TWI829564B - Cooling module that can move and adjust the contact position of the heat source - Google Patents

Abstract

A heat dissipation module that can move and adjust the contact position of a heat source, including: a heat sink, a base, and a heat pipe arranged between the base plate of the heat sink and the base; wherein at least one protrusion is formed on the lower surface of the base, And the protruding part is adjacent to the position where the heat pipe is disposed; the protruding part is movably disposed with at least one heat source contact element, and the heat source contact element has a fixing part that can fix the heat source contact element to the protruding part, so that The heat dissipation module with a single coverage area can be flexibly applied to different heat dissipation semiconductor chips.

Description

The heat dissipation module can move and adjust the contact position of the heat source

The invention relates to heat dissipation modules used in the fields of computers, servers, mining machines, etc.

The heat dissipation module is an important component used by computers, servers and other equipment to remove heat. Especially in recent years, mining machines used to mine virtual currencies have become increasingly popular, and because they require a large amount of calculations and generate a large amount of heat, the requirements for heat dissipation are even higher. high.

The conventional heat dissipation module structure generally includes a heat sink and a fan. The heat sink has a base plate and a plurality of fins connected to the base plate. A base is provided on the bottom surface of the base plate, and a heat pipe is provided between the base and the base plate. The heat pipe is a high-efficiency passive heat exchange element that is currently commonly used in heat dissipation modules of high-end graphics cards. Its structure is made of copper tubes with high thermal conductivity and is filled with heat exchange liquid.

The heat dissipation principle of the conventional heat dissipation module is to contact and cover the base combined with the heat sink to the chip mounted on the printed circuit board (PCB) to absorb the heat generated by the chip, and conduct the heat to the heat pipe. The guidance of the capillary tissue accelerates the heat exchange liquid to absorb heat energy and sublimate into gas, quickly conduct the heat to the other end with a lower temperature, and then conduct it to the substrate and fins connected to it, and then cooperate with the fan to quickly discharge the heat.

Conventional heat dissipation modules are developed accordingly according to the layout position of the chip on the PCB. That is to say, the positions of the heat pipes and heat conductive elements arranged on the heat dissipation module are fixed. Therefore, a certain type of PCB must be designed accordingly. Developing a dedicated cooling module increases manufacturing costs.

The object of the present invention is to provide a heat dissipation module that can move and adjust the contact position of the heat source, that is, the position of the heat source contact element for contacting the heat source on the heat dissipation module can be flexibly adjusted according to the different positions of the heat source on the PCB. This enables a heat dissipation module to be used in a variety of PCB chip layout structures.

The heat dissipation module provided by the invention can move and adjust the contact position of the heat source, including: a heat sink having a base plate and a plurality of fins connected to the base plate; a base located on the bottom surface of the base plate; and a heat pipe disposed on the base plate. between the base plate and the base; wherein at least one protruding portion is formed on the lower surface of the base, and the protruding portion is adjacent to the position where the heat pipe is disposed; and at least one heat source contact element has at least one fixing portion, the The heat source contact element is movably arranged on the protruding part, and the heat source contact element can be fixed on the protruding part by using the fixing part. With this structure, the position of the heat source contact component can be flexibly adjusted according to the chip positions laid out on different PCBs, so that one heat dissipation module can be used in a variety of PCB chip layout structures.

In one embodiment of the present invention, the protruding portion may be a continuously extending U-shaped track, and a continuously extending first through-groove is formed between opposite sides of the protruding portion.

In another embodiment of the present invention, the protruding portion can be continuously bent and formed into a shape having a plurality of curved portions, and a continuously extending first through-groove is formed between opposite sides of the protruding portion.

Another embodiment of the present invention may include a plurality of block-shaped protrusions arranged in a matrix.

In one embodiment of the present invention, fixing portions can be respectively provided on opposite sides of the heat source contact element. The heat source contact element is fixed to the opposite sides of the protruding portion through the fixing portions, thereby fixing the heat source contact element to the protruding portion. The protruding portion enables the heat source contact element to contact the heat pipe.

In one embodiment of the present invention, flanges can be formed on opposite sides of the protruding portion, and the fixing portion can be an elastic fastener. The heat source contact element fastens the flange through the elastic fastener, thereby connecting the heat source to the flange. The contact element is fixed to this projection.

In one embodiment of the present invention, a groove is formed on the bottom surface of the base of the heat sink. When the base is assembled to the bottom surface of the substrate, the groove communicates with the first through groove to jointly form a space, and the heat pipe is disposed on in the space between the groove and the first through groove.

