TWI906101B - Electronic system and method of glue path planning - Google Patents

Abstract

An electronic system including memory, processor for glue path planning, and coating device is provided. The coating device performs glue coating on a surface based on a sequence data. The processor receives a first glue weight, glue height, coating data, viscosity coefficient, and surface tension coefficient from the memory and a mode selection signal. Calculates a distance with one of at least three nodes as starting point based on the mode selection signal and the coating data. Calculates a second glue weight based on glue height, coating data, viscosity coefficient, surface tension coefficient, and the distance. When the second glue weight does not equal the first glue weight, modify the coating data. When the second glue weight equals the first glue weight, generates a planning result that indicates path planning is finished, and generates the sequence data based on the planning result and a optimization signal.

Description

Electronic system and adhesive path planning methods

This invention relates to adhesive path planning, and more particularly to an electronic system and method for adhesive path planning.

In modern manufacturing, coating technology is an indispensable part of the manufacturing process and is widely used in industries such as electronics and automobiles. The quality of coating and spraying processes directly affects many product properties, such as structural integrity, sealing, and durability. However, traditional coating pathways and the design of necessary parameters usually rely on manual operation, which is not only inefficient but also prone to increased costs due to the complexity of product design. Furthermore, the accuracy and consistency of spraying are difficult to control. In addition, some coating processes may require manual operation in high-risk environments or environments containing hazardous substances, which also increases the safety risks of operation. Therefore, a solution to this problem is needed.

In one embodiment, the invention provides an electronic system including a memory, a spraying device, and an adhesive path planning processor. The memory is configured to store a first adhesive weight, an adhesive height, multiple coating data, a viscosity coefficient, and a surface tension coefficient, wherein the coating data includes a spacing and at least one adhesive width. The spraying device is configured to spray adhesive onto a surface according to a sequence of data. The adhesive path planning processor is configured to: receive a first adhesive weight, adhesive height, coating data, viscosity coefficient, and surface tension coefficient; perform path planning based on at least three nodes located on the surface and the coating data, calculating a path length starting from one of the at least three nodes; calculate a second adhesive weight based on the adhesive height, coating data, viscosity coefficient, surface tension coefficient, and path length; and adjust the coating data when the second adhesive weight is not equal to the first adhesive weight.

Specifically, when the second glue weight equals the first glue weight, a planning result representing the end of path planning is generated, and the sequence data is generated based on the planning result and an optimization judgment signal.

When the coating data cannot yield a second glue weight equal to the first glue weight, the coating path planning processor outputs a planning failure signal indicating that the path planning has failed.

The adhesive path planning processor further includes a coverage path planning module, a frame path planning module, a first calculation module, a second calculation module, and a region order optimization module. The coverage path planning module corresponds to a spacing mode or a width mode corresponding to at least one adhesive width. The coverage path planning module is configured to determine whether to enter a width mode or a spacing mode based on the coating data and perform path planning when a mode selection signal indicates that coverage path planning is to be performed. A frame path planning module is configured to perform path planning when a mode selection signal indicates that frame path planning is to be performed. A first calculation module and a second calculation module are respectively coupled to the coverage path planning module and the frame path planning module, wherein the first calculation module and the second calculation module are configured to calculate a second glue weight. A region order optimization module is configured to generate the order data based on the planning results and optimization judgment signals.

In another embodiment, the present invention provides a method for adhesive path planning for spraying adhesive onto a surface. The method includes: receiving a first adhesive weight, an adhesive height, a viscosity coefficient, a surface tension coefficient, and multiple coating data; and performing [further steps] based on at least three nodes on the surface and the coating data. The path is planned, and a path length is calculated starting from one of at least three nodes; a second adhesive weight is calculated by a complex calculation module based on the adhesive height, coating data, viscosity coefficient, surface tension coefficient, and path length; and the coating data is adjusted when the second adhesive weight is not equal to the first adhesive weight.

Specifically, when the second glue weight equals the first glue weight, a planning result representing the end of path planning is output; and a regional order optimization calculation is performed based on an optimization judgment signal and the planning result to output a sequence data to a spraying device.

The coating data includes at least one glue width or one space.

