TWI906871B - Color-dependent defective pixel mitigation method - Google Patents
Color-dependent defective pixel mitigation methodInfo
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Abstract
Description
本公開的實施例一般涉及微型LED顯示器和製造微型LED顯示器的方法。具體而言,本文所述的實施例提供了修復微型LED顯示器的方法和裝置。 The embodiments disclosed herein generally relate to micro LED displays and methods for manufacturing micro LED displays. Specifically, the embodiments described herein provide methods and apparatus for repairing micro LED displays.
發光二極體(LED)面板使用LED陣列,其中個別LED提供單獨可控制的像素元素。這種LED面板可用於電腦、觸控板裝置、個人數位助理(PDA)、手機、電視螢幕等。 Light-emitting diode (LED) panels use LED arrays, where individual LEDs provide individually controllable pixel elements. These LED panels are used in computers, touchpad devices, personal digital assistants (PDAs), mobile phones, television screens, and more.
發光二極體(LED)技術廣泛應用於顯示技術。一般來說,LED技術的實作是利用具有LED陣列的LED面板。陣列內的各個LED可提供單獨可控制的像素元素,這可使得使用者可以在LED面板上顯示可自訂的圖像。因此,在一個範例中,LED技術可能是適合終端使用者顯示設備的顯示機制,包括電腦顯示器、觸控板裝置、個人數位助理(PDA)、手機、電視螢幕等。目前的LED技術已 經提供了採用基於III-V族半導體技術的微米級LED(也稱為微型LED)的LED面板系統。與有機發光二極體(OLED)相比,微型LED提供多種優勢,例如,微型LED促進更高的能源效率、更強勁的顯示器亮度和更長的顯示器壽命。與OLED相比,製造商可亦使用顯示堆疊中更少的材料層來生產微型LED,這可以降低與LED生產相關的複雜性和成本。 Light-emitting diode (LED) technology is widely used in display technology. Generally, LED technology is implemented using LED panels with LED arrays. Each LED within the array provides an individually controllable pixel element, allowing users to display customized images on the LED panel. Therefore, in one example, LED technology might be a display mechanism suitable for end-user display devices, including computer monitors, touchpad devices, personal digital assistants (PDAs), mobile phones, television screens, etc. Current LED technology has provided LED panel systems using micron-sized LEDs (also known as micro-LEDs) based on III-V semiconductor technology. Compared to organic light-emitting diodes (OLEDs), micro-LEDs offer several advantages, such as higher energy efficiency, stronger display brightness, and longer display lifespan. Compared to OLEDs, manufacturers can also produce micro-LEDs using fewer material layers in the display stack, which reduces the complexity and cost associated with LED production.
繞過拾取和放置步驟的另一種方法是選擇性地在以單色LED製造的基板上的特定像素位置處沉積顏色轉換劑(例如量子點、奈米結構、光致發光材料、或有機物質)。單色LED可以產生相對較短波長的光,例如紫光或藍光,而顏色轉換劑可以將這種短波長的光轉換為較長波長的光,例如紅光、藍光、或綠光,以用於紅色、藍色或綠色像素。可使用高解析度陰影遮罩或可控制噴墨或氣溶膠噴射列印來實行顏色轉換劑的選擇性沉積。 Another method that bypasses the pick-and-place step is to selectively deposit color-changing agents (such as quantum dots, nanostructures, photoluminescent materials, or organic materials) at specific pixel locations on a substrate made of monochromatic LEDs. Monochromatic LEDs can produce relatively short-wavelength light, such as violet or blue light, and the color-changing agent can convert this short-wavelength light into longer-wavelength light, such as red, blue, or green light, for use with red, blue, or green pixels. Selective deposition of the color-changing agent can be achieved using high-resolution shadow masks or controllable inkjet or aerosol printing.
然而,微型LED面板的製造仍存在挑戰。因此,本領域需要改進的微型LED顯示器以及製造微型LED顯示器的方法。 However, the manufacture of micro-LED panels still faces challenges. Therefore, this field requires improved micro-LED displays and methods for manufacturing them.
在一些實施例中,提供了方法。方法包括判定像素的沉積圖案,其中每個像素包括至少四個子像素,每個子像素包括界定阱的子像素隔離結構。識別缺陷子像素,缺陷子像素包括以下至少一者:包括第一子像素顏色的第 一子像素、包括第二子像素顏色的第二子像素、或包括第三子像素顏色的第三子像素。識別單元內備用修復子像素。基於ISR子像素和缺陷子像素判定沉積模式。在ISR子像素中沉積顏色轉換材料。顏色轉換材料經配置為發射第一子像素顏色、第二子像素顏色、或第三子像素顏色中的至少一者。 In some embodiments, a method is provided. The method includes determining a deposition pattern of pixels, wherein each pixel comprises at least four sub-pixels, and each sub-pixel comprises a sub-pixel isolation structure defining a well. Defective sub-pixels are identified, comprising at least one of: a first sub-pixel including a first sub-pixel color, a second sub-pixel including a second sub-pixel color, or a third sub-pixel including a third sub-pixel color. Backup repair sub-pixels are identified within the unit. A deposition pattern is determined based on the ISR sub-pixels and the defective sub-pixels. Color-changing material is deposited in the ISR sub-pixels. The color-changing material is configured to emit at least one of the first sub-pixel color, the second sub-pixel color, or the third sub-pixel color.
在其他實施例中,提供了方法。方法包括判定像素的沉積圖案,每個像素包括至少四個子像素,每個子像素包括界定阱的子像素隔離結構。基於第一子像素上色性閾值,使包括第一子像素顏色的第一子像素優先於包括第二子像素顏色的第二子像素和包括第三子像素顏色的第三子像素。基於第二子像素上色性閾值,使包括第二子像素顏色的第二子像素優先於包括第三子像素顏色的第三子像素。基於第三子像素上色性閾值,使包括第三子像素顏色的第三子像素優先於不具有子像素顏色的第四子像素。基於第一子像素上色性閾值、第二子像素上色性閾值、和第三子像素上色性閾值形成像素。根據沉積模式在每個阱中沉積配置為發射第一子像素顏色、第二子像素顏色、第三子像素顏色、或不發射子像素顏色的顏色轉換材料。 In other embodiments, a method is provided. The method includes determining a deposition pattern of pixels, each pixel comprising at least four sub-pixels, each sub-pixel comprising a sub-pixel isolation structure defining a well. Based on a first sub-pixel chromaticity threshold, a first sub-pixel including a first sub-pixel color is prioritized over a second sub-pixel including a second sub-pixel color and a third sub-pixel including a third sub-pixel color. Based on a second sub-pixel chromaticity threshold, a second sub-pixel including a second sub-pixel color is prioritized over a third sub-pixel including a third sub-pixel color. Based on a third sub-pixel chromaticity threshold, a third sub-pixel including a third sub-pixel color is prioritized over a fourth sub-pixel that does not have a sub-pixel color. A pixel is formed based on the first sub-pixel chromaticity threshold, the second sub-pixel chromaticity threshold, and the third sub-pixel chromaticity threshold. Color conversion material configured to emit a first sub-pixel color, a second sub-pixel color, a third sub-pixel color, or no sub-pixel color is deposited in each well according to the deposition pattern.
