TWI902558B - Ghz pulse burst laser source system and method for drilling composite material - Google Patents

Abstract

The present invention provides a GHz pulse burst laser source system. The GHz pulse burst laser source system comprises: a carrier module, configured to carry a composite material; a laser light generator module, configured to provide a laser beam; a laser beam expander, configured to generate an expanded laser beam; an X-axis laser light Galvo scanning module, configured to reflect the expanded laser beam; a X-axis laser light Galvo controller, configured to control X-axis direction rotation angles of the X-axis laser light Galvo scanning module; a Y-axis laser light Galvo scanning module, configured to reflect the expanded laser beam; a Y-axis laser light Galvo controller, configured to control Y-axis direction rotation angles of the Y-axis laser light Galvo scanning module; and a condenser, configured to aggregate the expanded laser beam from the Y-axis laser light Galvo scanning module into an focused laser beam having a predetermined high aspect ratio, so as to project the focused laser beam to one or more drilling places of the composite material; wherein a pulse width of the laser beam is between 50 and 500 fs.

Description

GHz Pulse Train Laser Source System and Method for Drilling Composite Materials

This invention is a divisional application of Taiwan Patent Application No. 112115234 (application date: April 25, 2023), the full contents of which are incorporated herein by reference as part of the patent description.

This invention relates to a laser light source system, and more particularly to a GHz pulse train laser light source system and method for drilling composite materials.

Glass has always been an indispensable material in industry, with potential applications including optical components, microelectronics, microfluidics, and display technology. In recent years, many products have been miniaturized to the micrometer and nanometer scale, which means that the precision requirements for glass processing will be more stringent than in the past.

Femtosecond lasers represent a significant technological breakthrough in recent years. A femtosecond laser refers to a laser pulse width on the order of femtoseconds (fs, ^10⁻¹⁵ seconds). By focusing the laser beam, extremely high power density can be achieved. Furthermore, femtosecond lasers exhibit minimal heat-affected zone during material processing and can process the interiors of transparent materials. Welding is one of the most popular laser applications, and femtosecond lasers offer numerous advantages for drilling and welding, such as eliminating the need for pre-heating, providing high spatial resolution, minimizing significant thermal deformation, and allowing melting and recrystallization only near the focal point. Furthermore, compared to traditional drilling or welding, femtosecond laser glass drilling or welding can effectively achieve complete transparency of the weld point, which is a huge leap forward for glass drilling or welding.

Therefore, how to utilize femtosecond lasers to improve the processing efficiency of glass drilling or welding has become a direction for the industry to strive for.

This invention provides a GHz pulsed laser light source system and method for drilling or welding composite materials to avoid delamination at the drilled area of the processed composite material and maintain a small heat-affected zone (HAZ), thus preventing the generation of any debris and cracks at the drilled area of the processed composite material.

This invention discloses a GHz pulsed laser source system for drilling or welding composite materials, comprising a carrier module, a laser light generating module, a laser light expander, an X-axis laser light galvanometer scanning module, an X-axis laser light galvanometer controller, a Y-axis laser light galvanometer scanning module, a Y-axis laser light galvanometer controller, and a condenser. The carrier module carries the composite material. The laser light generating module provides the laser beam. The laser light expander amplifies the laser beam's laser spot to generate an amplified laser beam. The X-axis laser galvanometer scanning module reflects the amplified laser beam according to multiple X-axis rotation angles. The X-axis laser galvanometer controller is coupled to the X-axis laser galvanometer scanning module and controls these X-axis rotation angles. The Y-axis laser galvanometer scanning module receives the amplified laser beam reflected from the X-axis laser galvanometer scanning module and reflects the amplified laser beam according to multiple Y-axis rotation angles. The Y-axis laser galvanometer controller controls the rotation angles of the Y-axis laser galvanometer scanning module. The condenser lens focuses the amplified laser beam reflected from the Y-axis laser galvanometer scanning module into a focused laser beam with a predetermined high aspect ratio, projecting the focused laser beam onto one or more drilled holes in the composite material. The projection path of the focused laser beam is adjusted by the X-axis and Y-axis laser galvanometer scanning modules to deflect the focused laser beam projected onto one or more drilled holes in the composite material, or the composite material is moved to deflect one or more drilled holes in the composite material. The pulse width of the laser beam is between 50 and 500 fs, the repetition frequency of the laser beam is between 0.5 and 10 GHz, and the pulse energy of the laser beam is between 100 and 1000 μJ. The laser beam generation module, laser beam expander, X-axis laser beam scanning module, Y-axis laser beam scanning module, condenser, and carrier module are arranged in the same optical path.

