TWI905585B - Touch device - Google Patents
Touch deviceInfo
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- TWI905585B TWI905585B TW112147690A TW112147690A TWI905585B TW I905585 B TWI905585 B TW I905585B TW 112147690 A TW112147690 A TW 112147690A TW 112147690 A TW112147690 A TW 112147690A TW I905585 B TWI905585 B TW I905585B
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Abstract
Description
本揭露是有關於一種觸控裝置。This disclosure relates to a touch device.
當前觸控裝置的發展趨勢是從單純觸控功能到觸控、力感測與觸覺反饋的整合。一種習知的觸控裝置是將力感測器設置在彈性構件(例如金屬支架)上,並將彈性構件固定至觸控電路板,例如台灣專利號第I773594號。然而,當習知的觸控裝置的設計於較大尺寸應用時,會面臨蓋板中央變形問題。The current trend in touch device development is from simple touch functionality to the integration of touch, force sensing, and haptic feedback. A conventional touch device places the force sensor on a flexible component (such as a metal bracket) and fixes the flexible component to the touch circuit board, for example, Taiwan Patent No. I773594. However, when conventional touch device designs are used in larger applications, they face the problem of deformation in the center of the cover.
因此,如何提出一種可解決上述問題的觸控裝置,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to develop a touch device that can solve the above problems is one of the issues that the industry is currently eager to address by investing research and development resources in.
有鑑於此,本揭露之一目的在於提出一種可有解決上述問題的觸控裝置。In view of this, one of the purposes of this disclosure is to provide a touch device that can solve the above problems.
為了達到上述目的,依據本揭露之一實施方式,一種觸控裝置包含電路板組件以及磁鐵組。電路板組件包含第一板體、第二板體以及複數個支撐單元。第一板體上設置觸控電極層。第二板體上設置線圈組。支撐單元支撐於第一板體與第二板體之間。磁鐵組設置於第一板體上,並與線圈組對應設置。To achieve the above objectives, according to one embodiment of this disclosure, a touch device includes a circuit board assembly and a magnet assembly. The circuit board assembly includes a first board, a second board, and a plurality of support units. A touch electrode layer is disposed on the first board. A coil assembly is disposed on the second board. The support units are supported between the first and second boards. The magnet assembly is disposed on the first board and corresponds to the coil assembly.
於本揭露的一或多個實施方式中,磁鐵組設置於第一板體面向第二板體的一側。線圈組位於第二板體面向第一板體的一側。In one or more embodiments disclosed herein, the magnet assembly is disposed on the side of the first plate facing the second plate. The coil assembly is located on the side of the second plate facing the first plate.
於本揭露的一或多個實施方式中,第二板體包含複數個彈臂部。支撐單元分別設置於彈臂部上。In one or more embodiments disclosed herein, the second plate includes a plurality of spring arms. Support units are respectively disposed on the spring arms.
於本揭露的一或多個實施方式中,第二板體具有複數個通槽。通槽分別臨接彈臂部的邊緣。In one or more embodiments disclosed herein, the second plate has a plurality of through slots. The through slots are respectively adjacent to the edges of the spring arm portion.
於本揭露的一或多個實施方式中,通槽呈U字型。In one or more embodiments disclosed herein, the through-slot is U-shaped.
於本揭露的一或多個實施方式中,觸控裝置進一步包含複數個力感測器。力感測器設置於第二板體面向第一板體的一側。In one or more embodiments disclosed herein, the touch device further includes a plurality of force sensors. The force sensors are disposed on the side of the second plate facing the first plate.
於本揭露的一或多個實施方式中,第二板體包含複數個彈臂部。力感測器分別設置於彈臂部上。In one or more embodiments disclosed herein, the second plate includes a plurality of spring arms. Force sensors are respectively disposed on the spring arms.
