TWI901112B - Burn-in device - Google Patents

Abstract

[Question] A burn-in device is provided that can increase the number of DUTs that can be measured per unit area of the device and suppress signal transmission loss. [Solution] The burn-in device 1 includes a burn-in plate 20, a burn-in chamber 11, an insulating chamber 30 separated from the burn-in chamber 11 by a wall 115a and isolated from the outside air by a wall 60, and a functional board 50. Wall 115a includes a top plate 40. The burn-in plate 20 and the top plate 40 are electrically connected by connector 23 mating with connector 42. The functional board 50 enters the interior of the insulating chamber 30 through an opening 61 formed in the wall 60 and is electrically connected to the top plate 40 by connector 52 mating with connector 43.

Description

Burn-in device

The present invention relates to a burn-in device.

A burn-in device is known for testing a device under test (DUT) in a high-temperature or low-temperature environment to remove any initial defects (e.g., see Patent Document 1). [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2022-138609.

[Identify the problem you want to solve]

In the aforementioned burn-in system, a heating layer houses the burn-in board and heats the DUT mounted on it. To provide thermal insulation for the heating layer, the burn-in board and driver board are connected via a relay board. However, this burn-in system presents the following issues: the presence of the relay board increases the size of the system, limiting the number of DUTs that can be measured per unit area of the system. Furthermore, because signals pass through the relay board, signal transmission loss between the burn-in board and driver board can occur.

The present invention aims to provide a burn-in device that increases the number of DUTs that can be measured per unit area of the device and suppresses signal transmission loss. [Solution]

[1] Aspect 1 of the present invention is a burn-in device comprising a burn-in board, a chamber, an insulating chamber, and a functional board. The burn-in board comprises a socket for mounting a DUT, a first substrate for mounting the socket, and a first connector mounted on the first substrate. The chamber accommodates the burn-in board. The insulating chamber is separated from the chamber by a first wall and from the outside air by a second wall. The functional board comprises a second substrate and a second connector mounted on the second substrate. The first wall comprises a top plate, the top plate comprising a third substrate, a third connector mounted on one main surface of the third substrate, and a fourth connector mounted on the other main surface of the third substrate. The burn-in board is electrically connected to the top plate via the engagement of the first connector and the third connector. The functional board enters the interior of the heat-insulating chamber through the opening formed in the second wall. The functional board is electrically connected to the top plate through the engagement of the second connector and the fourth connector.

[2] Aspect 2 of the present invention may be a burning device in the burning device of aspect 1, wherein the burning device includes a dry air supply device for supplying dry air to the insulating chamber.

[3] Aspect 3 of the present invention may be a burning device in the burning device of aspect 2, wherein the burning device includes a heating device for heating the dry air.

[4] Aspect 4 of the present invention may be a burning device in the burning device of aspect 3, wherein the burning device includes a temperature sensor for measuring the temperature in the chamber, and a control device for controlling the heating device based on the measurement result of the temperature sensor.

[5] Aspect 5 of the present invention may be a burning device in the burning device of aspect 4, wherein when the temperature in the aforementioned chamber is lower than a predetermined temperature, the aforementioned control device controls the aforementioned heating device to heat the aforementioned dry air, and when the temperature in the aforementioned chamber is higher than the predetermined temperature, the aforementioned control device controls the aforementioned heating device not to heat the aforementioned dry air.

[6] Aspect 6 of the present invention may be a burning device in the burning device of aspect 5, wherein the aforementioned predetermined temperature is a temperature value below 0°C.

[7] Aspect 7 of the present invention may be any of the burning devices of aspects 1 to 6, wherein the burning device includes a sealing member for sealing the opening of the second wall and the functional plate.

[8] Aspect 8 of the present invention may be any of the burning devices of aspects 1-7, wherein the functional panel includes a first portion that enters the interior of the insulating chamber through the opening, and a second portion that is located outside the insulating chamber.

[9] Aspect 9 of the present invention may be a burning device in the burning device of aspect 8, wherein the burning device includes a fan that supplies air to the second portion to cool the functional panel.

