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TWI901244B - Ball grinding apparatus - Google Patents

Ball grinding apparatus

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Publication number
TWI901244B
TWI901244B TW113124795A TW113124795A TWI901244B TW I901244 B TWI901244 B TW I901244B TW 113124795 A TW113124795 A TW 113124795A TW 113124795 A TW113124795 A TW 113124795A TW I901244 B TWI901244 B TW I901244B
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TW
Taiwan
Prior art keywords
grinding
ball
roller
pressure roller
drive
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TW113124795A
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Chinese (zh)
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TW202602606A (en
Inventor
李安哲
黃家聲
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宇榮高爾夫科技股份有限公司
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Priority to TW113124795A priority Critical patent/TWI901244B/en
Application granted granted Critical
Publication of TWI901244B publication Critical patent/TWI901244B/en
Publication of TW202602606A publication Critical patent/TW202602606A/en

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Abstract

A ball grinding apparatus is adapted to perform a multi-stage grinding operation on at least one elastic ball, so that the at least one elastic ball has a target size. The ball grinding apparatus includes a grinding device and a control host. The ball grinding apparatus includes a grinding roller, a pressing roller, a first driver, and a second driver. The grinding roller is opposite to the pressing roller. The first driver is connected to the grinding roller, so as to drive the grinding roller to rotate at a working speed. The second driver is connected to the pressing roller, so as to drive the pressing roller to move closer to or away from the grinding roller. The control host is electrically connected to the second driver, so as to control the second driver to adjust a distance between the grinding roller and the pressing roller. Therefore, the accuracy of grinding the at least one elastic ball can be improved.

Description

球體研磨設備Ball grinding equipment

本發明涉及一種球體研磨設備,特別是涉及一種可多段式研磨的球體研磨設備。The present invention relates to a ball grinding device, and in particular to a ball grinding device capable of multi-stage grinding.

在高爾夫球的生產過程中,首先要將球料初胚(如橡膠初胚)放入模具中熱壓成彈性球體,此彈性球體稱為球心。而後為了消除球心的表面瑕疵、達到所需的尺寸規格並提高真圓度,需要對球心進行研磨。In the golf ball production process, a rough ball (such as a rubber blank) is first placed in a mold and hot-pressed into a flexible sphere, called the core. The core is then ground to remove surface imperfections, achieve the required dimensions, and improve roundness.

現有的研磨設備是在一次研磨操作中將球心直接研磨至目標尺寸,惟如此操作對彈性球體的研磨精準度較低,而且也很難控制彈性球體的真圓度,最終可能影響成品高爾夫球的性能。雖然可以透過二次研磨加工來補救,但是會大大降低生產效率。Existing grinding equipment grinds the center of the ball to the target size in a single grinding operation. However, this operation has low grinding accuracy for elastic balls and is difficult to control the roundness of the elastic ball, which can ultimately affect the performance of the finished golf ball. While secondary grinding can be used to correct this, it significantly reduces production efficiency.

故,如何通過結構設計的改良,來克服上述的缺陷,已成為本發明技術領域所欲解決的重要課題之一。Therefore, how to overcome the above-mentioned defects by improving the structural design has become one of the important issues to be solved in the field of the present invention.

本發明所要解決的技術問題在於,針對現有技術的不足提供一種球體研磨設備,適於在同一研磨工序中對至少一彈性球體進行多段研磨操作。The technical problem to be solved by the present invention is to provide a ball grinding device suitable for performing multiple grinding operations on at least one elastic ball in the same grinding process in order to address the shortcomings of the existing technology.

