TWI832971B - Inductor - Google Patents

Abstract

The present invention provides an inductor with good inductance and capable of suppressing crosstalk. The inductor 1 of the present invention includes a plurality of wirings 2 and a magnetic layer 3. The plurality of wirings 2 are arranged spaced apart from each other in the first direction. The plurality of wirings 2 each have a conductor 6 and an insulating layer 7, which are adjacent to each other. The first direction alignment region 10 in which the anisotropic magnetic particles 8 are aligned along the first direction is formed between the plurality of wirings 2 so as to include the imaginary line L2 passing through the center C1 of the wirings 2. The first direction alignment region 10 The distance N is 60% or less relative to the spacing S between the two wirings on the first imaginary line L2.

Description

Inductor

The present invention relates to an inductor.

It is known that inductors are mounted on electronic equipment and the like and are used as passive components such as voltage conversion components.

For example, an inductor is proposed, which has a rectangular parallelepiped chip body made of magnetic material, and an internal conductor such as copper embedded in the chip body, and the cross-sectional shape of the chip body is similar to the cross-sectional shape of the internal conductor. shape (see Patent Document 1). That is, in the inductor of Patent Document 1, a magnetic material is coated around a wiring (internal conductor) that is rectangular in cross-section (cuboid shape). [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 10-144526

[Problem to be solved by the invention]

However, studies have been conducted on using anisotropic magnetic particles such as flat magnetic particles as the magnetic material and arranging the anisotropic magnetic particles around the wiring to increase the inductance of the inductor.

However, in the inductor of Patent Document 1, since the wiring has a rectangular cross-sectional shape, there is a problem that it is difficult to align the anisotropic magnetic particles around the wiring due to the existence of corners and the like. Therefore, the improvement in inductance may not be sufficient.

In addition, an inductor with multiple wiring lines is also required. However, when an inductor has a plurality of wirings, a problem (crosstalk) occurs, that is, the magnetic properties of adjacent wirings interact with each other due to anisotropic magnetic particles, thereby generating noise.

The present invention provides an inductor with good inductance and capable of suppressing crosstalk. [Technical means to solve problems]

The present invention [1] includes a plurality of wirings and a magnetic layer covering the plurality of wirings. The plurality of wirings are arranged spaced apart from each other in the first direction. The plurality of wirings each include a conductor and an insulation covering the conductor. The above-mentioned magnetic layer contains anisotropic magnetic particles and a binder. The above-mentioned anisotropic magnetic particles are formed between the plurality of adjacent wirings in a manner that includes an imaginary line passing through the center of the wirings. In the first direction alignment region of the first direction alignment, the distance between the first direction alignment region and the distance between the wirings on the above imaginary line is 60% or less.

According to this inductor, since it is provided with a plurality of wirings and a magnetic layer covering the plurality of wirings, the anisotropic magnetic particles can be easily aligned in the outer circumferential direction around the plurality of wirings. Therefore, the inductance can be increased.

Furthermore, a first direction alignment region in which the anisotropic magnetic particles are aligned along the first direction is formed to include an imaginary line passing through the centers of the plurality of wirings, and the distance of the first direction alignment region is relative to the distance on the above imaginary line. The spacing between wiring rooms should be 50% or less. That is, in the space between the wirings, which is the path of the magnetic flux flowing in the first direction, the distance in the first direction alignment region is shorter than the distance outside it. Therefore, the influence of magnetic correlation from one wiring to another wiring can be reduced, and crosstalk can be suppressed.

The present invention [2] includes the inductor according to [1], wherein each has a first region around the plurality of wirings, and the anisotropic magnetic particles in the first region are aligned along the outer circumferential direction of the wirings. Therefore, the inductance can be increased.

The present invention [3] includes the inductor according to [2], which further includes a second region around each of the plurality of wirings, and the anisotropic magnetic particles in the second region are not aligned along the outer circumferential direction. Therefore, the DC superposition characteristics can be improved. [Effects of the invention]

According to the inductor of the present invention, the inductance is good and crosstalk can be suppressed.

In FIG. 1A , the left-right direction of the paper is the first direction, the left side of the paper is one side of the first direction, and the right side of the paper is the other side of the first direction. The upper and lower directions on the paper are the second direction (the direction orthogonal to the first direction), the upper side of the paper is one side of the second direction (one direction of the wiring axis), and the lower side of the paper is the other side of the second direction (the other side of the wiring axis). one direction). The paper thickness direction on the paper is the up and down direction (the third direction, the thickness direction, which is orthogonal to the first and second directions), the side near the paper is the upper side (the third direction side, the thickness direction side), and the back side of the paper is the lower side. (The other side in the third direction and the other side in the thickness direction). Specifically, follow the directional arrows in each figure.

＜One embodiment＞ 1.Inductor An embodiment of the inductor of the present invention will be described with reference to FIGS. 1A-2 .

As shown in FIGS. 1A and 1B , the inductor 1 has a substantially rectangular shape in plan view extending in the plane direction (the first direction and the second direction).

As shown in FIGS. 1A to 2 , the inductor 1 includes a plurality of (two) wirings 2 and a magnetic layer 3 .

(wiring) Each of the plurality of wiring lines 2 includes a first wiring line 4 and a second wiring line 5 . The second wiring line 5 is spaced apart from the first wiring line 4 in the width direction (first direction).

