TWI903800B - Ring structures and systems for use in a plasma chamber - Google Patents

Abstract

Systems and methods for securing an edge ring to a support ring are described. The edge ring is secured to the support ring via multiple fasteners that are inserted into a bottom surface of the edge ring. The securing of the edge ring to the support ring provides stability of the edge ring during processing of a substrate within a plasma chamber. In addition, the securing of the edge ring to the support ring secures the edge ring to the plasma chamber because the support ring is secured to an insulator ring, which is connected to an insulator wall of the plasma chamber. Moreover, the support ring and the edge ring are pulled down vertically using one or more clasp mechanisms during the processing of the substrate and are pushed up vertically using the clasp mechanisms to remove the edge ring and the support ring from the plasma chamber.

Description

Ring structure and system for plasma chambers

This invention relates to a ring, system, method, and structure for use in fixing a plasma chamber.

Plasma chambers are used to perform various processes on wafers. For example, plasma chambers are used to clean wafers, deposit materials on wafers, or etch wafers. Plasma chambers contain many components, such as various rings, which are used to process different parts of the wafer.

The embodiments described in this disclosure are presented herein.

In the described embodiment, the plasma chamber is provided with an edge ring and a support ring. In one embodiment, the edge ring is coupled to a support ring disposed below the edge ring. The edge ring is coupled to the support ring, for example, by a plurality of screws attached to the bottom side of the edge ring. To secure the support ring, a plurality of pull-down structures are coupled to the bottom side of the support ring, which pull down to keep the edge ring fixed during processing. If the edge ring is not properly secured during processing, the adhesive used to secure the edge ring is insufficient. One reason why adhesive alone is insufficient is that the high-temperature cycling within the plasma chamber reduces the adhesive force provided by the adhesive compound formed between the support ring and the edge ring. Furthermore, a constant force is applied to the compound, which may disintegrate over time. Therefore, it is desirable for the edge ring and support ring to remain in their original positions during substrate processing, even with reduced adhesive force and/or compound disintegration. For example, it is desirable for the edge ring to be fixed relative to the support ring during substrate processing. Otherwise, any displacement of the edge ring during substrate processing could lead to undesirable processes being performed on the substrate, or undesirable portions of the substrate being processed. In one embodiment, the bottom surface of the edge ring has slots, such as screw holes, for receiving multiple fasteners to connect the edge ring to the support ring during substrate processing. This helps prevent movement of the edge ring relative to the support ring.

In one embodiment, it is desirable for the edge ring to have one or more curved edges to reduce the likelihood of arcing when plasma is formed in the plasma chamber.

In another embodiment, it is desirable to provide a cover ring to surround an edge ring. The cover ring is further configured to have one or more curved edges to reduce the possibility of arcing when plasma is formed within the plasma chamber. Furthermore, the width of the cover ring is chosen such that the tracking distance along that width helps to achieve a stand-off voltage at the vertically oriented inner surface of the cover ring. For example, if the RF voltage dissipates within the cover ring in the range of approximately 7 volts (inclusive) to 10 volts per thousandth of an inch of cover ring, then a predetermined isolation voltage of 5000 volts (V) is achieved at the vertically oriented inner surface of the cover ring, the width of which corresponds to the tracking distance. The tracking distance is a multiple (such as two or three) of the isolation voltage and a ratio of voltage dissipation per unit length (such as one-thousandth of an inch) of the cover ring. In some embodiments, the width of the cover ring is the tracking distance provided by this ratio. In another embodiment, the surface length between the edge ring and the ground (e.g., along several stepped surfaces) defines the tracking distance.

In one embodiment, it is desirable that the support ring and the edge ring be fixed relative to the insulator ring located below the support ring. Otherwise, any torque on the support ring relative to the insulator ring would cause movement of the edge ring on top of the support ring. Movement of the edge ring is undesirable during substrate processing. Any displacement of the support ring during substrate processing could lead to undesirable processes being performed on the substrate, or undesirable portions of the substrate being processed. Furthermore, for maintenance or replacement of the support ring or the edge ring, or both the edge ring and the support ring, it is desirable that the support ring and the edge ring be easily removed.

In some embodiments, an edge ring for a plasma processing chamber is described. The edge ring has an annular shape surrounding a substrate support of the plasma processing chamber. The annular shape has a bottom side, a top side, an inner side, and an outer side. The edge ring has a plurality of fastener holes disposed along the bottom side within the annular shape. Each fastener hole has an inner surface for receiving the threads of a fastener used to attach the annular shape to a support ring. The edge ring further includes a step disposed on the inner side of the annular shape. The step has a lower surface separated from the upper surface of the top side by an angled surface. The edge ring has curved edges formed on the top surface and the outer side surface.

In several embodiments, a cover ring for a plasma processing chamber is described. The cover ring has an annular shape surrounding an edge ring and adjacent to a ground ring. The annular shape has an upper main body portion, a middle main body portion, and a lower main body portion. The middle main body portion defines a stepped reduction portion from the upper main body portion, such that the middle main body portion has a first annular width. The lower main body portion defines a stepped reduction portion from the middle main body portion, such that the lower main body portion has a second annular width smaller than the first annular width.

Among various embodiments, a system for securing a perimeter ring of a plasma chamber is described. The system includes a support ring with the perimeter ring oriented above it. The system further includes a colloidal layer disposed between a bottom surface of the perimeter ring and a top surface of the support ring. The system also includes a plurality of screws configured to secure the perimeter ring to the support ring. Each of the plurality of screws is attached to a screw hole disposed within the bottom surface of the perimeter ring and passing through the support ring. The system also includes a plurality of clamping rods connected to the bottom surface of the support ring. The system includes a plurality of pneumatic pistons. Each of the plurality of pneumatic pistons is coupled to an individual of the plurality of clamping rods.

Some advantages of the systems and methods described herein include providing edge rings with one or more non-sharp, curved edges. When plasma is formed within a plasma chamber, sharp edges (such as edges with a 90° angle) typically handle the arcing of RF power. One or more curved edges reduce the likelihood of such arcing.

A further advantage of the system and method is that the edge ring has one or more grooves, such as screw holes, for receiving fasteners, such as screws, for coupling the edge ring to the support ring. Even when the adhesive force provided by the adhesive between the edge ring and the support ring decreases, or the adhesive is consumed, or the adhesive breaks down due to forces applied to the adhesive during substrate processing, the coupling of the edge ring and the support ring fixes the edge ring relative to the support ring. Furthermore, the support ring is secured relative to the insulator ring by one or more clamping rods. Therefore, the edge ring is fixed relative to the insulator ring by the support ring, and thus the edge ring cannot be displaced during substrate processing. Such displacement lacks the ability to reduce (e.g., avoid) the possibility of performing any undesirable processes on the substrate, or to reduce the possibility of undesirable areas of the substrate being processed.

Additional advantages of this system and method include the provision of one or more mechanisms, such as one or more pneumatic mechanisms, for pulling down or pushing up the support ring by one or more clamping rods. Pulling down is performed during substrate processing to reduce the possibility of displacement of the support ring relative to the insulator ring. Therefore, due to the pull down, the edge ring and support ring remain fixed within the plasma chamber during multiple processing operations (e.g., from one processing operation to another) until they are replaced or removed from the plasma chamber for maintenance. Pushing up is performed to remove the edge ring or support ring for replacement or maintenance, such as cleaning.

Other advantages of the system and method described herein include providing the cover ring with one or more curved edges to reduce the possibility of arcing during plasma formation within the plasma chamber. Furthermore, the cover ring has an annular width to achieve voltage isolation at the vertically oriented inner surface of the cover ring, as described above.

Other implementations will become apparent from the following detailed descriptions in conjunction with the accompanying diagrams.

The following embodiments describe a system and method for fixing an edge ring within a plasma chamber. Obviously, the embodiments of the invention may be implemented without some or all of these specific details. Furthermore, well-known process operations are not described in detail to avoid unnecessarily obscuring the embodiments of the invention.

Figure 1 is a diagram of an embodiment of system 100 illustrating the manner in which an edge ring 108 is secured to a support ring 112, which is sometimes referred to herein as an adjustable edge sheath (TES) ring. System 100 includes an edge ring 108, a grounding ring 114, a base ring 116 (as shown in Figure 9G below), an insulator ring 106, a cover ring 118 (as shown in Figure 9G below), and a chuck 104. The edge ring 108 is made of a conductive material, such as silicon, boron-doped single-crystal silicon, alumina, silicon carbide, or a silicon carbide layer on top of an alumina layer, or an alloy of silicon, or a combination thereof. It should be noted that the edge ring 108 has a toroidal shape, such as a circle, a ring, or a disc. Furthermore, the support ring 112 is made of a dielectric material, such as quartz, ceramic, _alumina ( _Al₂O₃ ), or a polymer. For example, the support ring 112 has an inner diameter of approximately 12.5 inches, an outer diameter of approximately 13.5 inches, and a thickness of approximately 0.5 inches along the y-axis. For illustration, the support ring 112 has an inner diameter ranging from approximately 12.7 inches (inclusive) to approximately 13 inches, an outer diameter ranging from approximately 13.3 inches (inclusive) to approximately 14 inches, and a thickness ranging from approximately 0.5 inches (inclusive) to approximately 0.7 inches. This is just an example size for the plasma chamber used to process a 300mm wafer.

Furthermore, the insulator ring 106 is made of an insulating material such as a dielectric material, and the base ring 116 is also made of a dielectric material. The grounding ring 114 is made of a conductive material. The grounding ring 114 is coupled to a grounding potential. Examples of the chuck 104 include an electrostatic chuck. Each ring, such as the edge ring 108, the support ring 112, the grounding ring 114, the base ring 116, and the insulator ring 106, has a ring shape, such as a ring or a disc. The cap ring 118 is made of a dielectric material such as fused silica or a ceramic material such as _aluminum oxide ( _Al₂O₃ ) or yttrium _oxide ( _Y₂O₃ ). The cap ring 118 has a ring shape, such as a disc or ring shape.

The bottom surface of the edge ring 108 has a portion P1 coupled to the upper surface of the support ring 112 via a thermally conductive adhesive layer 110A, so that heat from the support ring 112 is dissipated to the edge ring 108. Examples of thermally conductive adhesives used herein include polyimide, polyketone, polyetherketone, polyether ether, polyethylene terephthalate, fluorinated ethylene-propylene copolymer, cellulose, triacetates, and silicone. Furthermore, the bottom surface of the edge ring 108 has another portion P2 coupled to the upper surface of the chuck 104 via a thermally conductive adhesive layer 110B. In addition, the bottom surface of the edge ring 108 also has another part P3 located above and adjacent to the base ring 116.

Edge ring 108 is located above base ring 116, support ring 112, and chuck 104. The bottom surface of edge ring 108 faces a portion of base ring 116, support ring 112, and chuck 104. Edge ring 108 also surrounds a portion of chuck 104, such as the top portion PRTN1. Support ring 112 surrounds a portion of chuck 104, and insulator ring 106 surrounds another portion of chuck 104. Base ring 116 surrounds a portion of insulator ring 106 and support ring 112. A cover ring 118 surrounds an edge ring 108 and a base ring 116. A grounding ring 114 surrounds a portion of the cover ring 118 and the base ring 116. A portion of the cover ring 118 is located above the grounding ring 114 and is arranged to the side adjacent to the grounding ring 114.

Edge ring 108 has multiple edges, such as edge 1, edge 2, edge 3, edge 4, edge 5, and edge 6. Edges 1 to 6 are curved, such as arc-shaped. For illustration, edges 1 to 6 have no sharp angles, have radii, and have smooth curves. It should be noted that in many embodiments, the radii of edges 1 to 6 are greater than the range of about 0.01 inches (inclusive) to about 0.03 inches. An edge radius of about 0.01 inches (inclusive) to about 0.03 inches reduces the possibility of edge breakage during semiconductor wafer fabrication. Fragmentation occurs during the processing of semiconductor wafers, producing particles.

In one embodiment, the edge ring 108 has a plurality of edges. In one embodiment, the edges defining the edge ring 108 are rounded. For example, edge 1 of the edge ring 108 is rounded to a radius of about 0.03 inches or greater, preferably greater than 0.07 inches. For illustration, edge 1 is rounded to have a radius ranging from about 0.03 inches (inclusive) to about 0.1 inches. As another example, edge 1 is rounded to have a radius ranging from about 0.07 inches (inclusive) to about 0.1 inches. Because edge 1 of edge ring 108 is close to ground ring 114, edge 1 of edge ring 108 is particularly prone to arcing. Due to the increased power level used in plasma processing operations, a high electric field will be generated between edge ring 108 and ground ring 114. Rounding edge 1 reduces the likelihood of such arcing. It has been determined that when the plasma chamber is in operation, a lower degree of rounding of these edges may not be sufficient to prevent or reduce the likelihood of arcing at RF power. The reduced likelihood of arcing due to the sharper feature edges within the plasma chamber may be detrimental to manufacturing processes performed on and above the semiconductor wafer. Slight edge rounding (e.g., edge 1 ranging from about 0.01 inches to about 0.03 inches) helps reduce the likelihood of grain generation or edge fragmentation during semiconductor wafer fabrication. Therefore, although some rounding is performed on the surface of the feature (e.g., edge 1) disposed within the plasma chamber, given the increased power level used in the plasma processing operation, this degree of rounding is less than that used to prevent or reduce arc discharge.

