TWI901192B - Input buffer - Google Patents
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Abstract
Description
本案是關於一種輸入緩衝器及其操作方法,特別是關於一種具有多個放大器且可接收寬頻訊號的輸入緩衝器及其操作方法。This application relates to an input buffer and an operating method thereof, and more particularly to an input buffer having multiple amplifiers and capable of receiving broadband signals and an operating method thereof.
訊號在從發射裝置傳送至接收裝置的通道中會衰減。當無法補償通道衰耗時,解決此問題的另一方向就是在訊號被使用前,將其放大。此外,根據香農-哈特利定理(Shannon-Hartley theorem),可靠通訊的訊號速率直接與通訊頻寬成比例。對於高速訊號傳輸,若頻寬不夠,訊號不能完整被接收。加大頻寬亦是通訊領域的重要課題之一。因此,本發明致力於發展一種寬頻緩衝器以解決通道衰耗及頻寬不足之問題。Signals attenuate along the path from a transmitter to a receiver. When channel attenuation cannot be compensated for, another approach to addressing this problem is to amplify the signal before use. Furthermore, according to the Shannon-Hartley theorem, the signal rate for reliable communication is directly proportional to the communication bandwidth. For high-speed signal transmission, insufficient bandwidth prevents the signal from being fully received. Increasing bandwidth is also a key issue in the field of communications. Therefore, this invention is dedicated to developing a broadband buffer to address the problems of channel attenuation and insufficient bandwidth.
本案之一些實施方式提供一種輸入緩衝器,其包含第一至第二放大器。第一放大器包含第一前端電路、第一電晶體、以及第二電晶體。第一前端電路用以接收第一電壓及第二電壓。第一電晶體的第一端在第一節點與第一前端電路耦接。第二電晶體的第一端在第二節點與第一前端電路耦接。第二電晶體的第二端在參考節點與第一電晶體的第二端耦接。第一放大器用以響應於第一電壓及第二電壓分別在第一節點與第二節點輸出第三電壓及第四電壓。第二放大器包含第三電晶體與第四電晶體。第三電晶體的控制端與第四電晶體的控制端分別在第一節點和第二節點與第一放大器耦接。第二放大器用以響應該第三電壓及該第四電壓產生第五電壓。Some embodiments of the present invention provide an input buffer comprising a first to second amplifier. The first amplifier comprises a first front-end circuit, a first transistor, and a second transistor. The first front-end circuit is used to receive a first voltage and a second voltage. The first end of the first transistor is coupled to the first front-end circuit at a first node. The first end of the second transistor is coupled to the first front-end circuit at a second node. The second end of the second transistor is coupled to the second end of the first transistor at a reference node. The first amplifier is used to output a third voltage and a fourth voltage at a first node and a second node, respectively, in response to the first voltage and the second voltage. The second amplifier comprises a third transistor and a fourth transistor. The control end of the third transistor and the control end of the fourth transistor are coupled to the first amplifier at a first node and a second node, respectively. The second amplifier is used to generate a fifth voltage in response to the third voltage and the fourth voltage.
在一些實施例中,第一放大器更包含耦接在第一節點與第一電晶體的控制端之間的第一電阻以及耦接在第二節點與第二電晶體的控制端之間的第二電阻。In some embodiments, the first amplifier further includes a first resistor coupled between the first node and the control terminal of the first transistor and a second resistor coupled between the second node and the control terminal of the second transistor.
在一些實施例中,第一電晶體與第二電晶體為相同導電態。In some embodiments, the first transistor and the second transistor have the same conductivity state.
在一些實施例中,第一電晶體與第二電晶體皆具有第一閾值電壓。In some embodiments, the first transistor and the second transistor both have a first threshold voltage.
在一些實施例中,第一前端電路包含電晶體對。電晶體對的複數個控制端用以接收第一電壓及第二電壓以及電晶體對的複數個第一端彼此耦接。In some embodiments, the first front-end circuit includes a transistor pair, wherein a plurality of control terminals of the transistor pair are configured to receive a first voltage and a second voltage, and a plurality of first terminals of the transistor pair are coupled to each other.
在一些實施例中,電晶體對的每一電晶體的第二閾值電壓大於第一閾值電壓。In some embodiments, the second threshold voltage of each transistor of the transistor pair is greater than the first threshold voltage.
在一些實施例中,第三電晶體及第四電晶體為相同導電態。In some embodiments, the third transistor and the fourth transistor have the same conductivity state.
本案之一些實施方式提供一種輸入緩衝器, 其包含耦接電流源的前端電路、第一至第四電晶體以及電流控制單元。第一電晶體的汲極在第一節點與前端電路耦接。第二電晶體的汲極在第二節點與前端電路耦接。而且第二電晶體的源極與第一電晶體的源極在參考節點彼此耦接。第三電晶體的閘極耦接至第一節點。第三電晶體的汲極在第三節點與偏壓供應電路的第一輸出端耦接。第四電晶體的閘極耦接至該第二節點。第四電晶體的汲極在第四節點與偏壓供應電路的第二輸出端耦接。電流控制單元在第五節點與第三電晶體的源極及第四電晶體的源極耦接,用以控制流經第三電晶體及第四電晶體的總電流。Some embodiments of the present invention provide an input buffer comprising a front-end circuit coupled to a current source, first to fourth transistors, and a current control unit. The drain of the first transistor is coupled to the front-end circuit at a first node. The drain of the second transistor is coupled to the front-end circuit at a second node. Moreover, the source of the second transistor and the source of the first transistor are coupled to each other at a reference node. The gate of the third transistor is coupled to the first node. The drain of the third transistor is coupled to the first output terminal of the bias supply circuit at a third node. The gate of the fourth transistor is coupled to the second node. The drain of the fourth transistor is coupled to the second output terminal of the bias supply circuit at a fourth node. The current control unit is coupled to the source of the third transistor and the source of the fourth transistor at a fifth node to control the total current flowing through the third transistor and the fourth transistor.
在一些實施例中,第一至第四電晶體為相同導電態。In some embodiments, the first to fourth transistors have the same conductivity state.