This invention also discloses a method for drilling or welding composite materials, comprising: S1: providing a laser beam through a laser light generation module of a GHz pulsed laser light source system; S2: through... The GHz pulsed laser light source system includes a laser beam expander, an X-axis laser galvanometer scanning module, a Y-axis laser galvanometer scanning module, and a condenser, which generate a focused laser beam based on the laser beam; S3: The focused laser beam is projected onto one or more drilled holes in the composite material on the carrier module; S4: When the focused laser beam contacts the surface of one or more drilled holes, the surface is melted (ablation) by the focused laser beam; S5: After the focused laser beam has melted the surface, the focused laser beam is incident on the inner wall of one or more drilled holes in the composite material and smooths it; S6: Based on multiple laser parameters of the focused laser beam, a portion of the composite material is effectively removed, thereby creating one or more drilled holes at one or more drilled holes. The laser beam has a pulse width between 50 and 500 fs, a repetition frequency between 0.5 and 10 GHz, and a pulse energy between 100 and 1000 μJ. The laser beam generation module, laser beam expander, X-axis laser beam scanning module, Y-axis laser beam scanning module, condenser, and carrier module are arranged in the same optical path.

In summary, the GHz burst laser light source system and method disclosed in this invention utilizes a GHz burst laser beam with a pulse width between 50 and 500 fs to drill or weld holes in composite materials, thereby preventing delamination at the drilled areas of the processed composite materials and maintaining a small HAZ. Furthermore, due to the small HAZ of the processed composite materials, any debris and cracks can be avoided at the drilled areas.

To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and accompanying drawings are only for illustrating this invention and do not limit the scope of protection of this invention in any way.

The following specific embodiments illustrate the implementation of the "GHz pulse train laser light source system and method for drilling composite materials" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions based on actual dimensions, as stated in advance. The following embodiments will further explain the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

It should be understood that although terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" used in this document should, as appropriate, include any combination of one or more of the related listed items.

Please refer to Figure 1, which illustrates a schematic diagram of the structure of a GHz burst laser light source system D1 for drilling or welding composite materials according to an embodiment of the present invention. The GHz pulsed laser light source system D1 includes a laser light generating module 102, a laser light expander 104, an X-axis laser light galvanometer scanning module 106, an X-axis laser light galvanometer controller 108, a Y-axis laser light galvanometer scanning module 110, a Y-axis laser light galvanometer controller 112, a condenser lens 114, and a carrier module 116. The laser light generating module 102, laser light expander 104, X-axis laser light galvanometer scanning module 106, Y-axis laser light galvanometer scanning module 110, condenser lens 114, and carrier module 116 are arranged in the same optical path, but the present invention is not limited thereto. It is worth mentioning that, for example, in another feasible embodiment, the GHz pulsed laser light source system D1 includes a laser light generation module 102, a collimation module, a laser light adjustment module (not shown), a condenser lens 114, and a carrier module 116. The laser light generation module 102, collimation module, laser light adjustment module, condenser lens 114, and carrier module 116 are arranged in the same optical path, but the invention is not limited thereto.