為了解決上述的技術問題,本發明所採用的其中一技術方案是提供一種球體研磨設備,適於對至少一彈性球體進行多段研磨操作,使至少一該彈性球體具有一目標尺寸。該球體研磨設備包括一研磨裝置以及一控制主機。該研磨裝置包括一研磨輥、一加壓輥、一第一驅動器及一第二驅動器,該研磨輥與該加壓輥相對設置,該第一驅動器經設置以驅動該加壓輥以一工作轉速轉動,且該第二驅動器經設置以驅動該加壓輥移動而靠近或遠離該研磨輥。該控制主機電連接該第二驅動器,以控制該第二驅動器調整該加壓輥與該研磨輥之間的距離。另外,該多段研磨操作依序包括第一段研磨操作、第二段研磨操作及第三段研磨操作;在該第一段研磨操作中,該加壓輥與該研磨輥相距第一距離,以將至少一該彈性球體從初始尺寸研磨至第一尺寸;在該第二段研磨操作中,該加壓輥與該研磨輥相距第二距離,以將至少一該彈性球體從該第一尺寸研磨至第二尺寸,該第二距離小於該第一距離,且該第二尺寸相對於該目標尺寸的縮率小於該第一尺寸相對於該目標尺寸的縮率;在該第三段研磨操作中,該加壓輥與該研磨輥相距第三距離,以將至少一該彈性球體從該第二尺寸研磨至第三尺寸,該第三距離小於該第二距離,且該第三尺寸相對於該目標尺寸的縮率小於該第二尺寸相對於該目標尺寸的縮率。To address the aforementioned technical issues, one of the technical solutions employed by the present invention is to provide a ball grinding apparatus suitable for performing multiple grinding operations on at least one elastic ball, thereby achieving a target size for the at least one elastic ball. The ball grinding apparatus includes a grinding device and a control host. The grinding device comprises a grinding roller, a pressure roller, a first drive, and a second drive. The grinding roller is disposed opposite the pressure roller. The first drive is configured to rotate the pressure roller at an operating speed, and the second drive is configured to move the pressure roller toward or away from the grinding roller. The control host is electrically connected to the second driver to control the second driver to adjust the distance between the pressure roller and the grinding roller. In addition, the multi-stage grinding operation includes a first grinding operation, a second grinding operation, and a third grinding operation in sequence; in the first grinding operation, the pressure roller and the grinding roller are separated by a first distance to grind at least one of the elastic balls from an initial size to a first size; in the second grinding operation, the pressure roller and the grinding roller are separated by a second distance to grind at least one of the elastic balls from the first size to a second size, and the second distance is The distance between the second dimension and the target dimension is smaller than the first distance, and the reduction ratio of the second dimension relative to the target dimension is smaller than the reduction ratio of the first dimension relative to the target dimension. In the third grinding operation, the pressure roller and the grinding roller are separated by a third distance to grind at least one of the elastic spheres from the second dimension to a third dimension, the third distance being smaller than the second distance, and the reduction ratio of the third dimension relative to the target dimension is smaller than the reduction ratio of the second dimension relative to the target dimension.

在本發明的其中一較佳或可行實施例中,該研磨裝置包括一研磨室,該加壓輥與該研磨輥設置於該研磨室內,且該第一驅動器與該第二驅動器設置於該研磨室外。In one preferred or feasible embodiment of the present invention, the grinding device includes a grinding chamber, the pressure roller and the grinding roller are arranged in the grinding chamber, and the first drive and the second drive are arranged outside the grinding chamber.

在本發明的其中一較佳或可行實施例中,該研磨輥具有多個沿軸向間隔排列的研磨槽。In one preferred or feasible embodiment of the present invention, the grinding roller has a plurality of grinding grooves spaced apart along the axial direction.

在本發明的其中一較佳或可行實施例中,該研磨裝置包括一設置於該研磨室內的承托座,該承托座位於該加壓輥與該研磨輥之間並具有多個斜向導槽,且多個該斜向導槽與多個該研磨槽位置相對應。In one preferred or feasible embodiment of the present invention, the grinding device includes a support seat disposed in the grinding chamber, the support seat is located between the pressure roller and the grinding roller and has a plurality of oblique guide grooves, and the plurality of oblique guide grooves correspond to the positions of the plurality of grinding grooves.

在本發明的其中一較佳或可行實施例中,該球體研磨設備還包括一送球裝置,該送球裝置包括一輸送軌道及多個與該輸送軌道連通的進球管件,且多個該進球管件設置於該研磨室內。另外,多個該進球管件位於該承托座上方並與多個該斜向導槽位置相對應。In one preferred or feasible embodiment of the present invention, the ball grinding apparatus further includes a ball feeding device comprising a conveyor track and a plurality of ball-feeding tubes connected to the conveyor track, wherein the plurality of ball-feeding tubes are disposed within the grinding chamber. Furthermore, the plurality of ball-feeding tubes are positioned above the support seat and correspond to the plurality of the inclined guide grooves.

在本發明的其中一較佳或可行實施例中,該球體研磨設備還包括一洗球裝置,且該洗球裝置經設置以對研磨後的至少一該彈性球體進行清洗。In one preferred or feasible embodiment of the present invention, the ball grinding apparatus further comprises a ball washing device, and the ball washing device is configured to clean at least one of the elastic balls after grinding.

在本發明的其中一較佳或可行實施例中,該洗球裝置包括一導引部件及一清洗槽體,且該清洗槽體通過該導引部件以從該研磨室接收研磨後的至少一該彈性球體。In one preferred or feasible embodiment of the present invention, the ball washing device includes a guide component and a cleaning tank, and the cleaning tank receives at least one of the ground elastic balls from the grinding chamber through the guide component.

