TWI825210B - 雷射加工裝置 - Google Patents
雷射加工裝置 Download PDFInfo
- Publication number
- TWI825210B TWI825210B TW108139299A TW108139299A TWI825210B TW I825210 B TWI825210 B TW I825210B TW 108139299 A TW108139299 A TW 108139299A TW 108139299 A TW108139299 A TW 108139299A TW I825210 B TWI825210 B TW I825210B
- Authority
- TW
- Taiwan
- Prior art keywords
- laser processing
- processing head
- laser
- light
- laser light
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 412
- 238000000034 method Methods 0.000 claims abstract description 86
- 230000008569 process Effects 0.000 claims abstract description 83
- 230000008859 change Effects 0.000 claims description 3
- 210000003128 head Anatomy 0.000 description 239
- 230000007246 mechanism Effects 0.000 description 35
- 230000003287 optical effect Effects 0.000 description 31
- 238000005259 measurement Methods 0.000 description 26
- 238000003384 imaging method Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 210000001747 pupil Anatomy 0.000 description 2
- 238000002407 reforming Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000010128 melt processing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-203671 | 2018-10-30 | ||
| JP2018203671A JP7108517B2 (ja) | 2018-10-30 | 2018-10-30 | レーザ加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202035055A TW202035055A (zh) | 2020-10-01 |
| TWI825210B true TWI825210B (zh) | 2023-12-11 |
Family
ID=70463756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108139299A TWI825210B (zh) | 2018-10-30 | 2019-10-30 | 雷射加工裝置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7108517B2 (ja) |
| KR (1) | KR102685373B1 (ja) |
| CN (1) | CN112955278B (ja) |
| TW (1) | TWI825210B (ja) |
| WO (1) | WO2020090907A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7438048B2 (ja) * | 2020-07-15 | 2024-02-26 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| JP2025090110A (ja) * | 2023-12-05 | 2025-06-17 | 浜松ホトニクス株式会社 | レーザ加工装置 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2650138B2 (ja) * | 1987-01-30 | 1997-09-03 | パワーレーザス・リミティッド | 金属のレーザー加工効率を向上させる手段 |
| JP4519560B2 (ja) * | 2004-07-30 | 2010-08-04 | 株式会社メディアプラス | 積層造形方法 |
| JP4523757B2 (ja) * | 2003-01-09 | 2010-08-11 | 新日本製鐵株式会社 | レーザ加工装置および加工方法 |
| JP2012004313A (ja) * | 2010-06-16 | 2012-01-05 | Showa Denko Kk | レーザ加工方法 |
| CN103447687A (zh) * | 2012-05-31 | 2013-12-18 | 灿美工程股份有限公司 | 激光加工系统及方法 |
| JP6121901B2 (ja) * | 2010-07-12 | 2017-04-26 | ロフィン−シナー テクノロジーズ インコーポレーテッド | レーザーフィラメント形成による材料加工方法 |
| CN108515273A (zh) * | 2018-03-29 | 2018-09-11 | 大族激光科技产业集团股份有限公司 | Led晶圆片的切割装置及切割方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533733Y2 (ja) | 1978-07-27 | 1980-08-11 | ||
| JPS56165649A (en) * | 1980-04-30 | 1981-12-19 | Sumitomo Rubber Ind Ltd | Automatic liner winding device |
| JP3357170B2 (ja) | 1994-03-07 | 2002-12-16 | ヤマザキマザック株式会社 | レーザ加工機 |
| JPH10156570A (ja) * | 1996-11-20 | 1998-06-16 | Ibiden Co Ltd | レーザ加工装置、多層プリント配線板の製造装置及び製造方法 |
| TWI446984B (zh) * | 2010-06-28 | 2014-08-01 | Mitsuboshi Diamond Ind Co Ltd | 被加工物的加工方法、被加工物的分割方法及雷射加工裝置 |
| JP5808267B2 (ja) * | 2012-02-20 | 2015-11-10 | 住友重機械工業株式会社 | レーザ加工装置及びレーザ加工方法 |
| US9828278B2 (en) * | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
| CN103537805B (zh) * | 2012-07-17 | 2016-05-25 | 大族激光科技产业集团股份有限公司 | 晶圆片激光切割方法及晶圆片加工方法 |
| JP6272145B2 (ja) * | 2014-05-29 | 2018-01-31 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
-
2018
- 2018-10-30 JP JP2018203671A patent/JP7108517B2/ja active Active
-
2019
- 2019-10-30 TW TW108139299A patent/TWI825210B/zh active
- 2019-10-30 CN CN201980071421.4A patent/CN112955278B/zh active Active
- 2019-10-30 KR KR1020217015674A patent/KR102685373B1/ko active Active
- 2019-10-30 WO PCT/JP2019/042614 patent/WO2020090907A1/ja not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2650138B2 (ja) * | 1987-01-30 | 1997-09-03 | パワーレーザス・リミティッド | 金属のレーザー加工効率を向上させる手段 |
| JP4523757B2 (ja) * | 2003-01-09 | 2010-08-11 | 新日本製鐵株式会社 | レーザ加工装置および加工方法 |
| JP4519560B2 (ja) * | 2004-07-30 | 2010-08-04 | 株式会社メディアプラス | 積層造形方法 |
| JP2012004313A (ja) * | 2010-06-16 | 2012-01-05 | Showa Denko Kk | レーザ加工方法 |
| JP6121901B2 (ja) * | 2010-07-12 | 2017-04-26 | ロフィン−シナー テクノロジーズ インコーポレーテッド | レーザーフィラメント形成による材料加工方法 |
| CN103447687A (zh) * | 2012-05-31 | 2013-12-18 | 灿美工程股份有限公司 | 激光加工系统及方法 |
| CN108515273A (zh) * | 2018-03-29 | 2018-09-11 | 大族激光科技产业集团股份有限公司 | Led晶圆片的切割装置及切割方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112955278B (zh) | 2022-12-20 |
| CN112955278A (zh) | 2021-06-11 |
| KR102685373B1 (ko) | 2024-07-17 |
| TW202035055A (zh) | 2020-10-01 |
| JP2020069486A (ja) | 2020-05-07 |
| JP7108517B2 (ja) | 2022-07-28 |
| WO2020090907A1 (ja) | 2020-05-07 |
| KR20210082485A (ko) | 2021-07-05 |
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