TWI839324B - Light-shielding sliding film, light-shielding sliding member, and resin composition for light-shielding sliding film - Google Patents
Light-shielding sliding film, light-shielding sliding member, and resin composition for light-shielding sliding film Download PDFInfo
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- TWI839324B TWI839324B TW106142328A TW106142328A TWI839324B TW I839324 B TWI839324 B TW I839324B TW 106142328 A TW106142328 A TW 106142328A TW 106142328 A TW106142328 A TW 106142328A TW I839324 B TWI839324 B TW I839324B
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- Prior art keywords
- light
- shielding sliding
- shielding
- mass
- sliding film
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- 239000011342 resin composition Substances 0.000 title claims description 23
- 239000002245 particle Substances 0.000 claims abstract description 88
- 239000006229 carbon black Substances 0.000 claims abstract description 51
- 229920005862 polyol Polymers 0.000 claims abstract description 45
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 35
- 150000003077 polyols Chemical class 0.000 claims abstract description 29
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 11
- 239000012508 resin bead Substances 0.000 claims abstract description 6
- 239000011256 inorganic filler Substances 0.000 claims abstract description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 4
- 239000007787 solid Substances 0.000 claims description 54
- 239000004840 adhesive resin Substances 0.000 claims description 36
- 229920006223 adhesive resin Polymers 0.000 claims description 36
- 239000005056 polyisocyanate Substances 0.000 claims description 34
- 229920001228 polyisocyanate Polymers 0.000 claims description 34
- 230000003287 optical effect Effects 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 abstract description 24
- 239000011347 resin Substances 0.000 abstract description 24
- 238000000576 coating method Methods 0.000 abstract description 17
- 238000002156 mixing Methods 0.000 abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 15
- 238000005299 abrasion Methods 0.000 abstract description 5
- 239000011230 binding agent Substances 0.000 abstract description 5
- 239000012948 isocyanate Substances 0.000 abstract description 4
- 150000002513 isocyanates Chemical class 0.000 abstract description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 abstract 1
- 239000010408 film Substances 0.000 description 131
- 239000001993 wax Substances 0.000 description 60
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 39
- 239000000126 substance Substances 0.000 description 28
- 239000000654 additive Substances 0.000 description 26
- -1 polyethylene Polymers 0.000 description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 21
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 17
- 239000004848 polyfunctional curative Substances 0.000 description 17
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 16
- 238000002360 preparation method Methods 0.000 description 15
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 14
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 14
- 239000012046 mixed solvent Substances 0.000 description 14
- 230000000996 additive effect Effects 0.000 description 13
- 238000010790 dilution Methods 0.000 description 13
- 239000012895 dilution Substances 0.000 description 13
- 239000011164 primary particle Substances 0.000 description 13
- 238000001723 curing Methods 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 229920001296 polysiloxane Polymers 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000011859 microparticle Substances 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000006224 matting agent Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000000049 pigment Substances 0.000 description 6
- 229920006267 polyester film Polymers 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000314 lubricant Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 239000000975 dye Substances 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- 239000012169 petroleum derived wax Substances 0.000 description 2
- 235000019381 petroleum wax Nutrition 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- WCOXQTXVACYMLM-UHFFFAOYSA-N 2,3-bis(12-hydroxyoctadecanoyloxy)propyl 12-hydroxyoctadecanoate Chemical compound CCCCCCC(O)CCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCC(O)CCCCCC)COC(=O)CCCCCCCCCCC(O)CCCCCC WCOXQTXVACYMLM-UHFFFAOYSA-N 0.000 description 1
- WAVNYPVYNSIHNC-UHFFFAOYSA-N 2-benzylidenepropanedinitrile Chemical compound N#CC(C#N)=CC1=CC=CC=C1 WAVNYPVYNSIHNC-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Divinylene sulfide Natural products C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UAUDZVJPLUQNMU-UHFFFAOYSA-N Erucasaeureamid Natural products CCCCCCCCC=CCCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004712 Metallocene polyethylene (PE-MC) Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- JMHQPTAFBUVYBA-UHFFFAOYSA-N N=C=O.N=C=O.CC1=CC=CC=C1N Chemical compound N=C=O.N=C=O.CC1=CC=CC=C1N JMHQPTAFBUVYBA-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000004904 UV filter Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000000641 acridinyl group Chemical class C1(=CC=CC2=NC3=CC=CC=C3C=C12)* 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000007759 kiss coating Methods 0.000 description 1
- 239000006233 lamp black Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 229920003087 methylethyl cellulose Polymers 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000012184 mineral wax Substances 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- FATBGEAMYMYZAF-UHFFFAOYSA-N oleicacidamide-heptaglycolether Natural products CCCCCCCCC=CCCCCCCCC(N)=O FATBGEAMYMYZAF-UHFFFAOYSA-N 0.000 description 1
- 150000004893 oxazines Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical class C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- UKXKGTGQIITIAB-UHFFFAOYSA-N spiro[1,3-dihydroindole-2,2'-pyran] Chemical class C1C2=CC=CC=C2NC11OC=CC=C1 UKXKGTGQIITIAB-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000006234 thermal black Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000004897 thiazines Chemical class 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000001834 xanthenyl group Chemical class C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/046—Forming abrasion-resistant coatings; Forming surface-hardening coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
- C08L91/06—Waxes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B9/00—Exposure-making shutters; Diaphragms
- G03B9/02—Diaphragms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B9/00—Exposure-making shutters; Diaphragms
- G03B9/08—Shutters
- G03B9/10—Blade or disc rotating or pivoting about axis normal to its plane
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B9/00—Exposure-making shutters; Diaphragms
- G03B9/08—Shutters
- G03B9/36—Sliding rigid plate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Diaphragms For Cameras (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Shutters For Cameras (AREA)
- Optical Elements Other Than Lenses (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Abstract
Description
本發明係關於遮光性滑動薄膜、遮光性滑動構件及遮光性滑動薄膜用樹脂組成物。The present invention relates to a light-shielding sliding film, a light-shielding sliding member and a resin composition for the light-shielding sliding film.
單眼相機、輕便相機、攝影機等之各種光學機器之快門或光圈構件等中,由將外光所致之光暈或重像產生等予以防止等之觀點而言,係使用具有遮光性之構件。進一步地,此等之遮光構件中,由其使用態樣而言,滑性(滑動性)優良,及低光澤亦為必要。In the shutter and aperture components of various optical devices such as SLR cameras, compact cameras, and video cameras, components with light-shielding properties are used from the viewpoint of preventing halo or ghosting caused by external light. Furthermore, in these light-shielding components, good slip properties and low gloss are also required in terms of their usage.
此外,以往,作為各種光學機器之快門或光圈構件等,係使用對金屬薄膜塗佈有黑色塗料者。但是,近年來,係有探討替代為輕量之塑膠材料。In addition, in the past, as shutters and aperture components of various optical devices, metal films coated with black paint were used. However, in recent years, there has been a study on replacing them with lightweight plastic materials.
作為如此之非金屬製之遮光構件,本申請人提出有將含有黏合劑樹脂、碳黑、聚乙烯蠟等之粒子狀潤滑劑,及吸油量250(g/100g)以上之微粒子的遮光膜,形成於由合成樹脂薄膜所構成的基材上而得之光學機器用遮光構件(參照專利文獻1)。又,本申請人,提出有將含有特定量之黏合劑樹脂、碳黑、粒子狀之潤滑劑,及微粒子的遮光膜,形成於薄膜基材上而得之光學機器用遮光構件(參照專利文獻2)。As such a non-metallic light-shielding member, the present applicant has proposed a light-shielding member for optical devices in which a light-shielding film containing a particulate lubricant such as a binder resin, carbon black, polyethylene wax, and fine particles with an oil absorption of 250 (g/100g) or more is formed on a substrate composed of a synthetic resin film (see Patent Document 1). In addition, the present applicant has proposed a light-shielding member for optical devices in which a light-shielding film containing a specific amount of a binder resin, carbon black, a particulate lubricant, and fine particles is formed on a film substrate (see Patent Document 2).