Please refer to Figure 2A, which shows a schematic diagram of the structure of the laser light generation module 102. The laser light generation module 102 includes a pulsed laser light generation module 1022, an acousto-optic modulator (AOM) 1024, and a laser light amplifier 1026. The pulsed laser light generation module 1022 is used to generate a laser light source Ls with multiple pulse signals P1-Pn. The acousto-optic modulator (AOM) 1024 is adjacent to the pulsed laser light generation module 1022 and is used to increase the repetition frequency of the laser light source Ls, so as to generate a pulsed laser light Lb with multiple bursts based on the enhanced laser light source Ls. Laser amplifier 1026 is located adjacent to acousto-optic modulator 1024 and is used to increase the pulse energy of pulse train laser light Lb to generate laser beam L1, wherein the repetition frequency of pulse train laser light Lb is between 0.5 and 10 GHz (e.g., any positive integer between 0.5 and 10 GHz), and the pulse energy of laser beam L1 is between 100 and 1000 μJ (e.g., any positive integer between 10 and 30 mJ), but the invention is not limited thereto.

Please refer to Figure 2B, which shows a schematic diagram of the structure of multiple pulse trains B1-Bn of the laser beam L1. As shown in Figure 2B, these pulse trains B1-Bn include multiple pulse signals P1-Pn. That is, multiple pulse signals P1 form pulse train B1, multiple pulse signals P2 form pulse train B2, ..., multiple pulse signals Pn form pulse train Bn, so that these pulse trains B1-Bn respectively form multiple pulse signals P1-Pn. The pulse widths of the pulse signals P1-Pn are between 50 and 500 fs (e.g., any positive integer between 50 and 500 fs), the number of the pulse signals P1-Pn is between 50 and 1000 (e.g., any positive integer between 50 and 1000), and the frequencies of the pulse signals P1-Pn are between 1 and 2000 kHz (e.g., any positive integer between 1 and 2000 kHz), but the invention is not limited thereto.

Please refer to Figures 1, 2A, and 2B. The laser beam generating module 102 is used to provide a laser beam L1. The laser beam expander 104 is adjacent to the laser beam generating module 102 and is used to expand a laser spot of the laser beam L1 to generate an expanded laser beam L2. The laser beam L1 can be adjusted by the laser light generation module 102. The pulse width of the laser beam L1 (i.e., the pulse width of the pulse signals P1-Pn) is between 50 and 500 fs (e.g., any positive integer between 50 and 500 fs), and the repetition frequency of the laser beam L1 (i.e., the repetition frequency of the pulse train laser light Lb) is between 0.5 and 10 GHz (e.g., any positive integer between 0.5 and 10 GHz). The average power of the laser beam L1 is determined based on the pulse energy and the repetition frequency, but the invention is not limited thereto.

It is worth noting that the pulse width, pulse energy, frequency, repetition frequency, and number of pulse signals P1-Pn of the laser beam L1 can be appropriately adjusted according to individual needs. For example, if a higher pulse energy of the laser beam L1 is used for drilling or welding composite materials, the repetition frequency of the laser beam L1 can be adjusted to a lower frequency. However, the above example is only one possible embodiment and is not intended to limit the invention.

Furthermore, it is worth noting that if the pulse width, pulse energy, frequency of pulse signals P1-Pn, repetition frequency of laser beam L1, and number of pulse signals P1-Pn used in drilling or welding composite materials are below the aforementioned predetermined range, the laser beam will be difficult to use for drilling or welding composite materials. Materials; if the pulse width, pulse energy, frequency, repetition frequency, and number of pulse signals P1-Pn of the laser beam L1 used for drilling or welding composite materials exceed the aforementioned predetermined range, cracks are likely to occur at the drilled point of the composite material. For example, if the pulse width of the laser beam L1 used for drilling or welding composite materials is 600 fs, cracks are likely to occur at the drilled point of the composite material. However, the above example is only one possible embodiment and is not intended to limit the invention.

