TWI834171B - Wire bonding device, maintenance method and program - Google Patents

Abstract

A wire bonding device for bonding a wire to a target includes: a prediction part which predicts, based on time-series data of a diagnosis result regarding an operation of the wire bonding device, a transition of a change from the diagnosis result in an initial state; and a setting part which sets a time point at which the prediction part predicts that an amount of change from the diagnosis result in the initial state reaches a first threshold value as a time point for performing maintenance of the wire bonding device. The wire bonding device allows the maintenance to be performed suitably.

Description

Wire bonding devices, maintenance methods and procedures

The present invention relates to a wire bonding device, a maintenance method and a program.

Previously, a wire bonding device has been known. The wire bonding device, for example, joins one end of a metal wire to an electronic component mounted on a substrate, and joins the other end of the metal wire to a terminal of the substrate, thereby wiring the metal wire to the electronic component. and the terminals of the substrate (for example, see Patent Document 1). [Prior art documents] [Patent Document]

Patent Document 1: Japanese Patent Application Publication No. 2020-119988

[Problem to be solved by the invention]

However, in the prior art, there is still room for improvement in the maintenance method of the wire bonding device.

The present invention was made to solve such a problem and provide a wire bonding device, a maintenance method, and a program that can be properly maintained. [Means to solve the problem]

A wire bonding device according to one aspect of the present invention bonds a wire to an object, and includes a prediction unit that predicts changes in diagnostic results from an initial state based on time series data of diagnostic results related to the operation of the wire bonding device. transition; and a setting unit that sets the time point when the prediction unit predicts that the change amount of the diagnosis result from the initial state reaches the first threshold value as the time point to perform maintenance of the wire bonding device.

A maintenance method according to one aspect of the present invention notifies information related to maintenance of the wire bonding device, and includes predicting a change in the diagnosis result from an initial state based on time series data of diagnosis results related to the operation of the wire bonding device. a step of transitioning; and a step of setting a time point when the change amount of the diagnosis result from the initial state is predicted to reach a first threshold value as a time point for performing maintenance on the wire bonding device.

Furthermore, a program in one aspect of the present invention causes one or more computers to execute a process of predicting a change in the diagnosis result relative to an initial state based on time series data of diagnosis results related to the operation of the wire bonding device. Processing; and processing of setting a time point when the change amount of the diagnosis result from the initial state is predicted to reach a first threshold value as a time point for performing maintenance on the wire bonding device. [Effects of the invention]

According to the present invention, maintenance can be performed appropriately.

Hereinafter, a wire bonding device according to an embodiment will be described with reference to the drawings.

As shown in FIG. 1 , the wire bonding device 10 includes, for example, a stage 11 , an XY stage 12 , a bonding head 13 , a bonding arm 14 , a soldering pin 15 (an example of a bonding tool), a discharge electrode 16 , and a wire clamp 17 .

The substrate 51 on which the semiconductor chip 50 is mounted is mounted on the stage 11 . A heater (not shown) for heating the terminals of the substrate 51 is built into the stage 11 .

The XY stage 12 is connected to the joint head 13 . The joining head 13 is connected to the joining arm 14 via a lifting mechanism (not shown). The joint arm 14 is an arm protruding from the joint head 13 in the horizontal direction. A soldering pin 15 is connected to the front end of the joint arm 14 . The bonding pin 15 can move along the horizontal direction with respect to the semiconductor wafer 50 placed on the stage 11 in conjunction with the horizontal movement of the bonding head 13 using the XY stage 12 and the vertical movement of the bonding arm 14 using the lifting mechanism. direction and relative movement in the up and down directions.

An ultrasonic vibrator is built into the joint arm 14 . When a voltage is applied to the ultrasonic vibrator during wire bonding, ultrasonic vibration is imparted to the soldering pin 15 connected to the tip of the bonding arm 14 .

The soldering pins 15 face each other in the up-and-down direction with respect to the stage 11 and include through-holes penetrating in the up-and-down direction. A bonding wire 60 such as a gold wire is inserted into the through hole of the soldering pin 15 . A discharge electrode 16 is arranged near the soldering pin 15 .

When a voltage is applied to the discharge electrode 16 , a discharge is generated between the discharge electrode 16 and the front end of the bonding wire 60 , thereby melting the front end of the bonding wire 60 to form the ball portion 61 .

The wire clamp 17 is provided above the soldering pin 15 and is configured to clamp the bonding wire 60 inserted into the through hole of the soldering pin 15 .

