TWI900685B - Sensor package and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a sensor package and a manufacturing method thereof. The sensor package may include: a substrate; a sensor mounted on one side of the substrate; and a mold formed by secondary molding on the surface of the substrate on which the sensor is mounted, wherein the upper surface of the mold is a single-curvature surface or a multi-curvature surface.

Description

Sensor package and manufacturing method thereof

The present invention relates to a sensor package and a method for manufacturing the same, and more specifically, to a sensor package having at least a portion of its upper portion being a curved surface and a method for manufacturing the same.

After the sensor array chip is mounted on the printed circuit board (PCB), the sensor package is resin-molded to protect the array chip.

The mold can be post-processed as needed.

For example, fingerprint recognition sensors using sensor packages are widely applicable to electronic devices such as mobile phones, laptops, and tablets. These sensor packages can be installed externally, partially or fully exposed, in a manner that conforms to the appearance of various electronic devices. In the case of a fingerprint sensor (FPS) packaged product, the package is exposed to the outside, allowing users to identify fingerprints by deciphering the component surface. This offers the advantage of conforming to the curved surface of the product, allowing the fingerprint sensor to be installed in the desired location. As a specific example, in the case of a fingerprint sensor package for a smartphone, it can be located on the side, not just the back. In this case, the entire smartphone side surface is curved, but the majority of the fingerprint sensor is flat.

As mentioned above, electronic devices are manufactured in a variety of shapes, including curved surfaces. To accommodate these electronic device shapes, flat sensor packages need to be processed into curved shapes.

Another example of post-molding processing involves performing curvature processing or edge curved surface processing based on the shape of the product to which the sensor package is applied.

As another example of post-processing, Korean Patent Publication No. 10-2017-0117671 (published on October 24, 2017, entitled "Semiconductor Package for Fingerprint Sensor and Method of Manufacturing the Same") describes a technique for improving the sensitivity of sensor chips by polishing the surface of a molded part.

As mentioned above, existing sensor packaging requires post-processing of the mold as needed. As the number of steps increases, manufacturing costs increase.

Furthermore, the processing mainly involves grinding, and it is difficult to determine the grinding endpoint. After the processing, the surface condition of each molded part varies, making it difficult to ensure uniformity of properties.

Existing technical literature

Patent Literature

Korean Patent Publication No. 10-2017-0117671 (October 24, 2017)

In view of the above problems, the technical problem to be solved by the present invention is to provide a sensor package and a manufacturing method thereof that does not require post-processing.

A sensor package according to one embodiment of the present invention, which is used to solve the above-mentioned technical problems, may include: a substrate; a sensor mounted on one side of the substrate; and a mold formed by secondary molding on the surface of the substrate on which the sensor is mounted, wherein the upper surface of the mold has a single or multiple curvatures.

In an embodiment of the present invention, the multi-curvature surface of the mold may include a curved surface forming a boundary between the upper surface and the side surface of the mold, and the upper surface or the curved surface may be a flat surface or a curved surface.

In an embodiment of the present invention, the upper surface and the curved surface are both flat surfaces, and the portion where the upper surface and the curved surface meet may be a curved surface.

In an embodiment of the present invention, the upper surface is a flat surface, the curved surface is a curved surface, and the radius of curvature of the curved surface can be 2.0 mm to 6.5 mm.

In an embodiment of the present invention, the upper surface and the curved surface are both flat surfaces, and the portion where the upper surface and the curved surface meet is a curved surface having a curvature radius of 0.05 mm to 0.5 mm.

In an embodiment of the present invention, the upper surface and the curved surface are both curved surfaces, and their respective curvature radii may be different.

In an embodiment of the present invention, the radius of curvature of the upper surface is 2.0 mm to 7.0 mm, and the radius of curvature of the curved surface can be 2.0 mm to 6.5 mm.

In an embodiment of the present invention, the upper end of the side surface of the mold and the lower end of the curved surface or the upper surface may be in direct contact with each other.

In an embodiment of the present invention, the upper end of the side surface of the mold and the lower end of the curved surface or the upper surface may not be in direct contact with each other, and a placement surface that is a flat surface parallel to the substrate is located therebetween.

In an embodiment of the present invention, the mold is a curved surface protruding along the upper side of the upper surface, and may include curved surfaces extending from both ends of the upper surface and the side surface along the lower side.

In an embodiment of the present invention, the curved surface may be a single-curvature surface or a multi-curvature surface.

In an embodiment of the present invention, the curved surface is a single-curvature surface, and the radius of curvature can be 2.0 mm to 7.0 mm.

In an embodiment of the present invention, the curved surface may include: a first curved surface extending from both ends of the upper surface along the lower side; and a second curved surface extending from both ends of the side surface, with its upper end directly contacting the lower end of the first curved surface.