The X-axis laser beam oscillator scanning module 106 is located adjacent to the laser beam expander 104 and is used to reflect the expanded laser beam L2 according to multiple X-axis rotation angles (e.g., 0°, 30°, 60°, ...) (not shown) of the X-axis laser beam oscillator scanning module 106. That is, the X-axis laser beam oscillator scanning module 106 rotates to generate multiple rotation angles in the X-axis direction, so that the X-axis laser beam oscillator scanning module 106 reflects the expanded laser beam L2 with mirrors at different angles.

The X-axis laser galvanometer controller 108 is coupled to the X-axis laser galvanometer scanning module 106 and is used to control the rotation angles of the X-axis laser galvanometer scanning module 106 in certain X-axis directions. For example, the X-axis laser galvanometer controller 108 can drive the X-axis laser galvanometer scanning module 106 to rotate according to control commands, so that the X-axis laser galvanometer scanning module 106 generates multiple rotation angles in specific X-axis directions. However, the above example is only one possible embodiment and is not intended to limit the invention.

The Y-axis laser galvanometer scanning module 110 is adjacent to the X-axis laser galvanometer scanning module 106 and is used to receive the amplified laser beam L2 reflected from the X-axis laser galvanometer scanning module 106. The amplified laser beam L2 is reflected according to multiple rotation angles in the Y-axis direction of the Y-axis laser galvanometer scanning module 110. That is, the Y-axis laser galvanometer scanning module 110 rotates to generate multiple rotation angles in the Y-axis direction, so that the Y-axis laser galvanometer scanning module 110 reflects the amplified laser beam L2 with mirror surfaces at different angles.

The Y-axis laser galvanometer controller 112 is coupled to the Y-axis laser galvanometer scanning module 110 and is used to control the rotation angles of the Y-axis laser galvanometer scanning module 110 in certain Y-axis directions. For example, the Y-axis laser galvanometer controller 112 can drive the Y-axis laser galvanometer scanning module 110 to rotate according to control commands, so that the Y-axis laser galvanometer scanning module 110 generates multiple rotation angles in a specific Y-axis direction. However, the above example is only one possible embodiment and is not intended to limit the invention.

Specifically, users can input control commands to the X-axis laser galvanometer controller 108 and the Y-axis laser galvanometer controller 112 according to drilling requirements. The X-axis laser galvanometer controller 108 and the Y-axis laser galvanometer controller 112 then send corresponding drive commands to the X-axis laser galvanometer scanning module 106 and the Y-axis laser galvanometer scanning module 110, respectively, based on their control commands. The X-axis laser galvanometer scanning module 106 and the Y-axis laser galvanometer scanning module 110 are driven to rotate according to their respective driving commands, generating multiple rotation angles in specific X-axis and Y-axis directions. This allows the X-axis and Y-axis laser galvanometer scanning modules 106 and 110 to amplify the laser beam L2 by reflecting the mirror surface at different angles according to drilling requirements. However, the above example is only one possible embodiment and is not intended to limit the invention.

The carrier module 116 is used to carry the composite material 118. A condenser lens 114 is adjacent to the Y-axis laser galvanometer scanning module 110 and is used to focus the amplified laser beam L2 reflected from the Y-axis laser galvanometer scanning module 110 into a focused laser beam L3 with a predetermined high aspect ratio, so as to project the focused laser beam L3 onto one or more drilled locations 120 of the composite material 118. The composite material 118 has a thickness of 50~1000 µm and includes at least two substrates prepared for drilling, each substrate being a glass, a metal, a ceramic, or a semiconductor wafer, but the invention is not limited thereto.

