TWI901971B - Magnetically conductive electrically insulating material in a capacitance module - Google Patents

Abstract

A capacitance module may include a stack of layers, the stack including a first substrate and at least one capacitance sensing electrode on the substrate. The capacitance module may also include a magnetically conductive, electrically insulating material incorporated into the capacitance module.

Description

Magnetoresistive insulating material in capacitor modules

This disclosure generally relates to systems and methods for capacitor modules, such as those used in touchpads. More specifically, this disclosure relates to systems and methods for transmitting and receiving radio frequencies on a touchpad.

This application is a continuation-in-part of U.S. Patent Application No. 17/873,613, filed July 26, 2022, entitled "Antenna Shielding in a Capacitance Module," the entire contents of which are incorporated herein by reference.

Touchpads are typically included in processor-based devices (e.g., laptops) to allow users to use their fingers, styluses, etc., as input and selection sources. Additionally, processor-based devices typically include radio frequency (e.g., 3MHz-30GHz) transmitters, receivers, transceivers, etc. (collectively referred to as "transceivers" in this document) for Wi-Fi, Bluetooth, Near Field Communication (NFC), etc. However, capacitive touchpads typically use an electrical shield to prevent noise from processor-based devices from interfering with normal touchpad functionality. This shield prevents the transmission and reception of radio frequencies when near the radio transceiver.

For example, the opening in the chassis of a touchpad for a processor-based device (e.g., a laptop) may be the only opening in the chassis, allowing for the transmission and reception of Wi-Fi or NFC communications. Existing devices may place a radio frequency antenna near (e.g., adjacent to) the touchpad to allow some radio frequencies to pass through a shielding layer. However, this method typically requires antenna tuning, which is often difficult. Furthermore, the antenna system may use more power to transmit signals around the touchpad components, potentially affecting touchpad performance. Additionally, the manufacturing of such systems may be more challenging because variations in the touchpad's printed circuit board (PCB) affect antenna resonance. Other drawbacks, inconveniences, and problems also exist with existing devices and methods.

In one embodiment, a capacitor module includes a stack. The stack may include: a first substrate; at least one capacitive sensing electrode on the first substrate; and a magnetoelectric insulating material integrated into the at least one layer.

The module can further include an antenna integrated into the stack.

The antenna can be an inductive antenna.

The antenna can be a near-field antenna.

The antenna can be located on the same substrate as at least one capacitive inductor electrode.

Magnetically conductive insulating materials can partially cover antennas.

Magnetorheological insulating materials can be dielectric layers.

Antennas can be located on a different layer than the magnetic insulating material.

The stack may include a second substrate, and a magnetoelectric insulating layer may isolate the first substrate from the second substrate.

The magnetoelectric insulating layer may include ferrite.

The layering can further include a ground plane layer made of conductive material.

Magnetically conductive insulating materials can shield the ground plane layer, protecting it from antenna interference.

Magnetoresistive insulating materials can redirect the inductive signal of an inductive antenna through a capacitor reference surface adjacent to the stack.

In one embodiment, a capacitor module may include a stack. The stack may include: a first substrate; at least one capacitive sensing electrode on the substrate; a near-field antenna integrated into the stack; and a magnetoelectric insulating material integrated into the at least one layer.

The near-field antenna can be located on the same substrate as at least one capacitive sensing electrode.

Magnetically conductive insulating materials can partially cover near-field antennas.

Magnetorheological insulating materials can be dielectric layers.

The layering can further include a ground plane layer made of conductive material.

Magnetoelectric insulating materials can redirect the magnetic field of a near-field antenna through adjacent stacked capacitive reference surfaces.

In one embodiment, a capacitor module may include a stack. The stack may include: a first substrate; a second substrate; a magnetoelectric insulating material integrated between the first and second substrates; and at least one capacitive sensing electrode on the first substrate, the second substrate, or both the first and second substrates.

In one embodiment, a device may include a stack. The stack may include: a first layer; a second layer; a magnetoelectric insulating material integrated between the first and second layers; and at least one capacitive electrode on the first substrate, the second substrate, or both the first and second substrates.

The first layer can be a capacitor reference surface.

The device may further include an antenna, which can be deposited on the same layer as the magnetoelectric insulating material.

In one embodiment, a capacitor module may include a stack, wherein the stack includes a substrate, at least one capacitive sensing electrode on the substrate, a near-field antenna integrated into the stack, and a magnetoelectric insulating material integrated into the stack.

In one embodiment, a capacitor module may include a stack, wherein the stack includes a first substrate and at least one capacitive sensing electrode on the substrate, and wherein the capacitor module may include a magnetoelectric insulating material integrated into the capacitor module.

In one embodiment, a capacitor module may include a substrate, at least one capacitive sensing electrode on the substrate, an antenna adjacent to a first side of the substrate, and a magnetoelectric insulating material adjacent to a second side of the substrate, wherein the second side of the substrate is opposite to the first side of the substrate.

The module may include a conductive shielding layer adjacent to the magnetoelectric insulating material.

Magnetorically insulating materials can be used between the antenna and the conductive shielding layer.

The magnetoelectric insulating material can be a coating layer on a conductive shielding layer.

The module may include a conductive shielding layer, wherein a magnetoelectric insulating material is located between the conductive shielding layer and the antenna.

In some embodiments, a capacitor module may include: a substrate; a capacitive sensing electrode on the substrate; a masking layer made of a first material that at least reduces some noise at the capacitive sensing electrode; and a second material adjacent to the substrate that at least reduces the formation of eddy currents in the masking layer.

The second material can eliminate the formation of vortices in the masking layer.

The first material can be a conductive material.

The second material can be a magnetically insulating material.

The second material can be a composite material.

Composite materials may include magnetically conductive materials suspended within electrical insulating materials.

Composite materials may include a magnetically conductive coating on an electrically insulating material.

The second material may include ferrite.

The second material can possess the property of redirecting magnetic fields.

The second material can possess the property of repelling magnetic fields.

The second material can possess the property of absorbing magnetic fields.

100: Electronic Devices

102: Keyboard

103: Shell

104: Touchpad

106: Display

108: Keys

114: Connecting mechanism

200: Capacitor Module

202: Substrate, first substrate, layer having capacitor electrodes

204: First group of electrodes, traveling electrode, electrode

206: Second group of electrodes, column electrodes, electrodes

208: Touch controller

212: Capacitor Reference Surface

214: Mask layer

216: Electrical connection

218: Electrical Connection

400: Display Layer

500: Magnetically conductive insulating material

502: Second substrate

504: First side

505: Part One

506: Second side

510: Part Two

515: Part Three

800: Antenna

802: Bottom side

804: Bottom side

805: Bottom side

1000: Edge

1200: Capacitor electrode

1300:Substrate

1305: Bottom side

1310: Outer Ring Road

1315: Surface

1320: Inner Ring Road

1325: MCEI material

1330: Section

1400: Front Surface

1405: MCEI Material

1500: MCEI slot

1505: Inner Passage

1600:Substrate

1605: Mask layer

1610: MCEI Material

1615: Conductive metals, metals, conductive materials

1620: Surface

1625: Segmented MCEI material

1700: Dielectric layer

1705: Dielectric layer

1800: Surface

1805:Substrate

1810: MCEI material

1900: Segmented MCEI Material

1910: Masking Layer

2000: Capacitor Module

2002: First Capacitive Sensor Layer

2004: Second Capacitive Sensor Layer

2006: Masking Layer

2008: Capacitor Reference Surface

2010: Antenna

2015: Bottom side

2016: Antenna

2020: Materials

2100:Substrate

2102: Conductive shielding layer

2104: First District

2106: Antenna

2108: Second Region

2110: MCEI Materials

2200:Substrate

2202: First District

2204: Second Region

2206: Antenna

2208: MCEI Barrier

2300: Antenna

2302:Substrate

2304: Conductive shielding layer

2306: MCEI Barrier

2400: Capacitor Module

2402: First Floor

2404: First Surface

2406: Second Surface

2408: Second Floor

2410: Conductive shielding layer

2414: Antenna

2416: MCEI Material

2500: Layers

2502: MCEI External Region

2504: Internal area of conductive shield

2600: Layer

2602: MCEI region

2604: Conductive shielding area

Figure 1 illustrates an example of an electronic device according to this disclosure.

