TWI828192B - Sensor package structure - Google Patents

Abstract

The present invention provides a sensor package structure, which includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer having a ring shape and disposed on an inner surface of the light-permeable layer, and a package body that is formed on the substrate. A projection region defined by orthogonally projecting the shielding layer onto a top surface of the sensor chip surrounds an outer side of a sensing region of the sensor chip. A portion of the shielding layer in contact with the light-curing layer defines a ring-shaped distribution region having at least one light-permeable slot. The sensor chip, the light-curing layer, the light-permeable layer, and the shielding layer are embedded in the package body that exposes at least part of the light-permeable layer therefrom.

Description

Sensor packaging structure

The present invention relates to a packaging structure, and in particular to a sensor packaging structure.

In the existing sensor packaging structure, the glass plate is disposed on the sensing chip through an adhesive layer, and the adhesive layer surrounds the periphery of the sensing area of the sensing chip. However, since the light passing through the glass plate may be partially reflected by the adhesive layer, it may affect the sensing area of the sensing chip (eg, glare phenomenon).

As mentioned above, the existing sensor packaging structure forms a shielding layer between the glass plate and the adhesive layer to reduce the glare phenomenon. However, the shielding layer embedded in the glue layer may easily cause the glue layer to be difficult to be completely cured and may cause delamination.

Therefore, the inventor believed that the above-mentioned defects could be improved, so he devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects.

Embodiments of the present invention provide a sensor packaging structure that can effectively improve defects that may occur in existing sensor packaging structures.

An embodiment of the present invention discloses a sensor packaging structure, which includes: a substrate; a sensing chip, which is disposed on the substrate along a preset direction, and the sensing chip is electrically coupled to The substrate; wherein, a top surface of the sensing chip contains a sensing area; a photo-cured layer is annular and is disposed on the top surface of the sensing chip and surrounds the sensing area The outside of ; Wherein, the inner surface of the light-transmitting layer, the photo-cured layer, and the top surface of the sensing chip together form a closed space; a shielding layer is annular and is disposed on the transparent layer. The inner surface of the light layer, and a projection area formed by the orthogonal projection of the shielding layer to the top surface along the preset direction, which surrounds the outside of the sensing area; wherein, in contact with the The shielding layer of the photocurable layer defines an annular configuration area, and the annular configuration area is formed with at least one light-transmitting slot; and a package is formed on the substrate; wherein, the sensing chip, The photocurable layer, the light-transmitting layer, and the shielding layer are all embedded in the package, and at least part of the outer surface of the light-transmitting layer is exposed outside the package.

Embodiments of the present invention also disclose a sensor packaging structure, which includes: a substrate; a sensing chip, which is square and disposed on the substrate along a preset direction, and the sensing chip is electrically coupled to The substrate; wherein, a top surface of the sensing chip contains a sensing area; a photo-cured layer is annular and is disposed on the top surface of the sensing chip and surrounds the sensing area The outside of The inner surface of the light-transmitting layer, the photo-cured layer, and the top surface of the sensing chip together form a closed space; a shielding layer is provided on the inner surface of the light-transmitting layer, The shielding layer includes a plurality of shielding strips spaced apart from each other; wherein the area of two adjacent shielding strips spaced apart from each other corresponds to a corner of the sensing wafer, and each shielding strip forms There is at least one light-transmitting slot; wherein the shielding layer is projected along the preset direction to a projection area formed by the top surface, which surrounds the outside of the sensing area; and a package, formed from the base Board; wherein the sensing chip, the photocurable layer, the light-transmitting layer, and the shielding layer are all embedded in the package, and at least part of the outer surface of the light-transmitting layer is exposed outside the package.

In summary, the sensor packaging structure disclosed in the embodiment of the present invention is based on the premise of using the shielding layer to block light to reduce the glare phenomenon caused by the reflection of the photocured layer. At least one of the light-transmitting slots in the shielding layer can be used to allow light to pass through and irradiate the photo-cured layer to facilitate its complete curing and prevent the light-transmitting layer from tilting, and the shielding layer is connected to the The generation of delamination defects between the photo-cured layers can also be effectively avoided, thereby improving the yield of the sensor packaging structure.