在本發明的其中一較佳或可行實施例中,該洗球裝置包括一設置於該清洗槽體上方的噴灑器。In one preferred or feasible embodiment of the present invention, the ball washing device includes a sprayer disposed above the cleaning tank.

在本發明的其中一較佳或可行實施例中,該球體研磨設備還包括一光學尺。另外,該第二驅動器為一伺服驅動器並包括一驅動桿件,該驅動桿件的自由端連接於該加壓輥,且該光學尺設置於該驅動桿件的一側,用以量測該加壓輥相對於該研磨輥的移動距離。In one preferred or feasible embodiment of the present invention, the ball grinding apparatus further includes an optical ruler. Furthermore, the second actuator is a servo actuator comprising a drive rod, the free end of which is connected to the pressure roller. The optical ruler is disposed on one side of the drive rod to measure the distance traveled by the pressure roller relative to the grinding roller.

總體來說,本發明所提供的球體研磨設備,其能通過包括技術特徵“研磨輥與加壓輥相對設置,第一驅動器經設置以驅動該加壓輥以一工作轉速轉動,且第二驅動器經設置以驅動加壓輥移動而靠近或遠離研磨輥”、“控制主機電連接第二驅動器,以控制第二驅動器調整加壓輥與研磨輥之間的距離”以及“加壓輥與研磨輥在後一段研磨操作中的相對距離相較於它們在前一段研磨操作中的相對距離更小,同時後一段研磨操作所得到的球體尺寸縮率相較於前一段研磨操作所得到的球體尺寸縮率也更小”的技術方案,以提高對彈性球體的研磨加工的精準度,以及提高研磨後的彈性球體的真圓度。In general, the ball grinding device provided by the present invention can be realized by including the technical features of "the grinding roller and the pressure roller are arranged opposite to each other, the first driver is arranged to drive the pressure roller to rotate at a working speed, and the second driver is arranged to drive the pressure roller to move closer to or away from the grinding roller", "the control main motor is electrically connected to the second driver to control the second driver to adjust the distance between the pressure roller and the grinding roller ” and “the relative distance between the pressure roller and the grinding roller in the latter grinding operation is smaller than their relative distance in the former grinding operation, and the size reduction ratio of the sphere obtained in the latter grinding operation is also smaller than the size reduction ratio of the sphere obtained in the former grinding operation”, so as to improve the accuracy of the grinding process of the elastic sphere and improve the roundness of the ground elastic sphere.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“球體研磨設備”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following describes the implementation of the "ball grinding apparatus" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual size. Please note that the following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that while terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

請參閱圖1,其示出根據本發明實施例的球體研磨設備的主要部分。如圖1所示,本發明的球體研磨設備Z包括一研磨裝置1以及一控制主機2。研磨裝置1可受控制主機2的控制以對至少一彈性球體進行多段研磨操作,即在一次研磨操作中分成多次將至少一彈性球體研磨至目標尺寸。彈性球體例如為高爾夫球的橡膠球心,但本發明不受限於此。Please refer to Figure 1, which illustrates the main components of a ball grinding apparatus according to an embodiment of the present invention. As shown in Figure 1, the ball grinding apparatus Z of the present invention comprises a grinding device 1 and a control host 2. The grinding device 1, under the control of the control host 2, can perform a multi-stage grinding operation on at least one elastic ball, i.e., grinding the at least one elastic ball to a target size in multiple stages within a single grinding operation. The elastic ball can be, for example, a rubber core for a golf ball, but the present invention is not limited thereto.

下文中,將配合圖2至圖7來描述研磨裝置1與控制主機2的技術細節。In the following, the technical details of the polishing device 1 and the control host 2 will be described in conjunction with Figures 2 to 7.

研磨裝置1主要包括一研磨輥11、一加壓輥12、一第一驅動器13及一第二驅動器14。研磨輥11與加壓輥12相對設置,第一驅動器13經設置以驅動加壓輥12以一工作轉速轉動,且第二驅動器14經設置以驅動加壓輥12移動而靠近或遠離研磨輥11。控制主機2電連接第二驅動器14,以控制第二驅動器14調整加壓輥12與研磨輥11之間的距離。The polishing device 1 primarily comprises a polishing roller 11, a pressure roller 12, a first drive 13, and a second drive 14. The polishing roller 11 and the pressure roller 12 are disposed opposite each other. The first drive 13 is configured to drive the pressure roller 12 to rotate at an operating speed, and the second drive 14 is configured to move the pressure roller 12 toward or away from the polishing roller 11. The control host 2 is electrically connected to the second drive 14 to control the second drive 14 to adjust the distance between the pressure roller 12 and the polishing roller 11.