另一方面,作為黑色度及塗膜強度高之遮光性構件,本申請人提出有於表面經粗面化而成之可剝離的基材之粗面化面上,設置含有黏合劑樹脂及黑色微粒子之遮光層而得之光學機器用遮光構件(參照專利文獻3)。 [先前技術文獻] [專利文獻]On the other hand, as a light-shielding component with high blackness and coating strength, the applicant has proposed a light-shielding component for optical devices, in which a light-shielding layer containing a binder resin and black particles is provided on the roughened surface of a removable substrate (see Patent Document 3). [Prior Art Document] [Patent Document]
[專利文獻1]國際公開第2006/016555號 [專利文獻2]日本特開2011-123255號公報 [專利文獻3]日本特開2012-088499號公報[Patent Document 1] International Publication No. 2006/016555 [Patent Document 2] Japanese Patent Publication No. 2011-123255 [Patent Document 3] Japanese Patent Publication No. 2012-088499
近年來,遮光性滑動薄膜中,不僅滑動性,亦要求耐磨耗性(耐久性)優良。但是,專利文獻1及2記載之光學機器用遮光構件,耐磨耗性尚有改善的餘地。又,此等由於含有二氧化矽等之巨大且硬質的微粒子,故有該微粒子於滑動時容易脫落的問題。進一步地,於滑動時黏合劑樹脂脫落或缺損時,巨大且硬質之微粒子會露出於遮光膜表面。於此,於快門或光圈構件中,通常係採用2枚以上之遮光性滑動薄膜(遮光膜)呈對向配置,相互表面接觸而滑動之結構。此時,露出於一方或雙方之遮光膜表面的巨大且硬質之微粒子,會損傷對向面之遮光性滑動薄膜(遮光膜),因此亦可能產生對向面之遮光性滑動薄膜的耐久性急速惡化之問題。 In recent years, light-shielding sliding films are required to have not only sliding properties but also excellent wear resistance (durability). However, the light-shielding components for optical devices described in Patent Documents 1 and 2 still have room for improvement in wear resistance. In addition, since these contain huge and hard microparticles such as silicon dioxide, there is a problem that the microparticles are easy to fall off during sliding. Furthermore, when the adhesive resin falls off or is damaged during sliding, the huge and hard microparticles will be exposed on the surface of the light-shielding film. Therefore, in shutter or aperture components, a structure is usually adopted in which two or more light-shielding sliding films (light-shielding films) are arranged opposite to each other and slide with their surfaces in contact with each other. At this time, the huge and hard particles exposed on the surface of one or both light-shielding films will damage the light-shielding sliding film (light-shielding film) on the opposite surface, which may also cause the durability of the light-shielding sliding film on the opposite surface to deteriorate rapidly.
另一方面,專利文獻3中,必須使用表面經粗面化之基材薄膜,通用性不佳。又,專利文獻3為指向黑色度及塗膜強度高之遮光性構件者,對於各種光學機器之快門或光圈構件等之滑動構件中所要求的高度之滑動性及耐磨耗性,毫無任何考慮。 On the other hand, Patent Document 3 requires the use of a roughened substrate film, which has poor versatility. In addition, Patent Document 3 is directed to light-shielding components with high blackness and coating strength, and does not take into account the high sliding properties and wear resistance required in sliding components such as shutters or aperture components of various optical devices.
本發明係有鑑於上述課題而為者。亦即本發明之目的為提供塗膜強度及耐磨耗性更加改善之遮光性滑動薄膜,及使用其之遮光性滑動構件,以及可使用於此等之遮光性滑動薄膜用樹脂組成物。 The present invention is made in view of the above-mentioned subject. That is, the purpose of the present invention is to provide a light-shielding sliding film with improved coating strength and wear resistance, a light-shielding sliding component using the same, and a resin composition for the light-shielding sliding film that can be used therefor.
本發明者等人為了解決上述課題努力進行探討。其結果,發現藉由合併使用特定之胺基甲酸酯系黏合劑樹脂、碳黑及粒子狀蠟,會解決上述課題,而完成本發明。 The inventors of the present invention have made great efforts to study and research to solve the above problems. As a result, they found that the above problems can be solved by combining a specific urethane adhesive resin, carbon black and granular wax, thus completing the present invention.
亦即,本發明提供以下(1)~(11)所示之具體的態樣。 That is, the present invention provides the specific aspects shown in the following (1) to (11).
(1)一種遮光性滑動薄膜,其特徵為至少含有多元醇與聚異氰酸酯硬化劑之硬化物的胺基甲酸酯系黏合劑樹脂、碳黑及粒子狀蠟,前述胺基甲酸酯系黏合劑樹脂,係前述多元醇與前述聚異氰酸酯硬化劑之摻合比例,以前述聚異氰酸酯硬化劑所具有之NCO基與前述多元醇所具有之OH基的比率(NCO/OH比)計,為1.21~1.40。 (1) A light-shielding sliding film characterized by comprising at least a polyol and a polyisocyanate curing agent, a urethane adhesive resin, carbon black and a granular wax, wherein the polyol and the polyisocyanate curing agent are mixed in a ratio of 1.21 to 1.40, based on the ratio of the NCO group of the polyisocyanate curing agent to the OH group of the polyol (NCO/OH ratio).
(2)如上述(1)之遮光性滑動薄膜,其實質上不含有平均粒子徑D50為3.0μm以上之無機填料及/或平均粒子徑D50為3.0μm以上之樹脂珠。 (2) The light-shielding sliding film of (1) above does not substantially contain inorganic fillers having an average particle size D50 of 3.0 μm or more and/or resin beads having an average particle size D50 of 3.0 μm or more.
(3)如上述(1)或(2)之遮光性滑動薄膜,其中以固體成分換算,含有60~85質量%之前述胺基甲酸酯系黏合劑樹脂。 (3) The light-shielding sliding film as described in (1) or (2) above, wherein the film contains 60 to 85% by mass of the aforementioned urethane adhesive resin, calculated as solid content.
(4)如上述(1)~(3)中任一項之遮光性滑動薄膜,其中以固體成分換算,含有7.5~18.0質量%之前述碳黑。 (4) A light-shielding sliding film as described in any one of (1) to (3) above, which contains 7.5 to 18.0% by mass of the aforementioned carbon black in terms of solid content.
(5)如上述(1)~(4)中任一項之遮光性滑動薄膜,其中前述碳黑,具有0.01~1.0μm之平均粒子徑D50。 (5) The light-shielding sliding film according to any one of (1) to (4) above, wherein the carbon black has an average particle size D 50 of 0.01 to 1.0 μm.
(6)如上述(1)~(5)中任一項之遮光性滑動薄膜,其中以固體成分換算,含有7.5~18.0質量%之前述粒子狀蠟。 (6) A light-shielding sliding film as described in any one of (1) to (5) above, wherein the film contains 7.5 to 18.0% by mass of the aforementioned particulate wax in terms of solid content.
(7)如上述(1)~(6)中任一項之遮光性滑動薄膜,其中前述粒子狀蠟,具有2~18μm之平均粒子徑D50。 (7) The light-shielding sliding film according to any one of (1) to (6) above, wherein the particulate wax has an average particle size D 50 of 2 to 18 μm.
(8)如上述(1)~(7)中任一項之遮光性滑動薄膜,其具有5.4~6.0之光學密度(OD)。 (8) A light-shielding sliding film as described in any one of (1) to (7) above, having an optical density (OD) of 5.4 to 6.0.
(9)如上述(1)~(8)中任一項之遮光性滑動薄膜,其具有0.5μm以上、30μm以下之厚度。 (9) A light-shielding sliding film as described in any one of (1) to (8) above, having a thickness of not less than 0.5 μm and not more than 30 μm.
(10)一種遮光性滑動構件,其至少具備基材,與設置於前述基材之至少1個以上之表面上的如上述(1)~(9)中任一項之遮光性滑動薄膜。 (10) A light-shielding sliding member, which comprises at least a substrate and a light-shielding sliding film as described in any one of (1) to (9) above, disposed on at least one surface of the substrate.
(11)一種遮光性滑動薄膜用樹脂組成物,其特徵為至少含有多元醇與聚異氰酸酯硬化劑之預聚物、碳黑、粒子狀蠟、溶劑,前述預聚物,係前述多元醇與前述聚異氰酸酯硬化劑之摻合比例,以前述聚異氰酸酯硬化劑所具有之NCO基與前述多元醇所具有之OH基的比率(NCO/OH比)計,為1.21~1.40。 (11) A resin composition for a light-shielding sliding film, characterized by containing at least a prepolymer of a polyol and a polyisocyanate curing agent, carbon black, a granular wax, and a solvent, wherein the prepolymer is a mixture of the polyol and the polyisocyanate curing agent, and the ratio of the NCO group of the polyisocyanate curing agent to the OH group of the polyol (NCO/OH ratio) is 1.21 to 1.40.
依照本發明,可提供塗膜強度及耐磨耗性優良之遮光性滑動薄膜及遮光性滑動構件。該遮光性滑動薄膜等中,不以二氧化矽等之巨大且硬質之粒子為必須成分,因此可相對地提高樹脂成分、碳黑及/或粒子狀蠟等之含有比例。亦即,依照本發明,可提高設計自由度,亦可改善製造時之分散性、製膜性、操作性等。 According to the present invention, a light-shielding sliding film and a light-shielding sliding member with excellent coating strength and wear resistance can be provided. In the light-shielding sliding film, etc., huge and hard particles such as silicon dioxide are not essential components, so the content ratio of resin components, carbon black and/or granular wax can be relatively increased. That is, according to the present invention, the degree of design freedom can be increased, and the dispersibility, film-forming properties, operability, etc. during manufacturing can also be improved.
