、各種形狀之射出成形體、中空成形體、壓空成形體、真空成形體、擠出成形體、發泡成形體、不織布或纖維狀之成形體、合成皮革等多種多樣之成形體,但並不限定於以上。 該等成形體例如可用於汽車用零件、食品包裝材料、醫療器具、家電製品構件、電子元件構件、建築材料、工業零件、家庭用品、玩具素材、鞋類用素材、纖維素材等。[Molded Article Using Hydrogenated Block Copolymer (A) or Hydrogenated Block Copolymer Composition] The molded article of this embodiment is a molded article of the hydrogenated block copolymer (A) or hydrogenated block copolymer composition of this embodiment, which can be obtained by molding the aforementioned hydrogenated block copolymer (A) or hydrogenated block copolymer composition of this embodiment. The molded article can be manufactured, for example, by extrusion molding, injection molding, two-color injection molding, sandwich molding, hollow molding, compression molding, vacuum molding, rotation molding, powder agglomeration molding, foam molding, laminated molding, calendering, blow molding, etc. Examples of molded bodies include, but are not limited to, sheets, films, injection molded bodies of various shapes, hollow molded bodies, compressed molded bodies, vacuum molded bodies, extruded molded bodies, foamed molded bodies, non-woven or fibrous molded bodies, and synthetic leather. These molded bodies can be used, for example, in automotive parts, food packaging materials, medical devices, components for home appliances, electronic components, building materials, industrial parts, household goods, toy materials, footwear materials, and fiber materials.
作為汽車用零件,例如可例舉:側飾條、墊圈、換擋把頭、密封條、窗框與其密封材、扶手、輔助握把、車門拉手、手柄、控制台盒、頭枕、儀錶板、保險桿、擾流板、氣囊蓋等,但並不限定於以上。 作為醫療器具,例如可例舉:醫療用管(tube)、醫療用軟管(hose)、導管、採血袋、輸液袋、血小板保存袋、人工透析用袋等,但並不限定於以上。 作為建築材料,例如可例舉壁材、地板材等,但並不限定於以上。 除此以外,並無特別限定,例如可例舉:工業用軟管、食品用軟管、吸塵器軟管、電冰箱密封件、電線及其他各種被覆材、握把用被覆材、軟質玩偶等。 亦可對上述成形體適當實施發泡、粉末、延伸、接著、印刷、塗裝、鍍覆等加工。 本實施方式之氫化嵌段共聚物(甲)及上述氫化嵌段共聚物組合物表現出柔軟性、低反跳彈性、透明性、耐扭結性優異之效果,故作為軟管、管等中空狀成形體之材料極有用。As automotive parts, examples include: side trim strips, gaskets, gear shift knobs, weatherstripping, window frames and their sealing materials, armrests, auxiliary grips, door handles, door handles, console boxes, headrests, instrument panels, bumpers, spoilers, airbag covers, etc., but are not limited to the above. As medical devices, examples include: medical tubes, medical hoses, catheters, blood bags, infusion bags, platelet storage bags, artificial dialysis bags, etc., but are not limited to the above. As building materials, examples include: wall materials, flooring materials, etc., but are not limited to the above. Besides these, there are no particular limitations. Examples include: industrial hoses, food hoses, vacuum cleaner hoses, refrigerator seals, wires and various other coating materials, grip coating materials, soft toys, etc. The above-mentioned molded bodies can also be appropriately processed by foaming, powdering, stretching, bonding, printing, coating, plating, etc. The hydrogenated block copolymer (A) of this embodiment and the above-mentioned hydrogenated block copolymer compositions exhibit excellent flexibility, low rebound elasticity, transparency, and kink resistance, making them extremely useful as materials for hollow molded bodies such as hoses and tubes.
其次,對使用本實施方式之氫化嵌段共聚物(甲)、氫化嵌段共聚物組合物之成形體,按目的分成[第一成形體]~[第三成形體]進行說明。Secondly, the hydrogenated block copolymer (A) and the molded articles of the hydrogenated block copolymer composition using this embodiment will be explained in terms of purpose as divided into [first molded article] to [third molded article].
[第一成形體] 作為使用本實施方式之氫化嵌段共聚物(甲)之成形體之第一態樣,可例舉實質上僅包含氫化嵌段共聚物(甲)之成形體。 「實質上僅包含氫化嵌段共聚物(甲)」係構成成形體之聚合物僅為氫化嵌段共聚物(甲)之主旨,且不為排除含有下述各種添加劑之主旨。又,不排除於不損害氫化嵌段共聚物(甲)之功能之範圍內,添加其他聚合物之態樣。可容許之其他聚合物之添加量亦取決於聚合物之結構或用途,例如於和聚丙烯等聚烯烴之樹脂組合物之情形時,大致為5質量%以下。若為與其他彈性體之樹脂組合物,則雖然亦取決於上述其他彈性體之結構,但其添加量可容許至80質量%以下。 第一成形體除適於醫療用途等中所使用之透明之管、袋以外,亦可用作構成用於保護膜之黏著性膜之黏著層,但第一成形體並不限定於上述。[First Molded Body] As a first example of a molded body using the hydrogenated block copolymer (A) of this embodiment, an example may be a molded body that substantially contains only the hydrogenated block copolymer (A). "Substantially contains only the hydrogenated block copolymer (A)" means that the polymer constituting the molded body is primarily the hydrogenated block copolymer (A), and does not exclude the inclusion of the various additives described below. Furthermore, the addition of other polymers is not excluded, provided it does not impair the function of the hydrogenated block copolymer (A). The permissible amount of other polymers added also depends on the polymer's structure or application; for example, in the case of resin compositions with polyolefins such as polypropylene, it is approximately 5% by mass or less. If it is a resin composition with other elastomers, although it also depends on the structure of the other elastomers, its addition amount is allowed to be up to 80% by mass. In addition to being suitable for transparent tubes and bags used in medical applications, the first molded body can also be used as an adhesive layer for forming an adhesive film for protective films, but the first molded body is not limited to the above.
(管) 使用本實施方式之氫化嵌段共聚物(甲)之管之透明性、柔軟性、耐扭結性、溶劑接著性、及各特性之平衡優異。 於無損本實施方式之目的之範圍內,管除了本實施方式之氫化嵌段共聚物(甲)以外,亦可進而含有其他成分。作為其他成分,例如可例舉:不同於氫化嵌段共聚物(甲)之結構之氫化共聚物(苯乙烯系熱塑性彈性體)、熱穩定劑、抗氧化劑、紫外線吸收劑、抗老化劑、塑化劑、光穩定劑、結晶成核劑、衝擊改良劑、顏料、潤滑劑、軟化劑、防靜電劑、分散劑、阻燃劑、防銅害劑、交聯劑、阻燃助劑、相容劑、及黏著性賦予劑等,但並不限定於以上。該等其他成分可僅使用一種,亦可組合使用兩種以上。(Tube) The tube using the hydrogenated block copolymer (A) of this embodiment has excellent transparency, flexibility, kink resistance, solvent adhesion, and a good balance of these properties. Without prejudice to the purpose of this embodiment, the tube may contain other components besides the hydrogenated block copolymer (A) of this embodiment. Other components may include, but are not limited to, hydrogenated copolymers (styrene-based thermoplastic elastomers) with structures different from hydrogenated block copolymer (A), thermal stabilizers, antioxidants, UV absorbers, anti-aging agents, plasticizers, light stabilizers, crystal nucleating agents, impact modifiers, pigments, lubricants, softeners, antistatic agents, dispersants, flame retardants, copper scavenging agents, crosslinking agents, flame retardant accelerants, compatibilizers, and adhesive imparters. Only one of these other components may be used, or two or more may be used in combination.
<潤滑劑> 上述管為了防止管表面彼此或內部彼此之固著,及使手感等質感變得良好,可含有潤滑劑。 作為潤滑劑,較佳為選自脂肪醯胺系潤滑劑、硬脂酸金屬鹽系潤滑劑、及脂肪酸單甘油酯系潤滑劑中之至少一種(較佳為至少兩種)之潤滑劑。 作為脂肪醯胺系潤滑劑,例如可例舉:芥酸醯胺、山萮醯胺、油醯胺、硬脂醯胺、N-硬脂基月桂醯胺、N-硬脂基硬脂醯胺、N-硬脂基山萮醯胺、N-硬脂基芥酸醯胺、N-油基油醯胺、N-油基山萮醯胺、N-月桂基芥酸醯胺、伸乙基雙油醯胺、伸乙基雙硬脂醯胺、六亞甲基雙油醯胺、六亞甲基雙芥酸醯胺等,但並不限定於以上。該等之中,較佳為芥酸醯胺、山萮醯胺、油醯胺、硬脂醯胺、及伸乙基雙硬脂醯胺,更佳為油醯胺。 作為硬脂酸金屬鹽系潤滑劑之金屬種,例如可例舉:鋅、鈉、鈣、鎂、鋰等。該等之中,較佳為硬脂酸鋅。 作為脂肪酸單甘油酯系潤滑劑,例如可例舉:月桂酸單甘油酯、肉豆蔻酸單甘油酯、棕櫚酸單甘油酯、硬脂酸單甘油酯、油酸單甘油酯、山萮酸單甘油酯等,但並不限定於以上。該等之中,較佳為硬脂酸單甘油酯。 從防止固著之觀點出發,上述管中之潤滑劑之含量較佳為0.05質量%以上,從避免潤滑劑自管內滲出而對向管表面之印刷性帶來影響之觀點出發,較佳為1.0質量%以下,更佳為0.7質量%以下。從該等觀點出發,上述管中之潤滑劑之含量較佳為0.05~1.0質量%,更佳為0.05~0.7質量%之範圍內。 脂肪醯胺系潤滑劑、硬脂酸金屬鹽系潤滑劑、及脂肪酸單甘油酯系潤滑劑分別可僅單獨使用一種,亦可併用兩種以上。其中,較佳為併用芥酸醯胺、硬脂酸鋅、及伸乙基雙硬脂醯胺,質量比較佳為芥酸醯胺/硬脂酸鋅/伸乙基雙硬脂醯胺=0.20/0.15/0.15。<Lubricant> To prevent adhesion between tube surfaces or internal parts and to improve the feel and texture, the tubes described above may contain a lubricant. Preferably, the lubricant is a lubricant selected from at least one (preferably at least two) of fatty acid amine-based lubricants, stearate metal salt-based lubricants, and fatty acid monoglyceride-based lubricants. Examples of fatty amide lubricants include: erucic acid amide, benzyl amide, oleyl amide, stearyl amide, N-stearyl lauryl amide, N-stearyl stearyl amide, N-stearyl benzyl amide, N-stearyl erucic acid amide, N-oleyl oleyl amide, N-oleyl benzyl amide, N-lauryl erucic acid amide, ethyl bisoleyl amide, ethyl bisstearyl amide, hexamethylene bisoleyl amide, hexamethylene biserucic acid amide, etc., but are not limited to the above. Among these, erucic acid amide, betaine amide, oleyl amide, stearyl amide, and ethyldistearate amide are preferred, with oleyl amide being more preferred. Examples of metals that can be used as stearic acid metal salt lubricants include, for example, zinc, sodium, calcium, magnesium, and lithium. Among these, zinc stearate is preferred. Examples of fatty acid monoglyceride lubricants include, for example, glyceryl laurate, glyceryl myristate, glyceryl palmitate, glyceryl stearate, glyceryl oleate, and glyceryl betaine, but are not limited to these. Among these, glyceryl stearate is preferred. From the viewpoint of preventing adhesion, the content of lubricant in the aforementioned tube is preferably 0.05% by mass or more. From the viewpoint of preventing lubricant from seeping out of the tube and affecting the printability of the tube surface, it is preferably 1.0% by mass or less, and more preferably 0.7% by mass or less. From these viewpoints, the content of lubricant in the aforementioned tube is preferably in the range of 0.05% to 1.0% by mass, and more preferably in the range of 0.05% to 0.7% by mass. One type of fatty amide lubricant, stearate metal salt lubricant, and fatty acid monoglyceride lubricant may be used alone, or two or more may be used in combination. The preferred method is to use erucic acid amine, zinc stearate, and ethyl bis-stearic acid amine in combination, with a preferred mass ratio of erucic acid amine/zinc stearate/ethyl bis-stearic acid amine = 0.20/0.15/0.15.
<軟化劑> 上述管可含有軟化劑。 作為軟化劑,例如可例舉:石蠟系油、環烷系油、芳香族系油、固體石蠟(paraffin wax)、液態石蠟、白礦物油、植物系軟化劑等,但並不限定於以上。該等之中,從低溫特性或耐滲出性等觀點出發,更佳為石蠟系油、液態石蠟、白礦物油。 軟化劑於40℃下之動黏度較佳為500 mm2/sec以下。軟化劑於40℃下之動黏度之下限值並無特別限定,較佳為10 mm2/sec。若軟化劑於40℃下之動黏度為500 mm2/sec以下,則有上述管之流動性進一步提高,成形加工性進一步提高之傾向。軟化劑之動黏度可藉由使用玻璃製毛細管式黏度計進行試驗之方法等加以測定。<Softener> The above-mentioned tubes may contain a softener. Examples of softeners include paraffin oils, naphthenic oils, aromatic oils, solid paraffin wax, liquid paraffin, white mineral oil, and plant-based softeners, but are not limited to these. Among these, paraffin oils, liquid paraffin, and white mineral oil are preferred from the viewpoint of low-temperature characteristics or impermeability. The kinematic viscosity of the softener at 40°C is preferably 500 mm² /sec or less. The lower limit of the kinematic viscosity of the softener at 40°C is not particularly limited, but is preferably 10 mm² /sec. If the kinematic viscosity of the softener at 40°C is below 500 mm² /sec, the flowability and processability of the aforementioned tubes tend to improve further. The kinematic viscosity of the softener can be measured by methods such as testing with a glass capillary viscometer.
<黏著賦予劑> 管亦可含有黏著賦予劑。 作為黏著賦予劑,例如可例舉:苯并呋喃-茚樹脂、對第三丁基苯酚-乙炔樹脂、苯酚-甲醛樹脂、二甲苯-甲醛樹脂、萜烯樹脂、氫化萜烯樹脂、萜烯-酚樹脂、芳香族系烴樹脂、脂肪族系烴樹脂、脂肪族系環狀烴樹脂、脂肪族/脂環族系石油樹脂、脂肪族/芳香族系烴樹脂、氫化改性脂環族系烴樹脂、氫化脂環族系烴樹脂、烴系黏著化樹脂、聚丁烯、液狀聚丁二烯、順-1,4-聚異戊二烯橡膠、氫化聚異戊二烯橡膠、液狀聚異戊二烯橡膠、松脂系樹脂等,但並不限定於以上。<Adhesive Enhancing Agent> The tube may also contain an adhesive enhancing agent. Examples of adhesive enhancing agents include: benzofuran-indene resin, p-tert-butylphenol-acetylene resin, phenol-formaldehyde resin, xylene-formaldehyde resin, terpene resin, hydrogenated terpene resin, terpene-phenol resin, aromatic hydrocarbon resin, aliphatic hydrocarbon resin, aliphatic cyclic hydrocarbon resin, and aliphatic/alicyclic hydrocarbon resin. Oil resins, aliphatic/aromatic hydrocarbon resins, hydrogenated modified alicyclic hydrocarbon resins, hydrogenated alicyclic hydrocarbon resins, hydrocarbon adhesive resins, polybutene, liquid polybutadiene, cis-1,4-polyisoprene rubber, hydrogenated polyisoprene rubber, liquid polyisoprene rubber, rosin-based resins, etc., but not limited to the above.
<管之製造方法> [構成管之材料之製造方法] 構成管之材料例如可適當選擇本實施方式之氫化嵌段共聚物(甲)、及視需要添加之其他成分,藉由將該等乾摻之方法;利用供於通常之高分子物質之混合之裝置混合之方法等而製備。 作為混合裝置,並無特別限定,例如可例舉:班布里混合機、Laboplastomill、單軸擠出機、雙軸擠出機等混練裝置,從生產性、優良混練性之觀點出發,較佳為藉由使用擠出機之熔融混合法來製造。 混練時之熔融溫度可適當設定,通常為130~300℃之範圍內,較佳為150~250℃之範圍。<Method for Manufacturing the Tube> [Method for Manufacturing the Material Constituting the Tube] The material constituting the tube may be, for example, the hydrogenated block copolymer (A) of this embodiment, and other components added as needed, and is prepared by dry admixture of these components; or by mixing using an apparatus for mixing common polymeric substances. There are no particular limitations on the mixing apparatus; examples include: a Bamboo mixer, a Laboplastomill, a single-shaft extruder, a twin-shaft extruder, etc. From the viewpoint of productivity and good mixing properties, it is preferable to manufacture the tube by melt mixing using an extruder. The melting temperature during mixing can be appropriately set, typically in the range of 130–300°C, preferably in the range of 150–250°C.
[管之成形方法] 作為管之成形方法,並無特別限定,例如可例舉如下方法:適當選擇本實施方式之氫化嵌段共聚物(甲)、及視需要添加之其他成分,投入至擠出機中而使其熔融,將其通入至模具中而形成為管狀,並進行水冷或空氣冷卻而製成管。作為擠出機,可使用單軸或多軸擠出機,又,亦可將多層管成形,該多層管係使用複數台擠出機進行多層擠出而成。 管之形狀並無特別限定,通常使用圓形、橢圓形等管。管之粗細並無特別限定,例如以外徑計較佳為1~50 mm者,更佳為2~30 mm者,進而較佳為3~20 mm者。又,管之厚度較佳為0.3~30 mm者,更佳為0.4~20 mm者,進而較佳為0.5~10 mm者。[Tube Forming Method] There are no particular limitations on the tube forming method. For example, the following method can be used: The hydrogenated block copolymer (A) of this embodiment, and other components added as needed, are appropriately selected, fed into an extruder to melt it, and then passed into a mold to form a tube. The tube is then water-cooled or air-cooled to produce the tube. The extruder can be a single-shaft or multi-shaft extruder. Furthermore, multi-layer tubes can also be formed by extruding multiple layers using multiple extruders. The tube shape is not particularly limited; round or elliptical tubes are commonly used. The tube diameter is not particularly limited; for example, a diameter of 1–50 mm is preferred, more preferably 2–30 mm, and even more preferably 3–20 mm. Furthermore, the thickness of the tube is preferably 0.3 to 30 mm, more preferably 0.4 to 20 mm, and even more preferably 0.5 to 10 mm.