Figure 2 depicts an example of a substrate having a first set of electrodes and a second set of electrodes according to this disclosure.

Figure 3 depicts an example of a touchpad according to this disclosure.

Figure 4 depicts an example of a touchscreen according to this disclosure.

Figure 5 illustrates an example of a magnetoresistive insulating material in a capacitor module according to this disclosure.

Figure 6 illustrates an example of a magnetoresistive insulating material in a capacitor module according to this disclosure.

Figure 7 illustrates an example of a magnetoresistive insulating material in a capacitor module according to this disclosure.

Figure 8 illustrates an example of the magnetoresistive insulating material and the antenna near the overlay in a capacitor module according to this disclosure.

Figure 9 illustrates an example of the magnetoresistive insulating material and the antenna near the overlay in a capacitor module according to this disclosure.

Figure 10 illustrates an example of the magnetoresistive insulating material and the antenna near the stack in a capacitor module according to this disclosure.

Figure 11 illustrates an example of the magnetic insulating material and antenna in a capacitor module according to this disclosure.

Figure 12a depicts an example of an antenna according to this disclosure, on the same layer as at least one capacitor electrode.

Figure 12b illustrates an example of the magnetic insulating material and antenna in a capacitor module according to this disclosure.

Figure 13a illustrates an example of a magnetoelectric insulating material partially surrounding an antenna according to this disclosure.

Figure 13b illustrates an example of a magnetoresistive insulating material surrounding the inner and outer periphery of an antenna according to this disclosure.

Figure 13c depicts an example of a magnetoresistive insulating material surrounding the outer periphery of an antenna according to this disclosure.

Figure 13d depicts an example of a magnetoresistive insulating material adjacent to the outer periphery of the antenna, according to this disclosure.

Figure 14a illustrates an example of a magnetoelectric insulating material partially surrounding an antenna according to this disclosure.

Figure 14b depicts an example of a magnetoresistive insulating material adjacent to an antenna according to this disclosure.

Figure 14c illustrates an example of a segmented magnetic insulating material partially surrounding an antenna according to this disclosure.

Figure 15 illustrates an example of a magnetoelectric insulating material forming a groove according to this disclosure.

Figure 16a illustrates an example of a magnetoelectric insulating material located on a masking layer according to this disclosure.

Figure 16b depicts an example of a magnetoelectric insulating material located on a masking layer according to this disclosure.

Figure 16c illustrates an example of a segmented magnetoelectric insulating material located on a masking layer according to this disclosure.

Figure 17 illustrates an example of segmented magnetic insulating material in a capacitor module according to this disclosure.

Figure 18 illustrates an example of a magnetoelectric insulating material, according to this disclosure, on a different layer than the antenna but near the antenna.

Figure 19 illustrates an example of a segmented magnetic insulating material according to this disclosure.

Figure 20 illustrates an example of a magnetoelectric insulating material on the underside of a capacitor reference surface according to this disclosure.

Figure 21 depicts an example of a masking layer with an antenna according to this disclosure.

Figure 22 illustrates an example of a masking layer with an antenna according to this disclosure.

Figure 23 illustrates an example of a shielding layer with an antenna according to this disclosure.

Figure 24 illustrates an example of a masking layer with an antenna according to this disclosure.

Figure 25 depicts an example of a masking layer with MCEI material according to this disclosure.

Figure 26 depicts an example of a masking layer with MCEI material according to this disclosure.

While various modifications and substitutions are readily possible with respect to this disclosure, specific embodiments have been illustrated by way of example in the accompanying drawings and will be described in detail herein. However, it should be understood that this disclosure is not intended to be limited to the specific forms disclosed. Rather, it is intended to cover all modifications, equivalents, and substitutions that fall within the scope of the invention as defined in the appended claims.

This disclosure provides examples and is not intended to limit the scope, applicability, or configuration of the invention. Rather, the following description will provide those skilled in the art with a feasible description of how to implement embodiments of the invention. Various changes can be made to the function and arrangement of the components.

Therefore, various embodiments may appropriately omit, substitute, or add various programs or components. For example, it should be understood that methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Furthermore, aspects and elements described in some embodiments may be combined in other embodiments. It should also be understood that the following systems, methods, devices, and software may, individually or collectively, be components of a larger system, wherein other programs may take precedence over or otherwise modify their application.

For the purposes of this disclosure, the term "alignment" generally refers to parallelism, substantially parallelism, or forming an angle of less than 35.0 degrees. For the purposes of this disclosure, the term "lateral" generally refers to perpendicularity, substantially perpendicularity, or forming an angle of 55.0 to 125.0 degrees. For the purposes of this disclosure, the term "length" generally refers to the longest dimension of an object. For the purposes of this disclosure, the term "width" generally refers to the dimension of an object from one side to the other, and may also refer to a measurement spanning the object perpendicular to its length.

For the purposes of this disclosure, the term "electrode" generally refers to a portion of an electrical conductor used for measurement, and the terms "circuit" and "trace" generally refer to portions of an electrical conductor not used for measurement. When referring to a circuit in this disclosure, the term "circuit" generally refers to a combination of an electrode and a portion of a conductor that is a "circuit" or "trace". For the purposes of this disclosure, the term "Tx" generally refers to a transmitting line, an electrode, or a portion of a transmitting line and an electrode, and the term "Rx" generally refers to an induction line, an electrode, or a portion of an induction line and an electrode.

For the purposes of this disclosure, the term "electronic device" generally means a device that is transportable and includes batteries and electronic components. Examples may include laptops, desktop computers, mobile phones, tablets, personal digital devices, watches, game controllers, gaming wearables, wearable devices, measuring devices, automation devices, safety devices, displays, vehicles, information and entertainment systems, audio systems, consoles, other types of devices, motion tracking devices, tracking devices, card readers, purchasing stations, self-service terminals, or combinations thereof.

It should be understood that the terms "capacitive module," "touchpad," and "touch sensor" used in this document are interchangeable with "capacitive touch sensor," "capacitive sensor," "capacitive touch and proximity sensor," "proximity sensor," "touch and proximity sensor," "touch panel," "touchpad," and "touchscreen." Capacitive modules can be integrated into electronic devices.

