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TWI907350B - Laminated body and reinforcing membrane - Google Patents

Laminated body and reinforcing membrane

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Publication number
TWI907350B
TWI907350B TW109114337A TW109114337A TWI907350B TW I907350 B TWI907350 B TW I907350B TW 109114337 A TW109114337 A TW 109114337A TW 109114337 A TW109114337 A TW 109114337A TW I907350 B TWI907350 B TW I907350B
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TW
Taiwan
Prior art keywords
reinforcing film
adhesive layer
adhesive
reinforcing
substrate
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Application number
TW109114337A
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Chinese (zh)
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TW202103915A (en
Inventor
仲野武史
片岡賢一
Original Assignee
日商日東電工股份有限公司
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Priority claimed from JP2019091611A external-priority patent/JP7503890B2/en
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202103915A publication Critical patent/TW202103915A/en
Application granted granted Critical
Publication of TWI907350B publication Critical patent/TWI907350B/en

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Abstract

本發明之積層體1具備補強膜4、及配置於補強膜4之一面之軟性被黏著體5。補強膜4具備基材2及配置於基材2之一面且包含高黏著成分及低黏著成分之黏著劑層3。補強膜4於軟性被黏著體5之面方向上具備彼此空開間隔而配置之第1補強膜部6及第2補強膜部7。於第1補強膜部6之黏著劑層3及第2補強膜部7之黏著劑層3之各者中,在厚度方向上,高黏著成分於軟性被黏著體5及黏著劑層3之界面偏集存在。The laminate 1 of the present invention includes a reinforcing film 4 and a flexible adherend 5 disposed on one side of the reinforcing film 4. The reinforcing film 4 includes a substrate 2 and an adhesive layer 3 disposed on one side of the substrate 2, comprising a high-adhesion component and a low-adhesion component. The reinforcing film 4 has a first reinforcing film portion 6 and a second reinforcing film portion 7 disposed at intervals from each other in the surface direction of the flexible adherend 5. In each of the adhesive layers 3 of the first reinforcing film portion 6 and the second reinforcing film portion 7, in the thickness direction, the high-adhesion component is concentrated at the interface between the flexible adherend 5 and the adhesive layer 3.

Description

積層體及補強膜Laminated structures and reinforcing membranes

本發明係關於一種積層體及補強膜。This invention relates to a laminate and a reinforcing membrane.

已知藉由於實施電子器件等各種器件之組裝、加工、運輸等步驟之前將黏著性膜暫時黏至器件之表面,而謀求保護表面或賦予耐衝擊性。It is known that by temporarily attaching an adhesive film to the surface of a device before assembling, processing, or transporting various devices such as electronic devices, the aim is to protect the surface or impart impact resistance.

作為此種黏著性膜,已知有一種硬化性接著片材,其係於加熱前或照射紫外線之前黏著力較弱,藉由加熱或照射紫外線而發揮黏著性(例如參照專利文獻1)。As such an adhesive film, there is a known type of curable adhesive sheet that has weaker adhesion before heating or irradiation with ultraviolet light, and whose adhesion is enhanced by heating or irradiation with ultraviolet light (see, for example, Patent 1).

藉由使此種黏著性膜在貼合於器件之狀態下殘存,可獲得補強性優異之積層體。By leaving this adhesive film in a bonded state, a laminate with excellent reinforcing properties can be obtained.

[先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2011-127054號公報[Previous Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Publication No. 2011-127054

[發明所欲解決之問題][The problem that the invention aims to solve]

另一方面,存在如下情況:為了提高零件配置之自由度,而將此種黏著性膜貼附於軟性被黏著體來製造積層體。On the other hand, there is a situation where, in order to increase the freedom of component configuration, this adhesive film is attached to a soft substrate to create a laminate.

又,存在如下情況:為了使此種積層體彎曲,而去除中央部分之黏著性膜(換言之,於軟性被黏著體之面方向上之兩端僅使2個黏著性膜殘存)。Furthermore, there exists a situation where, in order to bend this laminate, the adhesive membrane in the central part is removed (in other words, only two adhesive membranes remain at both ends in the direction of the soft adhered body).

並且,存在如下缺陷:若使該積層體如上所述般彎曲,則2個黏著性膜容易剝離。Furthermore, there is a drawback: if the laminate is bent as described above, the two adhesive films are easily peeled off.

本發明提供一種將補強膜及軟性被黏著體牢固地接著而成之積層體及該積層體中所使用之補強膜。 [解決問題之技術手段]This invention provides a laminate formed by firmly bonding a reinforcing film and a soft adherend, and the reinforcing film used in the laminate. [Technical Means for Solving the Problem]

本發明[1]係一種積層體,其係具備補強膜、及配置於上述補強膜之一面之軟性被黏著體者,且上述補強膜具備基材及配置於上述基材之一面且包含高黏著成分及低黏著成分之黏著劑層,上述補強膜於上述軟性被黏著體之面方向上具備彼此空開間隔而配置之第1補強膜部及第2補強膜部,於上述第1補強膜部之黏著劑層及上述第2補強膜部之黏著劑層之各者中,在厚度方向上,上述高黏著成分於上述軟性被黏著體及上述黏著劑層之界面偏集存在。The present invention [1] is a laminate having a reinforcing film and a soft adherend disposed on one side of the reinforcing film. The reinforcing film has a substrate and an adhesive layer disposed on one side of the substrate, comprising a high adhesive component and a low adhesive component. The reinforcing film has a first reinforcing film portion and a second reinforcing film portion disposed apart from each other in the direction of the surface of the soft adherend. In each of the adhesive layers of the first reinforcing film portion and the second reinforcing film portion, in the thickness direction, the high adhesive component is concentrated at the interface between the soft adherend and the adhesive layer.

本發明[2]包含上述[1]所記載之積層體,其中於上述第1補強膜部之黏著劑層及上述第2補強膜部之黏著劑層之各者中,於在厚度方向上較上述界面更為上述黏著劑層側,上述高黏著成分及上述低黏著成分混合存在。The present invention [2] includes the laminate described in [1] above, wherein in each of the adhesive layer of the first reinforcing film portion and the adhesive layer of the second reinforcing film portion, the high-adhesion component and the low-adhesion component are mixed and present on the side of the adhesive layer that is further from the interface in the thickness direction than the interface.

本發明[3]包含上述[1]或[2]所記載之積層體,其中上述高黏著成分為多官能(甲基)丙烯酸酯之硬化物,上述低黏著成分為丙烯酸系聚合物。The present invention [3] includes the laminate described in [1] or [2] above, wherein the high-adhesion component is a cured polyfunctional (meth)acrylate and the low-adhesion component is an acrylic polymer.

本發明[4]包含上述[1]或[2]所記載之積層體,其中上述高黏著成分為丙烯酸系聚合物,上述低黏著成分為含有有機矽氧烷之成分。The present invention [4] includes the laminate described in [1] or [2] above, wherein the high-adhesion component is an acrylic polymer and the low-adhesion component is a component containing organosiloxane.

本發明[5]係一種積層體,其係具備補強膜、及配置於上述補強膜之一面之軟性被黏著體者,且上述補強膜具備基材及配置於上述基材之一面且包含高黏著成分及低黏著成分之黏著劑層,上述補強膜於上述軟性被黏著體之面方向上具備彼此空開間隔而配置之第1補強膜部及第2補強膜部,上述黏著劑層之黏著力為5 N/25 mm以上,上述黏著劑層之厚度為5 μm以上。The present invention [5] is a laminate having a reinforcing film and a soft adherend disposed on one side of the reinforcing film, wherein the reinforcing film has a substrate and an adhesive layer disposed on one side of the substrate and comprising a high adhesive component and a low adhesive component, the reinforcing film having a first reinforcing film portion and a second reinforcing film portion disposed apart from each other in the direction of the surface of the soft adherend, the adhesive layer having an adhesive force of 5 N/25 mm or more, and the adhesive layer having a thickness of 5 μm or more.

本發明[6]係一種補強膜,其用於積層體,該積層體具備補強膜、及配置於上述補強膜之一面之軟性被黏著體,且上述補強膜具備基材及配置於上述基材之一面且包含高黏著成分及低黏著成分之黏著劑層,上述補強膜於上述軟性被黏著體之面方向上具備彼此空開間隔而配置之第1補強膜部及第2補強膜部。 [發明之效果]The present invention [6] is a reinforcing film used in a laminate, the laminate having a reinforcing film and a soft adherend disposed on one side of the reinforcing film, wherein the reinforcing film has a substrate and an adhesive layer disposed on one side of the substrate and comprising a high-adhesion component and a low-adhesion component, and the reinforcing film having a first reinforcing film portion and a second reinforcing film portion disposed at intervals from each other in the direction of the surface of the soft adherend. [Effects of the Invention]

該積層體係於軟性被黏著體之面方向上以彼此空開間隔之方式配置有第1補強膜部及第2補強膜部。The laminate system has a first reinforcing film portion and a second reinforcing film portion disposed on the surface of the soft adherend in a manner that leaves space between each other.

因此,可於第1補強膜部及第2補強膜部之間使積層體彎曲。Therefore, the laminate can be bent between the first reinforcing membrane portion and the second reinforcing membrane portion.

又,於第1補強膜部之黏著劑層及第2補強膜部之黏著劑層之各者中,在厚度方向上,高黏著成分於軟性被黏著體及黏著劑層之界面偏集存在。Furthermore, in both the adhesive layer of the first reinforcing film and the adhesive layer of the second reinforcing film, in the thickness direction, the highly adhesive component is concentrated at the interface between the soft adherend and the adhesive layer.

因此,於該積層體中,黏著劑層與軟性被黏著體被牢固地接著,尤其是即便如上所述般使積層體彎曲,亦可抑制第1補強膜部及第2補強膜部剝離。Therefore, in the laminate, the adhesive layer and the soft adherend are firmly bonded, and even when the laminate is bent as described above, the separation of the first reinforcing film and the second reinforcing film can be suppressed.

參照圖1對本發明之積層體之一實施形態進行說明。The embodiment of the laminate of the present invention will be described with reference to Figure 1.

1.積層體 如圖1所示,積層體1具備:補強膜4,其具備基材2及配置於基材2之一面之黏著劑層3;及軟性被黏著體5,其配置於補強膜4之一面。1. Laminate As shown in Figure 1, the laminate 1 has: a reinforcing film 4 having a substrate 2 and an adhesive layer 3 disposed on one side of the substrate 2; and a soft adherend 5 disposed on one side of the reinforcing film 4.

詳細將於後文下述,但積層體1係藉由將補強膜4貼附於軟性被黏著體5而獲得。Details will be described below, but the laminate 1 is obtained by attaching the reinforcing film 4 to the soft adherend 5.

以下,對各層進行詳細敍述。The following is a detailed description of each layer.

2.補強膜 補強膜4於軟性被黏著體5之面方向上具有彼此空開間隔而配置之第1補強膜部6及第2補強膜部7。2. Reinforcing film The reinforcing film 4 consists of a first reinforcing film portion 6 and a second reinforcing film portion 7 arranged with a gap between each other in the direction of the surface of the soft adherend 5.

第1補強膜部6及第2補強膜部7具有具有特定厚度之膜形狀(包含片形狀),沿與厚度方向正交之方向(面方向)延伸,且具有平坦之上表面及平坦之下表面。The first reinforcing membrane portion 6 and the second reinforcing membrane portion 7 have a membrane shape (including a sheet shape) with a specific thickness, extend in a direction orthogonal to the thickness direction (surface direction), and have a flat upper surface and a flat lower surface.

並且,第1補強膜部6及第2補強膜部7分別具備基材2、及配置於基材2之一面之黏著劑層3。Furthermore, the first reinforcing film portion 6 and the second reinforcing film portion 7 each have a substrate 2 and an adhesive layer 3 disposed on one side of the substrate 2.

即,補強膜4具備基材2、及配置於基材2之一面之黏著劑層3。That is, the reinforcing film 4 has a substrate 2 and an adhesive layer 3 disposed on one side of the substrate 2.

2-1.基材 基材2係確保補強膜4之機械強度之支持層(支持材料)。又,基材2係積層體1中用以補強軟性被黏著體5之補強材料。又,基材2具有沿面方向延伸之膜形狀,具有平坦之平面及平坦之下表面。2-1. Substrate Substrate 2 is a support layer (support material) that ensures the mechanical strength of the reinforcing film 4. Furthermore, substrate 2 is a reinforcing material in the laminate 1 used to reinforce the soft adherend 5. Also, substrate 2 has a film shape extending in the surface direction, and has a flat plane and a flat lower surface.

基材2包含可撓性之塑膠材料。Substrate 2 contains a flexible plastic material.

作為此種塑膠材料,可例舉:例如聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等聚酯樹脂、例如聚甲基丙烯酸酯等(甲基)丙烯酸系樹脂(丙烯酸系樹脂及/或甲基丙烯酸系樹脂)、例如聚乙烯、聚丙烯、環烯烴聚合物(COP)等聚烯烴樹脂、例如聚碳酸酯樹脂、例如聚醚碸樹脂、例如聚芳酯樹脂、例如三聚氰胺樹脂、例如聚醯胺樹脂、例如聚醯亞胺樹脂、例如纖維素樹脂、例如聚苯乙烯樹脂、例如𦯉烯樹脂之合成樹脂等。Examples of such plastic materials include: polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate; (meth)acrylic resins such as polymethacrylate (acrylic resins and/or methacrylic resins); polyolefin resins such as polyethylene, polypropylene, and cycloolefin polymers (COP); polycarbonate resins; polyether resins; polyarylate resins; melamine resins; polyamide resins; polyimide resins; cellulose resins; polystyrene resins; and synthetic resins such as terpene resins.

詳細將於後文敍述,但於自基材2側照射光而使黏著劑層3硬化之情形時,較佳為基材2具有對光之透明性。Details will be described later, but when the adhesive layer 3 is hardened by light shining from the side of the substrate 2, it is preferable that the substrate 2 is transparent to light.

就兼具對光之透明性及機械強度之觀點而言,作為塑膠材料,較佳可例舉聚酯樹脂、更佳可例舉聚對苯二甲酸乙二酯(PET)。From the perspective of combining transparency to light and mechanical strength, polyester resin and polyethylene terephthalate (PET) are better examples of plastic materials.