Specifically, the projection path of the focused laser beam L3 can be adjusted by the X-axis laser oscillator scanning module 106 and the Y-axis laser oscillator scanning module 110 so that the focused laser beam L3 projected onto one or more drill holes 120 of the composite material 118 is deflected at a deflection velocity V. That is, the focused laser beam L3 is projected onto one or more drill holes 120 of the composite material 118 at a deflection velocity V. In one embodiment, the composite material 118 can be offset at a deflection velocity V by moving the carrier module 116 (e.g., the carrier module 116 can move along the X-axis or Y-axis on a horizontal plane). That is, the carrier module 116 is offset in parallel at a deflection velocity V, thereby causing the one or more drilled points 120 of the composite material 118 to be offset at a deflection velocity V. The deflection velocity V of the focused laser beam L3 is determined according to the repetition frequency of the laser beam L1, but the invention is not limited thereto.

Therefore, by adjusting the X-axis laser galvanometer scanning module 106 and the Y-axis laser galvanometer scanning module 110, or by moving the support module 116, the focused laser beam L3 is projected onto the drilling location 120 of the composite material 118 for drilling. For details regarding the drilling method of the focused laser beam L3 on the composite material 118, please refer to Figure 3 below.

Please refer to Figure 3, which illustrates the drilling method of the focused laser beam L3. First, the focused laser beam L3 is projected onto one or more drilled locations 120 of the composite material 118 on the carrier module 116. When the focused laser beam L3 contacts the surface 122 of the drilled location 120, it melts (ablation) the surface 122. Then, after the focused laser beam L3 has completely melted the surface 122, it enters the inner wall 124 of the drilled location 120 of the composite material 118 and smooths it. Finally, according to the focused laser beam... Multiple laser parameters of beam L3 are used to effectively remove a portion of the composite material, thereby creating one or more drill holes 126 at one or more drill points 120. The way in which the focused laser beam L3 melts from the surface 122 to the inner wall 124 is called the preheating phenomenon. The multiple laser parameters include the pulse width of laser beam L1, the pulse energy of laser beam L1, the number of multiple pulse signals P1-Pn of multiple pulse trains B1-Bn of laser beam L1, the repetition frequency of laser beam L1, and the frequency of multiple pulse signals P1-Pn. Furthermore, during the process of the focused laser beam L3 melting the inner wall 124, the focused laser beam L3 undergoes reflection under grazing incidence and multiple scattering on the inner wall 124. The focused laser beam L3 loses some energy with each reflection, causing the drill energy to decrease as the drill depth increases, until the drill depth reaches saturation.

Specifically, when the bottom influence of the focused laser beam L3 is lower than a fusion threshold, melting of the inner wall 124 stops. The bottom influence can be considered as the energy density of the composite material melted by the laser beam; energy density refers to the joules per square unit of the laser beam. The melting threshold can be adjusted according to the pulse width of the laser beam L1, the pulse energy of the laser beam L1, the number of multiple pulse signals P1-Pn of the multiple pulse trains B1-Bn of the laser beam L1, the repetition frequency of the laser beam L1, and the frequency of the multiple pulse signals P1-Pn, but the present invention is not limited thereto.

Please refer to Figure 4, which illustrates a flowchart of the drilling method used in Figures 1 and 3. The method includes: Step S1: Providing a laser beam L1 through the laser light generation module 102 of the GHz pulsed laser light source system D1; Step S2: Through... The GHz pulsed laser light source system D1 includes a laser beam expander 104, an X-axis laser beam scanning module 106, a Y-axis laser beam scanning module 110, and a condenser 114. Based on the laser beam L1, a focused laser beam L3 is generated. Step S3: The focused laser beam L3 is projected onto one or more drilled holes 120 on the composite material 118 of the carrier module 116. Step S4: When the focused laser beam L3 contacts the surface 122 of one or more drilled holes 120, Step S5: When the focused laser beam L3 has completely melted the surface 122, the focused laser beam L3 is incident on the inner wall 124 of one or more drill holes 120 of the composite material 118 and smooths it; Step S6: According to multiple laser parameters of the focused laser beam L3, a portion of the composite material is effectively removed, thereby creating one or more drill holes 126 at one or more drill holes 120.

