TWI903914B - Liquid-cooling and monitoring system and method - Google Patents

Abstract

A liquid-cooling and monitoring system includes a pump, a liquid-cooling pipeline, a cold plate, a liquid-cooling radiator, a plurality of temperature sensors and a microcontroller. The pump and the liquid-cooling pipe line are configured to transport coolant. The liquid-cooling radiator is in thermal contact with a power component. The plurality of temperature sensors are disposed at at least two different points on a liquid-cooling cooling path. The microcontroller is connected to the plurality of temperature sensors and the pump, and is configured to obtain at least one temperature difference between the at least two different points and the measured flow rate of the coolant, and obtain an estimated power consumption and an estimated temperature of the power component based on the at least one temperature difference, the measured flow rate, and specific heat capacity and density of the coolant, and control the rotation speed of the pump according to the estimated temperature to adjust the flow rate of the coolant.

Description

Water-cooled heat dissipation and monitoring system and method

This invention relates to a water-cooled heat dissipation and monitoring system and method.

As computer performance continues to improve, processor power consumption and heat generation also increase. To ensure stable processor operation, an efficient heat dissipation system is required. While traditional water-cooling systems offer some heat dissipation, they have limitations in controlling water cooling parameters and monitoring temperature, making it difficult to meet the demands of modern electronic devices for efficient, intelligent, and reliable heat dissipation systems.

In view of the above, the present invention provides a water-cooled heat dissipation and monitoring system and method.

A water-cooled heat dissipation and monitoring system according to an embodiment of the present invention includes a pump, water-cooled piping, a water-cooling block, a water-cooling radiator, multiple temperature sensors, and a microcontroller. The pump is used to deliver a coolant. The water-cooled piping is connected to the pump and is used to transport the coolant. The water-cooling block is connected to the water-cooled piping and is used to make thermal contact with a power element. The water-cooling radiator is connected to the water-cooled piping and is used to allow heat exchange between the coolant and the surrounding environment. The multiple temperature sensors are disposed at at least two different points on the water-cooling paths of the water-cooled piping and the water-cooling block. The microcontroller is connected to the plurality of temperature sensors and the pump, and is used to obtain at least one temperature difference between at least two different points and the measured flow rate of the coolant, and to obtain an estimated power consumption of the power element based on the at least one temperature difference, the measured flow rate, the specific heat capacity and density of the coolant, to obtain an estimated temperature of the power element based on the estimated power consumption and a preset power consumption-temperature meter, and to control the rotation speed of the pump to adjust the flow rate of the coolant based on the estimated temperature.

According to an embodiment of the present invention, a water-cooling heat dissipation and temperature monitoring method includes the following steps performed by a microcontroller: obtaining at least one temperature difference between at least two different points on a water-cooling path of a water-cooling pipe and a water-cooling head through multiple temperature sensors, wherein the water-cooling head is in thermal contact with a power element; obtaining an estimated power consumption of the power element based on the at least one temperature difference, a measured flow rate of coolant on the water-cooling path, and the specific heat capacity and density of the coolant; obtaining an estimated temperature of the power element based on the estimated power consumption and a preset power consumption-temperature meter; and controlling the rotation speed of a pump connected to the water-cooling pipe to adjust the flow rate of the coolant based on the estimated temperature.

With the above structure, the water-cooling heat dissipation and monitoring system and method disclosed in this application obtain at least one temperature difference by setting multiple temperature sensors on the water-cooling path. Based on this temperature difference, the measured flow rate, specific heat capacity, and density of the coolant, an estimated power consumption of the power element is obtained. Furthermore, based on the estimated power consumption and a preset power consumption-temperature table, an estimated temperature of the power element is obtained. The state of the power element can be estimated using water-cooling parameters without directly measuring the operating state of the power element. Moreover, the water-cooling heat dissipation and monitoring system and method of this application can adjust the flow rate of the coolant based on the aforementioned estimated power consumption/temperature, achieving precise monitoring and prediction of the coolant flow rate, power consumption, and temperature of the power element.

The above description of the contents of this disclosure and the following description of the implementation methods are intended to demonstrate and explain the spirit and principles of this invention, and to provide a further explanation of the scope of the patent application of this invention.