基材2之厚度例如為4 μm以上,就補強軟性被黏著體5(後述)之觀點而言,較佳為20 μm以上,更佳為30 μm以上,進而較佳為45 μm以上,又,例如為500 μm以下,就可撓性及處理性之觀點而言,較佳為300 μm以下,更佳為200 μm以下,進而較佳為100 μm以下。The thickness of the substrate 2 is, for example, 4 μm or more. From the viewpoint of reinforcing the soft adhesive 5 (described later), it is preferably 20 μm or more, more preferably 30 μm or more, and even more preferably 45 μm or more. Alternatively, it may be 500 μm or less. From the viewpoint of flexibility and handleability, it is preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less.

2-2.黏著劑層 黏著劑層3被配置於基材2之一面之整面。2-2. Adhesive layer 3 is disposed on the entire surface of one side of the substrate 2.

黏著劑層3係用以使補強膜4接著於軟性被黏著體5之感壓接著層。又,黏著劑層3具有沿面方向延伸之膜形狀,且具有平坦之平面及平坦之下表面。The adhesive layer 3 is a pressure-sensitive bonding layer used to attach the reinforcing film 4 to the soft adherend 5. Furthermore, the adhesive layer 3 has a film shape extending in the surface direction and has a flat plane and a flat lower surface.

黏著劑層3由黏著性組合物所形成。The adhesive layer 3 is formed of an adhesive composition.

黏著性組合物係能夠自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化之組合物。Adhesive compositions are compositions that can irreversibly change state from a state with lower adhesive strength to a state with higher adhesive strength.

作為此種黏著性組合物,可例舉:例如能夠藉由光照射而自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化之第1黏著性組合物、例如能夠藉由加熱而自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化之第2黏著性組合物等。Examples of such adhesive compositions include: a first adhesive composition that can irreversibly change state from a state of low self-adhesion to a state of high self-adhesion by means of light irradiation; and a second adhesive composition that can irreversibly change state from a state of low self-adhesion to a state of high self-adhesion by means of heating.

第1黏著性組合物包含基礎聚合物、光硬化劑、及光聚合起始劑。The first adhesive composition comprises a base polymer, a photocuring agent, and a photopolymerization initiator.

作為基礎聚合物,例如可例舉:丙烯酸系聚合物、天然橡膠、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(SIS嵌段共聚物)、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS嵌段共聚物)、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS嵌段共聚物)、苯乙烯-丁二烯橡膠、聚丁二烯、聚異戊二烯、聚異丁烯、丁基橡膠、氯丁二烯橡膠、矽酮橡膠等,就控制黏著力之觀點而言,較佳可例舉丙烯酸系聚合物。Examples of basic polymers include: acrylic polymers, natural rubber, styrene-isoprene-styrene block copolymers (SIS block copolymers), styrene-butadiene-styrene block copolymers (SBS block copolymers), styrene-ethylene-butene-styrene block copolymers (SEBS block copolymers), styrene-butadiene rubber, polybutadiene, polyisoprene, polyisobutylene, butyl rubber, chloroprene rubber, silicone rubber, etc. From the perspective of controlling adhesion, acrylic polymers are preferred.

丙烯酸系聚合物係藉由包含(甲基)丙烯酸烷基酯作為主成分之第1單體成分之聚合而獲得。Acrylic polymers are obtained by polymerizing a first monomer component containing alkyl (meth)acrylate as the main component.

(甲基)丙烯酸烷基酯為丙烯酸酯及/或甲基丙烯酸酯,例如可例舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸異三(十二烷基)酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸異十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸異十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等直鏈狀或支鏈狀之(甲基)丙烯酸C1-20烷基酯等。Alkyl methacrylates are acrylates and/or methacrylates, such as: methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, dibutyl methacrylate, terbutyl methacrylate, amyl methacrylate, isoamyl methacrylate, neopentyl methacrylate, hexyl methacrylate, heptyl methacrylate, 2-ethylhexyl methacrylate, octyl methacrylate, isooctyl methacrylate, propylene methacrylate Nonyl acrylate, isononyl acrylate, decyl acrylate, isodecanyl acrylate, undecyl acrylate, dodecyl acrylate, tri(dodecyl) acrylate, tetradecyl acrylate, isotetradecyl acrylate, pentadecyl acrylate, succinate acrylate, heptadecanyl acrylate, octadecyl acrylate, isooctadecyl acrylate, nonadecanyl acrylate, eicosyl acrylate, etc., in straight-chain or branched form, of C1-20 alkyl acrylates.

(甲基)丙烯酸烷基酯可單獨使用或併用兩種以上。Alkyl methacrylates can be used alone or in combination of two or more.

作為(甲基)丙烯酸烷基酯,就調整玻璃轉移溫度及剪切儲存模數G'之觀點而言,較佳可例舉甲基丙烯酸甲酯與丙烯酸C4-12烷基酯之併用。As an alkyl methacrylate, from the viewpoint of adjusting the glass transition temperature and shear storage modulus G', the combined use of methyl methacrylate and C4-12 alkyl acrylate is preferable.

於併用甲基丙烯酸甲酯與丙烯酸C4-12烷基酯作為(甲基)丙烯酸烷基酯之情形時,相對於甲基丙烯酸甲酯及丙烯酸C4-12烷基酯之總量100質量份,甲基丙烯酸甲酯之調配比率例如為5質量份以上,又,例如為20質量份以下,又,丙烯酸C4-12烷基酯之調配比率例如為80質量份以上,又,例如為95質量份以下。When methyl methacrylate and C4-12 alkyl acrylate are used together as (meth)acrylate alkyl esters, the blending ratio of methyl methacrylate is, for example, 5 parts by mass or more, or, for example, 20 parts by mass or less, relative to 100 parts by mass of the total amount of methyl methacrylate and C4-12 alkyl acrylate, and the blending ratio of C4-12 alkyl acrylate is, for example, 80 parts by mass or more, or, for example, 95 parts by mass or less.

(甲基)丙烯酸烷基酯之調配比率相對於第1單體成分,例如為50質量%以上、較佳為60質量%以上,又,例如為80質量%以下。The blending ratio of (meth)acrylate alkyl ester relative to the first monomer component is, for example, 50% by mass or more, preferably 60% by mass or more, or, for example, 80% by mass or less.

又,第1單體成分較佳為包含能夠與(甲基)丙烯酸烷基酯進行共聚之含官能基之乙烯基單體。Furthermore, the first monomer component is preferably a vinyl monomer containing a functional group that can copolymerize with alkyl (meth)acrylates.

作為含官能基之乙烯基單體,例如可例舉:含羥基之乙烯基單體、含羧基之乙烯基單體、含氮之乙烯基單體、含氰基之乙烯基單體、含縮水甘油基之乙烯基單體、含磺基之乙烯基單體、含磷酸基之乙烯基單體、芳香族乙烯基單體、乙烯酯單體、乙烯基醚單體等。Examples of vinyl monomers containing functional groups include: vinyl monomers containing hydroxyl groups, vinyl monomers containing carboxyl groups, vinyl monomers containing nitrogen, vinyl monomers containing cyano groups, vinyl monomers containing glycidyl groups, vinyl monomers containing sulfonyl groups, vinyl monomers containing phosphate groups, aromatic vinyl monomers, vinyl ester monomers, vinyl ether monomers, etc.

作為含羥基之乙烯基單體,例如可例舉(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸4-(羥基甲基)環己基)甲酯等,較佳可例舉(甲基)丙烯酸2-羥基乙酯,更佳可例舉丙烯酸2-羥基乙酯。Examples of vinyl monomers containing hydroxyl groups include 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, 6-hydroxyhexyl methacrylate, 8-hydroxyoctyl methacrylate, 10-hydroxydecyl methacrylate, 12-hydroxylauryl methacrylate, and 4-(hydroxymethyl)cyclohexyl methacrylate. 2-hydroxyethyl methacrylate is a preferred example, and 2-hydroxyethyl acrylate is even more preferred.

作為含羧基之乙烯基單體,例如可例舉:(甲基)丙烯酸、(甲基)丙烯酸2-羧基乙酯、羧基戊基(甲基)丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、丁烯酸等。Examples of vinyl monomers containing carboxyl groups include: (meth)acrylic acid, 2-carboxyethyl (meth)acrylic acid, carboxypentyl (meth)acrylic acid carboxypentyl ester, itaconic acid, maleic acid, fumaric acid, butenoic acid, etc.

又,作為含羧基之乙烯基單體,例如亦可例舉馬來酸酐、伊康酸酐等含酸酐基之單體。Furthermore, examples of vinyl monomers containing carboxyl groups include maleic anhydride and isocarboxylic anhydride.

作為含氮之乙烯基單體,例如可例舉:N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌𠯤、乙烯基吡𠯤、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基𠰌啉、N-丙烯醯𠰌啉、N-乙烯基羧醯胺類、N-乙烯基己內醯胺等。Examples of nitrogen-containing vinyl monomers include: N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperidine, vinylpyridine, vinylpyrrole, vinylimidazolium, vinylpyrazole, vinylpyridine, N-acrylamide, N-vinylcarboxylate, N-vinylcaprolactam, etc.

作為含氰基之乙烯基單體,例如可例舉(甲基)丙烯腈等。Examples of vinyl monomers containing cyano groups include (meth)acrylonitrile.

作為含縮水甘油基之乙烯基單體,例如可例舉(甲基)丙烯酸縮水甘油酯等。Examples of vinyl monomers containing glycidyl groups include glycidyl (meth)acrylate.

作為含磺基之乙烯基單體,例如可例舉苯乙烯磺酸、烯丙基磺酸等。Examples of vinyl monomers containing sulfonyl groups include styrene sulfonic acid and allyl sulfonic acid.

作為含磷酸基之乙烯基單體,例如可例舉2-羥基乙基丙烯醯基磷酸酯等。Examples of vinyl monomers containing phosphate groups include 2-hydroxyethyl acrylate.

作為芳香族乙烯基單體,例如可例舉:苯乙烯、對甲基苯乙烯、鄰甲基苯乙烯、α-甲基苯乙烯等。Examples of aromatic vinyl monomers include styrene, p-methylstyrene, ortho-methylstyrene, α-methylstyrene, etc.

作為乙烯酯單體,例如可例舉:乙酸乙烯酯、丙酸乙烯酯等。Examples of vinyl ester monomers include vinyl acetate and vinyl propionate.

作為乙烯基醚單體,例如可例舉甲基乙烯基醚等。Examples of vinyl ether monomers include methyl vinyl ether.

作為含官能基之乙烯基單體,可單獨使用或併用兩種以上。於調配交聯劑(於下文敍述)之情形時,就對丙烯酸系聚合物導入交聯結構之觀點而言,較佳可例舉含羥基之乙烯基單體、含羧基之乙烯基單體,又,就提高凝集力之觀點而言,較佳可例舉含氮之乙烯基單體,更佳為將含羥基之乙烯基單體及/或含羧基之乙烯基單體、與含氮之乙烯基單體併用。As functionalized vinyl monomers, two or more can be used alone or in combination. In the case of formulating crosslinking agents (described below), from the viewpoint of introducing crosslinking structures into acrylic polymers, vinyl monomers containing hydroxyl groups and vinyl monomers containing carboxyl groups are preferred examples. Furthermore, from the viewpoint of improving cohesiveness, vinyl monomers containing nitrogen are preferred examples. More preferably, vinyl monomers containing hydroxyl groups and/or vinyl monomers containing carboxyl groups, and vinyl monomers containing nitrogen are used in combination.

於將含羥基之乙烯基單體及/或含羧基之乙烯基單體、與含氮之乙烯基單體併用之情形時,相對於含羥基之乙烯基單體及/或含羧基之乙烯基單體、與含氮之乙烯基單體之總量100質量份,含羥基之乙烯基單體及/或含羧基之乙烯基單體之調配比率例如為40質量份以上,又,例如為60質量份以下,又,含氮之乙烯基單體之調配比率例如為40質量份以上,又,例如為60質量份以下。When hydroxyl-containing vinyl monomers and/or carboxyl-containing vinyl monomers are used together with nitrogen-containing vinyl monomers, the blending ratio of hydroxyl-containing vinyl monomers and/or carboxyl-containing vinyl monomers to 100 parts by mass of the total amount of nitrogen-containing vinyl monomers and/or nitrogen-containing vinyl monomers is, for example, 40 parts by mass or more, or, for example, 60 parts by mass or less, and the blending ratio of nitrogen-containing vinyl monomers is, for example, 40 parts by mass or more, or, for example, 60 parts by mass or less.

含官能基之乙烯基單體之調配比率相對於第1單體成分,例如為5質量%以上、較佳為10質量%以上、更佳為15質量%以上,又,例如為30質量%以下、較佳為20質量%以下。The proportion of the functionalized vinyl monomer relative to the first monomer component is, for example, 5% by mass or more, preferably 10% by mass or more, more preferably 15% by mass or more, or, for example, 30% by mass or less, preferably 20% by mass or less.

並且,丙烯酸系聚合物係使上述第1單體成分聚合而成之聚合物。Furthermore, the acrylic polymer is a polymer formed by polymerizing the first monomer component mentioned above.

於使第1單體成分聚合時,例如調配(甲基)丙烯酸烷基酯且視需要調配含官能基之乙烯基單體而製備第1單體成分,將其例如藉由溶液聚合、塊狀聚合、乳化聚合等公知之聚合方法進行製備。When polymerizing the first monomer component, for example, by formulating alkyl methacrylates and, as needed, vinyl monomers containing functional groups to prepare the first monomer component, the first monomer component is prepared by known polymerization methods such as solution polymerization, block polymerization, emulsion polymerization, etc.

作為聚合方法,較佳可例舉溶液聚合。Solution polymerization is a preferred example of a polymerization method.

於溶液聚合中,例如向溶劑中調配第1單體成分、與聚合起始劑而製備單體溶液,然後對單體溶液進行加熱。In solution polymerization, for example, a monomer solution is prepared by adding a first monomer component and a polymerization initiator to a solvent, and then the monomer solution is heated.