在一些實施例中,第一電晶體與第二電晶體皆具有第一尺寸。第三電晶體與第四電晶體皆具有不同於第一尺寸的第二尺寸。In some embodiments, the first transistor and the second transistor both have a first size, and the third transistor and the fourth transistor both have a second size different from the first size.
以下揭露內容提供許多不同實施例或實例,用於實施提供的標的的不同特徵。以下描述組件及配置的具體實例以簡化本揭露內容。當然,此等僅為實例,且並不意欲為限制性。舉例而言,在接下來的描述中,第一特徵在第二特徵上方或上的形成可包括第一與第二特徵直接接觸地形成的實施例,且亦可包括額外特徵可形成於第一與第二特徵之間使得第一與第二特徵可不直接接觸的實施例。此外,在各種實例中,本揭露內容可重複參考數字及/或字母。此重複係為了簡單且清晰的目的,且自身並不規定論述的各種實施例及/或組態之間的關係。The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the description that follows, the formation of a first feature over or on a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features such that the first and second features are not in direct contact. Furthermore, the disclosure may refer to numbers and/or letters repeatedly in various examples. This repetition is for the sake of simplicity and clarity and does not, in itself, dictate a relationship between the various embodiments and/or configurations discussed.
在本說明書中使用的術語通常具有其在此項技術中及在使用各術語的具體上下文中的普通意義。在本說明書中的實例(包括本文中論述的任何術語的實例)的使用僅為說明性,且決不限制本案的一實施例或任一舉例說明的術語的範疇及意義。同樣地,本案的一實施例不限於在本說明書中給出的各種實施例。The terms used in this specification generally have their ordinary meanings in the art and in the specific context in which they are used. The use of examples in this specification (including examples of any term discussed herein) is illustrative only and in no way limits the scope or meaning of an embodiment of this disclosure or any of the exemplified terms. Similarly, an embodiment of this disclosure is not limited to the various embodiments presented in this specification.
貫穿本說明書對「一個實施例」、「一實施例」或「一些實施例」的參考意謂結合該(等)實施例描述的一特定特徵、結構、實施或特性包括於本案的至少一個實施例中。因此,片語「在一個實施例中」或「在一實施例中」或「在一些實施例中」在貫穿本說明書各處中的使用未必皆指同一實施例。此外,在一或多個實施例中,可按任一合適方式來組合特定特徵、結構、實施或特性。Reference throughout this specification to "one embodiment," "an embodiment," or "some embodiments" means that a particular feature, structure, implementation, or characteristic described in connection with that embodiment(s) is included in at least one embodiment of the disclosure. Thus, the use of the phrase "in one embodiment," "in an embodiment," or "in some embodiments" in various places throughout this specification is not necessarily referring to the same embodiment. Furthermore, the particular features, structures, implementations, or characteristics may be combined in any suitable manner in one or more embodiments.
如本文中所使用,「大約」、「約」、「大致」或「實質上」應大體指一給定值或範圍的任一近似值,其中其取決於其屬於的各種技術而變化,且其範疇應與由熟習其屬於的此項技術者理解的最寬泛解釋一致,以便涵蓋所有此等修改及類似結構。在一些實施例,其應大體意謂在一給定值或範圍的20%內,較佳地10%內,且更佳地5%內。本文中給出的數值量為近似,意謂術語「大約」、「約」、「大致」或「實質上」若未明確地陳述,則可加以推斷,或意謂其他近似值。As used herein, "approximately," "about," "substantially," or "substantially" shall generally refer to any approximation of a given value or range, which may vary depending on the various technologies to which it pertains, and its scope shall be consistent with the broadest interpretation understood by those skilled in the art to which it pertains so as to encompass all such modifications and similar structures. In some embodiments, it shall generally mean within 20%, preferably within 10%, and more preferably within 5% of a given value or range. The numerical values given herein are approximate, meaning that if the term "approximately," "about," "substantially," or "substantially" is not expressly stated, it may be inferred or may mean another approximate value.
現在參照第1圖,第1圖為本揭露之部分實施例之發射裝置Tx與接收裝置Rx之間訊號傳送的示意圖。如第1圖所示,發射裝置Tx用以將(多個)訊號傳送至接收裝置Rx。接收裝置Rx包含輸入緩衝器100及與輸入緩衝器100電性連接的工作電路200。在一些實施例中,工作電路200包含邏輯運算電路、類比電路或其他合適的內部積體電路。Referring now to Figure 1, Figure 1 is a schematic diagram illustrating signal transmission between a transmitter device Tx and a receiver device Rx according to some embodiments of the present disclosure. As shown in Figure 1, the transmitter device Tx is configured to transmit signal(s) to the receiver device Rx. The receiver device Rx includes an input buffer 100 and an operating circuit 200 electrically connected to the input buffer 100. In some embodiments, the operating circuit 200 includes a logic operation circuit, an analog circuit, or other suitable internal integrated circuitry.
在一些實施例中,輸入緩衝器100用以放大來自發射裝置Tx的訊號,再傳至工作電路200使用以解決通道損耗LOSS所造成的訊號減小之問題。In some embodiments, the input buffer 100 is used to amplify the signal from the transmitter Tx and then transmit it to the working circuit 200 to solve the signal reduction problem caused by channel loss LOSS.
