TWI906900B - Liquid cooling device - Google Patents

Abstract

A liquid cooling device includes a first cold plate, a second cold plate and a cover. The second cold plate is stacked on the first cold plate. The cover is disposed on a side of the first cold plate and the second cold plate. The side of the first cold plate, the side of the second cold plate and the cover together form a connecting channel. The connecting channel is in fluid communication with the first cold plate and the second cold plate, and extends from an end of the first cold plate, the second cold plate and the cover to the other end of the first cold plate, the second cold plate and the cover.

Description

Liquid cooling device

The present invention relates to a liquid cooling device, and more particularly to a liquid cooling device having two water cooling plates and a connecting channel.

Electronic devices generate a significant amount of heat during operation. If this heat cannot be effectively dissipated, internal electronic components can overheat, leading to malfunctions or crashes. Therefore, electronic devices are typically equipped with appropriate heat dissipation systems to ensure that components operate within their preset temperature range. Especially for high-performance electronic devices, liquid cooling systems, such as water-cooled plates, are often used to provide better heat dissipation.

One common liquid-cooled heat dissipation system sandwiches a condenser between two water-cooled plates for more even heat distribution. Typically, the two plates are connected by a connecting pipe. However, the size of this connecting pipe is usually smaller than the size of the water-cooled plates, increasing coolant flow resistance and reducing heat dissipation efficiency. Conversely, reducing coolant flow resistance by decreasing the condenser size and increasing the connecting pipe size results in an insufficient heat exchange area due to the condenser's small size, further reducing heat dissipation efficiency. Therefore, maintaining the heat dissipation efficiency of a liquid-cooled heat dissipation system without reducing heat exchange area and lowering coolant flow resistance is one of the problems that researchers need to solve.

The present invention provides a liquid cooling device that maintains the heat dissipation efficiency of a liquid cooling system without reducing the heat exchange area and reducing the flow resistance of the coolant.

An embodiment of the present invention discloses a liquid cooling device comprising a first water-cooled plate, a second water-cooled plate, and a side cover. The second water-cooled plate is stacked on top of the first water-cooled plate. The side cover is disposed on one side of the first water-cooled plate and the second water-cooled plate. The one side of the first water-cooled plate, the one side of the second water-cooled plate, and the side cover together form a connecting channel. The connecting channel connects the first water-cooled plate and the second water-cooled plate, and extends from one end of the first water-cooled plate, the second water-cooled plate, and the side cover to the other end of the first water-cooled plate, the second water-cooled plate, and the side cover.

According to the liquid cooling device of the above embodiment, since the connecting channel extends from one end of the first water-cooled plate, the second water-cooled plate, and the side cover to the other end of the first water-cooled plate, the second water-cooled plate, and the side cover, the connecting channel has a large width. Therefore, there is no need to reduce the size of the condenser, the first internal fin, the second internal fin, the third internal fin, or the fourth internal fin, and the heat exchange area is not reduced. In this way, the heat dissipation efficiency of the liquid cooling device can be improved.

The above description of the contents of this invention and the following description of the embodiments are used to demonstrate and explain the principles of this invention, and to provide a further explanation of the scope of the patent application of this invention.

Please refer to Figures 1 through 6. Figure 1 is a perspective view of the liquid cooling device according to an embodiment of the present invention. Figure 2 is a perspective view of the liquid cooling device of Figure 1 from another angle. Figure 3 is a cross-sectional view of the first water-cooling plate of the liquid cooling device of Figure 1. Figure 4 is a cross-sectional view of the liquid cooling device along section line 4-4 of Figure 3. Figure 5 is a cross-sectional view of the liquid cooling device along section line 5-5 of Figure 3. Figure 6 is a cross-sectional view of the second water-cooling plate of the liquid cooling device of Figure 1.

The liquid cooling device 100 of this embodiment is installed on a server (not shown) and includes a first water-cooled plate 101, a second water-cooled plate 102, a side cover 103, a condenser 104, multiple thermosiphon pipes 105, two evaporators 106, a liquid inlet pipe 107, and a liquid outlet pipe 108. The first water-cooled plate 101 and the second water-cooled plate 102 are used to contain a first coolant (not shown). The second water-cooled plate 102 is stacked on the first water-cooled plate 101. The first water-cooled plate 101 has a first side 1013 and a second side 1014 opposite to each other. The second water-cooled plate 102 has a third side 1023 and a fourth side 1024 opposite to each other. Side cover 103 is disposed on the first side 1013 of the first water-cooled plate 101 and the third side 1023 of the second water-cooled plate 102.

