TWI828581B - Mass transfer method and device of micro-luminescent diodes - Google Patents

Abstract

A mass transfer method of micro-luminescent diodes, including: driving a temperature-controlled adhesive plate to adhere to a temporary carrier plate, wherein the temperature-controlled adhesive plate has a plurality of cold adhesive parts, and the temporary carrier plate adheres to a plurality of LED chips, and the cold-reduced adhesive parts are in contact with the LED chips; driving a heating device to perform a heating operation on the temporary carrier plate to increase the distance between the LED chips and the temperature-controlled adhesion plate The viscosity allows the LED chips to adhere to the temperature-controlled adhesive plate; driving the temperature-controlled adhesive plate to adhere to a circuit board so that the LED chips correspond to a plurality of contact pads of the circuit board, wherein, Each contact pad is coated with a flux layer; and a cooling device is driven to perform a cooling operation on the temperature-controlled adhesion board to reduce the viscosity between the LED chips and the temperature-control adhesion board and increase the temperature of the LED chips. The viscosity between the temperature control adhesive plate and the circuit board causes the LED chips to separate and the LED chips to adhere to the circuit board.

Description

Mass transfer method and device of micro-luminescent diodes

The present invention relates to a method and device for transferring electronic components, and in particular to a method and device for transferring micro-light emitting diodes in large quantities.

As the functionality of electronic products continues to improve, the attachment of light-emitting components in many display panels involves transferring a huge number of micro-light-emitting diodes on a wafer to a circuit carrier board.

The general micro-light emitting diode transfer method mainly includes: grinding the back side of a wafer; affixing a blue film on the back side; laser cutting and utilizing multiple micro-light emitting diodes on the front side of the wafer. A separation and expansion machine performs an expansion operation on the blue film to expand the spacing of the micro-light emitting diodes; and uses a robot arm or manual clamping of the micro-light emitting diodes one by one to the corresponding connections on a circuit carrier board Pad.

However, when the number of micro-light emitting diodes on a wafer increases significantly with the advancement of wafer manufacturing processes, the transfer efficiency of existing transfer methods will be significantly insufficient.

In order to solve the above-mentioned problems, a novel mass transfer solution of micro-light emitting diodes is urgently needed in this field.

One object of the present invention is to provide a mass transfer method of micro-light emitting diodes, which can transfer multiple LED dies on a temporary carrier to a circuit via a temperature-controlled adhesive plate by changing the temperature of the contact surface. on the board to significantly shorten the huge transfer time of LED dies, thereby improving the production efficiency of a display.

Another object of the present invention is to provide a mass transfer device for micro-light emitting diodes, which can significantly shorten the mass transfer time of LED dies through the above method to improve the production efficiency of a display.

In order to achieve the above purpose, a mass transfer method of micro-light emitting diodes is proposed, which is implemented by a control circuit executing a program and includes the following steps: Driving an attachment surface of a temperature-controlled adhesive board to adhere to a component surface of a temporary carrier board, wherein the attachment surface of the temperature-controlled adhesive board has a plurality of cold adhesive parts, and the component of the temporary carrier board A plurality of LED chips are adhered to the surface, and the cold-reduced adhesive parts are in contact with the LED chips; Driving a heating device to perform a heating operation on the temporary carrier plate to increase the viscosity between the LED chips and the temperature-controlled adhesion plate, so that the LED chips adhere to the temperature-controlled adhesion plate; The attachment surface of the temperature-controlled adhesive board is driven to adhere to a circuit board so that the LED dies correspond to a plurality of contact pads of the circuit board, wherein each contact pad is coated with a flux layer; and Driving a cooling device to perform a cooling operation on the temperature-controlled adhesive plate to reduce the viscosity between the LED chips and the temperature-controlled adhesive plate and increase the viscosity between the LED chips and the circuit board, thereby making the temperature-controlled The adhesive board is detached from the LED chips and adheres the LED chips to the circuit board.