作為溶劑,例如可例舉有機溶劑等。As a solvent, examples include organic solvents.

作為有機溶劑,可例舉:例如甲苯、苯、二甲苯等芳香族烴系溶劑、例如二乙基醚等醚系溶劑、例如丙酮、甲基乙基酮等酮系溶劑、例如乙酸乙酯等酯系溶劑、例如N,N-二甲基甲醯胺等醯胺系溶劑,較佳可例舉酯系溶劑,更佳可例舉乙酸乙酯。Examples of organic solvents include: aromatic hydrocarbon solvents such as toluene, benzene, and xylene; ether solvents such as diethyl ether; ketone solvents such as acetone and methyl ethyl ketone; ester solvents such as ethyl acetate; and amide solvents such as N,N-dimethylformamide. Ester solvents are preferred, and ethyl acetate is even more preferred.

溶劑可單獨使用或併用兩種以上。Solvents can be used alone or in combination of two or more.

溶劑之調配比率相對於第1單體成分100質量份,例如為100質量份以上、較佳為200質量份以上,又,例如為500質量份以下、較佳為300質量份以下。The solvent mixing ratio is 100 parts by mass relative to the first monomer component, for example, 100 parts by mass or more, preferably 200 parts by mass or more, or for example, 500 parts by mass or less, preferably 300 parts by mass or less.

作為聚合起始劑,例如可例舉過氧化物系聚合起始劑、偶氮系聚合起始劑等。Examples of polymerization initiators include peroxide-based polymerization initiators and azo-based polymerization initiators.

作為過氧化物系聚合起始劑,例如可例舉:過氧化碳酸酯、過氧化酮、過氧縮酮、過氧化氫、二烷基過氧化物、二醯基過氧化物、過氧酯等有機過氧化物。Examples of peroxide-based polymerization initiators include: peroxy carbonates, peroxide ketones, peroxy ketones, hydrogen peroxide, dialkyl peroxides, diacetyl peroxides, peroxy esters, and other organic peroxides.

作為偶氮系聚合起始劑,例如可例舉:2,2'-偶氮二異丁腈、2,2'-偶氮雙(2-甲基丁腈)、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙異丁酸二甲酯等偶氮化合物。Examples of azo compounds that can be used as initiators for azo polymerization include: 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis(2,4-dimethylpentanonitrile), and dimethyl 2,2'-azobisisobutyrate.

作為聚合起始劑,較佳可例舉偶氮系聚合起始劑,更佳為可例舉2,2'-偶氮二異丁腈。As a polymerization initiator, azo polymerization initiators are preferred, and 2,2'-azobisisobutyronitrile is even more preferred.

聚合起始劑可單獨使用或併用兩種以上。Polymerization initiators can be used alone or in combination of two or more.

聚合起始劑之調配比率相對於第1單體成分100質量份,例如為0.05質量份以上、較佳為0.1質量份以上,又,例如為1質量份以下、較佳為0.5質量份以下。The mixing ratio of the polymerization initiator relative to 100 parts by mass of the first monomer component is, for example, 0.05 parts by mass or more, preferably 0.1 parts by mass or more, or, for example, 1 part by mass or less, preferably 0.5 parts by mass or less.

加熱溫度例如為50℃以上80℃以下,加熱時間例如為1小時以上8小時以下。The heating temperature is, for example, above 50°C and below 80°C, and the heating time is, for example, above 1 hour and below 8 hours.

藉此,使第1單體成分聚合而獲得包含丙烯酸系聚合物之丙烯酸系聚合物溶液。In this way, the first monomer component is polymerized to obtain an acrylic polymer solution containing an acrylic polymer.

丙烯酸系聚合物溶液之固形物成分濃度例如為20質量%以上,又,例如為80質量%以下。The solid content concentration of the acrylic polymer solution is, for example, 20% by mass or more, or, for example, 80% by mass or less.

丙烯酸系聚合物之重量平均分子量例如為100000以上、較佳為300000以上、500000以上,又,例如為5000000以下、較佳為3000000以下、更佳為2000000以下。The weight average molecular weight of the acrylic polymer is, for example, 100,000 or more, preferably 300,000 or more, 500,000 or more, or, for example, less than 5,000,000, preferably less than 3,000,000, and even more preferably less than 2,000,000.

再者,上述重量平均分子量係藉由GPC(凝膠滲透層析法)進行測定並藉由聚苯乙烯換算而算出之值。Furthermore, the aforementioned weight-average molecular weight was determined by GPC (gel permeation chromatography) and calculated using polystyrene conversion.

於第1黏著性組合物中,基礎聚合物之玻璃轉移溫度(Tg)例如為-100℃以上、較佳為-80℃以上、更佳為-40℃以上,又,例如為-10℃以下、較佳為-5℃以下、更佳為0℃以下。In the first adhesive composition, the glass transition temperature (Tg) of the base polymer is, for example, above -100°C, preferably above -80°C, more preferably above -40°C, and also, for example, below -10°C, preferably below -5°C, more preferably below 0°C.

此種構成就確保第1黏著性組合物中之基礎聚合物之流動性之方面而言適宜,因此,就藉由活性能量線(於下文敍述)使第1黏著性組合物向高黏著力狀態變化之方面而言適宜。This configuration is suitable in terms of ensuring the fluidity of the base polymer in the first adhesive composition, and therefore suitable in terms of changing the first adhesive composition to a high adhesive state by means of active energy lines (described below).

再者,玻璃轉移溫度係文獻或目錄等中所記載之值、或基於下述式(1)(Fox式)計算所得之值。關於下述其他聚合物之玻璃轉移溫度亦同樣如此。Furthermore, the glass transition temperature is a value recorded in literature or catalogues, or a value calculated based on the following formula (1) (Fox formula). The same applies to the glass transition temperatures of the other polymers described below.

1/Tg=W1 /Tg1 +W2 /Tg2 +…+Wn /Tgn (1)1/Tg=W 1 /Tg 1 +W 2 /Tg 2 +…+W n /Tg n (1)

於上述式(1)中,Tg表示聚合物(A)之玻璃轉移溫度(單位:K),Tgi (i=1、2、…n)表示單體i形成均聚物時之玻璃轉移溫度(單位:K),Wi (i=1、2、…n)表示單體i在所有單體成分中之質量分率。In the above formula (1), Tg represents the glass transition temperature of polymer (A) (unit: K), Tg i (i = 1, 2, ... n) represents the glass transition temperature of monomer i when it forms a homopolymer (unit: K), and Wi (i = 1, 2, ... n) represents the mass fraction of monomer i in all monomer components.

於第1黏著性組合物中,基礎聚合物之調配比率相對於基礎聚合物、光硬化劑及光聚合起始劑之總量,例如為70質量%以上,又,例如為95質量%以下。In the first adhesive composition, the formulation ratio of the base polymer relative to the total amount of the base polymer, photocuring agent and photopolymerization initiator is, for example, 70% by mass or more, or, for example, 95% by mass or less.

光硬化劑就藉由光照射使黏著劑層3之黏著力充分地提高之觀點而言,例如可例舉官能基數量2以上3以下之多官能(甲基)丙烯酸酯,具體而言,可例舉聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、聚四亞甲基二醇二(甲基)丙烯酸酯、雙酚A環氧乙烷改性二(甲基)丙烯酸酯、雙酚A環氧丙烷改性二(甲基)丙烯酸酯、烷二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯等2官能(甲基)丙烯酸酯、例如乙氧化異三聚氰酸三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯等3官能(甲基)丙烯酸酯等,較佳可例舉2官能(甲基)丙烯酸酯。From the perspective of light curing agents, which significantly enhance the adhesive strength of adhesive layer 3 through light irradiation, examples include multifunctional (meth)acrylates with a functional group number of 2 to 3. Specifically, examples include polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, bisphenol A ethylene oxide modified di(meth)acrylate, bisphenol A propylene oxide modified di(meth)acrylate, and alkyldiol di(meth)acrylate. Difunctional (meth) acrylates include methacrylates such as tricyclodecanediethanol di(meth)acrylate, pentaerythritol di(meth)acrylate, neopentyl glycol di(meth)acrylate, and glycerol di(meth)acrylate; and trifunctional (meth) acrylates such as ethoxyisocyanurate tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and trihydroxymethylpropane tri(meth)acrylate, with difunctional (meth) acrylates being preferred.

又,作為光硬化劑,例如亦可例舉:丙烯酸系光反應性低聚物、胺基甲酸酯系、聚醚系、聚酯系、聚碳酸酯系、聚丁二烯系等光反應性低聚物。Furthermore, examples of photocuring agents include: acrylic photoreactive oligomers, carbamate-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based photoreactive oligomers.

光硬化劑可單獨使用或併用兩種以上。Light curing agents can be used alone or in combination of two or more.

又,光硬化劑之官能基當量例如為50 g/eq以上,又,例如為500 g/eq以下。Furthermore, the functional group equivalent of the photocuring agent is, for example, 50 g/eq or more, or, for example, 500 g/eq or less.

光硬化劑在25℃下之黏度例如為5 mPa・s以上,又,例如為1000 mPa・s以下。The viscosity of the light-curing agent at 25°C is, for example, 5 mPa·s or more, or, for example, 1000 mPa·s or less.

就相溶性之觀點而言,光硬化劑之分子量例如為200以下,又,例如為1000以上。From the perspective of compatibility, the molecular weight of the photocuring agent is, for example, less than 200, or more than 1000.

又,光硬化劑較佳為選擇不與基礎聚合物(較佳為丙烯酸系聚合物)相溶者。Furthermore, the light curing agent is preferably one that is incompatible with the base polymer (preferably an acrylic polymer).

若光硬化劑不與基礎聚合物(較佳為丙烯酸系聚合物)相溶,則可使未被照射光之黏著劑層3之黏著力(於下文敍述)變低。If the light-curing agent is not compatible with the base polymer (preferably an acrylic polymer), the adhesion of the adhesive layer 3 that has not been exposed to light (described below) may be reduced.

光硬化劑之調配比率相對於基礎聚合物100質量份,例如為10質量份以上,又,例如為50質量份以下、較佳為30質量份以下。The mixing ratio of the light curing agent relative to 100 parts by mass of the base polymer is, for example, 10 parts by mass or more, or, for example, 50 parts by mass or less, preferably 30 parts by mass or less.

又,光硬化劑之調配比率相對於基礎聚合物、光硬化劑及光聚合起始劑之總量,例如為5質量%以上,又,例如為30質量%以下。Furthermore, the mixing ratio of the photocuring agent relative to the total amount of the base polymer, photocuring agent, and photopolymerization initiator is, for example, 5% by mass or more, or, for example, 30% by mass or less.

光聚合起始劑促進光硬化劑之硬化反應,且根據光硬化劑之種類等而適當選擇,可例舉:例如光陽離子起始劑(光酸產生劑)、例如1-羥基環己基苯基酮等羥基酮類、苯偶醯二甲基縮酮類、胺基酮類、醯基氧化膦類、二苯甲酮類、含三氯甲基之三𠯤衍生物等光自由基起始劑、例如光陰離子起始劑(光鹼產生劑)等。Photopolymerization initiators promote the curing reaction of photocuring agents, and can be appropriately selected according to the type of photocuring agent. Examples include: photocationic initiators (photoacid generators), hydroxy ketones such as 1-hydroxycyclohexylphenyl ketone, benzohexanedimethyl acetones, amino ketones, acetophosphine oxides, benzophenones, photoradical initiators such as trichloromethyl triazine derivatives, and photocationic initiators (photoalkali generators).

光聚合起始劑可單獨使用或併用兩種以上。Photopolymerization initiators can be used alone or in combination of two or more.

此種光聚合起始劑中,於使用多官能(甲基)丙烯酸酯作為光硬化劑之情形時,較佳採用光自由基起始劑,更佳採用羥基酮類。In the case of using polyfunctional (meth)acrylates as photocuring agents, photoradical initiators are preferred, and hydroxyl ketones are even more preferred.

光聚合起始劑之光吸收區域例如為300 nm以上,又,例如為450 nm以下。The light absorption region of the photopolymerization initiator is, for example, above 300 nm, or below 450 nm.

光聚合起始劑之調配比率相對於基礎聚合物100質量份,例如為0.01質量份以上,又,例如為1質量份以下、較佳為0.5質量份以下。The ratio of the photopolymerization initiator to the base polymer is, for example, more than 0.01 parts by mass, or, for example, less than 1 part by mass, preferably less than 0.5 parts by mass.

又,光聚合起始劑之調配比率相對於基礎聚合物、光硬化劑及光聚合起始劑之總量,例如為0.01質量%以上,又,例如為1質量%以下、較佳為0.5質量%以下。Furthermore, the proportion of the photopolymerization initiator relative to the total amount of the base polymer, photocuring agent, and photopolymerization initiator is, for example, 0.01% by mass or more, or, for example, 1% by mass or less, preferably 0.5% by mass or less.

並且,於製備第1黏著性組合物時,將基礎聚合物(較佳為丙烯酸系聚合物(於藉由溶液聚合來製備丙烯酸系聚合物之情形時,為丙烯酸系聚合物溶液))、光硬化劑、及光聚合起始劑以上述比率進行調配並混合。Furthermore, in preparing the first adhesive composition, the base polymer (preferably an acrylic polymer (in the case of preparing an acrylic polymer by solution polymerization, an acrylic polymer solution)), the photocuring agent, and the photopolymerization initiator are formulated and mixed in the above ratio.

於第1黏著性組合物中,就對基礎聚合物(較佳為丙烯酸系聚合物)導入交聯結構之觀點而言,較佳為調配交聯劑。In the first adhesive composition, from the viewpoint of introducing a crosslinking structure into the base polymer (preferably an acrylic polymer), a formulation crosslinking agent is preferred.

作為交聯劑,例如可例舉異氰酸酯系交聯劑、環氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、碳二醯亞胺系交聯劑、金屬螯合物系交聯劑等,較佳可例舉異氰酸酯系交聯劑。Examples of crosslinking agents include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, aziridine-based crosslinking agents, carbodiimide-based crosslinking agents, and metal chelate-based crosslinking agents, with isocyanate-based crosslinking agents being a preferred example.