When plasma is formed within the plasma chamber where system 100 is located, the curved edges 1 to 6 reduce the possibility of fragmentation or arcing. It should be noted that edge 5 is less rounded than edge 1 to reduce the possibility of plasma ions entering the gap between edge 5 and chuck 104. For example, the radius of edge 5 is smaller than the radius of edge 1. As an example, edge ring 108 has an outer diameter ranging from approximately 13.6 inches (inclusive) to approximately 15 inches along the x-axis. As another example, edge ring 108 has an outer diameter ranging from approximately 13 inches (inclusive) to approximately 15 inches. As another example, the edge ring 108 has a thickness of approximately 0.248 inches measured along the y-axis. For illustration, the thickness of the edge ring 108 ranges from approximately 0.24 inches (inclusive) to approximately 0.256 inches. The x-axis is perpendicular to the y-axis. As the outer diameter of the edge ring 108 increases, the distance between the outer surface of the edge 1 adjacent to the edge ring 108 and the cover ring 118 decreases. When plasma is formed within the plasma chamber, the reduced distance decreases the likelihood of arcing of RF power between the edge ring 108 and the cover ring 118.

The edge ring 108 includes multiple grooves, such as groove 125, formed within its bottom surface. An example of a groove within the edge ring is a screw hole. Each groove surrounds a fastener hole, such as fastener hole 124A. The fastener hole does not extend entirely along the y-axis but along the length of the edge ring 108 to form a through-hole within the edge ring 108. Multiple fastener holes are formed within the bottom surface of the edge ring 108. An example of a fastener hole is a screw hole with helical threads for receiving a screw. Groove 125 has a top surface TS and a side surface SS. The top surface TS and the side surface SS are surfaces formed by drilling into the bottom surface of the edge ring 108. The side surface SS is substantially perpendicular to the top surface TS. For example, the side surface SS forms an angle with respect to the top surface TS, such as an angle between 85 degrees and 95 degrees. As another example, the side surface SS is perpendicular to the top surface TS. The top surface TS partially surrounds the fastener hole 124A, and the side surface SS partially surrounds the fastener hole 124A.

Furthermore, through-hole 132A is formed within the support ring 112 to receive fasteners 122, such as screws, bolts, or pins. Similarly, additional through-holes, such as through-hole 132A, are formed at other locations within the support ring 112 to accommodate multiple fasteners, such as fasteners 122, as described herein for coupling the support ring 112 to the edge ring. For example, three through-holes are formed within the support ring 112 at the vertices of an equilateral triangle in a horizontal plane along the x-axis. As another example, six or nine through holes are formed within the support ring 112, and the distance between one set of adjacent through holes is substantially equal to (e.g., equal to or within predetermined limits) the distance between another set of adjacent through holes. It should be noted that the set of adjacent through holes has at least one through hole that is different from at least one of the other sets of adjacent through holes.

Fastener 122 is made of a metal such as steel, aluminum, an alloy of steel, or an alloy of aluminum. Through hole 132A is formed to conform to the shape of fastener 122. For example, fastener 122 has a head portion with a diameter larger than the body of fastener 122. The lower portion of through hole 132A is formed to have a diameter slightly larger (e.g., a fraction of a millimeter) than the head portion of fastener 122. Furthermore, the upper portion of through hole 132A is formed to have a diameter slightly larger (e.g., a fraction of a millimeter) than the body of fastener 122. Additionally, the diameter of fastener hole 124A is slightly larger (e.g., a fraction of a millimeter) than the threaded portion of fastener 122. Furthermore, a space is formed along the y-axis between the top surface TS of the slot 125 and the tip of the fastener 122. An example of this space is a gap 1 ranging from approximately 0 mm (inclusive) to approximately 1 mm. Another example of gap 1 is a space ranging from approximately 0 mm (inclusive) to approximately 0.5 mm. Yet another example of gap 1 is a space ranging from approximately 0 mm (inclusive) to approximately 0.25 mm. The space of gap 1 is in the vertical direction along the y-axis. The space between the top surface TS of the slot 125 and the threaded portion of the fastener 122 ranges from approximately 0 mm (inclusive) to approximately 0.5 mm to reduce the possibility of arcing of RF power within the space. If arcing occurs, the fastener 122 may melt due to the heat generated by the arcing.

Fastener 122 is inserted into through hole 132A, such that the head and body of fastener 122 are located within support ring 112, and the threaded portion of fastener 122 is inserted into fastener hole 124A formed within edge ring 108. The space (such as gap 2) formed between the side surface of fastener 122 and the inner surface of support ring 112 ranges from about 0 mm (inclusive) to about 0.2 mm.

The support ring 112 has an embedded electrode EL for receiving radio frequency (RF) power from an RF signal received by an auxiliary RF generator via an auxiliary matching circuit (such as an impedance matching circuit).

In some embodiments, the support ring 112 is a coupling ring.

In many embodiments, fastener 122 is made of plastic.

In some embodiments, a double-sided conductive strip with conductive gel on both sides is used instead of a conductive gel layer. In many embodiments, interstitial beads with conductive gel are used instead of a conductive gel layer.

In some embodiments, instead of fastener holes with multiple threads, the fastener holes described herein, located within the bottom surface of the edge ring, are fitted with inserts, such as metal sleeves. For illustration, the metal sleeve is screwed into a groove formed within the bottom surface of the edge ring. The insert has threads on its inner surface. The fastener is then screwed into the threads of the insert, rather than into the threaded fastener hole.

Figure 2 is a diagram of an embodiment of system 200 illustrating the coupling of power pin 208 to support ring 112. System 200 includes an edge ring 228, a cover ring 201, a grounding ring 114, an insulator ring 106, a base ring 210, a device plate 224, a chuck 104, support ring 112, a bowl-shaped body 218, and an insulator wall 230. The insulator wall 230, as described herein, is the wall of the bias enclosure of the plasma chamber. The insulator ring 106 is fixed relative to the insulator wall 230, such as being non-movable. The grounding ring 114 is unpainted. Edge ring 228 is sometimes referred to herein as a thermal edge ring (HER). Edge ring 228 is made of the same material as edge ring 108 of Figure 1, except that edge ring 228 has a different shape than edge ring 108. As an example, edge ring 228 has an outer diameter ranging from about 13.6 inches (inclusive) to about 15 inches along the x-axis. As another example, edge ring 228 has an outer diameter ranging from about 13 inches (inclusive) to about 15 inches. As yet another example, edge ring 228 has a thickness of about 0.248 inches as measured along the y-axis. For illustration, the thickness of the edge ring 228 ranges from about 0.24 inches (inclusive) to about 0.256 inches. Multiple fastener holes (such as fastener hole 124A) in Figure 1 are formed within the edge ring 228 to secure the edge ring 228 to the support ring 112.

Furthermore, the cover ring 201 is made of the same material as the cover ring 118 in Figure 1, except that the cover ring 201 has a different shape than the cover ring 118. The cover ring 201 has a ring shape, such as a disc-shaped or ring-shaped ring. A portion of the cover ring 201 is located above and adjacent to the grounding ring 114, while another portion of the cover ring 201 is located adjacent to and above the base ring 210. Similarly, the base ring 210 is made of the same material as the base ring 116 in Figure 1, except that the base ring 210 has a different shape than the base ring 116.

A portion P5 of the edge ring 228 is coupled to the support ring 112 via a colloidal layer 110C to dissipate heat from the support ring 112 to the edge ring 228. Similarly, another portion P4 of the edge ring 228 is coupled to a portion of the chuck 104 via a colloidal layer 110C. The edge ring 228 surrounds the top portion PRTN1 of the chuck 104. Furthermore, another portion P6 of the edge ring 228 is a portion of the top surface adjacent to the base ring 210. Additionally, a cover ring 201 surrounds the edge ring 228. The support ring 112 is located below the edge ring 228 and surrounds a portion of the chuck 104. The insulator ring 106 is located below the support ring 112 and surrounds the bottom portion of the chuck 104. The base ring 210 is located below the cover ring 201 and surrounds a portion of the insulator ring 106. The grounding ring 114 surrounds a portion of the insulator ring 106 and the base ring 210. The bowl-shaped body 218 is located below the insulator ring 106. The insulator wall 230 is located below a portion of the insulator ring 106 and the grounding ring 114. The insulator wall 230 is made of insulating material.

The power feed passage 206 is inserted through a through-hole in the insulator ring 106 and a hole formed in the support ring 112. The power feed passage 206 is a sleeve made of an insulator such as plastic or ceramic to protect the power pin 208. The power pin 208 is located within the power feed passage 206. The power pin 208 is a conductive rod made of a metal such as aluminum or steel to conduct RF power to the support ring 112 or the electrode EL within the support ring 112. The tip of the power pin 208 contacts the electrode EL to provide RF power to the electrode EL. The middle part of the power feed passage 206 is enclosed within a mounting base 216A made of insulating material.

O-ring 214 is positioned above and adjacent to mounting base 216A to seal mounting base 216A against power feed passage 206. O-ring 214 surrounds the bottom portion of power feed passage 206. Examples of O-rings described herein are made of metals such as aluminum or steel. Additionally, another O-ring 204 is positioned at the top portion of power feed passage 206 to prevent air between power pin 208 and power feed passage 206 from entering the plasma chamber containing system 200. There is no vacuum between power pin 208 and power feed passage 206. O-ring 204 surrounds the top portion of power feed passage 206.

It should be noted that in some embodiments, multiple power pins are used. For example, two power pins are used to provide power to the electrode EL at multiple locations, and these power pins can be used with power pin feed passages, O-rings around the bottom portions of the power pin feed passages, and O-rings around the top portions of the power pin feed passages.

The stand-off RF voltage is generated from the RF power of the RF signal received from the auxiliary RF generator via auxiliary matching. The stand-off RF voltage has a traceable distance 213 from the vertically oriented inner surface 203 of the cover ring 201 to the ground ring 114. The stand-off RF voltage is generated via this traceable distance 213 from the vertically oriented inner surface 203 to the ground ring 114. It should be noted that in some embodiments, the ring width of the cover ring 201 is chosen such that the traceable distance 213 between the edge ring 228 and the ground ring 114 is sufficient to reduce the RF voltage loss from the edge ring 228 to the ground ring 114 to a predetermined value. For example, if the predetermined isolation voltage to be achieved at the vertically oriented inner surface 203 of the cover ring 201 is 5000 volts (V), and the cover ring 201 dissipates a voltage between 7 and 10 volts per thousandth of an inch, then the ring width of the cover ring 201 is chosen such that the traceable distance 213 or the ring width is a multiple of 5000 volts (such as two or three times) to 10 volts. For illustration, this ratio is (2 × 5000) / 10 volts. The traceable distance 213 lies in the x-y plane of the cross-section of the cover ring 201. The x-y plane is formed by the x-axis and the y-axis and lies between the x-axis and the y-axis.

In some embodiments, multiple power feed passages are coupled to the support ring 112 to provide RF power. Each power feed passage has a power pin.

In some embodiments, the grounding ring 114 is coated with a conductive material such as alumina to increase the conductivity of the grounding ring 114.

In many embodiments, the colloidal layer 110C is disposed at multiple locations along the lower surface of the edge ring 228 and along the upper surfaces of the support ring 112 and the chuck 104 to provide electrical and thermal conductivity between the edge ring 228 and the support ring 112 and between the edge ring 228 and the chuck 104.

Figure 3A is a diagram of an embodiment of system 300. Each hold-down rod 302A and 302B is inserted through a slot in the bottom surface 308 of the support ring 112. For example, hold-down rod 302A is inserted into the first slot in the bottom surface 308 at position L1 to secure the support ring 112 to the insulating ring 106 at position L1. Similarly, hold-down rod 302B is inserted into the second slot in the bottom surface 308 at position L2 to secure the support ring 112 to the insulating ring 106 at position L2. As another example, each clamping rod 302A and 302B has threads on its top portion, and the threads match the threads of the respective slots formed in the bottom surface 308. As yet another example, each clamping rod 302A and 302B has a spring-based retractable and extendable mechanism that retracts before being inserted into the respective slots in the bottom surface 308 and extends after insertion.