As shown in FIGS. 1AB , the first wiring 4 extends long in the second direction, and has, for example, a substantially U-shape in plan view. As shown in FIG. 2 , the first wiring 4 has a substantially circular cross-sectional shape.

The first wiring 4 includes a conductor 6 and an insulating layer 7 covering the conductor 6 .

The conductive wire 6 extends long in the second direction, and has, for example, a substantially U-shape in plan view. Moreover, the conductive wire 6 has a substantially circular cross-sectional shape sharing a central axis with the first wiring 4 .

The material of the conductor 6 is, for example, a metal conductor such as copper, silver, gold, aluminum, nickel or alloys thereof, preferably copper. The conductor 6 may have a single-layer structure, or may have a multi-layer structure in which the surface of the core conductor (such as copper) is plated (such as nickel).

The radius R1 of the conductor 6 is, for example, 25 μm or more, preferably 50 μm or more, and is, for example, 2000 μm or less, preferably 200 μm or less.

The insulating layer 7 is used to protect the wires 6 from being corroded by chemicals or water, and to prevent the wires 6 from being short-circuited. The insulating layer 7 is arranged to cover the entire outer peripheral surface of the conductor 6 .

The insulating layer 7 has a substantially annular cross-sectional shape that shares a central axis (center C1 ) with the first wiring 4 .

Examples of materials for the insulating layer 7 include polyvinyl formal, polyester, polyester amide, polyamide (including nylon), polyamide, polyamide and polyurethane. Ester and other insulating resins. One type of these materials may be used alone, or two or more types may be used in combination.

The insulating layer 7 may be composed of a single layer or multiple layers.

The thickness R2 of the insulating layer 7 is substantially uniform in the radial direction of the wiring 2 at any position in the circumferential direction, for example, 1 μm or more, preferably 3 μm or more, and, for example, 100 μm or less, preferably 50 μm or less.

The ratio (R1/R2) of the radius R1 of the conductor 6 to the thickness R2 of the insulating layer 7 is, for example, 1 or more, preferably 10 or more, and is, for example, 200 or less, preferably 100 or less.

The radius (R1+R2) of the first wiring 4 is, for example, 25 μm or more, preferably 50 μm or more, and, for example, 2000 μm or less, preferably 200 μm or less.

When the first wiring 4 is substantially U-shaped, the distance D2 between the centers of the first wiring 4 and the distance D1 between the centers of the plurality of wirings 2 described below are the same distance, for example, 20 μm or more, preferably 50 μm or more, and for example, 3000 μm or less, preferably 2000 μm or less.

The second wiring 5 has the same shape as the first wiring 4 and has the same structure, size and material. That is, like the first wiring 4 , the second wiring 5 includes a conductor 6 and an insulating layer 7 covering the conductor 6 .

The distance S between the first wiring 4 and the second wiring 5 is the shortest distance between the outer peripheral edge of the first wiring 4 and the outer peripheral edge of the second wiring 5, that is, the magnetic layer 3 located between the first wiring 4 and the second wiring 5 The distance from the first imaginary line L2. Specifically, the spacing S between the wirings 2 (4, 5) is, for example, 20 μm or more, preferably 70 μm or more, and is, for example, 2000 μm or less, preferably 1000 μm or less.

The distance D1 between the centers of the first wiring 4 and the second wiring 5 is, for example, 20 μm or more, preferably 50 μm or more, and is, for example, 3000 μm or less, preferably 2000 μm or less.

(magnetic layer) Magnetic layer 3 is a layer used to increase inductance.

The magnetic layer 3 is disposed so as to cover the entire outer peripheral surface of the plurality of wirings 2 . Magnetic layer 3 forms the outer shape of inductor 1 . Specifically, the magnetic layer 3 has a substantially rectangular shape in plan view extending in the plane direction (the first direction and the second direction). In addition, the second direction end edges of the plurality of wirings 2 are exposed on the other surface of the magnetic layer 3 in the second direction.

The magnetic layer 3 is formed of a magnetic composition containing anisotropic magnetic particles 8 and a binder 9 .

Examples of the magnetic material constituting the anisotropic magnetic particles (hereinafter, also referred to as "particles") 8 include soft magnets and hard magnets. From the viewpoint of inductance, soft magnets are preferred.

Examples of the soft magnet include a single metal body containing one metal element in a pure material state, and, for example, one or more metal elements (first metal element) and one or more metal elements (second metal element), and/or The eutectic (mixture) of non-metallic elements (carbon, nitrogen, silicon, phosphorus, etc.) is the alloy body. These can be used alone or in combination.

Examples of the single metal body include a metal element composed of only one metal element (first metal element). As the first metal element, for example, iron (Fe), cobalt (Co), nickel (Ni) and other metal elements contained as the first metal element of the soft magnetic material can be appropriately selected.