Figure 1A is a schematic diagram of an electronic system 10 for applying adhesive according to an embodiment of the present invention, wherein the electronic system 10 includes a memory 20, a processing unit 30, and a spraying device 40. The memory 20 receives and stores multiple data from external sources (e.g., user input or pre-stored data), such as the weight G of the adhesive to be used, the adhesive height H, multiple coating data, and multiple physical parameters. The coating data includes an adhesive width W, an adhesive width range, and/or a spacing D, while the physical parameters include at least a viscosity coefficient η and a surface tension coefficient σ.

When the electronic system 10 needs to plan the adhesive application path, the processing unit 30 can read user-inputted or pre-stored data from the memory 20 and perform adhesive application path planning based on this data. In addition, the processing unit 30 receives a mode selection signal PRG and an optimization decision signal OPT from the outside. The mode selection signal PRG indicates the mode that the processing unit 30 needs to enter (e.g., cover path planning mode or frame path planning mode), and the optimization decision signal OPT indicates whether the processing unit 30 needs to perform area order optimization calculations.

If the processing unit 30 cannot complete the path planning based on the received data during the path planning process, it will output a planning failure signal FPRG. Conversely, when the path planning is completed, the processing unit 30 will output a sequence data OPRG, which may include the glue width W, the glue height H, the coating data, the physical parameters, and the path length and/or the glue spraying order (e.g., the result of the area order optimization calculation) obtained from the path planning (e.g., it can be calculated using an algorithm or the code stored in memory 20). Next, the spraying device 40 performs the user-specified or preset adhesive spraying operation according to the received sequence data OPRG.

Processing unit 30 may include a single processor or a plurality of processors. Furthermore, processing unit 30 may be a single-core processor or a multi-core processor, and may also include a general-purpose microprocessor, or a combination of a general-purpose microprocessor and a special-purpose processor, and/or related chipsets, such as an instruction-set processor, a special-purpose microprocessor, etc. Memory 20 may include random access memory (RAM), and may also include non-volatile memory, such as one or more disk storage devices, flash memory devices, or other non-volatile solid-state memory devices. However, the memory 20 and processing unit 30 of the present invention are not limited thereto.

Figure 1B is a schematic diagram of an adhesive path planning processor 100 described according to an embodiment of the present invention. The adhesive path planning processor 100 is an embodiment of the processing unit 30 in Figure 1A, and includes a path planning module 110, a region order optimization module 140, and a physical parameter module 150. The path planning module 110 includes a coverage path planning module 120 and a frame path planning module 130. As shown in Figure 1B, the adhesive path planning processor 100 receives adhesive weight G, adhesive height H, and other application data (including adhesive width W and/or spacing D) from external sources (e.g., user input into memory 20). The adhesive width W can be a range of adhesive widths. The physical parameter module 150 receives these physical parameters (e.g., viscosity coefficient η and surface tension coefficient σ) from memory 20 and provides them to the path planning module 110. Furthermore, the adhesive path planning processor 100 receives an externally received mode selection signal PRG and an optimization judgment signal OPT. The mode selection signal PRG will be sent to the path planning module 110 to determine the operation to be performed by the adhesive path planning processor 100.

For example, if the mode selection signal PRG indicates that a coverage path planning is currently required, the path planning module 110 will send the mode selection signal PRG to the coverage path planning module 120, and determine whether to operate in a one-width mode or a one-spacing mode based on the mode selection signal PRG and the input data (such as: glue weight G, glue width W, glue height H and/or spacing D). Specifically, based on the input data, the coverage path planning module 120 determines whether to operate in a specified glue width mode or a glue width search mode. Conversely, if the mode selection signal PRG indicates that frame path planning is currently required, the path planning module 110 will send the mode selection signal PRG to the frame path planning module 130 to operate in frame path planning mode. The operation flow and judgment method of glue width mode, spacing mode, specified glue width mode, glue width search mode, and frame path planning mode will be explained below with reference to Figures 3, 4A to 4C, and 5.