[10] Aspect 10 of the present invention may be any of the burn-in devices of aspects 1-9, wherein the functional board includes a control circuit mounted on the second substrate and configured to input and output signals to the DUT. [Effects of the Invention]

In the present invention, the burn-in board and the top board are electrically connected via the first and third connectors, and the function board and the top board are electrically connected via the second and fourth connectors. Therefore, there is no need for additional components to connect the burn-in board and the function board, reducing the size of the burn-in device and increasing the number of DUTs that can be measured per unit area of the device. Furthermore, because the burn-in board and the function board are connected via the top board and the first to fourth connectors, the communication path between the burn-in board and the function board is shorter, thereby reducing signal transmission loss between the two boards.

The following describes the embodiments of the present invention based on the accompanying drawings.

The overall structure of the burning device 1 of this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a front view of the burning device of this embodiment, Figure 2 is a side sectional view of the burning device of this embodiment, and Figure 3 is a view corresponding to the III-III portion of Figure 2. Figure 4 is an enlarged view corresponding to the IV portion of Figure 2.

The burn-in apparatus 1 of this embodiment is an apparatus for performing a burn-in test. The burn-in test is a type of screening test that aims to extract initial defects of an electronic component under test (DUT) such as a semiconductor integrated circuit element and remove the initial defective products.

As shown in Figures 1 to 3, the burn-in apparatus 1 includes a burn-in chamber 11, a burn-in board 20, a functional board 50, and an insulating chamber 30. The burn-in board 20 is a wiring board comprising a plurality of sockets 22 arranged in a matrix on a substrate 21, and allows the DUT 100 to be removably mounted thereon. The burn-in chamber 11 can accommodate a plurality of burn-in boards 20. The functional board 50 is a wiring board that inputs voltage and signals to the DUT 100 mounted on the burn-in board 20. The insulating chamber 30 isolates the burn-in chamber 11 from the outside air.

Burn-in apparatus 1 screens DUT 100 by applying low-temperature thermal stress (e.g., approximately -55°C to -10°C) to DUT 100 mounted on burn-in board 20 housed in burn-in chamber 11 while simultaneously applying power voltage and signals to DUT 100. The thermal stress applied to DUT 100 can be either room temperature or high temperature (e.g., approximately +25°C to +180°C).

As shown in Figure 1, the firing chamber 11 comprises a constant temperature chamber 111, partitioned by insulating walls and other elements, that accommodates the firing panels 20, and a door 112 that allows the constant temperature chamber 111 to be opened and closed. This constant temperature chamber 111 is provided with a plurality of slots 113 for holding the firing panels 20. Each slot 113 has a pair of rails 114 that support the left and right ends of the firing panel 20. The firing panel 20 slides on these rails 114 while being moved into the constant temperature chamber 111 through the door 112. Within the constant temperature chamber 111, 24 slots 113 are arranged in two rows, accommodating a total of 48 firing panels 20.

In the figure, one door (the door on the right) is not shown, showing constant temperature chamber 111 open. In contrast, the other door 112 (the door on the left) is shown closed, and accordingly, the 24 slots 113 on the left are not shown. The number and arrangement of slots 113 (i.e., the number and positional relationship of burn-in plates 20 within constant temperature chamber 111) are not limited to the example shown in Figure 1 and can be arbitrarily set based on testing efficiency.

Furthermore, the burning chamber 11 includes a temperature control device comprising an evaporator 116, a heater 117, and a fan 118. This temperature control device can be used to adjust the temperature within the constant temperature chamber 111. Specifically, the air within the constant temperature chamber 111 is circulated by the fan 118 in the direction of the arrows shown in FIG. 1 , while being cooled by the evaporator 116 and heated by the heater 117, thereby regulating the temperature within the constant temperature chamber 111.

As shown in Figure 2, a temperature sensor 119 is installed inside the constant temperature chamber 111 to measure the temperature inside the constant temperature chamber 111. Furthermore, the burning apparatus 1 includes a control device 80 that controls the entire burning apparatus 1. The temperature sensor 119 is electrically connected to the control device 80, and a detection signal from the temperature sensor 119 is output to the control device 80. The operation of the evaporator 116, heater 117, and fan 118 is controlled by the control device 80 in response to the temperature inside the constant temperature chamber 111 detected by the temperature sensor 119.

Among the walls 115 that separate the firing chamber 11 from the constant temperature chamber 111, the back wall 115a includes a top plate 40 that separates the insulating chamber 30 from the firing chamber 11. When viewed from the front of the firing chamber 11, the top plate 40 is positioned inside each slot 113. The top plate 40 is a wiring board that includes a substrate 41 and a connector 42 provided on one main surface of the substrate 41. This connector 42 can be mated with the connector 23 of the firing board 20 inserted into the slot 113. The mating of the connector 23 and the connector 42 electrically connects the firing board 20 to the top plate 40.

