TWI900378B - Vertical vacuum heating process conveying mechanism and operating method thereof - Google Patents

Abstract

A vertical vacuum heating process transfer mechanism includes a vertical lifting chamber and a process chamber. The vertical lifting chamber has a vertical lifting platform. The first placement area of the vertical lifting platform receives a first carrier through an in-and-out gate valve, and the vertical lifting platform then moves so that the second placement area of the vertical lifting platform then receives a second carrier through an in-and-out gate valve. The process chamber receives the first carrier and performs a vacuum heating process. After the wafer in the first carrier completes the vacuum heating process, the first carrier is cooled in the first placement area. When the first carrier is cooled in the first placement area without breaking the vacuum, the process chamber receives the second carrier and performs a vacuum heating process on the wafer in the second carrier.

Description

Vertical vacuum heating process transmission mechanism and operation method thereof

The present disclosure relates to a transfer mechanism and a method for operating the transfer mechanism, and in particular to a vertical vacuum heating process transfer mechanism and a method for operating the transfer mechanism that shortens wafer process time by utilizing a first placement area and a second placement area of a vertical lifting platform and a division of labor configuration of a process chamber.

Generally speaking, operators usually transport carriers containing wafers into a heating furnace tube to perform a growth process on the wafers in the carrier, such as a Chemical Vapor Deposition (CVD) process. However, after the wafers complete the growth process, the carriers containing the wafers need to be cooled down in a gas chamber connected to the heating furnace tube. The waiting time for this cooling down is about three to four hours. The carriers that have undergone the growth process have to wait in the gas chamber for their own temperature to return to room temperature before they can be taken out, thus occupying a large amount of the operating time of the heating furnace tube and the gas chamber. In other words, the heating furnace tube needs to wait until the temperature of the first set of carriers reaches room temperature and is sent out of the gas chamber before it can receive the next set of carriers ready for the process. This manufacturing process not only takes a lot of time waiting for the wafers to cool down, but also slows down the shipment of wafers.

One of the technical aspects disclosed herein is a vertical vacuum heating process transfer mechanism, which can simultaneously transfer the second wafer from the second placement area of the vertical lifting platform to the process chamber for vacuum heating process when the first wafer completes the vacuum heating process and is cooled in the first placement area of the vertical lifting platform. Therefore, the cooling waiting time and the time for performing the vacuum heating process can be shortened for manufacturing multiple groups of wafers.

An embodiment of the present disclosure provides a vertical vacuum heating process transfer mechanism that sequentially transfers a first carrier, a second carrier, and a third carrier, and includes a vertical lift chamber and a process chamber. The vertical lift chamber includes a vertical lift platform, an inlet and outlet gate valve disposed on one side of the vertical lift platform, and a process gate valve disposed on the other side of the vertical lift platform. The vertical lift platform includes a first placement area and a second placement area adjacent to the first placement area, the first placement area and the second placement area being aligned in a first direction. The first placement area is configured to receive a first carrier via the inlet and outlet gate valve, and the vertical lift platform is configured to move so that the second placement area subsequently receives a second carrier via the inlet and outlet gate valve. The process chamber is connected to a process gate valve located in the vertical lift chamber and is configured to receive a first carrier and perform a vacuum heating process on a first wafer in the first carrier. After the vacuum heating process is completed for the first wafer, the first placement area is further configured to receive the first carrier that has completed the vacuum heating process. The vertical lift then moves in a first direction to cool the first carrier in the first placement area. While the first carrier is cooling in the first placement area without breaking the vacuum, the process chamber is further configured to receive a second carrier and perform a vacuum heating process on a second wafer in the second carrier.

According to one embodiment of the present disclosure, when the first wafer has completed cooling and the second wafer in the second carrier is still undergoing a vacuum heating process in the process chamber, the vertical lifting platform then moves in a second direction opposite to the first direction so that the first placement area is exposed again from the access gate valve, the first carrier is used to be removed, and the first placement area is further configured to receive a third carrier.