管亦可於不阻礙本實施方式之目的之範圍內積層其他聚合物而製成多層管。上述其他聚合物可單獨使用一種,或者組合使用兩種以上,以單層或每層之種類可不同之多層進行積層而使用。進而,藉由多層化,適當地選擇不同之2種以上之聚合物,藉此可獲得根據部位而硬度不同,儘管如此不具有接縫之管。作為上述多層結構之管之包含上述聚合物的層根據所賦予之所需性能,可位於最內層、中間層、最外層中之任一者。The tube can also be made into a multilayer tube by laminating other polymers to the extent that it does not impede the purpose of this embodiment. The aforementioned other polymers can be used alone or in combination of two or more, and can be used in single layers or in multiple layers with different types of polymers. Furthermore, by multilayering and appropriately selecting two or more different polymers, a tube with varying hardness depending on the location can be obtained, even without seams. The layer containing the aforementioned polymers in the tube with the above-mentioned multilayer structure can be located in any of the innermost, middle, or outermost layers, depending on the desired properties imparted.
於上述管中,從進而抑制壁厚之增加而維持柔軟性,其後提高耐壓性等之觀點出發,可捲繞編織補強線或螺旋補強體而製成耐壓管(軟管)。 編織補強線設置於厚度方向之內部或層間,可使用維尼綸、聚醯胺、聚酯、芳族聚醯胺纖維、碳纖維、金屬線等,螺旋補強體設置於外周,可使用金屬、塑膠等。From the perspective of maintaining flexibility by suppressing the increase of wall thickness and subsequently improving pressure resistance, pressure-resistant tubes (hose) can be made by winding braided reinforcing threads or spiral reinforcements in the aforementioned tubes. The braided reinforcing threads are located inside or between layers in the thickness direction and can be made of vinylon, polyamide, polyester, aramid fiber, carbon fiber, metal wire, etc. The spiral reinforcements are located on the outer periphery and can be made of metal, plastic, etc.
上述管能夠以高度之水準使優異之透明性、柔軟性、耐扭結性、溶劑接著性、及各特性之平衡變得良好,尤其可不限定用途地使用。 可有效利用上述特性而用於家電用品用途、汽車內外裝零件用途、日用品、娛樂用品、玩具、工業用品、食品製造設備用途、醫療用途、飲用水用途等較廣泛之用途。該等之中,上述管可尤其適宜地用作醫療用途。例如亦可適宜地用作輸液裝置(infusion set)用管、經腸營養裝置用管、延長管、藥劑投予管、血液迴路用管、營養管、連結管、附葉片之靜脈針用管、進而,吸引用導管、排液用導管、經腸營養導管、胃管導管、藥液投予導管、腹膜透析用管、血液導管及氣球導管、尿道導管等。The aforementioned tube achieves a high level of transparency, flexibility, kink resistance, solvent adhesion, and a good balance of various properties, making it suitable for a wide range of applications, including household appliances, automotive interior and exterior parts, daily necessities, entertainment products, toys, industrial products, food manufacturing equipment, medical applications, and drinking water applications. Among these, the aforementioned tube is particularly suitable for medical applications. For example, it can also be appropriately used as tubing for infusion sets, enteral nutrition devices, extension tubing, drug delivery tubing, blood circulation tubing, feeding tubing, connecting tubing, leaflet-type intravenous needle tubing, and further, suction tubing, drainage tubing, enteral nutrition tubing, gastric tube tubing, drug delivery tubing, peritoneal dialysis tubing, blood tubing, balloon tubing, urethral tubing, etc.
(黏著性膜) 黏著性膜具備:基材膜;及黏著層,其配置於上述基材膜上,包含本實施方式之氫化嵌段共聚物(甲),且初始黏著性、黏著亢進性及卷出性、其等各種性能平衡優異。 於黏著性膜之黏著層中亦可含有黏著賦予劑。 作為黏著賦予劑,只要為可對黏著層賦予黏性之樹脂,則並無特別限定,例如可例舉:氫化萜烯樹脂、松脂系萜烯系樹脂、氫化松脂萜烯系樹脂、芳香族改性氫化萜烯樹脂、苯并呋喃系樹脂、酚系樹脂、萜酚系樹脂、氫化萜酚樹脂、芳香族烴樹脂、脂肪族烴樹脂等公知之黏著賦予樹脂。尤佳為氫化萜烯樹脂、芳香族改性氫化萜烯樹脂、氫化萜酚樹脂、及萜酚樹脂。 黏著賦予劑可僅單獨使用一種,亦可混合使用兩種以上。 作為黏著賦予劑,例如可使用「橡膠、塑膠調配藥品」(Rubber Digest公司編)中所記載者。藉由使用黏著賦予劑,可謀求改良黏著力。黏著層中之黏著賦予劑之含量於黏著層中較佳為0.5~50質量%,更佳為5~45質量%,進而較佳為10~30質量%。若黏著層中之黏著賦予劑之含量為50質量%以下,則有可有效地防止黏著亢進,可進一步減少剝離時之糊劑殘留量之傾向。若為0.5質量%以上,則可有獲得適度之黏著力之傾向。(Adhesive Membrane) The adhesive membrane comprises: a substrate membrane; and an adhesive layer disposed on the substrate membrane, comprising the hydrogenated block copolymer (A) of this embodiment, and exhibiting excellent balance of various properties such as initial adhesion, adhesion hyperactivity, and roll-up properties. An adhesive preamble may also be contained in the adhesive layer of the adhesive membrane. As an adhesive enhancer, there are no particular limitations as long as it is a resin capable of imparting adhesiveness to the adhesive layer. Examples include: hydrogenated terpene resins, rosin-based terpene resins, hydrogenated rosin-based terpene resins, aromatic modified hydrogenated terpene resins, benzofuran resins, phenolic resins, terpene-phenol resins, hydrogenated terpene-phenol resins, aromatic hydrocarbon resins, aliphatic hydrocarbon resins, and other known adhesive enhancers. Hydrogenated terpene resins, aromatic modified hydrogenated terpene resins, hydrogenated terpene-phenol resins, and terpene-phenol resins are particularly preferred. One type of adhesive enhancer may be used alone, or two or more may be used in combination. As an adhesive preform, one such preform can be used, for example, those described in "Rubber and Plastic Formulation Pharmaceuticals" (published by Rubber Digest). By using an adhesive preform, improved adhesion can be achieved. The content of the adhesive preform in the adhesive layer is preferably 0.5–50% by mass, more preferably 5–45% by mass, and even more preferably 10–30% by mass. If the content of the adhesive preform in the adhesive layer is less than 50% by mass, it can effectively prevent excessive adhesion and further reduce the amount of paste residue during peeling. If it is 0.5% by mass or more, it tends to achieve adequate adhesion.
<基材膜> 作為基材膜之材料,並無特別限定,可使用非極性樹脂及極性樹脂中之任一種。從性能或價格方面等出發,作為非極性樹脂,可例舉聚乙烯、均聚聚丙烯或嵌段聚丙烯作為較佳者,作為極性樹脂,可例舉聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯等聚酯系樹脂、聚醯胺系樹脂、乙烯-乙酸乙烯酯共聚物及其水解物等作為較佳者。 基材膜之厚度較佳為1 mm以下,更佳為300 μm以下,進而較佳為10~200 μm。若基材膜之厚度為10 μm以上,則可充分地進行被接著體之保護,若基材膜之厚度為1 mm以下,則可獲得實用上良好之彈性模數,可獲得良好之凹凸追隨性,可有效地防止隆起或剝離。<Substrate Film> There are no particular limitations on the material used for the substrate film; any type of non-polar resin or polar resin can be used. From the perspective of performance or price, polyethylene, homopolymer polypropylene, or block polypropylene are preferred non-polar resins, while polyethylene terephthalate, polybutylene terephthalate, and other polyester resins, polyamide resins, ethylene-vinyl acetate copolymers, and their hydrolysates are preferred polar resins. The thickness of the substrate film is preferably less than 1 mm, more preferably less than 300 μm, and even more preferably 10–200 μm. If the thickness of the substrate film is 10 μm or more, it can adequately protect the substrate. If the thickness of the substrate film is less than 1 mm, it can obtain a good modulus of elasticity for practical use, good surface tracking, and effectively prevent bulging or peeling.
<黏著層> 黏著性膜於上述基材膜上具有包含本實施方式之氫化嵌段共聚物(甲)之黏著層。於該黏著層中亦可含有下述其他材料。<Adhesive Layer> The adhesive film has an adhesive layer comprising the hydrogenated block copolymer (A) of this embodiment on the aforementioned substrate film. The adhesive layer may also contain other materials as described below.
[黏著層中之其他材料] <氫化苯乙烯系彈性體> 黏著性膜之黏著層亦可進而含有氫化苯乙烯系彈性體。 作為氫化苯乙烯系彈性體,例如可例舉:苯乙烯-丁二烯-苯乙烯(SBS)、苯乙烯-異戊二烯-苯乙烯(SIS)、苯乙烯-丁二烯無規聚合物(SBR)、藉由氫化使SBS飽和而成之苯乙烯-乙烯-丁烯-苯乙烯(SEBS)、苯乙烯-乙烯-丙烯-苯乙烯(SEPS)作為代表性氫化苯乙烯系彈性體,但並不限定於以上,除此以外,亦可為苯乙烯-乙烯-丁烯(SEB)、苯乙烯-乙烯-丙烯(SEP)、苯乙烯-異丁烯-苯乙烯三嵌段共聚物(SIBS)等結構之彈性體。 又,作為上述氫化苯乙烯系彈性體,亦可使用賦予了各種官能基之反應性彈性體。作為上述官能基,例如可例舉:羥基、羧基、羰基、硫代羰基、醯鹵化物基、酸酐基、硫代羧酸基、醛基、硫代醛基、羧酸酯基、醯胺基、磺酸基、磺酸酯基、磷酸基、磷酸酯基、胺基、亞胺基、腈基、吡啶基、喹啉基、環氧基、硫代環氧基、硫基、異氰酸基、異硫氰酸基、鹵化矽基、烷氧基矽基、鹵化錫基、硼酸基、含硼之基、硼酸鹽基、烷氧基錫基、苯基錫基,但並不限定於以上。[Other Materials in the Adhesive Layer] <Hydrogenated Styrene-Based Elastomers> The adhesive layer of the adhesive film may also contain hydrogenated styrene-based elastomers. Examples of representative hydrogenated styrene-based elastomers include: styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene-butadiene random polymer (SBR), styrene-ethylene-butene-styrene (SEBS) formed by hydrogenating SBS, and styrene-ethylene-propylene-styrene (SEPS). However, these are not limited to the above. In addition, elastomers with structures such as styrene-ethylene-butene (SEB), styrene-ethylene-propylene (SEP), and styrene-isobutene-styrene triblock copolymer (SIBS) may also be used. Furthermore, as the aforementioned hydrogenated styrene-based elastomers, reactive elastomers endowed with various functional groups can also be used. Examples of such functional groups include: hydroxyl, carboxyl, carbonyl, thiocarbonyl, acetyl halide, acid anhydride, thiocarboxylic acid, aldehyde, thioaldehyde, carboxylic acid ester, acetamino, sulfonic acid, sulfonate, phosphoric acid, phosphate ester, amino, imino, nitrile, pyridinyl, quinolinyl, epoxy, thioepoxy, thio, isocyanate, isothiocyanate, halogenated silica, alkoxysilyl, halogenated tin, borate, boron-containing groups, borate salts, alkoxytin, and phenyltin, but are not limited to the above.
<烯烴系樹脂、烯烴系彈性體> 黏著性膜之黏著層亦可進而含有烯烴系樹脂、烯烴系彈性體。 作為烯烴系樹脂、烯烴系彈性體,可例舉:碳數2~20之α-烯烴聚合物或共聚物、乙烯與不飽和羧酸或不飽和羧酸酯之共聚物。 具體而言,可例舉:乙烯-丙烯共聚物、乙烯-1-丁烯共聚物、乙烯-1-己烯共聚物、乙烯-4-甲基戊烯共聚物、乙烯-1-辛烯共聚物、丙烯均聚物、丙烯-乙烯共聚物、丙烯-乙烯-1-丁烯共聚物、1-丁烯均聚物、1-丁烯-乙烯共聚物、1-丁烯-丙烯共聚物、4-甲基戊烯均聚物、4-甲基戊烯-1-丙烯共聚物、4-甲基戊烯-1-丁烯共聚物、4-甲基戊烯-1-丙烯-1-丁烯共聚物、丙烯-1-丁烯共聚物、乙烯-乙酸乙烯酯共聚物、乙烯-甲基丙烯酸共聚物、乙烯-甲基丙烯酸甲酯共聚物等。<Alkene Resins and Alkene Elastomers> The adhesive layer of an adhesive film may also contain alkene resins and alkene elastomers. Examples of alkene resins and alkene elastomers include: α-olefin polymers or copolymers with 2 to 20 carbon atoms, and copolymers of ethylene with unsaturated carboxylic acids or unsaturated carboxylic acid esters. Specifically, examples include: ethylene-propylene copolymers, ethylene-1-butene copolymers, ethylene-1-hexene copolymers, ethylene-4-methylpentene copolymers, ethylene-1-octene copolymers, propylene homopolymers, propylene-ethylene copolymers, propylene-ethylene-1-butene copolymers, 1-butene homopolymers, 1-butene-ethylene copolymers, 1-butene-propylene copolymers, 4-methylpentene homopolymers, 4-methylpentene-1-propylene copolymers, 4-methylpentene-1-butene copolymers, 4-methylpentene-1-propylene-1-butene copolymers, propylene-1-butene copolymers, ethylene-vinyl acetate copolymers, ethylene-methacrylic acid copolymers, and ethylene-methyl methacrylate copolymers.
<丙烯酸系共聚物> 黏著性膜之黏著層亦可進而含有丙烯酸系共聚物。 作為丙烯酸系共聚物,例如可例舉:丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸甲酯、丙烯腈等與乙酸乙烯酯、氯乙烯、苯乙烯等之共聚物,但並不限定於以上。<Acrylic Copolymers> The adhesive layer of the adhesive film may also contain acrylic copolymers. Examples of acrylic copolymers include copolymers of methyl acrylate, ethyl acrylate, methyl methacrylate, acrylonitrile, etc., with vinyl acetate, vinyl chloride, styrene, etc., but are not limited to the above.
<軟化劑> 黏著性膜之黏著層亦可進而含有軟化劑。 作為軟化劑,並無特別限定,例如可使用礦物油系軟化劑及合成樹脂系軟化劑中之任一種。 作為礦物油系軟化劑,例如可例舉:芳香族系烴、環烷系烴及石蠟系烴之混合物。再者,石蠟系烴之碳原子數占全部碳原子中之50%以上者被稱為石蠟系油,環烷系烴之碳原子為30~45%者被稱為環烷系油,又,芳香族系烴之碳原子為35%以上者被稱為芳香族系油。作為礦物油系軟化劑,較佳為橡膠用軟化劑之石蠟系油,作為合成樹脂系軟化劑,較佳為聚丁烯、低分子量聚丁二烯等。<Softener> The adhesive layer of the adhesive film may also contain a softener. There are no particular limitations on the type of softener; for example, either mineral oil-based softeners or synthetic resin-based softeners can be used. Examples of mineral oil-based softeners include mixtures of aromatic hydrocarbons, cycloalkane hydrocarbons, and paraffinic hydrocarbons. Furthermore, paraffinic hydrocarbons with more than 50% carbon atoms are called paraffinic oils, cycloalkane hydrocarbons with 30-45% carbon atoms are called cycloalkane oils, and aromatic hydrocarbons with more than 35% carbon atoms are called aromatic oils. As a mineral oil-based softener, paraffin-based oils used as rubber softeners are preferred; as a synthetic resin-based softener, polybutene and low molecular weight polybutadiene are preferred.
<抗氧化劑、光穩定劑等> 於黏著性膜之黏著層中亦可進而添加抗氧化劑、光穩定劑等穩定劑。 作為抗氧化劑,例如可例舉:2,6-二第三丁基-4-甲基苯酚、3-(4'-羥基-3',5'-二第三丁基苯基)丙酸正十八烷基酯、2,2'-亞甲基雙(4-甲基-6-第三丁基苯酚)、2,2'-亞甲基雙(4-乙基-6-第三丁基苯酚)、2,4-雙[(辛硫基)甲基]-鄰甲酚、丙烯酸2-第三丁基-6-(3-第三丁基-2-羥基-5-甲基苄基)-4-甲基苯酯、丙烯酸2,4-二第三戊基-6-[1-(3,5-二第三戊基-2-羥基苯基)乙基]苯酯、丙烯酸2-[1-(2-羥基-3,5-二第三戊基苯基)]酯等受阻酚系抗氧化劑;硫代二丙酸二月桂酯、硫代二丙酸月桂基硬脂酯、季戊四醇-四(β-月桂基硫代丙酸酯)等硫系抗氧化劑;亞磷酸三(壬基苯基)酯、亞磷酸三(2,4-二第三丁基苯基)酯等磷系抗氧化劑等,但並不限定於以上。 作為光穩定劑,例如可例舉:2-(2'-羥基-5'-甲基苯基)苯并三唑、2-(2'-羥基-3',5'第三丁基苯基)苯并三唑、2-(2'-羥基-3',5'-二第三丁基苯基)-5-氯苯并三唑等苯并三唑系紫外線吸收劑或2-羥基-4-甲氧基二苯甲酮等二苯甲酮系紫外線吸收劑、或受阻胺系光穩定劑,但並不限定於以上。<Antioxidants, light stabilizers, etc.> Antioxidants and light stabilizers can also be added to the adhesive layer of adhesive films. Examples of antioxidants include: 2,6-di-tert-butyl-4-methylphenol, octadecyl 3-(4'-hydroxy-3',5'-di-tert-butylphenyl)propionate, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 2,4-bis[(octylthio)methyl]-orthocresol, 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, propylene... Hindered phenolic antioxidants such as 2,4-diterpentyl-6-[1-(3,5-diterpentyl-2-hydroxyphenyl)ethyl]phenyl ester and 2-[1-(2-hydroxy-3,5-diterpentylphenyl)] ester of acrylate; sulfur-based antioxidants such as dilauryl thiodipropionate, lauryl stearate thiodipropionate, and pentaerythritol tetra(β-lauryl thiopropionate); and phosphorus-based antioxidants such as tri(nonylphenyl) phosphite and tri(2,4-diterpentylphenyl) phosphite, but not limited to the above. Examples of light stabilizers include, but are not limited to, benzotriazole-based UV absorbers such as 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-tert-butylphenyl)benzotriazole, and 2-(2'-hydroxy-3',5'-ditert-butylphenyl)-5-chlorobenzotriazole, benzophenone-based UV absorbers such as 2-hydroxy-4-methoxybenzophenone, or hindered amine-based light stabilizers.
