TWI902017B - Matrix 3d scanning and positioning system and image capturing method using the same - Google Patents
Matrix 3d scanning and positioning system and image capturing method using the sameInfo
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Abstract
Description
本發明係關於一種三維建模系統及方法;更特別言之,本發明係關於一種利用二維影像取像進而建構三維建模之矩陣式三維掃描定位系統及其取像方法。 This invention relates to a three-dimensional modeling system and method; more specifically, it relates to a matrix-based three-dimensional scanning and positioning system and its image acquisition method for constructing three-dimensional models using two-dimensional images.
三維建模技術於現代已受到相當重視。通常,三維建模係指以攝像機所擷取之圖像為基礎,透過重構之演算法,計算還原出真實場景或物件之三維立體空間訊息。此種技術已廣泛應用於自動駕駛、3D列印、智慧機器人視覺、醫療、虛擬實境、電子商務、遊戲娛樂、自動化製造等產業。 3D modeling technology has gained considerable importance in modern times. Generally, 3D modeling refers to using images captured by a camera as a basis, and through reconstruction algorithms, calculating and reconstructing the three-dimensional spatial information of a real scene or object. This technology has been widely applied in industries such as autonomous driving, 3D printing, intelligent robot vision, medicine, virtual reality, e-commerce, gaming and entertainment, and automated manufacturing.
實現上述三維建模之方式,其一為透過使用特殊設備,諸如利用可運算深度訊息之取像裝置直接生成三維影像。惟此種方式仰賴於複雜之硬體設備及專業操作,設備成本高且不利於普及。另一為透過諸如MVS(Multi View Stereo)算法,對擷取之多張二維影像進行對位拼接合成三維影像。惟此類算法耗費資源過大,不利於使用一般資源有限之設備進行 運算。再者,其多張影像之間之匹配定位參數選取仍過於複雜。另亦有其餘通過攝像進行三維建模之方式者,惟對於各三維影像間如何進行拼接處理,仍仰賴大量人力操作或複雜運算,於成本仍居高不下。 One method for achieving the aforementioned 3D modeling is through specialized equipment, such as image acquisition devices capable of processing depth information, to directly generate 3D images. However, this method relies on complex hardware and specialized operation, resulting in high equipment costs and hindering widespread adoption. Another method involves using algorithms such as MVS (Multi-View Stereo) to align and stitch multiple captured 2D images to create a 3D image. However, such algorithms are resource-intensive and impractical for equipment with limited resources. Furthermore, the selection of matching and positioning parameters between multiple images remains overly complex. There are also other methods for 3D modeling using photography, but the stitching process between the various 3D images still relies heavily on manual labor or complex calculations, keeping costs high.
基於此,開發具有簡易高效運算,可普遍運用尋常設備即可構成精確之三維建模系統者仍有必要。 Therefore, it remains necessary to develop a simple and efficient 3D modeling system that can be constructed using common equipment to achieve accurate results.
本發明係提供一種矩陣式三維掃描定位系統及其取像方法,其可使用矩陣式攝像模組,配合特殊之取像方法及運算,可於拼接二維影像進行三維建模時,提高準確度及效率,並可高度還原待測物之真實幾何型態及顏色者。 This invention provides a matrix-based 3D scanning and positioning system and its image acquisition method. It utilizes a matrix camera module, combined with a special image acquisition method and calculations, to improve accuracy and efficiency when stitching 2D images for 3D modeling, and can highly reproduce the true geometric shape and color of the object under test.
於一實施方式,本發明揭示一種矩陣式三維掃描定位系統,其包含一基座、一參考模組、一矩陣式攝像模組以及一處理器模組。基座供置放一待測物。參考模組設置於基座上,其包含多個顏色區塊。矩陣式攝像模組包含矩陣式排列之多個攝像頭。矩陣式攝像模組透過多個攝像頭掃描待測物,同時擷取包含待測物及參考模組之顏色區塊之多個二維影像並傳送一影像訊號。處理器模組用以接收矩陣式攝像模組傳送之影像訊號,依據顏色區塊之顏色對多個二維影像進行影像辯識及對齊定位分析,將多個二維影像組合成對應待測物之真實幾何型態及顏色之一三維影像。 In one embodiment, the present invention discloses a matrix-based 3D scanning and positioning system, comprising a base, a reference module, a matrix-based camera module, and a processor module. The base is used to place an object to be measured. The reference module is disposed on the base and includes multiple color blocks. The matrix-based camera module includes multiple cameras arranged in a matrix. The matrix-based camera module scans the object to be measured through the multiple cameras, simultaneously capturing multiple 2D images containing the object to be measured and the color blocks of the reference module, and transmitting an image signal. The processor module receives image signals from the matrix camera module, performs image recognition and alignment analysis on multiple two-dimensional images based on the color of color blocks, and combines the multiple two-dimensional images into a three-dimensional image that corresponds to the true geometric shape and color of the object under test.