The covered path planning module 120 and the frame path planning module 130 respectively include calculation modules 125 and 135, which are used to calculate the adhesive weight based on the input data (such as: adhesive weight G, adhesive height H, adhesive width W and/or spacing D), the calculated data (such as: path length and/or adhesive width), viscosity coefficient η and surface tension coefficient σ. For example, when the adhesive path planning processor 100 is in the covered path planning mode, the calculation module 125 in the covered path planning module 120 will perform adhesive weight calculation, and after completing the adhesive weight calculation, the covered path planning module 120 will output a planning result SPRG1 to the area order optimization module 140. Alternatively, when the adhesive path planning processor 100 is in frame path planning mode, the calculation module 135 in the frame path planning module 130 performs adhesive weight calculation, and after completing the adhesive weight calculation, outputs a planning result SPRG2 to the area order optimization module 140 through the frame path planning module 130. Furthermore, in other embodiments, unlike those shown in Figure 1B, the calculation module 125 may not be integrated as part of the coverage path planning module 120, and the calculation module 135 may not be integrated as part of the frame path planning module 130.

Based on the optimization decision signal OPT, the area order optimization module 140 determines whether the current operation requires area order optimization calculation. For example, if the optimization decision signal OPT indicates that area order optimization calculation is not required at present (e.g., only a single area needs to be coated with adhesive), then the area order optimization module 140 will only perform spray path order optimization calculation for that single area. Conversely, if the optimization decision signal OPT indicates that area order optimization calculation is required at present (e.g., multiple areas need to be coated with adhesive), then the area order optimization module 140 will perform area order optimization calculation. The detailed process of the regional order optimization module 140 performing regional order optimization calculations will be explained in Figure 6 below.

In addition, if the coverage path planning module 120 and/or the frame path planning module 130 have completed the planning (e.g., the path planning has been completed and the calculation modules 125 and 135 have completed the glue weight calculation), the coverage path planning module 120 and the frame path planning module 130 will send the planning results SPRG1 and SPRG2 to the area order optimization module 140 respectively. Next, if the optimization decision signal OPT indicates that area order optimization calculation is required, the area order optimization module 140 will receive the planning results SPRG1 and SPRG2 from the coverage path planning module 120 and the frame path planning module 130, respectively. After performing the area order optimization calculation, the calculation result will be output as sequential data OPRG to the spraying device 40, such as a robotic arm, spray gun or other spraying tool, or other systems that can perform subsequent data processing or integration.

The path planning module 110, the region order optimization module 140, and the physical parameter module 150 may be composed of software (such as program sets, algorithms, etc.), firmware, and/or hardware (such as circuit components, transistors, etc.).

Figures 2A and 2B are respectively diagrams 200a and 200b of the adhesive application area distribution as described in the embodiments of the present invention, showing the distribution of areas on a surface to be coated with adhesive. The surface may consist of at least three nodes (e.g., at least three of nodes N1 to N27). As shown in Figure 2A, the areas to be covered by the spraying route planning are areas 210, 220, 230, and 240, indicated by dashed lines. Area 240 includes an area 245 that must be left blank (i.e., non-sprayed area). Nodes N1 to N27 represent the order in which the adhesive is sprayed during the process, that is, the order contained in the order data OPRG output by the region sequence optimization module 140. Starting from node N1 in region 210, spraying is performed according to the input adhesive weight G, adhesive width W, adhesive height H and/or spacing D, and after spraying is completed, the process moves to node N2 to start spraying region 220. No adhesive spraying occurs when moving between regions 210, 220, 230, and 240.

Next, the process moves from node N11 to node N12 to begin spraying region 230. The adhesive segment (represented by a solid box) extending the same width as the line connecting nodes N14 and N15 is defined as the adhesive width W. The distance between the adhesive segments connecting nodes N14 and N15 and the adhesive segments connecting nodes N16 and N17 is defined as the spacing D of this invention. Then, the process moves from node N17 to node N18 to begin spraying region 240. When the coating is sprayed to node N21, since area 245 does not need to be sprayed, it will be moved from node N21 to node N22, and then sprayed to node N27 to complete the coating of all areas.

This invention allows for the adaptive movement of the spraying device between nodes when spraying in a single area. For example, as shown in area 240 of Figure 2A, after passing through nodes N19, N20, and N21 from node N18, the spraying device will be lifted and moved to node N22 and then lowered, and spraying will continue from node N22. Compared to traditional path planning that requires one-stroke planning (e.g., spraying directly from node N21 through nodes N18, N19, and N20 to nodes N22 and N23, and so on, making the adhesive path in region 240 appear as one stroke, but the spraying direction from nodes N18 to N21 is different from that from nodes N22 to N27), the path planning of this invention makes the spraying direction consistent, thereby reducing the possible path planning and reducing complexity, thus saving planning time.