<顏料、蠟類、熱塑性樹脂、天然橡膠、合成橡膠> 除了上述各種材料以外,黏著性膜之黏著層視需要亦可包含各種添加劑。 作為上述添加劑,例如可例舉:鐵丹、二氧化鈦等顏料;固體石蠟、微晶蠟、低分子量聚乙烯蠟等蠟類;無定形聚烯烴、乙烯-丙烯酸乙酯共聚物等聚烯烴系或低分子量之乙烯基芳香族系熱塑性樹脂;天然橡膠;聚異戊二烯橡膠、聚丁二烯橡膠、苯乙烯-丁二烯橡膠、乙烯-丙烯橡膠、氯丁二烯橡膠、丙烯酸系橡膠、異戊二烯-異丁烯橡膠、聚戊烯橡膠等合成橡膠,但並不限定於以上。作為上述合成橡膠,除了上述以外,可例舉於「橡膠、塑膠調配藥品」(Rubber Digest公司編)等中所記載者。<Pigments, waxes, thermoplastic resins, natural rubber, synthetic rubber> In addition to the above materials, the adhesive layer of the adhesive film may also contain various additives as needed. Examples of the aforementioned additives include: pigments such as red lead and titanium dioxide; waxes such as solid paraffin wax, microcrystalline wax, and low molecular weight polyethylene wax; polyolefin-based or low molecular weight vinyl aromatic thermoplastic resins such as amorphous polyolefins and ethylene-ethyl acrylate copolymers; natural rubber; and synthetic rubbers such as polyisoprene rubber, polybutadiene rubber, styrene-butadiene rubber, ethylene-propylene rubber, chloroprene rubber, acrylic rubber, isoprene-isobutylene rubber, and polypentene rubber, but are not limited to these. In addition to the above, examples of synthetic rubbers can be found in publications such as "Rubber and Plastics Formulation Products" (published by Rubber Digest).
<飽和脂肪酸雙醯胺> 黏著性膜之黏著層可包含具有抑制黏著亢進之效果之飽和脂肪酸雙醯胺。 作為飽和脂肪酸雙醯胺,例如可例舉:伸乙基雙硬脂醯胺(EBSA)、亞甲基雙硬脂醯胺、六亞甲基雙硬脂醯胺等飽和脂肪酸脂肪族雙醯胺;以及間苯二甲基雙硬脂醯胺、及N,N'-二硬脂基間苯二甲醯胺等飽和脂肪酸芳香族雙醯胺,但並不限定於以上。 該等飽和脂肪酸雙醯胺可僅單獨使用一種,亦可組合使用兩種以上。 亦可進而調配具有抑制黏著亢進之效果之苯乙烯系嵌段相補強劑。作為苯乙烯系嵌段相補強劑,例如作為單體單元,可例舉:苯乙烯及α-甲基苯乙烯、對甲基苯乙烯、對氯苯乙烯、氯甲基苯乙烯、第三丁基苯乙烯、對乙基苯乙烯、二乙烯苯等苯乙烯系化合物,但並不限定於以上。該等可僅單獨使用一種,亦可組合使用兩種以上。<Saturated Fatty Acid Bisamides> The adhesive layer of an adhesive film may contain saturated fatty acid bisamides that have the effect of inhibiting hyperadhesion. Examples of saturated fatty acid bisamides include, but are not limited to, aliphatic bisamides such as ethyl distearate (EBSA), methylene distearate, and hexamethylene distearate; and aromatic bisamides such as m-phenylenediamine and N,N'-distearate m-phenylenediamine. Only one of these saturated fatty acid bisamides may be used alone, or two or more may be used in combination. Furthermore, styrene-based block phase reinforcing agents with the effect of inhibiting excessive adhesion can be formulated. Examples of styrene-based block phase reinforcing agents, as monomer units, include styrene and styrene compounds such as α-methylstyrene, p-methylstyrene, p-chlorostyrene, chloromethylstyrene, tributylstyrene, p-ethylstyrene, and divinylbenzene, but are not limited to these. One of these can be used alone, or two or more can be used in combination.
<構成黏著性膜之黏著層之樹脂材料之製造方法> 構成本實施方式之黏著性膜之黏著層之樹脂材料例如可藉由如下方法製造:對本實施方式之氫化嵌段共聚物(甲)、及視需要添加之其他成分進行乾摻之方法;或者利用供於通常之高分子材料之混合之裝置進行混合之方法等。 作為混合裝置,例如可例舉:班布里混合機、Laboplastomill、單軸擠出機、雙軸擠出機等混練裝置,但並不限定於以上,從生產性、優良混練性之觀點出發,較佳為藉由使用擠出機之熔融混合法來製造。 又,尤其是於在構成黏著層之樹脂材料中調配黏著賦予劑之情形時,於使用上述乾摻法之情形時,黏著賦予劑之黏性較強,且為片狀,故有處理性變差之虞,故亦可製作預先將黏著賦予劑混練於本實施方式之氫化嵌段共聚物(甲)中而成之母料。構成黏著層之樹脂材料於混練時之熔融溫度可適當設定,通常在130~300℃之範圍內,較佳為150~250℃之範圍。 為了謀求輕量化、柔軟化及密接性之提高效果,亦可對構成黏著層之樹脂材料實施發泡處理。作為發泡方法,例如有化學方法、物理方法、熱膨脹型微球之利用等,但並不限定於以上。可藉由分別添加無機系發泡劑、有機系發泡劑等化學發泡劑、物理發泡劑等,添加熱熱膨脹型微球等而使氣泡分佈於材料內部。又,亦可藉由添加中空填料(已膨脹氣球),謀求輕量化、柔軟化、密接性之提高。<Method for Manufacturing Resin Material Constituting the Adhesive Layer of the Adhesive Film> The resin material constituting the adhesive layer of the adhesive film of this embodiment can be manufactured by, for example, by dry admixture of the hydrogenated block copolymer (A) of this embodiment and other components added as needed; or by mixing using an apparatus for mixing conventional polymer materials. Examples of mixing apparatus include, but are not limited to, Bamboo mixers, Laboplastomills, single-shaft extruders, and biaxial extruders. From the viewpoint of productivity and good mixing properties, it is preferable to manufacture by melt mixing using an extruder. Furthermore, especially when the adhesive preformer is incorporated into the resin material constituting the adhesive layer, the adhesive preformer tends to be more viscous and sheet-like when using the aforementioned dry admixture method, which may lead to a decrease in processing quality. Therefore, a masterbatch can be prepared by pre-mixing the adhesive preformer into the hydrogenated block copolymer (A) of this embodiment. The melting temperature of the resin material constituting the adhesive layer during mixing can be appropriately set, typically in the range of 130–300°C, preferably in the range of 150–250°C. To achieve lighter weight, softer texture, and improved adhesion, the resin material constituting the adhesive layer can also be foamed. Foaming methods include chemical methods, physical methods, and the use of thermally expandable microspheres, but are not limited to these. Bubbles can be distributed within the material by adding inorganic or organic foaming agents, physical foaming agents, or thermally expandable microspheres. Furthermore, adding hollow fillers (expanded air balloons) can also achieve lightweighting, softening, and improved adhesion.
<黏著性膜之製造方法> 黏著性膜於基材膜上具備包含本實施方式之氫化嵌段共聚物(甲)之黏著層。 黏著性膜之製造方法並無特別限定,例如可例舉:將構成黏著層之樹脂材料之溶液或熔融物塗敷於基材膜上之方法、使用膜擠出機之方法等。此處,於使用構成黏著層之樹脂材料之溶液或熔融物之情形時,可於製成含有氫化嵌段共聚物(甲)及其他成分之樹脂材料後製成溶液或熔融物,亦可於製成添加有氫化嵌段共聚物(甲)之溶液或熔融物後進行混合。 於藉由樹脂材料之溶液塗敷之方法製造黏著性膜之情形時,例如可藉由溶解於能夠溶解樹脂材料溶之溶劑中,並使用塗佈機等塗敷於基材膜上,並將溶劑加熱乾燥等而製造,但並不限定於以上。於使樹脂材料熔融並塗敷之方法中,例如可藉由使用熱熔塗佈機等,將熔融之樹脂材料塗敷於基材膜上等而製造黏著性膜,但並不限定於此。於該情形時,較佳為使用具有高於塗敷溫度之玻璃轉移溫度、熔點或軟化點之各種基材膜。 作為利用膜擠出機製造黏著性膜之方法,例如可藉由如下方法製造:利用熔融共擠壓機,使包含樹脂材料之黏著層之成分、與可構成基材膜之熱塑性樹脂等成分成為兩個流向,即,使黏著層形成用流體、與基材體膜形成用流體於模嘴內合流而形成單一流體並擠出,將黏著層與樹脂膜層複合,但並不限定於以上。於利用膜擠出機之方法之情形時,形成黏著層之樹脂材料亦可藉由預先將黏著層用之各成分乾摻而製造,故其為生產性優異之方法。又,於進行擠出成形之情形時,有所製作之黏著性膜之密接性、接著強度尤其優異之傾向。 黏著性膜可暫時黏著於導光板或稜鏡片材等光學系統成形體、合成樹脂板、金屬板、裝飾合板、被覆塗裝鋼板、各種銘牌等之表面,用作該等被接著體之加工時或搬送、保管時之防止損傷或防止污垢用保護膜。<Method for Manufacturing an Adhesive Membrane> The adhesive membrane has an adhesive layer comprising the hydrogenated block copolymer (A) of this embodiment on a substrate membrane. The method for manufacturing the adhesive membrane is not particularly limited; examples include methods such as applying a solution or melt of the resin material constituting the adhesive layer onto the substrate membrane, and methods using a membrane extruder. When using a solution or melt of the resin material constituting the adhesive layer, the solution or melt can be prepared after preparing a resin material containing the hydrogenated block copolymer (A) and other components, or it can be mixed after preparing a solution or melt containing the hydrogenated block copolymer (A). When an adhesive film is manufactured by applying a resin material solution, it can be produced, for example, by dissolving the resin material in a solvent capable of dissolving it, applying it to a substrate film using a coating machine, and then heating and drying the solvent, but is not limited to the above. In a method of melting and applying a resin material, for example, an adhesive film can be manufactured by applying molten resin material to a substrate film using a hot melt coating machine, but is not limited to this. In this case, it is preferable to use various substrate films having a glass transition temperature, melting point, or softening point higher than the coating temperature. As a method for manufacturing adhesive films using a membrane extruder, for example, the film can be manufactured by using a melt co-extruder, in which the components of the adhesive layer containing resin material and the components of the thermoplastic resin that can form the substrate film flow in two directions. That is, the fluid for forming the adhesive layer and the fluid for forming the substrate film are combined in the die to form a single fluid and extruded, thus combining the adhesive layer and the resin film layer, but it is not limited to the above. In the case of using a membrane extruder, the resin material for forming the adhesive layer can also be manufactured by pre-dry blending the components for the adhesive layer, thus it is a method with excellent productivity. Furthermore, adhesive films produced during extrusion molding tend to exhibit particularly excellent adhesion and bonding strength. These adhesive films can be temporarily adhered to the surfaces of optical system moldings such as light guide plates or prism sheets, synthetic resin sheets, metal sheets, decorative plywood, coated steel sheets, and various nameplates, serving as protective films to prevent damage or contamination during the processing, handling, and storage of these adhered bodies.
[第二成形體] 第二成形體為上述本實施方式之氫化嵌段共聚物組合物之成形體。 作為第二成形體,可例舉:汽車構件,例如汽車內飾表皮材、片狀成形體(片材、膜)、飲用水配管、飲用水管;以及包裝材,例如食品包裝材、及衣服包裝材;用於保護膜之黏著性膜、與極性樹脂之包覆模製成形體,但並不限定於上述。[Second Molded Body] The second molded body is a molded body of the hydrogenated block copolymer composition of the present embodiment described above. Examples of the second molded body include: automotive components, such as automotive interior skin materials, sheet molded bodies (sheets, films), drinking water pipes, and drinking water hoses; and packaging materials, such as food packaging materials and clothing packaging materials; adhesive films for protective films, and overmolded bodies with polar resins, but are not limited to the above.
(包覆模製成形體) 本實施方式之氫化嵌段共聚物組合物有對極性樹脂顯示出接著性之傾向,故可形成與極性樹脂一併進行包覆模製成形而成之多層成形體(包覆模製成形體)。 包覆模製成形體藉由設為具備包含極性樹脂之層、及積層於其層上之包含本實施方式之氫化嵌段共聚物組合物之層之構成,成為接著性優異者。(Overmolded Article) The hydrogenated block copolymer composition of this embodiment tends to exhibit adhesion to polar resins, thus allowing the formation of a multilayered molded article (overmolded article) by overmolding together with the polar resin. The overmolded article, by having a structure comprising a layer containing a polar resin and a layer containing the hydrogenated block copolymer composition of this embodiment stacked on top of that layer, becomes an excellent adhesive.
<極性樹脂> 作為極性樹脂,例如可例舉:聚氯乙烯、ABS、丙烯腈-苯乙烯共聚物、聚丙烯酸、聚丙烯酸甲酯之類的聚丙烯酸酯、聚甲基丙烯酸、聚甲基丙烯酸甲酯之類的聚甲基丙烯酸酯、聚乙烯醇、聚偏二氯乙烯、聚對苯二甲酸乙二酯、聚醯胺、聚縮醛、聚碳酸酯、聚對苯二甲酸丁二酯、聚偏二氟乙烯、聚碸、聚醚碸、聚苯硫醚、聚芳酯、聚醯胺醯亞胺、聚醚醯亞胺、聚醚酮、聚醚醚酮、聚醯亞胺、液晶聚合物、聚四氟乙烯、酚樹脂、脲樹脂、三聚氰胺樹脂、不飽和聚酯、環氧樹脂、及聚胺基甲酸酯,但並不限定於以上。 極性樹脂可單獨使用一種,亦可組合使用兩種以上。<Polar Resins> Examples of polar resins include: polyvinyl chloride, ABS, acrylonitrile-styrene copolymer, polyacrylic acid, polymethyl methacrylate and other polyacrylates, polymethacrylic acid, polymethyl methacrylate and other polymethacrylates, polyvinyl alcohol, polyvinylidene chloride, polyethylene terephthalate, polyamide, polyacetal, polycarbonate, polybutylene terephthalate, polyvinylidene fluoride, polyurethane, polyether ether, polyphenylene sulfide, polyarylate, polyamide imide, polyether imide, polyether ketone, polyether ether ketone, polyamide, liquid crystal polymer, polytetrafluoroethylene, phenolic resin, urea resin, melamine resin, unsaturated polyester, epoxy resin, and polyurethane, but are not limited to the above. Polar resins can be used alone or in combination with two or more.
包含極性樹脂之層除了極性樹脂以外,亦可包含填充劑。 作為包含極性樹脂之層中之填充劑,例如可例舉:玻璃纖維、玻璃球、玻璃中空球、碳纖維、纖維素奈米纖維、矽灰石、鈦酸鉀晶鬚、碳酸鈣晶鬚、硼酸鋁晶鬚、硫酸鎂晶鬚、海泡石、硬矽鈣石、氧化鋅晶鬚等之類的纖維狀無機填充劑、滑石、碳酸鈣、氧化鈣、碳酸鋅、矽灰石、沸石、矽灰石、二氧化矽、氧化鋁、黏土、氧化鈦、氫氧化鎂、氧化鎂、矽酸鈉、矽酸鈣、矽酸鎂、鋁酸鈉、鋁酸鈣、鋁矽酸鈉、氧化鋅、鈦酸鉀、水滑石、硫酸鋇、鈦黑、以及爐黑、熱碳黑、及乙炔黑等之類的碳黑等,但並不限定於以上。 纖維狀無機填充劑亦可利用對極性樹脂具有親和性基或反應性基之化合物進行表面處理。 填充劑可單獨使用一種,亦可使用兩種以上。In addition to polar resins, layers containing polar resins may also contain fillers. Examples of fillers in layers containing polar resins include: glass fibers, glass spheres, hollow glass spheres, carbon fibers, cellulose nanofibers, wollastonite, potassium titanium oxide fringes, calcium carbonate fringes, aluminum borate fringes, magnesium sulfate fringes, sepiolite, diaspore, zinc oxide fringes, and other fibrous inorganic fillers; talc; calcium carbonate; and calcium oxide. Zinc carbonate, wollastonite, zeolite, wollastonite, silica, alumina, clay, titanium oxide, magnesium hydroxide, magnesium oxide, sodium silicate, calcium silicate, magnesium silicate, sodium aluminate, calcium aluminate, sodium aluminosilicate, zinc oxide, potassium titanium oxide, hydrotalcite, barium sulfate, titanium black, and carbon black such as furnace black, thermal black, and acetylene black, etc., but not limited to the above. Fiber-like inorganic fillers can also be used for surface treatment using compounds with affinity or reactive groups for polar resins. One filler may be used alone, or two or more may be used.