在其他實施例中,提供了方法。方法包括判定像素的沉積圖案,其中每個像素包括至少四個子像素,每個子像素包括界定阱的子像素隔離結構。識別缺陷微型LED,缺陷微型LED包括以下至少一者:包括第一子像素顏色設置於其上的第一微型LED、包括第二子像素顏色設 置於其上的第二微型LED、或包括第三子像素顏色設置於其上的第三微型LED。識別單元內備用修復(ISR)微型LED。基於ISR微型LED和缺陷微型LED判定沉積模式。在ISR微型LED上方沉積顏色轉換材料。顏色轉換材料經配置為發射第一子像素顏色、第二子像素顏色、或第三子像素顏色中的至少一者。 In other embodiments, a method is provided. The method includes determining a deposition pattern of pixels, wherein each pixel includes at least four sub-pixels, and each sub-pixel includes a sub-pixel isolation structure defining a well. A defective microLED is identified, the defective microLED including at least one of: a first microLED including a first sub-pixel color disposed thereon, a second microLED including a second sub-pixel color disposed thereon, or a third microLED including a third sub-pixel color disposed thereon. A backup repair (ISR) microLED within a unit is identified. A deposition pattern is determined based on the ISR microLED and the defective microLED. A color-changing material is deposited over the ISR microLED. The color-changing material is configured to emit at least one of the first sub-pixel color, the second sub-pixel color, or the third sub-pixel color.
本專利或申請文件包含至少一張色圖。在根據請求並支付必要費用後,局所將提供本專利或專利申請出版的色圖的副本。因此,可以詳細瞭解本公開的上述特徵的方法,本公開的更具體的描述,簡要概述於上,可參照實施例,其中一些實施例描繪在隨附圖式中。然而,應注意,隨附圖式僅示出範例實施例,因此不應被視為限制其範圍,且可允許其他等效的實施例。 This patent or application contains at least one color drawing. Upon request and payment of the necessary fees, the office will provide a copy of the published color drawing of this patent or application. Thus, the methods for understanding the above-described features of this disclosure can be understood in detail. A more detailed description of this disclosure, briefly summarized above, can be seen with reference to the embodiments, some of which are depicted in the accompanying drawings. However, it should be noted that the accompanying drawings only show exemplary embodiments and should not be considered as limiting its scope, and other equivalent embodiments are permissible.
100A:像素 100A: pixels
100B:像素 100B: pixels
101:像素陣列 101: Pixel Array
102:背板 102: Backplate
103:黏合材料 103: Adhesive Materials
104:子像素隔離(SI)結構 104: Subpixel Isolation (SI) Structure
105:阱 105: Trap
106:微型LED 106: Miniature LED
108:電極 108: Electrode
109:子像素 109: Subpixel
110:第一子像素 110: First subpixel
112:第二子像素 112: Second subpixel
114:第三子像素 114: Third subpixel
115:顏色轉換材料 115: Color Conversion Materials
115a:顏色轉換材料 115a: Color Conversion Material
115b:顏色轉換材料 115b: Color conversion material
115c:顏色轉換材料 115c: Color conversion material
115d:顏色轉換材料 115d: Color Conversion Material
116:第四子像素 116: Fourth sub-pixel
117:犧牲材料 117: Sacrificial Materials
122:第一缺陷子像素 122: First defective subpixel
124:第二缺陷子像素 124: Second defective subpixel
130:子像素 130: Subpixel
136:子像素 136: Subpixel
140:子像素 140: Subpixel
142:子像素 142: Subpixel
144:子像素 144: Subpixel
150:微型LED顯示器 150: Miniature LED Display
152:分割線 152: dividing line
200:像素陣列 200: Pixel Array
210:像素 210: pixels
220:像素 220 pixels
230:像素 230 pixels
240:像素 240 pixels
250:像素陣列 250: Pixel Array
300:像素 300 pixels
350:像素 350 pixels
400:像素陣列 400: Pixel Array
410:像素 410: pixels
420:像素 420 pixels
430:像素 430 pixels
440:像素 440 pixels
450:像素陣列 450: Pixel Array
圖1A是根據實施例在製造微型LED顯示器的方法之前像素的橫截面視圖。 Figure 1A is a cross-sectional view of a pixel prior to the method of manufacturing a microLED display according to an embodiment.
圖1B是根據本文所述的一些實施例在製造微型LED顯示器的方法之前的像素的頂視圖。 Figure 1B is a top view of the pixels prior to a method for manufacturing a microLED display according to some embodiments described herein.
圖1C是根據本文所述的實施例的像素的橫截面圖。 Figure 1C is a cross-sectional view of a pixel according to the embodiment described herein.
圖1D是根據本文所述的一些實施例在製造微型LED顯示器的方法之前的微型LED顯示器的頂視圖。 Figure 1D is a top view of a microLED display prior to a method for manufacturing a microLED display according to some embodiments described herein.
圖2A是根據本文所述的第一實施例在製造微型LED顯示器的方法之前像素陣列的一部分的頂視圖。 Figure 2A is a top view of a portion of the pixel array prior to a method for manufacturing a micro-LED display according to the first embodiment described herein.
圖2B是根據本文所述的第一實施例在製造微型LED顯示器的方法之後的像素陣列的一部分的頂視圖。 Figure 2B is a top view of a portion of the pixel array following a method for manufacturing a micro-LED display according to the first embodiment described herein.
圖3A是根據本文所述的第二實施例在製造微型LED顯示器的方法之前的像素的頂視圖。 Figure 3A is a top view of the pixels prior to the method of manufacturing a microLED display according to the second embodiment described herein.
圖3B是根據本文所述的第二實施例在製造微型LED顯示器的方法之後的像素的頂視圖。 Figure 3B is a top view of the pixels following the method for manufacturing a micro-LED display according to the second embodiment described herein.
圖4A是根據本文所述的第三實施例在製造微型LED顯示器的方法之前像素陣列的一部分的頂視圖。 Figure 4A is a top view of a portion of the pixel array prior to the method of manufacturing a micro-LED display according to the third embodiment described herein.
圖4B是根據本文所述的第三實施例在製造微型LED顯示器的方法之前像素陣列的一部分的頂視圖。 Figure 4B is a top view of a portion of the pixel array prior to the method of manufacturing a micro-LED display according to the third embodiment described herein.
為了便於理解,在可能的情況下,已使用相同的元件符號來表示圖中共同的相同元件。可以設想的是,一個實施例的元件和特徵可以有益地併入其他實施例中而無需進一步敘述。 For ease of understanding, the same component symbols have been used to represent common, identical components in the figures where possible. It is conceivable that the components and features of one embodiment can be beneficially incorporated into other embodiments without further description.
附文簡要說明 Brief Explanation Attached
為了可以詳細瞭解本公開的上述特徵的方法,本公開的更具體的描述,簡要概述於上,可參照實施例,其中一些實施例描繪在附文中。然而,應當注意,隨文僅示出本公開的典型實施例,且因此不應將其視為限制其範圍,因為本公開可承認其他等效的實施例。 To provide a detailed understanding of the methods featuring the above-described characteristics of this disclosure, a more specific description of the disclosure is briefly summarized above, with reference to the embodiments, some of which are depicted in the appendix. However, it should be noted that the appendix only illustrates typical embodiments of this disclosure and should not be construed as limiting its scope, as other equivalent embodiments are permissible.
