TWI827112B - Folded circuit board and preparation method thereof - Google Patents

Abstract

The present application provides a folded circuit board and a preparation method thereof. By setting bendable regions of unequal length, the folded circuit board adapts to the difference in the folding radius of each layer, and can make the stress evenly dispersed, thereby improving the problem of small static folding radius and easy breakage of the multi-layer circuit board, thereby improving the reliability of the folded circuit board. By setting the bendable regions of unequal length, it can not only ensure the reliability, but also make the thickness of the folded circuit board larger, which is suitable for thick boards. The present application improves the typesetting utilization rate of the product, improves the material utilization rate, and reduces the cost.

Description

Folding circuit board and preparation method thereof

The present application relates to a folding circuit board and its preparation method.

Flexible circuit boards (FPC) have many advantages that rigid printed circuit boards do not have. For example, they can be freely bent, rolled, and folded, can be arranged arbitrarily according to the spatial layout, and can be moved and stretched in three-dimensional space to realize component assembly and wiring. Integrated connectivity. The use of flexible circuit boards can greatly reduce the size of electronic products, which is suitable for the development needs of high density, miniaturization and high reliability of electronic products. Therefore, flexible circuit boards have been widely used in electronic products such as portable devices (such as mobile phones), computers, PADs, and digital cameras.

In order to meet the needs of the rapid development of electronic products, foldable flexible circuit boards with a certain thickness (with multi-layer structure) and complex shapes have emerged. However, the existing technology is relatively wasteful in terms of typesetting utilization, easily leads to a waste of materials, increases corporate costs, and also affects the shipping speed of finished products, and the folded flexible circuit boards are easily broken.

In view of this, the present application proposes a method for preparing a folded circuit board, which can not only improve material utilization, reduce costs, but also make the folded circuit board less likely to break.

One embodiment of the present application provides a method for preparing a folded circuit board, which includes the following steps: stacking at least one first copper-clad board and at least one second copper-clad board on opposite sides of the first circuit substrate, wherein the first The circuit substrate includes a first bendable area and is connected to the first Two first connection areas at both ends of a bendable area, the first copper clad plate includes a second bendable area and two second connection areas connected to both ends of the second bendable area, the first The two copper-clad boards include a third bendable area and two third connection areas connected to both ends of the third bendable area. The position of the second bendable area and the position of the third bendable area are The positions correspond to the positions of the first bendable area; along the extension direction of the first circuit substrate, the length a of the second bendable area is greater than the length b of the first bendable area. , the length b of the first bendable area is greater than the length c of the third bendable area; the second bendable area and the third bendable area face the first circuit substrate The surfaces of the second connection area and the third connection area facing the first connection area are all provided with non-soluble adhesive; the first copper-clad plate and the first circuit are pressed together The substrate and the second copper-clad board are arranged to form a first protrusion by protruding the first bendable area toward the direction close to the first copper-clad board, and the second bendable area is convex toward the direction away from the first copper-clad board. A direction protrusion of a circuit substrate forms a second protruding portion, the second protruding portion and the first protruding portion are connected through the soluble glue, and the first protruding portion and the third bendable area are connected through the The soluble glue connection; forming a first circuit layer on the first copper clad board, forming a second circuit layer on the second copper clad board; removing the soluble glue; connecting the second bendable area and the The first bendable area and the third bendable area are bent into an arc shape to obtain the folded circuit board.

In one embodiment, 0<a-b<0.1mm, 0<b-c<0.1mm.

In one embodiment, along the extending direction, the length of the second protrusion is L, and L<0.1 mm.

In one embodiment, before removing the sol, the preparation method further includes the following steps: forming a first protective layer on the outside of the first circuit layer to obtain a second circuit substrate; A second protective layer is formed on the outside to obtain a third circuit substrate.

In one embodiment, before the step of "laminating at least one first copper-clad board and at least one second copper-clad board on opposite sides of the first circuit substrate," the preparation method further includes preparing the first circuit. The following steps of the substrate: setting a first conductive hole on a double-sided copper-clad plate, the double-sided copper-clad plate including a first base material layer and two first copper foil layers disposed on opposite surfaces of the first base material layer and A second copper foil layer, the first conductive hole electrically connects the first copper foil layer and the second copper foil layer; a first conductive layer is formed on the first copper foil layer, and the first conductive hole is electrically connected to the second copper foil layer. A second conductive layer is formed on the copper foil layer; two third protective layers are respectively provided on part of the surfaces of the first conductive layer and the second conductive layer to obtain the first circuit substrate.