In an embodiment of the present invention, the portion where the first curved surface and the second curved surface meet can be a curved surface.

In an embodiment of the present invention, the curvature radii of the upper surface and the curved surface may be different.

In an embodiment of the present invention, the radius of curvature of the upper surface is 2.0 mm to 7.0 mm, and the radius of curvature of the curved surface can be 2.0 mm to 7.0 mm.

In an embodiment of the present invention, the two facing curved surfaces can be symmetrical with respect to each other based on the upper surface and the side surface.

In an embodiment of the present invention, the upper end of the side surface of the mold and the lower end of the upper surface may be in direct contact with each other.

In an embodiment of the present invention, the upper end of the side surface of the mold and the lower end of the upper surface may not be in direct contact with each other, and a placement surface that is a flat surface parallel to the substrate is located therebetween.

In an embodiment of the present invention, the mold may include a connecting surface that forms a boundary between the upper surface and the side surface of the mold, and may be a flat surface or a curved surface.

In an embodiment of the present invention, the connecting surface may be a curved surface having a radius of curvature that is different from the radius of curvature of the upper surface.

In an embodiment of the present invention, the portion where the connecting surface is joined to the upper surface and the portion where the connecting surface is joined to the side surface may be curved surfaces.

In an embodiment of the present invention, the upper end of the side surface of the mold and the lower end of the connecting surface may be in direct contact with each other.

In an embodiment of the present invention, the upper end of the side surface of the mold and the lower end of the connecting surface may not be in direct contact with each other, and a placement surface that is a flat surface parallel to the substrate is located therebetween.

In an embodiment of the present invention, the upper surface of the mold may be a curved surface that is concave along the lower side.

In an embodiment of the present invention, the mold may include: a first curved surface extending from both ends of the upper surface along the upper side curve; and a second curved surface extending from both ends of the side surface, with the upper end of the second curved surface directly contacting the lower end of the first curved surface.

In an embodiment of the present invention, the first curved surface may be a single-curvature surface or a multi-curvature surface.

In an embodiment of the present invention, the first curved surface is a single-curvature surface, and the radius of curvature can be 2.0 mm to 6.5 mm.

In an embodiment of the present invention, the curvature radii of the upper surface and the first curved surface may be different.

In an embodiment of the present invention, the radius of curvature of the upper surface is 2.0 mm to 6.5 mm, and the radius of curvature of the first curved surface can be 2.0 mm to 6.5 mm.

In an embodiment of the present invention, the two opposing first curved surfaces are symmetrical with respect to the upper surface, and the two opposing second curved surfaces can be symmetrical with respect to the side surface.

In an embodiment of the present invention, the above-mentioned mold can be formed by mold casting.

In an embodiment of the present invention, the upper surface may be a curved surface connecting two opposing sides of the mold.

In an embodiment of the present invention, the upper surface may be a curved surface connecting two pairs of opposing sides.

Another embodiment of the present invention provides a sensor package manufacturing method that may include: step a) mounting a plurality of sensors on a substrate; step b) forming a mold on the substrate on which the plurality of sensors are mounted using a mold casting method; and step c) cutting the mold and substrate to separate the sensors on the substrate from the mold formed by secondary molding on the upper portion of the sensors, wherein the mold is formed by forming a concave surface with a single or multiple curvatures in the region of the upper surface of the mold casting method.

In an embodiment of the present invention, the radius of curvature of the upper surface of the mold formed by the single curvature surface can be 2.0 mm to 7.0 mm, and the radius of curvature of the upper surface of the mold formed by the multiple curvature surfaces can be 2.0 mm to 7.0 mm. The mold is formed so that the radius of curvature of the curved surface between the upper surface and the side surface reaches 2.0 mm to 7.0 mm.

In an embodiment of the present invention, the upper surface and the curved surface are both flat surfaces, and the portion where the upper surface and the curved surface meet can be a curved surface with a curvature radius of 0.05 mm to 0.5 mm.

In an embodiment of the present invention, the curvature radius of the upper surface and the curved surfaces extending from both ends of the upper surface and the side surface along the lower side can be 2.0 mm to 6.5 mm.

In an embodiment of the present invention, a predetermined distance outside the lower end of the curved surface or the lower end of the upper surface may be cut to form a placement surface that is a flat surface parallel to the substrate between the side surface of the mold and the curved surface or the upper surface.

Another embodiment of the present invention provides a sensor package manufacturing method that may include: step a) mounting a plurality of sensors on a substrate; step b) forming a mold on the substrate on which the plurality of sensors are mounted using a mold casting; and step c) cutting the mold and substrate to separate the respective sensor packages. In the region of the mold upper surface formed by the mold casting, the mold upper surface is formed using a concave surface having a single or multiple curvatures.

In an embodiment of the present invention, the curvature radius of the upper surface and the curved surfaces extending from both ends of the upper surface along the upper side can be 2.0 mm to 6.5 mm.