本公開包含至少一頁彩色附文。經請求並支付必要的費用後,將向局所提供本文內容及其彩色附文的副 本。由於彩色附文是透過EFS-Web以電子方式提交的,因此僅需提交一套附文。 This disclosure includes at least one page of color text. A copy of this document and its color text will be provided to the relevant authority upon request and payment of the necessary fees. Since the color text is submitted electronically via EFS-Web, only one set of text is required.
本公開的實施例一般涉及LED像素和製造LED像素的方法。裝置通常包括設置在背板上的兩個或更多個像素,每個像素進一步包括至少四個子像素。每個子像素包括微型LED和子像素隔離(sub-pixel isolation,SI)結構。背板包括設置在背板上的成對的背板電極。微型LED包括與成對的背板電極耦接的成對的微型LED電極。背板電極設置於背板上。SI結構位於微型LED之間的上表面上。SI結構界定了子像素的阱(well)105,其中設置有顏色轉換材料115。 This disclosure generally relates to LED pixels and methods of manufacturing LED pixels. The apparatus typically includes two or more pixels disposed on a backplane, each pixel further including at least four subpixels. Each subpixel includes a microLED and a sub-pixel isolation (SI) structure. The backplane includes pairs of backplane electrodes disposed on the backplane. The microLED includes pairs of microLED electrodes coupled to the pairs of backplane electrodes. The backplane electrodes are disposed on the backplane. The SI structure is located on the upper surface between the microLEDs. The SI structure defines a well 105 for the subpixel, in which a color-converting material 115 is disposed.
圖1A是在製造微型LED顯示器150的方法之前像素100A的橫截面圖。圖1B是像素100A的頂視圖,顯示了圖1A中使用的分割線152。像素100A包括耦接至背板102的微型LED 106。微型LED 106經由電極108耦接至背板102。黏合材料103設置在背板102上方、在電極108之間、在微型LED 106之間。像素100A包括至少四個子像素109,例如第一子像素110、第二子像素112、第三子像素114、以及第四子像素116。至少四個子像素109由子像素隔離(sub-pixel isolation,SI)結構104界定。SI結構104界定至少四個子像素109的阱105。在這個範例中,所有四個子像素109(第一子像素110、第二 子像素112、第三子像素114、和第四子像素116)可配置成獨立地調節其輸出強度。 Figure 1A is a cross-sectional view of pixel 100A prior to the method of manufacturing the microLED display 150. Figure 1B is a top view of pixel 100A, showing the dividing line 152 used in Figure 1A. Pixel 100A includes microLEDs 106 coupled to a backplane 102. MicroLEDs 106 are coupled to the backplane 102 via electrodes 108. Adhesive material 103 is disposed above the backplane 102, between the electrodes 108, and between the microLEDs 106. Pixel 100A includes at least four sub-pixels 109, such as a first sub-pixel 110, a second sub-pixel 112, a third sub-pixel 114, and a fourth sub-pixel 116. The at least four sub-pixels 109 are defined by a sub-pixel isolation (SI) structure 104. The SI structure 104 defines a well 105 for the at least four sub-pixels 109. In this example, all four subpixels 109 (first subpixel 110, second subpixel 112, third subpixel 114, and fourth subpixel 116) can be configured to independently adjust their output intensity.
至少四個子像素109中的三個具有設置在其各自的微型LED上方的阱105中的顏色轉換材料115。第一子像素110包括對應於設置在微型LED 106上方的阱105中的第一子像素顏色的第一顏色轉換材料115a。第二子像素112包括對應於設置在微型LED 106上方的阱105中的第二子像素顏色的第二顏色轉換材料115b。第三子像素114包括對應於設置在微型LED 106上方的阱105中的第三子像素顏色的第三顏色轉換材料115c。顏色轉換材料115對應第一子像素顏色、第二子像素顏色、第三子像素顏色或其他子像素顏色,其中,第一子像素顏色、第二子像素顏色、第三子像素顏色或其他子像素顏色各者可以彼此不同,也可以相同。第四子像素116包括設置在微型LED 106上方的阱105中的犧牲材料117。在其他實施例中,第四子像素116的阱105不包括設置在微型LED 106上方的阱105中的顏色轉換材料。在又一些實施例中,第四子像素116可包括設置在微型LED 106上方的阱105中的對應於第一子像素顏色、第二子像素顏色、第三子像素顏色,或其他子像素顏色的第四顏色轉換材料115d,配置為發射第一、第二、第三、或第四顏色,其可以彼此不同。第一子像素顏色、第二子像素顏色、第三子像素顏色或其他子像素顏色可以配置為發射紅色、綠色、藍色、或其他顏色。 At least three of the four sub-pixels 109 have color-changing materials 115 disposed in wells 105 above their respective micro-LEDs. The first sub-pixel 110 includes a first color-changing material 115a corresponding to the color of the first sub-pixel disposed in the well 105 above the micro-LED 106. The second sub-pixel 112 includes a second color-changing material 115b corresponding to the color of the second sub-pixel disposed in the well 105 above the micro-LED 106. The third sub-pixel 114 includes a third color-changing material 115c corresponding to the color of the third sub-pixel disposed in the well 105 above the micro-LED 106. The color-changing materials 115 correspond to the first sub-pixel color, the second sub-pixel color, the third sub-pixel color, or other sub-pixel colors, wherein the first sub-pixel color, the second sub-pixel color, the third sub-pixel color, or other sub-pixel colors may be different from each other or the same. The fourth sub-pixel 116 includes sacrificial material 117 disposed in a well 105 above the micro-LED 106. In other embodiments, the well 105 of the fourth sub-pixel 116 does not include color-changing material disposed in the well 105 above the micro-LED 106. In still other embodiments, the fourth sub-pixel 116 may include a fourth color-changing material 115d disposed in the well 105 above the micro-LED 106, corresponding to a first sub-pixel color, a second sub-pixel color, a third sub-pixel color, or another sub-pixel color, configured to emit a first, second, third, or fourth color, which may be different from each other. The first sub-pixel color, the second sub-pixel color, the third sub-pixel color, or other sub-pixel colors may be configured to emit red, green, blue, or other colors.
圖1C是在製造微型LED顯示器150的方法之前像素100B的橫截面圖。像素100B包括耦接至背板102的微型LED 106。微型LED 106經由電極108耦接至背板102。黏合材料103設置在背板102上方、在電極108之間、在微型LED 106之間。像素100B包括至少四個子像素109,例如第一子像素110、第二子像素112、第三子像素114、以及第四子像素116。至少四個子像素109由子像素隔離(sub-pixel isolation,SI)結構104界定。SI結構104界定至少四個子像素109的阱105。在這個範例中,所有四個子像素109(第一子像素110、第二子像素112、第三子像素114、和第四子像素116)可配置成獨立地調節其輸出強度。 Figure 1C is a cross-sectional view of pixel 100B prior to a method of manufacturing the micro-LED display 150. Pixel 100B includes micro-LEDs 106 coupled to a backplane 102. Micro-LEDs 106 are coupled to the backplane 102 via electrodes 108. Adhesive material 103 is disposed above the backplane 102, between the electrodes 108, and between the micro-LEDs 106. Pixel 100B includes at least four sub-pixels 109, such as a first sub-pixel 110, a second sub-pixel 112, a third sub-pixel 114, and a fourth sub-pixel 116. The at least four sub-pixels 109 are defined by a sub-pixel isolation (SI) structure 104. The SI structure 104 defines a well 105 for the at least four sub-pixels 109. In this example, all four subpixels 109 (first subpixel 110, second subpixel 112, third subpixel 114, and fourth subpixel 116) can be configured to independently adjust their output intensity.