In order to further understand the characteristics and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not make any reference to the protection scope of the present invention. limit.

100: Sensor packaging structure

1:Substrate

11: Upper surface

111: Chip fixing area

112:Joining pad

12: Lower surface

2: Sensing chip

21:Top surface

211: Sensing area

212: Bearing area

213:Connection pad

22: Bottom surface

23: side

24:Corner

3:Metal wire

4: Light curing layer

5: Translucent layer

51:Outer surface

52:Inner surface

6: Masking layer

6a: Ring configuration area

6b: Masking strip

61:Light-transmitting slot

7:Package

8: Solder ball

E: Enclosed space

P: preset direction

D1-1, D1-2, D1-3, D1-4, D2-1, D2-2, D2-3, D2-4: distance

W6a, W4, W61: Width

FIG. 1 is a schematic three-dimensional view of a sensor packaging structure according to Embodiment 1 of the present invention.

Figure 2 is a schematic top view of Figure 1.

FIG. 3 is a schematic cross-sectional view along section line III-III of FIG. 2 .

FIG. 4 is an enlarged schematic diagram of area IV in FIG. 3 .

FIG. 5 is a schematic top view of FIG. 1 with the light-transmitting layer and the package body omitted.

FIG. 6 is a schematic diagram (1) of the changing configuration of the shielding layer in FIG. 5 .

FIG. 7 is a schematic diagram (2) of the changing configuration of the shielding layer in FIG. 5 .

FIG. 8 is a schematic diagram (3) of the changing configuration of the shielding layer in FIG. 5 .

FIG. 9 is a schematic diagram (4) of the changing configuration of the shielding layer in FIG. 5 .

FIG. 10 is a schematic three-dimensional view of a sensor packaging structure according to Embodiment 2 of the present invention.

FIG. 11 is a schematic top view of FIG. 10 with the light-transmitting layer and the package body omitted.

FIG. 12 is an enlarged schematic diagram of area XII of FIG. 11 .

FIG. 13 is a schematic diagram (1) of the changing configuration of the shielding layer in FIG. 10 .

FIG. 14 is a schematic diagram (2) of the changing configuration of the shielding layer in FIG. 10 .

FIG. 15 is a schematic diagram (3) of the changing configuration of the shielding layer in FIG. 10 .

The following is a specific embodiment to illustrate the implementation of the "sensor packaging structure" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.

It should be understood that although terms such as “first”, “second” and “third” may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another component or one signal from another signal. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[Example 1]

Please refer to FIG. 1 to FIG. 9 , which is Embodiment 1 of the present invention. As shown in Figures 1 and 2, this embodiment discloses a sensor packaging structure 100; that is to say, any structure that does not encapsulate a sensor internally has a structural design basis that is different from the sensing structure 100 referred to in this embodiment. device packaging structure 100, so comparison between the two is not suitable.

As shown in FIGS. 3 to 5 , the sensor package structure 100 includes a substrate 1 , a sensing chip 2 disposed on the substrate 1 , and the sensing chip 2 is electrically coupled to the substrate. A plurality of metal lines 3 of 1, a photo-curing layer 4 arranged on the sensing chip 2, a light-transmitting layer 5 arranged on the photo-curing layer 4, and a light-transmitting layer 5 arranged on the sensing chip 2. A shielding layer 6 of 5 and a package 7 formed on the substrate 1 .

Although the sensor packaging structure 100 is described as including the above components in this embodiment, the sensor packaging structure 100 can also be adjusted and changed according to design requirements. For example, in other embodiments not shown in the present invention, the sensor packaging structure 100 can omit a plurality of the metal lines 3, and the sensing chip 2 is fixed and electrically coupled through a flip-chip method. Connected to the substrate 1; alternatively, the sensor package structure 100 can also omit or replace the package body 7 with other structures. The structure and connection relationship of each component of the sensor packaging structure 100 in this embodiment will be described below.