The present invention has the following effect: the mold for the sensor package is formed according to the shape and curved surface of the applicable product, thereby eliminating the need for post-processing and preventing an increase in product costs.

At the same time, the present invention has the following effect: it can provide a mold with uniform surface roughness, which can prevent processing deviations from each product and thus ensure uniform quality.

1: Sensor packaging

10:Substrate

20,20’: Mold

21:Upper face

22: Curved surface

221: First curved surface

222: Second curved surface

23: Connecting surface

24:Side

25,25’: Boundary

26: Placement surface

30: Sensor

40: Casting

41: Lower area

A-A,B-B,A’-A’,B’-B’: straight line

L1: First Length

L2: Second length

R: Radius of curvature

R1: First radius of curvature

R2: Second radius of curvature

R3: Third radius of curvature

R4: Fourth radius of curvature

R5: Fifth radius of curvature

R6: Sixth radius of curvature

Figure 1 is a perspective view of a sensor package according to an embodiment of the present invention.

Figure 2 is a cross-sectional view of Figure 1 along line A-A and line B-B.

Figure 3 is a perspective view of a sensor package according to another embodiment of the present invention.

Figure 4 is a cross-sectional view taken along line A’-A’ and line B’-B’ in Figure 3.

Figure 5 is a perspective view of a sensor package according to another embodiment of the present invention.

Figure 6 is a cross-sectional view of Figure 5 along line A-A and line B-B.

Figure 7 is a perspective view of a sensor package according to another embodiment of the present invention.

Figure 8 is a cross-sectional view of Figure 7 along line A-A and line B-B.

Figure 9 is a perspective view of a sensor package according to another embodiment of the present invention.

Figure 10 is a cross-sectional view of Figure 9 along line A-A and line B-B.

Figures 11 to 17 are illustrations of molds suitable for use with the present invention.

Figures 18 and 19 are partial cross-sectional structural diagrams of the manufacturing process of the present invention.

Figures 20 and 21 are cross-sectional structural diagrams of the sensor package of the present invention during the sawing process.

To fully understand the structure and effects of the present invention, preferred embodiments of the present invention are described with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be embodied in a variety of forms and modifications. The description of these embodiments is provided solely to complete the disclosure of the present invention and to fully inform those skilled in the art of the present invention of the scope of the invention. In the accompanying drawings, the size of structural elements may be exaggerated, and the proportions of individual structural elements may be enlarged or reduced for ease of illustration.

Terms such as "first," "second," and so on may be used to describe various structural elements. These structural elements are not limited to the above terms. These terms may be used to distinguish between two structural elements. For example, a "first structural element" may be referred to as a "second structural element," and similarly, a "second structural element" may be referred to as a "first structural element" without departing from the scope of the present invention. Furthermore, as long as the context clearly indicates otherwise, references to the singular include references to the plural. Unless otherwise specified, the terms used in the embodiments of the present invention have the same meanings as those commonly understood by persons of ordinary skill in the art to which the present invention pertains.

Figure 1 is a perspective view of a sensor package 1 according to a preferred embodiment of the present invention, and Figure 2 is a cross-sectional view taken along lines A-A and B-B of Figure 1 .

Referring to Figures 1 and 2 , the sensor package 1 of the present invention includes a substrate 10, such as a printed circuit board (PCB), a sensor 30 mounted on top of the substrate 10, and a mold 20 that is secondary molded onto the upper surface of the substrate 10 on which the sensor 30 is mounted.

The upper surface 21 of the mold 20 is a curved surface with a predetermined curvature. In the illustrated embodiment, the upper surface 21 is a curved surface protruding along the upper side.

The upper surface 21 may be a curved surface with both ends connected to the side surfaces 27 of the mold 20. In this case, the radius of curvature of the upper surface 21 may be determined based on the design shape of the product to which the present invention is applied. In one embodiment, the radius of curvature may be 2.0 mm to 7.0 mm.

In this case, the radius of curvature of the upper surface 21 can be determined according to the design shape of the product to which the present invention is applied.

The substrate 10 may be a rectangular structure with planar long and short sides, and the bottom surface of the mold 20 may also be in the same rectangular shape as the substrate 10.

This shape is just one example, and various substrates 10 may be used, such as those with rectangular or circular planes.

The mold 20 may be made of resin, and the upper surface 21 may be a curved surface having a predetermined curvature along the direction connecting the long side and the short side.

The shape of the upper surface 21 is not formed through post-processing after the mold 20 is formed. Instead, the mold 20 with the curved upper surface 21 is directly formed by mold casting or mold pressing.

For example, before sawing the substrate 10 on which the multiple sensors 30 are mounted, the substrate 10 is inserted into a mold casting and a mold solution is injected to form the mold 20, which is then overmolded onto the multiple sensors 30. The mold 20 and substrate 10 are then cut to form a product.