The following embodiments detail the features and advantages of this invention, the content of which is sufficient to enable anyone skilled in the art to understand the technical content of this invention and implement it accordingly. Furthermore, based on the content disclosed in this specification, the scope of the patent application, and the drawings, anyone skilled in the art can easily understand the relevant objectives and advantages of this invention. The following embodiments further illustrate the viewpoints of this invention, but are not intended to limit the scope of this invention in any way.

Figure 1 is a functional block diagram of a water-cooled heat dissipation and monitoring system according to an embodiment of the present invention. As shown in Figure 1, the water-cooled heat dissipation and monitoring system 1 may include a pump 11, water-cooled piping 12, a water-cooling head 13, a water-cooling radiator 14, multiple temperature sensors 15, and a microcontroller 16. The pump 11 is used to deliver a coolant. The water-cooled piping 12 is connected to the pump 11 and is used to deliver the coolant. The water-cooling head 13 is connected to the water-cooled piping 12 and is used to make thermal contact with a power element 20. The water-cooling radiator 14 is connected to the water-cooled piping 12 and is used to allow the coolant to exchange heat with the surrounding environment. Multiple temperature sensors 15 are disposed at at least two different points on the water cooling path of the water cooling pipe 12 and the water cooling head 13. A microcontroller 16 is connected to the multiple temperature sensors 15 and the pump 11 to obtain at least one temperature difference between the at least two different points and the measured flow rate of the coolant. Based on the at least one temperature difference, the measured flow rate, the specific heat capacity and density of the coolant, the microcontroller obtains an estimated power consumption of the power element 20. Based on the estimated power consumption and a preset power consumption-temperature meter, the microcontroller obtains an estimated temperature of the power element 20. Based on the estimated temperature, the microcontroller controls the rotation speed of the pump 11 to adjust the flow rate of the coolant.

The water cooling and monitoring system 1 of this invention can be used for intelligent water cooling and temperature monitoring of the power element 20. The power element 20 can be a processor in a computer device, such as a central processing unit (CPU), a graphics processing unit (GPU), or other high-power heat-generating components, which are not limited in this invention.

In this embodiment, the pump 11, water-cooling head 13, and water-cooling radiator 14 are connected via water-cooling piping 12 to form a water-cooling loop. The rotational speed of the pump 11 can be controlled to adjust the flow rate of the coolant in the cooling loop. The flow rate referred to in this invention can be the volumetric flow rate of the coolant, that is, the volume of coolant flowing per unit time. Generally speaking, pumps have several important specifications: flow rate, pressure, rotational speed, and horsepower, among which the flow rate is basically positively correlated with the rotational speed. Therefore, by controlling the rotational speed of the pump 11, the flow rate of the coolant can be adjusted. The water-cooling head 13 is in thermal contact with the power element 20 and is used to conduct the heat energy generated by the power element 20 into the coolant. The water radiator 14 is in thermal contact with the surrounding environment to cool the coolant carrying the heat energy of the power components 20. The water radiator 14 can be equipped with a fan to improve heat exchange efficiency, which will not be described in detail here. A temperature sensor 15 is used to measure the temperature at at least two different points (e.g., heat dissipation nodes N1 and N2) along the water cooling path. The temperature sensor 15 can be a contact or non-contact temperature sensor. For example, a contact temperature sensor can be installed in the water cooling path to measure the coolant temperature through direct contact with the coolant. A non-contact temperature sensor can be installed in a conduit corresponding to the water cooling pipe 12 or the water block 13 to indirectly measure the coolant temperature. The temperature sensor 15 mentioned above can be, for example, a resistance temperature sensor, an infrared temperature sensor, or any other type of temperature sensor, and this application does not limit it.

The microcontroller 16 is connected to the pump 11 and the temperature sensor 15, and may include one or more processing/control units with data receiving, recording, calculation, storage, and output functions. These processing/control units may be, for example, a microcontroller, a central processing unit, a graphics processing unit, a programmable logic controller (PLC), or any combination thereof. In this embodiment, the temperature sensor 15 may be installed at the inlet and outlet of the water cooling head 13 to measure the temperature change of the coolant before and after it is heated by the power element 20 as it passes through the water cooling head 13. When the temperature sensor 15 acquires temperature data, it can transmit the temperature data to the microcontroller 16. The microcontroller 16 can perform calculations based on this temperature data and further control the operation of the pump 11. Specifically, the microcontroller 16 can obtain the temperature difference between the at least two different points and the measured flow rate of the coolant, and obtain an estimated power consumption of the power element 20 based on the temperature difference, the measured flow rate, the specific heat capacity and density of the coolant, obtain an estimated temperature of the power element 20 based on the estimated power consumption and a preset power consumption-temperature meter, and control the rotation speed of the pump 11 to adjust the flow rate of the coolant based on the estimated temperature.