The substrate 1 is square or rectangular in this embodiment, but the invention is not limited thereto. The substrate 1 is provided with a chip fixing area 111 at approximately the center of its upper surface 11 , and the substrate 1 is formed with a plurality of bonding pads 112 located outside the chip fixing area 111 on the upper surface 11 . The plurality of bonding pads 112 are generally arranged in a ring shape in this embodiment, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the chip fixing area 111 .

In addition, the substrate 1 can also be provided with a plurality of solder balls 8 on its lower surface 12, and the sensor package structure 100 can be soldered and fixed to an electronic component (not shown in the figure) through a plurality of the solder balls 8. shown), thereby enabling the sensor packaging structure 100 to be electrically connected to the electronic component.

The sensing chip 2 is in a square shape (eg, rectangular or square) in this embodiment and is illustrated as an image sensing chip, but is not limited to this. Wherein, the sensing chip 2 (bottom surface 22) It is fixed to the chip fixing area 111 of the substrate 1 along a preset direction P; that is, the sensing chip 2 is located inside a plurality of the bonding pads 112 . Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a carrying area 212 surrounding the sensing area 211 (and in an annular shape), and the sensing chip 2 includes a A plurality of connection pads 213 of the carrying area 212 (that is, a plurality of the connection pads 213 are located outside the sensing area 211).

In this embodiment, the number and position of the connection pads 213 of the sensing chip 2 respectively correspond to the number and position of the bonding pads 112 of the substrate 1 . Furthermore, one ends of the metal wires 3 are respectively connected to the bonding pads 112 , and the other ends of the metal wires 3 are connected to the connection pads 213 respectively (that is, each Both ends of the metal wires 3 are respectively connected to one of the bonding pads 112 and the corresponding connection pads 213), so that the substrate 1 can be electrically coupled through a plurality of the metal wires 3 on the sensing chip 2.

The photocurable layer 4 is disposed on the top surface 21 of the sensing chip 2 and surrounds the outside of the sensing chip 2 . In this embodiment, the photocurable layer 4 is located inside a plurality of the metal lines 3 and does not contact any of the metal lines 3 , but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, at least a part of the metal line 3 can also be embedded in the photocurable layer 4 . In addition, the photo-curable layer 4 is further limited to an ultraviolet light-curable layer in this embodiment, which means a structure that is cured by ultraviolet light irradiation.

The light-transmitting layer 5 is illustrated as a transparent flat glass in this embodiment, but the invention is not limited thereto. In this embodiment, the light-transmitting layer 5 includes an outer surface 51 and an inner surface 52 located on the opposite side of the outer surface 51 . Wherein, the light-transmitting layer 5 is disposed on the photo-curing layer 4 with the inner surface 52 so as to be located above the sensing chip 2; that is to say, the photo-curing layer 4 is sandwiched between the transparent layer 5 and the photo-curing layer 4. Between the light layer 5 and the substrate 1, and the inner surface 52 of the light-transmitting layer 5, the photo-cured layer 4, and the top surface 21 of the sensing chip 2 together form a closed Space E.

The shielding layer 6 is annular and is disposed on the inner surface 52 of the light-transmitting layer 5 to block light from passing through. The shielding layer 6 is projected forward along the preset direction P to a projection area formed by the top surface 21 , which surrounds the outside of the sensing area 211 . To put it another way, an opening is formed on the inner edge of the shielding layer 6 directly above the sensing area 211 .

Furthermore, the portion of the shielding layer 6 that is in contact with the photocurable layer 4 defines an annular arrangement area 6a, and the annular arrangement area 6a is formed with at least one light-transmitting slot 61. The photocurable layer 4 is filled into at least one of the light-transmitting slots 61 and is further connected to the inner surface 52 of the light-transmitting layer 5 .