Furthermore, a mold solution is applied to the upper portion of the substrate 10 on which the multiple sensors 30 are mounted, and a mold press is used to press the substrate 10. This forms multiple molds 20 for secondary molding of the sensors 30, which are then cut through a sawing process to form individual sensor packages 1.

The sensor package 1 of the present invention can be used in electronic devices such as laptops, smartphones, and tablet computers. The curvature of the upper surface of the mold 20 can be determined based on the design shape of the applicable electronic device, and a casting mold that conforms to the curvature can be used.

As described above, when mold 20 is formed, its shape is determined and formed directly, thus eliminating the need for subsequent processing steps. As mentioned above, subsequent processing steps can include grinding, laser etching, and CNC processing. Since these subsequent steps are not used, the surface roughness uniformity of mold 20 can be ensured.

Furthermore, by reducing errors in subsequent processes, the performance uniformity of individual sensor packages 1 can be ensured, thereby improving product reliability.

The curvature of the upper surface 21 of the mold 20 can be a single curvature surface with a curvature radius of 2.0 mm to 7.0 mm. As will be described in more detail later, it can have multiple curvatures.

Figure 3 is a perspective view of a sensor package 1 according to another embodiment of the present invention, and Figure 4 is a cross-sectional view taken along line A'-A' and line B'-B' of Figure 3.

Referring to Figures 3 and 4 respectively, the rest of the structure is the same as the example described with reference to Figures 1 and 2 above. The upper surface of the mold 20' has a predetermined curvature on all four sides.

That is, with the center of the upper surface 21 of the mold 20' as the reference, the surfaces facing each side can have a specified curvature.

It is easy to understand that when the substrate 10 is circular, a nearly hemispherical upper surface 21 can be formed.

In this case, the lateral curvature of the upper surface 21 also ranges from 2.0 mm to 7.0 mm. In the structure described above, the curvature of the surface connecting the two opposing short sides may be different from the curvature of the surface connecting the two long sides.

Another difference between the examples shown in Figures 3 and 4 is that a curved surface 22 is included between the upper surface 21 and the side surface 27.

The area surrounding the upper surface 21 of the mold 20 serves as the curved surface 22 of the sensor package 1.

The present invention can form the curvature of the upper surface 21 and the curvature of the curved surface 22 to be the same or different even without using a post-processing step.

When the curvature of the upper surface 21 is the same as the curvature of the curved surface 22, the upper surface 21 and the curved surface 22 are not physically distinguishable from each other, and thus have the same structure as the upper surface of the single-curvature surface described with reference to Figures 1 and 2 above.

That is, the upper end of the side surface of the mold 20 can directly contact the lower end of the single-curvature upper surface 21.

The radius of curvature of the upper surface 21 of the mold 20 can be in the range of 2.0 mm to 7.0 mm, and the radius of curvature of the curved surface 22 can be in the range of 2.0 mm to 6.5 mm.

Figure 5 is a perspective view of a sensor package 1 according to another embodiment of the present invention, and Figure 6 is a cross-sectional view taken along lines A-A and B-B of Figure 5 .

Referring to Figures 5 and 6 , the rest of the structure is the same as the example described with reference to Figures 1 and 2 . However, curved surfaces 22 are formed on both ends of the upper surface 21 and side surface 24 of the mold 20.

Furthermore, the two facing curved surfaces 22 can be arranged symmetrically with respect to the upper surface 21 and the side surface 24.

The curved surface 22 may extend from both ends of the upper surface 21 and the side surface 24 along the lower side and have a predetermined curvature. In this case, the curved surface 22 may be a single-curvature surface or a multi-curvature surface.

The curvature of the upper surface 21 and the curvature of the curved surface 22 may be the same or different.

The sensor package 1 of the present invention can determine the curvature of the upper surface 21 and the curved surface 22 of the mold 20 based on the design shape of the applicable electronic device, and can be manufactured using a casting mold 40 that matches the curvature.

In one embodiment, the curvature radius of the upper surface 21 and the curved surface 22 of the mold 20 can both be 2.0 mm to 6.5 mm.

Figure 7 is a perspective view of a sensor package 1 according to another embodiment of the present invention, and Figure 8 is a cross-sectional structural view taken along lines A-A and B-B of Figure 7.

Referring to Figures 7 and 8 , the remaining structure is the same as the example described with reference to Figures 5 and 6 above. However, the curved surface 22 can be divided into a first curved surface 221 and a second curved surface 222.

The first curved surface 221 extends from both ends of the upper surface 21 and curves along the lower side. The first curved surface 221 extends from both ends of the side surface 24, with its upper end directly contacting the lower end of the first curved surface 221. In this case, the portion where the first curved surface 221 and the second curved surface 222 meet can be a curved surface.