以下,參照圖式詳細說明本發明之實施形態。再者,上下左右等之位置關係,只要無特別指明,係基於圖式所示之位置關係。又,圖式之尺寸比率,不限定於圖示之比率。惟,以下之實施形態,為用以說明本發明之例示,本發明不限定於此等,可於不脫離其要旨之範圍內任意變更來實施。再者,本說明書中,例如「1~100」之數值範圍的表述,係指包含其上限值「1」及下限值「100」雙方者。又,其他數值範圍之表述亦相同。 The following is a detailed description of the implementation of the present invention with reference to the drawings. Furthermore, the positional relationship of up, down, left, right, etc., unless otherwise specified, is based on the positional relationship shown in the drawings. Furthermore, the dimensional ratio of the drawings is not limited to the ratio shown in the drawings. However, the following implementation forms are examples for illustrating the present invention, and the present invention is not limited to them and can be implemented with any changes within the scope of the gist. Furthermore, in this specification, the expression of a numerical range such as "1~100" refers to the one that includes both the upper limit "1" and the lower limit "100". Moreover, the expression of other numerical ranges is the same.
圖1為示意性顯示本發明之第一實施形態之遮光性滑動構件100及遮光性滑動薄膜21之重要部分的截面圖。遮光性滑動構件100,具備薄片狀之基材11,與設置於該基材11之至少1個以上之表面的遮光性滑動薄膜21。本實施形態中,遮光性滑動薄膜21,係設置於基材11之主面11a及另一方之主面11b的2個部位。
FIG1 is a cross-sectional view schematically showing the important parts of the light-
此處,本說明書中,「設置於基材之表面」,不僅為如本實施形態般於基材11之表面(例如主面11a或主面11b)直接載置遮光性滑動薄膜21的態樣,且為包含於基材11之表面與遮光性滑動薄膜21之間存在任意之層(例如底塗層、接著層等)的態樣之意義。又,本實施形態中,係顯示於基材11之兩面(主面11a上及主面11b)分別設置遮光性滑動薄膜21的態樣,但當然亦可僅於薄片狀之基材11的一方之面(主面11a或主面11b)設置遮光性滑動薄膜21。藉由於基材11之兩面設置遮光性滑動薄膜21,有遮光性滑動構件100之操作性提高的傾向。
Here, in this specification, "arranged on the surface of the substrate" means not only a state where the light-
基材11,只要係可支撐遮光性滑動薄膜21者,其種類並無特殊限定。其具體例子可列舉紙、合成紙、金屬薄片、合金薄片、金屬箔、合成樹脂薄膜及此等之層合體等,但不特別限定於此等。再者,基材11可為具有與遮光性滑動薄膜21之接著性者、亦可為不具有者。不具有與遮光性滑動薄膜21之接著性的基材11,可作為脫模薄膜而發揮功能。由尺寸安定性、機械強度及輕量化等之觀點而言,較佳使用合成樹脂薄膜。
The type of the
合成樹脂薄膜之具體例子,可列舉聚酯薄膜、ABS(丙烯腈-丁二烯-苯乙烯)薄膜、聚醯亞胺薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜等。又,亦可使用丙烯酸系、聚烯烴系、纖維素系、聚碸系、聚苯硫醚系、聚醚碸系、聚醚醚酮系之薄膜。此等之中,作為基材11,尤適宜使用聚酯薄膜。尤以一軸或二軸延伸薄膜,特別是二軸延伸聚酯薄膜,由於機械強度及尺寸安定性優良,故特佳。又,於耐熱用途,特佳為一軸或二軸延伸聚醯亞胺薄膜。
Specific examples of synthetic resin films include polyester films, ABS (acrylonitrile-butadiene-styrene) films, polyimide films, polystyrene films, polycarbonate films, etc. In addition, acrylic, polyolefin, cellulose, polysulfone, polyphenylene sulfide, polyethersulfone, and polyetheretherketone films can also be used. Among these, polyester films are particularly suitable for use as the
基材11之外觀,係透明、半透明、不透明之任意者均可,無特殊限定。例如亦可使用發泡聚酯薄膜等之經發泡的合成樹脂薄膜,或含有碳黑等之黑色顏料或其他顏料之合成樹脂薄膜。更薄且高遮光性為必要時,藉由使用黑色聚酯薄膜等之光學密度高的基材11,亦可補強遮光性滑動構件100全體之光學密度。
The appearance of the
基材11之厚度,可依要求性能及用途而適當設定,並無特殊限定。一般而言係以1μm以上、未達
250μm為標準。此處由遮光性滑動構件100之強度或剛性等之觀點而言,基材11之厚度,較佳為36μm以上、未達250μm。另一方面,由輕量化及薄膜化之觀點而言,基材11之厚度,較佳為1μm以上、50μm以下;更佳為1μm以上、25μm以下,又更佳為4μm以上、10μm以下;特佳為5μm以上、7μm以下。再者,由提高與遮光性滑動薄膜21之接著性的觀點而言,亦可依需要,對基材11表面進行錨定處理或電暈處理等之各種公知之表面處理。
The thickness of the
遮光性滑動薄膜21,至少含有胺基甲酸酯系黏合劑樹脂、碳黑及粒子狀蠟。此處所用之胺基甲酸酯系黏合劑樹脂,為多元醇與聚異氰酸酯硬化劑之硬化物,且為聚異氰酸酯硬化劑所具有之NCO基與多元醇所具有之OH基的比率(NCO/OH比)為1.21~1.40之胺基甲酸酯系樹脂。以下詳述各成分。
The light-shielding sliding
構成胺基甲酸酯系黏合劑樹脂之多元醇,可使用壓克力多元醇、聚酯多元醇、環氧基多元醇、聚醚多元醇等之各種公知者,其種類並無特殊限定。此等之中就膜強度、滑動性、耐磨耗性等之觀點而言,尤以壓克力多元醇、聚酯多元醇、聚醚多元醇為佳;更佳為壓克力多元醇、聚酯多元醇。此等之多元醇,較佳為分子末端具有2個以上之OH基、更佳為3個以上、又更佳為4個以上。OH基會與聚異氰酸酯硬化劑交聯而形成3維之網狀結構,因此分子中較佳為包含較多數之OH基。特別是OH基位於分子末端時,與硬化劑之反應性高,故較佳。又,由得到高 分散性與高耐久性之觀點而言,多元醇亦可依需要具有羧酸基、磺酸基、磷酸基等之極性基。此等可1種單獨,或組合2種以上使用。 Polyols constituting the urethane adhesive resin may be various well-known polyols such as acrylic polyols, polyester polyols, epoxy polyols, and polyether polyols, and the types thereof are not particularly limited. Among these, acrylic polyols, polyester polyols, and polyether polyols are preferred from the viewpoints of film strength, slip, and wear resistance; acrylic polyols and polyester polyols are more preferred. These polyols preferably have two or more OH groups at the molecular ends, more preferably three or more, and even more preferably four or more. The OH groups crosslink with the polyisocyanate hardener to form a three-dimensional network structure, so it is preferred that the molecule contain more OH groups. In particular, when the OH group is located at the molecular end, the reactivity with the hardener is high, so it is preferred. In addition, from the perspective of obtaining high dispersibility and high durability, the polyol may also have polar groups such as carboxylic acid groups, sulfonic acid groups, phosphoric acid groups, etc. as needed. These can be used alone or in combination of two or more.
構成胺基甲酸酯系黏合劑樹脂之聚異氰酸酯硬化劑,可列舉甲苯二異氰酸酯、4,4’-二苯基甲烷二異氰酸酯、六亞甲二異氰酸酯、伸二甲苯二異氰酸酯、萘-1,5-二異氰酸酯、o-甲苯胺二異氰酸酯、異佛酮二異氰酸酯、三苯基甲烷三異氰酸酯等之異氰酸酯類;此等之異氰酸酯類與多元醇之生成物;藉由異氰酸酯類之縮合所生成之聚異氰酸酯等,但不特別限定於此等。聚異氰酸酯硬化劑之市售品,係有Burnock D-750、Burnock DN-950、Burnock DN-980(以上均為商品名、東曹股份有限公司製);Coronate L、Coronate HL、Coronate 2030、Coronate 2031、Millionate MR、Millionate MTL(以上均為商品名、東曹股份有限公司製);Takenate D-102、Takenate D-110N、Takenate D-200、Takenate D-202(以上均為商品名、三井化學股份有限公司製);Desmodur L、Desmodur IL、Desmodur N、Desmodur HL(以上均為商品名、住友Bayer Urethane股份有限公司製)等,可由市場輕易獲得。此等之多元醇,可1種單獨,或組合2種以上使用。此等可1種單獨使用,也可組合2種以上來使用。 Examples of the polyisocyanate curing agent constituting the urethane adhesive resin include isocyanates such as toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, hexamethylene diisocyanate, xylene diisocyanate, naphthalene-1,5-diisocyanate, o-toluidine diisocyanate, isophorone diisocyanate, and triphenylmethane triisocyanate; products of these isocyanates and polyols; and polyisocyanates formed by condensation of isocyanates, but are not particularly limited to these. Commercially available polyisocyanate curing agents include Burnock D-750, Burnock DN-950, Burnock DN-980 (all trade names, manufactured by Tosoh Co., Ltd.); Coronate L, Coronate HL, Coronate 2030, Coronate 2031, Millionate MR, Millionate MTL (all trade names, manufactured by Tosoh Co., Ltd.); Takenate D-102, Takenate D-110N, Takenate D-200, Takenate D-202 (all trade names, manufactured by Mitsui Chemicals Co., Ltd.); Desmodur L, Desmodur IL, Desmodur N, Desmodur HL (all trade names, manufactured by Sumitomo Bayer Urethane Co., Ltd.), etc., which are easily available in the market. These polyols can be used alone or in combination of two or more. These can be used alone or in combination of two or more.