It should also be understood that, as used herein, the terms “vertical,” “horizontal,” “horizontal,” “upper,” “lower,” “left,” “right,” “inner,” and “outer,” etc., can refer to the relative orientation or position of features in the disclosed devices and/or elements shown in the figures. For example, “upper” or “topmost” can refer to a feature being closer to the top of the page than another feature. However, these terms should be interpreted broadly to include devices and/or elements having other orientations (e.g., inverted or tilted orientations), where top/bottom, above/below, above/below, above/below, and left/right can be interchanged depending on the orientation.

In some cases, the capacitor module is located inside the housing. The capacitor module can be located below the housing and can detect objects outside the housing. In this example, the housing acts as a capacitive reference surface when the capacitor module can detect changes in capacitance through the housing. For example, the capacitor module may be exposed within a cavity formed by the keyboard housing of a computer (e.g., a laptop or other type of computing device), and the sensor may be located below the surface of the keyboard housing. In such an example, the keyboard housing adjacent to the capacitor module acts as a capacitive reference surface. In some examples, an opening may be formed in the housing, and a cover layer may be located within the opening. In this example, the cover layer acts as a capacitive reference surface. In such examples, the capacitor module may be located on the back side adjacent to the cover layer, and the capacitor module may sense the presence of an object through the thickness of the cover layer. For the purposes of this disclosure, the term "reference surface" generally refers to a surface through which a pressure sensor, capacitance sensor, or other type of sensor is positioned to sense input pressure, presence, location, touch, proximity, capacitance, magnetism, electrical properties, other types of attributes, or other characteristics, or combinations thereof. For example, the reference surface may be a housing, cover layer, or other type of surface through which inputs are sensed. In some examples, the reference surface has no moving parts. In some examples, the reference surface may be made of any suitable type of material, including but not limited to plastics, glass, dielectric materials, metals, other types of materials, or combinations thereof.

For the purposes of this disclosure, the term "display" can generally refer to a display or screen that is not depicted in the same area as the capacitive reference surface. In some cases, the display is integrated into a laptop, where the keyboard is located between the display and the capacitive reference surface. In some examples where the capacitive reference surface is integrated into a laptop, the capacitive reference surface may be part of a touchpad. Pressure sensors may be integrated into the layers that make up the capacitive module. However, in some cases, the pressure sensor may be located in other parts of the laptop, such as under the keyboard case but outside the area used for sensing touch input, on the side of the laptop, above the keyboard, on the side of the keyboard, in other locations on the laptop, or in other locations. In examples where these elements are integrated into the laptop, the display may be pivotally connected to the keyboard case. The display may be a digital monitor, a touchscreen, other types of monitors, or a combination of the above. In some cases, the display is located on the same device as the capacitive reference surface, while in other examples, the display is located on a different device than the one where the capacitive reference surface is located. For example, the display can be projected onto different surfaces, such as a wall or projector screen. In some examples, the reference surface may be located on an input or game controller, and the display may be located on a wearable device, such as a virtual reality or augmented reality screen. In some cases, the reference surface and the display are located on the same surface, but at different positions on that surface. In other examples, the reference surface and the display may be integrated into the same device, but on different surfaces. In some cases, the reference surface and the display may be oriented at different angles relative to each other.

For the purposes of this disclosure, the term "near-field antenna" generally refers to an antenna configured to operate using the Near Field Communication (NFC) protocol. In some cases, NFC operates within a range smaller than 5 inches, 4 inches, smaller than 2 inches, smaller than 1 inch, or other relatively close proximity. NFC can be based on inductive coupling between two near-field antennas communicating in one or both directions. In some cases, NFC can use frequencies in the 13.56 MHz band, but any suitable frequency can be used.

For the purposes of this disclosure, the term "magnetically conductive electrical insulating (MCEI) material" can generally refer to any suitable material that is generally magnetically and electrically insulating. In one example, an MCEI material can have a higher permeability than air. In some cases, the MCEI has a permeability high enough to keep the magnetic field away from the ground plane of the stack, but low enough to minimize losses due to hysteresis. Preferably, the permeability of the MCEI material is more than 10 times, more than 20 times, more than 40 times, more than 100 times that of air, or other suitable permeabilities. In some cases, the permeability is less than about 2,000. In some cases, the permeability is less than about 800. In some cases, the permeability of the MCEI material is about 125.

In some cases, the resistivity of MCEI material is approximately 12 microohm-centimeters. In other cases, the resistivity of MCEI is greater than approximately 1 million ohm-centimeters.

MCEI elements can be made from a single material. In some cases, the MCEI material is ferrite. Ferrite can be a ceramic-like material. Ferrite can be iron-containing and composed of numerous small crystallites. Ferrite can include iron oxide and other metals, including magnesium, aluminum, barium, manganese, copper, nickel, cobalt, and even iron itself.

In some cases, MCEI materials are composite materials that combine magnetic and electrical insulation properties of a single material. For example, such materials can be made from a matrix of magnetically conductive particles and electrically insulating particles, where the overall matrix impedes current conduction while promoting magnetic current conduction. One such material, comprising ferromagnetic metal particles molded within a polymer matrix, is called "iron powder" and can be a suitable MCEI material.

In some cases, MCEI materials comprise ferrite, iron, alloys of iron, mixtures of iron with other compounds, or combinations thereof. In some examples, MCEI may include partially magnetic materials, paramagnetic materials, ferromagnetic materials, dimagnetic materials, permanent magnetic materials, magnetically absorbing materials, hard magnetic materials, soft magnetic materials, alloys, mixtures, composites, or combinations thereof. In some cases, MCEI materials may include iron, cobalt, nickel, bismuth, tungsten, tin, titanium, pyrolytic graphite, barium hexaferrometallurgical, rare earth elements ruthenium, borax, neodymium, aluminum, ruthenium cobalt, flexible rubber, aluminum nickel cobalt, strontium, barium, manganese, zinc, other metals with similar electrical properties, other metals, or combinations thereof. In some cases, MCEI materials include layered magnetic materials, which may comprise magnetic sheets separated by insulating layers.

In some cases, the MCEI material can be deposited on the substrate of the stack. In other examples, the MCEI material can be formed separately and attached to the substrate. In some cases, the substrates in the stack are separated by a dielectric. In such examples, at least one dielectric may include the MCEI material. In some cases, the substrate itself may have a magnetically and electrically insulating material, and therefore may be the MCEI material. In other examples, the MCEI material may be located near a masking layer of the stack, wherein the masking layer includes copper designed to shield the capacitor electrodes from electrical noise. The MCEI material may be located within the stack to protect the masking layer from the formation of eddy currents, which may be generated by one or more inductor components integrated into the capacitor module. An example of an inductive element that can be located close to or integrated into a capacitor module is an inductive antenna. In some cases, inductive antennas can operate on the NFC protocol, but they can operate based on any suitable protocol type.

Figure 1 illustrates an example of an electronic device 100. In this example, the electronic device is a laptop. In the illustrated example, the electronic device 100 includes input components such as a keyboard 102 and capacitor modules such as a touchpad 104, which are integrated into a casing 103. The electronic device 100 also includes a display 106. Programs operated by the electronic device 100 can be displayed on the display 106 and controlled by a user via a sequence of commands provided by the keyboard 102 and/or the touchpad 104. An internal battery (not shown) is used to power the operation of the electronic device 100.