According to an embodiment of the present disclosure, when the third carrier is located in the first placement area and the second wafer in the second carrier completes the vacuum heating process, the vertical lifting platform is further configured to move along the first direction so that the second placement area receives the second carrier that has completed the vacuum heating process.

According to an embodiment of the present disclosure, after the second carrier that has completed the vacuum heating process is received in the second placement area, the vertical lifting platform is further configured to move along the second direction so that the second carrier can be cooled in the second placement area without breaking the vacuum, and the process chamber is further configured to receive a third carrier and perform a vacuum heating process on the third wafer in the third carrier. When the second wafer has completed cooling and the third wafer in the third carrier is still undergoing the vacuum heating process in the process chamber, the vertical lifting platform then moves along the first direction to expose the second placement area from the inlet and outlet gate valve so that the second carrier can be taken out.

According to an embodiment of the present disclosure, the vertical lift chamber has a conveying gate valve, and the process gate valve and the conveying gate valve are located on opposite sides of the vertical lift platform.

According to one embodiment of the present disclosure, the vertical vacuum heating process transfer mechanism further includes a transverse conveyor device. The transverse conveyor device is connected to a conveyor gate valve disposed within the vertical lift chamber and comprises a transverse gripper. The transverse gripper is configured to push the first and second carriers from the first and second placement areas into the process chamber, or to pull them back from the process chamber to the first and second placement areas, respectively.

Another embodiment of the present disclosure is an operating method of a vertical vacuum heating process transfer mechanism, which can simultaneously enable the second placement area of the vertical lifting platform to transfer the second wafer to the process chamber for vacuum heating process when the first wafer completes the vacuum heating process and is cooled in the first placement area of the vertical lifting platform. Therefore, the cooling waiting time for manufacturing multiple groups of wafers and the time for performing the vacuum heating process can be shortened.

The embodiment of the present disclosure provides an operating method of a vertical vacuum heating process transfer mechanism for sequentially transferring a first carrier, a second carrier, and a third carrier, and includes: a first placement area of a vertical lifting platform of a vertical lifting chamber receives the first carrier through an inlet and outlet gate valve of the vertical lifting platform, and the vertical lifting platform then moves vertically so that a second placement area of the vertical lifting platform receives the second carrier through an inlet and outlet gate valve, wherein the first placement area of the vertical lifting platform and the second placement area adjacent to the first placement area are in a first direction. The process chamber receives a first carrier and performs a vacuum heating process on a first wafer in the first carrier; after the first wafer completes the vacuum heating process, the first placement area of the vertical lift receives the first carrier that has completed the vacuum heating process and then moves vertically; and when the first carrier is cooled in the first placement area without breaking the vacuum, the process chamber receives a second carrier and performs a vacuum heating process on a second wafer in the second carrier.

According to one embodiment of the present disclosure, the above-mentioned operating method further includes: when the first wafer has completed cooling and the second wafer in the second carrier is still undergoing a vacuum heating process in the process chamber, the vertical lifting platform then moves in a second direction opposite to the first direction so that the first placement area is exposed again from the access gate valve; and the first carrier is removed and the first placement area receives the third carrier.

According to an embodiment of the present disclosure, the above-mentioned operating method further includes: when the third carrier is located in the first placement area and the second wafer in the second carrier completes the vacuum heating process, the vertical lifting platform then moves along the first direction so that the second placement area receives the second carrier that has completed the vacuum heating process.

According to an embodiment of the present disclosure, the above-mentioned operating method further includes: after the second carrier that has completed the vacuum heating process is received in the second placement area, the vertical lifting platform then moves along the second direction so that the second carrier is cooled in the second placement area without breaking the vacuum, and the process chamber receives the third carrier and performs a vacuum heating process on the third wafer in the third carrier; and when the second wafer has completed cooling and the third wafer in the third carrier is still undergoing the vacuum heating process in the process chamber, the vertical lifting platform then moves along the first direction so that the second placement area is exposed from the access gate valve, and the second carrier is taken out.

