TWI837052B - Splicing display and manufacturing method thereof - Google Patents

Abstract

A splicing display comprises a substrate, a conductive wire, at least two adhesive members, at least two light emitting diode display panels, and a conductive member. The conductive wire is located on the main board. Said at least two adhesive members are spaced on the substrate and cover at least part of the conductive wires. Said at least two light emitting diode display panels, each of them is located on said at least two adhesive members, and each of them contains a conductive portion and a side surface, said at least two light emitting diode display panels with their respective side surfaces facing each other. The conductive member electrically connects the conductive wire and the conductive portion of each of said at least two light emitting diode display panels and contacts the respective side surfaces of said at least two light emitting diode display panels.

Description

Spliced display and manufacturing method

The present invention relates to a spliced display and a manufacturing method thereof.

Due to the limitation of mass transfer technology, the current Micro light emitting diode (Micro LED) panel can only transfer smaller LED panels. For large-size applications, it is necessary to splice multiple small panels onto a printed circuit board (PCB). However, this structure is complex and requires a large number of components and connections between hard and soft boards, resulting in relatively high production costs.

At present, the methods to achieve seamless splicing are mostly to use the splicing of glass panels with glass perforation (TGV) technology or the side wiring (Side Wire) technology to arrange wiring along the front, side and back of the glass substrate. , but these glass processing technologies are not only difficult to produce, but also expensive.

In view of the above, the present invention provides a spliced display and a manufacturing method thereof.

According to an embodiment of the present invention, a spliced display comprises a substrate, a conductive wire, at least two adhesives, at least two LED display panels and a conductive member. The conductive wire is arranged on the substrate. The at least two adhesives are arranged on the substrate at intervals and cover at least a portion of the conductive wire. The at least two LED display panels are arranged on the at least two adhesives respectively, and each comprises a conductive portion and a side surface, and the side surfaces of the at least two LED display panels face each other. The conductive member electrically connects the conductive wire and the conductive portions of the at least two LED display panels, and contacts the side surfaces of the at least two LED display panels.

According to an embodiment of the present invention, a spliced display manufacturing method comprises: providing a substrate provided with a conductive line; placing the at least two LED display panels on the substrate at intervals through the at least two adhesives to cover at least a portion of the conductive line; and placing a conductive member, wherein the conductive member electrically connects the conductive line and the conductive portions of the at least two LED display panels, and contacts the sides of the at least two LED display panels facing each other.

Through the above structure, the spliced display and its manufacturing method disclosed in this case can reduce the electrical difference between different display panels through the conductive parts between the splicing seams, thereby improving the quality of the spliced display screen. Compared with the technology of glass perforation or side wiring, the spliced display and its manufacturing method disclosed in this case can have a simpler process and lower production cost.

The above description of the present disclosure and the following description of the embodiments are used to demonstrate and explain the spirit and principles of the present invention, and to provide further explanation of the patent application scope of the present invention.

1,1’: Spliced display

11: Substrate

12: Conductive wire

121: Conductive wire

13,13’: Adhesive parts

14,14’: LED display panel

141:Subbase

142: Substrate film layer

143,143’: Conductive part

1431:Conductive sub-part

144: Light-emitting element

145:Encapsulation layer

15,15’: Conductive parts

151:Conductive electronic parts

16:Driver

17: Connect the soft board

18:Printed circuit board

19: Control chip

20: Mask

s1,s2,s3: Setting surface

d:Interval

S101, S102, S103, S201, S202, S203, S301, S302, S303: Steps

FIG. 1 is a schematic cross-sectional view of a spliced display according to an embodiment of the present invention.

Figure 2 is a cross-sectional schematic diagram of a spliced display according to another embodiment of the present invention.

FIG3 is a flow chart of a spliced display manufacturing method according to an embodiment of the present invention.

FIG4 is a flow chart of a spliced display manufacturing method according to an embodiment of the present invention, in which at least two LED display panels are spaced apart on a substrate.

