TWI834199B - Processing device and method of manufacturing processed product - Google Patents

Abstract

The invention simplifies the structure of the device and reduces the occupied area while preventing the scattering of the processing fluid. The invention includes: a processing table to hold the sealed substrate; a first holding mechanism to hold the sealed substrate in order to transport the sealed substrate to the processing table; The processing mechanism processes the sealed substrate held on the processing table; the transfer table moves the plurality of products; the second holding mechanism holds the plurality of products in order to transfer the plurality of products from the processing table to the transfer table; for transportation The moving mechanism has a common transmission shaft extending along the arrangement direction of the processing table and the transfer table and used to move the first holding mechanism and the second holding mechanism; the moving mechanism for processing makes the processing mechanism move along the horizontal plane. The transmission axis moves in the X direction and the Y direction orthogonal to the X direction respectively; the machining fluid supply mechanism moves together with the machining mechanism by the machining moving mechanism, and injects machining fluid to the machining mechanism from the front side of the machining feed direction; And a machining fluid scattering prevention mechanism is provided on the rear side of the machining mechanism in the machining feed direction, and covers the upper side from a position lower than the upper surface of the machining table to prevent the machining fluid from scattering.

Description

Processing device and method of manufacturing processed product

The present invention relates to a processing device and a method for manufacturing processed products.

Previously, as shown in Patent Document 1, in a cutting system, a structure in which a strip picker moves in the X-axis direction and transfers a semiconductor strip from a loading device to a cutting device has been considered. The chuck table absorbs the semiconductor strip and moves it to the rear of the system in the Y-axis direction. After that, the semiconductor strip is cut into semiconductor packages by a mandrel. In addition, the chuck table is configured to move in the Y-axis direction using a ball screw (ball screw mechanism).

However, in the cutting system, since the ball screw is used to move the chuck table for cutting, it is necessary to provide an bellows member that protects the ball screw from processing water or processing chips, and furthermore, it is necessary to protect the bellows member. A plurality of plate members are provided on the bellows member. As a result, the device structure becomes complicated.

In addition, in the cutting system, the semiconductor strip is moved not only in the X-axis direction but also in the Y-axis direction to the rear of the system in order to cut the semiconductor strip, so the footprint of the device becomes larger.

On the other hand, as shown in Patent Document 2, a processing device is considered in which a cutting member is processed in the X-axis direction by a machining feed member, and a fixed chuck table is positioned in the Z direction by a cutting feed member. Cutting feed in the axial direction, while maintaining Cutting is performed on the workpiece held on the chuck table. In this machining apparatus, a waterproof member based on a bellows structure arranged horizontally around the chuck table is not required to waterproof the cutting water accompanying the machining feed.

However, in this machining apparatus, waterproof members based on the bellows structure arranged horizontally around the chuck table are not required. However, cutting water may scatter to surrounding components during cutting, which may cause problems.

[Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2007-536727

[Patent Document 2] Japanese Patent Application Laid-Open No. 2008-140981

Therefore, the present invention is made in order to solve the above-mentioned problems, and its main subject is to simplify the structure of the device and reduce the occupied area, and to prevent the scattering of the machining fluid.

That is, the processing apparatus of the present invention is characterized by including: a processing table that holds an object to be processed; a first holding mechanism that holds the object to be processed in order to transport the object to the processing table; and a processing mechanism that holds the object to be processed. The processing object held on the processing table is processed; the transfer table moves the processed object; and the second holding mechanism is used to transport the processed object from the processing table. The processed object is held on the transfer table; and a transport moving mechanism has a structure extending along the arrangement direction of the processing table and the transfer table. A common transmission shaft used to move the first holding mechanism and the second holding mechanism; a processing moving mechanism to move the processing mechanism on the horizontal plane in the first direction along the transmission shaft and with the The machining fluid supply mechanism moves in a second direction orthogonal to the first direction respectively; the machining fluid supply mechanism moves together with the machining mechanism through the machining moving mechanism, and sprays the machining mechanism to the machining mechanism from the front side of the machining feed direction. liquid; and a machining liquid scattering prevention mechanism, which is provided on the rear side in the machining feed direction with respect to the machining mechanism, and covers the upper side from a position lower than the upper surface of the machining table to prevent the Spraying of machining fluid.

According to the present invention configured in this way, the device structure can be simplified and the occupied area can be reduced, while the scattering of the machining fluid can be prevented.

2A, 2B: Cutting table (processing table)

3: The first holding mechanism

4: Cutting mechanism (processing mechanism)

5:Transfer platform

6: Second holding mechanism

7:Moving mechanism for transportation

8: Moving mechanism for cutting (moving mechanism for processing, moving mechanism)

9A, 9B: Rotating mechanism

10A, 10B: Vacuum pump

11:Substrate supply mechanism

12: Cutting water supply mechanism (machining fluid supply mechanism)

13:Inspection Department

14:Reversal mechanism

15: cover member

15a, 15b: opening

16. 241: Bellows member

17: Processing waste collection department

18:The first cleaning agency

18a, 121: Injection nozzle

19:Second cleaning mechanism

20:Classification agency

21:Pallet

22:Pallet transport mechanism

23:Pallet storage department

24: Cutting water scattering prevention mechanism (machining fluid scattering prevention mechanism)

31, 61: Adsorption head

40: Rotary tool

41A, 41B: Blade

42A, 42B: Spindle

71: Common transmission shaft (transmission shaft)

72: Main moving mechanism

73, 181, 244: Lifting and moving mechanism

73a, 831: Z direction guide rail

73b: Actuator part

74: Horizontal moving mechanism

74a, 821: Y direction guide rail

74b: Elastomer

74c: Cam mechanism

81:X direction moving part

82:Y direction moving part

83:Z direction moving part

100: Cutting device (processing device)

111:Substrate receiving section

112:Substrate supply department

113:Heating part

131:First Inspection Department

132:Second Inspection Department

141:Keeping platform

142:Reversal Department

151:window

171:Guide chute

171X: Upper opening

172:Recycling container

173:Separation Department

242:Baffle component

242a: first protrusion

242b: Second protrusion

243A, 243B: Fixed part

244a: baffle holding part

244b, 721: Guide rail

244c:Drive Department

311, 611: Adsorption department

722:Pinion mechanism

722a: Cam rack

722b: pinion

722b1:Roller body

722b2:Roller pin

723:Sliding member

811: A pair of X-direction guide rails (X-direction guide rail, guide rail)

812:Support

813: Ball screw mechanism

822:Y direction slider

823: Linear motor

832:Z direction slider

CTL:Control Department

D: Descending position

P: Product (processed object)

RP: maintain position

S: Processing chips

SD: processing feed direction

U: ascending position

W: Sealed substrate (object to be processed)

X, Y, Z, θ: direction

FIG. 1 is a diagram schematically showing the structure of a cutting device according to an embodiment of the present invention.

FIG. 2 is a perspective view schematically showing the cutting table of the embodiment and its surrounding structure.

FIG. 3 is a diagram (plan view) viewed from the Z direction, schematically showing the structure of the cutting table and its surrounding structures according to the embodiment.

4 is a diagram (front view) viewed from the Y direction, schematically showing the structure of the cutting table and its surrounding structures according to the embodiment.

Fig. 5 is a schematic diagram showing the first holding mechanism and the conveying device of the embodiment; The structure of the moving mechanism, viewed from the Y direction (front view).

6 is a diagram (side view) viewed from the X direction, schematically showing the structure of the first holding mechanism and the transport moving mechanism of the embodiment.

7 is a cross-sectional view schematically showing the structure of a rack and pinion mechanism according to the embodiment.

8 is a diagram (front view) viewed from the Y direction schematically showing the structures of the second holding mechanism and the transport moving mechanism of the embodiment.

9 is a cross-sectional view viewed from the X direction schematically showing the structure of the processing moving mechanism and the cover member of the embodiment.