至少四個子像素109中的三個具有設置在其各自的微型LED上方的阱105中的顏色轉換材料115。第一子像素110包括對應於設置在微型LED 106上方的阱105中的第一子像素顏色的第一顏色轉換材料115a。第二子像素112包括對應於設置在微型LED 106上方的阱105中的第二子像素顏色的第二顏色轉換材料115b。第三子像素114包括對應於設置在微型LED 106上方的阱105中的第三子像素顏色的第三顏色轉換材料115c。顏色轉換材料115對應第一子像素顏色、第二子像素顏色、第三子像素顏色或其他子像素顏色,其中,第一子像素顏色、第二子像素顏色、第三子像素顏色或其他子像素顏色各者可以彼此不同。在這個範例實施例中,第四子像素116可以具有與第 二子像素顏色相對應的第二轉換材料,該第二轉換材料與第二子像素112的微型LED106上方的阱105中沉積的第二轉換材料相同,此第二轉換材料沉積在第四子像素116的微型LED 106上方的阱105中。在其他實施例中,第四子像素116的阱105不包括設置在微型LED 106上方的阱105中的顏色轉換材料。在又一些實施例中,第四子像素116可包括設置在微型LED 106上方的阱105中的對應於第一子像素顏色、第二子像素顏色、第三子像素顏色,或其他子像素顏色的第四顏色轉換材料115d,配置為發射第一、第二、第三、或第四顏色,其可以彼此不同。第一子像素顏色、第二子像素顏色、第三子像素顏色、或其他子像素顏色可以是紅色、綠色、藍色或白色,且第一子像素顏色、第二子像素顏色、第三子像素顏色或其他子像素顏色可以彼此不同或相同。在這個範例中,所有四個子像素109(第一子像素110、第二子像素112、第三子像素114、和第四子像素116)可配置成獨立地調節其輸出強度。 At least three of the four sub-pixels 109 have color-changing materials 115 disposed in wells 105 above their respective micro-LEDs. The first sub-pixel 110 includes a first color-changing material 115a corresponding to a first sub-pixel color disposed in the well 105 above the micro-LED 106. The second sub-pixel 112 includes a second color-changing material 115b corresponding to a second sub-pixel color disposed in the well 105 above the micro-LED 106. The third sub-pixel 114 includes a third color-changing material 115c corresponding to a third sub-pixel color disposed in the well 105 above the micro-LED 106. The color-changing materials 115 correspond to the first sub-pixel color, the second sub-pixel color, the third sub-pixel color, or other sub-pixel colors, wherein each of the first sub-pixel color, the second sub-pixel color, the third sub-pixel color, or other sub-pixel colors may be different from each other. In this exemplary embodiment, the fourth sub-pixel 116 may have a second color-changing material corresponding to the color of the second sub-pixel. This second color-changing material is the same as the second color-changing material deposited in the well 105 above the microLED 106 of the second sub-pixel 112, which is also deposited in the well 105 above the microLED 106 of the fourth sub-pixel 116. In other embodiments, the well 105 of the fourth sub-pixel 116 does not include the color-changing material disposed in the well 105 above the microLED 106. In still other embodiments, the fourth sub-pixel 116 may include a fourth color-changing material 115d disposed in the well 105 above the microLED 106, corresponding to the first sub-pixel color, the second sub-pixel color, the third sub-pixel color, or another sub-pixel color, configured to emit the first, second, third, or fourth color, which may be different from each other. The first sub-pixel color, the second sub-pixel color, the third sub-pixel color, or other sub-pixel colors can be red, green, blue, or white, and these colors can be different from or the same as each other. In this example, all four sub-pixels 109 (first sub-pixel 110, second sub-pixel 112, third sub-pixel 114, and fourth sub-pixel 116) can be configured to independently adjust their output intensity.
圖1D是在製造微型LED顯示器150的方法之前的微型LED顯示器150的頂視圖。微型LED顯示器包括兩個或更多像素100A的像素陣列101。像素100A包括耦接至背板102的微型LED 106。微型LED 106經由電極108耦接至背板102。黏合材料103設置在背板102上方、在電極108之間、在微型LED 106之間、及在子像素隔離(SI)結構104。SI結構104界定至少四個子像素109的阱105。像素100A包括至少四個子像素109,例如第一子像素 110、第二子像素112、第三子像素114、以及第四子像素116。在這個範例中,兩個或更多個像素100A的所有四個子像素109(第一子像素110、第二子像素112、第三子像素114、和第四子像素116)可配置成獨立地調節其輸出強度。 Figure 1D is a top view of a microLED display 150 prior to a method of manufacturing the microLED display 150. The microLED display includes a pixel array 101 of two or more pixels 100A. Pixel 100A includes microLEDs 106 coupled to a backplane 102. MicroLEDs 106 are coupled to the backplane 102 via electrodes 108. Adhesive material 103 is disposed above the backplane 102, between the electrodes 108, between the microLEDs 106, and in a subpixel isolation (SI) structure 104. SI structure 104 defines a well 105 for at least four subpixels 109. Pixel 100A includes at least four subpixels 109, such as a first subpixel 110, a second subpixel 112, a third subpixel 114, and a fourth subpixel 116. In this example, all four subpixels 109 (first subpixel 110, second subpixel 112, third subpixel 114, and fourth subpixel 116) of two or more pixels 100A can be configured to independently adjust their output intensity.