The keyboard 102 includes a layout of keys 108 that can be selected individually when the user presses a key 108 with sufficient force, causing the key 108 to be pressed against a switch located below the keyboard 102. In response to the selection key 108, the program can receive instructions on how to operate, such as a word processing program determining which types of words to process. The user can use the touchpad 104 to issue different types of instructions to programs operating on the computing device 100. For example, a cursor displayed on the display 106 can be controlled via the touchpad 104. The user can control the cursor's position by sliding his or her hand along the surface of the touchpad 104. In some cases, the user can move the cursor to or near an object on the display of the computing device and select the object by issuing a command via the touchpad 104. For example, the user can provide a command to select the object by tapping the surface of the touchpad 104 once or multiple times.

The touchpad 104 is a capacitor module comprising a stack disposed beneath the keyboard housing, beneath a cover layer fitted into an opening in the keyboard housing, or beneath another capacitor reference surface. In some examples, the capacitor module is located in an area of the keyboard surface where the user's palm can rest while typing. The capacitor module may include a substrate, such as a printed circuit board or other type of substrate. One layer of the capacitor module may include a sensor layer comprising a first set of electrodes oriented along a first direction and a second layer of electrodes oriented along a second direction transverse to the first direction. These electrodes may be spaced apart and/or electrically isolated from each other. Electrical isolation can be achieved by depositing at least a portion of the electrodes on different sides of the same substrate or by providing a dedicated substrate for each set of electrodes. Capacitance can be measured at the overlapping crossover points between different sets of electrodes. However, when an object with a dielectric value different from that of the surrounding air (e.g., a finger, a stylus, etc.) approaches the crossover point between the electrodes, the capacitance between the electrodes may change. This change in capacitance, and the relative position of the object with respect to the capacitance module, can be calculated to determine the position where the user touches or hovers the object within the detection range of the capacitance module. In some examples, the first and second sets of electrodes are equidistant from each other. Therefore, in these examples, the sensitivity of the capacitance module is the same in both directions. However, in other examples, the distance between the electrodes can be unevenly spaced to provide greater sensitivity for movement in certain directions.

In some cases, the display 106 is mechanically independent and movable relative to the keyboard using a connection mechanism 114. In these examples, the display 106 and the keyboard 102 can be connected and movable relative to each other. The display 106 is movable relative to the keyboard 102 within a range of 0 degrees to 180 degrees or greater. In some examples, when in the off position, the display 106 can fold onto the upper surface of the keyboard 102, and when in the operating position, the display 106 can fold open from the keyboard 102. In some examples, when the user uses the display 106, the display 106 can be oriented at an angle between 35 and 135 degrees relative to the keyboard 102. However, in these examples, the display 106 can be positioned at any angle desired by the user.

In some examples, display 106 may be a non-touchscreen display. However, in other examples, at least a portion of display 106 is touchscreen. In these examples, the touchscreen display may also include a capacitor module located behind the outer surface of display 106. When a user's finger or other object approaches the touchscreen, the capacitor module can detect a change in capacitance as user input.

Although the example depicting an electronic device in Figure 1 is an example of a notebook computer, capacitive sensors and touch surfaces can be integrated into any suitable device. A non-exhaustive list of devices includes, but is not limited to, desktop computers, displays, monitors, self-service terminals, computing devices, electronic tablets, smartphones, position sensors, card readers, other types of electronic devices, other types of devices, or combinations thereof.

Figure 2 illustrates an example of a portion of a capacitor module 200. In this example, the capacitor module 200 may include a substrate 202, a first set of electrodes 204, and a second set of electrodes 206. The first set of electrodes 204 and the second set of electrodes 206 may be oriented laterally relative to each other. Furthermore, the first set of electrodes 204 and the second set of electrodes 206 may be electrically insulated from each other, preventing short circuits between the electrodes. However, capacitance can be measured where the first set of electrodes 204 and the second set of electrodes 206 overlap. The capacitor module 200 may include one or more of the first set of electrodes 204 or the second set of electrodes 206. Such a substrate 202 and electrode assembly can be integrated into a touchscreen, touchpad, position sensor, game controller, button, and/or detection circuitry.

In some examples, the capacitor module 200 is a mutual capacitance sensing device. In such examples, the substrate 202 has a set of row electrodes 204 and a set of column electrodes 206, which define the touch/proximity sensitive area of the component. In some cases, the component is configured as a rectangular grid of electrodes of an appropriate number (e.g., 8x6, 16x12, 9x15, etc.).

As shown in Figure 2, the capacitor module 200 includes a touch controller 208. The touch controller 208 may include at least one of a central processing unit (CPU), a digital signal processor (DSP), an analog front-end (AFE) including an amplifier, a peripheral interface controller (PIC), other types of microprocessors, and/or combinations thereof, and may be implemented as an integrated circuit, a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), a combination of logic gate circuits, other types of digital or analog electrical design components, or combinations thereof, selected from available operating modes using appropriate circuitry, hardware, firmware, and/or software.

In some cases, the touch controller 208 includes at least one multiplexing circuit to alternate which of the electrode groups 204 and 206 is used as the driving electrode and the sensing electrode. The driving electrodes can be driven one at a time in sequence, randomly, or multiple electrodes can be driven simultaneously in a coded mode. Other configurations are also possible, such as a self-capacitive mode where electrodes are simultaneously driven and sensed. The electrodes can also be arranged in a non-rectangular array, such as a radial pattern, a linear series, etc. A shielding layer (see Figure 3) can be placed below the electrodes to reduce noise or other interference. The shielding layer can extend beyond the electrode grid. Other configurations are also possible.

In some cases, no fixed reference point is used for measurement. The touch controller 208 can generate a signal that is sent directly to either the first set of electrodes 204 or the second set of electrodes 206 in various modes.

In some cases, the component does not rely on absolute capacitance measurements to determine the position of a finger (or stylus, pointer, or other object) on the surface of capacitor module 200. Capacitor module 200 can measure charge imbalances at the electrodes used as sensing electrodes; in some examples, the sensing electrodes can be any of the electrodes specified in sets 204 and 206, or in other examples, a dedicated sensing electrode. When no directional object is on or near capacitor module 200, touch controller 208 can be in a balanced state, and there is no signal at the sensing electrodes. When a finger or other directional object creates an imbalance due to capacitive coupling, a change in capacitance can occur at the intersection of the two sets of electrodes 204 and 206 constituting the touch/proximity sensitive area. In some cases, the change in capacitance is measured. However, in optional examples, the absolute capacitance value can be measured.

While this example describes capacitor module 200 as having the flexibility to switch electrode groups 204, 206 between sensing and transmitting electrodes, in other examples, each electrode group is dedicated to either transmitting or sensing functions.

Figure 3 illustrates an example of a substrate 202 on which a first set of electrodes 204 and a second set of electrodes 206 are deposited and integrated into a capacitor module. The first set of electrodes 204 and the second set of electrodes 206 can be spaced apart from each other and are electrically isolated from each other. In the example depicted in Figure 3, the first set of electrodes 204 is deposited on a first side of the substrate 202, and the second set of electrodes 206 is deposited on a second side of the substrate 202, wherein the second side is opposite to the first side and is separated by the thickness of the substrate 202. The substrate can be made of an electrically insulating material to prevent the first set of electrodes 204 and the second set of electrodes 206 from short-circuiting with each other. As shown in Figure 2, the orientations of the first set of electrodes 204 and the second set of electrodes 206 can be transverse to each other. Capacitance measurements can be performed at the intersection of the overlapping first set of electrodes 204 and the second set of electrodes 206. In some examples, a voltage can be applied to the transmitting electrode, and the voltage of the inducting electrode overlapping with the transmitting electrode can be measured. The voltage from the inducting electrode can be used to determine the capacitance at the intersection where the inducting electrode and the transmitting electrode overlap.