The aforementioned preset power consumption-temperature table can be pre-stored in the memory of the microcontroller 16, and records the correspondence between multiple preset ambient temperatures, multiple preset power consumptions of the power element 20, and multiple preset temperatures. For example, the preset power consumption-temperature table can record the preset temperature corresponding to a CPU preset power consumption of 200 watt-hours at room temperature. Thus, when the microcontroller 16 obtains the corresponding predicted temperature based on the predicted power consumption, it can increase the pump speed when the predicted temperature of the power element 20 is too high to improve the cooling effect; or decrease the pump speed when the predicted temperature is within a suitable range to save system power consumption.

In this embodiment, the microcontroller 16 can obtain the measured flow rate of the coolant based on the rotational speed of the pump 11. For example, the pump 11 may have a rotational speed-flow rate lookup table according to its own specifications, allowing the microcontroller 16 to obtain the measured flow rate of the coolant. Alternatively, the microcontroller 16 can also obtain the measured flow rate of the coolant through a flow meter. Furthermore, the microcontroller 16 can be connected to the power element 20 (CPU) or other components on the motherboard to obtain the measured power consumption of the power element 20; alternatively, the motherboard of the computer device may have a dedicated temperature sensor for the power element 20, and the microcontroller 16 can read the measured temperature of the power element 20 to obtain the measured power consumption. Further, after the microcontroller 16 obtains the measured power consumption and estimated power consumption of the power element 20, it can calculate the percentage of air bubbles in the water cooling cycle based on the measured power consumption and the estimated power consumption.

Please refer to Figure 2, which is a functional block diagram of a water-cooled heat dissipation and monitoring system according to another embodiment of the present invention. As shown in Figure 2, the water-cooled heat dissipation and monitoring system 1' in this embodiment further includes a vibration device 17 compared to the embodiment in Figure 1. The vibration device 17 is connected to the microcontroller 16 and is configured to correspond to the pump 11, water-cooled pipe 12, water-cooling head 13, or water-cooling radiator 14. Furthermore, the microcontroller 16 in this embodiment can be further used to actuate the vibration device 17 to remove bubbles in the water-cooling cycle when it is determined that the percentage of bubbles exceeds a preset threshold. For example, the vibration device 17 can be installed at any section of the pump 11, the water cooling pipe 12, the water cooling head 13, or the water cooling radiator 14 to generate vibration at the location where bubbles easily accumulate in the water cooling circulation, so as to remove bubbles.

Please refer to Figure 3, which is a schematic diagram illustrating a water-cooling heat dissipation and monitoring system according to another embodiment of the present invention, showing multiple temperature sensing elements configured on the water cooling path. As shown in Figure 3, multiple temperature sensors 15 can be set at multiple heat dissipation nodes N1 to N4 in multiple sub-regions A1 to A3 on the water cooling path, and the microcontroller can be used to obtain multiple temperature differences between these heat dissipation nodes N1 to N4, and obtain multiple estimated sub-power consumptions of the power element 20 in these sub-regions A1 to A3 based on these temperature differences. This figure omits multiple elements that are repeated in the embodiments of Figures 1 and 2, and focuses only on describing the multiple temperature sensors 15 set in multiple sub-regions of the power element 20 corresponding to the water cooling head 13. In this embodiment, among the multiple heat dissipation nodes along the cooling path, the coolant temperatures, from lowest to highest, are: first heat dissipation node N1, third heat dissipation node N3, fourth heat dissipation node N4, and second heat dissipation node N2. The microcontroller can obtain multiple estimated sub-power consumptions of the power element 20 in the first sub-region A1, second sub-region A2, and third sub-region A3 based on the temperature differences between these heat dissipation nodes. For example, the microcontroller can obtain the estimated sub-power consumption of the power element 20 in the first sub-region A1 based on the temperature difference between heat dissipation nodes N1 and N3. Thus, by placing multiple temperature sensors 15 on key heat dissipation nodes, the estimated power consumption of a specific area can be detected, achieving accurate local temperature monitoring. Furthermore, the sum of these estimated sub-power consumptions can be equal to the overall estimated power consumption of power element 20.