Please refer to Figure 5, which shows a schematic diagram of the processing result using the drilling method in Figure 3. As shown in Figure 5, the drill holes 126 of one or more drill points 120 are cylindrical holes with a fixed diameter. The inner wall of the drill holes 126 is a smooth surface. The depth of the drill holes 126 is determined according to the number of pulse trains and the energy density, and the depth of the drill holes 126 varies linearly. The diameter of the drilled holes 126 is between 20 and 40 µm, the depth of the drilled holes 126 is between 70 and 295 µm, and the smoothness (Rz) of the inner wall of the drilled holes 126 is between 100 and 5000 nm (ten-point average roughness Rz), but the present invention is not limited thereto.

Please refer to Figure 6, which illustrates the processing result of the composite material 118 using the drilling method of Figure 3. As shown in Figure 6, through the drilling method of Figure 3, no delamination occurred at one or more drilled locations 120 of the processed composite material 118, and a small heat-affected zone (HAZ) was maintained. Therefore, the processed composite material 118 and its surface 122 were undamaged, and the measured electrical performance was normal. Furthermore, due to the small HAZ of the processed composite material 118, any debris and cracks can be avoided at one or more drilled locations 120 of the processed composite material 118.

Therefore, the GHz pulsed laser light source system D1 of this invention uses a GHz pulsed laser beam L1 with a pulse width between 50 and 500 fs to drill or weld one or more drilled locations 120 of the composite material 118, thereby avoiding delamination at the drilled locations 120 of the composite material 118 after processing and maintaining a small HAZ. Furthermore, because the HAZ of the processed composite material 118 is small, any fragments and cracks can be avoided at the drilled locations 120 of the processed composite material 118.

It is worth mentioning that the implementation of the GHz pulsed laser light source system D1 for welding composite materials of the present invention, as well as the advantages and effects of the present invention, can be clearly understood through the above specific examples. However, the present invention is not limited to the examples mentioned above.

[Beneficial effects of this invention's embodiments]

In summary, the GHz burst laser light source system and method disclosed in this invention utilizes a GHz burst laser beam with a pulse width between 50 and 500 fs to drill or weld holes in composite materials, thereby preventing delamination at the drilled areas of the processed composite materials and maintaining a small HAZ. Furthermore, due to the small HAZ of the processed composite materials, any debris and cracks can be avoided at the drilled areas.

Furthermore, the GHz pulsed laser light source system and method provided by this invention can be used for drilling or welding composite materials such as glass-to-glass, glass-to-metal, glass-to-ceramic, and glass-to-silicon wafers (silicon slabs), and can be applied to 5G power devices using third-generation semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC).

Furthermore, the composite materials used in this invention (e.g., glass) have advantages such as low electromagnetic signal shielding, high hardness, low cost, and light weight, which have led to their gradual adoption as materials for 3C panels and camera modules in recent years. Therefore, the value of using femtosecond lasers for glass drilling or welding in this invention is correspondingly increased, processing efficiency is improved, and economic costs are reduced, thus showing broad prospects.

The above-disclosed content is merely a preferred feasible embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's description and drawings are included within the scope of the present invention's patent.

102: Laser Beam Generation Module 104: Laser Beam Expander 106: X-Axis Laser Gorilla Mirror Scanning Module 108: X-Axis Laser Gorilla Mirror Controller 110: Y-Axis Laser Gorilla Mirror Scanning Module 112: Y-Axis Laser Gorilla Mirror Controller 114: Condenser 116: Support Module 118: Composite Material 120: Drill Hole 122: Surface 124: Inner Wall 126: Drill Hole 1022: Pulsed Laser Beam Generation Module 1024: Acousto-optic Modulator 1026: Laser Amplifier D1: GHz Pulsed Series Laser Source System L1: Laser Beam L2: Expanded laser beam L3: Focused laser beam V: Deflection velocity P1-Pn: Pulse signal Ls: Laser source Lb: Pulse train laser beam B1-Bn: Pulse signal HAZ: Thermally affected area S1-S6: Steps

Figure 1 illustrates a schematic diagram of a GHz pulsed laser light source system for drilling or welding composite materials according to an embodiment of the present invention.