在本發明的其中一較佳或可行實施例中,研磨輥11可設置為輥式沙輪,且研磨輥11具有多個沿軸向方向間隔排列的研磨槽11R,其中每一個研磨槽11R可作用於一個彈性球體B。加壓輥12可通過一傳動軸131連接至第一驅動器13,且可在第一驅動器13的驅動下與傳動軸131同步轉動。又,加壓輥12可設置於一多軸移動機構15上,且多軸移動機構15與第二驅動器14驅動連接。因此,加壓輥12可在第二驅動器14的驅動下沿徑向方向往復移動,即靠近或遠離研磨輥11。另外,加壓輥12可在多軸移動機構15的帶動下沿軸向方向往復擺動,以提高彈性球體B的真圓度。In one preferred or feasible embodiment of the present invention, the grinding roller 11 can be configured as a grinding wheel and has a plurality of grinding grooves 11R spaced axially, each of which acts on a resilient ball B. The pressure roller 12 can be connected to a first drive 13 via a drive shaft 131 and can rotate synchronously with the drive shaft 131 under the drive of the first drive 13. Furthermore, the pressure roller 12 can be mounted on a multi-axis motion mechanism 15, which is drivably connected to a second drive 14. Therefore, the pressure roller 12 can be driven by the second driver 14 to reciprocate in the radial direction, that is, to move closer to or farther away from the grinding roller 11. In addition, the pressure roller 12 can be driven by the multi-axis movement mechanism 15 to reciprocate in the axial direction to improve the roundness of the elastic ball B.

更進一步來說,多軸移動機構15可設置為多個線性滑台的組合,且可包括一動力源151以為自身的往復擺動提供動力,但本發明不受限於此。Furthermore, the multi-axis motion mechanism 15 can be configured as a combination of multiple linear slides and can include a power source 151 to provide power for its reciprocating motion, but the present invention is not limited thereto.

實際應用時,研磨裝置1包括一研磨室100,研磨輥11與加壓輥12設置於研磨室100內,且第一驅動器13與第二驅動器14設置於研磨室100外。又,研磨裝置1包括一設置於研磨室100內的承托座16,承托座16位於研磨輥11與加壓輥12之間並具有多個斜向導槽16R,且多個斜向導槽16R與多個研磨槽11R位置相對應,從而每一個研磨後的彈性球體B可在斜向導槽16R的導向作用下向外移動離開研磨室100。In practice, the grinding apparatus 1 includes a grinding chamber 100, wherein a grinding roller 11 and a pressure roller 12 are disposed within the grinding chamber 100, and a first drive 13 and a second drive 14 are disposed outside the grinding chamber 100. Furthermore, the grinding apparatus 1 includes a support 16 disposed within the grinding chamber 100. The support 16 is located between the grinding roller 11 and the pressure roller 12 and has a plurality of inclined guide grooves 16R. The plurality of inclined guide grooves 16R correspond to the plurality of grinding grooves 11R. Thus, each elastic ball B, after grinding, can be guided outward from the grinding chamber 100 by the inclined guide grooves 16R.

如圖1及圖3所示,本發明的球體研磨設備Z還可包括一送球裝置3,以連續向研磨室100內提供待研磨的彈性球體B。送球裝置3可包括一輸送軌道31及多個與輸送軌道31連通的進球管件32,且多個進球管件32設置於研磨室100內。另外,多個進球管件32位於承托座16上方並與多個斜向導槽16R位置相對應,其中每一個進球管件32可將彈性球體B導入研磨室100內並落在所對應的斜向導槽16R上。As shown in Figures 1 and 3 , the ball grinding apparatus Z of the present invention may further include a ball feeding device 3 for continuously supplying elastic balls B to be ground into the grinding chamber 100. The ball feeding device 3 may include a conveyor track 31 and a plurality of ball inlet pipes 32 connected to the conveyor track 31. The plurality of ball inlet pipes 32 are disposed within the grinding chamber 100. Furthermore, the plurality of ball inlet pipes 32 are positioned above the support 16 and correspond to the plurality of inclined guide grooves 16R. Each ball inlet pipe 32 guides the elastic balls B into the grinding chamber 100 and places them into the corresponding inclined guide groove 16R.

如圖3至圖5所示,本發明的球體研磨設備Z針對彈性球體B(如高爾夫球的橡膠球心)的多段研磨操作可依序包括第一段研磨操作、第二段研磨操作及第三段研磨操作。As shown in FIG3 to FIG5, the multi-stage grinding operation of the ball grinding device Z of the present invention on the elastic ball B (such as the rubber ball core of a golf ball) can sequentially include a first grinding operation, a second grinding operation and a third grinding operation.