<包含氫化嵌段共聚物組合物之層> 作為構成上述包覆模製成形體之包含氫化嵌段共聚物組合物之層,可例舉含有本實施方式之氫化嵌段共聚物組合物與橡膠狀聚合物者。 橡膠狀聚合物較佳為包含乙烯基芳香族單體單元,且包含至少1個將乙烯基芳香族單體單元作為主體之聚合物嵌段,又,亦較佳為包含乙烯基芳香族單體單元,且乙烯基芳香族單體單元為60質量%以下之橡膠或彈性體。 作為橡膠狀聚合物,例如可例舉:苯乙烯丁二烯橡膠及其氫化物(但本實施方式之氫化嵌段共聚物除外)、苯乙烯-丁二烯嵌段共聚物及其氫化物、苯乙烯-丁二烯-異戊二烯嵌段共聚物及其氫化物等,但並不限定於以上。<Layer containing hydrogenated block copolymer composition> As a layer constituting the above-mentioned overmolded article containing hydrogenated block copolymer composition, examples include those containing the hydrogenated block copolymer composition of this embodiment and a rubber-like polymer. The rubber-like polymer preferably contains vinyl aromatic monomer units and contains at least one polymer block with vinyl aromatic monomer units as the main component. It is also more preferably that it contains vinyl aromatic monomer units, and the vinyl aromatic monomer units are rubber or elastomers of 60% by mass or less. Examples of rubber-like polymers include, but are not limited to, styrene-butadiene rubber and its hydrogenates (except for the hydrogenated block copolymers of this embodiment), styrene-butadiene block copolymers and their hydrogenates, styrene-butadiene-isoprene block copolymers and their hydrogenates.
包含氫化嵌段共聚物組合物之層除了上述熱塑性樹脂(丙)以外,還可含有其他熱塑性樹脂。 作為上述熱塑性樹脂(丙)及其他熱塑性樹脂,例如可例舉:聚丙烯、聚乙烯、乙烯-丙烯共聚橡膠(EPM)、及乙烯-丙烯-非共軛二烯共聚橡膠(EPDM)等烯烴系聚合物;聚酯彈性體、聚對苯二甲酸乙二酯及聚對苯二甲酸丁二酯等聚酯系聚合物;聚醯胺6、聚醯胺6,6、聚醯胺6,10、聚醯胺11、聚醯胺12、及聚醯胺6,12等聚醯胺系樹脂;聚丙烯酸甲酯及聚甲基丙烯酸甲酯等丙烯酸系樹脂;聚甲醛均聚物及聚甲醛共聚物等聚甲醛系樹脂;苯乙烯均聚物、丙烯腈-苯乙烯樹脂、及丙烯腈-丁二烯-苯乙烯樹脂等苯乙烯系樹脂;聚碳酸酯樹脂;苯乙烯-丁二烯共聚物橡膠、及苯乙烯-異戊二烯共聚物橡膠等苯乙烯系彈性體以及其氫化物或其改性物;天然橡膠;合成異戊二烯橡膠及液狀聚異戊二烯橡膠以及其氫化物或改性物;氯丁二烯橡膠;丙烯酸系橡膠;丁基橡膠;丙烯腈-丁二烯橡膠;表氯醇橡膠;聚矽氧橡膠;氟橡膠;氯磺化聚乙烯;胺基甲酸酯橡膠;聚胺基甲酸酯系彈性體;聚醯胺系彈性體;聚酯系彈性體;軟質氯乙烯樹脂等,但並不限定於以上。 該等熱塑性樹脂可單獨使用一種,亦可併用兩種以上。In addition to the thermoplastic resin (propylene) mentioned above, the layer containing the hydrogenated block copolymer composition may also contain other thermoplastic resins. Examples of the aforementioned thermoplastic resins (propylene) and other thermoplastic resins include, for example: olefinic polymers such as polypropylene, polyethylene, ethylene-propylene copolymer rubber (EPM), and ethylene-propylene-non-conjugated diene copolymer rubber (EPDM); polyester polymers such as polyester elastomers, polyethylene terephthalate, and polybutylene terephthalate; polyamide resins such as polyamide 6, polyamide 6,6, polyamide 6,10, polyamide 11, polyamide 12, and polyamide 6,12; acrylic resins such as polymethyl acrylate and polymethyl methacrylate; polyoxymethylene resins such as polyoxymethylene homopolymers and polyoxymethylene copolymers; styrene homopolymers, acrylonitrile-styrene... Acrylonitrile resins and styrene-based resins such as acrylonitrile-butadiene-styrene resins; polycarbonate resins; styrene-butadiene copolymer rubbers and styrene-isoprene copolymer rubbers and their hydrogenates or modifications thereof; natural rubbers; synthetic isoprene rubbers and liquid polyisoprene rubbers and their hydrogenates. Or modified compounds; chloroprene rubber; acrylic rubber; butyl rubber; acrylonitrile-butadiene rubber; epichlorohydrin rubber; polysiloxane rubber; fluororubber; chlorosulfonated polyethylene; urethane rubber; polyurethane elastomers; polyamide elastomers; polyester elastomers; soft vinyl chloride resins, etc., but not limited to the above. These thermoplastic resins may be used alone or in combination of two or more.
包含氫化嵌段共聚物組合物之層除了上述軟化劑(丁)以外,還可含有其他軟化劑。 作為上述軟化劑(丁)及其他軟化劑,例如可例舉:石蠟系油、環烷系油、芳香族系油、固體石蠟、液態石蠟、白礦物油、植物系軟化劑等,但並不限定於以上。 軟化劑於40℃下之動黏度較佳為500 mm2/sec以下。軟化劑於40℃下之動黏度之下限值並無特別限定,較佳為10 mm2/sec。 若軟化劑於40℃下之動黏度為500 mm2/sec以下,則有熱塑性彈性體組合物之流動性進一步提高,成形加工性進一步提高之傾向。軟化劑之動黏度可藉由使用玻璃製毛細管式黏度計進行試驗之方法等加以測定。In addition to the softener (but) mentioned above, the layer comprising the hydrogenated block copolymer composition may also contain other softeners. Examples of the softener (but) and other softeners include, but are not limited to, paraffin oils, naphthenic oils, aromatic oils, solid paraffin, liquid paraffin, white mineral oil, and plant-based softeners. The kinematic viscosity of the softener at 40°C is preferably 500 mm² /sec or less. The lower limit of the kinematic viscosity of the softener at 40°C is not particularly limited, but is preferably 10 mm² /sec. If the kinematic viscosity of the softener at 40°C is below 500 mm² /sec, the flowability and processability of the thermoplastic elastomer composition tend to improve further. The kinematic viscosity of the softener can be measured by methods such as testing with a glass capillary viscometer.
包含氫化嵌段共聚物組合物之層除了上述成分(B)以外,亦可進而含有其他烯烴系樹脂、及烯烴系彈性體。 作為上述成分(B)及其他烯烴系樹脂、烯烴系彈性體,例如可例舉:碳數2~20之α-烯烴聚合物或共聚物、乙烯與不飽和羧酸或不飽和羧酸酯之共聚物,但並不限定於以上。例如可例舉:乙烯-丙烯共聚物、乙烯-1-丁烯共聚物、乙烯-1-己烯共聚物、乙烯-4-甲基戊烯共聚物、乙烯-1-辛烯共聚物、丙烯均聚物、丙烯-乙烯共聚物、丙烯-乙烯-1-丁烯共聚物、1-丁烯均聚物、1-丁烯-乙烯共聚物、1-丁烯-丙烯共聚物、4-甲基戊烯均聚物、4-甲基戊烯-1-丙烯共聚物、4-甲基戊烯-1-丁烯共聚物、4-甲基戊烯-1-丙烯-1-丁烯共聚物、丙烯-1-丁烯共聚物、乙烯-乙酸乙烯酯共聚物、乙烯-甲基丙烯酸共聚物、乙烯-甲基丙烯酸甲酯共聚物等,但並不限定於以上。In addition to component (B) mentioned above, the layer containing the hydrogenated block copolymer may further contain other olefinic resins and olefinic elastomers. Examples of components (B) and other olefinic resins and olefinic elastomers include, for example, α-olefin polymers or copolymers having 2 to 20 carbon atoms, copolymers of ethylene with unsaturated carboxylic acids or unsaturated carboxylic acid esters, but are not limited to the above. Examples include: ethylene-propylene copolymers, ethylene-1-butene copolymers, ethylene-1-hexene copolymers, ethylene-4-methylpentene copolymers, ethylene-1-octene copolymers, propylene homopolymers, propylene-ethylene copolymers, propylene-ethylene-1-butene copolymers, 1-butene homopolymers, 1-butene-ethylene copolymers, 1-butene-propylene copolymers, 4-methylpentene homopolymers, 4-methylpentene-1-propylene copolymers, 4-methylpentene-1-butene copolymers, 4-methylpentene-1-propylene-1-butene copolymers, propylene-1-butene copolymers, ethylene-vinyl acetate copolymers, ethylene-methacrylic acid copolymers, ethylene-methyl methacrylate copolymers, etc., but are not limited to the above.
包含氫化嵌段共聚物組合物之層亦可含有黏著賦予劑。 作為黏著賦予劑,例如可例舉:苯并呋喃-茚樹脂、對第三丁基苯酚-乙炔樹脂、苯酚-甲醛樹脂、二甲苯-甲醛樹脂、萜烯樹脂、氫化萜烯樹脂、萜烯-酚樹脂、氫化萜酚樹脂、芳香族改性萜烯樹脂、芳香族改性氫化酚樹脂、苯乙烯樹脂、α甲基苯乙烯樹脂、芳香族系烴樹脂、脂肪族系烴樹脂、脂肪族系環狀烴樹脂、脂肪族/脂環族系石油樹脂、脂肪族/芳香族系烴樹脂、氫化改性脂環族系烴樹脂、氫化脂環族系烴樹脂、烴系黏著化樹脂、聚丁烯、液狀聚丁二烯、順-1,4-聚異戊二烯橡膠、氫化聚異戊二烯橡膠、液狀聚異戊二烯橡膠、松脂系樹脂等,但並不限定於以上。Layers comprising hydrogenated block copolymer compositions may also contain adhesive preambles. Examples of adhesive preambles include: benzofuran-indene resin, p-tert-butylphenol-acetylene resin, phenol-formaldehyde resin, xylene-formaldehyde resin, terpene resin, hydrogenated terpene resin, terpene-phenol resin, hydrogenated terpene-phenol resin, aromatic modified terpene resin, aromatic modified hydrogenated phenol resin, styrene resin, α-methylstyrene resin, aromatic hydrocarbon resins, and aliphatic hydrocarbons. Resins, aliphatic cyclic hydrocarbon resins, aliphatic/alicyclic petroleum resins, aliphatic/aromatic hydrocarbon resins, hydrogenated modified alicyclic hydrocarbon resins, hydrogenated alicyclic hydrocarbon resins, hydrocarbon adhesive resins, polybutene, liquid polybutadiene, cis-1,4-polyisoprene rubber, hydrogenated polyisoprene rubber, liquid polyisoprene rubber, rosin-based resins, etc., but not limited to the above.
於無損本發明之目的之範圍內,包含氫化嵌段共聚物組合物之層除了上述成分以外,亦可進而包含其他添加劑。 作為其他添加劑,例如可例舉:熱穩定劑、抗氧化劑、紫外線吸收劑、抗老化劑、塑化劑、光穩定劑、結晶成核劑、衝擊改良劑、顏料、潤滑劑、防靜電劑、阻燃劑、阻燃助劑、及相容劑等。 該等添加劑可僅使用一種,亦可組合使用兩種以上。Without prejudice to the purpose of this invention, the layer comprising the hydrogenated block copolymer composition may further include other additives in addition to the aforementioned components. Examples of such other additives include: heat stabilizers, antioxidants, ultraviolet absorbers, anti-aging agents, plasticizers, light stabilizers, crystal nucleating agents, impact modifiers, pigments, lubricants, antistatic agents, flame retardants, flame retardant accelerants, and compatibilizers. Only one of these additives may be used, or two or more may be used in combination.
<構成上述第二成形體之氫化嵌段共聚物組合物製造方法> 構成第二成形體之氫化嵌段共聚物組合物之製造方法並無特別限定,可藉由先前公知之方法製造。 例如可使用利用加壓捏合機、班布里混合機、密閉混合機、Laboplastomill、MIX-LABO、單螺桿擠出機、雙螺桿擠出機、雙向捏合機、多螺桿擠出機等通常之混合機之熔融混練方法;於使各成分溶解或分散混合後,將溶劑加熱去除之方法等。 構成上述第二成形體之氫化嵌段共聚物組合物之形狀並無特別限定,例如可例舉:顆粒狀、片狀、繩狀、小片狀等。又,亦可於熔融混練後,直接製成成形品。<Method for Manufacturing the Hydrogenated Block Copolymer Composition Constituting the Second Molded Article> The method for manufacturing the hydrogenated block copolymer composition constituting the second molded article is not particularly limited and can be manufactured using previously known methods. For example, melt mixing methods using conventional mixers such as pressure kneaders, Bamboo mixers, closed mixers, Laboplastomills, MIX-LABO, single-screw extruders, twin-screw extruders, bidirectional kneaders, and multi-screw extruders can be used; methods such as removing the solvent by heating after dissolving or dispersing the components can also be used. The shape of the hydrogenated block copolymer composition constituting the second molded article is not particularly limited; examples include granules, flakes, ropes, and small flakes. Furthermore, the molded article can also be directly formed after melt mixing.
<包覆模製成形體之製造方法> 若包覆模製成形體分別包含1層以上之包含本實施方式之氫化嵌段共聚物組合物之層、及包含極性樹脂之層,則積層層數並無特別限定。 包覆模製成形體之層形成方法並無特別限定,可使用先前公知之方法,例如可使用擠出成形、射出成形(嵌入成形、雙色射出成形、夾層成形、中空成形、壓縮成形、真空成形、旋轉成形、粉末凝塑成形、發泡成形、積層成形、壓延成形、及吹塑成形。 包含本實施方式之氫化嵌段共聚物組合物之層較佳為熱融合於包含極性樹脂之層。更具體而言,包覆模製成形體之製造方法較佳為包括如下步驟之形態:使用選自由射出成形法、嵌入成形法、擠出成形法、及壓縮成形法所組成之群中之至少1種方法,使包含本實施方式之氫化嵌段共聚物組合物之層成形於已成形的包含極性樹脂之層上。 包覆模製成形體之製造方法亦可於該步驟之前,包括如下步驟:藉由任意方法,較佳為選自由射出成形法、嵌入成形法、擠出成形法、及壓縮成形法所組成之群中之至少1種方法,使包含極性樹脂之層成形。<Manufacturing Method of Overmolded Article> If the overmolded article comprises one or more layers of the hydrogenated block copolymer composition of this embodiment and layers of polar resin, the number of layers is not particularly limited. The layer forming method of the overmolded article is not particularly limited, and previously known methods can be used, such as extrusion molding, injection molding (embedding molding, two-color injection molding, sandwich molding, hollow molding, compression molding, vacuum molding, rotational molding, powder agglomeration molding, foam molding, lamination molding, calendering molding, and blow molding). The layer of the hydrogenated block copolymer composition comprising this embodiment is preferably thermally fused to the layer comprising a polar resin. More specifically, the method for manufacturing the overmolded body preferably includes the following steps: using at least one method selected from the group consisting of injection molding, insert molding, extrusion molding, and compression molding, to layer the hydrogenated block copolymer composition comprising this embodiment onto the pre-formed layer comprising a polar resin. The method for manufacturing the overmolded body may also include, prior to this step, the following step: using any method, preferably at least one method selected from the group consisting of injection molding, insert molding, extrusion molding, and compression molding, to layer the polar resin.
包覆模製成形體例如可形成為與汽車零件、工具、玩具、電氣、電子設備零件、醫療器具、建材、配管構件、餐具、生活、裝飾用品、工業零件、各種軟管、各種殼體、各種模組盒、各種功率控制單元零件、書寫工具、機器手、及醫療器具等各種用途相應之形狀。該等之中,較佳為具有把手者、及人觸摸需要握力或優良觸感者。作為此種成形體,例如可例舉:工具、電線、連接器、輕便電子設備、牙刷、電動剃刀、以及圓珠筆、觸控筆、及手寫筆之類的筆、以及叉子、刀子、及勺子之類的餐具、以及具有握把部之構件,但並不限定於以上。尤佳為因使用時之振動而對人體施加之負荷較大之電動工具。 作為構成上述握把部之構件,例如較佳為構成選自工具之握把、電線被覆構件、連接器殼體、輕便電子設備之握把、牙刷之握把、電動剃刀之握把、餐具之握把、書寫工具之握把、機器手之握把部、及汽車內飾構件之握把部中之至少一種。Overmolded bodies can be formed into shapes corresponding to various applications such as automotive parts, tools, toys, electrical and electronic equipment parts, medical devices, building materials, piping components, tableware, household and decorative items, industrial parts, various hoses, various housings, various module boxes, various power control unit components, writing instruments, robotic arms, and medical devices. Among these, those with handles and those requiring a strong grip or excellent tactile feedback are preferred. Examples of such molded bodies include, but are not limited to, tools, wires, connectors, portable electronic devices, toothbrushes, electric razors, pens such as ballpoint pens, styluses, and pen styluses, tableware such as forks, knives, and spoons, and components with handles. It is particularly preferred to use power tools that exert a greater load on the human body due to vibration during use. As a component constituting the above-mentioned grip, it is preferably at least one of the following: a tool grip, a wire sheath component, a connector housing, a grip for a portable electronic device, a toothbrush grip, a power razor grip, a cutlery grip, a writing instrument grip, a robotic hand grip, and a grip for an automotive interior component.