Examples of the single metal body include a core containing only one metal element, and a surface layer containing an inorganic substance and/or an organic substance that modifies part or all of the surface of the core, for example, a core containing a first metal element. The form of an organic metal compound or an inorganic metal compound after decomposition (such as thermal decomposition). More specifically, examples of the latter form include iron powder (sometimes referred to as carbonyl iron powder) obtained by thermal decomposition of an organic iron compound (specifically, carbonyl iron) containing iron as the first metal element. Furthermore, the position at which the layer containing the inorganic substance and/or the organic substance is modified, which is a part containing only one metal element, is not limited to the surface as described above. In addition, the organic metal compound or inorganic metal compound that can obtain a single metal body is not particularly limited, and can be appropriately selected from known or commonly used organic metal compounds or inorganic metal compounds that can obtain a single metal body of a soft magnetic body.

An alloy system is a eutectic melt of more than one metallic element (the first metallic element) and more than one metallic element (the second metallic element) and/or non-metallic elements (carbon, nitrogen, silicon, phosphorus, etc.), as long as it is The alloy bodies that can be used as soft magnets are not particularly limited.

The first metal element is an essential element in the alloy body, and examples thereof include iron (Fe), cobalt (Co), nickel (Ni), and the like. Furthermore, if the first metal element is Fe, the alloy system is an Fe-based alloy. If the first metal element is Co, the alloy system is a Co-based alloy. If the first metal element is Ni, the alloy system is Ni series alloy.

The second metal element is an element (auxiliary component) contained in the alloy body and is compatible (eutectic) with the first metal element. Examples thereof include iron (Fe) (the first metal is other than Fe). element), cobalt (Co) (when the first metal element is an element other than Co), nickel (Ni) (when the first metal element is an element other than Ni), chromium (Cr), aluminum (Al), silicon (Si), copper (Cu), silver (Ag), manganese (Mn), calcium (Ca), barium (Ba), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), molybdenum (Mo), tungsten (W), ruthenium (Ru), rhodium (Rh), zinc (Zn), gallium (Ga), indium (In), germanium (Ge), tin (Sn), lead (Pb), scandium (Sc), yttrium (Y), strontium (Sr) and various rare earth elements, etc. These can be used individually or in combination of 2 or more types.

The non-metallic element is an element (auxiliary component) contained in the alloy body and is compatible (eutectic) with the first metallic element. Examples thereof include boron (B), carbon (C), and nitrogen. (N), silicon (Si), phosphorus (P), sulfur (S), etc. These can be used individually or in combination of 2 or more types.

Examples of Fe-based alloys as alloy bodies include magnetic stainless steel (Fe-Cr-Al-Si alloy) (including electromagnetic stainless steel), iron-silicon-aluminum alloy (Fe-Si-Al alloy) (including super iron-silicon-aluminum alloy). ), Permalloy (Fe-Ni alloy), Fe-Ni-Mo alloy, Fe-Ni-Mo-Cu alloy, Fe-Ni-Co alloy, Fe-Cr alloy, Fe-Cr-Al alloy, Fe-Ni -Cr alloy, Fe-Ni-Cr-Si alloy, silicon copper (Fe-Cu-Si alloy), Fe-Si alloy, Fe-Si-B (-Cu-Nb) alloy, Fe-B-Si-Cr alloy , Fe-Si-Cr-Ni alloy, Fe-Si-Cr alloy, Fe-Si-Al-Ni-Cr alloy, Fe-Ni-Si-Co alloy, Fe-N alloy, Fe-C alloy, Fe-B Alloy, Fe-P alloy, ferrite (including stainless steel ferrite, Mn-Mg ferrite, Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite Oxygen, soft ferrites such as Cu-Zn ferrite, Cu-Mg-Zn ferrite, iron-cobalt alloy (Fe-Co alloy), Fe-Co-V alloy, Fe-based amorphous alloy, etc.

Examples of Co-based alloys that are alloy bodies include Co-Ta-Zr and cobalt (Co)-based amorphous alloys.

An example of the Ni-based alloy as an alloy body is a Ni-Cr alloy.

Among these soft magnets, from the viewpoint of magnetic properties, an alloy body is preferred, an Fe-based alloy is more preferred, and an iron-silicon-aluminum alloy (Fe-Si-Al alloy) is more preferred. Furthermore, as the soft magnet, a single metal body is preferably used, a single metal body containing an iron element in a pure material state is more preferably used, and simple iron or iron powder (carbonyl iron powder) is still more preferably used.

From the viewpoint of anisotropy, examples of the shape of the particles 8 include flat shapes (plate shapes), needle shapes, etc., and from the viewpoint of good relative magnetic permeability in the planar direction (two dimensions), preferred shapes are Flat shape. Furthermore, the magnetic layer 3 may further contain non-anisotropic magnetic particles in addition to the anisotropic magnetic particles 8 . The non-anisotropic magnetic particles may have shapes such as spheres, granules, lumps, and clusters. The average particle diameter of the non-anisotropic magnetic particles is, for example, 0.1 μm or more, preferably 0.5 μm or more, and, for example, 200 μm or less, preferably 150 μm or less.

Furthermore, the flatness (flatness) of the flat particles 8 is, for example, 8 or more, preferably 15 or more, and is, for example, 500 or less, preferably 450 or less. The oblateness is calculated, for example, as an aspect ratio obtained by dividing the average particle diameter (average length) of the particles 8 (described below) by the average thickness of the particles 8 .