於本揭露的一或多個實施方式中,觸控裝置進一步包含殼體以及連接體。殼體位於第二板體下方。連接體連接於殼體與第二板體之間。連接體具有複數個凹陷。In one or more embodiments disclosed herein, the touch device further includes a housing and a connector. The housing is located below the second plate. The connector is connected between the housing and the second plate. The connector has a plurality of recesses.
於本揭露的一或多個實施方式中,觸控裝置進一步包含複數個力感測器。第二板體包含複數個彈臂部。力感測器分別設置於彈臂部上。凹陷對應設置於力感測器下方。In one or more embodiments disclosed herein, the touch device further includes a plurality of force sensors. The second plate includes a plurality of spring arms. Force sensors are respectively disposed on the spring arms. Recesses are correspondingly disposed below the force sensors.
於本揭露的一或多個實施方式中,連接體具有相反兩側。凹陷位於兩側中的至少一者上。In one or more embodiments of this disclosure, the connector has two opposite sides. A recess is located on at least one of the two sides.
於本揭露的一或多個實施方式中,觸控裝置進一步包含殼體以及連接體。殼體位於第二板體下方。連接體連接於殼體與第二板體之間。殼體面向連接體的表面具有複數個凹槽。In one or more embodiments disclosed herein, the touch device further includes a housing and a connector. The housing is located below the second plate. The connector is connected between the housing and the second plate. The surface of the housing facing the connector has a plurality of grooves.
於本揭露的一或多個實施方式中,觸控裝置進一步包含複數個力感測器。第二板體包含複數個彈臂部。力感測器分別設置於彈臂部上。凹槽對應設置於力感測器下方。In one or more embodiments disclosed herein, the touch device further includes a plurality of force sensors. The second plate includes a plurality of spring arms. The force sensors are respectively disposed on the spring arms. Recesses are correspondingly disposed below the force sensors.
綜上所述,於本揭露的觸控裝置中,電路板組件的內部設置有複數個支撐單元,因此可加強電路板組件的整體支撐性。此外,設置於電路板組件的磁鐵組也可進一步提升電路板組件的整體剛性。藉此,本揭露的觸控裝置於較大尺寸應用時,可以有效解決蓋板中央變形問題。In summary, in the touch device disclosed herein, the circuit board assembly has multiple support units internally, thus enhancing the overall support of the circuit board assembly. Furthermore, the magnet assembly disposed on the circuit board assembly further improves the overall rigidity of the circuit board assembly. Therefore, the touch device disclosed herein can effectively solve the problem of central deformation of the cover plate in larger-size applications.
以上所述僅係用以闡述本揭露所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本揭露之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above description is only used to illustrate the problem to be solved by this disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of this disclosure will be introduced in detail in the implementation method and related diagrams below.
以下將以圖式揭露本揭露之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本揭露。也就是說,在本揭露部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The following diagrams disclose several embodiments of this disclosure. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, these practical details are not necessary in some embodiments of this disclosure. In addition, for the sake of simplicity, some conventional structures and components will be shown in the diagrams in a simplified manner.
請參照第1圖,其為繪示根據本揭露一實施方式之觸控裝置100的示意圖。如第1圖所示,於本實施方式中,觸控裝置100包含主機110以及顯示器120以及觸控板模組。觸控板模組設置於主機110的殼體111 (即俗稱的C/D件)的容置槽111a內。觸控裝置100是以筆記型電腦為例,但本揭露不以此為限。於實際應用中,觸控裝置100亦可為以觸控板作為輸入或操作介面的其他電子產品(例如:個人數位助理、包含觸控板之鍵盤…等)。換言之,本揭露之觸控裝置100的概念可以應用於任何以觸控板作為輸入或操作介面的電子產品。以下將詳細說明觸控裝置100所包含的部分元件的結構、功能以及這些元件之間的連接與作動關係。Please refer to Figure 1, which is a schematic diagram illustrating a touch device 100 according to an embodiment of this disclosure. As shown in Figure 1, in this embodiment, the touch device 100 includes a host 110, a display 120, and a touchpad module. The touchpad module is disposed in a receiving slot 111a of the casing 111 (commonly known as the C/D component) of the host 110. The touch device 100 is exemplified by a laptop computer, but this disclosure is not limited thereto. In practical applications, the touch device 100 may also be other electronic products that use a touchpad as an input or operation interface (e.g., personal digital assistants, keyboards including touchpads, etc.). In other words, the concept of the touch device 100 disclosed herein can be applied to any electronic product that uses a touchpad as an input or operation interface. The structure, function, and connection and operation relationship between some of the components included in the touch device 100 will be described in detail below.