In the example depicting a cross-section of the capacitor module in Figure 3, substrate 202 may be located between capacitor reference surface 212 and masking layer 214. Capacitor reference surface 212 may be a cover layer disposed on a first side of substrate 202, through which the electric field at least partially penetrates. When a user's finger or stylus approaches capacitor reference surface 212, the presence of the finger or stylus can affect the electric field on substrate 202. The voltage measured from the inductive electrode in the presence of the finger or stylus may differ from that in its absence. Therefore, changes in capacitance can be measured.

The masking layer 214 may be a conductive layer that masks electrical noise from internal components of the electronic device. This masking layer prevents interference with the electric field on the substrate 202. In some cases, the masking layer is a conductive solid material. In others, the masking layer has a substrate and a conductive material disposed on at least one substrate. In other examples, the masking layer is a layer in a touchpad that performs a function while also shielding electrodes from electrical interference noise. For example, in some examples, a graphics layer in a display application may form an image visible through a capacitive reference surface, but also shield the electrodes from electrical noise.

The voltage applied to the transmitting electrode can be controlled via an electrical connection 216 from the touch controller 208 to the appropriate electrode assembly. The voltage applied to the inductive electrode by the electric field generated from the transmitting electrode can be detected via an electrical connection 218 from the inductive electrode to the touch controller 208.

Although the example in Figure 3 is depicted as having two sets of electrodes deposited on a substrate, one set on the first side and the second set on the second side, in other examples, each set of electrodes may be deposited on its own dedicated substrate.

Furthermore, while the examples above describe a touchpad with a first set of electrodes and a second set of electrodes, in some examples, the capacitor module has a single set of electrodes. In such examples, the electrodes of the sensor layer can be used simultaneously as both transmitting and receiving electrodes. In some cases, a voltage can be applied to the electrode for a duration, thereby changing the capacitance around the electrode. When the duration ends, the application of voltage stops. The voltage can then be measured from the same electrode to determine the capacitance. If there are no objects (e.g., fingers, styluses, etc.) on or near the capacitor reference surface, the voltage measured from the electrode after the application of voltage stops can be at a value consistent with the base capacitance. However, if an object touches or approaches the capacitor's reference surface, the measured voltage can indicate the change in capacitance relative to the base capacitance.

In some examples, the capacitor module has a first set of electrodes and a second set of electrodes and communicates with a controller configured to perform mutual capacitance measurements (e.g., capacitance measurements using both the first and second sets of electrodes) or self-capacitance measurements (e.g., capacitance measurements using only one set of electrodes).

Figure 4 illustrates an example of a capacitor module integrated into a touchscreen. In this example, the substrate 202, the sets of electrodes 204, 206, and the electrical connections 216, 218 can be arranged similarly to that described in conjunction with Figure 3. In the example of Figure 4, a mask layer 214 is located between the substrate 202 and the display layer 400. The display layer 400 can be a light-emitting pixel or diode layer that produces an image. The display layer can be a liquid crystal display, a light-emitting diode display, an organic light-emitting diode display, an electroluminescent display, a quantum dot light-emitting diode display, an incandescent filament display, a vacuum fluorescent lamp display, a cathode gas display, other types of displays, or combinations thereof. In this example, the mask layer 214, substrate 202, and capacitive reference surface 212 can all be at least partially optically transparent, so that the image depicted in the display layer is visible to the user through the capacitive reference surface 212. Such a touchscreen can be included in displays, display elements, laptops, mobile phones, mobile devices, tablet computers, dashboards, display panels, information and entertainment devices, other types of electronic devices, or combinations thereof.

Figure 5 illustrates an example of the stacking in capacitor module 200. In this example, the capacitor reference surface 212 is depicted as part of capacitor module 200; however, in some examples, the capacitor reference surface is not part of the capacitor module.

The illustrated example also depicts a single substrate 202 on which capacitor electrodes for generating and measuring capacitance changes are deposited. In some cases, the capacitor electrodes are deposited on both sides 204, 206 of substrate 202, but in other examples, the capacitor electrodes are primarily deposited on one side.

The masking layer 214 is located adjacent to the substrate 202 having capacitive electrodes. In some examples, the masking layer 214 includes a second substrate 502, and a copper layer or other metal layer is deposited on a first side 504 of the second substrate 502.

Memory, traces, resistors, and other components that can be used to operate the capacitor module may be located on the second side 506 of the second substrate 502. However, in other examples, these components may be connected to a third substrate adjacent to the second substrate. In some cases, the third substrate may be dedicated to components operating the capacitor module 200.

In the example shown in Figure 5, the magnetoelectric insulating (MCEI) material 500 is located between the first substrate 202 and the second substrate 502. In some cases, the MCEI material is a dielectric material located between the substrates. In the example of Figure 6, the MCEI material 500 is located between the first substrate 202 and the capacitive reference surface 212. In the examples of Figures 5 and 6, the MCEI material 500 is placed above the masking layer 214. In Figure 7, the MCEI material 500 is located on the second side 506 adjacent to the masking layer 214.

The MCEI material 500 can have the advantage of at least reducing inductively based eddy currents in the shielding layer 214 or the capacitor electrodes themselves. In some cases, inductively based interference causes noise in the capacitor electrodes, thereby interfering with the ability to detect capacitance changes. In some cases, the noise affecting the capacitor electrodes originates from eddy currents formed in the shielding layer. The shielding layer can provide the benefit of blocking electrical interference from components such as batteries, Wi-Fi antennas, and other electrical devices located near the capacitor module 200. However, inductively based components, such as inductively based antennas, can generate eddy currents in the shielding layer with sufficient strength to make the shielding layer a source of electrical interference to the capacitor electrodes. However, since the conductivity of the MCEI material is at least lower than that of the conductive material of the shielding layer, eddy currents either do not form on the MCEI material or are even more difficult to form on the MCEI material. In some cases, the conductivity of the MCEI material is lower than that of the shielding layer made of copper or other types of conductive metals. At the same time, the magnetic permeability of the MCEI material allows it to shield magnetic fields. Therefore, when the MCEI material is located between the inductor and the shielding layer 214, the MCEI material can block the shielding layer from the magnetic field generated by the inductor. Therefore, the MCEI material can shield the capacitor electrodes, shielding layer, and any other components in a capacitor device, protecting them from the influence of inductive components in or near the capacitor module 200.

Although the examples in Figures 5 through 7 depict the MCEI material as a dielectric between substrates, the MCEI material can be integrated into the capacitor module in any suitable manner. For example, at least one substrate can be made wholly or partially of the MCEI material. In some cases, the MCEI material is deposited on the surface of at least one substrate.