In one embodiment, the first conductive hole is provided in the first connection area, and the two third protective layers are provided in the first bendable area. After pressing the first copper-clad board, the first circuit substrate and the second copper-clad board, the non-soluble adhesive located on the first copper-clad board and the second copper-clad board respectively covers two third protection layers. both ends of the layer.

In one embodiment, before the step of "forming a first circuit layer on the first copper-clad board and forming a second circuit layer on the second copper-clad board", the preparation method further includes: setting at least one second circuit layer. The conductive hole is used to electrically connect the first circuit substrate and the first copper-clad plate, and at least one third conductive hole is provided to electrically connect the first circuit substrate and the second copper-clad plate.

In one embodiment, the second conductive hole is provided in the second connection area and the first connection area to electrically connect the first circuit layer and the first conductive layer.

In one embodiment, the third conductive hole is provided in the third connection area and the first connection area to electrically connect the second circuit layer and the second conductive layer.

Another aspect of the present application also provides a folded circuit board prepared by the above preparation method. The folded circuit board includes a first circuit substrate and a circuit board provided on one side of the first circuit substrate. At least one second circuit substrate, at least one third circuit substrate provided on the other side of the first circuit substrate, and non-soluble glue.

The first circuit substrate includes a first bendable area and two first connection areas connected to both ends of the first bendable area. The first bendable area faces toward the end of the second circuit substrate. The direction is raised.

The second circuit substrate includes a second bendable area and two second connection areas connected to both ends of the second bendable area, and the second bendable area faces away from the first circuit substrate. The direction is convex, and the position of the second bendable area corresponds to the position of the first bendable area.

The third circuit substrate includes a third bendable area and two third connection areas connected to both ends of the third bendable area. The position of the third bendable area is consistent with the first bendable area. Corresponds to the location of the fold area. The length a of the second bendable area is greater than the length b of the first bendable area, and the length b of the first bendable area is greater than the length c of the third bendable area.

The non-soluble glue is sandwiched between the first connection area and the second connection area and between the first connection area and the third connection area, and exposes the first circuit substrate at the part of the surface of the first bendable area.

In one embodiment, the folded circuit board further includes a first protective layer, a second protective layer and two third protective layers. The first protective layer is provided on the side of the first circuit layer facing away from the first circuit substrate, and the second protective layer is provided on the side of the second circuit layer facing away from the first circuit substrate. The two third protective layers are respectively disposed on two surfaces of the first circuit substrate close to the second circuit substrate and the third circuit substrate, and the two third protective layers are located on the first circuit substrate. Bendable area.

This application adapts to the difference in folding radius of each layer by setting up bendable areas of unequal lengths, and can evenly disperse the stress, thus improving the problem of small static folding radius and easy breakage of multi-layer circuit boards, thereby improving the efficiency of folding circuit boards. reliability. By setting up bendable areas with unequal lengths, it is possible to ensure reliability, and can make the thickness of folding circuit boards larger, suitable for thick boards. This application improves the typesetting utilization rate of the product, improves the material utilization rate, and reduces the cost.

100: Folding circuit board

10: First circuit substrate

20: Second circuit substrate

30:Third circuit substrate

11:Double-sided copper clad laminate

111: First base material layer

112a: First copper foil layer

112b: Second copper foil layer

113:First blind hole

114: First conductive hole

115: Resist film

116: First conductive layer

117: Second conductive layer

118:The third layer of protection

101: First bendable area

102: First connection area

103:First protrusion

21: The first copper clad laminate

211: Second base material layer

212: First copper layer

213: First glue layer

214:Second blind hole

215: Second conductive hole

216: First line layer

217:First layer of protection

218:Contact pad

2181:Gold layer

201: Second bendable area

202:Second connection area

203:Second protrusion

31: Second copper clad plate

311: The third base material layer

312: Second copper layer

313: Second glue layer

314:Third blind hole

315: The third conductive hole

316: Second line layer

317:Second layer of protection

301: The third bendable area

302: The third connection area

2131,3131:Soluble

2132,3132: non-soluble gel

Figure 1 is a cross-sectional view of a double-sided copper-clad laminate provided by an embodiment of the present application.