As shown in Figure 2B, this is the outline path planning for the area 250 to be sprayed, formed by nodes N28 to N41. Since this is an airtight adhesive spraying path, considering both sealing and structural integrity, a single-stroke spraying is required. Therefore, the spraying tool will start spraying from node N28 to node N41. The detailed outline path planning process will be explained below with reference to Figure 5.

Figure 3 is a schematic diagram of the adhesive path planning method 300 described according to an embodiment of the present invention. Referring to Figures 1B and 3, in step 302, the adhesive path planning processor 100 receives data from external sources (e.g., user input), such as adhesive weight G, adhesive width W, adhesive height H, spacing D, mode selection signal PRG, and/or optimization judgment signal OPT. Then, in step 304, the region order optimization module 140 determines whether to perform region order optimization calculation based on the optimization judgment signal OPT.

If step 304 is successful, proceed to step 306, where the mode selection signal PRG determines whether the current mode is coverage path planning or frame path planning. If coverage path planning is selected, proceed to step 308, where the adhesive path planning processor 100 activates the coverage path planning module 120 to perform coverage path planning. Then, proceed to step 310, where the coverage path planning module 120 determines whether the planning was successful. If so, the overlay path planning module 120 outputs the planning result SPRG1 to the region order optimization module 140 and proceeds to step 316. The region order optimization module 140 determines whether to perform region order optimization calculation based on the optimization judgment signal OPT. Conversely, if the overlay path planning module 120 determines that the planning has failed in step 310, it proceeds to step 312, where the overlay path planning module 120 outputs the planning failure signal FPRG to inform the user that the path planning cannot be completed with the currently input data (such as: glue weight G, glue width W, glue height H and/or spacing D). At this point, the adhesive path planning method 300 returns to step 302, waiting for the user to re-enter the data before starting the operation.

If step 316 determines that regional order optimization calculation is required, then proceed to step 320, where the regional order optimization module 140 determines whether route planning for each region has been completed. Since the regional order optimization module 140 has received the planning result SPRG1 (representing that the coverage route planning module 120 has completed route planning and the calculation module 125 has completed the glue weight calculation), proceed to step 322, where the regional order optimization module 140 performs regional order optimization calculation based on the planning result SPRG1, and then outputs the calculation result (i.e., the order data OPRG) in step 324. If step 316 determines that no region order optimization calculation is needed, then proceed to step 318, overwrite the path planning module 120 to output the planning result SPRG1 to the region order optimization module 140, so as to perform the spraying order optimization calculation for nodes in a single region and output the order data OPRG.

If step 306 determines that the frame path planning mode needs to be selected, then proceed to step 314, where the adhesive path planning processor 100 activates the frame path planning module 130 to perform frame path planning. Next, proceed to step 316, where the region order optimization module 140 determines whether to perform region order optimization calculation. If it is determined that it is necessary, then proceed to steps 320, 322, and 324. The region order optimization module 140 receives the planning result SPRG2 from the frame path planning module 130 and performs region path optimization calculation, generating order data OPRG and outputting it to the backend system. Conversely, if step 316 determines that no area order optimization calculation is needed, then step 318 is entered, and the frame path planning module 130 outputs the planning result SPRG2 to the area order optimization module 140 to perform the spraying order optimization calculation for nodes in a single area and output the order data OPRG.

Furthermore, if in step 304, the area order optimization module 140 determines that area order optimization calculation is not required based on the optimization judgment signal OPT, then proceed to step 320, where the area order optimization module 140 determines whether each area has been planned. Since the coverage path planning module 120 and the frame path planning module 130 have not yet started path planning, the area order optimization module 140 does not receive the planning result SPRG1 or SPRG2. Therefore, step 320 is determined to be negative, causing the adhesive path planning method 300 to proceed to step 306 and perform the path planning operation process as described above.

The planning results SPRG1 and SPRG2 output by the coverage path planning module 120 and the frame path planning module 130 respectively may include the input data (such as: glue weight G, glue width W, glue height H and/or spacing D), and the glue weight, glue width, spacing and/or path length calculated based on the input data, viscosity coefficient η and surface tension coefficient σ.

Figures 4A to 4C are flowcharts 400 illustrating a coverage path planning process performed by the coverage path planning module 120 according to embodiments of the present invention. The following will describe, with reference to Figure 3 and Figures 4A to 4C, the process of coverage path planning performed by the coverage path planning module 120 when the input data differs, through several embodiments.