FIG5 is a flow chart of a spliced display manufacturing method according to another embodiment of the present invention, in which at least two LED display panels are spaced apart on a substrate.

FIG6A is a schematic diagram of placing an adhesive on a light-emitting diode display panel in a spliced display manufacturing method according to an embodiment of the present invention.

FIG. 6B is a schematic diagram illustrating adhesive members spaced on a substrate in a spliced display manufacturing method according to an embodiment of the present invention.

FIG. 6C is a top view of a conductive member provided in a manufacturing method of a spliced display according to an embodiment of the present invention.

The detailed features and advantages of the present invention are described in detail in the following implementation method. The content is sufficient for anyone familiar with the relevant technology to understand the technical content of the present invention and implement it accordingly. According to the content disclosed in this specification, the scope of the patent application and the drawings, anyone familiar with the relevant technology can easily understand the relevant purposes and advantages of the present invention. The following embodiments are to further illustrate the viewpoints of the present invention, but do not limit the scope of the present invention by any viewpoint.

Please refer to FIG. 1, which is a cross-sectional schematic diagram of a spliced display according to an embodiment of the present invention. As shown in FIG. 1, the spliced display 1 includes a substrate 11, a conductive wire 12, at least two adhesives 13, at least two light-emitting diode display panels 14, a conductive member 15, a driver 16, a connecting soft board 17, a printed circuit board 18 and a control chip 19.

The substrate 11 is used as a carrier of the spliced display 1 . Specifically, the substrate 11 can be used to carry conductive lines 12, the at least two adhesive members 13, the at least two light-emitting diode display panels 14, the conductive members 15, the driver 16, the connecting flexible board 17, and the printed circuit board. 18 and control chip 19. For example, the substrate 11 may be a glass substrate.

The conductive wire 12 is disposed on the substrate 11. Specifically, the conductive wire 12 can be made of a conductive material such as metal.

The at least two adhesive members 13 are spaced apart on the substrate 11 and cover at least a part of the conductive line 12 . For example, the adhesive member 13 can be made of adhesive materials such as optical glue, double-sided tape, and water glue.

The at least two light-emitting diode display panels 14 are respectively disposed on the at least two adhesive members 13, and each includes a conductive portion 143 and a side surface s1. The side surfaces s1 of the at least two light-emitting diode display panels 14 face each other. . In other words, each of the at least two light-emitting diode display panels 14 is disposed on the substrate 11 through a corresponding one of the at least two adhesive members 13 . Like the at least two adhesive members 13 , the at least two light emitting diode display panels 14 are spaced apart from each other. Specifically, the light-emitting diode display panel 14 may include a sub-substrate 141, a substrate film layer 142, a conductive portion 143, a plurality of light-emitting elements 144 and an encapsulation layer 145. Furthermore, each of the at least two light-emitting diode display panels 14 further includes an opposite first setting surface s2 and a second setting surface s3, and the first setting surface s2 contacts the corresponding one of the at least two adhesive members 13, And the conductive part 143, the light emitting element 144 and the packaging layer 145 are provided on the second installation surface s3.

The conductive member 15 is used to electrically connect the conductive wire 12 and the conductive portion 143 of each of the at least two LED display panels 14, and to contact the side surfaces s1 of each of the at least two LED display panels 14, that is, to contact the two side surfaces s1 of the two LED display panels 14 facing each other. For example, the material of the conductive member 15 can be silver.