Figure 2A shows a schematic diagram of the structure of the laser light generating module.

Figure 2B shows a schematic diagram of multiple pulse trains of a laser beam.

Figure 3 shows a schematic diagram of the drilling method of the focused laser beam.

Figure 4 shows a flowchart of the drilling method used in Figures 1 and 3.

Figure 5 shows a schematic diagram of the processing result using the drilling method shown in Figure 3.

Figure 6 is a schematic diagram showing the processing result of composite materials using the drilling method shown in Figure 3.

102: Laser light generation module

104: Laser Beamer

106: X-axis laser oscilloscope scanning module

108: X-axis laser oscillator controller

110: Y-axis laser oscilloscope scanning module

112: Y-axis laser oscillator controller

114: Focusing Lens

116: Load-bearing module

118: Composite Materials

120: Drilling location

D1: GHz Pulsed Laser Light Source System

L1: Laser Beam

L2: Expand laser beam

L3: Focused laser beam

V: Offset velocity

Claims (10)

A GHz pulsed laser light source system includes: a carrier module for carrying a composite material; a laser light generating module for providing a laser beam; a laser beam expander for expanding a laser spot of the laser beam to generate an expanded laser beam; an X-axis laser galvanometer scanning module for reflecting the expanded laser beam according to a plurality of X-axis rotation angles of the X-axis laser galvanometer scanning module; and an X-axis laser galvanometer controller coupled to the X-axis laser galvanometer scanning module. The system includes: an X-axis laser scanning module for controlling the rotation angles of the X-axis directions of the X-axis laser scanning module; a Y-axis laser scanning module for receiving the amplified laser beam reflected from the X-axis laser scanning module and reflecting the amplified laser beam according to a plurality of Y-axis rotation angles of the Y-axis laser scanning module; a Y-axis laser scanning module controller for controlling the rotation angles of the Y-axis laser scanning module; and a condenser lens for focusing the light reflected from the X-axis laser scanning module. The amplified laser beam reflected by the Y-axis laser galvanometer scanning module is focused into a focused laser beam with a predetermined aspect ratio, so as to project the focused laser beam onto the composite material; wherein, the laser light generation module includes: a pulsed laser light generation module for generating a laser light source having a plurality of pulse signals; and an acousto-optic modulator, adjacent to the pulsed laser light generation module, for increasing the repetition frequency of the laser light source, so as to generate a plurality of pulse signals based on the increased laser light source. A pulsed series of laser beams; and a laser amplifier, located adjacent to the acousto-optic modulator, for increasing the pulse energy of the pulsed series of laser beams to generate the laser beam, wherein the pulses include the pulse signals; wherein the focused laser beam is projected at a deflection velocity onto one or more drill holes in the composite material, the one or more drill holes including one or more drill holes; wherein the one or more drill holes have a fixed hole diameter between 20 and 40 µm, the hole depth between 70 and 295 µm, and the inner wall smoothness between 100 and 5000 nm. The GHz pulse train laser light source system as described in claim 1, wherein the pulse width of the laser beam is between 50 and 500 fs, the repetition frequency of the laser beam is between 0.5 and 10 GHz, the pulse energy of the laser beam is between 100 and 1000 μJ, the laser light generating module, the laser light expander, the X-axis laser light galvanometer scanning module, the Y-axis laser light galvanometer scanning module, the condenser lens, and the carrier module are arranged in the same optical path, and the frequency of the pulse signals is between 1 and 2000 kHz. The GHz pulse train laser light source system as described in claim 1, wherein the projection path of the focused laser beam is adjusted by the X-axis laser oscillator scanning module and the Y-axis laser oscillator scanning module to deflect the focused laser beam projected onto one or more drill holes in the composite material, or the composite material is deflected by the movement of the carrier module to deflect one or more drill holes in the composite