In summary of the above, in the present disclosure, first, after completing the vacuum heating process, the first wafer of the first carrier can be cooled down in the first placement area of the vertical lift, and will not occupy the working space of the process chamber and the second placement area of the vertical lift. Therefore, when the first carrier is waiting to cool down in the first placement area, the second carrier located in the second placement area of the vertical lift can enter the process chamber to perform the vacuum heating process. In addition, when the first carrier completes cooling down in the first placement area and the second carrier is still performing the vacuum heating process in the process chamber, the vertical lift can be moved to remove the first carrier from the inlet and outlet gate valve, and the first placement area then receives the third carrier. After the second carrier completes the vacuum heating process, it is transferred to the second placement area of the vertical lift for cooling. The third carrier then enters the process chamber for the vacuum heating process. This repetitive operation allows the vertical vacuum heating process transfer mechanism to divide the work flow, not only shortening the cooling wait time and vacuum heating process time for manufacturing multiple wafers, but also improving the efficiency of wafer shipment using the vertical vacuum heating process transfer mechanism.

The following disclosed embodiments provide numerous different embodiments, or examples, for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. However, these examples are merely examples and are not intended to be limiting. Furthermore, the present disclosure may repeat component symbols and/or letters throughout the various examples. This repetition is for simplicity and clarity and does not, in itself, dictate a relationship between the various embodiments and/or configurations discussed.

Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive purposes to describe the relationship of one element or feature to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Please refer to Figures 1 and 2. Figure 1 shows a schematic diagram of a vertical vacuum heating process transport mechanism 100 according to an embodiment of the present disclosure, and Figure 2 shows a side view of a vertical lift chamber 110 according to an embodiment of the present disclosure. In Figures 1 and 2, the vertical vacuum heating process transport mechanism 100 can be used to sequentially transport a first carrier 200, a second carrier 300, and a third carrier 400 (described in detail later). The vertical vacuum heating process transport mechanism 100 includes a vertical lift chamber 110, a process chamber 120, and a horizontal transport device 130. The vertical lift chamber 110 includes a vertical lift platform 112, an inlet and outlet gate valve 111 disposed on one side of the vertical lift platform 112, and a process gate valve 113 disposed on the other side of the vertical lift platform 112. The vertical lift platform 112 includes a first placement area 114 and a second placement area 116 adjacent to the first placement area 114. The first placement area 114 and the second placement area 116 are aligned in a first direction D1. For example, the first placement area 114 and the second placement area 116 are aligned in the vertical direction. A partition may be provided between the first placement area 114 and the second placement area 116 to separate the first placement area 114 from the second placement area 116.

In some embodiments, the process chamber 120 is connected to a process gate valve 113 disposed in the vertical lift chamber 110. The vertical lift chamber 110 has a conveying gate valve 115, and the process gate valve 113 and the conveying gate valve 115 are located on opposite sides of the vertical lift platform 112. For example, the process gate valve 113 is located on the left side of the vertical lift platform 112, the conveying gate valve 115 is located on the right side of the vertical lift platform 112, and the inlet and outlet gate valve 111 is located on the front side of the vertical lift platform 112. In addition, the horizontal conveying device 130 is connected to the conveying gate valve 115 disposed in the vertical lift chamber 110 and has a horizontal gripper 132.

The following description will explain the operation of the vertical vacuum heating process transfer mechanism. The component connections, materials, and functions already described will not be repeated, so it is best to explain them first.