在第一段研磨操作中,加壓輥12與研磨輥11相距第一距離W1,以將至少一彈性球體B從初始尺寸研磨至第一尺寸。在第二段研磨操作中,加壓輥12與研磨輥11相距第二距離W2,以將至少一彈性球體B從第一尺寸研磨至第二尺寸,第二距離W2小於第一距離W1,且第二尺寸相對於目標尺寸的縮率小於第一尺寸相對於目標尺寸的縮率。在第三段研磨操作中,加壓輥12與研磨輥11相距第三距離W3,以將至少一彈性球體B從第二尺寸研磨至第三尺寸,第三距離W3小於第二距離W2,且第三尺寸相對於目標尺寸的縮率小於第二尺寸相對於目標尺寸的縮率。因此,既能提高對彈性球體B的研磨加工的精準度,又能提高研磨後的彈性球體B的真圓度。During the first grinding operation, the pressure roller 12 is spaced a first distance W1 from the grinding roller 11 to grind the at least one elastic sphere B from its initial size to the first size. During the second grinding operation, the pressure roller 12 is spaced a second distance W2 from the grinding roller 11 to grind the at least one elastic sphere B from the first size to the second size. The second distance W2 is smaller than the first distance W1, and the reduction ratio of the second size relative to the target size is smaller than the reduction ratio of the first size relative to the target size. During the third grinding operation, the pressure roller 12 is spaced a third distance W3 from the grinding roller 11 to grind at least one elastic sphere B from the second size to the third size. The third distance W3 is smaller than the second distance W2, and the reduction ratio of the third size relative to the target size is smaller than the reduction ratio of the second size relative to the target size. This improves both the grinding accuracy of the elastic sphere B and the roundness of the ground elastic sphere B.

如圖2所示,控制主機2可包括一顯示操控介面21,從而現場作業人員可透過顯示操控介面21設定各個研磨階段的操作參數,例如研磨時間、尺寸、加壓輥12的回退和暫停時間等,並在各個研磨階段中進行即時監控。更進一步來說,在各個研磨階段中,為了避免積累誤差,加壓輥12的移動是先後退再前進,即加壓輥12先退回到待啟動位置並在停留設定的時間後重新前進到新的工作位置。As shown in Figure 2, the control host 2 includes a display interface 21, through which on-site operators can set operating parameters for each grinding stage, such as grinding time, grinding size, and the retraction and pause time of the pressure roller 12. This allows for real-time monitoring of each grinding stage. Furthermore, to avoid cumulative errors, the pressure roller 12 moves backwards and then forwards during each grinding stage. Specifically, the pressure roller 12 first retracts to its standby position and then, after a set dwell time, reenters its new working position.

值得注意的是,雖然以上所述是以三段研磨操作為例說明本發明的特點,但是根據本發明的精神尚可應用在三段以上的研磨操作。舉例來說,針對不同材質的彈性球體可採用五段研磨操作,且加壓輥12與研磨輥11在後一段研磨操作中的相對距離相較於它們在前一段研磨操作中的相對距離更小,同時後一段研磨操作所得到的球體尺寸縮率相較於前一段研磨操作所得到的球體尺寸縮率也更小。It is worth noting that while the above description uses a three-stage grinding operation as an example to illustrate the features of the present invention, the spirit of the present invention can also be applied to grinding operations with more than three stages. For example, a five-stage grinding operation can be used for elastic spheres made of different materials, and the relative distance between the pressure roller 12 and the grinding roller 11 in the latter grinding operation is smaller than their relative distance in the former grinding operation. At the same time, the sphere size reduction ratio obtained in the latter grinding operation is also smaller than that obtained in the former grinding operation.

如圖1及圖6所示,本發明的球體研磨設備Z還可包括一光學尺4,用以量測加壓輥12相對於研磨輥11的移動距離。具體來說,第二驅動器14包括一驅動桿件141,且驅動桿件141的自由端連接於加壓輥12。光學尺4設置於驅動桿件141的一側,且控制主機2電連接光學尺4。因此,光學尺4可取得驅動桿件141伸縮位移之實際位移數據,並傳輸給控制主機2進行判讀和顯示。As shown in Figures 1 and 6 , the ball grinding apparatus Z of the present invention may also include an optical ruler 4 for measuring the travel distance of the pressure roller 12 relative to the grinding roller 11. Specifically, the second actuator 14 includes a drive rod 141, the free end of which is connected to the pressure roller 12. The optical ruler 4 is mounted on one side of the drive rod 141 and is electrically connected to the control host 2. Therefore, the optical ruler 4 can obtain actual displacement data of the drive rod 141's extension and contraction, and transmit this data to the control host 2 for interpretation and display.