10 is a cross-sectional view viewed from the Y direction schematically showing the structures of the processing moving mechanism, the cover member, and the cutting water scattering prevention mechanism according to the embodiment.

11 is a cross-sectional view viewed from the Y direction schematically showing the structures of the processing moving mechanism, the cover member, and the cutting water scattering prevention mechanism according to the embodiment.

12 is a schematic diagram showing (a) an ascending position and (b) a descending position of the baffle member in the cutting water scattering prevention mechanism of the embodiment.

FIG. 13 is a schematic diagram showing the operation of the cutting water scattering prevention mechanism of the embodiment.

FIG. 14 is a schematic diagram showing the operation of the cutting water scattering prevention mechanism of the embodiment.

Fig. 15 is a schematic diagram showing the operation of the cutting device according to the embodiment.

Next, the present invention will be described in more detail using examples. However, the present invention does not Limited by the following description.

As described above, the processing apparatus of the present invention is characterized by including: a processing table that holds the object to be processed; and a first holding mechanism that holds the object to be processed in order to transport the object to the processing table; a mechanism to process the object to be processed held on the processing table; a transfer table to move the object to be processed; and a second holding mechanism to remove the object to be processed from the object to be processed. The processing table is transported to the transfer table and the processed object is held; a transport moving mechanism extends along the arrangement direction of the processing table and the transfer table and is used to move the first A common transmission axis for movement of the holding mechanism and the second holding mechanism; a moving mechanism for processing to move the processing mechanism on a horizontal plane in a first direction along the transmission axis and orthogonal to the first direction respectively move in the second direction; a machining fluid supply mechanism moves together with the machining mechanism by the machining moving mechanism, and injects machining fluid to the machining mechanism from the front side of the machining feed direction; and prevents machining fluid from scattering A mechanism is provided on the rear side of the processing mechanism in the processing feed direction, and covers the upper side from a position below the upper surface of the processing table to prevent the machining fluid from scattering.

In the above-mentioned processing device, a structure is adopted in which the first holding mechanism and the second holding mechanism are moved by a common transmission shaft extending along the arrangement direction of the processing table and the transfer table, and the processing movement mechanism is used to perform processing. The mechanism moves respectively in the first direction along the transmission axis and the second direction orthogonal to the first direction on the horizontal plane, so the processing object can be machined without moving the processing table in the first direction and the second direction. Objects are processed. Therefore, the processing table can be moved without using the ball screw mechanism. to protect the bellows member of the ball screw mechanism and a cover member to protect the bellows member. As a result, the device structure of the processing device can be simplified. In addition, since the processing table is configured not to move in the first direction and the second direction on the horizontal plane, the movement space of the processing table and the useless space around it can be reduced, and the occupied area of the processing device can be reduced.

In particular, in the present invention, in the structure in which the machining fluid is sprayed toward the processing mechanism from the front side in the machining feed direction, the machining mechanism is provided from the rear side in the machining feed direction lower than the upper surface of the machining table. The position covers the upper machining fluid scattering prevention mechanism, thus preventing the machining fluid from scattering.

In order to prevent the machining fluid from scattering while following the movement of the machining mechanism using the machining moving mechanism, it is desirable that the machining fluid scattering prevention mechanism has an bellows member that expands and contracts with the movement of the machining mechanism and covers all parts of the machining fluid. The upper and lateral sides orthogonal to the processing feed direction; and a baffle member connected to the rear end of the accordion member in the processing feed direction and covering the rear side in the processing feed direction.

If the baffle member moves when the object to be processed is processed by the processing mechanism, there is a possibility that scattering of the machining fluid cannot be reliably prevented. In order to solve this problem, it is preferable that the processing device has a fixing portion for fixing the baffle member when the object to be processed is processed by the processing mechanism.

In order to improve the processing capability of the object to be processed in one processing device, it is desirable that the processing device of the present invention includes a plurality of the processing tables.

Here, it is desirable that the fixing portion and the plurality of processing tables are respectively provided correspondingly. Set. According to the above structure, the length of the bellows member can be made corresponding to one processing table, and the size of the bellows member in the contracted state can be reduced. In addition, the baffle member can be fixed to each processing table and the structure of covering one processing table with the bellows member can improve the ability to load the unprocessed processing object into the unprocessed processing table and to carry out the processed object. Processing capabilities of processing objects, etc.

In order to move the baffle member to a plurality of fixed parts corresponding to a plurality of processing tables, it is desirable that the processing moving mechanism moves the baffle member to a plurality of the fixed parts respectively.

According to the above structure, there is no need to provide a separate moving mechanism for moving the shutter member, and the structure of the moving shutter member can be simplified.

Since the lower end of the baffle member is provided at a lower position than the upper surface of the processing table, it is necessary to move the baffle member without interfering with the processing table. Therefore, it is desirable that the baffle member can have its lower end portion positioned in a raised position above the upper surface of the processing table, and the lower end portion be positioned lower than the upper surface of the processing table. It moves between the lowered positions, and is fixed by the fixing part in the lowered position.

The moving mechanism for processing is called a so-called gantry mechanism. Specifically, it is preferable that the processing moving mechanism includes: an X-direction moving part for linearly moving the processing mechanism in the X direction as the first direction; and a Y-direction moving part for moving the processing mechanism To move linearly in the Y direction as the second direction, the X-direction moving part has: a pair of X-direction guide rails arranged along the X-direction across the processing table; and a support body along the pair of X-direction guide rails. X direction guide rail The processing mechanism is moved and supported via the Y-direction moving part. In the above structure, the common transmission shaft is arranged above the support body and crosses the support body, and the common transmission shaft and the support body have a mutually intersecting positional relationship.

In this way, since the pair of X-direction guide rails provided along the X-direction are provided across the processing table, the pitch (interval) between the pair of X-direction guide rails can be increased. As a result, the influence on processing caused by the positional deviation of the X-direction guide rails in the up-down direction can be reduced. That is, the deviation of the orthogonality between the processing mechanism (for example, a rotating tool such as a blade) and the processing table can be reduced, and processing accuracy can be improved. In addition, for the X-direction guide rail, a guide rail with a lower specification than before can be used.

In the processing moving mechanism, it is desirable that the direction toward one side along the X direction is the processing feed direction, and the support is provided on one side along the X direction of the support body. In the machining mechanism and the machining fluid supply mechanism, the machining fluid scattering prevention mechanism is provided on the other side of the support body along the X direction. According to this structure, the machining fluid that has passed through the lower side of the support body can be prevented from scattering on the other side of the support body along the X direction.

In order to prevent the machining fluid from scattering on one side of the support body along the X direction, it is desirable to provide the machining mechanism and the machining fluid supply mechanism on one side of the support body along the X direction. cover member.

In addition, a method for manufacturing a processed product using the processing device is also an aspect of the present invention.

<One embodiment of the present invention>

Hereinafter, an embodiment of the processing device of the present invention will be described with reference to the drawings. bright. In addition, any of the figures shown below are omitted as appropriate or schematically drawn in an exaggerated manner for easy understanding. The same components are labeled with the same symbols, and descriptions are omitted where appropriate.

<Overall structure of processing equipment>

The processing device 100 of this embodiment is a cutting device that cuts the sealed substrate W as a processing object into individual pieces into a plurality of products P.

Here, the sealed substrate W is a substrate to which electronic components such as semiconductor wafers, resistive elements, and capacitor elements are connected, and is formed by resin molding so as to resin seal at least the electronic components. As the substrate constituting the sealed substrate W, a lead frame or a printed wiring board can be used. In addition to these, a semiconductor substrate (including a semiconductor wafer such as a silicon wafer), a metal substrate, a ceramic substrate, a glass substrate can also be used. substrate, resin substrate, etc. In addition, wiring may or may not be implemented on the substrate constituting the sealed substrate W.