Capacitor modules may include MCEI material for use near inductively based devices. In some examples, the MCEI material is integrated into locations within the capacitor module to shield portions of the module from the influence of devices intended to be mounted near the capacitor module in a larger electronic device. For example, inductive antennas may be integrated into mobile devices, laptops, gaming devices, sensors, self-service terminals, screens, automotive dashboards, or other types of electronic devices near where the capacitor module will be integrated. In other examples, inductive devices may be integrated into the capacitor module itself, and the MCEI material may be used to shield sensitive components of the capacitor module from the influence of the inductive device. For example, inductive antennas can be integrated into capacitor modules, and MCEI material can shield other parts or components of the capacitor module from the magnetic fields generated by the inductive device.

Figures 8 through 10 depict examples of an antenna 800 located near a capacitor module 200. In the example of Figure 8, the antenna 800 is located near the bottom 802 of the capacitor module, or in some cases, on the bottom of a layer of the capacitor module 200. MCEI material 500 may be located between the masking layer 214 and the antenna 800. In the example of Figure 9, the antenna 800 is located near the side of the capacitor module 200. A portion of the MCEI material 500 may be located between the masking layer 214 and the antenna 800. In the example of Figure 10, the MCEI material 500 is located on the bottom 804 of the masking layer 214, and also on the periphery 1000 of the masking layer 214. In this example, the MCEI material 500 is positioned to shield the shielding layer 214 from multiple angles and/or sides, protecting the shielding layer 214 from magnetic fields that may approach it.

Figure 11 illustrates an example of an antenna 800 positioned above a substrate 202 having capacitor electrodes. Figure 11 also depicts MCEI material 500 positioned between a masking layer 214 and the layer 202 having capacitor electrodes. In this example, the magnetic field generated by the antenna 800 can transmit signals above the masking layer 214 and the capacitor electrodes. However, the MCEI material 500 prevents the magnetic field from the antenna 800 from generating eddy currents in the masking layer 214. In some examples, when the MCEI material 500 eliminates or at least reduces eddy currents in the masking layer 214, the magnetic field itself may not significantly interfere with the operation of the capacitor electrodes.

In some examples, the MCEI material 500 can redirect the magnetic field from the antenna 800 to concentrate the signal through the capacitive reference surface 212. In such examples, with the magnetic field redirected, the antenna 800 can operate at lower power to allow the antenna signal to reach a receiver located on the other side of the capacitive reference surface 212 via components of the capacitive module. Therefore, in some examples, the MCEI material 500 can save power when operating the antenna 800.

In the example of Figure 11, the magnetic field from the antenna can be radiated through the substrate 202 with capacitive electrodes. In some cases, the MCEI material is located near the bottom of the substrate 202 and can prevent the magnetic field from moving across the substrate 202 (or at least reduce the intensity of the magnetic field that does pass through the substrate 202). Therefore, in some cases, the magnetic field is undetectable at the masking layer. In other cases, a magnetic field can be detected at the masking layer, but its intensity is weaker than the magnetic field intensity above the masking layer.

While magnetic fields can pass through or around capacitor electrodes in some cases, in other examples, they may not generate eddies in the capacitor sufficient to negatively affect capacitance measurements. In some cases, the magnetic field may cause some interference at the capacitor electrode, but this interference may be only slightly less than the interference generated at the capacitor electrode if eddies were allowed to form in the shielding layer according to the antenna.

MCEI materials can cause at least a portion of the magnetic field strength to shift towards and through the capacitive reference surface. This can cause the antenna signal to be more concentrated in a limited or single direction. Compared to a capacitor module without MCEI material, this magnetic field reorientation allows more antenna strength to pass through the reference capacitor surface while less energy is input to the antenna. In such an example, the antenna signal may require less energy to be picked up by a receiving antenna outside the electronic device integrating the capacitor module.

In some examples, MCEI material can replace the masking layer. In such examples, MCEI material can provide protection against other sources that might cause electromagnetic interference to the capacitor electrodes. For example, MCEI material can be used to mitigate electric field fluctuations from a battery that may be located near the capacitor module.

In other examples, a conductive material can be deposited on the surface of the MCEI material, making the MCEI material a composite shielding layer that is conductive on one side and electrically insulating on the other. Such a composite shielding layer can block electric fields on the first side and magnetic fields on the second side. This composite shielding layer can effectively block both electric and magnetic fields.

Figure 12a illustrates an example of a layer 202 having a capacitor electrode 1200 and an antenna 800 disposed on the same layer 202. Although this example depicts the antenna 800 surrounding the capacitor electrode 1200, in other examples, the antenna 800 may only surround a portion of the capacitor electrode 1200 or be located on one side of the capacitor electrode 1200. Figure 12b illustrates an example where an MCEI layer 500 is located below the layer 202 having the capacitor electrode 1200 and the capacitor electrode 1200 and antenna 800 are on the same surface.

Figure 13a depicts an example of an antenna 800 on a substrate 1300 (e.g., a substrate as part of a stack in a capacitor module). In this example, MCEI material is located on three sides adjacent to the antenna 800. A first portion 505 of the MCEI material is located on the first side adjacent to the antenna 800, a second portion 510 of the MCEI material is located on the second side adjacent to the antenna 800, and a third portion 515 of the MCEI material is located on the bottom side 805 adjacent to the antenna 800.

In the illustrated example, the first portion 505 and the second portion 510 of the MCEI material can be part of a single continuous sheet of MCEI material. In some cases, the first portion 505 and the second portion 510 of the MCEI material have the same magnetic and/or electrical insulation properties, but in other examples, the first portion 505 and the second portion 510 of the MCEI material can have different magnetic and/or electrical insulation properties.

In the example depicted in Figure 13a, a third portion 515 of the MCEI material is deposited on the bottom side 1305 of the substrate 1300. In this example, the third portion 515 of the MCEI material is shown covering the entire surface area of the bottom side 1305 of the substrate. However, in other examples, only a sub-portion of the bottom side of the substrate may be covered with MCEI material. In some examples, the third portion 515 of the MCEI material has the same magnetic and/or electrical insulation properties as the first portion 505 and/or the second portion 510 of the MCEI material. However, in other examples, the first portion 505 and/or the second portion 510 of the MCEI material may have different magnetic and/or electrical insulation properties than the third portion 515 of the MCEI material.

In some examples, the magnetic field generated by the inductive antenna can be redirected away from the MCEI material. Therefore, as shown in the example of FIG. 13a, the magnetic field can be forced away from the first portion 505, the second portion 510, and the third portion 515 of the MCEI material. In this example, since the bottom side 1305 of the substrate is adjacent to the MCEI material 515, the magnetic field is redirected to the opposite direction of the substrate 1300. For example, the third portion 515 of the MCEI material on the bottom side 1305 of the substrate 1300 may not allow the magnetic field to pass through, thus forcing the magnetic field in other directions. In the example of FIG. 13a, the first portion 505 of the MCEI material can prevent the magnetic field from freely moving away from the first side of the antenna 800, and the second portion 510 of the MCEI material can prevent the magnetic field from freely moving away from the second side of the antenna 800. Therefore, the magnetic field is primarily directed away from antenna 800 from one side, thus concentrating its influence in a single direction. In the example where the capacitive reference surface 212 is located on the front side of substrate 1300, the MCEI material can redirect the magnetic field of antenna 800 via the capacitive reference surface 212.