上述之多元醇與聚異氰酸酯硬化劑之摻合比例,聚異氰酸酯硬化劑所具有之NCO基與多元醇所具有之OH基的比率(NCO/OH比),必須為1.21~1.40。由膜強度、滑 動性、耐磨耗性、塗膜形成性、操作性等之觀點而言,較佳為NCO/OH比為1.23~1.39、更佳為NCO/OH比為1.25~1.38。以如此之摻合比例所形成的胺基甲酸酯系黏合劑樹脂,不僅操作性優良,也成為膜強度、滑動性、耐磨耗性之平衡優良者。 The above-mentioned blending ratio of polyol and polyisocyanate hardener, the ratio of NCO group of polyisocyanate hardener to OH group of polyol (NCO/OH ratio), must be 1.21~1.40. From the perspective of film strength, slip, wear resistance, film formation, operability, etc., the preferred NCO/OH ratio is 1.23~1.39, and the more preferred NCO/OH ratio is 1.25~1.38. The urethane adhesive resin formed by such a blending ratio not only has excellent operability, but also has an excellent balance of film strength, slip, and wear resistance.
遮光性滑動薄膜21中之胺基甲酸酯系黏合劑樹脂的含量,並無特殊限定,相對於遮光性滑動薄膜21之總量,以固體成分換算,較佳為60~85質量%、更佳為67~83質量%、又更佳為70~80質量%。藉由使胺基甲酸酯系黏合劑樹脂之含量為上述較佳之範圍內,有容易得到膜強度、滑動性、耐摩耗性等之物性經高維度地平衡的遮光性滑動薄膜21之傾向。尤其藉由使胺基甲酸酯系黏合劑樹脂之含量為較高,有容易提高碳黑或粒子狀蠟之分散性、遮光性滑動薄膜21之製膜性、膜強度、操作性、接著性、滑動性、耐磨耗性等的傾向。
The content of the urethane adhesive resin in the light-shielding sliding
再者,遮光性滑動薄膜21,亦可進一步含有上述胺基甲酸酯系黏合劑樹脂以外之樹脂成分。如此之任意樹脂成分,可列舉聚(甲基)丙烯酸系樹脂、聚酯系樹脂、聚乙酸乙烯酯系樹脂、聚氯乙烯系樹脂、聚乙烯縮丁醛系樹脂、纖維素系樹脂、聚苯乙烯/聚丁二烯樹脂、聚胺基甲酸酯系樹脂、醇酸樹脂、丙烯酸系樹脂、不飽和聚酯系樹脂、環氧酯系樹脂、環氧系樹脂、丙烯酸環氧酯系樹脂、胺基甲酸酯丙烯酸酯系樹脂、聚酯丙烯酸酯系樹脂、聚醚丙烯酸酯系樹脂、酚系樹脂、三聚氰胺系樹脂、尿素系樹脂、鄰苯二甲酸二烯丙酯系樹脂等之熱可塑性樹脂或熱硬化性樹脂,但不特別限定於此等。又,亦可使用熱可塑性彈性體、熱硬化性彈性體、紫外線硬化型樹脂、電子束硬化型樹脂等。此等可1種單獨使用,又,亦可組合2種以上使用。Furthermore, the light-shielding sliding
遮光性滑動薄膜21中所含有之碳黑,為將遮光性滑動薄膜21著色為黑色以賦予遮光性者。碳黑可無特別限制地使用油料爐黑、燈黑、槽黑、天然氣爐黑、乙炔黑、熱碳黑、科琴黑等以各種公知之製法所製作的碳黑。本實施形態中,作為遮光性滑動薄膜21中所含有之碳黑,就對遮光性滑動薄膜21賦予導電性而防止靜電所致之帶電的觀點而言,導電性碳黑較佳。碳黑歷史悠久,例如由三菱化學股份有限公司、旭Carbon股份有限公司、東海Carbon股份有限公司、御國色素股份有限公司、RESINO COLOR公司、Cabot公司、DEGUSSA公司等,有各種等級之碳黑單質及碳黑分散液在市售,只要依所要求性能或用途由此等當中適當選擇即可。此等可1種單獨使用,又,可組合2種以上來使用。The carbon black contained in the light-shielding sliding
此處所使用之碳黑的粒子尺寸,可依要求性能等來適當設定,並無特殊限定。由使遮光性滑動薄膜21之表面光澤度低,且提高滑動性等之觀點而言,碳黑之平均粒子徑D50
,較佳為0.01~1.0μm、更佳為0.05~0.9μm、又更佳為0.08~0.8μm。再者,本說明書中之平均粒子徑,意指以雷射繞射式粒度分布測定裝置(例如島津製作所公司:SALD-7000等)所測定之中位直徑(D50
)。又,50%體積粒子徑(D50
),意指於粒子分布中,粒子之量由小粒子徑側起累積計算而成為50%時的粒子徑。The particle size of the carbon black used here can be appropriately set according to the required performance, etc., and is not particularly limited. From the viewpoint of making the surface gloss of the light-shielding sliding
遮光性滑動薄膜21中之碳黑之含量,並無特殊限定,相對於遮光性滑動薄膜21之總量,以固體成分換算,較佳為7.5~18.0質量%、更佳為8.5~16.5質量%、又更佳為10.0~15.0質量%。藉由使碳黑之含量為上述較佳範圍內,有容易得到遮光性優良之遮光性滑動薄膜21的傾向。又,藉由將胺基甲酸酯系黏合劑樹脂或粒子狀蠟之含量保持為相對地高,有容易提高碳黑或粒子狀蠟之分散性、遮光性滑動薄膜21之製膜性、膜強度、操作性、接著性、滑動性、耐磨耗性等的傾向。The content of carbon black in the light-shielding sliding
再者,遮光性滑動薄膜21,亦可進一步含有上述碳黑以外之黑色顏料或染料。如此之任意成分之黑色顏料,例如可列舉黑色樹脂粒子、鈦黑、磁鐵礦系黑、銅/鐵/錳系黑、鈦黑等,但不特別限定於此等。此等可1種單獨使用,又,亦可組合2種以上使用。又,任意成分之染料,可列舉黑色系、藍色系、綠色系、黃色系、紅色系等之公知染料。具體而言,可列舉二芳基甲烷系;三芳基甲烷系;噻唑系;部花青素、吡唑啉酮次甲基等之次甲基系;靛苯胺(indoaniline)、苯乙酮甲亞胺、吡唑并甲亞胺、咪唑甲亞胺、咪唑并甲亞胺等之甲亞胺(azomethine)系;呫噸系;噁嗪系;二氰基苯乙烯、三氰基苯乙烯等之氰基亞甲基系;噻嗪系;吖嗪系;吖啶系;苯偶氮系;吡啶酮偶氮、噻吩偶氮、異噻唑偶氮、吡咯偶氮、咪唑偶氮、噻二唑偶氮、三唑偶氮、雙偶氮等之偶氮系;螺吡喃系;吲哚啉螺吡喃系;螢光黃母體系;萘醌系;蒽醌系;喹啉黃系等,但不特別限定於此等。此等可1種單獨使用,又,亦可組合2種以上來使用。再者,染料亦可用於控制遮光性滑動薄膜21之色調。Furthermore, the light-shielding sliding
進一步含有上述碳黑以外之黑色顏料時,遮光性滑動薄膜21中之全部黑色顏料(包含碳黑)之含量,並無特殊限定,由分散性、遮光性滑動薄膜21之製膜性、操作性、接著性、滑動性、消光性、耐磨耗性等之觀點而言,相對於遮光性滑動薄膜21中所含有的全部樹脂成分(不含粒子狀蠟)以固體成分換算(phr),較佳為7.5質量%以上、25質量%以下;更佳為8.5質量%以上、23質量%以下;又更佳為10質量%以上、20質量%以下。When the light-shielding sliding
遮光性滑動薄膜21中所含有的粒子狀蠟,為分子量200~10,000且具有40~160℃之熔點的常溫固體之化合物,且為提高遮光性滑動薄膜21之表面的滑動性(滑性),賦予消光性者。遮光性滑動薄膜21藉由含有粒子狀蠟,滑動時之摩擦電阻變小,表面之耐擦傷性提高。作為粒子狀蠟,可使用各種公知之蠟類。蠟類之具體例子,可列舉褐碳蠟、地蠟等之礦物系蠟;石蠟、微晶蠟等之石油系蠟;合成蠟,但不特別限定於此等。此等之中尤以石油系蠟、合成蠟為佳;更佳為合成蠟。此等之蠟類可1種單獨使用,又,亦可組合2種以上來使用。The particulate wax contained in the light-shielding sliding
合成蠟可列舉聚乙烯蠟、聚丙烯蠟等之聚烯烴系蠟;二茂金屬系聚乙烯、二茂金屬系聚丙烯等之二茂金屬蠟;硬脂酸、12-羥基硬脂酸等之脂肪酸系蠟;硬脂酸醯胺、油酸醯胺、芥酸醯胺等之醯胺系蠟;硬脂酸丁酯、硬脂酸單甘油酯等之酯系蠟;Fischer-Tropsch蠟;蓖麻蠟;此等之皂化物;此等之氧化處理物;此等之氟改質物等,但不特別限定於此等。此等之中尤以聚烯烴系蠟、二茂金屬蠟為佳。再者,合成蠟之酸價(mgKOH/g)較佳為0~15,皂化價(mgKOH/g)較佳為0~15。此等可1種單獨使用,又,可組合2種以上使用。Synthetic waxes include polyolefin waxes such as polyethylene wax and polypropylene wax; metallocene waxes such as metallocene polyethylene and metallocene polypropylene; fatty acid waxes such as stearic acid and 12-hydroxystearic acid; amide waxes such as stearamide, oleamide, erucamide; ester waxes such as butyl stearate and monoglyceride stearate; Fischer-Tropsch wax; castor wax; saponified products thereof; oxidized products thereof; fluorinated modified products thereof, but are not particularly limited to these. Among these, polyolefin waxes and metallocene waxes are particularly preferred. Furthermore, the acid value (mgKOH/g) of the synthetic wax is preferably 0-15, and the saponification value (mgKOH/g) is preferably 0-15. These may be used alone or in combination of two or more.
