TWI825463B - Package substrate - Google Patents

Abstract

A package substrate integrates a first antenna structure and a second antenna structure on an insulator, and the form of the first antenna structure is different from the form of the second antenna structure, so that the package substrate can be transmit / receive different antenna signals, so that electronic products using the package substrate can transmit / receive the signals of the required frequency and improve the antenna function of the electronic products.

Description

Package substrate

The present invention relates to a semiconductor packaging substrate, in particular to a packaging substrate with an antenna structure.

At present, wireless communication technology has been widely used in various consumer electronic products (such as mobile phones, tablet computers, etc.) to facilitate the reception or transmission of various wireless signals. In addition, in order to meet the convenience of portability and Internet access of consumer electronic products, the manufacturing and design of wireless communication modules are developed towards the needs of being light, thin, short and small. Among them, the planar antenna (Patch Antenna) has the characteristics of small size, Due to their light weight and ease of manufacturing, they are widely used in wireless communication modules of electronic products.

At present, 5G related application technologies will be fully commercialized in the future. Its application frequency range is about high-frequency bands between 1GHz and 1000GHz. Its commercial application model is 5G paired with 4G LTE, and a cellular base station is set up outdoors to coordinate with the equipment. In indoor small base stations, 5G mobile communications will use a large number of antennas in the base stations to meet the large-capacity, fast transmission and low-latency requirements of the 5G system.

Figure 1 is a three-dimensional schematic diagram of a conventional wireless communication module. As shown in FIG. 1 , the wireless communication module 1 includes: a packaging substrate 10 , a plurality of electronic components 11 provided on the packaging substrate 10 , an antenna structure 12 and a packaging material 13 . The electronic component 11 is disposed on the packaging substrate 10 and is electrically connected to the packaging substrate 10; the antenna structure 12 is planar and has an antenna body 120 and a wire 121. 120 is electrically connected to the electronic component 11 through the wire 121; the packaging material 13 covers the electronic component 11 and part of the wire 121.

On the other hand, in the 5G system, its frequency bands can be divided into 3.5Ghz~6Ghz, 28Ghz, 39Ghz, 60Ghz, 71Ghz~73Ghz, etc., and due to signal quality and transmission speed requirements, more antenna configurations are needed to improve signal quality. and transmission speed.

However, in the conventional wireless communication module 1, the packaging substrate 10 can only be configured with a single antenna structure 12, thus limiting the antenna function of the wireless communication module 1, causing the wireless communication module 1 to be unable to provide the necessary functions to operate the 5G system. The electrical function is difficult to meet the antenna operation requirements of the 5G system.

Therefore, how to overcome the above-mentioned problems of the conventional technology has become an urgent issue to be solved.

In view of the shortcomings of the above-mentioned conventional technologies, the present invention provides a packaging substrate, which includes: an insulator; a first antenna structure combined with the insulator; and a second antenna structure combined with the insulator, wherein the first antenna structure is combined with the insulator. The form of the antenna structure is different from the form of the second antenna structure.

In the aforementioned packaging substrate, the first antenna structure is in the form of a dipole antenna.

In the aforementioned packaging substrate, the first antenna structure includes a conductive pillar embedded in the insulator and an antenna body formed on the surface of the insulator and connected to the conductive pillar. For example, the antenna itself is a meandering antenna.

In the aforementioned packaging substrate, the second antenna structure is in the form of a patch antenna.

In the aforementioned packaging substrate, the second antenna structure includes a plurality of sets of first and second sheets that are separated from each other and arranged correspondingly. For example, the first chip body and the second chip system adopt an array arrangement. Set. For example, the second antenna structure includes at least four groups of first pieces and second pieces for matching at least one group of first antenna structures.

The aforementioned packaging substrate further includes a power distribution portion electrically connecting the first antenna structure and the second antenna structure. The power distribution part is formed on the surface of the insulator, and has a main line and a plurality of branch lines connected to the main line, so that the branch lines are connected to the second antenna structure, and the main line is connected to the first antenna structure. .

In the aforementioned packaging substrate, the resonant wavelength of the first antenna structure is 1/2 of the wavelength of the signal it receives, and the resonant wavelength of the second antenna structure is 1/2 of the wavelength of the signal it receives.