In one embodiment, the temporary carrier adheres the LED dies through a blue film.

In a possible embodiment, the flux layer includes at least one of ammonium chloride and rosin.

In a possible embodiment, the substrate of the circuit board may be a BT substrate, an ABF substrate or an MIS substrate.

In order to achieve the above object, the present invention further discloses a mass transfer device of micro-luminescence diodes, which has a control circuit, a heating device, a cooling device, a temperature-controlled adhesive plate and a temporary carrier plate to perform a micro-luminescence The mass transfer procedure of diodes includes: The control circuit drives an attachment surface of the temperature-controlled adhesive board to adhere to a component surface of the temporary carrier board, wherein the attachment surface of the temperature-controlled adhesive board has a plurality of cold viscosity-reducing adhesive parts, and the temporary carrier board A plurality of LED chips are adhered to the surface of the component, and the cold viscosity-reducing adhesive portions are in contact with the LED chips; The control circuit drives the heating device to perform a heating operation on the temporary carrier board to increase the viscosity between the LED chips and the temperature-controlled adhesive plate, so that the LED chips adhere to the temperature-controlled adhesive plate; The control circuit drives the attachment surface of the temperature-controlled adhesive plate to attach to a circuit board so that the LED chips are in contact with a plurality of contact pads of the circuit board, wherein each contact pad is coated with a flux layer; and The control circuit drives the cooling device to perform a cooling operation on the temperature-controlled adhesive plate to reduce the viscosity between the LED chips and the temperature-controlled adhesive plate and increase the viscosity between the LED chips and the circuit board, thereby making The temperature control adhesive plate is separated from the LED chips and adheres the LED chips to the circuit board.

In one embodiment, the temporary carrier adheres the LED dies through a blue film.

In a possible embodiment, the flux layer includes at least one of ammonium chloride and rosin.

In a possible embodiment, the substrate of the circuit board may be a BT (Bismaleimide Triazine) substrate, an ABF (Ajinomoto Build-up Film; Ajinomoto laminated film) substrate or an MIS (Molded Interconnect) Substrate; molding substrate) substrate.

In order to enable the review committee to further understand the structure, characteristics and purpose of the present invention, drawings and detailed descriptions of preferred embodiments are attached as follows.

Please refer to FIG. 1 , which illustrates a block diagram of an embodiment of a mass transfer device for micro-light emitting diodes of the present invention. As shown in Figure 1, a micro-light emitting diode mass transfer device 100 has a control circuit 110, a heating device 120, a cooling device 130, a temperature-controlled adhesive plate 140 and a temporary carrier plate 150, wherein the The control circuit 110 is used to execute a program to control the operations of the heating device 120, the cooling device 130, the temperature-controlled adhesion plate 140 and the temporary carrier plate 150 to realize a mass transfer process of micro-light emitting diodes, thereby transferring a huge amount of The micro-light emitting diodes are transferred to a circuit board 10 .

The heating device 120 is used to heat the temporary carrier 150 .

The cooling device 130 is used to cool down the temperature-controlled adhesion plate 140 .

Please refer to FIG. 2 , which is a schematic cross-sectional view of the temperature control adhesive plate 140 . As shown in Figure 2, the temperature-controlled adhesive plate 140 has an adhesion surface with a plurality of cold viscosity-reducing adhesive parts 141, wherein the viscosity of these cold viscosity-reducing adhesive parts 141 is proportional to the temperature, that is, when these cold viscosity-reducing adhesive parts 141 When the temperature of the cold viscosity-reducing adhesive parts 141 increases, the viscosity increases; when the temperature of the cold viscosity-reducing adhesive parts 141 decreases, the viscosity decreases accordingly.

Please refer to FIG. 3 , which is a schematic cross-sectional view of the temporary carrier board 150 . As shown in FIG. 3 , the component surface of the temporary carrier board 150 has a blue film 151 and a plurality of LED (light emitting diode; light emitting diode) dies 20 adhered to the blue film 151 .