作為異氰酸酯系交聯劑,可例舉:例如伸丁基二異氰酸酯、六亞甲基二異氰酸酯等脂肪族二異氰酸酯、例如伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族二異氰酸酯、例如2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族二異氰酸酯。Examples of isocyanate crosslinking agents include: aliphatic diisocyanates such as butyl diisocyanate and hexamethylene diisocyanate; alicyclic diisocyanates such as cyclopentyl diisocyanate, cyclohexyl diisocyanate, and isophorone diisocyanate; and aromatic diisocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and phenyl dimethyl diisocyanate.

又,作為異氰酸酯系交聯劑,亦可例舉上述異氰酸酯之衍生物(例如異氰尿酸酯改性體、多元醇改性體等)。Furthermore, as isocyanate-based crosslinking agents, derivatives of the aforementioned isocyanates (such as isocyanurate modifiers, polyol modifiers, etc.) can also be cited.

作為異氰酸酯系交聯劑,亦可使用市售品,例如可例舉:Coronate L(甲苯二異氰酸酯之三羥甲基丙烷加成物,Tosoh製造)、Coronate HL(六亞甲基二異氰酸酯之三羥甲基丙烷加成物,Tosoh製造)、Coronate HX(六亞甲基二異氰酸酯之異氰尿酸酯體)、Takenate D110N(苯二甲基二異氰酸酯之三羥甲基丙烷加成物,三井化學製造)等。As an isocyanate crosslinking agent, commercially available products can also be used, such as: Coronate L (trihydroxymethylpropane adduct of toluene diisocyanate, manufactured by Tosoh), Coronate HL (trihydroxymethylpropane adduct of hexamethylene diisocyanate, manufactured by Tosoh), Coronate HX (isocyanurate form of hexamethylene diisocyanate), Takenate D110N (trihydroxymethylpropane adduct of phenyl diisocyanate, manufactured by Mitsui Chemicals), etc.

交聯劑可單獨使用或併用兩種以上。Crosslinking agents can be used alone or in combination of two or more.

若於第1黏著性組合物中調配交聯劑,則基礎聚合物(較佳為丙烯酸系聚合物)中之羥基等官能基、與交聯劑進行反應,而對基礎聚合物(較佳為丙烯酸系聚合物)導入交聯結構。If a crosslinking agent is incorporated into the first adhesive composition, the hydroxyl and other functional groups in the base polymer (preferably an acrylic polymer) react with the crosslinking agent to introduce a crosslinked structure into the base polymer (preferably an acrylic polymer).

交聯劑之官能基當量例如為50 g/eq以上,又,例如為500 g/eq以下。The functional group equivalent of the crosslinking agent is, for example, 50 g/eq or more, or, for example, 500 g/eq or less.

交聯劑之調配比率相對於基礎聚合物100質量份,例如為0.1質量份以上、較佳為1.0質量份以上、更佳為1.5質量份以上、進而較佳為2.0質量份以上,又,例如為10質量份以下、較佳為5質量份以下、更佳為4質量份以下。The mixing ratio of the crosslinking agent relative to 100 parts by weight of the base polymer is, for example, 0.1 parts by weight or more, preferably 1.0 parts by weight or more, more preferably 1.5 parts by weight or more, and even more preferably 2.0 parts by weight or more, or, for example, 10 parts by weight or less, preferably 5 parts by weight or less, and even more preferably 4 parts by weight or less.

又,於在第1黏著性組合物中調配交聯劑之情形時,亦可為了促進交聯反應而調配交聯觸媒。Furthermore, when a crosslinking agent is formulated into the first adhesive composition, a crosslinking catalyst may also be formulated to promote the crosslinking reaction.

作為交聯觸媒,例如可例舉:鈦酸四正丁酯、鈦酸四異丙酯、三乙醯丙酮鐵、氧化丁基錫、二月桂酸二辛基錫等金屬系交聯觸媒等。Examples of crosslinking catalysts include: tetrabutyl titanium ester, tetraisopropyl titanium ester, iron triacetone, butyltin oxide, dioctyltin dilaurate, and other metal-based crosslinking catalysts.

交聯觸媒可單獨使用或併用兩種以上。Cross-linked catalysts can be used alone or in combination of two or more.

交聯觸媒之調配比率相對於基礎聚合物100質量份,例如為0.001質量份以上、較佳為0.01質量份以上,又,例如為0.05質量份以下。The mixing ratio of the crosslinked catalyst relative to 100 parts by mass of the base polymer is, for example, 0.001 parts by mass or more, preferably 0.01 parts by mass or more, and, for example, 0.05 parts by mass or less.

又,於第1黏著性組合物中,可視需要於無損本發明之效果之範圍內例如含有矽烷偶合劑、黏著性賦予劑、塑化劑、軟化劑、抗劣化劑、填充劑、著色劑、自螢光燈下或自然光下之穩定化之觀點之紫外線吸收劑、自螢光燈下或自然光下之穩定化之觀點之抗氧化劑、界面活性劑、抗靜電劑等添加劑等各種添加劑。Furthermore, the first adhesive composition may contain, as needed and to the extent that it does not impair the effects of the invention, various additives such as silane coupling agents, adhesive enhancers, plasticizers, softeners, anti-deterioration agents, fillers, colorants, UV absorbers that stabilize under fluorescent or natural light, antioxidants that stabilize under fluorescent or natural light, surfactants, antistatic agents, etc.

藉此,獲得第1黏著性組合物。In this way, the first adhesive composition is obtained.

基礎聚合物之調配比率相對於第1黏著性組合物,例如為50質量%以上、較佳為80質量%以上,又,例如為90質量%以下。The formulation ratio of the base polymer relative to the first adhesive component is, for example, 50% by mass or more, preferably 80% by mass or more, or, for example, 90% by mass or less.

光硬化劑之調配比率相對於第1黏著性組合物,例如為10質量%以上,又,例如為50質量%以下。The mixing ratio of the light curing agent relative to the first adhesive component is, for example, 10% by mass or more, or, for example, 50% by mass or less.

光聚合起始劑之調配比率相對於第1黏著性組合物,例如為0.01質量%以上,又,例如為0.5質量%以下、較佳為0.1質量%以下。The proportion of the photopolymerization initiator relative to the first adhesive component is, for example, 0.01% by mass or more, or, for example, 0.5% by mass or less, preferably 0.1% by mass or less.

第2黏著性組合物包含上述基礎聚合物、及含有有機矽氧烷之成分。The second adhesive composition comprises the aforementioned base polymer and an organosiloxane-containing component.

作為基礎聚合物,較佳可例舉丙烯酸系聚合物。As a basic polymer, acrylic polymers are a good example.

於第2黏著性組合物中,基礎聚合物之玻璃轉移溫度(Tg)例如為-100℃以上、較佳為-80℃以上、更佳為-40℃以上,又,例如為-10℃以下、較佳為-5℃以下、更佳為0℃以下。In the second adhesive composition, the glass transition temperature (Tg) of the base polymer is, for example, above -100°C, preferably above -80°C, more preferably above -40°C, and also, for example, below -10°C, preferably below -5°C, more preferably below 0°C.

此種構成就確保第2黏著性組合物中之基礎聚合物之流動性之方面而言適宜,因此,就藉由加熱使第2黏著性組合物向高黏著力狀態變化之方面而言適宜。This configuration is suitable in terms of ensuring the flowability of the base polymer in the second adhesive composition, and therefore suitable in terms of changing the second adhesive composition to a high adhesive state by heating.

基礎聚合物可單獨使用或併用兩種以上。The base polymer can be used alone or in combination of two or more.

基礎聚合物之調配比率相對於基礎聚合物與含有有機矽氧烷之成分之總量,例如為70質量%以上,又,例如為99質量%以下、較佳為90質量%以下。The blending ratio of the base polymer relative to the total amount of the base polymer and the component containing organosilicon is, for example, 70% by mass or more, or, for example, 99% by mass or less, preferably 90% by mass or less.

作為含有有機矽氧烷之成分,例如可例舉具有有機矽氧烷骨架之丙烯酸系聚合物、胺基甲酸酯系聚合物、聚醚系聚合物、聚酯系聚合物、聚碳酸酯系聚合物、聚丁二烯系聚合物等,就控制黏著力之觀點而言,較佳可例舉具有有機矽氧烷骨架之丙烯酸系聚合物。As a component containing organosiloxanes, examples include acrylic polymers, urethane polymers, polyether polymers, polyester polymers, polycarbonate polymers, and polybutadiene polymers that have organosiloxane backbones. From the viewpoint of controlling adhesive strength, acrylic polymers with organosiloxane backbones are preferred.

具有有機矽氧烷骨架之丙烯酸系聚合物係藉由包含具有有機矽氧烷骨架之單體與上述(甲基)丙烯酸烷基酯之第2單體成分之聚合而獲得。Acrylic polymers having an organosiloxane backbone are obtained by polymerization of a second monomer component comprising a monomer having an organosiloxane backbone and the aforementioned (meth)acrylate alkyl ester.

作為具有有機矽氧烷骨架之單體,並無特別限定,可使用含有有機矽氧烷骨架之任意單體。There are no particular limitations on the monomer having an organosiloxane skeleton; any monomer containing an organosiloxane skeleton can be used.

作為具有有機矽氧烷骨架之單體,例如可使用下述通式(1)或(2)所表示之化合物。As a monomer having an organosilicon skeleton, for example, a compound represented by the following general formula (1) or (2) can be used.

[化1] [Chemistry 1]

於上述式(1)中,R1 表示氫或甲基,m表示0以上之整數。In the above formula (1), R1 represents hydrogen or methyl, and m represents an integer greater than or equal to 0.

[化2] [Chemistry 2]

於上述式(2)中,R1 及m表示與上述式(1)之R1 及m相同之意義,R2 表示甲基或一價有機基,n表示0以上之整數。In the above formula (2), R1 and m have the same meaning as R1 and m in the above formula (1), R2 represents a methyl group or a monovalent organic group, and n represents an integer greater than 0.

又,作為具有有機矽氧烷骨架之單體,亦可使用市售品,具體而言,可例舉X-22-174ASX、X-22-2426、X-22-2475、KF-2012(以上為單末端反應性矽酮,信越化學工業股份有限公司製造)等。Furthermore, as a monomer with an organosilicon skeleton, commercially available products can also be used. Specifically, examples include X-22-174ASX, X-22-2426, X-22-2475, and KF-2012 (the above are single-terminal reactive silicones manufactured by Shin-Etsu Chemical Industry Co., Ltd.).

具有有機矽氧烷骨架之單體之官能基當量例如為700 g/mol以上、較佳為800 g/mol以上、更佳為850 g/mol以上、進而較佳為1500 g/mol以上,又,例如為未達20000 g/mol、較佳為未達15000 g/mol、更佳為未達10000 g/mol、進而較佳為未達6000 g/mol、尤佳為未達5000 g/mol。The functional group equivalent of the monomer having an organosilicon skeleton is, for example, 700 g/mol or more, preferably 800 g/mol or more, more preferably 850 g/mol or more, and even more preferably 1500 g/mol or more; and, for example, less than 20000 g/mol, preferably less than 15000 g/mol, more preferably less than 10000 g/mol, even more preferably less than 6000 g/mol, and even more preferably less than 5000 g/mol.

具有有機矽氧烷骨架之單體之調配比率相對於具有有機矽氧烷骨架之單體及(甲基)丙烯酸烷基酯之總量,例如為10質量%以上、較佳為15質量%以上、更佳為20質量%以上,又,例如為60質量%以下、較佳為50質量%以下、更佳為40質量%以下、進而較佳為30質量%以下。The proportion of the monomer having an organosiloxane backbone relative to the total amount of the monomer having an organosiloxane backbone and the (meth)acrylate alkyl ester is, for example, 10% by mass or more, preferably 15% by mass or more, more preferably 20% by mass or more, and, for example, 60% by mass or less, preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less.

又,第2單體成分較佳為亦可包含上述含官能基之乙烯基單體。Furthermore, the second monomer component may preferably also include the aforementioned vinyl monomers containing functional groups.

並且,具有有機矽氧烷骨架之丙烯酸系聚合物係使上述第2單體成分聚合而成之聚合物。Furthermore, the acrylic polymer having an organosilicon backbone is a polymer formed by polymerizing the aforementioned second monomer component.

於使第2單體成分聚合時,例如調配具有有機矽氧烷骨架之單體與(甲基)丙烯酸烷基酯並視需要調配含官能基之乙烯基單體而製備第2單體成分,將其例如藉由溶液聚合、塊狀聚合、乳化聚合等公知之聚合方法進行製備。When polymerizing the second monomer component, for example, a monomer having an organosiloxane backbone is formulated with an alkyl methacrylate and a vinyl monomer containing a functional group is formulated as needed to prepare the second monomer component, which is prepared by known polymerization methods such as solution polymerization, block polymerization, emulsion polymerization, etc.

作為聚合方法,較佳可例舉溶液聚合。Solution polymerization is a preferred example of a polymerization method.

於溶液聚合中,例如向溶劑中調配第2單體成分、及上述聚合起始劑而製備單體溶液,然後對單體溶液進行加熱。In solution polymerization, for example, a monomer solution is prepared by adding a second monomer component and the above-mentioned polymerization initiator to a solvent, and then the monomer solution is heated.

又,於上述聚合中,為了調整分子量,可使用公知之鏈轉移劑。Furthermore, in the above polymerization, known chain transfer agents can be used to adjust the molecular weight.

藉此,獲得具有有機矽氧烷骨架之丙烯酸系聚合物。In this way, an acrylic polymer with an organosiloxane backbone was obtained.

此種具有有機矽氧烷骨架之丙烯酸系聚合物於側鏈具有有機矽氧烷骨架。因此,具有該有機矽氧烷骨架之丙烯酸系聚合物藉由側鏈之移動性及移動容易性,而初期黏著力(加熱前之黏著力)較低,藉由加熱而黏著力上升。This type of acrylic polymer with an organosiloxane backbone has an organosiloxane backbone on its side chains. Therefore, due to the mobility and ease of movement of the side chains, the acrylic polymer with this organosiloxane backbone has a lower initial adhesion (adhesion before heating), and the adhesion increases with heating.