較佳地,第二驅動器14為一伺服驅動器,其可根據設定的驅動參數如驅動方向及驅動位移量,通過驅動桿件141驅使多軸移動機構15帶著加壓輥12前進或後退一定的距離,以達到更精準的研磨操作。Preferably, the second drive 14 is a servo drive that can drive the multi-axis motion mechanism 15 with the pressure roller 12 forward or backward a certain distance through the drive rod 141 according to the set drive parameters such as drive direction and drive displacement, so as to achieve a more precise grinding operation.

如圖7所示,本發明的球體研磨設備Z還可包括一洗球裝置5,且洗球裝置5經設置以使用清洗液如水對研磨後的至少一彈性球體B進行清洗。具體來說,洗球裝置5可包括一導引部件51及一清洗槽體52,且清洗槽體52通過導引部件51以從研磨室100接收研磨後的至少一彈性球體B。導引部件51可設置為落球軌道,但本發明不受限於此。根據實際需要,洗球裝置5可進一步包括一設置於清洗槽體52上方的噴灑器53。As shown in Figure 7 , the ball grinding apparatus Z of the present invention may further include a ball washing device 5 , which is configured to clean the at least one elastic ball B after grinding using a cleaning liquid, such as water. Specifically, the ball washing device 5 may include a guide member 51 and a cleaning trough 52 . The cleaning trough 52 receives the at least one elastic ball B after grinding from the grinding chamber 100 via the guide member 51 . The guide member 51 may be configured as a ball drop track, but the present invention is not limited thereto. If desired, the ball washing device 5 may further include a sprayer 53 disposed above the cleaning trough 52 .

[實施例的有益效果][Beneficial Effects of the Embodiments]

本發明所提供的球體研磨設備,其能通過包括技術特徵“研磨輥與加壓輥相對設置,第一驅動器經設置以驅動該加壓輥以一工作轉速轉動,且第二驅動器經設置以驅動加壓輥移動而靠近或遠離研磨輥”、“控制主機電連接第二驅動器,以控制第二驅動器調整加壓輥與研磨輥之間的距離”以及“加壓輥與研磨輥在後一段研磨操作中的相對距離相較於它們在前一段研磨操作中的相對距離更小,同時後一段研磨操作所得到的球體尺寸縮率相較於前一段研磨操作所得到的球體尺寸縮率也更小”的技術方案,以提高對彈性球體的研磨加工的精準度,以及提高研磨後的彈性球體的真圓度。The ball grinding device provided by the present invention can be realized by including the technical features of "a grinding roller and a pressure roller are arranged opposite to each other, a first driver is arranged to drive the pressure roller to rotate at a working speed, and a second driver is arranged to drive the pressure roller to move closer to or farther away from the grinding roller", "a control main motor is electrically connected to the second driver to control the second driver to adjust the distance between the pressure roller and the grinding roller" and The technical solution of "the relative distance between the pressure roller and the grinding roller in the latter grinding operation is smaller than their relative distance in the former grinding operation, and the sphere size reduction ratio obtained in the latter grinding operation is also smaller than that obtained in the former grinding operation" is used to improve the accuracy of the grinding process of the elastic sphere and improve the true roundness of the ground elastic sphere.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The contents disclosed above are merely preferred feasible embodiments of the present invention and do not limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the scope of the patent application of the present invention.

Z:球體研磨設備 1:研磨裝置 100:研磨室 11:研磨輥 11R:研磨槽 12:加壓輥 13:第一驅動器 131:傳動軸 14:第二驅動器 141:驅動桿件 15:多軸移動機構 151:動力源 16:承托座 16R:斜向導槽 2:控制主機 21:顯示操控介面 3:送球裝置 31:輸送軌道 32:進球管件 4:光學尺 5:洗球裝置 51:導引部件 52:清洗槽體 53:噴灑器 B:球體 W1:第一距離 W2:第二距離 W3:第三距離Z: Ball Grinding Equipment 1: Grinding Device 100: Grinding Chamber 11: Grinding Roller 11R: Grinding Tank 12: Pressure Roller 13: First Drive 131: Drive Shaft 14: Second Drive 141: Drive Rod 15: Multi-Axis Motion Mechanism 151: Power Source 16: Support 16R: Inclined Guide 2: Control Unit 21: Display Interface 3: Ball Feeder 31: Conveyor Track 32: Ball Feeding Tube 4: Optical Scale 5: Ball Washer 51: Guide Component 52: Cleaning Tank 53: Sprayer B: Ball W1: First Distance W2: Second Distance W3: Third Distance

圖1為本發明的球體研磨設備的其中一局部立體示意圖。FIG1 is a partial three-dimensional schematic diagram of the ball grinding device of the present invention.

