TWI830740B - Cover member - Google Patents

Abstract

The cover member (11) is used to be mounted on a base body having a recess for accommodating electronic components. The cover member (11) has a main body part (12) and a joint part (13). The joint part (13) is provided on the main body part (12). When the cover member (11) is installed on the base body, it is in contact with the base body at a position surrounding the opening of the recess. Engagement. The manufacturing method of the cover member (11) includes a first process and a second process. In the first process, the metal-based joining material is arranged on the main body (12). In the second process, the metal-based joining material is arranged on the main body (12). The metal-based joining material is melted and then cooled to form a joining portion (13). The shape of the metal-based joining material arranged on the main body part (12) in the first process is a frame shape, and the frame shape has a partially spaced separation part (G) and a part of a narrow width part with a narrow width in the circumferential direction. At least one.

Description

Cover member

The present invention relates to a method of manufacturing a cover member, a method of manufacturing a cover member, and an electronic component package.

A cover member is installed on the base body having a recessed portion for accommodating electronic components to seal the opening of the recessed portion. As disclosed in Patent Document 1, the base body and the cover member can be joined using a metal-based joining material such as Au-Sn alloy.

Prior technical literature patent documents

Patent Document 1: Japanese Patent Application Publication No. 2018-037581

When joining the cover member and the base body using the metal-based joining material as described above, the step of joining the cover member and the base body can be simplified by joining the metal-based joining material to the main body of the cover member in advance. However, in such a cover member having a metal-based joining material previously joined to the main body, there is a concern that the metal-based joining material may peel off from the main body due to the residual stress of the metal-based joining material.

The present invention was made in view of the above-mentioned circumstances, and an object thereof is to provide a method of manufacturing a cover member, a method of manufacturing a cover member, and an electronic component package that can suppress the occurrence of peeling of a metal-based joining material.

A method of manufacturing a cover member that solves the above problems is a method of manufacturing a cover member for mounting on a base body having a recessed portion for accommodating electronic components. The cover member has a main body portion and a joint portion, and the joint portion is provided in the main body portion. When the cover member is mounted to the base, it is joined to the base at a position surrounding the opening of the recess; the manufacturing method includes a first process and a second process, and in the first process, a metal-based joining material is disposed on the main body, In the second process, the metal-based joining material arranged on the main body part is melted and then cooled to form the joining part; in the first process, the shape of the metal-based joining material arranged on the main body part is set to a frame shape. , the frame shape has at least one of a partially spaced spacing part and a partially narrow width part in the circumferential direction. That is, the frame-shaped metal-based joining material is provided with at least one separation portion that divides the metal-based joining material into a plurality of separated parts in the circumferential direction, or has at least one part in the circumferential direction of the metal-based joining material with The width of the other parts of the metal-based joining material is narrower than that of the other parts.

According to this method, the stress generated in the metal-based joining material in the second process can be relaxed by at least one of the above-described spacing portion and the narrow-width portion.

In the manufacturing method of the cover member, it is preferable that the shape of the metal-based joining material disposed on the main body portion in the first process is a quadrangular frame shape, and the quadrangular frame shape is at least one of the four corner portions. The part has at least one of the above-mentioned spacing part and the above-mentioned narrow-width part. That is, it is preferable that the metal-based joining material in the shape of a square frame is divided into a plurality of parts spaced apart in the circumferential direction of the metal-based joining material by the separation part provided in at least one corner part; or in at least one corner part, The portion has a narrower width portion than other portions of the metal-based joining material.

According to this method, it is possible to reduce the corner portion where residual stress is likely to be concentrated during the formation of the joint portion in the second process.

In the manufacturing method of the cover member, it is preferable that the main body portion has a translucent substrate and a metal layer provided on the substrate, and the shape of the metal layer is a continuous frame shape, and the continuous frame shape surrounds the above-mentioned The recessed portion of the base body is arranged in an opening, and the metal-based joining material is arranged on the metal layer in the first process.

According to this method, the stress generated in the metal-based joining material in the second process is relaxed by at least one of the above-mentioned spacing portion and the narrow-width portion, and a cover member having a light-transmitting portion can be manufactured.