並且,第2黏著性組合物係藉由將基礎聚合物、及含有有機矽氧烷之成分進行混合而獲得。Furthermore, the second adhesive composition is obtained by mixing a base polymer and an organosiloxane-containing component.

又,於第2黏著性組合物中,亦可調配上述交聯劑及上述交聯觸媒。Furthermore, the aforementioned crosslinking agent and crosslinking catalyst may also be incorporated into the second adhesive composition.

又,於第2黏著性組合物中,可視需要於無損本發明之效果之範圍內例如含有矽烷偶合劑、黏著性賦予劑、塑化劑、軟化劑、抗劣化劑、填充劑、著色劑、自螢光燈下或自然光下之穩定化之觀點之紫外線吸收劑、自螢光燈下或自然光下之穩定化之觀點之抗氧化劑、界面活性劑、抗靜電劑等添加劑等各種添加劑。Furthermore, the second adhesive composition may contain, as needed and to the extent that it does not impair the effects of the invention, various additives such as silane coupling agents, adhesive enhancers, plasticizers, softeners, anti-deterioration agents, fillers, colorants, UV absorbers that stabilize under fluorescent or natural light, antioxidants that stabilize under fluorescent or natural light, surfactants, antistatic agents, etc.

藉此,獲得第2黏著性組合物。In this way, a second adhesive composition is obtained.

於第2黏著性組合物中,含有有機矽氧烷之成分之調配比率相對於基礎聚合物100質量份,例如為0.1質量份以上、較佳為0.3質量份以上、更佳為0.4質量份以上、進而較佳為0.5質量份以上、尤佳為1質量份以上、最佳為2質量份以上,又,例如為75質量份以下、較佳為50質量份以下、更佳為20質量份以下、進而較佳為10質量份以下、尤佳為8質量份以下、最佳為5質量份以下。In the second adhesive composition, the proportion of the organosiloxane component relative to 100 parts by weight of the base polymer is, for example, 0.1 parts by weight or more, preferably 0.3 parts by weight or more, more preferably 0.4 parts by weight or more, even more preferably 0.5 parts by weight or more, particularly preferably 1 part by weight or more, most preferably 2 parts by weight or more, and, for example, 75 parts by weight or less, preferably 50 parts by weight or less, more preferably 20 parts by weight or less, even more preferably 10 parts by weight or less, particularly preferably 8 parts by weight or less, most preferably 5 parts by weight or less.

並且,藉由下述方法自黏著性組合物(第1黏著性組合物或第2黏著性組合物)形成黏著劑層3。Furthermore, an adhesive layer 3 is formed by the self-adhesive composition (first adhesive composition or second adhesive composition) using the following method.

就黏著性之觀點而言,黏著劑層3之厚度例如為5 μm以上、較佳為10 μm以上、更佳為15 μm以上、進而較佳為20 μm以上,又,就處理性之觀點而言,例如為300 μm以下、較佳為100 μm以下、更佳為50 μm以下、進而較佳為40 μm以下、尤佳為30 μm以下。From the perspective of adhesion, the thickness of the adhesive layer 3 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, and even more preferably 20 μm or more. From the perspective of efficiency, it is, for example, 300 μm or less, preferably 100 μm or less, more preferably 50 μm or less, even more preferably 40 μm or less, and even more preferably 30 μm or less.

2-3.補強膜之製造方法 其次,參照圖2對製造補強膜4之方法進行說明。2-3. Method for manufacturing the reinforcing membrane Next, the method for manufacturing the reinforcing membrane 4 will be explained with reference to Figure 2.

製造該補強膜4之方法具備:準備基材2之第1步驟、及於基材2之一面配置黏著劑層3之第2步驟。The method for manufacturing the reinforcing film 4 includes: a first step of preparing a substrate 2, and a second step of applying an adhesive layer 3 to one side of the substrate 2.

於第1步驟中,如圖2A所示,準備基材2。In step 1, as shown in Figure 2A, substrate 2 is prepared.

於第2步驟中,如圖2B所示,於基材2之一面配置黏著劑層3。In step 2, as shown in Figure 2B, an adhesive layer 3 is disposed on one side of the substrate 2.

於在基材2之一面配置黏著劑層3時,例如在基材2之一面塗佈上述黏著性組合物,視需要對溶劑進行乾燥而去除。When the adhesive layer 3 is applied to one side of the substrate 2, for example, the adhesive composition is applied to one side of the substrate 2, and the solvent is dried and removed as needed.

作為黏著性組合物之塗佈方法,例如可例舉:輥式塗佈、接觸輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴塗、浸漬輥式塗佈、棒式塗佈、刮塗、氣刀塗佈、淋幕式塗佈、模唇塗佈、模嘴塗佈等。Examples of coating methods for adhesive compositions include: roller coating, contact roller coating, gravure coating, reverse coating, roller brush coating, spraying, dip roller coating, rod coating, scraping, air knife coating, curtain coating, mold lip coating, and mold nozzle coating.

作為乾燥條件,乾燥溫度例如為50℃以上、較佳為70℃以上、更佳為100℃以上,又,例如為200℃以下、較佳為180℃以下、更佳為150℃以下,乾燥時間例如為5秒以上、較佳為10秒以上,又,例如為20分鐘以下、較佳為15分鐘以下、更佳為10分鐘以下。As for drying conditions, the drying temperature is, for example, above 50°C, preferably above 70°C, more preferably above 100°C, or, for example, below 200°C, preferably below 180°C, more preferably below 150°C, and the drying time is, for example, above 5 seconds, preferably above 10 seconds, or, for example, below 20 minutes, preferably below 15 minutes, more preferably below 10 minutes.

藉此,於基材2之一面形成黏著劑層3,而獲得具備基材2、及配置於基材2之一面之黏著劑層3的補強膜4。In this way, an adhesive layer 3 is formed on one side of the substrate 2, thereby obtaining a reinforcing film 4 having the substrate 2 and the adhesive layer 3 disposed on one side of the substrate 2.

再者,於黏著性組合物包含交聯劑之情形時,在與乾燥去除同時、或溶劑之乾燥後(於黏著劑層3之一面積層剝離膜8(於下文敍述)後),較佳為藉由老化使交聯進行。Furthermore, when the adhesive composition contains a crosslinking agent, crosslinking is preferably carried out by aging, either simultaneously with drying or after the solvent has dried (after peeling off the film 8 on one area of the adhesive layer 3 (described below)).

老化條件係根據交聯劑之種類適當設定,老化溫度例如為20℃以上,又,例如為160℃以下、較佳為100℃以下,又,老化時間為1分鐘以上、較佳為12小時以上、更佳為1天以上,又,例如為7天以下。The aging conditions are set appropriately according to the type of crosslinking agent. For example, the aging temperature is above 20°C, or below 160°C, preferably below 100°C. The aging time is above 1 minute, preferably above 12 hours, more preferably above 1 day, or below 7 days.

又,如圖2C所示,補強膜4亦可視需要於黏著劑層3之一面積層剝離膜8。Furthermore, as shown in Figure 2C, the reinforcing membrane 4 can also be peeled off as needed onto one area of the adhesive layer 3.

於此種情形時,補強膜4依序具備基材2、黏著劑層3、及剝離膜8。In this case, the reinforcing membrane 4 sequentially comprises a substrate 2, an adhesive layer 3, and a peeling membrane 8.

作為剝離膜8,例如可例舉聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等可撓性之塑膠膜。As a release film 8, examples of flexible plastic films include polyethylene, polypropylene, polyethylene terephthalate, and polyester film.

剝離膜8之厚度例如為3 μm以上、較佳為10 μm以上,又,例如為200 μm以下、較佳為100 μm以下、更佳為50 μm以下。The thickness of the exfoliating membrane 8 is, for example, 3 μm or more, preferably 10 μm or more, and also, for example, 200 μm or less, preferably 100 μm or less, and more preferably 50 μm or less.

對於剝離膜8,較佳為利用矽酮系、氟系、長鏈烷基系、脂肪酸醯胺系等脫模劑實施脫模處理,或利用二氧化矽粉末實施脫模處理。For the release film 8, it is preferable to use release agents such as silicone-based, fluorine-based, long-chain alkyl-based, or fatty acid amide-based release agents for release treatment, or to use silica powder for release treatment.

3.軟性被黏著體 軟性被黏著體5係具有可撓性且由補強膜4補強之被補強體,例如可例舉:軟性顯示面板等軟性之光學器件、軟性印刷配線板(FPC)等軟性之電子器件、及作為該等之構成零件之軟性基材。於軟性被黏著體5為軟性之光學器件之情形時,於軟性被黏著體5之一面例如形成有包含呈陣列狀存在之複數個像素之像素區域、包含驅動電路等各種電路元件之電路區域、及將該等電性連接之配線圖案。於軟性被黏著體5為軟性之電子器件之情形時,於軟性被黏著體5之一面例如形成有各種電路元件及配線圖案。於圖1中,軟性被黏著體5具有平板形狀,但能夠根據製造目標器件之設計獲得各種俯視形狀。3. Flexible Adhesive The flexible adhesive 5 is a flexible, reinforced body reinforced by the reinforcing film 4. Examples include flexible optical devices such as flexible display panels, flexible electronic devices such as flexible printed circuit boards (FPCs), and flexible substrates that serve as components of such devices. When the flexible adhesive 5 is a flexible optical device, a pixel region containing a plurality of pixels arranged in an array, a circuit region containing various circuit elements such as driver circuits, and a wiring pattern connecting such electrical components are formed on one side of the flexible adhesive 5. When the flexible substrate 5 is a flexible electronic device, various circuit components and wiring patterns are formed on one side of the flexible substrate 5. In Figure 1, the flexible substrate 5 has a flat plate shape, but various top-view shapes can be obtained according to the design of the target device.

4.積層體之製造方法 參照圖3對積層體1之製造方法之一實施形態進行說明。4. Manufacturing method of laminate 1 Referring to Figure 3, one embodiment of the manufacturing method of laminate 1 will be explained.

該積層體1之製造方法具備:準備補強膜4之步驟(第3步驟);於補強膜4之一面配置軟性被黏著體5之步驟(第4步驟);藉由去除補強膜4之一部分而形成第1補強膜部6及第2補強膜部7之步驟(第5步驟);使黏著劑層3之黏著力提高之步驟(第6步驟)。The manufacturing method of the laminate 1 includes: a step of preparing a reinforcing film 4 (step 3); a step of placing a soft adhesive 5 on one side of the reinforcing film 4 (step 4); a step of forming a first reinforcing film portion 6 and a second reinforcing film portion 7 by removing a portion of the reinforcing film 4 (step 5); and a step of increasing the adhesive force of the adhesive layer 3 (step 6).

如上所述,第1黏著性組合物及第2黏著性組合物之共通點係為能夠自黏著力較低之狀態向黏著力較高之狀態不可逆地進行狀態變化之組合物,且於以下點不同:第1黏著性組合物藉由光進行狀態變化,另一方面,第2黏著性組合物藉由熱進行狀態變化。As described above, the common feature of the first adhesive composition and the second adhesive composition is that they are compositions capable of irreversibly changing from a state with lower adhesive strength to a state with higher adhesive strength. However, they differ in the following aspects: the first adhesive composition changes state by light, while the second adhesive composition changes state by heat.

又,詳細將於後文敍述,但於第1黏著性組合物中,光硬化劑(較佳為多官能(甲基)丙烯酸酯)之硬化物成為黏著力相對較高之高黏著成分,基礎聚合物(較佳為丙烯酸系聚合物)成為黏著力相對較低之低黏著成分,另一方面,於第2黏著性組合物中,基礎聚合物(較佳為丙烯酸系聚合物)成為黏著力相對較高之高黏著成分,含有有機矽氧烷之成分(較佳為具有有機矽氧烷骨架之丙烯酸系聚合物)成為黏著力相對較低之低黏著成分。即,根據黏著劑層3由第1黏著性組合物或第2黏著性組合物之哪一者所形成,而決定黏著劑層3中之高黏著成分及低黏著成分。Furthermore, details will be described later, but in the first adhesive composition, the cured product of the photocuring agent (preferably a polyfunctional (meth)acrylate) becomes a high-adhesion component with relatively high adhesive strength, and the base polymer (preferably an acrylic polymer) becomes a low-adhesion component with relatively low adhesive strength. On the other hand, in the second adhesive composition, the base polymer (preferably an acrylic polymer) becomes a high-adhesion component with relatively high adhesive strength, and the component containing organosiloxane (preferably an acrylic polymer with an organosiloxane backbone) becomes a low-adhesion component with relatively low adhesive strength. That is, the high-adhesion component and the low-adhesion component in the adhesive layer 3 are determined according to whether the adhesive layer 3 is formed by the first adhesive composition or the second adhesive composition.

因此,以下分為由第1黏著性組合物形成黏著劑層3之情形、與由第2黏著性組合物形成黏著劑層3之情形進行說明。Therefore, the following explanation will be divided into the case where the adhesive layer 3 is formed by the first adhesive composition and the case where the adhesive layer 3 is formed by the second adhesive composition.

4-1.由第1黏著性組合物形成黏著劑層之積層體之製造方法 第一,參照圖3對由第1黏著性組合物形成黏著劑層3之積層體1之製造方法(製法1)進行說明。4-1. Method for manufacturing a laminate containing an adhesive layer formed by a first adhesive composition First, a method for manufacturing a laminate containing an adhesive layer 3 formed by a first adhesive composition (method 1) will be explained with reference to FIG3.

於第3步驟中,如圖3A所示,準備補強膜4。In step 3, as shown in Figure 3A, the reinforcing membrane 4 is prepared.

繼而,於第4步驟中,如圖3B所示,以配置於基材2之一面之黏著劑層3、與軟性被黏著體5接觸之方式將補強膜4貼合於軟性被黏著體5。Next, in step 4, as shown in Figure 3B, the reinforcing film 4 is bonded to the soft substrate 5 in such a way that the adhesive layer 3 disposed on one side of the substrate 2 is in contact with the soft substrate 5.