Specifically, the sub-substrate 141, the substrate film layer 142, the conductive part 143, the light-emitting element 144 and the packaging layer 145 included in the at least two light-emitting diode display panels 14 can be disposed on the substrate 11 from bottom to top and adhered. The component 13 and the conductive wire 12 may be disposed between the LED display panel 14 and the substrate 11 , the adhesive component 13 may be disposed on the conductive wire 12 , and the adhesive component 13 may partially cover the conductive wire 12 . The driver 16, the connecting flexible board 17, the printed circuit board 18 and the control chip 19 can be disposed on the substrate 11 at a position different from that of the light-emitting diode display panel 14. Furthermore, the driver 16 can be disposed on the substrate 11 and connected to the substrate 11. One end of the flexible board 17 can be disposed on the substrate 11, and the other end can be disposed on the printed circuit board 18. The printed circuit board 18 can be disposed on the other side of the substrate 11 that is different from the light-emitting diode display panel 14. The control chip 19 can be disposed on the printed circuit board 18, and both the driver 16 and the connecting flexible board 17 can partially cover the conductive lines 12. The conductive portion 143 can be used to electrically connect the light-emitting element 144 . The conductive member 15 can be disposed between the at least two light-emitting diode display panels 14 . Furthermore, the conductive member 15 can be electrically connected to the light-emitting element 144 through the conductive portion 143 . In addition, the at least two light-emitting diode display panels 14 may not have through holes.

Specifically, the driver 16, the connection flexible board 17, the printed circuit board 18 and the control chip 19 shown in Figure 1 are optional components, and the driver 16, the connection flexible board 17, the printed circuit board 18 and the control chip 19 shown in Figure 1 The connection manner and arrangement position of the control chip 19 are presented as examples. Specifically, the driver 16 may be a source driver (Source Driver), used to provide The panel data signal is connected to the flexible board 17 which can be made of a flexible printed circuit board (FPC), and the control chip 19 can be a timing controller (TCON).

Please refer to FIG. 2 , which is a schematic cross-sectional view of a spliced display according to another embodiment of the present invention. As shown in Figure 2, the spliced display 1' includes a substrate 11, a conductive wire 12, the at least two adhesive members 13', the at least two light-emitting diode display panels 14, a conductive member 15, a driver 16, and a connecting flexible board 17 , printed circuit board 18 and control chip 19. The functions and connection relationships of the substrate 11, the conductive wires 12, the adhesive parts 13', the conductive parts 15, the driver 16, the connecting flexible board 17, the printed circuit board 18 and the control chip 19 are all the same as those included in the spliced display 1 of Figure 1 The substrate 11, conductive lines 12, conductive parts 15, driver 16, connecting flexible board 17, printed circuit board 18 and control chip 19 will not be described again here.

The function and connection relationship of the adhesive part 13' are roughly the same as the adhesive part 13 included in the spliced display 1 of Figure 1, but the adhesive part 13' included in the spliced display 1' has space to accommodate the light-emitting element 144 and the packaging layer 145. The projected area in the stacking direction is smaller than the projected area of the at least two light-emitting diode display panels 14 in the stacking direction.

The functions and connection relationships of the at least two light-emitting diode display panels 14 are substantially the same as those of the at least two light-emitting diode display panels 14 included in the spliced display 1 of Figure 1 , except that the spliced display 1' includes The at least two light-emitting diode display panels 14 further include a first and second setting surface s3 that contacts the corresponding one of the at least two adhesive members 13' and is provided with a conductive portion 143. Furthermore, compared with the arrangement in FIG. 1 , the arrangement of the at least two light-emitting diode display panels 14 is equivalent to combining the sub-substrate 141 and the base included in the light-emitting diode display panel 14 . The film layer 142, the conductive portion 143, the light-emitting element 144 and the encapsulation layer 145 are arranged on the substrate 11 in a reverse arrangement to that shown in FIG. 1, that is, they are arranged on the substrate 11 from top to bottom.

It should be particularly noted that FIG. 1 and FIG. 2 exemplarily show that the number of LED display panels 14 is two, but in other embodiments, the number of LED display panels 14 may be more. Specifically, two adjacent LED display panels 14 may be arranged on the substrate 11 in the manner of FIG. 1 or FIG. 2 . In addition, FIG. 1 and FIG. 2 only exemplarily show the number of components of the conductive wire 12, the conductive portion 143, the conductive element 15, the light-emitting element 144, and the packaging layer 145. In other embodiments, in the direction perpendicular to the paper, the conductive wire 12 may include a plurality of conductive sub-wires 121, the conductive portion 143 may include a plurality of conductive sub-portions 1431, and the conductive element 15 may include a plurality of conductive sub-components 151. In addition, the light-emitting element 144 can be an array composed of more light-emitting diodes.