FIG. 2 is a cross-sectional view after forming a first blind hole on the double-sided copper-clad board shown in FIG. 1 .

FIG. 3 is a cross-sectional view of the first blind hole shown in FIG. 2 after copper plating is performed to form a first conductive hole.

Figure 4 is a cross-sectional view after forming a layer of resist film on the outside of the structure shown in Figure 3, and then exposing, developing, etching, and removing the resist film to form a first conductive layer and a second conductive layer respectively.

FIG. 5 is a cross-sectional view after a first protective layer is respectively provided on part of the surface of the first conductive layer and the second conductive layer shown in FIG. 4 .

FIG. 6 is a cross-sectional view after a first copper-clad board and a second copper-clad board are respectively stacked on opposite sides of the first circuit substrate shown in FIG. 5 .

FIG. 7 is a cross-sectional view after laminating the first circuit substrate, the first copper-clad laminate and the second copper-clad laminate shown in FIG. 6 and making the first bendable area and the second bendable area convex.

FIG. 8 is a cross-sectional view of the structure shown in FIG. 7 after at least one second conductive hole and at least one third conductive hole are provided.

FIG. 9 is a cross-sectional view after forming a first circuit layer on the first copper-clad board shown in FIG. 8 and forming a second circuit layer on the second copper-clad board.

FIG. 10 is a cross-sectional view after forming a first protective layer on the first circuit layer shown in FIG. 9 and forming a second protective layer on the third circuit layer.

FIG. 11 is a cross-sectional view of the structure shown in FIG. 10 after removing the sol.

Fig. 12 is a cross-sectional view of the structure shown in Fig. 11 after being shaped by fold lines.

Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by a person skilled in the art to which the embodiments of the present application belong. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present application.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relationship between components in a specific posture (as shown in the drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

It will be understood that when a layer is referred to as being "on" another layer, it can be directly on the other layer or intervening layers may be present between. In contrast, when one layer is referred to as being "directly on" another layer, there are no intervening layers present.

In addition, descriptions such as "first", "second", etc. in this application are for descriptive purposes only and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Thus, features defined by "first" and "second" may explicitly or implicitly include at least one of these features. In the description of this application, "plural" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

Embodiments of the present application are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate configurations) of the present application. Thus, variations in the shapes of the illustrations due to manufacturing processes and/or tolerances are to be expected. Thus, embodiments of the present application should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. The regions shown in the figures are themselves merely schematic and their shapes are not intended to illustrate the actual shape of the device and are not intended to limit the scope of the present application.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

Please refer to FIGS. 1 to 12 . An embodiment of the present application provides a method for preparing a folded circuit board 100 . A method for preparing a circuit substrate 10.

As shown in FIG. 1 , a double-sided copper clad laminate 11 is provided, which includes a first base material layer 111 and a first copper foil layer 112 a and a second copper foil layer 112 b disposed on opposite surfaces of the first base material layer 111 .

The material of the first base material layer 111 includes, but is not limited to, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate two formic acid glycol ester, PEN), liquid crystal polymer (LCP) and modified polyimide (MPI). In this embodiment, the first base material layer 111 is made of PI.

As shown in FIG. 2 , the first blind hole 113 can be formed on the double-sided copper-clad board 11 by, but is not limited to, mechanical drilling, laser, etc. The first blind hole 113 penetrates the first copper foil layer 112a and the first base material layer 111, and a portion of the surface of the second copper foil layer 112b close to the first base material layer 111 is exposed through the first blind hole 113. The number of the first blind holes 113 may be one or more. In this embodiment, the number of the first blind holes 113 is two.

As shown in FIG. 3 , conductive material is filled or plated in the first blind hole 113 to form a first conductive hole 114 . In this embodiment, the first conductive hole 114 is formed by plating copper in the first blind hole 113 . The first conductive hole 114 electrically connects the first copper foil layer 112a and the second copper foil layer 112b.

As shown in FIG. 4 , circuit fabrication is performed on the first copper foil layer 112 a and the second copper foil layer 112 b to form a first conductive layer 116 and a second conductive layer 117 .