In the manufacturing method of the cover member, it is preferable that the substrate is a glass substrate, the metal layer has an Au layer, the metal-based joining material contains Au, and the metal-based joining material is arranged on the Au layer in the first process. superior.

As described above, when a metal-based bonding material containing Au is disposed on the Au layer, the bonding strength between the metal layer and the metal-based bonding material can be improved. Here, if the bonding strength between the metal layer and the metal-based joining material is increased, the residual stress of the metal-based joining material will tend to cause peeling between the glass substrate and the metal layer. In the above method, the stress generated in the metal-based joining material is relaxed by at least one of the above-mentioned spacing part and the narrow-width part, so that the peeling of the metal layer caused by the residual stress of the metal-based joining material can be preferably suppressed. of production.

In the manufacturing method of the said cover member, it is preferable that the said metal-type joining material is arrange|positioned on the said main body part using a coating method in the said 1st process.

According to this method, the productivity of the cover member can be easily improved.

In the manufacturing method of the cover member, it is preferable that the width dimension of the narrow-width portion is 2/3 or less of the width dimension of the portion of the metal-based joining material adjacent to the narrow-width portion. That is, it is preferable that the metal-based joining material has a portion with a width of 2/3 or less compared to other portions of the metal-based joining material in at least a portion of the circumferential direction of the metal-based joining material.

A cover member that solves the above problems is a cover member for mounting on a base body having a recess for accommodating electronic components. It has a main body part and a joint part. The joint part is provided on the main body part. When the lid member is attached to the base body It is joined to the base body at a position surrounding the opening of the recessed portion; the joining portion is formed of a metal-based joining material; the joining portion has a frame shape, and the frame shape has a partially spaced apart portion and a portion with a narrow width in the circumferential direction. At least one of the narrow width parts. That is, the frame-shaped joint part is provided with at least one separation part that divides the joint part into a plurality of separated parts in the circumferential direction; or at least a part of the circumferential direction of the joint part has other parts that are consistent with the joint part. Compared to the narrower width part.

In the above-mentioned cover member, it is preferable that the width dimension of the said narrow-width part is 2/3 or less of the width dimension of the part adjacent to the joint part of the said narrow-width part. That is, it is preferable that the joint portion has a portion with a width of 2/3 or less compared to other portions of the joint portion in at least a part of the circumferential direction of the joint portion.

A method of manufacturing an electronic component package that solves the above problem is a manufacturing method of an electronic component package including the above-mentioned cover member and the above-mentioned base body, and includes an installation step of attaching the above-mentioned cover member to the above-mentioned base body; The joint portion of the base body and the cover member is heated in a state of being pressed against the recessed portion, so that the opening of the recessed portion of the base body is sealed by the joint portion.

According to the present invention, it is possible to suppress the occurrence of peeling of the metal-based joining material.

11: Cover member

12: Main part

12a:Substrate

12b: Metal layer

13:Joint

13a: Narrow width part

14:Matrix

15: Electronic parts

16: concave part

17:Sealing part

G: alienation department

Fig. 1(a) is a top view showing the cover member in the embodiment, and Fig. 1(b) is a view showing the middle edge of Fig. 1(a) Sectional view along line 1b-1b.

FIG. 2(a) is a flowchart showing a method of manufacturing a cover member, and FIG. 2(b) is a flowchart showing a method of manufacturing an electronic component package.

FIG. 3 is a plan view showing the base body prepared in the manufacturing method of the cover member.

FIG. 4 is an explanatory diagram illustrating the first process of the manufacturing method of the cover member.

FIG. 5 is a cross-sectional view illustrating the manufacturing method of the electronic component package.

FIG. 6 is a cross-sectional view showing the electronic component package.

FIG. 7 is a plan view showing a modified example of the cover member.

FIG. 8 is a plan view showing a modified example of the cover member.

FIG. 9 is a plan view showing a modified example of the cover member.

Hereinafter, a method of manufacturing a cover member, a method of manufacturing a cover member, and an electronic component package will be described with reference to the drawings. In the drawings, some components may be exaggerated or simplified for convenience of explanation. In addition, the dimensional proportions of each part may differ from the actual size.