Please refer to Figure 4 in conjunction with Figure 1. Figure 4 is a flowchart illustrating a water-cooled heat dissipation and temperature monitoring method according to an embodiment of the present invention. As shown in Figure 4, the water cooling heat dissipation and temperature monitoring method may include the following steps executed by a microcontroller: Step S1: Obtaining at least one temperature difference between at least two different points on a water cooling path of a water cooling pipe and a water cooling head through multiple temperature sensors, wherein the water cooling head is in thermal contact with a power element; Step S3: Obtaining an estimated power consumption of the power element based on the at least one temperature difference, the measured flow rate of the coolant on the water cooling path, and the specific heat capacity and density of the coolant; Step S5: Obtaining an estimated temperature of the power element based on the estimated power consumption and a preset power consumption-temperature meter; and Step S7: Controlling the rotation speed of a pump connected to the water cooling pipe to adjust the flow rate of the coolant based on the estimated temperature.

As shown in Figure 1, in step S1, the microcontroller 16 can obtain at least one temperature difference between the heat dissipation nodes N1 and N2 on the water cooling path of the water cooling pipe 12 and the water cooling head 13 through multiple temperature sensors 15. In step S3, the microcontroller 16 can obtain an estimated power consumption of the power element 20 based on the at least one temperature difference, the measured flow rate of the coolant on the water cooling path, and the specific heat capacity and density of the coolant. Specifically, please refer to the following relationship (1).

Relationship (1): Estimated power consumption = measured flow rate × specific heat capacity × density × inlet and outlet water temperature difference.

The above relationship (1) specifically describes the estimated power consumption calculated under a water-cooled structure, given the measured flow rate, specific heat capacity, density of the coolant, and the inlet and outlet water temperature difference, where the estimated power consumption is the power consumption carried away by the coolant. Furthermore, when the power element 20 and the water cooling head 13 reach thermal equilibrium, this estimated power consumption can be the power consumption emitted by the power element 20. Therefore, the microcontroller 16 can obtain the estimated power consumption of the power element 20 through the temperature sensor 15 installed at the inlet and outlet. In addition to measuring the temperature of the coolant with the temperature sensor 15, the flow rate of the coolant can be obtained by converting the speed of the pump 11 or by measuring it with a flow meter, while the specific heat capacity and density of the coolant can be pre-stored in the memory of the microcontroller 16. In steps S5 and S7, the microcontroller 16 can obtain a predicted temperature of the power element based on the predicted power consumption and a preset power consumption-temperature meter; and control the rotation speed of the pump 11 connected to the water cooling pipe 12 according to the predicted temperature to adjust the flow rate of the coolant.

Please refer to Figure 5, which is a flowchart illustrating a water-cooled heat dissipation and temperature monitoring method according to another embodiment of the present invention. As shown in Figure 5, in this embodiment, the water-cooled heat dissipation and temperature monitoring method may further include: step S2: obtaining another temperature difference between the at least two different points at another time point; step S4: reading a measured power consumption of the power element through a software interface; and step S6: obtaining the estimated flow rate of the coolant based on the measured power consumption, the at least one temperature difference, the specific heat capacity and density of the coolant. Step S2 is similar to step S1; however, step S2 can be executed at any time point different from that of step S1, and subsequent steps S4 and S6 can be executed at the same or different time points as steps S3, S5, and S7 in Figure 4. This invention does not impose any restrictions on this. In step S4, the microcontroller 16 can read a measured power consumption of the power element 20 (CPU) through a software interface (e.g., Open Hardware Monitor). In step S6, the microcontroller 16 can calculate the estimated flow rate according to the following relationship (2). Specifically, equation (2) describes the estimated flow rate calculated under a water-cooled structure, given the measured power consumption, specific heat capacity, density and inlet/outlet water temperature difference of the coolant, where the inlet/outlet water temperature difference is another temperature difference obtained through step S2 above.