於一實施例,矩陣式攝像模組之攝像頭可裝配於一攝像機、一手機、一筆電或一平板電腦。 In one embodiment, the camera of the matrix camera module can be mounted on a camera, a mobile phone, a laptop, or a tablet computer.
於一實施例,各顏色區塊可具相同或相異顏色。 In one embodiment, the colored areas may have the same or different colors.
於一實施例,各顏色區塊包含一漸層色環。 In one embodiment, each colored area comprises a gradient color wheel.
於一實施例,多個攝像頭可排列呈一線性陣列。 In one embodiment, multiple cameras can be arranged in a linear array.
於一實施例,多個攝像頭可排列呈一環形陣列。 In one embodiment, multiple cameras can be arranged in a circular array.
於一實施例,各攝像頭相對待測物呈不同角度以擷取待測物相異部分之影像。 In one embodiment, each camera is positioned at a different angle relative to the object under test to capture images of different portions of the object.
於一實施例,處理器模組係可設置於矩陣式攝像模組中或設置於與矩陣式攝像模組連線之外部裝置中。 In one embodiment, the processor module can be located within the matrix camera module or in an external device connected to the matrix camera module.
於一實施例,基座上可設置多個標記點。矩陣式攝像模組中之各攝像頭對應各標記點之位置以於合成多個二維影像時進行對齊定位。 In one embodiment, multiple marker points can be set on the base. Each camera in the matrix camera module corresponds to a marker point for alignment and positioning when synthesizing multiple 2D images.
於一實施方式,本發明揭示一種應用上述矩陣式三維掃描定位系之取像方法,其包含:將待測物置於基座上;將參考模組設置於基座上;架設矩陣式攝像模組,將多個攝像頭進行矩陣式排列;透過多個攝像頭掃描待測物,同時擷取包含待測物及參考模組之該些顏色區塊之多個二維影像並傳送一影像訊號;以及透過處理器模組接收矩陣式攝像模組傳送之影像訊號,並依據該些顏色區塊之顏色對該些二維影像進行影像辨識及對齊定位分析,將該些二維影像組合成對應待測物之真實幾何型態及顏色之一三維影像。 In one embodiment, this invention discloses an image acquisition method using the aforementioned matrix-type 3D scanning and positioning system, comprising: placing the object to be measured on a base; placing a reference module on the base; setting up a matrix-type imaging module, arranging multiple cameras in a matrix; scanning the object to be measured through the multiple cameras, simultaneously capturing multiple two-dimensional images including the object to be measured and the color blocks of the reference module, and transmitting an image signal; and receiving the image signal transmitted by the matrix-type imaging module through a processing module, and performing image recognition and alignment positioning analysis on the two-dimensional images according to the colors of the color blocks, combining the two-dimensional images into a three-dimensional image corresponding to the true geometric shape and color of the object to be measured.
於一實施例,上述取像方法更包含:設置多個標記點於基座上,令矩陣式攝像模組中之各攝像頭對應各標記點之位置,以於合成多個二維影像時進行對齊定位。 In one embodiment, the above image acquisition method further includes: setting multiple marker points on a base, and aligning each camera in the matrix camera module with the position of each marker point, so as to perform alignment and positioning when synthesizing multiple two-dimensional images.
於一實施例,各顏色區塊可具相同或相異顏色。 In one embodiment, the colored areas may have the same or different colors.
於一實施例,各顏色區塊包含一漸層色環。 In one embodiment, each colored area comprises a gradient color wheel.