[第三成形體] 第三成形體為視目的含有樹脂組合物之總質量之5~99質量%、或5~80質量%、或超過8質量%且60質量%以下、或10~30質量%、或未達70質量%之本實施方式之氫化嵌段共聚物(甲)之樹脂組合物之成形體,且為含有聚烯烴樹脂10~40質量%作為其他樹脂成分之成形體。[Third Molded Body] The third molded body is a molded body of the hydrogenated block copolymer (A) of this embodiment containing 5 to 99% by mass, or 5 to 80% by mass, or more than 8% by mass and less than 60% by mass, or 10 to 30% by mass, or less than 70% by mass of the total mass of the resin composition, and is a molded body containing 10 to 40% by mass of polyolefin resin as other resin components.
構成第三成形體之樹脂組合物較佳為進而包含亦稱為硬化劑或硬化起始劑之自由基產生化合物。作為此種自由基產生化合物,例如可例舉:疊氮、過氧化物、硫及硫衍生物,但並不限定於以上。硬化起始劑作為自由基起始劑而尤佳。 亦稱為硬化觸媒之自由基產生化合物於高溫下、或UV(Ultra Violet,紫外線)照射下,進而於其他誘發能量添加下產生自由基。利用自由基產生化合物,樹脂組合物即便不存在UV或誘發能量亦能夠於低溫下進行加工,但於活化溫度下,或者於UV或誘發能量之導入下,會確實地產生高濃度之自由基。 作為自由基產生化合物,若於高溫下或添加UV照射等誘發能量,則可使用能夠生成自由基之任意化合物。 作為自由基產生化合物,例如可例舉:2,5-二甲基-2,5-二(過氧化第三丁基)-3-己炔、過氧化二第三丁基、過氧化第三丁基異丙苯基、二(過氧化第三丁基異丙基)苯、2,5-二甲基-2,5-二(過氧化第三丁基)己烷、過氧化二異丙苯等有機過氧化物,但並不限定於以上。 又,關於作為自由基產生化合物之典型之非過氧化起始劑,例如可例舉:2,3-二甲基-2,3-二苯基丁烷、2,3-三甲基矽烷氧基-2,3-二苯基丁烷等化合物。 又,關於作為自由基產生化合物之典型之UV自由基起始劑,可例舉2,2-二甲氧基-1,2二苯乙烷-1-酮。 硬化起始劑較佳為視目的以0.1~10質量%或0.3~7質量%或1~5質量%之量用於樹脂組合物中。The resin composition constituting the third molding preferably further includes a free radical generating compound, also known as a hardener or hardening initiator. Examples of such free radical generating compounds include, but are not limited to, azides, peroxides, sulfur, and sulfur derivatives. A hardening initiator is particularly preferred as a free radical initiator. The free radical generating compound, also known as a hardening catalyst, generates free radicals at high temperatures or under UV (Ultra Violet) irradiation, or further with the addition of other inducing energies. Using a free radical generating compound, the resin composition can be processed at low temperatures even in the absence of UV or inducing energy, but at activation temperatures, or with the introduction of UV or inducing energy, a high concentration of free radicals will be reliably generated. As a free radical generating compound, any compound capable of generating free radicals can be used if inducing energy such as high temperature or UV irradiation is added. Examples of free radical generating compounds include: 2,5-dimethyl-2,5-di(tert-butyl peroxide)-3-hexyne, ditert-butyl peroxide, tert-butyl isopropylphenyl peroxide, di(tert-butyl isopropyl)benzene, 2,5-dimethyl-2,5-di(tert-butyl peroxide)hexane, and diisopropylbenzene peroxide, but are not limited to these. Furthermore, typical non-peroxide initiators for free radical generating compounds include: 2,3-dimethyl-2,3-diphenylbutane and 2,3-trimethylsiloxy-2,3-diphenylbutane. Furthermore, 2,2-dimethoxy-1,2-diphenylethane-1-one is a typical example of a UV free radical initiator that is a free radical generating compound. The curing initiator is preferably used in the resin composition at an amount of 0.1–10% by mass, 0.3–7% by mass, or 1–5% by mass, depending on the intended use.
構成第三成形體之樹脂組合物亦可含有多官能性共硬化性添加劑、二烯系橡膠、鹵化或非鹵化阻燃劑、無機或有機填充劑或纖維、單乙烯系化合物、或抗氧化劑、著色劑或穩定劑、接著促進劑、強化劑、膜形成添加劑等本技術領域中公知之其他添加劑。又,亦可進而以樹脂組合物之0.1~50質量%之範圍之量包含其他添加劑。 樹脂組合物進而較佳為至少包含無機及/或有機填充劑。無機填充劑可用於抑制熱膨脹係數,改善積層片材之韌性。有機填充劑可用於降低積層片材之介電常數。The resin composition constituting the third molded body may also contain multifunctional co-curing additives, diene rubbers, halogenated or non-halogenated flame retardants, inorganic or organic fillers or fibers, monovinyl compounds, antioxidants, colorants or stabilizers, bonding accelerators, reinforcing agents, film-forming additives, and other additives known in the art. Furthermore, other additives may be included in an amount ranging from 0.1% to 50% by weight of the resin composition. The resin composition preferably contains at least inorganic and/or organic fillers. Inorganic fillers can be used to suppress the coefficient of thermal expansion and improve the toughness of the laminated sheet. Organic fillers can be used to reduce the dielectric constant of laminated sheets.
作為第三成形體,可例舉:預浸體、金屬積層板、CCL(Copper Clad Laminate,銅箔積層板)、印刷配線板、多層配線基板、及電子設備等,但並不限定於上述。Examples of third-order molding materials include: prepregs, metal laminates, CCLs (Copper Clad Laminates), printed wiring boards, multilayer wiring substrates, and electronic devices, but are not limited to the above.
[氫化嵌段共聚物之其他用途] (預浸體、金屬積層板) 本實施方式之氫化嵌段共聚物(甲)可用於金屬積層板用之介電化合物及利用其製作之印刷電路板。藉由使用本實施方式之氫化嵌段共聚物(甲),可獲得加工性良好、溶液黏度較低、具有優異之硬化性、軟化點溫度較高、於高頻下介電損耗因數較低、及介電常數特性較低之樹脂組合物,進而可由上述樹脂組合物獲得金屬箔與絕緣層之接著性優異之預浸體及金屬積層板。[Other Applications of Hydrogenated Block Copolymers] (Prepregs, Metal Laminates) The hydrogenated block copolymer (A) of this embodiment can be used as a dielectric compound for metal laminates and as a printed circuit board made therefrom. By using the hydrogenated block copolymer (A) of this embodiment, a resin composition with good processability, low solution viscosity, excellent curing properties, high softening temperature, low dielectric loss factor at high frequencies, and low dielectric constant can be obtained. Furthermore, prepregs and metal laminates with excellent adhesion between metal foils and insulating layers can be obtained from the aforementioned resin composition.
上述預浸體係指藉由使基布或補強布含浸包含本實施方式之氫化嵌段共聚物(甲)之樹脂組合物所獲得之經含浸後的織物。 金屬積層板係指印刷電路板或電路基板之基材。金屬積層板可藉由在浸漬於樹脂組合物中後之補強材料(例如纖維玻璃布)之單面或雙面積層金屬、例如銅包覆層所獲得。 具體而言,銅箔積層板(CCL)例如可藉由在1層以上之銅箔上積層1層以上之預浸體所獲得。積層係藉由將1組以上之銅與預浸體之重疊物於高溫、高壓力及真空條件下一同加壓而達成。 印刷電路板可藉由對CCL之銅表面進行蝕刻,製作電子電路所獲得。經蝕刻之CCL為了於層間確立電連接而裝配為具備貫通且經鍍覆處理之孔之多層構成。The aforementioned prepreg refers to an impregnated fabric obtained by impregnating a base fabric or reinforcing fabric with a resin composition comprising the hydrogenated block copolymer (A) of this embodiment. A metal laminate refers to the substrate of a printed circuit board or circuit board. A metal laminate can be obtained by laminating a metal, such as a copper cladding layer, on one or both sides of a reinforcing material (e.g., fiberglass cloth) impregnated with a resin composition. Specifically, a copper foil laminate (CCL) can be obtained, for example, by laminating one or more layers of prepreg on one or more layers of copper foil. Layering is achieved by pressing one or more layers of copper and prepreg together under high temperature, high pressure, and vacuum conditions. Printed circuit boards (CCLs) are obtained by etching the copper surface of the CCL to create electronic circuits. The etched CCL is assembled into a multi-layer structure with through-holes that have been plated to establish electrical connections between layers.
於製造預浸體或金屬積層板時,為了變更上述樹脂組合物之固形物成分,及為了調整樹脂組合物之黏度,可添加溶劑。 作為溶劑,例如可例舉:甲基乙基酮等酮;二丁醚等醚;乙酸乙酯等酯;二甲基甲醯胺等醯胺;苯、甲苯、二甲苯等芳香族烴;及三氯乙烯等氯化烴,但並不限定於以上。各溶劑可單獨使用一種,亦能夠以該等之組合使用。 較佳之溶劑選自由甲醇、乙醇、乙二醇甲醚、丙酮、甲基乙基酮、甲基異丁基酮、環己酮、甲苯、二甲苯、乙酸甲氧基乙酯、乙酸乙氧基乙酯、乙酸丙氧基乙酯、乙酸乙酯、二甲基甲醯胺、丙二醇甲醚、γ-丁內酯(GBL)及二異丁基酮(DIBK)所組成之群。 所使用之溶劑之量取決於成分之溶解度、填充劑之量、應用方法及其他因素。溶劑較佳為以相對於將溶液與固形物成分合計所得之總質量,包含10~50質量%之固形物成分、或15~40質量%之固形物成分之方式調整使用量。In the manufacture of prepregs or metal laminates, solvents may be added to change the solid composition of the resin composition and to adjust its viscosity. Examples of solvents include ketones such as methyl ethyl ketone; ethers such as dibutyl ether; esters such as ethyl acetate; amides such as dimethylformamide; aromatic hydrocarbons such as benzene, toluene, and xylene; and chlorinated hydrocarbons such as trichloroethylene, but are not limited to these. Each solvent may be used alone or in combination. Preferred solvents are selected from the group consisting of methanol, ethanol, ethylene glycol methyl ether, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, xylene, methoxyethyl acetate, ethoxyethyl acetate, propoxyethyl acetate, ethyl acetate, dimethylformamide, propylene glycol methyl ether, γ-butyrolactone (GBL), and diisobutyl ketone (DIBK). The amount of solvent used depends on the solubility of the components, the amount of filler, the application method, and other factors. The solvent is preferably adjusted to include 10–50% by mass or 15–40% by mass of solids relative to the total mass of the solution and solids.
於上述樹脂組合物中,可進而添加以下之添加劑:偶合劑、硬化促進劑、界面活性劑、強化劑、黏度調整劑、濕潤劑、抗氧化劑、著色劑等中之至少一種。 添加劑之選擇被用途、以及以增強電路組件之電特性或實質上不會造成不良影響之方式選擇之所需的特性,例如介電常數、介電損耗因數、介電損耗及/或其他所需之特性所左右。 硬化促進劑係為了使樹脂組合物之反應速度上升而添加。 界面活性劑係為了使無機填充劑均勻地分佈於樹脂組合物中、及防止無機填充劑之凝聚而添加。 強化劑係為了改善樹脂組合物之韌性而添加。In the above-mentioned resin composition, at least one of the following additives may be added: coupling agent, curing accelerator, surfactant, reinforcing agent, viscosity modifier, wetting agent, antioxidant, colorant, etc. The selection of additives is influenced by the intended use and the desired properties, such as dielectric constant, dielectric loss factor, dielectric loss, and/or other desired properties, chosen in a manner that enhances the electrical characteristics of the circuit components or does not substantially cause adverse effects. Curing accelerators are added to increase the reaction rate of the resin composition. Surfactants are added to ensure uniform distribution of inorganic fillers in the resin composition and to prevent the aggregation of inorganic fillers. The reinforcing agent is added to improve the toughness of the resin composition.
上述樹脂組合物能夠以全部樹脂組合物中之0.1~2質量%之量進而包含本技術領域中公知之接著促進劑,例如可形成金屬箔與複合體之含N雜環等金屬接著促進劑。藉此可增強金屬箔與樹脂組合物層之接著。接著促進劑亦能夠以水或有機溶劑之溶液或分散液之形態含有於電阻金屬層中。The aforementioned resin composition may further include, in an amount of 0.1 to 2% by mass, a bonding accelerator known in the art, such as an N-containing heterocyclic metal bonding accelerator capable of forming a metal foil and composite. This enhances the adhesion between the metal foil and the resin composition layer. The bonding accelerator may also be contained in the resistive metal layer in the form of a solution or dispersion in water or an organic solvent.
上述樹脂組合物可進而包含15質量%以下之接著促進聚合物,該接著促進聚合物選自由聚(伸芳基醚)、羧基官能化聚(伸芳基醚)、及利用順丁烯二酸酐進行官能化而成之苯乙烯-乙烯/丁烯-苯乙烯(SEBS)所組成之群中。 具體而言,硬化性樹脂組合物較佳為含有共聚物、選自硫硬化劑、及過氧化物硬化劑之硬化起始劑以及作為共硬化添加劑之二烯系橡膠。The aforementioned resin composition may further include up to 15% by weight of a subsequent promoting polymer, which is selected from the group consisting of poly(aryl ether), carboxyl-functionalized poly(aryl ether), and styrene-ethylene/butene-styrene (SEBS) functionalized with maleic anhydride. Specifically, the curing resin composition preferably contains a copolymer, a curing initiator selected from sulfur curing agents and peroxide curing agents, and a diene rubber as a co-curing additive.
上述樹脂組合物亦可進而含有聚苯醚樹脂、聚烯烴、苯乙烯系聚合物、苯乙烯系嵌段共聚物或氫化苯乙烯系嵌段共聚物、高Tg烴聚環烯烴等可溶性聚合物。以低量使用該等可溶性聚合物而用以對樹脂組合物進行改質,改善其膜形成能力、耐衝擊性、Tg、加工特性。The aforementioned resin composition may further contain soluble polymers such as polyphenylene ether resins, polyolefins, styrene-based polymers, styrene-based block copolymers or hydrogenated styrene-based block copolymers, and high-Tg polycyclic cycloenes. These soluble polymers are used in low amounts to modify the resin composition, improving its film-forming ability, impact resistance, Tg, and processing characteristics.
包含本實施方式之氫化嵌段共聚物(甲)之上述樹脂組合物中的任意選擇性之添加劑之量可視目的設為樹脂組合物之總量之0.1~25質量%、或超過0.2質量%、或超過0.5質量%、或未達10質量%、或未達15質量%之範圍。The amount of any selective additive in the above-mentioned resin composition containing the hydrogenated block copolymer (A) of this embodiment may be set as 0.1 to 25% by mass of the total amount of the resin composition, or more than 0.2% by mass, or more than 0.5% by mass, or less than 10% by mass, or less than 15% by mass, depending on the purpose.
包含本實施方式之氫化嵌段共聚物(甲)之上述樹脂組合物適合用於印刷電路板用之積層體,例如銅箔積層體。 上述積層體可藉由使樹脂組合物含浸於基板或補強材料例如玻璃系纖維、織布、混織(cross ply)積層體等,繼而使樹脂組合物部分或整體地硬化,形成預浸體而製造。為了製作積層體,於1層以上之預浸體上積層1層以上之銅。印刷電路板可用於大量高頻高資料速度之電氣及電子用途。The resin composition comprising the hydrogenated block copolymer (A) of this embodiment is suitable for use in laminates for printed circuit boards, such as copper foil laminates. The laminate can be manufactured by impregnating a substrate or reinforcing material, such as glass fibers, fabrics, or cross-ply laminates, with the resin composition partially or entirely cured to form a prepreg. To manufacture the laminate, one or more layers of copper are deposited on one or more layers of prepreg. Printed circuit boards can be used in a wide range of high-frequency, high-data-speed electrical and electronic applications.
作為用以製作高頻CCL或電路基板之一種方法,例如可例舉以下方法。 混合上述成分,獲得樹脂組合物,該上述成分包含本實施方式之氫化嵌段共聚物(甲)、硬化起始劑、及任意選擇之成分,例如二烯系聚合物等多官能性共硬化劑、阻燃劑、及其他任意選擇之成分,上述樹脂組合物使用溶劑例如甲苯、二甲苯、甲基乙基酮(MEK)、及其等之混合物稀釋為適當之黏度,形成膠液或清漆。將補強材料或基板,例如纖維、玻璃毛氈、木材紙漿紙、纖維玻璃布(已任意選擇性地利用偶合劑進行了處理)於膠液或清漆中含浸至所需之厚度。其次,藉由溶劑蒸發,自經含浸之纖維玻璃布中去除溶劑,形成預浸體。 上述預浸體係藉由如下方法形成:於未達硬化起始劑之活化溫度之溫度下使溶劑蒸發,或者以足以溶劑蒸發但未達到凝膠化時間之時間使溶劑蒸發。凝膠化時間係指材料開始軟化後至產生凝膠化為止之時間,凝膠化為自黏性液體向彈性凝膠之不可逆之變化。預浸體係藉由使樹脂組合物含浸於基板例如纖維品,使所獲得之含浸後之基板半硬化,或者使經塗佈之纖維與進一步之樹脂組合物一同熱壓而形成,或者不帶樹脂組合物地進行熱壓而形成。 其次,藉由將預浸體積層於銅箔之間,並於150~250℃之溫度及20 kg/cm2~70 kg/cm2之壓力下硬化,形成高頻CCL或電路基板。As a method for manufacturing high-frequency CCLs or circuit substrates, the following method can be exemplified. The above-mentioned components are mixed to obtain a resin composition comprising the hydrogenated block copolymer (A) of this embodiment, a curing initiator, and optional components, such as multifunctional co-curing agents like diene polymers, flame retardants, and other optional components. The resin composition is diluted to a suitable viscosity using a solvent such as toluene, xylene, methyl ethyl ketone (MEK), and mixtures thereof to form a glue or varnish. A reinforcing material or substrate, such as fiber, glass felt, wood pulp paper, or fiberglass cloth (optionally treated with a coupling agent), is impregnated in the glue or varnish to the desired thickness. Next, the solvent is removed from the impregnated fiberglass cloth by solvent evaporation to form a prepreg. The prepreg is formed by evaporating the solvent at a temperature below the activation temperature of the curing initiator, or for a time sufficient for solvent evaporation but not reaching the gelation time. The gelation time refers to the time from when the material begins to soften until gelation occurs; gelation is the irreversible change from a self-adhesive liquid to an elastic gel. Prepreg is formed by impregnating a substrate, such as a fiber, with a resin composition, resulting in a semi-cured substrate; or by hot-pressing coated fibers together with a further resin composition; or by hot-pressing without a resin composition. Next, a high-frequency CCL or circuit substrate is formed by building up the prepreg between copper foils and curing it at a temperature of 150–250°C and a pressure of 20 kg/ cm² –70 kg/ cm².