此時,於黏著劑層3與軟性被黏著體5之界面,光硬化劑(較佳為多官能(甲基)丙烯酸酯)偏集存在。At this time, at the interface between the adhesive layer 3 and the soft adherend 5, the photocuring agent (preferably a multifunctional (meth)acrylate) is segregated.

並且,此種光硬化劑阻礙黏著劑層3與軟性被黏著體5之黏著。Furthermore, this light-curing agent hinders the adhesion between the adhesive layer 3 and the soft adherend 5.

因此,可使黏著劑層3對軟性被黏著體5之黏著力變低。具體而言,黏著劑層3之黏著力例如為4 N/25 mm以下,較佳為1 N/25 mm以下。Therefore, the adhesive force of the adhesive layer 3 to the soft adherend 5 can be reduced. Specifically, the adhesive force of the adhesive layer 3 is, for example, 4 N/25 mm or less, preferably 1 N/25 mm or less.

若黏著劑層3之黏著力為上述上限以下,則於下述第5步驟中,可容易地去除補強膜4之一部分。If the adhesive force of the adhesive layer 3 is below the upper limit mentioned above, then a portion of the reinforcing film 4 can be easily removed in step 5 below.

再者,上述黏著力係藉由將補強膜4以25℃貼合於聚醯亞胺膜,並以剝離速度300 mm/分鐘進行180度剝離試驗而測定。Furthermore, the aforementioned adhesion was determined by bonding the reinforcing film 4 to the polyimide film at 25°C and performing a 180-degree peel test at a peeling speed of 300 mm/min.

繼而,於第5步驟中,去除補強膜4之一部分。Then, in step 5, a portion of the reinforcing membrane 4 is removed.

具體而言,僅去除將補強膜4沿面方向分割成3個部份中之中央部分之1個部位(以下設為去除部分9)。Specifically, only one part of the central portion of the three parts that divide the reinforcing membrane 4 along the surface direction is removed (hereinafter referred to as the removed portion 9).

於去除補強膜4之一部分時,首先,如圖3C所示,將去除部分9藉由例如CO2 雷射或YAG雷射等雷射光、例如湯姆森刀、畢諾克刀、旋轉刀、刮刀、刀片等刀具進行切斷,然後僅將去除部分9以去除部分9之端部為起點進行剝離。When removing a portion of the reinforcing film 4, firstly, as shown in Figure 3C, the portion to be removed 9 is cut off by laser light such as CO2 laser or YAG laser, or by a knife such as a Thomson knife, Binok knife, rotary knife, scraper, or blade. Then, the portion to be removed 9 is peeled off only from the end of the portion to be removed 9.

藉此,如圖3C所示,殘存第1補強膜部6及第2補強膜部7。Thus, as shown in Figure 3C, the first reinforcing membrane portion 6 and the second reinforcing membrane portion 7 remain.

繼而,於第6步驟中,使黏著劑層3之黏著力提高。Then, in step 6, the adhesive force of adhesive layer 3 is increased.

具體而言,對第1補強膜部之黏著劑層3及第2補強膜部7之黏著劑層3分別照射光。作為光,包含紫外線、電子束等活性能量線。Specifically, the adhesive layer 3 of the first reinforcing film portion and the adhesive layer 3 of the second reinforcing film portion 7 are respectively irradiated with light. The light includes active energy lines such as ultraviolet rays and electron beams.

藉此,於黏著劑層3與軟性被黏著體5之界面偏集存在之光硬化劑(較佳為多官能(甲基)丙烯酸酯)硬化,而該硬化物之黏著力變高。In this way, the photocuring agent (preferably a polyfunctional (meth)acrylate) that is segregated at the interface between the adhesive layer 3 and the soft adherend 5 is cured, and the adhesion of the cured material becomes higher.

即,於第1黏著性組合物中,光硬化劑(較佳為多官能(甲基)丙烯酸酯)之硬化物之黏著力提高,另一方面,基礎聚合物(較佳為丙烯酸系聚合物)之黏著力未提高。That is, in the first adhesive composition, the adhesive strength of the cured product of the photocuring agent (preferably a polyfunctional (meth)acrylate) is improved, while the adhesive strength of the base polymer (preferably an acrylic polymer) is not improved.

藉此,相對於基礎聚合物(較佳為丙烯酸系聚合物),光硬化劑(較佳為多官能(甲基)丙烯酸酯)之硬化物之黏著力相對變高,因此光硬化劑(較佳為多官能(甲基)丙烯酸酯)之硬化物成為高黏著成分,基礎聚合物(較佳為丙烯酸系聚合物)成為低黏著成分。Therefore, compared to the base polymer (preferably an acrylic polymer), the adhesive force of the cured product of the photocuring agent (preferably a polyfunctional (meth)acrylate) becomes relatively high. Thus, the cured product of the photocuring agent (preferably a polyfunctional (meth)acrylate) becomes a high-adhesion component, while the base polymer (preferably an acrylic polymer) becomes a low-adhesion component.

並且,作為高黏著成分之光硬化劑(較佳為多官能(甲基)丙烯酸酯)之硬化物於黏著劑層3與軟性被黏著體5之界面偏集存在。Furthermore, the cured material of the photocuring agent (preferably a multifunctional (meth)acrylate) which is a high-adhesion component exists in a segregated state at the interface between the adhesive layer 3 and the soft adherend 5.

具體而言,於下述TOF-SIMS(Time of Flight Secondary Ion Mass Spectrometry,飛行時間二次離子質譜儀)之測定中,以黏著劑層3及軟性被黏著體5之界面作為起點且以自該界面向黏著劑層3側而相當於黏著劑層3之厚度之5%的深度作為終點的區域中之高黏著成分之比率為低黏著成分之例如2倍以上、較佳為3倍以上。Specifically, in the TOF-SIMS (Time of Flight Secondary Ion Mass Spectrometry) measurements described below, the ratio of high-adhesion components in the region starting from the interface between the adhesive layer 3 and the soft adherend 5 and ending at a depth equivalent to 5% of the thickness of the adhesive layer 3 from that interface toward the adhesive layer 3 is, for example, more than twice, preferably more than three times, the ratio of low-adhesion components.

藉此,可將黏著劑層3與軟性被黏著體5牢固地接著。In this way, the adhesive layer 3 and the soft adherend 5 can be firmly bonded together.

具體而言,光照射後之黏著劑層3之黏著力例如為5 N/25 mm以上、較佳為8 N/25 mm以上、更佳為10 N/25 mm以上、進而較佳為12 N/25 mm以上。Specifically, the adhesive force of the adhesive layer 3 after light irradiation is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, more preferably 10 N/25 mm or more, and even more preferably 12 N/25 mm or more.

另一方面,光硬化劑(較佳為多官能(甲基)丙烯酸酯)之硬化物之一部分與基礎聚合物(較佳為丙烯酸系聚合物)相溶,自黏著劑層3與軟性被黏著體5之界面向黏著劑層3側擴散。如此,於在厚度方向上較黏著劑層3與軟性被黏著體5之界面更為黏著劑層3側,光硬化劑(較佳為多官能(甲基)丙烯酸酯)之硬化物(高黏著成分)及基礎聚合物(較佳為丙烯酸系聚合物)(低黏著成分)混合存在。On the other hand, a portion of the cured product of the photocuring agent (preferably a polyfunctional (meth)acrylate) is miscible with the base polymer (preferably an acrylic polymer) and diffuses from the interface between the adhesive layer 3 and the soft substrate 5 toward the adhesive layer 3. Thus, in the thickness direction, the cured product of the photocuring agent (preferably a polyfunctional (meth)acrylate) (high adhesive component) and the base polymer (preferably an acrylic polymer) (low adhesive component) are mixed and present on the adhesive layer 3 side, which is more prominent than the interface between the adhesive layer 3 and the soft substrate 5.

具體而言,於下述TOF-SIMS之測定中,將自黏著劑層3及軟性被黏著體5之界面向黏著劑層3側而相當於黏著劑層3之厚度之30%之深度作為起點且將相當於黏著劑層3之厚度之70%之深度作為終點的區域中之高黏著成分之比率為低黏著成分之例如0.8倍以上、較佳為1倍以上,又,例如為1.5倍以下。Specifically, in the TOF-SIMS measurement described below, the ratio of high-adhesion components in the region from the interface between the self-adhesive layer 3 and the soft adherend 5 toward the adhesive layer 3, at a depth equivalent to 30% of the thickness of the adhesive layer 3, and ending at a depth equivalent to 70% of the thickness of the adhesive layer 3, is, for example, at least 0.8 times, preferably at least 1 time, and, for example, at least 1.5 times, that of the low-adhesion components.

藉此,剪切蠕變特性提高。This improves shear creep properties.

基於以上,獲得積層體1。Based on the above, layer 1 is obtained.

4-2.由第2黏著性組合物形成黏著劑層之積層體之製造方法 第二,參照圖3對由第2黏著性組合物形成黏著劑層3之積層體1之製造方法(製法2)進行說明。4-2. Method for manufacturing a laminate containing an adhesive layer formed by a second adhesive composition Second, with reference to FIG3, a method (manufacturing method 2) for manufacturing a laminate containing an adhesive layer 3 formed by a second adhesive composition will be described.

如上所述,第2黏著性組合物包含基礎聚合物、及含有有機矽氧烷之成分。As described above, the second adhesive composition comprises a base polymer and an organosiloxane-containing component.

以下,對基礎聚合物為丙烯酸系聚合物,且含有有機矽氧烷之成分為具有有機矽氧烷骨架之丙烯酸系聚合物之情形進行詳細敍述。The following is a detailed description of the case where the base polymer is an acrylic polymer and the component containing organosiloxane is an acrylic polymer with an organosiloxane backbone.

於第2黏著性組合物中,相對於具有有機矽氧烷骨架之丙烯酸系聚合物,丙烯酸系聚合物之黏著力相對較高。即,於第2黏著性組合物中,丙烯酸系聚合物為高黏著成分,具有有機矽氧烷骨架之丙烯酸系聚合物為低黏著成分。In the second adhesive composition, the acrylic polymer exhibits relatively higher adhesive strength compared to the acrylic polymer with an organosilicon backbone. That is, in the second adhesive composition, the acrylic polymer is the high-adhesion component, while the acrylic polymer with an organosilicon backbone is the low-adhesion component.

於第3步驟中,如圖3A所示,準備補強膜4。In step 3, as shown in Figure 3A, the reinforcing membrane 4 is prepared.

繼而,於第4步驟中,如圖3B所示,以配置於基材2之一面之黏著劑層3、與軟性被黏著體5接觸之方式將補強膜4貼合於軟性被黏著體5。Next, in step 4, as shown in Figure 3B, the reinforcing film 4 is bonded to the soft substrate 5 in such a way that the adhesive layer 3 disposed on one side of the substrate 2 is in contact with the soft substrate 5.

此處,於黏著劑層3與軟性被黏著體5之界面,具有有機矽氧烷骨架之丙烯酸系聚合物偏集存在。Here, at the interface between the adhesive layer 3 and the soft adherend 5, there is an agglomeration of acrylic polymers with an organosilicon backbone.

並且,此種具有有機矽氧烷骨架之丙烯酸系聚合物阻礙黏著劑層3與軟性被黏著體5之黏著。Furthermore, this acrylic polymer barrier layer 3 with an organosilicon backbone hinders the adhesion between the adhesive layer 3 and the soft adherend 5.

因此,可使黏著劑層3對軟性被黏著體5之黏著力變低。具體而言,黏著劑層3之黏著力例如為4 N/25 mm以下、較佳為1 N/25 mm以下。Therefore, the adhesive force of the adhesive layer 3 to the soft adherend 5 can be reduced. Specifically, the adhesive force of the adhesive layer 3 is, for example, 4 N/25 mm or less, preferably 1 N/25 mm or less.

若黏著劑層3之黏著力為上述上限以下,則於下述第5步驟中,可容易地去除補強膜4之一部分。If the adhesive force of the adhesive layer 3 is below the upper limit mentioned above, then a portion of the reinforcing film 4 can be easily removed in step 5 below.

繼而,於第5步驟中,如上所述,去除補強膜4之一部分。Then, in step 5, as described above, a portion of the reinforcing membrane 4 is removed.

藉此,如圖3C所示,殘存第1補強膜部6及第2補強膜部7。Thus, as shown in Figure 3C, the first reinforcing membrane portion 6 and the second reinforcing membrane portion 7 remain.

繼而,於第6步驟中,使黏著劑層3之黏著力提高。Then, in step 6, the adhesive force of adhesive layer 3 is increased.

具體而言,對第1補強膜部之黏著劑層3及第2補強膜部7之黏著劑層3分別進行加熱。Specifically, the adhesive layer 3 of the first reinforcing film portion and the adhesive layer 3 of the second reinforcing film portion 7 are heated respectively.

作為加熱條件,加熱溫度例如為40℃以上、較佳為50℃以上、更佳為60℃以上,又,例如未達150℃、較佳為120℃以下、更佳為100℃以下、進而較佳為80℃以下,又,加熱時間並無特別限定,例如為1小時以下、較佳為30分鐘以下、更佳為10分鐘以下、進而較佳為5分鐘以下,又,例如為1分鐘以上。又,亦可於補強膜4或被黏著體5不產生明顯之熱劣化之限度內實施更長時間之(例如為2小時以上,較佳為5小時以上)加熱。再者,上述加熱亦可實施複數次。As for heating conditions, the heating temperature is, for example, above 40°C, preferably above 50°C, more preferably above 60°C, and also, for example, below 150°C, preferably below 120°C, more preferably below 100°C, and even more preferably below 80°C. The heating time is not particularly limited, for example, less than 1 hour, preferably less than 30 minutes, more preferably less than 10 minutes, and even more preferably less than 5 minutes, and also, for example, more than 1 minute. Furthermore, heating for a longer period (for example, more than 2 hours, preferably more than 5 hours) can be performed within the limit that the reinforcing film 4 or the adhered body 5 does not produce significant thermal degradation. Moreover, the above heating can be performed multiple times.