Next, the manufacturing method of the spliced display 1 shown in FIG. 1 and the spliced display 1' shown in FIG. 2 is described. Please refer to FIG. 3, which is a flow chart of the spliced display manufacturing method according to an embodiment of the present invention. As shown in FIG. 3, the spliced display manufacturing method includes step S101: providing a substrate provided with a conductive wire; step S102: at least two LED display panels are spaced apart on the substrate through at least two adhesives to cover at least a portion of the conductive wire; and step S103: providing a conductive member, wherein the conductive member electrically connects the conductive wire and the conductive portions of the at least two LED display panels, and contacts the sides of the at least two LED display panels facing each other. The spliced display manufacturing method can be applied to the spliced display 1 shown in FIG. 1 and the spliced display 1' shown in FIG. 2. The spliced display manufacturing method shown in FIG. 3 is described below by way of example using the spliced display 1 shown in FIG. 1.

In step S101, the spliced display 1 provides a substrate 11 provided with a conductive wire 12. Specifically, the conductive wire 12 is used to connect the at least two LED display panels 14 and transmit power and signals between the at least two LED display panels 14 and the substrate 11.

In step S102, the at least two LED display panels 14 are spaced apart on the substrate 11 through the at least two adhesives 13 to cover at least a portion of the conductive wire 12. Specifically, the adhesive 13 can adhere the at least two LED display panels 14 to the area on the substrate 11 that can cover at least a portion of the conductive wire 12.

In step S103, a conductive member 15 is provided, wherein the conductive member 15 electrically connects the conductive wire 12 and the conductive portion 143 of each of the at least two LED display panels 14, and contacts the mutually facing side surfaces s1 of the at least two LED display panels 14. In particular, in the embodiment of manufacturing the spliced display 1 shown in FIG. 1, the height of the conductive member 15 is higher than the height from the setting surface s3 to the substrate 11.

In particular, in one embodiment, the spliced display manufacturing method includes the above-mentioned steps S101 to S103 and does not include forming a through hole in the sub-substrate 141.

Please refer to FIG. 1 and FIG. 4 for further explanation of step S102 applicable to the spliced display 1 shown in FIG. Flowchart of the polar body display panel being arranged on the substrate at intervals. As shown in FIG. 4 , arranging the at least two light-emitting diode display panels at intervals on the substrate includes step S201: arranging one of at least two adhesive members on a third portion of one of the at least two light-emitting diode display panels. A setting surface; Step S202: Set the other one of at least two adhesive parts on The first installation surface of the other one of at least two light-emitting diode display panels; and step S203: arrange at least two adhesive members on the substrate at intervals.

In step S201, one of the at least two adhesive members 13 is disposed on the first placement surface s2 of one of the at least two light-emitting diode display panels 14. Specifically, each of the at least two light-emitting diode display panels 14 further includes an opposing first installation surface s2 and a second installation surface s3, and the second installation surface s3 is provided with a conductive portion 143.

In step S202, the other of the at least two adhesives 13 is disposed on the first mounting surface s2 of the other of the at least two LED display panels 14. Specifically, each of the remaining at least two adhesives 13 is respectively bonded to the first mounting surface s2 of each of the remaining at least two LED display panels 14, so that the at least two LED display panels 14 can be bonded to other components.

In step S203, the at least two adhesive members 13 are spaced apart on the substrate 11. Specifically, the at least two adhesive members 13 provided with the at least two light-emitting diode display panels 14 are bonded to the substrate 11 at a certain interval.