The first curved surface 221 and the second curved surface 222 may each have a predetermined curvature. Furthermore, the curvatures of the first curved surface 221 and the second curved surface 222 may be the same or different.

Another difference between the examples shown in Figures 7 and 8 is that a connecting surface 23 may be included between the upper surface 21 and the side surface 24.

The connecting surface 23 forms a boundary 25 between the upper surface 21 and the side surface 24 of the mold 20. Furthermore, the connecting surface 23 can be a flat surface or a curved surface.

The portion where the connecting surface 23 meets the upper surface 21 or the side surface 24 of the mold 20 can be a curved surface.

When the connecting surface 23 is a curved surface, its radius of curvature may be the same as or different from the radius of curvature of the upper surface 21.

Figure 9 is a perspective view of a sensor package 1 according to another embodiment of the present invention, and Figure 10 is a cross-sectional structural view taken along lines A-A and B-B in Figure 9.

Referring to Figures 9 and 10 , the rest of the structure is the same as the example described with reference to Figures 1 and 2 above. However, the upper surface 21 of the mold 20 is a curved surface that is concave along the lower side. Furthermore, a first curved surface 221 and a second curved surface 222 are formed at the ends of the upper surface 21 and the side surface 24 of the mold 20, respectively.

Furthermore, the two opposing first curved surfaces can be arranged symmetrically with respect to the upper surface 21, and the two opposing second curved surfaces can be arranged symmetrically with respect to the side surface 24.

The first curved surface 221 may extend from both ends of the upper surface 21 along the upper side and have a predetermined curvature. In this case, the first curved surface 221 may be a single-curvature surface or a multi-curvature surface. Furthermore, the curvatures of the first curved surface 221 and the upper surface 21 may be the same or different.

The second curved surface 222 extends from both ends of the side surface 24, and its upper end can directly contact the lower end of the first curved surface 221. In one embodiment, the portion where the first curved surface 221 and the second curved surface 222 meet can be a curved surface.

The first curved surface 221 and the second curved surface 222 may each have a predetermined curvature. Furthermore, the curvatures of the first curved surface 221 and the second curved surface 222 may be the same or different.

Below, with reference to Figures 11 to 17, multiple embodiments of the present invention are further described in detail.

FIG11 is an illustrative diagram of a mold 20 without curvature in the example of the present invention described above.

That is, the upper surface 21 of the mold 20 can be a flat surface parallel to the bottom surface of the mold 20, and the curved surface 22 forming the boundary between the side surface of the mold 20 and the upper surface 21 can also be a flat surface.

The inclination of the curved surface 22 of the upper surface 21 can be 45 degrees.

In this structure, the present invention can also simultaneously form the curved surface 22 without post-processing.

Figure 12 shows a cross-section of an example in which the upper surface 21 is a flat surface parallel to the bottom surface, and the curved surface 22 is a curved surface having a predetermined curvature.

In Figure 12, the height of the curved surface 22 can be 2 mm, and the curvature radius R of the entire curved surface 22 is 2 mm.

The range of the radius of curvature of the curved surface 22 differs between when the upper surface 21 is a flat surface and when the upper surface 21 is a curved surface.

Preferably, when the upper surface 21 is a flat surface, the curvature radius of the curved surface 22 is 2 mm to 6.5 mm.

FIG13 illustrates an example in which the heights of the upper surface 21 and the curved surface 22 are both curved.

In the above example, the radius of curvature of the upper surface 21 can be 5.5 mm, and the radius of curvature of the curved surface 22 can be 2.5 mm.

The above-mentioned radius of curvature is an example. The present invention can be applied by selecting the curvature of the upper surface 21 within a radius of curvature ranging from 2.0 mm to 7.0 mm.

Furthermore, the radius of curvature of the curved surface 22 can be selected within the range of 2.0 mm to 6.5 mm in consideration of the radius of curvature of the upper surface 21.

Unlike the example in Figure 2, the examples described above with reference to Figures 11 to 13 are structures with varying curvatures. For convenience, these structures are referred to as structures with multiple curvature surfaces.

In the example of a mold 20 having multiple curvature surfaces, the upper surface 21 of the mold 20 can be determined based on the design shape of the applicable electronic device. The curvature of the upper surface 21 can be taken into consideration to determine the radius of curvature of the curved surface 22.

Another example of a multi-curvature mold 20 is shown in FIG14 .

Referring to Figure 14 , although similar to the example of Figure 11 , the boundary 25′ between the upper surface 21 and the curved surface 22 and the boundary 25 between the curved surface 22 and the side surface 24 may be curved surfaces with a predetermined curvature.

In this case, the curvature radius of the two boundaries 25' and 25 is 0.05mm to 0.5mm. Even fine curvatures can be easily produced using the manufacturing method of the present invention.