藉此,於黏著劑層3與軟性被黏著體5之界面偏集存在之具有有機矽氧烷骨架之丙烯酸系聚合物、與丙烯酸系聚合物之相溶性提高,具有有機矽氧烷骨架之丙烯酸系聚合物被自黏著劑層3與軟性被黏著體5之界面向黏著劑層3側擴散。In this way, the compatibility between the acrylic polymer with an organosiloxane backbone, which is segregated at the interface between the adhesive layer 3 and the soft adherend 5, and the acrylic polymer with an organosiloxane backbone, is improved, and the acrylic polymer with an organosiloxane backbone is diffused to the adhesive layer 3 from the interface between the self-adhesive layer 3 and the soft adherend 5.

如此,於黏著劑層3與軟性被黏著體5之界面,丙烯酸系聚合物偏集存在之比率相對變多(換言之,作為高黏著成分之丙烯酸系聚合物於黏著劑層3與軟性被黏著體5之界面偏集存在)。Thus, at the interface between the adhesive layer 3 and the soft adherend 5, the proportion of acrylic polymers that are clustered together is relatively higher (in other words, the acrylic polymers, as high adhesive components, are clustered together at the interface between the adhesive layer 3 and the soft adherend 5).

具體而言,於下述TOF-SIMS之測定中,將黏著劑層3及軟性被黏著體5之界面作為起點且將自該界面向黏著劑層3側而相當於黏著劑層3之厚度之5%之深度作為終點的區域中之高黏著成分之比率為低黏著成分之例如2倍以上、較佳為3倍以上。Specifically, in the TOF-SIMS measurement described below, the ratio of high-adhesion components in the region where the interface between the adhesive layer 3 and the soft adherend 5 is taken as the starting point and the depth from the interface towards the adhesive layer 3, which is equivalent to 5% of the thickness of the adhesive layer 3, is taken as the ending point, is, for example, more than twice, and preferably more than three times, the ratio of low-adhesion components.

藉此,可將黏著劑層3與軟性被黏著體5牢固地接著。In this way, the adhesive layer 3 and the soft adherend 5 can be firmly bonded together.

具體而言,加熱後之黏著劑層3之黏著力例如為5 N/25 mm以上、較佳為8 N/25 mm以上、更佳為10 N/25 mm以上、進而較佳為12 N/25 mm以上。Specifically, the adhesive force of the adhesive layer 3 after heating is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, more preferably 10 N/25 mm or more, and even more preferably 12 N/25 mm or more.

另一方面,若使具有有機矽氧烷骨架之丙烯酸系聚合物自黏著劑層3與軟性被黏著體5之界面向黏著劑層3側擴散,則於在厚度方向上較黏著劑層3與軟性被黏著體5之界面更為黏著劑層3側,丙烯酸系聚合物(高黏著成分)及具有有機矽氧烷骨架之丙烯酸系聚合物(低黏著成分)混合存在。On the other hand, if the interface between the acrylic polymer self-adhesive layer 3 with an organosilicon backbone and the soft substrate 5 is diffused towards the adhesive layer 3, then in the thickness direction, the interface between the adhesive layer 3 and the soft substrate 5 is more on the adhesive layer 3 side, and the acrylic polymer (high adhesion component) and the acrylic polymer with an organosilicon backbone (low adhesion component) coexist in a mixture.

具體而言,於下述TOF-SIMS之測定中,將自黏著劑層3及軟性被黏著體5之界面向黏著劑層3側而相當於黏著劑層3之厚度之30%之深度作為起點且將相當於黏著劑層3之厚度之70%之深度作為終點的區域中之高黏著成分之比率為低黏著成分之例如0.8倍以上、較佳為1倍以上,又,例如為1.5倍以下。Specifically, in the TOF-SIMS measurement described below, the ratio of high-adhesion components in the region from the interface between the self-adhesive layer 3 and the soft adherend 5 toward the adhesive layer 3, at a depth equivalent to 30% of the thickness of the adhesive layer 3, and ending at a depth equivalent to 70% of the thickness of the adhesive layer 3, is, for example, at least 0.8 times, preferably at least 1 time, and, for example, at least 1.5 times, that of the low-adhesion components.

藉此,剪切蠕變特性提高。This improves shear creep properties.

基於以上,獲得積層體1。Based on the above, layer 1 is obtained.

7.積層體之作用效果 於該積層體1中,在軟性被黏著體5之面方向上以彼此空開間隔之方式配置有第1補強膜部6及第2補強膜部7。7. Effects of the laminate 1 In the laminate 1, a first reinforcing film 6 and a second reinforcing film 7 are arranged in a way that they are spaced apart from each other in the direction of the surface of the soft adhered body 5.

因此,如圖4所示,可以第1補強膜部6及第2補強膜部7彼此朝向外側之方式,於第1補強膜部6及第2補強膜部7之間使積層體1彎曲。又,可以第1補強膜部6及第2補強膜部7彼此朝向內側之方式,於第1補強膜部6及第2補強膜部7之間使積層體1彎曲。Therefore, as shown in Figure 4, the laminate 1 can be bent between the first reinforcing film 6 and the second reinforcing film 7 such that the first reinforcing film 6 and the second reinforcing film 7 face outwards from each other. Alternatively, the laminate 1 can be bent between the first reinforcing film 6 and the second reinforcing film 7 such that the first reinforcing film 6 and the second reinforcing film 7 face inwards from each other.

又,於第1補強膜部6之黏著劑層3、及第2補強膜部7之黏著劑層3之各者中,在厚度方向上,高黏著成分於軟性被黏著體5及黏著劑層3之界面偏集存在。Furthermore, in both the adhesive layer 3 of the first reinforcing film portion 6 and the adhesive layer 3 of the second reinforcing film portion 7, in the thickness direction, the highly adhesive component is concentrated at the interface between the soft adherend 5 and the adhesive layer 3.

因此,於該積層體1中,黏著劑層3與軟性被黏著體5被牢固地接著,尤其是即便以第1補強膜部6及第2補強膜部7彼此朝向外側之方式使積層體1彎曲,亦可抑制因自補強膜4朝向黏著劑層3之中央部分之剪力而剝離,又,即便以第1補強膜部6及第2補強膜部7彼此朝向內側之方式使積層體1彎曲,亦可抑制因自黏著劑層3之中央部分朝向補強膜4之剪力而剝離。Therefore, in the laminate 1, the adhesive layer 3 and the soft adherend 5 are firmly bonded. In particular, even when the laminate 1 is bent with the first reinforcing film 6 and the second reinforcing film 7 facing outwards from each other, it can suppress peeling due to shear force from the reinforcing film 4 toward the central portion of the adhesive layer 3. Furthermore, even when the laminate 1 is bent with the first reinforcing film 6 and the second reinforcing film 7 facing inwards from each other, it can suppress peeling due to shear force from the central portion of the adhesive layer 3 toward the reinforcing film 4.

又,於該積層體1中,於在厚度方向上較黏著劑層3與軟性被黏著體5之界面更為黏著劑層3側,高黏著成分及低黏著成分混合存在。Furthermore, in the laminate 1, on the side of the adhesive layer 3 that is closer to the interface between the adhesive layer 3 and the soft adherend 5 in the thickness direction, high-adhesion components and low-adhesion components coexist in a mixture.

因此,即便如上所述般使積層體1,因彎曲產生之應力亦得到分散,而可抑制積層體1破損。Therefore, even if the laminate 1 is subjected to bending stress as described above, the stress generated by bending is dispersed, and damage to the laminate 1 can be suppressed.

即,該積層體1之剪切蠕變特性優異。That is, the laminate 1 has excellent shear creep characteristics.

8.變化例 於上述由第2黏著性組合物形成黏著劑層之積層體之製造方法中,將具有有機矽氧烷骨架之丙烯酸系聚合物作為低黏著成分進行了例示,但並不限於此,例如存在如下情況:藉由第6步驟中之加熱,具有有機矽氧烷骨架之丙烯酸系聚合物中作為側鏈之有機矽氧烷骨架自黏著劑層3與軟性被黏著體5之界面向黏著劑層3側進行分子移動,另一方面,主鏈(丙烯酸骨架)於黏著劑層3與軟性被黏著體5之界面持續偏集存在。8. Variation Example In the above method for manufacturing a laminate in which an adhesive layer is formed from the second adhesive composition, an acrylic polymer having an organosiloxane backbone was used as a low-adhesion component, but it is not limited to this. For example, there may be a case where, by heating in step 6, the organosiloxane backbone, which serves as a side chain in the acrylic polymer having an organosiloxane backbone, moves molecularly from the interface between the adhesive layer 3 and the soft adherend 5 toward the adhesive layer 3. On the other hand, the main chain (acrylic backbone) continues to be segregated at the interface between the adhesive layer 3 and the soft adherend 5.

於此種情形時,具有有機矽氧烷骨架之丙烯酸系聚合物之側鏈成為低黏著成分,具有有機矽氧烷骨架之丙烯酸系聚合物之主鏈成為高黏著成分。In this case, the side chains of acrylic polymers with organosilicon backbones become low-adhesion components, while the backbones of acrylic polymers with organosilicon backbones become high-adhesion components.

[實施例] 以下,示出實施例及比較例而進而具體地說明本發明。再者,本發明不受實施例及比較例任何限定。又,以下記載中所使用之調配比率(含有比率)、物性值、參數等具體數值可代替為上述「實施方式」中所記載之與其等對應之調配比率(含有比率)、物性值、參數等該記載之上限值(定義為「以下」、「未達」之數值)或下限值(定義為「以上」、「超過」之數值)。[Examples] The present invention will be further explained in detail below by showing examples and comparative examples. Furthermore, the present invention is not limited by any of the examples and comparative examples. Also, the specific numerical values such as blending ratios (including ratios), physical property values, and parameters used in the following description can be replaced by the corresponding upper limit values (defined as "below" or "not reaching") or lower limit values (defined as "above" or "exceeding") of the blending ratios (including ratios), physical property values, and parameters described in the above-mentioned "Examples".

再者,「份」及「%」只要未特別提及,便為質量基準。Furthermore, unless otherwise specified, "parts" and "%" are considered quality standards.

1.成分之詳細 將各實施例及各比較例中所使用之各成分記載於以下。 Takenate D110N:苯二甲基二異氰酸酯之三羥甲基丙烷加成物之75%乙酸乙酯溶液,三井化學製造 APG700:聚丙二醇#700(n=12)二丙烯酸酯;官能基當量404 g/eq Irgacure 184:1-羥基環己基苯基酮,巴斯夫製造1. Detailed List of Ingredients The ingredients used in each embodiment and comparative example are described below. Takenate D110N: 75% ethyl acetate solution of the trihydroxymethylpropane adduct of phenyl diisocyanate, Mitsui Chemicals, Ltd. APG700: Polypropylene glycol #700 (n=12) diacrylate; functional group equivalent 404 g/eq Irgacure 184: 1-Hydroxycyclohexylphenyl ketone, BASF, Ltd.

2.聚合物之製備 合成例12. Preparation of Polymers Synthesis Example 1

向具備溫度計、攪拌機、回流冷卻管及氮氣導入管之反應容器中投入作為單體之甲基丙烯酸甲酯(MMA)9重量份、丙烯酸2-乙基己酯(2EHA)63重量份、丙烯酸羥基乙酯(HEA)13重量份、N-乙烯基吡咯啶酮(NVP)15重量份、作為聚合起始劑之偶氮二異丁腈0.2重量份、以及作為溶劑之乙酸乙酯233重量份,流入氮氣,一面攪拌一面進行約1小時之氮氣置換。然後,加熱至60℃,使反應7小時而獲得重量平均分子量(Mw)為1200000之丙烯酸系聚合物之溶液。A reaction vessel equipped with a thermometer, a stirrer, a reflux condenser, and a nitrogen inlet pipe was added to a mixture of 9 parts by weight of methyl methacrylate (MMA) as monomers, 63 parts by weight of 2-ethylhexyl acrylate (2EHA), 13 parts by weight of hydroxyethyl acrylate (HEA), 15 parts by weight of N-vinylpyrrolidone (NVP), 0.2 parts by weight of azobisisobutyronitrile (azobisisobutyronitrile) as a polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent. Nitrogen gas was introduced, and the mixture was stirred while undergoing nitrogen replacement for approximately 1 hour. The mixture was then heated to 60°C and reacted for 7 hours to obtain a solution of an acrylic polymer with a weight average molecular weight (Mw) of 1,200,000.

3.黏著性組合物之製備 製備例1(第1黏著性組合物之製備)3. Preparation of Adhesive Components Preparation Example 1 (Preparation of the First Adhesive Component)

向合成例1之丙烯酸系聚合物溶液中添加Takenate D110N(苯二甲基二異氰酸酯之三羥甲基丙烷加成物之75%乙酸乙酯溶液,三井化學製造)作為交聯劑且相對於聚合物之固形物成分100重量份為2.5質量份,添加APG700(聚丙二醇#700(n=12)二丙烯酸酯)作為光硬化劑且相對於聚合物之固形物成分100重量份為20質量份,添加Irgacure 184(1-羥基環己基苯基酮,巴斯夫公司製造)作為光聚合起始劑且相對於聚合物之固形物成分100重量份為0.1質量份,均勻地混合而製備第1黏著性組合物。Takenate D110N (75% ethyl acetate solution of trihydroxymethylpropane adduct of diphenyl diisocyanate, manufactured by Mitsui Chemicals) was added as a crosslinking agent to the acrylic polymer solution of Synthesis Example 1, with an amount of 2.5 parts by weight relative to 100 parts by weight of the polymer solids. APG700 (polypropylene glycol #700 (n=12) diacrylate) was added as a photocuring agent, with an amount of 20 parts by weight relative to 100 parts by weight of the polymer solids. Irgacure 184 (1-hydroxycyclohexylphenyl ketone, manufactured by BASF) was added as a photopolymerization initiator, with an amount of 0.1 parts by weight relative to 100 parts by weight of the polymer solids. The mixture was then homogeneously mixed to prepare the first adhesive composition.