請參照第2圖,其為第1圖中之觸控裝置100沿著割面線2-2的局部剖面圖。如第2圖所示,於本實施方式中,觸控裝置100進一步包含蓋板130、電路板組件140以及磁鐵組160。蓋板130、電路板組件140與磁鐵組160設置於殼體111的容置槽111a內。蓋板130由容置槽111a的入口外露。電路板組件140設置於蓋板130下方,並經由黏合層150與蓋板130連接。電路板組件140還承載於容置槽111a的底部上,並經由連接體180與殼體111連接。電路板組件140包含第一板體141、第二板體142以及複數個支撐單元143。第一板體141上設置觸控電極層141a。第二板體142上設置線圈組142a。支撐單元143支撐於第一板體141與第二板體142之間。磁鐵組160設置於第一板體141上,並與線圈組142a對應設置。Please refer to Figure 2, which is a partial cross-sectional view of the touch device 100 in Figure 1 along section line 2-2. As shown in Figure 2, in this embodiment, the touch device 100 further includes a cover plate 130, a circuit board assembly 140, and a magnet assembly 160. The cover plate 130, the circuit board assembly 140, and the magnet assembly 160 are disposed within a receiving groove 111a of the housing 111. The cover plate 130 is exposed through the entrance of the receiving groove 111a. The circuit board assembly 140 is disposed below the cover plate 130 and is connected to the cover plate 130 via an adhesive layer 150. The circuit board assembly 140 is also supported on the bottom of the receiving groove 111a and is connected to the housing 111 via a connector 180. The circuit board assembly 140 includes a first board 141, a second board 142, and a plurality of support units 143. A touch electrode layer 141a is disposed on the first board 141. A coil assembly 142a is disposed on the second board 142. The support units 143 are supported between the first board 141 and the second board 142. A magnet assembly 160 is disposed on the first board 141 and corresponds to the coil assembly 142a.
前述結構配置可知,電路板組件140的內部(即第一板體141與第二板體142之間)設置有複數個支撐單元143,因此可加強電路板組件140的整體支撐性。此外,設置於電路板組件140的第一板體141上的磁鐵組160也可進一步提升電路板組件140的整體剛性。藉此,本實施方式的觸控裝置100於較大尺寸應用時,可以有效解決蓋板130中央變形問題。As can be seen from the aforementioned structural configuration, a plurality of support units 143 are provided inside the circuit board assembly 140 (i.e., between the first plate 141 and the second plate 142), thereby enhancing the overall support of the circuit board assembly 140. Furthermore, the magnet assembly 160 disposed on the first plate 141 of the circuit board assembly 140 can further improve the overall rigidity of the circuit board assembly 140. Therefore, the touch device 100 of this embodiment can effectively solve the problem of central deformation of the cover plate 130 when applied to larger sizes.
於一些實施方式中,觸控電極層141a配置以感測使用者利用手指或其他觸控工具在蓋板130上的觸控操作,並對應產生觸控訊號。In some embodiments, the touch electrode layer 141a is configured to sense touch operations performed by a user on the cover 130 using a finger or other touch tool, and generate a touch signal accordingly.