Specifically, a layer of resist film 115 is formed on the outside of the first copper foil layer 112a and the second copper foil layer 112b respectively (for example, the resist film 115 is pressed onto the first copper foil layer 112a and the second copper foil layer 112b. outside), and then perform exposure, development, etching, and removal of the resist film 115 to form first conductive layers respectively. 116 and the second conductive layer 117. The steps of lamination, exposure, development, etching, film removal, etc. are common technical means in this field and will not be described in detail here.

As shown in FIG. 5 , a third protective layer 118 is respectively provided on part of the surface of the first conductive layer 116 and the second conductive layer 117 to obtain the first circuit substrate 10 . Along the extending direction of the first circuit substrate 10 , the third protective layer 118 is located approximately in the middle area. In this embodiment, the third protective layer 118 is a cover-lay (CVL). In other embodiments, the third protective layer 118 may also be a solder mask layer. The third protective layer 118 is used to protect the first conductive layer 116 and the second conductive layer 117 from being invaded by external water vapor or scratched by foreign objects.

Along the extending direction of the first circuit substrate 10 , the first circuit substrate 10 can be divided into a first bendable area 101 and two first connection areas 102 connected to the first bendable area 101 . The first bendable area 101 is located approximately in the middle of the first circuit substrate 10 , and the two first connection areas 102 are respectively located at both ends of the first bendable area 101 . In this embodiment, the third protective layer 118 is provided in the first bendable area 101 and partially extends to the first connection area 102 . Further, the first conductive hole 114 is provided in the first connection area 102 .

In step S10 , please refer to FIG. 6 , at least one first copper-clad plate 21 and at least one second copper-clad plate 31 are respectively stacked on opposite sides of the first circuit substrate 10 . In this embodiment, the number of the first copper clad laminate 21 and the second copper clad laminate 31 is one. In other embodiments, the number of the first copper clad laminate 21 and the second copper clad laminate 31 can be multiple. In this embodiment, the first copper-clad plate 21 is located on the upper side of the first circuit substrate 10 , and the second copper-clad plate 31 is located on the lower side of the first circuit substrate 10 .

The first copper-clad laminate 21 includes a second base material layer 211, a first copper layer 212 provided on one side of the second base material layer 211, and a first adhesive layer 213 provided on the other side of the second base material layer 211. The first glue layer 213 is disposed close to the first circuit substrate 10 . Along the extending direction of the first copper clad plate 21 , the first copper clad plate 21 includes a second bendable area 201 and two second connection areas 202 connected to the second bendable area 201 . The second bendable area 201 is located approximately in the middle of the first copper clad plate 21, and the two second bendable areas 201 are The connection areas 202 are respectively located at both ends of the second bendable area 201. The position of the second bendable area 201 corresponds to the position of the first bendable area 101. Specifically, the orthographic projection of the first bendable area 101 on the first copper clad plate 21 Located in the second bendable area 201. The material of the first glue layer 213 includes soluble glue 2131 and non-soluble glue 2132. The soluble glue 2131 is generally disposed in the second bendable area 201 of the first copper clad plate 21, and the non-soluble glue 2132 is generally disposed in the second bendable area 201 of the first copper clad plate 21. Connection area 202. The soluble glue 2131 can be removed under the action of a remover, and the material of the non-soluble glue 2132 can be, but is not limited to, epoxy resin or acrylic glue. In this embodiment, the sol 2131 is a hydrolyzable UV protective ink. For example, it is composed of modified silicone acrylic resin, epoxy resin, isobornyl acrylate trihydroxymethane chlorinated rubber grass green pigment silicon coupling agent defoaming agent, leveling agent, polymerization inhibitor, calcium carbonate, etc. It can be quickly cured in a short time, has no residue and is easy to peel off. The remover is, for example, a peeling liquid containing NaOH as a main component.