In addition, one of the surfaces of the sealed substrate W and product P of this embodiment becomes the mounting surface used for subsequent mounting. In the description of this embodiment, one of the surfaces used for mounting later will be described as the "mounting surface", and the surface on the opposite side will be described as the "opposite surface".

Specifically, as shown in FIG. 1 , the cutting device 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W; and a first holding mechanism 3 that transports the sealed substrate W to The cutting tables 2A and 2B hold the sealed substrate W; the cutting mechanism (processing mechanism) 4 holds the sealed substrate W on the cutting table. 2A. The sealed substrate W is cut on the cutting table 2B; the transfer table 5 moves the plurality of products P; the second holding mechanism 6 is used to remove the plurality of products P from the cutting table 2A and the cutting table 2B. The plurality of products P are transported to the transfer table 5 and held; the transfer moving mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and the cutting moving mechanism (processing The cutting mechanism 4 is moved relative to the sealed substrate W held by the cutting tables 2A and 2B using a moving mechanism 8 . Furthermore, the first holding mechanism 3 and the conveying moving mechanism 7 constitute a conveying mechanism (loader) for conveying the sealed substrate W, and the second holding mechanism 6 and the conveying moving mechanism 7 constitute a conveying mechanism for conveying the plurality of products P. (Unloader).

In the following description, the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are respectively referred to as the X direction as the first direction and the second direction. In the Y direction, let the vertical direction orthogonal to the X direction and the Y direction be the Z direction. Specifically, let the left-right direction in FIG. 1 be the X direction, and let the up-down direction be the Y direction. Although it will be described later, the X direction is the moving direction of the support body 812 and is a direction orthogonal to the longitudinal direction (the direction in which the beam portion extends) of the beam portion (cross beam portion) of the door-shaped support body 812 that spans a pair of legs. (Refer to Figure 2 and Figure 3).

<Cutting table 2A, cutting table 2B>

The two cutting tables 2A and 2B are fixedly installed in the X direction, the Y direction, and the Z direction. Furthermore, the cutting table 2A can be rotated in the θ direction by the rotation mechanism 9A provided below the cutting table 2A. In addition, the cutting table 2B can be rotated in the θ direction by the rotation mechanism 9B provided below the cutting table 2B.

These two cutting tables 2A and 2B are installed along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged so that their upper surfaces are located on the same horizontal plane (at the same height in the Z direction) (see FIG. 4 ), and the centers of the upper surfaces ( Specifically, they are arranged so that the rotation centers of the rotating mechanisms 9A and 9B are located on the same straight line extending in the X direction (see FIGS. 2 and 3 ).

In addition, the two cutting tables 2A and 2B suction and hold the sealed substrate W. As shown in FIG. 1 , two vacuum pumps 10A and 10B are arranged corresponding to the two cutting tables 2A and 2B for suction and holding. Each of the vacuum pumps 10A and 10B is, for example, a water-sealed vacuum pump.

Here, since the cutting table 2A and the cutting table 2B are fixed in the XYZ direction, the pipes (not shown) connected from the vacuum pump 10A and the vacuum pump 10B to the cutting table 2A and the cutting table 2B can be shortened. , which can reduce the pressure loss in the piping and prevent the reduction of adsorption force. As a result, even an extremely small package, for example, 1 mm square or less, can be reliably attracted to the cutting tables 2A and 2B. In addition, it is possible to prevent the reduction in adsorption force due to pressure loss in the piping, so that the capacity of the vacuum pump 10A and the vacuum pump 10B can be reduced, which contributes to downsizing and cost reduction.

<First holding mechanism 3>

As shown in FIG. 1 , the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting stages 2A and 2B. As shown in FIGS. 5 and 6 , the first holding mechanism 3 has: an adsorption head 31 provided with a plurality of adsorption portions 311 for adsorbing and holding the sealed substrate W; and An empty pump (not shown) is connected to the adsorption part 311 of the adsorption head 31 . Then, the suction head 31 is moved to a desired position by the conveyance moving mechanism 7 described below, etc., thereby conveying the sealed substrate W from the substrate supply mechanism 11 to the cutting stages 2A and 2B.

As shown in FIG. 1 , the substrate supply mechanism 11 has: a substrate accommodating part 111 for accommodating a plurality of sealed substrates W from the outside; and a substrate supply part 112 for moving the sealed substrates W accommodated in the substrate accommodating part 111 to a first position. A holding mechanism 3 adsorbs and holds the holding position RP. The holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction. Furthermore, the substrate supply mechanism 11 may have a heating unit 113 that heats the sealed substrate W adsorbed by the first holding mechanism 3 in order to make the sealed substrate W soft and easy to adsorb.

<Cutting mechanism 4>

As shown in FIGS. 1 , 2 and 3 , the cutting mechanism 4 as a processing mechanism has two rotating tools 40 including a blade 41A, a blade 41B and two spindles 42A and 42B. The two spindles 42A and 42B are provided with their rotational axes along the Y direction, and the blades 41A and 41B attached to the spindle portions are arranged to face each other (see FIG. 3 ). The blade 41A of the spindle 42A and the blade 41B of the spindle 42B cut the sealed substrate W held on each of the cutting tables 2A and 2B by rotating in the plane including the X direction and the Z direction. In addition, as shown in FIG. 4 , the cutting device 100 of this embodiment is provided with a cutting water supply mechanism (machining fluid supply mechanism) 12 in order to suppress cutting by the blade 41A. , The friction heat generated by the blade 41B causes cutting water as a machining fluid to be sprayed. The cutting water supply mechanism 12 will be described later.

<Transfer stage 5>

As shown in FIG. 1 , the transfer stage 5 of this embodiment is a stage that moves a plurality of products P inspected by an inspection unit 13 to be described later. The transfer table 5 is called a so-called index table and temporarily places a plurality of products P before sorting the products P into various trays 21 . In addition, the transfer table 5 is arranged in line with the two cutting tables 2A and 2B on the horizontal plane along the X direction. The plurality of products P placed on the transfer table 5 are classified into various trays 21 by the classification mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13 .

Furthermore, the various pallets 21 are conveyed to a required position by the pallet conveying mechanism 22 that moves along the transmission shaft 71, and the products P classified by the sorting mechanism 20 are placed thereon. After sorting, the various pallets 21 are accommodated in the pallet accommodating part 23 by the pallet transport mechanism 22 .

<Inspection Department 13>

Here, as shown in FIG. 1 , the inspection unit 13 is provided between the cutting table 2A, the cutting table 2B, and the transfer table 5 , and inspects a plurality of products P held by the second holding mechanism 6 . The inspection unit 13 of this embodiment includes a first inspection unit 131 that inspects the opposite surface of the product P, and a second inspection unit 132 that inspects the mounting surface of the product P. The first inspection unit 131 is an imaging camera having an optical system for inspecting the opposite surface, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the mounting surface. Furthermore, the first inspection part 131 and the second inspection part 132 may be shared.

In addition, in order to be able to inspect both of the plurality of products P by the inspection unit 13 On the other hand, a reversing mechanism 14 for reversing a plurality of products P is provided (see FIG. 1 ). The reversal mechanism 14 includes a holding base 141 that holds a plurality of products P, and a reversing portion 142 such as a motor that reverses the holding base 141 so that the front and back thereof are reversed.

When the second holding mechanism 6 holds a plurality of products P from the processing tables 2A and 2B, the opposite surface of the products P faces downward. In this state, while the plurality of products P are being transported from the processing tables 2A and 2B to the reversing mechanism 14 , the opposite surface of the products P is inspected by the first inspection unit 131 . Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 , and then the reversing mechanism 14 moves to the position of the transfer table 5 . During this movement, the mounting surface of the product P facing downward is inspected by the second inspection unit 132 . Thereafter, the product P is transferred to the transfer table 5 .