material; wherein the carrier module deflects at the deflection speed, the one or more drill holes are cylindrical holes, the inner walls of the one or more drill holes are smooth walls, and the depth of the one or more drill holes is determined according to the number of pulse trains and an energy density. The GHz pulsed laser light source system as described in claim 3, wherein the deflection velocity of the focused laser beam is determined based on the repetition frequency of the laser beam, and an average power of the laser beam is determined based on the pulse energy of the laser beam and the repetition frequency of the laser beam. The GHz pulsed laser light source system as described in claim 1, wherein the composite material has a thickness of 50 to 1000 µm and includes at least two substrates prepared for drilling, each substrate being a glass, a metal, a ceramic, or a semiconductor wafer. A method for drilling composite materials includes: S1: providing a laser beam through a laser light generating module of a GHz pulsed laser light source system; S2: through the... A GHz pulsed laser light source system includes a laser beam expander, an X-axis laser galvanometer scanning module, a Y-axis laser galvanometer scanning module, and a condenser, which generate a focused laser beam based on the laser beam; S3: Projecting the focused laser beam onto one or more drilled holes in a composite material on a carrier module; S4: When the focused laser beam contacts a surface at one or more drilled holes, melting the surface through the focused laser beam; S5: After the focused laser beam has melted the surface, the focused laser beam is incident on an inner wall of the composite material at one or more drilled holes and smooths it; and S6: Based on a plurality of laser parameters of the focused laser beam, effectively removing a portion of... The composite material thereby creates one or more drilled holes at the one or more drilled locations; wherein the laser light generating module includes: a pulsed laser light generating module for generating a laser light source having a plurality of pulse signals; and an acousto-optic modulator, adjacent to the pulsed laser light generating module, for increasing the repetition frequency of the laser light source, based on the increased frequency of the laser light source. A laser source generates a pulsed laser beam having a plurality of pulse trains; and a laser amplifier, adjacent to the acousto-optic modulator, is used to increase the pulse energy of the pulsed laser beam to generate the laser beam, wherein the pulse trains include the pulse signals; wherein the one or more drill holes have a fixed hole diameter between 20 and 40 µm, the hole depth between 70 and 295 µm, and the inner wall smoothness of the one or more drill holes between 100 and 5000 nm. The method for drilling composite materials as described in claim 6, wherein the pulse width of the laser beam is between 50 and 500 fs, the repetition frequency of the laser beam is between 0.5 and 10 GHz, the pulse energy of the laser beam is between 100 and 1000 μJ, the laser beam generating module, the laser beam expander, the X-axis laser beam scanning module, the Y-axis laser beam scanning module, the condenser, and the carrier module are arranged in the same optical path, and the frequency of the pulse signals is between 1 and 2000 kHz. The method for drilling composite materials as described in claim 6, wherein the focused laser beam is projected onto one or more drill holes in the composite material at an offset velocity, the carrier module is offset at the offset velocity, the one or more drill holes are cylindrical holes, the inner walls of the one or more drill holes are smooth walls, and the depth of the one or more drill holes is determined based on the number of pulse trains and an energy density. The method for drilling composite materials as described in claim 8, wherein the deflection velocity of the focused laser beam is determined based on the repetition frequency of the laser beam, and an average power of the laser beam is determined based on the pulse energy of the laser beam and the repetition frequency of the laser beam. The method for drilling a composite material as described in claim 6, wherein the composite material has a thickness of 50 to 1000 µm and includes at least two substrates prepared for drilling, each substrate being a glass, a metal, a ceramic, or a semiconductor wafer.