It should be noted that the dimensions of each through hole formed by the length measured along the y-axis of the support ring 112 vary with the outer diameter (OD) and inner diameter (ID) of the support ring 112. The inner diameter of the support ring 112 varies with the diameter of the chuck 104 in Figures 1 and 2.

In many embodiments, any number of clamping rods (such as two or more) are used to couple to the support ring 112.

Figure 3B is an isometric view illustrating the coupling between the clamping rod 302A and the bottom surface 308 of the support ring 112. A groove 330 is formed within the bottom surface, extending partially along the length of the support ring 112. The length of the support ring 112 is along the y-axis. The groove 330 is fitted with a receiver 332, which is made of a metal such as aluminum, steel, titanium, an alloy of aluminum, an alloy of steel, or an alloy of titanium. For example, the receiver 332 is attached to the surface of the groove 330 via an attachment mechanism such as a thread. To further illustrate, the groove 330 has threads that engage with the threaded receiver 332. The tip of the clamping rod 302A is inserted into the receiver 332 to engage with the receiver 332, thereby connecting the clamping rod 302A to the support ring 112.

Figure 4 is a side view of an embodiment of a system 900 for securing the edge ring 924 and the support ring 112 to the insulator ring 106. Examples of the edge ring 924 include the edge ring 108 of Figure 1 and the edge ring 228 of Figure 2. The system 900 includes a locking mechanism 920A, an insulator ring 106, a support ring 112, and an edge ring 924. The locking mechanism 920A includes a cylinder 912, a pneumatic piston 922, a threaded adapter 908, a pressing connector 906, and a mounting base 604A for mounting the clamping rod 302A to the insulator wall 230. Mounting base 604A is mounted to insulating wall 230 by multiple shoulder screws 902. Fastening mechanism 920A is coupled to multiple air fittings 914, including air fittings 914A and 914B located on one side of fastening mechanism 920A. The fastening mechanism described herein is made of metals such as steel, aluminum, steel alloys, or aluminum alloys. Furthermore, air fittings 914 are also made of metals such as steel, aluminum, steel alloys, or aluminum alloys.

Piston 922 has piston body 916 and piston rod 918. Piston body 916 is located within cylinder 912. Piston body 916 has a diameter larger than piston rod 918. Piston body 916 is integrated with or attached to piston rod 918. Mounting seat 604A is attached to cylinder 912 by a plurality of screws 910 on the top surface of cylinder 912. Thread adapter 908 is inserted into the center opening 930 of mounting seat 604A. Thread adapter 908 is fitted into a groove formed in the top surface of piston rod 918. Furthermore, thread adapter 908 has a slot for fitting press connector 906 into the slot. The push-button connector 906 is equipped with a clamping lever 302A, which is inserted through the center opening 930 of the mounting base 604A. The push-button connector 906 is attached to (e.g., tightened to) the bottom portion of the clamping lever 302A.

Similarly, another clamping rod 302B (FIG. 3A) is another pneumatic mechanism coupled to the locking mechanism 920B, which is described below. For example, the locking mechanism 920B includes a piston (such as piston 922) coupled to the clamping rod 302B to move the clamping rod 302B up and down in a vertical direction along the y-axis. The clamping rod 302A has a thread 932 at its tip for mating with a thread 934 corresponding to a groove 931 formed in the bottom surface 308 of the support ring 112. The top portion PR1 of the clamping rod 302A extends through the bottom surface of the support ring 112 into a groove within the support ring 112, while the middle portion PR2 of the clamping rod 302A extends through a through-hole within the insulator ring 106. Similarly, the top portion of the clamping rod 302B extends into a groove within the bottom surface of the support ring 112, while the middle portion of the clamping rod 302B extends into a through-hole within the insulator ring 106.

As described above, the support ring 112 is physically connected to the edge ring 924 via one or more fasteners. When air is supplied to the lower part of the cylinder 912 via the air fitting 914B, pressure is generated by the air below the lower surface of the piston body 916. Due to the pressure generated below the lower surface of the piston body 916, the piston 922 moves vertically upward along the y-axis to push the clamping rod 302A upward. When the clamping rod 302A is pushed upward, the support ring 112 rises vertically upward relative to the insulating ring 106. Simultaneously with the support ring 112, the edge ring 924 is also raised in a vertically upward direction away from the insulator ring 106. The support ring 112 and edge ring 924 are pushed vertically upward away from the insulator ring 106 to allow for removal of the support ring 112 and edge ring 924 from the plasma chamber. The support ring 112 and edge ring 924 are removed for replacement or repair of the support ring 112, or the edge ring 924, or a combination thereof.

On the other hand, when air is supplied to the upper part of cylinder 912 via air fitting 914A, pressure is generated by the air above the upper surface of piston body 916. Due to the pressure generated above the upper surface of piston body 916, piston 922 moves vertically downward along the y-axis to pull pressure rod 302A downward. When pressure rod 302A is pulled downward, support ring 112 is pulled downward relative to insulator ring 106 in a vertically downward direction. Simultaneously with support ring 112, edge ring 924 is also pulled downward toward insulator ring 106 in a vertically downward direction. During the processing of the substrate placed on the chuck 104, the support ring 112 and the edge ring 924 are pulled downward toward the insulator ring 106 to facilitate the processing of the substrate placed on the chuck 104.

Figure 5 is an isometric view of an embodiment of the fastening mechanism 920A. Figure 5 shows one of the screws 910 and the mounting base 604A.

Figure 6A is a diagram of an embodiment of system 1100, illustrating the synchronous pull-down of multiple clamping levers 302A and 302B (Figure 3A). System 1100 includes an air path 1102A, a locking mechanism 920A, a locking mechanism 920B, and a locking mechanism 920C. Locking mechanisms 920B and 920C have the same structure and function as locking mechanism 920A. As an example, each of locking mechanisms 920A to 920C has a double-acting cylinder. Locking mechanism 920B is connected to clamping lever 302B via a mounting bracket, while locking mechanism 920C is connected to clamping lever via a mounting bracket.

As described herein, the air path has multiple tubes, each made of an insulating material, such as a combination of plastics and plasticizers, or plastic alone. The air path is flexible and can be connected to the upper or lower part of the fastening mechanism 920A-920C.

Air path 1102A includes multiple pipes 1106A, 1106B, 1106C, 1106D, and 1106E. Pipes 1106A and 1106D are connected to pipe 1106B via connector C1, while pipes 1106B and 1106E are connected to pipe 1106C via connector C2. Each connector connecting the multiple pipes described herein has a hollow space to allow air passage through the hollow space. As an example, each connector connecting the multiple pipes is made of an insulating material.

Pipe 1106D is connected to the upper part 1104A of the fastening mechanism 920A via air fitting 914A (Figure 4). Similarly, pipe 1106E is connected to the upper part 1104C of the fastening mechanism 920B via air fitting (such as air fitting 914A), and pipe 1106C is connected to the upper part 1104E of the fastening mechanism 920C via air fitting (such as air fitting 914A).

Air is supplied to the upper part 1104A of the fastening mechanism 920A via pipe 1106A, connector C1, and pipe 1106D. Similarly, air is supplied to the upper part 1104C of the fastening mechanism 920B via pipe 1106A, connector C1, pipe 1106B, connector C2, and pipe 1106E. Furthermore, air is supplied to the upper part 1104E of the fastening mechanism 920C via pipe 1106A, connector C1, pipe 1106B, connector C2, and pipe 1106C. When the air system supplies air to the upper parts 1104A, 1104C, and 1104E, the piston system of the locking mechanism 920A-920C is synchronously pulled down along the y-axis (all at the same time) to make the support ring 112 (Fig. 4) and the edge ring 924 (Fig. 4) move toward the insulator ring 106 (Fig. 4).

As described below, multiple cylindrical seals surround the power pin 208, clamping rods 302A and 302B, and the temperature probe shaft. These cylindrical seals apply a force to the support ring 112 in a vertically upward direction along the y-axis. Clamping mechanisms 920A-920C counteract the upward force in the vertically upward direction to prevent the support ring 112 from lifting upward relative to the chuck in the vertical direction. Furthermore, clamping mechanisms 920A-920C apply a clamping force to the gel layers 110B and 110C (Figures 1 and 2) between the edge ring 924 and the chuck 104. The double-acting cylinder applies a constant force to the support ring 112 in a vertically upward or vertically downward direction, which is independent of the temperature of the support ring 112.

Figure 6B is a diagram of an embodiment of system 1150, used to illustrate the synchronous upward push of multiple clamping levers 302A and 302B (Figure 3A). System 1150 includes air path 1102B, clamping mechanism 920A, clamping mechanism 920B, and clamping mechanism 920C.

Air circuit 1102B includes multiple pipes 1106F, 1106G, 1106H, 1106I, and 1106J. Pipes 1106F and 1106I are connected to pipe 1106G via connector C3, while pipes 1106G and 1106J are connected to pipe 1106H via connector C4. Pipe 1106I is connected to the lower part 1104B of the fastening mechanism 920A via air fitting 914B (Figure 4). Similarly, pipe 1106J is connected to the lower part 1104D of fastening mechanism 920B via an air fitting (such as air fitting 914B), while pipe 1106H is connected to the lower part 1104F of fastening mechanism 920C via an air fitting (such as air fitting 914B).

Air is supplied to the lower part 1104B of the fastening mechanism 920A via pipe 1106F, connector C3, and pipe 1106I. Similarly, air is supplied to the lower part 1104D of the fastening mechanism 920B via pipe 1106F, connector C3, pipe 1106G, connector C4, and pipe 1106J. Furthermore, air is supplied to the lower part 1104F of the fastening mechanism 920C via pipe 1106F, connector C3, pipe 1106G, connector C4, and pipe 1106H. When the air system supplies air to the lower parts 1104B, 1104D, and 1104F, the piston system of the locking mechanism 920A-920C synchronously (all at the same time) pushes upward along the y-axis to move the support ring 112 (Fig. 4) and the edge ring 924 (Fig. 4) away from the insulator ring 106 (Fig. 4).

Figure 7 is a block diagram of an embodiment of system 1200 illustrating the supply of air to the locking mechanisms 920A to 920C. System 1200 includes multiple air compressors 1202A and 1202B, multiple air pressure regulators 1204A and 1204B, multiple orifices 1206A and 1206B, air lines 1102A and 1102B, and locking mechanisms 920A to 920C. Air compressor 1202A is coupled to the upper part of locking mechanisms 920A to 920C via regulator 1204A, orifice 1206A, and air line 1102A. Similarly, the air compressor 1202B is coupled to the lower part of the locking mechanism 920A to 920C via the regulator 1204B, the orifice 1206B, and the air line 1102B.

Air compressor 1202A compresses air to produce compressed air. The compressed air is supplied to air pressure regulator 1204A. Air pressure regulator 1204A controls (e.g., changes) the pressure of the compressed air to a predetermined air pressure and supplies compressed air with the predetermined air pressure through orifice 1206A and air line 1102A to the upper part of locking mechanism 920A. An example of the predetermined air pressure described herein is 28 pounds per square inch (psi). Other examples of preset air pressures, as described in this article, are air pressures ranging from 25 psi to 31 psi.

Similarly, air compressor 1202B compresses air to produce compressed air. The compressed air is supplied to air pressure regulator 1204B. Air pressure regulator 1204B controls (e.g., changes) the pressure of the compressed air to a predetermined air pressure, and supplies the compressed air with the predetermined air pressure to the lower part of the locking mechanism 920B through orifice 1206B and air line 1102B.

Figure 8A is an isometric view of an embodiment of the edge ring 228. The edge ring 228 has a top surface 1604. Figure 8A illustrates a perspective view of a plurality of fastener holes 124A, 124B, and 124C formed in the bottom surface 1612 of the edge ring 228.

In some embodiments, any other number of fastener holes (such as six or nine fastener holes) are formed within the bottom surface 1612 for assembling the same number of fasteners into the holes. For example, the distance between two adjacent holes in one set formed within the bottom surface 1612 of the edge ring 228 is the same as the distance between two adjacent holes in another set formed within the bottom surface 1612 of the edge ring 228. For illustration, either of the two adjacent holes in that set may be the same as or different from one of the two adjacent holes in the other set.

Figure 8B is a top view of an embodiment of the edge ring 228. The edge ring 228 has an inner diameter ID1 and an outer diameter OD1. The outer diameter OD1 ranges from about 13.6 inches (inclusive) to about 15 inches. As another example, the outer diameter OD1 ranges from about 13.6 inches (inclusive) to about 16 inches. As yet another example, the outer diameter OD1 ranges from about 12 inches (inclusive) to about 18 inches. When the outer diameter OD1 exceeds 13.6 inches (e.g., greater than 14 inches or close to 15 inches), the possibility of arcing of RF power between the edge ring 228 and the cover ring 118 is reduced. The inner diameter ID1 is the diameter of the inner periphery of the edge ring 228, while the outer diameter OD1 is the diameter of the outer periphery of the edge ring 228. The top surface 1604 is visible in the top view of the edge ring 228.