4.補強膜之製造 製造例14. Manufacturing of Reinforcing Membrane Manufacturing Example 1

將未經表面處理之厚度75 μm之聚對苯二甲酸乙二酯膜(東麗製造之「Lumirror S10」)作為基材,於該基材上將製備例1之光硬化性組合物以乾燥後之厚度成為25 μm之方式藉由槽輥進行塗佈。以130℃乾燥1分鐘而去除溶劑。藉此,於基材之一面形成黏著劑層。進而,於黏著劑層之一面貼合剝離膜(表面經矽酮脫模處理之厚度25 μm之聚對苯二甲酸乙二酯膜)之脫模處理面。然後,於25℃氛圍下進行4天老化處理,使聚合物與交聯劑之交聯反應進行。藉此製造補強膜。A 75 μm thick polyethylene terephthalate film (Toray's "Lumirror S10") without surface treatment was used as a substrate. The photocurable composition of Preparation Example 1 was coated onto this substrate to a dry thickness of 25 μm using a roller. The solvent was removed by drying at 130°C for 1 minute. This formed an adhesive layer on one side of the substrate. Then, the release film (a 25 μm thick polyethylene terephthalate film with a silicone release treatment) was laminated onto the release surface of the adhesive layer. Finally, an aging treatment was performed at 25°C for 4 days to allow the crosslinking reaction between the polymer and the crosslinking agent to proceed. This produced a reinforcing film.

5.積層體之製造 實施例15. Manufacturing of Laminated Materials Example 1

將剝離膜自製造例1之補強膜剝離後,將該補強膜貼附於厚度12.5 μm之聚醯亞胺膜(東麗杜邦製造之「Kapton 50EN」)。After the release membrane is peeled off from the reinforcing membrane of Manufacturing Example 1, the reinforcing membrane is attached to a 12.5 μm thick polyimide membrane ("Kapton 50EN" manufactured by Toray DuPont).

繼而,使用雷射光將補強膜沿面方向分割成3個部份,將中央部分之1個部位剝離。Next, laser light is used to divide the reinforcing film into three parts along the surface direction, and one part of the central part is peeled off.

藉此,使將補強膜沿面方向分割成3個部份中之兩端部分之2個部位(即,第1補強膜部及第2補強膜部)殘存。In this way, two parts (i.e., the first reinforcing membrane part and the second reinforcing membrane part) of the two ends of the three parts that are divided along the surface direction of the reinforcing membrane are retained.

然後,對第1補強膜部中之黏著劑層、及第2補強膜部中之黏著劑層照射光而使黏著劑層之黏著力提高。Then, light is irradiated onto the adhesive layer in the first reinforcing film and the adhesive layer in the second reinforcing film to increase the adhesive force of the adhesive layer.

藉此製造積層體。This is used to create laminates.

6.評價 (黏著劑層中之高黏著成分及低黏著成分之分佈)(TOF-SIMS測定)6. Evaluation (Distribution of high-adhesion and low-adhesion components in the adhesive layer) (TOF-SIMS determination)

對於實施例1之積層體,使用搭載有ULVAC-PHI製造之Ar-GCIB(Ar Gas Cluster Ion Beam,氣體團簇離子束)槍之TOF-SIMS(Time-of-Flight Secondary Ion Mass Spectrometry,TRIFT V nano TOF)測定黏著劑層中之高黏著成分及低黏著成分之分佈。作為一次離子源,使用Bi3 ++ (30 kV)。於帶電中和中併用25 eV電子槍。於深度方向解析中使用Ar-GCIB(Ar2500+ ,20 kV)。For the laminate of Example 1, the distribution of high-adhesion and low-adhesion components in the adhesive layer was determined using TOF-SIMS (Time-of-Flight Secondary Ion Mass Spectrometry, TRIFT V nano TOF) with an Ar-GCIB (Ar Gas Cluster Ion Beam) gun manufactured by ULVAC-PHI. Bi³⁺ ( 30 kV) was used as the primary ion source. A 25 eV electron gun was used during charge neutralization. Ar-GCIB (Ar2500 + , 20 kV) was used for depth-direction resolution.

將其結果示於表1。The results are shown in Table 1.

7.探討 如表1所示,於距離黏著劑層之穿透深度0 nm處,光硬化劑之硬化物之峰值強度(a.u.)為0.13。由此可知,光硬化劑之硬化物(高黏著成分)於聚醯亞胺膜及黏著劑層之界面偏集存在。7. Discussion As shown in Table 1, at a penetration depth of 0 nm from the adhesive layer, the peak intensity (a.u.) of the cured material of the photocuring agent is 0.13. This indicates that the cured material (high-adhesion component) of the photocuring agent is segregated at the interface between the polyimide film and the adhesive layer.

又,於距離黏著劑層之穿透深度500 nm處,光硬化劑之硬化物之峰值強度(a.u.)及丙烯酸系聚合物之峰值強度(a.u.)均為0.025。Furthermore, at a penetration depth of 500 nm from the adhesive layer, the peak strength (a.u.) of both the cured material of the photocuring agent and the acrylic polymer is 0.025.

由此可知,於較聚醯亞胺膜及黏著劑層之界面更為黏著劑層側,光硬化劑之硬化物(高黏著成分)及丙烯酸系聚合物(低黏著成分)混合存在。Therefore, it can be seen that at the interface between the polyimide film and the adhesive layer, on the adhesive layer side, the cured product of the light-curing agent (high adhesive component) and the acrylic polymer (low adhesive component) are mixed together.

[表1] 實施例No. 光硬化劑之硬化物 丙烯酸系聚合物 穿透深度(nm) 峰值強度(a.u.) 穿透深度(nm) 峰值強度(a.u.) 實施例1 0 0.13 0 0.02 500 0.025 500 0.025 1200 0.034 1200 0.023 [Table 1] Implementation Example No. Hardened material of light hardener acrylic polymers Penetration depth (nm) Peak intensity (au) Penetration depth (nm) Peak intensity (au) Implementation Example 1 0 0.13 0 0.02 500 0.025 500 0.025 1200 0.034 1200 0.023

再者,上述發明係作為本發明之例示之實施形態而提供,但其僅為單純之示例,不應限定地進行解釋。該技術領域之從業者所知之本發明之變化例包含於下述發明申請專利範圍中。 [產業上之可利用性]Furthermore, the above-described invention is provided as an illustrative embodiment of the present invention, but it is merely an example and should not be interpreted restrictively. Variations of the present invention known to those skilled in the art are included within the scope of the following invention claim. [Industrial Applicability]

本發明之積層體及補強膜適宜地使用於光學器件、電子器件及其構成零件。The laminate and reinforcing film of this invention are suitable for use in optical devices, electronic devices and their constituent parts.

1:積層體 2:基材 3:黏著劑層 4:補強膜 5:軟性被黏著體 6:第1補強膜部 7:第2補強膜部 9:去除部分1: Laminate 2: Substrate 3: Adhesive layer 4: Reinforcing film 5: Flexible adherend 6: First reinforcing film portion 7: Second reinforcing film portion 9: Removed portion

圖1表示本發明之積層體之一實施形態之概略圖。 圖2係表示補強膜之製造方法之一實施形態之概略圖,且圖2A表示準備基材之第1步驟,圖2B表示於基材之一面積層黏著劑層之第2步驟,圖2C表示於黏著劑層之一面積層剝離膜之步驟。 圖3係表示積層體之製造方法之一實施形態之概略圖,且圖3A表示準備補強膜之第3步驟,圖3B表示於補強膜之一面配置軟性被黏著體之第4步驟,圖3C表示藉由將補強膜之一部分去除而形成第1補強膜部及第2補強膜部之第5步驟,圖3D表示使黏著劑層之黏著力提高之第6步驟。 圖4表示以第1補強膜部及第2補強膜部彼此朝向外側之方式於第1補強膜部及第2補強膜部之間使之彎曲而成之積層體。Figure 1 is a schematic diagram of one embodiment of the laminate of the present invention. Figure 2 is a schematic diagram of one embodiment of the manufacturing method of the reinforcing film, where Figure 2A shows the first step of preparing the substrate, Figure 2B shows the second step of applying an adhesive layer to an area of the substrate, and Figure 2C shows the step of peeling the film off an area of the adhesive layer. Figure 3 is a schematic diagram illustrating one embodiment of the manufacturing method of the laminate. Figure 3A shows the third step of preparing the reinforcing film, Figure 3B shows the fourth step of placing the soft adherend on one side of the reinforcing film, Figure 3C shows the fifth step of forming the first and second reinforcing film portions by removing a portion of the reinforcing film, and Figure 3D shows the sixth step of improving the adhesive force of the adhesive layer. Figure 4 shows a laminate formed by bending the first and second reinforcing film portions between them, with the first and second reinforcing film portions facing outwards from each other.

1:積層體 1: Laminated body

2:基材 2: Substrate

3:黏著劑層 3: Adhesive layer

5:軟性被黏著體 5: Soft adherents

6:第1補強膜部 6: The first reinforced membrane part

7:第2補強膜部 7: The second reinforcing membrane part

Claims (5)

一種積層體,其特徵在於:其係具備補強膜、及配置於上述補強膜之一面之軟性被黏著體者,且上述補強膜具備基材及配置於上述基材之一面且包含高黏著成分及低黏著成分之黏著劑層,上述補強膜於上述軟性被黏著體之面方向上具備彼此空開間隔而配置之第1補強膜部及第2補強膜部,上述第1補強膜部及上述第2補強膜部於上述補強膜之表面,於與上述補強膜之延伸方向正交之方向,彼此空開間隔而配置,於上述第1補強膜部之黏著劑層及上述第2補強膜部之黏著劑層之各者中,在厚度方向上,上述高黏著成分於上述軟性被黏著體及上述黏著劑層之界面偏集存在,可於上述第1補強膜部及上述第2補強膜部之間使上述積層體彎曲,TOF-SIMS之測定中,以上述黏著劑層及上述軟性被黏著體之界面作為起點且以自該界面向上述黏著劑層側而相當於上述黏著劑層之厚度之5%的深度作為終點的區域中之上述高黏著成分之比率為上述低黏著成分之2倍以上。A laminate characterized in that it comprises a reinforcing film and a soft adherend disposed on one side of the reinforcing film, wherein the reinforcing film comprises a substrate and an adhesive layer disposed on one side of the substrate and comprising a high-adhesion component and a low-adhesion component; the reinforcing film has a first reinforcing film portion and a second reinforcing film portion disposed spaced apart from each other in the direction of the surface of the soft adherend; the first reinforcing film portion and the second reinforcing film portion are disposed spaced apart from each other on the surface of the reinforcing film in a direction orthogonal to the extension direction of the reinforcing film; and the first reinforcing film portion is disposed spaced apart from each other in the direction of the first reinforcing film portion. In both the adhesive layer and the adhesive layer of the second reinforcing film, in the thickness direction, the high-adhesion component is concentrated at the interface between the soft substrate and the adhesive layer, which can cause the laminate to bend between the first and second reinforcing films. In the TOF-SIMS measurement, the ratio of the high-adhesion component in the region starting from the interface between the adhesive layer and the soft substrate and ending at a depth equivalent to 5% of the thickness of the adhesive layer from that interface toward the adhesive layer is more than twice that of the low-adhesion component. 如請求項1之積層體,其中於上述第1補強膜部之黏著劑層及上述第2補強膜部之黏著劑層之各者中,於在厚度方向上較上述界面更為上述黏著劑層側,上述高黏著成分及上述低黏著成分混合存在,於TOF-SIMS之測定中,自上述黏著劑層及上述軟性被黏著體之界面向上述黏著劑層側,以相當於上述黏著劑層之厚度之30%的深度作為起點,以相當於上述黏著劑層之厚度之70%的深度作為終點的區域中之上述高黏著成分之比率為上述低黏著成分之0.8倍以上1.5倍以下。As in claim 1, in each of the adhesive layers of the first reinforcing film and the second reinforcing film, on the adhesive layer side further from the interface than the interface, the high-adhesion component and the low-adhesion component are mixed. In TOF-SIMS measurement, from the interface between the adhesive layer and the soft adherend towards the adhesive layer side, with a depth equivalent to 30% of the thickness of the adhesive layer as the starting point and a depth equivalent to 70% of the thickness of the adhesive layer as the ending point, the ratio of the high-adhesion component in the region is 0.8 times to 1.5 times that of the low-adhesion component. 如請求項1或2之積層體,其中上述高黏著成分為多官能(甲基)丙烯酸酯之硬化物,上述低黏著成分為丙烯酸系聚合物。For example, in the laminate of claim 1 or 2, the high-adhesion component is a cured polyfunctional (meth)acrylate, and the low-adhesion component is an acrylic polymer. 如請求項1或2之積層體,其中上述高黏著成分為丙烯酸系聚合物,上述低黏著成分為含有有機矽氧烷之成分。For example, in the laminate of claim 1 or 2, the high-adhesion component is an acrylic polymer and the low-adhesion component is a component containing organosiloxanes. 一種積層體,其特徵在於:其係具備補強膜、及配置於上述補強膜之一面之軟性被黏著體者,且上述補強膜具備基材及配置於上述基材之一面且包含高黏著成分及低黏著成分之黏著劑層,上述補強膜於上述軟性被黏著體之面方向上具備彼此空開間隔而配置之第1補強膜部及第2補強膜部,上述第1補強膜部及上述第2補強膜部於上述補強膜之表面,於與上述補強膜之延伸方向正交之方向,彼此空開間隔而配置,上述黏著劑層之黏著力為5 N/25 mm以上,上述黏著劑層之厚度為5 μm以上,可於上述第1補強膜部及上述第2補強膜部之間使上述積層體彎曲。A laminate characterized in that it comprises a reinforcing film and a soft adherend disposed on one side of the reinforcing film, wherein the reinforcing film comprises a substrate and an adhesive layer disposed on one side of the substrate and comprising a high-adhesion component and a low-adhesion component; the reinforcing film has a first reinforcing film portion and a second reinforcing film portion disposed spaced apart from each other in the direction of the surface of the soft adherend; the first reinforcing film portion and the second reinforcing film portion are disposed spaced apart from each other on the surface of the reinforcing film in a direction orthogonal to the extension direction of the reinforcing film; the adhesive force of the adhesive layer is 5 N/25 mm or more; and the thickness of the adhesive layer is 5 mm. For thicknesses of μm or greater, the laminate can be bent between the first reinforcing film portion and the second reinforcing film portion.
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