Furthermore, the wire bonding apparatus 10 presses the ball portion 61 formed at the first end of the wire 60 against the semiconductor wafer 50 as the voltage is applied to the discharge electrode 16 . Then, after bonding the first end of the bonding wire 60 to the semiconductor chip 50 , the wire bonding device 10 moves the soldering pin 15 to bend the bonding wire 60 so that a part of the bonding wire 60 faces the terminal of the substrate 51 in the up-down direction. Then, the wire bonding device 10 presses the part of the bonding wire 60 against the terminal of the substrate 51 as the voltage is applied to the discharge electrode 16 . Then, the wire bonding device 10 joins the part of the bonding wire 60 to the terminal of the substrate 51 , and moves the soldering needle 15 upward while holding the bonding wire 60 by the wire clamp 17 , thereby cutting the bonding wire 60 .

Next, the control structure of the wire bonding device 10 will be described.

As shown in FIG. 2 , the wire bonding device 10 includes, for example, a control unit 110 and a memory unit 120 .

The control unit 110 is implemented, for example, by a hardware processor such as a central processing unit (Central Processing Unit, CPU) executing a program (software). In addition, some or all of these structural elements can be implemented by Large Scale Integration (LSI) or Application Specific Integrated Circuit (ASIC) or Field-Programmable Gate Array (Field-Programmable Gate). Array, FPGA), graphics processing unit (Graphics Processing Unit, GPU) and other hardware (including circuit part: circuit), can also be realized through the collaboration of software and hardware. The program can be pre-stored in a memory device such as a hard disk drive (HDD) or flash memory of the wire bonding device 10 , or can be stored in a digital versatile disc (DVD) or read-only device. In a removable memory medium such as a compact disc-read only memory (CD-ROM), the memory medium is installed in the drive device, thereby being installed in the HDD or flash memory of the wire bonding device 10 .

The storage unit 120 is a non-volatile storage medium, including, for example, HDD (Hard Disk Drive). In addition to storing programs for executing control or processing of the wire bonding device 10 , the memory unit 120 also stores various parameter values, functions, check tables, etc. used for control or calculation. The diagnostic data 121, the first threshold value 122, the second threshold value 123, and the maintenance data 124 are examples of parameter values used for control or operation.

The diagnostic data 121 is time-series data of diagnostic results related to the operation of the wire bonding device 10 , and is obtained every time the wire bonding device 10 is used for bonding. Data items of the diagnostic data 121 include, for example, XYZ Lissajous, XYZ deviation, XY guidance, Z load, US impedance, US frequency, US calibration, and CL load. For example, the XYZ Lissajous waveform uses the average value of the A phase and the B phase of the Lissajous waveform as the diagnosis result. The XYZ deviation measures the deviation of each axis, and the difference from the XYZ optimization is used as the diagnosis result. The XY guide uses the value obtained by subtracting the minimum value from the maximum value of the current command value in each measurement interval as the diagnosis result. The Z load takes the balanced load of the Z axis during Z calibration as the diagnostic result. US impedance uses the resonance impedance during US calibration as the diagnostic result. The US frequency uses the resonance frequency during US calibration as the diagnostic result. US calibration uses the US calibration value as the diagnostic result. CL load uses the initial value during CL load calibration as self-diagnosis, and the difference between the value during calibration and the value during self-diagnosis is used as the diagnosis result. The first threshold value 122 is a threshold value of the diagnostic data 121 when the maintenance time point of the wire bonding device 10 is set in advance. The second threshold value 123 is the threshold value of the diagnostic data 121 when the operation of the wire bonding device 10 is stopped. The first threshold value 122 is a value smaller than the second threshold value 123 . Regarding the first threshold value 122 and the second threshold value 123, for example, the diagnostic data 121 just after the last maintenance is performed is set as the reference data. The maintenance data 124 indicates the maintenance time point of the wire bonding device 10 set using the first threshold value 122 .

The control unit 110 includes, for example, an acquisition unit 111, a diagnosis unit 112, a prediction unit 113, a setting unit 114, and a notification unit 115.

The acquisition unit 111 acquires diagnostic data 121 related to the operation of the wire bonding device 10 .

The diagnosis unit 112 diagnoses the operation of the wire bonding device 10 based on the diagnosis data 121 obtained by the acquisition unit 111 .

The prediction unit 113 predicts a change in the diagnostic data 121 from the initial state based on the diagnostic data 121 related to the operation of the wire bonding device 10 . For example, the prediction unit 113 calculates a function that approximates a change in the diagnostic data 121 from the initial state based on the diagnostic data 121 . The initial state includes, for example, a state in which the wire bonding device is introduced, a state in which the wire bonding device is operated after maintenance, or a state in which there is an instruction to reset from the screen of the wire bonding device.