The second copper-clad laminate 31 includes a third base material layer 311, a second copper layer 312 provided on one side of the third base material layer 311, and a second adhesive layer 313 provided on the other side of the third base material layer 311. The second glue layer 313 is disposed close to the first circuit substrate 10 . Along the extending direction of the second copper clad plate 31 , the second copper clad plate 31 includes a third bendable area 301 and two third connection areas 302 connected to the third bendable area 301 . The third bendable area 301 is located approximately in the middle of the second copper clad plate 31 , and the two third connection areas 302 are respectively located at both ends of the third bendable area 301 . The position of the third bendable area 301 corresponds to the position of the first bendable area 101. Specifically, the orthographic projection of the third bendable area 301 on the first circuit substrate 10 It is located in the first bendable area 101, that is, it is located in the second bendable area 201. The material of the second glue layer 313 includes soluble glue 3131 and non-soluble glue 3132. The soluble glue 3131 is generally disposed in the third bendable area 301 of the second copper-clad plate 31, and the non-soluble glue 3132 is generally disposed in the third bendable area 301 of the second copper-clad plate 31. Connection area 302. The soluble glue 3131 can be removed under the action of a remover, and the material of the non-soluble glue 2132 can be, but is not limited to, epoxy resin or acrylic glue. In this embodiment, the sol 3131 is a hydrolyzable UV protective ink. For example, it is made of modified silicone acrylic resin, epoxy resin, isobornylpropyl It is composed of acrylate trimethylol, chlorinated rubber, grass green pigment, silicon coupling agent, defoaming agent, leveling agent, polymerization inhibitor, calcium carbonate, etc. It can be quickly cured in a short time, has no residue and is easy to peel off. The remover is, for example, a peeling liquid containing NaOH as a main component.

The materials of the second base material layer 211 and the third base material layer 311 include but are not limited to PI, PET, PEN, LCP and MPI. The materials can be the same or different. In this embodiment, the materials of the second base material layer 211 and the third base material layer 311 are both PI.

As shown in Figure 6, along the extension direction, the length of the second bendable area 201 is a, the length of the first bendable area 101 is b, and the length of the third bendable area 301 is c, where a> b>c.

It can be understood that the length of each bendable area gradually increases from the inside to the outside according to the static folding position. In this embodiment, when the bendable area is bent to form an arc (see Figure 12), the third bendable area 301, the first bendable area 101 and the second bendable area 201 are arranged from the inside to the outside. Arranged in order, the second bendable area 201 located at the outermost side has the longest length, the first bendable area 101 has the second longest length, and the third bendable area 301 located at the innermost side has the smallest length. The arc radius formed by the second bendable area 201, the arc radius formed by the first bendable area 101, and the arc radius formed by the third bendable area 301 decrease in sequence from outside to inside. The lengths of the area 201, the first bendable area 101 and the third bendable area 301 are also set to decrease sequentially from the outside to the inside, which adapts to the difference in folding radius of each layer and can evenly disperse the stress, thus improving the multi-layer circuit board. The static folding radius is small and easy to break, which further improves the reliability of folding circuit boards.

Further, in some embodiments, 0<a-b<0.1mm, 0<b-c<0.1mm. The lengths of the third bendable area 301, the first bendable area 101 and the second bendable area 201 gradually increase from the inside to the outside according to the folding position. The value or proportion of the increase can be combined with the folding radius and the actual plate thickness. Make adjustments.

Step S20 , please refer to FIG. 7 , press the first copper clad plate 21 , the first circuit substrate 10 and the second copper clad plate 31 , and make the second bendable area 201 face away from the first circuit substrate 10 The second protrusion 203 is formed by protruding, and the first bendable area 101 is protruded toward the direction close to the first copper clad plate 21 to form the first protrusion 103, so that the non-soluble glue 2132 located on the first copper clad plate 21 Coverage is first Both ends of the third protective layer 118 on the conductive layer 116 , and the non-soluble glue 3132 on the second copper clad plate 31 covers both ends of the third protective layer 118 on the second conductive layer 117 . The second protruding part 203 and the first protruding part 103 are connected by a soluble glue 2131 , and the first protruding part 103 and the third bendable area 301 are connected by a soluble glue 3131 . The soluble glue 2131 fills the gap between the second protruding part 203 and the first protruding part 103 for fixing, and the sol 3131 fills the gap between the first protruding part 103 and the third bendable area 301 for fixing. The positions among the first copper-clad board 21, the first circuit substrate 10 and the second copper-clad board 31 are relatively fixed. Remove the soluble colloids 2131 and 3131 before molding, which can improve the problem of process water accumulation during the production process.

As shown in FIG. 7 , along the extending direction, the linear length of the second protruding portion 203 is L. In some embodiments, L<0.1mm.