方法 method
在一些實施例中,可以參考圖2A和圖2B來理解本公開的方法。圖2A是在製造微型LED顯示器的方法之前像素陣列200的一部分的頂視圖,顯示了四個像素(像素210、像素220、像素230、和像素240)的範例像素陣列200,其採用二乘二像素排列,其中四個像素(像素210、像素220、像素230和像素240)中的每一個均具有四個子像素109(第一子像素110、第二子像素112、第三子像素114、和第四子像素116)其採用二乘二子像素排列。在此範例中,四個像素(像素210、像素220、像素230、和像素240)中的每一個都包括耦接到背板102的微型LED 106。微型LED 106經由電極108耦接至背板102。黏合材料103設置在背板102上方、在電極108之間、在微型LED 106之間、及在子像素隔離(SI)結構104。SI結構104界定至少四個子像素109的阱105,例如第一子像素110、第二子像素112、第三子像素114、以及第四子像素116。在此範例中,四個像素(像素210、像素220、像素230和像素240)中的所有四個子像素109(第一子像素 110、第二子像素112、第三子像素114和第四子像素116)均可配置為獨立地調節其輸出強度。 In some embodiments, the method of this disclosure can be understood with reference to Figures 2A and 2B. Figure 2A is a top view of a portion of a pixel array 200 prior to the method of manufacturing a micro LED display, showing an exemplary pixel array 200 of four pixels (pixels 210, 220, 230, and 240) arranged in a 2x2 pixel configuration, wherein each of the four pixels (pixels 210, 220, 230, and 240) has four sub-pixels 109 (a first sub-pixel 110, a second sub-pixel 112, a third sub-pixel 114, and a fourth sub-pixel 116) arranged in a 2x2 sub-pixel configuration. In this example, each of the four pixels (pixels 210, 220, 230, and 240) includes a micro LED 106 coupled to a backplane 102. Micro-LEDs 106 are coupled to a backplane 102 via electrodes 108. An adhesive material 103 is disposed above the backplane 102, between the electrodes 108, between the micro-LEDs 106, and in a sub-pixel isolation (SI) structure 104. The SI structure 104 defines a well 105 for at least four sub-pixels 109, such as a first sub-pixel 110, a second sub-pixel 112, a third sub-pixel 114, and a fourth sub-pixel 116. In this example, all four sub-pixels 109 (first sub-pixel 110, second sub-pixel 112, third sub-pixel 114, and fourth sub-pixel 116) of the four pixels (pixels 210, 220, 230, and 240) can be configured to independently adjust their output intensity.
像素陣列200的四個像素(像素210、像素220、像素230和像素240)共享相同的計畫初始配置,如圖2A所示。第一子像素110配置為發射紅色,第二子像素112配置為發射綠色,第三子像素114配置為發射藍色,和第四子像素116不配置為發射顏色。如果第一子像素110、第二子像素112、或第三子像素114出現缺陷,則第四子像素116可以是用於單元內備用修復(intracell spare repair,ISR)的可用備用子像素。在像素陣列200中,其中一個像素(像素240)具有兩個缺陷子像素,其中四個子像素109中的第一缺陷子像素122配置為發射綠色,第二缺陷子像素124配置為發射藍色。可以透過將子像素與子像素顏色閾值(例如,綠色子像素顏色閾值、藍色子像素上色性(color yield)閾值和/或紅色子像素顏色閾值)進行比較來識別缺陷子像素。在一些實施例中,子像素顏色閾值可包括相對於子像素的預期亮度值(例如流明)的百分比值。例如,子像素顏色閾值可包括預期亮度值(例如子像素顏色的流明)的約50%至約100%。例如,子像素顏色閾值可包括相對於子像素的預期亮度值約50%的值。 Four pixels (pixels 210, 220, 230, and 240) of pixel array 200 share the same initial planned configuration, as shown in Figure 2A. The first sub-pixel 110 is configured to emit red, the second sub-pixel 112 is configured to emit green, the third sub-pixel 114 is configured to emit blue, and the fourth sub-pixel 116 is not configured to emit any color. If the first sub-pixel 110, the second sub-pixel 112, or the third sub-pixel 114 is defective, the fourth sub-pixel 116 can be a usable spare sub-pixel for intracell spare repair (ISR). In pixel array 200, one pixel (pixel 240) has two defective sub-pixels, where the first defective sub-pixel 122 of the four sub-pixels 109 is configured to emit green, and the second defective sub-pixel 124 is configured to emit blue. Defective subpixels can be identified by comparing them to subpixel color thresholds (e.g., green subpixel color threshold, blue subpixel color yield threshold, and/or red subpixel color threshold). In some embodiments, the subpixel color threshold may include a percentage value relative to the expected brightness value (e.g., lumens) of the subpixel. For example, the subpixel color threshold may include approximately 50% to approximately 100% of the expected brightness value (e.g., lumens of the subpixel color). For example, the subpixel color threshold may include a value approximately 50% of the expected brightness value of the subpixel.
圖2B是在製造微型LED顯示器的方法之後的像素陣列250的一部分的頂視圖,顯示了在進行修復兩個缺 陷子像素(第一缺陷子像素122和第二缺陷子像素124)的步驟之後的像素陣列200。 Figure 2B is a top view of a portion of the pixel array 250 following the method of manufacturing a micro-LED display, showing the pixel array 200 after the step of repairing two defective sub-pixels (first defective sub-pixel 122 and second defective sub-pixel 124).
缺陷子像素被判定為具有綠色和藍色的子像素。在這種情況下,將像素陣列200的區域上的綠色亮度值與綠色子像素上色性閾值進行比較,如上所述。另外,如上所述,將像素陣列200的區域上的藍色產量與藍色子像素上色性閾值進行比較。如果像素陣列200的區域上的綠色產量等於或超過綠色子像素上色性閾值(例如,約50%至約100%),且像素陣列200的區域上的藍色產量低於藍色子像素上色性閾值(例如,約50%至約100%),則最初未配置為發射顏色的像素240的第四子像素116可以改為用於ISR並配置為發射藍色。 Defective subpixels are identified as having both green and blue subpixels. In this case, the green luminance value in the region of pixel array 200 is compared with the chromaticity threshold of the green subpixel, as described above. Additionally, as described above, the blue production in the region of pixel array 200 is compared with the chromaticity threshold of the blue subpixel. If the green production in the region of pixel array 200 is equal to or exceeds the chromaticity threshold of the green subpixel (e.g., approximately 50% to approximately 100%), and the blue production in the region of pixel array 200 is less than the chromaticity threshold of the blue subpixel (e.g., approximately 50% to approximately 100%), then the fourth subpixel 116 of pixel 240, which was initially not configured as an emission color, can be repurposed for ISR and configured to emit blue.
然而,如果像素陣列200的區域上的綠色產量低於綠色子像素上色性閾值,且像素陣列200的區域上的藍色產量低於藍色子像素上色性閾值,則最初未配置為發射顏色的像素240的第四子像素116可以改為用於ISR並配置為發射綠色和/或藍色。在一些實施例中,由於在ISR中設置了額外的綠色而改善像素的視覺外觀,因此可以使綠色優先。 However, if the green output in the region of pixel array 200 is lower than the chromaticity threshold of the green subpixel, and the blue output in the region of pixel array 200 is lower than the chromaticity threshold of the blue subpixel, then the fourth subpixel 116 of pixel 240, which was not initially configured as an emission color, can be repurposed for the ISR and configured to emit green and/or blue. In some embodiments, green can be prioritized because the visual appearance of the pixel is improved by setting additional green in the ISR.
在一些實施例中,可以評估像素陣列200中的像素240的相鄰、斜角(diagonal)或正交(例如,鄰近)像素(例如,像素210、像素220、和像素230)是否存在尚未用於ISR的第四子像素116。如果發現第四子像素116,則可以發生相鄰單元備用修復(neighboring-cell spare repair,NSR),並且可以將像素210、像素220、和像素230中的第四子像素配置為發射像素240的第四子像素116中未設置的剩餘顏色(ISR)。例如,NSR可配置為發出藍色。 In some embodiments, it can be evaluated whether there is a fourth sub-pixel 116 that has not yet been used for ISR in adjacent, diagonal, or orthogonal (e.g., neighboring) pixels (e.g., pixels 210, 220, and 230) of pixel 240 in pixel array 200. If a fourth sub-pixel 116 is found, neighboring-cell spare repair (NSR) can occur, and the fourth sub-pixels of pixels 210, 220, and 230 can be configured to emit the remaining color (ISR) not set in the fourth sub-pixel 116 of pixel 240. For example, the NSR can be configured to emit blue.