<Second holding mechanism 6>

As shown in FIG. 1 , the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting table 2A and the cutting table 2B to the reversing mechanism 14 . As shown in FIG. 8 , the second holding mechanism 6 includes: an adsorption head 61 provided with a plurality of adsorption portions 611 for adsorbing and holding a plurality of products P; and a vacuum pump (not shown) connected to the adsorption head 61 . Adsorption part 611. Then, the adsorption head 61 is moved to a desired position by the conveyance moving mechanism 7 described below, etc., thereby conveying the plurality of products P from the cutting table 2A and the cutting table 2B to the holding table 141 .

<Moving mechanism 7 for transportation>

As shown in FIG. 1 , the transport moving mechanism 7 moves the first holding mechanism 3 to a distance between the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 to a distance between the substrate supply mechanism 11 and the cutting tables 2A and 2B. Between the table 2A, the cutting table 2B and the holding table 141 move between.

Furthermore, as shown in FIG. 1 , the transport moving mechanism 7 has a common transmission shaft 71 along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5 . Extending in a straight line, it is used to move the first holding mechanism 3 and the second holding mechanism 6 .

The transmission shaft 71 is provided in a range in which the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer stage 5 (see Figure 1). In addition, with respect to the transmission shaft 71 , the first holding mechanism 3 , the second holding mechanism 6 , the cutting table 2A, the cutting table 2B, and the transfer table 5 are provided on the same side (the near side) in plan view. In addition, the inspection part 13 , the reversing mechanism 14 , various pallets 21 , the pallet transport mechanism 22 , the pallet storage part 23 , the first cleaning mechanism 18 and the second cleaning mechanism 19 described below, and the recovery container 172 are also provided relative to the transmission shaft 71 On the same side (near front side).

Furthermore, as shown in FIGS. 5 , 6 and 8 , the transport moving mechanism 7 has: a main moving mechanism 72 for moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transmission shaft 71 ; and a lifting and lowering mechanism. The moving mechanism 73 makes the first holding mechanism 3 and the second holding mechanism 6 move up and down in the Z direction relative to the transmission shaft 71; and the horizontal movement mechanism 74 makes the first holding mechanism 3 and the second holding mechanism 6 move relative to the transmission shaft. 71 moves horizontally in the Y direction.

As shown in Figures 5 to 8, the main moving mechanism 72 has: a common guide rail 721, which is provided on the transmission shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, The first holding mechanism 3 and the second holding mechanism 6 Move along the guide rail 721 .

The guide rail 721 extends in a straight line in the X direction along the transmission shaft 71 , and is provided in a range where the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11 , and is similar to the transmission shaft 71 . The second holding mechanism 6 can move above the transfer platform 5 . A sliding member 723 is slidably provided on the guide rail 721 , and the sliding member 723 is provided with a first holding mechanism 3 and a second holding mechanism 6 via a lifting and lowering movement mechanism 73 and a horizontal movement mechanism 74 . Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6 , but the lifting and lowering movement mechanism 73 , the horizontal movement mechanism 74 and the sliding member 723 are specific to each of the first holding mechanism 3 and the second holding mechanism 6 . Set individually.

The rack and pinion mechanism 722 has: a cam rack 722a, which is shared by the first holding mechanism 3 and the second holding mechanism 6; and a pinion 722b, which is respectively provided in the first holding mechanism 3 and the second holding mechanism 6. Rotated by an actuator (not shown). The cam rack 722a is provided on the common transmission shaft 71 and can be changed to various lengths by connecting a plurality of cam rack elements. In addition, the pinion 722b is provided on the sliding member 723 and is called a so-called roller pinion. As shown in FIG. 7, it has a pair of roller bodies 722b1 that rotate together with the rotation axis of the motor; A plurality of roller pins 722b2 are provided at equal intervals in the circumferential direction between the pair of roller bodies 722b1 and are configured to be able to roll relative to the roller body 722b1. The rack and pinion mechanism 722 of this embodiment uses the roller pinion. Therefore, two or more roller pins 722b2 are in contact with the cam rack 722a, and no backlash is generated in the forward and reverse directions, making it easier to operate. The first holding mechanism 3 and the second holding mechanism 6 are in the X direction Positioning accuracy becomes better when moving.

As shown in FIGS. 5 and 8 , the lifting and lowering movement mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 respectively. As shown in FIGS. 5 and 6 , the lifting and lowering movement mechanism 73 of the first holding mechanism 3 is interposed between the transmission shaft 71 (specifically, the main movement mechanism 72 ) and the first holding mechanism 3 and has: Z The direction guide rail 73a is provided along the Z direction; and the actuator portion 73b moves the first holding mechanism 3 along the Z direction guide rail 73a. Furthermore, the actuator part 73b may use a ball screw mechanism, a cylinder, or a linear motor, for example. Furthermore, as shown in FIG. 8 , the structure of the lifting and lowering movement mechanism 73 of the second holding mechanism 6 is the same as that of the lifting and lowering movement mechanism 73 of the first holding mechanism 3 .

As shown in FIGS. 5 and 8 , the horizontal movement mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 respectively. As shown in FIGS. 5 and 6 , the horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transmission shaft 71 (specifically, the lifting movement mechanism 73 ) and the first holding mechanism 3 and has: The Y-direction guide rail 74a is provided along the Y-direction; the elastic body 74b applies force to the first holding mechanism 3 to one side of the Y-direction guide rail 74a; and the cam mechanism 74c makes the first holding mechanism 3 move toward one side of the Y-direction guide rail 74a. Move on the other side. Here, an eccentric cam is used as the cam mechanism 74c. By rotating the eccentric cam using an actuator such as a motor, the movement amount of the first holding mechanism 3 in the Y direction can be adjusted.

Furthermore, as shown in FIG. 8 , the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the lifting movement mechanism 73 of the first holding mechanism 3 . In addition, the second holding mechanism 6 may not be provided with the horizontal moving mechanism 74 , or the second holding mechanism 6 may be provided with the horizontal moving mechanism 74 . Both the first holding mechanism 3 and the second holding mechanism 6 are not provided with a horizontal moving mechanism 74 . Furthermore, like the up-and-down movement mechanism 73 , the horizontal movement mechanism 74 may not use the cam mechanism 74 c but may use, for example, a ball screw mechanism, a cylinder, or a linear motor.

<Moving mechanism for cutting 8 (moving mechanism for processing)>

The moving mechanism 8 for cutting linearly moves each of the two spindles 42A and 42B in each of the X direction, the Y direction, and the Z direction.

Specifically, as shown in FIGS. 2 to 4 and 9 to 11 , the moving mechanism 8 for cutting includes: an X-direction moving part 81 for linearly moving the spindles 42A and 42B in the X direction; The moving part 82 linearly moves the spindles 42A and 42B in the Y direction; and the Z-direction moving part 83 linearly moves the spindles 42A and 42B in the Z direction. In this embodiment, the processing feed direction SD of the cutting mechanism 4 using the cutting moving mechanism 8 is a direction toward one side along the X direction (a direction from the other side toward one of the sides along the X direction). ) (refer to Figure 3, etc.).

The X-direction moving part 81 is shared by the two cutting tables 2A and 2B. As shown in FIGS. 2 and 3 , the X-direction moving part 81 has a pair of X-direction guide rails 811 across the two cutting tables 2A along the X direction. , 2B; and the support body 812 moves along the pair of X-direction guide rails 811 and supports the spindles 42A and 42B via the Y-direction moving part 82 and the Z-direction moving part 83. A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction. In addition, the support body 812 is, for example, gate-shaped and has a shape extending in the Y direction. Specifically, the support body 812 has a pair of legs extending upward from a pair of X-direction guide rails 811, and is installed on the pair of X-direction guide rails 811. The beam portion (crossbeam portion) of the foot portion extends in the Y direction. The spindles 42A and 42B of the cutting mechanism 4 are provided on one side of the support body 812 along the X direction (the side facing the processing feed direction SD).