As shown in FIGS. 1( a ) and 1 ( b ), the cover member 11 has a main body part 12 and a joint part 13 provided in the main body part 12 . As shown in FIG. 5 , the cover member 11 is for mounting to the base 14 . The base 14 has a recessed portion 16 in which electronic components 15 are accommodated. The joint portion 13 of the cover member 11 is arranged to be joined to the base 14 at a position surrounding the opening of the recessed portion 16 of the base 14 when the cover member 11 is attached to the base 14 .

As shown in FIG. 1( b ), the main body portion 12 of the cover member 11 has a light-transmissive substrate 12 a and a metal layer 12 b provided on the substrate 12 a.

Specific examples of the translucent substrate 12a include a glass substrate, a sapphire substrate, a resin substrate, and the like. The substrate 12a may be a substrate provided with a functional film such as an antireflection film. For example, when the electronic component 15 accommodated in the recessed portion 16 of the base 14 as shown in FIG. 5 is a light source that emits ultraviolet rays or an element that receives ultraviolet rays, a substrate with ultraviolet ray transparency can be used. The thickness of the substrate is preferably in the range of 0.1 mm to 1 mm, more preferably 0.2 mm to 0.5 mm.

The metal layer 12b of the main body portion 12 is provided to ensure the bonding strength between the substrate 12a and the bonding portion 13. The shape of the metal layer 12 b is a continuous frame shape, and the continuous frame shape is arranged to surround the opening of the recessed portion 16 of the base 14 . The metal layer 12b is composed of three layers: a base layer, an intermediate layer, and a surface layer in order from the substrate 12a side. Examples of the metal used for the base layer include Cr, Ta, W, Ti, Mo, Ni, Pt, and the like. Examples of the metal used for the intermediate layer include Ni, Pt, Pd, and the like. Examples of the metal used for the surface layer include Au, Sn, Ag, Ni, Pt, and the like. The metal used in the metal layer 12b can be a single substance or an alloy.

As shown in FIGS. 1(a) and 1(b) , the shape of the joint portion 13 in the cover member 11 of this embodiment is a quadrangular frame shape having a spacing portion G partially spaced in the circumferential direction. That is, the quadrangular frame-shaped joint portion 13 is provided with at least one partition G, and the partition G divides the joint portion 13 into a plurality of separated parts in the circumferential direction. The quadrangular frame-shaped joint portion 13 preferably has a separation portion G on at least one of the four corner portions. That is, the quadrangular frame-shaped joint portion 13 is preferably divided into a plurality of portions spaced apart in the circumferential direction of the joint portion 13 by the distance portion G provided at at least one corner portion. In addition, the joint portion 13 preferably has a pair of separation portions G respectively located on a pair of corner portions constituting diagonal corners, and more preferably has four separation portions G respectively located on four corner portions like this embodiment. Divorce Department G.

The joint portion 13 is formed of a metal-based joint material. Specifically, the joint part 13 has an extension part E and a separation part G. The extension part E is made of a metal-based joining material and extends along the outer edge of the main body part 12 . The separation part G is formed between the extension part E and the extension part. Between Part E. Commercially available solder or hard solder can be used as the metal-based joining material. Examples of metal-based joining materials include Au-Sn alloys, Pb-Sn alloys, Au-Ge alloys, and the like.

When the substrate 12a of the main body 12 is a glass substrate, it is preferable to provide the metal layer 12b having an Au layer on the glass substrate, and to provide the joint portion 13 made of a metal-based joint material containing Au on the Au layer. The metal layer 12b can be composed of, for example, a three-layer structure in which a Cr layer serves as a base layer, a Ni layer serves as an intermediate layer, and an Au layer serves as a surface layer.

Next, a method of manufacturing the cover member 11 will be described.

As shown in FIG. 2( a ), in the method of manufacturing the cover member 11 , step S10 of preparing the main body portion 12 is first performed. As shown in FIG. 3 , the main body portion 12 prepared in step S10 of this embodiment is in an integrated state (that is, the state of the motherboard) before the plurality of main body portions 12 are individually separated. However, individual main body portions can also be prepared. 12. The main body portion 12 is obtained by forming a metal film (metal layer 12b) on the main surface of the substrate 12a. Examples of the film forming method of the metal film include sputtering, vacuum evaporation, vacuum evaporation using ion assist plating or ion plating, and CVD.