現在參照第2A圖,第2A圖為本揭露之部分實施例之輸入緩衝器100A的電路圖。在一些實施例中,輸入緩衝器100A是相應於,例如,第1圖中的輸入緩衝器100配置。如第2A圖所示,輸入緩衝器100A包含放大器110A以及放大器120A。詳細而言,放大器110A包含前端電路111、主動式電感(Active Inductor)電路112、以及主動式電感電路113以及與前端電路111耦接的電流源114。主動式電感電路112和主動式電感電路113分別在節點n1和節點n2與前端電路111耦接。放大器120A包含偏壓供應電路121、電晶體M3、電晶體M4、電流控制單元122以及與偏壓供應電路121耦接的電壓源123。電晶體M3的汲極和電晶體M4的汲極分別在節點n4和節點n5與偏壓供應電路121耦接,以及電流控制單元122在節點n7與電晶體M4的源極及電晶體M3的源極耦接。此外,主動式電感電路112、主動式電感電路113、以及電流控制單元122的一端耦接至具有電壓V -的參考節點R。在一些實施例中,參考節點R為一接地端(ground),電壓V -為接地電壓。 Now referring to FIG. 2A , FIG. 2A is a circuit diagram of an input buffer 100A according to some embodiments of the present disclosure. In some embodiments, the input buffer 100A corresponds to, for example, the configuration of the input buffer 100 in FIG. 1 . As shown in FIG. 2A , the input buffer 100A includes an amplifier 110A and an amplifier 120A. Specifically, the amplifier 110A includes a front-end circuit 111, an active inductor circuit 112, an active inductor circuit 113, and a current source 114 coupled to the front-end circuit 111. The active inductor circuit 112 and the active inductor circuit 113 are coupled to the front-end circuit 111 at nodes n1 and n2, respectively. Amplifier 120A includes a bias supply circuit 121, transistors M3 and M4, a current control unit 122, and a voltage source 123 coupled to bias supply circuit 121. The drains of transistors M3 and M4 are coupled to bias supply circuit 121 at nodes n4 and n5, respectively. Current control unit 122 is coupled to the sources of transistors M4 and M3 at node n7. Furthermore, active inductor circuit 112, active inductor circuit 113, and current control unit 122 are coupled at one end to a reference node R having a voltage V− . In some embodiments, reference node R is ground, and voltage V− is ground.
在一些實施例中,電晶體M3與電晶體M4為相同導電態,例如,N型金氧半場效電晶體(Metal-Oxide-Semiconductor Field-Effect Transistor,MOS)。In some embodiments, transistor M3 and transistor M4 have the same conductivity state, for example, N-type Metal-Oxide-Semiconductor Field-Effect Transistor (MOS).
在一些實施例中,如第2A圖所示,前端電路111用以接收相應於來自發射裝置Tx的訊號的電壓V1及電壓V2。具體而言,前端電路111包含由電晶體MP1與電晶體MP2構成的電晶體對MM1。電晶體對MM1的兩閘極 (即控制端)用以接收電壓V1及電壓V2。在一些實施例中,電晶體MP1與電晶體MP2為相同導電態,例如,P型MOS。In some embodiments, as shown in FIG. 2A , a front-end circuit 111 is configured to receive voltages V1 and V2 corresponding to signals from a transmitter Tx. Specifically, the front-end circuit 111 includes a transistor pair MM1 consisting of a transistor MP1 and a transistor MP2. The two gates (i.e., control terminals) of the transistor pair MM1 are configured to receive voltages V1 and V2. In some embodiments, transistors MP1 and MP2 have the same conductivity, for example, P-type MOS transistors.
如第2A圖所示,主動式電感電路112包含電阻R1與電晶體M1。電阻R1耦接在電晶體M1的閘極與汲極之間。電晶體M1的汲極在節點n1與前端電路111耦接。As shown in FIG2A , the active inductor circuit 112 includes a resistor R1 and a transistor M1. The resistor R1 is coupled between the gate and drain of the transistor M1. The drain of the transistor M1 is coupled to the front-end circuit 111 at a node n1.
主動式電感電路113包含電阻R2與電晶體M2。電阻R2耦接在電晶體M2的閘極與汲極之間。電晶體M2的汲極在節點n2與前端電路111耦接。The active inductor circuit 113 includes a resistor R2 and a transistor M2. The resistor R2 is coupled between the gate and drain of the transistor M2. The drain of the transistor M2 is coupled to the front-end circuit 111 at a node n2.
在一些實施例中,電晶體M1與電晶體M2為相同導電態,例如,N型MOS。在一些實施例中,電晶體M1至電晶體M4為相同導電態。In some embodiments, transistors M1 and M2 have the same conductivity state, for example, N-type MOS. In some embodiments, transistors M1 to M4 have the same conductivity state.
如第2A圖所示,放大器110A透過節點n1與節點n2與放大器120A耦接。具體而言,前端電路111及主動式電感電路112在節點n1與電晶體M3的閘極耦接。前端電路111與主動式電感電路113在節點n2與電晶體M4的閘極耦接。也就是說,放大器110A和放大器120A間連接關係是: 電晶體M3的閘極在節點n1與電晶體M1的汲極耦接;電晶體M4的閘極在節點n2與電晶體M2的汲極耦接。As shown in Figure 2A , amplifier 110A is coupled to amplifier 120A via nodes n1 and n2. Specifically, front-end circuit 111 and active inductor circuit 112 are coupled to the gate of transistor M3 at node n1. Front-end circuit 111 and active inductor circuit 113 are coupled to the gate of transistor M4 at node n2. In other words, the connection relationship between amplifiers 110A and 120A is as follows: the gate of transistor M3 is coupled to the drain of transistor M1 at node n1, and the gate of transistor M4 is coupled to the drain of transistor M2 at node n2.
在這樣的配置之下,放大器110A根據所接收的電壓V1與電壓V2在節點n1與節點n2分別產生電壓V3與電壓V4,並將電壓V3與電壓V4分別輸出至電晶體M3與電晶體M4的閘極。接著,放大器120A根據所接收的電壓V3及電壓V4,在節點n5產生電壓V5。With this configuration, amplifier 110A generates voltages V3 and V4 at nodes n1 and n2, respectively, based on received voltages V1 and V2. Voltages V3 and V4 are then output to the gates of transistors M3 and M4, respectively. Amplifier 120A then generates voltage V5 at node n5 based on received voltages V3 and V4.