如第2圖所示,於本實施方式中,磁鐵組160設置於第一板體141面向第二板體142的一側。線圈組142a位於第二板體142面向第一板體141的一側。設置於第一板體141上的磁鐵組160與設置於第二板體142上的線圈組142a構成振動模組。振動模組配置以產生適當的振動加速度,以滿足使用者體驗。As shown in Figure 2, in this embodiment, the magnet assembly 160 is disposed on the side of the first plate 141 facing the second plate 142. The coil assembly 142a is located on the side of the second plate 142 facing the first plate 141. The magnet assembly 160 disposed on the first plate 141 and the coil assembly 142a disposed on the second plate 142 constitute a vibration module. The vibration module is configured to generate appropriate vibration acceleration to meet the user experience.
詳細來說,請參照第3圖,其為繪示第2圖中之線圈組142a與磁鐵組160的俯視圖。如第3圖所示,於本實施方式中,線圈組142a包含兩線圈單元142a1、142a2。兩線圈單元142a1、142a2電性連接。具體來說,兩線圈單元142a1、142a2的繞線方式相同,並採串聯的連接方式。線圈單元142a1包含兩直線束段142a11、142a12。直線束段142a11、142a12上下並排。線圈單元142a2包含兩直線束段142a21、142a22。直線束段142a21、142a22上下並排。磁鐵組160位於直線束段142a11、142a21下方的極性為N極。磁鐵組160位於直線束段142a12、142a22下方的極性為S極。舉例來說,當線圈單元142a1、142a2中的電流方向(如第3圖中的粗箭頭所指方向)為逆時針方向時,根據左手定則(即手心面朝向N極,四指指向電流方向,則大拇指的方向為導體的受力方向),直線束段142a11、142a12、142a21、142a22的受力方向皆為向上。相對地,當線圈單元142a1、142a2中的電流方向為順時針方向時,直線束段142a11、142a12、142a21、142a22的受力方向皆為向下。For details, please refer to Figure 3, which is a top view showing the coil assembly 142a and the magnet assembly 160 in Figure 2. As shown in Figure 3, in this embodiment, the coil assembly 142a includes two coil units 142a1 and 142a2. The two coil units 142a1 and 142a2 are electrically connected. Specifically, the two coil units 142a1 and 142a2 have the same winding method and are connected in series. Coil unit 142a1 includes two straight wire bundle segments 142a11 and 142a12. The straight wire bundle segments 142a11 and 142a12 are arranged side by side. Coil unit 142a2 includes two straight wire bundle segments 142a21 and 142a22. The straight coil segments 142a21 and 142a22 are arranged side by side, one above the other. The magnet assembly 160 located below the straight coil segments 142a11 and 142a21 has the N pole. The magnet assembly 160 located below the straight coil segments 142a12 and 142a22 has the S pole. For example, when the current direction in the coil units 142a1 and 142a2 (as indicated by the thick arrow in Figure 3) is counterclockwise, according to the left-hand rule (i.e., with the palm facing the N pole and the four fingers pointing in the current direction, the thumb's direction indicates the direction of the force on the conductor), the force direction in the straight coil segments 142a11, 142a12, 142a21, and 142a22 is upward. Conversely, when the current direction in coil units 142a1 and 142a2 is clockwise, the force direction of straight wire bundle segments 142a11, 142a12, 142a21, and 142a22 is downward.
由此可知,第2圖中的磁鐵組160與線圈組142a所構成的振動模組可以水平線性馬達的形式做動,但本揭露並不以此為限。請參照第4圖,其為繪示根據本揭露另一實施方式之觸控裝置200的局部剖面圖。如第4圖所示,本實施方式相較於第2圖所示的實施方式的差異處,在於本實施方式提供修改後的磁鐵組260。具體來說,藉由改變磁鐵組260的磁極方位,磁鐵組260與線圈組142a所構成的振動模組可以垂直線性馬達的形式做動。Therefore, it can be seen that the vibration module composed of the magnet assembly 160 and the coil assembly 142a in Figure 2 can operate as a horizontal linear motor, but this disclosure is not limited to this. Please refer to Figure 4, which is a partial cross-sectional view of a touch device 200 according to another embodiment of this disclosure. As shown in Figure 4, the difference between this embodiment and the embodiment shown in Figure 2 is that this embodiment provides a modified magnet assembly 260. Specifically, by changing the orientation of the magnetic poles of the magnet assembly 260, the vibration module composed of the magnet assembly 260 and the coil assembly 142a can operate as a vertical linear motor.