In one embodiment of the present invention, the base may be formed with a plurality of second through-grooves, each of the second through-grooves is connected to the upper surface of a plurality of the protrusions, and the bottom surface of the base of the heat sink is formed with corresponding second through-grooves. There are a plurality of grooves in the groove. When the base is assembled to the bottom surface of the substrate, each groove and the corresponding second through groove together form a space, and a plurality of heat pipes are arranged between the groove and the second through groove. The heat source contact element is brought into contact with the heat pipe in the space between the slots.

In an embodiment of the present invention, the heat source contact element may be a composite metal material configured to contact the heat pipe.

The heat dissipation module of the present invention that can move and adjust the contact position of the heat source is particularly suitable for mining machines that generate virtual currency.

In order to facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and embodiments. The drawings illustrate some, but not all, embodiments of the invention. The invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough understanding of the present disclosure will be provided. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making any progressive efforts fall within the scope of protection of the present invention.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used in the description of the present invention is only for the purpose of describing specific embodiments and is not intended to limit the present invention.

"First Embodiment"

As shown in FIGS. 1 to 5 , the heat dissipation module provided by the present invention that can move and adjust the contact position of a heat source includes: a heat sink 10 , a base 12 , a heat pipe 14 , a heat source contact element 16 and a fan 18 . Among them, the heat sink 10 is integrally formed with a base plate 101 and a plurality of fins 102 connected to the base plate 101; the base 12 is provided on the bottom surface of the base plate 101; the heat pipe 14 is arranged between the base plate 101 and the base 12 as a Heat exchange element; the fan 18 is disposed on the fins 102 of the heat sink 10 to provide air flow in the direction of the fins 102 to remove heat.

In more detail, a T-shaped groove 103 cut through the fin 102 is formed above the heat sink 10. A plurality of locking blocks 22 with screw holes 221 are slidably provided in the T-shaped groove 103. Through the T-shaped groove 103, The structure of the groove 103 allows the locking block 22 to slide along the T-shaped groove 103 but cannot be moved out in the vertical direction. Therefore, by passing the first screw 20 through the through hole 181 provided in the fan 18 and then locking it into the T-shaped The screw hole 221 of the locking block 22 is in the groove 103 to fix the fan 18 to the heat sink 10 . Furthermore, a groove 1011 for accommodating the heat pipe 14 is formed on the bottom surface of the base plate 101 of the heat sink 10. In the first embodiment of the present invention, the groove 1011 is formed into a continuously extending U-shaped groove.

The base 12 is a metal plate used to cover the PCB and the heat source (such as a chip). The lower surface of the base 12 is integrally formed with a protruding portion 121 for disposing the heat source contact element 16. The protruding portion 121 is formed between opposite sides of the base 12. A first through groove 122 for disposing the heat pipe 14 is formed. Specifically, a forming method such as stamping, casting or cutting can be used to form the protruding portion 121 on the lower surface of the base 12 and form the first through-groove 122 between the opposite sides of the protruding portion 121; wherein, in order to make the first through-groove 122 The through groove 122 and the groove 1011 match each other to form a space for accommodating the heat pipe 14. The first through groove 122 is formed into a continuously extending U-shaped groove corresponding to the shape of the groove 1011. Correspondingly, the protruding portion 121 is formed as a continuously extending U-shaped track along the first through groove 122 . After the heat pipe 14 is arranged between the first through groove 122 and the groove 1011, the second screw 24 is passed through the hole 123 provided in the base 12 and locked into the bottom of the base plate 101, so that the heat pipe 14 is fixed. It is arranged between the substrate 101 and the base 12 , and at the same time, the heat pipe 14 is in close contact with the thermally conductive composite metal material layer 162 provided on the upper surface of the heat source contact element 16 . .

The heat pipe 14 is a high-efficiency passive heat exchange element, which has a copper tube with high thermal conductivity, and the inside of the copper tube is filled with heat exchange liquid.

The present invention can use a thermally conductive composite metal material layer 162 containing graphite to be disposed on the upper surface of the heat source contact element 16, and fixing portions 161 are provided on opposite sides of the heat source contact element 16, and the heat source contact element 16 is movably arranged. The heat source contact element 16 can be fixed on the protruding portion 121 of the base 12 by using the fixing portion 161 . More specifically, continuously extending flanges 1211 are formed on opposite sides of the protruding portion 121; the present invention uses elastic fasteners as the fixing portion 161, and the heat source contact element 16 is fastened by the elastic fasteners. This flange 1211 thereby secures the heat source contact element 16 to the protrusion 121 .