In a first embodiment, assuming the input data includes glue weight G, glue width W, glue application height H, spacing D, mode selection signal PRG, and optimization judgment signal OPT, and the mode selection signal PRG indicates entry into the coverage path planning mode, while the optimization judgment signal OPT indicates that area order optimization calculation needs to be performed. Referring to step 304 in Figure 3, the glue application path planning processor 100 determines, based on the optimization judgment signal OPT, that the current operation requires area order optimization calculation. Next, referring to step 306 in Figure 3, the adhesive path planning processor 100 determines whether to enter the coverage path planning mode based on the mode selection signal PRG, and starts the coverage path planning module 120. At this time, referring to Figure 4A, flowchart 400 enters step 402, and the coverage path planning module 120 determines whether to enter the adhesive width mode or the spacing mode based on the input data (i.e., adhesive weight G, adhesive width W, adhesive height H, and spacing D). Since the input data includes the glue width W, the coverage path planning module 120 determines that the current operation has entered the glue width mode.

Next, proceed to step 410, where the overlay path planning module 120 determines whether to enter the specified glue width mode or the glue width search mode. Since the input data includes a specific glue width W, the overlay path planning module 120 determines that the current operation should enter the specified glue width mode. Then, proceed to step 414, where the overlay path planning module 120 calculates the path length using the following relationship based on the input glue width W, glue height H, and spacing D: Glue weight G = k‧W‧H‧path length ─ Equation (1) where k is a constant and the path length is related to the spacing D. Within the same area of adhesive application, a larger spacing D results in a shorter path length. Conversely, a smaller spacing D results in a longer path length.

Referring to Figure 4C, after the coverage path planning module 120 enters the specified adhesive width mode, it proceeds to step 424. The calculation module 125 calculates the adhesive weight based on the input adhesive width W, coating height H, spacing D, viscosity coefficient η, surface tension coefficient σ, and the calculated path length. Then, in step 426, the coverage path planning module 120 determines whether the calculated adhesive weight corresponds to the input adhesive weight G (e.g., comparing whether the calculated adhesive weight is equal to the input adhesive weight G, where "equal to" or "corresponds" here means that the difference between the calculated adhesive weight and the input adhesive weight G is ±5%). If the calculated glue weight corresponds to the input glue weight G, then in step 428, the path planning module 120 outputs the planned result (e.g., planning result SPRG1). If the glue weight calculated by the calculation module 125 does not correspond to the input glue weight G, then in step 430, the path planning module 120 outputs a planning failure signal FPRG to indicate to the user that the currently input glue width W, glue height H, and spacing D cannot achieve the desired glue weight G.

In a second embodiment, compared to the first embodiment, the user inputs a glue width range instead of a specific glue width W. Referring to Figure 4A, the overlay path planning module 120 determines in step 402 whether to enter glue width mode or spacing mode based on the input data (i.e., glue weight G, glue height H, spacing D, and glue width range). Since the input data includes the glue width range, the overlay path planning module 120 determines that the current operation is in glue width mode. Next, since the input data includes the glue width range, the coverage path planning module 120 determines that the current operation enters the glue width search mode. Then, in step 412, the coverage path planning module 120 selects a glue width within the input glue width range and calculates the corresponding path length based on the selected glue width and the input glue height H and spacing D.

Next, referring to Figure 4B, in step 416, corresponding to the calculated path length, the calculation module 125 calculates an adhesive weight based on the viscosity coefficient η, surface tension coefficient σ, adhesive height H, spacing D, and the selected adhesive width, and compares the calculated adhesive weight with the input adhesive weight G. If the calculated adhesive weight corresponds to the input adhesive weight G, the coverage path planning module 120 records the currently selected adhesive width as the available adhesive width. Then, in step 418, the coverage path planning module 120 searches for other adhesive widths within the range of the input adhesive width. If no other glue widths are available, proceed to step 420, where the path planning module 120 outputs all available glue widths as part of the planning result SPRG1 to the region order optimization module 140. If there are other unselected glue widths, proceed to step 422, where the path planning module 120 selects other glue widths and returns to step 416 to calculate and determine whether the selected glue width is an available glue width. In addition, if there is no available glue width within the input glue width range, the overlay path planning module 120 outputs a planning failure signal FPRG to indicate to the user that the currently input glue width range, glue height H, and spacing D cannot achieve the desired glue weight G.