Figure 8C is a cross-sectional view of the edge ring 228 along the A-A cross-section depicted in Figure 8B. The edge ring 228 has a top surface 1604 (sometimes referred to herein as the top side) and a bottom surface 1612 (sometimes referred to herein as the bottom side). Both the top surface 1604 and the bottom surface 1612 are horizontally oriented surfaces. The top surface 1604 is sometimes referred to herein as the top side. The edge ring 228 further has an inner surface 1620 (sometimes referred to herein as the inner side) and an outer surface 1614 (sometimes referred to herein as the outer side). The outer surface 1614 is a vertically oriented surface. It should be noted that the edge ring 228 has a toroidal shape, such as a circle, a toroidal shape, or a disc shape.

The edge ring 228 has a step 1622, which includes an angled inner surface 1606 and a horizontally oriented inner surface 1608. The angled inner surface 1606 forms an angle A2 that is about 15° or about 50° relative to the vertically oriented inner surface 1610. In one embodiment, the angle A2 ranges between about 5° and about 55°. In another embodiment, the angle A2 ranges between about 12° and about 20°. In yet another embodiment, the angle A2 ranges between about 10° and about 20°. The angled inner surface 1606 is adjacent to the top surface 1604. For example, the angled inner surface 1606 forms a radius R3 relative to the top surface 1604. For illustration, the maximum radius R3 is approximately 0.01 inches. For example, a curve with a radius R3 is formed between an angled inner surface 1606 and a top surface 1604. As an example, the radius R3 ranges from approximately 0.009 inches (inclusive) to approximately 0.011 inches.

The horizontally oriented inner surface 1608 is adjacent to the angled inner surface 1606. For example, the horizontally oriented inner surface 1608 forms a radius R4 relative to the angled inner surface 1606. For illustration, the radius R4 is approximately 0.032 inches. For example, a curve with a radius R4 is formed between the horizontally oriented inner surface 1608 and the angled inner surface 1606. As an example, the radius R4 ranges from approximately 0.003 inches (inclusive) to approximately 0.0034 inches. The median diameter (MD) of the location on the edge ring 228 where the radius R4 is formed is approximately 11.858 inches. For example, the median diameter ranges from approximately 11.856 inches (inclusive) to approximately 11.86 inches.

As described herein, a horizontally oriented surface is substantially parallel to the x-axis, while a vertically oriented surface is substantially parallel to the y-axis. For example, a horizontally oriented surface forms an angle ranging from -5° to +5° relative to the x-axis, while a vertically oriented surface forms an angle ranging from -5° to +5° relative to the y-axis. To illustrate, a horizontally oriented surface is parallel to the x-axis and perpendicular to the y-axis, while a vertically oriented surface is parallel to the y-axis and perpendicular to the x-axis. Angular surfaces, as described herein, are neither vertically oriented nor horizontally oriented surfaces.

The horizontally oriented inner surface 1608 is separated from the top surface 1604 by an angled inner surface 1606. For example, the angled inner surface 1606 is adjacent to both the top surface 1604 and the horizontally oriented inner surface 1608, but the horizontally oriented inner surface 1608 is not adjacent to the top surface 1604.

Furthermore, the inner surface 1620 has a vertically oriented inner surface 1610 adjacent to a horizontally oriented inner surface 1608. For example, the vertically oriented inner surface 1610 forms a radius R5 relative to the horizontally oriented inner surface 1608. For illustration, a curve with radius R5 is formed between the vertically oriented inner surface 1610 and the horizontally oriented inner surface 1608. As an example, the radius R5 is approximately 0.012 inches. For illustration, the radius R5 ranges from approximately 0.007 inches (inclusive) to approximately 0.017 inches. The distance d3 along the y-axis of the vertically oriented inner surface 1610 is approximately 0.0169 inches. For example, the distance d3 ranges from approximately 0.0164 inches (inclusive) to approximately 0.0174 inches. The distance of the vertically oriented surface is the length along the y-axis in the vertical direction of the vertically oriented surface. Furthermore, the distance of the horizontally oriented surface is the width of the horizontally oriented surface along the x-axis in the horizontal direction. Additionally, the distance of the angled surface is measured in the vertical direction along the y-axis. The vertically oriented inner surface 1610 has an inner diameter ID1 of approximately 11.7 inches. For example, the inner diameter ID1 ranges from approximately 11 inches (inclusive) to approximately 12.4 inches.

Furthermore, the inner surface 1620 has an angled inner surface 1618 that is angled relative to the vertically oriented inner surface 1610 and the bottom surface 1612. The angled inner surface 1618 is adjacent to the vertically oriented inner surface 1610. For example, the angled inner surface 1618 forms a radius R6 relative to the vertically oriented inner surface 1610. For illustration, a curve with a radius R6 is formed between the angled inner surface 1618 and the vertically oriented inner surface 1610. As an example, the radius R6 is approximately 0.015 inches. For illustration, the radius R6 ranges from approximately 0.0149 inches (inclusive) to approximately 0.0151 inches. Furthermore, the angled inner surface 1618 is adjacent to the bottom surface 1612. For example, the angled inner surface 1618 forms a radius R7 relative to the bottom surface 1612. For illustration, a curve with radius R7 is formed between the angled inner surface 1618 and the bottom surface 1612. As an example, radius R7 is approximately twice the radius R6. For illustration, radius R6 ranges from approximately 2 × 0.0149 inches (inclusive) to approximately 2 × 0.0151 inches.

The angled inner surface 1618 has a length d2 of approximately 0.035 inches. For example, the length d2 ranges from approximately 0.0345 inches (inclusive) to approximately 0.0355 inches. The angled inner surface 1618 forms an angle A1 of approximately 30° relative to the vertically oriented inner surface 1610. For example, the angle A1 ranges from approximately 28° (inclusive) to approximately 32°. Note that the combination of the angled inner surface 1606, the horizontally oriented inner surface 1608, the vertically oriented inner surface 1610, and the angled inner surface 1618 is sometimes referred to herein as the inner side of the edge ring 228.

The outer surface 1614 is adjacent to, or continues, the bottom surface 1612. For example, the outer surface 1614 forms a radius R2 relative to the bottom surface 1612. For illustration, a curve with a radius R2 is formed between the outer surface 1614 and the bottom surface 1612. As an example, the radius R2 is approximately 0.012 inches. For illustration, the radius R2 ranges between 0.0119 inches and 0.0121 inches.

The edge ring 228 includes a curved edge 1616 formed between the top surface 1604 and the outer surface 1614 of the edge ring 228. For example, the curved edge 1616 is adjacent to the top surface 1604 and the outer surface 1614, such as being located beside the top surface 1604 and the outer surface 1614. The curved edge 1616 has a radius R1. For example, the radius R1 is approximately 0.1 inches. For illustration, the radius R1 ranges between 0.8 inches and 0.12 inches. The curvature of the curved edge 1616 reduces the possibility of arcing of RF power between the edge ring 228 and the cover ring 201. Arc discharge occurs when plasma is formed and maintained within the plasma chamber. Sharp edges increase the likelihood of arc discharge. The distance d1, the sum of the height of the curved edge 1616 along the y-axis and the vertical distance of the length of the outer surface 1614 along the y-axis, is approximately 0.23 inches. As an example, the distance d1 ranges from approximately 0.229 inches (inclusive) to approximately 0.231 inches. As an example, the outer surface 1614 has an outer diameter OD1 of approximately 14.06 inches, ranging between 13.5 inches and 14.5 inches. It should be noted that the inner diameter, outer diameter, or middle diameter of the edge ring described in this article is formed relative to the central axis passing through the center of mass of the edge ring.

It should be noted that the edge ring described here is consumable. For example, the edge ring may wear out after multiple uses to process the substrate. To illustrate, residual material is output after the plasma used to process the substrate, and this residual material corrodes the edge ring. Furthermore, the plasma corrodes the edge ring.

Furthermore, the edge ring is replaceable. For example, after reusing the edge ring, it is replaced. To illustrate, the edge ring is pushed vertically upward away from the insulator ring 106 (Figure 2) using the clamping rods 302A and 302B of Figure 3A to release it from the insulator ring 106 of Figures 1 and 2. The edge ring is then replaced with another edge ring. Then, the other edge ring is pulled vertically downward toward the insulator ring 106 using the clamping rods 302A and 302B for processing a substrate or another substrate.

In some embodiments, the radii R1 to R7 of the edges of the edge ring 228 are greater than about 0.03 inches to reduce the possibility of arc discharge of RF power toward or away from the edge. To further illustrate, the radii R1 to R7 of the edges of the edge ring 228 range from about 0.03 inches (inclusive) to about 0.1 inches to reduce the possibility of arc discharge of RF power toward or away from the edge. It should be noted that in many embodiments, the radii R1 to R7 are greater than the range of about 0.01 inches (inclusive) to about 0.03 inches. A radius ranging from approximately 0.01 inches (inclusive) to approximately 0.03 inches reduces the likelihood of edge breakage of the radius during semiconductor wafer manufacturing.

In one embodiment, edge ring 228 has a plurality of edges. In one embodiment, the edges defining edge ring 228 are rounded. For example, the edges of edge ring 228 having radii RA and RC (as shown in Figure 9E below) are rounded to a radius of approximately 0.03 inches or greater. It has been determined that a lower degree of rounding of these edges may be insufficient to prevent or reduce the possibility of arcing of RF power when the plasma chamber is in operation. The reduction in the possibility of arcing due to the sharper feature edges within the plasma chamber may be detrimental to manufacturing processes performed on and over the semiconductor wafer. Slight edge rounding (e.g., less than about 0.03 inches for each radius RA and RC (as shown in Figure 9E below), with each radius RA and RC (as shown in Figure 9E below) ranging from about 0.01 inches (inclusive) to about 0.03 inches) helps reduce the possibility of grain generation or edge fragmentation during semiconductor wafer manufacturing. Therefore, although some rounding is performed on the surface of the features (e.g., radii RA and RC (as shown in Figure 9E below)) disposed within the plasma chamber, given the increased power levels used in the plasma processing operation, this degree of rounding is less than the degree of rounding used to prevent or reduce arc discharge.

Figure 8D is a diagram of an embodiment of system 1650 illustrating the coupling of fastener 122 to edge ring 228. A cross-sectional view of edge ring 228 is obtained along cross-section a-a shown in Figure 8A. A groove 125 is formed by drilling within the bottom surface 1612 of edge ring 228. In addition to drilling the groove 125, threads 1652 are formed on the side surface SS of the groove 125. The side surface SS is substantially perpendicular, such as perpendicular to the top surface TS of the groove 125 or within a range of 85° to 95°. The groove 125 surrounds fastener hole 124A.

Fastener 122 has a thread 1654 formed at the tip of fastener 122. Furthermore, fastener 122 has a body 1658 below the thread 1654. The head 1660 of fastener 122 is located below the body 1658.

Fastener 122 is inserted into fastener hole 124A and rotated clockwise to engage thread 1654 with thread 1652, thereby connecting support ring 112 (FIG. 1) to edge ring 228. Similarly, additional fasteners (such as fastener 122) are inserted into multiple fastener holes 124B and 124C to connect support ring 112 to edge ring 228. Multiple fastener holes 124B and 124C are formed in grooves within the bottom surface 1612 of edge ring 228. For example, fastener holes 124A-124C form the vertices of an equilateral triangle within the horizontal plane of the bottom surface 1612 of the edge ring 228. When more than three fastener holes are formed within the bottom surface 1612, the fastener holes are located at substantially equal (e.g., equal) distances. For example, the distance between two adjacent fastener holes in one set within the bottom surface 1612 is the same as the distance between two adjacent fastener holes in another set within the bottom surface 1612. When at least one of the fastener holes in one set is not the same as one of the fastener holes in another set, two fastener holes in one set are different from two fastener holes in the other set. For illustration, the two different sets of fastener holes have at least one uncommon fastener hole. As another example, within the bottom surface 1612, the distance between two adjacent fastener holes in one set is within a predetermined limit relative to the distance between two adjacent fastener holes in another set. When the support ring 112 is connected to the edge ring 228 and the edge ring 228 or the support ring 112 is moved, the edge ring 228 and the support ring 112 move simultaneously in the vertical direction along the y-axis or in the horizontal direction along the x-axis.