Utilizing the aforementioned heat dissipation module of the present invention, in actual use, the position of the heat source contact element 16 on the protruding portion 121 can be moved and adjusted according to the different positions of the chips arranged on the PCB. After the position is predetermined, the fixing portion 161 can be used. The buckle fastens the flange 1211 of the protrusion 121 to fix it, and then the base 12 is covered to the PCB and the thermally conductive composite metal material layer 162 on the heat source contact component 16 is used as a thermal contact interface to contact the heat pipe 14, and the heat source contacts The lower surface of the component 16 contacts the chip (i.e., the heat source). Therefore, when the heat source contact component 16 absorbs the heat generated by the chip, it conducts the heat to the heat pipe 14 through the heat source contact component 16 and the thermally conductive composite metal material layer 162. The duct 14 is conducted to the substrate 101 and the fins 102 that are in contact with it, and then the heat is quickly discharged by the fan 18 .

"Second Embodiment"

The second embodiment of the present invention is a modification based on the technical features of the first embodiment. The difference between the two lies in the layout of the protruding portion 121 and the first through groove 122 formed on the base 12, and The layout form of the grooves 1011 formed in the substrate 101. As shown in FIGS. 6 and 7 , the heat dissipation module of the second embodiment of the present invention also includes: a heat sink 10 , a base 12 , a heat pipe 14 , a heat source contact element 16 and a fan 18 .

Among them, the groove 1011 formed on the bottom surface of the base plate 101 of the heat sink 10 to accommodate the heat pipe 14 is continuously bent and formed into a shape with a plurality of arc-shaped bends; at the same time, the first through groove on the upper surface of the base 12 is also formed. 122 is continuously bent and formed into a shape with a plurality of arc-shaped bends; accordingly, the protruding portions 121 located on opposite sides of the first through groove 122 are formed into a track that is continuously bent and formed into a shape with a plurality of arc-shaped bends. In addition, the heat pipe 14 extends continuously and curvedly into a shape corresponding to the first through groove 122 and the groove 1011. After it is arranged between the first through groove 122 and the groove 1011, the second screw 24 is passed through and set in the groove 1011. The hole 123 of the base 12 is locked into the bottom of the base plate 101 so that the heat pipe 14 is fixedly disposed between the base plate 101 and the base 12 . And like the first embodiment mentioned above, the heat source contact element 16 can be moved and adjusted to the appropriate position of the protruding portion 121 according to the location of the heat source, and then the elastic fasteners serving as the fixing portion 161 can be used to buckle the protruding portion 121 on both sides. The flange 1211 is used to fix the heat source contact element 16 to the protruding portion 121 , and at the same time, the thermally conductive composite metal material layer 162 on the heat source contact element 16 serves as a thermal contact interface to contact the heat pipe 14 .

"Third Embodiment"

The third embodiment of the present invention is a modification based on the technical features of the first embodiment. The difference between the two lies in the layout of the protruding portion 121 and the first through groove 122 formed on the base 12, and The layout form of the grooves 1011 formed in the substrate 101. As shown in FIGS. 8 and 9 , the heat dissipation module of the third embodiment of the present invention also includes: a heat sink 10 , a base 12 , a heat pipe 14 , a heat source contact element 16 and a fan 18 . Among them, a plurality of protrusions 121 arranged in a matrix are formed on the lower surface of the base 12, and a plurality of second through-grooves 124 are formed on the base 12. Each second through-groove 124 is connected to a plurality of the protrusions 121. For example, each second through-groove 124 has a straight shape and connects a plurality of protrusions 121 arranged in a straight line; flanges 1211 are formed on opposite sides of the protrusions 121 .

A plurality of grooves 1011 corresponding to the second through grooves 124 are formed on the bottom surface of the base plate 101 of the heat sink 10. When the base 12 is assembled to the bottom surface of the base plate 101, each groove 1011 is formed together with the corresponding second through grooves 124. A space for placing the heat pipe 14. When the base 12 is assembled to the bottom surface of the substrate 101 and the heat source contact element 16 is fixed to the flange 1211 through its fixing portion 161, the heat source contact element 16 contacts the heat source through the thermally conductive composite metal layer provided on the upper surface of the heat source contact element 16. Catheter 14.

The present invention uses the heat dissipation module that can move and adjust the contact position of the heat source to flexibly adjust the position of the heat source contact element on the heat dissipation module according to the different positions of the heat source on the PCB, so that one heat dissipation module can be used in a variety of applications. PCB chip layout structure, thereby saving the cost of developing various styles of heat dissipation modules.