The average particle diameter (average length) of the particles 8 (anisotropic magnetic particles) is, for example, 3.5 μm or more, preferably 10 μm or more, and, for example, 200 μm or less, preferably 150 μm or less. If the particles 8 are flat, their average thickness is, for example, 0.1 μm or more, preferably 0.2 μm or more, and, for example, 3.0 μm or less, preferably 2.5 μm or less.

Examples of the adhesive 9 include thermosetting resin and thermoplastic resin.

Examples of the thermosetting resin include epoxy resin, phenol resin, melamine resin, thermosetting polyimide resin, unsaturated polyester resin, polyurethane resin, silicone resin, and the like. From the viewpoints of adhesiveness, heat resistance, etc., epoxy resins and phenolic resins are preferred.

Examples of the thermoplastic resin include acrylic resin, ethylene-vinyl acetate copolymer, polycarbonate resin, polyamide resin (6-nylon, 6,6-nylon, etc.), thermoplastic polyimide resin, saturated polyamide resin, etc. Ester resins (PET (Polyethylene terephthalate, polyethylene terephthalate), PBT (Polybutylene terephthalate, polybutylene terephthalate), etc.), etc. Preferably, acrylic resin is used.

As the adhesive 9, a combination of a thermosetting resin and a thermoplastic resin is preferred. More preferably, a combination of acrylic resin, epoxy resin and phenol resin is used. Thereby, the particles 8 can be more reliably fixed around the wiring 2 in a specific alignment state and a high filling degree.

In addition, the magnetic composition may also contain additives as necessary, such as thermosetting catalysts, inorganic particles, organic particles, cross-linking agents, etc.

In the magnetic layer 3, the particles 8 are aligned and uniformly arranged in the adhesive 9.

The magnetic layer 3 has a peripheral region 11 and an outer region 12 in cross-section.

The peripheral area 11 is a peripheral area of the wiring 2 and is located around the plurality of wirings 2 so as to be in contact with the plurality of wirings 2 . The peripheral area 11 has a substantially annular cross-section that shares a central axis with the wiring 2 . More specifically, the peripheral region 11 is the radius of the wiring 2 advancing radially outward from the outer peripheral surface of the wiring 2 in the magnetic layer 3 (the average of the distances from the center (center of gravity) C1 of the wiring 2 to the outer peripheral surface; R1 + R2) A region of 1.5 times the value (preferably 1.2 times the value, more preferably 1 times the value, further preferably 0.8 times the value, particularly preferably 0.5 times the value).

The peripheral area 11 is arranged around each of the plurality of wirings 2 , that is, around the first wiring 4 and the second wiring 5 .

The peripheral areas 11 each include a plurality (two) of first areas 13 and a plurality (two) of second areas 14 .

The plurality of first regions 13 are circumferentially aligned regions. That is, in the first region 13, the particles 8 are aligned along the circumferential direction (outer circumferential direction) of the wiring 2 (the first wiring 4 or the second wiring 5).

The plurality of first regions 13 are arranged facing each other across the center C1 of the wiring 2 on the upper side (one side in the third direction) and the lower side (the other side in the third direction) of the wiring 2 . That is, the plurality of first regions 13 include the first region 15 disposed above the wiring 2 and the first region 16 disposed below the wiring 2 . In addition, the center C1 of the wiring 2 is located at the upper-lower center of the upper first region 15 and the lower first region 16 .

In each first region 13, the direction in which the relative magnetic permeability of the particles 8 is high (for example, in the case of flat anisotropic magnetic particles, the surface direction of the particles) and the circle centered on the center C1 of the wiring 2 are The tangents are roughly the same. More specifically, the particle 8 is defined as being aligned in the circumferential direction when the angle between the surface direction of the particle 8 and the tangent to the circle in which the particle 8 is located is 15° or less.

The ratio of the number of particles 8 aligned in the circumferential direction to the total number of particles 8 included in the first region 13 exceeds, for example, 50%, preferably 70% or more, and more preferably 80% or more. That is, the first region 13 may contain, for example, less than 50%, preferably 30% or less, and more preferably 20% or less of the particles 8 that are not aligned in the circumferential direction. The total area ratio of the plurality of first areas 13 relative to the entire surrounding area 11 is, for example, 40% or more, preferably 50% or more, more preferably 60% or more, and, for example, 90% or less, preferably 80% or less. .

The relative magnetic permeability in the circumferential direction of the first region 13 is, for example, 5 or more, preferably 10 or more, more preferably 30 or more, and, for example, 500 or less. The relative magnetic permeability in the radial direction is, for example, 1 or more, preferably 5 or more, and is, for example, 100 or less, preferably 50 or less, and more preferably 25 or less. Moreover, the ratio of the relative magnetic permeability in the circumferential direction to the radial direction (circumferential direction/radial direction) is, for example, 2 or more, preferably 5 or more, and, for example, 50 or less. If the relative magnetic permeability is within the above range, the inductance will be excellent.

The relative magnetic permeability can be measured, for example, by an impedance analyzer (manufactured by Agilent, "4291B") using a magnetic material test fixture.

The plurality of second regions 14 are non-aligned regions in the circumferential direction. That is, in the second region 14 , the particles 8 are not aligned along the circumferential direction (outer circumferential direction) of the wiring 2 . In other words, in the second region 14 , the particles 8 are aligned in a direction other than the circumferential direction of the wiring 2 (for example, the first direction or the radial direction) or are not aligned in a direction other than the circumferential direction of the wiring 2 .