於一實施例,上述取像方法更包含:轉動矩陣式攝像模組或待測物,以令矩陣式攝像模組中之各攝像頭拍攝待測物之各部分影像以合成一完整三維影像。 In one embodiment, the above image acquisition method further includes: rotating the matrix camera module or the object under test, so that each camera in the matrix camera module captures images of different parts of the object under test to synthesize a complete three-dimensional image.
100:矩陣式三維掃描定位系統 100: Matrix-based 3D Scanning and Positioning System
110:基座 110: Base
120:參考模組 120: Reference Module
120a:顏色區塊 120a: Color Blocks
130:矩陣式攝像模組 130: Matrix Camera Module
130a:攝像頭 130a: Camera
O:待測物 O: Analyzer Test Item
M:標記點 M: Marker point
S101、S102、S103、S104、S105:步驟 S101, S102, S103, S104, S105: Steps
第1圖係繪示依據本發明一實施例之矩陣式三維掃描定位系統之實體架構示意圖; Figure 1 is a schematic diagram illustrating the physical structure of a matrix-based 3D scanning positioning system according to an embodiment of the present invention;
第2圖係繪示第1圖中之矩陣式攝像模組之一種設置方式示意圖; Figure 2 is a schematic diagram illustrating one configuration of the matrix camera module shown in Figure 1;
第3圖係繪示第1圖中之矩陣式攝像模組之另一種設置方式示意圖; Figure 3 is a schematic diagram illustrating another configuration of the matrix camera module shown in Figure 1;
第4圖係繪示依據第1圖之矩陣式三維掃描定位系統進行影像對齊定位之示意圖; Figure 4 is a schematic diagram illustrating image alignment and positioning based on the matrix-based 3D scanning positioning system in Figure 1;
第5圖係繪示依據應用前述之矩陣式三維掃描定位系統之一種取像方法流程示意圖。 Figure 5 is a flowchart illustrating one image acquisition method based on the aforementioned matrix-based 3D scanning and positioning system.
以下將參照圖式說明本發明之複數個實施例。為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施例中,這些實務上的細節是非必要的。此外,為簡化圖式及著重於本案主要技術特徵,一些習知慣用、非必要的結構與元件,將在圖式中以簡單示意的方式繪示或省略之。 Several embodiments of the present invention will be described below with reference to the drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is, these practical details are not essential in some embodiments of the present invention. Furthermore, to simplify the drawings and emphasize the main technical features of the present invention, some conventional and non-essential structures and components will be shown in the drawings in a simplified schematic manner or omitted.
請參照第1圖。第1圖係繪示依據本發明一實施例之矩陣式三維掃描定位系統100之實體架構示意圖。 Please refer to Figure 1. Figure 1 is a schematic diagram illustrating the physical structure of a matrix-based 3D scanning and positioning system 100 according to an embodiment of the present invention.
矩陣式三維掃描定位系統100包含一基座110、一參考模組120、一矩陣式攝像模組130以及一處理器模組140。基座110供置放一待測物O。參考模組140設置於基座110上。 The matrix-based 3D scanning and positioning system 100 includes a base 110, a reference module 120, a matrix-based camera module 130, and a processor module 140. The base 110 is used to place an object O to be measured. The reference module 140 is mounted on the base 110.
參考模組120設置於基座110上之型式無特別限制,其可於基座110製造時一體成型地設置,或是額外單獨地設置於基座110上。參考模組120包含多個顏色區塊120a。各顏色區塊120a可具相同或相異顏色,亦或各顏色區塊120a可包含一漸層色環。 The form in which the reference module 120 is disposed on the base 110 is not particularly limited; it can be integrally formed during the manufacturing of the base 110, or it can be separately disposed on the base 110. The reference module 120 includes multiple color blocks 120a. Each color block 120a can have the same or different colors, or each color block 120a can include a gradient color ring.