Furthermore, the support body 812 linearly reciprocates along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. In addition, the support body 812 may also be configured to reciprocate by a linear motor or other linear motion mechanism.

Especially as shown in FIG. 3 , the Y-direction moving part 82 has a Y-direction guide rail 821 provided along the Y-direction in the support body 812 and a Y-direction slider 822 that moves along the Y-direction guide rail 821 . Furthermore, the Y-direction moving part 82 is provided on one side of the support body 812 along the X direction (the side facing the processing feed direction SD). The Y-direction slider 822 is driven by a linear motor 823, for example, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindles 42A and 42B. Thereby, the two spindles 42A and 42B can move in the Y direction independently of each other. In addition, the Y-direction slider 822 can also be configured to reciprocate by using other linear motion mechanisms such as ball screw mechanisms.

As shown in FIGS. 9 to 11 , the Z-direction moving part 83 has: a Z-direction guide rail 831 provided along the Z direction in each Y-direction slider 822 ; and a Z-direction slider 832 along the Z-direction guide rail 831 The spindles 42A and 42B are moved and supported. That is, the Z-direction moving part 83 is provided corresponding to each of the spindles 42A and 42B. The Z-direction slider 832 is driven by an eccentric cam mechanism (not shown), for example, and moves along the Z-direction guide rail. 831 moves back and forth linearly. In addition, the Z-direction slider 832 can also be configured to move back and forth by other linear motion mechanisms such as a ball screw mechanism.

Regarding the positional relationship between the cutting moving mechanism 8 and the transmission shaft 71 , as shown in FIGS. 1 and 4 , the transmission shaft 71 is arranged above the cutting moving mechanism 8 and traverses the cutting moving mechanism 8 . . Specifically, the transmission shaft 71 is disposed above the support body 812 and crosses the support body 812 , and the transmission shaft 71 and the support body 812 have a mutually intersecting positional relationship.

<Cover member 15>

As shown in FIGS. 3 , 4 , and 9 to 11 , in the cutting moving mechanism 8 , the support body 812 is provided with a cover member 15 that accommodates the two spindles 42A and 42B. In addition, the cover member 15 is omitted in FIG. 2 . This cover member 15 is provided on one side of the support body 812 along the X direction (the side facing the machining feed direction SD), and accommodates not only the two spindles 42A and 42B of the cutting mechanism 4 but also the cutting water supply. The injection nozzle 121 of the mechanism 12 is configured so that the cutting water injected from the injection nozzle 121 does not scatter around.

Specifically, as shown in FIGS. 9 to 11 , the cover member 15 has an opening 15 a formed on the lower surface to expose the blades 41A and 41B. In addition, an opening 15b is formed on the upper surface of the cover member 15 so as not to interfere with the movement of the spindle 42A, the spindle 42B, or the cutting moving mechanism 8 . The opening 15b of the upper surface is closed by the bellows member 16, and the bellows member 16 is configured to expand and contract in accordance with the movement of the spindles 42A and 42B. By these cover members 15 and bellows members 16, one side of the support body 812 along the X direction (the side facing the processing feed direction SD) becomes the spindle 42A, The structure in which both sides of the mandrel 42B in the X direction, both sides in the Y direction, and the upper side are covered limits the range in which the cutting water sprayed from the injection nozzle 121 scatters. In addition, a window 151 through which the inside of the cover member 15 can be viewed is formed on the side wall on the front side of the cover member 15 (the side opposite to the support body 812 ) (see FIGS. 10 and 11 ). Furthermore, by exhausting the inside of the cover member 15 using an exhaust mechanism (not shown), the liquid droplets (mists) can be efficiently exhausted to the outside.

<Machining waste storage portion 17>

In addition, as shown in FIG. 1 , the cutting device 100 of this embodiment further includes a processing waste storage portion 17 that stores processing waste S such as end materials generated when the sealed substrate W is cut.

As shown in FIGS. 2 to 4 , the processing chip storage part 17 is provided below the cutting table 2A and the cutting table 2B, and has a guide chute 171 surrounding the cutting table 2A in plan view. , the upper opening 171X of the cutting table 2B; and the recovery container 172 for recovering the processing chips S guided by the guide chute 171 . By arranging the processing waste storage portion 17 below the cutting tables 2A and 2B, the recovery rate of the processing waste S can be improved.

The guide chute 171 guides the processing chips S scattered or dropped from the cutting tables 2A and 2B to the recovery container 172 . In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A and 2B (see FIG. 3 ). Therefore, the processing chips S are less likely to be missed, and the processing chips S can be further increased. recovery rate. In addition, the guide chute 171 is provided to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4 ). It is configured to protect the rotating mechanism 9A and the rotating mechanism 9B from the influence of machining chips S and cutting water.

In this embodiment, the processing chip receiving part 17 is shared by the two cutting tables 2A and 2B, but may be provided corresponding to the cutting table 2A and the cutting table 2B respectively.

The recovery container 172 collects the processing chips S that have passed through the guide chute 171 due to its own weight. In the present embodiment, as shown in FIG. 4 and others, the recovery container 172 is provided corresponding to the two cutting tables 2A and 2B. Furthermore, the two recovery containers 172 are arranged on the front side of the transmission shaft, and are configured to be independently detachable from the front side of the cutting device 100 . With this structure, maintenance such as disposal of machining chips S can be improved. Furthermore, one recovery container 172 may be provided under all the cutting tables, or three or more recovery containers 172 may be provided in consideration of the size of the sealed substrate W, the size and amount of the processing chips S, workability, etc.

In addition, as shown in FIG. 4 etc., the machining chip storage part 17 has the separation part 173 which separates cutting water and machining chips. As a structure of the separation unit 173 , for example, a filter such as a porous plate that allows cutting water to pass is provided on the bottom surface of the recovery container 172 . The separation part 173 makes it possible to collect the machining chips S without accumulating cutting water in the recovery container 172 .

<First Cleaning Mechanism 18>

In addition, as shown in FIGS. 1 and 5 , the cutting device 100 of the present invention further includes a first cleaning mechanism 18 . The first cleaning mechanism 18 cleans a plurality of cutting tables held on the cutting tables 2A and 2B. Clean the upper surface side (mounting surface) of product P. The mentioned A cleaning mechanism 18 cleans the products by injecting cleaning fluid and/or compressed air from the injection nozzle 18a (see FIG. 5 ) onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. Clean the upper surface side of P.

As shown in FIG. 5 , the first cleaning mechanism 18 is configured to move along the transmission shaft 71 together with the first holding mechanism 3 . Here, the first cleaning mechanism 18 is provided on the sliding member 723 which slides on the guide rail 721 provided on the transmission shaft 71 . Here, between the first cleaning mechanism 18 and the sliding member 723, an up-and-down movement mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction is provided. As the lifting and lowering movement mechanism 181 , for example, it may be considered to use a rack and pinion mechanism, a ball screw mechanism, or a cylinder.

<Second cleaning mechanism 19>

Furthermore, as shown in FIG. 1 , the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (opposite surface) of the plurality of products P held by the second holding mechanism 6 . ) for cleaning. The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection part 13, and injects cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. The lower surface side of product P is cleaned. That is, while the second holding mechanism 6 is moving along the transmission shaft 71 , the second cleaning mechanism 19 cleans the lower surface side of the product P.

<Machining fluid supply mechanism 12 (cutting water supply mechanism) and machining fluid scattering prevention mechanism 24 (cutting water scattering prevention mechanism)>

In this embodiment, as described above, the processing feed direction SD of the cutting mechanism 4 is directed toward one side along the X direction (in FIG. 3 , downward from the paper surface). The direction of movement is the direction of movement from right to left on the paper in Figure 4).