Figure 9A is an isometric view of an embodiment of the cover ring 202. In some embodiments, the cover ring 202 is used instead of the cover ring 201 of Figure 2. The cover ring 202 has a top surface 1704. It should be noted that the cover ring described herein is consumable. For example, the cover ring may wear out after being used multiple times during substrate processing. To illustrate, residual material is generated during substrate processing by plasma, and this residual material corrodes the cover ring. Furthermore, the plasma corrodes the cover ring.

Furthermore, the cover ring is replaceable. For example, after reusing the cover ring, replace it. To illustrate, the cover ring is removed from the plasma chamber for replacement with another cover ring.

Figure 9B is a bottom view of an embodiment of the cover ring 202. The cover ring has a bottom surface 1705.

Figure 9C is a top view of an embodiment of the cover ring 202. The cover ring 202 has an inner diameter ID2 and a width W1. The inner diameter ID2 is the diameter of the inner periphery of the cover ring 202. The width W1 is the width of the ring shape of the cover ring 202 between the inner diameter ID2 and the outer diameter of the cover ring 202.

Figure 9D is a cross-sectional view of an embodiment of the cover ring 202 taken along cross section A-A of Figure 9C. The cover ring 202 has a vertically oriented inner surface 1724, another vertically oriented inner surface 1720, a vertically oriented outer surface 1716, another vertically oriented outer surface 1714, and a vertically oriented outer surface 1710. The diameter of the vertically oriented inner surface 1724 is ID2. The diameter ID2 is approximately 13.615 inches. For example, the diameter ID2 ranges from approximately 13.4 inches (inclusive) to approximately 13.8 inches. Furthermore, the diameter of the vertically oriented inner surface 1720 is D1. The diameter D1 is approximately 13.91 inches. For example, the diameter D1 ranges from approximately 13.8 inches (inclusive) to approximately 14 inches. Furthermore, the diameter of the vertically oriented outer surface 1716 is D2. Diameter D2 is approximately 14.21 inches. For example, the range of diameter D2 is from approximately 14 inches (inclusive) to approximately 14.5 inches. The diameter of the vertically oriented outer surface 1714 is D3, and the diameter of the vertically oriented outer surface 1710 is OD2. Diameter D3 is approximately 14.38 inches. For example, the range of diameter D3 is from approximately 14.2 inches (inclusive) to approximately 14.5 inches. The diameter OD2 is approximately 14.7 inches. For example, the range of diameter OD2 is from approximately 14 inches (inclusive) to approximately 15 inches.

Diameter D1 is larger than diameter ID2. Furthermore, diameter D2 is larger than diameter D1, and diameter D3 is larger than diameter D2. Diameter OD2 is larger than diameter D3.

Figure 9E is a cross-sectional view of an embodiment of the cover ring 202. The cover ring 202 includes an upper main body portion 1730, a middle main body portion 1732, and a lower main body portion 1734. The upper main body portion 1730 has a vertically oriented outer surface 1710, a horizontally oriented outer surface 1712, another horizontally oriented inner surface 1722, a vertically oriented inner surface 1724, and a horizontally oriented top surface 1704. A curved edge 1706 is formed between the vertically oriented outer surface 1710 and the top surface 1704. The curved edge 1706 has a radius RC of about 0.06 inches. For example, the radius RC ranges from about 0.059 inches (inclusive) to about 0.061 inches. The curved edge 1706 is adjacent to the top surface 1704 and the vertically oriented outer surface 1710, such as being continuous with or adjacent to the top surface 1704 and the vertically oriented outer surface 1710.

The vertically oriented outer surface 1710 is adjacent to the horizontally oriented outer surface 1712. For example, a curve with a radius RD is formed between the vertically oriented outer surface 1710 and the horizontally oriented outer surface 1712. The radius RD is approximately 0.015 inches. For example, the radius RD ranges from approximately 0.0145 inches (inclusive) to approximately 0.0155 inches.

Furthermore, the horizontally oriented inner surface 1722 is adjacent to the vertically oriented inner surface 1724. For example, a curve with a radius RK is formed between the vertically oriented inner surface 1724 and the horizontally oriented inner surface 1722. For illustration, the radius RK is approximately 0.015 inches. As an example, the radius RK ranges from approximately 0.0145 inches (inclusive) to approximately 0.0155 inches.

Furthermore, the top surface 1704 is adjacent to the vertically oriented inner surface 1724. For example, a curve with radius RA is formed between the vertically oriented inner surface 1724 and the top surface 1704. For illustration, radius RA is approximately 0.015 inches. As an example, the radius RA ranges from approximately 0.0145 inches (inclusive) to approximately 0.0155 inches. Radius RA reduces the possibility of arc discharge of RF power between the cover ring 202 and the edge ring 228. Arc discharge occurs during plasma formation within the plasma chamber.

The intermediate body portion 1732 includes a vertically oriented inner surface 1720, a vertically oriented outer surface 1714, and a horizontally oriented outer surface 1719. The vertically oriented outer surface 1714 is adjacent to the horizontally oriented outer surface 1712 of the upper body portion 1730. For example, a curve with a radius RE is formed between the vertically oriented outer surface 1714 and the horizontally oriented outer surface 1712. As an example, the radius RE is approximately 0.03 inches. For illustration, the radius RE ranges from approximately 0.029 inches (inclusive) to approximately 0.31 inches.

Furthermore, the vertically oriented inner surface 1720 is adjacent to the horizontally oriented inner surface 1722 of the upper body portion 1730. For example, a curve with a radius RB is formed between the horizontally oriented inner surface 1722 and the vertically oriented inner surface 1720. As an example, the radius RB is approximately 0.01 inches. For illustration, the radius RB ranges from approximately 0.09 inches (inclusive) to approximately 0.011 inches.

The horizontally oriented outer surface 1719 is adjacent to the vertically oriented outer surface 1714. For example, a curve with a radius RF is formed between the horizontally oriented outer surface 1719 and the vertically oriented outer surface 1714. As an example, the radius RF is approximately 0.015 inches. For illustration, the radius RF ranges from approximately 0.0145 inches (inclusive) to approximately 0.0155 inches.

The lower body portion 1734 includes a vertically oriented inner surface 1736, a bottom surface 1718, and a vertically oriented outer surface 1716. The vertically oriented inner surface 1736 is adjacent to the vertically oriented inner surface 1720 of the intermediate body portion 1732. For example, the vertically oriented inner surfaces 1720 and 1736 are integrated into a single surface and have the same diameter D1 (FIG. 9D). The vertically oriented inner surface 1736 is adjacent to the bottom surface 1718. For example, a curve with a radius RJ is formed between the vertically oriented inner surface 1736 and the bottom surface 1718. As an example, the radius RJ is approximately 0.02 inches. For illustration, the radius RJ ranges from approximately 0.019 inches (inclusive) to approximately 0.021 inches.

The vertically oriented outer surface 1716 is adjacent to the bottom surface 1718. For example, a curve with a radius RH is formed between the bottom surface 1718 and the vertically oriented outer surface 1716. As an example, the radius RH is approximately 0.02 inches. For illustration, the radius RH ranges from approximately 0.019 inches (inclusive) to approximately 0.021 inches.

The vertically oriented outer surface 1716 is adjacent to the horizontally oriented outer surface 1719 of the central body portion 1732. For example, a curve with a radius RG is formed between the vertically oriented outer surface 1716 and the horizontally oriented outer surface 1719. For example, the radius RG is approximately 0.01 inches. For illustration, the radius RG ranges from approximately 0.09 inches (inclusive) to approximately 0.011 inches.

The vertical distance dB (such as the distance along the y-axis) is formed between the horizontally oriented inner surface 1722 and the top surface 1704. For example, the vertical distance dB is approximately 0.27 inches. For illustration, the vertical distance dB ranges from approximately 0.25 inches (inclusive) to approximately 0.29 inches.

Furthermore, the vertical distance dA is formed between the horizontally oriented outer surface 1712 and the horizontally oriented inner surface 1722. As an example, the distance dA is approximately 0.011 inches. For illustration, the distance dA ranges from approximately 0.009 inches (inclusive) to approximately 0.013 inches.

Furthermore, the vertical distance between the horizontally oriented inner surface 1722 and the horizontally oriented outer surface 1719 is dD. For example, the distance dD is approximately 0.172 inches. For illustration, the distance dD ranges from approximately 0.17 inches (inclusive) to approximately 0.174 inches.

Furthermore, the vertical distance between the horizontally oriented inner surface 1722 and the horizontally oriented bottom surface 1718 is denoted as dC. For example, the distance dC is approximately 0.267 inches. For illustration, the distance dC ranges from approximately 0.265 inches (inclusive) to approximately 0.269 inches.

It should be noted that the bottom surface 1705 of the cover ring 202 includes a horizontally oriented inner surface 1722, vertically oriented inner surfaces 1720 and 1736, a bottom surface 1718, a vertically oriented outer surface 1716, a horizontally oriented outer surface 1719, a vertically oriented outer surface 1714, and a horizontally oriented outer surface 1712.

It should be noted further that all edges of the cover ring 202 are curved, such as arcuate. For example, radii RA, RB, RC, RD, RE, RF, RG, RH, RJ, and RK define the curved edges.

Figure 9F is a cross-sectional view of an embodiment of a system including an edge ring 228, a cover ring 202, a base ring 210, and a grounding ring 212. A stepped reduction section 1726 is formed, which includes a directional change from a vertically oriented inner surface 1724 to a vertically oriented inner surface 1720. The stepped reduction section 1726 is in a horizontal direction along the x-axis, such as the +x or x direction. The stepped reduction section 1726 is between the upper main body portion 1730 and the middle main body portion 1732. The stepped reduction section 1726 is in the +x direction away from the edge ring 228.

Furthermore, another stepped reduction section 1729 is formed, which occurs from the vertically oriented outer surface 1710 to the vertically oriented outer surface 1714. Again, the stepped reduction section 1729 is in the horizontal direction, such as the -x direction of the x-axis, except that the stepped reduction section 1729 is in the opposite direction to the stepped reduction section 1726. The stepped reduction section 1729 is in the direction toward the edge ring 228.

The depth 1762 is formed as the distance from the horizontally oriented inner surface 1722 to the horizontally oriented outer surface 1719 of the central body portion 1732. The depth used here is in the y-axis direction, such as the -y direction.

Furthermore, another stepped reduction section 1728 is formed from the vertically oriented outer surface 1714 to the vertically oriented outer surface 1716. The stepped reduction section 1728 is in the -x direction.

Another depth 1764 is formed between the horizontally oriented outer surface 1719 and the bottom surface 1718 of the lower main body portion 1734. Depth 1764 is the depth of the lower main body portion 1734. It should be noted that depth 1764 is less than depth 1762. In addition, the depth of the vertically oriented inner surface 1724 is greater than depth 1762.

The annular width 1746 is generated between the vertically oriented inner surface 1720 and the vertically oriented outer surface 1714. The annular width used herein is along the x-axis. Furthermore, another annular width 1754 is generated between the vertically oriented inner surface 1736 and the vertically oriented outer surface 1716. The annular width 1754 is smaller than the annular width 1746.

The traceable distance 1735 is located between the edge ring 228 and the ground ring 212. The traceable distance 1735 is the width L11 of the horizontally oriented inner surface 1722, the combined length L12 of the vertically oriented inner surfaces 1720 and 1736, the width L13 of the bottom surface 1718, the length L14 of the vertically oriented outer surface 1716, and the width L15 of the horizontally oriented outer surface 1719. The combined length L12 is the sum of the lengths of the vertically oriented inner surfaces 1720 and 1736. The traceable distance 1735 is the path along which the voltage received from the RF power pin 208 is dissipated by the cover ring 202. The edge ring 228 serves as the capacitor plate of the capacitor, while the electrode EL (Figure 2) serves as the other capacitor plate, with the dielectric material of the support ring 112 located between the two capacitor plates. The distance 1 is the horizontal distance along the x-axis between the edge ring 228 and the ground ring 212, used to dissipate the voltage provided by the RF power pin 208.

The annular width of the cover ring 202 is defined by a traceable distance of 1735 or 1. Furthermore, the annular width of the cover ring 202 is defined by voltage dissipation along the traceable distance of 1735 or 1. The annular width of the cover ring 202 is the difference between the inner diameter ID2 and the outer diameter OD2 of the cover ring 202. The annular width of the cover ring 202 is defined such that a predetermined isolation voltage is achieved at the vertically oriented inner surface 1724. For example, under the condition that 7-10 volts are dissipated along one-thousandth of an inch of the cover ring 202 and the isolation voltage at the vertically oriented inner surface 1724 is 5000 volts, the ring width of the cover ring 202 is equal to the ratio of a multiple of 5000 volts (such as two or three times) to the 7-10 volts dissipated per one-thousandth of an inch of the cover ring 202.