矩陣式攝像模組130包含矩陣式排列之多個攝像頭130a。各攝像頭130a可裝配於一攝像機、一手機、一筆電或一平板電腦上。換言之,可使用任何具攝像功能之攝像裝置組成矩陣式攝像模組130。矩陣式攝像模組130透過矩陣式排列之 多個攝像頭130a掃描待測物O,以拍攝對應待測物O之不同部位之影像。同時,於拍攝時,同時擷取包含待測物O及參考模組120之顏色區塊120a之多個二維影像。換言之,各攝像頭130a所拍攝之二維影像內,包含待測物O之部分影像以及參考模組120之顏色區塊120a之部分影像。於拍攝二維影像後,將其轉化為一影像訊號並傳送該影像訊號。 The matrix camera module 130 includes multiple cameras 130a arranged in a matrix. Each camera 130a can be mounted on a camera, a mobile phone, a laptop, or a tablet computer. In other words, any camera device with imaging capabilities can be used to form the matrix camera module 130. The matrix camera module 130 scans the object under test O through the multiple cameras 130a arranged in a matrix to capture images of different parts of the object under test O. At the same time, during the capture, multiple two-dimensional images containing the object under test O and the color blocks 120a of the reference module 120 are simultaneously captured. In other words, the two-dimensional images captured by each camera 130a include a portion of the image of the object under test O and a portion of the image of the color block 120a of the reference module 120. After capturing the two-dimensional image, it is converted into an image signal and transmitted.
處理器模組140用以接收矩陣式攝像模組130所傳送之影像訊號。同時,處理器模組140載有相關軟體程序,並依據顏色區塊120a之顏色,對不同攝像頭130a所拍攝之待測物O不同部分之多個二維影像進行影像辨識及對齊定位分析,並將多個二維影像組合成對應待測物O完整之真實幾何型態及顏色之一三維影像。 The processor module 140 receives image signals transmitted from the matrix camera module 130. Simultaneously, the processor module 140 carries relevant software programs and, based on the color of color blocks 120a, performs image recognition and alignment analysis on multiple two-dimensional images of different parts of the object under test O captured by different cameras 130a. It then combines these multiple two-dimensional images into a three-dimensional image that corresponds to the complete true geometric shape and color of the object under test O.
處理器模組140可設置於矩陣式攝像模組130中或設置於與矩陣式攝像模組130連線之外部裝置中。舉例而言,矩陣式攝像模組130中之攝像頭130a若裝配於一手機、一筆電或一平板電腦,則其自身即載有具運算功能之微處理器及軟體。攝像頭130a若裝配於一相機或錄影機中,則可以無線或有線連線方式,將其拍攝得到之二維影像轉化為影像訊號,並傳送至外部裝置進行影像辨識及運算分析。 The processor module 140 can be housed within the matrix camera module 130 or in an external device connected to the matrix camera module 130. For example, if the camera 130a in the matrix camera module 130 is mounted on a mobile phone, laptop, or tablet, it inherently contains a microprocessor and software with computing capabilities. If the camera 130a is mounted in a camera or video recorder, it can wirelessly or wiredly convert the captured two-dimensional images into image signals and transmit them to an external device for image recognition and analysis.
一般於合成多個二維影像進行三維影像建模時,是否得以完整真實還原對應原待測物之真實幾何型態及顏色,為一重要課題。本發明中,導入參考模組120之影像於影 像合成建模過程中,於進行影像辨識分析及合成之演算程序時,將參考模組120之顏色區塊120a之顏色一併進行運算。此種方式有利於待測物O各部分之二維影像拼接時之準確性。同時,藉由參考顏色之引入,減少不必要之顏色耗費,可增加影像合成效率。各顏色區塊120a可具相同或相異顏色,亦或各顏色區塊120a可包含一漸層色環。藉由多層次之過渡色彩或相異顏色,增加二維影像拼接之準確性,提高三維影像建模之真實度。 When synthesizing multiple 2D images for 3D image modeling, accurately reproducing the true geometry and color of the original object under test is a crucial issue. In this invention, during the image synthesis modeling process, the color of color blocks 120a of the reference module 120 is calculated together with the image of the reference module 120 during image recognition analysis and synthesis calculations. This method improves the accuracy of stitching together the 2D images of the various parts of the object under test O. Simultaneously, by introducing reference colors, unnecessary color consumption is reduced, increasing image synthesis efficiency. Each color block 120a can have the same or different colors, or each color block 120a can contain a gradient color wheel. By using multi-layered transitional colors or contrasting colors, the accuracy of 2D image stitching is increased, and the realism of 3D image modeling is improved.
請參照第2圖及第3圖。第2圖係繪示第1圖中之矩陣式攝像模組130之一種設置方式示意圖。第3圖係繪示第1圖中之矩陣式攝像模組130之另一種設置方式示意圖。 Please refer to Figures 2 and 3. Figure 2 is a schematic diagram illustrating one configuration of the matrix camera module 130 in Figure 1. Figure 3 is a schematic diagram illustrating another configuration of the matrix camera module 130 in Figure 1.