詳細而言,電晶體MP1與電晶體MP2分別響應電壓V1及電壓V2以根據電流Ic產生流經電晶體M1的電流I1與流經電晶體M2的電流I2。接著,放大器110A將相關於電流I1的電壓V3輸出至電晶體M3以控制流經電晶體M3的電流I3。相似地,放大器110A將相關於電流I2的電壓V4輸出至電晶體M4以控制流經電晶體M4的電流I4。接著,放大器120A輸出相關於電流I4的電壓V5。Specifically, transistors MP1 and MP2 respond to voltages V1 and V2, respectively, to generate currents I1 and I2 through transistor M1 and M2, respectively, based on current Ic. Amplifier 110A then outputs a voltage V3 related to current I1 to transistor M3, thereby controlling current I3 through transistor M3. Similarly, amplifier 110A outputs a voltage V4 related to current I2 to transistor M4, thereby controlling current I4 through transistor M4. Amplifier 120A then outputs a voltage V5 related to current I4.
與一些實施方式相比,藉由本案所提供的配置可加大輸入緩衝器100A傳輸訊號的頻寬。電晶體M3的閘極提供並聯在電晶體M1的汲極與源極之間的電容C L(圖未示出),電晶體M1自身的寄生電容提供並聯在其閘極與源極之間的電容Cgs(圖未示出)。電容C L與電阻R1組合會提供一個極點(Pole),電容Cgs與電阻R1組合會提供一個零點(Zero)。利用極零補償(Pole-Zero Compensation),頻寬會被加大。相似地,與電晶體M4及電晶體M2相關的配置亦具有加大頻寬的效果。 Compared to some embodiments, the configuration provided in this embodiment increases the bandwidth of the signal transmitted by input buffer 100A. The gate of transistor M3 provides a capacitor C L (not shown) connected in parallel between the drain and source of transistor M1. Transistor M1's own parasitic capacitance provides a capacitor C gs (not shown) connected in parallel between its gate and source. The combination of capacitor C L and resistor R1 creates a pole, while the combination of capacitor C gs and resistor R1 creates a zero. Pole-zero compensation increases bandwidth. Similarly, the configurations associated with transistors M4 and M2 also increase bandwidth.
以此方式,頻寬可以增為2~3倍。在一些實施例中,原來頻寬範圍在1~2GHz,透過極零補償後,頻寬變為3~5GHz。另一方面,當電阻R1、電阻R2為零時,極零補償消失而不具有加大頻寬的效果。因此,在一些實施例中,可選用可調式電阻作為電阻R1及電阻R2,並依照需求調整電阻R1及電阻R2的電阻值以改變頻寬成所需頻寬。In this way, bandwidth can be increased by a factor of 2-3. In some embodiments, the original bandwidth range is 1-2 GHz, but after zero-to-zero compensation, the bandwidth increases to 3-5 GHz. On the other hand, when resistors R1 and R2 are zero, zero-to-zero compensation disappears, and the bandwidth is not increased. Therefore, in some embodiments, adjustable resistors can be used as resistors R1 and R2, and the resistance values of resistors R1 and R2 can be adjusted as needed to change the bandwidth to the desired value.
此外,藉由本案所提供的配置,流過電晶體M3的電流I3會受到流經電晶體M1的電流I1限制以及流過電晶體M4的電流I4會受到流經電晶體M2的電流I2限制。因而,避免了放大器120A的功率消耗過大。Furthermore, with the configuration provided in this embodiment, the current I3 flowing through the transistor M3 is limited by the current I1 flowing through the transistor M1, and the current I4 flowing through the transistor M4 is limited by the current I2 flowing through the transistor M2. Thus, excessive power consumption of the amplifier 120A is avoided.
更詳細而言,偏壓供應電路121包含電晶體M5及電晶體M6。電晶體M5的汲極在節點n4與電晶體M3的汲極耦接。電晶體M6的汲極在節點n5與電晶體M4的汲極耦接。電晶體M5的源極與電晶體M6的源極在節點n6彼此耦接。偏壓供應電路121在節點n6接收電壓源123所提供的電壓V +並相應地輸出一偏壓於電晶體M3的汲極與電晶體M4的汲極之間。在一些實施例中,電壓V +大於參考節點R的電壓V-。此外,在一些實施例中,電晶體M5與電晶體M6為相同導電態,例如,P型MOS。 In more detail, the bias supply circuit 121 includes a transistor M5 and a transistor M6. The drain of transistor M5 is coupled to the drain of transistor M3 at node n4. The drain of transistor M6 is coupled to the drain of transistor M4 at node n5. The source of transistor M5 and the source of transistor M6 are coupled to each other at node n6. The bias supply circuit 121 receives a voltage V + provided by a voltage source 123 at node n6 and correspondingly outputs a bias voltage between the drains of transistor M3 and transistor M4. In some embodiments, the voltage V + is greater than the voltage V- at the reference node R. Furthermore, in some embodiments, the transistor M5 and the transistor M6 have the same conductivity state, for example, P-type MOS.
更詳細而言,電流控制單元122用以控制電流I3與電流I4的總和,即是,流經電晶體M3及電晶體M4的總電流It。在一些實施例中,電流控制單元122包含電晶體M7。電晶體M7的汲極、源極、和閘極分別耦接至節點n7、參考節點R、以及節點n4。在一些實施例中,電晶體M7的閘極與電晶體M5的閘極及電晶體M6的閘極在節點n4耦接。此外,在一些實施例中,電晶體M7是N型MOS。More specifically, current control unit 122 is used to control the sum of currents I3 and I4, that is, the total current It flowing through transistors M3 and M4. In some embodiments, current control unit 122 includes transistor M7. The drain, source, and gate of transistor M7 are coupled to node n7, reference node R, and node n4, respectively. In some embodiments, the gate of transistor M7 is coupled to the gates of transistor M5 and transistor M6 at node n4. Furthermore, in some embodiments, transistor M7 is an N-type MOS transistor.
現在參照第2B圖,第2B圖為本揭露之部分實施例之輸入緩衝器100B的電路圖。在一些實施例中,輸入緩衝器100B是相應於,例如,第1圖中的輸入緩衝器100配置。相對於第2A圖的實施例,為了易於理解,在第2B圖中的相似構件用相同參考編號來標示。為了簡潔起見,本文中省略已在以上段落中詳細論述的類似構件的具體操作,除非有需要介紹與第2B圖中的構件的合作關係。Referring now to FIG. 2B , FIG. 2B is a circuit diagram of an input buffer 100B according to some embodiments of the present disclosure. In some embodiments, input buffer 100B corresponds to, for example, the configuration of input buffer 100 in FIG. 1 . For ease of understanding, similar components in FIG. 2B are numbered with the same reference numbers as those in the embodiment of FIG. 2A . For the sake of brevity, the detailed operation of similar components discussed in detail in the preceding paragraphs will be omitted herein unless necessary to explain their cooperative relationship with the components in FIG. 2B .