Furthermore, a connector 43 is provided on the top panel 40 on the side opposite to the side provided with the connector 42. This connector 43 can be mated with a connector 52 of a function board 50 described later. By mating the connector 43 with the connector 52, the top panel 40 and the function board 50 are electrically connected.

As shown in Figures 2 and 3, the insulating chamber 30 is a roughly rectangular space partitioned by the wall 115a and the wall 60 of the firing chamber 11. The insulating chamber 30 is separated from the constant temperature chamber 111 of the firing chamber 11 by the top plate 40, and is separated from the outside air by the wall 60. In this embodiment, a recess 115b is formed in a portion of the wall 115a, and the recess 115b is recessed toward the inner side of the constant temperature chamber 111 (from the right side to the left side in Figure 2). The bottom surface of the recess 115b is formed by the top plate 40. The wall 60 is a plate-shaped member made of a metal material such as SUS, and is provided so as to face the top plate 40 and be located inside the recess 115b. In this embodiment, the space defined by the recessed portion 115b of the wall 115a and the wall 60 is used as the insulating chamber 30. Dry air is supplied to the insulating chamber 30 from a dry air supply device 70 described later.

In this embodiment, although the wall 60 is located within the recess 115b of the wall 115a, this is not particularly limiting. For example, the main surface of the wall 60 may be larger than the opening of the recess 115b, and the wall 60 may be attached to the outside of the wall 115a of the firing chamber 11 to cover the recess 115b. Furthermore, the material constituting the wall 60 is not particularly limited to the materials described above; for example, the wall 60 may also be formed of a resin material.

As shown in FIG4 , the wall 60 is formed with an opening 61 through which the functional panel 50 enters the inner side of the insulating chamber 30. Although not particularly limited, the number of the openings 61 is set to be the same as the number of the burning panel 20 and the functional panel 50.

The function board (tester board) 50 is a wiring board including a substrate 51, a connector 52, and a control circuit 53. The function board 50 inputs voltage and signals to the DUT 100 mounted on the burn-in board 20.

As shown in Figure 4 , a portion (first portion P1) of the function board 50 enters the interior of the insulating chamber 30 through the opening 61 of the wall 60 , and the connector 52 of the function board 50 engages with the connector 43 of the top plate 40 . With the connector 52 engaged with the connector 43, the function board 50 and the top plate 40 are electrically connected. As shown in Figure 2 , the control circuit 53 is mounted on the substrate 51 and controls the voltage and signals input to the burning plate 20 . The control circuit 53 is electrically connected to the control device 80 and is controlled by the control device 80 .

As shown in Figure 4 , a sealing member 62 is provided on the wall 60 to seal the gap between the opening 61 and the functional board 50. The material constituting the sealing member 62 is not particularly limited; for example, a resin material such as silicone rubber can be used. The provision of the sealing member 62 further insulates the constant temperature chamber 111 from the outside air.

The burn-in apparatus 1 includes a fan 90 for cooling the functional boards 50. While not specifically limited, the fan 90 is housed in a housing 91 adjacent to the burn-in chamber 11 and supporting the plurality of functional boards 50 (see FIG. 2 ). The fan 90 operates continuously during the burn-in test, supplying air to the base plate 51 in the second portion P2 of the functional board 50 to cool the functional board 50. The location of the fan 90 is not particularly limited; for example, the fan 90 may be located on the base plate 51 of the functional board 50.

Returning to FIG. 2 , the burn-in apparatus 1 further includes a dry air supply device 70 . The dry air supply device 70 is connected to the insulating chamber 30 via a supply path 71 and supplies dry air to the insulating chamber 30 during the burn-in test.

Although not specifically limited, the dry air supplied by the dry air supply device 70 is at room temperature (25°C). Although not specifically limited, a constant amount of dry air is always supplied to the adiabatic chamber 30 during the burn-in test. Supplying dry air to the adiabatic chamber 30 lowers the dew point within the adiabatic chamber 30 and suppresses condensation within the adiabatic chamber 30 and on the functional panel 50. Although not specifically limited, the dew point temperature of the dry air under atmospheric pressure is below -50°C, preferably below -70°C.