The first side 1013 of the first water-cooled plate 101, the third side 1023 of the second water-cooled plate 102, and the side cover 103 together form a connecting channel C1. The first side 1013 of the first water-cooled plate 101 has a first connecting port 1011. That is, the first connecting port 1011 is located on the side of the first water-cooled plate 101 near the connecting channel C1. The third side 1023 of the second water-cooled plate 102 has a second connecting port 1021. That is, the second connecting port 1021 is located on the side of the second water-cooled plate 102 near the connecting channel C1. The connecting channel C1 connects the first water-cooled plate 101 and the second water-cooled plate 102 through the first connecting port 1011 and the second connecting port 1021.

The second side 1014 of the first water-cooled plate 101 has a liquid inlet 1012. That is, the liquid inlet 1012 and the connecting channel C1 are respectively located on opposite sides of the first water-cooled plate 101. The liquid inlet pipe 107 is disposed at the liquid inlet 1012 and is used to allow the first coolant to flow in. The fourth side 1024 of the second water-cooled plate 102 has a liquid outlet 1022. That is, the liquid outlet 1022 and the connecting channel C1 are respectively located on opposite sides of the second water-cooled plate 102. The liquid outlet pipe 108 is disposed at the liquid outlet 1022 and is used to allow the first coolant to flow in. The first coolant is, for example, water, but is not limited thereto.

In this embodiment, the connecting channel C1 extends from one end of the first water-cooled plate 101, the second water-cooled plate 102, and the side cover 103 to the other end of the same plate. The first connecting port 1011 extends from one end of the first water-cooled plate 101 to the other end. The second connecting port 1021 extends from one end of the second water-cooled plate 102 to the other end. That is, compared to the small-sized connecting channel C1 of a typical liquid cooling device 100, the connecting channel C1 of this embodiment is wider to reduce the flow resistance of the first coolant and improve heat dissipation efficiency.

The condenser 104, the thermosiphon tubes 105, and the two evaporators 106 are used to accommodate a second coolant (not shown). The condenser 104 is disposed between the first water-cooled plate 101 and the second water-cooled plate 102. Specifically, the first water-cooled plate 101 is located at the bottom of the condenser 104, and the second water-cooled plate 102 is located at the top of the condenser 104. The thermosiphon tubes 105 are respectively connected to opposite ends of the condenser 104. The two evaporators 106 are respectively connected to the ends of the thermosiphon tubes 105 away from the condenser 104. The two evaporators 106 are used for thermal coupling to the two heat sources 200. Thermal coupling refers to thermal contact or connection through other heat-conducting media. Furthermore, the so-called thermosiphon refers to the partial vaporization of a liquid cooling fluid upon heating, forming a gas-liquid mixture, and the heat dissipation cycle is driven by the density difference between the liquid and gaseous cooling fluids. The second cooling fluid is, for example, a refrigerant, and the heat source 200 is, for example, a CPU, but is not limited to these.

When the second coolant absorbs the heat generated by the two heat sources 200 at the second evaporator 106 and flows to the condenser 104 through the thermosiphon pipes 105, it also absorbs and carries away the heat transferred to the second coolant by flowing through the first coolant on the first water-cooled plate 101, connecting channel C1, and second water-cooled plate 102. In this way, heat can be dissipated from the two heat sources 200.

In this embodiment, the liquid cooling device 100 may further include a first internal fin 109, a plurality of second internal fins 110, a third internal fin 111, and a plurality of fourth internal fins 114. The first water-cooled plate 101 has a first accommodating space S1. The first accommodating space S1, a first connecting port 1011, and a liquid inlet 1012 are connected. The first internal fin 109, the second internal fins 110, the third internal fins 111, and the fourth internal fins 114 are, for example, sheet-like. The first internal fin 109 and the second internal fins 110 are provided with the first accommodating space S1, and the second internal fins 110 are respectively located on opposite sides of the first internal fin 109. One end of the first internal fin 109 corresponds to the liquid inlet 1012. The thickness of the first internal fin 109 is, for example, greater than the thickness of each of the second internal fins 110, but is not limited thereto. By providing a thicker first internal fin 109, with one end of the first internal fin 109 corresponding to the liquid inlet 1012, the first coolant flowing in from the liquid inlet 1012 can be uniformly distributed. Furthermore, the extending direction of the first internal fin 109 and the second internal fins 110 is, for example, perpendicular to the extending direction of the side cover 103, but is not limited thereto.