與第2A圖的實施例相比,輸入緩衝器100B的電晶體MN1、MN2、M5、M6是N型的,以及電晶體M1、M2、M3、M4、M7是P型的。參考節點R具有電壓V +。而節點n6用以接收電壓V -。在一些實施例中,電壓V -小於電壓V +。在另一些實施例中,參考節點R為一接地端,電壓V -為接地(ground)電壓。 Compared to the embodiment of FIG. 2A , transistors MN1, MN2, M5, and M6 of input buffer 100B are N-type, and transistors M1, M2, M3, M4, and M7 are P-type. Reference node R has a voltage V + . Node n6 receives a voltage V− . In some embodiments, voltage V− is less than voltage V + . In other embodiments, reference node R is a ground terminal, and voltage V− is ground.
上述實施例僅為方便理解本揭露之主要構想並不用以限制本揭露的範圍。可依需求決定輸入緩衝器100的每一電晶體的導電狀態。The above embodiments are only for facilitating understanding of the main concept of the present disclosure and are not intended to limit the scope of the present disclosure. The conduction state of each transistor of the input buffer 100 can be determined according to requirements.
此外,亦可依需求決定輸入緩衝器100的每一電晶體的尺寸,例如,選擇每一電晶體的閘極寬度作為其尺寸。在一些實施例中,電晶體M1及電晶體M2的尺寸相同,皆具有尺寸W1。在一些實施例中,電晶體M3及電晶體M4的尺寸相同,皆具有尺寸W2。在一些實施例中,電晶體M1及電晶體M2皆具有尺寸W1以及電晶體M3及電晶體M4皆具有尺寸W2。在一些實施例中,尺寸W2等於尺寸W1。而在另一些實施例中,尺寸W2進一步大於尺寸W1,例如,尺寸W2為尺寸W1的1~2倍。尺寸W2相對於尺寸W1的尺寸比例限制電流I3相對於電流I1的電流比例的最大值及電流I4相對於電流I2的電流比例的最大值。舉例而言,當尺寸W2等於尺寸W1,電流I3不大於電流I1且電流I4亦不大於電流I2。又舉例而言,當尺寸W2為尺寸W1的2倍時,電流I3不大於2倍的電流I1且電流I4亦不大於2倍的電流I2。在一些實施例中,電晶體M1、電晶體M2、電晶體M3、及電晶體M4分別具有尺寸W1-1、尺寸W1-2、尺寸W2-1、及尺寸W2-2且尺寸W1-1、尺寸W1-2、尺寸W2-1、及尺寸W2-2可以是彼此不同的。相似地,尺寸W2-1相對於尺寸W1-1的尺寸比例限制電流I3相對於電流I1的電流比例的最大值,以及尺寸W2-2相對於尺寸W1-2的尺寸比例限制電流I4相對於電流I2的電流比例的最大值。也就是說,電流I3相對於電流I1的電流比例與尺寸W2-1相對於尺寸W1-1的尺寸比例相關,以及電流I4相對於電流I2的電流比例與尺寸W2-2相對於尺寸W1-2的尺寸比例相關。Furthermore, the size of each transistor of the input buffer 100 may be determined as required, for example, by selecting the gate width of each transistor as its size. In some embodiments, transistor M1 and transistor M2 are the same size, both having a size W1. In some embodiments, transistor M3 and transistor M4 are the same size, both having a size W2. In some embodiments, transistor M1 and transistor M2 both have a size W1, and transistor M3 and transistor M4 both have a size W2. In some embodiments, size W2 is equal to size W1. In other embodiments, size W2 is further greater than size W1, for example, size W2 is 1 to 2 times size W1. The size ratio of size W2 to size W1 limits the maximum current ratio of current I3 to current I1 and the maximum current ratio of current I4 to current I2. For example, when dimension W2 is equal to dimension W1, current I3 is no greater than current I1, and current I4 is no greater than current I2. For another example, when dimension W2 is twice dimension W1, current I3 is no greater than twice current I1, and current I4 is no greater than twice current I2. In some embodiments, transistor M1, transistor M2, transistor M3, and transistor M4 have dimensions W1-1, W1-2, W2-1, and W2-2, respectively, and dimensions W1-1, W1-2, W2-1, and W2-2 may be different from one another. Similarly, the ratio of dimension W2-1 to dimension W1-1 limits the maximum value of the ratio of current I3 to current I1, and the ratio of dimension W2-2 to dimension W1-2 limits the maximum value of the ratio of current I4 to current I2. In other words, the ratio of current I3 to current I1 is related to the ratio of dimension W2-1 to dimension W1-1, and the ratio of current I4 to current I2 is related to the ratio of dimension W2-2 to dimension W1-2.
在一些實施例中,電晶體M1及電晶體M2皆具有閾值電壓(threshold voltage)Vth1。在一些實施例中,電晶體對MM1的每一電晶體的閾值電壓Vth2大於閾值電壓Vth1。在一些實施例中,閾值電壓Vth2大於閾值電壓Vth1兩百毫伏特。在一些實施例中,閾值電壓Vth2為0.7伏特而閾值電壓Vth1為0.4或0.5伏特。如在第2A圖的實施例中,當電晶體MP1及電晶體MP2導通時,電壓V3(即節點n1的電壓)與電壓V4(即節點n2的電壓)需大於閾值電壓Vth1,以導通電晶體M1及電晶體M2。此外,當閾值電壓Vth1越低時,電壓V3及電壓V4的振幅越大,且電壓V3及電壓V4的偏移(offset)越小。In some embodiments, transistor M1 and transistor M2 both have a threshold voltage Vth1. In some embodiments, the threshold voltage Vth2 of each transistor in transistor pair MM1 is greater than threshold voltage Vth1. In some embodiments, threshold voltage Vth2 is greater than threshold voltage Vth1 by 200 millivolts. In some embodiments, threshold voltage Vth2 is 0.7 volts and threshold voltage Vth1 is 0.4 or 0.5 volts. As shown in the embodiment of FIG. 2A , when transistors MP1 and MP2 are turned on, voltage V3 (i.e., the voltage at node n1) and voltage V4 (i.e., the voltage at node n2) must be greater than threshold voltage Vth1 to turn on transistors M1 and M2. Furthermore, as threshold voltage Vth1 decreases, the amplitudes of voltages V3 and V4 increase, and the offset between voltages V3 and V4 decreases.