Step S30, please refer to FIG. 8. At least one second blind hole 214 is formed on the first copper clad plate 21 and the first circuit substrate 10 by mechanical drilling, laser, etc. At least one third blind hole 314 is formed on the second blind hole 214 and the third blind hole 314 is copper-plated respectively to form the second conductive hole 215 and the third conductive hole 315 . The second conductive hole 215 is electrically connected to the first conductive layer 116 of the first circuit substrate 10 and the first copper-clad plate 21 , and the third conductive hole 315 is electrically connected to the second conductive layer 117 of the first circuit substrate 10 The second copper clad laminate 31.

The second blind hole 214 penetrates the first copper clad plate 21 and partially exposes the first conductive layer 116 . The second blind hole 214 is provided in the second connection area 202 . The third blind hole 314 penetrates the second copper-clad plate 31 and partially exposes the second conductive layer 117 . The third blind hole 314 is provided in the third connection area 302 .

In step S40, please refer to FIG. 9. The first copper layer 212 is formed into a first circuit layer 216 through an image transfer process or the like, and the second copper layer 312 is formed into a second circuit layer 316.

Step S50, please refer to Figure 10, forming a first protective layer 217 on the outside of the first circuit layer 216 to obtain the second circuit substrate 20; forming a second protective layer 317 on the outside of the second circuit layer 316, The third circuit board 30 is obtained. The first protective layer 217 is used to protect the first circuit layer 216, and the second protective layer 317 is used to protect the second circuit layer 316 from being invaded by external water vapor or scratched by foreign objects. In this embodiment, the first circuit layer 216 and the second protective layer 317 are both a cover-lay (CVL). In other embodiments, they may also be solder resist layers. In this embodiment, part of the first circuit layer 216 is not covered by the first protective layer 217 and is exposed to form contact pads 218 . The contact pads 218 are used for electrical connection with external components. A gold nitride layer 2181 is also formed on the contact pad 218 .

In step S60 , please refer to FIG. 11 , the sols 2131 and 3131 can be removed by applying a removing agent (such as a stripping liquid containing NaOH as the main component).

As shown in FIG. 11 , the distance between the highest point of the second circuit substrate 20 (that is, the highest point after the second protrusion 203 covers the first protective layer 217 ) and the unprotruded horizontal first protective layer 217 for H. In some embodiments, H<0.08mm.

Step S70, please refer to Figure 12, folding line shaping: bend the second bendable area 201, the first bendable area 101 and the third bendable area 301 into an arc shape. At this time, the second circuit substrate The two second connection areas 202 of the circuit board 20 are generally parallel to each other, the two first connection areas 102 of the first circuit substrate 10 are generally parallel to each other, and the two third connection areas 302 of the third circuit substrate 30 are generally parallel to each other. , to obtain the folded circuit board 100.

As shown in Figure 12, one embodiment of the present application provides a foldable circuit board 100, which includes a first circuit substrate 10, at least one second circuit substrate 20 provided on one side of the first circuit substrate 10, and At least one third circuit substrate 30 on the other side of the first circuit substrate 10. In this embodiment, the number of the second circuit substrate 20 and the third circuit substrate 30 is one.

The first circuit substrate 10 includes a first base material layer 111 and a first conductive layer 116 and a second conductive layer 117 respectively provided on both sides of the first base material layer 111 . The first circuit substrate 10 is also provided with a first conductive hole 114 to electrically connect the first conductive layer 116 and the second conductive layer 117 . The first circuit substrate 10 includes a first bendable area 101 , and the first bendable area 101 is oriented close to the second circuit. The direction of the substrate 20 is convex and forms an arc shape, and the first conductive hole 114 is provided outside the first bendable area 101 .

The second circuit substrate 20 includes a second base material layer 211 and a first circuit layer 216 provided on one side of the second base material layer 211. The first circuit layer 216 is located away from the first circuit substrate 10. . The second circuit substrate 20 is also provided with a second conductive hole 215 to electrically connect the first circuit layer 216 and the first conductive layer 116 . The second circuit substrate 20 includes a second bendable area 201 . The second bendable area 201 is convex and forms an arc toward a direction away from the first circuit substrate 10 . The second bendable area 201 is curved. The position of 201 corresponds to the position of the first bendable area 101 . The second conductive hole 215 is disposed outside the second bendable area 201 .

The third circuit substrate 30 includes a third base material layer 311 and a second circuit layer 316 disposed on one side of the third base material layer 311 . The second circuit layer 316 is disposed away from the first circuit substrate 10 . The third circuit substrate 30 is also provided with a third conductive hole 315 to electrically connect the second circuit layer 316 and the second conductive layer 117 . The third circuit substrate includes a third bendable area 301. The position of the third bendable area 301 corresponds to the position of the first bendable area 101. The third conductive hole 315 is disposed in Outside the third bendable area 301.