In the aforementioned packaging substrate, the first antenna structure includes a first antenna part and a second antenna part, and the first antenna part includes a first conductive pillar embedded in the insulator. The conductive pillar connects the opposite sides of the insulator, so that one end of the first conductive pillar serves as a signal feed point, and the other end of the first conductive pillar serves as the emission source; the second antenna part includes a A second conductive pillar embedded in the insulator, the second conductive pillar connects the opposite sides of the insulator, so that one end side of the second conductive pillar is connected to the ground layer provided in the insulator, and the second conductive pillar The other end side of the conductive pillar is exposed to the insulator; the first antenna part further includes a first antenna body connected to the first conductive pillar, which is horizontal from the end side of the first conductive pillar exposed to the insulating layer. Extended and arranged on the surface of the insulating layer, the second antenna part further includes a second antenna body connected to the second conductive pillar, which extends horizontally from the end side of the second conductive pillar exposed to the insulating layer. and arranged on the surface of the insulating layer.

It can be seen from the above that in the packaging substrate of the present invention, the first antenna structure and the second antenna structure are mainly integrated into the insulator, so that the packaging substrate can send/receive different antenna signals according to the needs, so as to facilitate the application. The electronic product of the package substrate transmits the signal of the required frequency. Therefore, compared with the conventional technology, the package substrate is configured with multiple sets of antenna structures, thereby improving the antenna function of the electronic product and enabling the electronic product to operate 5G The electrical functions required by the system are required to meet the antenna operation requirements of the 5G system.

1: Wireless communication module

10:Packaging substrate

11: Electronic components

12: Antenna structure

120: Antenna body

121:Wire

13:Packaging material

2:Packaging substrate

2a: First antenna structure

2b: Second antenna structure

2c: Insulator

20:Base

20a: First surface

20b: Second surface

21:Insulation layer

21a: Surface

22a: First antenna part

22b: Second antenna part

220: First conductive pillar

220a, 220b: end side

221:The first antenna body

222:Second antenna body

224: Second conductive pillar

224a, 224b: end side

23: Ground layer

24a: First antenna layer

24b: Second antenna layer

241:First piece of body

242:Second body

25:Power distribution department

250: Main line

251:Branch line

A:Opening area

d:Thickness

h: height

L: Imaginary straight line

t:interval

Figure 1 is a three-dimensional schematic diagram of a conventional wireless communication module.

Figure 2 is a schematic cross-sectional view of the packaging substrate of the present invention.

Figure 2-1 is a schematic diagram of the lower plane of Figure 2.

Figure 3 is a schematic three-dimensional view of the packaging substrate of the present invention.

The following describes the implementation of the present invention through specific embodiments. Those familiar with the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to coordinate with the content disclosed in the specification for the understanding and reading of those familiar with the art, and are not used to limit the implementation of the present invention. Therefore, it has no technical substantive significance. Any structural modifications, changes in proportions, or adjustments in size shall still fall within the scope of this invention without affecting the effects that can be produced and the purposes that can be achieved. The technical content disclosed by the invention must be within the scope that can be covered. At the same time, terms such as "above", "first", "second" and "a" cited in this specification are only for convenience of description and are not used to limit the scope of the present invention. Changes or adjustments in their relative relationships, provided there is no substantial change in the technical content, shall also be deemed to be within the scope of the present invention.

Figures 2 and 3 are schematic diagrams of the packaging substrate 2 of the present invention. As shown in Figures 2 and 3, the packaging substrate 2 includes: an insulator 2c, a first antenna structure 2a and a second antenna structure 2b combined with the insulator 2c.

The insulator 2c includes a base 20 and at least one insulating layer 21 disposed on the base 20, and the base 20 has opposite first surfaces 20a and second surfaces 20b, so that the insulating layer 21 is formed on on the first surface 20a of the base 20.

In this embodiment, the base 20 includes dielectric material, polyimide (PI), dry film, epoxy or molding compound, etc., but Not limited to the above.