Please refer to FIG. 2 and FIG. 5 for further explanation of step S102 applicable to the spliced display 1' shown in FIG. 2, wherein FIG. A flow chart of a light-emitting diode display panel arranged on a substrate at intervals. As shown in FIG. 5 , arranging the at least two light-emitting diode display panels at intervals on the substrate includes step S301: arranging one of the at least two adhesive members on one of the at least two light-emitting diode display panels. surface; step S302: dispose the other one of the at least two adhesive members on the disposing surface of the other one of the at least two light-emitting diode display panels; and step S303: dispose the at least two adhesive members on the substrate at intervals.

In step S301, one of the at least two adhesive members 13 is disposed on the installation surface s3 of one of the at least two light-emitting diode display panels 14. Specifically, each of the at least two light-emitting diode display panels 14 further includes an installation surface s3, and the installation surface s3 is provided with a conductive portion 143.

In step S302, the other one of the at least two adhesive members 13 is disposed on the installation surface s3 of the other one of the at least two light-emitting diode display panels 14. Specifically, each remaining one of the at least two adhesive members 13 is respectively adhered to the installation surface s3 of each remaining one of the at least two light-emitting diode display panels 14, so that the at least two The LED display panel 14 can be bonded with other components. In addition, the projected area of the at least two adhesive members 13 disposed on the at least two LED display panels 14 in the stacking direction is smaller than the projected area of the at least two LED display panels 14 in the stacking direction.

In step S303, the at least two adhesive members 13 are spaced apart on the substrate. The implementation of step S303 is substantially the same as step S203, and will not be described again here.

In order to further explain the manufacturing method of a spliced display with multiple light-emitting diode display panels, please refer to FIG. 1 , FIG. 6A , FIG. 6B and FIG. 6C . FIG. 6A illustrates a spliced display manufacturing method according to an embodiment of the present invention. FIG. 6B is a schematic diagram of arranging adhesive members on a light-emitting diode display panel according to an embodiment of the present invention. FIG. 6B is a schematic diagram of arranging adhesive members on a substrate at intervals according to an embodiment of the present invention. A top view of the conductive elements provided in the manufacturing method of the spliced display shown in the embodiment.

As shown in FIG. 6A , the adhesive 13 is disposed on the first mounting surface s2 of the LED display panel 14 .

As shown in FIG. 6B , an adhesive member 13 provided with a light-emitting diode display panel 14 and another adhesive member 13 provided with a light-emitting diode display panel 14 are bonded to the substrate 11 with a spacing d.

As shown in FIG6C , the conductive line 12 includes a plurality of conductive sub-lines 121, and the conductive portion 143 includes a plurality of conductive sub-parts 1431. A conductive material (e.g., silver glue) is deposited in the gaps between the LED display panels 14 through the mask 20 to form a plurality of conductive sub-components 151, wherein each of the plurality of conductive sub-components 151 is electrically connected to a corresponding one of the plurality of conductive sub-lines 121 and a corresponding one of the plurality of conductive sub-parts 1431 of each of the at least two LED display panels 14. Furthermore, after the conductive material is deposited through the mask 20, laser etching may be performed to remove excess conductive material between the plurality of conductive sub-components 151 that may be formed due to glue overflow. In addition, external signals can be input to the at least two LED display panels 14 through the plurality of conductive wires 121. For example, the external signals can be TCON signals, driver signals, chip on glass (COG) signals, and chip on film (COF) signals.

With the above structure, the spliced display and its manufacturing method disclosed in this case can reduce the electrical difference between different display panels through the conductive parts between the splicing seams, thereby improving the quality of the spliced display screen, and relatively Compared with glass perforation or side wiring technologies, the spliced display and its manufacturing method disclosed in this case can have a simpler manufacturing process and lower production costs.

Although the present invention is disclosed as above by the aforementioned embodiments, it is not intended to limit the present invention. Any changes and modifications made within the spirit and scope of the present invention are within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the attached patent application scope.