Further, as shown in FIG. 12 , the first circuit substrate 10 further includes two first connection areas 102 connected to the first bendable area 101 . The two first connection areas 102 are respectively located at both ends of the first bendable area 101. The first conductive holes 114 are provided in the first connection areas 102. The two first connection areas 102 are approximately mutually connected. parallel. Partial surfaces of the first conductive layer 116 and the second conductive layer 117 are respectively provided with a third protective layer 118. The third protective layer 118 is provided in the first bendable area 101 and partially extends to The first connection area 102 is described. The second circuit substrate 20 also includes two second connection areas 202 connected to the second bendable area 201. The two second connection areas 202 are respectively located at the sides of the second bendable area 201. At both ends, the two second connection areas 202 are generally parallel to each other. A first glue layer 213 is provided on one side of the first circuit layer 216 close to the first circuit substrate 10 , and on the other side away from the first circuit substrate 10 A first protective layer 217 is provided. The third circuit substrate 30 further includes two third connection areas 302 connected to the third bendable area 301, and the two third connection areas 302 are respectively located on the third bendable area 301. At both ends, the two third connection areas 302 are generally parallel to each other. A second glue layer 313 is provided on one side of the second circuit layer 316 close to the first circuit substrate 10 , and a second protective layer 317 is provided on the other side away from the first circuit substrate 10 . The first glue layer 213 includes non-soluble glue 2132 , and the second glue layer 313 includes non-soluble glue 3132 . The non-soluble glue 2132 is sandwiched between the first connection area 102 and the second connection area 202 , and the non-soluble glue 3132 is sandwiched between the first connection area 102 and the third connection area 302, and expose part of the surface of the first circuit substrate 10 located in the first bendable area 101.

This application adapts to the difference in folding radius of each layer by setting up bendable areas of unequal lengths, and can evenly disperse the stress, thus improving the problem of small static folding radius and easy breakage of multi-layer circuit boards, thereby improving the efficiency of folding circuit boards. reliability. By setting up bendable areas with unequal lengths, reliability can be ensured and the thickness of the foldable circuit board can be increased, making it suitable for thick boards. This application improves the typesetting utilization rate of the product, improves the material utilization rate, and reduces the cost.

The above descriptions are some specific embodiments of the present application, but the actual application process cannot be limited to these embodiments. For those of ordinary skill in the art, other deformations and changes made based on the technical concept of the present application should fall within the protection scope of the present application.

100: Folding circuit board

10: First circuit substrate

20: Second circuit substrate

30:Third circuit substrate

111: First base material layer

114: First conductive hole

116: First conductive layer

117: Second conductive layer

101: First bendable area

102: First connection area

211: Second base material layer

213: First glue layer

215: Second conductive hole

216: First line layer

217:First layer of protection

201: Second bendable area

202: Second connection area

311: The third base material layer

313: Second glue layer

315: The third conductive hole

316: Second line layer

317:Second layer of protection

301: The third bendable area

302: The third connection area

Claims (10)