Relationship (2): Estimated flow rate = measurement power consumption / (specific heat capacity × density × inlet and outlet water temperature difference).

Please refer to Figure 6, which is a flowchart illustrating a water-cooling heat dissipation and temperature monitoring method according to another embodiment of the present invention. As shown in Figure 6, in this embodiment, the water-cooling heat dissipation and monitoring method may further include: step S4: reading a measured power consumption of the power element through a software interface; and step S8: calculating a bubble percentage in the water-cooling cycle based on the measured power consumption and the estimated power consumption. Step S4 may be performed at the same or different time points as any step in Figure 4, and step S8 may be performed after step S5 in Figure 4, which obtains the estimated temperature. Specifically, in step S8, the microcontroller may calculate the bubble percentage in the water-cooling cycle according to the following relationship (3).

Relationship (3): Bubble percentage = (1 - estimated power consumption / measured power consumption) × 100%.

After obtaining the percentage of bubbles in the water-cooling cycle, the microcontroller 16 can issue a warning message when it determines that the percentage of bubbles exceeds a preset threshold. Alternatively, as described in the embodiment of Figure 2, when the microcontroller 16 determines that the percentage of bubbles exceeds a preset threshold, it can actuate the vibration device 17 to vibrate the pump 11, water-cooling pipes 12, water-cooling head 13, or water-cooling radiator 14. Alternatively, when the microcontroller 16 determines that the percentage of bubbles exceeds the preset threshold, it can control the pump 11 to accelerate its operation to reduce the percentage of bubbles in the water-cooling cycle. Through this scheme of calculating and monitoring the percentage of bubbles in the water-cooling cycle, it is possible to ensure that the water-cooling system operates efficiently and increase the heat dissipation effect on power components. Furthermore, the processes of the various embodiments of the water cooling heat dissipation and monitoring methods shown in Figures 4 to 6 can be combined with each other. For example, step S4, which obtains the measured power consumption, can be executed at any time point of steps S1 to S7 in Figure 4, and after executing step S4, steps S6, which calculates the estimated flow rate, and steps S8, which calculate the percentage of bubbles, can be executed respectively.

Furthermore, the water-cooling heat dissipation and monitoring system and method of this case can also perform temperature prediction by obtaining specific operating information of the power element. Referring to Figure 1, in one embodiment, the microcontroller 16 can obtain application scenario information of the power element 20 through a software interface, and control the speed of the pump 11 to adjust the coolant flow rate according to the application scenario information, wherein the application scenario information includes screen refresh rate, screen resolution, and memory capacity. For example, the microcontroller 16 can pre-establish or store a correspondence between application scenario information and the power consumption/temperature of the power element 20. In this way, when the microcontroller 16 detects that the load on the power element 20 is large (e.g., running a game program with a high screen refresh rate, or a specific application scenario that loads a lot of information and consumes a lot of memory), it can first control the speed of the pump 11 to adjust the coolant flow rate and avoid the power element 20 from overheating.

Furthermore, the above-mentioned temperature prediction scheme can be trained using a big data model to enhance the accuracy of temperature prediction. Referring to Figure 1, in one embodiment, the microcontroller 16 can obtain an application scenario-temperature model between multiple historical temperature data and multiple historical scene data of the power element 20, obtain application scenario information of the power element 20 through a software interface, and control the rotation speed of the pump 11 according to the application scenario information and the application scenario-temperature model. The application scenario-temperature model is an application scenario-temperature curve generated by fitting the multiple historical scene data as training data and the multiple historical temperature data as label data through a regression method. For example, the aforementioned application scenario-temperature model can record the temperature change curve of the power element 20 over time during the execution of a specific program. In this way, the microcontroller 16 can more accurately adjust the flow rate of the coolant, optimizing the effects of water cooling and temperature monitoring.