圖2為本發明的球體研磨設備的控制主機的顯示介面示意圖。FIG2 is a schematic diagram of the display interface of the control host of the ball grinding equipment of the present invention.

圖3為本發明的球體研磨設備的研磨裝置的其中一研磨階段的操作示意圖。FIG3 is a schematic diagram illustrating the operation of the grinding device of the ball grinding apparatus of the present invention during one grinding stage.

圖4為本發明的球體研磨設備的研磨裝置的另外一研磨階段的操作示意圖。FIG4 is a schematic diagram illustrating the operation of the grinding device of the ball grinding apparatus of the present invention during another grinding stage.

圖5為本發明的球體研磨設備的研磨裝置的又一研磨階段的操作示意圖。FIG5 is a schematic diagram illustrating the operation of the grinding device of the ball grinding apparatus of the present invention during another grinding stage.

圖6為本發明的球體研磨設備的研磨裝置的局部俯視示意圖。FIG6 is a partial top view schematic diagram of the grinding device of the ball grinding apparatus of the present invention.

圖7為本發明的球體研磨設備的另外一局部立體示意圖。FIG7 is another partial three-dimensional schematic diagram of the ball grinding apparatus of the present invention.

Z:球體研磨設備 Z: Ball grinding equipment

1:研磨裝置 1: Grinding device

14:第二驅動器 14: Second drive

141:驅動桿件 141: Drive rod

15:多軸移動機構 15: Multi-axis motion mechanism

151:動力源 151: Power Source

2:控制主機 2: Control host

3:送球裝置 3: Ball delivery device

31:輸送軌道 31: Conveyor track

4:光學尺 4: Optical ruler

Claims (9)