Please refer to FIG. 4 , which is a schematic cross-sectional view of the circuit board 10 . As shown in FIG. 4 , the circuit board 10 has a plurality of contact pads 11 , and each contact pad 11 is coated with a flux layer 11 a.

In detail, the mass transfer process of the micro-light emitting diodes includes: (1) The control circuit 110 drives the attachment surface of the temperature-controlled adhesive board 140 to adhere to the component surface of the temporary carrier board 150, so that the The cold viscosity-reducing adhesive parts 141 are in contact with the LED chips 20. Please refer to Figure 5 for the situation; (2) The control circuit 110 drives the heating device 120 to perform a heating operation on the temporary carrier board 150 to increase the number of LED chips. 20 and the cold-reduced adhesive parts 141, so that the LED chips 20 adhere to the temperature-controlled adhesion plate 140. Please refer to Figure 6 for the situation; (3) The control circuit 110 drives the temperature-control adhesion plate 140 The attachment surface is attached to the circuit board 10 so that the LED chips 20 correspond to the flux layer 11a on the contact pads 11 of the circuit board 10. Please refer to Figure 7 for the situation; and (4) control The circuit 110 drives the cooling device 130 to perform a cooling operation on the temperature-controlled adhesive plate 140 to reduce the viscosity between the LED chips 20 and the cold-reduced adhesive parts 141 and to increase the viscosity between the LED chips 20 and the flux layers. The viscosity between 11a causes the temperature control adhesive plate 140 to separate from the LED chips 20 and make the LED chips 20 adhere to the circuit board 10. Please refer to FIG. 8 for the situation.

As can be seen from the above description, the present invention discloses a mass transfer method of micro-light emitting diodes. Please refer to FIG. 9 , which illustrates a flow chart of one embodiment of the mass transfer method of micro-light emitting diodes of the present invention, which is implemented by a control circuit executing a program. As shown in Figure 9, the method includes the following steps: driving an attachment surface of a temperature-controlled adhesive plate to attach to a component surface of a temporary carrier board, wherein the attachment surface of the temperature-controlled adhesive plate has a plurality of cold Adhesion-reducing glue part, a plurality of LED chips are adhered to the component surface of the temporary carrier board, and the cold viscosity-reducing glue parts are correspondingly contacted with the LED chips (step a); driving a heating device to the temporary carrier board The board undergoes a heating operation to increase the viscosity between the LED chips and the temperature-controlled adhesion board, thereby causing the LED chips to adhere to the temperature-control adhesion board (step b); driving the temperature-control adhesion board Attach a circuit board to the attachment surface so that the LED chips correspond to a plurality of contact pads of the circuit board, wherein each contact pad is coated with a flux layer (step c); and driving a cooling device Perform a cooling operation on the temperature-controlled adhesive plate to reduce the viscosity between the LED chips and the temperature-controlled adhesive plate and increase the viscosity between the LED chips and the circuit board, so that the temperature-controlled adhesive plate is separated from the Some LED chips are attached to the circuit board (step d).

In the above steps, the temporary carrier board adheres the LED chips through a blue film; the flux layer contains at least one of ammonium chloride and rosin; and the base material of the circuit board can be a BT substrate , ABF substrate or MIS substrate.

As can be seen from the above description, the present invention can provide the following advantages: (1) The mass transfer method of micro-light emitting diodes of the present invention can transfer multiple LED dies on a temporary carrier board to a circuit board through a temperature-controlled adhesive plate by changing the temperature of the contact surface. Significantly shortens the mass transfer time of LED dies, thereby improving the production efficiency of a display; and (2) The mass transfer device of micro-light emitting diodes of the present invention can significantly shorten the mass transfer time of LED chips through the above method to improve the production efficiency of a display.

What is disclosed in this case is a preferred embodiment. Any partial changes or modifications derived from the technical ideas of this case and easily inferred by those familiar with the art will not deviate from the scope of the patent rights of this case.