[發泡體] 本實施方式之成形體亦可為發泡體。 本實施方式之發泡體通常可藉由在本實施方式之氫化嵌段共聚物組合物中添加發泡劑(戊),並使其發泡而獲得。 發泡方法有化學方法或物理方法,均只要添加無機系發泡劑或有機系發泡劑等化學發泡劑、或物理發泡劑,其後藉由加熱等使發泡劑揮發及/或分解,使氣泡分佈於氫化嵌段共聚物組合物內部即可。藉由將氫化嵌段共聚物組合物之成形體製成發泡體,可謀求輕量化、柔軟性之提高、設計性之提高、制振、吸音特性之提高、隔熱特性之提高等。[Foamed Body] The molded body of this embodiment can also be a foamed body. The foamed body of this embodiment is typically obtained by adding a foaming agent (E) to the hydrogenated block copolymer composition of this embodiment and causing it to foam. Foaming methods can be chemical or physical. Both methods involve adding an inorganic or organic foaming agent, or a physical foaming agent, and then using heating or similar methods to volatilize and/or decompose the foaming agent, causing bubbles to distribute within the hydrogenated block copolymer composition. By making the molded body of the hydrogenated block copolymer composition into a foamed body, it is possible to achieve improvements in lightweighting, flexibility, designability, vibration damping, sound absorption, and thermal insulation properties.
(發泡劑(戊)) 作為上述發泡劑,可使用無機系發泡劑、或有機系發泡劑、物理發泡劑。 作為無機系發泡劑,例如可例舉:碳酸氫鈉、碳酸銨、碳酸氫銨、亞硝酸銨、疊氮化合物、硼氫化鈉、乙酸鋁、金屬粉等,但並不限定於以上。 作為有機系發泡劑,例如可例舉:偶氮二甲醯胺(Azodicarbonamide)、偶氮二甲醯胺(Azobisformamide)、偶氮二異丁腈、偶氮二羧酸鋇、N,N'-二亞硝基五亞甲基四胺、N,N'-二亞硝基-N,N'-二甲基對苯二甲醯胺、苯磺醯肼、對甲苯磺醯肼、對,對'-氧基雙苯磺醯肼、對甲苯磺醯胺基脲等,但並不限定於以上。 作為物理發泡劑,例如可例舉:戊烷、丁烷、己烷等烴;氯甲烷、二氯甲烷等鹵代烴;氮氣、二氧化碳、空氣等氣體;三氯氟甲烷、二氯二氟甲烷、三氯三氟乙烷、氯二氟乙烷、氫氟碳等氟化烴等,但並不限定於以上。 又,該等發泡劑亦可組合使用。 發泡劑之調配量相對於本實施方式之氫化嵌段共聚物或氫化嵌段共聚物組合物100質量份,較佳為0.1~30質量份,更佳為2~25質量份,進而較佳為3~20質量份。(Foaming Agent (E)) As the above-mentioned foaming agent, inorganic foaming agents, organic foaming agents, or physical foaming agents can be used. Examples of inorganic foaming agents include: sodium bicarbonate, ammonium carbonate, ammonium bicarbonate, ammonium nitrite, azide compounds, sodium borohydride, aluminum acetate, metal powder, etc., but are not limited to the above. Examples of organic foaming agents include: azodicarbonamide, azobisformamide, azobisisobutyronitrile, barium azodicarboxylate, N,N'-dinitrospentamethylenetetramine, N,N'-dinitroso-N,N'-dimethylphenylenedimethylamine, benzenesulfonamide, p-toluenesulfonamide, p,p'-oxybisbenzenesulfonamide, p-toluenesulfonamide, etc., but are not limited to the above. Examples of physical blowing agents include: pentane, butane, hexane, etc.; halogenated hydrocarbons such as chloromethane, dichloromethane, etc.; gases such as nitrogen, carbon dioxide, and air; and fluorinated hydrocarbons such as trichlorofluoromethane, dichlorodifluoromethane, trichlorotrifluoroethane, dichlorodifluoroethane, and hydrofluorocarbons, but are not limited to the above. Furthermore, these blowing agents can also be used in combination. The amount of blowing agent prepared relative to 100 parts by weight of the hydrogenated block copolymer or hydrogenated block copolymer combination of this embodiment is preferably 0.1 to 30 parts by weight, more preferably 2 to 25 parts by weight, and even more preferably 3 to 20 parts by weight.
(發泡助劑) 於上述發泡體之製作步驟中,可與發泡助劑一同使用發泡劑。 作為發泡助劑,並無特別限定,可使用先前作為發泡助劑所通用者。 例如可例舉:脲化合物;氧化鋅、硬脂酸鋅、苯亞磺酸鋅、甲苯磺酸鋅、三氟甲磺酸鋅、碳酸鋅等鋅化合物;二氧化鉛、及三鹼式鉛等鉛化合物等。 於併用發泡劑與發泡助劑之情形時,其調配量相對於發泡劑100質量份,較佳為將發泡助劑設為0.1~1000質量份,更佳為設為0.5~500質量份,進而較佳為設為1~200質量份。(Foaming Aid) In the above-described steps for manufacturing foamed materials, a foaming agent may be used together with the foaming agent. There are no particular limitations on the type of foaming agent used; commonly used foaming agents can be used. Examples include: urea compounds; zinc compounds such as zinc oxide, zinc stearate, zinc benzenesulfonate, zinc toluenesulfonate, zinc trifluoromethanesulfonate, and zinc carbonate; lead compounds such as lead dioxide and tribasic lead. When using both a foaming agent and a foaming aid, the mixing amount is preferably 0.1 to 1000 parts by weight of the foaming aid, more preferably 0.5 to 500 parts by weight, and even more preferably 1 to 200 parts by weight, relative to 100 parts by weight of the foaming agent.
(發泡成核劑) 於上述發泡體之製作步驟中,可使用發泡成核劑。 作為發泡成核劑,並無特別限定,可使用先前作為發泡成核劑而通用者。 例如可例舉:氧化鈦、滑石、高嶺土、黏土、矽酸鈣、二氧化矽、檸檬酸鈉、碳酸鈣、矽藻土、煅燒波來鐵、沸石、膨潤土、玻璃、石灰石、硫酸鈣、氧化鋁、氧化鈦、碳酸鎂、碳酸鈉、碳酸鐵、聚四氟乙烯粉末。 關於發泡成核劑之調配量,相對於本實施方式之氫化嵌段共聚物或氫化嵌段共聚物組合物100質量份,較佳為將發泡成核劑設為0.01~100質量份,更佳為0.05~50質量份,進而較佳為0.1~10質量份。(Foaming Nucleating Agent) A foaming nucleating agent may be used in the above-described foam manufacturing steps. There are no particular limitations on the type of foaming nucleating agent used; any commonly used foaming nucleating agent may be used. Examples include: titanium oxide, talc, kaolin, clay, calcium silicate, silicon dioxide, sodium citrate, calcium carbonate, diatomaceous earth, calcined iron oxide, zeolite, bentonite, glass, limestone, calcium sulfate, alumina, titanium oxide, magnesium carbonate, sodium carbonate, ferric carbonate, and polytetrafluoroethylene powder. Regarding the amount of foaming nucleating agent, relative to 100 parts by weight of the hydrogenated block copolymer or hydrogenated block copolymer composition of this embodiment, it is preferred that the amount of foaming nucleating agent be set to 0.01 to 100 parts by weight, more preferably 0.05 to 50 parts by weight, and even more preferably 0.1 to 10 parts by weight.
(發泡體之使用例) 本實施方式之發泡體可應用於片材或膜或其他各種形狀之射出成形品、中空成形品、壓空成形品、真空成形品、擠出成形品等。 又,本實施方式之發泡體可廣泛地用於汽車內飾材料(儀錶板、車門板、座椅靠背板、方向盤等)、家電製品、工具、傢俱(緩衝部等)、住宅建材等需要緩衝性之構件。 於將本實施方式之發泡體用於汽車內飾材料用途之情形時,作為所使用之發泡劑,從低健康有害性之觀點出發,較佳為碳酸氫鈉或氮氣、二氧化碳、空氣等氣體。(Examples of Application of Foamed Materials) The foamed material of this embodiment can be applied to injection-molded, hollow-molded, compressed-molded, vacuum-molded, and extruded products of various shapes, such as sheets, films, or other materials. Furthermore, the foamed material of this embodiment can be widely used in automotive interior materials (dashboards, door panels, seat back panels, steering wheels, etc.), household appliances, tools, furniture (buffers, etc.), and residential building materials—components requiring cushioning. When using the foamed material of this embodiment in automotive interior materials, from a low health hazard perspective, the foaming agent used is preferably sodium bicarbonate, nitrogen, carbon dioxide, air, or other gases.
(射出成形發泡之方法) 本實施方式之發泡體可藉由射出成形發泡來製作。 作為射出成形發泡之方法,並無特別限制,可例舉:短射法、全射法、抽芯法等。 藉由使用上述方法,可於相同之步驟內使具有緩衝性之發泡層、及褶皺面等具有設計性或與發泡層相比具有硬度之表層成形,故對削減成形步驟較有效。 又,作為射出成形發泡之方法,於應用抽芯法時,亦可基於消除成形體表面之旋渦痕(swirl mark)之目的等而使用反壓(Counter Pressure)裝置。(Injection Molding Foaming Method) The foam body of this embodiment can be manufactured by injection molding foaming. There are no particular limitations on the injection molding foaming method; examples include short-shot method, full-shot method, and core-pulling method. By using the above methods, a cushioned foam layer and a surface layer with design features or higher hardness compared to the foam layer, such as wrinkles, can be formed in the same steps, thus reducing the number of molding steps. Furthermore, when using the core-pulling method in injection molding foaming, a counter pressure device can be used to eliminate swirl marks on the surface of the molded body.
(適於發泡體之成形之氫化嵌段共聚物組合物) 發泡體之成形中之本實施方式之氫化嵌段共聚物組合物中的氫化嵌段共聚物(甲)之含量較佳為1質量%以上且50質量%以下,更佳為10質量%以上且49質量%以下,進而較佳為20質量%以上且48質量%以下。 若氫化嵌段共聚物組合物中之氫化嵌段共聚物(甲)之含量處於上述範圍內,則於發泡體成形時有氣泡微細且氣泡之獨立性增高(發泡性增高)之傾向,故可期待隔熱性之提高或長期之氣泡穩定性、或改善抽芯成形時之成形外觀(抑制縮痕、凹坑、旋渦痕等)。 又,本實施方式之氫化嵌段共聚物(甲)之依據JIS K7210於溫度230℃、荷重2.16 kg之條件下測定的MFR(Melt Flow Rate,熔體流動速率)為10以上,於發泡體成形中所使用之氫化共聚物組合物中之氫化嵌段共聚物(甲)中,上述MFR較佳為15以上,更佳為30以上,進而較佳為50以上。 若MFR較高,則可獲得良好之加工性,可期待改善發泡體成形時之成形外觀(抑制縮痕、凹坑、旋渦痕)、或提高發泡倍率。 發泡倍率之較佳之範圍取決於用途,但通常較佳為1.5倍以上,更佳為1.75倍以上。由於倍率較高,故可謀求輕量化、柔軟性之提高、設計性之提高、制振、吸音特性之提高、隔熱特性之提高。(Hydrogenated block copolymer composition suitable for foam molding) In the molding of foam, the content of hydrogenated block copolymer (A) in the hydrogenated block copolymer composition of this embodiment is preferably 1% by mass or more and 50% by mass or less, more preferably 10% by mass or more and 49% by mass or less, and even more preferably 20% by mass or more and 48% by mass or less. If the content of hydrogenated block copolymer (A) in the hydrogenated block copolymer composition is within the above range, there is a tendency for finer bubbles and increased bubble independence (increased foaming property) during foam molding. Therefore, it is expected to improve thermal insulation or long-term bubble stability, or improve the molding appearance during core pulling (suppressing shrinkage marks, pits, vortex marks, etc.). Furthermore, the MFR (Melt Flow Rate) of the hydrogenated block copolymer (A) in this embodiment, measured according to JIS K7210 at a temperature of 230°C and a load of 2.16 kg, is 10 or higher. In the hydrogenated block copolymer (A) of the hydrogenated copolymer composition used in foam molding, the aforementioned MFR is preferably 15 or higher, more preferably 30 or higher, and even more preferably 50 or higher. A higher MFR results in better processability, and can be expected to improve the molding appearance of the foam (suppressing shrinkage marks, pits, and swirl marks) or increase the foaming ratio. The preferred range of the foaming ratio depends on the application, but is generally preferably 1.5 times or higher, and more preferably 1.75 times or higher. Due to the higher magnification, it is possible to achieve improvements in lightweighting, flexibility, design, vibration damping, sound absorption, and heat insulation.
發泡體成形中所使用之氫化嵌段共聚物組合物中之烯烴系樹脂(乙)之含量較佳為5質量%以上且50質量%以下,更佳為8質量%以上且45質量%以下,進而較佳為12質量%以上且40質量%以下。 若烯烴系樹脂(乙)之含量處於上述範圍內,則有發泡性與柔軟性之平衡變得良好之傾向。The content of olefinic resin (ethyl) in the hydrogenated block copolymer composition used in foam molding is preferably 5% by mass or more and 50% by mass or less, more preferably 8% by mass or more and 45% by mass or less, and even more preferably 12% by mass or more and 40% by mass or less. If the content of olefinic resin (ethyl) is within the above range, there is a tendency for a good balance between foamability and softness.
發泡體成形中所使用之氫化嵌段共聚物組合物中之熱塑性樹脂(丙)之含量較佳為1質量%以上且50質量%以下,更佳為5質量%以上且40質量%以下,進而較佳為10質量%以上且30%以下。 若熱塑性樹脂(丙)之含量處於上述範圍內,則有發泡性與柔軟性之平衡變得良好之傾向。The thermoplastic resin (propylene) content in the hydrogenated block copolymer composition used in foam molding is preferably 1% by mass or more and 50% by mass or less, more preferably 5% by mass or more and 40% by mass or less, and even more preferably 10% by mass or more and 30% by mass or less. If the thermoplastic resin (propylene) content is within the above range, there is a tendency for a good balance between foamability and softness.
發泡體成形中所使用之氫化嵌段共聚物組合物中之軟化劑(丁)之含量較佳為5質量%以上且90質量%以下,更佳為10質量%以上且70質量%以下,進而較佳為20質量%以上且36質量%以下。 若軟化劑(丁)之含量處於上述範圍內,則有發泡性與柔軟性之平衡變得良好之傾向。 [實施例]The content of softener (D) in the hydrogenated block copolymer composition used in foam molding is preferably 5% by mass or more and 90% by mass or less, more preferably 10% by mass or more and 70% by mass or less, and even more preferably 20% by mass or more and 36% by mass or less. If the content of softener (D) is within the above range, a good balance between foamability and softness tends to be achieved. [Example]
以下,例舉具體之實施例及比較例對本發明詳細地進行說明,但本發明並不受以下之實施例及比較例之任何限定。 下文對實施例及比較例中所應用之物性之測定方法、評價方法進行闡述。The present invention will be described in detail below with specific embodiments and comparative examples, but the present invention is not limited by the following embodiments and comparative examples. The methods for measuring and evaluating the physical properties applied in the embodiments and comparative examples will be explained below.
[共聚物之結構之特定方法] ((1)氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元(苯乙烯)之含量) 使用氫化嵌段共聚物,利用紫外分光光度計(島津製作所製造,UV-2450),測定氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元(苯乙烯)之含量。[Specific method for the structure of copolymers] ((1) Content of all vinyl aromatic monomer units (styrene) in hydrogenated block copolymer (A) Using hydrogenated block copolymer, the content of all vinyl aromatic monomer units (styrene) in hydrogenated block copolymer (A) was determined using a UV spectrophotometer (manufactured by Shimadzu Corporation, UV-2450).
((2-1)氫化嵌段共聚物(甲)中之將乙烯基芳香族單體單元作為主體之聚合物嵌段(聚苯乙烯嵌段)(a)之含量) 使用氫化嵌段共聚物,並使用核磁共振裝置(NMR)(Y. Tanaka, et al., RUBBER CHEMISTRY and TECHNOLOGY 54, 685 (1981)中所記載之方法。以下稱為「NMR法」),測定氫化嵌段共聚物(甲)中之將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)之含量。((2-1) Content of polymer blocks (polystyrene blocks) with vinyl aromatic monomers as the main component in hydrogenated block copolymer (A)) Using hydrogenated block copolymer, the content of polymer blocks (a) with vinyl aromatic monomers as the main component in hydrogenated block copolymer (A) was determined using nuclear magnetic resonance (NMR) apparatus (Y. Tanaka, et al., RUBBER CHEMISTRY and TECHNOLOGY 54, 685 (1981). Hereinafter referred to as "NMR method").
((2-2)氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量) 藉由算出(100-氫化嵌段共聚物(甲)中之氫化共聚物嵌段(a)之含量),求出氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量。((2-2) Content of hydrogenated copolymer block (b) in hydrogenated block copolymer (A)) By calculating (100 - Content of hydrogenated copolymer block (a) in hydrogenated block copolymer (A), the content of hydrogenated copolymer block (b) in hydrogenated block copolymer (A) can be determined.