Figure 13b depicts an example of an antenna 800 deposited on a substrate 1300, wherein an outer ring 1310 made of a monolithic MCEI material surrounds the outside of the antenna 800. In this example, the outer ring 1310 of the MCEI material and the antenna 800 are on the same surface 1315 of the substrate 1300. The outer ring 1310 of the MCEI material can be used to orient the magnetic field of the antenna 800 in a predetermined direction. In some cases, in the example of Figure 13b, the bottom side of the substrate 1300 is also adjacent to the MCEI material. However, in other examples, the substrate in Figure 13b is not adjacent to the MCEI material. In other examples, other components of the capacitor module may be located on the substrate of the antenna depicted in Figure 13b, and the ring of MCEI material can orient the magnetic field of the antenna away from these components.

The example in Figure 13b also depicts an inner ring 1320 of the MCEI material. In this example, at least a portion of the inner ring 1320 is adjacent to the inner surface of the antenna 800. Although the MCEI material in this example is depicted as a ring, in other examples, the MCEI material can be a solid material, circular, triangular, square, asymmetrical, other types of shapes, segmented, or a combination of the above. In some cases, having the inner and outer surfaces of the MCEI material adjacent to the antenna can facilitate the orientation of the antenna's magnetic field.

Figure 13c depicts an example of MCEI material 1325 located only on the outer side of antenna 800. In the example of Figure 13d, multiple segments 1330 of the MCEI material are located on different sides of antenna 800. In some cases, surrounding the entire perimeter of the antenna may not be necessary to achieve the desired shielding effect and/or the desired concentration effect or reorientation of the magnetic field. Therefore, faster manufacturing and lower material costs can be achieved by using less MCEI material than is necessary to completely surround the antenna.

Figure 14a depicts an example of an antenna 800 disposed on the front surface 1400 of a substrate 1300. MCEI material 1405 is deposited on the bottom side 1305 of the substrate 1300, and the MCEI material 1405 is deposited only on one side of the antenna 800 on the front surface 1400 of the substrate 1300. In this example, the MCEI material on the bottom side 1305 of the substrate 1300 and the MCEI material on the front side 1400 of the substrate 1300 can be used to shield desired components of a capacitor module and to orient the magnetic field in a desired direction. In this example, compared to the example depicted in Figure 13a, the magnetic field can be more freely directed away from the outer periphery of the antenna 800. Figure 14b depicts a top view of the example of Figure 14a. Figure 14c depicts an alternative example where the MCEI material is segmented.

Figure 15 illustrates an example of an MCEI trench 1500 defining an inner channel 1505. An antenna 800 may be disposed within the inner channel 1505. The MCEI trench 1500 may be deposited or otherwise attached to the substrate of the capacitor module. The MCEI trench 1500 prevents magnetic fields from leaking into the substrate and through the gaps covered by the MCEI. In some cases, the MCEI trench 1500 can better concentrate the energy of the magnetic field in a single direction.

Figure 16a depicts an example of an antenna 800 on a substrate 1600 on a masking layer 1605 of a capacitor module. In this example, an MCEI material 1610 separates the antenna 800 from the conductive metal 1615 or other metals used on the same surface 1620 of the substrate. The MCEI material 1610 can sufficiently mask the metal 1615 deposited on the masking substrate 1600 to reduce and/or eliminate eddy currents formed in the metal 1615 due to the magnetic field of the antenna 800.

Figure 16b illustrates an example of MCEI material 1610 on the conductive material 1615 of the masking layer. Figure 16c illustrates an example of segmented MCEI material 1625 on the conductive material 1615 of the masking layer 1605. In the examples of Figures 16a and 16b, the MCEI material can be placed on the conductive material of the masking layer by a type of deposition process, additive manufacturing process, bonding process, other types of processes, or a combination of the above processes.

Figure 17 illustrates an example of multiple dielectric layers 1700, 1705 stacked and made of MCEI material. Figure 18 illustrates an example where antenna 800 is deposited on surface 1800 of substrate 1805 of a capacitor module, and MCEI material 1810 is deposited beneath substrate 1805 containing antenna 800. However, only a portion of this layer contains MCEI material 1810. In this example, MCEI material 1810 is limited to the area near antenna 800.

Figure 19 illustrates an example of segmented MCEI material 1900 on a layer in a capacitor module stack. In this example, the segmented MCEI material 1900 is located adjacent to the masking layer 1910. In some examples, the segmented MCEI barrier can provide sufficient eddy current reduction and/or elimination within the masking barrier to reduce and/or eliminate sufficient electrical interference on the capacitor electrodes, thereby obtaining the desired capacitance measurement. Although the example in Figure 19 depicts a segmented MCEI material in a specific location, segmented MCEI material can be placed anywhere suitable within the capacitor module. For example, segmented MCEI materials can be placed adjacent to a masking layer, a capacitor sensor layer, a capacitor reference surface, a component layer, a dielectric layer, on different layers, on the edges of layers, in the middle of layers, at other locations, or in combinations of the above locations.

Figure 20 illustrates an example of a capacitor module 2000. In this example, the capacitor module 2000 includes a first capacitor sensor layer 2002 having at least one capacitor electrode and a second capacitor sensor layer 2004 having at least one capacitor electrode. In this example, the capacitor module 2000 also includes a masking layer 2006.

Similarly, in this example, a capacitive reference surface 2008 is placed on top of the capacitive module 2000. The capacitive module 2000 also includes an antenna 2010 located between the first capacitive sensor layer 2002 and the capacitive reference module 2008. In this example, the antenna 2010 is located on the bottom side 2015 adjacent to the capacitive reference surface 2008. The capacitive module 2000 can be adhered to the bottom side 2015 of the capacitive reference module 2008 using an adhesive material 2020. In this example, the adhesive material 2020 can surround the antenna 2010.

In some cases, the bonding material 2020 can be an MCEI material. In such an example, the bonding material 2020 can concentrate the magnetic field through the capacitive reference surface 2008 and/or away from the shielding layer 2006. In this example, the bonding material and/or the MCEI material concentrate the antenna's magnetic field away from the capacitor electrode.

Figure 21 depicts an example of a substrate 2100, wherein a conductive shielding layer 2102 is present in a first region 2104 of the surface of the substrate 2100. An antenna 2016 is located in a second region 2108 of the surface of the substrate 2100. An MCEI material 2110 is located on the surface of the substrate 2100 between the conductive shielding layer 2102 and the antenna 2016. In this example, the MCEI material can redirect the magnetic field of the antenna away from the conductive shielding layer, thereby eliminating or at least reducing eddy currents induced in the conductive shielding layer.

Figure 22 depicts an example of a substrate 2200, wherein a conductive shielding material is present in a first region 2202 and a second region 2204 of the substrate surface, and an antenna 2206 is located between the first region 2202 and the second region 2204. An MCEI barrier 2208 is located between the antenna 2206 and the first region 2204, and also between the antenna 2206 and the second region 2204.

Figure 23 illustrates an example of an antenna 2300 on substrate 2302. In this example, the antenna 2300 surrounds a conductive shielding layer 2304. An MCEI barrier 2306 separates the conductive shielding layer 2304 from the antenna 2300. In this example, the MCEI barrier has a toroidal shape, but in other examples, any suitable shape may be used in accordance with the principles disclosed herein.

Figure 24 illustrates an example of a capacitor module 2400. In this example, the first layer 2402 has at least one capacitor electrode deposited on at least one of a first surface 2404, a second surface 2406, or a combination of the surfaces listed above.