FIG15 shows an example of a mold 20 having curved surfaces 22 formed at both ends of the upper surface 21 and the side surface 24.

In the embodiment shown in FIG15 , the longitudinal width and transverse width of the mold 20 are defined as a first length L1 and a second length L2, respectively, and the curvature radii of the upper surface 21 and the curved surface 22 are defined as a first curvature radius R1 and a second curvature radius R2, respectively.

The first radius of curvature R1 and the second radius of curvature R2 can be determined based on the first length L1 and the second length L2.

In one embodiment, the first length L1 of the mold 20 is 2.2 mm, the second length L2 is 14.3 mm, and the first radius of curvature R1 and the second radius of curvature R2 can be 2.0 mm to 7.0 mm, respectively.

FIG16 shows an example of a mold 20 including a connecting surface 23 between an upper surface 21 and a side surface 24.

In the embodiment shown in FIG16 , first curved surfaces 221 are formed at both ends of the upper surface 21, and second curved surfaces 222 are formed at both ends of the side surface 24.

In the above embodiment, the curvature radii of the upper surface 21 and the curved surface 22 are defined as the third curvature radius R3 and the fourth curvature radius R4, respectively.

The third radius of curvature R3 and the fourth radius of curvature R4 can be determined based on the design shape of the electronic device to which the sensor package 1 is applied.

In one embodiment, the third radius of curvature R3 and the fourth radius of curvature R4 may be 2.0 mm to 6.5 mm, respectively.

Figure 17 shows an example of a mold 20 in which the upper surface 21 follows a curved surface that is concave on the lower side.

In the embodiment shown in FIG17 , first curved surfaces 221 are formed at both ends of the upper surface 21, and second curved surfaces 222 are formed at both ends of the side surface 24.

In the above embodiment, the curvature radii of the upper surface 21 and the first curved surface 221 are defined as the fifth curvature radius R5 and the sixth curvature radius R6, respectively.

The fifth radius of curvature R5 and the sixth radius of curvature R6 can be determined based on the design shape of the electronic device to which the sensor package 1 is applied.

In one embodiment, the fifth radius of curvature R5 is 2.0 mm to 6.5 mm, and the sixth radius of curvature R6 can be 2.0 mm to 6.5 mm.

FIG18 is a diagram showing an example of a cross-section of a casting die 40 suitable for use in the molding die 20.

Only a portion of the casting mold 40 is shown, and only the upper shape of the compression mold or injection mold is shown.

In the casting mold 40, the area corresponding to the upper surface 21 of the mold 20 is recessed upward, while the area on the upper side of the substrate 10 where the sensor 30 is not provided is protruded downward, thereby forming the mold 20 of the example described above.

In particular, it is preferred that the downwardly protruding lower region 41 of the casting mold 40 at least does not contact the substrate 10, and in particular, when the mold 20 is formed, is located at the same height as the upper surface of the sensor 30.

Furthermore, the lower region 41 is a flat surface parallel to the substrate 10.

The above-described casting structure enables the formation of automatically molded parts without using additional units such as a pressurized injection unit.

That is, a path is formed that allows the molten resin material, which serves as the mold raw material, to move easily, thereby achieving uniform mold forming.

As described above, the plurality of sensors 30 are mounted on the substrate 10, and the mold 20 is formed entirely on the upper surface of the substrate 10 on which the plurality of sensors 30 are mounted.

In this process, Figure 18 shows the state where the mold 20 is formed using the casting mold 40. Afterwards, the casting mold 40 is removed, and the mold 20 and substrate 10 are cut through a sawing process to obtain individual sensor packages 1.

In this case, the sawing process can use laser cutting or various known cutting methods.

The side surface 24 of the mold 20 described above can be formed by a sawing process, and a side cut surface of the substrate 10 can be obtained, which is connected to the side surface 24 directly below.

In this case, a sawing process can be used to determine the final structure of the sensor package 1.

FIG19 is another exemplary cross-sectional view of a casting die 40 suitable for forming the mold 20.

In the casting mold 40, the area corresponding to the upper surface 21 of the mold 20 is formed to protrude downward, protruding further downward than the area on the upper side of the substrate 10 where the sensor 30 is not provided, thereby forming the mold 20 of the example described above.

In particular, when forming the mold 20, it is preferred that the area on the upper side of the substrate 10 of the mold 40 be located at a lower height than the height of the sensor 30. This allows each mold 20 to be formed independently of one another on the substrate.

Subsequently, the casting mold 40 is removed and the mold 20 and substrate are cut by a sawing process to obtain individual sensor packages 1.

In the embodiment shown in FIG20 , the sawing position of the mold 20 is the boundary 25 in FIG14 , so that the lower end of the curved surface 22 and the side surface 24 of the mold 20 are in contact with each other in the vertical direction and positioned.