Next, as shown in FIG. 4 , in the method of manufacturing the cover member 11 , a first process of arranging a metal-based joining material on the main body portion 12 is performed (step S11 ). In the first process of step S11, the shape of the metal-based joining material disposed on the main body portion 12 is set to a square frame shape having the spacing portion G partially spaced in the circumferential direction. That is, the square frame-shaped metal-based joining material is provided with at least one separation portion that divides the metal-based joining material into a plurality of separated parts in the circumferential direction.

In the arrangement of the metal-based joining material in step S11, a coating method in which the metal-based joining material is applied to the main body portion 12 can be used. For the coating method, a commercially available paste-like metal-based joining material can be used. Examples of the coating method include a printing method using a mask (screen printing method), a coating method using a dispenser, and the like. In the arrangement of the metal-based joining material in step S11 , a molded body of the metal-based joining material formed in advance into a predetermined shape may be placed on the main body 12 .

Next, in the method of manufacturing the cover member 11, a second process is performed in which the metal-based joining material disposed on the main body portion 12 is melted and then cooled to form the joining portion 13 (step S12). In the formation of the joint portion 13 in step S12, a well-known reflow furnace is used to heat the main body portion 12 on which the metal-based joining material is placed, so that the metal-based joining material is melted. The metal-based joining material is melted on the main body 12 and then cooled, thereby joining (welding) to the main body 12 .

In the second process of step S12, the cooling after the metal-based joining material is melted is preferably: slow cooling that maintains the temperature in a temperature range of 150°C or more and 300°C or less, and a time of 2 minutes or more and 30 minutes or less. . In this case, the stress of the metal-based joining material can be further relaxed, and the productivity of the cover member 11 can be easily maintained.

In the second process of step S12 in this embodiment, an integrated sample in which a plurality of cover members 11 is integrated can be obtained. The obtained integrated sample can be cut using a well-known cutting method such as a cutting blade or a laser, thereby obtaining a plurality of cover members 11 .

Next, a manufacturing method of the electronic component package will be described.

As shown in FIG. 2( b ), in the method of manufacturing an electronic component package, first, the base 14 containing the electronic component 15 in the recessed portion 16 is prepared (step S13 ). Examples of the material of the substrate 14 prepared in step S13 include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, and ceramics and glass. Glass ceramics, Fe-Ni-Co alloys, Cu-W alloys, Kovar (registered trademark) alloys, etc. made by mixing and sintering powders.

As shown in FIG. 5 , a metal layer M1 can be provided at the opening of the base 14 as appropriate. For example, when the base 14 is made of ceramic, the metal layer M1 containing a metal element constituting the joint 13 (metal-based joint material) of the cover member 11 can be provided on the base 14 to improve the relationship between the base 14 and the joint 13 . Adhesion (joint strength) between them.

Examples of the electronic components 15 accommodated in the recess 16 of the base 14 include optical components such as laser modules, LED light sources, photo sensors, imaging elements, and light converters. The electronic component 15 may also be a vibration sensor, an acceleration sensor, etc.

Next, as shown in FIG. 2( b ), in the manufacturing method of the electronic component package, a mounting step of mounting the cover member 11 to the base 14 is performed (step S14 ).

As shown in FIG. 6 , in the mounting step of step S14 , heating is performed in a state where the base 14 in which the electronic component 15 is accommodated in the recessed portion 16 and the joint portion 13 of the cover member 11 are in pressure contact. Specifically, in the mounting step of step S14, the metal-based joining material melted by heating is pressurized between the main body portion 12 and the base 14 of the cover member 11, so that the joining portion 13 flows and the spaced portion is filled. G, the joint portion 13 becomes a continuous frame-like opening surrounding the recessed portion 16, that is, an endless annular sealing portion 17. In this way, an electronic component package that maintains the airtightness of the recessed portion 16 of the base 14 can be obtained.

Next, the functions and effects of this embodiment will be described.

(1) The cover member 11 is mounted on the base 14 having the recessed portion 16 for accommodating the electronic components 15 . The cover member 11 has a main body part 12 and a joint part 13, and the joint part 13 is provided in the main body part 12. When the cover member 11 is mounted to the base 14 , the engaging portion 13 is engaged with the base 14 at a position surrounding the opening of the recess 16 .