In some embodiments, depth 1764 is greater than depth 1762. Furthermore, in many embodiments, the depth of the vertically oriented inner surface 1724 is less than depth 1762.

Figure 9G is a cross-sectional view of an embodiment of a system including an edge ring 108, a cover ring 118, a base ring 116, and a grounding ring 114. The cover ring 118 includes an upper main body portion 1761, a middle main body portion 1763, and a lower main body portion 1765.

The upper body portion 1761 includes a vertically oriented inner surface 1782, a horizontally oriented top surface 1766, a vertically oriented outer surface 1768, and a horizontally oriented outer surface 1770. The vertically oriented outer surface 1768 is adjacent to the top surface 1766, and the horizontally oriented outer surface 1770 is adjacent to the vertically oriented outer surface 1768. For example, a curve with a radius is formed between the vertically oriented outer surface 1768 and the top surface 1766, and a curve with a radius is formed between the horizontally oriented outer surface 1770 and the vertically oriented outer surface 1768. Furthermore, the vertically oriented inner surface 1782 is adjacent to the top surface 1766. For example, a curve with a radius is formed between the vertically oriented inner surface 1782 and the top surface 1766.

The intermediate main body portion 1763 includes a vertically oriented outer surface 1772, a vertically oriented inner surface 1780, and a horizontally oriented inner surface 1781. The vertically oriented outer surface 1772 is adjacent to the horizontally oriented outer surface 1770 of the upper main body portion 1761. For example, a curve with a radius is formed between the vertically oriented outer surface 1772 and the horizontally oriented outer surface 1770.

Furthermore, the vertically oriented inner surface 1780 is adjacent to, for example, the vertically oriented inner surface 1782. For illustration, the vertically oriented inner surface 1782 is located in the same vertical plane as the vertically oriented inner surface 1780.

The horizontally oriented inner surface 1781 is adjacent to the vertically oriented inner surface 1780. For example, a curve with a radius is formed between the horizontally oriented inner surface 1781 and the vertically oriented inner surface 1780.

The lower main body portion 1765 includes a vertically oriented outer surface 1774, a horizontally oriented bottom surface 1776, and a vertically oriented inner surface 1778. The vertically oriented inner surface 1778 is adjacent to the horizontally oriented inner surface 1781 of the middle main body portion 1763. For example, a curve with a radius is formed between the vertically oriented inner surface 1778 and the horizontally oriented inner surface 1781.

Furthermore, the bottom surface 1776 is adjacent to the vertically oriented inner surface 1778. For example, a curve with a radius is formed between the bottom surface 1776 and the vertically oriented inner surface 1778.

Furthermore, the bottom surface 1776 is adjacent to the vertically oriented outer surface 1774. For example, a curve with a radius is formed between the bottom surface 1776 and the vertically oriented outer surface 1774. The vertically oriented outer surface 1774 is located in the same vertical plane as the vertically oriented outer surface 1772 of the central main body portion 1763.

The stepped reduction section 1783 is formed between the vertically oriented outer surface 1768 of the upper main body portion 1761 and the vertically oriented outer surface 1772 of the middle main body portion 1763. The stepped reduction section 1783 is in the -x direction toward the edge ring 108.

Furthermore, another stepped reduction portion 1784 is formed from the vertically oriented inner surface 1780 of the intermediate main body portion 1763 to the horizontally oriented inner surface 1781 of the intermediate main body portion 1763. The stepped reduction portion 1784 from the vertically oriented inner surface 1780 occurs in the +x direction away from the x-axis of the edge ring 108.

An annular width 1786 is formed between the vertically oriented inner surface 1780 and the vertically oriented outer surface 1772 of the central main body portion 1763. The annular width 1786 is along the x-axis. Furthermore, another annular width 1788 is formed between the vertically oriented inner surface 1778 and the vertically oriented outer surface 1774 of the lower main body portion 1765. The annular width 1788 is along the x-axis. The annular width 1788 is smaller than the annular width 1786.

The depth 1790 of the middle main body portion 1763 along the y-axis is formed from the horizontally oriented outer surface 1770 to the horizontally oriented inner surface 1781. Furthermore, another depth 1792 of the lower main body portion 1765 along the y-axis is formed from the horizontally oriented inner surface 1781 to the bottom surface 1776. Depth 1792 is less than depth 1790.

It should be noted that the bottom surface of the cover ring 118 includes surfaces 1781, 1778, 1776, 1774, 1772 and 1770.

The traceable distance 1794 is formed between the edge ring 108 and the grounding ring 114. The traceable distance 1794 is along the following: the depth L21 of the vertically oriented inner surface 1780 along the y-axis, the width L22 of the horizontally oriented inner surface 1781 along the x-axis, the depth L23 of the vertically oriented inner surface 1778, and the width L24 of the bottom surface 1776. The depth L23 is the same as the depth 1792. The traceable distance 1794 is the path along which the voltage received by the edge ring 108 reaches the grounding ring 114 via the support ring 112. The edge ring 108 serves as the capacitor plate of the capacitor, while the electrode EL (Figure 2) serves as the other capacitor plate of the capacitor, wherein the dielectric material of the support ring 112 is located between the two capacitor plates.

The distance 2 along the x-axis is formed between the edge ring 108 and the grounding ring 114. Distance 2 is smaller than distance 1 in Figure 9F. Because the outer diameter of the edge ring 228 in Figure 9F is smaller than the outer diameter of the edge ring 108, the upper main body portion 1730 of the cover ring 202 in Figure 9F has a wider width than the upper main body portion 1761 of the cover ring 118. The increase in the width of the upper main body portion 1730 compared to the width of the upper main body portion 1761 causes distance 1 to increase relative to distance 2. The larger distance 1 compensates for the reduced width of the edge ring 228 compared to the edge ring 108, providing a predetermined distance for the RF voltage of the RF signal supplied by the power pin 208 (FIG. 2) to cross to the ground ring 212 via the traceable distance 213 (FIG. 2) or 1735 (FIG. 9F). For example, there is a loss of about 7 to about 10 volts per thousandth of an inch of cover ring. If a predetermined isolation voltage of 5000 V is to be reached at the vertically oriented inner surface of the main body portion above the cover ring, then the ring width of the main body portion above the cover ring is calculated as (positive real number x 5000) / (volt loss per thousandth of an inch of cover ring), where "positive real number" is a multiple, such as 2, 3, or 4.

In some implementations, depth 1792 is greater than depth 1790.

The embodiments described herein can be implemented using a variety of computer system configurations, including handheld hardware units, microprocessor systems, microprocessor-based or programmable consumer electronics products, minicomputers, mainframes, etc. These embodiments can also be implemented in distributed computing environments where tasks are executed by remote processing hardware units connected via a network link.

In some embodiments, the controller described herein is part of a system, which may be part of the examples above. These systems include semiconductor processing equipment comprising processing tools or multiple processing tools, chambers or multiple chambers, platforms or multiple platforms for processing, and/or specific processing elements (wafer davits, airflow systems, etc.). These systems are integrated with electronic devices used to control the operation of these systems before, during, and after semiconductor wafer or substrate processing. The electronic devices are referred to as "controllers" and can control various elements or sub-parts of the system or multiple systems. Depending on the system's processing requirements and/or type, the controller is programmed to control any processes disclosed herein, including: gas delivery, temperature settings (e.g., heating and/or cooling), pressure settings, vacuum settings, power settings, RF generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, entry and exit of tools and other transfer tools and/or wafer transfer of loading locks coupled to or interfaced with the system.

In a broad sense, in many embodiments, a controller is defined as an electronic device comprising various integrated circuits, logic, memory, and/or software that have functions such as receiving instructions, issuing instructions, controlling operations, enabling cleanup operations, and enabling endpoint measurements. Integrated circuits include chips in firmware form that store program instructions, digital signal processors (DSPs), chips defined as ASICs, PLDs, and/or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). These program instructions are instructions that communicate with the controller in the form of various individual settings (or program files), which define parameters, factors, variables, etc., for the semiconductor wafer or system to perform specific processes. In some embodiments, these program instructions are part of a formulation defined by a process engineer to complete one or more processing steps during the die fabrication of one or more layers, materials, metals, oxides, silicon, silica, surfaces, circuits, and/or wafers.

In some embodiments, the controller is part of or coupled to a computer that is integrated with, coupled to, or otherwise networked to the system, or a combination of the above. For example, the controller may be part or in whole of a cloud or wafer fab mainframe computer system, allowing remote access to wafer processing. The computer may allow remote access to the system to monitor the current progress of manufacturing operations, examine the history of past manufacturing operations, examine trends or performance metrics from multiple manufacturing operations to change parameters of the current processing, or set up processing steps or new processes after the current operation.

In some embodiments, a remote computer (e.g., a server) provides process recipes to the system via a network, including a local area network or the Internet. The remote computer includes a user interface that allows the input or programming of parameters and/or settings, which are then transmitted from the remote computer to the system. In some examples, the controller receives instructions in the form of data that explicitly specifies parameters, factors, and/or variables for each processing step to be performed during one or more operations. It should be understood that the parameters, factors, and/or variables are specifically used to describe the type of process to be performed and the type of tool the controller is configured to access or control. Therefore, as described above, the controller is distributed, for example by comprising one or more distributed controllers connected together by a network and operating towards a common purpose (such as the processes and controls described herein). An example of a distributed controller for such purposes includes one or more integrated circuits in a chamber that are connected to one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) in combination to control the process in the chamber.

Unrestricted, in many embodiments, example systems applying these methods include plasma etching chambers or modules, deposition chambers or modules, spin-wetting chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, etc. Atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, plasma enhanced chemical vapor deposition (PECVD) chambers or modules, clean-type chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing systems associated with or used in the fabrication and/or production of semiconductor wafers.

It should be noted that in some embodiments, the above operations can be applied to certain types of plasma chambers, such as plasma chambers containing inductively coupled plasma (ICP) reactors, transformer-coupled plasma reactors, conductor tools, dielectric tools, etc.; plasma chambers containing electron cyclotron resonator (ECR) reactors, etc. For example, one or more RF generators are coupled to an inductor within the ICP reactor. Examples of inductor shapes include solenoids, dome-shaped coils, flat coils, etc.

As described above, depending on the process steps or multiple process steps to be performed by the tool, the host computer communicates with one or more of the following: other tool circuits or modules, other tool elements, group tools, other tool interfaces, adjacent tools, neighboring tools, tools located at various locations in the factory, the host computer, another controller, or tools for material transport that carry the wafer container to and from tool locations and/or load terminals within the semiconductor manufacturing plant.

Having considered the foregoing embodiments, it should be understood that some embodiments utilize numerous computer-implementable operations involving data stored within a computer system. These operations are physical quantities that are physically manipulated. Any operations described herein that form part of such embodiments are useful mechanical operations.

Some embodiments also relate to hardware units or devices used to perform these operations. The device is specifically constructed for a special purpose computer. When defined as a special purpose computer, the computer performs other processing, program execution, or common programs that are not part of the special purpose, but is still able to operate for the special purpose.

In some embodiments, these operations can be processed by a computer selectively started or configured by one or more computer programs stored in computer memory, cache memory, or obtained through a computer network. When data is obtained through a computer network, the data can be processed by other computers on the computer network (e.g., cloud computing resources).

One or more embodiments may also be made into computer-readable code on a non-transient computer-readable medium. The non-transient computer-readable medium is any data storage hardware unit (e.g., a memory device) that stores data which is subsequently read by a computer system. Examples of non-transient computer-readable media include hard drives, network attached storage (NAS), ROM, RAM, optical disc ROM (CD-ROM), recordable optical disc (CD-R), rewritable optical disc (CD-RW), magnetic tape, and other optical and non-optical data storage hardware units. In some embodiments, the non-transient computer-readable media includes computer-readable physical media distributed across network-coupled computer systems, such that the computer-readable code is stored and executed in a distributed manner.

Although the above methods are described in a specific order, it should be understood that in many embodiments, other housekeeping operations are performed between operations, or the methods are adjusted so that the operations occur at slightly different points in time, or are distributed in systems that allow the methods to occur within various time intervals, or are performed in a different order than described above.

It should be noted that in one embodiment, one or more features from any of the foregoing embodiments are combined with one or more features from any other embodiment without departing from the scope described in the various embodiments described in this disclosure.

Although the embodiments described above have been described in detail for clarity of understanding, it will be apparent that various modifications and alterations may be made within the scope of the appended patent application. Therefore, the embodiments of the present invention should be regarded as illustrative rather than restrictive, and such embodiments are not limited to the details provided herein.