Accordingly, the sensor packaging structure 100 disclosed in the embodiment of the present invention is based on the premise of using the shielding layer 6 to block light to reduce the glare phenomenon caused by the reflection of the photocured layer 4 , at least one of the light-transmitting slots 61 of the shielding layer 6 can be used to allow light to pass through and irradiate the photo-cured layer 4 to facilitate its complete curing and avoid the tilt of the light-transmitting layer 5, and The formation of delamination defects between the shielding layer 6 and the photo-cured layer 4 can also be effectively avoided, thereby improving the yield of the sensor packaging structure 100 .

It should be noted that in order to make at least one light-transmitting slot 61 formed in the annular arrangement area 6 a more conducive to simultaneously reducing the glare phenomenon and facilitating the complete curing of the photo-cured layer 4 , the annular arrangement area 6a preferably meets at least one of the following structural conditions, but is not limited thereto.

Specifically, the annular configuration area 6a is separated from the inner edge of the shielding layer 6 by a distance D1-1 of 90 microns (μm) to 110 microns, and the annular configuration area 6a is separated from the inner edge of the shielding layer 6 The outer edges are separated by a distance D1-2 of 90 microns to 110 microns. The annular configuration area 6a is separated from the inner edge of the photo-cured layer 4 by a distance D1-3 of 45 microns to 55 microns, and the annular configuration area 6a is separated from the outer edge of the photo-cured layer 4 by 45 microns. ~55 micron distance D1-4. The width W6a of the annular configuration area 6a is the width between the inner edge and the outer edge of the photocurable layer 4 25%~100% of W4.

In addition, the number and shape of at least one light-transmitting slot 61 formed in the annular arrangement area 6a can be adjusted and changed according to different design requirements in this embodiment, but in order to facilitate the reduction of the glare phenomenon at the same time , and contribute to the complete curing of the photocurable layer 4. This embodiment will enumerate several feasible implementations of the shielding layer 6 in the following content, but the present invention is not limited thereto.

As shown in FIGS. 5 and 6 , at least one light-transmitting slot 61 is annular and occupies 25% to 100% of the annular configuration area 6 a. Further, as shown in FIG. 5 , the number of at least one light-transmitting slot 61 is limited to one and it occupies 100% of the annular arrangement area 6 a. Alternatively, as shown in FIG. 6 , the number of at least one light-transmitting slot 61 is limited to multiple (eg, two) and accounts for 25% to 100% of the annular configuration area 6 a.

As shown in FIG. 7 , at least one of the light-transmitting slots 61 is C-shaped and occupies 25% to 95% of the annular arrangement area 6 a. In FIG. 7 of this embodiment, the number of at least one light-transmitting slot 61 is illustrated as one, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the number of C-shaped light-transmitting slots 61 may also be multiple.

As shown in FIGS. 8 and 9 , the number of at least one light-transmitting slot 61 is limited to a plurality, each of which is in the shape of a strip, and the positions of the plurality of light-transmitting slots 61 respectively correspond to the sensors. Multiple sides 23 of wafer 2 are measured. Further, as shown in FIG. 9 , each side 23 of the sensing chip 2 corresponds to and is perpendicular to at least two of the light-transmitting slots 61 , and a plurality of the light-transmitting slots 61 occupies an area of The 25%~100% area of the annular configuration area 6a is described.

Or, as shown in FIG. 8 , each side 23 of the sensing chip 2 corresponds to and is parallel to one of the light-transmitting slots 61 , and a plurality of the light-transmitting slots 61 occupy the annular arrangement area. 25%~100% area of 6a, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, each side 23 of the sensing chip 2 may also correspond to and be parallel to at least two of the light-transmitting Slot 61.

The package body 7 is opaque in this embodiment to block visible light from passing through. The package body 7 is illustrated as a molding compound, and the package body 7 is formed on the upper surface 11 of the substrate 1 and its edge is flush with the edge of the substrate 1 . Wherein, the sensing chip 2, the photocurable layer 4, the light-transmitting layer 5, and the shielding layer 6 are all embedded in the package 7, and at least part of the light-transmitting layer 5 The outer surface 51 is exposed outside the package body 7 , but the present invention is not limited thereto.