粒子狀蠟之粒子尺寸,可依要求性能等來適當設定,並無特殊限定。由維持遮光性滑動薄膜21之表面光澤度在低水準且提高滑動性等之觀點而言,粒子狀蠟之平均粒子徑D50
,較佳為大於碳黑,具體而言,較佳為2~18μm、更佳為3~17μm、又更佳為4~16μm。The particle size of the granular wax can be appropriately set according to the required performance, etc., and is not particularly limited. From the viewpoint of maintaining the surface gloss of the light-shielding sliding
具有如此之平均粒子徑D50 的粒子狀之蠟的市售品,係有Ceridust 3620(平均粒子徑D50 :7.5~9.5μm)、Ceridust 3610(平均粒子徑D50 :4.5~5.5μm)、Ceridust 3715(平均粒子徑D50 :7.5~9.5μm)、Ceridust 6050M(平均粒子徑D50 :6.5~12.5μm)、Ceridust 9610F(平均粒子徑D50 :7.5~9.5μm)、Ceridust 9630F(平均粒子徑D50 :7.0~9.5μm)、Ceridust 3920F(平均粒子徑D50 :5.0~7.0μm)、Ceridust 3940F(平均粒子徑D50 :12~15μm)、Ceridust 9615A(平均粒子徑D50 :5.5~7.5μm)、Ceridust 3910(平均粒子徑D50 :5.5~7.5μm)、Ceridust 5551(平均粒子徑D50 :7.5~9.5μm)、Ceridust 2051(平均粒子徑D50 :5.5~7.5μm)、Ceridust 8020(平均粒子徑D50 :7.0~9.5μm)、Ceridust 8330TP(平均粒子徑D50 :4.5~6.5μm)、Ceridust 8091TP(平均粒子徑D50 :8μm)、Ceridust 9202F(平均粒子徑D50 :2.0~6.0μm)、Ceridust 9205F(平均粒子徑D50 :5.5~10.5μm)等(以上均為商品名、Clariant Chemicals股份有限公司製),可於市場容易地獲得。Commercially available granular waxes having such an average particle size D 50 include Ceridust 3620 (average particle size D 50 : 7.5-9.5 μm), Ceridust 3610 (average particle size D 50 : 4.5-5.5 μm), Ceridust 3715 (average particle size D 50 : 7.5-9.5 μm), Ceridust 6050M (average particle size D 50 : 6.5-12.5 μm), Ceridust 9610F (average particle size D 50 : 7.5-9.5 μm), Ceridust 9630F (average particle size D 50 : 7.0-9.5 μm), Ceridust 3920F ...3920F (average particle size D 50 : 7.5-9.5 μm), Ceridust 3920F (average particle size D 50 : 7.5-9.5 μm), Ceridust 3920M (average particle size D 50 : 7.5-9.5 μm), Ceridust 3920M (average particle size D 50 : 7.5-9.5 μm), Ceridust 3920M (average :5.0~7.0μm)、Ceridust 3940F(average particle size D 50 :12~15μm)、Ceridust 9615A(average particle size D 50 :5.5~7.5μm)、Ceridust 3910(average particle size D 50 :5.5~7.5μm)、Ceridust 5551(average particle size D 50 :7.5~9.5μm)、Ceridust 2051(average particle size D 50 :5.5~7.5μm)、Ceridust 8020(average particle size D 50 :7.0~9.5μm)、Ceridust 8330TP(average particle size D 50 :4.5~6.5μm)、Ceridust 8091TP(average particle size D 50 : 8μm), Ceridust 9202F (average particle size D 50 : 2.0-6.0μm), Ceridust 9205F (average particle size D 50 : 5.5-10.5μm), etc. (all of the above are trade names, manufactured by Clariant Chemicals Co., Ltd.) and are easily available in the market.
遮光性滑動薄膜21中之粒子狀蠟的含有比例,並無特殊限定,相對於遮光性滑動薄膜21之總量,以固體成分換算,較佳為7.5~18.0質量%、更佳為8.5~16.5質量%、又更佳為10.0~15.0質量%。藉由使粒子狀蠟之含量於上述較佳範圍內,有容易得到滑動性優良之遮光性滑動薄膜21的傾向。又,藉由將胺基甲酸酯系黏合劑樹脂或碳黑之含量保持在相對地高,有容易提高碳黑之分散性、遮光性滑動薄膜21之製膜性、膜強度、遮光性、操作性、接著性、滑動性、耐磨耗性等之傾向。The content ratio of the particulate wax in the light-shielding sliding
再者,遮光性滑動薄膜21,亦可含有消光劑(消光劑)。藉由含有消光劑,可降低遮光性滑動薄膜21之表面的光澤度(鏡面光澤度),提高滑動性或遮光性。該消光劑,可使用公知者。具體而言,可列舉交聯壓克力珠等之有機系微粒子;二氧化矽、滑石、偏矽酸鋁酸鎂、氧化鈦等之無機系微粒子等,但不特別限定於此等。此等之中,就分散性或成本等之觀點,尤以二氧化矽或滑石為佳。此等可1種單獨使用,又,亦可組合2種以上來使用。Furthermore, the light-shielding sliding
另一方面,遮光性滑動薄膜21,較佳為實質上不含有上述胺基甲酸酯系黏合劑樹脂、碳黑及粒子狀蠟以外之巨大且硬質之微粒子。如此之巨大且硬質之微粒子,可列舉平均粒子徑D50
為3.0μm以上、較佳為4.0μm以上、更佳為5.0μm以上之無機填料;平均粒子徑D50
為3.0μm以上、較佳為4.0μm以上、更佳為5.0μm以上之樹脂珠。如此之巨大且硬質之微粒子,於本所屬領域中,係可作為消光劑、潤滑劑、滑動性提高材等而摻合於遮光薄膜者。更具體而言,二氧化矽微粒子、滑石微粒子、偏矽酸鋁酸鎂、氧化鈦等之粒子狀之固體潤滑劑;交聯聚甲基丙烯酸甲酯粒子等之丙烯酸系樹脂珠;交聯聚苯乙烯粒子等之苯乙烯系樹脂珠;聚偏二氟乙烯等之氟樹脂粒子等之氟系樹脂珠等係相當於此。例如藉由使遮光性滑動薄膜21實質上不含有本所屬領域中作為消光劑或潤滑劑所通用之無定形二氧化矽微粒子或丙烯酸系樹脂珠等之巨大且硬質之微粒子,有抑制滑動時之微粒子脫落或對向面之遮光性滑動薄膜耐久性之惡化的傾向。又,可使遮光性滑動薄膜21中之胺基甲酸酯系黏合劑樹脂、碳黑,及粒子狀蠟之相對含量為高,因此有容易提高上述之分散性、製膜性、膜強度、操作性、接著性、滑動性、耐磨耗性等的傾向。再者,本說明書中,實質上不含有,意指相對於遮光性滑動薄膜21之總量,以固體成分換算,巨大且硬質之微粒子之含量為0~3質量%。更佳為0~1質量%、又更佳為0~0.5質量%、特佳為0~0.1質量%。On the other hand, the light-shielding sliding
再者,遮光性滑動薄膜21,亦可進一步含有其他成分。該其他成分,可列舉導電劑、阻燃劑、抗菌劑、防黴劑、抗氧化劑、可塑劑、調平劑、流動調整劑、消泡劑、分散劑等,但不特別限定於此等。此等之含有比例並無特殊限定,相對於遮光性滑動薄膜21中所含有的全部樹脂成分,以固體成分換算,一般而言較佳分別為0.01~5質量%。Furthermore, the light-shielding sliding
遮光性滑動薄膜21之厚度,可依要求性能及用途而適當設定,並無特殊限定,較佳為0.5μm以上、30μm以下;更佳為1μm以上、20μm以下;又更佳為3μm以上、10μm以下。The thickness of the light-shielding sliding
又,遮光性滑動薄膜21,表面光澤度較佳為未達15%。如此地表面光澤度為低時,有入射光之反射變少,光吸收性提高的傾向。遮光性滑動薄膜21之表面光澤度,更佳為未達10%。 再者,本說明書中,表面光澤度,意指根據JIS-Z8741:1997所測定之60度表面光澤度(G60表面光澤度)。Furthermore, the surface gloss of the light-shielding sliding
進一步地,遮光性滑動薄膜21,由具備充分的抗靜電性能之觀點而言,表面電阻率較佳為未達1.0×1010
Ω、更佳為未達1.0×109
Ω、又更佳為未達1.0×108
Ω。再者,本說明書中,表面電阻率,為根據JIS-K6911:1995所測定之值。Furthermore, from the viewpoint of having sufficient antistatic performance, the surface resistivity of the light-shielding sliding