Furthermore, the insulating layer 21 includes, but is not limited to, dielectric material, polyimide (PI), dry film, epoxy or molding compound. above. It should be understood that the base 20 and the insulating layer 21 can be made of the same material or different materials as required.

The first antenna structure 2a is in the form of a dipole antenna, its applicable frequency range is Sub-6G or millimeter wave (mmWave), and the first antenna structure 2a includes a first antenna portion 22a and the second antenna part 22b.

The first antenna part 22a includes a first conductive post 220 embedded in the insulator 2c, which extends from one side of the insulator 2c to the other side, so that the first conductive post 220 communicates with the insulator 2c. The opposite sides of the insulator 2c are such that one end side 220a of the first conductive pillar 220 is located in the base 20 to serve as a signal feed point, and the other end side 220b of the first conductive pillar 220 is exposed to the insulator. 2c, for use as emission source.

In this embodiment, the first conductive pillar 220 connects the first surface 20a and the second surface 20b of the base 20 with one end side 220a, and the first conductive pillar 220 passes through the insulating layer 21, so that the first conductive pillar 220 passes through the insulating layer 21. The other end side 220 b of the first conductive pillar 220 is exposed on the surface 21 a of the insulating layer 21 . For example, a ground layer 23 is disposed on the first surface 20a of the base 20, which can be formed by coating a metal layer (such as copper), such as sputtering, vaporing, The ground layer 23 is formed by electroplating or electroless plating, or by lamination or foiling (such as a mesh or metal foil of any pattern), and the ground layer 23 is formed with an opening area A. This allows the first conductive pillar 220 to pass through the opening area A without contacting the ground layer 23, so that the first conductive pillar 220 is exposed on the end side 220a of the second surface 20b of the base 20 as a signal feed point.

Furthermore, the first antenna part 22a further includes a first antenna body 221 connected to the first conductive post 220, which extends horizontally from the end side 220b of the first conductive post 220 exposed to the insulating layer 23 and is arranged. On the surface 21a of the insulating layer 21, the wavelength (or frequency) of the signal emitted by the first antenna part 22a is changed by adjusting the length of the first antenna body 221, that is, the first antenna body There is a proportional relationship between the length of 221 and the radiation wavelength, and the resonant wavelength of the first antenna part 22a is 1/2 of the wavelength of the received signal, so as to increase the antenna gain (Gain) and improve the signal reception capability.

In addition, the height h of the first conductive pillar 220 can be adjusted according to the thickness d of the insulating layer 21 (or the thickness of the insulator 2c) to change the impedance value of the first conductive pillar 220.

In addition, the first antenna part 22a can be formed by laying a metal layer (such as copper material), such as sputtering, vaporing, electroplating or chemical plating; or by pressing or The first antenna portion 22a is formed by a mounting method such as a frame.

The second antenna part 22b includes a second conductive post 224 embedded in the insulator 2c, which extends from one side of the insulator 2c to the other side, so that the second conductive post 224 communicates with the insulator 2c. The opposite sides of the insulator 2c are such that one end side 224a of the second conductive pillar 224 is connected to the ground layer 23, and the other end side 224b of the second conductive pillar 224 is exposed to the insulator 2c.

In this embodiment, the second conductive pillar 224 is arranged parallel to the first conductive pillar 220, so that the first antenna part 22a and the second antenna part 22b are arranged symmetrically with each other, and the first antenna part 22a They are electrically matched with the second antenna portion 22b. For example, the second antenna part 22b is used for grounding, and the first antenna part 22a and the second antenna part 22b form a dipole antenna.

Furthermore, the second antenna part 22b further includes a second antenna body 222 connected to the second conductive pillar 224, which extends horizontally from the end side 224b of the second conductive pillar 224 exposed to the insulating layer 21 and is arranged. On the surface 21a of the insulating layer 21, the length of the second antenna body 222 is adjusted to match the first antenna body 221, so that the first antenna part 22a can conform to the waveform of the signal that needs to be emitted. For example, the second The antenna body 222 and the first antenna body 221 are separated from each other to maintain a distance t, and they are aligned with each other and arranged on an imaginary straight line L, as shown in FIG. 3 .