Compared to the first embodiment, the adhesive width search mode provided in the second embodiment can more efficiently select the corresponding adhesive width within a certain range through iterative calculation, based on the input adhesive weight G, coating height H, spacing D, viscosity coefficient η, and surface tension coefficient σ. In this way, users do not need to repeatedly input different adhesive widths W to know which adhesive widths are available within the specified range under the input conditions of adhesive weight G, coating height H, and spacing D, thereby increasing the efficiency of path planning and reducing the planning costs.

In a third embodiment, compared to the first embodiment, it is assumed that the input data does not include the glue width W. Referring to Figure 4A, proceed to step 402, where the coverage path planning module 120 determines whether to enter the glue width mode or the spacing mode based on the input data (i.e., glue weight G, glue height H, and spacing D). Since the input data does not include the glue width W, the coverage path planning module 120 determines that the current operation should enter the spacing mode.

After entering the spacing mode, in step 404, the overlay path planning module 120 calculates the path length based on the input spacing D. Then, in step 406, the calculation module 125 calculates the corresponding adhesive width based on the input adhesive weight G, adhesive height H, spacing D, viscosity coefficient η, surface tension coefficient σ, and the calculated path length, and outputs the calculation result in step 408. If the calculation module 125 calculates the corresponding adhesive width, the overlay path planning module 120 outputs the planning result SPRG1 to the area order optimization module 140. If the corresponding glue width cannot be calculated, the overlay path planning module 120 outputs a planning failure signal FPRG to indicate to the user that, given the current glue weight G, glue height H, and spacing D, the usable glue width cannot be determined.

Figure 5 is a flowchart 500 illustrating the operation of the frame path planning module 130 as described in the embodiments of the present invention. In a fourth embodiment, it is assumed that the input data includes glue weight G, glue height H, mode selection signal PRG, and optimization judgment signal OPT, and the mode selection signal PRG indicates entry into frame path planning mode, while the optimization judgment signal OPT indicates that area order optimization calculation needs to be performed. Referring to step 304 in Figure 3, the glue path planning processor 100 determines, based on the optimization judgment signal OPT, that the current operation requires area order optimization calculation. Next, referring to step 306 in Figure 3, the adhesive path planning processor 100 determines the current frame path planning mode based on the mode selection signal PRG and activates the frame path planning module 130. At this time, referring to Figure 5, flowchart 500 proceeds to step 510, where the frame path planning module 130 performs area skeletonization on the area to be sprayed. For example, by capturing an image of the area to be sprayed (e.g., area 250 in Figure 2B), the frame lines to be sprayed can be marked and then extracted to obtain skeletonized line segments. Then, a drawing path is planned based on the key nodes on the line segment.

Then, proceeding to step 520, the frame path planning module 130 (or calculation module 135) calculates the adhesive width based on the input data (such as adhesive weight G, adhesive height H, etc.), the path length of the planned one-stroke drawing line, the viscosity coefficient η, and the surface tension coefficient σ. Next, proceeding to step 530, the frame path planning module 130 outputs the calculated adhesive width W as part of the planning result SPRG2 to the area order optimization module 140. If the optimization judgment signal OPT indicates that area order optimization calculation is required, then referring to steps 316, 320, 322 and 324 in Figure 3, the area order optimization module 140 performs order optimization on the planning areas of each frame path after receiving the planning result SPRG2, and outputs the order data OPRG to the back-end system.

Figure 6 is a flowchart 600 illustrating the operation of the region order optimization module 140 as described in the embodiments of the present invention. In step 610, the region order optimization module 140 calculates the distance between each node. Then, in step 620, the region order optimization module 140 optimizes the access order of each node. Referring to Figures 2A and 2B, for example, Figure 2A has regions 210, 220, 230, and 240 that are separated from each other by unpainted regions. At this point, the region order optimization module 140 can plan the region order based on the distances between each node (e.g., the distance between nodes N1 and N2, nodes N11 and N12, nodes N17 and N18, etc.) to achieve the most efficient and time-saving and/or cost-effective adhesive application path planning. Then, in step 630, the region order optimization module 140 outputs the results of the region order optimization calculation as order data OPRG.