To sum up, regardless of the purpose, means and effects of this case, it shows that it is completely different from the conventional technology, and that the invention is practical first, and indeed meets the patent requirements for inventions. I sincerely ask the review committee to take a clear look and grant the patent as soon as possible for your benefit. Society is a prayer for the Supreme Being.

10:Circuit board 11:Contact pad 11a: Flux layer 20:LED die 100: Micro-luminescent diode mass transfer device 110:Control circuit 120:Heating device 130: Cooling device 140:Temperature control adhesive plate 141:Cold viscosity reduction department 150: Temporary carrier board 151: blue film Step a: Driving an attachment surface of a temperature-controlled adhesive board to adhere to a component surface of a temporary carrier board, wherein the attachment surface of the temperature-controlled adhesive board has a plurality of cold adhesive parts, and the temporary carrier board A plurality of LED chips are adhered to the surface of the component, and the cold-reduced adhesive parts are in contact with the LED chips. Step b: Driving a heating device to perform a heating operation on the temporary carrier board to increase the viscosity between the LED chips and the temperature-controlled adhesion plate, so that the LED chips adhere to the temperature-control adhesion plate. Step c: Driving the attachment surface of the temperature control adhesive board to attach to a circuit board so that the LED dies correspond to a plurality of contact pads of the circuit board, wherein each contact pad is coated with a flux layer Step d: Drive a cooling device to perform a cooling operation on the temperature-controlled adhesive plate to reduce the viscosity between the LED chips and the temperature-controlled adhesive plate and increase the viscosity between the LED chips and the circuit board, thereby making The temperature-controlled adhesive plate separates from the LED chips and adheres the LED chips to the circuit board

FIG. 1 is a block diagram illustrating an embodiment of a mass transfer device for micro-light emitting diodes of the present invention. FIG. 2 is a schematic cross-sectional view of the temperature-controlled adhesive plate of the mass transfer device of micro-light emitting diodes in FIG. 1 . FIG. 3 is a schematic cross-sectional view of a temporary carrier plate of the mass transfer device for micro-light emitting diodes in FIG. 1 . FIG. 4 is a schematic cross-sectional view of a circuit board used in the mass transfer device of micro-light emitting diodes in FIG. 1 . FIG. 5 is a schematic diagram of the mass transfer device of micro-light emitting diodes in FIG. 1 so that the temperature-controlled adhesive plate contacts the temporary carrier plate accordingly. FIG. 6 is a schematic diagram of the mass transfer device of micro-light emitting diodes in FIG. 1 using a heating operation to adhere multiple LED dies on the temporary carrier board to the temperature-controlled adhesion board. 7 is a schematic diagram of the mass transfer device of micro-light emitting diodes in FIG. 1 so that the temperature-controlled adhesive plate is attached to the circuit board so that each of the LED chips contacts a flux layer on one of the contact pads of the circuit board. FIG. 8 is a schematic diagram of the mass transfer device of micro-light emitting diodes in FIG. 1 to separate the temperature-controlled adhesion plate from the LED chips and adhere the LED chips to the circuit board. FIG. 9 is a flow chart illustrating an embodiment of a mass transfer method of micro-light emitting diodes according to the present invention.

Step a: Driving an attachment surface of a temperature-controlled adhesive board to adhere to a component surface of a temporary carrier board, wherein the attachment surface of the temperature-controlled adhesive board has a plurality of cold adhesive parts, and the temporary carrier board A plurality of LED chips are adhered to the surface of the component, and the cold-reduced adhesive parts are in contact with the LED chips.

Step b: Driving a heating device to perform a heating operation on the temporary carrier board to increase the viscosity between the LED chips and the temperature-controlled adhesion plate, so that the LED chips adhere to the temperature-control adhesion plate.