為拍攝待測物各部分之多種角度,以得到更精確之三維影像合成效果。矩陣式攝像模組130中之多個攝像頭130a可選擇多種排列方式。第2圖中,多個攝像頭130a排列呈一線性陣列。換言之,多個攝像頭130a係沿一直線同軸地設置。攝像頭130a之數量並無特別限制,惟選取數量較多的攝像頭130a可拍攝數量較多的待測物O各部位及參考模組120之顏色區塊120a之二維影像,可合成更接近待測物O真實幾何型態及顏色之三維影像。第3圖中,多個攝像頭130a排列呈一環形陣列。換言之,多個攝像頭130a圍繞待測物O呈一環形,以拍攝待測物O各部位及參考模組120之顏色區塊120a之二維影像。此外,一維線性陣列可依據不同攝像頭數量擴展為二維陣 列。 To capture images of various parts of the object under test from multiple angles and obtain a more accurate 3D image synthesis effect, the multiple cameras 130a in the matrix camera module 130 can be arranged in various ways. In Figure 2, the multiple cameras 130a are arranged in a linear array. In other words, the multiple cameras 130a are set up coaxially along a straight line. There is no particular limitation on the number of cameras 130a, but selecting a larger number of cameras 130a can capture more 2D images of various parts of the object under test O and the color blocks 120a of the reference module 120, which can synthesize a 3D image that more closely resembles the true geometry and color of the object under test O. In Figure 3, multiple cameras 130a are arranged in a circular array. In other words, multiple cameras 130a surround the object under test O in a ring to capture two-dimensional images of various parts of the object O and the color blocks 120a of the reference module 120. Furthermore, the one-dimensional linear array can be expanded into a two-dimensional array depending on the number of cameras.
請參照第4圖。第4圖係繪示依據第1圖之矩陣式三維掃描定位系統100進行影像對齊定位之示意圖。矩陣式三維掃描定位系統100中,基座110上可設置多個標記點M。矩陣式攝像模組130中之各攝像頭130a對應各標記點M之位置,並利用三角定位法,可於進行合成多個二維影像時進行對其定位。 Please refer to Figure 4. Figure 4 is a schematic diagram illustrating image alignment and positioning using the matrix-based 3D scanning and positioning system 100 as shown in Figure 1. In the matrix-based 3D scanning and positioning system 100, multiple marker points M can be set on the base 110. Each camera 130a in the matrix-based camera module 130 corresponds to the position of each marker point M, and using triangulation, it can be positioned when synthesizing multiple 2D images.
請參照第5圖。第5圖係繪示依據應用前述之矩陣式三維掃描定位系統之一種取像方法流程示意圖。第5圖之取像方法中,包含:步驟S101係將待測物置於基座上;步驟S102係將參考模組設置於基座上;步驟S103係架設矩陣式攝像模組,將多個攝像頭進行矩陣式排列;步驟S104係透過多個攝像頭掃描待測物,同時擷取包含待測物及參考模組之多個顏色區塊之多個二維影像並傳送一影像訊號;步驟S105係透過處理器模組接收矩陣式攝像模組傳送之影像訊號,並依據多個顏色區塊之顏色對多個二維影像進行影像辨識及對齊定位分析,將多個二維影像組合成對應待測物之真實幾何型態及顏色之一三維影像。 Please refer to Figure 5. Figure 5 is a schematic flowchart illustrating an image acquisition method based on the aforementioned matrix-type 3D scanning and positioning system. The image acquisition method in Figure 5 includes: step S101 placing the object to be measured on the base; step S102 setting the reference module on the base; step S103 setting up the matrix-type camera module, arranging multiple cameras in a matrix; and step S104 scanning the object to be measured with the multiple cameras, simultaneously capturing images containing both the object to be measured and the reference module. Step S105 involves receiving multiple two-dimensional images of each color block and transmitting an image signal; the processor module receives the image signal transmitted from the matrix camera module, and performs image recognition and alignment analysis on the multiple two-dimensional images based on the colors of the multiple color blocks, combining the multiple two-dimensional images into a three-dimensional image corresponding to the true geometric shape and color of the object under test.