The manufacturing method of the cover member 11 includes a first process and a second process. In the first process, the metal-based joining material is arranged on the main body part 12. In the second process, the metal-based joining material arranged on the main body part 12 is melted. It is cooled and the joint part 13 is formed. In the first process of the manufacturing method of the cover member 11, the shape of the metal-based joining material arranged on the main body portion 12 is a frame shape, and the frame shape has a spaced portion G that is partially spaced in the circumferential direction. That is, the frame-shaped metal-based joining material is provided with at least one separation portion G that divides the metal-based joining material into a plurality of separated parts in the circumferential direction.

According to this method, the stress generated in the metal-based joining material in the second process can be relaxed by the above-mentioned separation portion G. In this way, the occurrence of peeling of the metal-based joining material can be suppressed.

(2) In the manufacturing method of the cover member 11, it is preferable that the shape of the metal-based joining material arranged on the main body portion 12 in the first process is a square frame shape, and the square frame shape is at least one of the four corner portions. There is a separation part G on the corner part. That is, it is preferable that the square frame-shaped metal-based joining material is divided into a plurality of separated parts in the circumferential direction of the metal-based joining material by the separation portion G provided on at least one corner portion.

In this case, it is possible to reduce the corner portion where residual stress is likely to be concentrated during the formation of the joint portion 13 in the second process. Therefore, the occurrence of peeling of the metal-based joining material can be preferably suppressed.

(3) In the method of manufacturing the cover member 11, the main body 12 has a translucent substrate 12a and a metal layer 12b provided on the substrate 12a. The shape of the metal layer 12 b of the main body 12 is a continuous square frame shape, and is arranged to surround the opening of the recessed portion 16 of the base 14 . In the manufacturing method of the cover member 11, in the first process, the metal-based joining material is arranged on the metal layer 12b.

At this time, the stress generated in the metal-based joining material in the second process can be relaxed by the separation portion G, and the cover member 11 having the light-transmitting portion can be manufactured. Therefore, it is possible to obtain the cover member 11 that has a light-transmitting portion and in which the occurrence of peeling of the metal-based joining material is suppressed.

(4) In the manufacturing method of the cover member 11, it is preferable that the substrate 12a is a glass substrate, the metal layer 12b has an Au layer, and the metal-based joining material contains Au. At this time, the metal-based bonding material is placed on the Au layer in the first process.

As described above, when the metal-based bonding material containing Au is disposed on the Au layer, the bonding strength between the metal layer 12 b and the metal-based bonding material can be improved. Here, if the bonding strength between the metal layer 12b and the metal-based joining material is increased, the residual stress of the metal-based joining material will tend to cause peeling between the glass substrate and the metal layer 12b. In the above-mentioned method, the separation part G relaxes the stress generated in the metal-based joining material, so that the occurrence of peeling of the metal layer 12b due to the residual stress in the metal-based joining material can be preferably suppressed.

(5) In the first process of the manufacturing method of the cover member 11, it is preferable to arrange the metal-based joining material on the main body portion 12 using a coating method. In this case, the productivity of the cover member 11 can be easily improved.

(6) The joint portion 13 of the cover member 11 is formed of a metal-based joint material. The shape of the joint portion 13 of the cover member 11 is a frame shape, and the frame shape has a spaced portion G partially spaced in the circumferential direction. That is, the frame-shaped joint part 13 is provided with at least one partition G, and the partition G divides the joint part 13 into a plurality of separated parts in the circumferential direction.

According to this structure, the residual stress of the metal-based joining material in the cover member 11 is relaxed by the separation portion G. Therefore, the occurrence of peeling of the metal-based joining material in the cover member 11 can be suppressed.

(Example of change)

This embodiment can also be implemented by changing it as follows. This embodiment and the following modified examples can be implemented by combining each other within the scope of no technical inconsistency.