於一些實施方式中,線圈組142a為由第二板體142的上表面暴露出的內嵌線圈組142a層,但本揭露並不以此為限。In some embodiments, coil assembly 142a is an embedded coil assembly 142a layer exposed by the upper surface of the second plate 142, but this disclosure is not limited thereto.
於一些實施方式中,黏合層150為壓感膠層(Pressure Sensitive Adhesive,PSA),但本揭露並不以此為限。In some embodiments, the adhesive layer 150 is a pressure-sensitive adhesive (PSA) layer, but this disclosure is not limited to this.
於一些實施方式中,連接體180亦為壓感膠層,但本揭露並不以此為限。In some embodiments, connector 180 is also a pressure-sensitive adhesive layer, but this disclosure is not limited to this.
於一些實施方式中,支撐單元143具有降低震動噪音及有效釋放水平方向的震動應力的效果。為了達到前述效果,於一些實施方式中,支撐單元143的楊氏模量可在0.55 Mpa至0.8 Mpa的範圍,但本揭露並不以此為限。In some embodiments, the support element 143 has the effect of reducing vibration noise and effectively releasing horizontal vibration stress. In order to achieve the aforementioned effects, in some embodiments, the Young's modulus of the support element 143 may be in the range of 0.55 MPa to 0.8 MPa, but this disclosure is not limited thereto.
請參照第5圖,其為第2圖中之第二板體142及支撐單元143的上視圖。如第5圖所示,於本實施方式中,第二板體142包含複數個彈臂部142b。支撐單元143分別設置於彈臂部142b上。具體來說,第二板體142具有複數個通槽142c。通槽142c貫穿第二板體142,並分別臨接彈臂部142b的邊緣。由此可知,藉由將支撐單元143分別設置於第二板體142的彈臂部142b上,可以由彈臂部142b提供更佳的吸震或隔震效果。Please refer to Figure 5, which is a top view of the second plate 142 and support unit 143 in Figure 2. As shown in Figure 5, in this embodiment, the second plate 142 includes a plurality of spring arms 142b. Support units 143 are respectively disposed on the spring arms 142b. Specifically, the second plate 142 has a plurality of through slots 142c. The through slots 142c penetrate the second plate 142 and are respectively adjacent to the edges of the spring arms 142b. It can be seen that by disposing the support units 143 on the spring arms 142b of the second plate 142, the spring arms 142b can provide better shock absorption or vibration isolation effects.
於一些實施方式中,通槽142c呈U字型。換言之,彈臂部142b與通槽142c位於第二板體142的外緣以內,因此第二板體142得以保持完整外緣,從而使第二板體142除了彈臂部142b以外的部位的變形量獲得良好的控制。In some embodiments, the through groove 142c is U-shaped. In other words, the spring arm portion 142b and the through groove 142c are located within the outer edge of the second plate 142, so the second plate 142 can maintain an intact outer edge, thereby allowing good control over the deformation of the second plate 142 except for the spring arm portion 142b.