The adhesive path planning processor and method proposed in this invention can determine the operation to be performed based on the data input by the user. Furthermore, this invention provides multiple path planning modes, so users can choose to input a specific numerical value or a range of values for path planning. Furthermore, since the adhesive path planning processor and adhesive path planning method proposed in this invention can consider both adhesive weight and adhesive width during the path planning stage, it is possible to quickly find the combination of adhesive parameters that can cover all areas, thereby reducing the time required for repeated trial and error by the user and speeding up the adhesive application process.

Furthermore, the adhesive path planning processor and adhesive path planning method proposed in this invention can avoid the problems of inconsistent adhesive application direction or unpredictable paths caused by traditional adhesive path planning algorithms when planning paths. For example, as shown in Figure 2A, in order to achieve a single-stroke path in traditional adhesive coating path planning calculations, the sequence traversed from node N17 to node N22 might be nodes N17, N21, N18, N19, N20, N22, followed by nodes N23, N24, ..., N27. This results in the spraying direction from node N18 to N22 being different from that from node N23 to N27, thus increasing the complexity and time required for path planning. However, by separating the path planning process from the region sequence optimization process, this invention avoids the aforementioned situation.

10: Electronic System 20: Memory 30: Processing Unit 40: Spraying Device 100: Adhesive Path Planning Processor 110: Path Planning Module 120: Coverage Path Planning Module 125, 135: Calculation Module 130: Frame Path Planning Module 140: Region Sequence Optimization Module 150: Physical Parameter Module G: Adhesive Weight W: Adhesive Width H: Adhesive Height D: Spacing η: Viscosity Coefficient σ: Surface Tension Coefficient PRG: Mode Selection Signal OPT: Optimization Judgment Signal FPRG: Planning Failure Signal SPRG1, SPRG2: Planning Results OPRG: Sequential Data; 200a, 200b: Coating Area Distribution Map; 210, 220, 230, 240, 245, 250: Areas; N1~N41: Nodes; 300: Coating Path Planning Method; 302~324, 402~430, 510, 520, 530, 610, 620, 630: Steps; 400, 500, 600: Flowchart

Figure 1A is a schematic diagram of an electronic system for adhesive spraying according to an embodiment of the present invention. Figure 1B is a schematic diagram of an adhesive path planning processor according to an embodiment of the present invention. Figures 2A and 2B are adhesive area distribution diagrams according to an embodiment of the present invention. Figure 3 is a schematic diagram of an adhesive path planning method according to an embodiment of the present invention. Figures 4A to 4C are flowcharts of a coverage path planning module according to an embodiment of the present invention for coverage path planning. Figure 5 is a flowchart of a frame line path planning module according to an embodiment of the present invention for frame line path planning. Figure 6 is a flowchart of a region order optimization calculation performed according to one of the region order optimization modules described in this embodiment of the invention.

20: Memory

40: Spraying device

100: Adhesive Path Planning Processor

110: Route Planning Module

120: Covers the route planning module

125, 135: Calculation Modules

130: Frame Path Planning Module

140: Regional Order Optimization Module

150: Physics Parameter Module

G: Glue weight

W: Glue Width

H: Coating height

D: Spacing

η: Viscosity coefficient

σ: Surface tension coefficient

PRG: Mode selection signal

OPT: Optimization Decision Signal

FPRG: Planning Failure Signal

SPRG1, SPRG2: Planning Results

OPRG: Sequential Data

Claims (14)