In addition, the ground layers 23 can be selected to cover the vertical projection range of the first surface 20a area of the base 20, as shown in Figure 2, so that its vertical projection range is larger than the vertical projection range of the first antenna portion 22a. The projection range and/or the vertical projection range of the second antenna portion 22b. For example, the first antenna part 22 a and/or the second antenna part 22 b are located within the vertical projection range of the ground layer 23 .

In addition, the second antenna portion 22b can be formed by laying a metal layer (such as copper material), such as sputtering, vaporizing, electroplating or chemical plating; or by pressing or The second antenna portion 22b is formed by a mounting method such as a frame.

It should be understood that the base 20 and/or the insulating layer 21 can use a patterning (such as electroplating metal or etching metal) wiring process, such as a redistribution layer (RDL) process, to form a circuit layer as required. (Figure omitted), in order to form the substrate specifications for carrying the semiconductor chip (Figure omitted), and simultaneously fabricate the first antenna part 22a and the second antenna part 22b, so that the first antenna body 221 and the The second antenna body 222 can be a meander-shaped antenna (as shown in FIG. 3 ).

The second antenna structure 2b is in the form of a patch antenna, and its applicable frequency range is Sub-6G or millimeter wave (mmWave), and the second circuit structure 2b includes components that are separated from each other and configured correspondingly. The first antenna layer 24a and the second antenna layer 24b on opposite sides of the insulating layer 21, where the layout position of the first antenna layer 24a corresponds to the layout position of the second antenna layer 24b, as shown in Figure 3 Show.

In this embodiment, the first antenna layer 24a is located on the upper side of the insulating layer 21 and is located on the same surface 21a as the first antenna body 221, and the second antenna layer 24b is located under the insulating layer 21. side and is located above the ground layer 23, and the resonant wavelength of the second antenna structure 2b is 1/2 of the wavelength of the received signal, so as to increase the antenna gain (Gain) and enhance the signal receiving capability.

Furthermore, the first antenna layer 24a includes a plurality of first sheets 241, and the second antenna layer 24b includes a plurality of second sheets 242 corresponding to the first sheets 241. For example, the first antenna layer 24a The system includes four first sheets 241, and the second antenna layer 24b also includes four second sheets 242, and the first sheets 241 and the second sheets 242 are arranged in an array. .

In addition, as shown in Figure 2-1, the second antenna structure 2b further includes a dendritic power divider 25 that is electrically connected to the second antenna layer 24b and is formed on the base 20 The second surface 20b has a main circuit 250 and a plurality of branch circuits 251 connected to the main circuit 250, so that each branch circuit 251 is connected to each of the second sheets 242 respectively. For example, the main line 250 corresponds to the opening area A of the ground layer 23, so that the end side 220a (signal feed point) of the first conductive pillar 220 is connected to the main line 250, and the power distribution part 25 has four respective The branch lines 251 are connected to the second sheets 242 to evenly distribute the fed signals (or energy) to the first sheets 241 and the second sheets 242 . Therefore, the signal feeding point is connected to the first conductive pillar 220 of the first antenna structure 2a and the main line 250 of the second antenna structure 2b. Therefore, during use, the signal can be selectively transmitted from the first antenna structure 2a and/or the second antenna structure 2b transmit and receive.

In addition, the first antenna layer 24a, the second antenna layer 24b and the power distribution part 25 can be formed by laying a metal layer (such as copper), such as sputtering or vaporing. , electroplating or chemical plating, etc.; or, the first antenna layer 24a, the second antenna layer 24b and the power distribution part 25 are formed by lamination or frame placement.

Therefore, the packaging substrate 2 of the present invention mainly integrates the first antenna structure 2a and the second antenna structure 2b into the insulator 2c, so that the packaging substrate can emit/receive different antenna signals according to the needs to facilitate the application. The electronic product of the packaging substrate 2 transmits the signal of the required frequency. Therefore, compared with the conventional technology, the packaging substrate 2 is configured with multiple sets of antenna structures, thereby improving the antenna function of the electronic product and enabling the electronic product to provide The electrical functions required to operate the 5G system are required to meet the antenna operation requirements of the 5G system.

Furthermore, the preferred configuration of the packaging substrate 2 is to use at least four groups of second antenna structures 2b of the first piece 241 and the second piece 242, and at least one group of antenna combinations of the first antenna structure 2a.