Please refer to Figure 3, which shows a flow chart of the operating method of the vertical vacuum heating process transfer mechanism according to an embodiment of the present disclosure. In Figure 3, the operating method of the vertical vacuum heating process transfer mechanism includes the following steps. The operating method of the vertical vacuum heating process transfer mechanism can transport the first carrier, the second carrier, and the third carrier in sequence. First, in step S1, the first placement area of the vertical lifting platform of the vertical lifting chamber receives the first carrier through the inlet and outlet gate valve of the vertical lifting platform, and the vertical lifting platform then moves vertically so that the second placement area of the vertical lifting platform receives the second carrier through the inlet and outlet gate valve, wherein the first placement area of the vertical lifting platform is aligned with the second placement area adjacent to the first placement area in the first direction, and the inlet and outlet gate valve is arranged on one side of the vertical lifting platform. Next, in step S2, the process chamber receives a first carrier and performs a vacuum heating process on the first wafer in the first carrier. Next, in step S3, after the vacuum heating process is complete for the first wafer, the first placement area of the vertical lift receives the first carrier that has completed the vacuum heating process and then moves vertically. Next, in step S4, while the first carrier is cooling in the first placement area without breaking the vacuum, the process chamber receives a second carrier and performs a vacuum heating process on the second wafer in the second carrier. The following description will describe each of these steps in detail.

Figures 4, 7, 8, 10, and 11 illustrate schematic diagrams of different stages of the operation of a vertical vacuum heating process transfer mechanism according to some embodiments of the present disclosure. Figures 5, 6, 9, and 12 to 15 illustrate side views of the vertical lift chamber 110 of the vertical vacuum heating process transfer mechanism 100 at different stages according to some embodiments of the present disclosure. Please refer to Figures 4 to 6. First, when the first placement area 114 of the vertical lifting platform 112 of the vertical lifting chamber 110 is exposed from the inlet and outlet gate valve 111 of the vertical lifting chamber 110 (that is, the inlet and outlet gate valve 111 is opened so that the first placement area 114 can be observed), the first placement area 114 is configured to receive the first carrier 200 through the inlet and outlet gate valve 111, and the vertical lifting platform 112 then moves vertically (for example, moves along the first direction D1) to expose the second placement area 116 from the inlet and outlet gate valve 111 (that is, the inlet and outlet gate valve 111 is opened so that the second placement area 116 can be observed) and receive the second carrier 300 through the inlet and outlet gate valve 111, as shown in Figure 5. After the second carrier 300 is received in the second placement area 116, the vertical lift 112 then moves vertically (e.g., along the second direction D2) to prepare the first carrier 200 for entry into the process chamber 120, as shown in FIG6 . For clarity, the first carrier 200 and the second carrier 300 in FIG4 have different sizes. However, in actual applications, the sizes of the first carrier 200 and the second carrier 300 can be the same or different, and the sizes of the first carrier 200 and the second carrier 300 are not limited to this.

Referring to Figures 7 to 9 , in some embodiments, the lateral gripper 132 of the lateral conveyor 130 can push the first carrier 200 from the first placement area 114 into the process chamber 120, as shown in Figure 7 . In other embodiments, the lateral gripper 132 of the lateral conveyor 130 may not be used. Instead, a robot (not shown) of the vertical lift chamber 110 can push the first carrier 200 from the first placement area 114 into the process chamber 120. The method for pushing the first carrier 200 into the process chamber 120 is not limited. The process chamber 120 is connected to the process gate valve 113 disposed on the vertical lift chamber 110. The process chamber 120 can receive the first carrier 200 and perform a vacuum heating process on the first wafer 210 in the first carrier 200, as shown in Figures 8 and 9. Furthermore, the first carrier 200 can be pulled back from the process chamber 120 to the first placement area 114 using the horizontal gripper 132 of the horizontal transport device 130 or a robot (not shown) that vertically elevates the chamber 110. The method for pulling the first carrier 200 back from the process chamber 120 to the first placement area 114 is not limited.