The plurality of second regions 14 are arranged facing each other on one side and the other side of the wiring 2 in the first direction with the wiring 2 interposed therebetween. That is, the plurality of second regions 14 include the second region 17 disposed on one side of the wiring 2 (the first wiring 4 or the second wiring 5 ) in the first direction, and the second region 17 disposed on the other side of the wiring 2 in the first direction. Area 2 18 on the other side. The second region 17 on one side and the second region 18 on the other side are substantially line-symmetrical with respect to the second imaginary line L3.

Furthermore, the second imaginary line L3 is a straight line that passes through the center C1 of the first wiring 4 or the second wiring and extends in the up-down direction.

In each second region 14, the direction in which the relative magnetic permeability of the particles 8 is high (for example, in the case of flat anisotropic magnetic particles, the surface direction of the particles) and the circle centered on the center C1 of the wiring 2 are The tangents are inconsistent. More specifically, when the angle between the plane direction of the particle 8 and the tangent to the circle in which the particle 8 is located exceeds 15°, it is defined as the particle 8 not being aligned in the circumferential direction.

The ratio of the number of particles 8 that are not aligned in the circumferential direction to the total number of particles 8 included in the second region 14 exceeds 50%, preferably 70% or more, and is, for example, 95% or less, preferably 90% or less. .

The second region 14 may include, for example, particles 8 aligned in the circumferential direction. The ratio of the number of particles 8 aligned in the circumferential direction to the total number of particles 8 included in the second region 14 is less than 50%, preferably less than 30%, and for example, more than 5%, preferably more than 10% .

Furthermore, when the particles 8 aligned in the circumferential direction are included, it is preferable that the particles 8 aligned in the circumferential direction are arranged on the innermost side of the second region 14 , that is, on the surface of the wiring 2 .

The total area ratio of the plurality of second regions 14 relative to the entire peripheral region 11 is, for example, 10% or more, preferably 20% or more, and, for example, 60% or less, preferably 50% or less, and more preferably 40% or less.

The center C2 of the second area 14 does not exist on the first imaginary line L2. That is, the center C2 is located below the first imaginary line L2, preferably at a distance 0.1 times the radius R from the first imaginary line L2, and more preferably at a distance 0.3 times the radius R relative to the first imaginary line L2. times the distance below. More specifically, the center C2 is preferably located 10 μm below the first imaginary line L2, and more preferably 30 μm below the first imaginary line L2.

Moreover, the center C2 of the second area 14 is located between the first imaginary line L2 and the second imaginary line L3. That is, the center C2 of the second area 14 does not exist on either of the first virtual line L2 and the second virtual line L3.

Furthermore, the center C2 of the second area 14 is the center of the virtual arc L1 connecting one end in the circumferential direction and the other end in the circumferential direction in the second area 14 . More specifically, the center C2 of the second region 14 is the center of the virtual arc L1 connecting the radial center of one circumferential end edge and the radial center of the other circumferential end edge in the second region 14 .

The first imaginary line L2 is a straight line that passes through the centers C1 of the plurality of adjacent wiring lines 2 and extends in the first direction.

In the second region 14, an intersection (top) 19 is formed by at least two types of particles 8 with different alignment directions. That is, the particles 8 (first particles) located relatively upward in the second region 14 and aligned from the circumferential direction toward the first direction as they approach the lower end side of the second region 14 in the circumferential direction of the wiring 2 are different from those in the second region 14 . Particles 8 (second particles) located relatively downward in the region 14 (below the first particles) and aligned from the circumferential direction toward the first direction as they approach the upper end side of the second region 14 in the circumferential direction form a substantially triangular shape. There are at least two sides, thereby forming an intersection 19 . Specifically, the first particles and the second particles together with the particles 8 (third particles) aligned in the circumferential direction inside the second region 14 form a substantially triangle (preferably an acute triangle).

The intersection 19 does not exist on the first imaginary line L2 between the first wiring 4 and the second wiring 5 and passing through their centers. That is, the intersection 19 is disposed below the first imaginary line L2 and spaced apart from the imaginary arc L1. More specifically, the angle θ formed by the straight line connecting the center of the intersection 19 and the center C1 of the wiring 2 and the first imaginary line L2 is, for example, 15° or more, preferably 45° or more, and, for example, 75° or less. Preferably it is below 60°.

In the peripheral area 11 (especially each of the first area 13 and the second area 14), the filling rate of the particles 8 is, for example, 40 volume % or more, preferably 45 volume % or more, and, for example, 90 volume % or less. Preferably it is 70 volume% or less. If the filling rate is equal to or higher than the above-mentioned lower limit, the inductance will be excellent.

The filling rate can be calculated by measuring the actual specific gravity, binarizing the SEM photo cross-section, etc.

In the peripheral area 11, a plurality of first areas 13 and a plurality of second areas 14 are arranged adjacent to each other in the circumferential direction. Specifically, the upper first region 15, the one second region 17, the lower first region 16, and the other second region 18 are sequentially continuous in the circumferential direction. Furthermore, the circumferential boundary (one end edge or the other end edge) between the first region 13 and the second region 14 is assumed to be an imaginary straight line extending radially outward from the center of the wiring 2 .