In the embodiment shown in Figure 21, the sawing position of the mold 20 is a predetermined distance away from the bottom end of the curved surface 22 in the outward direction. The curved surface 22 and the side surface 24 of the mold 20 do not directly contact each other. Furthermore, the predetermined distance can be 3 μm.

In the above embodiment, a placement surface 26 is formed between the upper end of the side surface 24 of the mold 20 and the curved surface 22. The placement surface 26 is located below the lower region 41 of the casting mold 40 described with reference to FIG. 18 and is formed parallel to the substrate 10.

The placement surface 26 can be formed according to mechanical requirements. For example, a portion of another component can be placed on the placement surface 26 to form a more stable bonding structure.

Furthermore, when the sensor package 1 of the present invention is inserted and fixed into the window of another component, the placement surface 26 abuts against the other component, preventing it from detaching in the opposite direction.

That is, the present invention can form a curved surface 22 that is flat or curved without additional post-processing, and can simultaneously form a placement surface along the outer side of the curved surface 22.

It should be understood that, in addition to the relationship between the lower end of the curved surface 22 and the side surface 24 of the mold 20, the embodiments shown in Figures 20 and 21 are also applicable to the relationship between the lower end of the connecting surface 23 and the side surface 24 of the mold 20.

That is, the lower end of the connecting surface 23 and the side surface 24 of the mold 20 are in contact with each other in the vertical direction and positioned, or a placement surface 26 formed parallel to the substrate 10 can be formed therebetween.

The embodiments of the present invention described above are merely illustrative. A person skilled in the art will readily appreciate various modifications and equivalent embodiments from the above description. Therefore, the true scope of technical protection for the present invention is defined by the following patent application.

10:Substrate

20: Mold

21:Upper face

24:Side

30: Sensor

A-A, B-B: Straight Line

Claims (36)