The second water-cooled plate 102 has a second accommodating space S2. The second accommodating space S2, the second connecting port 1021, and the liquid outlet 1022 are connected. That is, the first accommodating space S1 and the second accommodating space S2 are connected through the first connecting port 1011, the connecting channel C1, and the second connecting port 1021. The third internal fin 111 and the fourth internal fins 114 are provided in the second accommodating space S2, and the fourth internal fins 114 are respectively located on opposite sides of the third internal fin 111. One end of the third internal fin 111 corresponds to the liquid outlet 1022. The thickness of the third internal fin 111 is greater than the thickness of each of the fourth internal fins 114, but is not limited thereto. By providing a thicker third internal fin 111, with one end of the third internal fin 111 corresponding to the liquid inlet 1012, the first coolant after diversion can be made to converge at the liquid outlet 1022. In addition, the extending direction of the third internal fin 111 and these fourth internal fins 114 is, for example, perpendicular to the extending direction of the side cover 103, but is not limited thereto.

In this embodiment, since the extending directions of the first inner fin 109 and the second inner fin 110 are perpendicular to the extending direction of the side cover 103, and the extending directions of the third inner fin 111 and the fourth inner fin 114 are perpendicular to the extending direction of the side cover 103, the flow direction of the first coolant after diversion in the first accommodating space S1 and the second accommodating space S2 is parallel to the extending directions of the first inner fin 109, the second inner fin 110, the third inner fin 111 and the fourth inner fin 114.

In this embodiment, the liquid cooling device 100 may also include multiple external fins 115. These external fins 115 are disposed on the side of the first water-cooled plate 101 away from the second water-cooled plate 102. In this way, the airflow generated by the server's fan (not shown) flowing through these external fins 115 can further improve cooling efficiency. Specifically, by providing the first internal fin 109, these second internal fins 110, the third internal fins 111, the fourth internal fins 114, and these external fins 115, the temperature of the airflow generated by the server's fan after flowing through these external fins 115 can decrease by, for example, 5.6°C.

In this embodiment, since the connecting channel C1 extends from one end of the first water-cooled plate 101, the second water-cooled plate 102, and the side cover 103 to the other end of the same plate, the connecting channel C1 has a large width. Therefore, there is no need to reduce the size of the condenser 104, the first internal fin 109, the second internal fins 110, the third internal fins 111, or the fourth internal fins 114, and the heat exchange area is not reduced. In this way, the heat dissipation efficiency of the liquid cooling device 100 can be improved.

Furthermore, since the flow direction of the first coolant after diversion in the first accommodating space S1 and the second accommodating space S2 is parallel to the extension direction of the first internal fin 109, the second internal fin 110, the third internal fin 111, and the fourth internal fin 114, in addition to not having to reduce the size of the first internal fin 109, the second internal fin 110, the third internal fin 111, and the fourth internal fin 114 to increase the width of the connecting channel C1, the number of times the first coolant after diversion changes direction when flowing in the first accommodating space S1 and the second accommodating space S2 can be reduced to shorten the flow path, thereby reducing the flow resistance of the first coolant and improving the heat dissipation efficiency of the further liquid cooling device 100.

Furthermore, by providing the connecting channel C1, the first internal fin 109, the second internal fins 110, the third internal fins 111, and the fourth internal fins 114, the pressure drop of the first coolant can be reduced. This further reduces the flow resistance of the first coolant, thereby further improving the heat dissipation efficiency of the liquid cooling device 100. For example, compared to a typical liquid cooling device (where the connecting channel size is smaller than that of the connecting channel C1 in this embodiment), the liquid cooling device 100 of this embodiment can reduce the pressure drop of the first coolant, for example, from 475.9 Pa to 225.6 Pa. That is, the liquid cooling device 100 of this embodiment can reduce the pressure drop of the first coolant, for example, by 250.3 Pa, i.e., a pressure drop reduction of approximately 53%.