The outer region 12 is a region in the magnetic layer 3 other than the peripheral region 11 . The outer region 12 is arranged outside the peripheral region 11 and is continuous with the peripheral region 11 .

In the outer region 12, the particles 8 are aligned along the plane direction (especially the first direction).

In the outer region 12 , the direction in which the relative magnetic permeability of the particles 8 is high (for example, the surface direction of the particles in the case of flat anisotropic magnetic particles) is substantially consistent with the first direction. More specifically, when the angle between the surface direction of the particles 8 and the first direction is 15° or less, it is defined that the particles 8 are aligned in the first direction.

In the outer region 12 , the ratio of the number of particles 8 aligned in the first direction to the total number of particles 8 included in the outer region 12 exceeds 50%, preferably 70% or more, and more preferably 90% or more. That is, the outer region 12 may contain less than 50%, preferably 30% or less, more preferably 10% or less of the particles 8 that are not aligned in the first direction.

In the outer region 12, the relative magnetic permeability in the first direction is, for example, 5 or more, preferably 10 or more, more preferably 30 or more, and, for example, 500 or less. The relative magnetic permeability in the vertical direction is, for example, 1 or more, preferably 5 or more, and, for example, 100 or less, preferably 50 or less, and more preferably 25 or less. Moreover, the ratio of the relative magnetic permeability in the first direction to the up-down direction (first direction/up-down direction) is, for example, 2 or more, preferably 5 or more, and, for example, 50 or less. If the relative magnetic permeability is within the above range, the inductance will be excellent.

The filling rate of the particles 8 in the outer region 12 is, for example, 40 volume % or more, preferably 45 volume % or more, and, for example, 90 volume % or less, preferably 70 volume % or less. If the filling rate is equal to or higher than the above-mentioned lower limit, the inductance will be excellent.

Furthermore, a first direction alignment region 10 including a first imaginary line L2 is formed between the plurality of wirings 2 including the peripheral region 11 and the outer region 12 . That is, the first direction alignment region 10 is located between the plurality of wirings 2 in a cross section of the inductor 1 cut along the first direction and the up-down direction, and includes the first imaginary line L2. Specifically, the first direction alignment area 10 is an area centered on the first imaginary line L2 in the up-down direction, and the up-down direction length is 40% of the radius R1 of the conductor 6 (preferably 50 μm), and it is assumed that It is a region where particles 8 are aligned along the first direction.

The ratio of the number of particles 8 aligned in the first direction to the total number of particles 8 included in the first direction alignment region 10 is, for example, 85% or more, preferably 90% or more, and more preferably 95% or more. That is, the first direction alignment region 10 may contain, for example, 15% or less, preferably 10% or less, and more preferably 5% or less of the particles 8 that are not aligned in the first direction.

Furthermore, in the areas adjacent to one side and the other side of the first direction alignment area 10 in the first direction, the particles 8 are not aligned in the first direction.

The first direction distance N of the first direction alignment region 10 is, for example, 500 μm or less, preferably 400 μm or less, more preferably 300 μm or less, and, for example, 10 μm or more, preferably 40 μm or more.

The first direction distance N of the first direction alignment region 10 is 60% or less, preferably 50% or less, further preferably 30% or less, and, for example, 5% or more relative to the wiring spacing S. If the above-mentioned ratio (N/S×100%) is equal to or less than the above-mentioned upper limit, crosstalk between the wirings 2 can be suppressed.

The first direction length T ₁ of the magnetic layer 3 is, for example, 5 mm or more, preferably 10 mm or more, and is, for example, 5000 mm or less, preferably 2000 mm or less.

The length T ₂ of the magnetic layer 3 in the second direction is, for example, 5 mm or more, preferably 10 mm or more, and is, for example, 5000 mm or less, preferably 2000 mm or less.

The vertical length (thickness) T ₃ of the magnetic layer 3 is, for example, 100 μm or more, preferably 200 μm or more, and, for example, 2000 μm or less, preferably 1000 μm or less.

2. Manufacturing method of inductor Referring to FIGS. 3A-B , an embodiment of a method of manufacturing the inductor 1 will be described. The manufacturing method of the inductor 1 includes, for example, a preparation step, a placement step, and a lamination step in this order.

In the preparation step, a plurality of wires 2 and two anisotropic magnetic sheets 20 are prepared.

Each of the two anisotropic magnetic sheets 20 has a sheet shape extending in the plane direction and is formed of a magnetic composition. In the anisotropic magnetic sheet 20, the particles 8 are aligned in the plane direction. Preferably, two anisotropic magnetic sheets 20 in a semi-hardened state (B stage) are used.

Examples of such anisotropic magnetic sheet 20 include soft magnetic thermosetting adhesive films or soft magnetic films described in Japanese Patent Application Laid-Open No. 2014-165363, Japanese Patent Application Laid-Open No. 2015-92544, and the like.

In the arrangement step, as shown in FIG. 3A , a plurality of wires 2 are arranged on the upper surface of one of the anisotropic magnetic sheets 20 , and another anisotropic magnetic sheet 20 is arranged oppositely above the plurality of wires 2 . .