The second layer 2408 includes a conductive shielding layer 2410 located in the first portion of the second layer 2408. The second layer 2408 also includes an antenna 2414 and MCEI material 2416 located between the antenna 2414 and the conductive shielding layer 2410.

In the illustrated example, the magnetic field from antenna 2414 can pass through layer 2404, which has capacitive electrodes. In some cases, the magnetic field can pass through the capacitive electrodes on layer 2402. MCEI material 2416 can prevent or reduce the formation of eddy currents in the conductive shielding layer 2410.

Figure 25 illustrates an example of layer 2500 having an outer MCEI region 2502 and an inner conductive shield region 2504. Figure 26 illustrates an example of layer 2600 having an MCEI region 2602 and a conductive shield region 2604. In some cases, the MCEI material can be placed on the same layer as the conductive shield layer. The placement of the MCEI material can correspond to the location of the antenna on other layers of the capacitor module or to the location of the inductor source outside the capacitor module.

While examples of specific antenna types have been illustrated above, any suitable antenna can be used based on the principles described herein. For example, the antenna can be a Wi-Fi antenna, directional antenna, semi-directional antenna, omnidirectional antenna, inductive antenna, near-field antenna, RFID antenna, Bluetooth antenna, passive antenna, active antenna, starter antenna, dipole antenna, monopole antenna, toroidal antenna, capacitive antenna, other types of antennas, or combinations thereof.

It should be noted that the methods, systems, and apparatuses discussed above are merely illustrative. It must be emphasized that various embodiments may appropriately omit, substitute, or add various programs or components. For example, it should be understood that in alternative embodiments, the method may be executed in a sequence different from the described order, and various steps may be added, omitted, or combined. Furthermore, features described for some embodiments may be combined in various other embodiments. Different aspects and elements of the embodiments may be combined in a similar manner. Additionally, it should be emphasized that technology is constantly evolving; therefore, many elements are exemplary and should not be construed as limiting the scope of the invention.

Specific details are provided in the description to offer a thorough understanding of the embodiments. However, it will be understood by those skilled in the art that the embodiments can be implemented without these specific details. For example, well-known circuits, processes, algorithms, structures, and techniques have been shown without unnecessary details to avoid obscuring the embodiments.

Additionally, note that embodiments can be described as processes, which are depicted as flowcharts or block diagrams. Although each flowchart or block diagram can describe operations as a sequential process, many operations can be performed in parallel or simultaneously. Furthermore, the order of operations can be rearranged. Processes may have additional steps not included in the diagram.

After describing several embodiments, those skilled in the art will recognize that various modifications, substitutions, and equivalents can be used without departing from the spirit of the invention. For example, the aforementioned elements may only be part of a larger system in which other rules may take precedence over or otherwise modify the application of the invention. Furthermore, steps may be taken before, during, or after considering the aforementioned elements. Therefore, the above description should not be considered as a limitation on the scope of the invention.

200: Capacitor module; 202: Substrate, first substrate, layer with capacitor electrodes; 204: First set of electrodes, row electrodes, electrode; 206: Second set of electrodes, column electrodes, electrode; 212: Capacitor reference surface; 214: Masking layer; 500: Magnetoresistive insulating material; 502: Second substrate; 504: First side; 506: Second side.

Claims (12)

A capacitor module includes: a stack comprising: a first substrate; at least one capacitive sensing electrode on the first substrate; an antenna integrated into the stack, the antenna having a first side, a second side opposite to the first side, and a bottom side; and a magnetoelectric insulating material integrated into the capacitor module, wherein at least a portion of the magnetoelectric insulating material is adjacent to the bottom side of the antenna and adjacent to at least one of the first side and the second side, the magnetoelectric insulating material is located between the antenna and the at least one capacitive sensing electrode, the antenna, the at least one capacitive sensing electrode, and the magnetoelectric insulating material are on the same layer, and... The magnetoelectric insulating material is adjacent to the first side and the second side of the antenna, or the magnetoelectric insulating material forms an outer ring around the antenna, or the magnetoelectric insulating material forms an inner ring adjacent to the inner surface of the antenna, or the magnetoelectric insulating material is segmented, or the magnetoelectric insulating material surrounds the entire periphery of the antenna, or the magnetoelectric insulating material forms a groove with an inner channel and at least a portion of the antenna is disposed within the inner channel. The module according to claim 1, wherein the antenna is an inductive antenna. The module according to claim 1, wherein the antenna is a near-field antenna. According to claim 1, the module wherein the magnetic insulating material is the dielectric layer of the stack. The module according to claim 1 further includes a conductive shield, wherein the magnetoelectric insulating material is located on the same layer as the conductive shield. A capacitor module includes: a stack, the stack comprising: a substrate; at least one capacitive sensing electrode on the substrate; a near-field antenna integrated into the stack, the near-field antenna having a first side, a second side opposite to the first side, and a bottom side; and a magnetoelectric insulating material integrated into the stack, wherein at least a portion of the magnetoelectric insulating material is adjacent to the bottom side of the antenna and adjacent to at least one of the first side and the second side, the magnetoelectric insulating material is located between the antenna and the at least one capacitive sensing electrode, the antenna, the at least one capacitive sensing electrode, and the magnetoelectric insulating material are on the same layer, and... The magnetoelectric insulating material is adjacent to the first side and the second side of the antenna, or the magnetoelectric insulating material forms an outer ring around the antenna, or the magnetoelectric insulating material forms an inner ring adjacent to the inner surface of the antenna, or the magnetoelectric insulating material is segmented, or the magnetoelectric insulating material surrounds the entire periphery of the antenna, or the magnetoelectric insulating material forms a groove with an inner channel and at least a portion of the antenna is disposed within the inner channel. According to claim 6, the near-field antenna and the at least one capacitive sensing electrode are on the same substrate. According to claim 6, the module wherein the magnetic insulating material partially covers the near-field antenna. According to claim 6, the module wherein the magnetoelectric insulating material is a dielectric layer. An electronic device includes: a stack comprising: a first layer; a second layer; a magnetoelectric insulating material integrated between the first layer and the second layer; at least one capacitor electrode on the first layer, the second layer, or both the first layer and the second layer; and a near-field antenna integrated into the stack, the near-field antenna having a first side, a second side opposite to the first side, and a bottom side, wherein at least a portion of the magnetoelectric insulating material is adjacent to the bottom side of the near-field antenna and adjacent to at least one of the first side and the second side, the magnetoelectric insulating material being located between the near-field antenna and the at least one capacitor electrode. The near-field antenna, the at least one capacitive sensing electrode, and the magnetoelectric insulating material are on the same layer, and the magnetoelectric insulating material is adjacent to the first side and the second side of the antenna, or the magnetoelectric insulating material forms an outer ring around the antenna, or the magnetoelectric insulating material forms an inner ring adjacent to the inner surface of the antenna, or the magnetoelectric insulating material is segmented, or the magnetoelectric insulating material surrounds the entire periphery of the antenna, or the magnetoelectric insulating material forms a groove with an inner channel and at least a portion of the antenna is disposed within the inner channel. The apparatus according to claim 10, wherein the first layer is a capacitive reference surface. The device according to claim 10, wherein the near-field antenna is deposited on the same layer as the magnetoelectric insulating material.