Step c: Driving the attachment surface of the temperature control adhesive board to attach to a circuit board so that the LED dies correspond to a plurality of contact pads of the circuit board, wherein each contact pad is coated with a flux layer

Step d: Drive a cooling device to perform a cooling operation on the temperature-controlled adhesive plate to reduce the viscosity between the LED chips and the temperature-controlled adhesive plate and increase the viscosity between the LED chips and the circuit board, thereby making The temperature-controlled adhesive plate separates from the LED chips and adheres the LED chips to the circuit board

Claims (8)

A mass transfer method of micro-luminescent diodes is implemented by a control circuit executing a program and includes the following steps: Driving an attachment surface of a temperature-controlled adhesive board to adhere to a component surface of a temporary carrier board, wherein the attachment surface of the temperature-controlled adhesive board has a plurality of cold adhesive parts, and the component of the temporary carrier board A plurality of LED chips are adhered to the surface, and the cold-reduced adhesive parts are in contact with the LED chips; Driving a heating device to perform a heating operation on the temporary carrier plate to increase the viscosity between the LED chips and the temperature-controlled adhesion plate, so that the LED chips adhere to the temperature-controlled adhesion plate; The attachment surface of the temperature-controlled adhesive board is driven to adhere to a circuit board so that the LED dies correspond to a plurality of contact pads of the circuit board, wherein each contact pad is coated with a flux layer; and Driving a cooling device to perform a cooling operation on the temperature-controlled adhesive plate to reduce the viscosity between the LED chips and the temperature-controlled adhesive plate and increase the viscosity between the LED chips and the circuit board, thereby making the temperature-controlled The adhesive board is detached from the LED chips and adheres the LED chips to the circuit board. The mass transfer method of micro-light emitting diodes as described in claim 1, wherein the temporary carrier board adheres the LED dies through a blue film. The mass transfer method of micro-light emitting diodes as claimed in claim 1, wherein the flux layer contains at least one material selected from the group consisting of ammonium chloride and rosin. The mass transfer method of micro-light emitting diodes as described in claim 1, wherein the substrate of the circuit board is a substrate selected from the group consisting of BT substrate, ABF substrate and MIS substrate. A mass transfer device of micro-light emitting diodes, which has a control circuit, a heating device, a cooling device, a temperature-controlled adhesive plate and a temporary carrier plate to perform a mass transfer process of micro-light emitting diodes. The program includes: The control circuit drives an attachment surface of the temperature-controlled adhesive board to adhere to a component surface of the temporary carrier board, wherein the attachment surface of the temperature-controlled adhesive board has a plurality of cold viscosity-reducing adhesive parts, and the temporary carrier board A plurality of LED chips are adhered to the surface of the component, and the cold viscosity-reducing adhesive portions are in contact with the LED chips; The control circuit drives the heating device to perform a heating operation on the temporary carrier board to increase the viscosity between the LED chips and the temperature-controlled adhesive plate, so that the LED chips adhere to the temperature-controlled adhesive plate; The control circuit drives the attachment surface of the temperature-controlled adhesive plate to attach to a circuit board so that the LED chips are in contact with a plurality of contact pads of the circuit board, wherein each contact pad is coated with a flux layer; and The control circuit drives the cooling device to perform a cooling operation on the temperature-controlled adhesive plate to reduce the viscosity between the LED chips and the temperature-controlled adhesive plate and increase the viscosity between the LED chips and the circuit board, thereby making The temperature control adhesive plate is separated from the LED chips and adheres the LED chips to the circuit board. The mass transfer device of micro-light emitting diodes as described in claim 5, wherein the temporary carrier board adheres the LED dies through a blue film. The mass transfer device of micro-light emitting diodes according to claim 5, wherein the flux layer contains at least one material selected from the group consisting of ammonium chloride and rosin. The mass transfer device of micro-light emitting diodes according to claim 5, wherein the substrate of the circuit board is a substrate selected from the group consisting of BT substrate, ABF substrate and MIS substrate.

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