A method for preparing a folded circuit board, including the following steps: stacking at least one first copper-clad board and at least one second copper-clad board on opposite sides of the first circuit substrate, wherein the first circuit substrate includes a first A bending area and two first connecting areas connected to both ends of the first bending area. The first copper-clad plate includes a second bending area and two first connecting areas connected to both ends of the second bending area. A second connection area, the second copper clad plate includes a third bendable area and two third connection areas connected to both ends of the third bendable area, the position of the second bendable area and The positions of the third bendable areas correspond to the positions of the first bendable areas; along the extension direction of the first circuit substrate, the length a of the second bendable area is greater than the length a of the first bendable area. The length b of the first bendable zone is greater than the length c of the third bendable zone; the second bendable zone and the third bendable zone The surface of the area facing the first circuit substrate is provided with soluble glue, and the surfaces of the second connection area and the third connection area facing the first connection area are provided with non-solubil; the first copper-clad board, the first circuit substrate and the second copper-clad board, and the first bendable area is raised toward a direction close to the first copper-clad board to form a first protrusion; The second bendable area protrudes toward a direction away from the first circuit substrate to form a second protruding portion. The second protruding portion and the first protruding portion are connected through the soluble glue. The first protruding portion Connected to the third bendable area through the soluble glue; forming a first circuit layer on the first copper-clad board, forming a second circuit layer on the second copper-clad board; removing the soluble glue; The second bendable area, the first bendable area and the third bendable area are bent into an arc shape to obtain the folded circuit board. The method for preparing a folded circuit board as described in claim 1, wherein 0<a-b<0.1mm, 0<b-c<0.1mm. The method for manufacturing a folded circuit board according to claim 1, wherein the length of the second protrusion along the extending direction is L, and L<0.1 mm. The preparation method of a folded circuit board according to claim 1, wherein before removing the soluble glue, the preparation method further includes the following steps: forming a first protective layer on the outside of the first circuit layer to obtain a third Two circuit substrates; forming a second protective layer on the outside of the second circuit layer to obtain a third circuit substrate. The method for preparing a folded circuit board according to claim 1, wherein before the step of "stacking at least one first copper-clad laminate and at least one second copper-clad laminate on opposite sides of the first circuit substrate", The preparation method also includes the following step of preparing the first circuit substrate: setting a first conductive hole on a double-sided copper-clad plate, the double-sided copper-clad plate including a first base material layer and a first conductive hole disposed on the first base material. The first copper foil layer and the second copper foil layer are on opposite surfaces of the layer, and the first conductive hole is electrically connected to the first copper foil layer and the second copper foil layer; on the first copper foil layer A first conductive layer is formed, and a second conductive layer is formed on the second copper foil layer; two third protective layers are respectively provided on part of the surfaces of the first conductive layer and the second conductive layer to obtain the The first circuit substrate. The method for manufacturing a folded circuit board according to claim 5, wherein the first conductive hole is provided in the first connection area, and the two third protective layers are provided in the first bendable area; After pressing the first copper-clad board, the first circuit substrate and the second copper-clad board, the non-soluble adhesive located on the first copper-clad board and the second copper-clad board respectively covers two third protection layers. both ends of the layer. The method for preparing a folded circuit board according to claim 6, wherein before the step of "forming a first circuit layer on the first copper-clad board and forming a second circuit layer on the second copper-clad board", the The preparation method also includes: setting at least one second conductive hole to electrically connect the first circuit substrate and the first copper-clad board, at least one third conductive hole is provided to electrically connect the first circuit substrate and the second copper-clad board. The method for manufacturing a folded circuit board according to claim 7, wherein the second conductive hole is provided in the second connection area and the first connection area to electrically connect the first circuit layer and the a first conductive layer; the third conductive hole is provided in the third connection area and the first connection area to electrically connect the second circuit layer and the second conductive layer. A foldable circuit board, which includes a first circuit substrate, at least one second circuit substrate provided on one side of the first circuit substrate, and at least one second circuit substrate provided on the other side of the first circuit substrate. A third circuit substrate and a non-soluble glue, wherein the first circuit substrate includes a first bendable area and two first connection areas connected to both ends of the first bendable area, the first bendable area The folding area protrudes toward the direction close to the second circuit substrate; the second circuit substrate includes a second bendable area and two second connection areas connected to both ends of the second bendable area, the The second bendable area protrudes in a direction away from the first circuit substrate, and the position of the second bendable area corresponds to the position of the first bendable area; the third circuit substrate includes A third bendable area and two third connecting areas connected to both ends of the third bendable area, the position of the third bendable area corresponding to the position of the first bendable area, The length a of the second bendable area is greater than the length b of the first bendable area, and the length b of the first bendable area is greater than the length c of the third bendable area; The non-soluble glue is sandwiched between the first connection area and the second connection area and between the first connection area and the third connection area, and the first circuit substrate is exposed on the third connection area. A portion of the surface of a bendable area. The foldable circuit board according to claim 9, wherein the foldable circuit board further includes a first protective layer, a second protective layer and two third protective layers, the first protective layer being disposed on the second circuit The side of the substrate facing away from the first circuit substrate, the second protective layer is disposed on the third circuit substrate The side of the board facing away from the first circuit substrate, the two third protective layers are disposed on both surfaces of the first circuit substrate close to the second circuit substrate and the third circuit substrate, and the Two third protective layers are located in the first bendable area.

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