[Example 2]

Please refer to Figures 11 to 12, which are Embodiment 2 of the present invention. Since this embodiment is similar to the above-mentioned Embodiment 1, the similarities between the two embodiments will not be repeated (such as: the substrate 1, the sensing chip 2, the plurality of metal lines 3, the photo-curing Layer 4, the light-transmitting layer 5, and the package 7), and the difference between this embodiment and the above-mentioned Embodiment 1 mainly lies in: the shielding layer 6.

In FIGS. 9 to 11 of this embodiment, the shielding layer 6 is formed on the inner surface (not labeled) of the light-transmitting layer 5 , and the shielding layer 6 includes a plurality of shielding layers spaced apart from each other. Article 6b. Wherein, the shielding layer 6 (or the plurality of shielding strips 6b) is projected forward along the preset direction P to a projection area formed by the top surface 21, which surrounds the outside of the sensing area 211. ; That is to say, the sensing area 211 is generally located inside the projection area, so that the above-mentioned glare phenomenon can be reduced through the shielding layer 6 .

In more detail, each side 23 of the sensing chip 2 corresponds to and is parallel to one of the shielding strips 6b, and the area between two adjacent shielding strips 6b is corresponding to the sensing area. Measure one corner 24 of wafer 2. Accordingly, the portion of the photocurable layer 4 located at each corner 24 can not be covered by the shielding layer 6 to facilitate its complete curing.

Furthermore, the shielding layer 6 is formed with at least one light-transmitting groove on each of the shielding strips 6b. holes 61, and the photocurable layer 4 is filled into at least one light-transmitting slot 61 of each shielding strip 6b, and is further connected to the inner surface (not labeled) of the light-transmitting layer 5. From another perspective, since the corners 24 of the sensing chip 2 are not blocked by the shielding layer 6 in this embodiment, the light-transmitting slots formed by the shielding layer 6 The configuration of 61 in this embodiment is different from that in Embodiment 1.

It should be noted that the number and shape of at least one light-transmitting slot 61 formed in each shielding strip 6b can be adjusted and changed according to different design requirements in this embodiment, but in order to facilitate both reduction and The glare phenomenon is beneficial to the complete curing of the photocurable layer 4. The following content will enumerate several feasible implementations of the shielding layer 6, but the present invention is not limited thereto.

As shown in Figures 11 and 13, at least one light-transmitting slot 61 is formed in at least 25% of the area of each shielding strip 6b; in each of the shielding strips 6b, at least one of the light-transmitting slots 61 The slots 61 are elongated and penetrate along the length direction corresponding to the shielding strip 6b, and the number of at least one of the light-transmitting slots 61 can be one (eg: Figure 11) or multiple ( Such as: Figure 13) and they are parallel to each other.

Furthermore, in each of the shielding strips 6b shown in Figures 11 and 12, at least one of the light-transmitting slots 61 is separated from the inner edge of the shielding layer 6 by a distance of 90 microns to 110 microns. D2-1, and at least one of the light-transmitting slots 61 is separated from the outer edge of the shielding layer 6 by a distance D2-2 of 90 microns to 110 microns. The inner edges of the layer 4 are separated by a distance D2-3 of 45 microns to 55 microns, and at least one of the light-transmitting slots 61 is separated from the outer edge of the photocurable layer 4 by a distance D2-4 of 45 microns to 55 microns. Furthermore, in each of the shielding strips 6b shown in FIGS. 11 and 12 , the width W61 of at least one of the light-transmitting slots 61 is the distance between the inner edge and the outer edge of the photocurable layer 4 . The width between edges is 25%~100% of W4.

In addition, in each of the shielding strips 6b shown in FIG. 14, at least one of the transparent The light slot 61 may be adjacent to the end of the corresponding shielding strip 6 b, that is, adjacent to one of the corners 24 of the sensing chip 2 . It should be additionally noted that the number and size of at least one light-transmitting slot 61 of any of the shielding strips 6b can be adjusted and changed according to design requirements, and is not limited to the drawings of the above embodiment.