The heating device 72 is connected to the dry air supply device 70 via the supply path 71. Specifically, the heating device 72 is located in the supply path 71 connecting the dry air supply device 70 and the insulating chamber 30. By heating the dry air using the heating device 72, the temperature of the dry air supplied to the insulating chamber 30 can be adjusted from a normal temperature within the range of 150°C. By supplying heated dry air to the insulating chamber 30, the dew point within the insulating chamber 30 is lowered, and the functional panel 50 (particularly the first portion P1 entering the insulating chamber 30) can be heated. This prevents condensation from forming within the insulating chamber 30 and on the functional panel 50, even when the constant temperature chamber 111 is low.

The dry air supply device 70 and the heating device 72 are each electrically connected to a control device 80 and controlled by the control device 80. Furthermore, although the dry air supply device 70 and the heating device 72 are shown separately in FIG. 2 , this is not particularly limiting, and the dry air supply device 70 and the heating device 72 may be a single integrated device.

The control device 80 is comprised of, for example, a computer. Although not specifically illustrated, this computer is an electronic computer that includes a CPU (processor), primary storage (RAM, etc.), secondary storage (hard drive, SSD, etc.), and an interface. The control described below is functionally implemented, for example, by executing programs in the control device 80. Alternatively, the control device 80 may be comprised of a circuit board instead of a computer.

In addition to controlling the applied voltage and signal to the DUT 100 and the temperature adjustment within the constant temperature chamber 111, the control device 80 determines that a DUT 100 with an abnormal response during the burn-in test is a defective product, stores the serial number of the DUT 100 (e.g., corresponding to the number of the slot 113 and the position on the burn-in board 20), and feeds back the test results.

Furthermore, the control device 80 controls the dry air supply device 70 and the heating device 72 as follows according to the temperature of the constant temperature chamber 111.

Specifically, when the temperature Tc within constant temperature chamber 111 measured by temperature sensor 119 is higher than predetermined temperature T1 (Tc ≥ T1), control device 80 determines that the temperature within constant temperature chamber 111 is high and controls dry air supply device 70 and heating device 72 to supply dry air at room temperature to insulating chamber 30. Specifically, in this case, control device 80 controls dry air supply device 70 and heating device 72 to supply dry air from dry air supply device 70 to insulating chamber 30 without heating the dry air.

On the other hand, if the temperature Tc within constant temperature chamber 111 measured by temperature sensor 119 is less than predetermined temperature T1 (Tc < T1), control device 80 determines that the temperature within constant temperature chamber 111 is low and controls dry air supply device 70 and heating device 72 to supply heated dry air to insulating chamber 30. Specifically, in this case, control device 80 controls dry air supply device 70 and heating device 72 to supply dry air from dry air supply device 70 to insulating chamber 30 and heat the dry air.

Although not particularly limited, the predetermined temperature T1 is a temperature below 0°C (T1≤0°C), preferably below -5°C, and more preferably below -10°C. As an example of the temperature T2 of the heated dry air, for example, it is above 40°C (T2≥40°C). In addition, if the temperature T2 of the heated dry air is higher than the normal temperature, it is not particularly limited to the above, and can be appropriately adjusted corresponding to the temperature in the constant temperature chamber 111. In this way, by supplying dry air whose temperature is appropriately adjusted corresponding to the temperature Tc in the constant temperature chamber 111 to the insulating chamber 30, the dew point in the insulating chamber 30 is controlled, the functional panel 50 can be heated, and condensation in the insulating chamber 30 and on the functional panel 50 can be further suppressed.

Furthermore, when high-temperature thermal stress is applied to the DUT 100, cooled dry air can be supplied to the insulating chamber 30. Specifically, when the temperature Tc within the constant-temperature chamber 111 is 100°C or higher (Tc ≥ 100°C), cooled dry air can be supplied to the insulating chamber 30. An example of the temperature T3 of the cooled dry air is -10°C or lower (T3 ≤ -10°C).

As described above, the burn-in apparatus 1 of this embodiment does not use relay boards or relay cables to connect the burn-in board 20 and the functional board 50. Instead, the burn-in board 20 and the functional board 50 are connected via the top board 40 and connectors 23, 42, 43, and 52. Therefore, there is no need to provide space within the apparatus to accommodate relay boards or relay cables, and the number of DUTs 100 that can be measured per unit area occupied by the burn-in apparatus 1 can be increased.