A sensor package comprises: a substrate; a sensor mounted on a surface of the substrate; and a mold formed by secondary molding on the surface of the substrate on which the sensor is mounted, wherein the upper surface of the mold has a single or multiple curvatures. The multiple curvatures of the mold include a curved surface that forms a boundary between the upper surface and a side surface of the mold, and the upper surface or the curved surface is flat or curved. The upper surface is flat, the curved surface is curved, and the radius of curvature of the curved surface is 2.0 mm to 6.5 mm. A sensor package comprises: a substrate; a sensor mounted on a surface of the substrate; and a mold formed by secondary molding on the surface of the substrate on which the sensor is mounted, wherein the upper surface of the mold has a single or multiple curvatures. The multiple curvatures of the mold include a curved surface forming a boundary between the upper surface and a side surface of the mold, and the upper surface or the curved surface is flat or curved. Both the upper surface and the curved surface are flat, and the portion where the upper surface meets the curved surface is a curved surface with a radius of curvature of 0.05 mm to 0.5 mm. A sensor package comprises: a substrate; a sensor mounted on a surface of the substrate; and a mold formed by secondary molding on the surface of the substrate on which the sensor is mounted, wherein the upper surface of the mold has a single or multiple curvatures. The multiple curvatures of the mold include a curved surface that forms a boundary between the upper surface and a side surface of the mold, and the upper surface or the curved surface is flat or curved. Both the upper surface and the curved surface are curved, and each has a different radius of curvature. The sensor package of claim 3, wherein the radius of curvature of the upper surface is 2.0 mm to 7.0 mm, and the radius of curvature of the curved surface is 2.0 mm to 6.5 mm. The sensor package as described in claim 3, wherein the upper end of the side surface of the mold and the lower end of the curved surface or the upper surface are in direct contact with each other. A sensor package as described in claim 3, wherein the upper end of the side surface of the mold and the lower end of the curved surface or the upper surface are not in direct contact with each other, and a placement surface which is a flat surface parallel to the substrate is located between them. The sensor package as described in claim 3, wherein the mold is a curved surface protruding along the upper side of the upper surface, including curved surfaces extending from both ends of the upper surface and the side surface along the lower side. The sensor package as described in claim 7, wherein the curved surface is a single curvature surface or a multi-curvature surface. The sensor package as described in claim 8, wherein the curved surface is a single-curvature surface with a curvature radius of 2.0 mm to 7.0 mm. The sensor package of claim 7, wherein the curved surface comprises: a first curved surface extending from both ends of the upper surface along the lower side; and a second curved surface extending from both ends of the side surface, the upper end of the second curved surface being in direct contact with the lower end of the first curved surface. The sensor package as described in claim 10, wherein the portion where the first curved surface and the second curved surface meet is a curved surface. The sensor package of claim 7, wherein the upper surface and the curved surface have different radii of curvature. The sensor package of claim 12, wherein the radius of curvature of the upper surface is 2.0 mm to 7.0 mm, and the radius of curvature of the curved surface is 2.0 mm to 7.0 mm. The sensor package as described in claim 7, wherein the two facing curved surfaces are symmetrical to each other with respect to the upper surface and the side surface. The sensor package as described in claim 7, wherein the upper end of the side surface of the mold and the lower end of the upper surface are in direct contact with each other. A sensor package as described in claim 7, wherein the upper end of the side surface of the mold and the lower end of the upper surface are not in direct contact with each other, and a placement surface which is a flat surface parallel to the substrate is located between them. A sensor package as described in claim 7, wherein the mold includes a connection surface forming a boundary between the upper surface and the side surface of the mold, formed as a flat surface or a curved surface. The sensor package of claim 17, wherein the connecting surface is a curved surface having a radius of curvature that is different from a radius of curvature of the upper surface. The sensor package as described in claim 17, wherein the portion where the connection surface is connected to the upper surface and the portion where the connection surface is connected to the side surface are curved surfaces. The sensor package as described in claim 19, wherein the upper end of the side surface of the mold and the lower end of the connecting surface are in direct contact with each other. A sensor package as described in claim 17, wherein the upper end of the side surface of the mold and the lower end of the connection surface are not in direct contact with each other, and a placement surface which is a flat surface parallel to the substrate is located between them. A sensor package comprises: a substrate; a sensor mounted on a surface of the substrate; and a mold formed by secondary molding on the surface of the substrate on which the sensor is mounted, wherein the upper surface of the mold is a single-curvature surface or a multi-curvature surface. The upper surface of the mold is a curved surface that is concave along the lower side. The mold comprises: a first curved surface extending from both ends of the upper surface along the upper side; and a second curved surface extending from both ends of the side surface, with its upper end directly contacting the lower end of the first curved surface. The upper surface and the first curved surface have different radii of curvature. The sensor package as described in claim 22, wherein the first curved surface is a single curvature surface or a multi-curvature surface. The sensor package of claim 23, wherein the first curved surface is a single-curvature surface having a curvature radius of 2.0 mm to 6.5 mm. The sensor package of claim 22, wherein the radius of curvature of the upper surface is 2.0 mm to 6.5 mm, and the radius of curvature of the first curved surface is 2.0 mm to 6.5 mm. The sensor package as described in claim 22, wherein the two opposing first curved surfaces are symmetrical to each other with respect to the upper surface, and the two opposing second curved surfaces are symmetrical to each other with respect to the side surface. A sensor package as described in any of claims 3, 7 and 22, wherein the mold is formed by mold casting. A sensor package as described in any one of claims 3, 7 and 22, wherein the upper surface is a curved surface connecting two opposite sides of the mold. A sensor package as described in any one of claims 3, 7 and 22, wherein the upper surface is a curved surface connecting two pairs of opposing sides. A sensor package manufacturing method comprises: Step a) mounting a plurality of sensors on an upper portion of a substrate; Step b) forming a mold on the upper portion of the substrate on which the plurality of sensors are mounted using a mold casting; and Step c) cutting the mold and substrate to separate the sensors on the substrate from the mold formed by secondary molding on the upper portion of the sensors. In the region of the upper surface of the mold forming the mold casting, the upper surface is formed as a concave surface with a single or multiple curvatures. The sensor package manufacturing method of claim 30, wherein: the radius of curvature of the upper surface of the mold formed by the single-curvature surface is 2.0 mm to 7.0 mm, the radius of curvature of the upper surface of the mold formed by the multi-curvature surface is 2.0 mm to 7.0 mm, and the mold is formed so that the radius of curvature of the curved surface between the upper surface and the side surface is 2.0 mm to 7.0 mm. The sensor package manufacturing method of claim 31, wherein: the upper surface and the curved surface are both flat surfaces; the portion where the upper surface meets the curved surface is a curved surface having a radius of curvature of 0.05 mm to 0.5 mm. A sensor package manufacturing method as described in claim 30, wherein the curvature radius of the upper surface and the curved surface extending from both ends of the upper surface and the side surface along the lower side is 2.0 mm to 6.5 mm. A sensor package manufacturing method as described in claim 31, wherein, in step c), a prescribed interval outer side is cut in the lower end of the curved surface or the lower end of the upper surface to form a placement surface as a flat surface parallel to the substrate between the side surface of the mold and the curved surface or the upper surface. A sensor package manufacturing method includes: Step a) mounting a plurality of sensors on a substrate; Step b) forming a mold on the substrate on which the plurality of sensors are mounted using a mold casting; and Step c) cutting the mold and substrate to separate the respective sensor packages. In the region of the mold upper surface forming the mold casting, the mold upper surface is formed as a concave surface with a single or multiple curvatures. A sensor package manufacturing method as described in claim 35, wherein the curvature radius of the upper surface and the curved surfaces extending from both ends of the upper surface along the upper side are both 2.0 mm to 6.5 mm.