而如在第2B圖的實施例中,當電晶體MN1及電晶體MN2導通時,電壓V3(即節點n1的電壓)與電壓V4(即節點n2的電壓)需小於(電壓V +-閾值電壓Vth1),以導通電晶體M1及電晶體M2。此外,當閾值電壓Vth1越低時,電壓V3及電壓V4的振幅越大,且電壓V3及電壓V4的偏移(offset)越小。 As shown in the embodiment of Figure 2B , when transistors MN1 and MN2 are conducting, voltage V3 (i.e., the voltage at node n1) and voltage V4 (i.e., the voltage at node n2) must be less than (voltage V + - threshold voltage Vth1) to turn on transistors M1 and M2. Furthermore, as threshold voltage Vth1 decreases, the amplitudes of voltages V3 and V4 increase, and the offset between voltages V3 and V4 decreases.
亦可依需求決定輸入緩衝器100的每一電阻的電阻值。在一些實施例中,電阻R1及電阻R2具有相同電阻值。The resistance value of each resistor of the input buffer 100 can also be determined according to requirements. In some embodiments, the resistor R1 and the resistor R2 have the same resistance value.
此外,如前所述,輸入緩衝器用以限制電流大小的關鍵元素基本上涉及四個電晶體M1、M2、M3、M4之連接。而這些電晶體M1、M2、M3、M4的連接方式所限制的事實上是電流比例。可再加入電流控制單元122確定電流總和以限制電流I3及電流I4的最大值。而連接方式的應用並不限於處理放大器的功率耗損。舉例而言,可用於電路保護裝置的製作,限制流經所欲保護電路的電流大小以防止電路被燒壞。Furthermore, as previously mentioned, the key element used by the input buffer to limit current magnitude essentially involves the connection of four transistors M1, M2, M3, and M4. The connection method of these transistors M1, M2, M3, and M4 effectively limits the current ratio. A current control unit 122 can be added to determine the total current to limit the maximum values of currents I3 and I4. The application of this connection method is not limited to processing amplifier power dissipation. For example, it can be used in the manufacture of circuit protection devices to limit the current flowing through the desired protection circuit to prevent circuit damage.
現在參照第3圖,第3圖是本揭露之部分實施例之輸入緩衝器100C的示意圖。在一些實施例中,如第3圖所示,輸入緩衝器100C包含多個放大器110A_1、110A_2…110A_f。在一些實施例中,放大器110A_1、110A_2…110A_f是相應於第2A圖中的放大器110A配置。舉例而言,放大器110A_1包含前端電路111_1、電阻R3~R4、電晶體M8~M9,其中前端電路111_1包含電晶體MP3~MP4。前端電路111_1相對於2A圖中的前端電路111配置。電晶體MP3~MP4相對於2A圖中的電晶體MP1~MP2配置。電阻R3~R4相對於2A圖中的電阻R1~R2配置。電晶體M8~M9相對於2A圖中的電晶體M1~M2配置。放大器110A_2…110A_f的配置與前述放大器110A_1相同,在此不再贅述。Referring now to FIG. 3 , FIG. 3 is a schematic diagram of an input buffer 100C according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 3 , input buffer 100C includes multiple amplifiers 110A_1, 110A_2, ..., 110A_f. In some embodiments, amplifiers 110A_1, 110A_2, ..., 110A_f are configured corresponding to amplifier 110A in FIG. 2A . For example, amplifier 110A_1 includes a front-end circuit 111_1, resistors R3-R4, and transistors M8-M9, wherein front-end circuit 111_1 includes transistors MP3-MP4. Front-end circuit 111_1 is configured similarly to front-end circuit 111 in FIG. 2A . Transistors MP3-MP4 are configured similarly to transistors MP1-MP2 in FIG. 2A . Resistors R3-R4 are configured similarly to resistors R1-R2 in FIG. 2A Transistors M8-M9 are configured similarly to transistors M1-M2 in FIG. 2A The configuration of amplifiers 110A_2 . . . 110A_f is the same as that of amplifier 110A_1 and will not be further described.
如第3圖所示,放大器110A_1、110A_2…等經由其中對應的端點(例如,第3圖中的節點n8、n9、n10、n11…等)依序耦接至放大器110A_f。舉例而言,放大器110A_1的電晶體MP3~MP4的汲極在節點n8~n9與放大器110A_2的電晶體MP5~MP6的閘極耦接,以此類推。As shown in FIG3 , amplifiers 110A_1, 110A_2, etc. are sequentially coupled to amplifier 110A_f via corresponding nodes (e.g., nodes n8, n9, n10, n11, etc. in FIG3 ). For example, the drains of transistors MP3-MP4 of amplifier 110A_1 are coupled to the gates of transistors MP5-MP6 of amplifier 110A_2 at nodes n8-n9, and so on.
此外,放大器110A_f透過節點n_f1及節點n_f2耦接至放大器120A。詳細而言,放大器110A_f的前端電路111_f在節點n_f1及節點n_f2分別與放大器120A中的電晶體M3的閘極及電晶體M4的閘極耦接。Furthermore, the amplifier 110A_f is coupled to the amplifier 120A via nodes n_f1 and n_f2. Specifically, the front-end circuit 111_f of the amplifier 110A_f is coupled to the gates of transistors M3 and M4 in the amplifier 120A at nodes n_f1 and n_f2, respectively.