Furthermore, as shown in FIGS. 3 , 4 , 10 and 11 , the cutting device 100 of this embodiment includes a cutting water supply mechanism 12 that moves together with the cutting mechanism 4 by a cutting moving mechanism 8 . and a cutting water scattering prevention mechanism 24 that prevents the cutting water from scattering.

Here, the cutting mechanism 4 and the cutting water supply mechanism 12 are provided on one side of the support body 812 along the X direction (the side facing the machining feed direction SD). A cutting water scattering prevention mechanism 24 is provided on the other side (the side opposite to the machining feed direction SD).

As shown in FIGS. 10 and 11 , the cutting water supply mechanism 12 has an injection nozzle 121 for injecting cutting water from the front side in the machining feed direction SD to the blades 41A and 41B of the cutting mechanism 4 . The injection nozzle 121 sprays cutting water from the Z direction, for example. The moving part 83 supports. Specifically, the injection nozzle 121 injects cutting water toward the blades 41A and 41B of the cutting mechanism 4 from the side opposite to the support 812 .

The cutting water scattering prevention mechanism 24 is provided on the rear side of the cutting mechanism 4 in the machining feed direction SD, and covers the upper side from a position lower than the upper surfaces of the cutting tables 2A and 2B. structure.

Specifically, as shown in FIGS. 3 , 4 , 10 and 11 , the cutting water scattering prevention mechanism 24 includes a bellows member 241 that expands and contracts with the movement of the cutting mechanism 4 , and a machining process member 241 connected to the bellows member 241 . To the baffle member 242 at the rear end in the direction SD.

The bellows member 241 covers the upper side and the side orthogonal to the processing feed direction SD. Specifically, the bellows member 241 has a pair of side wall parts that cover the sides, and an upper wall part that is provided continuously with the upper ends of the pair of side wall parts and covers the upper side. In addition, the front end portion of the bellows member 241 in the processing feed direction SD is connected to the side surface of the support body 812 (the surface on the opposite side to the processing feed direction SD). In addition, the baffle member 242 covers the rear side in the processing feed direction SD. By these bellows members 241 and baffle members 242, the material passes below the support body 812 (specifically, below the beam portion of the support body 812) and is scattered toward the side opposite to the processing feed direction SD with respect to the support body 812. The cutting water is enclosed in the space surrounded by the bellows member 241 and the baffle member 242 . Here, by exhausting the inside of the guide chute 171 of the machining chip storage portion 17 using an exhaust mechanism (not shown), the liquid droplets (mists) can be efficiently exhausted to the outside.

In addition, as shown in FIGS. 3 , 4 , 10 and 11 , the cutting water scattering prevention mechanism 24 has the function of fixing the baffle member 242 to the cutting table 2A when the sealed substrate W is cut by the cutting mechanism 4 . Fixed portion 243A and fixed portion 243B of the cutting table 2B. In this embodiment, since there are two cutting stands 2A and 2B, the fixing portions 243A and 243B are provided corresponding to the two cutting stands 2A and 2B, respectively. Specifically, each fixing portion 243A, 243B is provided on the rear side in the processing feed direction SD with respect to each cutting table 2A, 2B. In addition, two of each of the fixing portions 243A and 243B are provided along the Y direction in order to fix both end portions of the baffle member 242 in the Y direction (see FIG. 3 ).

Furthermore, the baffle members 242 are moved by the X-direction moving part 81 of the cutting moving mechanism 8 to respective positions corresponding to the two cutting tables 2A and 2B. Fixed part 243A, fixed part 243B.

Here, when the sealed substrate W is cut by the cutting mechanism 4, the lower end portion of the baffle member 242 is positioned lower than the upper surface of each cutting table 2A, 2B. Therefore, as shown in FIGS. 10 , 11 and 12 , the baffle member 242 of this embodiment is configured so that its lower end can be positioned above the upper surfaces of the cutting tables 2A and 2B. The ascending position U (refer to FIGS. 10 and 12(a)) and the descending position D (refer to FIGS. 11 and 2B) with the lower end located lower than the upper surfaces of the cutting platforms 2A and 2B. 12(b)). Furthermore, the lower end portions of the pair of side wall portions of the bellows member 241 may be disposed at a position lower than the upper surfaces of the cutting stands 2A and 2B.

Furthermore, as shown in FIGS. 11 and 12(b) , the baffle member 242 is fixed at the lowered position D by the fixing parts 243A and 243B. Specifically, the baffle member 242 is fixed in the lowered position D by fitting the first protruding portion 242a provided on the side surface of the baffle member 242 into the recessed portions of the fixing portions 243A and 243B.

In addition, the baffle member 242 is connected to the rear end of the bellows member 241 in a manner that can move up and down. As shown in FIGS. 3 , 4 , 10 to 12 , the baffle member 242 can be lifted and lowered by the lifting mechanism provided on the support body 812 . The moving mechanism 244 moves up and down.

As shown in FIGS. 10 to 12 , the lifting and lowering movement mechanism 244 has a baffle holding part 244 a that holds the baffle member 242 , and a guide rail that guides the baffle holding part 244 a in the up and down direction (Z direction) relative to the support body 812 . 244b, and a driving part 244c such as an air cylinder that moves the baffle holding part 244a along the guide rail 244b. Yu Benshi In the embodiment, the baffle holding part 244a has a recessed part that fits into the second protruding part 242b provided on the side surface of the baffle member 242.

By raising the baffle holding part 244a by the driving part 244c, the recessed part of the baffle holding part 244a is fitted into the second protruding part 242b, the baffle holding part 244a lifts the baffle member 242, and the baffle member 242 moves to the raised position. U (see (a) of Fig. 10 and Fig. 12 ). In addition, the raised position U is a state in which the baffle member 242 is held by the baffle holding part 244a, and the fixing of the baffle member 242 by the fixing parts 243A and 243B is released.

<Operation of the cutting water scattering prevention mechanism 24 accompanying cutting>

Next, considering the case where the sealed substrate W is cut on the cutting table 2A on the left side of FIG. 4 , the operation of the cutting water scattering prevention mechanism 24 will be described with reference to FIGS. 10 to 14 .

First, the baffle holding part 244a of the lifting and lowering movement mechanism 244 is raised, the baffle holding part 244a is fitted with the second protruding part 242b of the baffle member 242, and the baffle member 242 is raised to the raised position U (see FIG. 10, Figure 12 (a), Figure 13 (a)). In addition, the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2A by the transport moving mechanism 7, and the sealed substrate W is placed on the cutting table 2A (see (a) of FIG. 13 )). In this state, the support body 812 of the cutting moving mechanism 8 is moved to one side along the X direction, and the baffle member 242 is moved above the fixing portion 243A corresponding to the left cutting table 2A. In this position, when the baffle holding part 244a of the lifting and lowering movement mechanism 244 is lowered, the baffle member 242 is lowered to the lowering position D, and is fitted and fixed with the fixing part 243A (see See Figure 12(b) and Figure 13(b)). Furthermore, when the baffle member 242 is placed in the lowered position D, the retaining of the baffle member 242 by the baffle holding portion 244a is released.

After the baffle member 242 is fixed by the fixing part 243A, the cutting mechanism 4 is moved in the machining feed direction SD by the cutting moving mechanism 8 while injecting cutting water from the injection nozzle 121 of the cutting water supply mechanism 12. At the same time, the sealed substrate W is cut (see (c) of FIG. 11 and FIG. 13 ). In this cutting operation, along with the movement of the cutting mechanism 4 and the support body 812, the bellows member 241 expands and contracts while the rear end of the bellows member 241 is fixed to the baffle member 242. Thereby, the cutting water that passes under the support body 812 and scatters is blocked by the bellows member 241 and the baffle member 242 , thereby preventing the cutting water from scattering to the right cutting table 2B and the like.