((3)氫化嵌段共聚物(甲)中之乙烯基鍵量) 使用氫化嵌段共聚物,並使用核磁共振裝置(NMR)測定乙烯基鍵量。氫化嵌段共聚物(甲)中之共軛二烯單體單元中之乙烯基鍵量係藉由如下比率求出,該比率為與NMR測定中獲得之波峰中之共軛二烯單體單元相關的1,2-鍵及3,4-鍵之波峰合計面積相對於所有波峰(1,2-鍵、3,4-鍵之比率、及1,4-鍵)之合計面積之比率。((3) Vinyl bond content in hydrogenated block copolymer (A)) Hydrogenated block copolymers were used, and the vinyl bond content was determined using nuclear magnetic resonance (NMR). The vinyl bond content in the conjugated diene monomer units in hydrogenated block copolymer (A) was determined by the following ratio, which is the ratio of the total area of the peaks of 1,2-bonds and 3,4-bonds associated with the conjugated diene monomer units obtained in the NMR determination to the total area of all peaks (the ratio of 1,2-bonds, 3,4-bonds, and 1,4-bonds).
((4)氫化嵌段共聚物(甲)之重量平均分子量、分子量分佈) 使用氫化嵌段共聚物,利用GPC[裝置:HLC-82209PC(東曹公司製造),管柱:TSKgeguard colum SuperHZ-L(4.6 mm×20 cm)×3根]進行測定。 溶劑使用四氫呋喃。測定係於溫度35℃下進行。 重量平均分子量係使用根據市售之標準聚苯乙烯之測定求出之校準曲線(使用標準聚苯乙烯之波峰分子量而製作),求出層析圖之波峰之分子量。 再者,於在層析圖中存在複數個波峰之情形時,將根據各波峰之分子量與各波峰之組成比(根據層析圖之各波峰之面積比求出)求出之平均分子量設為重量平均分子量(Mw)。 關於分子量分佈(Mw/Mn),亦同樣地利用GPC測定數量平均分子量(Mn),並根據Mw/Mn之比率算出。((4) Weight-average molecular weight and molecular weight distribution of hydrogenated block copolymer (A)) Hydrogenated block copolymers were used, and the molecular weight was determined using GPC [Apparatus: HLC-82209PC (manufactured by Tosoh Corporation), column: TSK Geguard column SuperHZ-L (4.6 mm × 20 cm) × 3]. Tetrahydrofuran was used as the solvent. The determination was performed at a temperature of 35°C. The weight-average molecular weight was determined by using a calibration curve (made using the peak molecular weight of standard polystyrene) obtained from the determination of commercially available standard polystyrene, and the molecular weight of the peaks in the chromatogram was obtained. Furthermore, when there are multiple peaks in the chromatogram, the average molecular weight (Mw) obtained by calculating the molecular weight of each peak and the composition ratio of each peak (determined by the area ratio of each peak in the chromatogram) was set as the weight-average molecular weight. Regarding the molecular weight distribution (Mw/Mn), the number average molecular weight (Mn) was also determined using GPC and calculated based on the Mw/Mn ratio.
((5)氫化嵌段共聚物(甲)之共軛二烯單體單元之雙鍵之氫化率) 使用氫化嵌段共聚物,並使用核磁共振裝置(JEOL RESONANCE公司製造,測定ECS400),測定氫化嵌段共聚物(甲)之共軛二烯單體單元之雙鍵之氫化率。((5) Hydrogenation rate of double bonds in conjugated diene monomer units of hydrogenated block copolymer (A)) Hydrogenated block copolymer was used, and the hydrogenation rate of double bonds in conjugated diene monomer units of hydrogenated block copolymer (A) was determined using a nuclear magnetic resonance apparatus (manufactured by JEOL RESONANCE, ECS400).
((6-1)相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS、氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量) 根據上述(1)中測定之氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元之含量、與上述(2-1)中測定之氫化嵌段共聚物(甲)中之將乙烯基芳香族單體單元作為主體之聚合物嵌段(a)之含量的差,算出相對於聚合物整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元含量RS,且根據與上述(2-2)中測定之氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量之比,算出氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量。((6-1) The content RS of vinyl aromatic monomers in the hydrogenated copolymer block (b) relative to the total content of vinyl aromatic monomers in the hydrogenated block copolymer (A) and the content of vinyl aromatic monomers in the hydrogenated copolymer block (b)) Based on the difference between the content of all vinyl aromatic monomers in the hydrogenated block copolymer (A) measured in (1) above and the content of polymer blocks (a) in the hydrogenated block copolymer (A) with vinyl aromatic monomers as the main component measured in (2-1) above, the content RS of vinyl aromatic monomers in the hydrogenated copolymer block (b) relative to the total content of vinyl aromatic monomers in the polymer is calculated. Based on the ratio of the content of the hydrogenated copolymer block (b) in the hydrogenated block copolymer (A) measured in (2-2) above, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) is calculated.
((6-2)氫化共聚物嵌段(b)中之共軛二烯單體單元相對於氫化嵌段共聚物(甲)整體之含量) 藉由自氫化嵌段共聚物(甲)中之氫化共聚物嵌段(b)之含量減去相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量而求出。((6-2) Content of congypsum diene monomer units in hydrogenated copolymer block (b) relative to the total content of hydrogenated copolymer (A)) is obtained by subtracting the content of vinyl aromatic monomer units in hydrogenated copolymer block (b) relative to the total content of hydrogenated copolymer (A) from the content of hydrogenated copolymer block (b) in hydrogenated copolymer (A).
[氫化嵌段共聚物之物性之測定方法] ((7)tanδ波峰溫度) 將如下所述般製造之「氫化嵌段共聚物之加壓成形片材」切割為寬度12.5 mm、長度40 mm之尺寸而設為測定用樣品。 其次,將該測定用樣品設定為裝置ARES(TA Instruments股份有限公司製造,商品名)之扭轉型幾何形狀,於有效測定長度25 mm、應變0.5%、頻率1 Hz、升溫速度3℃/min之條件下,求出-20~60℃之tanδ波峰溫度。 tanδ波峰溫度設為根據利用RSI Orchestrator(TA Instruments股份有限公司製造,商品名)之自動測定而檢測到之波峰求出之值。[Method for Determining the Physical Properties of Hydrogenated Block Copolymers] ((7) Tanδ Peak Temperature) A "compression-molded sheet of hydrogenated block copolymer" manufactured as described below was cut into dimensions of 12.5 mm in width and 40 mm in length and set as a test sample. Next, the test sample was set to a torsion geometry of the device ARES (manufactured by TA Instruments Co., Ltd., trade name), and the tanδ peak temperature from -20 to 60°C was determined under the conditions of an effective measurement length of 25 mm, a strain of 0.5%, a frequency of 1 Hz, and a heating rate of 3°C/min. The tanδ peak temperature was set as the value obtained from the peak detected by the automatic measurement using the RSI Orchestrator (manufactured by TA Instruments Co., Ltd., trade name).
((8)tanδ峰高) 將上述(7)中求出之-20~60℃之tanδ波峰溫度下的tanδ之值設為-20~60℃之tanδ峰高。((8) tanδ peak height) Set the value of tanδ at the tanδ peak temperature of -20 to 60℃ obtained in (7) above as the tanδ peak height of -20 to 60℃.
((9)硬度) 製成如下所述般製造之「氫化嵌段共聚物之加壓成形片材」測定用樣品。 依據JIS K6253,利用A型硬度計分別測定瞬時之值。 對使硬度測定器之探針降下至測定用樣品上之瞬時之硬度值進行測定。 於下述表4~表5中,記載為硬度(JIS-A,瞬時)。(9) Hardness) A test sample of "hydrogenated block copolymer compression molding sheet" manufactured as described below was prepared. The instantaneous values were measured using a type A hardness tester according to JIS K6253. The instantaneous hardness value was measured when the probe of the hardness tester was lowered onto the test sample. The hardness (JIS-A, instantaneous) is recorded in Tables 4 and 5 below.
((10)熔體流動速率(MFR,單位:g/10 min)) 製成如下所述般製造之「氫化嵌段共聚物之加壓成形片材」測定用樣品。 依據JIS K7210,於溫度230℃、荷重2.16 kg之條件下進行MFR之測定。((10) Melt Flow Rate (MFR, unit: g/10 min)) A sample for testing "compression-molded sheet of hydrogenated block copolymer" was prepared as described below. The MFR was measured at a temperature of 230°C and a load of 2.16 kg in accordance with JIS K7210.
[使用氫化嵌段共聚物之成形體之特性之評價方法] ((11)耐磨耗性) 使用學振型摩擦試驗器(TESTER SANGYO股份有限公司製造,AB-301型),以摩擦布細白布3號棉、荷重500 g,對藉由下述[射出成形片材之製作]而製作之射出成形片材表面(皮紋加工面)進行摩擦,根據摩擦後之體積減少量,依據以下之基準評價耐磨耗性。 <評價基準> 5:摩擦次數50000次後,體積減少量未達0.01 ml 4:摩擦次數50000次後,體積減少量為0.01 ml以上且未達0.05 ml 3:摩擦次數50000次後,體積減少量為0.05 ml以上且未達0.10 ml 2:摩擦次數50000次後,體積減少量為0.10 ml以上且未達0.15 ml 1:摩擦次數50000次後,體積減少量超過0.15 ml[Evaluation Method for the Properties of Molded Articles Using Hydrogenated Block Copolymers] ((11) Abrasion Resistance) Using a vibration-type friction tester (manufactured by TESTER SANGYO Co., Ltd., AB-301 type), the surface (leather-textured surface) of the injection-molded sheet produced by the [production of injection-molded sheet] below is rubbed with a friction cloth of fine white cotton No. 3 and a load of 500 g. The abrasion resistance is evaluated according to the following criteria based on the amount of volume reduction after friction. <Evaluation Criteria> 5: After 50,000 friction cycles, the volume reduction is less than 0.01 ml. 4: After 50,000 friction cycles, the volume reduction is 0.01 ml or more but less than 0.05 ml. 3: After 50,000 friction cycles, the volume reduction is 0.05 ml or more but less than 0.10 ml. 2: After 50,000 friction cycles, the volume reduction is 0.10 ml or more but less than 0.15 ml. 1: After 50,000 friction cycles, the volume reduction exceeds 0.15 ml.
可判定為耐磨耗性合格之評分為3分以上,且分數越高,就於使用上述更薄壁/複雜之成形體之情形時,以更高之荷重或眼較粗之布料進行磨耗時之耐久性提高、調配自由度提高之觀點而言,評價為越優異。 若耐磨耗性良好,則可於汽車材料等中,用於要求更嚴格之耐磨耗性之用途。例如,於汽車內飾材料等中,於以更薄壁成形時或更複雜/大型之成形體成形時,亦不遜色於簡易之形狀且小型之通常之成形體,且可期待於使用更長時間之情形時亦維持材料之外觀。 又,於假定乘車時因更高之荷重或眼較粗之布料(例如眼粗於細白布3號之類的棉布料之布料即粗斜紋棉布布料等)而受到磨耗之情形,亦可期待長時間維持材料外觀。 又,若耐磨耗性良好,則有於本實施方式之氫化嵌段共聚物組合物中氫化嵌段共聚物(甲)調配量下限降低,調配自由度提高之傾向。 通常有氫化嵌段共聚物組合物中之氫化嵌段共聚物(甲)之調配量越多,則耐磨耗性變得越良好之傾向,但有氫化嵌段共聚物(甲)之調配量越少,則耐油性或材料成本等變得越良好之傾向,故調配量之下限較佳為較低。A score of 3 or higher is considered acceptable for abrasion resistance. A higher score indicates better durability and greater flexibility in applications involving thinner-walled or more complex molded bodies, especially under heavier loads or with coarser fabrics. Good abrasion resistance allows for applications requiring stringent abrasion resistance, such as automotive materials. For example, in automotive interior materials, it performs comparably to simpler, smaller molded bodies when molded with thinner walls or more complex/larger shapes, and its appearance can be expected to remain consistent over longer periods of use. Furthermore, even assuming wear and tear during travel due to higher loads or coarser fabrics (e.g., coarse twill cotton fabric with a coarser weave than fine white cotton No. 3), the material's appearance can be expected to be maintained for a long time. Also, if abrasion resistance is good, there is a tendency to lower the lower limit of the amount of hydrogenated block copolymer (A) in the hydrogenated block copolymer composition of this embodiment, increasing the degree of freedom in formulation. Generally, a higher amount of hydrogenated block copolymer (A) in a hydrogenated block copolymer composition tends to result in better abrasion resistance, while a lower amount of hydrogenated block copolymer (A) tends to result in better oil resistance or material cost; therefore, a lower lower limit for the formulation amount is preferable.
((12)低反彈性:鄧祿普(Dunlop)反跳彈性模數) 製成以下述方式製造之「氫化嵌段共聚物之加壓成形片材」測定用樣品。 利用鄧祿普反跳彈性試驗機,依據BS903,於23℃下測定反跳彈性模數。 從觸感之觀點出發,若反跳彈性模數為20%以下,則實用上良好,數值越低,評價為傾向於越優異。((12) Low elasticity: Dunlop rebound modulus) Samples for testing "compression-molded sheets of hydrogenated block copolymers" were prepared as follows. The rebound modulus was measured at 23°C using a Dunlop rebound elasticity tester according to BS903. From a tactile perspective, a rebound modulus of 20% or less is considered good in practice, and the lower the value, the better the evaluation.
(氫化嵌段共聚物之隨機性參數g之算出) 對氫化嵌段共聚物(甲),於下述表3之條件下,進行py-GC/MS測定,並算出波峰強度P。 又,根據相對於氫化嵌段共聚物(甲)整體之共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS,利用P0=0.005563×RS算出P0,並根據g=P/P0算出g。 此處,上述「0.005563」表示將相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS(質量%)、與波峰強度P進行一次近似時之比例常數(k),該波峰強度P係利用熱分解氣相層析質譜分析裝置對藉由下述特定之聚合方法(均相聚合法)聚合而成之氫化嵌段共聚物(甲)進行分析時獲得。(Calculation of the random parameter g of the hydrogenated block copolymer) The hydrogenated block copolymer (A) was subjected to py-GC/MS determination under the conditions shown in Table 3 below, and the peak intensity P was calculated. Furthermore, based on the content RS of vinyl aromatic monomer units in the copolymer block (b) relative to the whole hydrogenated block copolymer (A), P0 was calculated using P0 = 0.005563 × RS, and g was calculated using g = P/P0. Here, "0.005563" represents the proportionality constant (k) that approximates the content RS (mass %) of the vinyl aromatic monomer units in the hydrogenated copolymer block (b) relative to the overall hydrogenated block copolymer (A) with the peak intensity P, which is obtained by analyzing the hydrogenated block copolymer (A) polymerized by the following specific polymerization method (homogeneous polymerization) using a thermal decomposition gas chromatography-mass spectrometry analysis apparatus.
[表3]
[氫化嵌段共聚物之製造] (氫化觸媒之製備) 藉由下述方法製備於下述實施例及比較例中製作氫化嵌段共聚物時所使用之氫化觸媒。 預先對具備攪拌裝置之反應容器進行氮氣置換,於其中添加經乾燥、純化之環己烷1升。 其次,添加雙(η5-環戊二烯基)二氯化鈦100毫莫耳。 一面將其充分地攪拌,一面添加包含三甲基鋁200毫莫耳之正己烷溶液,於室溫下反應約3天。藉此獲得氫化觸媒。[Preparation of Hydrogenated Block Copolymers] (Preparation of Hydrogenation Catalyst) The hydrogenation catalyst used in the preparation of hydrogenated block copolymers in the following embodiments and comparative examples was prepared by the following method. First, a reaction vessel equipped with a stirring device was purged with nitrogen, and 1 liter of dried and purified cyclohexane was added. Next, 100 mmol of bis(n-5-cyclopentadienyl)titanium dichloride was added. While stirring thoroughly, a hexane solution containing 200 mmol of trimethylaluminum was added, and the reaction was carried out at room temperature for approximately 3 days. The hydrogenation catalyst was thus obtained.
(氫化嵌段共聚物) 以如下方式製備構成氫化嵌段共聚物組合物之氫化嵌段共聚物(甲)-1~(甲)-10、(甲)-A~(甲)-E。(Hydrogenated block copolymers) Hydrogenated block copolymers (A)-1 to (A)-10 and (A)-A to (A)-E constituting hydrogenated block copolymer compositions are prepared in the following manner.
[實施例1] (氫化嵌段共聚物(甲)-1) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯13質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份添加正丁基鋰0.047質量份,及相對於正丁基鋰(n-BuLi)1莫耳添加乙烯基鍵量調整劑N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯30質量份與苯乙烯44質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升。於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯13質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為70質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為44質量%,乙烯基鍵量為21質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-1。 所獲得之氫化嵌段共聚物(甲)-1之氫化率為98莫耳%。 將其他物性示於表4。[Example 1] (Hydrogenated Block Copolymer (A)-1) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 13 parts by mass of styrene was added. Next, 0.047 parts by mass of n-butyllithium and 0.9 mol of vinyl bond modifier N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 30 parts by mass of butadiene and 44 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased. When the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased, thereby adjusting to the desired reaction ratio until the reaction was completed. Finally, a cyclohexane solution containing 13 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterwards, methanol was added to stop the polymerization reaction, obtaining a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 70% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 44% by mass, the vinyl bond content is 21% by mass, and the weight average molecular weight is 160,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-1. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-1 was 98 mol%. Other properties are shown in Table 4.
[實施例2] (氫化嵌段共聚物(甲)-2) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯12質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯31質量份與苯乙烯45質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯12質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為69質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為45質量%,乙烯基鍵量為20質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-2。 所獲得之氫化嵌段共聚物(甲)-2之氫化率為98莫耳%。將其他物性示於表4。[Example 2] (Hydrogenated Block Copolymer (A)-2) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 12 parts by mass of styrene was added. Next, 0.048 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 31 parts by mass of butadiene and 45 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 12 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Subsequently, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 69% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 45% by mass, the vinyl bond content is 20% by mass, and the weight average molecular weight is 160,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-2. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-2 was 98 mol%. Other properties are shown in Table 4.