100: System 104: Chuck 106: Insulator Ring 108: Edge Ring 110A: Colloid Layer 110B: Colloid Layer 110C: Colloid Layer 112: Support Ring 114: Grounding Ring 116: Base Ring 118: Cover Ring 122: Fastener 124A: Fastener Hole 124B: Fastener Hole 124C: Fastener Hole 125: Groove 132A: Through Hole 200: System 201: Cover Ring 202: Cover Ring 203: Inner Surface 204: O-ring 206: Power feed pin 208: Power pin 210: Base ring 212: Grounding ring 213: Trackable distance 214: O-ring 216A: Mounting bracket 218: Bowl-shaped body 224: Equipment plate 228: Edge ring 230: Insulator wall 300: System 302A: Clamping rod 302B: Clamping rod 308: Bottom surface 330: Slot 332: Receiver 604A: Mounting bracket 900: System 902: Shoulder screw 906: Press-fit connector 908: Thread Adapter 910: Screw 912: Cylinder 914: Air Components 914A: Air Components 914B: Air Components 916: Piston Body 918: Piston Rod 920A: Locking Mechanism 920B: Locking Mechanism 920C: Locking Mechanism 922: Piston 924: Edge Ring 930: Center Opening 931: Groove 932: Thread 934: Thread 1100: System 1102A: Air Path 1102B: Air Path 1104A: Upper Part 1104B: Lower Part 1104C: Upper Part 1104D: Lower Part 1104E: Upper part 1104F: Lower part 1106A: Pipe 1106B: Pipe 1106C: Pipe 1106D: Pipe 1106E: Pipe 1106F: Pipe 1106G: Pipe 1106H: Pipe 1106I: Pipe 1106J: Pipe 1150: System 1200: System 1202A: Air compressor 1202B: Air compressor 1204A: Regulator 1204B: Regulator 1206A: Orifice 1206B: Orifice 1604: Top surface 1606: Inner surface 1608: Inner surface 1610: Inner surface 1612: Bottom Surface 1614: Outer Surface 1616: Curved Edge 1618: Inner Surface 1620: Inner Surface 1622: Step 1650: System 1652: Thread 1654: Thread 1658: Main Body 1660: Head 1704: Top Surface 1705: Bottom Surface 1706: Curved Edge 1710: Outer Surface 1712: Outer Surface 1714: Outer Surface 1716: Outer Surface 1718: Bottom Surface 1719: Outer Surface 1720: Inner Surface 1722: Inner Surface 1724: Inner Surface 1726: Stepped Reduction Section 1728: Stepped Reduction Section 1729: Stepped Reduction Section 1730: Upper Main Body 1732: Middle Main Body 1734: Lower Main Body 1735: Trackable Distance 1736: Inner Surface 1746: Circular Width 1754: Circular Width 1761: Upper Main Body 1762: Depth 1763: Middle Main Body 1764: Depth 1765: Lower Main Body 1766: Top Surface 1768: Outer Surface 1770: Outer Surface 1772: Outer Surface 1774: Outer Surface 1776: Bottom Surface 1778: Inner Surface 1780: Inner Surface 1781: Inner Surface 1782: Inner Surface 1783: Stepped Reduction Section 1784: Stepped Reduction Section 1786: Circular Width 1788: Circular Width 1790: Depth 1792: Depth 1794: Trackable Distance A1: Angle A2: Angle C1: Connector C2: Connector C3: Connector C4: Connector D1: Diameter D2: Diameter D3: Diameter d1: Distance d2: Length d3: Distance dA: Distance dB: Distance dC: Distance dD: Distance EL: Electrode ID: Inner Diameter ID1: Inner Diameter ID2: (Inner) Diameter L1: Position L2: Position L11: Width L12: Length L13: Width L14: Length L15: Width L21: Depth L22: Width L23: Depth L24: Width MD: Center Diameter OD: Outer Diameter OD1: Outer Diameter OD2: (Outer) Diameter P1: Part P2: Part P3: Part P4: Part P5: Part P6: Part PR1: Top Part PR2: Middle Part PRTN1: Top Part R1: Radius R2: Radius R3: Radius R4: Radius R5: Radius R6: Radius R7: Radius RA: Radius RB: Radius RC: Radius RD: Radius RE: Radius RF: Radius RG: Radius RH: Radius RJ: Radius RK: Radius SS: Side Surface TS: Top Surface W1: Width

These embodiments can be best understood by referring to the following description in conjunction with the accompanying figures.

Figure 1 is a diagram of an embodiment of the system to illustrate how the edge ring is fixed to the support ring.

Figure 2 is a diagram of an embodiment of the system to illustrate the coupling of the power pin to the support ring.

Figure 3A is a diagram of an embodiment of the system, illustrating the connection of multiple hold-down rods to multiple locations of the support ring.

Figure 3B is an isometric view illustrating the coupling between the clamping rod and the bottom surface of the support ring.

Figure 4 is a side view of an embodiment of a system for fixing edge rings and support rings to an insulating ring.

Figure 5 is an isometric view of an embodiment of the fastening mechanism.

Figure 6A is a diagram of an embodiment of the system used to illustrate the synchronous pull-down of the clamping lever.

Figure 6B is a diagram of an embodiment of the system, used to illustrate the synchronous upward push of the clamping lever.

Figure 7 is a block diagram of an embodiment of the system to illustrate the supply of air to multiple fastening mechanisms.

Figure 8A is an isometric view of an embodiment of the edge ring.

Figure 8B is a top view of an embodiment of the edge ring of Figure 8A.

Figure 8C is a cross-sectional view of the edge ring of Figure 8B.

Figure 8D is a diagram of an embodiment of the system to illustrate the coupling of the fastener to the edge ring of Figure 8A.

Figure 9A is an isometric view of an embodiment of the cover ring.

Figure 9B is a bottom view of an embodiment of the cover ring of Figure 9A.

Figure 9C is a top view of an embodiment of the cover ring of Figure 9A.

Figure 9D is a cross-sectional view of an embodiment of the cover ring of Figure 9C.

Figure 9E is a cross-sectional view of an embodiment of the cover ring of Figure 9A.

Figure 9F is a cross-sectional view of an embodiment of the cover ring of Figure 9A.

Figure 9G is a cross-sectional view of an embodiment of the cover ring.

228: Peripheral Ring

1604: Top surface

1606: Inner surface

1608: Inner Surface

1610: Inner surface

1612: Bottom surface

1614: Outer surface

1616: The Curved Edge

1618: Inner surface

1620: Inner surface

1622: Steps

A1:Angle

A2: Angle

d1: distance

d2: Length

d3: distance

ID1: Inner Diameter

MD: Center Diameter

OD1: Outer Diameter

R1: Radius

R2: Radius

R3: Radius

R4: Radius

R5: Radius

R6: Radius

R7: Radius

Claims (87)