如第2圖所示,於本實施方式中,觸控裝置100進一步包含複數個力感測器170。力感測器170設置於第二板體142面向第一板體141面的一側。設置於第二板體142上的力感測器170配置以因應於電路板組件140的變形(例如因使用者按壓蓋板130)而產生力感測訊號。於實際應用中,當力感測器170產生力感測訊號時,電路板組件140可根據力感測訊號控制振動模組產生不同的振動力道,以提供觸覺反饋效果。As shown in Figure 2, in this embodiment, the touch device 100 further includes a plurality of force sensors 170. The force sensors 170 are disposed on the side of the second plate 142 facing the first plate 141. The force sensors 170 disposed on the second plate 142 are configured to generate force sensing signals in response to deformation of the circuit board assembly 140 (e.g., due to a user pressing the cover plate 130). In practical applications, when the force sensor 170 generates a force sensing signal, the circuit board assembly 140 can control the vibration module to generate different vibration forces according to the force sensing signal to provide tactile feedback.
於一些實施方式中,力感測器170為應變計,但本揭露並不以此為限。In some embodiments, the force sensor 170 is a strain gauge, but this disclosure is not limited thereto.
如第2圖與第5圖所示,於本實施方式中,力感測器170分別設置於彈臂部142b上。由於彈臂部142b較易於變形,因此設置於彈臂部142b上力感測器170可以有效地增加感測靈敏度。As shown in Figures 2 and 5, in this embodiment, force sensors 170 are respectively disposed on the spring arm portion 142b. Since the spring arm portion 142b is more easily deformed, the force sensors 170 disposed on the spring arm portion 142b can effectively increase the sensing sensitivity.
如第2圖所示,於本實施方式中,連接於殼體111與第二板體142之間的連接體180具有複數個凹陷181。並且,凹陷181對應設置於力感測器170下方。藉由凹陷181在力感測器170下方提供讓位空間,可以提供給電路板組件140向下變形的空間(特別是提供給彈臂部142b向下變形的空間)。As shown in Figure 2, in this embodiment, the connector 180 connecting the housing 111 and the second plate 142 has a plurality of recesses 181. Furthermore, the recesses 181 are correspondingly located below the force sensor 170. By providing clearance space below the force sensor 170 through the recesses 181, space can be provided for the circuit board assembly 140 to deform downwards (especially for the spring arm portion 142b to deform downwards).
如第2圖所示,於本實施方式中,連接體180具有相反兩側。凹陷181位於連接體180兩側上,但本揭露並不以此為限。於實際應用中,凹陷181可僅位於兩側中的其中一者上。As shown in Figure 2, in this embodiment, the connector 180 has two opposite sides. Recesses 181 are located on both sides of the connector 180, but this disclosure is not limited thereto. In practical applications, recesses 181 may be located on only one of the two sides.
如第2圖所示,於本實施方式中,殼體111面向連接體180的表面具有複數個凹槽111b。並且,凹槽111b對應設置於力感測器170下方。藉由凹槽111b在力感測器170下方提供讓位空間,可以提供給電路板組件140向下變形的空間(特別是提供給彈臂部142b向下變形的空間)。As shown in Figure 2, in this embodiment, the surface of the housing 111 facing the connector 180 has a plurality of grooves 111b. Furthermore, the grooves 111b are correspondingly disposed below the force sensor 170. By providing clearance space below the force sensor 170 through the grooves 111b, space can be provided for the circuit board assembly 140 to deform downwards (particularly for the spring arm portion 142b to deform downwards).
由以上對於本揭露之具體實施方式之詳述,可以明顯地看出,於本揭露的觸控裝置中,電路板組件的內部設置有複數個支撐單元,因此可加強電路板組件的整體支撐性。此外,設置於電路板組件的磁鐵組也可進一步提升電路板組件的整體剛性。藉此,本揭露的觸控裝置於較大尺寸應用時,可以有效解決蓋板中央變形問題。From the detailed description of the specific embodiments of this disclosure above, it is clear that in the touch device of this disclosure, the circuit board assembly has multiple support units inside, thus enhancing the overall support of the circuit board assembly. Furthermore, the magnet assembly disposed on the circuit board assembly can further improve the overall rigidity of the circuit board assembly. Therefore, the touch device of this disclosure can effectively solve the problem of central deformation of the cover plate when used in larger-size applications.