在操作中,放大器110A_1的前端電路111_1接收來自發射裝置Tx的訊號的電壓V1及電壓V2,且響應於電壓V1及電壓V2,放大器110A_1產生電壓V8及電壓V9至放大器110A_2。放大器110A_2的前端電路111_2接收電壓V8及電壓V9,且響應於電壓V8及電壓V9,放大器110A_2產生電壓V10及電壓V11至下一級放大器,以此類推。換句話說,放大器110A_1、110A_2…110A_f中的兩相鄰放大器以相同於放大器110A_1及放大器110A_2的方式,產生與電壓V1及電壓V2相關的訊號。In operation, the front-end circuit 111_1 of the amplifier 110A_1 receives voltages V1 and V2 from the transmitter Tx. In response to voltages V1 and V2, the amplifier 110A_1 generates voltages V8 and V9, which are then passed to the amplifier 110A_2. The front-end circuit 111_2 of the amplifier 110A_2 receives voltages V8 and V9, and in response to voltages V8 and V9, the amplifier 110A_2 generates voltages V10 and V11, which are then passed to the next amplifier stage, and so on. In other words, two adjacent amplifiers among the amplifiers 110A_1, 110A_2, ..., 110A_f generate signals related to the voltages V1 and V2 in the same manner as the amplifiers 110A_1 and 110A_2.
經過多級的放大器110A_1、110A_2…等,最終,產生電壓V_f1及電壓V_f2至放大器110A_f的前端電路111_f。在放大器110A_f的前端電路111_f接收電壓V_f1及電壓V_f2之後,放大器110A_f協同放大器120A根據如前述的輸入緩衝器100A的操作方式,在節點n5輸出電壓V5。After passing through multiple stages of amplifiers 110A_1, 110A_2, and so on, voltages V_f1 and V_f2 are ultimately generated and transmitted to front-end circuit 111_f of amplifier 110A_f. After receiving voltages V_f1 and V_f2, amplifier 110A_f, in conjunction with amplifier 120A, outputs voltage V5 at node n5, as described above for input buffer 100A.
在一些實施例中,經過放大器110 A _1、放大器110A_2…放大器110 A_f,訊號皆會被進一步放大,因而,提高增益。In some embodiments, the signal is further amplified through the amplifier 110A_1, the amplifier 110A_2, ..., and the amplifier 110A_f, thereby increasing the gain.
在一些實施例中,電晶體M8~M11、M_f1、M_f2、電晶體M3與電晶體M4為相同導電態,同為P型電晶體或N型電晶體。在一些實施例中,放大器110A_1、110A_2…110A_f是相應於第2B圖中的放大器110B配置且相應地,第3圖中的放大器120A由放大器120B取代。In some embodiments, transistors M8-M11, M_f1, M_f2, transistor M3, and transistor M4 have the same conductivity state, being either P-type or N-type transistors. In some embodiments, amplifiers 110A_1, 110A_2, ..., 110A_f are configured corresponding to amplifier 110B in FIG. 2B , and accordingly, amplifier 120A in FIG. 3 is replaced by amplifier 120B.
現在參照第4圖,第4圖是本揭露之部分實施例的第1圖至第3圖的輸入緩衝器的操作方法400的流程圖。應當理解,可以在第4圖所示的過程之前、期間和之後可有附加操作,並且對於操作方法400的附加實施例而言,下面描述的一些操作可以被替換或消除。輸入緩衝器的操作方法400包含下面參考第2A圖至第3圖描述的操作401至402。Referring now to FIG. 4 , FIG. 4 is a flow chart of a method 400 for operating the input buffer of FIG. 1 through FIG. 3 according to some embodiments of the present disclosure. It should be understood that additional operations may occur before, during, or after the process illustrated in FIG. 4 , and that some operations described below may be replaced or eliminated for additional embodiments of the method 400. The method 400 for operating the input buffer includes operations 401 and 402 described below with reference to FIG. 2A through FIG. 3 .
在操作401中,如第2A圖所示,施加電流Ic至放大器110A的前端電路111以及透過前端電路111響應於電壓V1與電壓V2產生分別流經電晶體M1的電流I1與流經電晶體M2的電流I2。In operation 401, as shown in FIG. 2A , a current Ic is applied to the front-end circuit 111 of the amplifier 110A, and the front-end circuit 111 generates a current I1 flowing through the transistor M1 and a current I2 flowing through the transistor M2 in response to the voltage V1 and the voltage V2, respectively.
在操作402中,透過放大器120A根據與電流I1相關的電壓V3以及與電流I2相關的電壓V4產生流經電晶體M3的電流I3與流經電晶體M4的電流I4,以及透過放大器120A根據電流I4輸出電壓V5。In operation 402, a current I3 flowing through transistor M3 and a current I4 flowing through transistor M4 are generated by amplifier 120A according to voltage V3 associated with current I1 and voltage V4 associated with current I2, and a voltage V5 is outputted by amplifier 120A according to current I4.
在一些實施例中,輸入緩衝器的操作方法400更包含施加電壓源123供應的電壓於偏壓供應電路121以輸出一偏壓在電晶體M3的汲端以及電晶體M4的汲端之間的操作。In some embodiments, the input buffer operating method 400 further includes applying a voltage supplied by the voltage source 123 to the bias supply circuit 121 to output a bias voltage between the drain terminal of the transistor M3 and the drain terminal of the transistor M4.
綜上所述,本揭露藉著引入一種連接方式於放大器之間,確實提供了一種可加大頻寬且限制電流大小的輸入緩衝器,解決頻寬不足及高功率耗損之問題。In summary, the present disclosure provides an input buffer that can increase bandwidth and limit current by introducing a connection method between amplifiers, thereby solving the problems of insufficient bandwidth and high power loss.
雖然本案已以實施方式揭示如上,然其並非用以限定本案,任何本領域具通常知識者,在不脫離本案之精神和範圍內,當可作各種之更動與潤飾,因此本案之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above in the form of implementation, it is not intended to limit the present invention. Anyone with ordinary skill in the art may make various modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the patent application attached hereto.