An edge ring for use in a plasma chamber includes: an annular body having an inner surface, an angled surface, a top surface, a bottom surface, and an outer surface, wherein the angled surface is angled relative to the inner surface and angled relative to the bottom surface; and a plurality of fastener holes formed within the annular body extending from the bottom surface toward the top surface, wherein the bottom surface has a horizontally oriented portion extending from the angled surface to the plurality of fastener holes, wherein each of the plurality of fastener holes is configured to receive a fastener for coupling the annular body to a support ring located below the annular body. The edge ring of claim 1, wherein the inner surface is a side surface and the outer surface is a side surface, wherein the inner surface and the outer surface are oriented vertically relative to the bottom surface, and wherein the top surface and the bottom surface are oriented horizontally relative to the inner surface and the outer surface, respectively. As in claim 1, the edge ring, wherein the angled surface is adjacent to the inner surface and the bottom surface. As in claim 1, the edge ring has an angled surface having a first length and an outer surface having a second length, wherein the first length is less than the second length, and wherein the first and second lengths are each measured from the bottom surface in a vertical direction. As in claim 1, the edge ring has an angled surface having a first length from the bottom surface and a top surface having a second length from the bottom surface, wherein the first length is less than the second length. As in claim 1, the edge ring, wherein the angled surface forms a 30-degree angle with respect to the inner surface. As in claim 1, the edge ring, wherein each of the plurality of fastener holes does not extend along the full length of the ring, wherein the full length is the distance between the top surface and the bottom surface. As in claim 1, the edge ring, wherein each of the plurality of fastener holes includes threads formed on one side surface of the fastener hole, wherein each of the plurality of fastener holes has a top surface, wherein the side surface of the fastener hole extends from the bottom surface of the ring to the top surface of the fastener hole. As in claim 8, the edge ring, wherein the side surface of the fastener hole is substantially perpendicular to the top surface of the fastener hole. An electroplating chamber includes: a support ring; an edge ring located above the support ring; and a chuck located beside the edge ring and the support ring, wherein the edge ring includes: an annular body having an inner surface, an angled surface, a top surface, a bottom surface, and an outer surface, wherein the angled surface is angled relative to the inner surface and angled relative to the bottom surface; and a plurality of fastener holes formed within the annular body extending from the bottom surface toward the top surface, wherein the bottom surface has a horizontally oriented portion extending from the angled surface to the plurality of fastener holes, wherein each of the plurality of fastener holes is configured to receive a fastener for coupling the annular body to the support ring. The plasma chamber of claim 10, wherein the inner surface is a side surface and the outer surface is a side surface, wherein the inner surface and the outer surface are oriented vertically relative to the bottom surface, and wherein the top surface and the bottom surface are oriented horizontally relative to the inner surface and the outer surface, respectively. For example, in the plasma chamber of claim 10, the angled surface is adjacent to the inner surface and the bottom surface. As in claim 10, the plasma chamber, wherein the angled surface has a first length and the outer surface has a second length, wherein the first length is less than the second length. As in claim 10, the plasma chamber, wherein the angled surface has a first length from the bottom surface and the top surface has a second length from the bottom surface, wherein the first length is less than the second length, and wherein each of the first and second lengths is measured from the bottom surface in a vertical direction. For example, in the plasma chamber of claim 10, the angled surface forms a 30-degree angle with respect to the inner surface. For example, in the plasma chamber of claim 10, each of the plurality of fastener holes does not extend along the full length of the annular body, wherein the full length is the distance between the top surface and the bottom surface. As in claim 10, the plasma chamber, wherein each of the plurality of fastener holes includes a thread formed on one side surface of the fastener hole, wherein each of the plurality of fastener holes has a top surface, wherein the side surface of the fastener hole extends from the bottom surface of the toroidal body to the top surface of the fastener hole. As in claim 17, the plasma chamber wherein the side surface of the fastener hole is substantially perpendicular to the top surface of the fastener hole. A plasma chamber includes: a substrate support; an edge ring; a support ring located below the edge ring, wherein the edge ring and the support ring are located beside the substrate support; an insulator ring located below the support ring; a cover ring located beside the edge ring, wherein the cover ring and the substrate support are located on opposite sides of the edge ring; and a grounding ring positioned adjacent to the cover ring and the insulator ring. The edge ring includes: a ring-shaped body having an inner surface, an angled surface, and... A top surface, a bottom surface, and an outer surface, wherein the angled surface is angled relative to the inner surface and angled relative to the bottom surface; and a plurality of fastener holes formed within the annulus extending from the bottom surface toward the top surface, wherein the bottom surface has a horizontally oriented portion extending from the angled surface to the plurality of fastener holes, wherein each of the plurality of fastener holes is configured to receive a fastener to couple the annulus to the support ring. The plasma chamber of claim 19, wherein each of the plurality of fastener holes includes a thread formed on one side surface of the fastener hole, wherein each of the plurality of fastener holes has a top surface, wherein the side surface of the fastener hole extends from the bottom surface of the toroidal body to the top surface of the fastener hole. An edge ring for use in a plasma chamber includes: a body having a first inner surface, a top surface, a bottom surface, and an outer surface; and a plurality of fastener holes formed within the body of the edge ring and extending from the bottom surface toward the top surface, wherein each of the plurality of fastener holes is configured to receive a fastener for coupling the body of the edge ring to a support ring. The edge ring of claim 21, wherein the first inner surface is vertically oriented, the bottom surface is horizontally oriented, the outer surface is vertically oriented, and the top surface is horizontally oriented. Such as the edge ring of claim 21, wherein the bottom surface is positioned along a horizontal plane. As in claim 21, the edge ring, wherein the bottom surface is adjacent to the outer surface, further includes: a second inner surface that is horizontally oriented; and an angled surface that is angled relative to the second inner surface and relative to the top surface, wherein the angled surface is adjacent to the second inner surface and adjacent to the top surface. As in claim 21, the edge ring wherein each of the plurality of fastener holes is surrounded by a groove formed within the bottom surface, wherein the groove has threads. As in claim 25, the edge ring wherein the thread of the groove is constructed to engage with the thread of one of the plurality of fasteners to couple the body to the support ring. The edge ring of claim 25, wherein the groove has a side surface and a top surface, wherein the side surface of the groove is substantially perpendicular to the top surface, and wherein a gap formed between one of the plurality of fasteners and the top surface is less than 1 mm to reduce the possibility of arc discharge. A plasma chamber includes: a substrate support; an edge ring surrounding the substrate support; and a support ring located below the edge ring and surrounding the substrate support; wherein the edge ring includes: a body having a first inner surface, a top surface, a bottom surface, and an outer surface; and a plurality of fastener holes formed within the body of the edge ring and extending from the bottom surface toward the top surface, wherein each of the plurality of fastener holes is configured to receive a fastener to couple the body of the edge ring to the support ring. The plasma chamber of claim 28, wherein the first inner surface is vertically oriented, the bottom surface is horizontally oriented, the outer surface is vertically oriented, and the top surface is horizontally oriented. For example, in the plasma chamber of claim 28, the bottom surface is positioned along a horizontal plane. As in claim 28, the plasma chamber, wherein the bottom surface is adjacent to the outer surface, and the edge ring further includes: a second inner surface that is horizontally oriented; and an angled surface that is angled relative to the second inner surface and relative to the top surface, wherein the angled surface is adjacent to the second inner surface and adjacent to the top surface. As in claim 28, the plasma chamber wherein each of the plurality of fastener holes is surrounded by a groove formed within the bottom surface, wherein the groove has threads. As in claim 32, the plasma chamber wherein the thread of the groove is constructed to engage with the thread of one of the plurality of fasteners to couple the body to the support ring. The plasma chamber of claim 32, wherein the groove has a side surface and a top surface, wherein the side surface of the groove is substantially perpendicular to the top surface, and wherein a gap formed between one of the plurality of fasteners and the top surface is less than 1 mm to reduce the possibility of arc discharge. The plasma chamber of claim 28, wherein the support ring has an electrode embedded therein. A plasma system includes: a substrate support; an edge ring surrounding the substrate support; a cover ring located next to and surrounding the edge ring; a grounding ring located next to and surrounding a portion of the cover ring; and a support ring located below the edge ring, wherein the edge ring includes: a body having a first inner surface, a top surface, a bottom surface, and an outer surface; and a plurality of fastener holes formed within the body and extending from the bottom surface toward the top surface, wherein each of the plurality of fastener holes is configured to receive a fastener for coupling the body to the support ring. The plasma system of claim 36, wherein the first inner surface is vertically oriented, the bottom surface is horizontally oriented, the outer surface is vertically oriented, and the top surface is horizontally oriented. For example, in the plasma system of claim 36, the bottom surface is positioned along a horizontal plane. As in the plasma system of claim 36, wherein the bottom surface is adjacent to the outer surface, the edge ring further includes: a second inner surface that is horizontally oriented; and an angled surface that is angled relative to the second inner surface and relative to the top surface, wherein the angled surface is adjacent to the second inner surface and adjacent to the top surface. The plasma system of claim 36, wherein each of the plurality of fastener holes is surrounded by a groove formed in the bottom surface, wherein the groove has threads. As in claim 40, the plasma system wherein the thread of the groove is constructed to engage with the thread of one of the plurality of fasteners to couple the body to the support ring. The plasma system of claim 40, wherein the tank has a side surface and a top surface, wherein the side surface of the tank is substantially perpendicular to the top surface, and wherein a gap formed between one of the plurality of fasteners and the top surface is less than 1 mm to reduce the possibility of arc discharge. The plasma system of claim 36, wherein the support ring has an electrode embedded therein. An edge ring constructed to surround a chuck in a plasma processing chamber, the edge ring comprising: an annular body having a bottom surface, a top surface, an inner surface, and an outer surface; a plurality of fastener holes formed along the bottom surface into the annular body, each of the plurality of fastener holes having a threaded inner surface for receiving a fastener for securing the annular body to a support ring; and a step disposed on the inner surface, the step having a lower level separated from the top surface by an angled surface. The surface, wherein the inner surface has a vertically oriented inner surface and an angled inner surface that is angled relative to the vertically oriented inner surface and the bottom surface, wherein the bottom surface has a first portion, a second portion, and a third portion, the first portion being configured to extend horizontally above the chuck from the angled inner surface and being configured to be thermally coupled to the chuck, the second portion including a horizontally oriented surface configured to be thermally coupled to the support ring, and the third portion being configured to face a base ring. As in claim 44, the edge ring wherein the inner surface of the thread is constructed to contact a plurality of threads of the fastener to securely fasten the ring shape to the support ring. As in claim 44, the edge ring wherein each of the plurality of fastener holes is drilled into the bottom surface of the ring shape. Such as the edge ring of claim 44, wherein the ring shape forms a capacitor plate relative to an electrode contained within the support ring. Such as the edge ring of claim 44, wherein the inner surface of the thread has a plurality of helical threads. As in claim 44, an edge ring wherein one of the plurality of fastener holes has a top surface and a threaded inner surface made of a conductive material of the toroidal body, wherein the threaded inner surface extends perpendicularly between the top surface of the one of the plurality of fastener holes and the bottom surface of the toroidal body, wherein the threaded inner surface is configured to contact the threads of the fastener to securely fasten the toroidal body to the support ring. As in claim 49, the edge ring wherein the top surface of one of the plurality of fastener holes is horizontally oriented. As in claim 50, the edge ring, wherein the top surface of one of the plurality of fastener holes is substantially perpendicular to the inner surface of the thread. As in claim 51, the edge ring wherein the top surface of one of the plurality of fastener holes forms an angle between 85 and 95 degrees relative to the inner surface of the thread. For example, the edge ring of request item 44, wherein each of the plurality of fastener holes has no insert. As in claim 44, the edge ring wherein a first distance between the first set of adjacent fastener holes in the plurality of fastener holes is within a predetermined limit of a second distance between the second set of adjacent fastener holes in the plurality of fastener holes. An edge ring configured to surround a chuck in a plasma processing chamber, the edge ring comprising: an annular body having a bottom surface, a top surface, an inner surface, and an outer surface, wherein the inner surface has a vertically oriented inner surface and an angled inner surface angled relative to the vertically oriented inner surface and the bottom surface; and a plurality of fastener holes formed along the bottom surface into the annular body, each of the plurality of fastener holes having a threaded inner surface. The ring includes a fastener for securing the ring to a support ring; a step disposed on the inner surface, the step having a horizontal surface separated from the top surface by an angled surface; a first curved edge formed between the top surface and the outer surface; and a second curved edge formed between the vertically oriented inner surface and the angled inner surface, wherein the radius of the second curved edge is smaller than the radius of the first curved edge. For example, the edge ring of claim 55, wherein the radius of the first curved edge is between 0.8 inches and 0.12 inches. For example, the edge ring of claim 55, wherein the radius of the second curved edge is between 0.0149 inches and 0.0151 inches. As in claim 55, the edge ring wherein a third curved edge is formed between the lower horizontal surface and the angled surface. As in claim 58, the radius of the third curved edge is smaller than the radius of the first curved edge and larger than the radius of the second curved edge. As in claim 59, the radius of the third curved edge is between 0.03 inches and 0.034 inches. As in claim 58, the edge ring has a fourth curved edge formed between the angled surface and the top surface. As in claim 61, the radius of the fourth curved edge is in the range of 0.009 inches to 0.011 inches. The edge ring of claim 55, wherein the angled inner surface has a vertical length ranging from 0.0345 inches to 0.0355 inches. As in claim 55, the edge ring, wherein the angled inner surface forms an angle of 30 degrees relative to the vertically oriented inner surface. The edge ring of claim 55, wherein the inner surface of the thread has a plurality of helical threads. As in claim 55, an edge ring wherein one of the plurality of fastener holes has a top surface and a threaded inner surface made of a conductive material of the toroidal body, wherein the threaded inner surface extends perpendicularly between the top surface of the one of the plurality of fastener holes and the bottom surface of the toroidal body, wherein the threaded inner surface is configured to contact the threads of the fastener to securely fasten the toroidal body to the support ring. As in claim 66, the edge ring wherein the top surface of one of the plurality of fastener holes is horizontally oriented. As in claim 67, the edge ring, wherein the top surface of one of the plurality of fastener holes is substantially perpendicular to the inner surface of the thread. As in claim 68, the edge ring wherein the top surface of one of the plurality of fastener holes forms an angle between 85 and 95 degrees relative to the inner surface of the thread. For example, the edge ring of request item 55, wherein each of the plurality of fastener holes has no insert. As in claim 55, the edge ring wherein a first distance between the first set of adjacent fastener holes in the plurality of fastener holes is within a predetermined limit of a second distance between the second set of adjacent fastener holes in the plurality of fastener holes. A plasma chamber includes: a support ring; a base ring surrounding the support ring; a grounding ring surrounding a portion of the base ring; a chuck; and an edge ring surrounding the chuck, the edge ring comprising: an annular body at least partially disposed on the chuck and the base ring, wherein the annular body has a bottom surface, a top surface, an inner surface, and an outer surface; a plurality of fastener holes formed into the annular body along the bottom surface, each of the plurality of fastener holes having a threaded inner surface for receiving a fastener for securing the annular body to the support ring; and a step disposed on the inner surface. The step has a lower horizontal surface separated from the top surface by an angled surface, wherein the inner surface has a vertically oriented inner surface and an angled inner surface that is angled relative to the vertically oriented inner surface and the bottom surface, wherein the bottom surface has a first portion, a second portion, and a third portion, the first portion being configured to extend horizontally above the chuck from the angled inner surface and being configured to be thermally coupled to the chuck, the second portion including a horizontally oriented surface configured to be thermally coupled to the support ring, and the third portion being configured to face the base ring. As in claim 72, the plasma chamber wherein the inner surface of the thread is constructed to contact a plurality of threads of the fastener to securely fasten the toroidal body to the support ring. As in claim 72, the plasma chamber wherein each of the plurality of fastener holes is drilled into the bottom surface of the annulus. The plasma chamber of claim 72, wherein the support ring has an electrode contained therein, wherein the ring shape forms a capacitor plate relative to the electrode contained in the support ring. As in claim 72, the plasma chamber, wherein one of the plurality of fastener holes has a top surface and a threaded inner surface made of a conductive material of the toroidal body, wherein the threaded inner surface extends perpendicularly between the top surface of the one of the plurality of fastener holes and the bottom surface of the toroidal body, wherein the threaded inner surface is configured to contact the threads of the fastener to securely fasten the toroidal body to the support ring. A plasma chamber includes: a support ring; a base ring surrounding the support ring; a grounding ring surrounding a portion of the base ring; a chuck; and an edge ring surrounding the chuck, the edge ring including: an annular body at least partially disposed on the chuck and the base ring, wherein the annular body has a bottom surface, a top surface, an inner surface, and an outer surface, wherein the inner surface has a vertically oriented inner surface and an angled inner surface angled relative to the vertically oriented inner surface and the bottom surface; and a plurality of fastener holes along the... The bottom surface is formed into the annular body, each of the plurality of fastener holes having a threaded inner surface to receive a fastener for securing the annular body to the support ring; a step is disposed on the inner surface, the step having a lower horizontal surface separated from the top surface by an angled surface; a first curved edge is formed between the top surface and the outer surface; and a second curved edge is formed between the vertically oriented inner surface and the angled inner surface, wherein the radius of the second curved edge is smaller than the radius of the first curved edge. For example, in the plasma chamber of claim 77, the radius of the first curved edge is between 0.8 inches and 0.12 inches. For example, in the plasma chamber of claim 77, the radius of the second curved edge is in the range of 0.0149 inches to 0.0151 inches. As in claim 77, in the plasma chamber, a third curved edge is formed between the lower horizontal surface and the angled surface. For example, in the plasma chamber of claim 80, the radius of the third curved edge is smaller than the radius of the first curved edge and larger than the radius of the second curved edge. For example, in the plasma chamber of claim 81, the radius of the third curved edge is between 0.03 inches and 0.034 inches. As in claim 80, the plasma chamber has a fourth curved edge formed between the angled surface and the top surface. For example, in the plasma chamber of claim 83, the radius of the fourth curved edge is in the range of 0.009 inches to 0.011 inches. The plasma chamber of claim 77, wherein the angled inner surface has a vertical length ranging from 0.0345 inches to 0.0355 inches. As in claim 77, the plasma chamber wherein the angled inner surface forms an angle of 30 degrees relative to the vertically oriented inner surface. As in claim 77, the plasma chamber, wherein one of the plurality of fastener holes has a top surface and a threaded inner surface made of a conductive material of the toroidal body, wherein the threaded inner surface extends perpendicularly between the top surface of the one of the plurality of fastener holes and the bottom surface of the toroidal body, wherein the threaded inner surface is configured to contact the threads of the fastener to securely fasten the toroidal body to the support ring.