When the cutting of the sealed substrate W is completed, the support body 812 of the cutting moving mechanism 8 is moved to the vicinity of the fixed part 243A, and the baffle holding part 244a is moved to a position where it can connect with the second protruding part 242b of the baffle member 242 The position of the chimera. In this state, the baffle holding part 244a of the lifting and lowering movement mechanism 244 is raised, the baffle holding part 244a is fitted with the second protruding part 242b, and the baffle member 242 is moved to the raised position U (see ( in FIG. 12 a), (d) of Figure 14). Thereby, the fixing of the baffle member 242 by the fixing part 243A is released. Then, the support body 812 of the cutting moving mechanism 8 is moved to a position that does not interfere with the transportation of the plurality of products P. In this state, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting table 2A after cutting, and the second holding mechanism 6 adsorbs and holds the plurality of products P, and the plurality of products P are removed from the cutting table 2A. Transport (see (e) of Fig. 14).

Thereafter, the sealed substrate W is cut on the right cutting table 2B. In the case of , after placing the sealed substrate W on the cutting table 2B (see (f) of FIG. 14 ), the support 812 of the cutting moving mechanism 8 is moved to the other side along the X direction. , the baffle member 242 is moved above the fixing part 243B corresponding to the cutting table 2B on the right side. The subsequent actions are the same as those described above.

<An example of the operation of the cutting device>

Next, an example of the operation of the cutting device 100 will be described. In FIG. 15 , the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 during the operation of the cutting device 100 are shown. In addition, in this embodiment, all operations or controls such as the operation of the cutting device 100, such as the transportation of the sealed substrate W, the cutting of the sealed substrate W, the operation of the cutting water scattering prevention mechanism 24, and the inspection of the product P are This is performed by the control unit CTL (see Figure 1).

The substrate supply part 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodating part 111 toward the holding position RP held by the first holding mechanism 3 .

Next, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 absorbs and holds the sealed substrate W. Thereafter, the transport moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting table 2A and the cutting table 2B, and the first holding mechanism 3 releases the adsorption and holding, and holds the sealed substrate W. Place them on the cutting table 2A and the cutting table 2B. At this time, the X-direction position of the sealed substrate W is adjusted by the main moving mechanism 72 , and the Y-direction position of the sealed substrate W is adjusted by the horizontal moving mechanism 74 . Furthermore, the cutting table 2A and the cutting table 2B adsorb and hold the sealed substrate W.

Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting and lowering moving mechanism 73 raises the first holding mechanism 3 to a position where it is not in contact with the cutting moving mechanism 8 (supporting Body 812) to the location where physical interference occurs. Furthermore, when moving the first holding mechanism 3 holding the sealed substrate W to the cutting stage 2B, there is no need to retract the support body 812 from the cutting stage 2B to the transfer stage 5 side. As described above, the first holding mechanism 3 is raised and lowered.

In this state, the cutting moving mechanism 8 sequentially moves the two spindles 42A and 42B in the X direction and the Y direction, and rotates the cutting tables 2A and 2B to cut the sealed substrate W into a grid. Shape and monolithic. When the sealed substrate W is cut into a grid shape, the cutting water scattering prevention mechanism 24 performs the operation described in the "Operation of the cutting water scattering prevention mechanism 24 accompanying cutting".

After cutting, the conveyance moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (mounting surfaces) of the plurality of products P held on the cutting tables 2A and 2B. After the above cleaning, the transport moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.

Next, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 absorbs and holds the plurality of products P. Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 . Thereby, the second cleaning mechanism 19 cleans the lower surface side (opposite surface) of the plurality of products P held by the second holding mechanism 6 .

After cleaning, the plurality of products P held in the second holding mechanism 6 are inspected on both sides by the inspection part 13 and the reversing mechanism 14 . Thereafter, the transport moving mechanism 7 The second holding mechanism 6 is moved to the transfer table 5 , the second holding mechanism 6 releases the suction holding, and the plurality of products P are placed on the transfer table 5 . The plurality of products P placed on the transfer table 5 are classified into various trays 21 by the classification mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13 .

Furthermore, regarding the double-sided inspection, for example, first one of the surfaces of the product P is inspected while being suction-held by the second holding mechanism 6 . Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while being adsorbed and held by the reversed holding table 141, whereby both sides can be performed. Check. Furthermore, subsequent transportation of the product P from the holding table 141 to the transfer table 5 can be performed by transferring from the holding table 141 to the second holding mechanism 6 . In addition, the holding table 141 is configured to be movable in the X direction, and at least one of the holding table 141 and the transfer table 5 is made to be movable in the Z direction, so that the holding table 141 is moved to the transfer position. Above the stage 5, the product P can also be transported to the transfer stage 5 and transferred.

<Effects of this embodiment>

According to the cutting device 100 of this embodiment, the first holding mechanism 3 and the first holding mechanism 3 are moved by the common transmission shaft 71 extending along the arrangement direction of the cutting table 2A, the cutting table 2B, and the transfer table 5 . The structure of the second holding mechanism 6 allows the cutting mechanism 4 to move on the horizontal plane in the X direction along the transmission axis 71 and in the Y direction orthogonal to the X direction respectively by the cutting moving mechanism 8, so there is no need to move the cutting mechanism 4 The sealed substrate W can be processed by moving the cutting table 2A and the cutting table 2B in the X direction and the Y direction. Therefore, the cutting table 2A and the cutting table 2B can be used without using the ball screw mechanism. Movement without the need for an bellows member to protect the ball screw mechanism and a cover member to protect the bellows member. As a result, the device structure of the cutting device 100 can be simplified. In addition, the cutting table 2A and the cutting table 2B can be configured so as not to move in the X direction and the Y direction, so that the area occupied by the cutting device 100 can be reduced.

In addition, in the present embodiment, in the structure in which cutting water is sprayed toward the cutting mechanism 4 from the front side in the machining feed direction SD, since the cutting mechanism 4 is provided with a self-control device on the rear side in the machining feed direction SD, The lower positions of the upper surfaces of the cutting tables 2A and 2B cover the upper cutting water scattering prevention mechanism 24 , thereby preventing the cutting water from scattering. Especially in this embodiment, in the structure in which the cutting mechanism 4 and the cutting water supply mechanism 12 are provided on one side of the support body 812 along the X direction, since the other side of the support body 812 along the X direction A cutting water scattering prevention mechanism 24 is provided on one side, thereby preventing cutting water that has passed through the lower side of the support body 812 from scattering on the other side of the support body 812 along the X direction.

Furthermore, in this embodiment, since the cutting water scattering prevention mechanism 24 is configured using the bellows member 241, it can prevent the cutting water from scattering while following the movement of the cutting mechanism 4 by the cutting moving mechanism 8. Here, since the baffle member 242 is connected to the rear end of the bellows member 241 in the processing feed direction SD, and the baffle member 242 is fixed by the fixing portion 243A and the fixing portion 243B, the sealed substrate is When W is being processed, the space surrounded by the bellows member 241 and the baffle member 242 can be fixed, and the scattering of cutting water can be reliably prevented.

In addition, since there are two or more cutting tables 2A and 2B along the X direction, The structure is such that the support body 812 supporting the spindles 42A and 42B is disposed and moved in the X direction. Therefore, when the sealed substrate W is processed by one of the cutting stations 2A, the other cutting table 2A can be cut. Use the station 2B to perform other processing such as transportation. Furthermore, in this embodiment, since the fixing portions 243A and 243B for fixing the baffle members are provided for each of the cutting stands 2A and 2B, the bellows member 241 can be formed into one cutting stand 2A, 2B. The length corresponding to 2B can reduce the size of the bellows member 241 in the contracted state. In addition, in order to fix the baffle member 242 to each of the cutting tables 2A and 2B, one of the cutting tables 2A and 2B is covered with the bellows member 241, so that the unprocessed cutting table 2A and the cutting table 2A can be improved. The cutting station 2B has processing capabilities such as being able to carry in the sealed substrate W before processing, or being able to carry out a plurality of products P, and the like.