With the above structure, the water-cooling heat dissipation and monitoring system and method disclosed in this application obtain at least one temperature difference by setting multiple temperature sensors on the water-cooling path. Based on this temperature difference, the flow rate, specific heat capacity, and density of the coolant, an estimated power consumption of the power element is obtained. Furthermore, based on the estimated power consumption and a preset power consumption-temperature table, an estimated temperature of the power element is obtained. The state of the power element can be estimated using water-cooling parameters without directly measuring the operating state of the power element. Moreover, the water-cooling heat dissipation and monitoring system and method of this application can adjust the flow rate of the coolant based on the aforementioned estimated power consumption/temperature, achieving precise monitoring and prediction of the coolant flow rate, power consumption, and temperature of the power element. In addition, this project can also utilize big data analysis technology to analyze the temperature change curve of specific application scenarios, achieve accurate temperature prediction, and adjust the heat dissipation strategy in advance based on the prediction results to ensure that electronic equipment always works within the optimal temperature range.

Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the invention. Any modifications and refinements made without departing from the spirit and scope of the present invention are within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached patent application.

1,1’: Water cooling heat dissipation and monitoring system; 11: Pump; 12: Water cooling piping; 13: Water block; 14: Water radiator; 15: Temperature sensing element; 16: Microcontroller; 17: Vibration device; 20: Power element; N1,N2,N3,N4: Heat dissipation nodes; A1,A2,A3: Sub-regions; S1-S7: Steps

Figure 1 is a functional block diagram of a water-cooling heat dissipation and monitoring system according to one embodiment of the present invention. Figure 2 is a functional block diagram of a water-cooling heat dissipation and monitoring system according to another embodiment of the present invention. Figure 3 is a schematic diagram of a water-cooling heat dissipation and monitoring system according to yet another embodiment of the present invention, in which multiple temperature sensing elements are arranged on the water cooling path. Figure 4 is a flowchart of a water-cooling heat dissipation and monitoring method according to one embodiment of the present invention. Figure 5 is a flowchart of a water-cooling heat dissipation and monitoring method according to another embodiment of the present invention. Figure 6 is a flowchart of a water-cooling heat dissipation and monitoring method according to yet another embodiment of the present invention.

1: Water-cooled heat dissipation and monitoring system

11: Bangpu

12: Water-cooled piping

13: Water Block

14: Water-cooled radiator

15: Temperature sensing element

16: Microcontroller

20: Power Components

N1, N2: Heat dissipation nodes (Note: The last part, "N1, N2: Heat dissipation nodes")

Claims (18)