進一步地,遮光性滑動薄膜21,由具備充分的遮光性之觀點而言,較佳為具有5.4~6.0之光學密度(OD)、更佳為5.5~6.0。又,同樣地,遮光性滑動構件100,由具備充分的遮光性之觀點而言,較佳為具有5.4~6.0之光學密度(OD)、更佳為5.5~6.0。再者,本說明書中,光學密度(OD)為根據JIS-K7651:1988所測定之值。Furthermore, the light-shielding sliding
本實施形態之遮光性滑動構件100及遮光性滑動薄膜21之製造方法,只要可得到上述構成及組成者,則無特殊限定。由再現性良好、簡易地且以低成本製造所期望之遮光性滑動薄膜21的觀點而言,可適合使用軋刀塗佈(doctor coating)、浸漬塗佈、輥塗佈、棒塗佈、模塗佈、刮刀塗佈(blade coating)、氣刀塗佈、吻合塗佈(kiss coating)、噴霧塗佈、旋轉塗佈等之以往公知之塗佈方法。The manufacturing method of the light-
例如,可將於溶劑中含有作為上述胺基甲酸酯系黏合劑樹脂之前驅物的預聚物、碳黑,及粒子狀蠟,以及依需要摻合之任意成分的塗佈液,塗佈於基材11之單面或兩面,使其乾燥後,依需要進行熱處理或加壓處理等,藉以於基材11上將遮光性滑動薄膜21製膜。此處所使用之塗佈液的溶劑,可使用水;甲基乙基酮、甲基異丁基酮、環己酮等之酮系溶劑;乙酸甲酯、乙酸乙酯、乙酸丁酯等之酯系溶劑;甲基賽珞蘇、乙基賽珞蘇等之醚系溶劑;甲醇、乙醇、異丙醇等之醇系溶劑;以及此等之混合溶劑等。又,亦可預先調製僅含有上述多元醇及聚異氰酸酯硬化劑之一方的塗佈液,以取代作為前驅物之預聚物,於膜形成時摻合此等中之另一方。再者,為了提高基材11與遮光性滑動薄膜21之接著,亦可依需要進行錨定處理或電暈處理等。進一步地,亦可依需要,於基材11與遮光性滑動薄膜21之間設置接著層等之中間層。For example, a coating liquid containing a prepolymer, carbon black, and granular wax as a pre-driving agent for the urethane adhesive resin, and any other optional components as needed in a solvent can be applied to one or both sides of the
再者,本實施形態中,係顯示於基材11上設置遮光性滑動薄膜21之層合結構的遮光性滑動構件100,但本發明亦能夠以省略了基材11之態樣來實施。例如,藉由將上述基材11由遮光性滑動構件100剝離,可容易地得到單層結構之遮光性滑動薄膜21。Furthermore, in this embodiment, the light-
又,上述塗佈液,可作為可再現性良好而簡便地得到遮光性滑動構件100及遮光性滑動薄膜21的樹脂組成物,作為本發明之一態樣而有效地實施。藉由使用該樹脂組成物,以熱成形、壓縮成形、射出成形、吹塑成形、轉移成形、擠出成形等之各種公知之成形方法成形為所期望形狀,可簡易地得到具有所期望形狀之遮光性滑動構件。又,一旦成形為薄片狀後,亦可進行真空成形或壓空成形等。Furthermore, the coating liquid can be effectively implemented as a resin composition that can easily and reproducibly obtain the light-
本發明之遮光性滑動構件及遮光性滑動薄膜中,藉由合併使用特定之NCO/OH比之胺基甲酸酯系黏合劑樹脂與粒子狀蠟,提高了膜強度及耐磨耗性,即使不含有二氧化矽等之巨大且硬質之粒子作為必須成分亦可。因此,以往產生之巨大且硬質之粒子滑動時的脫落或露出所致之問題被防止。又,與此同時地,必須成分,例如胺基甲酸酯系黏合劑樹脂、碳黑及粒子狀蠟等之缺損或脫落亦被抑制。此外,伴隨著省略或減少二氧化矽等之巨大且硬質之粒子的摻合,可相對地提高胺基甲酸酯系黏合劑樹脂、碳黑及/或粒子狀蠟等之含有比例。推測此等合力的結果,可得到兼備高滑動性及高耐磨耗性之遮光性滑動薄膜及遮光性滑動構件。惟本發明之作用不限定於此等。In the light-shielding sliding member and light-shielding sliding film of the present invention, by combining a urethane adhesive resin and a granular wax with a specific NCO/OH ratio, the film strength and wear resistance are improved, even if huge and hard particles such as silica are not contained as essential components. Therefore, the problems caused by the falling off or exposure of huge and hard particles during sliding that have occurred in the past are prevented. At the same time, the defects or falling off of essential components such as urethane adhesive resins, carbon black and granular wax are also suppressed. In addition, along with the omission or reduction of the admixture of huge and hard particles such as silica, the content ratio of urethane adhesive resins, carbon black and/or granular wax can be relatively increased. It is estimated that as a result of these combined forces, a light-shielding sliding film and a light-shielding sliding member having both high sliding properties and high wear resistance can be obtained. However, the effects of the present invention are not limited to these.
如以上所詳述,本發明之遮光性滑動構件及遮光性滑動薄膜,可於要求滑動性及耐磨耗性之用途,廣泛且有效地利用。尤其,本發明之遮光性滑動構件及遮光性滑動薄膜,作為於精密機械領域、半導體領域、光學機器領域等之高性能遮光性滑動素材的利用價值高,可特別適合使用作為高性能單眼相機、輕便相機、攝影機、行動電話、投影機等之各種光學機器之滑動構件,例如快門、光圈構件。 [實施例]As described above, the light-shielding sliding member and light-shielding sliding film of the present invention can be widely and effectively used in applications requiring sliding properties and wear resistance. In particular, the light-shielding sliding member and light-shielding sliding film of the present invention have high utilization value as high-performance light-shielding sliding materials in the fields of precision machinery, semiconductors, and optical machines, and can be particularly suitable for use as sliding members, such as shutter and aperture members, of various optical machines such as high-performance SLR cameras, compact cameras, video cameras, mobile phones, and projectors. [Examples]
以下,列舉實施例及比較例,以詳細說明本發明,但本發明不受此等實施例之任何限定。本發明,只要係不脫離本發明之要旨,且會達成本發明之目的,可採用各種之條件。再者,以下只要無特別指明,「份」表示「質量份」。The following examples and comparative examples are given to illustrate the present invention in detail, but the present invention is not limited to these examples. The present invention can adopt various conditions as long as they do not deviate from the gist of the present invention and can achieve the purpose of the present invention. In addition, unless otherwise specified, "part" means "part by mass".