In addition, the package substrate 2 can use the ground layer 23 to prevent the first antenna body 221 and the second antenna body 222 from causing cross talking and noise interfering to the semiconductor chip in the electronic product. and issues such as radiation interference.

To sum up, the packaging substrate of the present invention integrates the first antenna structure and the second antenna structure into the insulator, so that the packaging substrate includes signal receiving capabilities in two frequency bands (Sub-6G or mmWave). , so electronic products using this packaging substrate can meet the needs of radio frequency products of multiple frequencies, and thus the product size can be reduced, so that electronic products can meet the demand for miniaturization.

Furthermore, by designing the first antenna structure and the second antenna structure in different antenna forms, it can not only save the space required for electronic products (such as mobile devices such as smartphones, tablets or laptops) that use the packaging substrate, but space, and can improve the signal reception capability of the electronic product at various angles.

The above embodiments are used to illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of rights protection of the present invention should be as listed in the patent application scope described below.

2:Packaging substrate

2a: First antenna structure

2b: Second antenna structure

2c: Insulator

21a: Surface

221:The first antenna body

222:Second antenna body

24a: First antenna layer

24b: Second antenna layer

241:First piece of body

242:Second body

A:Opening area

L: Imaginary straight line

t:interval

Claims (11)

A packaging substrate includes: an insulator; a first antenna structure combined with the insulator; and a second antenna structure combined with the insulator, wherein the form of the first antenna structure is the same as that of the second antenna structure. The form is different, so that the packaging substrate includes signal receiving capabilities in two frequency bands, and part of the first antenna structure and part of the second antenna structure are located on the same surface of the insulator. The first antenna structure includes A conductive post embedded in the insulator and an antenna body formed on the surface of the insulator and connected to the conductive post. The power distribution part is formed on the insulator where the first antenna structure and the second antenna structure are located. The opposite surface of the same surface is electrically connected to the first antenna structure and the second antenna structure. The power distribution part has a main line and a plurality of branch lines connected to the main line, so that the branch lines are connected to the third antenna structure. There are two antenna structures, and the main line is connected to the first antenna structure. The packaging substrate of claim 1, wherein the first antenna structure is in the form of a dipole antenna. The packaging substrate according to claim 1, wherein the antenna system is a meandering antenna. The packaging substrate as claimed in claim 1, wherein the second antenna structure is in the form of a patch antenna. The packaging substrate of claim 1, wherein the second antenna structure includes a plurality of sets of first and second sheets that are separated from each other and arranged correspondingly. The packaging substrate according to claim 5, wherein the first chip body and the second chip system are arranged in an array. The packaging substrate of claim 5, wherein the second antenna structure includes at least four groups of first sheets and second sheets for matching at least one group of first antenna structures. The packaging substrate of claim 1, wherein the resonant wavelength of the first antenna structure is 1/2 of the wavelength of the received signal, and the resonant wavelength of the second antenna structure is 1/2 of the wavelength of the received signal. 1/2 of the wavelength. The packaging substrate of claim 1, wherein the first antenna structure includes a first antenna part and a second antenna part, and the first antenna part includes a first antenna embedded in the insulator. Conductive pillar, the first conductive pillar connects the opposite sides of the insulator, so that one end of the first conductive pillar serves as a signal feed point, and the other end of the first conductive pillar serves as the emission source. The packaging substrate of claim 9, wherein the second antenna part includes a second conductive pillar embedded in the insulator, and the second conductive pillar connects opposite sides of the insulator, so that the second conductive pillar One end of the conductive pillar is connected to the ground layer provided in the insulator, and the other end of the second conductive pillar is exposed on the insulator. The packaging substrate of claim 10, wherein the first antenna part further includes a first antenna body connected to the first conductive pillar, which is horizontally exposed from the end side of the first conductive pillar to the insulating layer. Extended and arranged on the surface of the insulating layer, the second antenna part further includes a second antenna body connected to the second conductive pillar, which extends horizontally from the end side of the second conductive pillar exposed to the insulating layer. and arranged on the surface of the insulating layer.

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