[實施例3] (氫化嵌段共聚物(甲)-3) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯34質量份與苯乙烯50質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為66質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,乙烯基鍵量為21質量%,重量平均分子量為16.1萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-3。 所獲得之氫化嵌段共聚物(甲)-3之氫化率為98莫耳%。將其他物性示於表4。[Example 3] (Hydrogenated Block Copolymer (A)-3) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.048 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 34 parts by mass of butadiene and 50 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 66% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 50% by mass, the vinyl bond content is 21% by mass, and the weight average molecular weight is 161,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-3. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-3 was 98 mol%. Other properties are shown in Table 4.
[實施例4] (氫化嵌段共聚物(甲)-4) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯7質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.049質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯35質量份與苯乙烯51質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯7質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為65質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為51質量%,乙烯基鍵量為21質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-4。 所獲得之氫化嵌段共聚物(甲)-4之氫化率為98莫耳%。將其他物性示於表4。[Example 4] (Hydrogenated Block Copolymer (A)-4) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 7 parts by mass of styrene was added. Next, 0.049 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 35 parts by mass of butadiene and 51 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 7 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 65% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 51% by mass, the vinyl bond content is 21% by mass, and the weight average molecular weight is 160,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-4. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-4 was 98 mol%. Other properties are shown in Table 4.
[實施例5] (氫化嵌段共聚物(甲)-5) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.050質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯39質量份與苯乙烯45質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為61質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為45質量%,乙烯基鍵量為24質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-5。 所獲得之氫化嵌段共聚物(甲)-5之氫化率為98莫耳%。將其他物性示於表4。[Example 5] (Hydrogenated Block Copolymer (A)-5) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.050 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 39 parts by mass of butadiene and 45 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 61% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 45% by mass, the vinyl bond content is 24% by mass, and the weight average molecular weight is 160,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-5. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-5 was 98 mol%. Other properties are shown in Table 4.
[實施例6] (氫化嵌段共聚物(甲)-6) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.050質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯38質量份與苯乙烯46質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為62質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為46質量%,乙烯基鍵量為22質量%,重量平均分子量為15.9萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-6。 所獲得之氫化嵌段共聚物(甲)-6之氫化率為98莫耳%。將其他物性示於表4。[Example 6] (Hydrogenated Block Copolymer (A)-6) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.050 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 38 parts by mass of butadiene and 46 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 62% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 46% by mass, the vinyl bond content is 22% by mass, and the weight average molecular weight is 159,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-6. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-6 was 98 mol%. Other properties are shown in Table 4.
[實施例7] (氫化嵌段共聚物(甲)-7) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.047質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯30質量份與苯乙烯54質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為70質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為54質量%,乙烯基鍵量為17質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-7。 所獲得之氫化嵌段共聚物(甲)-7之氫化率為98莫耳%。將其他物性示於表4。[Example 7] (Hydrogenated Block Copolymer (A)-7) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.047 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 30 parts by mass of butadiene and 54 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 70% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 54% by mass, the vinyl bond content is 17% by mass, and the weight average molecular weight is 160,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-7. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-7 was 98 mol%. Other properties are shown in Table 4.
[實施例8] (氫化嵌段共聚物(甲)-8) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.047質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯29質量份與苯乙烯55質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為71質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為55質量%,乙烯基鍵量為17質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-8。 所獲得之氫化嵌段共聚物(甲)-8之氫化率為98莫耳%。將其他物性示於表4。[Example 8] (Hydrogenated Block Copolymer (A)-8) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.047 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 29 parts by mass of butadiene and 55 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 71% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 55% by mass, the vinyl bond content is 17% by mass, and the weight average molecular weight is 160,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-8. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-8 was 98 mol%. Other properties are shown in Table 4.
[實施例9] (氫化嵌段共聚物(甲)-9) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯34質量份與苯乙烯50質量份之環己烷溶液(濃度20質量%),並於60℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為66質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,乙烯基鍵量為24質量%,重量平均分子量為16.1萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-9。 所獲得之氫化嵌段共聚物(甲)-9之氫化率為98莫耳%。將其他物性示於表4。[Example 9] (Hydrogenated Block Copolymer (A)-9) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.048 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 34 parts by mass of butadiene and 50 parts by mass of styrene was added, and polymerization was carried out at 60°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 66% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 50% by mass, the vinyl bond content is 24% by mass, and the weight average molecular weight is 161,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-9. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-9 was 98 mol%. Other properties are shown in Table 4.
[實施例10] (氫化嵌段共聚物(甲)-10) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.5莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯34質量份與苯乙烯50質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為66質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,乙烯基鍵量為17質量%,重量平均分子量為16.0萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-10。 所獲得之氫化嵌段共聚物(甲)-10之氫化率為98莫耳%。將其他物性示於表4。[Example 10] (Hydrogenated Block Copolymer (A)-10) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.048 parts by mass of n-butyllithium and 0.5 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 34 parts by mass of butadiene and 50 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 66% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 50% by mass, the vinyl bond content is 17% by mass, and the weight average molecular weight is 160,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-10. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-10 was 98 mol%. Other properties are shown in Table 4.
[比較例1] (氫化嵌段共聚物(甲)-A) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯18質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.045質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯22質量份與苯乙烯42質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯18質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為78質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為42質量%,乙烯基鍵量為21質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-A。 所獲得之氫化嵌段共聚物(甲)-A之氫化率為98莫耳%。將其他物性示於表5。[Comparative Example 1] (Hydrogenated Block Copolymer (A)-A) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 18 parts by mass of styrene was added. Next, 0.045 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 22 parts by mass of butadiene and 42 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 18 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Subsequently, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 78% by mass, and the content of vinyl aromatic monomer units in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 42% by mass, the vinyl bond content is 21% by mass, and the weight average molecular weight is 160,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-A. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-A was 98 mol%. Other properties are shown in Table 5.
[比較例2] (氫化嵌段共聚物(甲)-B) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯2質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.050質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯39質量份與苯乙烯57質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯2質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為61質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為57質量%,乙烯基鍵量為20質量%,重量平均分子量為15.9萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-B。 所獲得之氫化嵌段共聚物(甲)-B之氫化率為98莫耳%。將其他物性示於表5。[Comparative Example 2] (Hydrogenated Block Copolymer (A)-B) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 2 parts by mass of styrene was added. Next, 0.050 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 39 parts by mass of butadiene and 57 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired level, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired level, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 2 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 61% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 57% by mass, the vinyl bond content is 20% by mass, and the weight average molecular weight is 159,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-B. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-B was 98 mol%. Other properties are shown in Table 5.
[比較例3] (氫化嵌段共聚物(甲)-C) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.054質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯51質量份與苯乙烯33質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為49質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為33質量%,乙烯基鍵量為30質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-C。 所獲得之氫化嵌段共聚物(甲)-C之氫化率為98莫耳%。將其他物性示於表5。[Comparative Example 3] (Hydrogenated Block Copolymer (A)-C) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.054 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 51 parts by mass of butadiene and 33 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 49% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 33% by mass, the vinyl bond content is 30% by mass, and the weight average molecular weight is 160,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-C. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-C was 98 mol%. Other properties are shown in Table 5.
[比較例4] (氫化嵌段共聚物(甲)-D) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.044質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯20質量份與苯乙烯64質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,一面利用ReactIR將反應系統中之丁二烯、苯乙烯濃度即時定量,一面以各者之聚合速度達到1:1(質量份換算)之方式適當調整進料速度。 於ReactIR中,以1589 cm-1之波長追蹤丁二烯單體,且以775 cm-1之波長始終追蹤苯乙烯單體,於較所需之反應性比高10%以上之情形時,使丁二烯之進料速度上升,於較所需之反應性比低10%以上之情形時,降低丁二烯之進料速度,藉此調整為所需之反應比直至反應結束。 最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為80質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為64質量%,乙烯基鍵量為14質量%,重量平均分子量為16.1萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-D。 所獲得之氫化嵌段共聚物(甲)-D之氫化率為98莫耳%。將其他物性示於表5。[Comparative Example 4] (Hydrogenated Block Copolymer (A)-D) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.044 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 20 parts by mass of butadiene and 64 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was used to quantitatively measure the concentrations of butadiene and styrene in the reaction system in real time, while the feed rates were adjusted appropriately to achieve a 1:1 (mass conversion) polymerization rate between the two. In ReactIR, butadiene monomers were tracked at a wavelength of 1589 cm⁻¹ , and styrene monomers were continuously tracked at a wavelength of 775 cm⁻¹. When the reactivity ratio was more than 10% higher than the desired ratio, the butadiene feed rate was increased; when the reactivity ratio was more than 10% lower than the desired ratio, the butadiene feed rate was decreased. This adjustment was used to achieve the desired reaction ratio until the reaction was complete. Finally, a cyclohexane solution containing 8 parts by mass of styrene (concentration 20% by mass) was added, and polymerization was carried out at 65°C for 1 hour. Afterward, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content is 80% by mass, the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) of the hydrogenated block copolymer (A) is 64% by mass, the vinyl bond content is 14% by mass, and the weight average molecular weight is 161,000. Furthermore, in the obtained block copolymer, 100 ppm of hydrogenation catalyst prepared in the above manner (based on Ti) is added per 100 parts by mass of the block copolymer, and the hydrogenation reaction is carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Secondly, relative to 100 parts by weight of the block copolymer, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer to obtain hydrogenated block copolymer (A)-D. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-D was 98 mol%. Other properties are shown in Table 5.
[比較例5] (氫化嵌段共聚物(甲)-E) 使用具備攪拌裝置及夾套之槽型反應器(內容積10 L)而進行分批聚合。 首先,投入包含苯乙烯8質量份之環己烷溶液(濃度20質量%)。 其次,相對於全部單體100質量份,添加正丁基鋰0.048質量份,及相對於正丁基鋰1莫耳,添加N,N,N',N'-四甲基乙二胺(以下稱為「TMEDA」)0.9莫耳,並於65℃下進行1小時聚合。 其次,添加包含丁二烯34質量份與苯乙烯50質量份之環己烷溶液(濃度20質量%),並於80℃下進行2小時聚合。此時,未使用ReactIR,以進料速度成為丁二烯:苯乙烯=34:50之方式以一定速度進行進料。最後,添加包含苯乙烯8質量份之環己烷溶液(濃度20質量%),並於65℃下進行1小時聚合。其後,添加甲醇,停止聚合反應,獲得嵌段共聚物。 關於以上述方法獲得之嵌段共聚物,苯乙烯含量為66質量%,相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量RS為50質量%,乙烯基鍵量為25質量%,重量平均分子量為16萬。 進而,於所獲得之嵌段共聚物中,相對於嵌段共聚物每100質量份,添加以Ti基準計為100 ppm之以上述方式製備之氫化觸媒,並於氫壓0.7 MPa、溫度65℃下進行氫化反應。 其次,相對於嵌段共聚物100質量份,添加0.3質量份之作為穩定劑之3-(3,5-二第三丁基-4-羥基苯基)丙酸十八烷基酯,獲得氫化嵌段共聚物(甲)-E。 所獲得之氫化嵌段共聚物(甲)-E之氫化率為98莫耳%。將其他物性示於表5。[Comparative Example 5] (Hydrogenated Block Copolymer (A)-E) Batch polymerization was carried out using a tank reactor (10 L volume) equipped with a stirring device and a jacket. First, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added. Next, 0.048 parts by mass of n-butyllithium and 0.9 mol of N,N,N',N'-tetramethylethylenediamine (hereinafter referred to as "TMEDA") were added relative to 100 parts by mass of all monomers, and polymerization was carried out at 65°C for 1 hour. Next, a cyclohexane solution (concentration 20% by mass) containing 34 parts by mass of butadiene and 50 parts by mass of styrene was added, and polymerization was carried out at 80°C for 2 hours. At this point, ReactIR was not used; butadiene was fed at a constant rate of 34:50. Finally, a cyclohexane solution (concentration 20% by mass) containing 8 parts by mass of styrene was added, and polymerization was carried out at 65°C for 1 hour. Subsequently, methanol was added to stop the polymerization reaction, yielding a block copolymer. Regarding the block copolymer obtained by the above method, the styrene content was 66% by mass, and the content of vinyl aromatic monomers in the hydrogenated copolymer block (b) relative to the overall hydrogenated block copolymer (A) was 50% by mass, the vinyl bond content was 25% by mass, and the weight average molecular weight was 160,000. Furthermore, to the obtained block copolymer, 100 ppm of a hydrogenation catalyst prepared as described above (based on Ti) was added per 100 parts by weight of the block copolymer, and the hydrogenation reaction was carried out at a hydrogen pressure of 0.7 MPa and a temperature of 65°C. Next, 0.3 parts by weight of octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate was added as a stabilizer per 100 parts by weight of the block copolymer to obtain hydrogenated block copolymer (A)-E. The hydrogenation rate of the obtained hydrogenated block copolymer (A)-E was 98 mol%. Other physical properties are shown in Table 5.
[加壓成形片材之製作] 使用4英吋輥,分別單獨對以上述方式製作之氫化嵌段共聚物(甲)-1~(甲)-10、及(甲)-A~(甲)-E於160℃下進行輥壓出,其後藉由油壓加壓,於200℃、100 kg/cm2下進行加壓成形,製作2 mm厚之加壓成形片材。[Preparation of Compression Molded Sheets] Using 4-inch rollers, the hydrogenated block copolymers (A)-1 to (A)-10 and (A)-A to (A)-E prepared in the above manner were individually extruded at 160°C. Subsequently, hydraulic pressure was applied to compress the sheets at 200°C and 100 kg/ cm² to produce 2 mm thick compression molded sheets.
[射出成形片材之製作] 使用氫化嵌段共聚物(甲)-1~(甲)-10、及(甲)-A~(甲)-E,於220℃下進行射出成形,製作2 mm厚之射出成形片材,獲得物性測定片。[Preparation of Injection Molded Sheets] Using hydrogenated block copolymers (A)-1 to (A)-10 and (A)-A to (A)-E, injection molding was performed at 220°C to produce injection molded sheets with a thickness of 2 mm, and physical property testing sheets were obtained.
對上述[實施例1~10]、[比較例1~5]之氫化嵌段共聚物(甲)-1~10、及(甲)-A~E,測定下述項目之數值。 (結構分析值) 氫化嵌段共聚物(甲)中之全部乙烯基芳香族單體單元(苯乙烯)之含量(質量%) 將氫化嵌段共聚物(甲)中之乙烯基芳香族單體單元作為主體之聚合物嵌段(聚苯乙烯嵌段)(a)之含量(質量%) 氫化嵌段共聚物(甲)中之包含乙烯基芳香族單體單元與共軛二烯單體單元之氫化共聚物嵌段(b)之含量(質量%) 氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%) 相對於氫化嵌段共聚物(甲)整體之氫化共聚物嵌段(b)中之乙烯基芳香族單體單元之含量(質量%) 氫化共聚物嵌段(b)中之共軛二烯相對於氫化嵌段共聚物(甲)整體之含量(質量%) 氫化嵌段共聚物(甲)中之乙烯基鍵量(質量%) 氫化嵌段共聚物(甲)之分子量分佈 氫化嵌段共聚物(甲)之重量平均分子量(萬) 氫化嵌段共聚物(甲)之共軛二烯單體單元之雙鍵之氫化率(莫耳%) (物性) ・熔體流動速率(MFR:230℃,2.16 kg) ・黏彈性測定圖中之-20~60℃之tanδ波峰溫度(℃) ・硬度(JIS-A 瞬時)The values of the following items were measured for the hydrogenated block copolymers (A)-1 to 10 and (A)-A to E of [Examples 1 to 10] and [Comparative Examples 1 to 5] above. (Structural Analysis Values) Content (mass %) of all vinyl aromatic monomer units (styrene) in the hydrogenated block copolymer (A) Content (mass %) of polymer blocks (polystyrene blocks) (a) with vinyl aromatic monomer units as the main component in the hydrogenated block copolymer (A) Content (mass %) of hydrogenated copolymer blocks (b) containing both vinyl aromatic monomer units and conjugated diene monomer units in the hydrogenated block copolymer (A) Content (mass %) of vinyl aromatic monomer units in hydrogenated copolymer blocks (b) relative to the total hydrogenated block copolymer (A) Content (mass %) of conjugated diene in hydrogenated copolymer blocks (b) relative to the total hydrogenated block copolymer (A) Vinyl bond content (mass %) in hydrogenated block copolymer (A) Molecular weight distribution of hydrogenated block copolymer (A) Weight average molecular weight (ten thousand) of hydrogenated block copolymer (A) Hydrogenation rate of double bonds in conjugated diene monomer units of hydrogenated block copolymer (A) (Moles %) (Physical Properties) • Melt flow rate (MFR: 230℃, 2.16 kg) • Tanδ peak temperature (℃) of -20~60℃ in the viscoelasticity test graph • Hardness (JIS-A instantaneous)
再者,聚合物嵌段(a)~(b)分別表示以下之聚合物嵌段。 聚合物嵌段(a):將乙烯基芳香族單體單元作為主體之聚合物嵌段 共聚物嵌段(b):包含乙烯基芳香族化合物單體單元與共軛二烯單體單元之氫化共聚物嵌段Furthermore, polymer blocks (a) to (b) represent the following polymer blocks, respectively: Polymer block (a): A polymer block with a vinyl aromatic monomer as the main component. Copolymer block (b): A hydrogenated copolymer block containing a vinyl aromatic compound monomer and a conjugated diene monomer.
[表4]
[表5]
可知,實施例1~10之氫化嵌段共聚物之耐磨耗性與低反彈性優異。 [產業上之可利用性]It can be seen that the hydrogenated block copolymers of Examples 1-10 exhibit excellent abrasion resistance and low elasticity. [Industrial Applicability]
本發明之氫化嵌段共聚物於汽車零件(汽車內飾材料、汽車包裝材料)、醫療用具材料、食品包裝容器等各種容器、家電用品、工業零件、玩具等領域中具有產業上之可利用性。The hydrogenated block copolymer of this invention has industrial applicability in the fields of automotive parts (automotive interior materials, automotive packaging materials), medical equipment materials, food packaging containers and other containers, household appliances, industrial parts, toys and other fields.
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