In each of the shielding strips 6b shown in FIG. 15 , at least 25% of the area of each shielding strip 6b is formed with at least one of the light-transmitting slots 61 , and at least one of the light-transmitting slots 61 The number is limited to multiple and each of them is in the shape of a long strip. Each of the light-transmitting slots 61 is penetrating along the width direction of the corresponding shielding strip 6b. Each side 23 of the sensing chip 2 corresponds to and is perpendicular to at least two of the light-transmitting slots 61 .

[Technical effects of the embodiments of the present invention]

In summary, the sensor packaging structure disclosed in the embodiment of the present invention is based on the premise of using the shielding layer to block light to reduce the glare phenomenon caused by the reflection of the photocured layer. At least one of the light-transmitting slots in the shielding layer can be used to allow light to pass through and irradiate the photo-cured layer to facilitate its complete curing and prevent the light-transmitting layer from tilting, and the shielding layer is connected to the The generation of delamination defects between the photo-cured layers can also be effectively avoided, thereby improving the yield of the sensor packaging structure.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. within.

100: Sensor packaging structure

1:Substrate

11: Upper surface

111: Chip fixing area

112:Joining pad

12: Lower surface

2: Sensing chip

21:Top surface

211: Sensing area

212: Bearing area

213:Connection pad

22: Bottom surface

23: side

3:Metal wire

4: Light curing layer

5: Translucent layer

51:Outer surface

52:Inner surface

6: Masking layer

6a: Ring configuration area

61:Light-transmitting slot

7:Package

8: Solder ball

E: Enclosed space

P: preset direction

Claims (20)