The above-described embodiments only express the preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be noted that for those of ordinary skill in the art, several changes and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

10:Heat sink

101:Substrate

1011: Groove

102:Fins

103:T-shaped groove

12: Base

121:Protrusion 1211:Flange 122: First through slot 123:hole 124:Second through slot 14:Heat pipe 16: Heat source contact element 161: Fixed part 162: Thermal conductive composite metal layer 18:Fan 20:First screw 22: Lock block 221:Screw hole 24:Second screw

Figure 1 is a perspective view 1 showing the first embodiment of the present invention; Figure 2 is a perspective view 2 showing the first embodiment of the present invention; Figure 3 is an exploded perspective view showing the assembly relationship of components according to the first embodiment of the present invention; Figure 4 is a plan cross-sectional view along the IV-IV direction of Figure 1; Figure 5A is a partially enlarged schematic diagram showing the combined structure of the heat source contact element and the protruding portion of the present invention; Figure 5B is a partially enlarged schematic diagram showing the structure of the heat source contact element and the protruding portion of Figure 5A after separation; Figure 6 is an exploded perspective view showing the assembly relationship of components of the second embodiment of the present invention; Figure 7 is a schematic diagram showing the shape of the protrusion formed on the base according to the second embodiment of the present invention; FIG. 8 is an exploded perspective view showing the assembly relationship of components according to the third embodiment of the present invention; and FIG. 9 is a schematic diagram showing the shape of the protruding portion formed on the base according to the third embodiment of the present invention.

10:Heat sink

12: Base

121:Protrusion

1211:Flange

16: Heat source contact element

18:Fan

Claims (10)

A heat dissipation module that can move and adjust the contact position of a heat source, including: a heat sink having a base plate and a plurality of fins connected to the base plate; a base located on the bottom surface of the base plate; and a heat pipe configured on between the substrate and the base; it is characterized in that: the lower surface of the base is formed with at least one protruding portion, and the protruding portion is adjacent to the position where the heat pipe is disposed; and at least one heat source contact element has at least one fixed part, the heat source contact element is movably arranged on the protruding part, and the heat source contact element can be fixed on the protruding part by using the fixing part. The heat dissipation module that can move and adjust the contact position of the heat source as described in claim 1, wherein the protruding part is a continuously extending U-shaped track, and a continuously extending first first rail is formed between the opposite sides of the protruding part. Through groove. The heat dissipation module that can move and adjust the contact position of the heat source as described in claim 1, wherein the protruding portion is continuously bent and extended into a shape with a plurality of bends, and a continuous shape is formed between opposite sides of the protruding portion. An extended first through slot. The heat dissipation module that can move and adjust the contact position of the heat source as described in claim 1, wherein the heat dissipation module includes a plurality of block-shaped protrusions arranged in a matrix. The heat dissipation module that can move and adjust the contact position of the heat source as described in any one of claims 1 to 4, wherein a fixing part is provided on opposite sides of the heat source contact element, and the heat source contact element is fixed by the fixing part. to opposite sides of the protruding portion, thereby fixing the heat source contact element to the protruding portion, so that the heat source contact element is in contact with the heat pipe. The heat dissipation module that can move and adjust the contact position of the heat source as described in claim 5, wherein a flange is formed on opposite sides of the protruding portion, and the fixing portion is an elastic fastener, and the heat source contact element The heat source contact element is fixed to the protruding portion by the elastic fastener buckling the flange. The heat dissipation module with movable adjustment of the contact position of the heat source as described in claim 2 or 3, wherein a groove is formed on the bottom surface of the base plate of the heat sink, and when the base is assembled to the bottom surface of the base plate, the groove and the The first through grooves are connected to form a space together, and the heat pipe is arranged in the space between the groove and the first through groove. The heat dissipation module that can move and adjust the contact position of the heat source as described in claim 4, wherein the base is formed with a plurality of second through-grooves, and each of the second through-grooves is connected to the upper surfaces of a plurality of the protrusions, wherein The bottom surface of the base plate of the heat sink is formed with a plurality of grooves corresponding to the second through grooves. When the base is assembled to the bottom surface of the base plate, each of the grooves and the corresponding second through grooves together form a space, and wherein a plurality of the heat pipes are respectively arranged in the space between the groove and the second through groove, so that the heat source contact element is in contact with the heat pipe. The heat dissipation module that can move and adjust the contact position of the heat source as described in claim 1, wherein the heat source contact element is provided with a thermally conductive composite metal material layer for contacting the heat pipe. The heat dissipation module that can move and adjust the contact position of the heat source as described in claim 1, wherein the heat dissipation module is used in a mining machine used to generate virtual currency.

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