如果第四子像素116不適用於NSR以配置為發射藍色,則可以將像素陣列200的區域上的藍色產量與藍色子像素上色性閾值進行比較。如果像素陣列200的區域上的藍色產量等於或超過藍色子像素上色性閾值,例如,約50%至約100%,則像素240的第二缺陷子像素124可能無法修復。如果像素陣列200的區域上的藍色產量低於藍色子像素上色性閾值,則可以對像素240的第二缺陷子像素124進行物理修復。 If the fourth subpixel 116 is not suitable for NSR configuration to emit blue, the blue yield in the region of pixel array 200 can be compared with the chromaticity threshold of the blue subpixel. If the blue yield in the region of pixel array 200 is equal to or exceeds the chromaticity threshold of the blue subpixel, for example, about 50% to about 100%, the second defective subpixel 124 of pixel 240 may not be repairable. If the blue yield in the region of pixel array 200 is lower than the chromaticity threshold of the blue subpixel, the second defective subpixel 124 of pixel 240 can be physically repaired.
在一些實施例中,可以參考圖3A和圖3B來理解本公開的方法。圖3A是在製造微型LED顯示器的方法之前像素陣列的頂視圖。範例像素300包括耦接到背板102的微型LED 106。微型LED 106經由電極108耦接至背板102。黏合材料103設置在背板102上方、在電極108之間、在微型LED 106之間、及在子像素隔離(SI)結構104。SI結構104界定至少四個子像素109的阱105。像素300包括至少四個子像素109,例如第一子像素110、第二子像素112、第三子像素114、以及第四子像素116。在這個範例中,兩個或更多個像素100A的所有四個子像素109(第一子像素110、第二子像素112、第三子像素114、和第四子像素116)可配置成獨立地調節其輸出強度。如圖 3A所示,所有四個子像素109(第一子像素110、第二子像素112、第三子像素114和第四子像素116)最初可能未配置為發射顏色。相反地,所有四個子像素109(第一子像素110、第二子像素112、第三子像素114、和第四子像素116)的配置可能取決於四個子像素109中有多少個子像素有缺陷(例如由於亮度值低於子像素顏色閾值和/或由於有缺陷的微型LED),並基於分配給顏色的優先順序配置其餘可操作的子像素。例如,其中兩個子像素(第一子像素110和第四子像素116)可能由於有缺陷的微型LED而出現缺陷。在這個範例中,像素300的所有四個子像素109(第一子像素110、第二子像素112、第三子像素114、和第四子像素116)均可配置為獨立調節其輸出強度。 In some embodiments, the method of this disclosure can be understood with reference to Figures 3A and 3B. Figure 3A is a top view of the pixel array prior to the method of manufacturing a micro-LED display. Example pixel 300 includes micro-LEDs 106 coupled to a backplane 102. Micro-LEDs 106 are coupled to the backplane 102 via electrodes 108. Adhesive material 103 is disposed above the backplane 102, between the electrodes 108, between the micro-LEDs 106, and in a sub-pixel isolation (SI) structure 104. SI structure 104 defines a well 105 for at least four sub-pixels 109. Pixel 300 includes at least four sub-pixels 109, such as a first sub-pixel 110, a second sub-pixel 112, a third sub-pixel 114, and a fourth sub-pixel 116. In this example, all four subpixels 109 (first subpixel 110, second subpixel 112, third subpixel 114, and fourth subpixel 116) of two or more pixels 100A can be configured to independently adjust their output intensity. As shown in Figure 3A, all four subpixels 109 (first subpixel 110, second subpixel 112, third subpixel 114, and fourth subpixel 116) may not initially be configured to emit a color. Instead, the configuration of all four subpixels 109 (first subpixel 110, second subpixel 112, third subpixel 114, and fourth subpixel 116) may depend on how many of the four subpixels 109 are defective (e.g., due to brightness values below the subpixel color threshold and/or due to defective microLEDs), and the remaining operable subpixels are configured based on the priority assigned to colors. For example, two of the sub-pixels (first sub-pixel 110 and fourth sub-pixel 116) may be defective due to a defective microLED. In this example, all four sub-pixels 109 of pixel 300 (first sub-pixel 110, second sub-pixel 112, third sub-pixel 114, and fourth sub-pixel 116) can be configured to independently adjust their output intensity.
在一些實施例中,在將一或多個剩餘的可操作子像素配置為發射紅色以接近、達到或超過紅色子像素上色性閾值,或發射藍色以接近、達到或超過藍色子像素上色性閾值之前,可將一或多個剩餘的可操作子像素配置為發射綠色以接近、達到或超過綠色子像素上色性閾值。不受理論的束縛,當與藍色和/或紅色相比,使綠色優先可以提供增強的視覺外觀。 In some embodiments, one or more remaining operable subpixels may be configured to emit green to approach, reach, or exceed the chromaticity threshold of a red subpixel before configuring one or more remaining operable subpixels to emit red to approach, reach, or exceed the chromaticity threshold of a blue subpixel, or to emit blue to approach, reach, or exceed the chromaticity threshold of a blue subpixel. Without theoretical constraints, prioritizing green over blue and/or red can provide an enhanced visual appearance.
在一些實施例中,在將一或多個剩餘的可操作子像素配置為發射綠色以接近、達到或超過綠色子像素上色性閾值,或發射藍色以接近、達到或超過藍色子像素上色性閾值之前,可將一或多個剩餘的可操作子像素配置為發射紅色以接近、達到或超過紅色子像素上色性閾值。 In some embodiments, one or more remaining operable subpixels may be configured to emit red to approach, reach, or exceed the chromaticity threshold of a green subpixel before configuring one or more remaining operable subpixels to emit green to approach, reach, or exceed the chromaticity threshold of a blue subpixel.
在一些實施例中,在將一個或多個剩餘的可操作子像素配置為發射綠色以接近、達到或超過綠色子像素上色性閾值,或發射紅色以接近、達到或超過紅色子像素上色性閾值之前,可將一或多個剩餘的可操作子像素配置為發射藍色以接近、達到或超過藍色子像素上色性閾值。 In some embodiments, one or more remaining operable subpixels may be configured to emit blue to approach, reach, or exceed the chromaticity threshold of a green subpixel before configuring one or more remaining operable subpixels to emit green to approach, reach, or exceed the chromaticity threshold of a red subpixel, or to emit red to approach, reach, or exceed the chromaticity threshold of a red subpixel.
圖3B是製造後的像素350的一部分的頂視圖,顯示了採取步驟修復兩個缺陷子像素(子像素130和子像素136)後的像素300。雖然圖3B示出子像素填滿了綠色和紅色,但可以使用任何顏色來配置子像素。例如,當未達到藍色子像素顏色閾值時,可以利用藍色。 Figure 3B is a top view of a portion of the manufactured pixel 350, showing pixel 300 after steps were taken to repair the two defective subpixels (subpixels 130 and 136). Although Figure 3B shows the subpixels filled with green and red, any color can be used to configure the subpixels. For example, blue can be used when the blue subpixel color threshold is not reached.