Referring to Figures 10 to 12 , after the vacuum heating process is completed on the first wafer 210, the first placement area 114 is further configured to receive the first carrier 200 that has completed the vacuum heating process. The vertical lift 112 then moves along the first direction D1 to cool the first carrier 200 in the first placement area 114. Furthermore, while the first carrier 200 is cooling in the first placement area 114 without breaking the vacuum, the process chamber 120 is further configured to receive the second carrier 300 and perform the vacuum heating process on the second wafer 310 in the second carrier 300, as shown in Figures 11 and 12 .

Referring to Figures 13 to 15 , after the first wafer 210 has finished cooling and the second wafer 310 in the second carrier 300 is still undergoing a vacuum heating process in the process chamber 120, the vertical lift 112 then moves in a second direction D2 opposite to the first direction D1, exposing the first placement area 114 again from the access gate valve 111 (i.e., the access gate valve 111 opens after breaking the vacuum, allowing the first carrier 200 to be observed). The first carrier 200 can then be removed, and the first placement area 114 is further configured to receive a third carrier 400, as shown in Figure 13 . After the third carrier 400 is positioned in the first placement area 114 and the second wafer 310 in the second carrier 300 completes the vacuum heating process, the vertical lift 112 is further configured to move along the first direction D1, allowing the second placement area 116 to receive the second carrier 300 that has completed the vacuum heating process. The second carrier 300 is then cooled in the second placement area 116 without breaking the vacuum, as shown in FIG14 . The vertical lift 112 is further configured to move along the second direction D2, and the process chamber 120 is further configured to receive the third carrier 400 and perform the vacuum heating process on the third wafer 410 in the third carrier 400, as shown in FIG15 .

Next, when the second wafer 310 has finished cooling and the third wafer 410 in the third carrier 400 is still undergoing the vacuum heating process in the process chamber 120, the vertical lift 112 moves in the first direction D1, exposing the second placement area 116 from the access gate valve 111 (i.e., the access gate valve 111 opens after breaking the vacuum, allowing the second carrier 300 to be observed), and the second carrier 300 is ready for removal. This repeated operation shortens the wafer cooling waiting time and the vacuum heating process time.

In summary, after the vacuum heating process, the first wafer 210 on the first carrier 200 can be cooled in the first placement area 114 of the vertical lift 112, without occupying the working space of the process chamber 120 and the second placement area 116 of the vertical lift 112. Therefore, while the first carrier 200 is waiting to cool in the first placement area 114, the second carrier 300 located in the second placement area 116 of the vertical lift 112 can enter the process chamber to undergo the vacuum heating process. Furthermore, when the first carrier 200 has completed cooling in the first placement area 114 and the second carrier 300 is still undergoing the vacuum heating process in the process chamber 120, the vertical lift 112 can be moved to remove the first carrier 200 from the access gate valve 111, and the first placement area 114 then receives the third carrier 400. After the second carrier 300 has completed the vacuum heating process, it can be transferred to the second placement area 116 of the vertical lift 112 and cooled there. The third carrier 400 can then enter the process chamber 120 for the vacuum heating process. This repetitive operation allows the division of labor in the vertical vacuum heating process transfer mechanism 100 to not only shorten the cooling waiting time and vacuum heating process time for manufacturing multiple sets of wafers, but also improve the wafer shipping efficiency using the vertical vacuum heating process transfer mechanism 100.

The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should understand that they can easily use this disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and/or achieve the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent structures do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations can be made herein without departing from the spirit and scope of the present disclosure.