In this embodiment, the first water-cooled plate 101 located at the bottom of the condenser 104 is used for the inflow of the first coolant, and the second water-cooled plate 102 located at the top of the condenser 104 is used for the outflow of the first coolant, but this is not a limitation. In other embodiments, the flow direction of the first coolant can also be reversed. That is, the second water-cooled plate located at the top of the condenser can be used for the inflow of the first coolant, and the first water-cooled plate located at the bottom of the condenser can be used for the outflow of the first coolant.

In this embodiment, the configuration within the first water-cooled plate 101 and the configuration within the second water-cooled plate 102 are symmetrical structures, but this is not a limitation. In other embodiments, when the structure of these thermosiphon tubes needs to be adjusted due to different configurations within the server, the configuration within the first water-cooled plate and the configuration within the second water-cooled plate can also be adjusted according to the structure of these thermosiphon tubes.

In this embodiment, the connecting channel C1 extends from one end of the first water-cooled plate 101, the second water-cooled plate 102, and the side cover 103 to the other end of the same plate. The first connecting port 1011 extends from one end of the first water-cooled plate 101 to the other end, and the second connecting port 1021 extends from one end of the second water-cooled plate 102 to the other end, but this is not a limitation. In other embodiments, the liquid cooling device may also divide the connecting channel, the first connecting port, and the second connecting port into two sections, for example, by providing a barrier.

In this embodiment, the first inner fin sheet 109, the second inner fin sheets 110, the third inner fin sheets 111, and the fourth inner fin sheets 114 are sheet-like, but not limited thereto. In other embodiments, the first inner fin sheet, the second inner fin sheets, the third inner fin sheets, and the fourth inner fin sheets may also be in other forms, for example.

Please refer again to Figures 3 to 6. In this embodiment, when the first coolant flows into the first accommodating space S1 from the inlet pipe 107 along direction A, the first coolant is first blocked by the first internal fin 109 and temporarily diverted at the inlet 1012, and flows into the connecting channel C1 in the first accommodating space S1 along directions B and C respectively. Then, the diverted first coolant temporarily converges in the connecting channel C1 and flows into the second accommodating space S2 along direction C in the connecting channel C1.

Next, the first coolant, after converging, is temporarily diverted in the second accommodating space S2 by the obstruction of the second internal fin 110, and flows into the outlet pipe 108 in directions D and E respectively within the second accommodating space S2. Then, the diverted first coolant converges at the outlet 1022 and flows from the second accommodating space S2 to the outside of the outlet pipe 108 in direction F, beginning the next cycle. In this way, the cooling cycle of the first coolant is completed.

According to the liquid cooling device of the above embodiment, since the connecting channel extends from one end of the first water-cooled plate, the second water-cooled plate, and the side cover to the other end of the first water-cooled plate, the second water-cooled plate, and the side cover, the connecting channel has a large width. Therefore, there is no need to reduce the size of the condenser, the first internal fin, the second internal fin, the third internal fin, or the fourth internal fin, and the heat exchange area is not reduced. In this way, the heat dissipation efficiency of the liquid cooling device can be improved.

Furthermore, since the flow direction of the first coolant after diversion in the first and second accommodating spaces is parallel to the extension direction of the first, second, third, and fourth internal fins, in addition to not having to increase the width of the connecting channel by reducing the size of the first, second, third, and fourth internal fins, the number of times the first coolant after diversion changes direction when flowing in the first and second accommodating spaces can be reduced, thereby shortening the flow path and reducing the flow resistance of the first coolant, thus further improving the heat dissipation efficiency of the liquid cooling device.

Furthermore, by incorporating connecting channels, a first internal fin, second internal fins, third internal fins, and fourth internal fins, the pressure drop of the first coolant can be reduced. This further reduces the flow resistance of the first coolant, thereby further improving the heat dissipation efficiency of the liquid cooling system.

In one embodiment of the present invention, the liquid cooling device of the present invention can be used as a server, which can be used for artificial intelligence (AI) computing, edge computing, or as a 5G server, cloud server or vehicle network server.