如圖3B所示,由於微型LED有缺陷,其中兩個子像素(子像素130和子像素136)可能有缺陷。因此,像素300的第二子像素112或第三子像素114可以是用於單元內備用修復(ISR)的可用備用子像素,例如ISR子像素和/或用於單元內備用修復(ISR)的備用微型LED,例如ISR微型LED。在一些實施例中,在將一或多個剩餘的可操作子像素配置為發射紅色以接近、達到或超過紅色子像素上色性閾值,或發射藍色以接近、達到或超過藍色子像素上色性閾值(其中綠色子像素上色性閾值尚未達到或超過)之前,可將一或多個剩餘的可操作子像素配置為發射綠色以接近、達到或超過綠色子像素上色性閾值。像素350的第二子像素112最初未配置為發射顏色,但可以改為用於ISR並配置為發射綠色。另外或可替代地,第三子像素114亦可用於ISR(未示出)。 As shown in Figure 3B, due to defects in the microLEDs, two sub-pixels (sub-pixels 130 and 136) may be defective. Therefore, the second sub-pixel 112 or the third sub-pixel 114 of pixel 300 may be a usable backup sub-pixel for in-cell alternative repair (ISR), such as an ISR sub-pixel and/or a backup microLED for in-cell alternative repair (ISR), such as an ISR microLED. In some embodiments, one or more remaining operable sub-pixels may be configured to emit green to approach, reach, or exceed the chromaticity threshold of a red sub-pixel before configuring one or more remaining operable sub-pixels to emit red to approach, reach, or exceed the chromaticity threshold of a blue sub-pixel (wherein the chromaticity threshold of a green sub-pixel has not yet been reached or exceeded). The second sub-pixel 112 of pixel 350 was not initially configured to emit a color, but can be repurposed for the ISR and configured to emit green. Alternatively, the third sub-pixel 114 can also be used for the ISR (not shown).
在一些實施例中,在將一或多個剩餘的可操作子像素配置為發射綠色以接近、達到或超過綠色子像素上色性閾值,或發射藍色以接近、達到或超過藍色子像素上色性閾值(其中紅色子像素上色性閾值尚未達到或超過)之前,可將一或多個剩餘的可操作子像素配置為發射紅色以接近、達到或超過紅色子像素上色性閾值。像素350的第三子像素114最初未配置為發射顏色,但可以改為用於ISR並配置為發射紅色。另外或可替代地,第三子像素114亦可用於ISR(未示出)。 In some embodiments, one or more remaining operable subpixels may be configured to emit red to approach, reach, or exceed the chromaticity threshold of the green subpixel before configuring one or more remaining operable subpixels to emit green to approach, reach, or exceed the chromaticity threshold of the blue subpixel (wherein the chromaticity threshold of the red subpixel has not yet been reached or exceeded). The third subpixel 114 of pixel 350 is not initially configured to emit a color, but can be repurposed for ISR and configured to emit red. Alternatively, the third subpixel 114 may also be used for ISR (not shown).
在一些實施例中,可以參考圖4A和圖4B來理解本公開的方法。圖4A是根據第一實施例在製造微型LED顯示器的方法之前像素陣列400的一部分的頂視圖,顯示了四個像素(像素410、像素420、像素430、和像素440)的範例像素陣列400,其採用二乘二像素排列,其中四個像素(像素410、像素420、像素430和像素440)中的每一個均具有四個子像素109(第一子像素110、第二子像素112、第三子像素114、和第四子像素116)其採用二乘二子像素排列。在此範例中,四個像素(像素410、像素420、像素430、和像素440)中的每一個都包括耦接到背板102的微型LED 106。微型LED 106經由電極108耦接至背板102。黏合材料103設置在背板102上方、在電極108之間、在微型LED 106之間、及在SI結構104。SI結構104界定至少四個子像素109的阱105,例如第一子像素110、第二子像素112、第三子像素114、以及第四子像素116。 在此範例中,四個像素(像素410、像素420、像素430和像素440)中的所有四個子像素109(第一子像素110、第二子像素112、第三子像素114和第四子像素116)均可配置為獨立地調節其輸出強度。 In some embodiments, the method of this disclosure can be understood with reference to Figures 4A and 4B. Figure 4A is a top view of a portion of a pixel array 400 prior to a method of manufacturing a micro LED display according to a first embodiment, showing an exemplary pixel array 400 of four pixels (pixels 410, 420, 430, and 440) arranged in a 2x2 pixel arrangement, wherein each of the four pixels (pixels 410, 420, 430, and 440) has four sub-pixels 109 (a first sub-pixel 110, a second sub-pixel 112, a third sub-pixel 114, and a fourth sub-pixel 116) arranged in a 2x2 sub-pixel arrangement. In this example, each of the four pixels (pixels 410, 420, 430, and 440) includes a micro LED 106 coupled to a backplane 102. Micro-LEDs 106 are coupled to a backplane 102 via electrodes 108. An adhesive material 103 is disposed above the backplane 102, between the electrodes 108, between the micro-LEDs 106, and in an SI structure 104. The SI structure 104 defines a well 105 for at least four sub-pixels 109, such as a first sub-pixel 110, a second sub-pixel 112, a third sub-pixel 114, and a fourth sub-pixel 116. In this example, all four sub-pixels 109 (first sub-pixel 110, second sub-pixel 112, third sub-pixel 114, and fourth sub-pixel 116) of the four pixels (pixels 410, 420, 430, and 440) can be configured to independently adjust their output intensity.
如圖4A所示,像素陣列400的四個像素(像素410、像素420、像素430和像素440)共享相同的計畫初始配置。第一子像素110將配置為發射紅色,第二子像素112將配置為發射綠色,第三子像素114將配置為發射藍色,而第四子像素116將最初不配置為發射顏色。最初未配置的第四子像素116將,若第一子像素110、第二子像素112或第三子像素114因未達到或超過子像素顏色閾值和/或由於微型LED有缺陷而出現缺陷時,替代地充當用於單元內備用修復(ISR)的可用備用子像素。在像素陣列400中,像素440之一具有四個子像素109(在其四個子像素109中將被配置為發射紅色的第一子像素110、將被配置為發射綠色的第二子像素112、將被配置為發射藍色的第二子像素112),其中微型LED 106有缺陷,導致像素440的子像素140、子像素142和子像素144有缺陷。 As shown in Figure 4A, the four pixels (pixels 410, 420, 430, and 440) of pixel array 400 share the same initial planned configuration. The first sub-pixel 110 will be configured to emit red, the second sub-pixel 112 will be configured to emit green, the third sub-pixel 114 will be configured to emit blue, and the fourth sub-pixel 116 will initially not be configured to emit any color. The initially unconfigured fourth sub-pixel 116 will, alternatively, serve as a usable backup sub-pixel for in-cell backup repair (ISR) if the first sub-pixel 110, the second sub-pixel 112, or the third sub-pixel 114 is defective due to not reaching or exceeding the sub-pixel color threshold and/or due to defects in the microLED. In pixel array 400, one of pixel 440 has four sub-pixels 109 (among which a first sub-pixel 110 will be configured to emit red, a second sub-pixel 112 will be configured to emit green, and a second sub-pixel 112 will be configured to emit blue), where the micro-LED 106 is defective, resulting in defects in sub-pixels 140, 142, and 144 of pixel 440.