一種球體研磨設備,適於對至少一彈性球體進行多段研磨操作,使至少一該彈性球體具有一目標尺寸,該球體研磨設備包括: 一研磨裝置,包括一研磨輥、一加壓輥、一第一驅動器及一第二驅動器,該研磨輥與該加壓輥相對設置,該第一驅動器經設置以驅動該加壓輥以一工作轉速轉動,且該第二驅動器經設置以驅動該加壓輥移動而靠近或遠離該研磨輥;以及 一控制主機,電連接該第二驅動器,以控制該第二驅動器調整該加壓輥與該研磨輥之間的距離; 其中,該多段研磨操作依序包括第一段研磨操作、第二段研磨操作及第三段研磨操作;在該第一段研磨操作中,該加壓輥與該研磨輥相距第一距離,以將至少一該彈性球體從初始尺寸研磨至第一尺寸;在該第二段研磨操作中,該加壓輥與該研磨輥相距第二距離,以將至少一該彈性球體從該第一尺寸研磨至第二尺寸,該第二距離小於該第一距離,且該第二尺寸相對於該目標尺寸的縮率小於該第一尺寸相對於該目標尺寸的縮率;在該第三段研磨操作中,該加壓輥與該研磨輥相距第三距離,以將至少一該彈性球體從該第二尺寸研磨至第三尺寸,該第三距離小於該第二距離,且該第三尺寸相對於該目標尺寸的縮率小於該第二尺寸相對於該目標尺寸的縮率;且 其中,在各個該多段研磨操作中,該加壓輥係經配置以退回到一待啟動位置,並在該待啟動位置中停留一設定時間後,重新前進到一新的工作位置。A ball grinding apparatus is suitable for performing a multi-stage grinding operation on at least one elastic ball to obtain a target size. The ball grinding apparatus comprises: a grinding device including a grinding roller, a pressure roller, a first driver, and a second driver, wherein the grinding roller and the pressure roller are arranged opposite each other, the first driver being configured to drive the pressure roller to rotate at a working speed, and the second driver being configured to drive the pressure roller to move closer to or farther from the grinding roller; and a control host electrically connected to the second driver to control the second driver to adjust the distance between the pressure roller and the grinding roller. The multi-stage grinding operation includes a first grinding operation, a second grinding operation and a third grinding operation in sequence; in the first grinding operation, the pressure roller and the grinding roller are separated by a first distance to grind at least one of the elastic spheres from an initial size to a first size; in the second grinding operation, the pressure roller and the grinding roller are separated by a second distance to grind at least one of the elastic spheres from the first size to a second size, and the second distance is The pressurizing roller is configured to return to a standby position during each of the multiple grinding operations, and after remaining in the standby position for a predetermined period of time, the pressurizing roller is moved back to a new working position. 如請求項1所述的球體研磨設備,其中,該研磨裝置包括一研磨室,該加壓輥與該研磨輥設置於該研磨室內,且該第一驅動器與該第二驅動器設置於該研磨室外。The ball grinding apparatus as described in claim 1, wherein the grinding device includes a grinding chamber, the pressure roller and the grinding roller are arranged in the grinding chamber, and the first drive and the second drive are arranged outside the grinding chamber. 如請求項2所述的球體研磨設備,其中,該研磨輥具有多個沿軸向間隔排列的研磨槽。The ball grinding apparatus as described in claim 2, wherein the grinding roller has a plurality of grinding grooves arranged at intervals along the axial direction. 如請求項3所述的球體研磨設備,其中,該研磨裝置包括一設置於該研磨室內的承托座,該承托座位於該加壓輥與該研磨輥之間並具有多個斜向導槽,且多個該斜向導槽與多個該研磨槽位置相對應。The ball grinding apparatus as described in claim 3, wherein the grinding device includes a support seat arranged in the grinding chamber, the support seat is located between the pressure roller and the grinding roller and has a plurality of inclined guide grooves, and the plurality of inclined guide grooves correspond to the positions of the plurality of grinding grooves. 如請求項4所述的球體研磨設備,還包括一送球裝置,該送球裝置包括一輸送軌道及多個與該輸送軌道連通的進球管件,且多個該進球管件設置於該研磨室內;其中,多個該進球管件位於該承托座上方並與多個該斜向導槽位置相對應。The ball grinding equipment as described in claim 4 further includes a ball feeding device, which includes a conveying track and multiple ball-entering pipes connected to the conveying track, and multiple ball-entering pipes are arranged in the grinding chamber; wherein, multiple ball-entering pipes are located above the supporting seat and correspond to the positions of multiple inclined guide grooves. 如請求項4所述的球體研磨設備,還包括一洗球裝置,且該洗球裝置經設置以對研磨後的至少一該彈性球體進行清洗。The ball grinding apparatus as described in claim 4 further comprises a ball washing device, and the ball washing device is configured to clean at least one of the elastic balls after grinding. 如請求項6所述的球體研磨設備,其中,該洗球裝置包括一導引部件及一清洗槽體,且該清洗槽體通過該導引部件以從該研磨室接收研磨後的至少一該彈性球體。The ball grinding apparatus as described in claim 6, wherein the ball washing device includes a guide component and a cleaning tank, and the cleaning tank receives at least one of the elastic balls after grinding from the grinding chamber through the guide component. 如請求項7所述的球體研磨設備,其中,該洗球裝置包括一設置於該清洗槽體上方的噴灑器。The ball grinding equipment as described in claim 7, wherein the ball washing device includes a sprayer arranged above the cleaning tank. 如請求項7所述的球體研磨設備,還包括一光學尺,其中該第二驅動器為一伺服驅動器並包括一驅動桿件,該驅動桿件的自由端連接於該加壓輥,且該光學尺設置於該驅動桿件的一側,用以量測該加壓輥相對於該研磨輥的移動距離。The ball grinding apparatus of claim 7 further comprises an optical ruler, wherein the second drive is a servo drive and includes a drive rod, the free end of which is connected to the pressure roller, and the optical ruler is disposed on one side of the drive rod to measure the movement distance of the pressure roller relative to the grinding roller.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3868661B2 (en) * 1999-04-06 2007-01-17 ミクロン精密株式会社 Centerless grinding method and centerless grinding apparatus for spherical workpiece
TW200927373A (en) * 2007-12-20 2009-07-01 pin-yuan Lai Sphere grinding machine
US20180029191A1 (en) * 2016-02-12 2018-02-01 Amatsuji Steel Ball Mfg. Co., Ltd. High-precision sphere size measuring device and sphere polishing device
TWM661688U (en) * 2024-07-03 2024-10-11 宇榮高爾夫科技股份有限公司 Ball grinding equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3868661B2 (en) * 1999-04-06 2007-01-17 ミクロン精密株式会社 Centerless grinding method and centerless grinding apparatus for spherical workpiece
TW200927373A (en) * 2007-12-20 2009-07-01 pin-yuan Lai Sphere grinding machine
US20180029191A1 (en) * 2016-02-12 2018-02-01 Amatsuji Steel Ball Mfg. Co., Ltd. High-precision sphere size measuring device and sphere polishing device
TWM661688U (en) * 2024-07-03 2024-10-11 宇榮高爾夫科技股份有限公司 Ball grinding equipment

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