100: Vertical vacuum heating process transfer mechanism 110: Vertical lift chamber 111: Entry and exit gate valve 112: Vertical lift platform 113: Process gate valve 114: First placement area 115: Transport gate valve 116: Second placement area 120: Process chamber 130: Horizontal transfer mechanism 132: Horizontal gripper 200: First carrier 210: First wafer 300: Second carrier 310: Second wafer 400: Third carrier 410: Third wafer D1: First direction D2: Second direction S1, S2, S3, S4: Steps

One embodiment of the present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be emphasized that, in accordance with standard industry practice, various features are not drawn to scale and are shown for illustrative purposes only. In fact, the dimensions of various features may be arbitrarily increased or decreased for clarity of presentation. Figure 1 illustrates a schematic diagram of a vertical vacuum heating process transfer mechanism according to one embodiment of the present disclosure. Figure 2 illustrates a side view of a vertical lift chamber according to one embodiment of the present disclosure. Figure 3 illustrates a flow chart of a method for operating the vertical vacuum heating process transfer mechanism according to one embodiment of the present disclosure. Figures 4, 7, 8, 10, and 11 illustrate schematic diagrams of different stages of the operation of a vertical vacuum heating process transfer mechanism according to some embodiments of the present disclosure. Figures 5, 6, 9, and 12 to 15 illustrate side views of a vertical lift chamber of a vertical vacuum heating process transfer mechanism according to some embodiments of the present disclosure at different stages.

100: Vertical vacuum heating process transmission mechanism

110: Vertical Lift Chamber

111: Inlet and outlet gate valve

112: Vertical Lift Platform

113: Process Gate Valve

115: Conveyor gate valve

120: Process chamber

130: Horizontal conveyor device

132: Horizontal grabber

Claims (10)