In addition, in this embodiment, the burn-in board 20 and the functional board 50 are electrically connected without the intervention of a relay board or a relay cable, and since the communication path between the burn-in board 20 and the functional board 50 is shorter than that of a known burn-in device including a relay board, the transmission loss of the signal from the functional board 50 to the burn-in board 20 can be reduced.

Furthermore, in this embodiment, by supplying heated dry air to the insulating chamber 30, the functional board 50 is heated, and condensation on the functional board 50 can be further suppressed. Therefore, in this embodiment, even if the functional board 50 is configured as a portion (P1) of the functional board 50 that enters the insulating chamber 30, and no other component is used to connect the burning plate 20 and the functional board 50, condensation on the functional board 50 can be suppressed. In this way, in this embodiment, by omitting other components to connect the burning plate 20 and the functional board 50, the device size of the burning device 1 is reduced, and condensation on the functional board 50 can be suppressed.

In addition, the embodiments described above are recorded to facilitate understanding of the present invention, rather than to limit the present invention. Therefore, the various elements disclosed in the embodiments described above are intended to include all design variations and equivalents that fall within the technical scope of the present invention.

1: Burning device 11: Burning chamber 20: Burning plate 21, 41, 51: Baseboard 22: Socket 23, 42, 43, 52: Connector 30: Insulated chamber 40: Top plate 50: Function board 53: Control circuit 60, 115, 115a: Wall 61: Opening 62: Sealing member 70: Dry air supply device 71: Supply path 72: Heating device 80: Control device 90, 118: Fan 91: Housing 100: Electronic component under test/DUT 111: Constant temperature chamber 112: Door 113: Slot 114: Guide rail 115b: Recess 116: Evaporator 117: Heater 119: Temperature sensor P1: First section P2: Second section

Figure 1 is a front view of a burning device according to an embodiment of the present invention. Figure 2 is a side sectional view of the burning device according to an embodiment of the present invention. Figure 3 is a view corresponding to the III-III portion of Figure 2. Figure 4 is an enlarged view corresponding to the IV portion of Figure 2.

11: Burning chamber 20: Burning plate 21, 41, 51: Baseboard 22: Socket 23, 42, 43, 52: Connector 30: Insulated chamber 40: Top plate 50: Function board 53: Control circuit 60, 115, 115a: Wall 61: Opening 70: Dry air supply unit 71: Supply path 72: Heating unit 80: Control unit 90: Fan 91: Housing 100: Electronic component under test/DUT 111: Constant temperature chamber 115b: Recess 119: Temperature sensor

Claims (9)

A burn-in device comprises: a burn-in board comprising a socket for assembling a DUT, a first substrate for mounting the socket, and a first connector mounted on the first substrate; a chamber for accommodating the burn-in board; an insulating chamber separated from the chamber by a first wall and from the outside air by a second wall; and a functional board comprising a second substrate and a second connector mounted on the second substrate, wherein the first wall comprises a top plate, the top plate comprises a third substrate, a third connector mounted on one main surface of the third substrate, and a fourth connector mounted on the other main surface of the third substrate, wherein the burning plate is electrically connected to the top plate via the engagement of the first connector with the third connector, wherein the functional board enters the interior of the insulating chamber via the opening formed in the second wall, and further includes: a first portion that enters the interior of the insulating chamber via the opening; and a second portion located outside the insulating chamber, wherein the functional board is electrically connected to the top plate via the engagement of the second connector with the fourth connector. The burning device as described in claim 1 further includes a dry air supply device for supplying dry air to the aforementioned insulating chamber. The burning device as described in claim 2 further includes a heating device for heating the aforementioned dry air. The burning device as described in claim 3 further includes: a temperature sensor for measuring the temperature in the aforementioned chamber; and a control device for controlling the aforementioned heating device based on the measurement result of the aforementioned temperature sensor. The burn-in device as described in claim 4, wherein when the temperature in the chamber is less than a predetermined temperature, the control device controls the heating device to heat the dry air, and when the temperature in the chamber is greater than the predetermined temperature, the control device controls the heating device not to heat the dry air. The burn-in device as described in claim 5, wherein the aforementioned predetermined temperature is a temperature value below 0°C. The burn-in device as described in claim 1 or 2 further includes a sealing member to seal the opening of the second wall and the functional plate. The burn-in device as described in claim 1 or 2 further includes a fan that supplies air to the second portion to cool the functional panel. A burn-in device as described in claim 1 or 2, wherein the functional board includes a control circuit, is mounted on the second substrate, and inputs and outputs signals to the DUT.