An electronic system includes: a memory configured to store a first adhesive weight, an adhesive height, multiple coating data, a viscosity coefficient, and a surface tension coefficient, wherein the coating data includes a spacing and at least one adhesive width; a spraying device configured to spray adhesive onto a surface according to a sequence of data; and an adhesive path planning processor configured to: receive the first adhesive weight, the adhesive height, the coating data, the viscosity coefficient, and the surface tension coefficient; Path planning is performed based on at least three nodes located on the surface and the coating data, calculating a path length starting from one of the at least three nodes; and a second adhesive weight is calculated based on the adhesive height, the coating data, the viscosity coefficient, the surface tension coefficient, and the path length; and when the second adhesive weight is not equal to the first adhesive weight, the coating data is adjusted. The electronic system as described in claim 1, wherein the surface includes: one or more sprayed areas, the one or more sprayed areas comprising the at least three nodes; and one or more non-sprayed areas located between the one or more sprayed areas. The electronic system as described in claim 1, wherein when the second adhesive weight equals the first adhesive weight, the adhesive path planning processor generates a planning result representing the end of path planning, and generates the sequence data based on the planning result and an optimization decision signal. The electronic system as described in claim 1, wherein when the coating data cannot yield a second adhesive weight equal to the first adhesive weight, the coating path planning processor outputs a planning failure signal representing a path planning failure. The electronic system as claimed in claim 1, wherein the adhesive path planning processor further comprises: a coverage path planning module configured to, upon a mode selection signal indicating that coverage path planning is being performed, determine, based on the coating data, whether to enter an adhesive width mode or a spacing mode and perform path planning; a frame line path planning module configured to perform path planning when the mode selection signal indicates that frame line path planning is being performed; A first calculation module and a second calculation module are respectively coupled to the coverage path planning module and the frame path planning module, wherein the first calculation module and the second calculation module are configured to calculate the second adhesive weight; and a region sequence optimization module is configured to generate the sequence data based on a planning result and an optimization judgment signal. The electronic system as described in claim 5, wherein the coverage path planning module enters the spacing mode corresponding to the spacing, or enters the adhesive width mode corresponding to the at least one adhesive width. The electronic system as described in claim 5, wherein the operation of the coverage path planning module entering the adhesive width mode based on the coating data includes: planning a path based on the at least one adhesive width and the spacing to calculate the path length; calculating the second adhesive weight using the first calculation module based on the at least one adhesive width, the spacing, the coating height, the viscosity coefficient, the surface tension coefficient, and the path length; and when the second adhesive weight equals the first adhesive weight, outputting the planning result to the area sequence optimization module to generate the sequence data, If the second adhesive weight, equal to the first adhesive weight, cannot be calculated from at least one adhesive width, the coverage path planning module outputs a planning failure signal, indicating that the first adhesive weight, the at least one adhesive width, the adhesive height, the spacing, the viscosity coefficient, and the surface tension coefficient cannot reach the first adhesive weight. The electronic system as described in claim 7, wherein when the second adhesive weight calculated by the first calculation module is equal to the first adhesive weight, the coverage path planning module records the at least one adhesive width corresponding to the second adhesive weight as the available adhesive width. The electronic system of claim 5, wherein the operation of the coverage path planning module entering the spacing mode based on the coating data includes: planning a path based on the spacing to calculate the path length; calculating at least one adhesive width using the first calculation module based on the spacing, the first adhesive weight, the coating height, the viscosity coefficient, the surface tension coefficient, and the path length to generate the planning result; and outputting the planning result to the area sequence optimization module to generate sequence data. The electronic system of claim 5, wherein the operation of the frame path planning module entering the frame path planning mode based on the coating data includes: planning the frame path based on one or more sprayed areas of the surface to calculate the path length; calculating the at least one adhesive width using the second calculation module based on the first adhesive weight, the adhesive height, the spacing, and the path length to generate the planning result; and outputting the planning result to the area sequence optimization module to generate sequence data. A method for adhesive path planning, used for spraying adhesive onto a surface, the method comprising: receiving a first adhesive weight, an adhesive height, a viscosity coefficient, a surface tension coefficient, and multiple coating data; planning a path based on at least three nodes on the surface and the coating data, and calculating a path length starting from one of the at least three nodes; calculating an adhesive weight using a multiple calculation module based on the adhesive height, the coating data, the viscosity coefficient, the surface tension coefficient, and the path length to generate a second adhesive weight; and When the weight of the second adhesive layer is not equal to the weight of the first adhesive layer, adjust the coating data. The adhesive path planning method as described in claim 11 further includes: determining, based on a mode selection signal, performing a coverage path plan or a frame path plan, wherein when the mode selection signal indicates that the coverage path plan is to be performed, determining, based on the coating data, to enter an adhesive width mode or a spacing mode and performing path planning. The adhesive path planning method as described in claim 11, wherein the operation of calculating the adhesive weight through the calculation module to generate the second adhesive weight further includes: when the second adhesive weight equals the first adhesive weight, outputting a planning result representing the end of path planning; and performing a region order optimization calculation based on an optimization judgment signal and the planning result to output order data to a spraying device. The adhesive path planning method as described in claim 11, wherein the coating data includes at least one adhesive width or one spacing.