Specifically, the lower anisotropic magnetic sheet 21 is placed on a horizontal platform, and then a plurality of wirings are arranged on the upper surface of the lower anisotropic magnetic sheet 21 at desired intervals in the first direction. 2.

Subsequently, the upper anisotropic magnetic sheet 22 is disposed opposite to the lower anisotropic magnetic sheet 21 and the plurality of wirings 2 at intervals.

In the lamination step, as shown in FIG. 3B , two anisotropic magnetic sheets 20 are laminated in such a manner that a plurality of wirings 2 are buried.

Specifically, the upper anisotropic magnetic sheet 22 is pressed toward the lower side.

At this time, when the two anisotropic magnetic sheets 20 are in a semi-hardened state, the plurality of wirings 2 are slightly sunk into the lower anisotropic magnetic sheet 21 by pressing, and in the sunk part, the particles 8 move along the plurality of wires 2 . Strip wiring 2 alignment. That is, the lower first region 16 is formed.

In addition, the upper anisotropic magnetic sheet 22 is covered along the plurality of wirings 2 , and the particles 8 are aligned along the plurality of wirings 2 and laminated on the upper surface of the lower anisotropic magnetic sheet 21 . That is, on the upper side of the wiring 2, the upper first region 15 is formed by the upper anisotropic magnetic sheet 22, and on both sides (sides) of the wiring 2 in the first direction, the lower anisotropic magnetic sheet 21 and In the vicinity where the upper anisotropic magnetic sheets 22 are in contact, the particles 8 aligned in these sheets collide, and as a result, the second region 14 and the intersection 19 are formed.

Furthermore, when the anisotropic magnetic sheet 20 is in a semi-hardened state, it is heated. Thereby, the anisotropic magnetic sheet 20 becomes a hardened state (C stage). Furthermore, the contact interface 25 between the two anisotropic magnetic sheets 20 disappears, and the two anisotropic magnetic sheets 20 form one magnetic layer 3 .

Thereby, as shown in FIG. 2 , an inductor 1 is obtained, which includes a wiring 2 having a substantially circular cross-section and a magnetic layer 3 covering the wiring 2 . That is, the inductor 1 is formed by laminating a plurality of (two) anisotropic magnetic sheets 20 with the wiring 2 sandwiched between them. Furthermore, a cross-sectional view (SEM photograph) of an actual example of the inductor 1 is shown in FIG. 4 .

3.Use Inductor 1 is a part of electronic equipment, that is, a part used to make electronic equipment. It does not contain electronic components (chips, capacitors, etc.) or a mounting substrate for mounting electronic components. It is circulated in the form of a single part and can be Devices used in industry.

The inductor 1 is mounted (assembled) in an electronic device or the like, for example. Although not shown in the figure, the electronic device includes a mounting substrate and electronic components (chips, capacitors, etc.) mounted on the mounting substrate. Furthermore, the inductor 1 is mounted on a mounting substrate via a connecting member such as solder, is electrically connected to other electronic equipment, and functions as a passive component such as a coil.

Furthermore, since the inductor 1 is provided with the plurality of wirings 2 and the magnetic layer 3 covering the plurality of wirings 2, the particles 8 can be easily aligned around the plurality of wirings 2 in the circumferential direction. Therefore, the axis of easy magnetization of the particles 8 is in the same direction as the magnetic field lines generated around the wiring, so the inductance can be increased.

In addition, the first direction alignment region 10 in which the particles 8 are aligned along the first direction is formed so as to overlap the first imaginary line L2. The distance N in the first direction of the first direction alignment region 10 is relative to the first imaginary line. The spacing S between two wiring rooms on L2 is 50% or less. That is, in the space between the wirings 2, which is the path of the magnetic flux flowing along the first direction, the distance N of the first direction alignment region 10 is shorter than other distances (that is, the distance N between the first direction alignment regions 10 is The area where the particles 8 on the side are not aligned in the first direction). Therefore, the influence of magnetic correlation from one wiring 2 (the first wiring 4 or the second wiring 5) to the other wiring (the second wiring 5 or the first wiring 4) can be reduced, and crosstalk can be suppressed.

Furthermore, in the inductor 1 , the first regions 13 serving as circumferential direction alignment regions are provided in the peripheral regions 11 of the plurality of wirings 2 . Therefore, the inductance can be improved.

Furthermore, in the inductor 1 , the second regions 14 as circumferential non-alignment regions are provided in the peripheral regions 11 of the plurality of wirings 2 . Therefore, the hard magnetization axis of the particle 8 is in the same direction as the magnetic field lines generated around the wiring, so the DC superposition characteristics are good.

In addition, the center C2 in the second area 14 does not exist on the first virtual line L2. Therefore, the distance from the first wiring 4 to the second wiring 5 via the second region 14 can be increased. That is, the distance between the wirings 2 through which magnetic flux passes can be substantially increased. Therefore, the influence of the magnetic correlation from the first wiring 4 to the second wiring 5 can be reduced, and crosstalk can be further suppressed.

＜Example of changes＞ Hereinafter, a modification example of the embodiment shown in FIGS. 1A to 2 will be described. In addition, in the modified example, the same members as those in the above-mentioned embodiment are assigned the same reference numerals, and the description thereof is omitted. These modifications also exhibit the same functions and effects as those of the above-mentioned embodiment.