In this embodiment, the pair of X-direction guide rails 811 provided in the X-direction are provided across the cutting table 2A and the cutting table 2B. Therefore, the distance between the pair of X-direction guide rails 811 can be increased. As a result, the influence on processing caused by the positional deviation of the X-direction guide rails 811 in the Z-direction can be reduced. Furthermore, as the distance between the pair of guide rails 811 increases, the straightness of the X-direction moving part 81 improves. As a result, the wobbling of the blade tips of the blades 41A and 41B becomes smaller, and the cutting resistance during cutting becomes smaller, thereby reducing the cutting resistance. Can improve processing accuracy. In addition, the X-direction guide rail 811 can use components with lower specifications than before.

In this embodiment, since the two or more cutting tables 2A and 2B do not move in the Y direction during cutting, the movement of the two or more cutting tables 2A and 2B can be adjusted simultaneously. The parallelism of the mechanism 8 (X-direction moving part 81) in the X-direction. That is, when two cutting tables are installed in a conventional device that moves the cutting table during cutting, it is necessary to adjust the parallelism of the two cutting tables in the X direction. Furthermore, the adjusted parallelism in the X direction and the parallelism of the blade in the X direction are adjusted (specifically, two adjustments are required). In this embodiment, the two cutting tables 2A , 2B does not move in the X direction during cutting, so only the parallelism of the blades 41A and 41B in the X direction can be adjusted (specifically, it can be adjusted once).

<Other modified embodiments>

In addition, the present invention is not limited to the above-described embodiment.

For example, in the above-described embodiment, a cutting device with a double cutting table type and a double mandrel structure has been described, but the invention is not limited thereto. A cutting device with a single cutting table type and a single mandrel structure may also be used. Or a cutting device with a single cutting table type and a double mandrel structure, etc. In addition, a structure having three or more cutting stages may be used. Even in this case, it is a structure which has three or more fixing parts corresponding to three or more cutting stands respectively.

In addition, the transfer table 5 in the above embodiment is an index table that is temporarily placed before sorting into various pallets 21 , but the transfer table 5 may also be used as the holding table 141 of the reversal mechanism 14 .

Furthermore, in the above-mentioned embodiment, it is a structure in which the transfer stage 5 is sorted into the tray 21 (also called "tray storage"). However, a plurality of products P may be attached to an attachment member having an adhesive surface. It may be a structure in which multiple products P are dropped into a storage box and stored in a scattered state (also called "bulk storage"), or a structure in which multiple products P are dropped into a storage box and stored in a scattered state (also called "bulk storage"). A structure in which the individual product P is inserted into the opening at one end of the cylindrical container and stored (also called "tube storage").

Moreover, in the structure of the said embodiment, you may make it a structure which forms a groove|channel in the cutting table 2A and the cutting table 2B, without cutting the sealed substrate. In this case, for example, a structure may be adopted in which the sealed substrate W subjected to groove processing on the cutting tables 2A and 2B is moved by the first holding mechanism 3 and the transport moving mechanism 7 and returns to the substrate supply unit 112 . In addition, a structure may be adopted in which the sealed substrate W returned to the substrate supply part 112 is accommodated in the substrate accommodating part 111 .

In addition, since the cam rack element constituting the transmission shaft 71 can be configured by connecting a plurality of them, for example, the cutting device (processing device) 100 can be configured to be separable and connectable between the second cleaning mechanism 19 and the inspection part 13 ( Modular structure that can be attached and detached). In this case, for example, a module that performs a different type of inspection from the inspection in the inspection unit 13 may be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Furthermore, in addition to the structure illustrated here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (removable) somewhere, or an additional module may be used as an inspection unit. Modules with various functions other than.

In addition, the processing device of the present invention can also perform processing other than cutting, for example, it can also perform other mechanical processing such as cutting or grinding.

In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention.

[Industrial availability]

According to the present invention, the device structure can be simplified and the occupied area can be reduced, while the scattering of the machining fluid can be prevented.

2A, 2B: Cutting table (processing table)

9A, 9B: Rotating mechanism

12: Cutting water supply mechanism (machining fluid supply mechanism)

15: cover member

16. 241: Bellows member

17: Processing waste collection department

24: Cutting water scattering prevention mechanism (machining fluid scattering prevention mechanism)

41A: Blade

42A: mandrel

71: Common transmission shaft (transmission shaft)

81:X direction moving part

82:Y direction moving part

83:Z direction moving part

121:Jet nozzle

171:Guide chute

171X: Upper opening

172:Recycling container

173:Separation Department

242:Baffle component

243A, 243B: Fixed part

244: Lifting and moving mechanism

811: A pair of X-direction guide rails (X-direction guide rail, guide rail)

812:Support

822:Y direction slider

832:Z direction slider

S: Processing chips

SD: processing feed direction

W: Sealed substrate (object to be processed)

X, Y, Z: direction

Claims (10)

A processing device includes: a processing table that holds a processing object; a first holding mechanism that holds the processing object in order to transport the processing object to the processing table; and a processing mechanism that holds the processing object on the processing table. the processing object is processed; a transfer table moves the processed object; and a second holding mechanism is used to transport the processed object from the processing table to the transfer table and retaining the processed object; a transport moving mechanism extending along the arrangement direction of the processing table and the transfer table and used to move the first holding mechanism and the second holding mechanism A common transmission axis that moves; a moving mechanism for processing that moves the processing mechanism in a first direction along the transmission axis and a second direction orthogonal to the first direction on the horizontal plane; machining fluid a supply mechanism that moves together with the processing mechanism by the processing moving mechanism, and injects processing fluid to the processing mechanism from one side of the processing feed direction; and a processing fluid scattering prevention mechanism, relative to the processing The mechanism is provided on the other side in the machining feed direction, and covers the upper surface from a position lower than the upper surface of the machining table to prevent the machining fluid from scattering. The processing device according to claim 1, wherein the machining fluid scattering prevention mechanism has: an accordion member that expands and contracts with the movement of the processing mechanism to cover the upper and side sides orthogonal to the processing feed direction; and a baffle member connected to the rear end of the accordion member in the processing feed direction. The end covers the rear of the processing feed direction. The processing device according to claim 2, further comprising a fixing portion that fixes the baffle member to the processing table when the processing mechanism processes the object. The processing device according to claim 3 includes a plurality of the processing tables, and the fixing portions are provided corresponding to the plurality of processing tables. The processing apparatus according to claim 4, wherein the processing moving mechanism moves the baffle member to each of the plurality of fixing parts. The processing device according to any one of Claims 3 to 5, wherein the baffle member is capable of being positioned at a raised position above the upper surface of the processing table at its lower end, and in contact with the processing table. The lower end portion moves between lowered positions located below the upper surface of the processing table, and is fixed by the fixing portion at the lowered position. The processing device according to any one of claims 1 to 5, wherein the processing moving mechanism includes an X-direction moving part that moves the processing mechanism in a straight line in the X direction as the first direction. Move; and a Y-direction moving part to linearly move the processing mechanism in the Y direction as the second direction, the X-direction moving part having a pair of X-direction guide rails that move along the X-direction across the processing table direction setting; and the support body moves along the pair of X-direction guide rails and And the processing mechanism is supported via the Y-direction moving part. The processing device according to claim 7, wherein the direction toward one side along the X direction is the processing feed direction, and the support is provided on one side along the X direction of the support body. In the machining mechanism and the machining fluid supply mechanism, the machining fluid scattering prevention mechanism is provided on the other side of the support body along the X direction. The processing device according to claim 8, wherein a cover member for accommodating the processing mechanism and the processing fluid supply mechanism is provided on one side of the support body along the X direction. A method of manufacturing a processed product using the processing device according to any one of claims 1 to 9.