A water-cooled heat dissipation and monitoring system includes: a pump for delivering a coolant; a water-cooled pipeline connected to the pump for delivering the coolant; a water-cooling head connected to the water-cooling pipeline for thermal contact with a power component; a water-cooling radiator connected to the water-cooling pipeline for heat exchange between the coolant and the surrounding environment; a plurality of temperature sensors disposed at at least two different points on the water-cooling path of the water-cooling pipeline and the water-cooling head; and A microcontroller, connected to the temperature sensors and the pump, is configured to obtain at least one temperature difference between the at least two different points and the measured flow rate of the coolant, and to obtain an estimated power consumption of the power element based on the at least one temperature difference, the measured flow rate, the specific heat capacity and density of the coolant, to obtain an estimated temperature of the power element based on the estimated power consumption and a preset power consumption-temperature meter, and to control the rotation speed of the pump to adjust the flow rate of the coolant based on the estimated temperature. The water-cooled heat dissipation and monitoring system as described in claim 1, wherein the microcontroller is further configured to obtain another temperature difference between the at least two different points at another time point, read a measured power consumption of the power element through a software interface, and obtain an estimated flow rate of the coolant based on the measured power consumption, the other temperature difference, the specific heat capacity of the coolant, and the density of the coolant. The water cooling and monitoring system as described in claim 1, wherein the microcontroller is further configured to read a measured power consumption of the power element through a software interface, and to calculate a bubble percentage in the water cooling cycle based on the measured power consumption and the estimated power consumption. The water cooling and monitoring system as described in claim 3, wherein the microcontroller is further configured to issue a warning message when it is determined that the percentage of bubbles exceeds a preset threshold. The water cooling heat dissipation and monitoring system as described in claim 3 further includes: a vibration device connected to the microcontroller and configured to correspond to the pump, the water cooling pipeline, the water cooling head, or the water cooling radiator; wherein the microcontroller is further configured to actuate the vibration device when it is determined that the percentage of bubbles exceeds a preset threshold. The water cooling and monitoring system as described in claim 3, wherein the microcontroller is further configured to control the pump to accelerate operation when it is determined that the percentage of bubbles exceeds a preset threshold, so as to reduce the percentage of bubbles in the water cooling cycle. The water-cooled heat dissipation and monitoring system as described in claim 1, wherein the temperature sensors are disposed at multiple heat dissipation nodes in multiple sub-regions on the water-cooling path, and the microcontroller is used to obtain multiple temperature differences of the heat dissipation nodes and obtain multiple estimated sub-power consumptions of the power element in the multiple sub-regions based on the temperature differences. The water cooling and monitoring system as described in claim 1, wherein the microcontroller is further configured to obtain application scenario information of the power element through a software interface, and control the speed of the pump to adjust the flow rate of the coolant based on the application scenario information, wherein the application scenario information includes screen refresh rate, screen resolution, and memory capacity. The water cooling and monitoring system as described in claim 1, wherein the microcontroller is further configured to obtain an application scenario-temperature model between multiple historical temperature data and multiple historical scenario data of the power element, obtain application scenario information of the power element through a software interface, and control the speed of the pump according to the application scenario information and the application scenario-temperature model, wherein the application scenario-temperature model is an application scenario-temperature curve generated by fitting the historical scenario data as training data and the historical temperature data as label data through a regression method. A water-cooling heat dissipation and monitoring method includes the following steps performed by a microcontroller: obtaining at least one temperature difference between at least two different points on a water-cooling path of a water-cooling pipe and a water-cooling head via multiple temperature sensors, wherein the water-cooling head is in thermal contact with a power element; obtaining an estimated power consumption of the power element based on the at least one temperature difference, a measured flow rate of coolant on the water-cooling path, and the specific heat capacity and density of the coolant; obtaining an estimated temperature of the power element based on the estimated power consumption and a preset power consumption-temperature meter; and controlling the rotation speed of a pump connected to the water-cooling pipe to adjust the flow rate of the coolant based on the estimated temperature. The water-cooled heat dissipation and monitoring method as described in claim 10 further includes: obtaining another temperature difference between the at least two different points at another time point; reading a measured power consumption of the power element through a software interface; and obtaining an estimated flow rate of the coolant based on the measured power consumption, the at least one temperature difference, the specific heat capacity of the coolant, and the density of the coolant. The water cooling heat dissipation and monitoring method as described in claim 10 further includes: reading a measured power consumption of the power element through a software interface; and calculating a bubble percentage in the water cooling cycle based on the measured power consumption and the estimated power consumption. The water-cooled heat dissipation and monitoring method as described in claim 12 further includes: issuing a warning message when it is determined that the percentage of bubbles exceeds a preset threshold. The water cooling heat dissipation and monitoring method as described in claim 12 further includes: when it is determined that the percentage of bubbles exceeds a preset threshold, actuating a vibration device to cause the pump, the water cooling pipeline, the water cooling head or a water cooling radiator to vibrate. The water cooling heat dissipation and monitoring method as described in claim 12 further includes: when it is determined that the percentage of bubbles exceeds a preset threshold, controlling the pump to accelerate operation in order to reduce the percentage of bubbles in the water cooling cycle. The water cooling heat dissipation and monitoring method as described in claim 10, wherein obtaining at least one temperature difference between at least two different points on the water cooling path comprises obtaining multiple temperature differences between multiple heat dissipation nodes in multiple sub-regions on the water cooling path, and obtaining the estimated power consumption based on the at least one temperature difference, the flow rate of the coolant, the specific heat capacity and the density comprises obtaining multiple estimated sub-power consumptions of the power element in the sub-regions based on the temperature differences. The water cooling heat dissipation and monitoring method as described in claim 10 further includes: obtaining application scenario information of the power element through a software interface, and controlling the speed of the pump to adjust the flow rate of the coolant based on the application scenario information, wherein the application scenario information includes screen refresh rate, screen resolution, and memory capacity. The water cooling heat dissipation and monitoring method as described in claim 10 further includes: obtaining an application scenario-temperature model between multiple historical temperature data and multiple historical scenario data of the power element, wherein the application scenario-temperature model is an application scenario-temperature curve generated by fitting the historical scenario data as training data and the historical temperature data as label data through a regression method; obtaining an application scenario information of the power element through a software interface, and controlling the rotational speed of the pump according to the application scenario information and the application scenario-temperature model.