‧As shown in FIG. 7 , the joint portion 13 of the cover member 11 may have a distance portion G at a position connecting the middle portion of the extension portion E between adjacent corner portions. That is, the quadrangular frame-shaped joint part 13 can also be divided into a plurality of separated parts in the circumferential direction of the joint part 13 by the distance part G provided in the middle part of at least one extension part E. It is preferable that the joint part 13 has a pair of spaced parts G respectively at the positions of the pair of opposing middle parts, and more preferably, it has four spaced parts G respectively at the positions of the four middle parts. However, it may be changed to have the separation part G in both the corner part of the joint part 13 and the middle part of the joint part 13.

‧As shown in FIG. 8 , the shape of the joint portion 13 of the cover member 11 may be a square frame shape having a narrow portion 13 a with a partially narrow width. That is, the quadrangular frame-shaped joint portion 13 may have a portion with a narrower width than other portions of the joint portion 13 in at least a portion of the circumferential direction of the joint portion 13 . At this time, the residual stress of the metal-based joining material is relaxed by the narrow-width portion 13a. Therefore, the occurrence of peeling of the metal-based joining material in the cover member 11 can be suppressed. The width dimension W1 of the narrow-width portion 13a is preferably 2/3 or less of the width dimension W2 of the portion adjacent to the joint portion 13 of the narrow-width portion 13a, and is more preferably 1/2 or less. That is, it is preferable that the joint portion 13 has a width of at least a portion in the circumferential direction of the joint portion 13 that is preferably 2/3 or less, more preferably 1/2 or less, compared to other portions of the joint portion 13 . . The width dimension W1 of the narrow portion 13a is preferably not less than 0.1 mm and not more than 0.8 mm, more preferably not less than 0.15 mm and not more than 0.5 mm. The width dimension W2 of the portion adjacent to the joint portion 13 of the narrow-width portion 13a is preferably 0.2 mm or more and 2.0 mm or less.

In addition, as shown in FIG. 9 , the narrow portion 13 a in the joint portion 13 of the cover member 11 can also form the four corners of the joint portion 13 .

8 and 9 illustrate that the narrow-width portion 13 a of the joint portion 13 is formed narrowly and continuously inside the square frame shape, but the invention is not limited to this. For example, the narrow portion 1 of the joint portion 13 3a can also be formed narrowly and continuously on the outside of the square frame shape. Alternatively, the narrow portion 13a of the joint portion 13 may be formed narrowly and continuously in the central portion of the square frame shape.

The cover member 11 having such a narrow width portion 13a can be configured by setting the shape of the metal-based joining material arranged on the main body portion 12 to a frame shape in the first process, and the frame shape has a portion with a narrow width. the narrow-width portion 13a, and then perform the second process. Among them, the cover member 11 having the narrow-width portion 13a can also be obtained by arranging a frame-shaped metal-based joining material having partially spaced gaps in the circumferential direction in the first process. part, and then in the second process, the metal-based joining material adjacent to the separation part is made to flow. That is, it is also possible to form the narrow-width portion 13a in the second process without forming the narrow-width portion in the first process. However, the joint part 13 of the cover member 11 may have both the narrow width part 13a and the separation part G.

‧The outer shape of the cover member 11 is not limited to a rectangular shape, but may also be a polygonal shape such as a triangular shape or a hexagonal shape, or may be a circular shape.

‧The frame shape of the joint portion 13 of the cover member 11 is not limited to a rectangular frame shape, but may also be a polygonal frame shape or a circular frame shape other than the rectangular frame shape.

‧The cover member 11 may have a main body portion having non-light-transmitting properties. For example, when a metal main body is used as the cover member 11, the metal layer 12b can be omitted.

11: Cover member

12: Main part

12a:Substrate

12b: Metal layer

13:Joint

G: alienation department

E:Extension part

Claims (1)

A cover member for mounting on a base body having a recessed portion for accommodating electronic components, characterized in that it has a main body part and a joint part; the joint part is provided on the main body part and surrounds the cover member when it is installed on the base body The position of the opening of the above-mentioned recessed part is joined to the above-mentioned base body; the above-mentioned joining part is formed of a metal-based joining material; the shape of the above-mentioned joining part is a frame shape, and the frame shape has a partially spaced apart separation part and a part with a narrow width in the circumferential direction. At least one of the width portions; the width dimension of the narrow-width portion is less than 2/3 of the width dimension of the portion adjacent to the joint portion of the narrow-width portion.