Although the present invention has been disclosed above with reference to the aforementioned embodiments, it is not intended to limit the present invention. Anyone skilled in similar art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.

100: Liquid Cooling Device 101: First Water-Cooling Plate 1011: First Connecting Port 1012: Liquid Inlet 1013: First Side 1014: Second Side 102: Second Water-Cooling Plate 1021: Second Connecting Port 1022: Liquid Outlet 1023: Third Side 1024: Fourth Side 103: Side Cover 104: Condenser 105: Thermosiphon Pipe 106: Evaporator 107: Liquid Inlet Pipe 108: Liquid Outlet Pipe 109: First Inner Fin 110: Second Inner Fin 111: Third Inner Fin 114: Fourth Inner Fin 115: Outer Fin 200: Heat Source A~F: Direction C1: Connecting Channel S1: First Accommodation Space S2: Second Accommodation Space

Figure 1 is a perspective view of the liquid cooling device according to an embodiment of the present invention. Figure 2 is a perspective view of the liquid cooling device of Figure 1 from another angle. Figure 3 is a cross-sectional view of the first water-cooling plate of the liquid cooling device of Figure 1. Figure 4 is a cross-sectional view of the liquid cooling device along section line 4-4 of Figure 3. Figure 5 is a cross-sectional view of the liquid cooling device along section line 5-5 of Figure 3. Figure 6 is a cross-sectional view of the second water-cooling plate of the liquid cooling device of Figure 1.

100: Liquid cooling device

102: Second water-cooled plate

1024: Fourth side

103: Side Cover

104: Condenser

105: Thermosiphon Tube

106: Evaporator

108: Discharge tube

115: External fin plate

200: Heat source

Claims (9)

A liquid cooling device includes: a first water-cooled plate; and a second water-cooled plate stacked on the first water-cooled plate. A side cover is disposed on one side of the first water-cooled plate and the second water-cooled plate; and a condenser, multiple thermosiphon tubes and two evaporators are provided. The condenser is disposed between the first water-cooled plate and the second water-cooled plate. The thermosiphon tubes are respectively connected to opposite ends of the condenser. The two evaporators are respectively connected to the ends of the thermosiphon tubes away from the condenser. The two evaporators are used to make thermal contact with two heat sources. The side of the first water-cooled plate, the side of the second water-cooled plate and the side cover together form a connecting channel. The connecting channel connects the first water-cooled plate and the second water-cooled plate and extends from one end of the first water-cooled plate, the second water-cooled plate and the side cover to the other end of the first water-cooled plate, the second water-cooled plate and the side cover. The liquid cooling device as described in claim 1, wherein the first water-cooled plate has a first connection port on one side near the connecting channel, and the second water-cooled plate has a second connection port on one side near the connecting channel. The connecting channel connects the first water-cooled plate and the second water-cooled plate through the first connection port and the second connection port. The first connection port extends from one end of the first water-cooled plate to the other end of the first water-cooled plate, and the second connection port extends from one end of the second water-cooled plate to the other end of the second water-cooled plate. The liquid cooling device as described in claim 2 further includes a first internal fin and a plurality of second internal fins, and the first water-cooled plate has a first receiving space connected to the first connection port. The first internal fin and the second internal fins are disposed in the first receiving space, and the second internal fins are respectively located on opposite sides of the first internal fin. The liquid cooling device as described in claim 3, wherein the thickness of the first internal fin is greater than the thickness of each of the second internal fins. The liquid cooling device as described in claim 3, wherein the extending directions of the first inner fin and the second inner fin are perpendicular to the extending direction of the side cover. The liquid cooling device as described in claim 3 further includes a third internal fin and a plurality of fourth internal fins, and the second water-cooled plate has a second receiving space that is connected to the second connection port. The third internal fin and the fourth internal fins are disposed in the second receiving space, and the fourth internal fins are respectively located on opposite sides of the third internal fin. The liquid cooling device as described in claim 6, wherein the thickness of the third internal fin is greater than the thickness of each of the fourth internal fins. The liquid cooling device as described in claim 6, wherein the extension direction of the third inner fin and the fourth inner fins is perpendicular to the extension direction of the side cover. The liquid cooling device as described in claim 1 further includes a plurality of external fins disposed on one side of the first water-cooled plate away from the second water-cooled plate.