雖然本揭露已以實施方式揭露如上,然其並不用以限定本揭露,任何熟習此技藝者,在不脫離本揭露的精神和範圍內,當可作各種的更動與潤飾,因此本揭露的保護範圍當視後附的申請專利範圍所界定者為準。Although this disclosure has been made in practice as described above, it is not intended to limit this disclosure. Anyone skilled in the art may make various modifications and alterations without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the scope of the attached patent application.
100,200:觸控裝置 110:主機 111:殼體 111a:容置槽 111b:凹槽 120:顯示器 130:蓋板 140:電路板組件 141:第一板體 141a:觸控電極層 142:第二板體 142a:線圈組 142a1,142a2:線圈單元 142a11,142a12,142a21,142a22:直線束段 142b:彈臂部 142c:通槽 143:支撐單元 150:黏合層 160,260:磁鐵組 170:力感測器 180:連接體 181:凹陷 2-2:割面線 100, 200: Touchscreen Device 110: Main Unit 111: Housing 111a: Receiving Slot 111b: Recess 120: Display 130: Cover Plate 140: Circuit Board Assembly 141: First Plate 141a: Touch Electrode Layer 142: Second Plate 142a: Coil Assembly 142a1, 142a2: Coil Unit 142a11, 142a12, 142a21, 142a22: Straight Wire Harness Section 142b: Spring Arm Section 142c: Through Slot 143: Support Unit 150: Adhesive Layer 160, 260: Magnet Assembly 170: Force sensor 180: Connector 181: Recess 2-2: Truncation line
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為繪示根據本揭露一實施方式之觸控裝置的示意圖。 第2圖為第1圖中之觸控裝置沿著割面線2-2的局部剖面圖。 第3圖為繪示第2圖中之線圈組與磁鐵組的俯視圖。 第4圖為繪示根據本揭露另一實施方式之觸控裝置的局部剖面圖。 第5圖為第2圖中之第二板體及支撐單元的上視圖。 To make the above and other objects, features, advantages, and embodiments of this disclosure more apparent, the accompanying drawings are explained as follows: Figure 1 is a schematic diagram illustrating a touch device according to one embodiment of this disclosure. Figure 2 is a partial cross-sectional view of the touch device in Figure 1 along section line 2-2. Figure 3 is a top view illustrating the coil assembly and magnet assembly in Figure 2. Figure 4 is a partial cross-sectional view illustrating a touch device according to another embodiment of this disclosure. Figure 5 is a top view of the second plate and support unit in Figure 2.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic Storage Information (Please record in order of storage institution, date, and number) None International Storage Information (Please record in order of storage country, institution, date, and number) None
100:觸控裝置 111:殼體 111a:容置槽 111b:凹槽 130:蓋板 140:電路板組件 141:第一板體 141a:觸控電極層 142:第二板體 142a:線圈組 143:支撐單元 150:黏合層 160:磁鐵組 170:力感測器 180:連接體 181:凹陷 100: Touch device 111: Housing 111a: Receiving slot 111b: Recess 130: Cover plate 140: Circuit board assembly 141: First plate 141a: Touch electrode layer 142: Second plate 142a: Coil assembly 143: Support unit 150: Adhesive layer 160: Magnet assembly 170: Force sensor 180: Connector 181: Recess
Claims (11)
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| Application Number | Priority Date | Filing Date | Title |
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| TW112147690A TWI905585B (en) | 2023-12-07 | Touch device |
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| TW112147690A TWI905585B (en) | 2023-12-07 | Touch device |
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| TW202524276A TW202524276A (en) | 2025-06-16 |
| TWI905585B true TWI905585B (en) | 2025-11-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190079583A1 (en) | 2017-09-08 | 2019-03-14 | Immersion Corporation | Haptic Actuation Systems for a Touch Surface |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190079583A1 (en) | 2017-09-08 | 2019-03-14 | Immersion Corporation | Haptic Actuation Systems for a Touch Surface |
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