100:輸入緩衝器 100A:輸入緩衝器 100B:輸入緩衝器 100C:輸入緩衝器 110A_1,110A_2:放大器 110A_f:放大器 110A:放大器 110B:放大器 111:前端電路 111_1,111_2:前端電路 111_f:前端電路 112:主動式電感電路 113:主動式電感電路 114:電流源 120A:放大器 120B:放大器 121:偏壓供應電路 122:電流控制單元 123:電壓源 200:工作電路 400:輸入緩衝器的操作方法 401~402:操作 I1~I4:電流 Ic:電流 Ic_1,Ic_2:電流 Ic_f:電流 It:總電流 LOSS:通道損耗 M1~M11:電晶體 MM1:電晶體對 MN1,MN2:電晶體 MP1~MP6:電晶體 MP_f1~MP_f2:電晶體 M_f1,M_f2:電晶體 n1~n11:節點 n_f1,n_f2:節點 R1~R6:電阻 Rf1~Rf2:電阻 R:參考節點 Rx:接收裝置 Tx:發射裝置 V1~V11:電壓 V_f1,V_f2:電壓 V +,V -:電壓 100: Input buffer 100A: Input buffer 100B: Input buffer 100C: Input buffer 110A_1, 110A_2: Amplifier 110A_f: Amplifier 110A: Amplifier 110B: Amplifier 111: Front-end circuit 111_1, 111_2: Front-end circuit 111_f: Front-end circuit 112: Active inductor circuit 113: Active inductor circuit 114: Current source 120A: Amplifier 120B: Amplifier 121: Bias supply circuit 122: Current control unit 123: Voltage source 200: Working circuit 400: Input buffer operation Methods 401-402: Operations I1-I4: Current Ic: Currents Ic_1, Ic_2: Current Ic_f: Current It: Total current LOSS: Channel loss M1-M11: Transistor MM1: Transistor pair MN1, MN2: Transistors MP1-MP6: Transistors MP_f1-MP_f2: Transistors M_f1, M_f2: Transistors n1-n11: Nodes n_f1, n_f2: Nodes R1-R6: Resistors Rf1-Rf2: Resistor R: Reference node Rx: Receiver Tx: Transmitter V1-V11: Voltages V_f1, V_f2: Voltages V + , V- : Voltages
為讓本案之上述和其他目的、特徵、優點與實施例能夠更明顯易懂,所附圖式之說明如下: 第1圖為本揭露之部分實施例之發射裝置與接收裝置之間訊號傳送的示意圖; 第2A圖為本揭露之部分實施例之輸入緩衝器的電路圖; 第2B圖為本揭露之部分實施例之輸入緩衝器的電路圖; 第3圖為本揭露之部分實施例之輸入緩衝器的示意圖;以及 第4圖是本揭露之部分實施例的第1圖至第3圖的輸入緩衝器的操作方法的流程圖。 To facilitate understanding of the above and other objects, features, advantages, and embodiments of the present invention, the accompanying drawings are described as follows: Figure 1 is a schematic diagram illustrating signal transmission between a transmitter and a receiver according to certain embodiments of the present disclosure; Figure 2A is a circuit diagram of an input buffer according to certain embodiments of the present disclosure; Figure 2B is a circuit diagram of an input buffer according to certain embodiments of the present disclosure; Figure 3 is a schematic diagram of an input buffer according to certain embodiments of the present disclosure; and Figure 4 is a flow chart illustrating a method for operating the input buffer described in Figures 1 through 3 according to certain embodiments of the present disclosure.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic Storage Information (Please enter in order by institution, date, and number) None International Storage Information (Please enter in order by country, institution, date, and number) None
100A:輸入緩衝器 100A: Input buffer
110A:放大器 110A: Amplifier
111:前端電路 111: Front-end circuit
112:主動式電感電路 112: Active inductor circuit
113:主動式電感電路 113: Active Inductor Circuit
114:電流源 114: Current Source
120A:放大器 120A:Amplifier
121:偏壓供應電路 121: Bias supply circuit
122:電流控制單元 122: Current control unit
123:電壓源 123: Voltage Source
I1~I4:電流 I1~I4: Current
It:總電流 It:Total current
Ic:電流 Ic: Current
MP1,MP2:電晶體 MP1, MP2: Transistors
M1~M7:電晶體 M1~M7: Transistors
MM1:電晶體對 MM1: Transistor pair
n1~n7:節點 n1~n7: nodes
R1,R2:電阻 R1, R2: resistors
R:參考節點 R: Reference node
V1~V5:電壓 V1~V5: Voltage
V+,V-:電壓 V +, V - : Voltage
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113122010A TWI901192B (en) | 2024-06-14 | 2024-06-14 | Input buffer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113122010A TWI901192B (en) | 2024-06-14 | 2024-06-14 | Input buffer |
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| Publication Number | Publication Date |
|---|---|
| TWI901192B true TWI901192B (en) | 2025-10-11 |
| TW202549261A TW202549261A (en) | 2025-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW113122010A TWI901192B (en) | 2024-06-14 | 2024-06-14 | Input buffer |
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| Country | Link |
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| TW (1) | TWI901192B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7595533B2 (en) * | 2002-09-10 | 2009-09-29 | Nec Corporation | Thin film semiconductor device and manufacturing method |
| US20230188097A1 (en) * | 2020-05-20 | 2023-06-15 | Suzhou Novosense Microelectronics Co., Ltd. | Differential signal amplification circuit, digital isolator, and digital receiver |
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2024
- 2024-06-14 TW TW113122010A patent/TWI901192B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7595533B2 (en) * | 2002-09-10 | 2009-09-29 | Nec Corporation | Thin film semiconductor device and manufacturing method |
| US20230188097A1 (en) * | 2020-05-20 | 2023-06-15 | Suzhou Novosense Microelectronics Co., Ltd. | Differential signal amplification circuit, digital isolator, and digital receiver |
Non-Patent Citations (1)
| Title |
|---|
| 專書 B. Razavi, "Design of Analog CMOS Integrated Circuits," 1st McGraw Hill 2001年12月31日 * |
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