圖4B是在製造微型LED顯示器的方法之後的像素陣列450的一部分的頂視圖,顯示了在修復三個缺陷子像素(子像素140、子像素142、和子像素144)之後的陣列400。具有三個缺陷子像素(子像素140、子像素142和子像素144)的像素440的第四子像素116最初未配置為發射顏色,可用於ISR並配置為發射綠色。不受理論的束 縛,與藍色和/或紅色相比,將ISR配置為發出綠色可提供增強的視覺外觀。 Figure 4B is a top view of a portion of the pixel array 450 following the method of manufacturing a micro-LED display, showing the array 400 after repairing three defective sub-pixels (sub-pixels 140, 142, and 144). The fourth sub-pixel 116 of pixel 440, which has the three defective sub-pixels (sub-pixels 140, 142, and 144), was not initially configured to emit a color but is available for the ISR and configured to emit green. Regardless of theoretical constraints, configuring the ISR to emit green provides an enhanced visual appearance compared to blue and/or red.
可以評估像素陣列400中的像素440的相鄰、斜角(diagonal)或正交(即鄰近)像素(例如,像素410、420和430)是否存在尚未用於ISR的第四子像素116。如果發現第四子像素116,則可能會發生相鄰單元備用修復(NSR),並且可以替代地將可用的ISR配置為發射綠色、紅色、或藍色。例如,像素410、像素420、和像素430中的第四子像素116可用於紅色配置的NSR。作為進一步的範例,像素410、像素420、和像素430中的第四子像素116可用於藍色配置的NSR。 It can be evaluated whether there is a fourth sub-pixel 116 in pixel array 400 that is adjacent, diagonal, or orthogonal (i.e., neighboring) pixels (e.g., pixels 410, 420, and 430) to pixel 440 that has not yet been used for ISR. If the fourth sub-pixel 116 is found, adjacent cell spare repair (NSR) may occur, and the available ISR can be configured to emit green, red, or blue. For example, the fourth sub-pixel 116 in pixels 410, 420, and 430 can be used for a red-configured NSR. As a further example, the fourth sub-pixel 116 in pixels 410, 420, and 430 can be used for a blue-configured NSR.
雖然圖4B中未示出,但如果第四子像素116不適用於NSR以配置為發射藍色,則可以將像素100A的區域上的藍色產量與藍色子像素上色性閾值進行比較。如果像素100A的區域上的藍色產量等於或超過藍色子像素上色性閾值,則不修復缺陷藍色子像素並且不採取進一步措施。如果像素100A的區域上的藍色產量低於藍色子像素上色性閾值,則可以對缺陷藍色子像素進行物理修復。 Although not shown in Figure 4B, if the fourth sub-pixel 116 is not suitable for NSR configuration to emit blue, the blue production in the region of pixel 100A can be compared with the chromaticity threshold of the blue sub-pixel. If the blue production in the region of pixel 100A is equal to or exceeds the chromaticity threshold of the blue sub-pixel, the defective blue sub-pixel is not repaired and no further action is taken. If the blue production in the region of pixel 100A is lower than the chromaticity threshold of the blue sub-pixel, the defective blue sub-pixel can be physically repaired.
另外,如果第四子像素116不適用於NSR以配置為發射紅色,則可以將像素100A的區域上的紅色產量與紅色子像素上色性閾值進行比較。如果像素100A的區域上的紅色產量等於或超過紅色子像素上色性閾值,則不會修復缺陷紅色子像素。如果像素100A的區域上的紅色產量低於紅色子像素上色性閾值,則可以對缺陷紅色子像素進行物 理修復。無論像素100A的區域上的紅色產量是否等於或超過紅色子像素上色性閾值,或像素100A的區域上的紅色產量是否低於紅色子像素上色性閾值,都可以將像素100A的區域上的藍色產量與藍色子像素上色性閾值進行比較。如果像素100A的區域上的藍色產量等於或超過藍色子像素上色性閾值,則不修復缺陷藍色子像素並且不採取進一步措施。如果像素100A的區域上的藍色產量低於藍色子像素上色性閾值,則可以對缺陷藍色子像素進行物理修復。 Additionally, if the fourth sub-pixel 116 is not used with the NSR to be configured to emit red, the red production in the region of pixel 100A can be compared with the chromaticity threshold of the red sub-pixel. If the red production in the region of pixel 100A is equal to or exceeds the chromaticity threshold of the red sub-pixel, the defective red sub-pixel will not be repaired. If the red production in the region of pixel 100A is lower than the chromaticity threshold of the red sub-pixel, the defective red sub-pixel can be physically repaired. Regardless of whether the red production in the region of pixel 100A is equal to or exceeds the chromaticity threshold of the red sub-pixel, or whether the red production in the region of pixel 100A is lower than the chromaticity threshold of the red sub-pixel, the blue production in the region of pixel 100A can be compared with the chromaticity threshold of the blue sub-pixel. If the blue output in region 100A is equal to or exceeds the chromaticity threshold of the blue subpixel, the defective blue subpixel is not repaired and no further action is taken. If the blue output in region 100A is less than the chromaticity threshold of the blue subpixel, the defective blue subpixel can be physically repaired.
總體而言,本揭露的實施例通常涉及LED像素和製造LED像素的方法,該方法能夠重新排列顏色轉換層中的量子點沉積,以減少基於人類視覺敏感度對LED像素進行修復的需要。LED像素和製造LED像素的方法可以為個人提供類似的視覺品質,而無需對LED像素進行物理修復和/或更換。 In general, the embodiments disclosed herein typically relate to LED pixels and methods for manufacturing LED pixels that rearrange quantum dot deposits in a color conversion layer to reduce the need for LED pixel repair based on human visual sensitivity. The LED pixels and methods for manufacturing LED pixels can provide individuals with similar visual quality without requiring physical repair and/or replacement of the LED pixels.
雖然前述內容是針對本公開的實施例,但可在不脫離本公開的基本範疇的情況下設計本公開的其他和進一步的實施例,並且其中之範疇由隨附申請專利範圍來判定。 Although the foregoing content pertains to embodiments of this disclosure, other and further embodiments of this disclosure may be designed without departing from the basic scope of this disclosure, the scope of which is determined by the appended patent application.
100A:像素 104:子像素隔離(SI)結構 105:阱 109:子像素 110:子像素 112:子像素 114:子像素 115:顏色轉換材料 115a:顏色轉換材料 115b:顏色轉換材料 115c:顏色轉換材料 115d:顏色轉換材料 116:子像素 152:分割線 100A: Pixel 104: Subpixel Separation (SI) Structure 105: Well 109: Subpixel 110: Subpixel 112: Subpixel 114: Subpixel 115: Color Conversion Material 115a: Color Conversion Material 115b: Color Conversion Material 115c: Color Conversion Material 115d: Color Conversion Material 116: Subpixel 152: Divider Line
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