The setting unit 114 sets the time when the prediction unit 113 predicts that the change amount of the diagnostic data 121 from the initial state reaches the first threshold value 122 as the time to perform maintenance on the wire bonding device 10 . For example, the setting unit 114 sets the time point at which the function calculated by the prediction unit 113 crosses the first threshold value 122 as the time point at which maintenance of the wire bonding device 10 is performed.

The setting unit 114 switches the execution of the error of the wire bonding device when the change amount of the diagnostic data 121 from the initial state reaches the first threshold value 122 by the prediction unit 113 based on whether a predetermined operation is accepted from the user. Information related to maintenance of the wire bonding device 10 is stopped or notified.

The notification unit 115 notifies the information related to the maintenance of the wire bonding device 10 on the condition that the setting unit 114 is set to notify the information related to the maintenance of the wire bonding device 10 .

FIG. 3 is a diagram showing an example of transition of changes in diagnostic data relative to an initial state. In the example shown in FIG. 3 , diagnostic data 121 is obtained periodically, and the number of diagnostic data 121 is accumulated as time passes. The prediction unit 113 calculates a function that approximates the change in the diagnostic data 121 relative to the initial state on the condition that the number of diagnostic data 121 is a predetermined number or more, and displays the calculated function in the form of a graph. In this example, the diagnostic data 121 is a graph in which the data value increases with the passage of time, and the time point t1 when the diagnostic data 121 reaches the first threshold value 122 is set as the time point to perform maintenance on the wire bonding device 10 .

FIG. 4 is a diagram showing an example of a maintenance timing setting process of the wire bonding device 10 . In the example shown in FIG. 4 , the data items of the setting history include, for example, the type of maintenance, the maintenance items, and the scheduled date of maintenance. A maintenance start button B1 and an end button B2 are attached at positions adjacent to these data items. When the start button B1 is operated, the corresponding maintenance is started manually. When the end button B2 is operated, execution of the corresponding maintenance ends.

Next, the reporting process of the wire bonding quality inspection result in the wire bonding device 10 according to the embodiment will be described with reference to the flowchart shown in FIG. 5 .

As shown in FIG. 5 , the wire bonding device 10 sets the reference data of the diagnostic data 121 (step S10 ). Next, the wire bonding device 10 obtains the diagnostic data 121 (step S11). Next, the wire bonding apparatus 10 predicts a change in the diagnostic data 121 relative to the initial state (step S12 ). Next, the wire bonding device 10 sets the time when the change amount of the diagnostic data 121 from the initial state is predicted to reach the first threshold value 122 as the time to perform maintenance on the wire bonding device 10 (step S13 ). Thus, the flow chart shown in Figure 5 is completed.

Next, the reporting process of the wire bonding quality inspection result in the wire bonding device 10 according to the embodiment will be described with reference to the flowchart shown in FIG. 6 .

As shown in FIG. 6 , the wire bonding device 10 determines whether the current time has reached the time to perform maintenance on the wire bonding device 10 (step S20 ). When the wire bonding device 10 determines that the current time point has reached the time point for maintenance of the wire bonding device 10 (step S20 = YES), the wire bonding device 10 determines whether the change amount of the diagnostic data 121 from the initial state has reached the first threshold value. At time 122 , an error stop determination of the wire bonding device 10 is performed (step S21 ). When the wire bonding device 10 determines that execution of the error stop of the wire bonding device 10 is set (step S21 = YES), the wire bonding device 10 executes the error stop (step S22 ). Next, the wire bonding device 10 determines whether there is an instruction to start maintenance (step S23 ). When the wire bonding device 10 determines that there is an instruction to start maintenance (step S23 = YES), the wire bonding device 10 performs maintenance (step S24 ), and ends the flowchart shown in FIG. 6 . On the other hand, when the wire bonding apparatus 10 determines that there is no instruction to start maintenance (step S23 = No), the wire bonding apparatus 10 does not perform maintenance and ends the flowchart shown in FIG. 6 . On the other hand, the wire bonding device 10 determines that the current time point has reached the time point for maintenance of the wire bonding device 10 (step S20 = No), or determines that an error stop of the wire bonding device 10 is set (step S21 =No), the maintenance-related information is notified (step S25), and the flow chart shown in FIG. 6 ends.

Furthermore, the above-mentioned embodiment can also be implemented in the following forms.

In the above embodiment, the first threshold value may be preset as an initial value in the preparatory stage of maintenance.

In the above-described embodiment, the setting of the second threshold value, which is the threshold value of the diagnostic data 121 when the operation of the wire bonding device 10 is stopped, may be omitted.