[樹脂組成物(塗佈液)之調製] (調製例1) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:29.8質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.23)73.6質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 13.2質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 13.2質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)[Preparation of resin composition (coating liquid)] (Preparation Example 1) A resin composition having the following blending composition was prepared (solid content concentration: 29.8% by mass). ・Urethane adhesive resin (NCO/OH ratio: 1.23) 73.6 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 13.2 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 13.2 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(調製例2) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:29.8質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.30)73.6質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 13.2質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 13.2質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Preparation Example 2) A resin composition having the following blending composition was prepared (solid content: 29.8% by mass). ・Urethane adhesive resin (NCO/OH ratio: 1.30) 73.6 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 13.2 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 13.2 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(調製例3) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:29.4質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.37)73.6質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 13.2質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 13.2質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Preparation Example 3) A resin composition having the following blending composition was prepared (solid content: 29.4 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.37) 73.6 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 13.2 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 13.2 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(調製例4) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:29.5質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.40)73.6質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 13.2質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 13.2質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Preparation Example 4) A resin composition having the following blending composition was prepared (solid content: 29.5 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.40) 73.6 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 13.2 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 13.2 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(調製例5) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:28.3質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.37)82.0質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 9.0質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 9.0質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Preparation Example 5) A resin composition having the following blending composition was prepared (solid content: 28.3 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.37) 82.0 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 9.0 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 9.0 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(調製例6) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:28.5質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.37)65.0質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 17.5質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 17.5質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Preparation Example 6) A resin composition having the following blending composition was prepared (solid content: 28.5 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.37) 65.0 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 17.5 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 17.5 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(調製例7) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:28.2質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.37)77.7質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 8.3質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 14.0質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Preparation Example 7) A resin composition having the following blending composition was prepared (solid content: 28.2 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.37) 77.7 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 8.3 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 14.0 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(調製例8) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:28.4質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.37)83.2質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 8.4質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 8.4質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Preparation Example 8) A resin composition having the following blending composition was prepared (solid content: 28.4 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.37) 83.2 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 8.4 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 8.4 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(比較調製例1) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:29.7質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.20)72.0質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 12.9質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 12.9質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・二氧化矽 2.2質量份 (ACEMATT TS100、Evonik Degussa Japan製、平均粒徑4μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Comparative Preparation Example 1) A resin composition having the following blending composition was prepared (solid content: 29.7 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.20) 72.0 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 12.9 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Partial wax 12.9 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・Silica 2.2 parts by mass (ACEMATT TS100, Evonik Degussa Japan, average particle size 4μm) ・Leveling agent 0.2 parts by mass (polysilicone additive M-ADDITIVE: Toray Dow Corning Co., Ltd.) ・Dilution solvent (MEK: toluene: butyl acetate = 4:3:3 mixed solvent)
(比較調製例2) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:30.0質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.42)72.0質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 12.9質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 12.9質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・二氧化矽 2.2質量份 (ACEMATT TS100、Evonik Degussa Japan製、平均粒徑4μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Comparative Preparation Example 2) A resin composition having the following blending composition was prepared (solid content: 30.0 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.42) 72.0 parts by mass Acrylic polyol component (Acrydic A804: DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 12.9 parts by mass (Vulcan XC-72R: Cabot, average primary particle size 30nm, aggregate particle size 0.4μm) ・Partial wax 12.9 parts by mass (Ceridust 3620: Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・Silica 2.2 parts by mass (ACEMATT TS100, Evonik Degussa Japan, average particle size 4μm) ・Leveling agent 0.2 parts by mass (polysilicone additive M-ADDITIVE: Toray Dow Corning Co., Ltd.) ・Dilution solvent (MEK: toluene: butyl acetate = 4:3:3 mixed solvent)
(比較調製例3) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:29.7質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.20)73.6質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 13.2質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 13.2質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Comparative Preparation Example 3) A resin composition having the following blending composition was prepared (solid content: 29.7% by mass). ・Urethane adhesive resin (NCO/OH ratio: 1.20) 73.6 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 13.2 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 13.2 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(比較調製例4) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:29.5質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.00)73.6質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate D110N:三井化學公司製、NCO價:11.5、固體成分:75質量%) ・碳黑 13.2質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 13.2質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Comparative Preparation Example 4) A resin composition having the following blending composition was prepared (solid content: 29.5 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.00) 73.6 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate D110N: manufactured by Mitsui Chemicals, NCO value: 11.5, solid content: 75% by mass) ・Carbon black 13.2 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Particulate wax 13.2 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・0.2 parts by weight of leveling agent (M-ADDITIVE, a silicone additive manufactured by Dow Corning Toray Co., Ltd.) ・Dilution solvent (a mixed solvent of MEK: toluene: butyl acetate = 4:3:3)
(比較調製例5) 調製以下所示摻合組成之樹脂組成物(固體成分濃度:40.4質量%)。 ・胺基甲酸酯系黏合劑樹脂(NCO/OH比:1.01)72.6質量份 壓克力多元醇成分 (Acrydic A804:DIC公司製、OH價:40、固體成分:50質量%) 聚異氰酸酯硬化劑成分 (Takenate DN980:三井化學公司製、NCO價:15.5、固體成分:75質量%) ・碳黑 13.4質量份 (Vulcan XC-72R:Cabot公司製、平均一次粒子徑30nm、凝集體粒子徑0.4μm) ・粒子狀蠟 9.5質量份 (Ceridust 3620:Clariant Chemicals公司製、平均粒子徑D50 :7.5~9.5μm) ・消光劑 4.5質量份 (ACEMATT TS100、Evonik Degussa Japan製、平均粒徑4μm) ・調平劑 0.2質量份 (聚矽氧系添加劑M-ADDITIVE:東麗道康寧公司製) ・稀釋溶劑 (MEK:甲苯:乙酸丁酯=4:3:3之混合溶劑)(Comparative Preparation Example 5) A resin composition having the following blending composition was prepared (solid content: 40.4 mass %). ・Urethane adhesive resin (NCO/OH ratio: 1.01) 72.6 parts by mass Acrylic polyol component (Acrydic A804: manufactured by DIC, OH value: 40, solid content: 50% by mass) Polyisocyanate hardener component (Takenate DN980: manufactured by Mitsui Chemicals, NCO value: 15.5, solid content: 75% by mass) ・Carbon black 13.4 parts by mass (Vulcan XC-72R: manufactured by Cabot Corporation, average primary particle size 30nm, aggregate particle size 0.4μm) ・Partial wax 9.5 parts by mass (Ceridust 3620: manufactured by Clariant Chemicals, average particle size D50 : 7.5~9.5μm) ・Matting agent 4.5 parts by mass (ACEMATT TS100, Evonik Degussa Japan, average particle size 4μm) ・Leveling agent 0.2 parts by mass (polysilicone additive M-ADDITIVE: Toray Dow Corning Co., Ltd.) ・Dilution solvent (MEK: toluene: butyl acetate = 4:3:3 mixed solvent)
(實施例1~8、及比較例1~5) 使用上述調製例1~8及比較調製例1~5之樹脂組成物,分別製作實施例1~8及比較例1~5之遮光性滑動構件。此處,於作為基材之厚度6μm之聚酯薄膜(K200:三菱化學聚酯公司)兩面,藉由棒塗佈法,以乾燥後之厚度成為3μm的方式,各塗佈上述樹脂組成物,並進行乾燥,於基材兩面各形成厚度3μm之遮光性滑動薄膜,藉以分別製作遮光性滑動構件。各自之摻合組成示於表1。(Examples 1 to 8, and Comparative Examples 1 to 5) The resin compositions of the above-mentioned Preparation Examples 1 to 8 and Comparative Examples 1 to 5 are used to prepare light-shielding sliding components of Examples 1 to 8 and Comparative Examples 1 to 5, respectively. Here, the above-mentioned resin compositions are applied to both sides of a 6μm thick polyester film (K200: Mitsubishi Chemical Polyester Co., Ltd.) as a substrate by a rod coating method in such a manner that the thickness after drying becomes 3μm, and then dried to form a light-shielding sliding film with a thickness of 3μm on both sides of the substrate, thereby preparing light-shielding sliding components. The respective blending compositions are shown in Table 1.
[評估方法及評估基準] 對於所得之遮光性滑動構件,進行各物性之測定及評估。表1顯示評估結果。再者,各自之物性的評估方法及評估基準係如以下所述。[Evaluation method and evaluation criteria] For the obtained light-shielding sliding member, various physical properties were measured and evaluated. Table 1 shows the evaluation results. In addition, the evaluation method and evaluation criteria of each physical property are as described below.