1: Spliced display

11:Substrate

12: Conductive wire

13: Adhesive parts

14:LED display panel

141:Subbase

142: Substrate film layer

143: Conductive part

144:Light-emitting components

145:Encapsulation layer

15: Conductive parts

16: drive

17: Connect the soft board

18:Printed circuit board

19: Control chip

20: Mask

s1, s2, s3: setting surface

Claims (10)

A spliced display, including: a substrate; a conductive wire, arranged on the substrate; at least two adhesive members, spaced on the substrate, and covering at least a part of the conductive wire; at least two light-emitting diode display panels, respectively arranged on The at least two adhesive members each include a conductive part and a side surface, and the side surfaces of the at least two light-emitting diode display panels face each other; and a conductive member is electrically connected to the conductive wire and the at least two light-emitting diodes. The conductive portion of each of the polar display panels is in contact with the side of each of the at least two light-emitting diode display panels, wherein the conductive line is disposed from the first one of the at least two light-emitting diode display panels and the The first area between the substrates extends to a second area between the second one of the at least two light-emitting diode display panels and the substrate, and passes through the second area. The spliced display according to claim 1, wherein each of the at least two light-emitting diode display panels further includes an opposite first setting surface and a second setting surface, and the first setting surface contacts the at least two adhesive members. A corresponding one, and the conductive part is provided on the second installation surface. The spliced display as described in claim 1, wherein each of the at least two LED display panels further comprises a setting surface, the setting surface contacts a corresponding one of the at least two adhesive members and is provided with the conductive portion. The spliced display of claim 1, wherein the at least two light-emitting diode display panels do not have through holes. The spliced display of claim 1, wherein the conductive line includes a plurality of conductive sub-lines, the conductive part includes a plurality of conductive sub-parts, the conductive member includes a plurality of conductive sub-components, and each of the conductive sub-components is electrically connected. A corresponding one of the conductive sub-lines and a corresponding one of the conductive sub-portions of each of the at least two light-emitting diode display panels. A method for manufacturing a spliced display, including: providing a substrate provided with a conductive line; disposing at least two light-emitting diode display panels on the substrate at intervals through at least two adhesive members to cover at least a portion of the conductive line; and providing a A conductive element, wherein the conductive element is electrically connected to the conductive line and the respective conductive portions of the at least two light-emitting diode display panels, and contacts the side surfaces of the at least two light-emitting diode display panels facing each other, wherein the conductive line Disposed to extend from a first region between the first one of the at least two light-emitting diode display panels and the substrate to a second region between the second one of the at least two light-emitting diode display panels and the substrate , and passes through the second area. The manufacturing method of a spliced display as described in claim 6, wherein each of the at least two LED display panels further comprises a first setting surface and a second setting surface opposite to each other, the second setting surface is provided with the conductive portion, and the at least two LED display panels are spaced apart and arranged on the substrate through the at least two adhesives respectively, comprising: arranging one of the at least two adhesives on the first setting surface of one of the at least two LED display panels; arranging the other of the at least two adhesives on the first setting surface of the other of the at least two LED display panels; and arranging the at least two adhesives on the substrate at intervals. The method for manufacturing a spliced display as claimed in claim 6, wherein each of the at least two light-emitting diode display panels further includes a setting surface, the setting surface is provided with the conductive portion, and the at least two light-emitting diode display panels are respectively connected through the at least two adhesive members. The light-emitting diode display panels are arranged at intervals on the substrate, including: arranging one of the at least two adhesive members on the installation surface of one of the at least two light-emitting diode display panels; The other one is arranged on the installation surface of the other one of the at least two light-emitting diode display panels; and the at least two adhesive members are arranged on the substrate at intervals. The manufacturing method of a spliced display according to claim 6 does not include forming a through hole in a sub-substrate. The manufacturing method of a spliced display as described in claim 6, wherein the conductive line includes a plurality of conductive sub-lines, the conductive portion includes a plurality of conductive sub-portions, and the provision of the conductive element includes: depositing a conductive material through a mask in the gap between the at least two LED display panels to form a plurality of conductive sub-portions, wherein each of the conductive sub-portions is electrically connected to a corresponding one of the conductive sub-lines and a corresponding one of the conductive sub-portions of the at least two LED display panels.

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