The wire bonding apparatus 10 of the embodiment has been described above, taking as an example the case where the terminals of the semiconductor chip 50 and the terminals of the substrate 51 are electrically connected by the wires 60 . In addition, the wire bonding apparatus of the above embodiment can also be applied to a case where, for example, a semiconductor module is constructed by electrically connecting the terminals of the semiconductor chip 50 and the terminals of the lead frame using the wires 60 . Furthermore, the wire bonding apparatus of the above embodiment can also be applied to a case where bumps are formed on arbitrary electrodes such as terminals of the semiconductor chip 50 by the wire 60 .

10:Wire bonding device 11: Carrier platform 12:XY platform 13:joint head 14:joint arm 15: Soldering pin 16: Discharge electrode 17: Cable clip 50:Semiconductor wafer 51:Substrate 60:Threading 61: Ball Club 110:Control Department 111:Acquisition Department 112:Diagnosis Department 113:Forecasting Department 114: Setting Department 115:Notification Department 120:Memory Department 121: Diagnostic information 122: first threshold value 123: The second threshold value 124:Maintenance information

FIG. 1 is a diagram showing the structure of a wire bonding device according to an embodiment. FIG. 2 is a diagram showing the control structure of the wire bonding device according to the embodiment. FIG. 3 is a diagram showing an example of transition of changes in diagnostic data relative to an initial state. FIG. 4 is a flowchart showing an example of setting processing of a maintenance time point for wire bonding in the wire bonding device according to the embodiment. FIG. 5 is a flowchart showing an example of maintenance processing in the wire bonding device according to the embodiment. 6 is a flowchart illustrating an example of reporting processing of inspection results of wire bonding quality in the wire bonding apparatus according to the embodiment.

10:Wire bonding device 110:Control Department 111:Acquisition Department 112:Diagnosis Department 113:Forecasting Department 114: Setting Department 115:Notification Department 120:Memory Department 121: Diagnostic information 122: first threshold value 123: The second threshold value 124:Maintenance information

Claims (9)

A wire bonding device that joins a wire to an object, and includes a prediction unit that obtains time series data of diagnostic results related to the operation of the wire bonding device for a plurality of maintenance items, and calculates all changes relative to an initial state. a function obtained by approximating a change in the diagnosis result to predict a change in the diagnosis result relative to an initial state, wherein the plurality of maintenance items include cleaning and calibration of the wire bonding device; and a setting unit, For each of the plurality of maintenance items, the time point when the prediction unit predicts that the change amount of the diagnosis result relative to the initial state of the plurality of maintenance items reaches a first threshold value is set to The time point when maintenance of the wire bonding device is performed. The wire bonding device according to claim 1, wherein the time series data of the diagnosis results includes time series data obtained after the last maintenance of the wire bonding device. The wire bonding device according to claim 1 or claim 2, wherein the first threshold value is set based on the diagnosis result of the wire bonding device just after the last maintenance was performed. The wire bonding device according to claim 1 or claim 2, wherein the first threshold value is a smaller value than the second threshold value, and the second threshold value is such that the wire bonding device The threshold value of the diagnostic result when the action stops. The wire bonding device as claimed in Claim 1 or Claim 2 further includes: an operation acceptance unit to accept specified operations, The setting unit switches when the prediction unit predicts that the change amount of the diagnosis result from the initial state reaches a first threshold value based on whether the predetermined operation is accepted through the operation accepting unit. Execution of an error stop of the wire bonding device or notification of information related to maintenance of the wire bonding device. The wire bonding device according to Claim 1 or Claim 2 further includes: a display unit that displays the set maintenance time point in the form of a scheduled maintenance date for each of the plurality of maintenance items. A maintenance method that notifies information related to the maintenance of a wire bonding device, and includes: obtaining time series data of diagnostic results related to the operation of the wire bonding device for a plurality of maintenance items, and calculating all changes relative to an initial state. The step of predicting the transition of the change of the diagnostic result relative to an initial state by approximating a function obtained by approximating the transition of the diagnostic result, wherein the plurality of maintenance items include cleaning and calibration of the wire bonding device; and for For each of the plurality of maintenance items, a time point when the change amount of the diagnosis result relative to the initial state of the plurality of maintenance items is predicted to reach a first threshold value is set to perform the operation of the wire bonding device. Maintenance timing steps. The maintenance method according to claim 7 further includes the step of notifying the set time point for maintenance of the wire bonding device. A program that causes one or more computers to perform the following processing: obtain time series data of diagnostic results related to the operation of the wire bonding device for a plurality of maintenance items, and calculate the change of the diagnostic results relative to the initial state. The process of predicting the change of the diagnostic result relative to the initial state by approximating the change of the function, wherein the plurality of maintenance items include cleaning and calibration of the wire bonding device; and for the plurality of For each maintenance item, a time point when the change amount of the diagnosis result from the initial state of the plurality of maintenance items is predicted to reach a first threshold value is set as the time point when maintenance of the wire bonding device is performed. handle.