In the embodiment shown in FIG. 2 , the center C2 in the second area 14 does not exist on the first imaginary line L2. However, for example, as shown in FIG. 5 , the center C2 in the second area 14 may also exist on the first imaginary line L2. On the imaginary line L2.

That is, the embodiment shown in FIG. 5 is substantially line-symmetrical with respect to the first imaginary line L2.

From the viewpoint of further reducing crosstalk, it is preferable to enumerate the embodiments shown in FIGS. 1A to 2 .

In the embodiment shown in FIG. 2 , the wiring 2 has a generally circular cross-sectional shape, but its cross-sectional shape is not particularly limited. For example, although not shown, it may also be generally elliptical or generally rectangular (including square). and rectangular shape) and roughly indefinite shape. Furthermore, the wiring 2 may have a substantially rectangular shape, and may have at least one side bent or at least one corner bent.

In any of the above embodiments, the peripheral area 11 is the area that, in cross-section, is the average of the longest length and the shortest length from the center of gravity C1 of the wiring 2 to the outer peripheral surface of the wiring 2 ([ Maximum length + minimum length]/2) 1.5 times the value.

In the embodiment shown in FIGS. 1A and 1B , there are two wiring lines 2 , but their number is not limited and may be three or more.

In the embodiment shown in FIGS. 1A-B , each wiring 2 has a substantially U-shape in plan view, but its shape is not limited and can be set appropriately.

In the embodiment shown in FIGS. 1A-B , the magnetic layer 3 may also have alignment marks.

In the embodiment shown in FIGS. 1A-B , the ratio of the anisotropic magnetic particles 8 in the magnetic layer 3 can be the same in the magnetic layer 3 , and can also become higher or lower as the distance from each wiring 2 increases. [Industrial availability]

The inductor of the present invention can be used as a passive component such as a voltage conversion component.

1: Inductor 2: Wiring 3: Magnetic layer 4: First wire 5: Second wire 6: Conductor 7: Insulating layer 8: Anisotropic magnetic particles 9: Adhesive 10: First direction alignment area 11: Peripheral area 12: Outside area 13: 1st area 14: 2nd area 15: Upper 1st area 16: Lower 1st area 17: One side 2nd area 18: Other side 2nd area 19: Intersection (top) 20 : Anisotropic magnetic sheet 21: Lower anisotropic magnetic sheet 22: Upper anisotropic magnetic sheet 25: Contact interface C1: Center of wiring C2: Center of virtual arc D1: Distance between centers D2: Center Distance L1: Imaginary arc L2: First imaginary line L3: Third imaginary line N: Distance in the first direction R1: Radius of the wire R2: Thickness of the insulating layer S: Interval T ₁ : Length T of the magnetic layer in the first direction ₂ : Length T of the magnetic layer in the second direction ₃ : Length (thickness) of the magnetic layer in the upper and lower directions θ: Angle

1A-B shows an embodiment of the inductor of the present invention. FIG. 1A shows a top view, and FIG. 1B shows a cross-sectional view taken along line A-A of FIG. 1A. Fig. 2 shows a partial enlarged view of the dotted line portion in Fig. 1B. Figures 3A-B show the manufacturing steps of the inductor shown in Figures 1A-B. Figure 3A shows the arrangement step, and Figure 3B shows the lamination step. FIG. 4 shows a cross-sectional view of an actual SEM photograph of the inductor shown in FIGS. 1A-B. FIG. 5 is a cross-sectional view showing a modified example of the inductor of the present invention (a form in which the center of the second region is located on the first imaginary line).

1:Inductor

2: Wiring

3: Magnetic layer

4: 1st wiring

5: 2nd wiring

6: Wire

7: Insulation layer

8:Anisotropic magnetic particles

9: Adhesive

10: 1st direction alignment area

11: Surrounding area

12: Outside area

13: Area 1

14:Zone 2

15: The first area on the upper side

16: Lower 1st area

17: Area 2 on one side

18: Area 2 on the other side

19: Cross section (top)

C1: Center of wiring

C2: Center of virtual arc

D1: distance between centers

L1: Imaginary arc

L2: 1st imaginary line

L3: The third imaginary line

N: Distance in the first direction

R1: radius of wire

R2: Thickness of insulation layer

S: interval

θ: angle

Claims (3)

An inductor characterized by: It has a plurality of wirings and a magnetic layer covering the plurality of wirings. The plurality of wirings are arranged spaced apart from each other in the first direction, The above-mentioned plurality of wirings respectively include conductors and insulation layers covering the conductors. The above magnetic layer contains anisotropic magnetic particles and adhesive, A first direction alignment region in which the anisotropic magnetic particles are aligned along the first direction is formed between the plurality of wirings adjacent to each other in such a manner as to include an imaginary line passing through the center of the wirings, The distance between the first direction alignment region and the distance between the wirings on the imaginary line is 60% or less. The inductor according to claim 1, wherein a first region is provided around each of the plurality of wirings, and the anisotropic magnetic particles in the first region are aligned along the outer circumferential direction of the wirings. The inductor of Claim 2 further has a second region around each of the plurality of wirings, and the anisotropic magnetic particles in the second region are not aligned along the outer circumferential direction.