<G60表面光澤度> 使用數位變角光澤計(UGV-5K:Suga試驗機公司製),根據JIS-Z8741:1997,測定於入射受光角60°之遮光性滑動薄膜表面的表面光澤度(鏡面光澤度)(%),由以下基準判斷。 未達10% ◎ 未達15% ○<G60 Surface Gloss> Using a digital angular gloss meter (UGV-5K: manufactured by Suga Testing Instruments Co., Ltd.), the surface gloss (mirror gloss) (%) of the light-shielding sliding film surface at an incident angle of 60° was measured according to JIS-Z8741:1997 and judged according to the following criteria. Less than 10% ◎ Less than 15% ○
<表面電阻率> 根據JIS K6911:1995測定遮光性滑動薄膜之表面電阻率(Ω),由以下基準判斷。 未達1.0×108 Ω ◎ 未達1.0×109 Ω ○ 未達1.0×1010 Ω △<Surface resistivity> The surface resistivity (Ω) of the light-shielding sliding film was measured in accordance with JIS K6911:1995 and judged according to the following criteria: Less than 1.0×10 8 Ω ◎ Less than 1.0×10 9 Ω ○ Less than 1.0×10 10 Ω △
<光學密度OD> 根據JIS-K7651:1988,使用光學密度計(TD-904:GretagMacbeth公司)測定光學機器用遮光部之光學密度。再者,測定係使用UV濾光片。 6.0以上 ○<Optical density OD> According to JIS-K7651:1988, the optical density of the light-shielding part of the optical device is measured using an optical densitometer (TD-904: GretagMacbeth). In addition, the measurement is performed using a UV filter. 6.0 or more ○
<接著性> 基於JIS-K5400:1990之棋盤膠帶法進行測定來評估。 100個中,100個殘存 ◎ 100個中,99個以下殘存 ○<Adhesion> Evaluated based on the checkerboard tape method of JIS-K5400:1990. 100 pieces out of 100 remain ◎ 99 pieces out of 100 remain ○
<塗膜強度> 根據JIS-K5400之鉛筆刮擦試驗,使用表面測定機(HEIDON-14:新東科學公司製),在施加1000g之荷重下使特定硬度之鉛筆以0.5mm/秒之速度移動,測定於遮光性滑動薄膜不產生破裂(傷痕亦OK)之鉛筆硬度的極限。 H以上 ◎ 6B以上且未達H ○ 未達6B ×<Coating Strength> According to the pencil scratch test of JIS-K5400, a surface measuring machine (HEIDON-14: manufactured by Shinto Science Co., Ltd.) is used to move a pencil of a specific hardness at a speed of 0.5mm/sec under a load of 1000g, and the limit of pencil hardness that does not cause cracks in the light-shielding sliding film (scratches are also OK) is measured. H or above ◎ 6B or above and less than H ○ Less than 6B ×
<滑動性> 根據JIS-K7125:1999,於荷重200(g)、速度100(mm/min)之條件下測定遮光性滑動薄膜之靜摩擦係數(μs)與動摩擦係數(μk),分別由以下基準評估。 靜摩擦係數(μs) 未達0.25 ◎ 0.25以上且未達0.30 ○ 0.30以上且未達0.35 △ 0.35以上 × 動摩擦係數(μk) 未達0.25 ◎ 0.25以上且未達0.30 ○ 0.30以上且未達0.35 △ 0.35以上 × 靜摩擦係數與動摩擦係數之差(μk) 0.02以下 ◎ 0.02以上且未達0.04 ○ 0.04以上 ×<Sliding property> According to JIS-K7125:1999, the static friction coefficient (μs) and dynamic friction coefficient (μk) of the light-shielding sliding film were measured under the conditions of load 200 (g) and speed 100 (mm/min), and evaluated according to the following standards. Static friction coefficient (μs) Less than 0.25 ◎ 0.25 or more and less than 0.30 ○ 0.30 or more and less than 0.35 △ 0.35 or more × Dynamic friction coefficient (μk) Less than 0.25 ◎ 0.25 or more and less than 0.30 ○ 0.30 or more and less than 0.35 △ 0.35 or more × Difference between static friction coefficient and dynamic friction coefficient (μk) Less than 0.02 ◎ 0.02 or more and less than 0.04 ○ 0.04 or more ×
<耐磨耗性> 於磨耗試驗機(NUS-ISO-1)之可動部與固定部,分別設置光學機器用遮光構件之樣品片,以荷重300g進行來回滑動,以進行磨耗試驗。一邊以目視觀察設置於固定部之樣品片表面(遮光性滑動薄膜表面)的傷痕產生狀況,一邊計算至無法使用為止的來回次數。 200次以上 ◎ 150次以上且未達200次 ○<Abrasion resistance> In the movable part and fixed part of the abrasion tester (NUS-ISO-1), set the sample pieces of light-shielding components for optical instruments, respectively, and slide them back and forth with a load of 300g to perform the abrasion test. While visually observing the scratches on the surface of the sample piece set in the fixed part (the surface of the light-shielding sliding film), calculate the number of back and forth movements until it becomes unusable. More than 200 times ◎ More than 150 times and less than 200 times ○
[產業上之可利用性] [Industrial Availability]
本發明可於要求滑動性及耐磨耗性之用途,例如精密機械領域、半導體領域、光學機器領域等中,作為高性能之遮光性滑動構件廣泛且有效地利用。尤其可特別有效地利用作為高性能單眼相機、輕便相機、攝影機、行動電話、智慧型手機、PDA資訊終端機、投影機等之各種光學機器之滑動構件,例如快門或光圈構件。The present invention can be widely and effectively used as a high-performance light-shielding sliding member in applications requiring sliding properties and wear resistance, such as in the fields of precision machinery, semiconductors, and optical machines. In particular, it can be particularly effectively used as a sliding member, such as a shutter or aperture member, of various optical machines such as high-performance SLR cameras, compact cameras, video cameras, mobile phones, smart phones, PDA information terminals, and projectors.
100‧‧‧遮光性滑動構件11‧‧‧基材11a‧‧‧表面(主面)11b‧‧‧表面(主面)21‧‧‧遮光性滑動薄膜100‧‧‧Light-shielding sliding
[圖1]示意性顯示一實施形態之遮光性滑動構件及遮光性滑動薄膜的截面圖。[Fig. 1] A cross-sectional view schematically showing a light-shielding sliding member and a light-shielding sliding film in one embodiment.
100‧‧‧遮光性滑動構件 100‧‧‧Light-shielding sliding member
11‧‧‧基材 11‧‧‧Base material
11a‧‧‧表面(主面) 11a‧‧‧Surface (main surface)
11b‧‧‧表面(主面) 11b‧‧‧Surface (main surface)
21‧‧‧遮光性滑動薄膜 21‧‧‧Light-shielding sliding film
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| KR20250033338A (en) * | 2019-08-09 | 2025-03-07 | 주식회사 다이셀 | Light-shielding film and method for producing light-shielding film |
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| EP4251421A4 (en) | 2020-11-26 | 2024-10-23 | 3M Innovative Properties Company | LAMINATE COMPRISING SURFACE LAYER HAVING SCRATCH RESISTANCE AND MATTE PROPERTIES AND SURFACE COATING COMPOSITION |
| JP7202495B1 (en) | 2022-06-06 | 2023-01-11 | 大日精化工業株式会社 | Aqueous varnish composition, kit, article with printed layer and method for producing the same |
| CN116656227B (en) * | 2023-05-22 | 2025-07-11 | 中山市永鑫电子科技有限公司 | Extinction coating, preparation method thereof and shading film for optical instrument |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016186097A1 (en) * | 2015-05-21 | 2016-11-24 | 株式会社きもと | Light-shielding member, black resin composition, and black resin molded product |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1058444C (en) * | 1994-03-31 | 2000-11-15 | 苏马吕株式会社 | Light blocking film |
| JP4386919B2 (en) * | 2004-08-10 | 2009-12-16 | 株式会社きもと | Light shielding member for optical equipment |
| WO2008156006A1 (en) * | 2007-06-20 | 2008-12-24 | Kimoto Co., Ltd. | Light shielding member for optical instrument |
| JP2011123255A (en) * | 2009-12-10 | 2011-06-23 | Kimoto & Co Ltd | Light-blocking member for use in optical equipment |
| WO2012005148A1 (en) * | 2010-07-09 | 2012-01-12 | 株式会社 きもと | Light-blocking member for optical instrument |
| JP2012088499A (en) | 2010-10-19 | 2012-05-10 | Kimoto & Co Ltd | Light-shielding member for optical instrument, and method for manufacturing optical instrument using the same |
| US10100195B2 (en) * | 2013-06-07 | 2018-10-16 | Kaneka Corporation | Curable resin composition, structural adhesive, coating material or fiber reinforced composite material using the same, foam body using the same, laminate using the same, and cured material thereof |
| JP6361235B2 (en) * | 2014-03-31 | 2018-07-25 | 大日本印刷株式会社 | Shielding sheet, and back surface protection sheet for solar cell module and solar cell module using the same |
| JP2015209538A (en) * | 2014-04-30 | 2015-11-24 | バンドー化学株式会社 | Optical transparent adhesive sheet |
-
2016
- 2016-12-14 JP JP2016242641A patent/JP6867793B2/en active Active
-
2017
- 2017-11-24 WO PCT/JP2017/042261 patent/WO2018110251A1/en not_active Ceased
- 2017-11-24 CN CN201780077213.6A patent/CN110073249B/en active Active
- 2017-11-24 KR KR1020197017329A patent/KR102518423B1/en active Active
- 2017-12-04 TW TW106142328A patent/TWI839324B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016186097A1 (en) * | 2015-05-21 | 2016-11-24 | 株式会社きもと | Light-shielding member, black resin composition, and black resin molded product |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6867793B2 (en) | 2021-05-12 |
| JP2018097208A (en) | 2018-06-21 |
| KR102518423B1 (en) | 2023-04-04 |
| TW201840711A (en) | 2018-11-16 |
| CN110073249A (en) | 2019-07-30 |
| WO2018110251A1 (en) | 2018-06-21 |
| KR20190092443A (en) | 2019-08-07 |
| CN110073249B (en) | 2022-06-17 |
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