A vertical vacuum heating process conveying mechanism for sequentially conveying a first carrier (200), a second carrier (300) and a third carrier (400) comprises: a vertical lifting chamber (110) having a vertical lifting platform (112), an inlet and outlet gate valve (111) disposed on one side of the vertical lifting platform (112) and a process gate valve (113) disposed on the other side of the vertical lifting platform (112), wherein the vertical lifting platform (112) comprises a first placement area (114) and a second placement area (113) adjacent to the first placement area (114). 6), the first placement area (114) and the second placement area (116) are aligned in a first direction (D1), wherein the first placement area (114) is configured to receive the first carrier (200) through the inlet and outlet gate valve (111), and the vertical lifting platform (112) is configured to move so that the second placement area (116) then receives the second carrier (300) through the inlet and outlet gate valve (111); and A process chamber (120) is connected to the process gate valve (113) arranged in the vertical lift chamber (110) and is configured to receive the first carrier (200) and perform a vacuum heating process on a first wafer (210) in the first carrier (200), wherein after the vacuum heating process is completed on the first wafer (210), the first placement area (114) is further configured to receive the first carrier (200) that has completed the vacuum heating process. The vertical lifting platform (112) then moves along the first direction (D1) to cool the first carrier (200) in the first placement area (114). When the first carrier (200) is cooled in the first placement area (114) without breaking the vacuum, the process chamber (120) is further configured to receive the second carrier (300) and perform a vacuum heating process on a second wafer (310) in the second carrier (300). A vertical vacuum heating process transfer mechanism as described in claim 1, wherein when the first wafer (210) has completed cooling and the second wafer (310) in the second carrier (300) is still undergoing a vacuum heating process in the process chamber (120), the vertical lifting platform (112) is then moved along a second direction (D2) opposite to the first direction (D1) to expose the first placement area (114) again from the access gate valve (111), the first carrier (200) is used to be taken out and the first placement area (114) is further configured to receive the third carrier (400). A vertical vacuum heating process transfer mechanism as described in claim 2, wherein when the third carrier (400) is located in the first placement area (114) and the second wafer (310) in the second carrier (300) completes the vacuum heating process, the vertical lifting platform (112) is further configured to move along the first direction (D1) so that the second placement area (116) receives the second carrier (300) that has completed the vacuum heating process. The vertical vacuum heating process transfer mechanism as described in claim 3, wherein after the second carrier (300) that has completed the vacuum heating process is received in the second placement area (116), the vertical lifting platform (112) is further configured to move along the second direction (D2) to cool the second carrier (300) in the second placement area (116) without breaking the vacuum, and the process chamber (120) is further configured to receive the third carrier (400) and cool the third carrier (400). 00) undergoes a vacuum heating process, and when the second wafer (310) has completed cooling and the third wafer (410) in the third carrier (400) is still undergoing a vacuum heating process in the process chamber (120), the vertical lifting platform (112) then moves along the first direction (D1) to expose the second placement area (116) from the access gate valve (111), and the second carrier (300) is used to be taken out. A vertical vacuum heating process transfer mechanism as described in claim 1, wherein the vertical lifting chamber (110) has a transfer gate valve (115), and the process gate valve (113) and the transfer gate valve (115) are located on opposite sides of the vertical lifting platform (112). The vertical vacuum heating process transfer mechanism as described in claim 5 further comprises: A horizontal transfer device (130) connected to the transfer gate valve (115) disposed in the vertical lift chamber (110) and having a horizontal gripper (132), wherein the horizontal gripper (132) is configured to push the first carrier (200) and the second carrier (300) from the first placement area (114) and the second placement area (116) into the process chamber (120) or pull them back from the process chamber (120) to the first placement area (114) and the second placement area (116) respectively. A method for operating a vertical vacuum heating process transfer mechanism for sequentially transferring a first carrier (200), a second carrier (300), and a third carrier (400), comprising: A first placement area (114) of a vertical lifting platform (112) of a vertical lifting chamber (110) receives the first carrier (200) via an inlet and outlet gate valve (111) of the vertical lifting platform (112), and the vertical lifting platform (112) then moves vertically so that a second placement area (116) of the vertical lifting platform (112) receives the second carrier (300) via the inlet and outlet gate valve (111), wherein the first placement area (114) of the vertical lifting platform (112) and the second placement area (116) adjacent to the first placement area (114) are aligned in a first direction (D1), and the inlet and outlet gate valve (111) is arranged on one side of the vertical lifting platform (112); A process chamber (120) receives the first carrier (200) and performs a vacuum heating process on a first wafer (210) in the first carrier (200); after the vacuum heating process is completed on the first wafer (210), the first placement area (114) of the vertical lifting platform (112) receives the first carrier (200) that has completed the vacuum heating process and then moves vertically; and when the first carrier (200) is cooled in the first placement area (114) without breaking the vacuum, the process chamber (120) receives the second carrier (300) and performs a vacuum heating process on a second wafer (310) in the second carrier (300). The method for operating the vertical vacuum heating process transfer mechanism as described in claim 7 further includes: when the first wafer (210) has completed cooling and the second wafer (310) in the second carrier (300) is still undergoing a vacuum heating process in the process chamber (120), the vertical lifting platform (112) is then moved along a second direction (D2) opposite to the first direction (D1) to expose the first placement area (114) again from the access gate valve (111); and the first carrier (200) is taken out and the first placement area (114) receives the third carrier (400). The method for operating the vertical vacuum heating process transfer mechanism as described in claim 8 further comprises: When the third carrier (400) is located in the first placement area (114) and the second wafer (310) in the second carrier (300) completes the vacuum heating process, the vertical lifting platform (112) then moves along the first direction (D1) so that the second placement area (116) receives the second carrier (300) that has completed the vacuum heating process. The method for operating the vertical vacuum heating process transfer mechanism as described in claim 9 further includes: After the second placement area (116) receives the second carrier (300) that has completed the vacuum heating process, the vertical lifting platform (112) then moves along the second direction (D2) to cool the second carrier (300) in the second placement area (116) without breaking the vacuum, and the process chamber (120) receives the third carrier (400) and performs a vacuum heating process on a third wafer (410) in the third carrier (400); and When the second wafer (310) has completed cooling and the third wafer (410) in the third carrier (400) is still undergoing a vacuum heating process in the process chamber (120), the vertical lifting platform (112) then moves along the first direction (D1) to expose the second placement area (116) from the access gate valve (111), and the second carrier (300) is taken out.