於上述步驟S103中,除如前述第2、3圖實施例中,使用矩陣式攝像模組130中之多個攝像頭130a以拍攝待測物O各部分之二維影像外,亦可令各攝像頭130a相對待測物O呈不同角度以拍攝待測物O相異部分之影像。換言之,調整各 攝像頭130a相對待測物之傾斜角度,以拍攝待測物O各部分及各種不同角度之二維影像。 In step S103 above, in addition to using multiple cameras 130a in the matrix camera module 130 to capture two-dimensional images of different parts of the object under test O as in the embodiments shown in Figures 2 and 3, each camera 130a can also be positioned at different angles relative to the object under test O to capture images of different parts of the object under test O. In other words, by adjusting the tilt angle of each camera 130a relative to the object under test, two-dimensional images of different parts of the object under test O from various angles can be captured.
上述步驟S104中,待測物O或矩陣式攝像模組130可設計為可轉動。藉此,無需設置數量龐大之攝像頭130a,使用較少之攝像頭130a即可拍攝多個相對待測物O各部分及參考模組120之顏色區塊120a各部分之二維影像,將可減少攝像頭130a之使用並提高拍攝效率。於轉動待測物O或矩陣式攝像模組130時,可間隔一定角度進行360度轉動。當拍攝之二維影像張數越多時,可合成越細緻之三維影像。 In step S104 above, the object under test O or the matrix camera module 130 can be designed to be rotatable. This eliminates the need for a large number of cameras 130a, allowing for the capture of multiple 2D images relative to various parts of the object under test O and the color blocks 120a of the reference module 120 using fewer cameras, thus reducing the number of cameras 130a used and improving shooting efficiency. When rotating the object under test O or the matrix camera module 130, it can rotate 360 degrees at certain intervals. The more 2D images captured, the more detailed the 3D image can be synthesized.
是故,本發明揭示之矩陣式三維掃描定位系統100及其取像方法,使用矩陣式攝像模組130可達到精確之三維建模,可降低設備成本。再者,透過參考模組120之設置,有助於提高二維影像拼接之精確度,可簡化演算流程,並提高三維建模之真實度。 Therefore, the matrix-based 3D scanning and positioning system 100 and its image acquisition method disclosed in this invention, using a matrix-based camera module 130, can achieve accurate 3D modeling, reducing equipment costs. Furthermore, the reference module 120 helps improve the accuracy of 2D image stitching, simplifies the calculation process, and enhances the realism of the 3D model.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the invention has been disclosed above by way of embodiment, it is not intended to limit the invention. Anyone skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention. Therefore, the scope of protection of this invention shall be determined by the appended patent claims.
S101、S102、S103、S104、S105:步驟 S101, S102, S103, S104, S105: Steps
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| CN102438153A (en) * | 2010-09-29 | 2012-05-02 | 华为终端有限公司 | Multi-camera image correction method and equipment |
| TW202043759A (en) * | 2019-05-21 | 2020-12-01 | 中華學校財團法人中華科技大學 | Three-dimensional phase shift defect detection method and system for detecting and marking on defects of surface bumps and depressions for a to-be-tested three-dimensional curve surface |
| CN113532318B (en) * | 2021-07-13 | 2022-08-05 | 燕山大学 | Three-dimensional scanning system and method for positioning using multiple sets of laser trackers |
| TWM653426U (en) * | 2023-09-25 | 2024-04-01 | 方舟智慧股份有限公司 | A matrix 3D scanning and positioning system |
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| CN102438153A (en) * | 2010-09-29 | 2012-05-02 | 华为终端有限公司 | Multi-camera image correction method and equipment |
| TW202043759A (en) * | 2019-05-21 | 2020-12-01 | 中華學校財團法人中華科技大學 | Three-dimensional phase shift defect detection method and system for detecting and marking on defects of surface bumps and depressions for a to-be-tested three-dimensional curve surface |
| CN113532318B (en) * | 2021-07-13 | 2022-08-05 | 燕山大学 | Three-dimensional scanning system and method for positioning using multiple sets of laser trackers |
| TWM653426U (en) * | 2023-09-25 | 2024-04-01 | 方舟智慧股份有限公司 | A matrix 3D scanning and positioning system |
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