A sensor packaging structure, which includes: a substrate; a sensing chip, which is disposed on the substrate along a preset direction, and the sensing chip is electrically coupled to the substrate; wherein the sensing chip A top surface of the sensing chip contains a sensing area; a photo-cured layer is annular and is disposed on the top surface of the sensing chip and surrounds the outside of the sensing area; a light-transmitting layer has An outer surface and an inner surface located on opposite sides, and the light-transmitting layer is disposed on the photo-cured layer with the inner surface so as to be located above the sensing chip; wherein, the light-transmitting layer The inner surface, the photocurable layer, and the top surface of the sensing chip together form a closed space; a shielding layer is annular and is disposed on the inner surface of the light-transmitting layer, and The shielding layer is projected forward along the preset direction to a projection area formed by the top surface, which surrounds the outside of the sensing area; wherein, the portion of the shielding layer that is in contact with the photocurable layer The location defines an annular configuration area, and the annular configuration area is formed with at least one light-transmitting slot; and a package is formed on the substrate; wherein the sensing chip, the photo-cured layer, the transparent slot The light layer and the shielding layer are both embedded in the package, and at least part of the outer surface of the light-transmitting layer is exposed outside the package. The sensor packaging structure of claim 1, wherein the annular configuration area is separated from the inner edge of the shielding layer by a distance of 90 micrometers (μm) ~ 110 microns, and the annular configuration area is separated from the inner edge of the shielding layer. The outer edges of the shielding layer are separated by a distance of 90 microns to 110 microns. The sensor packaging structure of claim 1, wherein the annular configuration area is separated from the inner edge of the photo-cured layer by a distance of 45 microns to 55 microns, and the annular configuration area is separated from the inner edge of the photo-cured layer. The outer edges of the layers are separated by a distance of 45 microns to 55 microns. The sensor packaging structure of claim 1, wherein the width of the annular configuration area is 25% to 100% of the distance between the inner edge and the outer edge of the photo-cured layer. The sensor packaging structure of claim 1, wherein at least one of the light-transmitting slots is annular and occupies 25% to 100% of the annular configuration area. The sensor packaging structure of claim 5, wherein the number of at least one light-transmitting slot is further limited to one and it occupies 100% of the annular configuration area. The sensor packaging structure of claim 5, wherein the number of at least one light-transmitting slot is further limited to a plurality and accounts for 25% to 100% of the annular configuration area. The sensor packaging structure of claim 1, wherein at least one of the light-transmitting slots is C-shaped and accounts for 25% to 95% of the annular configuration area. The sensor packaging structure according to claim 1, wherein the sensing chip is in a square shape, the number of at least one of the light-transmitting slots is further limited to a plurality, each of which is in the shape of a strip, and the plurality of light-transmitting slots are each in a strip shape. The positions of the light-transmitting slots respectively correspond to the Sensing multiple sides of the wafer. The sensor packaging structure of claim 9, wherein each side of the sensing chip corresponds to and is parallel to one of the light-transmitting slots, and a plurality of the light-transmitting slots occupy the 25%~100% area of the annular configuration area. The sensor packaging structure of claim 9, wherein each side of the sensing chip corresponds to and is perpendicular to at least two of the light-transmitting slots, and a plurality of the light-transmitting slots occupy an area of 25%~100% area of the annular configuration area. A sensor packaging structure, which includes: a substrate; a sensing chip, which is square and arranged on the substrate along a preset direction, and the sensing chip is electrically coupled to the substrate; wherein, A top surface of the sensing chip contains a sensing area; a photo-cured layer, which is annular and is disposed on the top surface of the sensing chip and surrounds the outside of the sensing area; a light-transmitting layer layer, having an outer surface and an inner surface located on opposite sides, and the light-transmitting layer is disposed on the photo-cured layer so as to be located above the sensing chip; wherein, the light-transmitting layer The inner surface, the photocurable layer, and the top surface of the sensing chip together form a closed space; a shielding layer is provided on the inner surface of the light-transmitting layer, and the shielding layer includes A plurality of shielding strips spaced apart from each other; wherein the area where two adjacent shielding strips are spaced apart from each other corresponds to a corner of the sensing chip, and each shielding strip is formed with at least one light-transmitting groove Hole; wherein the shielding layer is projected along the preset direction to a projection area formed by the top surface, which surrounds the outside of the sensing area; and A package formed on the substrate; wherein the sensing chip, the photocurable layer, the light-transmitting layer, and the shielding layer are all embedded in the package, and the light-transmitting layer At least part of the outer surface is exposed outside the package. The sensor packaging structure of claim 12, wherein each side of the sensing chip corresponds to and is parallel to one of the shielding strips, and at least 25% of the area of each of the shielding strips is formed with at least one The light-transmitting slot. The sensor packaging structure of claim 12, wherein in each of the shielding strips, at least one of the light-transmitting slots is separated from the inner edge of the photo-cured layer by a distance of 45 microns to 55 microns. , and at least one of the light-transmitting slots is separated from the outer edge of the photo-cured layer by a distance of 45 microns to 55 microns. The sensor packaging structure of claim 12, wherein in each of the shielding strips, the width of at least one of the light-transmitting slots is the distance between the inner edge and the outer edge of the photo-cured layer. 25%~100%. The sensor packaging structure of claim 12, wherein in each of the shielding strips, at least one of the light-transmitting slots is in the shape of a strip and penetrates along the length direction of the corresponding shielding strip. . The sensor packaging structure of claim 16, wherein in each of the shielding strips, the number of at least one light-transmitting slot is further limited to multiple and they are parallel to each other. The sensor packaging structure of claim 12, wherein in each of the shielding Among the strips, at least one of the light-transmitting slots is adjacent to an end of the corresponding shielding strip. The sensor packaging structure of claim 12, wherein in each of the shielding strips, the number of at least one of the light-transmitting slots is further limited to a plurality, each of which is in the shape of a strip, and each The light-transmitting slots are penetrating along the width direction corresponding to the shielding strip. The sensor packaging structure of claim 19, wherein each side of the sensing chip corresponds to and is perpendicular to at least two of the light-transmitting slots.

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